Joint device and method for joining

Abstract

To provide a joint device and a method for joining which can joint a first joint member and a second joint member to each other while suppressing damage on the first joint member and the second joint member.SOLUTION: A joint device 1 for joining a semiconductor chip W and a circuit board B to each other includes: a contactless chuck 2 for holding the semiconductor chip W and mounting the semiconductor chip W on the circuit board B; and an ultrasonic vibrator 23 for generating sound pressure. The contactless chuck 2 moves the ultrasonic vibrator 23 to a position separate from the semiconductor chip W mounted on the circuit board B, applies sound pressure from the ultrasonic vibrator 23 moved to a position separate from the semiconductor chip W to the semiconductor chip W, and joints the semiconductor chip W to the circuit board B.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a bonding device and a bonding method.

Background Art

[0002] Conventionally, when mounting components such as semiconductor chips on a substrate, various techniques for bonding the mounting components to the substrate have been proposed. For example, Patent Document 1 discloses a technique for thermally bonding a semiconductor chip to a substrate by pressing down a transparent conductive film heater in contact with the upper surface of the semiconductor chip.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional technology, when mounting a semiconductor chip on a substrate, since the transparent conductive film heater mechanically presses the semiconductor chip against the substrate, there is a risk of damaging the semiconductor chip.

[0005] Note that such problems generally occur not only when bonding a semiconductor chip to a substrate but also when bonding two bonding members.

[0006] Therefore, an object of the present disclosure is to provide a bonding device and a bonding method capable of bonding a first bonding member and a second bonding member while suppressing damage to the first bonding member or the second bonding member.

Means for Solving the Problems

[0007] The bonding device of the present disclosure is a bonding device that bonds a first bonding member and a second bonding member, and includes a holding unit that holds the first bonding member and places it on the second bonding member, a sound source unit that generates sound pressure, and a driving unit that moves the sound source unit and the holding unit. The driving unit moves the sound source unit to a position separated from the first bonding member placed on the second bonding member, and the sound source unit applies sound pressure toward the first bonding member conveyed to a position separated from the first bonding member, thereby bonding the first bonding member to the second bonding member.

[0008] In this way, by applying sound pressure from a position separated from the first bonding member toward the first bonding member to bond the first bonding member to the second bonding member, it is possible to bond the first bonding member and the second bonding member while suppressing damage to the first bonding member or the second bonding member.

[0009] In the bonding device of the present disclosure, the sound source unit may be provided on a holding surface that holds the first bonding member in the holding unit.

[0010] In this way, by moving the sound source unit using the holding unit that holds the first bonding member, it is not necessary to provide a driving unit for moving the sound source unit separately from the holding unit that holds the first bonding member, and the first bonding member and the second bonding member can be bonded with a simple configuration.

[0011] In the bonding device of the present disclosure, after the sound source unit separates the first bonding member from the holding unit and places it on the second bonding member, the sound source unit may apply sound pressure toward the first bonding member on the condition that the holding unit is moved a predetermined distance in a direction away from the first bonding member by the driving unit.

[0012] In this way, by continuously performing the process of separating the first bonding member from the holding unit and placing the second bonding member, and the process of moving the holding unit a predetermined distance in a direction away from the first bonding member, the throughput when bonding the first bonding member to the second bonding member can be improved.

[0013] In the bonding device of the present disclosure, the first bonding member may be a mounting component, and the second bonding member may be a circuit board on which the mounting component is mounted.

[0014] Thus, when the first bonding member is a mounting component and the second bonding member is a circuit board on which the mounting component is mounted, the bonding device of the present disclosure can be suitably applied. When mounting the mounting component on the circuit board, the mounting component and the circuit board can be bonded while suppressing damage to the mounting component and the circuit board.

[0015] The bonding method of the present disclosure is a bonding method for bonding a first bonding member and a second bonding member, and includes a step of placing the first bonding member on the second bonding member, a step of transporting a sound source unit to a position separated from the first bonding member placed on the second bonding member, and a step of applying sound pressure from the sound source unit transported to a position separated from the first bonding member toward the first bonding member to bond the first bonding member to the second bonding member.

