Joint device and method for joining
The bonding apparatus and method address the risk of damage to semiconductor chips and other bonding members by using a liquid to absorb mechanical stress during the bonding process, ensuring effective and damage-free bonding.
Patent Information
- Application Number
- JP2023212019
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-15
- Publication Date
- 2025-06-26
AI Technical Summary
Conventional bonding techniques for semiconductor chips on substrates risk damaging the chips due to mechanical pressure, which is a common issue in bonding not only semiconductor chips but also other bonding members.
A bonding apparatus and method that uses a liquid supply unit to apply liquid to the surface of a first bonding member opposite to the second bonding member, and a pressing unit to press and bond the first bonding member to the second through the liquid, thereby minimizing mechanical stress on the bonding members.
This approach effectively bonds the first and second bonding members while preventing damage to them, as the liquid acts as a shock absorber and reduces mechanical pressure during the bonding process.
Smart Images
Figure 2025095745000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a bonding apparatus and a bonding method.
Background Art
[0002] Conventionally, when mounting components such as semiconductor chips on a substrate, various techniques for bonding the mounting components to the substrate have been proposed. For example, Patent Document 1 discloses a technique for thermally bonding a semiconductor chip to a substrate by pressing a transparent conductive film heater against the upper surface of the semiconductor chip in a state of contact therewith.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] However, in the conventional technique, when mounting a semiconductor chip on a substrate, since the transparent conductive film heater mechanically presses the semiconductor chip against the substrate, there is a risk of damaging the semiconductor chip.
[0005] Note that such problems generally occur not only when bonding a semiconductor chip to a substrate but also when bonding two bonding members.
[0006] Therefore, an object of the present disclosure is to provide a bonding apparatus and a bonding method capable of bonding a first bonding member and a second bonding member while suppressing damage to the first bonding member or the second bonding member.
Means for Solving the Problems
[0007] The bonding device of the present disclosure is a bonding device that bonds a first bonding member and a second bonding member, and includes a liquid supply unit that supplies liquid to a surface of the first bonding member that is opposite to the surface on which the second bonding member is placed, and a pressing unit that presses and bonds the first bonding member toward the second bonding member through the liquid supplied by the liquid supply unit.
[0008] In this way, since the pressing unit presses and bonds the first bonding member toward the second bonding member through the liquid, the first bonding member and the second bonding member can be bonded while suppressing damage to the first bonding member or the second bonding member.
[0009] In the bonding device of the present disclosure, the liquid supply unit may control the liquid volume of the liquid supplied to the surface of the first bonding member that is opposite to the surface bonded to the second bonding member to a liquid volume that can hold the liquid.
[0010] In this way, since the liquid is held on the surface of the first bonding member that is opposite to the surface bonded to the second bonding member, it is possible to suppress the liquid from affecting the second bonding member.
[0011] In the bonding device of the present disclosure, the pressing unit includes a holding unit that holds the first bonding member, and a conveying unit that conveys the holding unit holding the first bonding member to a position where the first bonding member contacts the second bonding member. The conveying unit conveys the first bonding member to a position where it contacts the second bonding member and places the first bonding member on the second bonding member. The liquid supply unit supplies liquid to the first bonding member placed on the second bonding member, and the holding unit may press the supplied liquid to bond the first bonding member to the second bonding member.
[0012] In this way, by pressing the liquid using the holding unit that holds the first bonding member and bonding the first bonding member to the second bonding member, it is not necessary to provide a pressing unit for pressing the liquid separately from the holding unit that holds the first bonding member, and the first bonding member and the second bonding member can be bonded with a simple configuration.
[0013] In the bonding device of the present disclosure, the first bonding member may be a mounting component, and the second bonding member may be a circuit board on which the mounting component is mounted.
[0014] Thus, when the first bonding member is a mounting component and the second bonding member is a circuit board on which the mounting component is mounted, the bonding device of the present disclosure can be suitably applied, and when mounting the mounting component on the circuit board, the mounting component and the circuit board can be bonded while suppressing damage to the mounting component and the circuit board.
[0015] The bonding method of the present disclosure is a bonding method for bonding a first bonding member and a second bonding member, and includes a step of supplying a liquid to a surface of the first bonding member opposite to the surface on which the second bonding member is placed, and a step of pressing and bonding the first bonding member toward the second bonding member through the supplied liquid.
[0016] Thus, by pressing and bonding the first bonding member toward the second bonding member through the liquid by the pressing portion, the first bonding member and the second bonding member can be bonded while suppressing damage to the first bonding member or the second bonding member.
Advantages of the Invention
[0017] The present disclosure can bond the first bonding member and the second bonding member while suppressing damage to the first bonding member or the second bonding member.
