Substrate holder, substrate holding method, and film-forming apparatus

Abstract

To prevent a substrate from falling and to suppress deformation of or damage to the substrate and generation of scratches.SOLUTION: A substrate holder 10 includes a hole portion 12 in which a disc-shaped substrate 9 is vertically disposed and at least four support members 13 elastically deformably attached to the periphery of the hole portion, two of the support members supporting the disc-shaped substrate 9 at a first-side outer peripheral edge portion 14 and a second-side outer peripheral edge portion 15 located on the upper side of the disc-shaped substrate 9 in a vertical direction, and the other two support members supporting the disc-shaped substrate 9 at a third-side outer peripheral edge portion 16 and a fourth-side outer peripheral edge portion 17 located on the lower side of the disc-shaped substrate 9 in the vertical direction, wherein a central angle of the disc-shaped substrate between each of the first-side outer peripheral edge portion 14 and the second-side outer peripheral edge portion 15 and an uppermost end portion 18 of the disc-shaped substrate 9 located at a topmost position in the vertical direction is 30° to 65°, and a central angle of the disc-shaped substrate between each of the third-side outer peripheral edge portion 16 and the fourth-side outer peripheral edge portion 17 and a lowermost end portion 19 of the disc-shaped substrate 9 located at a bottommost position in the vertical direction is 10°to 20°.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a substrate holder, a substrate holding method, and a film forming apparatus.

Background Art

[0002] Conventionally, in a film forming apparatus for a substrate, a substrate holder that holds a substrate by a plurality of support members has been used. As a film forming apparatus using such a substrate holder, for example, Patent Document 1 discloses a carrier that holds two substrates with their plate surfaces facing the side in the transport direction, which is sequentially transported by a transport system to a plurality of vacuum chambers arranged along a polygonal transport path, and a continuous film forming process is performed by processing means arranged in the vacuum chamber constituting the film forming process chamber. An in-line type film forming apparatus is disclosed.

[0003] Further, Patent Document 2 discloses a first support member provided with a sandwiching member that protrudes from the inner periphery of the opening of the substrate holder body toward the inside of the opening and supports one end of an insulating substrate, and a second support member that supports the other end of the insulating substrate and is provided with a holding member, and has a second support member that can move so as to protrude into the opening or retract from the inside of the opening, and a substrate holder that holds the insulating substrate with a pair of first support members and second support members is disclosed. A film forming apparatus is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in film forming apparatuses such as Patent Documents 1 and 2, when the conveyance speed of the substrate is increased to improve productivity, there is a risk that the substrate is likely to fall due to vibration during conveyance or acceleration applied to the substrate. Further, when the supporting force of the substrate by the supporting member is increased to prevent the substrate from falling, as in the carrier of Patent Document 1 and the substrate holder of Patent Document 2, there is a risk that the substrate is likely to be deformed or damaged.

[0006] Also, when observed from the plane direction of the substrate, no deformation (plastic deformation dent, i.e., dent) was seen, but when observed from the thickness direction, scratch marks may occur on the substrate. The occurrence of these scratch marks causes dust generation in the film forming process for manufacturing the recording medium, and the applied voltage becomes unstable when applying a bias voltage from the supporting member of the substrate holder to the substrate.

[0007] Therefore, in view of the above problems, an object of the present invention is to suppress the dropping of the substrate and to suppress the occurrence of deformation or damage of the substrate and scratch marks.

Means for Solving the Problems

[0008] The present invention has the following configuration. (1) A hole portion in which a disk-shaped substrate is vertically arranged, At least four support members elastically deformably attached around the hole portion, And, Of the four support members, two first support members support the disk-shaped substrate at a first side outer peripheral end portion and a second side outer peripheral end portion of the disk-shaped substrate located above the disk-shaped substrate in the vertical direction, Of the four support members, the other two second support members support the disk-shaped substrate at a third side outer peripheral end portion and a fourth side outer peripheral end portion of the disk-shaped substrate located below the disk-shaped substrate in the vertical direction, The central angle of the disk-shaped substrate between each of the first side outer peripheral end portion and the second side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is 30° to 65°, The central angle of the disk-shaped substrate between each of the third-side outer peripheral end portion and the fourth-side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate located at the lowermost side of the disk-shaped substrate in the vertical direction is 10° to 20°, the substrate holder. (2) The range of the central angle of the disk-shaped substrate between each of the first-side outer peripheral end portion and the second-side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate, The range of the central angle of the disk-shaped substrate between each of the third-side outer peripheral end portion and the fourth-side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate, At the location of the disk-shaped substrate excluding the above, the support member does not support the disk-shaped substrate, the substrate holder according to (1). (3) The first support member, A coil spring disposed in a gap formed around the hole portion, A leaf spring member connected to the coil spring in the gap and protruding from the gap toward the inside of the hole portion, Having, the substrate holder according to (1) or (2). (4) The spring constant of the coil spring is 0.2 N / mm to 8.0 N / mm, the substrate holder according to (3). (5) The second support member has a shape bent in an L shape, The spring constant of the second support member is 0.2 N / mm to 8.0 N / mm, the substrate holder according to any one of (1) to (4). (6) A method for holding a substrate by a substrate holder, The substrate holder, Supporting the disk-shaped substrate at the first-side outer peripheral end portion and the second-side outer peripheral end portion of the disk-shaped substrate located above the disk-shaped substrate in the vertical direction by two of at least four support members elastically deformably attached around a hole portion in which the disk-shaped substrate is vertically arranged, Supporting the disk-shaped substrate at the third-side outer peripheral end portion and the fourth-side outer peripheral end portion of the disk-shaped substrate located below the disk-shaped substrate in the vertical direction by the other two of the four support members, Including, The central angle of the disk-shaped substrate between each of the first-side outer peripheral end portion and the second-side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is set to 30° to 65°. A substrate holding method, wherein the central angle of the disk-shaped substrate between each of the third-side outer peripheral end portion and the fourth-side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate located at the lowermost side of the disk-shaped substrate in the vertical direction is set to 10° to 20°. (7) A chamber for performing a film-forming process on a disk-shaped substrate, a carrier provided with the substrate holder according to (1) or (2) for holding the disk-shaped substrate at least inside the chamber, a transport mechanism for transporting the carrier, and a film-forming apparatus comprising the same.

