Semiconductor device handling apparatus and semiconductor device testing apparatus

Abstract

To provide a semiconductor device handling apparatus for testing a semiconductor device comprising an electronic circuit and an optical circuit.SOLUTION: A handler 50 moves a DUT 100 to bring a terminal 11 arranged on a lower surface 102 of the DUT 100 into contact with a contact 22 of a socket 20. The handler 50 comprises a pusher 60 that holds an upper surface 101 of the DUT 100. The pusher 60 comprises a second transmission unit 70 that transmits signals between an optical connection part 112 arranged on the upper surface 101 of the DUT 100 and a first transmission unit 30. The second transmission unit 70 inputs and outputs optical signals S2, S3 to and from the optical connection part 112.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a semiconductor device handling apparatus for handling a device under test (DUT) having an electronic circuit and an optical circuit, and a semiconductor device test apparatus for testing the DUT described above.

Background Art

[0002] An electronic component test apparatus including a tester for testing a DUT and a handler for pressing the DUT against a socket attached to the tester is known (see, for example, Patent Document 1). This electronic component test apparatus tests the electrical characteristics of the DUT by inputting and outputting test signals to and from the DUT electrically connected to the tester via the socket.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above-described electronic component test apparatus has a problem that it can only test electronic components and cannot test a semiconductor device having an optical circuit in addition to an electronic circuit.

[0005] The problem to be solved by the present invention is to provide a semiconductor device handling apparatus and a semiconductor device test apparatus for testing a semiconductor device having an electronic circuit and an optical circuit.

Means for Solving the Problems

[0006] [1]Aspect 1 of the present invention is a semiconductor device handling apparatus that moves a DUT and brings into contact a terminal disposed on a first surface of the DUT with a contact portion of a tester. The semiconductor device handling apparatus includes a holding portion that holds a second surface of the DUT. The holding portion includes a second transmission portion that transmits a signal between an optical connection portion disposed on the second surface of the DUT and a first transmission portion of the tester. The second transmission portion is a semiconductor device handling apparatus that inputs and outputs an optical signal to and from the optical connection portion.

[0007] [2]Aspect 2 of the present invention is the semiconductor device handling apparatus according to Aspect 1, wherein the second transmission portion may be a semiconductor device handling apparatus that inputs and outputs an optical signal to and from the first transmission portion.

[0008] [3]Aspect 3 of the present invention is the semiconductor device handling apparatus according to Aspect 1 or 2, wherein the second transmission portion includes a first optical transmission portion that receives a first optical signal from the first transmission portion and emits a second optical signal to the optical connection portion, and a second optical transmission portion that receives a third optical signal from the optical connection portion and emits a fourth optical signal to the first transmission portion.

[0009] [4]Aspect 4 of the present invention is the semiconductor device handling apparatus according to Aspect 3, wherein the holding portion includes a main body portion having a facing surface facing the second surface of the DUT. The first optical transmission portion includes a first incident portion that receives the first optical signal. The second optical transmission portion includes a first emission portion that emits the fourth optical signal. The first incident portion and the first emission portion may be disposed on the facing surface so as to face the first transmission portion.

[0010] [5]Aspect 5 of the present invention is the semiconductor device handling apparatus according to Aspect 3 or 4, wherein the holding unit includes a main body portion having a facing surface facing the second surface of the DUT, the second light transmission unit includes a second incident portion for receiving the third optical signal, the first light transmission unit includes a second emission portion for emitting the second optical signal, and the second incident portion and the second emission portion may be disposed on the facing surface so as to face the optical connection portion.

[0011] [6]Aspect 6 of the present invention is the semiconductor device handling apparatus according to any one of Aspects 3 to 5, wherein the first light transmission unit has a first optical transmission path capable of transmitting an optical signal between the first incident portion and the second emission portion, and the second light transmission unit has a second optical transmission path capable of transmitting an optical signal between the second incident portion and the first emission portion.

[0012] [7]Aspect 7 of the present invention is the semiconductor device handling apparatus according to any one of Aspects 3 to 6, wherein the first light transmission unit further includes a first incident portion for receiving the first optical signal, and a first lens disposed between the first transmission unit and the first incident portion and collecting the first optical signal to the first incident portion.

[0013] [8]Aspect 8 of the present invention is the semiconductor device handling apparatus according to any one of Aspects 3 to 7, wherein the second light transmission unit further includes a first emission portion for emitting the fourth optical signal, and a second lens disposed between the first transmission unit and the first emission portion and making the fourth optical signal emitted from the first emission portion into parallel light.

[0014] [9]Aspect 9 of the present invention is the semiconductor device handling apparatus according to any one of Aspects 1 to 8, wherein the second transmission unit is separated from the first transmission unit when the holding unit brings the terminal into contact with the contact portion.

[0015]

[10] Aspect 10 of the present invention is a semiconductor device handling apparatus according to any one of Aspects 1 to 6, wherein the second transmission part is in contact with the first transmission part when the holding part is bringing the terminal into contact with the contact part. The semiconductor device handling apparatus may also be such.

[0016]

[11] Aspect 11 of the present invention is a semiconductor device handling apparatus according to any one of Aspects 1 to 10, wherein the holding part includes a main body part having an opposing surface opposing the second surface of the DUT, and a suction holding mechanism that opens to the opposing surface and holds the DUT by suction. The semiconductor device handling apparatus may also be such.

