Lead correction device and mounting device

Abstract

To correct the tip position of a lead with high accuracy using a general-purpose lead correction tool.SOLUTION: A lead correction device includes a lead component holding mechanism for moving a lead component while holding the lead component, a recognition device for imaging the lead component held by the lead component holding mechanism and recognizing the position of the lead tip based on the image data, a lead correction tool that has a groove portion capable of accommodating the lead tip portion of the lead component held above the recognition device, and corrects the position of the lead tip by moving with respect to the lead component holding mechanism while the lead is hooked on the groove, and a tool moving device that moves the lead correction tool with respect to the recognition device.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The technology disclosed in this specification relates to a lead correction device and a mounting device.

Background Art

[0002] There is known a mounting device that holds an electronic component with a movable head and moves the head onto a substrate to mount the electronic component on the substrate. In such a mounting device, when mounting a lead component having a plurality of leads extending downward from a component body into through-holes of a substrate, there is known a lead correction jig for correcting the case where the interval between the leads is not within a preset allowable range (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such a lead correction jig, it is necessary to replace a dedicated jig each time according to the pitch, number, shape, layout, etc. of the leads, which is complicated. In addition, it is desired to be able to measure and correct the position of the leads with high precision according to the pitch, number, shape, layout, etc. of the leads.

[0005] The technology disclosed in this specification aims to accurately correct the tip position of leads with a highly versatile lead correction jig.

Means for Solving the Problems

[0006] This specification discloses a lead correction device. The lead correction device includes a lead component holding mechanism for holding and moving a lead component, a recognition device for imaging the lead component held by the lead component holding mechanism and recognizing the position of the tip of the lead based on image data, a groove portion capable of accommodating the tip portion of the lead of the lead component held above the recognition device, and a lead correction jig that corrects the position of the tip of the lead by relatively moving with respect to the lead component holding mechanism with the lead hooked in the groove portion, and a jig moving device for moving the lead correction jig with respect to the recognition device.

Effect of the Invention

[0007] According to the technology disclosed in this specification, the tip position of the lead can be corrected with high precision by a highly versatile lead correction jig.

Brief Description of the Drawings

[0008]

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DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. Note that the present invention is not limited by the following embodiments (hereinafter referred to as embodiments) for carrying out the present invention. Further, the constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within the so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be combined as appropriate.

[0010] In the embodiment, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of the predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotational direction or tilting direction centered on the X-axis direction is defined as the θX direction. The rotational direction or tilting direction centered on the Y-axis direction is defined as the θY direction. The rotational direction or tilting direction centered on the Z-axis direction is defined as the θZ direction. In the embodiment, the predetermined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-and-down direction. The +Z side is the upper side, and the -Z side is the lower side. Note that the predetermined plane may be inclined with respect to the horizontal plane. Also, in the embodiment, the predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0011] [Component] FIG. 1 is a perspective view schematically showing a lead component C according to an embodiment. The lead component C is an insertion-type electronic component. FIG. 2 is a bottom view schematically showing the lead component C according to the embodiment. As shown in FIGS. 1 and 2, the lead component C has a body Cb and a plurality of leads Cl protruding from the body Cb.

[0012] The body Cb includes a housing member made of synthetic resin. For example, a coil is disposed in the internal space of the body Cb. The lead Cl is a protrusion made of metal. The lead Cl is connected to, for example, a coil disposed in the internal space of the body Cb. The lead Cl protrudes downward from the lower surface of the body Cb.

[0013] A plurality of lead Cls are arranged at a predetermined interval on the lower surface of the body Cb. The predetermined interval may not be uniform. At least two lead Cls are arranged. In an embodiment, the lead Cls are arranged in two rows in the Y-axis direction, five are arranged in the X-axis direction in one row on the +Y side, and seven are arranged in the X-axis direction in the other row on the -Y side. That is, twelve lead Cls are provided on the body Cb. Also, among the lead Cls, two lead Cls on the -X side of the row on the +Y side are thicker than the other lead Cls. Note that the number and arrangement of the lead Cls arranged on the lead component C are not limited to the embodiment, and for example, they may be arranged in a matrix shape, or the thickness of all the lead Cls may be uniform.

[0014] [Mounting device] FIG. 3 is a plan view schematically showing the schematic configuration of a mounting device 100 according to an embodiment. The mounting device 100 is a device for mounting electronic components on a substrate P. The mounting device 100 includes a base member 101, a substrate transfer device 102, a component supply device 103, a mounting head 104, a head moving device 105, a component state detection unit 106, a replacement nozzle holding mechanism 107, a component storage unit 108, and a control device 109.

[0015] The base member 101 supports each of the substrate transfer device 102, the component supply device 103, the mounting head 104, the head moving device 105, the component state detection unit 106, the replacement nozzle holding mechanism 107, and the component storage unit 108.

[0016] The substrate transfer device 102 transfers the substrate P supplied to the mounting device 100 to the mounting area DM where electronic components are mounted by the mounting head 104. The mounting area DM is defined in the transfer path of the substrate transfer device 102. In the embodiment, the substrate transfer device 102 transfers the substrate P in the X-axis direction. The substrate P before the electronic components are mounted is carried into the substrate transfer device 102 from the -X side end of the base member 101. The substrate transfer device 102 transfers the carried-in substrate P in the +X direction and stops it in the mounting area DM. The mounting head 104 mounts electronic components on the surface of the substrate P arranged in the mounting area DM. The substrate transfer device 102 transfers the substrate P after the electronic components are mounted in the +X direction. The substrate P after the electronic components are mounted is carried out from the +X side end of the base member 101.

