Semiconductor device

Abstract

To provide a semiconductor device that is excellent in portability and at-a-glance display readability.SOLUTION: A semiconductor device has a display panel having flexibility, a first housing supporting a first area of the display panel, a second housing supporting a second area of the display panel, and a substrate adhered to the first housing and having flexibility. The display panel is deformable to a developed state where the first area and the second area are located on substantially the same plane and a folded state where the first area and the second area are located in an overlapping manner. The second housing has a groove part in which part of the substrate having flexibility can slide. In the developed state, part of the substrate having flexibility is inserted into the groove part. In deformation operations to the folded state, at least part of the substrate having flexibility inserted into the groove part is drawn out.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an article, a method, or a manufacturing apparatus. Alternatively, the present invention relates to a process, a machine, a manu facture, or a composition of matter. In particular, one aspect of the present invention relates to a semiconductor device, a display device, a light-emitting device, a lighting device, a driving method thereof, or a manufacturing method thereof. In particular, one aspect of the present invention relates to an electronic device having a display device, an information processing device, a communication information device, or a manufacturing method thereof.

Background Art

[0002] Portable information processing devices such as smartphones, tablets, and phablets have been actively developed. For example, an electronic device using a flexible display panel is known (Patent Document 1). Also, a multi-panel electronic device is known (Patent Document 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] The display area of a semiconductor device can be increased in size to increase the amount of information to be displayed and improve the overviewability of the display. On the other hand, in applications such as portable devices, increasing the display area reduces the portability (also referred to as mobility). That is, it is difficult to achieve both an improvement in the overviewability of the display and high portability. ​

[0005] One aspect of the present invention aims to provide a semiconductor device or the like with excellent portability. Or to provide a semiconductor device or the like with excellent display listability. Or to provide a semiconductor device or the like with high reliability. Or one of the problems is to provide a semiconductor device or the like with excellent portability and display listability. Or to provide a novel semiconductor device or the like as one of the problems.

[0006] Note that these problems do not prevent the existence of other problems. One aspect of the present invention does not need to solve all of these problems. Also, problems other than the above will become apparent from the description in the specification and the like, and it is possible to extract problems other than the above from the description in the specification and the like.

Means for Solving the Problems

[0007] One aspect of the present invention includes a flexible display panel, a first housing that supports a first region of the display panel, a second housing that supports a second region of the display panel, and a flexible substrate fixed to the first housing. The display panel can be deformed between a deployed state in which the first region and the second region are located in substantially the same plane and a folded state in which the first region and the second region overlap. The second housing has a groove portion in which a part of the flexible substrate can slide. In the deployed state, a part of the flexible substrate is inserted into the groove portion, and in the deformation operation to the folded state, at least a part of the flexible substrate inserted into the groove portion is pulled out.

[0008] In the above semiconductor device, in the folded state, the flexible substrate has a curved surface. It may be bent as described above.

[0009] In addition, one aspect of the present invention includes a flexible display panel, a first housing that supports a first region of the display panel, a second housing that supports a second region of the display panel, a first flexible substrate fixed to the first housing, and a second flexible substrate fixed to the first housing. The display panel can be deformed between a deployed state in which the first region and the second region are located in substantially the same plane and a folded state in which the first region and the second region overlap. The first flexible substrate is provided on the display surface side of the display panel, and the second flexible substrate is provided on the side opposite to the display surface of the display panel. The second housing has a first groove portion in which a part of the first flexible substrate can slide, and a second groove portion in which a part of the second flexible substrate can slide. In the deployed state, a part of the first flexible substrate is inserted into the first groove portion, and a part of the second flexible substrate is inserted into the second groove portion. In the operation of deforming into the folded state, at least a part of the first flexible substrate inserted into the first groove portion is pulled out, and at least a part of the second flexible substrate inserted into the second groove portion is pulled out. This is a semiconductor device. In the deployed state, a part of the first flexible substrate is inserted into the first groove portion, and a part of the second flexible substrate is inserted into the second groove portion. In the operation of deforming into the folded state, at least a part of the first flexible substrate inserted into the first groove portion is pulled out, and at least a part of the second flexible substrate inserted into the second groove portion is pulled out. This is a semiconductor device. and at least a part of the second flexible substrate inserted into the second groove portion is pulled out. This is a semiconductor device. This is a semiconductor device.

[0010] In addition, one aspect of the present invention includes a flexible display panel, a first housing that supports a first region of the display panel, a second housing that supports a second region of the display panel, a first flexible substrate fixed to the first housing, and a second flexible substrate fixed to the second housing. The display panel can be deformed between a deployed state in which the first region and the second region are located in substantially the same plane and a folded state in which the first region and the second region overlap. , it can be deformed into a folded state in which the first region and the second region overlap, and the first flexible substrate is provided on the display surface side of the display panel, and the second flexible substrate is provided on the side opposite to the display surface of the display panel. The first housing has a first groove portion in which a part of the second flexible substrate can slide. The second housing has a second groove portion in which a part of the first flexible substrate can slide. In the unfolded state, a part of the first flexible substrate is inserted into the second groove portion, and a part of the second flexible substrate is inserted into the first groove portion. In the deformation operation to the folded state, at least a part of the first flexible substrate inserted into the second groove portion is pulled out, and at least a part of the second flexible substrate inserted into the first groove portion is pulled out. This is a semiconductor device.

[0011] In the above semiconductor device, in the folded state, the first flexible substrate and the second flexible substrate may be bent so as to have a curved surface, respectively.

[0012]

Advantages of the Invention

[0013] . Or, according to one aspect of the present invention, a novel semiconductor device can be provided. It should be noted that the description of these effects does not prevent the existence of other effects. It should be noted that one​​​​ The aspect does not necessarily have to have all of these effects. In addition, effects other than these will become obvious on their own from the descriptions in the specification, drawings, claims, etc., and it is possible to extract effects other than these from the descriptions in the specification, drawings , claims, etc.

Brief Description of the Drawings

[0014]

Figure 1

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Mode for Carrying Out the Invention

[0015] Hereinafter, embodiments of an aspect of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art can easily understand that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore , the present invention is not construed as being limited to the description of the embodiments shown below. Also, in the embodiments described below, the same reference numerals or the same hatch patterns are commonly used among different drawings for the same part or parts having the same function, and the repeated description thereof is omitted.

[0016] In each of the drawings described in this specification, the size, film thickness, or region of each component may be exaggerated for clarity . Therefore, it is not necessarily limited to that scale.

[0017] Also, ordinal numbers such as first, second, etc. used in this specification are attached to avoid confusion of components and are not numerically limiting. Therefore, for example, "the first" can be appropriately replaced with "the second" or "the third" etc. for explanation.

[0018] Also, in this specification, etc., terms such as "upper" and "lower" do not limit the positional relationship of components to be "directly above" or "directly below". For example, in the expression "the second layer on the first layer", those including other components between the first layer and the second layer are not excluded. The same applies to "lower" .

[0019] (Embodiment 1) In this embodiment, a semiconductor device of one embodiment of the present invention will be described with reference to FIGS. A semiconductor device according to one embodiment of the present invention includes a flexible display panel supported by a plurality of housings. In addition, the display panel has a structure in which the areas supported by the different housings are positioned on substantially the same plane. In the unfolded state, the areas supported by different housings overlap each other. In the following, a flexible display panel supported by two housings is The display panel is curved between the two housings, and when the display panel is in an unfolded state (unfolded state), Take as an example a semiconductor device that can be transformed into a folded state (folded state) and a folded state (folded state). I will explain it below.

[0020] 1A, 1B, and 1C are perspective views of a semiconductor device 100 according to one embodiment of the present invention. The semiconductor device 100 includes a flexible display panel 102 and a region of the display panel 102. A housing 104 supports a region 110 of the display panel 102, and a housing 106 supports a region 112 of the display panel 102. A pair of flexible substrates 108a and 108b are provided between the housing 104 and the housing 106. One end of each of the pair of flexible base members 108a and 108b is connected to a housing. It is fixedly attached to the body 104 .

[0021] FIG. 1A shows a region 110 supported by a housing 104 and a region 112 supported by the housing 104 in a display panel 102. 1 shows a deployed state in which the area 112 supported by the support 06 is positioned substantially on the same plane. In the semiconductor device 100, a groove is provided on the surface of the housing 106 facing the housing 104. The other ends of the pair of flexible base members 108a and 108b are fixed to the housing 104. is disposed in a groove in the housing 106.

[0022] Figure 1(B) illustrates the folded state in which the regions 110 and 112 of the display panel 102 overlap. In the folded state, the display panel 102 supported by the housing 104 and the housing 106 is bent so as to have a curved surface in the region between the housing 104 and the housing 106. In the semiconductor device 100 of the present embodiment, the groove portion provided in one of the adjacent housings functions as a slide base, and the flexible base materials 108a and 108b provided between the adjacent housings slide (slide) in the groove portion. Therefore, in the folded state shown in FIG. 1(B), at least a part of the flexible base materials 108a and 108b disposed in the groove portion of the housing 106 in the unfolded state is pulled out and bent so as to have a curved surface similar to the display panel 102. The semiconductor device 100 has excellent portability in the folded state and can be a semiconductor device with excellent display integrity due to a seamless and wide display area in the unfolded state. In the folded state, the display panel 102 supported by the housing 104 and the housing 106 is bent so as to have a curved surface in the region between the housing 104 and the housing 106. In the folded state, the display panel 102 supported by the housing 104 and the housing 106 is bent so as to have a curved surface in the region between the housing 104 and the housing 106. In the semiconductor device 100 of the present embodiment, the groove portion provided in one of the adjacent housings functions as a slide base, and the flexible base materials 108a and 108b provided between the adjacent housings slide (slide) in the groove portion. In the semiconductor device 100 of the present embodiment, the groove portion provided in one of the adjacent housings functions as a slide base, and the flexible base materials 108a and 108b provided between the adjacent housings slide (slide) in the groove portion. Therefore, in the folded state shown in FIG. 1(B), at least a part of the flexible base materials 108a and 108b disposed in the groove portion of the housing 106 in the unfolded state is pulled out and bent so as to have a curved surface similar to the display panel 102. Therefore, in the folded state shown in FIG. 1(B), at least a part of the flexible base materials 108a and 108b disposed in the groove portion of the housing 106 in the unfolded state is pulled out and bent so as to have a curved surface similar to the display panel 102. In the folded state, the display panel 102 supported by the housing 104 and the housing 106 is bent so as to have a curved surface in the region between the housing 104 and the housing 106. In the folded state, the display panel 102 supported by the housing 104 and the housing 106 is bent so as to have a curved surface in the region between the housing 104 and the housing 106. The semiconductor device 100 has excellent portability in the folded state and can be a semiconductor device with excellent display integrity due to a seamless and wide display area in the unfolded state. The semiconductor device 100 has excellent portability in the folded state and can be a semiconductor device with excellent display integrity due to a seamless and wide display area in the unfolded state.

