Semiconductor device, display, photoelectric conversion device, and electronic apparatus

Abstract

To provide a technique advantageous for reducing a substrate size in a semiconductor device.SOLUTION: In a semiconductor device, a semiconductor chip is connected to a semiconductor substrate through a plurality of terminals. The semiconductor substrate comprises an effective element region, and a peripheral region that surrounds the effective element region. The semiconductor chip is electrically joined to an electrode part provided in the peripheral region. The semiconductor chip has a plurality of rows of input / output terminal groups arranged along a first direction. When the distance from an end of the semiconductor chip closest to the effective element region to the input / output terminal groups is defined as W1, and the distance from an end of the semiconductor chip farthest from the effective element region to the input / output terminal groups is defined as W2, W1>W2 is satisfied.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device, a display device, a photoelectric conversion device, and an electronic device.

Background Art

[0002] In electronic devices, there is a demand for miniaturization, weight reduction, and high performance, and the number of external output terminals has been rapidly increasing. In response to the increase in the number of external output terminals, in the conventional wire bonding connection, there is a limit to reducing the pitch of the connection terminals, and the electronic device becomes large. Therefore, a technique for flip-chip mounting semiconductor chips on each other has attracted attention.

[0003] In flip-chip mounting, since bonding pads miniaturized in a semiconductor process can be connected to each other via a connection portion such as a bump, a significant reduction in the pitch of external output terminals is possible compared to the conventional wire bonding connection.

[0004] As bonding methods for flip-chip mounting, there are ultrasonic bonding and solder bonding. In the manufacture of display devices such as organic EL, a bonding method using an anisotropic conductive film (ACF) that enables bonding at a low temperature is generally used in order to suppress the deterioration of elements due to heat during the bonding process.

[0005] Patent Documents 1 and 2 propose flip-chip mounting by ACF bonding. Also, the arrangement of electrodes and bumps and dummy bumps are described. In the technique described in Patent Document 1, a dummy bump is arranged between a first bump region and a second bump region divided on both sides of the chip, and the bumps are arranged uniformly on the chip, thereby reducing the warping of the chip during flip-chip mounting and reducing electrical contact failure. In the technique described in Patent Document 2, since the stress during crimping is concentrated at the four corners of the chip, dummy bumps are arranged at the four corners of the chip to reduce the breakage of electrical connection.

Prior Art Documents

Patent Documents

[0006] Patent Document 1 Japanese Patent Application Laid-Open No. 2016-127259 Patent Document 2 Japanese Patent Application Laid-Open No. 2005-26682 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, neither Patent Document 1 nor Patent Document 2 mentions the wiring of the semiconductor substrate. When the electrodes of the semiconductor chip are arranged closer to the effective pixel region of the semiconductor substrate, the wiring routing becomes complicated. Therefore, it is necessary to move the semiconductor chip away from the effective pixel region, which poses a problem of increasing the size of the semiconductor substrate. In particular, when this technology is applied to a display device or an imaging device, the number of output terminals of the semiconductor chip increases, and the wiring from the semiconductor chip to the effective pixels becomes dense. Therefore, it is necessary to provide a larger area for routing the wiring, resulting in a larger substrate size.

[0008] The present invention has been made in view of the above problems, and an object thereof is to provide a technology advantageous for reducing the size of a substrate in a semiconductor device. MEANS FOR SOLVING THE PROBLEMS

[0009] The present disclosure is a semiconductor device in which a semiconductor chip is connected to a semiconductor substrate via a plurality of terminals, the semiconductor substrate includes an active element region and a peripheral region surrounding the active element region, and the semiconductor chip is electrically bonded to an electrode portion provided in the peripheral region. The semiconductor chip has a plurality of rows of input / output terminal groups arranged along a first direction. Let the distance from the end of the semiconductor chip closest to the active element region to the input / output terminal group be W1, and the distance from the end of the semiconductor chip farthest from the active element region to the input / output terminal group be W2. Then, a semiconductor device is provided, characterized in that W1>W2. EFFECTS OF THE INVENTION

