Polishing device for membrane
The film polishing apparatus addresses surface roughness issues in semiconductor valves by employing a multi-assembly system for precise polishing, enhancing helium leak resistance and flow control in ALD diaphragm valves.
Patent Information
- Application Number
- JP2024049712
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-29
- Filing Date
- 2024-03-26
- Publication Date
- 2025-07-10
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The surface roughness requirements of membranes in semiconductor chip manufacturing valves are not met, leading to increased helium leakage and reduced service life, affecting the stability and flow control of etching gases.
A film polishing apparatus comprising a material feeding, polishing, clamping and moving, cleaning and recovery, and material supply assemblies, utilizing precise control systems and polishing wheels with adjustable polishing liquids to achieve high-precision polishing of concave and convex surfaces.
The apparatus achieves precise polishing, meeting roughness requirements, reducing helium leakage, and ensuring stable gas flow control in atomic deposition ALD diaphragm valves.
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Figure 2025105383000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductors, and particularly to a film polishing apparatus.
Background Art
[0002] In the past two years, due to the rise of the semiconductor industry in China, valves of different models and different applications are used in the equipment during semiconductor manufacturing. Especially during chip manufacturing, multiple types of toxic gases are used to etch wafers. During the transportation of toxic gases, it is required that there is no gas leakage, the pressure is constant, the pipelines and the flow channels in the valve body are clean and smooth, and there is no contamination. This is also the basic requirement of ultra-precision and ultra-cleanliness for photo-etching machines during semiconductor chip manufacturing. The most commonly used valve during gas etching is the atomic layer deposition (ALD) diaphragm valve. As shown in FIG. 1, its structure includes a valve body 101, a valve seat 102, a membrane 103, a valve gap, a button 104, a valve gap nut, and a low-pressure pneumatic actuator 105.
[0003] Its operating principle is as follows: The etching gas (pressure) enters from the left valve end. When no control gas is introduced into the low-pressure pneumatic actuator 105, the spring above the low-pressure pneumatic actuator 105 propels the intermediate thermal isolation connecting rod under the action of elasticity, presses the button 104, makes the membrane 103 face downward, seals the valve seat 102, and makes the atomic layer deposition (ALD) diaphragm valve in a normally closed state. When a gas with a certain pressure is introduced into the low-pressure pneumatic actuator 105, the piston in the low-pressure pneumatic actuator 105 drives the intermediate thermal isolation connecting rod to move upward. At this time, the button 104 faces upward, and the structure of the membrane 103 is as shown in FIG. 2. Under the action of its own elasticity, the membrane 103 moves upward away from the valve seat 102 while allowing the toxic etching gas introduced from the left end to flow through the valve body channel to the outlet at the right end. By controlling the gas introduction and closing time and frequency of the low-pressure pneumatic actuator 105, the flow rate and flow velocity size of the etching gas can be accurately controlled.
[0004] When a gas of 0.4 Mpa to 0.6 Mpa is introduced into the low-pressure pneumatic actuator and the introduction and closing time is 2 to 10 times per second, the distance between the underside of the membrane and the valve seat changes from large to small, and the gas flow rate passing through the valve seat is accurately controlled.
[0005] The helium gas leakage detection parameter of the atomic deposition ALD diaphragm valve is 1×10 -9 atm / s, and the leakage detection points are divided into internal leakage and external leakage. The internal leakage is the leakage between the membrane and the valve seat, and the external leakage is the leakage between the membrane and the concave arc surface of the valve body contact. When the roughness of the concave surface of the membrane is greater than 0.2 μm, regardless of whether it is internal leakage or external leakage, the requirements are not met.
[0006] The material of the membrane is a strip material, and the strip material can reach a surface roughness of only 0.8 μm during manufacturing and transportation. During the pressure forming process of the membrane, the surface roughness further increases. If the surface roughness cannot meet the requirements of the drawing, it will increase the helium detection leakage rate, affect the stable flow rate and flow rate of the etching gas, and reduce the service life of the atomic deposition ALD diaphragm valve. For the above reasons, the formed membrane needs to be polished after treatment.