[0023] Figure 1(C) is a development view for showing each configuration of the semiconductor device 100.

[0024] FIG. 2(A) shows a cross-sectional view of the semiconductor device 100 at A1 - B1 in FIG. 1(A). Further, FIG. 2(B) shows a cross-sectional view of the semiconductor device 100 at A2 - B2 in FIG. 1(B). FIG. 2(A) shows a cross-sectional view of the semiconductor device 100 at A1 - B1 in FIG. 1(A). Further, FIG. 2(B) shows a cross-sectional view of the semiconductor device 100 at A2 - B2 in FIG. 1(B).

[0025] As shown in FIG. 2(A), in the unfolded state, the region 160 of the flexible base material 108a fixed to the housing 104 by the adhesive layer 111 is inserted into the groove portion 105 of the housing 106. As shown in FIG. 2(A), in the unfolded state, the region 160 of the flexible base material 108a fixed to the housing 104 by the adhesive layer 111 is inserted into the groove portion 105 of the housing 106. As shown in FIG. 2(A), in the unfolded state, the region 160 of the flexible base material 108a fixed to the housing 104 by the adhesive layer 111 is inserted into the groove portion 105 of the housing 106. It can be appropriately set according to the radius of curvature of the loop 102. In FIGS. 2(A), (B), the flexible base material 108a is provided inside the housing 104 so as to face the display surface of the display panel 102 or the surface on the side opposite to the display surface (also referred to as the back surface). However, the embodiment of the present invention is not limited to this. For example, the flexible base material 108a may be provided outside the housing 104.

[0026] Also, as shown in FIG. 2(B), in the folded state, the housing 104 and the housing 1 06 are arranged to overlap so that one surface of the housing 104 and one surface of the housing 1 06 are in contact. The length of the region 170 of the flexible base material 108a arranged in the groove portion 105 of the housing 106 in the folded state is shorter than the length of the region 160 of the flexible base material 108a arranged in the groove portion 105 of the housing 106 in the unfolded state. In other words, in the operation of deforming the semiconductor device 100 from the unfolded state to the folded state, a part of the flexible base material 108a inserted into the groove portion 105 is pulled out from the groove portion 105. Further, in the folded state (B), the display panel 102 has a region that does not overlap with the housing 104 and the housing 106 (a region protruding from the housing 104 and the housing 106 in the cross-sectional view), and has a curved surface in this region . Similarly, in the folded state, the flexible base material 108a has a region that does not overlap with the housing 104 and the housing 106 (a region protruding from the housing 104 and the housing 106 in the cross-sectional view), and has a curved surface in this region . The curved surface of the flexible base material 108a is located outside the curved surface of the display panel 102. That is, in the folded state (B), the curved surface of the flexible base material 108a has the curved surface of the display panel 102 in between and the housing 106 (a region protruding from the housing 104 and the housing 106 in the cross-sectional view), and has a curved surface in this region. The curved surface of the flexible base material 108a is located outside the curved surface of the display panel 102. That is, in the folded state (B), the curved surface of the flexible base material 108a has the curved surface of the display panel 102 in between and the housing 106 (a region protruding from the housing 104 and the housing 106 in the cross-sectional view), and has a curved surface in this region. The curved surface of the flexible base material 108a is located outside the curved surface of the display panel 102. That is, in the folded state it has, and the curved surface of the flexible base material 108a is located outside the curved surface of the display panel 102. That is, in the folded state, the curved surface of the flexible base material 108a has the curved surface of the display panel 102 in between​​ faces the sides of the housing 104 and the housing 106 via

[0027] During the deformation between the unfolded state and the folded state and / or in the folded state, on the outer side of the curved surface of the display panel 10 2, a flexible base material 108a is arranged with a curved surface, so that the load such as stress on the curved region of the display panel 102 is reduced, and damage to the region can be suppressed from occurring.

[0028] Note that the display panel 102 is preferably provided by being fixed to at least one of the housing 104 and the housing 106. In FIG. 2, the case where the display panel 102 is fixed to the housing 104 and not fixed to the housing 106 is shown as an example. In such a configuration, during the bending operation of the semiconductor device 100, the display panel 102 can slide inside the housing 106, so that the load on the curved surface of the display panel 102 can be further reduced. For the configuration of the flexible base material 108a, it is not limited to FIG. 1 or FIGS. 2(A), (B). For example, as shown in FIG. 2(C), a configuration having an anchor portion 107 at the end of the flexible base material 108a may be used. By providing the anchor portion 107 at the end of the flexible base material 108a, during the deformation from the unfolded state to the folded state (or the deformation from the folded state to the unfolded state), it is possible to suppress all regions of the flexible base material 108a from being pulled out from the groove portion 105 of the housing 106. Note that, as shown in FIG. 2(C), when the flexible base material 108a has the anchor portion 107, the groove portion 105 has at least two types .

[0029] The configuration of the flexible base material 108a is not limited to FIG. 1 or FIGS. 2(A), (B). For example, as shown in FIG. 2(C), a configuration having an anchor portion 107 at the end of the flexible base material 108a may be used. By providing the anchor portion 107 at the end of the flexible base material 108a, during the deformation from the unfolded state to the folded state (or the deformation from the folded state to the unfolded state), it is possible to suppress all regions of the flexible base material 108a from being pulled out from the groove portion 105 of the housing 106. Note that, as shown in FIG. 2(C), when the flexible base material 108a has the anchor portion 107, the groove portion 105 has at least two types By providing the anchor portion 107 at the end of the flexible base material 108a, during the deformation from the unfolded state to the folded state (or the deformation from the folded state to the unfolded state), it is possible to suppress all regions of the flexible base material 108a from being pulled out from the groove portion 105 of the housing 106. Note that, as shown in FIG. 2(C), when the flexible base material 108a has the anchor portion 107, the groove portion 105 has at least two types From the groove portion 105 of the housing 106. Note that, as shown in FIG. 2(C), when the flexible base material 108a has the anchor portion 107, the groove portion 105 has at least two types When the flexible base material 108a has the anchor portion 107, the groove portion 105 has at least two types It has a height of a class. Specifically, the flexible base material 108a is pulled out of the housing 106 The height of the groove portion 105 in the region where it is drawn out is higher than the height of the region other than the anchor portion 10 7 in the flexible base material 108a and lower than the height of the anchor portion 107. Also, the The height of the groove portion 105 in the region where the anchor portion 107 is located is higher than the height of the anchor portion 107 That is, as the flexible base material 108a moves away from the region where it is pulled out from the housing 106 The height of the groove portion 105 may be configured to increase step by step. Note that the shape of the anchor portion 107 is not limited to the configuration of FIG. 2(C). Also, the anchor portion 107 does not necessarily have to be flexible.

[0030] In the folded display panel 102, the region hidden by folding may be set as a non-display region. For example, in the display panel 102, the region 110 supported by the housing 104 is set as the display region, and the region 112 supported by the housing 106 is set as the non-display region so that the power consumption of the region (here, the region 112) not visible to the user can be reduced . When the region 112 is set as the non-display region, the region where the display panel 102 curves ( the region having a curved surface) may be set as the display region or the non-display region. When it is set as the display region, the region and the region 110 may be operated separately or may be a continuous display region .

[0031] Details of each component in the semiconductor device 100 will be described below.

[0032] The housing 104 and the housing 106 only need to be able to support the display panel 102, and the display panel It is sufficient that the display device 102 is provided on at least one of the display surface side and the back surface side of the panel 102. 2A and 2B, the outer periphery of the display surface side of the display panel 102 ( The display panel 102 is supported by a rear side and a rear surface of the housing. In this way, by using a housing that supports both sides of the display panel 102, This increases the mechanical strength and prevents the semiconductor device 100 from being damaged.

[0033] Each housing may have rigidity. In addition, each housing may have a structure that allows the housing itself to withstand a twisting or bending force. Each housing may be made of a flexible material that is at least more flexible than the display panel 102. It is sufficient to use a material with low elasticity, and an elastic body such as hard rubber may be used for the skeleton. In addition, materials that can be used to construct each housing include plastic, metals such as aluminum, steel, Stainless steel, alloys such as titanium alloys, rubbers such as silicone rubber, etc. can be used.

[0034] In the housing 104 and the housing 106, the area located on the display surface side corresponds to the front surface of the display panel 102. If the display area does not overlap with the display surface, the housings may be made of a material that does not transmit light. If the area located at the position overlaps with at least a part of the display area of ​​the display panel 102, the display It is preferable that each housing is made of a material that transmits light from the display panel 102. A material that does not transmit light may be used in the region located on the opposite side.

[0035] The housing 104 and / or the housing 106 house circuits, electronic components, batteries, etc. In addition, it is possible to prevent the housing 104 and / or the housing 106 from being subjected to shocks, drops, etc. In order to provide a function of protecting the display panel 102 or the circuits and electronic components housed therein from Each housing may be formed of a material such as metal, resin, rubber, or a combination thereof. It may be like this.

[0036] In FIG. 2, an example is illustrated in which the housing 104 and the housing 106 are configured to have a space for holding the display panel 102. However, the embodiments of the present invention are not limited to this, and the housing 104 and / or the housing 106 may have a configuration separated in a direction perpendicular to or parallel to the display surface of the display panel 102. When the housing 104 and / or the housing 106 have a configuration separated in a direction perpendicular to or parallel to the display surface of the display panel 102, each of these members may be fixed to each housing and the display panel 102 by fixing means such as an adhesive or a screw. Although not shown, circuits and electronic components such as a control unit, a power supply unit, a storage battery, or an antenna may be stored in the space of the housing 104 and / or the housing 106. The connection between these circuits and electronic components and the display panel 102 may use an FPC (Flexible Printed Circuit Board). When fixing the housing 104 and / or the housing 106 to the display panel 102, it may be directly fixed with an adhesive or the like, or a flexible substrate may be provided between the display panel 102 and the housing. The flexible substrate may have, for example, a function as a protective member for the display panel 102 or a function for routing wiring. In addition, screws passing through any two or more of the housing and the display panel 10 2, pins, clips, etc. for sandwiching them may be used to fix each configuration. When fixing one of the housings to the display panel 102, the F connected to the display panel 102

[0037] When fixing the housing 104 and / or the housing 106 to the display panel 102, it may be directly fixed with an adhesive or the like, or a flexible substrate may be provided between the display panel 102 and the housing. The flexible substrate may have, for example, a function as a protective member for the display panel 102 or a function for routing wiring. In addition, screws passing through any two or more of the housing and the display panel 10 2, pins, clips, etc. for sandwiching them may be used to fix each configuration. When fixing the housing 104 and / or the housing 106 to the display panel 102, it may be directly fixed with an adhesive or the like, or a flexible substrate may be provided between the display panel 102 and the housing. The flexible substrate may have, for example, a function as a protective member for the display panel 102 or a function for routing wiring. In addition, screws passing through any two or more of the housing and the display panel 10 2, pins, clips, etc. for sandwiching them may be used to fix each configuration.