[0017]

[12] Aspect 12 of the present invention is a semiconductor device handling apparatus according to any one of Aspects 1 to 11, wherein the semiconductor device handling apparatus further includes a contact arm that holds the holding part and relatively moves the holding part with respect to the contact part, and the holding part is detachably held at the tip of the contact arm. The semiconductor device handling apparatus may also be such.

[0018]

[13] Aspect 13 of the present invention is a semiconductor device test apparatus for testing a DUT, including a semiconductor device handling apparatus according to any one of Aspects 1 to 12, and a tester for testing the DUT. The tester includes a contact part for inputting and outputting an electrical signal to and from the terminal, and a first transmission part for inputting and outputting a signal to and from the second transmission part. The semiconductor device test apparatus is such.

[0019]

[14] Aspect 14 of the present invention is a semiconductor device test apparatus for testing a DUT, comprising the semiconductor device handling apparatus of Aspect 7 and a tester for testing the DUT, wherein the tester comprises a contact portion for inputting and outputting an electrical signal to and from the terminals, and a first transmission portion for inputting and outputting a signal to and from the second transmission portion, and the first transmission portion further comprises a third emission portion for emitting the first optical signal to the first incidence portion, and a fourth lens disposed between the second transmission portion and the third emission portion for collimating the first optical signal emitted from the third emission portion. The semiconductor device test apparatus may be such a semiconductor device test apparatus.

[0020]

[15] Aspect 15 of the present invention is a semiconductor device test apparatus for testing a DUT, comprising the semiconductor device handling apparatus of Aspect 8 and a tester for testing the DUT, wherein the tester comprises a contact portion for inputting and outputting an electrical signal to and from the terminals, and a first transmission portion for inputting and outputting a signal to and from the second transmission portion, and the first transmission portion further comprises a third incidence portion for receiving the fourth optical signal from the first emission portion, and a third lens disposed between the second transmission portion and the third incidence portion for focusing the fourth optical signal onto the third incidence portion. The semiconductor device test apparatus may be such a semiconductor device test apparatus.

[0021]

[16] Aspect 16 of the present invention is a semiconductor device test apparatus according to any one of Aspects 13 to 15, wherein the contact portion includes a socket disposed on a test head, and the socket comprises a contact for contacting the terminals and the first transmission portion disposed so as to be located outside the contact. The semiconductor device test apparatus may be such a semiconductor device test apparatus.

Advantages of the Invention

[0022] In the present invention, since signals can be transmitted between the optical connection portion of the DUT and the first transmission portion of the tester by the second transmission portion, a semiconductor device handling apparatus and a semiconductor device test apparatus for testing a semiconductor device provided with an electronic circuit and an optical circuit can be provided.

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0024] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0025] Figure 1 is a diagram showing the overall configuration of the semiconductor device test apparatus 1 in the present embodiment. Figure 2 is a cross-sectional view showing part II of Figure 1, and is a cross-sectional view showing the state before pressing the DUT 100 against the socket 20. Figure 3 is a cross-sectional view showing part II of Figure 1, and is a cross-sectional view showing the state after pressing the DUT 100 against the socket 20. Figure 4 is a bottom view showing the socket 20 in the present embodiment. Figure 5 is a plan view showing the pusher 60 according to an embodiment of the present invention. For ease of understanding, in Figure 2, the DUT 100 is shown separated from the pusher 60, but in actuality, the DUT 100 is held by the pusher 60, so the DUT 100 is in contact with the pusher 60.

[0026] The semiconductor device test apparatus 1 in this embodiment is an apparatus for testing the DUT 100. As shown in FIG. 1, this semiconductor device test apparatus 1 includes a tester 10 and a handler 50. This handler 50 corresponds to an example of the "semiconductor device handling device" in the aspect of the present invention.

[0027] The DUT 100 that is the test object of the semiconductor device test apparatus 1 is a semiconductor device capable of handling electrical signals and optical signals. That is, this DUT 100 is a composite circuit device including an electronic circuit and an optical circuit.

[0028] Specifically, as shown in FIG. 2, the DUT 100 in this embodiment includes a substrate 110 and an IC chip 120. Although not particularly limited as a specific example of the substrate 110, a wiring board such as an interposer can be exemplified.

[0029] This substrate 110 has a plurality of terminals 111 and an optical connection portion 112. The terminals 111 are provided on the lower surface 102 of the substrate 110. As shown in FIG. 3, the terminals 111 are electrically connected to the contacts 22 of the socket 20 by contacting the contacts 22. Thereby, the DUT 100 is electrically connected to the test head 13 (described later) of the tester 10. The terminals 111 are used to input an electrical signal from the test head 13 to the electronic circuit of the DUT 100 and output an electrical signal from the electronic circuit to the test head 13. Further, the lower surface 102 corresponds to an example of the "first surface" in the aspect of the present invention.

[0030] As shown in FIG. 2, the optical connection part 112 is provided on the upper surface 101 of the substrate 110. As shown in FIG. 3, the optical connection part 112 is used to input and output optical signals to and from the DUT 100. Although not particularly limited, in the present embodiment, when the terminal 111 is in contact with the contact 22, the optical connection part 112 is separated from the second transmission unit 70 (described later). Although not particularly limited, specific examples of this optical connection part 112 can include devices equipped with grating couplers and the like. Alternatively, the optical connection part 112 may be an optical socket or an optical connector that can input and output light and can be connected to an optical fiber or the like. Note that the optical connection part 112 may be in contact with the second transmission unit 70 when the terminal 111 is in contact with the contact 22. Also, the upper surface 101 corresponds to an example of the "second surface" in the aspect of the present invention.