[0016] Thus, by applying sound pressure from a position where the sound source unit is separated from the first bonding member toward the first bonding member to bond the first bonding member to the second bonding member, the first bonding member and the second bonding member can be bonded while suppressing damage to the first bonding member or the second bonding member.

Effect of the Invention

[0017] The present disclosure can bond the first bonding member and the second bonding member while suppressing damage to the first bonding member or the second bonding member.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3A

Figure 3B

Figure 3C

Embodiments for Carrying Out the Invention

[0019] Hereinafter, an embodiment of a bonding apparatus will be described with reference to the drawings. As shown in FIG. 1, the bonding apparatus 1 includes a non-contact chuck 2 that floats and holds a semiconductor chip W, which is an example of a first bonding member and a mounting component, in a non-contact manner. The bonding apparatus 1 is used, for example, in a die bonding apparatus or a pickup apparatus in a semiconductor manufacturing process. In the illustrated example, the bonding apparatus 1 is picking up the semiconductor chip W.

[0020] The semiconductor chip is obtained by dicing a semiconductor wafer into individual pieces and is processed into an LSI package or the like through a subsequent bonding process. The interval between adjacent semiconductor chips is about the same as the thickness of the dicing cutter, for example, about 100 μm. The bonding apparatus 1 may be applied to a wire bonding method in which the semiconductor chip is picked up and placed on a substrate or the like with the active surface facing up. It may also be applied to a flip chip bonding method in which the semiconductor chip is picked up and placed on a substrate or the like with the active surface facing down.

[0021] As shown in FIG. 2, the non-contact chuck 2 has a holding portion 2A that holds the semiconductor chip W and a transfer portion 2B that transfers the holding portion 2A. The holding portion 2A has an injection hole 21 for injecting gas and a suction surface 22 formed around the injection hole 21. A plurality of ultrasonic vibrators 23 are provided on the suction surface 22 of the holding portion 2A. In this regard, the drive portion 2B moves the holding portion 2A in the horizontal and vertical directions with respect to the support 30 and the circuit board B. Also, the ultrasonic vibrator 23 is an example of a sound source portion. The ultrasonic vibrator may be provided, for example, in the vicinity of the injection hole 21 for injecting gas, and superimpose vibrations on the flow of the gas injected from the injection hole 21 to impart ultrasonic vibrations. Further, the ultrasonic vibrator may be constituted by, for example, a compressor, provided near the outlet of the injection hole 21, and send out compressed air having a pressure higher than the atmospheric pressure to impart ultrasonic vibrations. The sound source portion is not limited to the ultrasonic vibrator 23, and any device that imparts vibrations to the atmosphere may be used.

[0022] The non-contact chuck 2 is, for example, a Bernoulli chuck. When gas is injected from the injection hole 21, the air flow adjusting member 3 causes the flow direction of the gas to be along the suction surface 22, and a gas layer is formed between the semiconductor chip W and the suction surface 22, enabling the semiconductor chip W to be held in a non-contact manner. The gas may be air or another type of gas. The injection hole 21 for injecting gas is formed, for example, to be circular when viewed from below. The suction surface 22 surrounding the injection hole 21 is a flat surface that extends along the horizontal direction and can define a uniform flow path facing the flat semiconductor chip W. Note that the non-contact chuck 2 is not limited to a Bernoulli chuck, and may be, for example, a combination of an electromagnet that attracts the semiconductor chip W with magnetic force and an air blow that separates the workpiece with a force that balances the magnetic force.

[0023] The ultrasonic vibrator 23 is an electromechanical transducer that converts the high-frequency power supplied from the oscillator 24 into ultrasonic vibrations. The ultrasonic vibrator 23 may be any element capable of generating ultrasonic waves. For example, it may be an ultrasonic speaker or a unimorph vibrator formed by bonding a piezoelectric ceramic to one side of a metal disk. The configuration of the ultrasonic vibrator 23 is not particularly limited, and a known configuration can be appropriately selected. The ultrasonic vibrator 23 is embedded in the adsorption surface 22 and emits ultrasonic waves (rarefaction and compression waves) vertically downward. The number of ultrasonic vibrators 24 is not limited and may be single or plural. When there are plural ultrasonic vibrators 23, if the ultrasonic waves radiated from the plural ultrasonic vibrators 23 interfere with each other, a standing wave is generated, and the nodes and antinodes of the standing wave appear vertically at intervals of half a wavelength.

