Component production method and component holding structure

Abstract

To provide a technique of easily separating a component formed on a support sheet by an etching treatment while suppressing a deformation.SOLUTION: A manufacturing method of a component includes steps of: bonding a support sheet onto a component material sheet 14; bonding a resist material or printing a resist onto the component material sheet 14; applying an etching treatment to the component material sheet 14 to form a component 16 on the support sheet from the component material sheet 14; bonding an adhesive sheet 12 having an adhesive force higher than that of the support sheet onto the component 16 so as to hold the component 16 between the support sheet and the adhesive sheet 12; and removing the support sheet to obtain the component 16 transferred onto the adhesive sheet 12.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a component by an etching process and a structure for holding the component.

Background Art

[0002] Patent Document 1 discloses a heat-separable adhesive sheet used as a protective sheet for protecting an electronic component when the electronic component is subjected to an etching process using an acidic or alkaline chemical solution. The heat-separable adhesive sheet includes a first adhesive layer, a base material, and a second adhesive layer in this order. Since the first adhesive layer expands or foams by heating, the adhesive force decreases.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a component material sheet is bonded to a support sheet and an etching process is performed, if the resistance of the support sheet to the etching process is made sufficient, the peelability may decrease.

[0005] An object of the present invention is to provide a technique for easily peeling off a component formed on a support sheet by an etching process while suppressing deformation.

Means for Solving the Problems

[0006] In order to solve the above problems, a component manufacturing method according to an aspect of the present invention includes a step of laminating a support sheet on a component material sheet, a step of laminating a resist material or printing a resist on the component material sheet, a step of performing an etching process on the component material sheet to form a component from the component material sheet on the support sheet, a step of laminating an adhesive sheet having a higher adhesive force than the support sheet on the component to sandwich the component between the support sheet and the adhesive sheet, and a step of peeling off the support sheet to obtain the component transferred to the adhesive sheet.

[0007] Another aspect of the present invention is a component holding structure. This component holding structure includes a component formed by an etching process from a component material sheet laminated on a support sheet, and an adhesive sheet laminated on the component to transfer the component from the support sheet. The adhesive force of the adhesive sheet decreases by a process of heating, ultraviolet irradiation, cooling, or voltage application.

Advantages of the Invention

[0008] According to the present invention, it is possible to provide a technique for easily peeling off a component formed on a support sheet by an etching process while suppressing deformation.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] FIG. 1 is a plan view of the component holding structure 10 of the embodiment. Further, FIG. 2 is a partially enlarged view of the component holding structure 10 shown in FIG. 1. The component holding structure 10 is composed of an adhesive sheet 12 and a component material sheet 14. The component material sheet 14 includes components 16 formed by an etching process and residues 18 other than the components 16.

[0011] The adhesive sheet 12 is not adhered to the component material sheet 14 when performing the etching process on the component material sheet 14, and is adhered to the component material sheet 14 after the etching process. The adhesive sheet 12 holds a plurality of components 16.

[0012] When the component material sheet 14 is subjected to the etching process, it is held by a support sheet described later. After the etching process, the component material sheet 14 is transferred from the support sheet to the adhesive sheet 12. The component 16 shows a circular form, but is not limited to this form and is formed into a shape according to the application.

[0013] FIG. 3 is a diagram for explaining a manufacturing method of the component holding structure 10. FIGS. 3(a) to 3(e) show the manufacturing process of the component 16 in chronological order. In FIG. 3(a), the component material sheet 14 is bonded to the support sheet 20. The component material sheet 14 is formed of, for example, a metal material. Also, a film-like resist material is bonded to the component material sheet 14. A resist representing the processing pattern of the component may be directly printed on the component material sheet 14. The support sheet 20 is formed of a material suitable for etching treatment.

[0014] The support sheet 20 is adhered to the component material sheet 14 by an adhesive layer 20a formed of a silicon-based material. Since the adhesive layer 20a is formed of a silicon-based material, it is difficult to impregnate an etching solution such as a ferric chloride solution. Therefore, it is possible to suppress further corrosion of the component material sheet 14 by the etching material remaining on the support sheet 20. The support sheet 20 functions as a support for supporting the component during the etching treatment.

[0015] In FIG. 3(b), the component material sheet 14 is subjected to an etching treatment, and the component 16 is formed from the component material sheet 14 on the support sheet 20. Since the etching treatment on the component material sheet 14 is supported by the support sheet 20, it is bridge-free without connection between components or with a frame, and the component material sheet 14 is not fixed by a frame or the like. Generally, when forming a component by an etching treatment, a plurality of components are arranged on a frame from the viewpoint of processing efficiency. Also, since a general etching method does not have a support, if there is no bridge, there is a case where the component may fall off during processing depending on the size of the component. Also, the etching treatment on the component material sheet 14 may be dry etching. The side surface of the component 16 is formed in a tapered shape by the etching treatment.

