Water circulation device, cutting device and method for manufacturing cut product

Abstract

To provide a water circulation device capable of continuously supplying water even when an anomaly in circulation occurs, and to provide a cutting device, and a method for manufacturing a cut product.SOLUTION: A water circulation device 30 that cools, with first water W1 or second water W2, a spindle portion 6 that rotationally drives a blade 8 for cutting a to-be-cut object Sb, includes: a tank 31 in which the first water W1 is stored; a pump 32 connected to the tank 31 and configured to pump the first water W1 toward the spindle portion 6; a circulating flow passage F configured such that the first water W1 flowing out from the tank 31 flows into the tank 31 again via the pump 32 and the spindle portion 6; a switch valve 34 capable of switching the first water W1 flowing through the circulating flow passage F to the second water W2; and a control unit 50 configured to control operations of the pump 32 and the switch control valve 34. The control unit 50 controls the switch valve 34 to cause the second water W2 to flow through the circulating flow passage F when an anomaly in circulation of the first water W1 is detected.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a water circulation device, a cutting device, and a method for manufacturing a cut product.

Background Art

[0002] Generally, a substrate on which semiconductor chips or the like are fixed is resin-sealed and then cut by a cutting device to be fragmented and used as an electronic component. Conventionally, a cutting device for cutting a resin-sealed substrate is known. When cutting a substrate with a cutting device, water (cutting water) is used to cool the cutting blade and the substrate and to remove machining chips during cutting. In addition, water (cooling water) different from the cutting water is used to cool the spindle unit that rotates the blade. From the perspective of water conservation, these waters may be circulated and reused.

[0003] Patent Document 1 discloses a water circulation device for circulating and reusing water (processing water in Patent Document 1) used for cooling a blade and removing machining chips when cutting a resin-sealed substrate with a cutting device (processing device in Patent Document 1). The water after cutting the substrate contains impurities such as machining chips and cannot be reused as it is. In the water circulation device disclosed in Patent Document 1, the water after substrate cutting is filtered, irradiated with ultraviolet rays, and subjected to impurity ion removal, etc., to regenerate and reuse the water that can be used for substrate cutting.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In order to circulate water (waste liquid in Patent Document 1) after substrate cutting, the water is pumped by a pump (waste liquid supply pump and clean water supply pump in Patent Document 1). Filtration, ultraviolet irradiation, impurity ion removal, etc. are performed on the pumped water, and water that can be used for substrate cutting is regenerated. However, if abnormal water circulation occurs due to pump failure or the like, the water cannot be pumped. In this case, since water circulation does not occur, water for cutting cannot be supplied to the substrate, and the substrate cannot be cut by the cutting device.

[0006] Also, although not mentioned in Patent Document 1, water for cooling the spindle part that rotates the blade may also be circulated and reused using a pump. However, also in this case, if abnormal circulation occurs due to pump failure or the like, water circulation stops, and the spindle part cannot be properly cooled.

[0007] Therefore, there is a need for a water circulation device, a cutting device, and a method for manufacturing a cut product that can continue to supply water even when abnormal circulation occurs.

Means for Solving the Problems

[0008] One embodiment of the water circulation device according to the present disclosure is a water circulation device that cools a spindle part that rotationally drives a blade for cutting an object to be cut with first water or second water, a tank in which the first water is stored, a pump connected to the tank and pumping the first water stored in the tank toward the spindle part, a circulation flow path configured such that the first water flowing out of the tank flows back into the tank again via the pump and the spindle part, a switching valve capable of switching the first water flowing through the circulation flow path to the second water, and a control unit that controls the operation of the pump and the switching valve, wherein the control unit controls the switching valve to circulate the second water through the circulation flow path when detecting abnormal circulation of the first water.

[0009] One embodiment of the cutting device according to the present disclosure includes the water circulation device described above, a mounting table on which the object to be cut is placed, and a blade that cuts the object to be cut placed on the mounting table and a spindle unit that rotationally drives the blade, and a cutting mechanism including the same.

[0010] One embodiment of the method for manufacturing a cut product according to the present disclosure is a method for manufacturing a cut product using the cutting device described above, including a cooling step of circulating the first water through the circulation flow path by the water circulation device to cool the spindle unit, a fixing step of operating a water-sealed vacuum pump after placing the object to be cut on the mounting table to fix the object to be cut to the mounting table, and a cutting step of cutting the object to be cut by the cutting mechanism to obtain a cut product.

Advantages of the Invention

[0011] According to the embodiment of the present disclosure, it is possible to provide a water circulation device, a cutting device, and a method for manufacturing a cut product that can continuously supply water even when a circulation abnormality occurs.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Embodiments for Carrying Out the Invention

[0013] Hereinafter, embodiments of the water circulation device, the cutting device, and the method for manufacturing a cut product according to the present disclosure will be described in detail with reference to the drawings. Note that the embodiments described below are examples for explaining the water circulation device, the cutting device, and the method for manufacturing a cut product, and the water circulation device, the cutting device, and the method for manufacturing a cut product are not limited to these embodiments. Therefore, the water circulation device, the cutting device, and the method for manufacturing a cut product according to the present disclosure can be implemented in various forms without departing from the gist thereof.

[0014] After the substrate with elements such as semiconductor chips fixed thereon is resin-sealed, it is cut and separated into individual pieces to be used as electronic components. To cut the resin-sealed substrate, a dedicated cutting device is used.

[0015] The resin-sealing of the substrate is performed by placing the substrate on a mold (not shown) of a resin molding device and supplying liquid molten resin into the mold. The molten resin may be a thermoplastic resin or a thermosetting resin. The thermosetting resin has a reduced viscosity when heated, and further polymerization and curing occur when heated further, resulting in a cured resin. When resin-sealing a substrate with elements such as semiconductor chips fixed thereon, it is desirable to use a thermosetting resin. The elements fixed to the substrate are protected by the sealed resin.

