Transport device and transport method

Abstract

To easily and reliably transport a minute solder ball to a predetermined place or a predetermined position.SOLUTION: A transport device 1 comprises: a container 2 that has a support surface 13 onto which a plurality of micro solder balls sb are mounted; a vacuum chuck 4 having a holding surface 35 that captures and holds micro solder balls sb jumping off the support surface 13 of the container 2; a driving mechanism 6 that can move the vacuum chuck 4 in at least two or more directions; a container oscillation mechanism 3 that applies oscillation to the container 2; and a vacuum chuck oscillation mechanism 5 that applies oscillation to the vacuum chuck 4. On the support surface 13 and the holding surface 35, there are a plurality of grooves having a depth that is less than a diameter of the micro solder ball sb. In the holding surface 35, a plurality of vacuum holes 36 each having an inner diameter less than the diameter of the micro solder ball sb is further formed.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to the conveyance of solder balls, and particularly to the conveyance of solder balls having a diameter of 100 μm or less.

Background Art

[0002] Metal members may be joined using solder formed into a spherical shape (hereinafter referred to as "solder ball"). For example, an electrode provided on a substrate and a wire may be joined using a solder ball. More specifically, an electrode provided on a substrate mounted on an electronic device and a lead wire may be joined using a solder ball having a diameter of 100 μm or less (see Patent Document 1).

[0003] When joining an electrode and a wire using a solder ball, the solder ball is conveyed onto the substrate and placed on the electrode provided on the surface of the substrate. Thereafter, the end of the wire is placed on the solder ball disposed on the electrode. Next, the solder ball is heated and melted. That is, the solder ball is reflowed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Microscopic solder balls having a diameter of 100 μm or less are very small and light. For this reason, solder balls are likely to aggregate with each other due to static electricity or the like, or adhere to peripheral members. As a result, it is not easy to reliably convey a predetermined number of microscopic solder balls to a predetermined place or position.

[0006] Therefore, it is desired to enable easy and reliable conveyance of microscopic solder balls to a predetermined place or position.

Means for Solving the Problem

[0007] A conveying device according to an embodiment conveys solder balls having a diameter of 100 μm or less. This conveying device includes a container having a support surface on which a plurality of the solder balls are placed, a vacuum chuck having a holding surface for capturing and holding the solder balls that have bounced up from the support surface of the container, a drive mechanism capable of moving the vacuum chuck in at least two or more directions, a container vibration mechanism for applying vibration to the container, and a vacuum chuck vibration mechanism for applying vibration to the vacuum chuck. Then, a plurality of grooves having a depth less than the diameter of the solder balls are formed on the support surface and the holding surface. A plurality of suction holes having an inner diameter less than the diameter of the solder balls are further formed on the holding surface.

[0008] A conveying method according to an embodiment is a conveying method for conveying solder balls having a diameter of 100 μm or less. This conveying method includes a first vibration application step of applying vibration to a container having a support surface on which a plurality of the solder balls are placed to make the plurality of solder balls bounce up from the support surface, a holding step of bringing a vacuum chuck having a holding surface formed with a plurality of suction holes having an inner diameter less than the diameter of the solder balls close to the container and sucking the solder balls that have bounced up from the support surface into the suction holes, a second vibration application step of applying vibration to the vacuum chuck to shake off unnecessary solder balls, and a mounting step of moving the vacuum chuck and arranging the solder balls adsorbed to the respective suction holes on a predetermined electrode. And a plurality of grooves having a depth less than the diameter of the solder balls are formed on the support surface and the holding surface.

Advantages of the Invention

[0009] According to the present invention, minute solder balls can be easily and surely conveyed to a predetermined place or position.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3A

Figure 3B

Figure 4A

Figure 4B

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0011] Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings. In all the drawings for explaining the embodiment, the same or substantially the same configurations and elements are denoted by the same reference numerals. Also, for the configurations and elements once described, repeated explanations will not be given in principle.

[0012] <Overview of the Transport Device> FIG. 1 is a schematic diagram showing the configuration of a transport device 1 according to the present embodiment. The transport device 1 according to the present embodiment includes a container 2, a container vibration mechanism 3, a vacuum chuck 4, a vacuum chuck vibration mechanism 5, a drive mechanism 6, and the like.