[0038] When fixing one of the housings to the display panel 102, the F connected to the display panel 102​ The PC is preferably provided in a region where one of the housing and the display panel 102 are fixed together. An example of a semiconductor device having such a configuration is shown in FIGS. 16(A) and 16(B). In FIGS. 16(A) and 16(B), the case where the display panel 102 is fixed to the housing 104 by the adhesive layer 111a is illustrated. Further, the FPC 132 is provided in a region overlapping with the adhesive layer 111a via the display panel 102. With such a configuration, when deforming from the unfolded state (FIG. 16(A)) to the folded state (FIG. 16(B)), or from the folded state to the unfolded state, the position of the connection part between the FPC 132 and the display panel 102 does not move in the display panel 102. Therefore, it is possible to suppress the occurrence of defects such as peeling of the connection part. However, the connection between the display panel 102 and the FPC 132 is not limited to the configuration of FIG. 16. (FIG. 16(A)) to the folded state (FIG. 16(B)), or from the folded state to the unfolded state, the position of the connection part between the FPC 132 and the display panel 102 does not move in the display panel 102. Therefore, it is possible to suppress the occurrence of defects such as peeling of the connection part. However, the connection between the display panel 102 and the FPC 132 is not limited to the configuration of FIG. 16. Therefore, it is possible to suppress the occurrence of defects such as peeling of the connection part. However, the connection between the display panel 102 and the FPC 132 is not limited to the configuration of FIG. 16. However, the connection between the display panel 102 and the FPC 132 is not limited to the configuration of FIG. 16.

[0039] Also, the thicknesses of the plurality of housings may be the same, or the thicknesses of the respective housings may be different. When the thicknesses of two or more housings, preferably all the housings, are the same, it is preferable because it is easy to maintain the horizontality of the display surface in the unfolded state of the semiconductor device 100. Also, when the thicknesses of two or more housings, preferably all the housings, are the same, it is preferable because it is easy to maintain the horizontality of the display surface in the unfolded state of the semiconductor device 100. Further, by disposing the display panel 102 substantially at the center in the thickness direction of the semiconductor device 100, when the display panel 102 is curved so as to bend the semiconductor device 100, the stress applied to the display panel 102 can be minimized. Further, by disposing the display panel 102 substantially at the center in the thickness direction of the semiconductor device 100, when the display panel 102 is curved so as to bend the semiconductor device 100, the stress applied to the display panel 102 can be minimized. Further, by disposing the display panel 102 substantially at the center in the thickness direction of the semiconductor device 100, when the display panel 102 is curved so as to bend the semiconductor device 100, the stress applied to the display panel 102 can be minimized. Further, by disposing the display panel 102 substantially at the center in the thickness direction of the semiconductor device 100, when the display panel 102 is curved so as to bend the semiconductor device 100, the stress applied to the display panel 102 can be minimized.

[0040] Note that, in FIG. 2, an example is shown in which a part of the thickness of the housing 106 is thicker than the thickness of the housing 104 by the thickness of the groove portion 105 for sliding the flexible base material 108a. However, the embodiment of the present invention is not limited to this. Also, among the plurality of housings, one of them has the above various electronic components. Note that, in FIG. 2, an example is shown in which a part of the thickness of the housing 106 is thicker than the thickness of the housing 104 by the thickness of the groove portion 105 for sliding the flexible base material 108a. However, the embodiment of the present invention is not limited to this. Also, among the plurality of housings, one of them has the above various electronic components. Note that, in FIG. 2, an example is shown in which a part of the thickness of the housing 106 is thicker than the thickness of the housing 104 by the thickness of the groove portion 105 for sliding the flexible base material 108a. However, the embodiment of the present invention is not limited to this. Also, among the plurality of housings, one of them has the above various electronic components. Integrate all or most of them and use the housing as a relatively thick main body, reducing the thickness of other housings, and using the housing with reduced thickness simply as a member for supporting the display panel 102 It can also be used. For the display panel 102, a flexible panel having at least a display area can be used.

[0041] The display elements included in the display panel 102 can be appropriately selected from light-emitting elements, liquid crystal elements, electrophoretic elements, etc. It can be used as appropriate.

[0042] In addition, it is more preferable to provide a protective layer in the region that supports the outer peripheral portion (the region on the display surface side and outside the display region) and the back surface side of the display panel 102. By providing the protective layer in this region, the mechanical strength at the curved portion can be further enhanced. When providing the protective layer, it is sufficient to provide the protective layer in the region between the two housings that is at least the curved region. In that case, for example, the protective layer can also be selectively provided in the region where the flexible base materials 108a and 108b and the display panel 102 overlap in the unfolded state. When using a member having translucency as the protective layer, the translucent protective layer can also be provided in the region overlapping the display region of the display panel 102. When using a member having light-shielding properties as the protective layer, for example, the protective layer can be provided in the region covering the wirings and drive circuits located at the ends of the display panel 102. In that case, these wirings and drive circuits can be physically protected, and by shielding these wirings and drive circuits, deterioration of these wirings and drive circuits can be prevented. Furthermore, it is possible to prevent the wirings, drive circuits, etc. from being visually recognized and damaging the aesthetic appearance of the semiconductor device itself.

[0043] ​​​​​​​​​​​​​As the protective layer, for example, plastic, rubber, metal, alloy, etc. can be used. Protection When using plastic, rubber, titanium alloy, etc. as the protective layer or the housing, it is preferable because it is lightweight and difficult to break.

[0044] Also, it is preferable to use a material with high toughness for the protective layer and the housing. Thereby, a semiconductor device excellent in impact resistance and difficult to break can be realized. For example, by using an organic resin, a thin metal material, or an alloy material, a lightweight and difficult-to-break semiconductor device can be realized. Note that for the same reason, it is also preferable to use a material with high toughness for the substrate constituting the display panel 102. For the flexible substrates 108a and 108b, in the folded state, a material that can be bent to have a curvature radius of 1 mm or more and 100 mm or less can be applied. Specifically, for example, plastic, rubber, metal, alloy, etc. can be used. When the flexible substrates 108a and 108b are provided so as to overlap the display area, at least a material having translucency with respect to the light from the display panel 102 needs to be applied to the flexible substrates 108a and 108

[0045] b. However, when the flexible substrates 108a and 108b are provided on the back side of the display surface or on the outer periphery of the display area, etc., so that the flexible substrates 108a and 108b do not overlap with the display area, the translucency of the flexible substrates 108a and 108b is not a concern. Note that when using a translucent material for the flexible substrate, or when providing the flexible substrate on the back side of the display panel 102, the flexible substrate does not necessarily have to be separated into a pair, and it may be a continuous member.

[0046] ​​​​​​​​​ For ease of bending of the semiconductor device, it is preferable that the display panel 102 has high flexibility. On the other hand, if the flexibility of the display panel 102 is increased too much, the stress dispersion by the support substrate used for the display panel 102 becomes insufficient during the bending operation of the display panel 102. In such a case, there is a risk that the reliability of the semiconductor device may decrease due to cracks occurring in the curved region of the display panel 102. However, in the semiconductor device according to one aspect of the present invention, by providing a flexible base material outside the display panel 102, it becomes possible to disperse the stress applied to the curved region of the display panel 102 during the bending operation by the base material. Therefore, even when the display panel 102 has high flexibility, it is possible to suppress a decrease in the reliability of the display panel 102. Here, the flexible base materials 108a and 108b preferably have lower flexibility than the display panel 102. By providing a flexible base material outside the display panel 102 and having lower flexibility than the display panel 102, it is possible to produce a highly reliable semiconductor device with improved strength against bending while maintaining the ease of bending of the semiconductor device. Here, the flexible base materials 108a and 108b may have a sensor for determining whether the display panel 102 is curved or not. For example, the sensor can be configured using a switch, a MEMS pressure sensor, or a pressure-sensitive sensor. Alternatively, a metal material can be used for the flexible base materials 108a and 108b, and a sensor for detecting the metal material can be provided on the display panel 102 to determine the unfolded state or the folded state of the semiconductor device.

[0047]

[0048] ​​​​​​​​​​For the adhesive layer 111 that fixes the housing 104 and the flexible base materials 108a and 108b, various adhesives can be used. For example, curing resins that cure at room temperature, such as two-component mixed resins, resins such as photocurable resins and thermosetting resins can be used. Also, sheet-like adhesives may be used. Note that for fixing the housing 104 and the flexible base materials 108a and 108 b, it is not necessarily required to provide an adhesive layer. For example, screws that penetrate the flexible base materials 108 a and 108b, pins, clips, etc. that sandwich them may be used. Or, in the process of processing the housing, the flexible base material may be fixed so as to be sandwiched between the housing. Or, in the process of processing the housing, the flexible base material may be fixed so as to be sandwiched between the housing. That is also good.

[0049] The semiconductor device 100 of the present embodiment can be deformed into an unfolded state or a folded state while reducing the load such as stress on the region (the region having a curved surface) that curves in the display panel 102. Therefore, the durability in the region where the display panel 102 bends can be improved, and a highly reliable semiconductor device can be obtained. Also, in the bending operation of the semiconductor device 1 00, by the auxiliary function of the flexible base materials 108a and 108b, even when a highly tough member is provided as the display panel 102, the bending operation can be performed with good operability. Therefore, for example, it becomes possible to apply the display panel 102 provided with a film for protecting the display area, etc. to the semiconductor device 100, so that the reliability of the semiconductor device can be further improved. 00, by the auxiliary function of the flexible base materials 108a and 108b, even when a highly tough member is provided as the display panel 102, the bending operation can be performed with good operability. Therefore, for example, it becomes possible to apply the display panel 102 provided with a film for protecting the display area, etc. to the semiconductor device 100, so that the reliability of the semiconductor device can be further improved. Therefore, for example, it becomes possible to apply the display panel 102 provided with a film for protecting the display area, etc. to the semiconductor device 100, so that the reliability of the semiconductor device can be further improved. Therefore, for example, it becomes possible to apply the display panel 102 provided with a film for protecting the display area, etc. to the semiconductor device 100, so that the reliability of the semiconductor device can be further improved.

[0050] Note that by providing a pair of flexible base materials between the housings and allowing the pair of flexible base materials to slide, it is also possible to arrange two adjacent housings close to each other. For example by providing a pair of flexible base materials between the housings and allowing the pair of flexible base materials to slide, it is also possible to arrange two adjacent housings close to each other. For example As in the semiconductor device 120 shown in FIGS. 3(A) and 3(B), the housing 104 and the housing 106 may be arranged close to or in contact with each other.