[0017] The component supply device 103 supplies electronic components to the supply area SM. The component supply device 103 includes, for example, a plurality of tape feeders. A plurality of tape feeders are arranged in the X-axis direction. The supply area SM for the electronic components is defined by the tape feeders. The tape feeder conveys a carrier tape that holds a plurality of electronic components. By conveying the carrier tape, at least one of the plurality of electronic components is supplied to the supply area SM. In the embodiment, the component supply device 103 is arranged on both the +Y side and the -Y side of the substrate transfer device 102. Note that the component supply device 103 may be arranged on either the +Y side or the -Y side of the substrate transfer device 102.

[0018] The mounting head 104 holds the electronic components supplied from the component supply device 103 with a nozzle and mounts them on the substrate P. The mounting head 104 may have a plurality of nozzles. The mounting head 104 is movable so that nozzles are arranged in each of the supply area SM where the electronic components are supplied and the mounting area DM where the substrate P is arranged. The supply area SM and the mounting area DM are defined at different positions in the XY plane.

[0019] The mounting head 104 has one or more nozzles and a nozzle driving unit. The nozzle is, for example, a suction mechanism that has an opening at its tip and holds an electronic component by sucking the upper surface of the electronic component. The nozzle may be, for example, a gripping type nozzle that uses an arm operated by pneumatic pressure to hold the electronic component by sandwiching it from the side. When the nozzle is not mounted on the mounting head 104, it is stored (stored) in the exchange nozzle holding mechanism 107. The nozzle driving unit moves the nozzle in the Z-axis direction and rotates it in the θZ direction. The mounting head 104 holds the electronic component by supplying pneumatic pressure to the opening of the nozzle or the arm. The mounting head 104 holds the electronic component supplied to the supply area SM with the nozzle, moves to the mounting area DM, and then mounts it on the substrate P arranged in the mounting area DM.

[0020] The head moving device 105 can move the mounting head 104 in each of the X-axis direction, Y-axis direction, and Z-axis direction. The head moving device 105 has an X-axis driving unit 105X that moves the mounting head 104 in the X-axis direction, a Y-axis driving unit 105Y that moves the mounting head 104 in the Y-axis direction, and a lifting driving unit (not shown) that moves the mounting head 104 in the Z-axis direction.

[0021] The component state detection unit 106, the exchange nozzle holding mechanism 107, and the component storage unit 108 are arranged on the vertically lower side of the mounting head 104 in the movable area of the mounting head 104. In the embodiment, the component state detection unit 106, the exchange nozzle holding mechanism 107, and the component storage unit 108 are arranged between the mounting area DM where the electronic component is mounted on the substrate P and the supply area SM where the electronic component for mounting on the substrate P is supplied.

[0022] In the component state detection unit 106, the shape of the electronic component held by the nozzle of the mounting head 104 and the holding state of the electronic component by the nozzle are recognized. The component state detection unit 106 includes, for example, an image recognition device, and has a camera that photographs the vicinity of the nozzle of the mounting head 104 and an illumination unit that illuminates the photographed area. In the embodiment, the lead correction device 10 described later is arranged in the component state detection unit 106.

[0023] The exchange nozzle holding mechanism 107 is a mechanism that holds a plurality of types of nozzles. The exchange nozzle holding mechanism 107 holds a plurality of types of nozzles in a state where the mounting head 104 can be detachably exchanged. The mounting head 104 can change the nozzles mounted by the exchange nozzle holding mechanism 107, and by supplying pneumatic pressure to the mounted nozzles to drive them, the electronic components to be held can be held under appropriate conditions (suction or gripping).

[0024] The component storage section 108 is a box that stores electronic components that the mounting head 104 holds with a nozzle and does not mount on the substrate P. That is, in the mounting apparatus 100, it becomes a waste box for discarding electronic components that are not mounted on the substrate P. When there are electronic components that are not to be mounted on the substrate P among the electronic components held by the mounting head 104, the mounting apparatus 100 moves the mounting head 104 to a position facing the component storage section 108 and releases the held electronic components, thereby putting the electronic components into the component storage section 108.

[0025] The control device 109 controls each part of the mounting apparatus 100. The control device 109 includes a computer system having at least one processor, a main memory, a storage, and an interface. The processor is a CPU (Central Processing Unit). The main memory includes non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory). Examples of the storage include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM. The interface includes an input / output circuit. The functions of the processor are stored in the storage as a program. The processor reads the program from the storage and expands it in the main memory, and executes processing according to the program.

[0026] The control device 109 may be provided directly on the mounting device 100 or may exist separately via a network. In the embodiment, controlling the mounting head 104 includes controlling the head moving device 105. Controlling the nozzles of the mounting head 104 includes controlling the nozzle driving unit.

[0027] In addition, the mounting device 100 may appropriately include an operation device (not shown) for an operator to operate, a display device (not shown) for displaying various information, a warning device for generating warnings by light or sound, and the like.

[0028] [Lead correction device] FIG. 4 is a perspective view showing a lead correction device 10 according to the embodiment. The lead correction device 10 corrects the position of the lead Cl of the lead component C. The lead correction device 10 corrects the position of the tip of the lead Cl in the XY plane. In the embodiment, the lead correction device 10 is mounted on the component state detection unit 106 of the mounting device 100.

[0029] The lead correction device 10 includes a support member 12, a cover member 14, a recognition unit 20, a lead correction unit 30, and a lead component holding mechanism that holds the body Cb of the lead component C and moves it while maintaining the posture. In the embodiment, the lead correction unit 30 includes two lead correction units 30A and 30B. In the embodiment, the lead component holding mechanism is the mounting head 104 of the mounting device 100.

[0030] The support member 12 is fixed to the base member 101 of the mounting device 100 or is provided integrally with the base member 101. The support member 12 includes a first support base 12a, a column portion 12b, and a second support base 12c.