[0010] According to the present invention, it is possible to provide a technology advantageous for miniaturization of a semiconductor device. By arranging the terminals of a semiconductor chip at positions away from the active element region of the semiconductor substrate, it becomes possible to route the wiring on the substrate side in the region without terminals. Therefore, since the wiring routing region (the region between the active element region and the electrode portion) and the semiconductor chip can be overlapped, the semiconductor device itself can be miniaturized. In particular, in the case of a display device or an imaging device, since the number of output terminals on the active pixel side is large, the effect is significant.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the following description and drawings, common components are denoted by common reference numerals across a plurality of drawings. Therefore, the common components are described with reference to a plurality of drawings, and the description of the components denoted by the common reference numerals will be omitted as appropriate.

[0013] FIG. 1 is a plan view (schematic diagram) of a conventional semiconductor device in a plan view. The arrangement in the plan view is the arrangement when the semiconductor device is viewed from a direction (the normal direction of the main surface) perpendicular to the main surface of the semiconductor substrate 100. The semiconductor substrate 100 has an active element region AA in which functional elements (not shown) are provided on a substrate such as silicon, and a peripheral region located around the active element region AA. An electrode portion (not shown), which is an external connection terminal, is provided in the peripheral region, and the electrode portion and the semiconductor chip 300 are electrically joined. The active element region AA is electrically joined to the electrode portion by a wiring 60. The semiconductor chip 300 is a semiconductor chip provided with a drive circuit. On the surface connected to the semiconductor substrate 100, terminal groups 451 and 452 in which a plurality of terminals are arranged along the longitudinal direction of the semiconductor chip (direction D1 in FIG. 1: the first direction) are arranged.

[0014] The terminal groups 451 and 452 each constitute an output terminal group or an input terminal group. For example, each terminal of the terminal group 451 can be an output terminal and each terminal of the terminal group 452 can be an input terminal, or each terminal of the terminal group 451 can be an input terminal and each terminal of the terminal group 452 can be an output terminal. A terminal group constituted by a pair of input terminals and output terminals arranged in the short side direction of the semiconductor chip (direction D2 in FIG. 1: the second direction) is referred to as an input / output terminal group. The input / output terminal group is composed of one or more input terminals and one or more output terminals. A plurality of rows of input / output terminal groups are arranged along the first direction of the semiconductor chip, and each input / output terminal group is electrically connected to the semiconductor substrate as an external connection terminal (external connection terminal group).

[0015] Generally, the number of output terminals is large, and the desired number of output terminals is arranged by reducing the size of the output terminals or increasing the number of rows of output terminals in the short side direction of the semiconductor chip. Generally, when arranging about 2,000 to 10,000 output terminals, the length of one side of the output terminal is about 10 μm to 100 μm, and the height of the output terminal is about 3 μm to 50 μm. And the interval between output terminals is about 10 μm to 100 μm, and the number of rows of output terminals is about 3 to 20 rows. The electrode portion (not shown) includes a plurality of electrodes to which a plurality of output terminals are respectively connected via a connection member.

[0016] Generally, the number of input terminals is less than the number of output terminals, and since a low electrical resistance is required for the input terminals, it is preferable that the size of the input terminals is large. Generally, when arranging about 300 to 2,000 input terminals, the length of one side of the input terminal is about 10 μm to 200 μm, and the height of the input terminal is about 3 μm to 50 μm. And the interval between input terminals is about 10 μm to 50 μm, and the number of rows of input terminals in the short side direction of the semiconductor chip is about 1 to 5 rows. The electrode portion includes a plurality of electrodes to which a plurality of input terminals are respectively connected via a connection member.

[0017] Functional elements (not shown) can be provided in the effective element region AA of the semiconductor substrate 100. The functional element is a display element or a photoelectric conversion element, etc. In the case of a display element, it is an EL element in an ELD (electroluminescence display), a liquid crystal element in an LCD (liquid crystal display), or a reflection element in a DMD (digital mirror device).

