Connector and connector unit

Abstract

To provide a connector and a connector unit which can be miniaturized.SOLUTION: A connector 100A comprises an insulation layer 20, a conductor layer 30, and a metal support layer 10, and is used for connection with the other connection component. The conductor layer 30 includes a mounting part, and is formed on one surface of the insulation layer 20. The metal support layer 10 includes folding parts A1 to A3, and is formed on the other surface of the insulation layer 20. In the folding parts A1 to A3, an open part is formed at a part of the metal support layer 10 overlapped with the conductor layer 30. By folding the metal support layer 10 along the folding parts A1 to A3, a connection region 40 used for connection with the other connection component is formed.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a connector and a connector unit.

Background Art

[0002] Connectors are used to connect circuit boards in electronic devices. A connector includes a plurality of conductive contacts and is mounted on one circuit board by soldering or the like. The plurality of contacts of the connector mounted on one circuit board are each brought into contact with the plurality of contacts of the connector mounted on the other circuit board. Thereby, an electrical connection between the circuit boards is established.

[0003] Patent Document 1 describes a connector in which a plurality of contacts are arranged in a row. The plurality of contacts are formed by punching or pressing from a conductive metal thin plate material and inserted into a plurality of slots arranged in a row. Here, each slot includes a central connecting portion and two leg portions at both ends thereof. Each contact can be selectively inserted into either the central connecting portion or the leg portion of the slot. Thereby, the pitch between adjacent contacts can be changed between a first pitch and a second pitch smaller than the first pitch.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, with the miniaturization of electronic devices such as mobile devices, it has been required to miniaturize the circuit boards mounted on the electronic devices and also to miniaturize the connectors used for connecting the circuit boards. Therefore, it is necessary to reduce the width of a plurality of contacts of the connector and also to reduce the pitch between the plurality of contacts.

[0006] However, in Patent Document 1, due to the limit of the processing accuracy of the metal thin plate material, it is difficult to reduce the width of the contact. Further, in a circuit board, land portions for mounting contacts are arranged relatively widely spaced from each other in order to prevent short circuits due to solder contact. In this case, the plurality of contacts are also provided relatively widely spaced from each other, and the pitch between the plurality of contacts cannot be reduced.

[0007] An object of the present invention is to provide a connector and a connector unit that can be miniaturized.

Means for Solving the Problems

[0008] A connector according to an aspect of the present invention is a connector used for connection with other connection components, and includes an insulating layer, a mounting portion, a conductor layer formed on one surface of the insulating layer, and a bending portion, and a metal support layer formed on the other surface of the insulating layer. In the bending portion, an opening is formed in a portion of the metal support layer that overlaps the conductor layer, and the metal support layer is bent along the bending portion, thereby forming a connection region for connection with the other connection components.

[0009] A connector unit according to another aspect of the present invention includes a first connector that is the above connector and a second connector connected to the connection region of the first connector.

[0010] A connector according to still another aspect of the present invention is a connector used for connection with other connection components, and includes an insulating layer, a mounting portion, a conductor layer formed on one surface of the insulating layer, a bending portion, and a metal support layer formed on the other surface of the insulating layer. In the bending portion, an opening is formed in a portion of the metal support layer that overlaps the conductor layer. The metal support layer is bendable along the bending portion, and a contact portion for contacting the other connection component is provided so as to straddle the bending portion.

Advantages of the Invention

[0011] According to the present invention, the connector and the connector unit can be miniaturized.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

[0013] 1. Configuration of the Connector Hereinafter, a connector and a connector unit according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the configuration of a connector unit according to an embodiment of the present invention. As shown in FIG. 1, the connector unit 1 includes two connectors 100. Each connector 100 is manufactured by bending a laminate including a metal support layer 10, an insulating layer 20, and a conductor layer 30 into a predetermined shape. In FIG. 1, for ease of understanding of the structure, a hatching pattern is applied to the metal support layer 10, and a dot pattern is applied to the insulating layer 20.

[0014] In the following description, when distinguishing between the two connectors 100, the two connectors 100 are referred to as connector 100A and 100B, respectively. Connector 100A is a plug-type connector and has a convex portion 101 formed by bending. Connector 100B is a receptacle-type connector and has a concave portion 102 formed by bending. When the convex portion 101 of connector 100A fits with the concave portion 102 of connector 100B, the conductor layers 30 of each other come into contact. Thereby, connector 100A and connector 100B are electrically connected.

[0015] FIG. 2 is a plan view showing the configuration of the connector 100 before bending. As shown in FIG. 2, before bending, the metal support layer 10 has a substantially rectangular shape. The longitudinal direction of the metal support layer 10 is referred to as the first direction, and the width direction of the metal support layer 10 is referred to as the second direction. The metal support layer 10 is formed of a material having, for example, spring characteristics. In this example, the metal support layer 10 is formed of stainless steel. The insulating layer 20 contains, for example, a resin material and is formed on the entire surface of the metal support layer 10. In this example, the insulating layer 20 contains polyimide. The thickness of the insulating layer 20 is, for example, 3 μm or more and 30 μm or less.