[0031] Although not particularly shown, between the optical connection part 112 and the substrate 110, there is an optical module equipped with an optical circuit having a function of converting an optical signal into an electrical signal and a function of converting an electrical signal into an optical signal. In this optical module, the optical signal input from the optical connection part 112 is converted into an electrical signal and output to the substrate 110, while the electrical signal input from the substrate 110 is converted into an optical signal and output to the optical connection part 112.

[0032] The IC chip 120 is mounted on the upper surface 101 of the substrate 110. The type of this IC chip 120 is appropriately changed according to the design of the DUT 100. Although not particularly limited as an example, ASIC (Application Specific Integrated Circuit) and the like can be exemplified. The IC chip 120 has terminals 121 and is electrically connected to the substrate 110 through the terminals 121.

[0033] When testing the DUT100, an electrical signal is input to and output from the DUT100 via the terminal 111, and an optical signal is input to and output from the DUT100 via the optical connection unit 112. When this test is completed, for example, the optical fiber connected to the optical connector is connected to the optical connection unit 112 to form the final product. This final product is, for example, a CPO (Co-Packaged Optics) device.

[0034] Note that the DUT100 to be tested by the semiconductor device test apparatus 1 of the present embodiment is not limited to the above. For example, the DUT100 may include an interposer having the terminal 111 and a die mounted on this interposer. The die is a bare die (bare chip) formed by dicing a semiconductor wafer and includes an optical connection unit 112 for inputting and outputting an optical signal.

[0035] Alternatively, the DUT100 may be a bare die having the terminal 111 and the optical connection unit 112. That is, the DUT100 to be tested may be a single die before being mounted on a substrate. Alternatively, the DUT100 may form part of a semiconductor wafer. That is, each DUT100 of the semiconductor wafer on which a plurality of DUT100s are formed may be the test target. Each semiconductor wafer may have, for example, the terminal 111 on the lower surface and the optical connection unit 112 on the upper surface.

[0036] The tester (test apparatus main body) 10 is a test apparatus that tests the DUT100 using an electrical signal and an optical signal. As shown in FIG. 1, it includes a main frame (tester main body) 11, a cable 12, a test head 13, a socket 20, and a load board (performance board) 40 (see FIG. 2). Note that the socket 20 corresponds to an example of the "contact portion" in the form of the present invention.

[0037] The main frame 11 is, for example, a computer that executes a program, and communicates with each test module (pin electronics card) (not shown) in the test head 13 according to the program to control each test module.

[0038] The test head 13 is connected to the main frame 11 via the cable 12. This test head 13 houses a test module for testing the DUT 100 inside. Each test module generates a test signal in response to an instruction from the main frame 11 and outputs the test signal to the DUT 100.

[0039] The test module in this embodiment can transmit and receive an electrical signal as a test signal to and from the electronic circuit of the DUT 100 via the load board 40 and the socket 20. Further, this test module can transmit and receive an optical signal as a test signal to and from the optical connection portion 112 via the first transmission unit 30 and the second transmission unit 70. The tester 10 can test the DUT 100 by using this test module to transmit and receive electrical signals and optical signals.

[0040] As shown in FIGS. 2 to 4, the socket 20 includes a socket body 21, a plurality of contacts 22, and a first transmission unit 30. The socket body 21 is fixed to the upper surface of the test head 13 via the load board 40. The contacts 22 are held by the socket body 21.

[0041] The contacts 22 are electrically connected to the load board 40 disposed on the upper surface of the test head 13. Further, the contacts 22 are also electrically connected to the DUT 100 by contacting the terminals 111 of the DUT 100. An electrical signal as a test signal is input to the DUT 100 via the contacts 22. In this embodiment, pogo pins are used as the contacts 22, but other than pogo pins may be used as the contacts 22. For example, as the contacts 22, a cantilever type probe needle, an anisotropic conductive rubber sheet, or a membrane type contact in which bumps are formed on an insulating film may be used.

[0042] A first transmission unit 30 is provided in the socket body 21 in this embodiment. The first transmission unit 30 in this embodiment transmits a first optical signal S1 as a test signal to a second transmission unit 70 (described later) during the test of the DUT 100, and receives a fourth optical signal S4 as an output signal emitted from the second transmission unit 70. Note that the first transmission unit 30 corresponds to an example of the "first transmission unit" in the aspect of the present invention, and the second transmission unit 70 corresponds to an example of the "second transmission unit" in the aspect of the present invention.

[0043] This first transmission unit 30 is disposed outside the contact 22 in the socket 20. For this reason, the first transmission unit 30 faces the second transmission unit 70 and does not face the DUT 100. This first transmission unit 30 transmits an optical signal between the tester 10 and the second transmission unit 70 when the pusher 60 brings the terminal 111 of the DUT 100 into contact with the socket 20.

[0044] The first transmission unit 30 includes a first optical fiber 31, a first parallelization unit 32, a first condensing unit 33, and a second optical fiber 34. Note that the first optical fiber 31 corresponds to an example of the "third emission unit" in the aspect of the present invention, and the second optical fiber 34 corresponds to an example of the "third incident unit" in the aspect of the present invention.

[0045] As shown in FIGS. 2 and 3, the first optical fiber 31 is disposed inside a first holding hole 21a formed in the socket body 21 and is held in the first holding hole 21a. The first holding hole 21a penetrates the socket body 21 in the thickness direction, and the first optical fiber 31 also extends along the thickness direction of the socket body 21.