[0018] The peripheral region may include a peripheral circuit region (not shown) in which peripheral circuits are arranged. For example, in the case of a display device, the peripheral circuits include a drive circuit for driving active pixels, and a processing circuit (e.g., a DAC (digital-analog conversion circuit)) for processing signals input to the active pixels. The peripheral region is located outside the active element region AA and may include an inactive element region (not shown) provided with inactive elements. The inactive elements are elements that do not function as active elements, such as dummy elements, reference elements, test elements, or monitor elements.

[0019] The electrode portion of the semiconductor substrate 100 and the terminal group of the semiconductor chip 300 are formed with a relative pitch. The electrode portion of the semiconductor substrate 100 is made of aluminum or the like disposed in the opening of the passivation layer, and each terminal of the semiconductor chip is a bump-shaped bump formed of gold, copper, nickel or the like. The bump can be formed by a method such as plating, vapor deposition, or stud bump. The semiconductor substrate 100 and the semiconductor chip 300 can be connected by flip chip bonding or ultrasonic flip chip bonding.

[0020] The connection member between the semiconductor substrate 100 and the semiconductor chip 300 is an ACF, NCF, epoxy resin, acrylic resin, solder, or the like. For example, the electrode of the semiconductor substrate 100 and the terminal of the semiconductor chip 300 are electrically connected by thermocompression bonding or ultrasonic compression bonding. The ACF is a film in which conductive particles are dispersed in a thermosetting resin and can be interpreted as an anisotropic conductive resin. As the thermosetting resin, an epoxy resin or an acrylic resin is used. The size and number of the conductive particles are selected according to the size of the terminal. For example, in a general ACF, the size (diameter) of the conductive particles is about 1 μm to 50 μm, and the number (surface density) of the conductive particles is 10,000 to 100,000 pieces / mm 2 degree. By using NCF, epoxy resin, or acrylic resin, the connection strength and reliability between the electrode and the terminal can be improved.

[0021] (First Embodiment) The first embodiment will be described. FIG. 2 is a plan view (schematic diagram) when the semiconductor device of the first embodiment is viewed in plan. In the semiconductor device according to the first embodiment, the input / output terminal group is arranged such that W1>W2. W1 is the (shortest) distance from the end of the semiconductor chip closest to the effective element region AA of the semiconductor device to the input / output terminal group. W2 is the (shortest) distance from the end of the semiconductor chip farthest from the effective element region AA to the input / output terminal group. In this way, the interval between the terminal group 451 and the terminal group 452 is narrowed so that the terminal group 451 is arranged at a position away from the effective pixel region of the semiconductor substrate. By doing so, a region without terminals is formed inside the semiconductor chip (on the side of the effective element region AA), and wiring (wiring between the effective element region and the wiring portion) can be routed in this region. As a result, the wiring routing region (the region between the effective element region and the electrode portion) can be overlapped with the semiconductor chip, and the semiconductor chip can be moved closer to the effective element region side, so that the semiconductor device itself can be miniaturized. Particularly in the case of a display device or an imaging device, since the number of output terminals on the effective element side is large, the effect is significant.

[0022] FIG. 3 is a diagram for explaining the difference in size between a conventional semiconductor device and the semiconductor device of the first embodiment in relation to the arrangement of the input / output terminal group in the semiconductor device of the first embodiment. FIG. 3(a) is a schematic diagram of a conventional semiconductor device, and FIG. 3(b) is a schematic diagram of the semiconductor device of the first embodiment. The terminal group closer to the effective element region AA is used as the output terminal group (or input terminal group), and the distance from the effective element region AA to the output terminal group (or input terminal group) is defined as B. When the distance B is constant (the same wiring pattern), the semiconductor chip can be moved closer to the effective element region side, so that the semiconductor substrate can be miniaturized as shown in FIG. 3(b).

