Expansion joint

Abstract

To prevent a manufacturing environment from getting worse.SOLUTION: An expansion joint 20 used for a semiconductor manufacturing device is formed in a substantially rectangular cylinder shape having a bellows structure on a wall surface, and is axially expandable. The expansion joint 20 is formed of, for example, drawn polytetrafluoroethylene (ePTFE) etc. The expansion joint 20 is manufactured by sewing sheet type ePTFE by, for example, an industrial sewing machine. The expansion joint 20 formed of ePTFE loses neither cutting resistance nor rub resistance even at temperature, and has extremely high heat resistance and chemical resistance. Outgassing and production of impurities (substance) such as dust during use thereof or due to temporal change are prevented, and the manufacturing environment of semiconductors can be prevented from worsening. Consequently the clean level of the manufacturing environment of semiconductors can be held high to prevent functions of the semiconductor manufacturing device from being blocked.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a telescopic joint, and more particularly to a telescopic joint capable of preventing deterioration of the manufacturing environment.

Background Art

[0002] As a bellows-shaped telescopic joint, a rubber one is generally used (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the rubber telescopic joint as described above, outgassing of impurities such as sulfur dioxide and dust are spontaneously generated from the telescopic joint itself, so there is a problem that the manufacturing environment of semiconductors, which requires a very strict clean level at the component level, deteriorates.

[0005] The present invention has been made to solve the above problems, and an object thereof is to provide a telescopic joint capable of preventing deterioration of the manufacturing environment.

Means for Solving the Problems

[0006] To achieve the above object, the telescopic joint according to the present invention is composed of expanded polytetrafluoroethylene (ePTFE).

[0007] The above telescopic joint may be used in a portion through which a substance of a predetermined device passes.

[0008] The above expansion and contraction joint may be used in a portion through which substances in a semiconductor manufacturing apparatus pass.

[0009] The above expansion and contraction joint may be used as a protective cover that is covered on the expansion and contraction mechanism of a predetermined device to protect the expansion and contraction mechanism.

[0010] The above expansion and contraction joint may be manufactured by sewing a sheet-shaped stretched polytetrafluoroethylene with threads made of polytetrafluoroethylene.

[0011] Preferably, the seam of the thread is caulked with a sheet-shaped stretched polytetrafluoroethylene.

[0012] The above expansion and contraction joint may be configured such that the wall surface has a bellows structure.

Advantages of the Invention

[0013] According to the present invention, it is possible to provide an expansion and contraction joint that can prevent deterioration of the manufacturing environment.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0015] Hereinafter, embodiments for carrying out the present invention will be described.

[0016] First, the configuration of the telescopic joint according to the embodiment of the present invention will be described with reference to the drawings.

[0017] FIG. 1 is a cross-sectional view showing a configuration example of a semiconductor manufacturing apparatus using a telescopic joint according to an embodiment.

[0018] As shown in FIG. 1, the semiconductor manufacturing apparatus 100 includes a reaction chamber 1 that performs various processes such as thin film formation and etching on a semiconductor substrate such as a wafer by a chemical vapor deposition (CVD) method or the like. FIG. 1 also shows a semiconductor manufacturing environment 200.

[0019] In the reaction chamber 1, an upper electrode 2 that supplies reaction gas, etching gas, etc. and also functions as an electrode for plasma processing, and a stage 4 on which a wafer 3 is placed are arranged. The stage 4 is connected to a high-frequency power source 6 via a shaft 5 and also has a function as a lower electrode.

[0020] In addition, an exhaust system 20 for discharging active gases such as the reaction gas and etching gas after processing is provided in the reaction chamber 1. The exhaust system 10 includes pipes 7 and 8 respectively connected to both ends of the telescopic joint 20, and a vacuum pump 9 connected to the telescopic joint 20 via the pipe 8. Here, the active gas refers to a gas that easily undergoes a chemical reaction under ordinary conditions such as normal temperature and pressure (for example, refer to https: / / white-circle7338.com / hukassei-kassei / ). The inert gas, which is the opposite of the active gas, refers to a gas that does not react under ordinary conditions. Examples include helium, neon, argon, krypton, xenon, radon, nitrogen, carbon dioxide, or fluorocarbon (excluding flammable gases) (for example, refer to Article 2, Paragraph 1, Item 3 of the Refrigeration Safety Regulations).

[0021] Fig. 2(a) is a top view showing a configuration example of the telescopic joint according to the embodiment, and Fig. 2(b) is a side view.