Brief Description of the Drawings
[0018]
Figure 1
Figure 2
Figure 3A
Figure 3B
Figure 3C
Figure 4
Figure 5A
Figure 5B
Figure 5C
Figure 6
Figure 7
Figure 8
Embodiments for Carrying Out the Invention
[0019] <First Embodiment> Hereinafter, the bonding apparatus according to the first embodiment will be described with reference to the drawings. As shown in FIG. 1, the bonding apparatus 1 includes a non-contact chuck 2 that floats and holds a semiconductor chip W, which is an example of a first bonding member and a mounting component, in a non-contact manner. The bonding apparatus 1 is used, for example, in a die bonding apparatus or a pickup apparatus in a semiconductor manufacturing process. In the illustrated example, the bonding apparatus 1 is picking up the semiconductor chip W.
[0020] The semiconductor chip is obtained by dicing a semiconductor wafer into individual pieces, and is processed into an LSI package or the like through a subsequent bonding process. The interval between adjacent semiconductor chips is about the same as the thickness of the dicing cutter, for example, about 100 μm. The bonding apparatus 1 may be applied to a wire bonding method in which the semiconductor chip is picked up and placed on a substrate or the like with the active surface facing up. It may also be applied to a flip chip bonding method in which the semiconductor chip is picked up and placed on a substrate or the like with the active surface facing down.
[0021] As shown in FIG. 2, the non-contact chuck 2 includes a holding portion 2A that holds the semiconductor chip W and a transfer portion 2B that transfers the holding portion 2A. The holding portion 2A has an injection hole 21 for injecting gas and an adsorption surface 22 formed around the injection hole 21. A liquid supply portion 23 for supplying liquid to the semiconductor chip W is provided on the adsorption surface 22 of the holding portion 2A.
[0022] The non-contact chuck 2 is, for example, a Bernoulli chuck. When gas is injected from the injection hole 21, the flow direction of the gas becomes a direction along the adsorption surface 22 by the airflow adjusting member 3, and a gas layer is formed between the semiconductor chip W and the adsorption surface 22, and the semiconductor chip W can be held non-contact. The gas may be air or other types of gas. The injection hole 21 for injecting gas is formed, for example, in a circular shape when viewed from below. The adsorption surface 22 surrounding the injection hole 21 is a flat surface that extends along the horizontal direction and can define a uniform flow path facing the flat semiconductor chip W. Note that the non-contact chuck 2 is not limited to a Bernoulli chuck, and may be, for example, a combination of an electromagnet that attracts the semiconductor chip W by magnetic force and an air blow that separates the workpiece with a force that balances the magnetic force.
[0023] The liquid supply portion 23 is configured to supply liquid to the semiconductor chip W placed on the circuit board B as an example of the second joining member on the support base 30. The liquid supply portion 23 includes, for example, a tank for storing liquid, a communication path for supplying liquid, and a supply port for discharging liquid to the adsorption surface 22 (not shown). The liquid supply portion 23 controls the amount of liquid supplied to the surface of the semiconductor chip W opposite to the surface on which the semiconductor chip W is placed on the circuit board B to an amount of liquid that can be held by the liquid. The liquid is preferably a liquid having a viscosity such that the semiconductor chip W can be held from the viewpoint of ensuring an amount of liquid that can be held by the semiconductor chip W. Further, the liquid is preferably a liquid having low compressibility from the viewpoint of absorbing impact when the non-contact chuck 2 presses the semiconductor chip W through the liquid A. Further, the liquid is preferably a liquid having high volatility at room temperature from the viewpoint of reducing the influence on the semiconductor chip W and the circuit board B. For example, the liquid may be water or other types of liquid.
[0024] Next, the operation of the bonding apparatus 1 according to the first embodiment will be described with reference to the drawings.
[0025] First, as shown in FIG. 3A, the transfer unit 2B transfers the holding unit 2A holding the semiconductor chip W in the process shown in FIG. 1 to a position facing the circuit board B on the support base 30 in the vertical direction. Then, after the transfer unit 2B moves the holding unit 2A downward to a position where the semiconductor chip W contacts the circuit board B, the holding of the semiconductor chip W by the holding unit 2A is released, and the semiconductor chip W separated from the holding unit 2A is placed on the circuit board B.
[0026] Next, as shown in FIG. 3B, the liquid supply unit 23 supplies the liquid A from the liquid supply unit 23 to the semiconductor chip W placed on the circuit board B. In this case, the liquid A supplied to the semiconductor chip W is held on the surface of the semiconductor chip W opposite to the surface on which it is placed on the circuit board B by the surface tension of the liquid A. The liquid supply unit 23 controls the liquid volume of the liquid A so that it does not leak from the surface of the semiconductor chip W opposite to the surface held on the circuit board B and can function as a shock absorber when pressing the semiconductor chip W.