[0016] The conductor layer 30 contains, for example, copper and is formed on the insulating layer 20. The conductor layer 30 has a plurality of conductor patterns 31 and a plurality of pad portions 32. The plurality of conductor patterns 31 are provided on the insulating layer 20 so as to extend in the first direction and be arranged in the second direction. The width of each conductor pattern 31 is, for example, 10 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 50 μm or more and 150 μm or less. The pitch (interval between adjacent conductor patterns 31) of the conductor patterns 31 is, for example, 50 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 0.2 mm (200 μm) or less. In this case, the connector 100 can be easily miniaturized. The plurality of pad portions 32 are provided at one end portion of the insulating layer 20 in the first direction and are respectively connected to the end portions of the plurality of conductor patterns 31. The plurality of pad portions 32 are respectively connected to a plurality of land portions of a circuit board (not shown) by solder. Thereby, the connector 100 is mounted on the circuit board.

[0017] In this example, the conductor layer 30 includes six conductor patterns 31 and six pad portions 32. When distinguishing the six conductor patterns 31, the six conductor patterns 31 are respectively referred to as conductor patterns 31a to 31f. Also, when distinguishing the six pad portions 32, the six pad portions 32 are respectively referred to as pad portions 32a to 32f.

[0018] The pad portions 32a, 32b are arranged to be aligned in the first direction. The pad portions 32c, 32d are arranged to be aligned in the first direction. The pad portions 32e, 32f are arranged to be aligned in the first direction. Also, the pad portions 32a, 32c, 32e are aligned in the second direction, and the pad portions 32b, 32d, 32f are aligned in the second direction. The conductor patterns 31a, 31c, 31e extend from the pad portions 32a, 32c, 32e in the first direction respectively. The conductor patterns 31b, 31d, 31f protrude from the pad portions 32b, 32d, 32f in the second direction respectively, and bend and extend in the first direction.

[0019] According to this configuration, the conductor patterns 31a to 31f extend in the first direction in a state of being aligned in this order in the second direction. Here, since some of the pad portions 32 are aligned in the first direction instead of the second direction, even when the pitch between adjacent conductor patterns 31 is small, the pitch between a plurality of pad portions 32 is maintained relatively large. Thereby, it is possible to prevent a short circuit between the pad portions 32 due to solder when the connector 100 is mounted on the circuit board while reducing the pitch between adjacent conductor patterns 31.

[0020] 2. Details of the Connector Since the configuration of the connector 100 has been described with reference to FIG. 2, further features of each of the connectors 100A and 100B will be described below. FIG. 3 is a diagram showing the configuration of one connector 100A. A plan view of the connector 100A before bending is shown in the left part of FIG. 3, and a perspective view of the connector 100A after bending is shown in the right part of FIG. 3. As shown in the left part of FIG. 3, the metal support layer 10 of the connector 100A extends in the second direction and has three bending portions A1, A2, A3 aligned in this order in the first direction.

[0021] In this example, the region of the connector 100A including the bent portions A2 and A3 serves as the connection region 40 for connection to the connector 100B. That is, the portion of the conductor pattern 31 in the connection region 40 becomes the contact portion 41 for contacting the conductor pattern 31 of the connector 100B. Therefore, the contact portion 41 is provided so as to straddle the bent portions A2 and A3. In the left part of FIG. 3, the contact portions 41 in each conductor pattern 31 are shown by a hatching pattern. Nickel plating or gold (Au) plating may be formed on the contact portion 41. In this case, the electrical connectivity of the contact portion 41 is improved.

[0022] The connector 100A is bent along the bent portions A1 to A3 such that the metal support layer 10 is on the inside and the conductor layer 30 is on the outside. In this example, the bending angle of the connector 100A at each of the bent portions A1 to A3 is approximately 90 degrees. That is, in the metal support layer 10, the connector 100A is bent such that the angle formed by the two regions sandwiching each of the bent portions A1 to A3 is approximately 90 degrees.

[0023] When the connector 100A is bent, as shown in the right part of FIG. 3, the connection region 40 becomes convex. Thereby, a convex portion 101 is formed on the connector 100A. After bending, the dimensions of the connector 100A in the second direction (width direction), height direction, and depth direction are, for example, 1 mm or more and 3 mm or less. In the example in the right part of FIG. 3, the vertical direction is the height direction, and the direction orthogonal to the width direction and the height direction is the depth direction.

[0024] FIG. 4 is an enlarged view showing the structure of the connector 100A in the vicinity of the bent portions A1 to A3. An enlarged view of the A portion of the connector 100A in FIG. 3 is shown on the left side of FIG. 4. A cross-sectional view taken along line B-B of the connector 100A on the left side is shown on the right side of FIG. 4. As shown on the left side of FIG. 4, in the bent portions A1 to A3, an opening a is formed in a region of the metal support layer 10 that overlaps with the conductor pattern 31. In this example, the opening a is a through hole, but the embodiment is not limited to this. The opening a may be a blind hole. That is, in the bent portions A1 to A3, the thickness of the region of the metal support layer 10 that overlaps with the conductor pattern 31 may be smaller than the thickness of other regions of the metal support layer 10.