[0016] 〔Configuration of the Molded Substrate〕 In the present embodiment, the formed substrate Sb (an example of an object to be cut), which is an object to be cut by the cutting device 1 (see FIG. 2), as shown in FIG. 1, is obtained by resin-sealing a substrate 63 on which a plurality of elements 61 are fixed to form a resin package 65 on the side of the elements 61. The element 61 is, for example, an integrated circuit (semiconductor chip). The electrode 61a is a part of the element 61 and is exposed on the side opposite to the resin package 65 with respect to the substrate 63. In the present embodiment, a plurality of elements 61 are fixed to one substrate 63, and one element 61 has a plurality of electrodes 61a. In the example of FIG. 1, the number of elements 61 fixed to one substrate 63 is 21, and the number of electrodes 61a that one element 61 has is 4. However, the number of elements 61 fixed to one substrate 63 is not limited to 21, and the number of electrodes 61a that one element 61 has is not limited to 4. The dashed line in FIG. 1 represents the location to be cut by the cutting device 1 described later. In FIG. 1, the three on the upper right diagonal represent the electronic components Sc (an example of cut products) after being cut from the formed substrate Sb by the cutting device 1 of the present embodiment. One electronic component Sc has one element 61. Examples of the electronic component Sc include a BGA (Ball Grid Array) substrate, an LGA (Land Grid Array) substrate, a CSP (Chip Size Package) substrate, an LED (Light Emitting Diode) substrate, and a QFN (Quad Flat No-leaded) substrate. Further, the formed substrate Sb according to the present embodiment is not limited to the substrate 63 on which the elements 61 are fixed and resin-sealed. The formed substrate Sb may be, for example, a wiring substrate on which no elements 61 are fixed and which is provided with single-layer or multi-layer wirings.

[0017] 〔Configuration of the cutting device〕 FIG. 2 is a plan view schematically showing the cutting device 1 according to the present embodiment. The cutting device 1 is configured to cut the formed substrate Sb into a plurality of electronic components Sc (see FIG. 1). Hereinafter, of the two surfaces of the formed substrate Sb, the resin-sealed surface (the surface on which the resin package 65 is arranged; the lower surface in FIG. 1) is referred to as the front surface, and the surface opposite to the front surface (the upper surface in FIG. 1) is referred to as the back surface.

[0018] The cutting device 1 includes a cutting module A1 (an example of a cutting mechanism) and an inspection and storage module B1. The cutting module A1 manufactures a plurality of electronic components Sc by cutting the formed substrate Sb. The inspection and storage module B1 inspects each of the manufactured plurality of electronic components Sc, and then stores the electronic components Sc in a good product tray 15a or a defective product tray 15b. In the cutting device 1, each of the cutting module A1 and the inspection and storage module B1 is detachable and replaceable.

[0019] The control unit 50 of the cutting device 1 includes a processor such as a CPU (Central Processing Unit), and a storage device such as a RAM (Random Access Memory) and a ROM (Read Only Memory). The control unit 50 controls the operations of each part of the cutting module A1 and the inspection and storage module B1 of the cutting device 1 by executing the control program stored in the storage device with the processor. The operations of the cutting device 1 described below are performed based on the operation commands of the control unit 50 unless otherwise specified. In the following description, the operation commands of the control unit 50 are generally omitted, and the operation commands of the control unit 50 will be described as necessary.

[0020] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, a conveying unit 7, and a water circulation device 30. The cutting module A1 also includes a part of the first vacuum pump D1 and a second vacuum pump D2 (an example of a water-sealed vacuum pump).

[0021] The substrate supply unit 3 supplies the formed substrate Sb to the positioning unit 4 one by one by pushing out the formed substrate Sb one by one from a magazine M1 that houses a plurality of formed substrates Sb.

[0022] The positioning unit 4 positions the formed substrate Sb by placing the formed substrate Sb pushed out from the substrate supply unit 3 on the rail unit 4a. Then, the positioning unit 4 transports the positioned formed substrate Sb to the cutting table 5.

[0023] The cutting table 5 holds the formed substrate Sb to be cut. In the present embodiment, the cutting module A1 has two cutting tables 5. A second vacuum pump D2 is connected to each of the two cutting tables 5 through a second suction path VR2. That is, two second suction paths VR2 and two second vacuum pumps D2 are arranged in the cutting module A1, respectively. The second vacuum pump D2 is a water-sealed vacuum pump. Since the configuration of the water-sealed vacuum pump is well-known, a detailed description thereof is omitted.

[0024] Each cutting table 5 includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5c. The holding member 5a holds the formed substrate Sb by placing the formed substrate Sb transported to the positioning unit 4 thereon and sucking air from below by the second vacuum pump D2 to adsorb it. Thereby, the formed substrate Sb is fixed to the cutting table 5. The detailed configuration of the cutting table 5 and the configuration for fixing the formed substrate Sb to the holding member 5a by adsorption will be described later.

[0025] The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in FIG. 2. The movement mechanism 5c can move the holding member 5a along the Y-axis in FIG. 2. Note that the Z direction shown in FIG. 2 is the vertical direction, the arrangement direction of the cutting module A1 and the inspection and storage module B1 is the X direction, and the direction perpendicular to the X direction and the Z direction (the depth direction of each module) is the Y direction. The θ1 direction is the rotation direction around the Z axis.

[0026] The spindle unit 6 includes a motor 6a and a rotating shaft 6b that outputs the rotational driving force of the motor 6a. A blade 8 is disposed at the tip of the rotating shaft 6b. The spindle unit 6 rotates the rotating shaft 6b by the rotational driving force, and the blade 8 rotates as the rotating shaft 6b rotates. The blade 8 cuts the formed substrate Sb by rotating at high speed, and fragments the formed substrate Sb into a plurality of electronic components Sc.

