Ground structure of interface component and electronic device

Abstract

To provide a ground structure of an interface component which enables a housing and the interface component to contact with each other through a sufficient area by means of a conductive gasket, and to provide an electronic component.SOLUTION: A ground structure of an interface component 25 includes a soft conductive gasket 40 which establishes electric continuity between an interface component 25 which is attached to a rear surface 21a of a panel 21 forming a housing 20 and exposed on the surface side and the panel 21. The ground structure of the interface component 25 has a fixing member 30 including at least a first surface 31 which extends so as to face the rear surface 21a of the panel 21, and a second surface 32 which extends from the rear surface 21a of the panel 21 to the interior of the housing 20 and faces the interface component 25. The conductive gasket 40 is arranged so as to be sandwiched between the second surface 32 and the interface component 25, and the first surface 31 and the panel 21 establish electric continuity.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a grounding structure of an interface component grounded to a housing of an electronic device and an electronic device including the same.

Background Art

[0002] In an electronic device, electrical components are grounded for noise reduction and electrostatic countermeasures. To ground the electrical components, conductive gaskets are widely used. A grounding structure using a conductive gasket forms the housing of the electronic device with a conductive material such as metal and disposes a conductive gasket between the housing and the electrical component.

[0003] As a specific grounding structure, for example, a structure in which a conductive gasket is attached to the back surface of a panel constituting the housing of the electronic device and an electrical component attached to the panel is arranged to contact the conductive gasket, or a structure in which a conductive gasket is arranged between a substrate on which the electrical component is arranged and the housing. Examples of the grounding structure in which the electrical component and the housing are electrically connected using a conductive gasket include those described in Patent Document 1.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An interface component for connecting to an external device is provided in the housing of the electronic device. The interface component is fixed to the back side of the panel constituting the housing and exposed to the front side through an opening provided in the panel. In order to ground the interface component, a sheet-like conductive gasket having an opening corresponding to the opening of the panel is attached to the back surface of the panel, and by attaching the interface component, a structure is known in which the interface component and the conductive gasket are in contact with each other. However, in this structure, it takes time to form an opening in the conductive gasket according to the position and shape of the interface component, and since it is necessary to accurately align the conductive gasket with the panel, the man-hours for forming the grounding structure have been increased. In addition, since the conductive gasket is not sandwiched between the interface component and the housing, there is a possibility that the conductive gasket and the interface component may not be in sufficient contact. The same problem also occurs when grounding is performed using a finger formed of a metal leaf spring instead of the conductive gasket.

[0006] Therefore, a structure in which a conductive gasket is sandwiched between the interface component and the panel can be considered. However, since the area of the surface of the interface component on the panel side that is exposed to the front side of the panel is large and the area facing the back surface of the panel is small, it may be difficult to secure an area for sandwiching the conductive gasket, and it may be difficult to adopt such a structure.

[0007] The present invention has been made in view of the above problems, and an object thereof is to provide a grounding structure for an interface component and an electronic device capable of bringing the housing and the interface component into contact with each other through a sufficient area by a conductive gasket.

Means for Solving the Problems

[0008] To solve the above problems, the grounding structure of the interface component according to the present invention is a grounding structure of an interface component including a flexible conductive elastic body that electrically connects an interface component attached to the back surface of a panel constituting a housing and exposed on the front surface side and the panel, the grounding structure having a fixing member including at least a first surface extending so as to face the back surface of the panel and a second surface extending from the back surface of the panel toward the inside of the housing and facing the interface component, the conductive elastic body being disposed so as to be sandwiched between the second surface and the interface component, and the first surface and the panel being electrically connected.

[0009] Also, in the grounding structure of the interface component according to the present invention, the first surface of the fixing member is in electrical connection with the panel by being fixed in contact with the back surface of the panel.

[0010] Also, in the grounding structure of the interface component according to the present invention, the first surface of the fixing member is in electrical connection with the panel by having a panel contact conductive elastic body sandwiched between the first surface and the back surface of the panel.

