Mounting apparatus and mounting method

Abstract

To provide a mounting apparatus capable of improving the mounting accuracy of a component onto a circuit board.SOLUTION: A mounting apparatus 1 includes a mounting head 2, an imaging unit 3, and a control unit 4. The mounting head 2 has a capturing unit 22 that captures a component supplied from a component supply unit 7, and mounts a component captured by the capturing unit 22 onto a circuit board. The imaging unit 3 picks up an image of an area including the component before captured by the capturing unit 22 at least one of first timing and second timing. The control unit 4 is configured to determine whether or not the image captured by the imaging unit 3 is appropriate, and correct a target position on the basis of the determination result. The control unit 4 is configured to correct the target position by using a correction value of the target position based on the image determined as appropriate, and align the capturing unit 22 with the corrected target position.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure generally relates to a mounting apparatus and a mounting method, and more particularly to a mounting apparatus and a mounting method for mounting components on a substrate.

Background Art

[0002] Patent Document 1 describes a component mounting apparatus that captures an image including a target position before the mounting head reaches the target position, which is the target position reached by the mounting head, and changes the target position based on the image. In the component mounting apparatus described in Patent Document 1, the target position is changed based on the image captured immediately before the mounting head reaches the target position, thereby improving the mounting accuracy.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the component mounting apparatus (mounting apparatus) described in Patent Document 1, when an image including the target position is captured at the timing when the nozzle is lowered to the height position immediately before the nozzle sucks the component or immediately before the component adsorbed on the nozzle is mounted on the substrate, the nozzle or the component adsorbed on the nozzle may overlap the target position. As a result, the target position cannot be accurately changed, and there is a risk of degrading the mounting accuracy of the component on the substrate.

[0005] An object of the present disclosure is to provide a mounting apparatus and a mounting method capable of suppressing a decrease in the mounting accuracy of components on a substrate.

Means for Solving the Problems

[0006] An implementation device according to one aspect of the present disclosure includes a mounting head, an imaging unit, and a control unit. The mounting head has a capturing unit that captures the component supplied from a component supply unit that supplies components, and mounts the component captured by the capturing unit on a substrate. The imaging unit images an area including the component before being captured by the capturing unit at at least one of a first timing and a second timing, which are timings when the capturing unit descends toward a target position that is a capturing position of the component. The control unit determines whether an image obtained by the imaging unit is appropriate, and corrects the target position based on the determination result. The control unit corrects the target position using a correction value of the target position based on the image determined to be appropriate, and aligns the capturing unit with the corrected target position.

[0007] An implementation device according to another aspect of the present disclosure includes a mounting head, an imaging unit, and a control unit. The mounting head has a capturing unit that captures the component supplied from a component supply unit that supplies components, and mounts the component captured by the capturing unit on a substrate. The imaging unit images an area including the mounting position before the component is mounted at at least one of a third timing and a fourth timing, which are timings when the capturing unit descends toward a target position that is a mounting position on the substrate. The control unit determines whether an image obtained by the imaging unit is appropriate, and corrects the target position based on the determination result. The control unit corrects the target position using a correction value of the target position based on the image determined to be appropriate, and aligns the capturing unit with the corrected target position.

[0008] An implementation device according to another aspect of the present disclosure includes a mounting head, an imaging unit, and a control unit. The mounting head has a capturing unit that captures the component supplied from a component supply unit that supplies components, and mounts the component captured by the capturing unit on a substrate. The imaging unit images a region including the component before being captured by the capturing unit at at least one of a first timing and a second timing, which are timings when the capturing unit descends toward a target position that is a capturing position of the component. The control unit determines whether an image obtained by the imaging unit is appropriate, corrects the target position based on the determination result, and aligns the capturing unit with the corrected target position. The component supply unit supplies a plurality of components including a first component that is the component and a second component that is smaller in size than the first component. At the second timing when the capturing unit descends, the height of the capturing unit when the imaging unit images the first component is higher than the height of the capturing unit when the imaging unit images the second component.

[0009] An implementation device according to another aspect of the present disclosure includes a mounting head, an imaging unit, and a control unit. The mounting head has a capturing unit that captures the component supplied from a component supply unit that supplies components, and mounts the component captured by the capturing unit on a substrate. The imaging unit images a region including the mounting position before the component is mounted at at least one of a third timing and a fourth timing, which are timings when the capturing unit descends toward a target position that is a mounting position on the substrate. The control unit determines whether an image obtained by the imaging unit is appropriate, corrects the target position based on the determination result, and aligns the capturing unit with the corrected target position. The component supply unit supplies a plurality of components including a first component that is the component and a second component that is smaller in size than the first component. At the fourth timing when the capturing unit descends, the height of the capturing unit when the capturing unit captures the first component is higher than the height of the capturing unit when the capturing unit captures the second component.

[0010] An implementation method according to an aspect of the present disclosure is an implementation method for mounting a component on a substrate by a capturing unit that captures the component supplied from a component supply unit that supplies the component. The implementation method includes an imaging step and a control step. In the imaging step, an area including the component before being captured by the capturing unit is imaged at at least one of a first timing and a second timing, which are timings when the capturing unit descends toward a target position that is a capturing position of the component. In the control step, it is determined whether an image obtained by imaging in the imaging step is appropriate, and the target position is corrected based on the determination result. In the control step, the target position is corrected using a correction value of the target position based on the image determined to be appropriate, and alignment of the capturing unit is performed with respect to the corrected target position.

[0011] An implementation method according to another aspect of the present disclosure is an implementation method for mounting a component on a substrate by a capturing unit that captures the component supplied from a component supply unit that supplies the component. The implementation method includes an imaging step and a control step. In the imaging step, an area including the mounting position before the component is mounted is imaged at at least one of a third timing and a fourth timing, which are timings when the capturing unit descends toward a target position that is a mounting position on the substrate. In the control step, it is determined whether an image obtained by imaging in the imaging step is appropriate, and the target position is corrected based on the determination result. In the control step, the target position is corrected using a correction value of the target position based on the image determined to be appropriate, and alignment of the capturing unit is performed with respect to the corrected target position.

Advantages of the Invention

[0012] According to the implementation apparatus and the implementation method according to an aspect of the present disclosure, it is possible to suppress a decrease in the mounting accuracy of components on a substrate.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0014] Hereinafter, the implementation device and the implementation method according to the embodiment will be described with reference to the drawings. The drawings referred to in the following embodiments and the like are schematic diagrams, and the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensions, and the ratios of the sizes and the ratios of the thicknesses between the components do not necessarily reflect the actual dimensional ratios.

[0015] (Embodiment) (1) Overview First, the overview of the implementation device 1 according to the embodiment will be described with reference to FIGS. 1 and 2.

[0016] The mounting device 1 according to the embodiment is a device for mounting (attaching) the component 100 captured by the capturing unit 22 onto the substrate 200. The mounting device 1 is used, for example, in facilities such as factories, research institutes, offices, and educational institutions, for operations in the manufacture of various products such as electronic devices and automobiles.

[0017] In this embodiment, the case where the mounting device 1 is used in the manufacture of electronic devices in a factory will be described. A general electronic device has various circuit boards such as a power supply circuit and a control circuit, for example. In the manufacture of these circuit boards, as an example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) onto the substrate (including the printed wiring board). In the mounting process, components (including electronic components) are mounted (attached) onto the substrate. In the soldering process, for example, the substrate with components mounted thereon is heated in a reflow furnace to melt the cream solder and perform soldering. The mounting device 1 performs, in the mounting process, the operation of causing the capturing unit 22 to capture the component 100, and the operation of mounting (attaching) the component 100 captured by the capturing unit 22 onto the substrate 200.

[0018] As described above, the mounting device 1 used for mounting the component 100 onto the substrate 200 includes, as shown in FIGS. 1 and 2, a mounting head 2, an imaging unit 3, a control unit 4, a moving unit 5, a conveying unit 6, a plurality of feeders 7, a fixed camera 8, and a base 9. The conveying unit 6 has a pair of conveyor mechanisms 61 extending in the X-axis direction (a direction perpendicular to the plane of FIG. 2) on the base 9, and conveys the substrate 200 in the X-axis direction and positions it in a predetermined mounting space. The plurality of feeders 7 have a plurality of tape feeders arranged side by side in the X-axis direction on the feeder base 12 of the carriage 11 connected to the base 9. Each of the plurality of feeders 7 pitch-feeds the carrier tape 14 supplied from the reel 13 and supplies the component 100 held on the carrier tape 14 to the component supply port 71. The reel 13 is held by the carriage 11. The fixed camera 8 is mounted on the base 9 and images the upper side. On the base 9, the mounting head 2 and the moving unit 5 described later are provided.

[0019] On the base 9, a pair of support legs (not shown) are installed. The pair of support legs are located on both sides of the conveying unit 6 in the X-axis direction (the direction perpendicular to the plane of FIG. 2) and extend in the Y-axis direction. Guide rails (Y-axis driving unit 512) are provided on each of the pair of support legs, and both ends of the shaft member (X-axis driving unit 511) that holds the head unit 21 of the mounting head 2 in a state movable in the X-axis direction are attached to the pair of guide rails. A Y-axis motor (not shown) of the moving unit 5 is provided on each support leg, and the shaft member and the head unit 21 are moved in the Y-axis direction along the guide rails by the Y-axis motor. Further, a guide member extending in the X-axis direction and an X-axis motor (not shown) of the moving unit 5 are provided on the shaft member, and the head unit 21 is moved in the X-axis direction along the guide member by the X-axis motor.