[0013] The transfer device 1 holds solder balls with a diameter of 100 μm or less (hereinafter referred to as "micro solder balls sb") accommodated in the container 2 and moves them above the substrate which is the destination of transfer. Further, the transfer device 1 places the micro solder balls sb moved above the substrate on the electrodes provided on the surface of the substrate. The micro solder balls sb placed on the electrodes are temporarily fixed to the electrodes by the viscosity of the flux previously applied to the electrodes.

[0014] <Container> The container 2 includes a rectangular bottom 11 and four side walls 12 rising from each side of the bottom 11. In other words, the container 2 is a rectangular box with an open top.

[0015] A plurality of micro solder balls sb are accommodated in the container 2. The micro solder balls sb accommodated in the container 2 are supported by the inner surface 13 of the bottom and surrounded by the inner surface 14 of the side walls.

[0016] That is, the inner surface 13 of the bottom of the container 2 is a support surface on which a plurality of micro solder balls sb are placed. Therefore, in the following description, the inner surface 13 of the bottom may be referred to as "support surface 13".

[0017] <Container vibration mechanism> The container vibration mechanism 3 includes a container support base 21 that supports the container 2 and a vibration generator 22. The container support base 21 includes a top plate portion 23 on which the container 2 is placed and leg portions 24 extending downward from the four corners of the top plate portion 23.

[0018] The vibration generator 22 is disposed on the back side of the top plate portion 23 (the side opposite to the side on which the container 2 is placed). The vibration generator 22 applies vibration to the container 2 placed on the top plate portion 23.

[0019] More specifically, the vibration generator 22 includes an ultrasonic vibrator and can apply vibration with a frequency of 25 KHz or more and 60 KHz or less to the container 2. In the present embodiment, vibration with a frequency of 40 KHz is applied to the container 2.

[0020] When vibration is applied to the container 2, the minute solder balls sb inside the container 2 jump up from the support surface 13. Viewed another way, the minute solder balls sb inside the container 2 float (separate) from the support surface 13 by intermittent pushing up.

[0021] However, the minute solder balls sb are surrounded by the inner surface 14 of the side wall of the container 2. Therefore, the minute solder balls sb that have floated (separated) from the support surface 13 do not jump out of the container 2, nor do they scatter around the container 2.

[0022] Viewed another way, the frequency and amplitude of the vibration applied by the vibration generator 22 to the container 2 are set such that the minute solder balls sb inside the container 2 float (separate) from the support surface 13 while not jumping over the side wall 12.

[0023] Note that the components of the vibration applied by the vibration generator 22 to the container 2 are not particularly limited, but from the viewpoint of efficiently causing the minute solder balls sb to jump up, it is preferable that they contain a large amount of vertical components (longitudinal components).

[0024] <Vacuum chuck> The vacuum chuck 4 includes a chamber 31, a vacuum generator 32, and a hose 33 connecting the chamber 31 and the vacuum generator 32. Further, a plurality of suction holes 36 are formed in the bottom surface 35 of the chamber 31.

[0025] When the vacuum generator 32 operates, the air inside the chamber 31 is sucked into the vacuum generator 32 through the hose 33, and the inside of the chamber 31 is depressurized. As a result, a force (suction force) that attracts surrounding objects to the bottom surface 35 of the chamber 31 is generated.

[0026] At this time, if minute solder balls sb are present near the bottom surface 35 of the chamber 31, the minute solder balls sb are attracted to the bottom surface 35. More specifically, the minute solder balls sb are attracted to the respective suction holes 36 formed in the bottom surface 35 of the chamber 31.

[0027] However, the inner diameter of each suction hole 36 is less than the diameter of the micro solder ball sb. Specifically, the diameter of the micro solder ball sb is 35 μm, while the inner diameter of the suction hole 36 is 20 μm.

[0028] Therefore, the micro solder ball sb attracted to the suction hole 36 adheres to the edge of the suction hole 36 without passing through the suction hole 36. That is, the micro solder ball sb is adsorbed to each suction hole 36 formed on the bottom surface 35 of the chamber 31.

[0029] Viewed from another perspective, the bottom surface 35 of the chamber 31 in which a plurality of suction holes 36 to which the micro solder ball sb is adsorbed are formed is a holding surface for capturing and holding the micro solder ball sb. Therefore, in the following description, the bottom surface 35 may sometimes be referred to as the "holding surface 35".

[0030] <Vacuum chuck vibration mechanism> The vacuum chuck vibration mechanism 5 includes a chamber fixing base 41 to which the chamber 31 is fixed and a vibration generator 42.