Advantages of the Invention

[0009] According to one aspect of the present invention, it is possible to suppress the dropping of the substrate, and to suppress the occurrence of deformation, breakage, and rubbing marks of the substrate.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each drawing, the same reference numerals are assigned to the same components, and duplicate descriptions will be omitted as appropriate.

[0012] (Magnetic recording medium) First, an example of a recording medium manufactured by the film-forming apparatus according to the present embodiment will be described. FIG. 1 is a cross-sectional view showing an example of a recording medium manufactured by the film-forming apparatus according to the present embodiment. The recording medium is, for example, a magnetic recording medium.

[0013] In recent years, the application range of magnetic recording devices has increased significantly, the importance of magnetic recording devices has increased, and a significant improvement in the recording density of magnetic recording media used in magnetic recording devices has been attempted.

[0014] The magnetic recording medium is required to achieve an even higher recording density in the future. For this reason, it is required to achieve high coercivity magnetization, a high signal-to-noise ratio (SNR), and high resolution of the magnetic layer. In recent years, in addition to the improvement of the linear recording density, studies have been conducted to increase the areal recording density by increasing the track density.

[0015] As a method for manufacturing a magnetic recording medium, for example, there is a method in which a soft magnetic layer, an intermediate layer, a recording magnetic layer, etc. are formed on a non-magnetic substrate, and then a protective layer is formed on the recording magnetic layer.

[0016] In the case of such a manufacturing method, it is preferable to perform the process continuously using as few film-forming apparatuses as possible. By performing the film-forming process continuously, contamination of the substrate during handling can be prevented, the number of handling steps and the like can be reduced, the efficiency of the manufacturing process can be improved, the product yield can be improved, and the productivity of the magnetic recording medium can be increased.

[0017] Therefore, when manufacturing such a magnetic recording medium, it has been proposed to use an in-line type film-forming apparatus that sequentially forms magnetic layers and the like on both sides of a non-magnetic substrate while sequentially transporting a carrier holding the non-magnetic substrate between a plurality of chambers.

[0018] In order to increase the productivity of a magnetic recording medium in an in-line film forming apparatus, the conveyance speed of a carrier may be increased. However, when the conveyance speed of the carrier is increased, the substrate is likely to fall from the carrier due to vibration during conveyance or acceleration applied to the substrate.

[0019] In order to prevent the substrate from falling, if the supporting force of the supporting member that supports the substrate is increased too much, the substrate may be deformed and damaged. In particular, in recent years, in order to increase the recording capacity of a hard disk drive, the number of magnetic recording media stored in a case has been increased by thinning the substrate. Due to the thinning of the substrate, the strength of the substrate has decreased, and deformation or damage is likely to occur.

[0020] In order to solve such problems, the substrate holder and the substrate holding method according to the present embodiment suppress the fall of the substrate from the carrier even when the conveyance speed of the carrier is increased. Further, even when the thickness of the substrate is reduced, deformation, damage, and generation of rubbing marks of the substrate at the supporting portion of the substrate by the supporting member are suppressed. Furthermore, the film forming apparatus according to the present embodiment increases the productivity of the recording medium by using such a substrate holder.

[0021] In the present embodiment, a case where a magnetic recording medium mounted on a hard disk drive is manufactured using an in-line film forming apparatus that performs a film forming process while sequentially conveying a disk-shaped substrate between a plurality of chambers will be described as an example.

[0022] As shown in FIG. 1, the magnetic recording medium manufactured by the in-line film forming apparatus according to the present embodiment has a structure in which a soft magnetic layer 81, an intermediate layer 82, a recording magnetic layer 83, and a protective layer 84 are sequentially laminated on both surfaces of a disk-shaped substrate 9, and a lubricating film 85 is further formed on the outermost surface.

[0023] The disk-shaped substrate 9 is not particularly limited as long as it is a non-magnetic substrate, and any substrate may be used. Examples of the disk-shaped substrate 9 include Al alloy substrates such as Al-Mg alloys containing Al as a main component, soda glass, aluminosilicate-based glass or crystallized glass, silicon, titanium, ceramics, and substrates made of various resins.