[0020] The mounting head 2 has a capturing unit 22 capable of capturing the component 100. The capturing unit 22 is, for example, a suction nozzle and captures the component 100 in a state where it can be released (i.e., the capture can be released). The mounting device 1 lowers the capturing unit 22 so as to approach the component supply port 71 of the feeder 7 and causes the capturing unit 22 to capture the component 100. Further, the mounting device 1 lowers the capturing unit 22 so as to approach the substrate 200 in a state where the capturing unit 22 has captured the component 100 and mounts (attaches) the component 100 to the substrate 200.

[0021] The mounting device 1 according to the embodiment includes a mounting head 2, an imaging unit 3, and a control unit 4. The mounting head 2 has a capturing unit 22 that captures the component 100 supplied from a feeder 7 (component supply unit) that supplies the component 100, and mounts the component 100 captured by the capturing unit 22 on the substrate 200. The imaging unit 3 images the region R1 (see FIGS. 3A to 3D) including the component 100 before being captured by the capturing unit 22 at at least one of a first timing and a second timing, which is the timing when the capturing unit 22 descends toward the target position TP1, which is the capturing position CP1 of the component 100. The control unit 4 determines whether the image Im1 (see FIGS. 4A to 4D) obtained by imaging by the imaging unit 3 is appropriate, and corrects the target position TP1 based on the determination result. The control unit 4 corrects the target position TP1 using the correction value Δ1 (see FIG. 7) of the target position TP1 based on the image Im1 determined to be appropriate, and aligns the position of the capturing unit 22 with respect to the corrected target position TP1. In the present embodiment, it corresponds to the image Im1 in which the first captured image Im12 (see FIG. 4B) and the second captured image Im13 (see FIG. 4C) described later are determined to be appropriate.

[0022] On the other hand, in the third captured image Im14 (see FIG. 4D), the image representing the capturing unit 22 and the image representing the component 100 overlap. In the third captured image Im14, since the image representing the component 100 is blocked by the image representing the capturing unit 22, the control unit 4 may not be able to appropriately calculate the correction value Δ1 of the target position TP1 based on the third captured image Im14. Therefore, when the control unit 4 performs the process of correcting the target position TP1 using the third captured image Im14, the correction value Δ1 of the corrected target position TP1 may not be appropriately calculated, and there is a risk that the accuracy in capturing the component 100 may decrease.

[0023] In view of the above, in the mounting device 1 according to the embodiment, the control unit 4 determines whether the image Im1 (see FIGS. 4A to 4D) obtained by the imaging unit 3 is appropriate. Specifically, the control unit 4 determines that the first captured image Im12 (see FIG. 4B) and the second captured image Im13 (see FIG. 4C) are appropriate, and performs a process of correcting the target position TP1 using the first captured image Im12 (see FIG. 4B) and the second captured image Im13 (see FIG. 4C). On the other hand, it is determined that the third captured image Im14 (see FIG. 4D) in which the capturing unit 22 overlaps the component 100 is not appropriate, and a process of correcting the target position TP1 based on the third captured image Im14 is not performed.

[0024] As described above, the control unit 4 corrects the target position TP1 using the correction value Δ1 of the target position TP1 based on the image Im1 (for example, the second captured image Im13) determined to be appropriate, and aligns the position of the capturing unit 22 with respect to the corrected target position TP1. Thereby, even when the capturing unit 22 overlaps the component 100, since the target position TP1 is corrected using the correction value Δ1 based on the image Im1 determined to be appropriate, the target position TP1 can be changed with high accuracy. As a result, it is possible to suppress a decrease in the mounting accuracy of the component 100 with respect to the substrate 200.

[0025] (2) Details Next, the details of the mounting device 1 according to the embodiment will be described with reference to FIGS. 1 and 2.

[0026] (2.1) Premise In this embodiment, as an example, the case where the mounting apparatus 1 is used for mounting the component 100 by surface mount technology (SMT) will be described. That is, the component 100 is a surface mount device (SMD), and is mounted by being disposed on the mounting surface 201 of the substrate 200. However, the present disclosure is not limited to this example, and the mounting apparatus 1 may be used for mounting the component 100 by insertion mount technology (IMT). In this case, the component 100 is a component for insertion mounting having lead terminals, and is mounted on the mounting surface 201 of the substrate 200 by inserting the lead terminals into the holes of the substrate 200. That is, "mounting a component on a substrate" as used in the present disclosure includes disposing the component on the mounting surface of the substrate and inserting the lead terminals of the component into the holes of the substrate.

[0027] In the present disclosure, the captured image of the imaging unit 3 includes a still image (still picture) and a moving image (video). Further, the "moving image" includes a captured image composed of a plurality of still images obtained by frame shooting or the like. The captured image of the imaging unit 3 does not necessarily have to be the data itself output from the imaging unit 3. For example, the captured image of the imaging unit 3 may be subjected to appropriate data compression, conversion to another data format, or processing such as cutting out a part from the captured image of the imaging unit 3, focusing adjustment, brightness adjustment, or contrast adjustment as necessary. In this embodiment, as an example, the captured image of the imaging unit 3 is a full-color moving image.

[0028] Hereinafter, as an example, three axes of an X-axis, a Y-axis, and a Z-axis orthogonal to each other are set. The axes parallel to the surface of the substrate 200 are defined as the "X-axis" and the "Y-axis", and the axis parallel to the thickness direction of the substrate 200 is defined as the "Z-axis". Further, one of the two directions along the Z-axis is defined as the upward direction, and the other direction is defined as the downward direction. For example, when the capturing unit 22 faces the substrate 200, the substrate 200 is located below the capturing unit 22. Note that the X-axis, the Y-axis, and the Z-axis are all virtual axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely for explanation and do not have any physical entity. Also, these directions are not intended to limit the directions during the use of the mounting apparatus 1.

[0029] In addition, pipes for circulating cooling water, cables for power supply, pipes for supplying pneumatic pressure (including positive pressure and vacuum), etc. are connected to the mounting apparatus 1. However, in this embodiment, the illustrations of these are appropriately omitted.

[0030] (2.2) Overall Configuration Next, each component of the mounting apparatus 1 according to the embodiment will be described with reference to FIGS. 1 and 2.

[0031] As shown in FIGS. 1 and 2, the mounting apparatus 1 according to the embodiment includes a mounting head 2, an imaging unit 3, a control unit 4, a moving unit 5, a conveying unit 6, a plurality of feeders 7, and a fixed camera 8. However, the moving unit 5, the conveying unit 6, and the fixed camera 8 are not essential components of the mounting apparatus 1. That is, all or part of the moving unit 5, the conveying unit 6, and the fixed camera 8 may not be included in the components of the mounting apparatus 1.

[0032] (2.2.1) Mounting Head The mounting head 2 has a capturing unit 22 for capturing the component 100, and mounts the component 100 captured by the capturing unit 22 onto the substrate 200. The mounting head 2 has at least one capturing unit 22. In this embodiment, the mounting head 2 has one capturing unit 22. The mounting head 2 moves (descends) the capturing unit 22 so as to approach the capturing position CP1 (see FIG. 2), and causes the capturing unit 22 to capture the component 100 located at the capturing position CP1. The capturing position (adsorbing position) CP1 is an area where the component 100 is captured (adsorbed) in the feeder 7 that supplies the component 100. In the mounting apparatus 1, since the component 100 is supplied to the component supply port 71 by the feeder 7, the component supply port 71 corresponds to the capturing position CP1.

[0033] Also, with the component 100 captured by the capturing unit 22, the mounting head 2 moves (descends) the capturing unit 22 so as to approach the mounting position MP1 (see FIG. 2) on the mounting surface 201 of the substrate 200, and mounts (attaches) the component 100 at the mounting position MP1. The mounting position MP1 is an area where the component 100 is mounted on the mounting surface 201 of the substrate 200. In the mounting apparatus 1, the pad 202 (see FIG. 10) or land (not shown) provided on the mounting surface 201 of the substrate 200 corresponds to the mounting position MP1. Thus, the mounting head 2 holds the capturing unit 22 movably toward the capturing position CP1 and the mounting position MP1. In this embodiment, the above-described capturing position CP1 and mounting position MP1 are the target position TP1.

[0034] The capturing unit 22 is, for example, a suction nozzle. The capturing unit 22 is controlled by the control unit 4 and can be switched between a suction state of sucking (holding) the component 100 and a release state of releasing (releasing the suction) the component 100. However, the capturing unit 22 is not limited to a suction nozzle, and may be configured to capture (hold) the component 100 by grasping (pinching) the component 100, such as a robot hand or a mechanical chuck. That is, "capturing a component" as used in the present disclosure includes sucking the component and grasping the component.

[0035] Regarding the capture of the component 100 by the capture unit 22, the mounting head 2 operates by receiving the supply of pneumatic pressure (vacuum) as power. That is, the mounting head 2 switches between the suction state and the release state of the capture unit 22 by opening and closing a valve on the pneumatic pressure (vacuum) supply path connected to the capture unit 22.

[0036] In addition to the capture unit 22, the mounting head 2 further has a head unit 21 that holds the capture unit 22. In the present embodiment, one capture unit 22 is attached to one head unit 21. Thereby, the mounting head 2 can capture (hold) one component 100.

[0037] As an example, the head unit 21 is made of metal and is formed in a rectangular parallelepiped shape. By assembling the capture unit 22 and the vertical drive unit 52 (see FIG. 1) described later to the head unit 21, the head unit 21 holds the capture unit 22 and the vertical drive unit 52. In the present embodiment, the capture unit 22 is indirectly held by the head unit 21 via the vertical drive unit 52 in a state where it can move in the Z-axis direction and the θ direction described later. Further, the mounting head 2 moves in the X-Y plane by the head unit 21 being moved in the X-Y plane by the horizontal drive unit 51 (see FIG. 1) described later. The "X-Y plane" referred to here is a plane including the X-axis and the Y-axis and is a plane orthogonal to the Z-axis.

