Lamination type election component

Abstract

To suppress an electrostrictive crack generation of a lamination type election component.SOLUTION: A lamination type election component according to an embodiment of the present invention, comprises a third electrode pattern including: a first main part 123a in which a floating electrode layer is overlapped to a first direction with at least one part of a first electrode pattern; a second main part 123b which is overlapped to at least one part of a second electrode pattern to the first direction; and a pair of coupling parts 123d coupling the first and second main parts and arranged apart from each other in a third direction with a space part 123c therebetween. When the maximum width of the third electrode pattern to the third direction is W1 and the maximum width of the space part to the third direction is W2, W2 / W1 satisfies 0.08 or more and 0.92 or less.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, mobile phones, on-board chargers (OBCs) for electric vehicles, and circuits such as DC-DC converters, and plays a role in charging or discharging electricity.

[0003] When a voltage is applied to a multilayer ceramic capacitor, stress is generated inside the multilayer ceramic capacitor due to the electrostriction phenomenon, which can cause a decrease in the breakdown voltage characteristics of the multilayer ceramic capacitor.

[0004] Conventionally, attempts have been made to introduce a floating electrode layer structure to alleviate the electrostriction phenomenon.

[0005] However, an internal electrode structure with a general floating electrode layer can achieve the effect of distributing voltage as a whole, but there is a possibility of a problem that electrostriction cracks or burnt defects occur as the electrostriction tensile stress increases in the central region where the upper and lower electrode patterns do not overlap.

[0006] Therefore, there is a need for a structural improvement that can suppress the phenomenon of increasing electrostriction tensile stress in the central region where the upper and lower electrode patterns of the internal electrode structure with a floating electrode layer do not overlap.

Summary of the Invention

Problems to be Solved by the Invention

[0007] One of several objects of the present invention is to suppress the phenomenon in which the electrostriction tensile stress concentrates in a region where the upper and lower electrode patterns do not overlap in a laminated electronic component having an internal electrode structure including a floating electrode layer.

[0008] However, the problems to be solved by the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0009] A laminated electronic component according to an embodiment of the present invention includes a dielectric layer, and an internal electrode layer and a floating electrode layer alternately arranged in a first direction with the dielectric layer interposed therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction. And a main body, and external electrodes respectively disposed on the third surface and the fourth surface, the internal electrode layer includes a first electrode pattern in contact with the third surface, and a second electrode pattern in contact with the fourth surface and spaced apart from the first electrode pattern in the second direction, the floating electrode layer includes a first main portion overlapping at least a part of the first electrode pattern in the first direction, a second main portion overlapping at least a part of the second electrode pattern in the first direction, and the first main portion and the second main portion. And a third electrode pattern including a pair of connecting portions connected to each other and spaced apart from each other in a third direction with a space portion interposed therebetween. When the maximum width of the third electrode pattern in the third direction is W1 and the maximum width of the space portion in the third direction is W2, W2 / W1 can satisfy 0.08 or more and 0.92 or less.

Advantages of the Invention

[0010] One of the effects of the present invention is that in a multilayer electronic component having an internal electrode structure including a floating electrode layer, a space portion is formed in a region of the floating electrode layer where the upper and lower electrode patterns do not overlap, and the shapes of the floating electrode layer and the space portion are adjusted to cancel out the electrostrictive tensile stress in which the floating electrode layer where the upper and lower electrode patterns do not overlap is concentrated in the region, thereby suppressing the generation of electrostrictive cracks in the multilayer electronic component.

[0011] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of Drawings

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Mode for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings can be exaggerated for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0014] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the components shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown in the drawings. For components having the same functions within the same scope of thought, the same reference numerals are used for explanation. Further, throughout the specification, when a certain part says that a certain component "includes", this means that, unless otherwise stated to the contrary, it does not exclude other components, but may further include other components.

[0015] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0016] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line I-I' of FIG. 1. FIG. 3 is a cross-sectional view taken along the line II-II' of FIG. 1. FIG. 4 is a cross-sectional view taken along the line III-III' of FIG. 1. FIG. 5 is a cross-sectional view taken along the line IV-IV' of FIG. 1. FIG. 6 is an exploded perspective view schematically showing the shape in which a first electrode pattern, a second electrode pattern, and a third electrode pattern according to an example are stacked. FIG. 7(a) schematically shows a plan view of the structure of an internal electrode layer according to an example. FIG. 7(b) schematically shows a plan view of the structure of a floating electrode layer according to an example.