[0023] (Second Embodiment) The second embodiment will be described. FIG. 4 is a plan view (schematic diagram) of the semiconductor chip according to the second embodiment when viewed from above. In the first embodiment, since the input / output terminal group of the semiconductor chip is disposed on one side in a biased manner, there is a possibility that the electrical connection becomes unstable when the semiconductor chip is connected to the semiconductor substrate. In the second embodiment, a dummy terminal group 450 is provided between the end of the semiconductor chip closest to the active element region AA of the semiconductor device and the input / output terminal group. Thereby, the load applied between the electrode portion and the terminal group during bonding can be made uniform, and the electrical connection can be stabilized.

[0024] Furthermore, in the second embodiment, when the distance from the end of the semiconductor chip closest to the active element region AA of the semiconductor device to the dummy terminal group 450 is defined as W3, the dummy terminal group 450 is arranged such that W2 = W3. Thereby, the uniformity of the terminal arrangement of the semiconductor chip is further improved, and further stabilization of the electrical connection can be achieved. According to the second embodiment, an effect of equalizing the load applied between the electrode portion and the terminal group during bonding is obtained, and miniaturization of the semiconductor device and stabilization of the electrical connection become possible.

[0025] (Third Embodiment) The third embodiment will be described. FIG. 5(a) is a terminal arrangement diagram of the semiconductor chip according to the third embodiment. In the second embodiment, a dummy terminal group is provided between the end of the semiconductor chip closest to the active element region AA and the output terminal (or input terminal) 451. In the third embodiment, the shape and the number of terminals of each terminal in this dummy terminal group are made the same as those of each terminal in the terminal group 452 on the side farthest from the active element region. Thereby, the load can be applied more uniformly, and connection stability can be achieved. According to the third embodiment, an effect of equalizing the load applied between the electrode portion and the terminal group during bonding is obtained, and miniaturization of the semiconductor device and stabilization of the electrical connection become possible.

[0026] FIG. 5(b) is a cross-sectional view of the bonding portion between the semiconductor chip and the semiconductor substrate according to the third embodiment. The semiconductor chip 300 is electrically connected to the electrode portion 33 of the semiconductor substrate 100 via the connection member 500. The connection member 500 uses a conductive member such as an ACF (anisotropic conductive adhesive film), an NCF (non-conductive adhesive film), an epoxy resin, or an acrylic resin. The semiconductor substrate 100 is made of a semiconductor such as single crystal silicon. As described above, by using the semiconductor device according to the first to third embodiments, miniaturization of the semiconductor device becomes possible.

[0027]

[0028] (Fourth Embodiment) In the fourth embodiment, an example in which the semiconductor device according to the first to third embodiments is applied to various devices will be described. When the semiconductor device is used in a display device, the semiconductor substrate 100 is a display element substrate, and a light-emitting element is disposed in the active element region AA. When the semiconductor device is used in an imaging device, the semiconductor substrate 100 is an imaging element substrate, and an imaging element is disposed in the active element region AA.

[0029] FIG. 6 is a schematic diagram showing a display device 1000 which is an example of a display device according to the fourth embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009.

[0030] ​The display panel 1005 is a display unit having a semiconductor device according to the first to third embodiments, and performs display using light emitted from the semiconductor device. Flexible printed circuits FPC1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. A control circuit including transistors is printed on the circuit board 1007 to perform various controls such as control of the display panel 1005. The battery 1008 may not be provided if the display device is not a portable device, or may be provided at another position even if it is a portable device. The display device 1000 may have three types of color filters corresponding to red, green, and blue respectively. The plurality of color filters may be arranged in a delta array.

[0031] The display device 1000 may be used for the display unit of a portable terminal. In that case, the display device 1000 may have both a display function and an operation function. Examples of the portable terminal include mobile phones such as smartphones, tablets, and head-mounted displays.

[0032] The display device 1000 may be used for the display unit of an imaging device having an optical unit with a plurality of lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information (such as an image captured by the imaging element) acquired by the imaging element. Further, the display unit may be a display unit exposed to the outside of the imaging device or a display unit disposed within the viewfinder. The imaging device may be a digital camera, a digital video camera, or the like.