[0025] By forming the opening a in the metal support layer 10, it is possible to facilitate the bending of the connector 100A in the bent portions A1 to A3 while maintaining the shape of the connector 100A. As shown on the right side of FIG. 4, in the bent portions A1 to A3, the width of the opening a in the second direction may be made larger than the width of the conductor pattern 31a in a range where at least a part of the region of the metal support layer 10 that does not overlap with the conductor pattern 31 remains.

[0026] FIG. 5 is a view showing the configuration of the other connector 100B. A plan view of the connector 100B before bending is shown on the left side of FIG. 5, and a perspective view of the connector 100B after bending is shown on the right side of FIG. 5. As shown on the left side of FIG. 5, the metal support layer 10 of the connector 100B has six bent portions B1 to B6 that extend in the second direction and are arranged in this order in the first direction.

[0027] In this example, the region of the connector 100B including the bent portions B4 and B5 serves as a connection region 40 for connecting to the connector 100A. That is, the portion of the conductor pattern 31 in the connection region 40 serves as a contact portion 41 for contacting the conductor pattern 31 of the connector 100A. Therefore, the contact portion 41 is provided so as to straddle the bent portions B4 and B5. On the left side of FIG. 5, the contact portions 41 in each conductor pattern 31 are shown in a hatching pattern. Similar to the connector 100A, nickel plating or gold plating may be formed on the contact portion 41.

[0028] The connector 100B is bent along the bending portions B1 to B6 such that the metal support layer 10 is on the inner side and the conductor layer 30 is on the outer side. In this example, the bending angle of the connector 100B at each of the bending portions B1 to B6 is approximately 90 degrees. That is, in the metal support layer 10, the connector 100B is bent such that the angle formed by the two regions sandwiching each of the bending portions B1 to B6 is approximately 90 degrees.

[0029] When the connector 100B is bent, as shown in the right part of FIG. 5, the connection region 40 becomes concave. As a result, a recess 102 is formed in the connector 100B. After bending, the dimensions of the connector 100B in the second direction (width direction), height direction, and depth direction are, for example, 1 mm or more and 3 mm or less. In the example of the right part of FIG. 5, the vertical direction is the height direction, and the direction orthogonal to the width direction and the height direction is the depth direction.

[0030] In the bending portions B1 to B6, openings similar to the opening a in FIG. 4 are formed in the region of the metal support layer 10 overlapping the conductor pattern 31. Therefore, it is possible to facilitate the bending of the connector 100B at the bending portions B1 to B6 while maintaining the shape of the connector 100B.

[0031] 3. Manufacturing method of the connector FIG. 6 is a perspective view showing a connector assembly sheet. As shown in FIG. 6, in the present embodiment, a plurality of connectors 100 are formed on the connector assembly sheet 2 in an aligned state by a roll-to-roll method. The connector 100A and the connector 100B may be formed on separate connector assembly sheets 2.

[0032] Hereinafter, a method for manufacturing the connector 100 will be described while referring to a cross-section of one connector 100 formed on the connector assembly sheet 2. FIGS. 7 to 15 are diagrams for explaining an example of the method for manufacturing the connector 100. FIGS. 7 to 15 correspond to the cross-sectional view taken along the line A-A of the connector 100 in FIG. 2. In addition, although the manufacturing method of the connector 100A is described in FIGS. 7 to 15, in FIGS. 13 to 15, the manufacturing method of the connector 100B is the same except that the bent portions B1 to B6 are formed on the metal support layer 10 instead of the bent portions A1 to A3.

[0033] First, as shown in FIG. 7, a metal sheet 2A made of, for example, stainless steel is prepared. The thickness of the metal sheet 2A is, for example, 50 μm or more. The material of the metal sheet 2A is not limited to stainless steel and may be other metals such as aluminum.

[0034] Next, as shown in FIG. 8, an insulating layer 20 is formed on the upper surface of the metal sheet 2A. The insulating layer 20 may be formed by applying a photosensitive resin precursor to the entire upper surface of the metal sheet 2A and exposing the photosensitive resin precursor using ultraviolet light. In this example, the material of the insulating layer 20 is polyimide, but other resins such as epoxy may also be used. Subsequently, as shown in FIG. 9, a seed layer 30A is formed so as to cover the upper surface of the insulating layer 20. The seed layer 30A is formed, for example, by sputtering. Examples of the material of the seed layer 30A include chromium, copper, nickel, titanium, or alloys thereof.

[0035] Thereafter, as shown in FIG. 10, a mask 110 having a predetermined pattern opening 111 is formed on the upper surface of the seed layer 30A. The mask 110 may be formed, for example, by exposing and developing a photosensitive dry film resist. Next, as shown in FIG. 11, a conductor layer 30 is formed on the upper surface of the seed layer 30A through the pattern opening 111 of the mask 110, for example, by copper plating. The conductor layer 30 includes a plurality of conductor patterns 31 and a plurality of pad portions 32. Also, the portion of the conductor pattern 31 in the connection region 40 becomes the contact portion 41.

[0036] Subsequently, as shown in FIG. 12, the exposed portions of the mask 110 and the seed layer 30A are sequentially removed. Note that in FIG. 12, the illustration of the seed layer 30A is omitted. In FIGS. 9 to 12, the conductor layer 30 is formed by the semi-additive method, but the embodiment is not limited thereto. The conductor layer 30 may be formed by the additive method or the subtractive method.