[0016] In FIG. 3(c), the adhesive sheet 12 is bonded to the component 16, and the component 16 is sandwiched between the support sheet 20 and the adhesive sheet 12. An adhesive layer 12a is provided on the adhesive sheet 12.

[0017] In FIG. 3(d), the support sheet 20 is peeled off from the component 16. When the adhesive sheet 12 and the support sheet 20 are separated, since the adhesive force of the adhesive sheet 12 is higher than that of the support sheet 20, the component 16 maintains the state of being attached to the adhesive sheet 12.

[0018] In FIG. 3(e), the entire support sheet 20 is peeled off, and the adhesive sheet 12 holds the component 16. In this way, a plurality of components 16 are transferred from the support sheet 20 to the adhesive sheet 12 after the etching process, and the component holding structure 10 is obtained. Since a large number of components 16 are obtained in a state of being adhered to the adhesive sheet 12, the transportation is easy. For example, since the component holding structure 10 is in a sheet shape, it can also be shipped after being rolled up.

[0019] The adhesive sheet 12 has the property that its adhesive force decreases when it is subjected to a pre-peeling treatment such as heating, ultraviolet irradiation, cooling, or voltage application. Therefore, by subjecting the adhesive sheet 12 to the pre-peeling treatment, the component 16 can be easily peeled off from the adhesive sheet 12. Therefore, a plurality of components 16 can be transported in a state of being adhered to the adhesive sheet 12, and the adhesive sheet 12 can be subjected to the pre-peeling treatment so that the component 16 can be peeled off and used.

[0020] In this way, the support sheet 20 is used in the etching process, and the adhesive sheet 12 is used after the etching process. A material suitable for the etching process is selected for the support sheet 20, and a material that allows the component 16 to be easily peeled off is selected for the adhesive sheet 12.

[0021] Note that the timing at which the component 16 is peeled off from the adhesive sheet 12 is not limited to after shipment. For example, the component 16 may be peeled off from the adhesive sheet 12 before shipment. That is, after the component 16 is transferred to the adhesive sheet 12, heating, ultraviolet irradiation, cooling, or voltage application is performed on the adhesive sheet 12 to separate the component 16 from the adhesive sheet 12 and make it in a state ready for shipment. In this way, while the support sheet 20 is a material suitable for the etching process, the adhesive sheet 12 is a material whose adhesive force decreases due to the pre-peeling treatment and which allows the component 16 to be easily peeled off.

[0022] FIG. 4(a) is an enlarged view of the component holding structure 10, and FIG. 4(b) is a cross-sectional view taken along line A-A of the component holding structure 10 shown in FIG. 4(a).

[0023] The thickness T1 of the component material sheet 14 shown in FIG. 4(b) is 1 mm or less. The thickness T1 of the component material sheet 14 may be 0.2 mm or less. Since the component material sheet 14 is thin, there is a risk of breakage or curling when peeling off the component 16. Also, when the component 16 has a shape such as a circle, there is no starting point for peeling, so the peeling operation is not easy.

[0024] The support sheet 20 is a sheet in which the adhesive layer 20a is formed of a silicon-based material and the adhesive layer 20a having reworkability is applied in order to suppress impregnation of the etching material. The support sheet 20 may be formed by coating a resin material having flexibility that can be wound into a roll with the adhesive layer 20a. Also, the support sheet 20 may be a sheet subjected to a release treatment and may have a silicon-based release treatment layer instead of the adhesive layer 20a. The silicon-based release treatment layer also has appropriate adhesiveness. In any case, a coating that is difficult to impregnate with the etching material is applied to the surface layer of the support sheet 20. The thickness of the support sheet 20 is set in the range of 10 μm to 300 μm.

[0025] Since the adhesive sheet 12 is after the etching treatment, the degree of freedom in material selection is higher than that of the support sheet 20. The adhesive sheet 12 has flexibility that can be wound into a roll. Thereby, in a state where the component 16 is bonded, it can be wound into a roll and conveyed. The impregnation property of the adhesive sheet 12 with the etching material is not questioned.

[0026] The adhesive sheet 12 transfers the component 16 from the support sheet 20, adheres to the component 16, and then the component 16 is peeled off. The adhesive sheet 12 is required to have characteristics for transferring the component 16 from the support sheet 20 and characteristics for easily peeling off the component 16. Therefore, the adhesive layer 12a of the adhesive sheet 12 has a higher adhesive force than the support sheet 20 and has the characteristic that the adhesive force decreases by pre-treatment for peeling such as heating, ultraviolet irradiation, cooling, or voltage application. Thereby, when the adhesive sheet 12 transfers the component 16 from the support sheet 20, it has sufficient adhesive force, and when peeling off the component 16, it becomes easy to peel off by the pre-treatment for peeling.