[0051] Also, in FIGS. 2 and 3, an example in which the groove portion 105 is provided in one of the adjacent housings is shown. However, one aspect of the present invention is not limited to this, and the groove portion may be provided in both of the adjacent housings. As an example, FIG. 14 shows a configuration in which a groove portion 105a is provided in the housing 104 in the configuration shown in FIG. 2, and a configuration having groove portions in both the housing 104 and the housing 106. As shown in FIG. 14, by providing the groove portions 105a and 105 in the respective adjacent housings 104 and 106, it becomes easy to make the thickness of each housing approximately the same. As described above, by making the thickness of each of the plurality of housings used in the semiconductor device approximately the same, it is preferable because it is easy to maintain the horizontality of the display surface in the deployed state of the semiconductor device. Note that FIG. 14 shows a case where groove portions are provided in both of the adjacent housings in the configuration of FIG. 2. However, also in other drawings disclosed in this specification, it is possible to provide a plurality of groove portions.

[0052] Also, as shown in FIG. 4, flexible substrates may be provided on both the display surface side and the back surface side of the display panel 102, respectively. FIG. 4(A) is a perspective view of the semiconductor device 140 in the deployed state, FIG. 4(B) is a cross-sectional view taken along A3 - B3 of FIG. 4(A). Also, FIGS. 4(C1) and 4(C2) are cross-sectional views of the semiconductor device 140 in the folded state, respectively.

[0053] (C1) and FIG. 4(C2) are cross-sectional views of the semiconductor device 140 in the folded state, respectively.

[0053] The semiconductor device 140 shown in FIG. 4 has a display panel 102 between the housing 104 and the housing 106. Facing the display surface side, it has flexible substrates 108a and 108b, and for the display panel 102 Facing the back surface side, it has a flexible substrate 109a. Note that the back surface The flexible substrate 109a provided facing the back surface side of the display panel 102 may be a pair of substrates similar to the display surface side, or may be a single continuous substrate over at least the area overlapping the display panel 102. Note that when the flexible substrates 108a and 108b have translucency, the flexible substrates 108a and 108b may be provided so as to overlap the display area of the display panel 102. However, when the substrate does not have translucency, it is preferable to separate the substrate into a pair so that the substrate overlaps outside the display area.

[0054] As shown in the cross-sectional view of FIG. 4(B), in the unfolded state, the area 172 of the flexible substrate 108a fixed to the housing 104a is located in the groove portion 105 of the housing 106a, and the area 174 of the flexible substrate 109a fixed to the housing 104b is located in the groove portion 10 5b of the housing 106b. 4b.

[0055] Note that in FIG. 4, the housing 104 is divided into housings 104a and 104b in a direction perpendicular to the display surface of the display panel 102 and has a configuration fixed to each other by the adhesive layer 113. The housing 106 is divided into housings 106a and 106b in a direction perpendicular to the display surface of the display panel 102 and has a configuration fixed to each other by the adhesive layer 1 14, and this case is shown as an example. Note that instead of the adhesive layers 113 and 114, screws, pins, clips, etc. may be used.

[0056] Also, in FIG. 4, the adhesive layer 111 is not used for fixing the flexible substrates 108a and 108b. ​​when provided so as to be sandwiched between the housing 104 (specifically, the housing 104a or 104b) is shown as an example.

[0057] Figs. 4(C1) and 4(C2) show the folded state of the semiconductor device 140. The semiconductor device 1 40 has flexible base materials 108a , 108b, and 109a provided on both the display surface side and the back surface side of the display panel 102, so that the display surface of the display panel 102 can be bent inward (referred to as inward bending) or bent outward (referred to as outward bending).

[0058] Fig. 4(C1) shows the state in which the semiconductor device 140 is bent so that the display surface faces outward . As described above, in the folded state, the flexible base materials 108a and 109a disposed in the groove portions 105 and 105b are respectively pulled out. When the semiconductor device 140 is bent outward , the flexible base material 108a is located outside the display panel 102. In that case, the length of the region 176 of the flexible base material 108a located in the groove portion 105 is shorter than the length of the region 178 of the flexible base material 109a located in the groove portion 10 5b.

[0059] On the other hand, Fig. 4(C2) shows the state in which the semiconductor device 140 is bent so that the display surface faces inward . When the semiconductor device 140 is bent inward, the flexible base material 108a is located inside the display panel 102. In that case, the length of the region 182 of the flexible base material 108a located in the groove portion 105 is longer than the length of the region 184 of the flexible base material 109a located in the groove portion 105b .

[0060] ​​​​​By making the semiconductor device bendable outward, it becomes possible to diversify the display form. Also, By making the semiconductor device bendable inward, it is possible to suppress damage and dirt from adhering to the display surface during transportation or the like. For example, it is suitable when carrying the semiconductor device by putting it in a pocket of clothes or a bag. is suitable.

[0061] In addition, in FIG. 4, a case is shown where a flexible base material is fixed to the housing 104 and a groove portion for these to slide is provided in the housing 106. However, the embodiment of the present invention is not limited to this. For example , as shown in FIG. 5, a flexible base material 108a having flexibility and located on one surface (for example, the display surface) side of the display panel 102 is fixed to the housing 104a, and slides in the groove portion 105 provided in the housing 106a. configured to slide, and a flexible base material 109a having flexibility and located on the other surface (for example, the back surface) side of the display panel 102 is fixed to the housing 106b, and slides in the groove portion 105c provided in the housing 104b. configured to slide may also be used.

[0062] In addition, in the above, a case where a flexible base material is fixed to one of the adjacent housings and not fixed to the other is shown. However, one aspect of the present invention is not limited to this, and a flexible base material may have a region adhered to both of the adjacent housings. In this case , a configuration example of the semiconductor device is shown in FIG. 15(A). In FIG. 15(A), a flexible base material 1 08a and the housing 104 are adhered via an elastic body 130a, and a flexible base material 108 a and the housing 106 are adhered via an elastic body 130b, showing the unfolded state of the semiconductor device. When such a semiconductor device is bent, as shown in FIG. 15(B), the elastic body 1 30a and the elastic body 130b are stretched, and the concentration of stress on the curved region of the display panel 102 is prevented. Since it can be relaxed, the bending operation can be performed with good operability. The elastic body Examples of the elastic body include springs, rubbers, organic resins, and the like. In FIGS. 15(A) and 15( B), the case where an elastic body is provided in the configuration shown in FIG. 14 is shown as an example, but the elastic body can also be applied to the configurations shown in other drawings. As an example, FIG. 15(C) shows an example of a semiconductor device in which an elastic body 130b is provided as shown in FIG. 2(A).

[0063] Further, the display panel 102 may be adhered to the housing via an elastic body. As an example, FIG. 17(A) shows a developed state of a semiconductor device in which the display panel 102 is adhered to the housing 104 via an elastic body 130c and is also adhered to the housing 106 via an elastic body 130d. FIG. 17(B) shows a folded state of the semiconductor device shown in FIG. 17(A). As shown in FIG. 17(B), since the elastic bodies 130c and 130d are stretched, the bending operation of the semiconductor device can be performed with good operability.

[0064] Also, in the above, as the housing that supports the display panel 102, a semiconductor device having two housings, the housing 104 and the housing 106, and capable of being bent into two is shown, but the embodiment of the present invention is not limited to this. For example, as shown in FIG. 6, by supporting the display panel 102 by the housing 104, the housing 103, and the housing 106 and arranging flexible base materials 117a, 117b, 118a, 118b between adjacent housings, a semiconductor device 180 that can be folded into three can be obtained.

[0065] FIG. 6(A) shows a developed state of the semiconductor device 180, and FIG. 6(B) shows the semiconductor device 180 folded ​​​​​​​​​​​​illustrates the state of being folded. Further, FIG. 6(C) shows the folded state of the semiconductor device 180 In the semiconductor device 180, the flexible base materials 117a and 117b One end is fixed to one of the housing 106 and the housing 103, and the other end slides in a groove provided in the other of the housing 106 and the housing 103 Further, the flexible base materials 118a and 118b One end is fixed to one of the housing 103 and the housing 104, and the other end slides in a groove provided in the other of the housing 103 and the housing 104

[0066] Note that by setting the number of housings supporting the display panel 102 to n (n is an integer of 2 or more), a semiconductor device that can be folded into n pieces can be obtained. The details are the same as those of the semiconductor device that can be folded into the two pieces shown above

[0067] As described above, the semiconductor device of the present embodiment is provided with a flexible base material between adjacent housings that support a flexible display panel, and one of the housings fixes the flexible base material and makes it slidable with respect to the other, so that a semiconductor device with high portability, display integrity, and reliability can be obtained

[0068] Note that the configurations and the like in each figure shown in the present embodiment can be appropriately combined with the configurations and the like in other drawings and used

[0069] As described above, the configurations, methods, etc. of the present embodiment can be appropriately combined with the configurations, methods, etc. of other embodiments and used

[0070] (Embodiment 2) In the present embodiment, a flexible display panel applicable to a semiconductor device according to an aspect of the present invention ​​​As an example, an active matrix type display panel using an EL element will be described with reference to FIGS. 7 to 12. Note that as the display panel, not only a display panel having an EL element but also a display panel including display elements such as a liquid crystal element and an electrophoretic element may be applied.

[0071] <Specific Example 1> FIG. 7(A) shows a plan view of a flexible display panel, and FIG. 7(B) shows an example of a cross-sectional view taken along the dashed-dotted line A between 4-B4 in FIG. 7(A).

[0072] The display panel shown in FIG. 7(B) has an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 has a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors 1240, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements 1 230, an insulating layer 1211, a sealing layer 1213, an insulating layer 1261, a coloring layer 1259, a light-shielding layer 1 257, and an insulating layer 1255.

[0073] The conductive layer 1157 is electrically connected to the FPC 1108 via a connector 1215.

[0074] The light-emitting element 1230 has a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The EL layer has an organic light-emitting material. The lower electrode 1231 is electrically connected to the source electrode or the drain electrode of the transistor 1240. The end of the lower electrode 1231 is covered with an insulating layer 12 11. The light-emitting element 1230 has a top emission structure. The upper electrode 12 35 has translucency and transmits the light emitted by the EL layer 1233.

[0075] A coloring layer 1259 is provided at a position overlapping the light-emitting element 1230, and overlaps with the insulating layer 1211 ​​​A light-shielding layer 1257 is provided at the position. The coloring layer 1259 and the light-shielding layer 1257 are covered with an insulating layer 1 261. The space between the light-emitting element 1230 and the insulating layer 1261 is filled with a sealing layer 1213 .

[0076] The display panel has a plurality of transistors in the light extraction part 1104 and the drive circuit part 1106 . The transistor 1240 is provided on the insulating layer 1205. The insulating layer 1205 and the substrate 1201 are bonded together by an adhesive layer 1203. Also, the insulating layer 1255 and the substrate 1103 are bonded together by an adhesive layer 1105. If a film with low water permeability is used for the insulating layer 1205 or the insulating layer 1 255, it is possible to suppress the intrusion of impurities such as water into the light-emitting element 1230 and the transistor 1240, which is preferable because the reliability of the display panel is improved. The adhesive layer 1203 can use the same material as the adhesive layer 1105 .