Summary of the Invention
Problems to be Solved by the Invention
[0007] An object of the present invention is to provide a membrane polishing device that polishes the concave and convex surfaces of the membrane to solve the problem that the requirements for the surface roughness of the membrane in a plurality of types of control valves are higher during the manufacturing of semiconductor chips.
Means for Solving the Problems
[0008] To achieve the above object, the present invention provides the following solutions: The present invention provides a film polishing apparatus, which includes a material feeding assembly, a polishing assembly, a clamping and moving assembly, a cleaning and recovery assembly, and a material supply assembly. The material feeding assembly is used to transport the film to be polished. The material supply assembly is used to place the film to be polished on the clamping and moving assembly. The clamping and moving assembly is used to clamp the film to be polished. The polishing assembly is used to polish the film to be polished on the clamping and moving assembly. The clamping and moving assembly can drive the film to be polished to rotate and sway. The material supply assembly is used to place the film polished by the polishing assembly on the cleaning and recovery assembly. The cleaning and recovery assembly is used to clean and dry the film.
[0009] Preferably, the material feeding assembly includes a material feeding bracket, a material feeding drive structure, a first guide rail, a material feeding bottom plate, and a first tray. The material feeding drive structure is used to be electrically connected to a control system. Both the material feeding drive structure and the first guide rail are installed on the material feeding bracket. A first synchronous pulley is installed at the power output end of the material feeding drive structure. A second synchronous pulley is installed on the material feeding bracket. The first synchronous pulley and the second synchronous pulley are transmission-connected via a first synchronous belt. The material feeding bottom plate is installed on the first synchronous belt and is slidably connected to the first guide rail. Each of the first trays is installed in the groove of the material feeding bottom plate. Several first suction grooves for adsorbing the film to be polished are installed on the first tray. The shape of the first suction groove matches the concave or convex surface of the film to be polished.
[0010] Preferably, a first displacement sensor is installed on the material feeding bottom plate. The first displacement sensor is used to be electrically connected to a control system.
[0011] Preferably, the polishing assembly includes a polishing drive structure, a hollow shaft, and a polishing wheel. The polishing drive structure of the polishing assembly is used to be electrically connected to a control system. One end of the hollow shaft is connected to the power output end of the polishing drive structure, and the other end of the hollow shaft is connected to the polishing wheel. Liquid through holes are provided in the polishing wheel, and the liquid through holes communicate with the hollow shaft. The polishing liquid can reach the surface of the membrane through the hollow shaft and the liquid through holes. The shape of the polishing surface of the polishing wheel matches the concave or convex surface of the membrane.
[0012] Preferably, the polishing wheel is made of wool.
[0013] Preferably, the clamping motion assembly includes a suction cup, a rotation drive structure, and a swinging drive structure. The rotation drive structure and the swinging drive structure are each used to be electrically connected to a control system. The rotation drive structure is installed at the power output end of the swinging drive structure, and the suction cup is installed at the power output end of the rotation drive structure. The suction cup is used to adsorb the membrane. The shape of the suction cup matches the concave or convex surface of the membrane. The swinging drive structure drives the suction cup to swing, and the rotation drive structure drives the suction cup to rotate.
[0014] Preferably, the cleaning and recovery assembly includes a cleaning and recovery bracket, a cleaning and recovery drive structure, a second guide rail, a cleaning and recovery bottom plate, a second tray, and a cleaning cover. The cleaning and recovery drive structure is used to be electrically connected to a control system. Both the cleaning and recovery drive structure and the second guide rail are installed on the cleaning and recovery bracket. A third synchronous pulley is installed at the power output end of the cleaning and recovery drive structure. A fourth synchronous pulley is installed on the cleaning and recovery bracket. The third synchronous pulley and the fourth synchronous pulley are transmission-connected via a second synchronous belt. The cleaning and recovery bottom plate is installed on the second synchronous belt and is slidably connected to the second guide rail. Each of the second trays is installed in a groove of the cleaning and recovery bottom plate. Several second suction grooves for adsorbing the polished film are installed on the second tray. The shape of the second suction groove conforms to the concave or convex surface of the polished film. A cleaning cover is installed above the second tray. A cleaning spray head and a drying spray head are installed in the cleaning cover.