[0027] In the present embodiment, the cutting module A1 has two spindle units 6. The spindle unit 6 is movable along the X-axis and Z-axis in FIG. 2. Note that the cutting module A1 may be configured to have one spindle unit 6.

[0028] The spindle unit 6 is provided with a cutting water nozzle, a cooling water nozzle, a cleaning water nozzle (all not shown), etc. The cutting water nozzle injects cutting water onto the blade 8 that rotates at high speed. The cooling water nozzle injects cooling water onto the blade 8 and the formed substrate Sb that are heated by cutting. The cleaning water nozzle injects cleaning water for cleaning cutting chips and the like. The cutting water, cooling water, and cleaning water after injection are discharged to the outside of the cutting module A1.

[0029] Since the motor 6a of the spindle unit 6 generates heat when driven, it is cooled by water such as industrial water during driving. The cutting device 1 includes a water circulation device 30 that circulates water, and circulates and reuses the first cooling water W1 (an example of the first water) that cools the motor 6a (see FIG. 3). The detailed configuration of the water circulation device 30 will be described later.

[0030] The conveying unit 7 sucks the electronic components Sc held on the cutting table 5 and cut from above, and conveys them to the inspection table 11 of the inspection and storage module B1. A first vacuum pump D1 is connected to the conveying unit 7 through a first suction path VR1. The first vacuum pump D1 is a water-sealed vacuum pump. The conveying unit 7 sucks air by the first vacuum pump D1 to adsorb the electronic components Sc.

[0031] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement unit 14, and an extraction unit 15. Note that the first optical inspection camera 12 may be provided in the cutting module A1. Also, the inspection and storage module B1 includes a part of the first vacuum pump D1. That is, the first vacuum pump D1 exists across both the cutting module A1 and the inspection and storage module B1.

[0032] The inspection table 11 holds the electronic component Sc for the optical inspection of the electronic component Sc by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection table 11 is movable along the X-axis in FIG. 2. The inspection table 11 is provided with a holding member (not shown) that adsorbs and holds the electronic component Sc by the suction of the first vacuum pump D1.

[0033] The first optical inspection camera 12 and the second optical inspection camera 13 image both surfaces (the front and back surfaces) of the electronic component Sc. Various inspections of the electronic component Sc are performed based on the image data captured by the first optical inspection camera 12 and the second optical inspection camera 13. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged in the vicinity of the inspection table 11 to image upward.

[0034] The inspected electronic component Sc (see FIG. 1) is arranged in the arrangement unit 14 by the inspection table 11. The first vacuum pump D1 is connected to the arrangement unit 14 through the first suction path VR1.

[0035] The extraction unit 15 transfers the electronic component Sc arranged in the arrangement unit 14 to a tray. The electronic component Sc (see FIG. 1) is sorted into "good product" or "defective product" by the extraction unit 15 based on the results of the inspection using the first optical inspection camera 12 and the second optical inspection camera 13.

[0036] The cutting device 1 further includes a monitor 20 and a sound output unit 25. The monitor 20 is configured to display images. The monitor 20 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, for example. The sound output unit 25 is configured to output sounds. The sound output unit 25 is composed of a sound output device such as a speaker, a buzzer, or a bell, for example.

[0037] 〔Configuration of the water circulation device〕 Next, the water circulation device 30 will be described with reference to FIG. 3. As described above, the water circulation device 30 has a function of circulating and reusing the first cooling water W1 for cooling the spindle unit 6 (particularly the motor 6a). The water circulation device 30 includes a tank 31, a water pump 32 (an example of a pump), a cooler 33, a switching valve 34, a sensor group 35, a first vacuum pump D1, a second vacuum pump D2, a separator 37, a filter 38, and a circulation flow path F through which the first cooling water W1 flows through these components. The water circulation device 30 has one first vacuum pump D1 and two second vacuum pumps D2. Since the three vacuum pumps have the same configuration including the flow paths, only one second vacuum pump D2 is illustrated in FIG. 3 and will be described herein.

[0038] The circulation flow path F is configured to include a first flow path F1, a second flow path F2, a third flow path F3, a fourth flow path F4, and a fifth flow path F5. The first flow path F1 is disposed between the water pump 32 and the motor 6a. The second flow path F2 is disposed between the motor 6a and the tank 31. The third flow path F3 is disposed between the first flow path F1 and the second vacuum pump D2. The fourth flow path F4 is disposed between the second vacuum pump D2 and the separator 37. The fifth flow path F5 is disposed between the separator 37 and the tank 31. The third flow path F3 branches off from the first flow path F1, and the fifth flow path F5 merges into the second flow path F2 in front of the tank 31.

[0039] The tank 31 stores the first cooling water W1 which is the water to be circulated. The first cooling water W1 is, for example, industrial water, tap water, or pure water. The water pump 32 is arranged on the downstream side of the tank 31 in the first flow path F1. The water pump 32 sucks and pumps the first cooling water W1 stored in the tank 31 in order to circulate the first cooling water W1 through the circulation flow path F. The cooler 33 is arranged on the downstream side of the water pump 32 in the first flow path F1, and cools the first cooling water W1 flowing in from the water pump 32 by heat exchange with a refrigerant and then discharges it. The first cooling water W1 is, for example, water at a temperature lower than normal temperature. Since the configurations of the water pump 32 and the cooler 33 are well-known, detailed descriptions thereof are omitted.

[0040] On the downstream side of the cooler 33 in the first flow path F1, a sensor group 35 for detecting the flow rate, water pressure, water temperature, etc. of the first cooling water W1 is arranged. The sensor group 35 is composed of, for example, a flow rate sensor, a water pressure sensor, and a water temperature sensor. The sensor group 35 constantly detects the state of the first cooling water W1 flowing through the first flow path F1 and sends the detection result to the control unit 50.