[0024] (In-line film forming apparatus) FIG. 2 is a plan view of the in-line film forming apparatus 1 according to the present embodiment. When manufacturing a magnetic recording medium, for example, an in-line film forming apparatus 1 as shown in FIG. 2 is used, and at least a soft magnetic layer 81, an intermediate layer 82, a recording magnetic layer 83, and a protective layer 84 are sequentially laminated on both surfaces of a disk-shaped substrate 9 to be film-formed. By going through such a process, a magnetic recording medium can be obtained with high productivity.

[0025] Specifically, the in-line film forming apparatus 1 includes a robot base 8, a substrate cassette transfer robot 3 placed on the robot base 8, a substrate attachment / detachment robot 2 adjacent to the robot base 8, and a plurality of corner chambers 4 that rotate the carrier 7. Further, the in-line film forming apparatus 1 includes a plurality of chambers 5 disposed between the corner chambers 4, a plurality of carriers 7 that are transported through the plurality of corner chambers 4 and the plurality of chambers 5, and a transport mechanism 11 (see FIG. 3) that transports the plurality of carriers 7.

[0026] Also, a gate valve 6 is provided at the connection portion of each chamber 5, and when these gate valves 6 are in a closed state, each chamber 5 becomes an independent sealed space.

[0027] Also, a vacuum pump (not shown) is connected to each chamber 5, and a plurality of carriers 7 are sequentially transported into each chamber 5 in a reduced pressure state by the operation of these vacuum pumps by the transport mechanism 11. While sequentially transporting the plurality of carriers 7, in each chamber 5, the soft magnetic layer 81, the intermediate layer 82, the recording magnetic layer 83, and the protective layer 84 shown in FIG. 1 are sequentially formed on both surfaces of the disk-shaped substrate 9 held by the carrier 7. Then, the disk-shaped substrate 9 is taken out from the in-line film forming apparatus 1, and a lubricating film 85 shown in FIG. 1 is formed on both surfaces thereof, and finally the magnetic recording medium shown in FIG. 1 is obtained. Each corner chamber 4 is a chamber that changes the moving direction of the carrier 7, and a mechanism for rotating the carrier 7 and moving it to the next chamber 5 is provided inside the corner chamber 4.

[0028] FIG. 3 is a side sectional view of the chamber 5 in the in-line film forming apparatus 1 according to the present embodiment. The in-line film forming apparatus 1 includes, as a transport mechanism 11 for transporting the carrier 7, for example, a linear motor drive mechanism that drives in a non-contact state. This linear motor drive mechanism arranges a plurality of magnets at the lower part of the carrier 7 so that N poles and S poles are alternately arranged, and arranges rotating magnets in which N poles and S poles are alternately arranged in a spiral shape via a partition below the magnets of the carrier 7 along the transport path. The linear motor drive mechanism transports the carrier 7 by rotating the rotating magnet around its axis while magnetically coupling the magnet on the carrier 7 side and the rotating magnet in a non-contact manner.

[0029] (Method for manufacturing a magnetic recording medium) A method for manufacturing a magnetic recording medium using the in-line film forming apparatus 1 according to the present embodiment will be described with reference to FIG. 1. The in-line film forming apparatus 1 sequentially transports the disk-shaped substrate 9 held by the carrier 7 between a plurality of chambers 5, and sequentially laminates a soft magnetic layer 81, an intermediate layer 82, a recording magnetic layer 83, and a protective layer 84 on both surfaces of the disk-shaped substrate 9 to manufacture a magnetic recording medium.

[0030] Such a method for manufacturing a magnetic recording medium can be continuously performed from the formation of the soft magnetic layer 81 to the formation of the protective layer 84 using one apparatus by the in-line film forming apparatus 1, and it is possible to reduce the contamination of the disk-shaped substrate 9 during the handling of the disk-shaped substrate 9 to be film-formed. Further, the method for manufacturing a magnetic recording medium can improve the productivity of the magnetic recording medium by reducing the number of handling steps and the like by the in-line film forming apparatus 1, improving the manufacturing process efficiency, and improving the product yield.

[0031] (Substrate holder and substrate holding method) Figure 4 is a side view of the carrier 7 used in the inline film forming apparatus 1 according to the present embodiment. The carrier 7 in the present embodiment will be described in more detail with reference to FIG. 4. The carrier 7 is provided with one substrate holder 10 for holding the disk-shaped substrate 9 vertically. Note that "vertically" means a state in which the main surface (front or back surface) of the disk-shaped substrate 9 is parallel to the gravitational direction. The carrier 7 arranges one substrate holder 10 in the transport direction.

[0032] The substrate holder 10 has a thickness of about one to several times the thickness of the disk-shaped substrate 9. Further, a circular hole 12 having a diameter larger than that of the disk-shaped substrate 9 is formed in the substrate holder 10 so as to form a gap of about 10 mm in the radial direction from the outer peripheral end of the held disk-shaped substrate 9.