[0077] In Specific Example 1, the insulating layer 1205, the transistor 1240, and the light-emitting element 1230 are fabricated on a fabrication substrate with high heat resistance, the fabrication substrate is peeled off, and the insulating layer 1205, the transistor 1240, and the light-emitting element 1230 are transferred onto the substrate 1201 using the adhesive layer 1203 . A display panel that can be fabricated in this way is shown. Also, in Specific Example 1, the insulating layer 125 5, the coloring layer 1259, and the light-shielding layer 1257 are fabricated on a fabrication substrate with high heat resistance, the fabrication substrate is peeled off, and the insulating layer 1255, the coloring layer 1259, and the light-shielding layer 1257 are transferred onto the substrate 1103 using the adhesive layer 1105 . A display panel that can be fabricated in this way is shown .

[0078] When a material (such as resin) with high water permeability and low heat resistance is used for the substrate, high heat is applied to the substrate during the fabrication process ​Since heat cannot be applied, there are restrictions on the conditions for fabricating transistors and insulating films on the substrate. In the fabrication method of this embodiment, since fabrication of transistors and the like can be performed on a fabrication substrate with high heat resistance, it is possible to form highly reliable transistors and an insulating film with sufficiently low water permeability. And by transferring them to the substrate 1103 or the substrate 1201, a highly reliable display panel can be fabricated. Thus, in one aspect of the present invention, a lightweight or thin and highly reliable active matrix type display panel can be realized. The details of the fabrication method will be described later.

[0079] For the substrate 1103 and the substrate 1201, it is preferable to use a material with high toughness respectively. Thereby, a display panel with excellent impact resistance and difficult to break can be obtained. For example, by using the substrate 1103 as an organic resin substrate and the substrate 1201 as a substrate using a thin metal material or alloy material, compared with the case of using a glass substrate for the substrate, it is lightweight and difficult to break. A display panel can be configured.

[0080] Since the metal material or alloy material has high thermal conductivity and can easily conduct heat to the entire substrate, local temperature rise of the display panel can be suppressed, which is preferable. The thickness of the substrate using the metal material or alloy material is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

[0081] Also, if a material with high emissivity is used for the substrate 1201, it is possible to suppress the increase in the surface temperature of the display panel, and suppress the destruction of the display panel and the deterioration of reliability. For example, for the substrate 1201, a layer with high emissivity (for example, a metal oxide or a ceramic material) is used on a metal substrate. It may be a laminated structure of kiru). In each of the following specific examples, the description of the same configuration as in Specific Example 1 will be omitted. will be omitted.

[0082] <Specific Example 2> FIG. 8(A) shows another example of the light extraction portion 1104 in the display panel. The display panel in FIG. 8(A) is a display panel capable of touch operation.

[0083] The display panel shown in FIG. 8(A) includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors 1240, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements 1230, an insulating layer 1 211, a spacer 1217, a sealing layer 1213, an insulating layer 1261, a coloring layer 1259, a light-shielding layer 1257, a plurality of light-receiving elements 1250, a conductive layer 1281, a conductive layer 1283, an insulating layer 129 1, an insulating layer 1293, an insulating layer 1295, and an insulating layer 1255.

[0084] In Specific Example 2, a spacer 1217 is provided on the insulating layer 1211. By providing the spacer 1217, the distance between the substrate 1103 and the substrate 1201 can be adjusted.

[0085] FIG. 8(A) shows an example in which a light-receiving element 1250 is provided between the insulating layer 1255 and the sealing layer 1213. Since the light-receiving element 1250 can be disposed overlapping the non-light-emitting region on the substrate 1201 side (for example, the region where the transistor 1240 and the wiring are provided), a touch sensor can be provided on the display panel without reducing the aperture ratio of the pixel (light-emitting element). The light-receiving element 1250 included in the display panel may be, for example, a pn-type or pin-type photodiode.

[0086] For the light-receiving element 1250 included in the display panel, for example, a pn-type or pin-type photodiode In this embodiment, a p-type semiconductor layer can be used as the light receiving element 1250. 1271, an i-type semiconductor layer 1273, and an n-type semiconductor layer 1275. A diode is used.

[0087] The i-type semiconductor layer 1273 contains impurities that give p-type conductivity and impurities that give n-type conductivity. Each item is 1×10 20 cm -3 The concentration is less than 10 and the photoconductivity is 10 The i-type semiconductor layer 1273 contains impurities of Group 13 or 15 of the periodic table. In other words, i-type semiconductors are those that have valence electron control. When no impurity elements are intentionally added, it exhibits weak n-type electrical conductivity, so it is called an i-type semiconductor. The layer 1273 is formed by intentionally or unintentionally doping with an impurity element that imparts p-type conductivity during or after the film formation. This category includes substances that are intentionally added.

[0088] The light-shielding layer 1257 overlaps the light-receiving element 1250 on the side closer to the substrate 1103. The light-shielding layer 1257 located between the light-emitting element 1230 and the sealing layer 1213 prevents the light from emitting light from the light-emitting element 1230. This can prevent the light receiving element 1250 from being irradiated with the light.

[0089] The conductive layer 1281 and the conductive layer 1283 are each electrically connected to the light receiving element 1250 . The conductive layer 1281 is preferably a conductive layer that transmits light incident on the light receiving element 1250. The conductive layer 1283 is a conductive layer that blocks light incident on the light receiving element 1250. is preferred.

[0090] When the optical touch sensor is disposed between the substrate 1103 and the sealing layer 1213, the light emitting element 1230 It is preferable because it is less affected by light emission and the S / N ratio can be improved.

[0091] <Specific Example 3> FIG. 8(B) shows another example of the light extraction unit 1104 in the display panel. The table in FIG. 8(B) The display panel shown is a touch-operable display panel.

[0092] The display panel shown in FIG. 8(B) has an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors 1240, an insulating layer 1207, an insulating layer 1209a, an insulating layer 1209b, a plurality of light-emitting elements 1230, an insulating layer 1211, a spacer 1217, a sealing layer 1213, a coloring layer 1259, a light-shielding layer 1257, a plurality of light-receiving elements 1250, a conductive layer 1280, a conductive layer 1281, and an insulating layer 1255.

[0093] In FIG. 8(B), an example having a light-receiving element 1250 between the insulating layer 1205 and the sealing layer 1213 is shown. By providing the light-receiving element 1250 between the insulating layer 1205 and the sealing layer 1213, a conductive layer that is electrically connected to the light-receiving element 1250 and a photoelectric conversion layer that constitutes the light-receiving element 1250 can be formed using the same material and the same process as the conductive layer and the semiconductor layer that constitute the transistor 1240. Therefore, a touch-operable display panel can be manufactured without significantly increasing the manufacturing process. 1250 and the photoelectric conversion layer that constitutes the light-receiving element 1250 can be manufactured. Therefore, a touch-operable display panel can be manufactured without significantly increasing the manufacturing process.

[0094] <Specific Example 4> FIG. 9(A) shows another example of the display panel. The display panel in FIG. 9(A) is a touch-operable display panel.

[0095] The display panel shown in FIG. 9(A) has an element layer 1101, an adhesive layer 1105, and a substrate 1103.​​ It has. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors 1240, a conductive layer 1156, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements 1230, an insulating layer 1211, a spacer 1217, a sealing layer 1213, a coloring layer 1259, a light-shielding layer 1257, an insulating layer 1255, a conductive layer 1272, a conductive layer 1274, an insulating layer 1276, an insulating layer 1278, a conductive layer 1294, and a conductive layer 1296.

[0096] In FIG. 9(A), an example having a capacitive touch sensor between the insulating layer 1255 and the sealing layer 1213 is shown. The capacitive touch sensor has a conductive layer 1272 and a conductive layer 1274. It has.

[0097] The conductive layer 1156 and the conductive layer 1157 are electrically connected to the FPC 1108 via the connector 1215. The conductive layer 1294 and the conductive layer 1296 are electrically connected to the conductive layer 1274 via the conductive particles 1292. Therefore, the capacitive touch sensor can be driven via the FPC 1108. It can be.

[0098] <Specific Example 5> FIG. 9(B) shows another example of the display panel. The display panel in FIG. 9(B) is a display panel capable of touch operation. It is.

[0099] The display panel shown in FIG. 9(B) has an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors 1240, a conductive layer 1156, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements 1230, an insulating layer 1211, a spacer 1217, a sealing layer 1213, a coloring Layer 1259, light-shielding layer 1257, insulating layer 1255, conductive layer 1270, conductive layer 1272, conductive It has layer 1274, insulating layer 1276, and insulating layer 1278.

[0100] In FIG. 9(B), an example having a capacitive touch sensor between the insulating layer 1255 and the sealing layer 1213 is shown. The capacitive touch sensor has a conductive layer 1272 and a conductive layer 1274. It has.

[0101] The conductive layer 1156 and the conductive layer 1157 are electrically connected to the FPC 1108a via the connector 1215a. The conductive layer 1270 is electrically connected to the FPC 1108b via the connector 1215b. Therefore, it is possible to drive the light-emitting element 1230 and the transistor 1240 via the FPC 1108a and drive the capacitive touch sensor via the FPC 1108b. It can be done. It can be done.

[0102] <Specific Example 6> FIG. 10(A) shows another example of the light extraction part 1104 in the display panel.

[0103] The light extraction part 1104 shown in FIG. 10(A) includes a substrate 1103, an adhesive layer 1105, a substrate 12 02, an insulating layer 1205, a plurality of transistors 1240, an insulating layer 1207, a conductive layer 1208 , an insulating layer 1209a, an insulating layer 1209b, a plurality of light-emitting elements 1230, an insulating layer 1211, a sealing layer 1213, and a coloring layer 1259.

[0104] The light-emitting element 1230 has a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The lower electrode 1231 is electrically connected to the source electrode or the drain electrode of the transistor 1240 via the conductive layer 1208. The end of the lower electrode 1231 is covered with the insulating layer 1211. It is as follows. The light-emitting element 1230 has a bottom emission structure. The lower electrode 1231 has light-transmitting properties and transmits the light emitted by the EL layer 1233.

[0105] A colored layer 1259 is provided at a position overlapping the light-emitting element 1230, and the light emitted by the light-emitting element 1230 is taken out to the substrate 1103 side through the colored layer 1259. The space between the light-emitting element 1230 and the substrate 1202 is filled with a sealing layer 1213. The substrate 1202 can be manufactured using the same material as the aforementioned substrate 120 1.

[0106] <Specific Example 7> FIG. 10(B) shows another example of a display panel.

[0107] The display panel shown in FIG. 10(B) has an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 has a substrate 1202, an insulating layer 1205, a conductive layer 1310a, a conductive layer 1 310b, a plurality of light-emitting elements 1230, an insulating layer 1211, a conductive layer 1212, and a sealing layer 12 13.

[0108] The conductive layers 1310a and 1310b are external connection electrodes of the display panel and can be electrically connected to an FPC or the like.