[0011] Also, in the grounding structure of the interface component according to the present invention, the interface component has an image projected onto a plane parallel to the panel having a longitudinal direction and a lateral direction, and the second surface of the fixing member extends in a direction parallel to the longitudinal direction of the interface component and in a direction from the back surface of the panel toward the inside of the housing, respectively.

[0012] Also, in the grounding structure of the interface component according to the present invention, a plurality of the interface components are arranged in parallel along one direction, and at least one of the plurality of interface components has a different end position in a direction orthogonal to the one direction and the direction from the back surface of the panel toward the inside of the housing from the other interface components, and the conductive elastic body disposed on the second surface has a concavo-convex shape so as to be in contact with the plurality of interface components at the end positions, respectively.

[0013] In addition, in the grounding structure of the interface component according to the present invention, a plurality of the interface components are arranged on the same substrate provided inside the housing, and the fixing component is fixed to the substrate.

[0014] In addition, in the grounding structure of the interface component according to the present invention, a plurality of the interface components are arranged in parallel along one direction, and at least one of the plurality of interface components has a different position at one end in a direction orthogonal to the one direction and the direction from the back surface of the panel into the housing. The conductive elastic body has a surface that contacts a plurality of the interface components whose positions at one end in a direction orthogonal to the one direction and the direction from the back surface of the panel into the housing are different within the elastic deformation range of the conductive elastic body.

[0015] In addition, the electronic device according to the present invention includes the grounding structure of any of the interface components.

Advantages of the Invention

[0016] According to the grounding structure of the interface component and the electronic device according to the present invention, the conductive elastic body is sandwiched between the second surface of the mounting member extending in the direction from the panel into the housing and the interface component to conduct the two, so that a sufficient area of contact between the conductive elastic body and the interface component can be ensured. Therefore, the interface component can be reliably grounded. In addition, since the conductive elastic body conducts the two by being sandwiched between the second surface along the depth direction of the interface component and the interface component, processing according to the shape of the opening is not required, and accurate alignment of the conductive elastic body is not required, and the interface component can be grounded by a simple operation.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0018] Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a perspective view of an electronic device 10 having a grounding structure for an interface component according to the present embodiment. The type of the electronic device 10 is not particularly limited, but the electronic device 10 in the present embodiment is a CPU unit arranged in a disaster prevention display device constituting a fire alarm system. In the drawings of the present application, a part of the electrical components (including the electrical components mounted on the substrate 50) arranged inside the electronic device 10 is omitted.

[0019] The electronic device 10 has a box-shaped housing 20, and a large number of electrical components are arranged inside the housing 20. The housing 20 has a front panel 21 facing the front side. The housing 20 including the front panel 21 is formed of a conductive metal. Therefore, by electrically connecting the electrical components arranged inside the housing 20 to the housing 20 including the front panel 21, the electrical components can be grounded.

[0020] An interface component 25 is attached and fixed to the front panel 21 from the back surface 21a side. The interface component 25 is a component for connecting an external device to the electronic device 10, and is attached so that the front side is exposed on the front surface side of the front panel 21. Further, a substrate 50 on which electrical components are placed is provided in the housing 20, and a plurality of interface components described later are also arranged at an end of the substrate 50 on the front panel 21 side.

[0021] The grounding structure of the interface component 25 attached and fixed to the front panel 21 will be described. As shown in FIG. 2, the front panel 21 has an opening 23 for exposing the interface component 25. A mounting member 30 is fixed to the back surface 21a of the front panel 21 in the vicinity of the opening 23. The mounting member 30 extends so as to face the back surface 21a of the front panel 21, and includes a first surface 31 that is screwed and fixed to the front panel 21, and a second surface 32 that extends in a direction from the back surface 21a of the front panel 21 toward the inside of the housing 20. The first surface 31 is electrically connected to the front panel 21 by being screwed and fixed to the front panel 21. The second surface 32 is arranged so as to face the bottom surface of the interface component 25 fixed to the front panel 21.