[0024] Next, the operation of the bonding apparatus 1 according to the present embodiment will be described with reference to the drawings.

[0025] First, as shown in FIG. 3A, the transfer unit 2B transfers the holding unit 2A holding the semiconductor chip W to a position facing the circuit board B on the support base 30 in the vertical direction. Then, after the transfer unit 2B moves the holding unit 2A downward to a position where the semiconductor chip W contacts the circuit board B, the holding of the semiconductor chip W by the holding unit 2A is released, and the semiconductor chip W separated from the holding unit 2A is placed on the circuit board B.

[0026] Next, as shown in FIG. 3B, the transfer unit 2B adjusts the height of the holding unit 2A so that the distance between the ultrasonic vibrator 23 and the semiconductor chip W becomes a predetermined distance.

[0027] Next, as shown in FIG. 3C, the ultrasonic vibrator 23 emits ultrasonic waves toward the semiconductor chip W. Then, the ultrasonic waves radiated from the ultrasonic vibrator 23 propagate to the semiconductor chip W, and the semiconductor chip W is pressed against the circuit board B and bonded based on the sound pressure of the ultrasonic waves. In this case, the bonding method between the semiconductor chip W and the circuit board B may be direct bonding in which bonding is performed without an intervening adhesive layer, or indirect bonding in which bonding is performed with an intervening adhesive layer. In the case of indirect bonding, a step of supplying an adhesive material for forming the adhesive layer may be included.

[0028] As described above, according to the bonding apparatus 1 of the present embodiment, ultrasonic waves radiated from the ultrasonic vibrator 23 are propagated to the semiconductor chip W. Thereby, since a force can be applied to the semiconductor chip W without contacting it, damage to the semiconductor chip W can be suppressed.

[0029] Note that the above embodiment can also be implemented in the following forms.

[0030] In each of the above embodiments, the case of bonding the semiconductor chip W, which is an example of a mounting component, to the circuit board B has been described as an example. However, the members to be bonded are not limited to this, and any combination of members can be applied as the bonding target.

[0031] The embodiments described above are for facilitating the understanding of the present invention and are not for limiting and interpreting the present invention. Each element included in the embodiments, as well as its arrangement, material, conditions, shape, size, etc., are not limited to those illustrated and can be changed as appropriate. Also, it is possible to replace or combine the configurations shown in different embodiments regionally.

Description of Reference Numerals

[0032] 1... Bonding apparatus, 2... Non-contact chuck, 3... Airflow adjustment member, 21... Injection hole, 22... Adsorption surface, 23... Ultrasonic vibrator, 24... Oscillator, 30... Support base, B... Circuit board, W... Semiconductor chip.

Claims

1. A bonding device for bonding a first bonding member and a second bonding member, comprising: a holding portion that holds the first bonding member and places it on the second bonding member; a sound source portion that generates sound pressure; a driving portion that moves the sound source portion and the holding portion; The driving portion moves the sound source portion to a position separated from the first bonding member placed on the second bonding member, and the sound source portion applies sound pressure toward the first bonding member conveyed to a position separated from the first bonding member, thereby bonding the first bonding member to the second bonding member. Bonding device.

2. The sound source portion is provided on a holding surface that holds the first bonding member in the holding portion. The bonding device according to Claim 1.

3. After the sound source portion separates the first bonding member from the holding portion and places it on the second bonding member, the sound source portion applies sound pressure toward the first bonding member on the condition that the holding portion is moved a predetermined distance in a direction away from the first bonding member by the driving portion. The bonding device according to Claim 2.

4. The first bonding member is a mounting component, and the second bonding member is a circuit board on which the mounting component is mounted. The bonding device according to any one of Claims 1 to 3.

5. A bonding method for bonding a first bonding member and a second bonding member, comprising: a step of placing the first bonding member on the second bonding member; a step of conveying a sound source portion to a position separated from the first bonding member placed on the second bonding member; a step of applying sound pressure from the sound source portion conveyed to a position separated from the first bonding member toward the first bonding member, thereby bonding the first bonding member to the second bonding member. Including Bonding method. ​

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