[0041] Between the cooler 33 and the sensor group 35 in the first flow path F1, a sixth flow path F6 that joins the first flow path F1 is arranged. In the sixth flow path F6, unlike the first cooling water W1 stored in the tank 31, a second cooling water W2 (an example of second water) supplied from outside the water circulation device 30 flows. The second cooling water W2 is, for example, industrial water, tap water, or pure water, and it is desirable that it be the same type of water as the first cooling water W1. The second cooling water W2 cools the spindle portion 6 in the same manner as the first cooling water W1. Since the cooler 33 is not connected to the sixth flow path F6 and it joins the first flow path F1 downstream of the cooler 33, the second cooling water W2 is not cooled by the cooler 33. The second cooling water W2 is, for example, water at room temperature. In the sixth flow path F6, a switching valve 34 composed of an electromagnetic valve or the like that switches the opening and closing of the sixth flow path F6 is arranged. When the switching valve 34 is in the closed state, the second cooling water W2 does not join the first flow path F1. When the switching valve 34 is in the open state, the second cooling water W2 joins the first flow path F1. The opening and closing of the switching valve 34 are performed by the control unit 50. When the cutting device 1 is operating normally, the switching valve 34 is in the closed state.

[0042] Although not shown in FIG. 3, the water circulation device 30 may have a flow path that branches from the sixth flow path F6 and supplies the second cooling water W2 to the tank 31. In this case, the second cooling water W2 stored in the tank 31 becomes the first cooling water W1.

[0043] The downstream end of the first flow path F1 is connected to a flow path that cools the motor 6a of the spindle portion 6. The first cooling water W1 that has flowed through the first flow path F1 cools the motor 6a by flowing through, for example, an outer peripheral flow path (not shown) formed on the outer periphery of the motor 6a or an inner flow path (not shown) formed inside the motor 6a and near the stator. The first cooling water W1 that has flowed through the outer flow path and / or the inner flow path of the motor 6a flows through the second flow path F2 and returns to the tank 31. Near the tank 31 in the second flow path F2, a filter 38 is arranged to remove foreign substances and the like that have come to be contained in the first cooling water W1 during circulation.

[0044] As described above, the spindle unit 6 rotates the blade 8 by the rotational driving force of the motor 6a to cut the formed substrate Sb and separate it into a plurality of electronic components Sc. The formed substrate Sb is adsorbed to the holding member 5a of the cutting table 5. The holding member 5a is made of a member having an elastic force such as rubber, and has a suction hole 5a1 which is a through hole and a blade escape groove 5a2 which is a bottomed groove.

[0045] The suction holes 5a1 are formed at positions of the holding member 5a facing the respective electronic components Sc so that the plurality of electronic components Sc obtained by cutting the formed substrate Sb can be separately adsorbed. By sucking air from the suction holes 5a1, the formed substrate Sb can be adsorbed and fixed to the holding member 5a. The blade escape groove 5a2 is an escape groove for preventing the blade 8 from cutting the holding member 5a when the formed substrate Sb is cut. Therefore, the blade escape groove 5a2 is formed between adjacent electronic components Sc of the formed substrate Sb.

[0046] The holding member 5a is placed on the net member 5f and the base 5g. The net member 5f is formed with a first air flow path 5f1 communicating with the suction holes 5a1. The base 5g is formed with a second air flow path 5g1 communicating with the first air flow path 5f1. An exhaust hole 5g2 for exhausting the air sucked from the suction holes 5a1 to the outside of the base 5g is formed in the bottom wall of the base 5g. In FIG. 3, only the central second air flow path 5g1 among the five second air flow paths 5g1 seems to be connected to the exhaust hole 5g2, but actually all of the five second air flow paths 5g1 are connected to the exhaust hole 5g2.

[0047] The exhaust hole 5g2 is connected to a third air flow path 5h. That is, the air sucked from the suction holes 5a1 flows through the first air flow path 5f1 and the second air flow path 5g1, is discharged from the exhaust hole 5g2, and flows through the third air flow path 5h. The downstream end (the end opposite to the exhaust hole 5g2) of the third air flow path 5h is connected to the second vacuum pump D2. By operating the second vacuum pump D2, air is sucked from the suction holes 5a1, and thereby the formed substrate Sb is adsorbed and fixed to the holding member 5a (cutting table 5).

[0048] Returning to the description of the circulation passage F, a third passage F3 branches off between the sensor group 35 in the first passage F1 and the motor 6a. That is, the first cooling water W1 before flowing into the motor 6a also flows through the third passage F3. The downstream end of the third passage F3 is connected to the second vacuum pump D2. The second vacuum pump D2 is a water-sealed vacuum pump that circulates the first cooling water W1 by a driving force such as a trochoid pump to generate a negative pressure and thereby sucks air.

[0049] As described above, the second vacuum pump D2 sucks air from the suction holes 5a1 of the holding member 5a, thereby adsorbing the formed substrate Sb to the holding member 5a. In the second vacuum pump D2, the inflowing first cooling water W1 serves as sealing water. The air sucked from the suction holes 5a1 of the holding member 5a by the second vacuum pump D2 is discharged into the fourth passage F4 together with the first cooling water W1 and flows into the separator 37. That is, a water-containing air containing the first cooling water W1 serving as sealing water and the air sucked from the suction holes 5a1 flows through the fourth passage F4. In the present embodiment, since the first cooling water W1 is supplied to the second vacuum pump D2 as sealing water, the driving source (not shown) of the second vacuum pump D2 can be cooled by the first cooling water W1. Further, it may have a flow path configuration such that the first cooling water W1 flowing through the third passage F3 cools the driving source of the second vacuum pump D2 and then flows into the second vacuum pump D2.