[0031] The first support base 12a is a substantially rectangular plate member extending in the XY plane. In the embodiment, it is placed on the reference plane of the mounting device 100 and is detachably fixed to the base member 101 by screws. The first support base 12a supports the lead correction unit 30 on the upper surface side (+Z side). The column portion 12b is a column member extending downward (-Z side) from the four corners of the first support base 12a. The column portion 12b is connected to the lower surface side (-Z side) of the first support base 12a at the upper end and is connected to the second support base 12c on the upper surface side (+Z side) at the lower end. The height of the column portion 12b is lower than the height of the recognition unit 20. The second support base 12c is located below the first support base 12a (+Z side) and is a substantially rectangular plate member extending in the XY plane and is supported by the first support base 12a via the column portion 12b. The second support base 12c supports the recognition unit 20 on the upper surface side (+Z side).

[0032] The first support base 12a has an opening 12d penetrating in the Z-axis direction. The recognition unit 20 is inserted into the opening 12d. That is, the first support base 12a is provided so as to surround the recognition unit 20 within the XY plane. The lower part of the recognition unit 20 is buried below the reference plane of the mounting device 100. In the embodiment, the first support base 12a supports one lead correction unit 30A on the -Y side of the opening 12d and supports the other lead correction unit 30B on the +Y side of the opening 12d.

[0033] The cover member 14 is a substantially rectangular parallelepiped-shaped lid member that covers the space above the first support base 12a (+Z side). In the space surrounded by the upper surface of the first support base 12a and the cover member 14, a part of the upper side of the recognition unit 20 and the lead correction units 30A and 30B are accommodated. An opening 14a is provided in the cover member 14 directly above the transmission window 24 of the recognition unit 20.

[0034] FIG. 5 is a perspective view schematically showing the recognition unit 20 according to the embodiment. The recognition unit 20 includes a housing 22, a transmission window 24, and a recognition device 26. The housing 22 is fixed to the second support base 12c of the support member 12. A transmission window 24 extending in the XY plane is provided on the upper surface of the housing 22. A plurality of light emitting elements surrounding the transmission window 24 may be provided on the housing 22. The light emitting elements emit illumination light to illuminate the lead component C held above the transmission window 24.

[0035] The recognition device 26 is a device that recognizes the lead component C held above the transmission window 24 in three-dimensional coordinates. The recognition device 26 measures the position of the tip of the lead Cl of the lead component C within the XY plane position based on the phase shift method. The recognition device 26 includes a projection device 26A, an imaging device 26B, and an arithmetic device. The projection device 26A and the imaging device 26B are fixed at predetermined positions inside the housing 22. The arithmetic device is realized, for example, as part of the function of the control device 109 of the mounting device 100. The recognition device 26 measures the three-dimensional shape of the lead component C held above the transmission window 24 based on the phase shift method.

[0036] The projection device 26A irradiates the lead component C held above the transmission window 24 with stripe pattern light. The projection device 26A includes a light source, a light modulation element that modulates the light emitted from the light source to generate stripe pattern light, and an emission optical system that emits the stripe pattern light generated by the light modulation element. Examples of the light modulation element include a digital mirror device (DMD), a transmissive liquid crystal panel, or a reflective liquid crystal panel.

[0037] The imaging device 26B images the lead component C irradiated with the stripe pattern light from a predetermined viewpoint. The viewpoint of the imaging device 26B refers to the relative imaging position and imaging angle of the imaging device 26B with respect to the lead component C. The imaging device 26B includes an imaging optical system that forms an image of the stripe pattern light reflected by the lead component C, and an image sensor that acquires image data of the lead component C via the imaging optical system. As the image sensor, a CMOS image sensor (Complementary Metal Oxide Semiconductor Image Sensor) or a CCD image sensor (Charge Coupled Device Image Sensor) is exemplified.

[0038] The lead correction unit 30 shown in FIG. 4 corrects the position of the lead Cl of the lead component C held above the transmission window 24. The lead correction unit 30 corrects the position of the tip of the lead Cl in the XY plane. The lead correction unit 30 corrects the interval between the tips of two adjacent leads Cl.

[0039] In the embodiment, the lead correction unit 30 includes two lead correction units 30A and 30B arranged facing each other in the Y-axis direction with the recognition unit 20 interposed therebetween. The lead correction unit 30A and the lead correction unit 30B have a symmetrical configuration in the Y-axis direction. The lead correction unit 30 mounted on the lead correction device 10 is not limited to two, and may be one, or three or more. The lead correction units 30 may be arranged side by side in the X-axis direction, or may be arranged facing each other in the X-axis direction with the recognition unit 20 interposed therebetween. In the following description, when the lead correction units 30A and 30B are not particularly distinguished, they are simply referred to as the lead correction unit 30.

[0040] The lead correction unit 30 includes a lead correction jig 40 and a jig moving device 50 that moves the lead correction jig 40 relative to the recognition unit 20.

[0041] Figs. 6 and 7 are perspective views showing a part of the lead correction jig 40 according to the embodiment. Here, the configuration of the lead correction jig 40 of the lead correction unit 30B disposed on the +Y side of the recognition unit 20 will be mainly described.

[0042] The lead correction jig 40 is a square bar-shaped member extending in the Y-axis direction. The lead correction jig 40 corrects the position of the lead Cl at the tip on the recognition unit 20 side in the Y-axis direction. The lead correction jig 40 is supported by the jig moving device 50 on the side opposite to the recognition unit 20 in the Y-axis direction. The lead correction jig 40 includes an identification part 42 and a correction part 44.

[0043] The identification part 42 includes a marker for detecting the position of the lead correction jig 40 in the XY plane by the recognition device 26. The identification part 42 is provided on the -Z side of the lead correction jig 40 so that the recognition device 26 can recognize it when the lead correction jig 40 is positioned above the transmission window 24. By detecting the identification part 42 by the recognition device 26 and detecting the position of the lead correction jig 40 based on this, it is possible to correct the position of the lead correction jig 40 with high precision.