[0046] The first optical fiber 31 optically connects the first transmission unit 30 and the tester 10. During the test of the DUT 100, this first optical fiber 31 emits, from the emission end face (upper end face), a first optical signal S1 as a test signal output by the tester 10 toward the second transmission unit 70. Although not particularly limited, the diameter of the first optical signal S1 emitted from the emission end face of the first optical fiber 31 gradually increases as it approaches the first collimation unit 32.

[0047] In the present embodiment, for example, the first optical fiber 31 and the second optical fiber 34 of the first transmission unit 30 may extend to the inside of the test head 13, and optical signals may be directly input and output from the test head 13. Alternatively, the first optical fiber 31 and the second optical fiber 34 of the first transmission unit 30 may extend to the inside of the test head 13 and the main frame 11, and optical signals may be directly input and output from the main frame 11. In these cases, the test head 13 or the main frame 11 may include a light emitting element that emits an optical signal as a test signal to the first optical fiber 31 and a light receiving element that receives an optical signal as an output signal from the second optical fiber 34, and may have a function of evaluating a test result based on the optical signal received by the light receiving element.

[0048] Note that the tester 10 may not have a function of testing the DUT 100 with an optical signal. In this case, an external measuring instrument having a function of testing the optical circuit of the DUT 100 may be connected to be able to exchange optical signals with the first and third optical fibers 31, 714 of the first transmission unit 30. This external measuring instrument is a test apparatus independent of the tester 10 and may be electrically connected to the tester 10, for example.

[0049] The first collimating unit 32 collimates the first optical signal S1 emitted from the first optical fiber 31. That is, the first collimating unit 32 is a collimator that makes the first optical signal S1 into parallel light. The first collimating unit 32 has a lens holding part 321 and a first collimating lens 322. Note that the first collimating lens 322 corresponds to an example of the "fourth lens" in the aspect of the present invention.

[0050] As shown in FIG. 4, the lens holding part 321 is provided on the upper surface of the socket main body 21. This lens holding part 321 has a cylindrical shape, and the first collimating lens 322 can be held in the space inside the lens holding part 321.

[0051] The first collimating lens 322 in the present embodiment is fitted inside the lens holding part 321. This first collimating lens 322 converts the first optical signal S1 emitted from the first optical fiber 31 into parallel light. The first collimating lens 322 is not particularly limited, and for example, a biconvex lens or the like can be exemplified. In this way, by converting the first optical signal S1 emitted from the first optical fiber 31 so as to have an enlarged diameter into parallel light by the first collimating lens 322, the first optical signal S1 can be made into parallel light with a large diameter, so that the tolerance of the positional deviation of the first optical signal S1 with respect to the third optical fiber 714 (described later) of the second transmission unit 70 can be increased.

[0052] As shown in FIG. 4, the first condensing unit 33 condenses the fourth optical signal S4 emitted from the fourth optical fiber 721 (described later) of the second transmission unit 70 onto the second optical fiber 34. That is, the first condensing unit 33 reduces the diameter of the fourth optical signal S4 and condenses the fourth optical signal S4 onto the second optical fiber 34. This first condensing unit 33 has a lens holding part 331 and a first condensing lens 332.

[0053] The lens holding part 331 is provided on the upper surface of the socket body 21. This lens holding part 331 has a cylindrical shape, and the first condenser lens 332 can be held in the space inside the lens holding part 331.

[0054] The first condenser lens 332 is fitted inside the lens holding part 331. This first condenser lens 332 collects the fourth optical signal S4 emitted from the fourth optical fiber 721 of the second transmission unit 70 onto the incident end face (upper end face) of the second optical fiber 34. The first condenser lens 332 is not particularly limited, and for example, a biconvex lens capable of condensing incident light can be exemplified. Thus, since the fourth optical signal S4 emitted toward the first condensing part 33 is condensed onto the incident end face of the second optical fiber 341 by the first condenser lens 332, the transmission loss of the fourth optical signal S4 can be suppressed.

[0055] The second optical fiber 34 is incident with the fourth optical signal S4 during the test of the DUT100. This second optical fiber 34 is arranged inside the second holding hole 21b formed in the socket body 21 and is held in the second holding hole 21b, similarly to the first optical fiber 31. The fourth optical signal S4 incident on the incident end face of the second optical fiber 34 propagates inside the second optical fiber 34 and is incident on the tester 10.

[0056] In this embodiment, the first transmission unit 30 is provided in the socket 20, but it is not limited thereto. The first transmission unit 30 may be provided separately from the socket 20, for example. In this case, the first transmission unit 30 may be provided separately from the socket 20 on the upper surface of the load board 40 or the upper surface of the test head 13, etc.

[0057] The load board 40 is mounted on the upper surface of the test head 13 and is electrically connected to the test head 13. A socket 20 is mounted on this load board 40. By pressing the DUT 100 against the socket 20 by the handler 50, the DUT 100 and the tester 10 are electrically connected via the socket 20 and the load board 40.

[0058] As shown in FIG. 1, the handler 50 includes a contact arm 51 and a pusher 60. Note that the pusher 60 corresponds to an example of the "holding part" in the form of the present invention.

[0059] The contact arm 51 is supported by a rail (not shown) provided in the handler 50. This contact arm 51 moves relative to the socket 20. Specifically, the contact arm 51 includes a horizontal movement actuator (not shown) and can move back and forth, left and right along the rail. In addition, this contact arm 51 includes a vertical drive actuator (not shown) and can move in the vertical direction.

[0060] The pusher 60 is detachably held at the lower end of the contact arm 51. Although not particularly limited, in the present embodiment, the pusher 60 is detachably fixed to the lower end of the contact arm 51 by a plurality of bolts 66.