[0033] Further, four support members 13 are elastically deformably attached around the hole 12 of each substrate holder 10. The four support members 13 are provided around the hole 12 of the substrate holder 10 so as to support the outer peripheral end of the disk-shaped substrate 9 disposed inside the hole 12 at a specific position.

[0034] The substrate holder 10 supports the outer peripheral end of the disk-shaped substrate 9 and can detachably hold the disk-shaped substrate 9 fitted inside the support member 13. Further, the attachment and detachment of the disk-shaped substrate 9 to and from the substrate holder 10 are performed, for example, by the substrate attachment / detachment robot 2 pushing down the two support members 13 below the substrate holder 10 in the vertical direction.

[0035] The four support members 13 support the first-side outer peripheral end 14, the second-side outer peripheral end 15, the third-side outer peripheral end 16, and the fourth-side outer peripheral end 17 of the disk-shaped substrate 9, respectively, so that the substrate holder 10 holds the disk-shaped substrate 9 inside the hole 12. The first-side outer peripheral end 14, the second-side outer peripheral end 15, the third-side outer peripheral end 16, and the fourth-side outer peripheral end 17 of the disk-shaped substrate 9 include at least one of the outer peripheral surface of the disk-shaped substrate 9 and the outer peripheral edge (edge or corner) of the disk-shaped substrate 9.

[0036] The proximal end side of the support member 13 is located in the gap 121 formed around the hole 12 of the substrate holder 10 and is fixed to the main body of the substrate holder 10 within the gap 121. The distal end side of the support member 13 protrudes from the gap 121 of the substrate holder 10 toward the inside of the hole 12.

[0037] The four support members 13 include two first support members 13A and two second support members 13B.

[0038] The two first support members 13A support the first side outer peripheral end 14 located above the disk-shaped substrate 9 in the vertical direction and the second side outer peripheral end 15 located above the disk-shaped substrate 9 in the vertical direction. The first side outer peripheral end 14 is located on the left side of the disk-shaped substrate 9 in the horizontal direction (or on the right side when viewed from the back side of FIG. 4), and the second side outer peripheral end 15 is located on the right side of the disk-shaped substrate 9 in the horizontal direction (or on the left side when viewed from the back side of FIG. 4).

[0039] The first support member 13A includes a coil spring 131, a leaf spring member 132A, a fixing portion 133 disposed in the gap 121A located above the disk-shaped substrate 9 in the vertical direction among the gaps 121 of the hole 12, and a connecting portion 134 that connects the coil spring 131 and the leaf spring member 132A.

[0040] The coil spring 131 is installed on the fixing portion 133 disposed in the gap 121A of the hole 12 and is fixed to the main body of the substrate holder 10 via the fixing portion 133. One end of the coil spring 131 is connected to the connecting portion 134.

[0041] One end of the leaf spring member 132A is connected to the connecting portion 134 within the gap 121A of the hole 12, and it has a shape that protrudes from the gap 121A toward the inside of the hole 12 and is formed in a plate shape.

[0042] The fixing portion 133 is disposed in the gap 121A of the hole 12 and is fixed to the main body of the substrate holder 10.

[0043] The connecting portion 134 is disposed in the fixing portion 133 within the gap 121A of the hole portion 12, and connects the coil spring 131 and the leaf spring member 132A at the fixing portion 133.

[0044] The two second support members 13B support the third side outer peripheral end portion 16 located on the lower side of the disk-shaped substrate 9 in the vertical direction and the fourth side outer peripheral end portion 17 located on the lower side of the disk-shaped substrate 9 in the vertical direction. The third side outer peripheral end portion 16 is located on the left side of the disk-shaped substrate 9 in the horizontal direction (or on the right side when viewed from the back side of FIG. 4), and the fourth side outer peripheral end portion 17 is located on the right side of the disk-shaped substrate 9 in the horizontal direction (or on the left side when viewed from the back side of FIG. 4).

[0045] The second support member 13B has a leaf spring member 132B bent in a substantially L shape.

[0046] The leaf spring member 132B has a shape that protrudes from the gap 121B located on the lower side of the disk-shaped substrate 9 in the vertical direction toward the inside of the hole portion 12 among the gaps 121 of the hole portion 12.

[0047] Further, at the tip of the support member 13 (the tips of the leaf spring members 132A and 132B), for example, a V-shaped or U-shaped groove portion that engages with the outer peripheral end portion of the disk-shaped substrate 9 may be provided to suppress the fall of the disk-shaped substrate 9.

[0048] The spring constant of the coil spring 131 is preferably 0.2 N / mm to 8.0 N / mm. The lower limit value of the spring constant of the coil spring 131 is more preferably 1.0 N / mm or more, and even more preferably 3.0 N / mm or more. The upper limit value of the spring constant of the coil spring 131 is more preferably 7.0 N / mm or less, and even more preferably 6.0 N / mm or less. By setting the spring constant of the coil spring 131 within the above preferable range, the effect of suppressing the fall of the disk-shaped substrate 9 can be further enhanced, and at the same time, the effects of suppressing deformation or breakage of the disk-shaped substrate 9 and the occurrence of rubbing marks on the disk-shaped substrate 9 can be further enhanced.