[0022] A conductive gasket 40 is arranged on the second surface 32 of the mounting member 30 as a conductive elastic body. The conductive gasket 40 has an outer skin made of a conductive fiber or a metal foil on the outer surface of a sponge-like core material formed of polyurethane or the like, and is formed as an elastically deformable and flexible member. The conductive gasket 40 arranged on the mounting member 30 is formed to have an elongated rectangular parallelepiped shape.

[0023] As shown in FIG. 3, the interface component 25 can be attached to the front panel 21 with the conductive gasket 40 disposed on the second surface 32 of the attachment member 30. The interface component 25 has a longitudinal direction and a short-side direction in an image projected onto a plane parallel to the front panel 21. The second surface 32 of the attachment member 30 extends in a direction parallel to the longitudinal direction of the interface component 25. Therefore, the second surface 32 can secure a large area facing the interface component 25, and can increase the area of conduction with the interface component 25 via the conductive gasket 40.

[0024] As shown in FIG. 4, by attaching the interface component 25 to the front panel 21, the conductive gasket 40 is sandwiched between the second surface 32 of the attachment member 30 and the interface component 25 and deformed so as to be crushed, and comes into contact with both. As described above, since the attachment member 30 and the front panel 21 are electrically connected, the interface component 25 and the front panel 21 are electrically connected via the conductive gasket 40 and the attachment member 30, and the interface component 25 can be grounded.

[0025] Since the conductive gasket 40 is sandwiched between the second surface 32 of the attachment member 30 extending in the direction from the front panel 21 toward the inside of the housing 20 and the interface component 25 to electrically connect the two, a sufficient area where the conductive gasket 40 contacts the interface component 25 can be secured. Therefore, the interface component 25 can be reliably grounded. Further, since the conductive gasket 40 is sandwiched between the second surface 32 along the depth direction of the interface component 25 and the interface component 25 to electrically connect the two, processing according to the shape of the opening 23 is not required, and accurate alignment of the conductive gasket 40 is not required, and the interface component 25 can be grounded by a simple operation.

[0026] Next, the grounding structure of the interface component using the second mounting member 35 will be described. As shown in FIG. 5, the second mounting member 35 has a first surface 36 that extends so as to face the back surface 21a of the front panel 21, and a second surface 37 that extends in a direction from the back surface 21a of the front panel 21 toward the inside of the housing 20. The second surface 37 faces a plurality of interface components 26, 27, 28, 29, which will be described later, when the second mounting member 35 is fixed to the substrate 50.

[0027] As shown in FIG. 6, a first conductive gasket 42 is disposed and fixed on the second surface 37 of the second mounting member 35. The first conductive gasket 42 has a rectangular parallelepiped shape. The first conductive gasket 42 can be fixed to the second surface 37 with a conductive adhesive or the like. The first conductive gasket 42 is disposed at one end of the side of the second surface 37 closest to the back surface 21a of the front panel 21.

[0028] As shown in FIG. 7, a second conductive gasket 43 is disposed and fixed adjacent to the first conductive gasket 42 on the second surface 37 of the second mounting member 35. The second conductive gasket 43 has a rectangular parallelepiped shape with a greater height and width than the first conductive gasket 42. The second conductive gasket 43 can be fixed to the second surface 37 with a conductive adhesive or the like. The second conductive gasket 43 is disposed so as to be aligned with the first conductive gasket 42 without a gap on the second surface 37. Thereby, an uneven shape in the height direction is formed by the first conductive gasket 42 and the second conductive gasket 43.

[0029] A panel contact conductive gasket 45 is disposed and fixed on the first surface 36 of the second mounting member 35. The panel contact conductive gasket 45 has an elongated rectangular parallelepiped shape. The panel contact conductive gasket 45 is disposed so as to be sandwiched between the first surface 36 and the back surface 21a of the front panel 21 when the second mounting member 35 is attached to the substrate 50.