[0033] FIG. 7(a) is a schematic diagram showing an imaging device 1100 which is an example of an imaging device according to the fourth embodiment. The imaging device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may include a display device according to the fourth embodiment (a display device having the semiconductor device according to the first to third embodiments and performing display using the light emitted from the semiconductor device). In that case, the display device may display not only the image to be captured but also environmental information, imaging instructions, and the like. The environmental information may be the intensity of external light, the direction of external light, the speed at which the subject moves, the possibility that the subject is blocked by an obstacle, and the like. The rear display 1102 may also include a display device according to the fourth embodiment.

[0034] Since the timing suitable for imaging is a very short time, it is better to display information as soon as possible. Therefore, it is preferable to use a display device using an organic light-emitting element with a high response speed. A display device using an organic light-emitting element can be more preferably used than a liquid crystal display device or the like in a device where a display speed is required.

[0035] The imaging device 1100 includes an optical unit (not shown). The optical unit has a plurality of lenses and forms an image of light on an imaging element housed in the housing 1104. The plurality of lenses can adjust the focus by adjusting their relative positions. This operation can also be performed automatically. The imaging device 1100 may be called a photoelectric conversion device. The photoelectric conversion device may include, as imaging methods, a method of detecting the difference from a previous image instead of sequentially imaging, a method of cutting out a part of the recorded image, and the like.

[0036] FIG. 7(b) is a schematic diagram showing an electronic device 1200 which is an example of an electronic device according to the fourth embodiment. The electronic device 1200 includes a display unit 1201, an operation unit 1202, and a housing 1203. The display unit 1201 includes the semiconductor device according to the first to third embodiments, and performs display using the light emitted from the semiconductor device. The electronic device 1200 may include a circuit, a printed circuit board having the circuit, a battery, and a communication unit that communicates with the outside, in the housing 1203. The operation unit 1202 may be a button or a reaction unit of a touch panel method. The operation unit may be a biometric recognition unit that recognizes a fingerprint and performs unlocking or the like. An electronic device having a communication unit may also be referred to as a communication device. The electronic device may further have a camera function by including a lens and an imaging device. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone, a notebook computer, and the like.

[0037] FIG. 8(a) is a schematic diagram showing a display device 1300 which is an example of a display device according to the fourth embodiment. The display device 1300 is a display device such as a TV monitor or a PC monitor. The display device 1300 includes a frame 1301, a display unit 1302, and a base 1303 that supports the frame 1301 and the display unit 1302. The display unit 1302 includes the semiconductor device according to the first to third embodiments, and performs display using the light emitted from the semiconductor device. The form of the base 1303 is not limited to the form in FIG. 8(a). The lower side of the frame 1301 may also serve as the base 1303. Further, the frame 1301 and the display unit 1302 may be bent. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0038] FIG. 8(b) is a schematic diagram showing a display device 1310 which is an example of another display device according to the fourth embodiment. The display device 1310 is a so-called foldable display device configured to be foldable. The display device 1310 includes a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. Each of the first display unit 1311 and the second display unit 1312 includes a semiconductor device according to the first to third embodiments, and performs display using light emitted from the semiconductor device. The first display unit 1311 and the second display unit 1312 may be a single seamless display device. The first display unit 1311 and the second display unit 1312 can be separated at the bending point. The first display unit 1311 and the second display unit 1312 may display different images respectively, or may display one image together.

[0039] FIG. 9(a) is a schematic diagram showing a lighting device 1400 which is an example of a lighting device according to the fourth embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusing portion 1405. The light source 1402 includes a semiconductor device according to the first to third embodiments. The optical film 1404 may be a filter (optical filter) that improves the color rendering property of the light source 1402. The light diffusing portion 1405 can effectively diffuse the light of the light source 1402, such as lighting up, and deliver the light to a wide range. The optical film 1404 and the light diffusing portion 1405 may be provided on the light emitting side of the lighting device 1400. If necessary, a cover may be provided on the outermost side.