[0050] In the separator 37, the water-containing air that has flowed through the fourth passage F4 is separated into the first cooling water W1 and air. The first cooling water W1 is stored below the separator 37, and air is stored above the separator 37. The first cooling water W1 stored in the separator 37 flows out, flows through the fifth passage F5, joins the second passage F2, is filtered by the filter 38, and returns to the tank 31.

[0051] The air stored in the separator 37 flows through the fourth air passage 39 and flows into the tank 31. The fourth air passage 39 is arranged across the vertically upper part of the separator 37 and the vertically upper part of the tank 31 so that the first cooling water W1 does not accidentally flow through the inside.

[0052] When the first cooling water W1 circulates through the circulation flow path F, the flow paths (the fifth flow path F5 and the second flow path F2 after confluence) between the separator 37 and the tank 31 are filled with the first cooling water W1. And since the internal air pressure of the tank 31 and the internal air pressure of the separator 37 are equal to the atmospheric pressure, the water surface height of the first cooling water W1 stored in the tank 31 and the water surface height of the first cooling water W1 stored in the separator 37 become the same. Also, the separator 37 requires a space for storing only the air separated from the water-containing air. If the water surface height of the first cooling water W1 rises and reaches the upper wall 37a which is the highest position in the vertical direction of the separator 37, there will be no space for storing air, and there is a possibility that the adsorption of the formed substrate Sb by the second vacuum pump D2 will not be sufficient.

[0053] Therefore, a drain port 31a for discharging the surplus first cooling water W1 to the outside of the tank 31 is arranged at a position lower than the upper wall 37a of the separator 37 in the tank 31 (refer to the dashed line in Fig. 3). By arranging the drain port 31a in the tank 31, the water surface height of the first cooling water W1 in the tank 31 and the separator 37 will not become higher than the drain port 31a. Therefore, the water surface height of the first cooling water W1 will not reach the upper wall 37a of the separator 37, so a space for storing only the air separated from the first cooling water W1 is secured in the separator 37.

[0054] An exhaust port 31b is arranged at a position higher than the drain port 31a of the tank 31 in the vertical direction. From the exhaust port 31b, the air that has flowed into the tank 31 through the fourth air flow path 39 from the separator 37 and is stored in the tank 31 is discharged to the outside. In this way, by connecting the fourth air flow path 39 to the tank 31, even if the first cooling water W1 accidentally mixes into the air separated by the separator 37 and flows out into the fourth air flow path 39, the mixed first cooling water W1 can be stored in the tank 31.

[0055] As described above, when the cutting device 1 is operating normally, by circulating the first cooling water W1 stored in the tank 31 through the circulation passage F, the motor 6a of the spindle unit 6 can be appropriately cooled, and the formed substrate Sb can be adsorbed to the holding member 5a of the cutting table 5. However, if a circulation abnormality occurs in which the first cooling water W1 does not circulate through the circulation passage F for some reason such as a failure of the water pump 32, it may become impossible to appropriately cool the motor 6a of the spindle unit 6 or to adsorb the formed substrate Sb to the holding member 5a of the cutting table 5.

[0056] Whether the circulation is normal or a circulation abnormality has occurred is determined by the control unit 50 based on the detection results sent from the sensor group 35. The detection from the sensor group 35 that the control unit 50 determines as a circulation abnormality includes, for example, a deviation from the normal range of the flow rate of the first cooling water W1 by a flow rate sensor, a deviation from the normal range of the water pressure of the first cooling water W1 by a water pressure sensor, and a deviation from the normal range of the water temperature of the first cooling water W1 by a water temperature sensor. The deviation from the normal range in the flow rate sensor and the water pressure sensor indirectly detects a failure of the water pump 32. The deviation from the normal range in the water temperature sensor indirectly detects a failure of the cooler 33.

[0057] When the control unit 50 determines a circulation abnormality based on the detection results of the sensor group 35, it opens the switching valve 34 and controls so that the second cooling water W2 flows through the first flow path F1 of the circulation passage F instead of the first cooling water W1. As a result, the second cooling water W2 circulates from the first flow path F1 through the fifth flow path F5, appropriately cools the motor 6a of the spindle unit 6, and adsorbs the formed substrate Sb to the holding member 5a of the cutting table 5. Thereby, even when a circulation abnormality occurs, since the second cooling water W2 can be continuously supplied from the first cooling water W1, it is possible to continue cutting the formed substrate Sb and the like without stopping the operation of the cutting device 1. However, since the second cooling water W2 cannot circulate through the circulation passage F, after flowing into and being stored in the tank 31 from the fifth flow path F5, it is discharged to the outside through the drain port 31a.

[0058] [Manufacturing Method of Electronic Component] Next, a method of manufacturing the electronic component Sc by cutting the formed substrate Sb using the cutting device 1 will be described with reference to FIGS. 2 and 3. The method of manufacturing the electronic component Sc includes a cooling step of circulating the first cooling water W1 through the circulation channel F by the water circulation device 30 to cool the spindle unit 6, a fixing step of placing the formed substrate Sb on the cutting table 5 and then operating the second vacuum pump D2 to fix the formed substrate Sb to the cutting table 5, and a cutting step of cutting the formed substrate Sb by the cutting module A1 to obtain the electronic component Sc.

[0059] In the cutting module A1 shown in FIG. 2, the substrate supply unit 3 pushes out the formed substrates Sb one by one from the magazine M1 that houses a plurality of formed substrates Sb, and supplies the formed substrates Sb to the positioning unit 4 one by one. At this time, the formed substrate Sb is arranged with its back surface facing up.

[0060] The positioning unit 4 positions the formed substrate Sb by placing the formed substrate Sb pushed out from the substrate supply unit 3 on the rail unit 4a. Then, the positioning unit 4 transports the positioned formed substrate Sb to the cutting table 5.