[0015] Preferably, a second displacement sensor is installed on the cleaning and recovery bottom plate. The second displacement sensor is used to be electrically connected to a control system.
[0016] Preferably, the material supply assembly includes a six-axis manipulator and a suction head. The six-axis manipulator is used to be electrically connected to a control system. The suction head is installed on the six-axis manipulator. The suction head is used to adsorb the film to be polished and the polished film. The shape of the suction head conforms to the concave or convex surface of the film.
Advantages of the Invention
[0017] Compared with the prior art, the present invention has achieved the following technical effects. The present invention can precisely polish the concave and convex surfaces of the film, meet the roughness requirements defined in the drawings for the film, passivate the edges of the film at the same time, has high manufacturing efficiency and automation level, employs a manipulator to control the transportation and positioning of the film, has high precision, and the film obtained by adopting the present invention, when used in an atomic deposition ALD diaphragm valve, has no leakage in helium detection of the valve, has a constant pressure, and the flow rate can be controlled.
Brief Description of the Drawings
[0018] To more clearly explain the technical solutions in the embodiments of the present invention or the prior art, the drawings required for use in the following embodiments will be briefly described. Obviously, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without creative efforts.
[0019]
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Embodiments for Carrying Out the Invention
[0020] Next, while referring to the drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.
[0021] An object of the present invention is to provide a film polishing apparatus that polishes the concave and convex surfaces of a film to solve the problem that the requirements for the surface roughness of the film in a plurality of types of control valves are higher during the manufacture of semiconductor chips.
[0022] In order to make the above objects, features, and advantages of the present invention clearer and easier to understand, the present invention will be described in more detail below with reference to the drawings and embodiments for carrying out the invention.
[0023] As shown in FIGS. 3 to 13: This embodiment provides a film polishing apparatus, which includes a material feeding assembly 1, a polishing assembly 2, a clamping and moving assembly 3, a cleaning and recovery assembly 4, and a material supply assembly 5. The material supply assembly 5 is located in front of the polishing assembly 2 and the clamping and moving assembly 3. The material feeding assembly 1 is located on the left side of the polishing assembly 2. The cleaning and recovery assembly 4 is located on the right side of the polishing assembly 2. The material feeding assembly 1 is used to transport the film to be polished. The material supply assembly 5 is used to place the film to be polished on the clamping and moving assembly 3. The clamping and moving assembly 3 is used to clamp the film to be polished. The polishing assembly 2 is used to polish the film to be polished on the clamping and moving assembly 3. The clamping and moving assembly 3 can be driven to rotate and swing the film to be polished. The material supply assembly 5 is used to place the polished film by the polishing assembly 2 on the cleaning and recovery assembly 4. The cleaning and recovery assembly 4 is used to clean and dry the film.
[0024] Specifically, in this embodiment, the material feeding assembly 1 includes a material feeding bracket 6, a material feeding drive structure 7, a first guide rail 8, a material feeding bottom plate 9, and a first tray 10. The material feeding drive structure 7 is used to be electrically connected to the control system. The material feeding drive structure 7 is a servo motor. Both the material feeding drive structure 7 and the first guide rail 8 are installed on the material feeding bracket 6. A first synchronous pulley is installed at the power output end of the material feeding drive structure 7, and a second synchronous pulley is installed on the material feeding bracket 6. The first synchronous pulley and the second synchronous pulley are transmission-connected via a first synchronous belt. The material feeding bottom plate 9 is installed on the first synchronous belt and is slidably connected to the first guide rail 8. Each first tray 10 is installed in the groove of the material feeding bottom plate 9. Several first suction grooves 11 for adsorbing the film to be polished are installed on the first tray 10. The shape of the first suction groove 11 matches the concave or convex surface of the film to be polished. A first suction hole with a diameter of 0.3 mm is installed in the first suction groove 11. The first suction hole is connected to a vacuum device. The vacuum device and the first suction hole adsorb the film to be polished and prevent inaccurate positioning of the film.