[0044] The correction part 44 is located at the tip on the recognition unit 20 side in a square bar shape extending in the Y-axis direction. In the lead correction jig 40 of the embodiment, the width of the correction part 44 in the X-axis direction is smaller than that of the other parts. The width of the correction part 44 in the X-axis direction is 0.5 mm in the embodiment. When the gap between two adjacent leads Cl in the X-axis direction is 0.5 mm or less, the correction part 44 can enter between the two leads Cl as the lead correction jig 40 moves in the Y-axis direction. A first groove part 46 and a second groove part 48 are formed in the correction part 44.

[0045] The first groove portion 46 opens to the upper surface of the correction portion 44 and one side surface in the longitudinal direction (Y-axis direction). The first groove portion 46 is a concave portion (slit) that extends a predetermined distance from the +Z side surface to the -Z side on the +X side surface of the correction portion 44. The first groove portion 46 can accommodate the tip of the lead Cl. The lead correction jig 40 can correct the tip of the lead Cl in the moving direction by moving in the XY direction with the tip of the lead Cl hooked in the first groove portion 46.

[0046] The first groove portion 46 corrects the tip position of the lead Cl to the +X side by pressing the bottom surface of the concave portion, that is, the -X side surface, against the tip of the lead Cl to the +X side. The first groove portion 46 corrects the tip position of the lead Cl to the -Y side and the +Y side by pressing the side surfaces of the concave portion, that is, the +Y side surface and the -Y side surface, against the tip of the lead Cl to the -Y side and the +Y side, respectively.

[0047] The second groove portion 48 opens to the upper surface of the correction portion 44 and the other side surface in the longitudinal direction (Y-axis direction). The second groove portion 48 is a concave portion (slit) that extends a predetermined distance from the +Z side surface to the -Z side on the -X side surface of the correction portion 44. The second groove portion 48 is formed at a position shifted in the Y-axis direction from the first groove portion 46. In the embodiment, the second groove portion 48 is formed on the +Y side (opposite side to the recognition unit 20) from the first groove portion 46. The second groove portion 48 can accommodate the tip of the lead Cl. The lead correction jig 40 can correct the tip of the lead Cl in the moving direction by moving in the XY direction with the tip of the lead Cl hooked in the second groove portion 48.

[0048] The second groove portion 48 corrects the tip position of the lead Cl to the -X side by pressing the bottom surface of the concave portion, that is, the +X side surface, against the tip of the lead Cl to the -X side. The second groove portion 48 corrects the tip position of the lead Cl to the -Y side and the +Y side by pressing the side surfaces of the concave portion, that is, the +Y side surface and the -Y side surface, against the tip of the lead Cl to the -Y side and the +Y side, respectively.

[0049] The configuration of the lead correction jig 40 of the lead correction unit 30A disposed on the -Y side of the recognition unit 20 is substantially the same as the configuration of the lead correction jig 40 of the lead correction unit 30B, except that it is symmetric in the Y-axis direction. However, as shown for FIG. 8 described later, in the lead correction jig 40 of the lead correction unit 30A, the first groove portion 46 is formed on the -X side surface of the correction portion 44, and the second groove portion 48 is formed on the +X side surface of the correction portion 44.

[0050] The jig moving device 50 shown in FIG. 4 moves the lead correction jig 40 relative to the recognition unit 20. The jig moving device 50 of the embodiment is controlled by the control device 109 of the mounting device 100. The jig moving device 50 includes an X-axis moving device 52, a Y-axis moving device 54, and a jig support portion 56.

[0051] The X-axis moving device 52 of the embodiment moves the Y-axis moving device 54 in the X-axis direction with respect to the first support base 12a. The X-axis moving device 52 includes, for example, a linear guide that extends in the X-axis direction and supports the Y-axis moving device 54, a ball screw that extends in the X-axis direction, and a servo motor that rotates the ball screw about its axis. The X-axis moving device 52 moves the Y-axis moving device 54 in the X-axis direction with respect to the first support base 12a as the ball screw rotates.

[0052] The Y-axis moving device 54 of the embodiment moves the jig support portion 56 in the Y-axis direction with respect to the X-axis moving device 52. The Y-axis moving device 54 includes, for example, a linear guide that extends in the Y-axis direction and supports the jig support portion 56, a ball screw that extends in the Y-axis direction, and a servo motor that rotates the ball screw about its axis. The Y-axis moving device 54 moves the jig support portion 56 in the Y-axis direction with respect to the X-axis moving device 52 as the ball screw rotates.

[0053] The jig support part 56 of the embodiment maintains the posture of the lead correction jig 40 and supports it in a cantilever state. The jig support part 56 moves in the XY directions with respect to the first support base 12a by the X-axis moving device 52 and the Y-axis moving device 54. When the jig support part 56 approaches the recognition unit 20, the lead correction jig 40 protrudes above the transmission window 24. When the jig support part 56 moves away from the recognition unit 20, the lead correction jig 40 retracts from above the transmission window 24.

[0054] [Operation of Lead Correction Jig] FIGS. 8 and 9 are diagrams for explaining the operation of the lead correction jig 40 according to the embodiment. In the embodiment, the position of the lead Cl of the lead component C held by the mounting head 104 (see FIG. 1) is corrected. However, in the following figures, the description of the mounting head 104 that holds the lead component C is omitted.

[0055] The lead correction jig 40 corrects the position of the tip of the lead Cl of the lead component C held above the transmission window 24 by the mounting head 104. In the examples shown in FIGS. 8 and 9, the case where two leads Cl are corrected simultaneously by the lead correction jig 40 of the lead correction unit 30A and the lead correction jig 40 of the lead correction unit 30B is shown.