[0037] Next, as shown in FIG. 13, a mask 120 is formed on a specific portion of the lower surface of the metal sheet 2A. The mask 120 has through holes 121 at a plurality of predetermined positions. The method of forming the mask 120 is the same as the method of forming the mask 110. Subsequently, etching is performed on the portion of the metal sheet 2A exposed from the through holes 121 of the mask 120 using an etching solution. The etching solution may be, for example, a ferric chloride solution.

[0038] By performing the etching, as shown in FIG. 14, the portion of the metal sheet 2A exposed from the mask 120 is removed, and the metal support layer 10 is formed on the metal sheet 2A. Further, a plurality of openings a are formed in the metal support layer 10 so as to overlap the plurality of through holes 121 of the mask 120. Each opening a is a through hole, but when the openings a1 to a3 are bottomed holes, etching is performed on the portion of the metal sheet 2A overlapping the plurality of through holes 121 of the mask 120 for a relatively short time.

[0039] In this example, the plurality of openings a include six openings a1, six openings a2, and six openings a3. The six openings a1 are formed so as to be arranged in the second direction (the depth direction in FIG. 14). Similarly, the six openings a2 are formed so as to be arranged in the second direction. The six openings a3 are formed so as to be arranged in the second direction. In the metal support layer 10, the portion where the plurality of openings a1 are formed becomes the bent portion A1, the portion where the plurality of openings a2 are formed becomes the bent portion A2, and the portion where the plurality of openings a3 are formed becomes the bent portion A3.

[0040] Also, in this example, in FIG. 11, six conductor patterns 31a to 31f and six pad portions 32a to 32f are formed (see FIG. 2). The six openings a1 formed in FIG. 14 overlap the six conductor patterns 31a to 31f respectively at the bent portion A1. Similarly, the six openings a2 overlap the six conductor patterns 31a to 31f respectively at the bent portion A2. The six openings a3 overlap the six conductor patterns 31a to 31f respectively at the bent portion A3.

[0041] Thereafter, as shown in FIG. 15, the mask 120 is removed from the metal support layer 10. As a result, the connector assembly sheet 2 of FIG. 6 in which a plurality of connectors 100A before bending are formed is completed. The openings a1 to a3 may be formed by laser processing using, for example, a YAG (yttrium aluminum garnet) laser or the like instead of the steps of FIGS. 13 to 15.

[0042] Thereafter, the connectors 100A are recovered from the connector assembly sheet 2. Finally, the recovered connectors 100A are bent along the bent portions A1 to A3. As a result, the connectors 100A on the right side of FIG. 4 are completed. According to the above manufacturing method, in the manufacture of the connector 100, it is not necessary to use an adhesive layer. Thereby, the heat resistance of the connector 100 can be improved.

[0043] 4. Cross-sectional shape of the opening FIG. 16 is an enlarged view showing an example of the cross-sectional shape of the openings a1 to a3. FIG. 16 corresponds to the cross-sectional view taken along the line A-A of the connector 100 in FIG. 2. The same applies to FIG. 17 described later. Also, in FIG. 16 and FIG. 17 described later, only the opening a1 is shown, and the illustration of the openings a2 and a3 is omitted, but the cross-sectional shapes of the openings a2 and a3 are the same as the cross-sectional shape of the opening a1.

[0044] As shown in Fig. 16, the opening a1 may have a rectangular cross-sectional shape. Here, let the length of the opening a1 in the first direction centered on the bent portion A1 be X, the depth of the opening a1 be Y, and the thickness of the metal support layer 10 be T. In this case, X is preferably 0.5×T or more, more preferably 5×T or more, and even more preferably 6×T or more. Also, Y is preferably 0.4×T or more, and more preferably 0.5×T or more. In the example of Fig. 16, Y = T.

[0045] Fig. 17 is an enlarged view showing another example of the cross-sectional shapes of the openings a1 to a3. As shown in Fig. 17, the opening a1 may have a tapered cross-sectional shape. Specifically, as the depth of the opening a1 increases, the length of the opening a1 in the first direction may gradually decrease. Therefore, in the first direction, if the length of the opening a1 on the surface portion of the metal support layer 10 is X and the length of the bottom surface portion of the opening a1 is Z, Z may be smaller than X.

[0046] 5. Effects In the connector 100 according to the present embodiment, a conductor layer 30 having a pad portion 32 as a mounting portion is formed on one surface of the insulating layer 20. Also, a metal support layer 10 having bent portions A1 to A3 or bent portions B1 to B6 is formed on the other surface of the insulating layer 20. By bending the metal support layer 10 along the bent portions A1 to A3 or the bent portions B1 to B6, a connection region 40 is formed.

[0047] According to this configuration, it is possible to manufacture the connector 100 using the manufacturing technology of a wiring circuit board. Therefore, the connection region 40 can be formed in a small size. Also, since the pattern of the conductor layer 30 can be arbitrarily formed by the manufacturing technology of the wiring circuit board, the degree of freedom in arranging the mounting portion is improved. Therefore, even when the connection region 40 is formed in a small size, the mounting portion can be arranged so that no short circuit occurs when the mounting portion is mounted on a circuit board or the like by solder.