[0109] The light-emitting element 1230 has a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The end of the lower electrode 1231 is covered with the insulating layer 1211. The light-emitting element 1230 has a bottom emission structure. The lower electrode 1231 has light-transmitting properties and transmits the light emitted by the EL layer 1233. The conductive layer 1212 is electrically connected to the lower electrode 1231.

[0110] The substrate 1103 has, as a light extraction structure, a hemispherical lens, a microlens array, a concavo-convex structure It may have a film, a light diffusing film, etc. to which is applied. For example, on a resin substrate, the above lens or film is adhered using an adhesive or the like having the same refractive index as the substrate or the lens or film, thereby forming a light extraction structure.

[0111] The conductive layer 1212 is not necessarily provided, but it is preferably provided because it can suppress the voltage drop caused by the resistance of the lower electrode 1231. Also, for the same purpose, a conductive layer electrically connected to the upper electrode 1235 may be provided on the insulating layer 1211.

[0112] The conductive layer 1212 can be formed as a single layer or by lamination using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum or an alloy material having these as main components. The film thickness of the conductive layer 1212 can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.5 μm or less.

[0113] When a paste (such as a silver paste) is used as the material of the conductive layer electrically connected to the upper electrode 1235, the metal constituting the conductive layer becomes granular and aggregates. Therefore, the surface of the conductive layer becomes rough with many gaps, making it difficult for the EL layer 1233 to completely cover the conductive layer, and it is preferable that the electrical connection between the upper electrode and the auxiliary wiring is facilitated.

[0114] <Example of Material> Next, materials that can be used for the display panel, etc. will be described. Note that the description of the configuration described above in this embodiment will be omitted.

[0115] The element layer 1101 has at least a display element. When a light-emitting element is used as the display element it is possible to use an element capable of self-luminescence, and the luminance is controlled by current or voltage and the element is included in that category. For example, a light-emitting diode (LED), an organic EL element, an inorganic EL element, etc. can be used.

[0116] The element layer 1101 may further have a transistor for driving the display element, a touch sensor, etc. It may also have them.

[0117] The structure of the transistor included in the display panel is not particularly limited. For example, it may be a staggered transistor or an inverted staggered transistor. Also, it may be either a top gate type or a bottom gate type transistor structure. The semiconductor material used for the transistor is not particularly limited, and examples include silicon, germanium, etc. Or, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In-Ga-Zn based metal oxide, may be used.

[0118] The crystallinity of the semiconductor material used for the transistor is not particularly limited either, and any of an amorphous semiconductor, a semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or a semiconductor having a crystal region partially) may be used. Using a semiconductor having crystallinity is preferable because it can suppress deterioration of the transistor characteristics.

[0119] The light-emitting element included in the display panel has a pair of electrodes (lower electrode 1231 and upper electrode 1235) and an EL layer 1233 provided between the pair of electrodes. One of the pair of electrodes functions as an anode and the other functions as a cathode.

[0120] The light-emitting element may have any of a top emission structure, a bottom emission structure, and a dual emission structure. For the electrode on the side where light is extracted, a conductive film that transmits visible light is used. For the electrode on the side where light is not extracted, it is preferable to use a conductive film that reflects visible light.

[0121] The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide, zinc oxide doped with gallium, etc. Also, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (e.g., titanium nitride) can also be used by forming them thinly to have light-transmitting properties. In addition, a laminated film of the above materials can be used as the conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because it can enhance conductivity. Also, graphene or the like can be used.

[0122] The conductive film that reflects visible light can be formed using, for example, metal materials such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or alloys containing these metal materials. Also, lanthanum, neodymium, or germanium, etc. may be added to the above metal materials or alloys. Also, alloys of aluminum and titanium, alloys of aluminum and nickel, alloys of aluminum and neodymium, etc. ​​​​​​​​​​​​​Alloys containing palladium (aluminum alloys), silver-copper alloys, silver-palladium-copper alloys, silver The electrode can be formed using an alloy containing silver, such as an alloy of silver and magnesium. Gold is preferred because of its high heat resistance. By laminating the oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, a film made of silver and ITO may be laminated. A laminated film, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used.

[0123] The electrodes may be formed by vapor deposition or sputtering. Formed using a discharge method such as the jet method, a printing method such as the screen printing method, or a plating method. It is possible.

[0124] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 1231 and the upper electrode 1235. Then, holes are injected into the EL layer 1233 from the anode side, and electrons are injected from the cathode side. The injected electrons and holes recombine in the EL layer 1233 to form luminescent The substance emits light.

[0125] The EL layer 1233 has at least a light-emitting layer. The EL layer 1233 has a layer other than the light-emitting layer. , a material with high hole injection properties, a material with high hole transport properties, a material with hole blocking properties, A material with high electron transporting properties, a material with high electron injecting properties, or a bipolar material (electron transporting and hole transporting properties) The semiconductor device may further include a layer containing a substance having high transport properties.

[0126] Either a low-molecular compound or a high-molecular compound can be used for the EL layer 1233, and it may contain an inorganic compound. The layers constituting the EL layer 1233 can be formed by methods such as vapor deposition (including vacuum vapor deposition), transfer method, printing method, inkjet method, coating method, etc. In the element layer 1101, it is preferable that the light-emitting element is provided between a pair of insulating films with low water permeability. This can suppress the intrusion of impurities such as water into the light-emitting element and suppress the decrease in the reliability of the light-emitting device. Examples of the insulating film with low water permeability include films containing nitrogen and silicon such as silicon nitride film and silicon oxynitride film, and films containing nitrogen and aluminum such as aluminum nitride film. Also, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, etc. may be used.

[0127]

[0128]

[0129] For example, the water vapor transmission rate of the insulating film with low water permeability is 1×10 -5 g / m 2 ·day or less, preferably 1×10 -6 g / m 2 ·day or less, more preferably 1×10 -7 g / m 2 ·d ay or less, even more preferably 1×10 -8 g / m 2 ·day or less.

[0130] The substrate 1103 has light transmittance and transmits at least the light emitted by the light-emitting element included in the element layer 1101. The substrate 1103 may have flexibility. Also, for the substrate 1103, a substrate with a refractive index higher than that of the atmosphere is applied. Note that compared with glass, an organic resin is lighter in weight. ​​​​​​​​​Therefore, when applying a substrate using an organic resin as the substrate 1103, it is preferable because the semiconductor device can be made lighter than in the case of using glass. Compared with , it is preferable that the semiconductor device can be made lighter.

[0131] Examples of materials having flexibility and transparency to visible light include glass having a thickness sufficient to have flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate ( PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES ) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, and the like. In particular, it is preferable to use a material having a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. can be preferably used. In addition, a substrate in which glass fibers are impregnated with an organic resin or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can also be used. As the substrate 1103, a layer using the above material may be laminated with a hard coat layer (for example, a silicon nitride layer, etc.) that protects the surface of the display panel from scratches, a layer made of a material capable of dispersing pressure (for example,

[0132] an aramid resin layer, etc.). Further, in order to suppress a decrease in the life of the light-emitting element due to moisture or the like, the above-described insulating film having low water permeability may be provided. The adhesive layer 1105 has translucency and transmits at least the light emitted by the light-emitting element included in the element layer 1101. Also, the refractive index of the adhesive layer 1105 is higher than the refractive index of the atmosphere. In order to suppress a decrease in the life of the light-emitting element due to moisture or the like, the above-described insulating film having low water permeability may be provided.

[0133] The adhesive layer 1105 has translucency and transmits at least the light emitted by the light-emitting element included in the element layer 1101. Also, the refractive index of the adhesive layer 1105 is higher than the refractive index of the atmosphere.

[0134] For the next layer 1105, a curable resin that cures at room temperature, such as a two-component mixed resin, a photo-curable resin , a resin such as a thermosetting resin can be used. For example, epoxy resin, acrylic resin , silicone resin, phenolic resin, etc. can be mentioned. In particular, a material with low moisture permeability such as epoxy resin is preferable.

[0135] Also, the above resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an oxide of an alkaline earth metal (calcium oxide , barium oxide, etc.), can be used. Or, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. When a desiccant is included, it is possible to suppress the entry of impurities such as moisture into the light-emitting element, which is preferable because the reliability of the light-emitting device is improved.

[0136] Also, by mixing a filler with a high refractive index (such as titanium oxide) into the above resin, the light extraction efficiency from the light-emitting element can be improved, which is preferable.

[0137] Also, the adhesive layer 1105 may have a scattering member that scatters light. For example, for the adhesive layer 1105, a mixture of the above resin and particles having a refractive index different from that of the above resin can also be used. The particles function as a light scattering member.

[0138] It is preferable that the difference in refractive index between the resin and the particles having a refractive index different from that of the resin is 0.1 or more, and more preferably 0.3 or more. Specifically, as the resin, epoxy resin, acrylic resin , imide resin, silicone, etc. can be used. As the particles, titanium oxide , barium oxide, zeolite, etc. can be used.

[0139] Particles of titanium oxide and barium oxide preferably have strong light-scattering properties. Also, zeo When using , water adsorbed by resins and the like can be removed, improving the reliability of the light-emitting element. It is possible to do so.

[0140] For the insulating layer 1205 and the insulating layer 1255, an inorganic insulating material can be used. In particular, using the insulating film with low water permeability described above is preferable because a display panel with high reliability can be realized.

[0141] The insulating layer 1207 has the effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor. As the insulating layer 1207, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used.

[0142] As the insulating layer 1209, the insulating layer 1209a, and the insulating layer 1209b, it is preferable to select an insulating film having a planarizing function in order to reduce surface irregularities caused by transistors and the like. For example, organic materials such as polyimide, acrylic, and benzocyclobutene-based resins can be used. In addition to the above organic materials, low dielectric constant materials (low-k materials) and the like can be used. Note that a plurality of insulating films and inorganic insulating films formed of these materials may be laminated.

[0143] The insulating layer 1211 is provided to cover the end portion of the lower electrode 1231. In order to improve the covering property of the EL layer 1233 and the upper electrode 1235 formed on the upper layer of the insulating layer 1211, it is preferable that the side wall of the insulating layer 1211 is an inclined surface formed with a continuous curvature.

[0144] As the material of the insulating layer 1211, a resin or an inorganic insulating material can be used. As the resin Then, for example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, or phenol resin can be used. In particular, since the production of the insulating layer 1211 becomes easy, it is preferable to use a negative photosensitive resin or a positive photosensitive resin.

[0145] The method for forming the insulating layer 1211 is not particularly limited, and a photolithography method, a sputtering method , an evaporation method, a droplet discharge method (such as an inkjet method), a printing method (such as screen printing, offset printing, etc.) can be used.

[0146] The spacer 1217 can be formed using an inorganic insulating material, an organic insulating material, or a metal material, etc. For example, as the organic insulating material, a negative or positive photosensitive resin, a non-photosensitive resin, etc. can be used. Also, as the metal material, titanium, aluminum, etc. can be used. By using a conductive material for the spacer 1217 and configuring it to electrically connect the spacer 1217 and the upper electrode 1235, the potential drop caused by the resistance of the upper electrode 1235 can be suppressed. Also, the spacer 1217 may have a forward taper shape or a reverse taper shape.