[0025] In this embodiment, a first displacement sensor 12 is installed on the material feeding bottom plate 9. The first displacement sensor 12 is preferably a grating scale. The first displacement sensor 12 is used to be electrically connected to the control system. The first displacement sensor 12 transmits the position information of the material feeding bottom plate 9 to the control system. The control system controls the material feeding drive structure 7 by calculation to form a position closed-loop control and achieve the purpose of accurately controlling the position. After all the films to be polished on one first tray 10 are taken by the material supply assembly 5, this first tray 10 is transferred to the next working position to prepare for recycling.
[0026] In this embodiment, the polishing assembly 2 includes a polishing drive structure 13, a hollow shaft 14, and a polishing wheel 15. The polishing drive structure 13 is used to be electrically connected to a control system. The polishing drive structure 13 is a frequency conversion motor. One end of the hollow shaft 14 is connected to the power output end of the polishing drive structure 13, and the other end of the hollow shaft 14 is connected to the polishing wheel 15. The polishing wheel 15 is formed by compressing and adhering wool. A liquid passage hole is provided in the polishing wheel 15. The liquid passage hole is located at the central position of the polishing wheel 15 and communicates with the hollow shaft 14. The polishing liquid can reach the surface of the membrane through the hollow shaft 14 and the liquid passage hole. The shape of the polishing surface of the polishing wheel 15 coincides with the concave or convex surface of the membrane. The polishing drive structure 13 drives the hollow shaft 14 to rotate at a high speed, and by introducing polishing liquids with different meshes, coarse, fine, and finishing polishing are performed on the membrane. The polishing liquid enters from the hollow shaft 14 into the polishing wheel 15. Under the action of centrifugal force, the polishing liquid polishes the membrane sequentially from the center to the outside. After polishing, the polishing liquid is finally thrown along the outer edge of the polishing wheel 15, and the new polishing liquid also participates in the polishing gradually from the center to the outside. After polishing the membrane with a polishing liquid of one mesh, it is necessary to introduce clean water into the hollow shaft 14 to wash the polishing liquid. After washing, a polishing liquid of another mesh is introduced. For example, after coarsely polishing the membrane with a 1000-mesh polishing liquid, clean water is injected into the hollow shaft 14 of the polishing structure to wash the coarse-mesh polishing liquid on the polishing wheel 15. After washing, a 4000-mesh polishing liquid is injected to perform semi-finishing polishing on the membrane. After semi-finishing polishing, similarly, clean water is injected into the hollow shaft 14 of the polishing structure to wash the coarse-mesh polishing liquid on the polishing wheel 15, and a 20000-mesh polishing liquid is further injected to perform finishing polishing on the membrane.
[0027] In this embodiment, the clamping motion assembly 3 includes a suction cup 16, a rotary drive structure 17, and a swaying motion drive structure 18 that are coaxially installed. The rotary drive structure 17 and the swaying motion drive structure 18 are each used to be electrically connected to the control system. The rotary drive structure is a servo motor, and the swaying motion drive structure 18 is a swaying motion motor. The rotary structure is installed at the power output end of the swaying motion drive structure 18, and the suction cup 16 is installed at the power output end of the rotary drive structure 17. The suction cup 16 is connected to a vacuum facility and is used to adsorb the film. The shape of the suction cup 16 conforms to the concave or convex surface of the film. The swaying motion drive structure 18 drives the suction cup 16 to sway, and the rotary drive structure 17 drives the suction cup 16 to rotate. When the polishing assembly 2 is activated, the clamping motion assembly 3 performs two motions simultaneously. One is to rotate around the rotation axis, and different rotation speeds are set in different processes according to rough polishing, semi-finishing polishing, and finishing polishing. The other is a slight swaying motion of the spherical surface in the front, rear, left, and right directions. The swaying arc coincides with the arc of the film, and all the polished surfaces are brought into contact with the polishing head.