[0038] According to the above configuration, the mounting head 2 can move (lower) the capture unit 22 so as to approach the capture position CP1 (see FIG. 2) and capture the component 100 located at the capture position CP1 by the capture unit 22. Further, the mounting head 2 can move (lower) the capture unit 22 so as to approach the mounting position MP1 (see FIG. 2) on the mounting surface 201 of the substrate 200 in a state where the component 100 is captured (adsorbed) by the capture unit 22 and mount (attach) the component 100 at the mounting position MP1.

[0039] (2.2.2) Imaging unit As shown in FIG. 2, the imaging unit 3 is fixed to the head unit 21 of the mounting head 2. The imaging unit 3 is, for example, a video camera that captures a moving image. The imaging unit 3 images the region R1 (see FIGS. 3A to 3D) including the component 100 before being captured by the capturing unit 22 at at least one of the first timing and the second timing. The first timing is the timing when the capturing unit 22 is lowered toward the capturing position CP1 of the component 100, and as shown in FIG. 4B, it is the timing before the capturing unit 22 is reflected in the image Im1 obtained by the imaging unit 3. The second timing is the timing when the capturing unit 22 is lowered toward the capturing position CP1 of the component 100, and as shown in FIG. 4C, the capturing unit 22 is reflected in the image Im1 obtained by the imaging unit 3 and the capturing unit 22 does not overlap with the component 100. In the present embodiment, the imaging unit 3 images the region R1 at both the first timing and the second timing.

[0040] As shown in FIG. 1, the imaging unit 3 includes an imaging element 31 and an optical system 32. The optical system 32 forms an image of the image Im1 (see FIGS. 4A to 4D) obtained by imaging the region R1 including the capturing position CP1 on the imaging element 31. The imaging element 31 is, for example, an image sensor such as a CCD (Charge Coupled Devices) or a CMOS (Complementary Metal-Oxide Semiconductor). The imaging element 31 converts the image formed on the light receiving surface into an electrical signal and outputs it. The optical system 32 includes one or more lenses, mirrors, etc. In the present embodiment, as an example, the optical system 32 is realized by a combination of a plurality of lenses (lens group). The optical system 32 forms an image of the light from the region R1 including the capturing position CP1 on the light receiving surface of the imaging element 31. Note that the optical system 32 is not limited to the above-described configuration.

[0041] Specifically, as shown in FIG. 2, the imaging unit 3 is disposed laterally of the capture unit 22 in a plan view from the Z-axis direction below the head unit 21. In this way, the imaging unit 3 is attached to the head unit 21 together with the capture unit 22 and moves in the X-Y plane together with the capture unit 22. Note that the imaging unit 3 may be configured to move relative to the capture unit 22. For example, the head unit 21 may include an axis for moving the imaging unit 3.

[0042] Furthermore, the imaging unit 3 has an imaging optical axis Ax1 (see FIGS. 3A to 3D) that intersects the Z-axis (vertical direction). That is, the imaging optical axis Ax1 of the imaging unit 3 extends obliquely with respect to the vertical direction. In other words, the imaging unit 3 is fixed to the head unit 21 such that the imaging direction of the imaging unit 3 intersects the vertical direction, and images the region R1 including the capture position CP1 from obliquely above. Thereby, according to the mounting apparatus 1, it is possible to shorten the time required for mounting and improve productivity. Note that the horizontal direction is a direction along the X-Y plane, and the vertical direction is a direction orthogonal to the horizontal direction (the direction along the Z-axis).

[0043] (2.2.3) Control Unit The control unit 4 can be realized by, for example, a computer system having one or more processors and one or more memories. That is, the control unit 4 functions by one or more processors executing a program recorded in one or more memories of the computer system. The program is recorded in advance in the memory of the computer system here, but may be provided through a telecommunication line such as the Internet, or may be provided by being recorded in a non-temporary recording medium such as a memory card.

[0044] The control unit 4 controls each part of the mounting apparatus 1. The control unit 4 is electrically connected to, for example, each of the mounting head 2, the imaging unit 3, the moving unit 5, the conveying unit 6, the plurality of feeders 7, and the fixed camera 8. The control unit 4 outputs a control signal to the moving unit 5 and controls the driving of the moving unit 5 so that the component 100 captured by the capturing unit 22 is mounted on the mounting surface 201 of the substrate 200. Further, the control unit 4 outputs a control signal to the imaging unit 3 and the fixed camera 8, controls each of the imaging unit 3 and the fixed camera 8, and acquires images obtained by imaging by each of the imaging unit 3 and the fixed camera 8 from each of the imaging unit 3 and the fixed camera 8.

[0045] Also, the control unit 4 outputs a control signal to the conveying unit 6 and controls the conveying unit 6 so that the substrate 200 is positioned in the mounting space. Further, the control unit 4 outputs a control signal to the plurality of feeders 7 and controls the plurality of feeders 7 so that the component 100 is positioned at each component supply port 71.

[0046] The control unit 4 corrects the target position TP1 based on the image Im1 (see FIGS. 4A to 4C) obtained by imaging by the imaging unit 3. As described above, the target position TP1 is, for example, the capture position CP1 of the component 100, and the position of the component 100 exposed in the component supply port 71 of the feeder 7 corresponds to the target position TP1. More specifically, the control unit 4, for example, sets the difference between the center point Po1 of the component 100 (see FIG. 5) and the tip position of the capturing unit 22 in the image Im1 as the correction value Δ1 of the target position TP1 (see FIG. 7), and aligns the position of the capturing unit 22 so that the correction value Δ1 becomes zero. Here, the center point Po1 of the component 100 can be obtained based on the region R3 of the component 100 in the image Im1 (see FIG. 4C).

[0047] Here, as shown in FIG. 4D, in a state where the capturing unit 22 captured in the image Im1 overlaps the component 100, the region of the capturing unit 22 and the region R3 of the component 100 (see FIG. 4C) cannot be distinguished, and the center point Po1 of the component 100 cannot be accurately acquired. As a result, the target position TP1, which is the capture position CP1 of the component 100, cannot be accurately changed, and there is a risk that the mounting accuracy of the component 100 with respect to the substrate 200 will decrease.

[0048] Therefore, in the mounting device 1 according to the present embodiment, the control unit 4 determines whether the second captured image Im13 (see FIG. 4C) is appropriate. When the second captured image Im13 is appropriate, the control unit 4 corrects the target position TP1 after the second timing by using the correction value Δ1 of the target position TP1 based on the second captured image Im13, and aligns the position of the capturing unit 22 with respect to the corrected target position TP1. That is, after the second timing, the alignment of the capturing unit 22 is performed by using the correction value Δ1 of the target position TP1 based on the second captured image Im13 obtained at the second timing, without obtaining the correction value Δ1 of the target position TP1 based on the image Im1 obtained at each timing. Note that the image Im1 shown in FIG. 4D is a third captured image Im14 obtained by the imaging unit 3 imaging the region R1 at a timing later than the second timing. Here, the "appropriate image Im1" refers to an image that can be used when the control unit 4 calculates the correction value Δ1 of the target position TP1. More specifically, the first captured image Im12 and the second captured image Im13 in which the component 100 and the capturing unit 22 do not overlap in the image are appropriate images Im1. On the other hand, the third captured image Im14 in which the component 100 and the capturing unit 22 overlap in the image is an inappropriate image Im1.

[0049] (2.2.4) Moving part The moving unit 5 positions (aligns) the capturing unit 22 of the mounting head 2 at the capturing position CP1 of the component 100 and the mounting position MP1 of the component 100 on the substrate 200. That is, the moving unit 5 is a device for moving the mounting head 2 including the capturing unit 22 and the imaging unit 3. The moving unit 5 moves the head unit 21 horizontally within the X-Y plane and moves the capturing unit 22 in the vertical direction along the Z axis. That is, the moving unit 5 moves the head unit 21 in the X-axis direction and the Y-axis direction. In the present embodiment, since the capturing unit 22 and the imaging unit 3 are fixed to the head unit 21, the moving unit 5 also moves the capturing unit 22 and the imaging unit 3 together with the head unit 21 in the X-axis direction and the Y-axis direction. In FIG. 2, the mounting head 2 is moved by the moving unit 5 between above the component supply port 71 of the feeder 7 and above the substrate 200 positioned in the mounting space of the conveying unit 6.

[0050] Specifically, as shown in FIG. 1, the moving unit 5 includes a horizontal driving unit 51 and a vertical driving unit 52.

[0051] The horizontal driving unit 51 includes an X-axis driving unit 511 and a Y-axis driving unit 512. The X-axis driving unit 511 moves the mounting head 2 in a straight line in the X-axis direction. The Y-axis driving unit 512 moves the mounting head 2 in a straight line in the Y-axis direction. The Y-axis driving unit 512 moves the mounting head 2 in a straight line in the Y-axis direction by moving the mounting head 2 along the Y axis together with the X-axis driving unit 511. The X-axis driving unit 511 includes an X-axis motor (not shown) and drives the X-axis motor. The Y-axis driving unit 512 includes a Y-axis motor (not shown) and drives the Y-axis motor. Each of the X-axis motor and the Y-axis motor is, for example, a linear motor. Therefore, in the present embodiment, the X-axis driving unit 511 moves the mounting head 2 in a straight line in the X-axis direction by the driving force generated by the X-axis motor upon receiving power supply. Also, the Y-axis driving unit 512 moves the mounting head 2 in a straight line in the Y-axis direction by the driving force generated by the Y-axis motor upon receiving power supply.