[0049] The spring constant of the leaf spring member 132A is not particularly limited and may be designed to have any appropriate magnitude as needed. Since the leaf spring member 132A is attached to the coil spring 131, it is preferable for the leaf spring member 132A to have high rigidity. The rigidity of the leaf spring member 132A is preferably higher than that of the coil spring 131 or the leaf spring member 132B, for example. If the rigidity of the leaf spring member 132A is high, sliding during conveyance of the disk-shaped substrate 9 can be suppressed, and the occurrence of rubbing marks on the disk-shaped substrate 9 can be inhibited.

[0050] The spring constant of the leaf spring member 132B is preferably 0.2 N / mm to 8.0 N / mm, similar to the spring constant of the coil spring 131. The lower limit value of the spring constant of the leaf spring member 132B is more preferably 1.0 N / mm or more, and even more preferably 3.0 N / mm or more, similar to the coil spring 131. The upper limit value of the spring constant of the leaf spring member 132B is more preferably 7.0 N / mm or less, and even more preferably 6.0 N / mm or less, similar to the coil spring 131. By setting the spring constant of the leaf spring member 132B within the above preferable range, the effect of suppressing the drop of the disk-shaped substrate 9 can be further enhanced, and the effects of suppressing deformation or breakage of the disk-shaped substrate 9 and the occurrence of rubbing marks on the disk-shaped substrate 9 can be further enhanced.

[0051] For the support member 13, a heat-resistant alloy mainly composed of any one of iron, nickel, cobalt, molybdenum, tungsten, etc. can be used. Also, the supporting force of the disk-shaped substrate 9 by the support member 13 is appropriately selected according to the material and thickness of the disk-shaped substrate 9, and is, for example, 2 N to 6 N.

[0052] A first central angle α of the disk-shaped substrate 9 between a first side outer peripheral end portion 14 located above the disk-shaped substrate 9 in the vertical direction and a topmost end portion 18 located at the uppermost position of the disk-shaped substrate 9 in the vertical direction is 30° to 65°. The lower limit value of the first central angle α is preferably 35° or more, more preferably 40° or more, and even more preferably 45° or more. The upper limit value of the first central angle α is preferably 60° or less, more preferably 55° or less, and even more preferably 50° or less.

[0053] Also, the second central angle β of the disk-shaped substrate 9 between the second side outer peripheral end portion 15 located above the disk-shaped substrate 9 in the vertical direction and the uppermost end portion 18 located at the uppermost side of the disk-shaped substrate 9 in the vertical direction is, similar to the first central angle α, 30° to 65°, and preferably the same angle as the first central angle α. The lower limit value of the first central angle α is, similar to the first central angle α, preferably 35° or more, more preferably 40° or more, and still more preferably 45° or more. The upper limit value of the first central angle α is, similar to the first central angle α, preferably 60° or less, more preferably 55° or less, and still more preferably 50° or less.

[0054] The third central angle γ of the disk-shaped substrate 9 between the third side outer peripheral end portion 16 located below the disk-shaped substrate 9 in the vertical direction and the lowermost end portion 19 located at the lowermost side of the disk-shaped substrate 9 in the vertical direction is 10° to 20°. The lower limit value of the third central angle γ is preferably 12° or more, more preferably 13° or more. The upper limit value of the third central angle γ is preferably 18° or less, more preferably 15° or less.

[0055] Also, the fourth central angle δ of the disk-shaped substrate 9 between the fourth side outer peripheral end portion 17 located below the disk-shaped substrate 9 in the vertical direction and the lowermost end portion 19 located at the lowermost side of the disk-shaped substrate 9 in the vertical direction is, similar to the first central angle α, 10° to 20°, and preferably the same angle as the third central angle γ. The lower limit value of the fourth central angle δ is, similar to the third central angle γ, preferably 12° or more, more preferably 13° or more. The upper limit value of the fourth central angle δ is, similar to the third central angle γ, preferably 18° or less, more preferably 15° or less.

[0056] That is, both the first central angle α and the second central angle β of the disk-shaped substrate 9 are equal to or greater than the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9.

[0057] Then, it is preferable that the support member 13 does not support the disk-shaped substrate 9 at the location of the disk-shaped substrate 9 excluding the ranges of the first central angle α and the second central angle β and the ranges of the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9.

[0058] By using the substrate holder 10 having such a support member 13, even when the conveyance speed of the carrier 7 is increased, the fall of the disk-shaped substrate 9 from the carrier 7 is suppressed, and deformation, breakage, and generation of rubbing marks at the support portion of the disk-shaped substrate 9 by the support member 13 are suppressed. Therefore, the inline film forming apparatus 1 can improve the productivity of the magnetic recording medium. In addition, since deformation, breakage, and generation of rubbing marks of the disk-shaped substrate 9 are suppressed, it becomes possible to provide the inline film forming apparatus 1 capable of coping with thinning of the disk-shaped substrate 9.