[0028] In this embodiment, the cleaning and recovery assembly 4 includes a cleaning and recovery bracket 19, a cleaning and recovery drive structure 20, a second guide rail 21, a cleaning and recovery bottom plate 22, a second tray 23, and a cleaning cover 24. The cleaning and recovery drive structure 20 is used to be electrically connected to the control system. The cleaning and recovery drive structure 20 is a servo motor. Both the cleaning and recovery drive structure 20 and the second guide rail 21 are installed on the cleaning and recovery bracket 19. A third synchronous pulley is installed at the power output end of the cleaning and recovery drive structure 20. A fourth synchronous pulley is installed on the cleaning and recovery bracket 19. The third synchronous pulley and the fourth synchronous pulley are transmission-connected via a second synchronous belt. The cleaning and recovery bottom plate 22 is installed on the second synchronous belt and is slidably connected to the second guide rail 21. Each second tray 23 is installed in the groove of the cleaning and recovery bottom plate 22. Several second suction grooves for adsorbing the polished film are installed on the second tray 23. The shape of the second suction groove conforms to the concave or convex surface of the polished film. Second suction holes are installed in the second suction groove. The second suction holes are connected to a vacuum device. The vacuum device and the second suction holes adsorb the polished film. Above the second tray 23, a cleaning cover 24 is installed. A cleaning spray head 25 and a drying spray head 26 are installed in the cleaning cover 24. The cleaning spray head 25 is used to introduce clean water. The drying spray head 26 is used to introduce compressed air. The cleaning spray head 25 is a water washing head with adjustable direction, which washes the film from different directions and the washing pressure is adjustable. After all rough polishing, semi-finishing polishing, and finishing polishing are completed, first, the film on the second tray 23 is washed with clean water by the cleaning spray head 25, and then compressed air is introduced into the drying spray head 26 to blow and dry the film. Next, it enters the next process. The cleaning and recovery drive structure 20 drives the second synchronous belt to drive each second tray 23 sequentially under the cleaning cover 24 to wash and dry the film on the second tray 23. After washing and drying the film, the film is sent into the product tray by the material supply assembly 5 in the same manner. Arrangement grooves conforming to the concave or convex surface shape of the film are installed in the product tray, waiting for inspection and packaging.
[0029] In this embodiment, a second displacement sensor 27 is installed on the cleaning and recovery bottom plate 22. The second displacement sensor 27 is preferably a grating scale. The second displacement sensor 27 is used to be electrically connected to the control system. The second displacement sensor 27 transmits the position information of the cleaning and recovery bottom plate 22 to the control system. The control system controls the cleaning and recovery drive structure 20 by calculation to form a position closed-loop control and achieve the purpose of accurately controlling the position.
[0030] In this embodiment, the material supply assembly 5 includes a six-axis manipulator 28 and a suction head 29. The six-axis manipulator 28 is used to be electrically connected to the control system. The suction head 29 is installed on the six-axis manipulator 28. The suction head 29 is made of a soft non-metallic material. There are a plurality of small holes connected to the vacuum equipment on the suction head 29. The suction head 29 is used to adsorb the film to be polished and the polished film. The shape of the suction head 29 conforms to the concave or convex surface of the film.
[0031] The vacuum suction related to the material feeding assembly 1, the clamping movement assembly 3, the cleaning and recovery assembly 4, and the material supply assembly 5 are all independent. Each vacuum equipment is controlled by a Siemens numerical control system. The suction force of each vacuum equipment is adjustable. The polishing time of each stage, the rotation speed of the polishing drive structure 13, the rotation speed of the rotation drive structure 17, the swaying amount of the swaying drive structure 18, etc. can all be set by the system.