[0052] The vertical drive unit 52 moves the capture unit 22 in a straight line in the Z-axis direction. Further, the vertical drive unit 52 rotates the capture unit 22 in a rotational direction (hereinafter referred to as the "θ direction") about an axis along the Z-axis direction. That is, the vertical drive unit 52 is an actuator that moves the capture unit 22 in a straight line in the Z-axis direction and rotates the capture unit 22 in the θ direction. In this embodiment, as an example, with regard to the movement of the capture unit 22 in the Z-axis direction, the vertical drive unit 52 is driven by a driving force generated by a linear motor. Also, with regard to the movement of the capture unit 22 in the θ direction, the vertical drive unit 52 is driven by a driving force generated by a rotary motor. As described above, the head unit 21 of the mounting head 2 moves in a straight line in the X-axis direction and the Y-axis direction by the horizontal drive unit 51. As a result, the capture unit 22 attached to the head unit 21 can be moved in the X-axis direction, Y-axis direction, Z-axis direction, and θ direction by the horizontal drive unit 51 and the vertical drive unit 52.

[0053] (2.2.5) Conveyor Unit The conveyor unit 6 is a device for conveying the substrate 200. The conveyor unit 6 has, for example, a pair of conveyor mechanisms 61 as shown in FIG. 2. The conveyor unit 6 conveys the substrate 200 in the X-axis direction (the direction perpendicular to the plane of FIG. 2) by the pair of conveyor mechanisms 61. The conveyor unit 6 conveys the substrate 200 to a mounting space that faces the capture unit 22 at least below the mounting head 2, that is, in the Z-axis direction. Then, the conveyor unit 6 stops the substrate 200 in the mounting space until the mounting of the component 100 on the substrate 200 by the mounting head 2 is completed.

[0054] (2.2.6) Component Supply Unit Each of the plurality of feeders 7 is a component supply unit that supplies a plurality of components 100 to the mounting head 2. As will be described later, the plurality of components 100 includes a first component 100A (see FIG. 6A) and a second component 100B (see FIG. 6B) that is smaller than the first component 100A. Each feeder 7 has, as an example, a tape feeder that supplies the components 100 accommodated in the carrier tape 14. Each feeder 7 moves the component 100 to the component supply port 71 by feeding out the carrier tape 14 in the Y-axis direction by the tape feeder. Note that each feeder 7 may have a tray on which a plurality of components 100 are placed instead of or together with the tape feeder. Also, each feeder 7 may have a bulk feeder instead of or together with the tape feeder.

[0055] (2.2.7) Fixed Camera The fixed camera (component recognition camera) 8 images the mounting head 2 moving between above the component supply port 71 of the feeder 7 and above the substrate 200 positioned in the mounting space from below. Therefore, the component 100 captured by the capturing unit 22 appears in the image obtained by imaging with the fixed camera 8. That is, the image obtained by imaging with the fixed camera 8 includes information on the mutual positional relationship between the capturing unit 22 and the component 100, in other words, information on the deviation of the component 100 with respect to the capturing unit 22.

[0056] Note that it is preferable for the fixed camera 8 to image the mounting head 2 moving from the component supply port 71 toward the substrate 200 from below. In this case, the fixed camera 8 does not image constantly, but images at the timing when the capturing unit 22 capturing the component 100 passes above the fixed camera 8. Also, the fixed camera 8 may be installed below the component supply port 71.

[0057] (2.2.8) Others In addition to the above configuration, the mounting apparatus 1 may include, for example, an illumination device and a communication unit.

[0058] The lighting device illuminates the imaging area of the imaging unit 3. The imaging area is, for example, the area R1 (see FIGS. 3A to 3D) including the capture position CP1. The lighting device only needs to be lit at least at the timing when the imaging unit 3 performs imaging. For example, it emits light in accordance with the imaging timing of the imaging unit 3. In the present embodiment, since the image Im1 (see FIGS. 4A to 4D) obtained by the imaging unit 3 is a full-color moving image, the lighting device outputs light in the wavelength range of the visible light region such as red or blue. In the present embodiment, as an example, the lighting device has a plurality of light sources such as LEDs (Light Emitting Diodes). The lighting device illuminates the imaging area of the imaging unit 3 by causing these plurality of light sources to emit light. The lighting device is realized by an appropriate lighting method such as a diffused type or an oblique light type, for example. The lighting device is fixed to the mounting head 2 together with the imaging unit 3, for example.

[0059] The communication unit is configured to communicate with a host system directly or indirectly via a network or a repeater or the like. Thereby, the mounting device 1 can exchange data with the host system.

[0060] (3) Operations of the imaging unit and the capture unit Next, the operations of the imaging unit 3 and the capture unit 22 will be described with reference to FIGS. 3A to 3D, FIGS. 4A to 4D, FIG. 5, and FIGS. 6A to 6B.

[0061] As shown in FIG. 3A, the imaging unit 3 starts imaging the area R1 from the state where the capture unit 22 is located at the first position P11. The first position P11 is the position (height) when the capture unit 22 starts to descend toward the capture position CP1 of the component 100. In the image Im11 at the first position P11, as shown in FIG. 4A, the component 100 appears in the area on one end side (the left side in FIG. 4A) of the image Im11. Note that "TP11" in FIG. 4A is the target position when the capture unit 22 is located at the first position P11.

[0062] As shown in FIG. 3B, the imaging unit 3 images the region R1 in a state where the capture unit 22 is located at the second position P12, and acquires the first captured image Im12 (see FIG. 4B). The second position P12 is an intermediate position when the capture unit 22 is descending toward the capture position CP1 of the component 100, and is the position (height) immediately before the capture unit 22 is reflected in the image Im1. The first captured image Im12 is an image obtained by the imaging unit 3 imaging the region R1 at the first timing. That is, the timing when the capture unit 22 is located at the second position P12 corresponds to the first timing. In the first captured image Im12 at the second position P12, as shown in FIG. 4B, the component 100 is shown in the region closer to the center in the first captured image Im12. Note that "TP12" in FIG. 4B is the target position when the capture unit 22 is located at the second position P12.

[0063] As shown in FIG. 3C, the imaging unit 3 images the region R1 in a state where the capture unit 22 is located at the third position P13, and acquires the second captured image Im13 (see FIG. 4C). The third position P13 is an intermediate position when the capture unit 22 is descending toward the capture position CP1 of the component 100, and is the position (height) where the capture unit 22 is reflected in the image Im1 and the capture unit 22 does not overlap with the component 100. The second captured image Im13 is an image obtained by the imaging unit 3 imaging the region R1 at the second timing. That is, the timing when the capture unit 22 is located at the third position P13 corresponds to the second timing. In the second captured image Im13 at the third position P13, as shown in FIG. 4C, the component 100 is shown in the region closer to the center in the second captured image Im13, and the capture unit 22 is shown in the region on the other end side (the right side in FIG. 4C) of the second captured image Im13. Also, in the second captured image Im13, the capture unit 22 does not overlap with the component 100. Note that "TP13" in FIG. 4C is the target position when the capture unit 22 is located at the third position P13. In the present embodiment, the second captured image Im13 corresponds to the captured image in which the capture unit 22 is reflected.

[0064] As shown in FIG. 3D, the imaging unit 3 images the region R1 with the capture unit 22 positioned at the fourth position P14 and acquires a third captured image Im14 (see FIG. 4D). The fourth position P14 is an intermediate position when the capture unit 22 is descending toward the capture position CP1 of the component 100, where the capture unit 22 is reflected in the image Im1 and the capture unit 22 overlaps with the component 100 (height). The third captured image Im14 is an image obtained by the imaging unit 3 imaging the region R1 at a timing after the second timing (hereinafter referred to as "fifth timing"). That is, the timing when the capture unit 22 is positioned at the fourth position P14 corresponds to the fifth timing. In the third captured image Im14 at the fourth position P14, as shown in FIG. 4D, the component 100 and the capture unit 22 are shown in the region closer to the center in the third captured image Im14, and the capture unit 22 overlaps with the component 100. Note that "TP14" in FIG. 4D is the target position when the capture unit 22 is positioned at the fourth position P14. Here, in FIG. 4D, the component 100 and the capture unit 22 overlap, and the correction value Δ1 of the target position TP1 cannot be calculated. Therefore, the target position TP14 when the capture unit 22 is positioned at the fourth position P14 is calculated based on the second captured image Im13 when the capture unit 22 is positioned at the third position P13. That is, the target position TP14 is the same position as the target position TP13. In the present embodiment, the third captured image Im14 corresponds to an overlapping image in which the capture unit 22 is reflected and the capture unit 22 overlaps with the component 100.

[0065] In the implementation device 1 according to the present embodiment, the imaging unit 3 images the region R1 and determines whether the first captured image Im12, the second captured image Im13, and the third captured image Im14 (hereinafter, may be simply described as "image Im1" if there is no need to distinguish) are appropriate. More specifically, the control unit 4 determines whether the image Im1 is appropriate based on an index value indicating the height of the capture unit 22 when the image Im1 is captured. The index value is, for example, the time elapsed since the capture unit 22 started to descend (hereinafter, may be described as "elapsed time"). Based on the descending speed of the capture unit 22 and the second position P12, the time required for the capture unit 22 to reach each of the second position P12, the third position P13, and the fourth position P14 since it started to descend (hereinafter, may be described as "standard time") is preset. Then, the control unit 4 compares the elapsed time when the first captured image Im12, the second captured image Im13, and the third captured image Im14 are captured with the standard time. When the elapsed time when the image Im1 is captured is equal to or less than the standard time required to reach the second position P12 or the third position P13, the control unit 4 determines that the image Im1 is appropriate. On the other hand, when the elapsed time when the image Im1 is captured is longer than the standard time required to reach the third position P13 or the fourth position P14, the control unit 4 determines that the image Im1 is not appropriate. Here, each of the first timing, which is the timing for acquiring the first captured image Im12, the second timing, which is the timing for acquiring the second captured image Im13, and the fifth capture timing, which is the timing for acquiring the third captured image Im14, is determined in advance based on the above-described standard time. The first timing is determined based on the standard time required to reach the second position P12 and is, for example, the timing 10 ms after the capture unit 22 starts to descend. The second timing is determined based on the standard time required to reach the third position P13 and is, for example, the timing 13 ms after the capture unit 22 starts to descend. The fifth timing is determined based on the standard time required to reach the fourth position P14 and is, for example, the timing 15 ms after the capture unit 22 starts to descend. In this way, by setting the first timing, the second timing, and the fifth timing as fixed values preset in advance, it is possible to reduce the processing load on the control unit 4.In this embodiment, as an example, each of the first timing, the second timing, and the fifth timing is determined based on, for example, a standard time input by an operator or the like. Further, since the first timing, the second timing, and the fifth timing differ depending on the size S1 of each component 100 (see FIGS. 6A and 6B), it is necessary to provide a certain margin. This margin may be time or the number of rotations of the linear motor provided in the vertical drive unit 52. Note that the index value indicating the height of the capture unit 22 may be not limited to the elapsed time, but may be the position of the capture unit 22 in the direction in which the capture unit 22 descends, for example, an encoder value.