[0027] Next, as shown in FIG. 3C, the transfer unit 2B moves the holding unit 2A in a direction approaching the semiconductor chip W, and presses the surface of the semiconductor chip W where the liquid is supplied with the holding unit 2A. Then, based on the surface tension of the liquid, the holding unit 2A presses and bonds the semiconductor chip W to the circuit board B with the liquid A interposed between the adsorption surface 22 and the semiconductor chip W. In this regard, the non-contact chuck 2 is an example of a pressing unit. In this case, the bonding method between the semiconductor chip W and the circuit board B may be direct bonding in which bonding is performed without interposing an adhesive layer, or indirect bonding in which bonding is performed with an adhesive layer interposed. In the case of joint bonding, a step of supplying an adhesive material for forming an adhesive layer may be included.
[0028] According to the bonding device 1 according to the first embodiment described above, when the non-contact chuck 2 presses the semiconductor chip W and bonds it to the circuit board B, the liquid A intervening between the non-contact chuck 2 and the semiconductor chip W absorbs the impact, so that damage to the semiconductor chip W and the circuit board B can be suppressed.
[0029] <Second Embodiment> In the second embodiment, descriptions of matters common to the first embodiment are omitted, and only different points will be described. In particular, similar operational effects due to similar configurations will not be sequentially mentioned.
[0030] As shown in FIG. 4, the bonding device 1A according to the second embodiment further includes a plurality of ultrasonic vibrators 24, an oscillator 25 that supplies high-frequency power to the ultrasonic vibrators 24, and a blower unit 26 that blows gas onto the semiconductor chip W. The ultrasonic vibrator 24 is an electromechanical transducer that converts the high-frequency power supplied from the oscillator 25 into ultrasonic vibration.
[0031] The ultrasonic vibrator 24 may be any element capable of generating ultrasonic waves. For example, it is an ultrasonic speaker and is composed of a unimorph vibrator in which a piezoelectric ceramic is bonded to one side of a metal disk. The configuration of the ultrasonic vibrator 24 is not particularly limited, and a known configuration can be appropriately selected. The ultrasonic vibrator 24 is embedded in the adsorption surface 22 and emits ultrasonic waves (rarefaction and compression waves) vertically downward. The number of ultrasonic vibrators 24 is not limited and may be single or plural. When there are plural ultrasonic vibrators 24, if the ultrasonic waves radiated from the plural ultrasonic vibrators 24 interfere with each other, a standing wave is generated, and the nodes and antinodes of the standing wave appear vertically every half wavelength.
[0032] Next, the operation of the bonding device 1A according to the second embodiment will be described with reference to the drawings.
[0033] First, as shown in FIG. 5A, the transfer unit 2B transfers the holding unit 2A holding the semiconductor chip W to a position facing the circuit board B on the support base 30 in the vertical direction. Then, after the transfer unit 2B moves the holding unit 2A downward to a position where the semiconductor chip W contacts the circuit board B, the holding of the semiconductor chip W by the holding unit 2A is released, and the semiconductor chip W separated from the holding unit 2A is placed on the circuit board B.
[0034] Next, as shown in FIG. 5B, the liquid supply unit 23 supplies the liquid A to the semiconductor chip W placed on the circuit board B. In this case, the liquid A supplied to the semiconductor chip W is held on the surface of the semiconductor chip W opposite to the surface on which it is placed on the circuit board B due to the surface tension of the liquid A.
[0035] Next, as shown in FIG. 5C, the transfer unit 2B adjusts the height of the non-contact chuck 2 so that the distance between the ultrasonic vibrator 24 and the semiconductor chip W becomes a predetermined distance. The height of the ultrasonic vibrator 24 may be adjusted to contact or not contact the liquid A. The ultrasonic vibration of the ultrasonic vibrator 24 is adjusted so that it can be preferably transmitted to the liquid A. Then, the ultrasonic vibrator 24 emits ultrasonic waves toward the surface of the semiconductor chip W to which the liquid A is supplied. Then, the ultrasonic waves radiated from the ultrasonic vibrator 24 propagate through the liquid A and reach the semiconductor chip W, and the semiconductor chip W is pressed against the circuit board B and joined based on the sound pressure of the ultrasonic waves.
[0036] Thereafter, as shown in FIG. 6, the blower unit 26 removes the liquid A from the semiconductor chip W by blowing gas against the liquid A supplied to the semiconductor chip W.
[0037] As described above, according to the bonding apparatus 1A of the second embodiment, the ultrasonic waves radiated from the ultrasonic vibrator 24 reach the semiconductor chip W by propagating through the liquid. In this case, since the ultrasonic waves radiated from the ultrasonic vibrator 24 have higher propagation efficiency when propagating in the liquid than when propagating in the air, the sound pressure can be efficiently transmitted to the semiconductor chip W. Further, since a force can be applied to the semiconductor chip W without contacting it, damage to the semiconductor chip W can be suppressed.