[0048] Further, in the bent portions A1 to A3 or the bent portions B1 to B6, an opening a is formed in the portion of the metal support layer 10 that overlaps the conductor layer 30. Therefore, even when the metal support layer 10 is bent, the strain of the conductor layer 30 is reduced. As a result, the breakage resistance of the connector 100 is improved. Further, since a part of the metal support layer 10 remains in the bent portions A1 to A3 or the bent portions B1 to B6, the shape of the connector 100 is maintained even when the metal support layer 10 is bent. As a result of these, the connector 100 can be miniaturized.

[0049] The conductor layer 30 extends in the first direction. The bent portions A1 to A3 or the bent portions B1 to B6 extend along the second direction. Therefore, the metal support layer 10 can be easily bent along the bent portions A1 to A3 or the bent portions B1 to B6. Also, in the second direction, the length of the opening a is larger than the length of the conductor layer 30 that overlaps the opening a. In this case, since the opening a is sufficiently large in the second direction, the breakage resistance of the connector 100 is further improved.

[0050] The length (X) of the opening a in the first direction is preferably 0.5 times or more, more preferably 5 times or more, and even more preferably 6 times or more the thickness (T) of the metal support layer 10. In this case, since the opening a is sufficiently large in the first direction, the breakage resistance of the connector 100 is further improved.

[0051] The depth (Y) of the opening a is preferably 0.4 times or more, more preferably 0.5 times or more of T. Also, it is even more preferable that Y is 1 time of T, that is, the opening a is a through hole. In this case, since the opening a is sufficiently deep, the breakage resistance of the connector 100 is further improved.

[0052] In the connection region 40, a plurality of contact portions 41 that come into contact with another connector 100 are provided so as to extend in a first direction and be arranged in a second direction. In this case, the connector 100 can be used for transmitting various electrical signals. Also, according to the manufacturing technology of the wiring circuit board, it is possible to reduce the width of each contact portion 41 and reduce the pitch between the plurality of contact portions 41 in the second direction. Therefore, even when the plurality of contact portions 41 are provided so as to be arranged in the second direction, the connector 100 can be miniaturized.

[0053] Further, the mounting portion of the conductor layer 30 includes a plurality of pad portions 32 that are electrically connected to the plurality of contact portions 41 respectively. In this case, an electrical signal can be transmitted to the corresponding contact portion 41 via the pad portion 32. Here, since the degree of freedom in the arrangement of the mounting portion is improved, it is not necessary to match the pitch of the plurality of pad portions 32 with the pitch of the plurality of contact portions 41.

[0054] Therefore, at least a part of the plurality of pad portions 32 may be provided so as to be arranged in the first direction. According to this arrangement, it is possible to sufficiently maintain a large pitch between at least some of the pad portions 32 without hindering the miniaturization of the connector 100. Thereby, while miniaturizing the connector 100, it is possible to easily prevent a short circuit between the pad portions 32 due to solder when the pad portions 32 are mounted on a circuit board or the like.

[0055] Also, in the present embodiment, a plurality of contact portions 41 are formed in the connection region 40 using a part of the conductor pattern 31 of the conductor layer 30, and the metal support layer 10 is arranged so as to face the plurality of conductor patterns 31 in the connection region 40. In this case, electromagnetic noise to the plurality of contact portions 41 is shielded. Thereby, it is possible to prevent electromagnetic noise from being mixed into the electrical signal transmitted by the connector 100.

[0056] Since the connector unit 1 includes connectors 100A and 100B that are connected to each other, it is possible to miniaturize the connector unit 1. Thereby, the connector unit 1 can be mounted on a small electronic device such as a mobile device.

[0057] 6. Other embodiments (1) In the above embodiment, at least a part of the plurality of pad portions 32 is provided so as to be arranged in the first direction, but the embodiment is not limited thereto. At least a part of the plurality of pad portions 32 may be provided so as to be arranged in a direction intersecting the second direction. Therefore, at least a part of the plurality of pad portions 32 may be provided so as to be arranged in a staggered manner.

[0058] Even in these configurations, it is possible to maintain a large pitch between at least some of the pad portions 32 without hindering the miniaturization of the connector 100. Thereby, while reducing the pitch between the contact portions 41, it is possible to prevent a short circuit between the pad portions 32 due to solder when the pad portions 32 are mounted on a circuit board or the like. On the other hand, when the connector 100 can be sufficiently miniaturized, all the pad portions 32 may be provided so as to be arranged in the second direction.

[0059] (2) In the above embodiment, the bending angle of the metal support layer 10 along the bending portions A1 to A3 or the bending portions B1 to B6 is 90 degrees, but the embodiment is not limited thereto. The bending angle of the metal support layer 10 may be other angles. Here, the bending angle of the metal support layer 10 is preferably 20 degrees or more and 150 degrees or less. In this case, it is more reliably prevented that the metal support layer 10 is damaged by bending.

[0060] (3) In the above embodiment, the connection region 40 has a convex shape or a concave shape. Therefore, the metal support layer 10 has two or more bending portions A1 to A3 or bending portions B1 to B6. In this case, the connector 100 comes into contact with other connection components more reliably. Thereby, the connection reliability of the connector 100 can be improved.