[0147] The insulating layer 1276, the insulating layer 1278, the insulating layer 1291, the insulating layer 1293, and the insulating layer 1295 can be formed using an inorganic insulating material or an organic insulating material, respectively. In particular, for the insulating layer 1278 and the insulating layer 1295, it is preferable to use an insulating layer having a planarizing function to reduce the surface unevenness caused by the sensor element.

[0148] For the sealing layer 1213, a curable resin that cures at room temperature, such as a two-component mixed resin, a photocurable resin ​​​​​​, resins such as thermosetting resins can be used. For example, PVC (polyvinyl chloride) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB ( polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 1213 may contain a desiccant. Also, when the light of the light-emitting element 1230 passes through the sealing layer 1213 and is taken out of the display panel, it is preferable that the sealing layer 1213 contains a filler with a high refractive index or a scattering member. As for the desiccant, filler with a high refractive index, and scattering member, the same materials as those that can be used in the adhesive layer 1105 can be mentioned.

[0149] The conductive layer 1156, conductive layer 1157, conductive layer 1294, and conductive layer 1296 can be formed of the same material and in the same process as the conductive layer constituting the transistor or light-emitting element. Also, the conductive layer 1280 can be formed of the same material and in the same process as the conductive layer constituting the transistor.

[0150] For example, each of the above conductive layers can be formed as a single layer or laminated using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, etc. or an alloy material containing these elements. Also, each of the above conductive layers may be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, indium zinc oxide (such as In2O3-ZnO), or a material obtained by adding silicon oxide to these metal oxide materials can be used.

[0151] Also, the conductive layer 1208, the conductive layer 1212, the conductive layer 1283, and the conductive layers 1310a and 1310b can also be formed using the above metal materials, alloy materials, or conductive metal oxides, etc. respectively.

[0152] The conductive layers 1272, 1274, and 1281 are conductive layers having translucency. For example, indium oxide, ITO, indium zinc oxide, zinc oxide, zinc oxide added with gallium, etc. can be used. Also, the conductive layer 1270 can be formed of the same material as the conductive layer 1272 in the same process. respectively.

[0153] The conductive particles 1292 are those obtained by coating the surface of particles such as organic resin or silica with a metal material. Using nickel or gold as the metal material is preferable because it can reduce the contact resistance. Also, it is preferable to use particles coated with two or more types of metal materials in layers, such as coating nickel with gold. respectively.

[0154] As the connector 1215, a paste-like or sheet-like material obtained by mixing metal particles with a thermosetting resin can be used, and a material showing anisotropic conductivity by thermocompression bonding can be used. As the metal particles, it is preferable to use particles in which two or more types of metals are layered, such as those obtained by coating nickel particles with gold. respectively. respectively.

[0155] The colored layer 1259 is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, a blue (B) color filter that transmits light in the blue wavelength band, etc. can be used. Each colored layer can be formed using various materials by printing, inkjet, or photo... Form them at desired positions respectively by an etching method using a triso-graphy method or the like.

[0156] Further, a light-shielding layer 1257 is provided between adjacent color layers 1259. The light-shielding layer 125 7 shields light that wraps around from adjacent light-emitting elements and suppresses color mixing between adjacent pixels. Here, by providing the end portion of the color layer 1259 so as to overlap with the light-shielding layer 1257, light leakage can be suppressed. The light-shielding layer 1257 can use a material that shields the light emission of the light-emitting element and can be formed using a metal material, a resin material containing a pigment or a dye, or the like. Note that, as shown in FIG. 7(A), if the light-shielding layer 1257 is provided in a region other than the light extraction portion 1104 such as the drive circuit portion 1106, unintended light leakage due to waveguide light or the like can be suppressed, which is preferable.

[0157] Further, if an insulating layer 1261 that covers the color layer 1259 and the light-shielding layer 1257 is provided, impurities such as pigments contained in the color layer 125 9 and the light-shielding layer 1257 can be suppressed from diffusing into the light-emitting element or the like. This is preferable. The insulating layer 1261 uses a light-transmissive material and can use an inorganic insulating material or an organic insulating material. The insulating film with low water permeability described above may be used for the insulating layer 1261.

[0158] <Method for manufacturing a display panel> The method for manufacturing a display panel will be exemplified with reference to FIGS. 11 and 12. Here, a display panel having the configuration of Specific Example 1 (FIG. 7 (B)) will be described as an example.

[0159] First, a release layer 1303 is formed on a manufacturing substrate 1301, and an insulating layer 120 5 is formed on the release layer 1303. Next, a plurality of transistors 1240 and a conductive layer 1157 are formed on the insulating layer 1205. 12, an insulating layer 1207, an insulating layer 1209, a plurality of light emitting elements 1230, and an insulating layer 1211 are formed. In addition, the insulating layer 1211, the insulating layer 1209, and the conductive layer 1157 are formed so as to be exposed. In addition, the insulating layer 1207 is opened (FIG. 11(A)).

[0160] In addition, a peeling layer 1307 is formed over the formation substrate 1305, and an insulating layer 125 is formed over the peeling layer 1307. Next, a light-shielding layer 1257, a coloring layer 1259, and an insulating layer 5 are formed on the insulating layer 1255. 1261 is formed (FIG. 11(B)).

[0161] The substrates 1301 and 1305 are made of a glass substrate, a quartz substrate, and a silicon substrate, respectively. A ceramic substrate, a metal substrate, or the like can be used.

[0162] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. For example, a glass material such as barium borosilicate glass can be used. If the strain point is high, it is advisable to use a material with a strain point of 730°C or higher.

[0163] When a glass substrate is used as the substrate, a silicon oxide film or an oxide When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon oxynitride film is formed, the glass This is preferable since it can prevent contamination from the substrate.

[0164] The peeling layers 1303 and 1307 are made of tungsten, molybdenum, and titanium, respectively. Tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of tungsten, palladium, osmium, iridium, and silicon; It is made of an alloy material containing the element, or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

[0165] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. The coating method includes a spin coating method, a droplet discharging method, and a dispensing method.

[0166] When the peeling layer has a single layer structure, it is made of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten oxide or oxide. a layer containing an oxynitride of molybdenum, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of tantalum and molybdenum may be formed. A mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum. do.

[0167] In addition, a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten may be used as the peeling layer. In the case of forming a tungsten-containing layer, an insulating film made of oxide is formed on the tungsten-containing layer. By forming the insulating film, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating film. In addition, the surface of the layer containing tungsten may be subjected to a thermal oxidation treatment. , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, ozone water, and other highly oxidizing solvents Alternatively, a layer containing tungsten oxide may be formed by performing a treatment with a liquid or the like. The treatment and heating process may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The above plasma treatment or heat treatment may be performed under a gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that is formed later. do.

[0168] Each insulating layer is formed using a method such as sputtering, plasma CVD, coating, or printing. For example, the film formation temperature can be increased to 250°C or higher, up to 400°C, using the plasma CVD method. By forming the membrane as described below, it is possible to obtain a dense membrane with extremely low water permeability.

[0169] Thereafter, the surface of the preparation substrate 1305 on which the colored layer 1259 and the like are provided or the surface of the preparation substrate 1301 is A material for forming the sealing layer 1213 is applied to the surface on which the optical element 1230 and the like are provided. The surfaces are then attached together via an adhesive (FIG. 11(C)).

[0170] Then, the manufacturing substrate 1301 is peeled off, and the exposed insulating layer 1205 and the substrate 1201 are bonded to each other by an adhesive layer. The substrate 1305 is peeled off to expose the insulating layer 12. 55 and a substrate 1103 are bonded together using an adhesive layer 1105. In FIG. The conductive layer 1157 and the substrate 1103 are not overlapped with each other. They may overlap.

[0171] For example, a peeling layer may be formed by a method using a film to be peeled off. When a layer containing a metal oxide film is formed on the side in contact with the peeled layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the layer. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the plate and the peeled layer, the laser beam The amorphous silicon film is removed by irradiation or etching, so that the layer to be peeled off is separated from the production substrate. In addition, the peeling layer may include a layer including a metal oxide film on the side in contact with the layer to be peeled. The metal oxide film is weakened by crystallization, and a part of the peeling layer is dissolved in a solution or NF3 After removing the gold by etching using fluoride gas such as BrF3 or ClF3, the weakened gold Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. A film containing hydrogen (e.g., an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) is used. The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of accelerating the peeling between the peeled layer and the substrate may be used. The substrate was mechanically removed or etched with a solution or a fluoride gas such as NF3, BrF3, or ClF3. A method of removing the film by etching or the like can be used. In this case, it is not necessary to provide a peeling layer. stomach.

[0172] Moreover, by combining a plurality of the above-mentioned peeling methods, the peeling step can be carried out more easily. That is, irradiation with laser light, etching of the peeling layer with gas or solution, or using a sharp knife or knife Mechanical removal is performed using a tool such as a brush to make the peeling layer and the layer to be peeled easier to peel off, and then Peeling can also be achieved by physical force (mechanically, etc.).

[0173] In addition, the layer to be peeled off can be peeled off from the substrate by penetrating a liquid into the interface between the peeling layer and the layer to be peeled off. Also, during the peeling, liquid such as water may be poured onto the film.

[0174] As for other peeling methods, when the peeling layer is made of tungsten, it is possible to use ammonia water and perchloric acid. The peeling layer may be etched with a mixed solution of hydrogen oxide and water to perform the peeling.

[0175] Note that when separation is possible at the interface between the formation substrate and the layer to be peeled off, a peeling layer does not have to be provided. For example, glass is used as a substrate, and an organic resin such as polyimide is formed in contact with the glass. An insulating film, a transistor, etc. are formed on the organic resin. In this case, by heating the organic resin, it can be peeled off at the interface between the production substrate and the organic resin. Or, a metal layer is provided between the production substrate and the organic resin, and the metal layer is heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin.

[0176] Finally, by opening the insulating layer 1255 and the sealing layer 1213, the conductive layer 1157 is exposed (FIG. 12(B)). In the case where the substrate 1103 overlaps with the conductive layer 1157, the substrate 1103 and the adhesive layer 1105 are also opened (FIG. 12(C)). The means for opening is not particularly limited , and for example, a laser ablation method, an etching method, an ion beam sputtering method, etc. may be used. Further, a cut may be made in the film on the conductive layer 1157 using a sharp blade or the like, and a part of the film may be peeled off by physical force.

[0177] Thus, a display panel can be manufactured.

[0178] The display panel of this embodiment is composed of two substrates, namely, the substrate 1103 and the substrate 1201 or the substrate 1202. Even if it includes a touch sensor, it can be composed of two substrates. By minimizing the number of substrates, the light extraction efficiency and the clarity of the display are facilitated.