[0040] The lighting device 1400 is, for example, a device for lighting an interior. The lighting device 1400 may emit white, cool white, or other colors (any color from blue to red). White and is a color with a color temperature of 4200K, and daylight white is a color with a color temperature of 5000K. The lighting device 1400 may have a dimming circuit for dimming the emission color of the lighting device 1400. The lighting device 1400 may have a power supply circuit connected to the light source 1402. The power supply circuit is a circuit that converts an AC voltage into a DC voltage. Also, the lighting device 1400 may have a color filter. Further, the lighting device 1400 may have a heat radiating part. The heat radiating part releases the heat inside the device to the outside of the device, and examples include metals with high specific heat, liquid silicon, etc.

[0041] FIG. 9(b) is a schematic diagram showing an automobile 1500 which is an example of a moving body according to the fourth embodiment. The automobile 1500 may have a tail lamp 1501 which is an example of a lighting fixture. The tail lamp 1501 lights up according to a brake operation or the like.

[0042] The tail lamp 1501 has the semiconductor device according to the first to third embodiments. The tail lamp 1501 may have a protection member for protecting the semiconductor device. The protection member has a certain degree of strength, and the material may be any as long as it is transparent, but it is preferably made of polycarbonate or the like. A phthalic acid derivative, an acrylonitrile derivative, etc. may be mixed into the polycarbonate.

[0043] The automobile 1500 may have a vehicle body 1503 and a window 1502 attached to the vehicle body 1503. The window 1502 may be a transparent display as long as it is not a window for checking the front and rear of the automobile 1500. The transparent display may have the semiconductor device according to the first to third embodiments. In this case, the constituent materials such as the electrodes of the semiconductor device are made of transparent members.

[0044] The moving body according to the fourth embodiment may be a ship, an aircraft, a drone, or the like. The moving body may have a fuselage and a lighting fixture provided on the fuselage. The lighting fixture may emit light for notifying the position of the fuselage. The lighting fixture has the semiconductor device according to the first to third embodiments.

[0045] The display device according to the fourth embodiment (a display device having the semiconductor devices according to the first to third embodiments and performing display using the light emitted from the semiconductor devices) can be applied to wearable devices such as smart glasses, HMDs, and smart contacts. The display device according to the fourth embodiment can also be applied to a system having a wearable device or the like. An imaging display device used as a wearable device or the like includes an imaging device capable of photoelectrically converting visible light and a display device capable of emitting visible light.

[0046] FIG. 10(a) is a schematic diagram showing glasses 1600 (smart glasses), which is an example of a wearable device according to the fourth embodiment. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front surface side of the lens 1601 of the glasses 1600. Further, on the back surface side of the lens 1601, a display device according to the fourth embodiment (a display device having the semiconductor devices according to the first to third embodiments and performing display using the light emitted from the semiconductor devices) is provided.

[0047] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power supply that supplies power to the imaging device 1602 and the above-described display device. Further, the control device 1603 controls the operations of the imaging device 1602 and the display device. An optical system for condensing light onto the imaging device 1602 is formed on the lens 1601.

[0048] FIG. 10(b) is a schematic diagram showing glasses 1610 (smart glasses), which is an example of a wearable device according to the fourth embodiment. The glasses 1610 have a control device 1612, and an imaging device corresponding to the imaging device 1602 and a display device according to the fourth embodiment are mounted on the control device 1612. An optical system for projecting the light emitted from the imaging device in the control device 1612 and the display device is formed on the lens 1611, and an image is projected onto the lens 1611. The control device 1612 functions as a power supply that supplies power to the imaging device and the display device, and controls the operations of the imaging device and the display device.

[0049] The control device may have a gaze detection unit that detects the gaze of the wearer of the glasses 1610. The detection of the gaze may use infrared light. The infrared light emitting unit emits infrared light toward the eyeball of the user who is gazing at the display image. An imaging image of the eyeball is obtained by the imaging unit having a light receiving element detecting the reflected light of the emitted infrared light from the eyeball. By having a reduction unit that reduces the light from the infrared light emitting unit to the display unit in a plan view, the degradation of the quality of the image projected from the display device to the lens 1611 is reduced. The control device detects the user's gaze with respect to the display image from the imaging image of the eyeball obtained by imaging the infrared light. Any known method can be applied to the gaze detection using the imaging image of the eyeball. As an example, a gaze detection method based on the Purkinje image by the reflection of the irradiation light on the cornea can be used. More specifically, gaze detection processing based on the pupil corneal reflection method is performed. Using the pupil corneal reflection method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image included in the imaging image of the eyeball, whereby the user's gaze is detected.