[0066] Here, as shown in FIG. 5, the target position TP1, which is the capture position CP1 of the component 100, is corrected so as to approach the center point Po1 of the component 100 in the order of TP11, TP12, and TP13, and the capture unit 22 captures the component 100 at the timing when the target position TP1 overlaps with the center point Po1 of the component 100.

[0067] Further, in this embodiment, as shown in FIGS. 6A and 6B, each of the plurality of feeders 7 supplies a plurality of components 100 including the first component 100A and the second component 100B. The plurality of components 100 (the first component 100A, the second component 100B) have different sizes S1 from each other. The size S1 is, for example, the size (area) of the component 100 in a plan view from the Z-axis direction. In FIGS. 6A and 6B, the size S12 of the second component 100B is smaller than the size S11 of the first component 100A.

[0068] Here, FIGS. 6A and 6B are schematic diagrams showing a second captured image Im13 obtained at the same second timing. When the capturing unit 22 captures the second component 100B, as shown in FIG. 6B, the capturing unit 22 does not overlap with the second component 100B. On the other hand, when the capturing unit 22 captures the first component 100A, as shown in FIG. 6A, the capturing unit 22 overlaps with the first component 100A. Thus, when the second timing is the same, depending on the size S1 of the component 100, the capturing unit 22 may overlap with the component 100. Therefore, in the mounting apparatus 1 according to the present embodiment, the second timing when capturing the first component 100A is made earlier than the second timing when capturing the second component 100B so that the capturing unit 22 does not overlap with the first component 100A in the second captured image Im13. In other words, for a plurality of components having different sizes, the height of the third position P13 at which the second captured image Im13 is captured is different. That is, the control unit 4 determines the second timing for each of the plurality of components 100 based on the size S1 of each of the plurality of components 100. In other words, at the second timing when the capturing unit 22 is descending, the height of the capturing unit 22 when the imaging unit 3 captures the first component 100A is higher than the height of the capturing unit 22 when the imaging unit 3 captures the second component 100B.

[0069] On the other hand, as described above, the first timing is the timing at which only the component 100 appears and the first captured image Im12 in which the capturing unit 22 does not appear is obtained. Therefore, it is preferably constant regardless of the size S1 of the component 100. That is, the first timing is preferably constant regardless of the size S1 of each of the plurality of components 100. In this case, it is preferable to determine the first timing based on the size S11 of the first component 100A so that the capturing unit 22 does not appear in the image Im1 (the first captured image Im12) when capturing the first component 100A having the largest size S1. That is, the first timing is preferably determined based on the size S11 of the first component 100A having the largest size S1 among the plurality of components 100.

[0070] (4) Overall operation of the mounting apparatus Next, the overall operation of the mounting apparatus 1 according to the embodiment will be described with reference to FIGS. 7 and 8. “Δ1” in FIG. 7 is a correction value for the target position TP1. Also, “V1” in FIG. 7 is the speed of the mounting head 2 when moving along the X-Y plane. Further, “V2” in FIG. 7 is the speed of the capturing unit 22 when moving in the Z-axis direction.

[0071] First, the mounting head 2 of the mounting apparatus 1 accelerates and moves along the X-Y plane so that the speed V1 becomes the speed V11 at time t1 during the period up to time t1. The mounting head 2 moves at a constant speed V11 along the X-Y plane during the period from time t1 to time t2. The mounting head 2 decelerates and moves along the X-Y plane so that the speed V1 becomes the speed V12 at time t4 during the period from time t2 to time t4. The speed V12 is smaller than the speed V11.

[0072] Here, the imaging unit 3 starts acquiring the image Im1 at time t3 before time t4, and acquires a plurality of images Im1 during the period from time t3 to time t6. In the present embodiment, as shown by the circles in FIG. 8, the imaging unit 3 acquires eight images Im1 during the period from time t3 to time t6. In FIG. 8, the circles indicated by the dotted lines show the imaging timing (first timing) before the capturing unit 22 is captured, and the circles indicated by the solid lines show the imaging timing (second timing) when the capturing unit 22 is captured and the capturing unit 22 does not overlap with the component 100.

[0073] After time t6, in the image Im1, the capture unit 22 overlaps with the component 100. Therefore, as shown by the two-dot chain line in FIG. 7, the correction value Δ1 of the target position TP1 fluctuates. Thus, after time t6, it is preferable for the control unit 4 to correct the target position TP1 using the correction value Δ1 obtained based on the second captured image Im13 (see FIG. 4C) obtained at the second timing. Note that the first period T1 in FIG. 8 is a period in which the target position TP1 is corrected based on the image Im1 obtained by the imaging unit 3. Also, the second period T2 in FIG. 8 is a period in which the target position TP1 is corrected based on the image Im1 (the second captured image Im13) obtained last in the first period T1.

[0074] After time t4, as shown in FIG. 7, the mounting head 2 moves along the X-Y plane and moves (descends) the capture unit 22 along the Z-axis direction. Specifically, in the X-Y plane, the mounting head 2 accelerates to a speed V13 at time t5 and then decelerates to a speed of zero at time t7. The speed V13 is greater than the speed V12 and less than the speed V11. Also, in the Z-axis direction, the mounting head 2 accelerates the capture unit 22 to a speed V21 at time t7 and then decelerates the capture unit 22 to a speed of zero at time t8. Then, at time t8, the mounting head 2 causes the capture unit 22 to capture the component 100.

[0075] (5) Mounting method Next, the mounting method according to the embodiment will be described.

[0076] The mounting method according to the embodiment is a method of mounting the component 100 on the substrate 200 by the capture unit 22 that captures the component 100 supplied from the feeder 7. The mounting method according to the embodiment is realized, for example, by the above-described mounting apparatus 1.

[0077] The mounting method according to the embodiment includes an imaging step ST1 and a control step (correction step ST2 and alignment step ST3). In the imaging step ST1, at least one of a first timing and a second timing, which is the timing when the capturing unit 22 is lowered toward the capturing position CP1 (see FIG. 2) of the component 100, an area R1 (see FIGS. 3A to 3D) including the component 100 before being captured by the capturing unit 22 is imaged. In the control step, it is determined whether the image Im1 obtained by imaging in the imaging step ST1 is appropriate, and the target position TP1 is corrected based on the determination result. In the control step, using the correction value Δ1 (see FIG. 7) of the target position TP1 based on the image Im1 (see FIGS. 4B and 4C) determined to be appropriate, the target position TP1 is corrected, and the capturing unit 22 is aligned with the corrected target position TP1.

[0078] In the mounting method according to the embodiment, in the control step, using the correction value Δ1 of the target position TP1 based on the image Im1 (first captured image Im12 or second captured image Im13) determined to be appropriate, the target position TP1 is corrected, and the capturing unit 22 is aligned with the corrected target position TP1. Thereby, even when the capturing unit 22 overlaps the component 100 in the image Im1, since the target position TP1 is corrected using the correction value Δ1 based on the image Im1, it is possible to accurately change the target position TP1. As a result, it is possible to suppress a decrease in the mounting accuracy of the component 100 with respect to the substrate 200.

[0079] FIG. 9 is a flowchart showing a mounting method executed by the mounting apparatus 1 according to the embodiment. The mounting method includes each step of ST1 to ST3 shown in FIG. 9.

[0080] First, the control unit 4 executes the imaging step ST1. More specifically, in the imaging step ST1, the control unit 4 causes the imaging unit 3 to capture a second captured image Im13 (see FIG. 4C). In the second captured image Im13, as shown in FIG. 4C, the component 100 before being captured by the capturing unit 22 and the capturing unit 22 before capturing the component 100 are captured. Also, in the second captured image Im13, the capturing unit 22 does not overlap the component 100. That is, the second captured image Im13 corresponds to the captured image in which the capturing unit 22 is captured.

[0081] Next, the control unit 4 executes the correction step ST2. More specifically, in the correction step ST2, the control unit 4 corrects the target position TP1 (see FIG. 2) based on the second captured image Im13. Specifically, the control unit 4 sets the difference between the target position TP1 obtained from the second captured image Im13 and the position of the tip of the capturing unit 22 as a correction value Δ1 (see FIG. 7), and corrects the target position TP1 so that the correction value Δ1 becomes zero. Here, in the second captured image Im13, as shown in FIG. 4C, since the capturing unit 22 does not overlap the component 100, it is possible to accurately acquire the correction value Δ1 of the target position TP1.

[0082] Thereafter, the control unit 4 executes the alignment step ST3. More specifically, in the alignment step ST3, the control unit 4 aligns the position of the capturing unit 22 with respect to the target position TP1 acquired in the correction step ST2. In the present embodiment, the correction step ST2 and the alignment step ST3 correspond to the control step.