[0061] As shown in FIGS. 2 and 3, the pusher 60 includes a pusher body 61, a suction pad 65, and a second transmission unit 70. Note that the pusher body 61 corresponds to an example of the "main body part" in the aspect of the present invention.

[0062] The pusher body 61 has a suction hole 611, a third holding hole 612, and a fourth holding hole 613. The suction hole 611 is a through hole that opens on the lower surface 61a of the pusher body 61. The lower surface 61a faces the upper surface 101 of the DUT 100. The suction hole 611 is connected to a vacuum pump (not shown), and the inside of the suction hole 611 is set to a negative pressure by this vacuum pump. Note that the lower surface 61a corresponds to an example of the "opposing surface" in the aspect of the present invention.

[0063] The third holding hole 612 is a through hole that opens at two locations on the lower surface 61a of the pusher body 61 and extends in a substantially U shape. The third holding hole 612 holds a third optical fiber 714, which will be described later. Similarly to the third holding hole 612, the fourth holding hole 613 is a through hole that opens at two locations on the lower surface 61a of the pusher body 61 and extends in a substantially U shape. The fourth holding hole 613 holds a fourth optical fiber 721, which will be described later.

[0064] On the lower surface 61a of the pusher body 61, a suction pad 65 is provided at a position corresponding to the suction hole 611. When the inside of this suction pad 65 is set to a negative pressure by a vacuum pump (not shown) via the suction hole 611, the suction pad 65 sucks and holds the upper surface 101 of the DUT 100. Note that the suction holding mechanism composed of the suction hole 611 and the suction pad 65 corresponds to an example of the "suction holding mechanism" in the present invention.

[0065] A second transmission unit 70 is provided on the pusher body 61. The second transmission unit 70 in the present embodiment transmits an optical signal between the first transmission unit 30 and the optical connection portion 112.

[0066] As shown in FIGS. 2, 3, and 5, this second transmission unit 70 includes a first optical transmission unit 71 and a second optical transmission unit 72. Note that the first optical transmission unit 71 corresponds to an example of the "first optical transmission portion" in the aspect of the present invention, and the second optical transmission unit 72 corresponds to an example of the "second optical transmission portion" in the aspect of the present invention.

[0067] When testing the DUT100, the first optical transmission unit 71 receives the first optical signal S1 from the first optical fiber 311 of the first transmission unit 30 and emits the second optical signal S2 to the optical connection unit 112. The first optical transmission unit 71 includes a second condensing unit 711 and a third optical fiber 714. Note that the third optical fiber 714 corresponds to an example of the "first incident portion", the "first optical transmission path", and the "second emission portion" in the aspect of the present invention.

[0068] The second condensing unit 711 is disposed between the first transmission unit 30 and the third optical fiber 714, and condenses the first optical signal S1 converted into parallel light by the first collimating lens 322 onto the incident end face 714a (see FIG. 5) of the third optical fiber 714. That is, the second condensing unit 711 reduces the diameter of the first optical signal S1 and condenses the first optical signal S1 onto the incident end face 714a of the third optical fiber 714. The second condensing unit 711 has a lens holding unit 712 and a second condensing lens 713.

[0069] The lens holding unit 712 is provided on the lower surface 61a of the pusher body 61. The lens holding unit 712 has a cylindrical shape, and the second condensing lens 713 can be held in the space inside the lens holding unit 712.

[0070] The second condensing lens 713 is fitted inside the lens holding unit 712. The second condensing lens 713 is disposed between the first collimating lens 322 and the third optical fiber 714, and condenses the first optical signal S1 converted into parallel light by the first collimating lens 322 onto the third optical fiber 714. The second condensing lens 713 is not particularly limited, and examples thereof include a biconvex lens capable of condensing incident light. In this way, since the first optical signal S1 is condensed onto the incident end face 714a of the third optical fiber 714 by the second condensing lens 713, the transmission loss of the first optical signal S1 can be suppressed.

[0071] The third optical fiber 714 is provided inside the third holding hole 612. In this third optical fiber 714, the condensed first optical signal S1 is incident on the incident end face 714a facing the first optical fiber 31. This first optical signal S1 propagates inside the third optical fiber 714 and is emitted from the emission end face 714b (see FIG. 5) facing the optical connection portion 112 to the optical connection portion 112 as the second optical signal S2. Note that the second optical signal S2 in the present embodiment is the first optical signal S1 that has propagated inside the third optical fiber 714 and is the same optical signal as the first optical signal S1.

[0072] As shown in FIG. 5, the incident end face 714a is located outside the emission end face 714b on the lower surface 61a of the pusher body 61. The incident end face 714a of the third optical fiber 714 faces the first optical fiber 31 of the first transmission unit 30 (see FIGS. 2 to 4), while the emission end face 714b faces the optical connection portion 112 of the DUT 100.

[0073] Although not particularly limited, in order to oppose the incident end face 714a of the third optical fiber 714 and the first optical fiber 31 of the first transmission unit 30, the position of the pusher 60 may be mechanically positioned with respect to the socket 20. For example, a positioning pin (not shown) is provided on the pusher 60, a fitting hole corresponding to the positioning pin is provided in the socket 20, and when the DUT 100 is pressed against the socket 20 by the pusher 60, the positioning pin is fitted into the fitting hole, so that the relative positions of the pusher 60 and the socket 20 can be adjusted so that the incident end face 714a and the first optical fiber 31 face each other.