[0050] In addition, when performing display control based on visual recognition detection (gaze detection), the semiconductor device according to the first to third embodiments can be preferably applied to smart glasses having an imaging device that images the outside. The smart glasses can display the imaged external information in real time.

[0051] In addition, the display device according to the fourth embodiment (a display device having the semiconductor device according to the first to third embodiments and performing display using the light emitted from the semiconductor device) may have an imaging device having a light receiving element and control the display image based on the user's gaze information from the imaging device. Specifically, based on the gaze information, a first visual field region that the user gazes at and a second visual field region other than the first visual field region are determined. The first visual field region and the second visual field region may be determined by the control device of the display device, or the display device may receive those determined by an external control device. In the display region of the display device, the display resolution of the first visual field region may be controlled to be higher than the display resolution of the second visual field region. That is, the resolution of the second visual field region may be made lower than that of the first visual field region.

[0052] Further, the display area has a first display area and a second display area different from the first display area, and based on the line-of-sight information, an area with a higher priority may be determined from the first display area and the second display area. The first display area and the second display area may be determined by the control device of the display device, or the display device may receive those determined by an external control device. The resolution of the area with a higher priority may be controlled to be higher than the resolution of the area other than the area with a higher priority. That is, the resolution of the area with a relatively lower priority may be lowered.

[0053] Note that AI may be used to determine the first visual field area, the area with a higher priority, etc. The AI may be a model configured to estimate the angle of the line of sight and the distance to the object at the tip of the line of sight from the eye image using the eye image and the direction in which the eye in the image is actually looking as teacher data. The AI program may be possessed by the display device, the imaging device, or an external device. When an external device possesses it, it is transmitted to the display device via communication.

[0054] As described above, by using the semiconductor device according to the first to third embodiments, various devices can display with good image quality and stable display for a long time.

[0055] Note that each functional part (configuration) of the various devices described in the fourth embodiment may be individual hardware or not. The functions of two or more functional parts may be realized by common hardware. Each of the multiple functions of one functional part may be realized by individual hardware. Two or more functions of one functional part may be realized by common hardware. Further, each functional part may be realized by hardware such as an ASIC, FPGA, or DSP, or not. For example, the device may have a processor and a memory (storage medium) in which a control program is stored. And the functions of at least some of the functional parts possessed by the device may be realized by the processor reading out and executing the control program from the memory.