[0083] Note that in the correction step ST2, the control unit 4 may correct the target position TP1 based on the first captured image Im12 (see FIG. 4B) acquired at the first timing instead of the second captured image Im13. That is, the control unit 4 uses the correction value Δ1 of the target position TP1 based on the first captured image Im12, which is an image obtained by the imaging unit 3 imaging the region R1 at the first timing, to correct the target position TP1 after the first capture timing, and may align the position of the capture unit 22 with respect to the corrected target position TP1. Also in this case, similar to the case of correcting based on the second captured image Im13, it is possible to accurately change the target position TP1, and as a result, it is possible to suppress a decrease in the mounting accuracy of the component 100 with respect to the substrate 200.

[0084] (6) Effect In the mounting apparatus 1 according to the embodiment, the control unit 4 corrects the target position TP1 using the correction value Δ1 of the target position TP1 based on the image Im1 determined to be appropriate, and aligns the position of the capture unit 22 with respect to the corrected target position TP1. As a result, even when the capture unit 22 overlaps the component 100 in the image Im1, it is possible to correct the target position TP1 using the correction value Δ1 based on the image Im1 determined to be appropriate, and it is possible to accurately change the target position TP1. As a result, it is possible to suppress a decrease in the mounting accuracy of the component 100 with respect to the substrate 200.

[0085] Further, in the mounting apparatus 1 according to the embodiment, for the image Im1 captured at at least one of the first timing and the second timing, the control unit 4 determines whether the image Im1 is appropriate based on an index value indicating the height of the capture unit 22 when the image Im1 was captured. Thereby, it is possible to reduce the processing load of the control unit 4 when determining whether the image Im1 is appropriate.

[0086] Also, in the mounting device 1 according to the embodiment, when the control unit 4 causes the capturing unit 22 to capture each of the plurality of components 100, the control unit 4 determines the second timing in each of the plurality of components 100 based on the size S1 of the component 100. Thereby, it becomes possible to appropriately determine the second capturing timing according to the size S1 of the component 100.

[0087] Also, in the mounting device 1 according to the embodiment, the first timing is constant regardless of the size S1 of the plurality of components 100. Further, in the mounting device 1 according to the embodiment, the first timing is determined based on the size S1 of the component 100 having the largest size S1 among the plurality of components 100. Thereby, it becomes possible to uniformly determine the first timing regardless of the size S1 of the plurality of components 100.

[0088] (7) Modification The above-described embodiment is merely one of various embodiments of the present disclosure. The above-described embodiment can be variously modified according to design and the like as long as the object of the present disclosure can be achieved. Also, functions similar to those of the mounting method according to the above-described embodiment may be embodied by the mounting device 1, a (computer) program, or a non-transitory recording medium recording the program.

[0089] Hereinafter, modification examples of the above-described embodiment will be listed. The modification examples described below can be applied in appropriate combinations.

[0090] The execution entity of the implementation device 1 or the implementation method in the present disclosure includes a computer system. The computer system mainly consists of a processor and a memory as hardware. By the processor executing a program recorded in the memory of the computer system, the function as the execution entity of the implementation device 1 or the implementation method in the present disclosure is realized. The program may be pre-recorded in the memory of the computer system, may be provided through a telecommunication line, or may be provided by being recorded in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). Here, integrated circuits such as the IC or LSI mentioned here have different names depending on the degree of integration, and include integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Furthermore, for an FPGA (Field-Programmable Gate Array) that is programmed after the manufacture of the LSI, or a logic device capable of reconfiguring the bonding relationship inside the LSI or reconfiguring the circuit section inside the LSI, it can also be adopted as a processor. The plurality of electronic circuits may be integrated on one chip, or may be provided distributed on a plurality of chips. The plurality of chips may be integrated in one device, or may be provided distributed in a plurality of devices. The computer system mentioned here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0091] At least some functions of the implementation device 1, for example, some functions of the control unit 4, may be realized by a cloud (cloud computing) or the like.

[0092] In the above-described embodiment, the size S1 of the component 100 is the size (area) of the component 100 in a plan view from the Z-axis direction. However, the size S1 of the component 100 may be, for example, the thickness (height) of the component 100 in the Z-axis direction. That is, the "size S1 of the component 100" as referred to in the present disclosure includes the size (area) of the component 100 in a plan view from the Z-axis direction and the thickness (height) of the component 100 in the Z-axis direction.

[0093] In the above-described embodiment, the image Im1 is captured at each of the start of descent, the first timing, the second timing, and the fifth timing of the capturing unit 22. However, for example, when using the correction value Δ1 (see FIG. 7) of the target position TP1 based on the first captured image Im12 (see FIG. 4B) for the target position TP1 after the first timing, at least the first captured image Im12 may be acquired. Further, for example, when using the correction value Δ1 (see FIG. 7) of the target position TP1 based on the second captured image Im13 (see FIG. 4C) for the target position TP1 after the second timing, at least the second captured image Im13 may be acquired.

[0094] In the above-described embodiment, each of the first timing, the second timing, and the fifth timing is determined based on the standard time input by an operator or the like as described above. In contrast, each of the first timing, the second timing, and the fifth timing may be determined based on, for example, the standard time automatically set before the production of the substrate 200. Specifically, for example, a series of operations for causing the capturing unit 22 of the mounting head 2 to capture the component 100 are executed, and each of the first timing, the second timing, and the fifth timing is determined based on a plurality of images Im1 obtained by the imaging unit 3 during this operation. Thereby, it becomes possible to omit the work input by an operator or the like.

[0095] In the above-described embodiment, the control unit 4 sets the image Im1 acquired at the first timing as the first captured image Im12, the image Im1 acquired at the second timing as the second captured image Im13, and the image Im1 acquired at the fifth timing as the third captured image Im14. In contrast, the control unit 4 may determine whether the second captured image Im13 is appropriate based on the third captured image Im14. Specifically, the control unit 4 identifies the image in which the capturing unit 22 appears based on the image Im1. Then, the control unit 4 determines whether the image representing the capturing unit 22 exists within a specific region in the identified image. The specific region is, for example, a region where it is estimated that the component 100 will be captured in the image when the component 100 is imaged without being blocked by other objects. For example, the control unit 4 identifies the second captured image Im13 and the third captured image Im14 as the image Im1 in which the capturing unit 22 appears. Then, the control unit 4 determines that the third captured image Im14 is the image Im1 in which the capturing unit 22 overlaps with the component 100. Therefore, the control unit 4 determines that the image Im1 acquired before the third captured image Im14 is appropriate. For example, the second captured image Im13 (see FIG. 4C) shows the capturing unit 22 and the capturing unit 22 does not overlap with the component 100. That is, by using the image Im1 captured before the third captured image Im14, the target position TP1 can be corrected accurately. That is, the control unit 4 determines that the image Im1 captured before the third captured image Im14 is appropriate based on the third captured image Im14 in which the capturing unit 22 appears and the capturing unit 22 overlaps with the component 100. Then, the control unit 4 corrects the target position TP1 based on the second captured image Im13. Since the second captured image Im13 (see FIG. 4C) shows the capturing unit 22 and the capturing unit 22 does not overlap with the component 100, it is possible to accurately change the target position TP1, which is the capturing position CP1 of the component 100. In this case, the third captured image Im14 corresponds to an overlapping image in which the capturing unit 22 appears and the capturing unit 22 overlaps with the component 100.

[0096] Further, the control unit 4 may determine whether the first captured image Im12 is appropriate based on the second captured image Im13. Specifically, the control unit 4 identifies the second captured image Im13 as the image Im1 in which the capturing unit 22 is shown. The control unit 4 determines that the image Im1 captured before the second captured image Im13 is appropriate. For example, in the first captured image Im12 (see FIG. 4B), the capturing unit 22 is not shown, and only the component 100 is shown. That is, if the image Im1 captured before the second captured image Im13 is used, the target position TP1 can be corrected accurately. That is, the control unit 4 determines that the image Im1 captured before the second captured image Im13 is appropriate based on the second captured image Im13 in which the capturing unit 22 is shown. Then, the control unit 4 corrects the target position TP1 based on the first captured image Im12. Thereby, the control unit 4 only needs to check the presence or absence of the capturing unit 22 in the image Im1, and there is an advantage that it is easy to create the recognition algorithm of the image Im1. In this case, the second captured image Im13 corresponds to the captured image in which the capturing unit 22 is shown.

[0097] In the above-described embodiment, the case where the capturing unit 22 of the mounting head 2 captures the component 100 has been described as an example. However, for example, as shown in FIGS. 10A to 10D, even when the component 100 captured by the capturing unit 22 is mounted on the substrate 200, it may be the case. Hereinafter, it will be specifically described with reference to FIGS. 10A to 10D.

[0098] As shown in FIG. 10A, the imaging unit 3 starts imaging the region R1 from the state where the capturing unit 22 is located at the fifth position P21. The region R1 is a region including the pad 202 provided on the mounting surface 201 of the substrate 200. The fifth position P21 is the position (height) when the capturing unit 22 starts to descend toward the mounting position MP1 (see FIG. 2) of the component 100. In the image at the fifth position P21, although not shown, the pad 202 on the substrate 200 is shown.

[0099] As shown in FIG. 10B, the imaging unit 3 images the region R1 in a state where the capture unit 22 is located at the sixth position P22, and acquires a first mounting image (not shown). The sixth position P22 is an intermediate position when the capture unit 22 is descending toward the mounting position MP1 of the component 100, and is the position (height) immediately before the capture unit 22 is reflected in the image. The first mounting image is an image obtained by the imaging unit 3 imaging the region R1 at the third timing. That is, the timing when the capture unit 22 is located at the sixth position P22 corresponds to the third timing. In the first mounting image at the sixth position P22, although not shown, the pad 202 on the substrate 200 is shown.