[0061] After transporting the formed substrate Sb to the cutting table 5 or before transporting it, the water pump 32 and the cooler 33 of the water circulation device 30 are operated to circulate the first cooling water W1 stored in the tank 31 through the circulation channel F and circulate the first cooling water W1. Thereby, the cooling of the motor 6a and the rotating shaft 6b of the spindle unit 6 is started (cooling step). Note that the first cooling water W1 is stored in the tank 31 in an amount necessary to circulate through the circulation channel F in advance.

[0062] Also, the second vacuum pump D2 is operated. When the second vacuum pump D2 operates, air is sucked from the suction holes 5a1 of the holding member 5a of the cutting table 5. Thereby, the formed substrate Sb is adsorbed by the holding member 5a and fixed to the cutting table 5 (fixing step).

[0063] When the formed substrate Sb is adsorbed and fixed on the cutting table 5, the formed substrate Sb is imaged by the first position confirmation camera 5d, and the position of the formed substrate Sb is confirmed. Thereafter, the cutting table 5 moves along the Y-axis in FIG. 2 toward the spindle unit 6. After the cutting table 5 moves below the spindle unit 6, by relatively moving the cutting table 5 and the spindle unit 6, the formed substrate Sb is cut to obtain a plurality of electronic components Sc that are separated into individual pieces (cutting process). Even while the cutting table 5 is moving and being separated into individual pieces by the blade 8, the formed substrate Sb remains in the adsorbed and fixed state. The spindle unit 6 is provided with a nozzle for cutting water, a nozzle for cooling water, a nozzle for cleaning water (all not shown), etc. Therefore, when cutting the formed substrate Sb, cutting water is sprayed from the nozzle for cutting water onto the blade 8 that rotates at high speed, cooling water is sprayed from the nozzle for cooling water onto the blade 8 and the formed substrate Sb that are heated by cutting, and cleaning water for cleaning cutting chips, etc. is sprayed from the nozzle for cleaning water. Thereafter, if necessary, the plurality of electronic components Sc are imaged by the second position confirmation camera 6c, and the positions, etc. of each of the plurality of electronic components Sc are confirmed.

[0064] After the cutting of the formed substrate Sb is completed, the cutting table 5 moves in a direction away from the spindle unit 6 along the Y-axis in FIG. 2 while adsorbing the plurality of electronic components Sc that are separated into individual pieces. In this moving process, the upper surface (back surface) of the electronic component Sc is cleaned (cleaned) and dried by the first cleaner 5e.

[0065] Next, the transfer unit 7 adsorbs the electronic component Sc held on the cutting table 5 from above. The transfer unit 7 adsorbs the electronic component Sc and transfers it to the inspection table 11 of the inspection and storage module B1. In this transfer process, the lower surface (front surface) of the electronic component Sc is cleaned and dried by the second cleaner 7a.

[0066] The inspection table 11 holds the electronic component Sc for optical inspection by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection table 11 is movable along the X-axis in FIG. 2. Further, the inspection table 11 can be turned upside down.

[0067] The first optical inspection camera 12 images the surface of the electronic component Sc conveyed to the inspection table 11 by the conveying unit 7. Thereafter, the conveying unit 7 places the electronic component Sc on the holding member of the inspection table 11. After the holding member adsorbs the electronic component Sc, the inspection table 11 is turned upside down. After the inverted inspection table 11 moves above the second optical inspection camera 13, the back surface of the electronic component Sc is imaged by the second optical inspection camera 13.

[0068] Inspected electronic components Sc are arranged in the arranging unit 14. The arranging unit 14 adsorbs the inspected electronic components Sc by the suction of the first vacuum pump D1. The arranging unit 14 is movable along the Y-axis in FIG. 2. The inspection table 11 arranges the inspected electronic components Sc in the arranging unit 14.

[0069] The extraction unit 15 transfers the electronic component Sc arranged in the arranging unit 14 to a tray. The electronic component Sc is classified into "good product" or "defective product" based on the results of the inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component Sc to a good product tray 15a or a defective product tray 15b based on the classification result. That is, the good electronic components Sc are stored in the good product tray 15a, and the defective electronic components Sc are stored in the defective product tray 15b.

[0070] 〔Alternative Embodiment〕 Hereinafter, an alternative embodiment of the above-described embodiment will be described. For members similar to those in the above-described embodiment, the same terms and reference numerals are used for explanation to facilitate understanding.

[0071] In the above-described embodiment, the separator 37 is disposed on the downstream side of the second vacuum pump D2 to separate the water-containing air into the first cooling water W1 and air. However, if the separation can be performed by the tank 31, the separator 37 may not be provided.

[0072] In the above embodiment, the sensor group 35 was composed of a flow rate sensor, a water pressure sensor, and a water temperature sensor, but the flow rate sensor, the water pressure sensor, and the water temperature sensor may be arranged individually. Further, it may be configured such that at least only one of the flow rate sensor, the water pressure sensor, and the water temperature sensor is arranged.

[0073] <c>In the above embodiment, the parameters by which the control unit 50 determines the circulation abnormality were the flow rate, water pressure, and water temperature of the first cooling water W1, but the present invention is not limited thereto. For example, abnormalities in the drive circuit or drive current of the water pump 32, abnormalities in the flow rate, pressure, and temperature of the cooling fluid supplied to the cooler 33 for cooling the first cooling water W1, and abnormalities in the storage amount of the first cooling water W1 in the tank 31 may also be used. Any abnormality that makes it impossible to properly cool the motor 6a of the spindle unit 6 and / or makes it impossible to fix the formed substrate Sb to the cutting table 5 may be included in the circulation abnormality.