[0056] As shown in FIG. 8, the lead component C is conveyed above the transmission window 24 of the recognition unit 20. The recognition device 26 images a predetermined imaging area F including the lead component C and outputs the image data to the control device 109. The control device 109 acquires the three-dimensional shape of the lead Cl in the imaging area F and recognizes the position of the tip of the lead Cl. In the imaging area F, an origin O (see FIG. 12 described later) is defined at a predetermined position (for example, the center position). The control device 109 calculates the XY coordinates of the tip of the lead Cl with respect to the origin O.

[0057] The control device 109 calculates the deviation direction and deviation amount of the tip of the lead Cl based on the pre-stored array information of the tip of the lead Cl and the recognized position information of the tip of the lead Cl. The lead correction jig 40 corrects the position of the tip of the lead Cl by moving the tip of the lead Cl in the direction opposite to the deviation direction. As shown in FIG. 8, while the lead component C is being recognized by the recognition device 26, the lead correction jig 40 is maintained at a standby position retracted from above the transmission window 24.

[0058] As shown in FIG. 9, in this example, the lead correction jig 40 of the lead correction unit 30A corrects the position of one of the leads Cl in the -Y side column substantially toward the -X side, and the lead correction jig 40 of the lead correction unit 30B corrects the position of one of the leads Cl in the +Y side column substantially toward the -X side.

[0059] In the lead correction jig 40 of the lead correction unit 30A, the lead correction unit 30A is moved so that the tip of the lead Cl to be corrected is accommodated in the first groove portion 46. The first groove portion 46 can correct the tip position of the lead Cl to the -X side by pressing the bottom surface of the concave portion, that is, the +X side surface, against the tip of the lead Cl to the -X side. The first groove portion 46 can correct the tip position of the lead Cl to the -Y side and the +Y side by pressing the side surfaces of the concave portion, that is, the +Y side surface and the -Y side surface, against the tip of the lead Cl to the -Y side and the +Y side, respectively.

[0060] In the lead correction jig 40 of the lead correction unit 30B, the lead correction unit 30A is moved so that the tip of the lead Cl to be corrected is accommodated in the second groove portion 48. The second groove portion 48 can correct the tip position of the lead Cl to the -X side by pressing the bottom surface of the concave portion, that is, the +X side surface, against the tip of the lead Cl to the -X side. The second groove portion 48 can correct the tip position of the lead Cl to the -Y side and the +Y side by pressing the side surfaces of the concave portion, that is, the +Y side surface and the -Y side surface, against the tip of the lead Cl to the -Y side and the +Y side, respectively.

[0061] [Implementation Method] FIG. 10 is a flowchart showing an implementation method according to an embodiment. The processes of the flowchart shown in FIG. 10 are executed by the control device 109 of the implementation device 100 in accordance with a program stored in advance. In the implementation process, the holding position of the lead component C in the component supply device 103, the mounting coordinates of the lead component C on the substrate P, etc. are assumed to be stored in the implementation device 100 in advance by teaching performed before the implementation process shown in FIG. 10.

[0062] The control device 109 controls the head movement device 105 to move the mounting head 104 to the supply area SM of the component supply device 103. The control device 109 controls the nozzle driving unit at a predetermined supply position in the supply area SM to hold the lead component C with the nozzle (step SA1).

[0063] FIG. 11 is a diagram for explaining the recognition operation of the lead Cl according to the embodiment. The control device 109 controls the head movement device 105 to move the lead component C held by the mounting head 104 above the transmission window 24 of the recognition unit 20. The control device 109 moves the lead component C in the -Z axis direction until the tip of the lead Cl of the lead component C reaches a recognition position included in a predetermined imaging area F by the recognition device 26. The control device 109 causes the recognition device 26 to image a predetermined imaging area F including the lead component C held above the transmission window 24 (step SA2). The image data is output to the control device 109.

[0064] The control device 109 acquires the three-dimensional shape of the lead Cl in the imaging area F from the acquired image data and recognizes the position of the tip of the lead Cl (step SA3). The control device 109 calculates the XY coordinates of the tip of the lead Cl with respect to the origin O.

[0065] The control device 109 determines whether the positions of the plurality of leads Cl are within the allowable range (step SA4).

[0066] FIG. 12 is a diagram schematically showing image data of the lead component C according to the embodiment. As shown in FIG. 12, a circle TL indicating the allowable range of the position of the lead Cl is set. The center of the circle TL indicates the target position of the lead Cl and is based on the array information of the tip of the lead Cl stored in advance in the storage area of the control device 109. When the tip of the lead Cl is disposed inside the circle TL, the control device 109 determines that the positions of the plurality of leads Cl are within the allowable range with respect to the target position. In the example shown in FIG. 12, the position of the lead Clx in the X-axis direction is not within the allowable range. Also, the position of the lead Cly in the Y-axis direction is not within the allowable range.

[0067] In step SA4, when it is determined that the position of the lead Cl is within the allowable range (step SA4; Yes), the control device 109 controls the head moving device 105 to move the mounting head 104 to a position where the nozzle faces a predetermined position on the substrate P in the mounting area DM. The control device 109 controls the nozzle driving unit to mount the lead component C held by the nozzle on the substrate P (step SA5).

[0068] FIG. 13 is a diagram schematically showing a state in which the lead Cl of the lead component C according to the embodiment is inserted into the opening PK of the substrate P. As the nozzle holding the body Cb moves downward (-Z side) while moving in the XY plane, the lead Cl is inserted into the opening PK of the substrate P. After the lead Cl is inserted into the opening PK of the substrate P, the holding of the lead component C by the nozzle is released. Thereby, the lead component C is mounted on the substrate P.