[0059] The reason for the above-described operational effects by using the substrate holder 10 is considered as follows. When the conveyance speed of the carrier 7 is increased, strong vibration and acceleration are applied to the disk-shaped substrate 9. The vibration and acceleration applied to the disk-shaped substrate 9 are particularly strong in the direction parallel to the traveling direction of the carrier 7, and such a component is the cause of the fall or deformation of the substrate. The substrate holder 10 supports the disk-shaped substrate 9 at specific locations near the uppermost end portion 18 and the lowermost end portion 19 of the disk-shaped substrate 9, thereby relaxing the force applied in the traveling direction of the carrier 7 and suppressing the fall of the disk-shaped substrate 9. Further, the substrate holder 10 can suppress the deformation of the disk-shaped substrate 9 because the support member 13 does not support the disk-shaped substrate 9 except at specific locations near the uppermost end portion 18 and the lowermost end portion 19 of the disk-shaped substrate 9.

[0060] On the other hand, when the two support members 13 support the first side outer peripheral end portion 14 and the second side outer peripheral end portion 15 of the disk-shaped substrate 9 in a range where the first central angle α and the second central angle β of the disk-shaped substrate 9 are smaller than 30°, the holding force of the disk-shaped substrate 9 by the substrate holder 10 decreases. Then, the disk-shaped substrate 9 is likely to fall from the substrate holder 10.

[0061] In addition, when the two support members 13 support the first side outer peripheral end portion 14 and the second side outer peripheral end portion 15 of the disk-shaped substrate 9 in a range where the first central angle α and the second central angle β of the disk-shaped substrate 9 are greater than 65°, deformation is likely to occur in the support portion of the disk-shaped substrate 9 by the two support members 13.

[0062] Furthermore, when the other two support members 13 support the third side outer peripheral end portion 16 and the fourth side outer peripheral end portion 17 of the disk-shaped substrate 9 in a range where the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9 are less than 10°, the holding force of the disk-shaped substrate 9 by the substrate holder 10 decreases. Then, the disk-shaped substrate 9 is likely to fall from the substrate holder 10.

[0063] In addition, when the other two support members 13 support the third side outer peripheral end portion 16 and the fourth side outer peripheral end portion 17 of the disk-shaped substrate 9 in a range where the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9 are greater than 20°, deformation is likely to occur in the support portion of the disk-shaped substrate 9 by the support members 13.

[0064] Note that the deformation of the disk-shaped substrate 9 includes those that are difficult to distinguish with the naked eye. A microscopic image showing an example of the deformation that occurred in the disk-shaped substrate 9 according to the prior art is shown in FIG. 5. As shown in FIG. 5, the disk-shaped substrate 9 has a deformation that is difficult to distinguish with the naked eye. This deformation of the disk-shaped substrate 9 is a dent (i.e., a dent) plastically deformed by the supporting force of the support member provided in the conventional substrate holder. This dent has a height of about 1.26 μm and a width from the outermost outer peripheral end of the disk-shaped substrate 9 of about 180.15 μm. In recent years, in order to meet the requirement of increasing the recording capacity of the hard disk device, the recording area of the magnetic recording medium extends to the side outer peripheral end portion. Therefore, even a minute dent that cannot be distinguished with the naked eye as shown in FIG. 5 is now judged as a defective part. By using the substrate holder 10 according to the present embodiment, it is possible to suppress the occurrence of deformation in the support portion of the disk-shaped substrate 9 by the support members 13.

[0065] According to the substrate holder 10 and the substrate holding method according to this embodiment, even if the conveyance speed of the carrier 7 is increased, the fall of the disk-shaped substrate 9 from the substrate holder 10 can be suppressed. Further, even if the thickness of the disk-shaped substrate 9 is reduced, deformation of the disk-shaped substrate 9 in the support portion of the disk-shaped substrate 9 by the support member 13 can be suppressed. Furthermore, a highly productive in-line film forming apparatus 1 can be provided. Also, since deformation of the disk-shaped substrate 9 is suppressed, an in-line film forming apparatus 1 capable of coping with thinning of the disk-shaped substrate 9 can be provided.

[0066] As described above, the preferred embodiments have been described in detail. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope described in the claims. For example, the film forming apparatus including the substrate holder 10 according to this embodiment is not limited to the in-line film forming apparatus 1, and can also be applied to a batch type film forming apparatus or the like. Further, the number of the support members 13 is not limited as long as it is four or more.

[0067] In addition, the numbers such as ordinal numbers and quantities used in the description of the above-described embodiments are all examples for specifically explaining the technology of the present invention, and the present invention is not limited to the illustrated numbers. Also, the connection relationship between the components is an example for specifically explaining the technology of the present invention, and the connection relationship for realizing the functions of the present invention is not limited thereto.

Example

[0068] Hereinafter, examples will be given to make the effects of the substrate holder 10 and the in-line film forming apparatus 1 according to this embodiment more apparent. Note that the substrate holder 10 and the in-line film forming apparatus 1 according to this embodiment are not limited to the following examples, and can be appropriately modified and implemented without changing the gist.