[0032] In this embodiment, for the purpose of improving the device structure, the control process of the control system is the prior art.
[0033] In this embodiment, when operating, the six-axis manipulator 28 moves to a fixed position on the first tray 10 of the material feeding assembly 1, and the suction head 29 adsorbs and clamps a film to be polished and places it on the suction cup 16 of the clamping movement assembly 3. The suction cup 16 adsorbs the film to be polished. At this time, the vacuum equipment of the suction head 29 is closed, and the six-axis manipulator 28 drives the suction head 29 back to a safe position, waits for the next command, activates the polishing assembly 2 and the clamping movement assembly 3, introduces polishing liquid through the hollow shaft 14, and polishes the film. During polishing, the rotary drive structure 17 drives the suction cup 16 to rotate, and the sway drive structure 18 drives the suction cup 16 to sway. After the polishing of the film is completed, the suction head 29 on the six-axis manipulator 28 adsorbs the polished film, closes the vacuum switch of the suction cup 16, and the suction head 29 places the film on the second tray 23. The second tray 23 adsorbs the film and washes the film with the cleaning spray head 25 and dries the film with the drying spray head 26. The polishing methods for the concave and convex surfaces of the film are the same.
[0034] This embodiment can precisely polish the concave and convex surfaces of the film, meet the roughness requirements defined in the drawing for the film, passivate the edge of the film at the same time, has high manufacturing efficiency and automation level, adopts a manipulator to control the transportation and positioning of the film, has high precision, and the film obtained by adopting this embodiment, when used in an atomic deposition ALD diaphragm valve, has no helium detection leakage in the valve, has a constant pressure, and the flow rate is controllable.
[0035] In this specification, specific examples are used to explain the principles and embodiments of the present invention. The description of the above embodiments is only used to help understand the method and core idea of the present invention. At the same time, for those skilled in the art, according to the idea of the present invention, all changes are made to the forms and application scopes for implementing the invention. In summary, the content of this specification should not be understood as a limitation to the present invention.
Description of reference numerals
[0036] 1 - Material feeding assembly 2 - Polishing assembly 3-Clamping Movement Assembly 4-Washing and Recycling Assembly 5-Material Supply Assembly 6-Material Feeding Bracket 7-Material Feeding Drive Structure 8-First Guide Rail 9-Material Feeding Bottom Plate 10-First Tray 11-First Suction Groove 12-First Displacement Sensor 13-Grinding Drive Structure 14-Hollow Shaft 15-Grinding Wheel 16-Suction Cup 17-Rotation Drive Structure 18-Swaying Movement Drive Structure 19-Washing and Recycling Bracket 20-Washing and Recycling Drive Structure 21-Second Guide Rail 22-Washing and Recycling Bottom Plate 23-Second Tray 24-Cleaning Cover 25-Washing Spray Head 26-Drying Spray Head 27-Second Displacement Sensor 28-6-Axis Manipulator 29-Suction Head 101-Valve Body 102-Valve Seat 103-Membrane 104-Button 105-Low-Pressure Pneumatic Actuator
Claims
1. A film polishing apparatus, comprising a material feeding assembly, a polishing assembly, a clamping and moving assembly, a cleaning and recovery assembly, and a material supply assembly, wherein the material feeding assembly is used to transport the film to be polished, the material supply assembly is used to place the film to be polished on the clamping and moving assembly, the clamping and moving assembly is used to clamp the film to be polished, the polishing assembly is used to polish the film to be polished on the clamping and moving assembly, the clamping and moving assembly can drive the film to be polished to rotate and swing, the material supply assembly is used to place the film polished by the polishing assembly on the cleaning and recovery assembly, and the cleaning and recovery assembly is used to clean and dry the film. A film polishing apparatus characterized by the above.