[0061] However, the embodiments are not limited thereto. As long as the connector 100 contacts other connection components with sufficient reliability, the metal support layer 10 may have only one bent portion, and the connection region 40 does not have to have a convex shape or a concave shape. For example, in the connector unit 1, two or more connectors 100 connected to each other may have the same shape.

[0062] (4) In the above embodiment, the connector 100 is circulated in a bent state, but the embodiments are not limited thereto. The connector 100 may be circulated in a state before being bent.

[0063] Even in this case, in the connector 100, a conductor layer 30 having a mounting portion is formed on one surface of the insulating layer 20. Also, a metal support layer 10 having bent portions A1 to A3 or bent portions B1 to B6 is formed on the other surface of the insulating layer 20. The metal support layer 10 is bendable along the bent portions A1 to A3 or the bent portions B1 to B6, and the contact portions 41 are provided so as to straddle the bent portions A1 to A3 or the bent portions B1 to B6.

[0064] According to this configuration, the connector 100 is circulated in a state before being bent. After the connector 100 is circulated, a user of the connector 100 can form a connection region 40 for connecting to other connection components by bending the metal support layer 10 along the bent portions A1 to A3 or the bent portions B1 to B6.

[0065] In the bent portions A1 to A3 or the bent portions B1 to B6, an opening a is formed in a portion of the metal support layer 10 that overlaps the conductor layer 30. Therefore, even when the metal support layer 10 is bent, the strain of the conductor layer 30 is reduced. Thereby, the breakage resistance of the connector 100 is improved. Further, since a part of the metal support layer 10 remains in the bent portions A1 to A3 or the bent portions B1 to B6, the shape of the connector 100 is maintained even when the metal support layer 10 is bent. As a result of these, the connector 100 can be miniaturized.

[0066] 7. Example In the following examples, the relationship between the structure of the opening and the damage resistance of the connector against bending was evaluated by simulation. In this evaluation, the nominal strain of the conductor layer of various connectors was calculated. Further, as a comparative example, the nominal strain of the conductor layer of a connector having no opening was calculated. Furthermore, for connectors having the same thickness of the metal support layer, the change rate of the nominal strain of the conductor layer of each example with respect to the nominal strain of the conductor layer of the comparative example (hereinafter referred to as the strain change rate) was calculated. A connector with a strain change rate of 90% or more was evaluated as "△", and a connector with a strain change rate of less than 90% was evaluated as "〇".

[0067] The connectors according to Examples 1 to 8 have the structure shown in FIG. 16. That is, in Examples 1 to 8, the opening has a rectangular cross-sectional shape. The lengths (X) of the openings in Examples 1 to 8 are 25 μm, 50 μm, μm, 250 μm, 300 μm, 600 μm, 900 μm, and 1500 μm, respectively. The depths (Y) of the openings in Examples 1 to 8 are all 25 μm, and the thicknesses (T) of the metal support layers are all 50 μm. On the other hand, the connector according to Comparative Example 1 has the same structure as the connectors according to Examples 1 to 8, except that no opening is formed.

[0068]

Table 1

[0069] Table 1 shows the evaluation results of the connectors according to Examples 1 to 8. As shown in Table 1, the strain change rates of the conductor layers of Examples 1 to 8 with respect to the conductor layer of Comparative Example 1 were 97.9%, 91.4%, 94.0%, 79.6%, 82.0%, 83.9%, 84.0%, and 83.9%, respectively. Therefore, the evaluation of the connectors according to Examples 1 to 3 was "△", and the evaluation of the connectors according to Examples 4 to 8 was "〇".

[0070] The connectors according to Examples 9 to 11 have the structure shown in FIG. 17. That is, in Examples 9 to 11, the opening has a tapered cross-sectional shape. In Example 9, X is 300 μm, and the length (Z) of the bottom surface of the opening is 250 μm. In Example 10, X is 325 μm, and Z is 275 μm. In Example 11, X is 350 μm, and Z is 300 μm. In all of Examples 9 to 11, Y is 25 μm, and T is 50 μm. That is, the angle of the tapered surface of the opening in Examples 9 to 11 is 45 degrees with respect to the vertical direction.

[0071]

Table 2

[0072] Table 2 shows the evaluation results of the connectors according to Examples 9 to 11. As shown in Table 2, the strain change rates of the conductor layers of Examples 9 to 11 with respect to the conductor layer of Comparative Example 1 in Table 1 were 79.6%, 81.0%, and 82.3%, respectively. Therefore, the evaluation of the connectors according to Examples 9 to 11 was "〇".

[0073] The connectors according to Examples 12 to 16 have the structure shown in FIG. 16. In Examples 12 to 16, Ys are different from each other. Ys in Examples 12 to 16 are 5 μm, 10 μm, 15 μm, 20 μm, and 50 μm, respectively. In all of Examples 12 to 16, X is 300 μm, and T is 50 μm. That is, in Example 16, the opening is a through hole.

[0074]

Table 3

[0075] Table 3 shows the evaluation results of the connectors according to Examples 12 to 16. As shown in Table 3, the strain change rates of the conductor layers of Examples 12 to 16 with respect to the conductor layer of Comparative Example 1 in Table 1 were 99.3%, 94.7%, 91.6%, 87.7%, and 50.6% respectively. Therefore, the evaluations of the connectors according to Examples 12 to 14 were "△", and the evaluations of the connectors according to Examples 15 and 16 were "〇".