[0022] As shown in Fig. 2(b), the telescopic joint 20 used in the semiconductor manufacturing apparatus 100 has a substantially square cylindrical shape with a bellows structure on the wall surface and is formed to be telescopic in the axial direction. As shown in Fig. 2(a), at both ends of the telescopic joint 20, there are plate-shaped parts having a central hole 21, and connection parts (not shown) made of metal are airtightly connected. The telescopic joint 20 is connected to the pipes 7 and 8 through the connection parts.

[0023] In this embodiment, the telescopic joint 20 is made of, for example, expanded polytetrafluoroethylene (ePTFE) manufactured by W. L. Gore & Associates. The telescopic joint 20 is manufactured by sewing a sheet-like ePTFE with a thread made of polytetrafluoroethylene or the like using, for example, an industrial sewing machine. ePTFE has a porous structure, is excellent in mechanical strength and flexibility, and has characteristics such as not losing cut resistance and friction resistance even at high temperatures.

[0024] Thus, since ePTFE has a porous structure and is excellent in mechanical strength and flexibility, the telescopic joint 20 can be easily and inexpensively manufactured by using it and sewing it with a thread made of polytetrafluoroethylene or the like.

[0025] Furthermore, the stitches 22 of the thread and the like are sealed 23 with the sheet-like ePTFE.

[0026] Fig. 3 is an enlarged perspective view for explaining the sealing according to this embodiment.

[0027] As shown in Fig. 3, the stopper 23 is composed of sheet-shaped ePTFE, and double-sided tapes 24 are provided near both longitudinal ends. The stopper 23 is bent near the middle in the longitudinal direction and is attached near the seam 22 by the double-sided tapes 24 so as to cover the entire seam 22 from both sides. Also, the stopper 23 is attached by the double-sided tapes 24 so as to cover the entire joint 25 between the sheet-shaped ePTFE constituting the expansion joint 20 as well.

[0028] Fig. 4 is an enlarged cross-sectional view for explaining the stopper according to the modification.

[0029] As shown in Fig. 4, the stopper 23 may be attached near the seam 22 by the double-sided tape 24 so as to cover the other surface near the seam 22 in a state of being bent so that one surface near the seam 22 is hidden. Also, as in Fig. 3, the stopper 23 may be attached by the double-sided tape 24 so as to cover the entire joint 25 between the sheet-shaped ePTFE constituting the expansion joint 20.

[0030] And the expansion joint 20 composed of ePTFE does not lose its antifriction property even at high temperatures and has very high heat resistance and chemical resistance. Therefore, it does not react with the high-temperature and corrosive reaction gas or active gas such as etching gas discharged from the reaction chamber 1 to generate outgas of impurities. Also, unlike a rubber expansion joint, no outgas of impurities such as sulfur dioxide or substances such as dust will spontaneously occur over time. Furthermore, unlike a rubber expansion joint, no white powder will be generated or stickiness will occur due to various components and oil content contained in additives and compounding agents. For this reason, according to the expansion joint 20 according to the present embodiment, generation of impurities (substances) such as outgas and dust due to its use or deterioration over time can be prevented, and deterioration of the semiconductor manufacturing environment 200 can be prevented. As a result, the cleanliness level of the semiconductor manufacturing environment 200 can be kept high, and it can be prevented that the functions of the semiconductor manufacturing apparatus 100 are inhibited.

[0031] Furthermore, since the expansion joint 20 is made of ePTFE, it is lightweight, and since the wall surface of the bellows structure can be contracted to reduce the size, storage and transportation can be achieved easily and inexpensively.

[0032] Note that the present invention is not limited to the above-described embodiments, and various modifications and applications are possible. Hereinafter, modified forms of the above-described embodiments applicable to the present invention will be described.

[0033] In the above-described embodiment, the expansion joint 20 has been described as being used in the exhaust system 10 of the semiconductor manufacturing apparatus 100. However, the present invention is not limited thereto, and it can be appropriately used in any part of the semiconductor manufacturing apparatus 100 through which a substance passes. Here, the substance is arbitrary as long as it can affect the deterioration of materials such as rubber and deteriorate the semiconductor manufacturing environment 200. The "substance" in the present invention includes, in addition to the above-described active gas, fluids such as water vapor, lime water, hydrochloric acid, sulfuric acid, aqueous sodium hydroxide solution, oil such as petroleum, liquids such as alcohol, particles such as dust and limestone, and electromagnetic waves such as ultraviolet rays.

[0034] Also, in the above-described embodiment, the expansion joint 20 has been described as having a substantially square cylindrical shape with a bellows structure on the wall surface and being formed to be axially expandable and contractible. However, the present invention is not limited thereto. For example, as shown in FIG. 5, the expansion joint 20 may not have a bellows structure on the wall surface, or may have a substantially cylindrical shape, and as long as it is hollow and axially expandable and contractible, its shape can be arbitrarily changed.