[0100] As shown in FIG. 10C, the imaging unit 3 images the region R1 in a state where the capture unit 22 is located at the seventh position P23, and acquires a second mounting image (not shown). The seventh position P23 is an intermediate position when the capture unit 22 is descending toward the mounting position MP1 of the component 100, and is the position (height) where the capture unit 22 is reflected in the image and the capture unit 22 does not overlap with the pad 202. The second mounting image is an image obtained by the imaging unit 3 imaging the region R1 at the fourth timing. That is, the timing when the capture unit 22 is located at the seventh position P23 corresponds to the fourth timing. In the second mounting image at the seventh position P23, although not shown, the capture unit 22 and the pad 202 are shown, and the capture unit 22 does not overlap with the pad 202.

[0101] As shown in FIG. 10D, the imaging unit 3 images the region R1 in a state where the capture unit 22 is located at the eighth position P24, and acquires a third mounting image (not shown). The eighth position P24 is an intermediate position when the capture unit 22 is descending toward the mounting position MP1 of the component 100, where the capture unit 22 is reflected in the image and the capture unit 22 overlaps with the pad 202 (height). The third mounting image is an image obtained by the imaging unit 3 imaging the region R1 at the sixth timing. That is, the timing when the capture unit 22 is located at the eighth position P24 corresponds to the sixth timing. Although not shown in the third mounting image at the eighth position P24, the capture unit 22 and the pad 202 are reflected, and the capture unit 22 overlaps with the pad 202.

[0102] The control unit 4 determines whether the image obtained by the imaging unit 3 is appropriate, and corrects the target position TP1 (see FIG. 2) based on the determination result. More specifically, for example, the control unit 4 corrects the target position TP1 after the fourth timing using the correction value of the target position TP1 based on the second mounting image, and aligns the position of the capture unit 22 with respect to the corrected target position TP1. Further, for example, the control unit 4 may correct the target position TP1 after the third timing using the correction value of the target position TP1 based on the first mounting image, and align the position of the capture unit 22 with respect to the corrected target position TP1.

[0103] That is, the mounting device 1 includes a mounting head 2, an imaging unit 3, and a control unit 4 (see FIG. 1). The mounting head 2 has a capturing unit 22 that captures the component 100 supplied from a feeder 7 (see FIG. 1) that supplies the component 100, and mounts the component 100 captured by the capturing unit 22 on the substrate 200. The imaging unit 3 images a region R1 including the mounting position MP1 before the component 100 is mounted at least at one of a third timing and a fourth timing, which are the timings when the capturing unit 22 descends toward the target position TP1, which is the mounting position MP1 on the substrate 200 (see FIG. 2). The control unit 4 determines whether the image obtained by imaging by the imaging unit 3 is appropriate, and corrects the target position TP1 based on the determination result. The control unit 4 corrects the target position TP1 using the correction value of the target position TP1 based on the image determined to be appropriate, and aligns the position of the capturing unit 22 with respect to the corrected target position TP1. Also in this case, it is possible to suppress a decrease in the mounting accuracy of the component 100 with respect to the substrate 200.

[0104] The above-described mounting device 1 can also be realized by executing the following mounting method. That is, the mounting method is a mounting method in which the component 100 is mounted on the substrate 200 by a capturing unit 22 that captures the 100 components supplied from a feeder 7 that supplies the component 100. The mounting method includes an imaging step and a control step. In the imaging step, a region R1 including the mounting position MP1 before the component 100 is mounted is imaged at least at one of a third timing and a fourth timing, which are the timings when the capturing unit 22 descends toward the target position TP1, which is the mounting position MP1 on the substrate 200. In the control step, it is determined whether the image obtained by imaging in the imaging step is appropriate, and the target position TP1 is corrected based on the determination result. In the control step, the target position TP1 is corrected using the correction value of the target position TP1 based on the image determined to be appropriate, and the position of the capturing unit 22 is aligned with respect to the corrected target position TP1.

[0105] Also, when mounting a plurality of components 100 with different sizes S1 to each other, the fourth timing may be varied according to the size S1 of the component 100. For example, as shown in FIGS. 6A and 6B, assume a case where a first component 100A and a second component 100B having a size S1 smaller than that of the first component 100A are mounted on a substrate 200. In this case, if the fourth timing when mounting the first component 100A is the same as the fourth timing when mounting the second component 100B, the first component 100A may overlap with the pad 202 on the substrate 200 in the second mounting image acquired at the fourth timing. For this reason, it is preferable that the fourth timing when mounting the first component 100A is earlier than the fourth timing when mounting the second component 100B. In other words, at the fourth timing when the capturing unit 22 is descending, the height of the capturing unit 22 when the capturing unit 22 captures the first component 100A is higher than the height of the capturing unit 22 when the capturing unit 22 captures the second component 100B. Also in this case, it is possible to set the fourth timing according to the size S1 of the component 100.

[0106] (Aspect) The following aspects are disclosed in this specification.

[0107] The mounting device (1) according to the first aspect includes a mounting head (2), an imaging unit (3), and a control unit (4). The mounting head (2) has a capturing unit (22) that captures a component (100) supplied from a component supply unit (7) that supplies the component (100), and mounts the component (100) captured by the capturing unit (22) on a substrate (200). The imaging unit (3) images a region (R1) including the component (100) before being captured by the capturing unit (22) at at least one of a first timing and a second timing, which is the timing when the capturing unit (22) descends toward a target position (TP1) that is the capturing position (CP1) of the component (100). The control unit (4) determines whether the image (Im1) obtained by imaging by the imaging unit (3) is appropriate, and corrects the target position (TP1) based on the determination result. The control unit (4) corrects the target position (TP1) using a correction value (Δ1) of the target position (TP1) based on the image (Im1) determined to be appropriate, and aligns the position of the capturing unit (22) with respect to the corrected target position (TP1).

[0108] According to this aspect, it is possible to suppress a decrease in the mounting accuracy of the component (100) with respect to the substrate (200).

[0109] In the mounting device (1) according to the second aspect, in the first aspect, the control unit (4) determines whether the image (Im1) is appropriate based on an index value indicating the height of the capturing unit (22) when the image (Im1) is captured, for the image (Im1) captured at at least one of the first timing and the second timing.

[0110] According to this aspect, it is possible to reduce the processing load of the control unit (4) when determining whether the image (Im1) is appropriate.

[0111] In the mounting device (1) according to the third aspect, in the second aspect, the component supply unit (7) supplies a plurality of components (100) including the component (100). The plurality of components (100) have different sizes (S1) from each other. The control unit (4) determines the second timing for each of the plurality of components (100) based on the size (S1).

[0112] According to this aspect, it is possible to determine the second timing according to the size (S1) of the component (100).

[0113] In the mounting apparatus (1) according to the fourth aspect, in the second or third aspect, the component supply unit (7) supplies a plurality of components (100) including the component (100). The plurality of components (100) have different sizes (S1) from each other. The first timing is constant regardless of the size (S1) of each of the plurality of components (100).

[0114] According to this aspect, it is possible to determine the first timing regardless of the size (S1) of the plurality of components (100).

[0115] In the mounting apparatus (1) according to the fifth aspect, in the fourth aspect, the first timing is determined based on the size (S11) of the component (100A) having the largest size (S1) among the plurality of components (100).

[0116] According to this aspect, it is possible to uniformly determine the first timing regardless of the size (S1) of the component (100).

[0117] In the mounting apparatus (1) according to the sixth aspect, in the first aspect, the imaging unit (3) acquires an overlapping image (Im14) which is an image (Im1) in which the capturing unit (22) is reflected and the capturing unit (22) overlaps with the component (100). The control unit (4) determines, based on the overlapping image (Im14), that the image (Im1) captured before the overlapping image (Im14) is appropriate.

[0118] According to this aspect, it is possible to accurately change the target position (TP1) based on the image (Im1) captured before the overlapping image (Im14).

[0119] In the mounting apparatus (1) according to the seventh aspect, in the first aspect, the imaging unit (3) acquires a captured image (Im13) which is the image (Im1) captured by the capturing unit (22). The control unit (4) determines that the image (Im1) captured before the captured image (Im13) is appropriate based on the captured image (Im13).

[0120] According to this aspect, there is an advantage that it is easy to create the recognition algorithm of the control unit (4).

[0121] The mounting apparatus (1) according to the eighth aspect includes a mounting head (2), an imaging unit (3), and a control unit (4). The mounting head (2) has a capturing unit (22) that captures a component (100) supplied from a component supply unit (7) that supplies the component (100), and mounts the component (100) captured by the capturing unit (22) on a substrate (200). The imaging unit (3) images a region (R1) including the mounting position (MP1) before the component (100) is mounted at least at one of the third timing and the fourth timing when the capturing unit (22) is lowered toward the target position (TP1) which is the mounting position (MP1) on the substrate (200). The control unit (4) determines whether the image obtained by the imaging unit (3) is appropriate, and corrects the target position (TP1) based on the determination result. The control unit (4) corrects the target position (TP1) using the correction value of the target position (TP1) based on the image (Im1) determined to be appropriate, and aligns the position of the capturing unit (22) with respect to the corrected target position (TP1).

[0122] According to this aspect, it is possible to suppress a decrease in the mounting accuracy of the component (100) with respect to the substrate (200).

[0123] The mounting apparatus (1) according to the ninth aspect includes a mounting head (2), an imaging unit (3), and a control unit (4). The mounting head (2) has a capturing unit (22) that captures a component (100) supplied from a component supply unit (7) that supplies the component (100), and mounts the component (100) captured by the capturing unit (22) on a substrate (200). The imaging unit (3) images a region (R1) including the component (100) before being captured by the capturing unit (22) at at least one of a first timing and a second timing, which is the timing when the capturing unit (22) descends toward a target position (TP1) that is a capturing position (CP1) of the component (100). The control unit (4) determines whether the image (Im1) obtained by imaging by the imaging unit (3) is appropriate, corrects the target position (TP1) based on the determination result, and aligns the position of the capturing unit (22) with respect to the corrected target position (TP1). The component supply unit (7) supplies a plurality of components (100) including a first component (100A) that is the component (100) and a second component (100B) having a size (S1) smaller than that of the first component (100A). At the second timing when the capturing unit (22) descends, the height of the capturing unit (22) when the imaging unit (3) images the first component (100A) is higher than the height of the capturing unit (22) when the imaging unit (3) images the second component (100B).