[0056] The disclosure of this embodiment includes the following configurations. (Configuration 1) A semiconductor device in which a semiconductor chip is connected to a semiconductor substrate via a plurality of terminals, wherein the semiconductor substrate consists of an active element region and a peripheral region surrounding the active element region, the semiconductor chip is electrically bonded onto an electrode portion provided in the peripheral region, the semiconductor chip has a plurality of rows of input / output terminal groups arranged along a first direction, the distance from the end of the semiconductor chip closest to the active element region to the input / output terminal group is W1, the distance from the end of the semiconductor chip farthest from the active element region to the input / output terminal group is W2, and a semiconductor device characterized in that W1 > W2. (Configuration 2) A dummy terminal group is arranged between the end of the semiconductor chip closest to the active element region of the semiconductor substrate and the input / output terminal group in the semiconductor device according to Configuration 1. (Configuration 3) When the distance from the end of the semiconductor chip closest to the active element region of the semiconductor substrate to the dummy terminal group is W3, the dummy terminals are arranged such that W3 = W2 in the semiconductor device according to Configuration 2. (Configuration 4) The shape and number of each terminal in the dummy terminal group are the same as those of each terminal in the input / output terminal group farthest from the active element region of the semiconductor substrate in the semiconductor device according to Configuration 2 or 3. (Configuration 5) The semiconductor chip is connected to the semiconductor substrate by flip chip bonding in the semiconductor device according to any one of Configurations 1 to 4. (Configuration 6) The semiconductor chip is connected to the semiconductor substrate using an anisotropic conductive film The semiconductor device according to any one of Configurations 1 to 5, characterized in that... (Configuration 7) The semiconductor chip is connected by ultrasonic flip chip bonding to a semiconductor substrate. The semiconductor device according to any one of Configurations 1 to 5, characterized in that... (Configuration 8) The semiconductor chip is connected by solder to a semiconductor substrate. The semiconductor device according to any one of Configurations 1 to 5, characterized in that... (Configuration 9) A display unit having the semiconductor device according to any one of Configurations 1 to 8, and a control circuit for controlling the display unit A display device characterized by having the above. (Configuration 10) An optical unit, an image sensor for receiving light that has passed through the optical unit, and a display unit for displaying an image captured by the image sensor A photoelectric conversion device characterized by having the above. wherein the display unit has the semiconductor device according to any one of Configurations 1 to 8 A photoelectric conversion device characterized by having the above. (Configuration 11) A display unit having the semiconductor device according to any one of Configurations 1 to 8, a housing in which the display unit is provided, a communication unit provided in the housing for communicating with the outside, An electronic device characterized by having the above.

Explanation of Reference Numerals

[0057] 33: Electrode portion 100: Semiconductor substrate 300: Semiconductor chip 450: Dummy terminal 451, 452: Terminal groups D1: First direction (longitudinal direction) D2: Second direction (lateral direction)

Claims

1. A semiconductor device in which a semiconductor chip is connected to a semiconductor substrate via a plurality of terminals, wherein the semiconductor substrate comprises an active element region and a peripheral region surrounding the active element region, a semiconductor chip is electrically bonded to an electrode portion provided in the peripheral region, the semiconductor chip has a plurality of input / output terminal groups arranged along a first direction, let the distance from the end of the semiconductor chip closest to the active element region to the input / output terminal group be W1, let the distance from the end of the semiconductor chip farthest from the active element region to the input / output terminal group be W2, then, the semiconductor device is characterized in that W1 > W2.

2. A dummy terminal group is arranged between the end of the semiconductor chip closest to the active element region of the semiconductor substrate and the input / output terminal group. The semiconductor device according to claim 1, characterized in that.

3. Let the distance from the end of the semiconductor chip closest to the active element region of the semiconductor substrate to the dummy terminal group be W3, the dummy terminals are arranged such that W3 = W2. The semiconductor device according to claim 2, characterized in that.

4. The shape and the number of terminals of each terminal in the dummy terminal group are the same as those of each terminal in the input / output terminal group farthest from the active element region of the semiconductor substrate. The semiconductor device according to claim 2, characterized in that.

5. The semiconductor chip is connected to the semiconductor substrate by flip chip bonding. The semiconductor device according to claim 1, characterized in that.

6. The semiconductor chip is connected to the semiconductor substrate using an anisotropic conductive film. The semiconductor device according to claim 1, characterized in that.

7. The semiconductor chip is connected to the semiconductor substrate by ultrasonic flip chip bonding. The semiconductor device according to claim 1, characterized in that.

8. The semiconductor chip is connected to the semiconductor substrate by solder. The semiconductor device according to claim 1, characterized in that.

9. A display unit having the semiconductor device according to any one of claims 1 to 8, and a control circuit for controlling the display unit. A display device, characterized in that it has.

10. An optical unit, an image sensor for receiving light that has passed through the optical unit, and a display unit for displaying an image captured by the image sensor. It has, the display unit has the semiconductor device according to any one of claims 1 to 8. A photoelectric conversion device, characterized in that.

11. A display unit having the semiconductor device according to any one of claims 1 to 8, a housing provided with the display unit, and a communication unit provided in the housing and communicating with the outside. An electronic device characterized by comprising the above.

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