[0074] In addition, in order to oppose the emission end face 714b and the optical connection portion 112, although not particularly limited, when the DUT 100 is adsorbed by the pusher 60, for example, positioning may be performed using image processing. For example, the positions of the emission end face 714b and the optical connection portion 112 are detected by an imaging element such as a camera, and using the detected image, the relative positions of the pusher 60 and the DUT 100 can be adjusted so that the emission end face 714b and the optical connection portion 112 face each other.

[0075] Alternatively, although not particularly limited, the positional relationship between the emission end face 714b and the optical connection portion 112 may be recognized, for example, based on the intensity of the light output from the optical connection portion 112. For example, a positioning device including a light emitting element and a light receiving element can be used. Specifically, light is irradiated from the light emitting element of this positioning device toward the upper surface 101 of the DUT 100 via the third optical fiber 714 of the second transmission unit 70. Then, the light output from the optical connection portion 112 via the loopback circuit incorporated in the optical circuit of the DUT 100 is received by the light receiving element of the positioning device via the fourth optical fiber 721 of the second transmission unit 70. While performing this operation, the pusher 60 is moved by the contact arm 51 to scan the fourth optical fiber 721 along the upper surface 101 of the DUT 100. Then, the positioning device measures the intensity of the light output from the optical connection portion 112, and stops the movement of the contact arm 51 at a position where the intensity of the light becomes equal to or greater than a predetermined value, thereby positioning the emission end face 714b of the third optical fiber 714 with respect to the optical connection portion 112. Note that, thereby, the positioning between the incident end face 721a of the fourth optical fiber 721, which will be described later, and the optical connection portion 112 can be completed simultaneously.

[0076] As shown in FIGS. 2, 3, and 5, when the DUT 100 is being tested, the second optical transmission unit 72 receives the third optical signal S3 from the optical connection portion 112 of the DUT 100 and emits a fourth optical signal S4 to the second optical fiber 34 of the first transmission unit 30. The second optical transmission unit 72 includes a fourth optical fiber 721 and a second parallelization unit 722. Note that the fourth optical fiber 721 corresponds to an example of the "second incident portion", the "second optical transmission path", and the "first emission portion" in the embodiments of the present invention.

[0077] When the DUT 100 is being tested, the third optical signal S3 is incident on the incident end face 721a (see FIG. 5) of the fourth optical fiber 721 from the optical connection portion 112. The third optical signal S3 is an optical signal emitted by the DUT 100 in response to the electrical signal input from the tester 10 or the above-described second optical signal S2.

[0078] In this fourth optical fiber 721, the third optical signal S3 emitted from the optical connection portion 112 is incident on the incident end face 721a, and the incident third optical signal S3 propagates inside the fourth optical fiber 721. Then, the propagated third optical signal S3 is emitted from the emission end face 721b (see FIG. 5) as a fourth optical signal S4 to the second optical fiber 34. Although not particularly limited, the diameter of the fourth optical signal S4 emitted from the emission end face of the fourth optical fiber 721 gradually increases as it approaches the second collimation portion 722. Note that the fourth optical signal S4 in the present embodiment is the third optical signal S3 that has propagated inside the fourth optical fiber 721 and is the same optical signal as the third optical signal S3.

[0079] As shown in FIG. 5, the incident end face 721a of the fourth optical fiber 721 is located inside the emission end face 721b on the lower surface 61a of the pusher body 61. The incident end face 721a faces the optical connection portion 112 of the DUT 100 (see FIGS. 2 to 4), while the emission end face 721b faces the second optical fiber 34 of the first transmission unit 30. The incident end face 721a and the optical connection portion 112 can be opposed to each other by the above-described positioning method based on image processing or light intensity, etc., and the emission end face 721b and the second optical fiber 34 can be opposed to each other by the above-described mechanical positioning.

[0080] As shown in FIGS. 2, 3, and 5, the second collimation portion 722 collimates the fourth optical signal S4 emitted from the fourth optical fiber 721. This second collimation portion 722 includes a lens holding portion 723 and a second collimating lens 724. Note that the second collimating lens 724 corresponds to an example of the "second lens" in the aspect of the present invention.

[0081] The lens holding portion 723 is provided on the lower surface 61a of the pusher body 61. This lens holding portion 321 has a cylindrical shape, and the second collimating lens 724 can be held in the space inside the lens holding portion 723.

[0082] In the present embodiment, the second collimating lens 724 is fitted inside the lens holding portion 723. The second collimating lens 724 converts the fourth optical signal S4 emitted from the fourth optical fiber 721 into parallel light. The second collimating lens 724 is not particularly limited, and for example, a biconvex lens or the like can be exemplified. Thus, since the second collimating lens 724 can make the fourth optical signal S4 into parallel light with a large diameter, the tolerance of the positional deviation of the fourth optical signal S4 with respect to the second optical fiber 34 of the first transmission unit 30 can be increased.

[0083] In the semiconductor device test apparatus 1 according to the present embodiment as shown in FIGS. 2 and 3, although not particularly limited, the DUT 100 is tested by the following method. The handler 50 has a holding portion (not shown) such as a tray or a buffer, and the DUT 100 before the test is held in this holding portion. The contact arm 51 positions the pusher 60 with respect to the DUT 100 held in this holding portion using the alignment method using the above-described image processing or the alignment method based on the intensity of light, and the pusher 60 sucks and holds the DUT 100. At this time, the emission end face 714b of the third optical fiber 714 and the incident end face 721a of the fourth optical fiber 721 face the optical connection portion 112 of the DUT 100.