[0124] According to this aspect, the second timing can be determined according to the size (S1) of the component (100), and as a result, it is possible to improve the mounting accuracy of the component (100) with respect to the substrate (200).

[0125] The mounting device (1) according to the tenth aspect includes a mounting head (2), an imaging unit (3), and a control unit (4). The mounting head (2) has a capturing unit (22) that captures a component (100) supplied from a component supply unit (7) that supplies the component (100), and mounts the component (100) captured by the capturing unit (22) on a substrate (200). The imaging unit (3) images a region (R1) including the mounting position (MP1) before the component (100) is mounted, at at least one of a third timing and a fourth timing, which is the timing when the capturing unit (22) descends toward the target position (TP1), which is the mounting position (MP1) on the substrate (200). The control unit (4) determines whether the image obtained by imaging by the imaging unit (3) is appropriate, corrects the target position (TP1) based on the determination result, and aligns the position of the capturing unit (22) with respect to the corrected target position (TP1). The component supply unit (7) supplies a plurality of components (100) including a first component (100A) that is the component (100) and a second component (100B) that is smaller in size (S1) than the first component (100A). At the fourth timing when the capturing unit (22) descends, the height of the capturing unit (22) when the capturing unit (22) captures the first component (100A) is higher than the height of the capturing unit (22) when the capturing unit (22) captures the second component (100B).

[0126] According to this aspect, the second mounting timing can be determined according to the size (S1) of the component (100), and as a result, it is possible to improve the mounting accuracy of the component (100) with respect to the substrate (200).

[0127] The mounting method according to the 11th aspect is a mounting method in which a component (100) is mounted on a substrate (200) by a capturing unit (22) that captures the component (100) supplied from a component supply unit (7) that supplies the component (100). The mounting method includes an imaging step (ST1) and control steps (ST2, ST3). In the imaging step (ST1), an area (R1) including the component (100) before being captured by the capturing unit (22) is imaged at at least one of a first timing and a second timing, which is the timing when the capturing unit (22) descends toward a target position (TP1) that is a capturing position (CP1) of the component (100). In the control steps (ST2, ST3), it is determined whether the image (Im1) obtained by imaging in the imaging step (ST1) is appropriate, and the target position (TP1) is corrected based on the determination result. In the control steps (ST2, ST3), the target position (TP1) is corrected using a correction value (Δ1) of the target position (TP1) based on the image (Im1) determined to be appropriate, and alignment of the capturing unit (22) is performed with respect to the corrected target position (TP1).

[0128] According to this aspect, it is possible to suppress a decrease in the mounting accuracy of the component (100) with respect to the substrate (200).

[0129] The mounting method according to the 12th aspect is a mounting method in which a component (100) is mounted on a substrate (200) by a capturing unit (22) that captures the component (100) supplied from a component supply unit (7) that supplies the component (100). The mounting method includes an imaging step and control steps. In the imaging step, an area (R1) including a mounting position (MP1) before the component (100) is mounted is imaged at at least one of a third timing and a fourth timing, which is the timing when the capturing unit (22) descends toward a target position (TP1) that is a mounting position (MP1) on the substrate (200). In the control steps, it is determined whether the image obtained by imaging in the imaging step is appropriate, and the target position (TP1) is corrected based on the determination result. In the control steps, the target position (TP1) is corrected using a correction value of the target position (TP1) based on the image determined to be appropriate, and alignment of the capturing unit (22) is performed with respect to the corrected target position (TP1).

[0130] According to this aspect, it is possible to suppress a decrease in the mounting accuracy of the component (100) with respect to the substrate (200).

[0131] Regarding the configurations according to the second to seventh aspects, they are not essential configurations of the mounting apparatus (1) and can be appropriately omitted.

Explanation of Reference Numerals

[0132] 1 Mounting apparatus 2 Mounting head 3 Imaging unit 4 Control unit 7 Feeder (component supply unit) 22 Capture unit 100 Component 100A First component (component) 100B Second component (component) 200 Substrate CP1 Capture position Im1 Image Im12 First captured image Im13 Second captured image (written image) Im14 Third captured image (overlapped image) MP1 Mounting position P12 Second position (height) P13 Third position (height) R1 Region S1 Size ST1 Imaging step ST2 Correction step (control step) ST3 Alignment step (control step) TP1 Target position Δ1 Correction value

Claims

1. A mounting apparatus comprising: a capturing unit that captures the component supplied from a component supply unit that supplies components; a mounting head that mounts the component captured by the capturing unit onto a substrate; an imaging unit that images a region including the component before being captured by the capturing unit at at least one of a first timing and a second timing which is the timing when the capturing unit descends toward a target position which is a capturing position of the component; a control unit that determines whether an image obtained by imaging by the imaging unit is appropriate and corrects the target position based on a determination result. The control unit: corrects the target position using a correction value of the target position based on the image determined to be appropriate; aligns the position of the capturing unit with respect to the corrected target position. Mounting apparatus.

2. The control unit determines whether the image is appropriate based on an index value indicating a height of the capturing unit when the image is captured, for the image captured at at least one of the first timing and the second timing. The mounting apparatus according to claim 1.

3. The component supply unit supplies a plurality of components including the component; the plurality of components have different sizes from each other; the control unit determines the second timing for each of the plurality of components based on the size when causing each of the plurality of components to be captured by the capturing unit. The mounting apparatus according to claim 2.

4. The component supply unit supplies a plurality of components including the component; the plurality of components have different sizes from each other; the first timing is constant regardless of the size of each of the plurality of components. The mounting apparatus according to claim 2 or 3.

5. The first timing is determined based on the size of the component having the largest size among the plurality of components. The mounting apparatus according to claim 4.

6. The imaging unit acquires an overlapping image which is an image in which the capturing unit is reflected and the capturing unit overlaps with the component; the control unit determines that an image captured before the overlapping image is appropriate based on the overlapping image. The mounting apparatus according to claim 1.

7. The imaging unit acquires an image with the capturing unit reflected therein; the control unit determines that an image captured before the image with the capturing unit reflected therein is appropriate based on the image with the capturing unit reflected therein. The mounting apparatus according to claim 1.

8. It has a capturing unit that captures the component supplied from a component supply unit that supplies components, and a mounting head that mounts the component captured by the capturing unit on a substrate. An imaging unit that images a region including the mounting position before the component is mounted at at least one of a third timing and a fourth timing, which is the timing when the capturing unit descends toward a target position that is the mounting position on the substrate. A control unit that determines whether the image obtained by the imaging unit is appropriate and corrects the target position based on the determination result. The control unit corrects the target position using a correction value of the target position based on the image determined to be appropriate. Aligns the position of the capturing unit with respect to the corrected target position. Mounting device.

9. It has a capturing unit that captures the component supplied from a component supply unit that supplies components, and a mounting head that mounts the component captured by the capturing unit on a substrate. An imaging unit that images a region including the component before the capturing unit captures it at at least one of a first timing and a second timing, which is the timing when the capturing unit descends toward a target position that is the capturing position of the component. A control unit that determines whether the image obtained by the imaging unit is appropriate, corrects the target position based on the determination result, and aligns the position of the capturing unit with respect to the corrected target position. The component supply unit supplies a plurality of components including a first component that is the component and a second component that is smaller in size than the first component. At the second timing when the capturing unit descends, the height of the capturing unit when the imaging unit images the first component is higher than the height of the capturing unit when the imaging unit images the second component. Mounting device.

10. It has a capturing unit that captures the component supplied from a component supply unit that supplies components, and a mounting head that mounts the component captured by the capturing unit on a substrate. An imaging unit that images a region including the mounting position before the component is mounted at at least one of a third timing and a fourth timing, which is the timing when the capturing unit descends toward a target position that is the mounting position on the substrate. A control unit that determines whether the image obtained by the imaging unit is appropriate, corrects the target position based on the determination result, and aligns the position of the capturing unit with respect to the corrected target position. The component supply unit supplies a plurality of components including a first component which is the component and a second component smaller in size than the first component. At the fourth timing when the capturing unit is descending, the height of the capturing unit when it captures the first component is higher than the height of the capturing unit when it captures the second component. Mounting device.

11. A mounting method for mounting a component on a substrate by a capturing unit that captures the component supplied from a component supply unit that supplies the component, an imaging step of imaging a region including the component before the capturing unit captures it at at least one of a first timing and a second timing which are timings when the capturing unit descends toward a target position which is a capturing position of the component; a control step of determining whether an image obtained by imaging in the imaging step is appropriate and correcting the target position based on the determination result. In the control step, the target position is corrected using a correction value of the target position based on the image determined to be appropriate, and alignment of the capturing unit is performed with respect to the corrected target position. Mounting method.

12. A mounting method for mounting a component on a substrate by a capturing unit that captures the component supplied from a component supply unit that supplies the component, an imaging step of imaging a region including the mounting position before the component is mounted at at least one of a third timing and a fourth timing which are timings when the capturing unit descends toward a target position which is a mounting position on the substrate; a control step of determining whether an image obtained by imaging in the imaging step is appropriate and correcting the target position based on the determination result. In the control step, the target position is corrected using a correction value of the target position based on the image determined to be appropriate, and alignment of the capturing unit is performed with respect to the corrected target position. Mounting method.

Images