[0027] The thickness T2 of the adhesive sheet 12 is set in the range of 10 μm to 300 μm and is thicker than the component material sheet 14. The adhesive layer 12a is formed of, for example, an acrylic-based adhesive material or a urethane-based adhesive material. The adhesive force of the adhesive layer 12a of the adhesive sheet 12 decreases to 1 / 5 or less of the original by pre-treatment for peeling. Thereby, it becomes possible to easily peel off the component 16.

[0028] The adhesive force of the adhesive sheet 12 before heating, ultraviolet irradiation, cooling, or voltage application to the adhesive sheet 12 is 2 times or more the adhesive force of the support sheet 20. That is, the adhesive force of the adhesive sheet 12 during transfer is 2 times or more the adhesive force of the support sheet 20. For example, the adhesive force of the support sheet 20 is generated to be 0.1 N / 25 mm or less, that is, 0.1 N or less for a 25 mm-wide support sheet 20. Also, the adhesive force of the adhesive sheet 12 during transfer is generated to be 1 N / 25 mm or more at a predetermined temperature (about 24°C), that is, 1 N or more for a 25 mm-wide adhesive sheet 12.

[0029] FIG. 5(a) is an enlarged cross-sectional view of the component holding structure 10 of the embodiment, and FIG. 5(b) is an enlarged cross-sectional view of the component holding structure 100 of the first modification.

[0030] As shown in Fig. 5(a), the side surface 16a of the component 16 cut by the etching process is formed in an inverted taper shape by being transferred. That is, both side surfaces 16a are formed so as to expand as they move away from the adhesive sheet 12. Therefore, the angle θ formed between the side surface 16a and the adhesive sheet 12 is an acute angle.

[0031] In the cross-section of the component along the plane direction of the adhesive sheet 12 shown in Fig. 5(a), the first side L1 in contact with the adhesive sheet 12 is less than or equal to the length of the second side L2 that was in contact with the support sheet 20 and was located opposite to the first side L1. That is, "L1 ≦ L2". Thus, when peeling off the component 16, it is also possible to catch and peel off the side surface 16a of the component 16. More preferably, "L1 < L2" may be satisfied.

[0032] In the component holding structure 100 shown in Fig. 5(b), the shape of the side surface 116a of the component 116 is different from that of the component 16 shown in Fig. 5(a). The side surface 116a is formed so as to be recessed as the corrosion of the etching process progresses. In the cross-section of the component 116 shown in Fig. 5(b), the first side L1 in contact with the adhesive sheet 12 is less than or equal to the length of the second side L2 located opposite to the first side L1.

[0033] Fig. 6 is a plan view of the component holding structure 200 of the second modified example. The component holding structure 200 includes an adhesive sheet 212, a component material sheet 214, and a component 216. The component 216 is separated from the component material sheet 214 by an etching process. The component 216 has a plurality of terminals 216a. A pair of components 216 are provided, and by bending the wire, they form a substantially octagonal shape as a whole.

[0034] Fig. 7 is a plan view of the component holding structure 300 of the third modified example. The component holding structure 300 includes an adhesive sheet 312, a component material sheet 314, and a component 316. Both ends of the component 316 are connected by a plurality of linear paths, and the whole is formed in a rectangular shape.

[0035] FIG. 8 is a plan view of a component holding structure 400 according to a fourth modified example. The component holding structure 400 includes an adhesive sheet 412, a component material sheet 414, and a component 416. The component 416 is formed in a pair of spiral shapes, and both terminals are disposed at the center of the pair of spiral portions.

[0036] FIG. 9 is a plan view of a component holding structure 500 according to a fifth modified example. The component holding structure 500 includes an adhesive sheet 512, a component material sheet 514, and a component 516. The component 516 is formed by connecting a circular portion inside a rectangular portion, and the circular portion is notched in a pair to form terminals.

[0037] FIG. 10 is a plan view of a component holding structure 600 according to a sixth modified example. The component holding structure 600 includes an adhesive sheet 612, a component material sheet 614, and a component 616. The component 616 has a rectangular portion having a dot-shaped punched hole on one surface, and a rod-shaped portion connected to the rectangular portion and positioned along one side of the rectangular portion.

[0038] FIG. 11 is a plan view of a component holding structure 700 according to a seventh modified example. The component holding structure 700 includes an adhesive sheet 712, a component material sheet 714, and a component 716. The component 716 has a single straight path and a plurality of protruding portions protruding upward from the path. The protruding portion is composed of a triangular portion and a portion connecting the base of the triangular portion to the path.