[0084] Next, the contact arm 51 moves the pusher 60 holding the DUT 100 above the socket 20 and lowers the pusher 60 toward the socket 20. Thereby, the terminal 111 of the DUT 100 comes into contact with the contact 22 of the socket 20. At this time, alignment of the DUT 100, the pusher 60, and the socket 20 is performed by the above-described mechanical alignment method or the like. Thereby, the upper end face (emission end face) of the first optical fiber 31 and the incident end face 714a of the third optical fiber 714 face each other, and the upper end face (emission end face) of the second optical fiber 34 and the emission end face 721b of the fourth optical fiber 721 face each other.

[0085] In this state, an electrical signal is input and output between the tester 10 and the DUT 100 via the contact 22 and the terminal 111, and an optical signal is input and output between the tester 10 and the DUT 100 via the first and second transmission units 30, 70 and the optical connection portion 112. In this way, by inputting and outputting both an electrical signal and an optical signal between the tester 10 and the DUT 100, the tester 10 tests the DUT 100.

[0086] With the semiconductor device test apparatus 1 as described above, the second transmission unit 70 can transmit a signal between the optical connection portion 112 of the DUT 100 and the first transmission unit 30 of the tester 10, so that it becomes possible to test the DUT 100 provided with an electronic circuit and an optical circuit. In particular, in the present embodiment, it becomes possible to test the DUT 100 having the terminal 111 disposed on the upper surface 101 of the DUT 100 and the optical connection portion 112 disposed on the lower surface 102 of the DUT 100.

[0087] Note that the embodiments described above are described to facilitate the understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

[0088] For example, in the above embodiment, an optical signal is transmitted between the tester 10 and the DUT 100 in a state where the first transmission unit 30 and the second transmission unit 70 are separated, but the present invention is not limited to this. The optical signal may be transmitted in a state where the first transmission unit 30 and the second transmission unit 70 are in contact with each other.

[0089] FIG. 6 is a cross-sectional view showing a portion corresponding to part II of FIG. 1 in another embodiment, and is a cross-sectional view showing a state before the DUT 100 is pressed against the socket 20. FIG. 7 is a cross-sectional view showing a portion corresponding to part II of FIG. 1 in another embodiment, and is a cross-sectional view showing a state after the DUT 100 is pressed against the socket 20.

[0090] As shown in FIGS. 6 and 7, the first transmission unit 30B includes first fitting portions 35, 35 each having a concave portion 35a around each of the first and second optical fibers 31, 34. The second transmission unit 70B may include second fitting portions 75, 75 each having a convex portion 75a around each of the third and fourth optical fibers 714, 721. That is, in the present embodiment, the first transmission unit 30B and the second transmission unit 70B are in contact with each other by the concave-convex fitting, so that the first optical fiber 31 and the third optical fiber 714 are in contact with each other, and the second optical fiber 34 and the fourth optical fiber 721 are in contact with each other. In this case, the first optical signal S1 and the fourth optical signal S4 are input and output at the contact end faces of the optical fibers.

[0091] Also, in the above embodiment, in the second transmission unit 70, the third and fourth optical fibers 714, 721 are bent in a substantially U shape to reverse the incident direction and the emission direction of the optical signal, but the present invention is not limited to this. For example, as shown in FIGS. 6 and 7, the incident direction and the emission direction of the optical signal may be controlled by reflecting the optical signal using mirrors 76, 77. Even when the optical fibers are in contact with each other as in the embodiments shown in FIGS. 6 and 7, the incident direction and the emission direction of the optical signal may be adjusted by bending the optical fibers in the second transmission unit 70 without using a mirror as in the embodiments shown in FIGS. 2 and 3.

[0092] Also, in the above embodiment, an optical signal is input and output between the first transmission unit 30 and the second transmission unit 70, but the present invention is not limited to this. An electrical signal may be input and output between the first transmission unit 30 and the second transmission unit 70. For example, the second transmission unit 70 may receive an electrical signal from the first transmission unit 30, convert the electrical signal into an optical signal by a photoelectric conversion element or the like, and emit the converted optical signal to the optical connection portion 112. Further, the second transmission unit 70 may receive an optical signal from the optical connection portion 112, convert the optical signal into an electrical signal by a photoelectric conversion element or the like, and output the converted electrical signal to the first transmission unit 30.

[0093] In the above embodiment, the case where the semiconductor device test apparatus 1 includes a pair of first transmission units 30 and second transmission units 70 has been illustrated, but the present invention is not limited thereto. When there are a plurality of input optical signals to the semiconductor device 100 and a plurality of output optical signals from the semiconductor device 100, etc., the semiconductor device test apparatus 1 may include a plurality of pairs of first transmission units 30 and second transmission units 70.

Explanation of Signs

[0094] 1…Semiconductor device test apparatus 10…Tester 11…Main frame 12…Cable 13…Test head 20…Socket 21…Socket body 21a, 21b…First and second holding holes 22…Contact 30, 30B…First transmission unit 31…First optical fiber 32…First parallelization unit 321…Lens holding part 322…First collimating lens 33…First condensing part 331…Lens holding part 332…First condensing lens 34…Second optical fiber 35…First fitting part 35a…Recessed part 40…Load board 50…Handler 51…Contact arm 60…Pusher 61…Pusher body 611…Suction hole 612, 613…Third and fourth holding holes 65…Adsorbing pad 66…Bolt 70, 70B…Second transmission unit 71…First optical transmission unit 711…Second condensing part 712…Lens holding part 713…Second condenser lens 714…Third optical fiber 72…Second optical transmission unit 721…Fourth optical fiber 722…Second collimation part 723…Lens holding part 724…Second collimating lens 75…Second fitting part 75a…Convex part 76, 77…Mirrors 100…Semiconductor device 101…Upper surface 102…Lower surface 110…Substrate 111…Terminal 112…Optical connection part 120…IC chip

Claims

1. A semiconductor device handling apparatus that moves a DUT and brings into contact a terminal disposed on a first surface of the DUT with a contact portion of a tester, wherein the semiconductor device handling apparatus includes a holding portion that holds a second surface of the DUT, the holding portion includes a second transmission portion that transmits a signal between an optical connection portion disposed on the second surface of the DUT and a first transmission portion of the tester, the second transmission portion is a semiconductor device handling apparatus that inputs and outputs an optical signal to and from the optical connection portion.