[0031] The vacuum chuck vibration mechanism 5 is disposed above the chamber 31 (the side opposite to the side where the holding surface 35 is provided). The vibration generator 42 applies vibration to the vacuum chuck 4. More specifically, the vibration generator 42 includes an ultrasonic vibrator and can apply vibration with a frequency of 25 KHz or more and 60 KHz or less to the chamber 31 via the chamber fixing base 41. In this embodiment, vibration with a frequency of 40 KHz is applied to the chamber 31.

[0032] When vibration is applied to the chamber 31, unnecessary micro solder balls sb are shaken off from the chamber 31. For example, the micro solder balls sb adhering to the holding surface 35 or other micro solder balls sb adhering to the micro solder balls sb adsorbed to the suction holes 36 are shaken off.

[0033] <Drive mechanism> The drive mechanism 6 includes a rail 51 and an actuator 52, and enables the vacuum chuck 4 to move in at least two or more directions. More specifically, the drive mechanism 6 enables the chamber 31 to move at least in the vertical direction and the horizontal direction.

[0034] The actuator 52 moves the chamber fixing base 41 along the rail 51, thereby moving the chamber 31 in the longitudinal direction of the rail 51. In other words, the rail 51 guides the movement of the chamber fixing base 41 and the chamber 31 by the actuator 52.

[0035] The actuator 52 moves the chamber 31 to approach or separate the chamber 31 from the container 2 or a substrate (not shown). For example, the actuator 52 moves the chamber 31 downward to approach the container 2 and moves it upward to separate it from the container 2.

[0036] Also, the actuator 52 moves the chamber 31 rightward or forward to approach a substrate (not shown) and moves it leftward or backward to separate it from the substrate (not shown). Further, the actuator 52 moves the chamber 31 downward to approach the surface of a substrate (not shown) and moves it upward to separate it from the surface of the substrate (not shown).

[0037] However, the moving direction for approaching or separating the chamber 31 from the substrate is appropriately selected or changed according to the positional relationship between the transfer device 1 and the substrate.

[0038] Furthermore, in another embodiment, the drive mechanism 6 moves the chamber 31 obliquely or rotates it.

[0039] <Roughening> The support surface 13 of the container 2 and the holding surface 35 of the vacuum chuck 4 are roughened to prevent or suppress the adhesion of the fine solder balls sb. FIG. 2(a) is a plan view schematically showing the inner surface 13 of the bottom of the container 2. FIG. 2(b) is a cross-sectional view of the container 2 taken along line A-A in FIG. 2(a), and FIG. 2(c) is a cross-sectional view of the container 2 taken along line B-B in FIG. 2(a).

[0040] On the inner surface (support surface) 13 of the bottom of the container 2, a plurality of vertical grooves 61 and horizontal grooves 62 that are orthogonal to each other are formed at equal pitches. In the following description, when the vertical grooves 61 and the horizontal grooves 62 are not particularly distinguished, these are collectively referred to as "grooves 60". That is, a plurality of grooves 60 are formed in a lattice pattern on the support surface 13 of the container 2.

[0041] In addition, in FIG. 2, a dot pattern is attached to any one vertical groove 61 and horizontal groove 62. However, this dot pattern is attached for the purpose of clarifying the vertical groove 61 and the horizontal groove 62, and the dot pattern is not actually attached to the surfaces of the actual vertical groove 61 and horizontal groove 62.

[0042] The grooves 60 are formed on the support surface 13 by laser irradiation on the support surface 13. Therefore, the depth D of the grooves 60 can be adjusted by the intensity of the laser light, the irradiation time, and the like.

[0043] However, from the viewpoint of preventing or suppressing the adhesion of the fine solder balls sb, it is preferable that the depth D of the grooves 60 is less than the diameter of the fine solder balls sb. Furthermore, according to the results of the comparative tests conducted by the inventor of the present invention, it has been confirmed that when the depth D of the grooves 60 is 40% or more of the diameter of the fine solder balls sb, the adhesion of the fine solder balls sb is sufficiently prevented. The details of this comparative test will be described again later.

[0044] Therefore, in the present embodiment where the diameter of the fine solder balls sb is 35 μm, the depth D of the grooves 60 is set to be 18 μm or more and 20 μm or less.