[0030] As shown in FIG. 8, a first interface component 26, a second interface component 27, a third interface component 28, and a fourth interface component 29 are arranged side by side along one direction at one end of a substrate 50. Among the first interface component 26, in the height direction from the substrate 50, the highest end position is the upper surface 26a. Among the second interface component 27, in the height direction from the substrate 50, the highest end position is the upper surface 27a. Among the third interface component 28, in the height direction from the substrate 50, the highest end position is the upper surface 28a. Among the fourth interface component 29, in the height direction from the substrate 50, the highest end position is the upper surface 29a. Note that the height direction of each interface component from the substrate 50 corresponds to a direction orthogonal to the one direction in which the interface components are arranged side by side and the direction from the back surface 21a of the front panel 21 toward the inside of the housing 20.

[0031] The upper surface 27a of the second interface component 27, the upper surface 28a of the third interface component 28, and the upper surface 29a of the fourth interface component 29 have the same height position in the height direction from the substrate 50, and the upper surface 26a of the first interface component 26 has a higher height position in the height direction from the substrate 50 than the upper surfaces of the other interface components. That is, at least one of the plurality of interface components has a different height position in the height direction of the upper surface from the other interface components. The upper surface of each interface component is planar. However, the upper surface of the interface component may have a shape other than planar.

[0032] The second mounting member 35 is fixedly mounted on the substrate 50 via the spacer 52. As shown in FIG. 9, when the second mounting member 35 is fixed to the substrate, the first conductive gasket 42 and the second conductive gasket 43 respectively contact the upper surfaces 26a, 27a, 28a, 29a of the plurality of interface components 26, 27, 28, 29 due to the uneven shape. Thereby, all of the plurality of interface components 26, 27, 28, 29 are electrically connected to the second mounting member 35. Further, the panel contact conductive gasket 45 of the second mounting member 35 is sandwiched between the first surface 36 and the back surface 21a of the front panel 21 and contacts both of them. For this reason, the first surface 36 and the front panel 21 are electrically connected. By these, all of the plurality of interface components 26, 27, 28, 29 are grounded via the first conductive gasket 42, the second conductive gasket 43, the second mounting member 35, and the panel contact conductive gasket 45.

[0033] Thus, in the grounding structure of the interface component using the second mounting member 35, by providing an uneven shape in the conductive gasket disposed on the second surface 37, the conductive gaskets can be brought into contact with a plurality of interface components having different heights respectively, and they can be grounded together. Therefore, compared with the case where a plurality of interface components are grounded individually, the man-hours for providing the grounding structure can be reduced.

[0034] In the present embodiment, the first conductive gasket 42 and the second conductive gasket 43 having different heights are adjacently arranged on the second mounting member 35 to form uneven shapes at different height positions, but it may be processed so that an uneven shape is provided in one conductive gasket.

[0035] In the present embodiment, the upper surfaces 27a of the second interface component 27, the upper surfaces 28a of the third interface component 28, and the upper surfaces 29a of the fourth interface component 29 that contact the second conductive gasket 43 have the same height position in the height direction from the substrate 50, but as long as it is within the range that can be absorbed by the elastic deformation of the second conductive gasket 43, there may be a difference in the height direction position.

[0036] If the height direction position from the substrate 50 is within the elastic deformation range of the second conductive gasket 43, for a plurality of interface components with different height direction positions, one surface of one conductive gasket (in the case of providing a plurality of surfaces with different heights by providing uneven shapes on one conductive gasket, any one of the surfaces) can be brought into contact and grounded collectively. Therefore, compared with the case of preparing conductive gaskets with different heights for each of a plurality of interface components whose height direction positions are different within the elastic deformation range of the conductive gasket, man-hours can be reduced.

[0037] In the present embodiment, a plurality of interface components with different heights are arranged on the substrate 50 having the same height position in the plane direction, so that the height direction positions of the upper surfaces of the interface components are arranged to be different. However, a plurality of interface components with the same height or different heights may be arranged at different height positions in the plane direction so that the height direction positions of the upper surfaces of the interface components are different. Also in this case, by providing an uneven shape on the conductive gasket so as to be in contact with the upper surfaces of the plurality of interface components respectively, the conductive gasket and the interface components can be surely brought into contact.