[0069] In step SA4, when it is determined that the position of the lead Cl is not within the allowable range (step SA4; No), the control device 109 outputs a correction command so that the lead Cl is corrected by the lead correction jig 40 (step SA6).

[0070] The control device 109 calculates the deviation direction and deviation amount of the tip of the lead Cl based on the pre-stored array information of the tip of the lead Cl and the XY coordinates of the tip of the lead Cl obtained in step SA3 or step SA10. The control device 109 determines the pushing direction (correction direction) and pushing amount (correction amount) by the lead correction jig 40 based on the deviation direction and deviation amount (step SA7).

[0071] The pushing direction is the moving direction of the lead correction jig 40 with the lead Cl hooked on the first groove portion 46 or the second groove portion 48 of the lead correction jig 40. The pushing direction is, for example, the direction opposite to the deviation direction in the XY plane. The pushing amount is the moving amount of the lead correction jig 40 with the lead Cl hooked on the first groove portion 46 or the second groove portion 48 of the lead correction jig 40. The pushing amount is, for example, the same as the deviation amount or the amount obtained by adding the spring-back amount of the lead Cl to the deviation amount. The spring-back amount is calculated based on the material, Young's modulus, shape, thickness, length, etc. of the lead Cl.

[0072] The control device 109 starts the correction process (step SA8). The correction process includes a process of raising the lead component C in the +Z direction until the tip of the lead Cl can be accommodated in the first groove portion 46 or the second groove portion 48, and a process of hooking the tip of the lead Cl on the first groove portion 46 or the second groove portion 48 of the lead correction jig 40 and pushing the lead Cl in the first groove portion 46 or the second groove portion 48. The specific flow of the correction process will be described later.

[0073] After the correction process is completed, the control device 109 controls the head moving device 105 to move the lead component C in the -Z axis direction until the tip of the lead Cl of the lead component C reaches the recognition position included in the predetermined imaging region F by the recognition device 26. The control device 109 causes the recognition device 26 to image a predetermined imaging region F including the lead component C held above the transmission window 24 in order to confirm whether the correction of the lead Cl is correctly performed (step SA9). The image data is output to the control device 109.

[0074] The control device 109 acquires the three-dimensional shape of the lead Cl within the imaging region F from the acquired image data and recognizes the position of the tip of the lead Cl (step SA10). The control device 109 calculates the XY coordinates of the tip of the lead Cl with reference to the origin O.

[0075] The control device 109 determines whether the positions of the plurality of leads Cl are within the allowable range. That is, the control device 109 determines whether the correction of the lead Cl has been correctly performed (step SA11).

[0076] In step SA11, if it is determined that the position of the lead Cl is within the allowable range (step SA11; Yes), the mounting process of the lead component C is performed (step SA5).

[0077] In step SA11, if it is determined that the position of the lead Cl is not within the allowable range (step SA11; No), the control device 109 determines whether to retry the correction process (step SA12).

[0078] In step SA12, if it is determined to retry the correction process (step SA12; Yes), the processes from step SA6 to step SA11 are performed.

[0079] For example, an upper limit on the number of retries of the correction process may be predetermined. Within the range of the number of retries, the processes from step SA6 to step SA11 are repeated until it is determined in step SA11 that the position of the lead Cl is within the allowable range.

[0080] Even if the number of retries exceeds the upper limit and it is not determined in step SA11 that the position of the lead Cl is within the allowable range (step SA11; No), in step SA13, it is determined not to retry the correction process (step SA12: No).

[0081] The lead component C whose position of the lead Cl has not been corrected to the allowable range is discarded in the component storage unit 108 (step SA13).

[0082] [Lead correction method (first example)] FIG. 14 is a flowchart showing a method for correcting the lead Cl according to the embodiment. FIGS. 15 to 20 are diagrams for explaining the operation of the lead correction device 10 according to the embodiment. The processing of the flowchart shown in FIG. 14 is executed by the control device 109 of the mounting device 100 along a program stored in advance in step SA8 shown in FIG. 10.

[0083] As shown in FIG. 15, the control device 109 controls the head movement device 105 to raise the mounting head 104 upward (+Z side) and move the lead component C held by the mounting head 104 to the correction height position (step SB1). The correction height is the height at which the tip of the lead Cl can be accommodated in the first groove portion 46 or the second groove portion 48, that is, the height position where the tip of the lead Cl is accommodated in the first groove portion 46 or the second groove portion 48 within a range where the tip of the lead Cl does not contact the bottom on the -Z side of the first groove portion 46 or the second groove portion 48.

[0084] As shown in FIG. 16, the control device 109 controls the X-axis movement device 52 of the jig movement device 50 to move the lead correction jigs 40 of the lead correction units 30A and 30B in the X-axis direction approaching the lead component C. In the lead correction device 10, at this timing, the identification unit 42 of the lead correction jig 40 may be detected by the recognition device 26, and the position of the lead correction jig 40 may be corrected.

[0085] As shown in FIG. 17, the control device 109 further controls the X-axis movement device 52 and the Y-axis movement device 54 of the jig movement device 50 to move the lead correction jigs 40 of the lead correction units 30A and 30B to a predetermined preparation position (step SB2). The preparation position indicates the position immediately before the correction portion 44 of the lead correction jig 40 enters between the lead Cl to be corrected and the lead Cl adjacent to the deviation direction side in the X-axis direction.

[0086] For example, in the embodiment, the lead Cly shown in FIG. 12 is corrected to the -Y side by the second groove portion 48 of the lead correction jig 40 of the lead correction unit 30A. Therefore, in the preparation position, in the X-axis direction, the second groove portion 48 is on the -X side of the lead Cly, and the correction portion 44 is arranged to be located between the lead Cly and the lead Cl adjacent to the -X side. Further, the correction portion 44 is arranged to be located on the -Y side of the lead Cly and the adjacent lead Cl.