[0045] Note that the groove 60 formed on the holding surface 35 of the vacuum chuck 4 is the same as or substantially the same as the groove 60 shown in FIGS. 2(a) to 2(c). That is, on the holding surface 35 of the vacuum chuck 4, vertical grooves 61 and horizontal grooves 62 with a depth D of 18 μm or more and 20 μm or less are formed at equal pitches.

[0046] <Conveying method> Next, an example of a method for conveying the micro solder balls sb using the conveying device 1 having the above configuration will be described. More specifically, a method for conveying the micro solder balls sb onto a substrate and disposing them on electrodes provided on the surface of the substrate will be described. However, the conveyance destination of the micro solder balls sb is not limited to the substrate, and the placement location of the micro solder balls sb is not limited to the electrodes.

[0047] The conveying method according to the present embodiment includes at least a first vibration step, a holding step, a second vibration step, a mounting step, and a releasing step.

[0048] FIG. 3A is an explanatory diagram showing the first vibration step, and FIG. 3B is an explanatory diagram showing the holding step. FIG. 4A is an explanatory diagram showing the second vibration step, and FIG. 4B is an explanatory diagram showing the mounting step. FIG. 5 is an explanatory diagram showing the releasing step.

[0049] ≪First vibration step≫ The first vibration step shown in FIG. 3A is a step of causing the micro solder balls sb to bounce from the support surface 13. Specifically, the vibration generator 22 shown in FIG. 1 is operated to apply vibration with a frequency of 25 KHz or more and 60 KHz or less to the container 2. More specifically, vibration with a frequency of 40 KHz is applied to the container 2.

[0050] When vibration is applied to the container 2, a plurality of micro solder balls sb bounce from the support surface 13. That is, a plurality of micro solder balls sb bounce inside the container 2. At this time, since the support surface 13 is roughened, the micro solder balls sb are easily separated from the support surface 13. As a result, the micro solder balls sb bounce reliably and sufficiently.

[0051] ≪Holding step≫ The holding process shown in FIG. 3B is a process of capturing and holding the bouncing solder balls sb by the vacuum chuck 4. Specifically, while the vibration generator 22 shown in FIG. 1 is operating, the vacuum generator 32 is operated to reduce the pressure inside the chamber 31. Further, the drive mechanism 6 is operated to move the chamber 31 downward. That is, the holding surface 35 of the vacuum chuck 4 is brought close to the support surface 13 of the container 2.

[0052] Then, the bouncing solder balls sb that have bounced up from the support surface 13 are attracted to the suction holes 36 provided on the holding surface 35 and adsorbed to the respective suction holes 36. That is, in the holding process, the solder balls sb are captured and held in the air.

[0053] Then, the vibration generator 22 is stopped to end the holding process. When the holding process ends, unnecessary solder balls sb adhere to the holding surface 35 due to static electricity or the like. Also, unnecessary solder balls sb adhere to the solder balls sb adsorbed to the suction holes 36.

[0054] ≪Second vibration process≫ The second vibration process shown in FIG. 4A is a process of shaking off unnecessary solder balls sb. Specifically, while the vacuum generator 32 shown in FIG. 1 is continuously operating, the vibration generator 42 is operated to apply vibrations with a frequency of 25 KHz or more and 60 KHz or less to the chamber 31. More specifically, vibrations with a frequency of 40 KHz are applied to the chamber 31.

[0055] When vibrations are applied to the chamber 31, the unnecessary solder balls sb are shaken off from the chamber 31. At this time, since the holding surface 35 is roughened, the solder balls sb are easily separated from the holding surface 35. As a result, the removal of the unnecessary solder balls sb is carried out quickly and surely.

[0056] ≪Mounting process≫ The mounting process shown in FIG. 4B is a process of placing the micro solder balls sb held by the vacuum chuck 4 on a predetermined electrode 90. Specifically, while stopping the vibration generator 42 shown in FIG. 1, the vacuum generator 32 continues to operate. Further, the drive mechanism 6 is operated to move the chamber 31 from above the container 2 to above the substrate 91 provided with the electrodes 90.

[0057] Note that on the holding surface 35, the same number of suction holes 36 as the electrodes 90 provided on the substrate 91 are formed at the same pitch as the electrodes 90. Therefore, when the chamber 31 is moved to a predetermined position above the substrate 91, the positions of the respective micro solder balls sb held on the holding surface 35 coincide with the positions of the corresponding respective electrodes 90.