2. The material feeding assembly includes a material feeding bracket, a material feeding drive structure, a first guide rail, a material feeding bottom plate, and a first tray. The material feeding drive structure is used to be electrically connected to a control system. Both the material feeding drive structure and the first guide rail are installed on the material feeding bracket. A first synchronous pulley is installed at the power output end of the material feeding drive structure, and a second synchronous pulley is installed on the material feeding bracket. The first synchronous pulley and the second synchronous pulley are transmission-connected via a first synchronous belt. The material feeding bottom plate is installed on the first synchronous belt and is slidably connected to the first guide rail. Each of the first trays is installed in the groove of the material feeding bottom plate, and several first suction grooves for adsorbing the film to be polished are installed on the first tray. The shape of the first suction groove is characterized by being consistent with the concave or convex surface of the film to be polished. The film polishing apparatus according to claim 1.
3. A first displacement sensor is installed on the material feeding bottom plate, and the first displacement sensor is used to be electrically connected to a control system. The film polishing apparatus according to claim 2, characterized by the above.
4. The polishing assembly includes a polishing drive structure, a hollow shaft, and a polishing wheel. The polishing drive structure of the polishing assembly is used to be electrically connected to a control system. One end of the hollow shaft is connected to the power output end of the polishing drive structure. The other end of the hollow shaft is connected to the polishing wheel. A liquid passage hole is provided in the polishing wheel, and the liquid passage hole communicates with the hollow shaft. The polishing liquid can reach the surface of the membrane through the hollow shaft and the liquid passage hole. The shape of the polishing surface of the polishing wheel coincides with the concave or convex surface of the membrane. The membrane polishing device according to claim 1, characterized in that.
5. The membrane polishing device according to claim 4, characterized in that the polishing wheel is made of wool.
6. The clamping motion assembly includes a suction cup, a rotation drive structure, and a sway drive structure. The rotation drive structure and the sway drive structure are each used to be electrically connected to a control system. The rotation drive structure is installed at the power output end of the sway drive structure. The suction cup is installed at the power output end of the rotation drive structure. The suction cup is used to adsorb the membrane. The shape of the suction cup coincides with the concave or convex surface of the membrane. The sway drive structure drives the suction cup to sway, and the rotation drive structure drives the suction cup to rotate. The membrane polishing device according to claim 1, characterized in that.
7. The cleaning and recovery assembly includes a cleaning and recovery bracket, a cleaning and recovery drive structure, a second guide rail, a cleaning and recovery bottom plate, a second tray, and a cleaning cover. The cleaning and recovery drive structure is used for electrically connecting to a control system. Both the cleaning and recovery drive structure and the second guide rail are installed on the cleaning and recovery bracket. A third synchronous pulley is installed at the power output end of the cleaning and recovery drive structure. A fourth synchronous pulley is installed on the cleaning and recovery bracket. The third synchronous pulley and the fourth synchronous pulley are transmission-connected via a second synchronous belt. The cleaning and recovery bottom plate is installed on the second synchronous belt and is slidably connected to the second guide rail. Each of the second trays is installed in the groove of the cleaning and recovery bottom plate. Several second suction grooves for adsorbing the polished film are installed on the second tray. The shape of the second suction groove matches the concave or convex surface of the polished film. A cleaning cover is installed above the second tray. A cleaning spray head and a drying spray head are installed in the cleaning cover. The film polishing apparatus according to claim 1, characterized in that
8. A second displacement sensor is installed on the cleaning and recovery bottom plate. The film polishing apparatus according to claim 7, characterized in that the second displacement sensor is used for electrically connecting to a control system.
9. The material supply assembly includes a six-axis manipulator and a suction head. The six-axis manipulator is used for electrically connecting to a control system. The suction head is installed on the six-axis manipulator. The suction head is used for adsorbing the film to be polished and the polished film. The film polishing apparatus according to claim 1, characterized in that the shape of the suction head matches the concave or convex surface of the film.
Citation Information
Patent Citations
High-purity diaphragm valve for semiconductor industry
CN218440779U
Substrate polishing method, program, and substrate polishing device
JP2023170262A