[0038] In the present embodiment, a plurality of interface components are arranged side by side along the horizontal direction, but they may be arranged side by side along other directions such as the vertical direction. In this case, if the end positions of the interface components in the direction perpendicular to the direction in which the interface components are arranged side by side and the direction from the back surface 21a of the front panel 21 toward the inside of the housing 20 are different, by providing an uneven shape on the conductive gasket and attaching the second attachment member 35 from the direction perpendicular to the direction in which the interface components are arranged side by side, the conductive gasket can be brought into contact with a plurality of interface components with different end positions.

[0039] As described above, the embodiments of the present invention have been explained. However, the application of the present invention is not limited to these embodiments, and it can be variously applied within the scope of its technical idea. In this embodiment, the front panel 21 and the interface component 25 are electrically connected. However, other panels constituting the housing 20 and the interface component 25 may be electrically connected. Further, in this embodiment, the housing 20 is formed of a conductive metal. However, the housing 20 itself may not have conductivity, and a conductive portion may be provided on the back surface of the panel constituting the housing 20, and the conductive gasket 40 may be brought into contact with this conductive portion. In this embodiment, the conductive elastic body is the conductive gasket 40. However, the conductive elastic body may have other configurations such as fingers formed of a metal leaf spring.

Explanation of Reference Numerals

[0040] 10 Electronic device 20 Housing 21 Front panel 21a Back surface 23 Opening 25 Interface component 26 First interface component 27 Second interface component 28 Third interface component 29 Fourth interface component 30 Mounting member 31 First surface 32 Second surface 35 Second mounting member 36 First surface 37 Second surface 40 Conductive gasket 42 First conductive gasket 43 Second conductive gasket 45 Panel contact conductive gasket 50 Substrate

Claims

1. An interface component grounding structure comprising a flexible conductive elastomer that electrically connects an interface component attached to the back surface of a panel constituting a housing and exposed on the front surface side to the panel, having a fixing member including at least a first surface extending so as to face the back surface of the panel and a second surface extending in a direction from the back surface of the panel toward the inside of the housing and facing the interface component, wherein the conductive elastomer is disposed so as to be sandwiched between the second surface and the interface component, and an interface component grounding structure in which the first surface and the panel are electrically connected.

2. The interface component grounding structure according to claim 1, wherein the first surface of the fixing member is fixed in contact with the back surface of the panel, thereby being electrically connected to the panel.

3. The interface component grounding structure according to claim 1, wherein a panel contact conductive elastomer is sandwiched between the first surface of the fixing member and the back surface of the panel, thereby being electrically connected to the panel.

4. The projection of the interface component onto a plane parallel to the panel has a longitudinal direction and a lateral direction, and the second surface of the fixing member extends in a direction parallel to the longitudinal direction of the interface component and in a direction from the back surface of the panel toward the inside of the housing, respectively, according to any one of claims 1 to 3. The grounding structure of the interface component described.

5. A plurality of the interface components are arranged in parallel along one direction, and at least one of the plurality of interface components has a different end position in a direction orthogonal to the one direction and a direction from the back surface of the panel toward the inside of the housing from the other interface components, and the conductive elastomer disposed on the second surface has an uneven shape so as to be in contact with the plurality of interface components at the end positions, respectively, according to any one of claims 1 to 3. The grounding structure of the interface component described.

6. The plurality of interface components are arranged on the same substrate provided inside the housing, and the fixing component is fixed to the substrate. The grounding structure of the interface component according to claim 5.

7. The interface components are arranged in parallel in a plurality along one direction, and at least one of the plurality of interface components has a different position at one end in a direction orthogonal to the other interface components, the one direction, and the direction from the back surface of the panel toward the inside of the housing. The grounding structure of the interface component according to any one of claims 1 to 3, wherein the conductive elastic body has a surface that contacts a plurality of the interface components that are different within an elastically deformable range of the conductive elastic body at one end position in a direction orthogonal to the one direction and the direction from the back surface of the panel toward the inside of the housing.

8. An electronic device including the grounding structure of the interface component according to any one of claims 1 to 3.

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