[0058] Viewed another way, the layout (number, position, pitch, etc.) of the suction holes 36 on the holding surface 35 coincides with the layout (number, position, pitch, etc.) of the electrodes 90 on the substrate 91.

[0059] Returning to the description of the mounting process. After moving the chamber 31 to a predetermined position above the substrate 91, the chamber 31 is moved downward. That is, the chamber 31 is brought close to the surface of the substrate 91 provided with the electrodes 90, and the micro solder balls sb are placed on the predetermined electrodes 90. Note that a flux 92 is previously applied to each electrode 90.

[0060] ≪Release process≫ The release process shown in FIG. 5 is a process of temporarily fixing the micro solder balls sb placed on the electrodes 90 to the electrodes 90. Specifically, after placing the micro solder balls sb on the electrodes 90, the holding of the electrodes 90 is released. More specifically, the vacuum generator 32 shown in FIG. 1 is stopped, and the chamber 31 is opened to the atmosphere. Then, the drive mechanism 6 is operated to move the chamber 31 upward.

[0061] Then, the minute solder balls sb placed on the electrode 90 in the previous process (mounting process) stay on the electrode 90 due to the viscosity of the flux 92. That is, the minute solder balls sb are temporarily fixed to the electrode 90 by the viscosity of the flux 92. Looking at it another way, the chamber 31 retracts upward while leaving the minute solder balls sb on the electrode 90.

[0062] Through the above steps, a predetermined number of minute solder balls sb are transported and arranged on a predetermined electrode 90 on a predetermined substrate 91.

[0063] <Comparative Test> Next, a comparative test conducted by the inventor of the present invention to confirm the effect of roughening the support surface 13 and the holding surface 35 will be described. FIG. 6 is a table showing the conditions and results of this test.

[0064] In this test, four samples (No. 1 to No. 4) having substantially the same surface as the support surface 13 and the holding surface 35 were prepared. Further, grooves substantially the same as the groove 60 formed on the support surface 13 and the holding surface 35 were formed on the surfaces of the samples No. 1 to No. 4, respectively.

[0065] However, the grooves formed in the samples No. 1 to No. 4 have different depths from each other. In other words, there are no differences in the samples No. 1 to No. 4 other than the depth of the grooves formed on the surface.

[0066] Specifically, the depth of the groove formed on the surface of the sample No. 1 is 18.952 μm. Similarly, the depth of the groove formed on the surface of the sample No. 2 is 18.269 μm, the depth of the groove formed on the surface of the sample No. 3 is 9.534 μm, and the depth of the groove formed on the surface of the sample No. 4 is 3.879 μm.

[0067] An approximately equal number (approximately equal amount) of minute solder balls (diameter 35 μm) were placed on the surfaces of the samples No. 1 to No. 4 in which the grooves of the above depths were formed, and these samples No. 1 to No. 4 were vibrated under the same conditions. Then, the samples No. 1 to No. 4 were tilted by about 22 degrees, and the number (amount) of minute solder balls remaining on the surface was visually confirmed.

[0068] Note that the number (quantity) of the fine solder balls placed on the surfaces of Sample Nos. 1 to 4 is about half of a medicine spoon having a size of about ear scraping. More specifically, at the tip of a medicine spoon with an area of about 19 mm 2 (ellipse with a major axis of about 6 mm and a minor axis of about 4 mm), a quantity (about 0.04 ml) of fine solder balls with a bulk height of about 2 mm was scooped up and placed on the surfaces of Sample Nos. 1 to 4. Also, the vibration frequency and the vibration application time are as described in the table of FIG. 6.

[0069] As a result of this test, it was confirmed that in Sample Nos. 1 and 2 where the groove depth was 40% or more of the diameter of the fine solder balls, the remaining number of the fine solder balls was significantly smaller than that in Sample Nos. 3 and 4 where the groove depth was less than 40% of the diameter of the fine solder balls.

[0070] Specifically, the remaining number of the fine solder balls in Sample No. 1 was about 10, and the remaining number of the fine solder balls in Sample No. 2 was about 100. On the other hand, in Sample Nos. 3 and 4, a large number of the fine solder balls remained.

[0071] The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof. For example, in the holding step shown in FIG. 3B, vibration may be applied to the chamber 31. In another view, the holding step and the second vibration application step may be executed simultaneously and in parallel.

[0072] Also, in the releasing step shown in FIG. 5, the pressure in the chamber 31 may be increased. By pressurizing the inside of the chamber 31, even when the viscosity of the flux 92 is low, the fine solder ball sb can be surely detached from the holding surface 35 (suction hole 36).