[0076] In Examples 5 to 8 of Table 1, not only the nominal strain of the conductor layer but also the nominal strain of the metal support layer was significantly reduced. Similarly, in Examples 9 to 11 of Table 2 and Examples 12 to 16 of Table 3, the nominal strain of the metal support layer was significantly reduced.

[0077] The connectors according to Examples 17 to 19 have the structure shown in FIG. 16. In Examples 17 to 19, T's are different from each other. Also, Y is 50% of T. Y of Example 17 is 12.5 μm and T is 25 μm. Y of Example 18 is 37.5 μm and T is 75 μm. Y of Example 19 is 50 μm and T is μm. X of Examples 17 to 19 is all 300 μm. On the other hand, the connectors according to Comparative Examples 2 to 4 have the same structure as the connectors according to Examples 17 to 19 respectively, except that no opening is formed.

[0078]

Table 4

[0079] Table 4 shows the evaluation results of the connectors according to Examples 17 to 19. As shown in Table 4, the strain change rate of the conductor layer of Example 17 with respect to the conductor layer of Comparative Example 2 was 89.1%. The strain change rate of the conductor layer of Example 18 with respect to the conductor layer of Comparative Example 3 was 68.7%. The strain change rate of the conductor layer of Example 19 with respect to the conductor layer of Comparative Example 4 was 72.0%. Therefore, the evaluations of the connectors according to Examples 17 to 19 were "〇". As already described in Example 5 of Table 1, when T is 50 μm, the evaluation of the connector is "〇".

[0080] From the above Examples 1 to 19, it was confirmed that by forming an opening where X is 0.5×T or more in the metal support layer, the breakage resistance of the connector against bending is improved. Further, when X is 5×T or more and Y is 0.4×T or more, it was confirmed that the breakage resistance of the connector is further improved. Furthermore, when X is 6×T or more, since the nominal strain of the metal support layer is greatly reduced, it was confirmed that the breakage resistance of the connector is further improved. Also, even when the cross-sectional shape of the opening is tapered, it was confirmed that the connector breakage resistance is equivalent to the case where the cross-sectional shape of the opening is rectangular.

[0081] 8. Corresponding relationship between each component of the claims and each part of the embodiment Hereinafter, examples of the correspondence between each component of the claims and each part of the embodiment will be described, but the present invention is not limited to the following examples. As each component of the claims, various other elements having the configurations or functions described in the claims can also be used.

[0082] In the above embodiment, the connector 100 is an example of a connector, one of the connectors 100A and 100B is an example of another connector or a first connector, and the other of the connectors 100A and 100B is an example of a connecting component or a second connector. The insulating layer 20 is an example of an insulating layer, the pad portion 32 is an example of a mounting portion or a pad portion, the conductor layer 30 is an example of a conductor layer, the bent portions A1 to A3 and B1 to B6 are examples of bent portions, the metal support layer 10 is an example of a metal support layer, the opening a is an example of an opening, the connection region 40 is an example of a connection region, and the contact portion 41 is an example of a contact portion.

[0083] 9. Summary of the embodiment (Claim 1) The connector according to claim 1 is a connector used for connection with other connecting components, an insulating layer, having a mounting portion, a conductor layer formed on one surface of the insulating layer, having a bent portion, and a metal support layer formed on the other surface of the insulating layer. In the bending portion, an opening is formed in a portion of the metal support layer that overlaps the conductor layer. By bending the metal support layer along the bending portion, a connection region for connecting to the other connection component is formed.

[0084] In this connector, a conductor layer having a mounting portion is formed on one surface of the insulating layer, and a metal support layer having a bending portion is formed on the other surface of the insulating layer. By bending the metal support layer along the bending portion, a connection region is formed.

[0085] According to this configuration, it is possible to manufacture the connector using the manufacturing technology of the wiring circuit board. Therefore, the connection region can be formed in a small size. In addition, since the pattern of the conductor layer can be arbitrarily formed by the manufacturing technology of the wiring circuit board, the degree of freedom in arranging the mounting portion is improved. Therefore, even when the connection region is formed in a small size, the mounting portion can be arranged so that no short circuit occurs when the mounting portion is mounted on a circuit board or the like by solder.

[0086] Also, in the bending portion, an opening is formed in a portion of the metal support layer that overlaps the conductor layer. Therefore, even when the metal support layer is bent, the strain of the conductor layer is reduced. As a result, the breakage resistance of the connector is improved. Further, since a part of the metal support layer remains in the bending portion, the shape of the connector is maintained even when the metal support layer is bent. As a result of these, the connector can be miniaturized.

[0087] (Item 2) In the connector according to Item 1, the conductor layer extends in a first direction, and the bending portion may extend along a second direction intersecting the first direction.

[0088] In this case, the metal support layer can be easily bent along the bending portion.

[0089] (Item 3) In the connector according to Item 2, In the second direction, the length of the opening may be greater than the length of the conductor layer overlapping the opening.