[0179] As described above, the configurations, methods, etc. of this embodiment can be appropriately combined with those of other embodiments and used.

[0180] (Embodiment 3) In this embodiment, an example of an electronic device to which a display device according to an aspect of the present invention is applied will be described with reference to the drawings.

[0181] As an electronic device to which a display device having a flexible shape is applied, for example, a television set (also referred to as a TV or a television receiver), a monitor for a computer, a dig ital camera, a digital video camera, a digital photo frame, a mobile phone (also referred to as a mobile phone or a mobile phone device), a portable game machine, a portable information terminal, an audio reproduction device, a large game machine, etc. can be mentioned.

[0182] FIGS. 13(A) and 13(B) illustrate a foldable tablet terminal 9600. Here, an example of a two-fold type is shown, but it can also be applied to those with a large number of folds such as three-fold or four-fold. FIG. 13(A) shows the open state of the tablet terminal 9600, and the tablet terminal 9600 has a housing 9630, a display unit 9631, a display mode switching switch 9626, a power switch 9627, a power saving mode switching switch 962 5, a fastener 9629, and an operation switch 9628.

[0183] The housing 9630 has a housing 9630a and a housing 9630b, and the housing 9630a and the housing 963 0b are coupled by a flexible base material 9639. Further, the housing 9630 can be folded in two by the flexible base material 9639.

[0184] In addition, the display unit 9631 is configured by a flexible display panel supported by the housing 9630a and the housing 9630b. As the flexible display panel, the display panel shown in the previous embodiment can be used. By disposing the flexible base material 9639 so as to have a curved surface on the outside of the curved portion of the display panel, the change to the folded state When in a curved shape, the load on the curved portion of the display panel can be reduced, and damage such as cracks in this area can be suppressed from occurring. Therefore, it becomes possible to provide a highly reliable tablet-type terminal.

[0185] The display unit 9631 can have a part as a touch sensor area 9632, and data can be input by touching the displayed operation key 9638. Note that the display unit 9631 For example, it can be configured such that half of the area has only a display function, and the other half of the area has a touch sensor function. Also, all areas of the display unit 9631 may have a touch sensor function. For example, a keyboard button display can be made on the entire surface of the display unit 9631 to also serve as a data input terminal.

[0186] Also, the display mode switching switch 9626 can select switching of the display orientation such as vertical or horizontal display, and switching between black-and-white display and color display. The power-saving mode switching switch 9625 can optimize the display brightness according to the amount of external light detected by the optical sensor built into the tablet-type terminal during use. The tablet-type terminal can incorporate not only an optical sensor but also other detection devices such as sensors for detecting inclination such as gyroscopes and acceleration sensors.

[0187] Figure 13(B) shows the state where the tablet-type terminal 9600 is closed, and the tablet-type terminal 96 00 has a housing 9630, a solar cell 9633, and a charge / discharge control circuit 9634. Note that in Figure 13(B), as an example of the charge / discharge control circuit 9634, a configuration having a battery 9635 and a DCDC converter 9636 is shown.

[0188] By using the display panel shown in the previous embodiment in the display unit 9631, the display unit 963 1 can be folded. For example, since the tablet terminal 9600 can be folded in two , the housing 9630 can be closed when not in use. Therefore, it has excellent portability and also, since the display unit 9631 can be protected by closing the housing 9630, it has excellent durability and can be made into a tablet terminal with excellent reliability from the viewpoint of long-term use.

[0189] In addition, the tablet terminals shown in FIGS. 13(A) and 13(B) also have functions such as displaying various information (still images, moving images, text images, etc.), displaying a calendar, date, or time on the display unit, a touch input function for touch input operation or editing of the information displayed on the display unit, and a function of controlling processing by various software (programs).

[0190] Power can be supplied to the touch panel, display unit, or video signal processing unit, etc. by the solar cell 9633 mounted on the surface of the tablet terminal. Note that the solar cell 9633 can be provided on one or both sides of the housing 9630 and can be configured to efficiently charge the battery 9635. As the battery 9635, using a lithium-ion battery has advantages such as enabling miniaturization.

[0191] Also, the configuration and operation of the charge / discharge control circuit 9634 shown in FIG. 13(B) will be described with reference to the block diagram in FIG. 13(C ). FIG. 13(C) shows a solar cell 9633, a battery 96 35, a DCDC converter 9636, a converter 9637, switches SW1 to SW3, The display unit 9631 is shown, and the battery 9635, DCDC converter 9636 , converter 9637, and switches SW1 to SW3 are located at positions corresponding to the charge / discharge control circuit 9634 shown in Fig. 13(B).

[0192] First, an example of the operation when power is generated by the solar cell 9633 due to external light will be described. The power generated by the solar cell is stepped up or down by the DCDC converter 9636 to a voltage for charging the battery 9635. When the power from the solar cell 9633 is used for the operation of the display unit 9631, switch SW1 is turned on, and the converter 9637 steps up or down the voltage to the voltage required for the display unit 9631. When the display on the display unit 9631 is not performed, SW1 is turned off and SW2 is turned on to charge the battery 9635.

[0193] Note that the solar cell 9633 is shown as an example of the power generation means, but it is not particularly limited, and the battery 9635 may be charged by other power generation means such as piezoelectric elements (piezoelectric elements) and thermoelectric conversion elements (Peltier elements). For example, a contactless power transmission module that wirelessly (non-contact) transmits and receives power for charging, or a configuration that combines other charging means may be used.

[0194] Of course, as long as the display device according to an aspect of the present invention is provided, it is not particularly limited to the above-described electronic devices.

[0195] As described above, the configuration, method, etc. of the present embodiment can be appropriately combined with the configuration, method, etc. of other embodiments and used.

Description of Reference Numerals

[0196] 100 Semiconductor device 102 Display panel 103 Housing 104 Housing 104a Housing 104b Housing 105 Groove portion 105a Groove portion 105b Groove portion 105c Groove portion 106 Housing 106a Housing 106b Housing 107 Anchor portion 108a Substrate 108b Substrate 109a Substrate 110 Region 111 Adhesive layer 111a Adhesive layer 112 Region 113 Adhesive layer 114 Adhesive layer 117a Substrate 117b Substrate 118a Substrate 118b Substrate 120 Semiconductor device 130a Elastomer 130b Elastomer 130c Elastomer 130d Elastomer 132 FPC 140 Semiconductor device 160 Region 170 Region 172 Region 174 Region 176 Region 178 Region 180 Semiconductor device 182 Region 184 Region 1101 Element layer 1103 Substrate 1104 Light extraction portion 1105 Adhesive layer 1106 Drive Circuit Section 1108 FPC 1108a FPC 1108b FPC 1156 Conductive Layer 1157 Conductive Layer 1201 Substrate 1202 Substrate 1203 Adhesive Layer 1205 Insulating Layer 1207 Insulating Layer 1208 Conductive Layer 1209 Insulating Layer 1209a Insulating Layer 1209b Insulating Layer 1211 Insulating Layer 1212 Conductive Layer 1213 Encapsulation Layer 1215 Connector 1215a Connector 1215b Connector 1217 Spacer 1230 Light Emitting Element 1231 Lower Electrode 1233 EL Layer 1235 Upper Electrode 1240 Transistor 1250 Light Receiving Element 1255 Insulating Layer 1257 Light Shielding Layer 1259 Coloring Layer 1261 Insulating Layer 1270 Conductive Layer 1271 p-Type Semiconductor Layer 1272 Conductive Layer 1273 i-Type Semiconductor Layer 1274 Conductive Layer 1275 n-Type Semiconductor Layer 1276 Insulating Layer 1278 Insulating Layer 1280 Conductive Layer 1281 Conductive Layer 1283 Conductive Layer 1291 Insulating Layer 1292 Conductive Particles 1293 Insulating Layer 1294 Conductive Layer 1295 Insulating layer 1296 Conductive layer 1301 Substrate for manufacturing 1303 Release layer 1305 Substrate for manufacturing 1307 Release layer 1310a Conductive layer 1310b Conductive layer 9600 Tablet terminal 9625 Switch 9626 Switch 9627 Power switch 9628 Operation switch 9629 Fastener 9630 Housing 9630a Housing 9630b Housing 9631 Display unit 9632 Touch sensor area 9633 Solar cell 9634 Charge and discharge control circuit 9635 Battery 9636 DCDC converter 9637 Converter 9638 Operation key 9639 Base material

Claims

1. A flexible display panel, a first housing that supports a first region of the display panel, a second housing that supports a second region of the display panel, and a flexible base material fixed to the first housing, wherein the display panel is deformable between a deployed state in which the first region and the second region are located in substantially the same plane and a folded state in which the first region and the second region overlap, the second housing has a groove portion in which a part of the flexible base material is slidable, in the deployed state, a part of the flexible base material is inserted into the groove portion, and in the deformation operation to the folded state, at least a part of the flexible base material inserted into the groove portion is pulled out. A semiconductor device.

2. The semiconductor device according to claim 1, wherein in the folded state, the flexible base material is bent so as to have a curved surface.

3. A flexible display panel, a first housing that supports a first region of the display panel, a second housing that supports a second region of the display panel, a first flexible base material fixed to the first housing, and a second flexible base material fixed to the first housing, wherein the display panel is deformable between a deployed state in which the first region and the second region are located in substantially the same plane and a folded state in which the first region and the second region overlap, the first flexible base material is provided on the display surface side of the display panel, the second flexible base material is provided on the side opposite to the display surface of the display panel, the second housing has a first groove portion in which a part of the first flexible base material is slidable and a second groove portion in which a part of the second flexible base material is slidable, in the deployed state, a part of the first flexible base material is inserted into the first groove portion, and a part of the second flexible base material is inserted into the second groove portion, and in the deformation operation to the folded state, at least a part of the first flexible base material inserted into the first groove portion is pulled out, and at least a part of the second flexible base material inserted into the second groove portion is pulled out. A semiconductor device.

4. A flexible display panel, a first housing that supports a first region of the display panel, a second housing that supports a second region of the display panel, A first flexible substrate fixed to the first housing; A second flexible substrate fixed to the second housing; The display panel is deformable between a deployed state in which the first region and the second region are located in substantially the same plane, and a folded state in which the first region and the second region overlap; The first flexible substrate is provided on the display surface side of the display panel; The second flexible substrate is provided on the side opposite to the display surface of the display panel; The first housing has a first groove portion in which a part of the second flexible substrate is slidable; The second housing has a second groove portion in which a part of the first flexible substrate is slidable; In the deployed state, a part of the first flexible substrate is inserted into the second groove portion, and a part of the second flexible substrate is inserted into the first groove portion; In the operation of deforming to the folded state, at least a part of the first flexible substrate inserted into the second groove portion is pulled out, and at least a part of the second flexible substrate inserted into the first groove portion is pulled out. A semiconductor device.

5. In claim 3 or 4, In the folded state, the first flexible substrate and the second flexible substrate are each bent so as to have a curved surface. A semiconductor device.

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