[0073] The material and structure of the container 2 and the chamber 31 are not particularly limited, but it is preferable that they have good vibration transmission efficiency and are made of materials and structures that are difficult to charge. From this perspective, examples of the material of the container 2 and the chamber 31 include metals and ceramics.

[0074] The inner diameter of the suction hole 36 can be changed according to the diameter of the target fine solder ball sb. Also, the layout (number, position, pitch, etc.) of the suction holes 36 on the holding surface 35 can be changed according to the layout (number, position, pitch, etc.) of the electrodes 90 on the substrate 91.

[0075] However, the use of the fine solder balls transported using the transport device and transport method of the present invention is not limited to the joining of electrodes and electric wires.

Explanation of reference numerals

[0076] 1... transport device, 2... container, 3... container vibration mechanism, 4... vacuum chuck, 5... vacuum chuck vibration mechanism, 6... drive mechanism, 11... bottom, 12... side wall, 13... inner surface of the bottom (support surface), 14... inner surface of the side wall, 21... container support base, 22... vibration generator, 23... top plate part, 24... leg, 31... chamber, 32... vacuum generator, 33... hose, 35... bottom surface, 35... holding surface, 36... suction hole, 41... chamber fixing base, 42... vibration generator, 51... rail, 52... actuator, 60... groove, 61... vertical groove, 62... horizontal groove, 90... electrode, 91... substrate, 92... flux, sb... fine solder ball

Claims

1. A conveying device for conveying solder balls with a diameter of 100 μm or less, comprising: a container having a support surface on which a plurality of the solder balls are placed; a vacuum chuck having a holding surface for capturing and holding the solder balls that have bounced up from the support surface of the container; a drive mechanism capable of moving the vacuum chuck in at least two directions; a container vibration mechanism for applying vibration to the container; a vacuum chuck vibration mechanism for applying vibration to the vacuum chuck, and a plurality of grooves having a depth less than the diameter of the solder balls are formed on the support surface and the holding surface, A conveying device, wherein a plurality of suction holes having an inner diameter less than the diameter of the solder balls are further formed on the holding surface.

2. The conveying device according to claim 1, wherein the groove has a depth of 40% or more of the diameter of the solder ball.

3. The conveying device according to claim 2, wherein the depth of the groove is 18 μm or more and 20 μm or less.

4. The container vibration mechanism applies vibration with a frequency of 25 kHz or more and 60 kHz or less to the container, The conveying device according to claim 1, wherein the vacuum chuck vibration mechanism applies vibration with a frequency of 25 kHz or more and 60 kHz or less to the vacuum chuck.

5. The conveying device according to claim 1, wherein the same number of suction holes as the electrodes provided on the substrate, which is the conveyance destination of the solder balls, are formed on the holding surface at the same pitch as the electrodes.

6. A conveying method for conveying solder balls with a diameter of 100 μm or less, comprising: a first vibration application step of applying vibration to a container having a support surface on which a plurality of the solder balls are placed to bounce up the plurality of solder balls from the support surface; a holding step of bringing a vacuum chuck having a holding surface formed with a plurality of suction holes having an inner diameter less than the diameter of the solder balls close to the container and sucking the solder balls that have bounced up from the support surface into the suction holes; a second vibration application step of applying vibration to the vacuum chuck to shake off unnecessary solder balls; a mounting step of moving the vacuum chuck and arranging the solder balls adsorbed in the respective suction holes onto a predetermined electrode, and A conveying method, wherein a plurality of grooves having a depth less than the diameter of the solder balls are formed on the support surface and the holding surface.

7. The conveying method according to claim 6, wherein the groove has a depth of 40% or more of the diameter of the solder ball.

8. The conveying method according to claim 7, wherein the depth of the groove is 18 μm or more and 20 μm or less.

9. In the first vibration application step, vibrations with a frequency of 25 kHz or more and 60 kHz or less are applied to the container. The conveying method according to claim 6, wherein in the second vibration application step, vibrations with a frequency of 25 kHz or more and 60 kHz or less are applied to the vacuum chuck.

10. Further including a release step performed after the mounting step. In the release step, by releasing the holding of the solder ball by the vacuum chuck, the solder ball is temporarily fixed to the electrode by the viscosity of the flux pre-applied to the electrode. The conveying method according to claim 6.

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