[0074] <d>In the above-described embodiment, the sixth flow path F6 is configured to merge into the first flow path F1 between the cooler 33 and the sensor group 35. However, the present invention is not limited to this. For example, the sixth flow path F6 may be configured to merge into the first flow path F1 between the water pump 32 and the cooler 33. With such a configuration, even when the water pump 32 fails and the second cooling water W2 flows through the first flow path F1, the second cooling water W2 can be cooled by the cooler 33 to a low temperature and then supplied to the spindle unit 6. Therefore, similar to the case of the first cooling water W1, the motor 6a of the spindle unit 6 can be cooled.

[0075] 〔Outline of the above embodiment〕 Hereinafter, an outline of the water circulation device (30), the cutting device (1), and the manufacturing method of the cut product (Sc) described in the above embodiment will be described.

[0076] <1>One aspect of the water circulation device (30) is a water circulation device (30) that cools a spindle unit (6) that rotationally drives a blade (8) for cutting a cutting object (Sb) including a substrate (63) with first water (W1) or second water (W2). The water circulation device (30) includes a tank (31) in which the first water (W1) is stored, a pump (32) connected to the tank (31) and pumping the first water (W1) stored in the tank (31) toward the spindle unit (6), a circulation flow path (F) configured such that the first water (W1) flowing out of the tank (31) flows back into the tank (31) again via the pump (32) and the spindle unit (6), a switching valve (34) capable of switching the first water (W1) flowing through the circulation flow path (F) to the second water (W2), and a control unit (50) that controls the operations of the pump (32) and the switching valve (34). When the control unit (50) detects an abnormal circulation of the first water (W1), the control unit (50) controls the switching valve (34) to allow the second water (W2) to flow through the circulation flow path (F).

[0077] In the water circulation device (30) of this aspect, when the control unit (50) detects an abnormality in the circulation of the first water (W1), the switching valve (34) is controlled from the closed state to the open state to allow the second water (W2) to flow through the circulation flow path (F). Therefore, the second water (W2) can be continuously supplied to the circulation flow path (F) from the first water (W1), and the cooling of the spindle unit (6) can be continued.

[0078] <2>In the water circulation device (30) described in <1> above, the second water (W2) is preferably industrial water.

[0079] According to this, by simply connecting to an industrial water supply line, the second water (W2) can be supplied to the circulation flow path (F), and no special equipment for generating the second water (W2) is required. Therefore, the water circulation device (30) can be configured at low cost.

[0080] <3>The water circulation device (30) described in <1> or <2> above further includes a water-sealed vacuum pump (D2) that is disposed in the middle of the circulation flow path (F) and sucks air to adsorb the object to be cut (Sb) to the mounting table (5). The water-sealed vacuum pump (D2) preferably uses the first water (W1) or the second water (W2) as sealing water.

[0081] When the object to be cut (Sb) is adsorbed to the mounting table (5) and cut, cutting water, cooling water, and cleaning water are sprayed. In this aspect, since the water-sealed vacuum pump (D2) is used to adsorb the object to be cut (Sb) to the mounting table (5), even if cutting water or the like enters the air suction hole for adsorbing the object to be cut (Sb), the adsorption of the object to be cut (Sb) to the mounting table (5) can be stably continued without affecting the operation of the water-sealed vacuum pump (D2). Further, since the first water (W1) or the second water (W2) for cooling the spindle unit (6) is used as the sealing water of the water-sealed vacuum pump (D2), no separate water source is required to supply the sealing water to the water-sealed vacuum pump (D2), and the configuration of the water circulation device (30) can be simplified and made inexpensive.

[0082] <4>In the water circulation device (30) described in <3> above, there is further provided a separator (37) into which the water-containing air containing the seal water (W1, W2) and air discharged from the water-sealed vacuum pump (D2) flows, and which separates the air and the seal water (W1, W2) and allows them to flow out respectively. The separator (37) is arranged between the water-sealed vacuum pump (D2) and the tank (31) in the circulation flow path (F). The tank (31) has a drain port (31a) for discharging excess first water (W1) or second water (W2) to the outside. It is preferable that the vertical position of the drain port (31a) is lower than the upper wall (37a) which is the highest vertical position of the separator (37).

[0083] According to this, the water surface height of the first water (W1) or the second water (W2) in the tank (31) and the separator (37) will not become higher than the drain port (31a). Therefore, since the water surface height of the first water (W1) or the second water (W2) does not reach the upper wall (37a) of the separator (37), a space for storing only the air separated from the first water (W1) or the second water (W2) can be secured in the separator (37).

[0084] <5>In the water circulation device (30) described in <4> above, the tank (31) has an exhaust port (31b) for discharging the air separated by the separator (37) and flowing into the tank (31) to the outside after flowing into the tank (31). It is preferable that the vertical position of the exhaust port (31b) is higher than that of the drain port (31a).

[0085] According to this, the air separated by the separator (37) can be discharged to the outside of the tank (31) without being affected by the first water (W1) or the second water (W2) stored in the tank (31). Also, with this configuration, even if the first water (W1) or the second water (W2) accidentally mixes into the air separated by the separator (37) and flows out from the separator (37), the first water (W1) or the second water (W2) can be stored in the tank 31.

[0086] <6>In the water circulation device (30) according to any one of <1> to <5> above, it is preferable that the circulation abnormality is a failure of the pump (32).

[0087] The pump (32) is an essential component for pumping the first water (W1) and circulating it through the circulation flow path (F). Therefore, when the pump (32) fails, the first water (W1) stops circulating, and the spindle part (6) cannot be properly cooled. However, according to this aspect, since the failure of the pump (32) is regarded as a circulation abnormality, even if the first water (W1) is not pumped, the second water (W2) can be circulated to properly cool the spindle part (6).