[0087] Also, in the embodiment, the lead Clx shown in FIG. 12 is corrected to the +X side by the first groove portion 46 of the lead correction jig 40 of the lead correction unit 30B. Therefore, in the preparation position, in the X-axis direction, the first groove portion 46 is on the -X side of the lead Clx, and the correction portion 44 is arranged to be located between the lead Clx and the lead Cl adjacent to the -X side. Further, the correction portion 44 is arranged to be located on the +Y side of the lead Clx and the adjacent lead Cl.

[0088] As shown in FIG. 18, the control device 109 further controls the Y-axis moving device 54 of the jig moving device 50 to move the lead correction jigs 40 of the lead correction units 30A and 30B in the Y-axis direction so that the lead Cl to be corrected is located on the side (X-axis direction) of the first groove portion 46 or the second groove portion 48 that performs the correction (step SB3).

[0089] In the embodiment, the lead correction jig 40 of the lead correction unit 30A is moved to the +Y side so that the second groove portion 48 is located on the -X side of the lead Cly, and the lead correction jig 40 of the lead correction unit 30B is moved to the -Y side so that the first groove portion 46 is located on the -X side of the lead Clx.

[0090] As shown in FIG. 19, the control device 109 further controls the X-axis moving device 52 of the jig moving device 50 to move the lead correction jigs 40 of the lead correction units 30A and 30B in the X-axis direction so that the lead Cl to be corrected is accommodated in the first groove portion 46 or the second groove portion 48 that performs the correction (step SB4).

[0091] In the embodiment, the lead correction jig 40 of the lead correction unit 30A is moved to the +X side so that the lead Cly is accommodated in the second groove portion 48, and the lead correction jig 40 of the lead correction unit 30B is moved to the +X side so that the lead Clx is accommodated in the first groove portion 46.

[0092] As shown in FIG. 20, the control device 109 further controls the X-axis moving device 52 and the Y-axis moving device 54 of the jig moving device 50 to move the lead correction jigs 40 of the lead correction units 30A and 30B in the XY directions in the pushing direction and the pushing amount determined in step SA7 of the flowchart shown in FIG. 10 (step SB5). The pushing operation may be executed two or more times. That is, the lead correction jig 40 may be reciprocated by the pushing amount in the pushing direction.

[0093] The control device 109 further controls the X-axis moving device 52 and the Y-axis moving device 54 of the jig moving device 50 to move the lead correction jigs 40 of the lead correction units 30A and 30B to the preparation position (step SB6). That is, the lead Cl to be corrected is released from the first groove portion 46 or the second groove portion 48.

[0094] The control device 109 controls the head moving device 105 to raise the mounting head 104 upward (+Z side) and move the lead component C held by the mounting head 104 to the standby height position (step SB7). The standby height is a height position where the lower end of the lead Cl is above the upper surface of the lead correction jig 40 (+Z side).

[0095] The correction process ends by a series of processes from step SB1 to step SB7, and the process proceeds to step SA9 of the flowchart shown in FIG. 10.

[0096] [Lead correction method (second example)] FIG. 21 is a flowchart showing a method for correcting lead Cl according to an embodiment. FIGS. 22 to 25 are diagrams for explaining the operation of the lead correction device 10 according to the embodiment. The processing of the flowchart shown in FIG. 21 is executed by the control device 109 of the mounting device 100 along a program stored in advance in step SA8 shown in FIG. 10.

[0097] As shown in FIG. 22, the control device 109 controls the head moving device 105 to raise the mounting head 104 upward (+Z side) and move the lead component C held by the mounting head 104 to the standby height position (step SC1). The standby height is a height position where the lower end of the lead Cl is above the upper surface of the lead correction jig 40 (+Z side).

[0098] As shown in FIG. 23, the control device 109 controls the X-axis moving device 52 of the jig moving device 50 to move the lead correction jig 40 of the lead correction unit 30B to the correction position (step SC2). The correction position indicates the position immediately before pushing in the lead Cl when correcting the lead Cl to be corrected.

[0099] As shown in FIG. 24, the control device 109 further controls the head moving device 105 to move the mounting head 104 in the XY direction so that the lead Cl to be corrected of the lead component C held by the mounting head 104 is directly above (+Z side) either the first groove portion 46 or the second groove portion 48, which is the groove portion used for correcting the lead Cl, and moves the lead component C in the XY direction (step SC3).

[0100] As shown in FIG. 25, the control device 109 controls the head moving device 105 to lower the mounting head 104 downward (-Z side) and move the lead component C held by the mounting head 104 to the correction height position (step SC4). The correction height position is a height at which the tip of the lead Cl can be accommodated in the first groove portion 46 or the second groove portion 48, that is, a height position where the tip of the lead Cl is within a range where it does not contact the bottom on the -Z side of the first groove portion 46 or the second groove portion 48 and the tip of the lead Cl is accommodated in the first groove portion 46 or the second groove portion 48.

[0101] Next, the control device 109 controls the X-axis moving device 52 and the Y-axis moving device 54 of the jig moving device 50 to move the lead correction jig 40 of the lead correction unit 30B in the XY directions by the pushing direction and the pushing amount determined in step SA7 of the flowchart shown in FIG. 10 (step SC5). The pushing operation may be executed two or more times. That is, the lead correction jig 40 may be reciprocally moved by the pushing amount in the pushing direction.

[0102] The control device 109 controls the head moving device 105 to raise the mounting head 104 upward (+Z side) and move the lead component C held by the mounting head 104 to the standby height position (step SC6).