[0039] FIG. 12 is a plan view of a component holding structure 800 according to an eighth modified example. The component holding structure 800 includes an adhesive sheet 812, a component material sheet 814, and a component 816. The component 816 has a single straight path and a plurality of end portions extending from both sides of the path.

[0040] In the embodiments and each modified example, although the aspect of forming the component 16 by an etching process is shown, the aspect is not limited thereto. For example, the component 16 may be formed by an electroforming process. The step of forming the component 16 by an electroforming process is shown below. (1) Bond a resist member to a support sheet that is a master mold. (2) Expose the resist member to the formation pattern of the component. (3) Develop the formation pattern of the component on the resist member. (4) Electrodeposit the component material on the support sheet other than the resist member by electroforming to form the component. (5) Remove the resist member from the support sheet. (5) Attach the adhesive sheet to the component remaining on the support sheet. (6) Peel the support sheet from the adhesive sheet and the component. That is, separate the support sheet and the adhesive sheet to obtain the component on the adhesive sheet.

[0041] Depending on the shape of the component formed on the support sheet, when the component is peeled from the support sheet, the possibility of defects and deformations occurring in the component increases. Therefore, the component is transferred from the support sheet to the adhesive sheet. The support sheet may be a synthetic resin material, and the adhesive layer of the support sheet may be formed of a silicon-based material that prevents the penetration of the plating solution. The support sheet functions as a support for supporting the component.

[0042] When forming the component 16 by electroforming treatment, the component material sheet 14 does not remain on the adhesive sheet 12, and the component holding structure 10 is composed of the adhesive sheet 12 and the component 16. Even when forming the component 16 by etching treatment, the component holding structure 10 may be composed only of the adhesive sheet 12 and the component 16.

[0043] The present invention is not limited to the above-described embodiments, and it is also possible to add various design changes and other modifications to each embodiment based on the knowledge of those skilled in the art. Embodiments with such modifications may also be included in the scope of the present invention.

Explanation of Reference Numerals

[0044] 10 Component holding structure, 12 Adhesive sheet, 12a Adhesive layer, 14 Component material sheet, 16 Component, 18 Residue, 20 Support sheet, 20a Adhesive layer.

Claims

1. A step of laminating a support sheet on a component material sheet; A step of laminating a resist material on or printing a resist on the component material sheet; A step of performing an etching process on the component material sheet to form a component on the support sheet from the component material sheet; A step of laminating an adhesive sheet having a higher adhesive force than the support sheet on the component to sandwich the component between the support sheet and the adhesive sheet; A step of peeling off the support sheet to obtain the component transferred to the adhesive sheet, characterized in that the component manufacturing method includes the above steps.

2. After the step of obtaining the component, the method further includes a step of heating, irradiating with ultraviolet rays, cooling, or applying a voltage to the adhesive sheet to peel off the adhesive sheet from the component, characterized in that the component manufacturing method according to claim 1 includes the above steps.

3. The support sheet is a sheet coated with an adhesive layer having reworkability or a sheet subjected to a release treatment; The thickness of the component material sheet is 1 mm or less, characterized in that the component manufacturing method according to claim 1 or 2 includes the above steps.

4. In the step of performing the etching process, a plurality of the components are formed in a state of being adhered to the support sheet from the component material sheet; A plurality of the components can be shipped in a state of being laminated on the adhesive sheet, characterized in that the component manufacturing method according to claim 1 or 2 includes the above steps.

5. In the step of performing the etching process, a plurality of the components are formed in a state of being adhered to the support sheet from the component material sheet; After transferring the component to the adhesive sheet, the method further includes a step of heating, irradiating with ultraviolet rays, cooling, or applying a voltage to the adhesive sheet to separate the component from the adhesive sheet to make it in a state where it can be shipped, characterized in that the component manufacturing method according to claim 1 or 2 includes the above steps.

6. The adhesive force of the adhesive sheet before heating, irradiating with ultraviolet rays, cooling, or applying a voltage to the adhesive sheet is 2 times or more the adhesive force of the support sheet, characterized in that the component manufacturing method according to claim 2 includes the above steps.

7. A component formed by an etching process from a component material sheet laminated on a support sheet; An adhesive sheet laminated on the component to transfer the component from the support sheet, comprising: The adhesive sheet is characterized in that its adhesive force decreases by a treatment of heating, irradiating with ultraviolet rays, cooling, or applying a voltage, and the component holding structure is provided.

8. The component holding structure according to claim 7, wherein the adhesive sheet has an adhesive force that is reduced to 1 / 5 or less by a treatment of heating, ultraviolet irradiation, cooling, or voltage application.

9. The component holding structure according to claim 7 or 8, wherein, in a cross-section of the component along the plane direction of the adhesive sheet, a first side that contacts the adhesive sheet is equal to or less than the length of a second side that is located on the opposite side of the first side and contacts the support sheet.

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