[0088] <7>In the water circulation device (30) according to any one of <1> to <5> above, it further includes a cooler (33) for cooling the first water (W1) stored in the tank (31), and it is preferable that the circulation abnormality is a failure of the cooler (33).

[0089] The cooler (33) is an essential component for lowering the temperature of the first water (W1) and cooling the spindle part (6). Therefore, when the cooler (33) fails, even if the first water (W1) circulates, the spindle part (6) cannot be properly cooled because the water temperature remains high. However, according to this aspect, since the failure of the cooler (33) is regarded as a circulation abnormality, even if the first water (W1) is not cooled, the second water (W2) can be circulated to properly cool the spindle part (6).

[0090] <8>One aspect of the cutting device (1) includes the water circulation device (30) according to any one of <1> to <7> above, a mounting table (5) for mounting the object to be cut (Sb), and a cutting mechanism (A1) including a blade (8) for cutting the object to be cut (Sb) mounted on the mounting table (5) and a spindle part (6) for rotationally driving the blade (8).

[0091] In the cutting device (1) of the present aspect, since the above-described water circulation device (30) is provided, even when a circulation abnormality occurs, the second water (W2) can be continuously supplied from the first water (W1). Thereby, it is possible to provide a cutting device (1) capable of continuously cutting the object to be cut (Sb) while appropriately cooling the spindle unit (6).

[0092] <9>One aspect of the method for manufacturing a cut product (Sc) using the cutting device (1) described in <8> above is a cooling step of circulating the first water (W1) through the circulation passage (F) by the water circulation device (30) to cool the spindle unit (6), and a fixing step of operating the water-sealed vacuum pump (D2) after placing the object to be cut (Sb) on the mounting table (5) to fix the object to be cut (Sb) to the mounting table (5), and a cutting step of cutting the object to be cut (Sb) by the cutting mechanism (A1) to obtain the cut product (Sc).

[0093] In the method for manufacturing a cut product (Sc) of the present aspect, it includes a cooling step of circulating the first water (W1) through the circulation passage (F) by the above-described water circulation device (30) to cool the spindle unit (6), a fixing step of operating the water-sealed vacuum pump (D2) after placing the object to be cut (Sb) on the mounting table (5) to fix the object to be cut (Sb) to the mounting table (5), and a cutting step of cutting the object to be cut (Sb) by the cutting mechanism (A1) to obtain the cut product (Sc). Therefore, even when a circulation abnormality occurs, the second water (W2) can be continuously supplied from the first water (W1). Thereby, while appropriately cooling the spindle unit (6), the cutting of the object to be cut (Sb) and the like can be continued, so that the manufacturing of the cut product (Sc) can be continued.

Industrial Applicability

[0094] The present disclosure can be used in a water circulation device, a cutting device, and a method for manufacturing a cut product.

Explanation of Reference Numerals

[0095] 1: Cutting device 5: Cutting table (mounting table) 6: Spindle section 8: Blade 30: Water circulation device 31: Tank 31a: Drain port 31b: Exhaust port 32: Water pump (pump) 33: Cooler 34: Changeover valve 37: Separator 37a: Upper wall 50: Control unit 61: Element 63: Substrate A1: Cutting module (cutting mechanism) D2: Second vacuum pump (water-sealed vacuum pump) F: Circulation flow path Sb: Formed substrate (object to be cut) Sc: Electronic component (cut product) W1: First cooling water (first water) W2: Second cooling water (second water)< / d> < / c>

Claims

1. A water circulation device that cools a spindle unit that rotationally drives a blade for cutting an object to be cut with first water or second water, a tank in which the first water is stored, a pump connected to the tank and pumping the first water stored in the tank toward the spindle unit, a circulation flow path configured such that the first water flowing out from the tank flows back into the tank again via the pump and the spindle unit, a switching valve capable of switching the first water flowing through the circulation flow path to the second water, a control unit that controls the operation of the pump and the switching valve, and the control unit controls the switching valve to circulate the second water through the circulation flow path when an abnormality in the circulation of the first water is detected. A water circulation device.

2. The water circulation device according to claim 1, wherein the second water is industrial water.

3. further comprising a water-sealed vacuum pump disposed in the middle of the circulation flow path, sucking air and adsorbing the object to be cut onto a mounting table, The water-sealed vacuum pump uses the first water or the second water as sealing water. The water circulation device according to claim 1 or 2.

4. further comprising a separator into which the water-containing air containing the sealed water and the air discharged from the water-sealed vacuum pump flows, separating the air and the sealed water and allowing each to flow out, The separator is disposed between the water-sealed vacuum pump and the tank in the circulation flow path, The tank has a drain port for discharging excess first water or second water to the outside, The water circulation device according to claim 3, wherein the vertical position of the drain port is lower than the upper wall, which is the highest vertical position of the separator.

5. The tank has an exhaust port for discharging the air that has flowed into the tank after being separated by the separator to the outside, The water circulation device according to claim 4, wherein the vertical position of the exhaust port is higher than that of the drain port.

6. The water circulation device according to any one of claims 1 to 5, wherein the circulation abnormality is a failure of the pump.

7. further comprising a cooler for cooling the first water stored in the tank, The water circulation device according to any one of claims 1 to 5, wherein the circulation abnormality is a failure of the cooler.

8. The water circulation device according to any one of claims 1 to 7, and A cutting device comprising a mounting table for mounting the object to be cut, and a cutting mechanism including the blade for cutting the object to be cut mounted on the mounting table and a spindle unit for rotationally driving the blade.

9. A method for manufacturing a cut product using the cutting device according to claim 8, a cooling step of circulating the first water through the circulation channel by the water circulation device to cool the spindle unit; a fixing step of operating a water-sealed vacuum pump after placing the object to be cut on the mounting table to fix the object to be cut on the mounting table; a cutting step of cutting the object to be cut by the cutting mechanism to obtain a cut product.

Images