2. The semiconductor device handling apparatus according to Claim 1, wherein the second transmission portion is a semiconductor device handling apparatus that inputs and outputs an optical signal to and from the first transmission portion.

3. The semiconductor device handling apparatus according to Claim 1, wherein the second transmission portion includes a first optical transmission portion that is incident with a first optical signal from the first transmission portion and emits a second optical signal to the optical connection portion, and a second optical transmission portion that is incident with a third optical signal from the optical connection portion and emits a fourth optical signal to the first transmission portion.

4. The semiconductor device handling apparatus according to Claim 3, wherein the holding portion includes a main body portion having a facing surface facing the second surface of the DUT, the first optical transmission portion includes a first incident portion that is incident with the first optical signal, the second optical transmission portion includes a first emission portion that emits the fourth optical signal, and the first incident portion and the first emission portion are disposed on the facing surface so as to face the first transmission portion.

5. The semiconductor device handling apparatus according to Claim 4, wherein the second optical transmission portion includes a second incident portion that is incident with the third optical signal, the first optical transmission portion includes a second emission portion that emits the second optical signal, and the second incident portion and the second emission portion are disposed on the facing surface so as to face the optical connection portion.

6. The semiconductor device handling apparatus according to Claim 5, wherein the first optical transmission portion has a first optical transmission path capable of transmitting an optical signal between the first incident portion and the second emission portion, and the second optical transmission portion has a second optical transmission path capable of transmitting an optical signal between the second incident portion and the first emission portion.

7. The semiconductor device handling apparatus according to claim 3, wherein the first light transmission unit comprises a first incident unit to which the first optical signal is incident, and a first lens disposed between the first transmission unit and the first incident unit, for collecting the first optical signal at the first incident unit. The semiconductor device handling apparatus further comprises the first lens. **Claim 8** The semiconductor device handling apparatus according to claim 3, wherein the second light transmission unit comprises a first emission unit that emits the fourth optical signal, and a second lens disposed between the first transmission unit and the first emission unit, for making the fourth optical signal emitted from the first emission unit into parallel light. The semiconductor device handling apparatus further comprises the second lens. **Claim 9** The semiconductor device handling apparatus according to claim 1, wherein when the holding unit brings the terminal into contact with the contact unit, the second transmission unit is separated from the first transmission unit. The semiconductor device handling apparatus is provided. **Claim 10** The semiconductor device handling apparatus according to claim 1, wherein when the holding unit brings the terminal into contact with the contact unit, the second transmission unit is in contact with the first transmission unit. The semiconductor device handling apparatus is provided. **Claim 11** The semiconductor device handling apparatus according to claim 1, wherein the holding unit comprises a main body portion having a facing surface facing the second surface of the DUT, and an adsorption holding mechanism that opens on the facing surface and holds the DUT by adsorption. The semiconductor device handling apparatus comprises the adsorption holding mechanism. **Claim 12** The semiconductor device handling apparatus according to claim 1, wherein the semiconductor device handling apparatus further comprises a contact arm that holds the holding unit and relatively moves the holding unit with respect to the contact unit, and the holding unit is detachably held at the tip of the contact arm. The semiconductor device handling apparatus is provided. **Claim 13** A semiconductor device test apparatus for testing a DUT, comprising the semiconductor device handling apparatus according to any one of claims 1 to 12, and a tester for testing the DUT, wherein the tester comprises a contact unit for inputting and outputting an electrical signal to and from the terminal, and a first transmission unit for inputting and outputting a signal to and from the second transmission unit. The semiconductor device test apparatus is provided. **Claim 14** A semiconductor device test apparatus for testing a DUT, comprising the semiconductor device handling apparatus according to claim 7, A tester for testing the DUT, and the tester includes a contact part for inputting and outputting an electrical signal to and from the terminal, and a first transmission part for inputting and outputting a signal to and from the second transmission part, and the first transmission part includes a third emission part for emitting the first optical signal to the first incidence part, and a semiconductor device test apparatus further including a fourth lens disposed between the second transmission part and the third emission part for making the first optical signal emitted from the third emission part into parallel light.

15. A semiconductor device test apparatus for testing a DUT, comprising the semiconductor device handling apparatus according to claim 8, and a tester for testing the DUT, and the tester includes a contact part for inputting and outputting an electrical signal to and from the terminal, and a first transmission part for inputting and outputting a signal to and from the second transmission part, and the first transmission part includes a third incidence part for receiving the fourth optical signal from the first emission part, and a semiconductor device test apparatus further including a third lens disposed between the second transmission part and the third incidence part for collecting the fourth optical signal to the third incidence part.

16. The semiconductor device test apparatus according to claim 13, wherein the contact part includes a socket disposed on a test head, and the socket includes a contact for contacting the terminal, and the first transmission part disposed to be located outside the contact, and

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