[0035] Furthermore, in the above-described embodiment, as an example of a predetermined device, the semiconductor manufacturing apparatus 100 has been described. However, the present invention is not limited to this, and any device in which an expansion joint is used in a portion through which a substance passes is applicable. For example, it may be a machine tool, a robot, an industrial machine, a food device, a plant device, a construction device, a precision device, a measuring device, a medical device, or the like. Even in such a device, by using the expansion joint according to the present invention, it is possible to prevent reaction with the passing substance and self-dust generation, prevent deterioration of the manufacturing environment and the surrounding environment, and prevent inhibition of the device function.

[0036] Also, in the above-described embodiment, the expansion joint 20 has been described as being used in a portion through which a substance of the semiconductor manufacturing apparatus passes. However, the present invention is not limited to this, and the expansion joint 20 may be used as a protective cover that covers a shaft of a predetermined device or an expansion mechanism such as a cylinder or a jack to protect the expansion mechanism. For example, an expansion joint may be used as a protective cover for protecting the expansion mechanism of a transfer robot that transfers a wafer from a load lock chamber to a reaction chamber.

[0037] FIG. 6 is a diagram showing a configuration example of a transfer robot covered with an expansion joint according to a modified example. Note that the same components as those of the semiconductor manufacturing apparatus 100 according to the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

[0038] As shown in FIG. 6, the transfer robot 40 is provided in a transfer chamber 43 positioned so as to be sandwiched between a load lock chamber (not shown) and the reaction chamber 1, and includes a blade 41 on which a wafer 3 is placed and an expandable and contractible expansion mechanism 42 connected to the blade 41.

[0039] The blade 41 is made of, for example, quartz or the like. The blade 41 is formed in a bifurcated shape, and the wafer 3 is placed on the upper surface.

[0040] The telescopic mechanism 42 extends and retracts horizontally via a motor (not shown) to carry the blade 41 on which the wafer 3 is placed into and out of the reaction chamber 1. In this modified example, the telescopic mechanism 42 is covered with a telescopic joint 30 made of expanded polytetrafluoroethylene and used as a protective cover to protect the telescopic mechanism 42. The telescopic joint 30 may have a bellows structure on the wall surface as shown in FIG. 2, but in this modified example, it has no bellows structure on the wall surface as shown in FIG. 5. Thus, by covering the telescopic mechanism 42 with the telescopic joint 30 made of expanded polytetrafluoroethylene, it is possible to prevent dust from falling on the telescopic mechanism, foreign substances from adhering, and other substances from being bitten or contacted, thereby preventing deterioration of the manufacturing environment 200 and the surrounding environment and preventing the function of the telescopic mechanism 42 from being inhibited.

Industrial Applicability

[0041] As described above, the telescopic joint made of ePTFE can maintain an extremely high cleanliness level so as to be used in semiconductor manufacturing equipment, in addition to excellent heat and chemical resistance, weather resistance, abrasion resistance, and insulation. Therefore, it can also be applied to other devices and environments where telescopic joints could not be incorporated before.

Explanation of Reference Numerals

[0042] 1 Reaction chamber 2 Upper electrode 3 Wafer 4 Stage 5 Shaft 6 High-frequency power supply 7, 8 Pipes 9 Vacuum pump 10 Exhaust system 20, 30 Telescopic joints 21 Central hole 22 Seam 23 Plug 24 Double-sided tape 25 Joint 40 Transfer robot 41 Blades 42 Telescopic mechanism 43 Conveyor chamber 100 Semiconductor manufacturing equipment 200 Manufacturing environment

Claims

1. An expansion joint composed of expanded polytetrafluoroethylene (ePTFE).

2. Used in the part where substances of a predetermined device pass through, The expansion joint according to Claim 1, characterized in that.

3. Used in the part where substances of a semiconductor manufacturing apparatus pass through, The expansion joint according to Claim 2, characterized in that.

4. Covered on the expansion mechanism of a predetermined device and used as a protective cover for protecting the expansion mechanism, The expansion joint according to Claim 1, characterized in that.

5. Manufactured by sewing a sheet-shaped expanded polytetrafluoroethylene with a thread made of polytetrafluoroethylene, The expansion joint according to Claim 1, characterized in that.

6. The seams of the thread are sealed with a sheet-shaped expanded polytetrafluoroethylene, The expansion joint according to Claim 5, characterized in that.

7. The wall surface is formed in a bellows structure, The expansion joint according to Claim 1, characterized in that.

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