[0069] <Example 1> [Conveyance of disk-shaped substrate 9] In Example 1, using the inline film-forming apparatus 1 shown in FIG. 2 and the carrier 7 shown in FIG. 4, a magnetic recording medium having the layer structure shown in FIG. 1 was manufactured from a disk-shaped substrate 9 made of an aluminum alloy (outer diameter: 96 mm, inner diameter: 25 mm, thickness: 0.7 mm). Specifically, using the DC sputtering method, an FeCoB alloy as a soft magnetic layer 81, Ru as an intermediate layer 82, and a 70Co-5Cr-15Pt-10SiO2 alloy as a recording magnetic layer 83 were laminated on both sides of the disk-shaped substrate 9. Further, using the ion beam method, a hard carbon film as a protective layer 84 was laminated on the recording magnetic layer 83.

[0070] The two upper first support members 13A of the substrate holder 10 supported the first outer peripheral end portion 14 and the second outer peripheral end portion 15 of the disk-shaped substrate 9 at positions where the first central angle α and the second central angle β of the disk-shaped substrate 9 were each 50°. Also, the two lower second support members 13B of the substrate holder 10 supported the third outer peripheral end portion 16 and the fourth outer peripheral end portion 17 of the disk-shaped substrate 9 at positions where the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9 were each 13°.

[0071] The coil spring 131 of the first support member 13A had a spring constant of 5.0 N / mm, a free length of 15 mm, a length of the coil spring 131 within the substrate holder 10 of 11 mm, and a pushing-in amount of the coil spring 131 when holding the disk-shaped substrate 9 of 1 mm.

[0072] The spring constant of the leaf spring member 132B of the second support member 13B was set to 5.0 N / mm.

[0073] The conveyance speed of the carrier 7 between the chambers 5 was 1.2 m / sec, and the acceleration during acceleration and deceleration was 6 m / sec 2 and.

[0074] Table 1 shows the magnitudes of the central angles (first central angle α, second central angle β, third central angle γ, fourth central angle δ) of each support member 13 (first support member 13A and second support member 13B) of the disk-shaped substrate 9 indicating the support positions of the disk-shaped substrate 9 by the support members 13, the spring constants of the coil spring 131 and the leaf spring member 132B, the thickness of the disk-shaped substrate 9, the conveyance speed of the carrier 7, and the acceleration during acceleration and deceleration.

[0075] [Evaluation] (Presence or absence of dropping of the disk-shaped substrate) Under the above conditions, 1000 magnetic recording media were manufactured, but no dropping of the disk-shaped substrate 9 occurred.

[0076] (Incidence rate of dents) The presence or absence of deformation (dents) at the outer peripheral end of the magnetic recording medium manufactured under the above conditions was determined by differential interference microscope images. When observing the magnetic recording medium from the surface side (data surface side), if a deformation with a width of 100 μm or more and a height of 0.5 μm or more was found starting from the outer peripheral end, it was determined that a dent had occurred.

[0077] (Incidence rate of scratches) The presence or absence of scratches at the outer peripheral end of the magnetic recording medium manufactured under the above conditions was determined by differential interference microscope images. When observing the magnetic recording medium in the thickness direction, if a scratch with a width of 60 μm or more was found, it was determined that a scratch had occurred. A microscope image of the disk-shaped substrate 9 observed in the thickness direction is shown in Fig. 6. Note that the black vertical linear part in Fig. 6 is the end face of the disk-shaped substrate 9, and both sides thereof are end faces out of focus. What appears white within the black vertical linear part in Fig. 6 are the scratches generated at the end portion. As shown in Fig. 6, almost no scratches occurred on the disk-shaped substrate 9 held and conveyed by the substrate holder 10 (see Fig. 6(a)).

[0078] The results of the presence or absence of dropping of the disk-shaped substrate 9, the incidence rate of dents, and the incidence rate of scratches are shown in Table 1. In Table 1, regarding the presence or absence of dropping of the disk-shaped substrate 9, when no dropping of the disk-shaped substrate 9 occurred, it is indicated by "A", and when dropping of the disk-shaped substrate 9 occurred, it is indicated by "B".

[0079] <Examples 2 to 15, Comparative Examples 1 to 6> In Example 1, the procedure was the same as in Example 1 except that the conditions shown in Table 1 were changed. Table 1 shows various conveyance conditions of the disk-shaped substrate 9 in the substrate holder 10 for each example and comparative example (the magnitudes of the central angles of the disk-shaped substrate 9 with respect to each support member 13 (first central angle α, second central angle β, third central angle γ, fourth central angle δ), the spring constants of the coil spring 131 and the leaf spring member 132A, the thickness of the disk-shaped substrate 9, the conveyance speed of the carrier 7, and the acceleration during acceleration and deceleration). Table 1 also shows the evaluation results (presence or absence of dropping of the disk-shaped substrate 9, dent occurrence rate, and scratch occurrence rate) for each example and comparative example. Note that the lightly hatched portions in Table 1 indicate numerical values within the scope of the present embodiment, and the darkly hatched portions indicate numerical values outside the scope of the present embodiment.

[0080] In addition, a microscopic image of the disk-shaped substrate 9 held and conveyed by the substrate holder of Comparative Example 1 as observed from the thickness direction is shown in FIG. 6. As shown in FIG. 6, it was confirmed that scratches occurred at the ends of the disk-shaped substrate 9 held and conveyed by the substrate holder of Comparative Example 1 (see FIG. 6(b)).