[0038] Note that the above embodiment can also be implemented with the following modification examples. In the above embodiment, as shown in FIG. 7, an ultrasonic vibrator 24 may be provided at a position corresponding to the periphery of the semiconductor chip W on the adsorption surface 22 which is the back surface of the holding portion 2A, so as to function to regulate leakage of the liquid A to the surroundings during pressurization. In this modification example, the ultrasonic vibrator 24 functions as an example of a regulating portion. The ultrasonic vibrator 24 seals the liquid A when pressing the semiconductor chip W via the liquid A by applying ultrasonic waves around the liquid A. Thereby, it becomes possible to bond the semiconductor chip W with a higher pressure in the bonding via the liquid A. Note that several modes of arranging the ultrasonic vibrator 24 are conceivable. For example, as shown in FIG. 8, four ultrasonic vibrators 24 may be provided corresponding to the four sides of the semiconductor chip W so as to surround the liquid supply portion 23. Also, a configuration in which a plurality of ultrasonic vibrators 24 are provided on each side of the semiconductor chip W may be adopted. That is, the ultrasonic vibrator 24 can be provided in any number and at any position according to the planar shape of the object to be bonded (semiconductor chip).
[0039] In each of the above embodiments, the case where the semiconductor chip W which is an example of a mounting component is bonded to the circuit board B has been described as an example, but the members to be bonded are not limited to this, and any combination of members can be applied as the object of bonding.
[0040] In each of the above-described embodiments, the liquid supply unit 23 controls the amount of liquid supplied to the surface of the semiconductor chip W opposite to the surface bonded to the circuit board B to an amount that can hold the liquid. Alternatively, the liquid supply unit 23 may control the amount of liquid supplied to the surface of the semiconductor chip W opposite to the surface bonded to the circuit board B to an amount such that the liquid leaks out.
[0041] Further, the liquid supply unit is not limited to the configuration provided in the non-contact chuck 2, and may supply water by a water supply head or a spray different from the non-contact chuck. Alternatively, it may supply water by spraying humid air to cause condensation.
[0042] The embodiments described above are for facilitating the understanding of the present invention and are not for limiting and interpreting the present invention. Each element included in the embodiments, as well as its arrangement, material, conditions, shape, size, etc. are not limited to those illustrated and can be appropriately changed. Also, it is possible to replace or combine the configurations shown in different embodiments regionally.
Description of Reference Numerals
[0043] 1, 1A... bonding device, 2... non-contact chuck, 3... air flow adjusting member, 21... injection hole, 22... adsorption surface, 23... liquid supply unit, 24... ultrasonic vibrator, 25... oscillator, 30... support base, A... liquid, B... circuit board, W... semiconductor chip.
Claims
1. A bonding device for bonding a first bonding member and a second bonding member, comprising: a liquid supply unit that supplies liquid to a surface of the first bonding member opposite to the surface on which the second bonding member is placed; a pressing unit that presses the first bonding member toward the second bonding member through the liquid supplied by the liquid supply unit to perform bonding; and a bonding device.
2. The bonding device according to claim 1, wherein the liquid supply unit controls the amount of the liquid supplied to a surface of the first bonding member opposite to the surface to be bonded to the second bonding member to an amount that can hold the liquid. The bonding device according to claim 1.
3. The bonding device according to claim 1, further comprising a restricting unit that restricts the spread of the liquid between the first bonding member and the second bonding member when the pressing unit presses the first bonding member toward the second bonding member through the liquid to perform bonding. The bonding device according to claim 1.
4. The pressing unit includes: a holding unit that holds the first bonding member; a conveying unit that conveys the holding unit holding the first bonding member to a position where the first bonding member contacts the second bonding member; and the conveying unit conveys the first bonding member to a position where it contacts the second bonding member and places the first bonding member on the second bonding member, the liquid supply unit supplies the liquid to the first bonding member placed on the second bonding member, and the holding unit presses the supplied liquid to bond the first bonding member to the second bonding member. The bonding device according to claim 1.
5. The first bonding member is a mounting component, and the second bonding member is a circuit board on which the mounting component is mounted. The bonding device according to claim 1.
6. A bonding method for bonding a first bonding member and a second bonding member, comprising: a step of placing the first bonding member on the second bonding member; a step of supplying liquid to a surface of the first bonding member opposite to the surface on which the second bonding member is placed; and a step of pressing the first bonding member toward the second bonding member through the supplied liquid to perform bonding. and a bonding method.
Citation Information
Patent Citations
Bonding device
JP2011086699A