[0090] In this case, since the opening is sufficiently large in the second direction, the damage resistance of the connector is further improved.

[0091] (Item 4) In the connector according to Item 2 or Item 3, the length of the opening in the first direction may be 0.5 times or more the thickness of the metal support layer.

[0092] In this case, since the opening is sufficiently large in the first direction, the damage resistance of the connector is further improved.

[0093] (Item 5) In the connector according to any one of Items 1 to 4, the opening may be a through hole.

[0094] In this case, the damage resistance of the connector is further sufficiently improved.

[0095] (Item 6) In the connector according to any one of Items 1 to 5, the bending angle of the metal support layer along the bent portion may be 20 degrees or more and 150 degrees or less.

[0096] In this case, it is more reliably prevented that the metal support layer is damaged by bending.

[0097] (Item 7) In the connector according to any one of Items 1 to 6, the metal support layer has two or more of the bent portions, and the connection region may be formed by bending the metal support layer along two or more of the bent portions.

[0098] In this case, the connector reliably contacts other connection components. Thereby, the reliability of the connection of the connector can be improved.

[0099] (Item 8) The connector unit according to Item 8 is a first connector which is the connector according to any one of Items 1 to 7, and a second connector connected to the connection region of the first connector.

[0100] In this case, since the connector unit can be miniaturized, the connector unit can be mounted on a small electronic device such as a mobile device.

[0101] (Item 9) The connector according to Item 9 is a connector used for connection with other connection parts, an insulating layer, a conductor layer having a mounting portion and formed on one surface of the insulating layer, a metal support layer having a bent portion and formed on the other surface of the insulating layer, in the bent portion, an opening is formed in a portion of the metal support layer that overlaps the conductor layer, the metal support layer is bendable along the bent portion, and a contact portion for contacting the other connection parts is provided so as to straddle the bent portion.

[0102] In this connector, a conductor layer having a mounting portion is formed on one surface of the insulating layer, and a metal support layer having a bent portion is formed on the other surface of the insulating layer. The metal support layer is bendable along the bent portion, and the contact portion is provided so as to straddle the bent portion. In this case, by bending the metal support layer along the bent portion, it is possible to form a connection region for connection with other connection parts.

[0103] According to this configuration, it is possible to manufacture the connector using the manufacturing technology of the wiring circuit board. Therefore, the connection area can be formed in a small size. Also, since the pattern of the conductor layer can be arbitrarily formed by the manufacturing technology of the wiring circuit board, the degree of freedom in arranging the mounting portions is improved. Thus, even when the connection area is formed in a small size, the mounting portions can be arranged so that no short circuit occurs when the mounting portions are mounted on a circuit board or the like by solder.

[0104] Further, in the bent portion, an opening is formed in a portion of the metal support layer that overlaps the conductor layer. Therefore, even when the metal support layer is bent, the strain of the conductor layer is reduced. Thereby, the breakage resistance of the connector is improved. Furthermore, since a part of the metal support layer remains in the bent portion, the shape of the connector is maintained even when the metal support layer is bent. As a result of these, the connector can be miniaturized.

Description of Reference Numerals

[0105] 1...connector unit, 2...connector assembly sheet, 2A...metal sheet, 10...metal support layer, 20...insulating layer, 30...conductor layer, 30A...seed layer, 31, 31a to 31f...conductor patterns, 32, 32a to 32f...pad portions, 100, 100A, 100B...connectors, 101...protrusion, 102...recess, 110, 120...masks, 111...pattern opening, 121...through hole, A1 to A3, B1 to B6...bent portions, a, a1 to a3...openings

Claims

1. A connector used for connection with other connection components, comprising an insulating layer, a conductor layer having a mounting portion and formed on one surface of the insulating layer, and a metal support layer having a bent portion and formed on the other surface of the insulating layer, wherein an opening is formed in a portion of the metal support layer that overlaps the conductor layer at the bent portion, and a connection region for connection with the other connection components is formed by bending the metal support layer along the bent portion.

2. The conductor layer extends in a first direction, and the bent portion extends along a second direction intersecting the first direction. The connector according to claim 1.

3. In the second direction, the length of the opening is greater than the length of the conductor layer overlapping the opening. The connector according to claim 2.

4. The length of the opening in the first direction is 0.5 times or more the thickness of the metal support layer. The connector according to claim 2 or 3.

5. The opening is a through hole. The connector according to any one of claims 1 to 3.

6. The bending angle of the metal support layer along the bent portion is 20 degrees or more and 150 degrees or less. The connector according to any one of claims 1 to 3.

7. The metal support layer has two or more bent portions, and the connection region is formed by bending the metal support layer along two or more bent portions. The connector according to any one of claims 1 to 3.

8. A first connector which is the connector according to any one of claims 1 to 3, and a second connector connected to the connection region of the first connector. A connector unit.

9. A connector used for connection with other connection components, comprising an insulating layer, a conductor layer having a mounting portion and formed on one surface of the insulating layer, and a metal support layer having a bent portion and formed on the other surface of the insulating layer, wherein an opening is formed in a portion of the metal support layer that overlaps the conductor layer at the bent portion, the metal support layer is bendable along the bent portion, and a contact portion for contacting the other connection components is provided so as to straddle the bent portion.

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