[0103] The correction process is completed by the series of processes from step SC1 to step SC6, and the process proceeds to step SA9 of the flowchart shown in FIG. 10.

[0104] [Effect] As described above, the lead correction device 10 of the present embodiment images the lead component C held by the lead component holding mechanism (mounting head 104), recognizes the position of the tip of the lead Cl from the image data, and corrects the position of the tip of the lead Cl with the lead correction jig 40 based on the image data. The lead correction jig 40 has groove portions (first groove portion 46, second groove portion 48) capable of accommodating the tip portion of the lead Cl, and by relatively moving with respect to the lead component C in a state where the lead Cl is hooked in the groove portion, the side surface of the groove portion can push and correct the tip of the lead Cl.

[0105] Since the correction is executed based on the recognition result while the lead component C is held by the lead component holding mechanism, the position of the tip of the lead Cl can be corrected with high precision. In addition, since the lead Cl is only hooked in the groove portion and the lead Cl is pushed in the correction direction by the groove portion, it is possible to handle various lead components C.

[0106] [Other Embodiments] The embodiments of the present application have been described above. However, the present invention is not limited by the contents of these embodiments. The above-described embodiments and modifications can be appropriately combined as long as the processing contents do not conflict. In addition, the above-described components include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within the so-called equivalent range. Furthermore, the above-described components can be appropriately combined. Moreover, various omissions, substitutions, or changes of the components can be made without departing from the gist of the above-described embodiments.

[0107] For example, the correction process of the first example shown in the flowchart of FIG. 14 and the correction process of the second example shown in the flowchart of FIG. 21 may be appropriately combined. For example, after moving the lead component C to the corrected height position in step SC4 shown in FIG. 21, the processes from step SB2 to step SB6 shown in FIG. 14 may be executed using the lead correction jig 40 of the lead correction unit 30A before starting step SC6.

[0108] The lead correction device 10 of the embodiment is mounted on the component state detection unit 106 of the mounting device 100. However, for example, it may be mounted upstream of the component supply device 103, or may be provided separately from the mounting device 100.

[0109] Also, among the processes described in the above embodiments, all or part of the processes described as being automatically performed can be manually performed, or all or part of the processes described as being manually performed can be automatically performed by a known method. In addition, regarding the processing procedures, specific names, information including various data and parameters shown in the above documents and drawings, they can be arbitrarily changed unless otherwise specified. For example, the various information shown in each figure is not limited to the illustrated information.

[0110] In addition, each component of each illustrated device is functionally conceptual and does not necessarily have to be physically configured as shown in the figure. That is, the specific form of the distribution and integration of each device is not limited to that shown in the figure, and all or part of it can be functionally or physically distributed and integrated in any unit according to various loads, usage conditions, etc. Further, the above-described control device 109 may be configured by a plurality of computers divided into several functions, may exist separately via a network, and some functions of the computer may be possessed by a cloud server that executes various functions in the form of cloud computing. Also, the program may be distributed to the control device 109 via a network.

Explanation of Reference Numerals

[0111] 10… Lead correction device, 12… Support member, 12a… First support base, 12b… Column part, 12c… Second support base, 12d… Opening, 14… Cover member, 14a… Opening, 20… Recognition unit, 22… Housing, 24… Transparent window, 26… Recognition device, 26A… Projection device, 26B… Imaging device, 30, 30A, 30B… Lead correction unit, 40… Lead correction jig, 42… Identification part, 44… Correction part, 46… First groove part, 48… Second groove part, 50… Jig moving device, 52… X-axis moving device, 54… Y-axis moving device, 56… Jig support part, 100… Mounting device, 101… Base member, 102… Substrate conveying device, 103… Component supply device, 104… Mounting head, 105… Head moving device, 105X… X-axis drive part, 105Y… Y-axis drive part, 106… Component state detection part, 107… Exchange nozzle holding mechanism, 108… Component storage part, 109… Control device, C… Lead component, Cb… Body, Cl… Lead, DM… Mounting area, F… Imaging area, O… Origin, P… Substrate, PK… Opening, SM… Supply area, TL… Circle.

Claims

1. A lead component holding mechanism for holding and moving a lead component, A recognition device that images the lead component held by the lead component holding mechanism and recognizes the position of the tip of the lead based on the image data, A lead correction jig having a groove portion capable of accommodating the tip portion of the lead of the lead component held above the recognition device, and moving relative to the lead component holding mechanism with the lead hooked in the groove portion to correct the position of the tip of the lead, A jig moving device for moving the lead correction jig relative to the recognition device, Comprising, A lead correction device.

2. The groove portion is, A first groove portion that opens on the upper surface and one side surface in the longitudinal direction and can accommodate the tip portion of the lead, A second groove portion that opens on the upper surface and the other side surface in the longitudinal direction at a position displaced in the longitudinal direction from the first groove portion and can accommodate the tip portion of the lead, Including, The lead correction jig is, By moving relative to the lead component holding mechanism with the lead hooked in either the first groove portion or the second groove portion, the position of the tip of the lead is corrected, The lead correction device according to claim 1.

3. The lead correction jig is, Having an identification portion capable of detecting the position in the horizontal plane by the recognition device, The lead correction device according to claim 1.

4. The correction direction and correction amount of the position of the tip of the lead by the lead correction jig are, Based on the deviation direction and the amount of displacement of the tip of the lead calculated based on the pre-stored array information of the tips of the leads and the position information of the tip of the lead recognized based on the image data, Determined based on, The lead correction device according to claim 1.

5. The lead correction device according to any one of claims 1 to 4, A mounting head that is the lead component holding mechanism and has a nozzle for holding the lead component, A control device that mounts the lead component, whose tip position has been corrected by the lead correction jig, on a substrate based on the image data, Comprising, A mounting device.

Images