[0081] [Table 1]

[0082] From Table 1, in each example, dropping of the disk-shaped substrate 9 did not occur, the dent occurrence rate was suppressed to 1.0% or less, and the scratch occurrence rate was suppressed to 4% or less. On the other hand, in each comparative example, either dropping of the disk-shaped substrate 9 occurred, the dent occurrence rate was 2.0% or more, or the scratch occurrence rate was 5% or more.

[0083] Therefore, by setting the first central angle α and the second central angle β of the disk-shaped substrate 9, which are the support positions of the two upper first support members 13A of the substrate holder 10, to 30° to 65° respectively, and setting the third central angle γ and the fourth central angle δ of the disk-shaped substrate 9, which are the support positions of the two lower second support members 13B of the substrate holder 10, to 10° to 20° respectively, it was confirmed that dropping of the disk-shaped substrate 9 can be prevented, and deformation, breakage, and occurrence of scratches of the disk-shaped substrate 9 can be suppressed.

[0084] Therefore, the substrate holder 10 according to the present embodiment can be suitably used as a substrate holder used in a film forming apparatus for manufacturing a magnetic recording medium from a disk-shaped substrate, particularly an in-line type film forming apparatus, and it can be said that the magnetic recording medium can be effectively manufactured with excellent yield.

Explanation of Signs

[0085] 1 In-line type film forming apparatus 7 Carrier 9 Disk-shaped substrate 10 Substrate holder 12 Hole portion 13 Support member 13A First support member 13B Second support member 14 First side outer peripheral end 15 Second side outer peripheral end 16 Third side outer peripheral end 17 Fourth side outer peripheral end 18 Uppermost end 19 Lowermost end 121, 121A, 121B Gap 131 Coil spring 132, 132A, 132B Leaf spring member 133 Fixed portion 134 Connecting portion α First central angle β Second central angle δ Third central angle γ Fourth central angle Z Vertical direction

Claims

1. a hole portion in which a disk-shaped substrate is arranged vertically; at least four support members elastically deformably attached around the hole portion; comprising of the four support members, two first support members support the disk-shaped substrate at a first-side outer peripheral end portion and a second-side outer peripheral end portion of the disk-shaped substrate located above the disk-shaped substrate in the vertical direction; of the four support members, the other two second support members support the disk-shaped substrate at a third-side outer peripheral end portion and a fourth-side outer peripheral end portion of the disk-shaped substrate located below the disk-shaped substrate in the vertical direction; a central angle of the disk-shaped substrate between each of the first-side outer peripheral end portion and the second-side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is 30° to 65°; a central angle of the disk-shaped substrate between each of the third-side outer peripheral end portion and the fourth-side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate located at the lowermost side of the disk-shaped substrate in the vertical direction is 10° to 20°, a substrate holder.

2. a range of the central angle of the disk-shaped substrate between each of the first-side outer peripheral end portion and the second-side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate; a range of the central angle of the disk-shaped substrate between each of the third-side outer peripheral end portion and the fourth-side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate; The substrate holder according to claim 1, wherein the support member does not support the disk-shaped substrate at a location of the disk-shaped substrate excluding the above.

3. The first support member a coil spring disposed in a gap formed around the hole portion; a leaf spring member connected to the coil spring in the gap and protruding from the gap toward the inside of the hole portion; The substrate holder according to claim 1, having.

4. The substrate holder according to claim 3, wherein a spring constant of the coil spring is 0.2 N / mm to 8.0 N / mm.

5. The second support member has a shape bent in an L shape; The substrate holder according to claim 1, wherein a spring constant of the second support member is 0.2 N / mm to 8.0 N / mm.

6. A method for holding a substrate by a substrate holder, comprising: the substrate holder supporting the disk-shaped substrate at a first-side outer peripheral end portion and a second-side outer peripheral end portion of the disk-shaped substrate located above the disk-shaped substrate in the vertical direction by two support members of at least four support members elastically deformably attached around a hole portion in which the disk-shaped substrate is arranged vertically; A step of supporting the disk-shaped substrate at a third-side outer peripheral end portion and a fourth-side outer peripheral end portion of the disk-shaped substrate located below the disk-shaped substrate in the vertical direction by the other two of the four support members; including; The central angle of the disk-shaped substrate between each of the first-side outer peripheral end portion and the second-side outer peripheral end portion and the uppermost end portion of the disk-shaped substrate located at the uppermost side of the disk-shaped substrate in the vertical direction is set to 30° to 65°; A substrate holding method, wherein the central angle of the disk-shaped substrate between each of the third-side outer peripheral end portion and the fourth-side outer peripheral end portion and the lowermost end portion of the disk-shaped substrate located at the lowermost side of the disk-shaped substrate in the vertical direction is set to 10° to 20°.

7. A chamber for performing a film-forming process on a disk-shaped substrate; A carrier provided with the substrate holder according to claim 1 or 2 for holding the disk-shaped substrate at least inside the chamber; A transport mechanism for transporting the carrier; A film-forming apparatus comprising:

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