[0017] Hereinafter, with reference to FIGS. 1 to 7(b), a stacked electronic component 100 according to an embodiment of the present invention will be described in detail. Also, as an example of the stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and can also be applied to various stacked electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0018] A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111, and an internal electrode layer and a floating electrode layer that are alternately arranged in a first direction with the dielectric layer interposed therebetween. The multilayer electronic component 100 includes a main body 110 including a first surface and a second surface 1 and 2 facing each other in the first direction, a third surface and a fourth surface 3 and 4 facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface 5 and 6 facing each other in a third direction perpendicular to the first direction and the second direction, and external electrodes 130 and 140 respectively arranged on the third surface and the fourth surface. The internal electrode layer includes a first electrode pattern 121 in contact with the third surface, and a second electrode pattern 122 in contact with the fourth surface and spaced apart from the first electrode pattern in the second direction. The floating electrode layer includes a first main portion 123a overlapping at least a part of the first electrode pattern in the first direction, a second main portion 123b overlapping at least a part of the second electrode pattern in the first direction, and a third electrode pattern 123 including a pair of connecting portions 123d that connect the first main portion and the second main portion and are spaced apart from each other in the third direction with a space portion 123c interposed therebetween. When the maximum width of the third electrode pattern in the third direction is W1 and the maximum width of the space portion in the third direction is W2, W2 / W1 can satisfy 0.08 or more and 0.92 or less.

[0019] The main body 110 can include a dielectric layer 111, and an internal electrode layer and a floating electrode layer that are alternately arranged between the dielectric layers 111.

[0020] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can have a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can substantially have a hexahedron shape.

[0021] The main body 110 can include a first surface and a second surface 1 and 2 facing each other in the first direction, a third surface and a fourth surface 3 and 4 facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface 5 and 6 facing each other in a third direction perpendicular to the first direction and the second direction.

[0022] The first to sixth surfaces 1, 2, 3, 4, 5, 6 of the main body 110 can be connected, whereby the main body 110 can be substantially in a hexahedron shape.

[0023] On the other hand, when a margin area where no electrode pattern is disposed overlaps on the dielectric layer 111, a step due to the thickness of the internal electrode layer may occur. As a result, the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, by performing a separate process to round the corners connecting the respective surfaces of the main body 110, the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces can have a rounded form.

[0024] The dielectric layer 111 forming the main body 110 can be formed in a plurality, and the plurality of dielectric layers 111 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be hardly confirmed without using a scanning electron microscope (SEM). The number of stacked dielectric layers 111 does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0025] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, the ceramic powder may be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0026] On the one hand, when using barium titanate (BaTiO3)-based powder as a raw material for forming the dielectric layer 111, the fired dielectric layer 111 can contain Ba and Ti. When the dielectric layer 111 contains Ba and Ti, the electrostriction phenomenon that occurs when a high voltage is applied to the multilayer electronic component 100 may become intense. Specifically, stress that expands in the first direction of the multilayer electronic component 100 may be more strongly generated, and the possibility of cracks occurring in the dielectric layer included in the unformed capacitance portion may be further increased. However, according to an embodiment of the present invention described later, the third electrode pattern 123 includes a first main portion 123a, a second main portion 123b, and a pair of connecting portions 123d spaced apart from each other in the third direction with the space portion 123c interposed therebetween. When the maximum width of the third electrode pattern in the third direction is W1 and the maximum width of the space portion in the third direction is W2, W2 / W1 is adjusted to satisfy 0.08 or more and 0.92 or less, so that the electrostriction tensile stress concentrated in the unformed capacitance portion can be effectively relaxed. Therefore, even when the dielectric layer contains Ba and Ti, it is possible to effectively suppress the occurrence of electrostriction cracks or burnt defects in the multilayer electronic component 100.

[0027] The average thickness td of the dielectric layer 111 is not particularly limited.

[0028] For the purpose of miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.35 μm or less. In order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 may be 15 μm or more.

[0029] The average thickness td of the dielectric layer 111 can be measured by scanning an image of the cross section (L-T cross section) of the main body 110 in the third and first directions with a scanning electron microscope (SEM).

[0030] For example, the average thickness of the dielectric layer 111 can be measured by scanning the length and the cross-section in the thickness direction (L-T) cut at the central portion in the width direction of the main body 110 with a scanning electron microscope (SEM), extracting the dielectric layers from the image, and measuring the thicknesses of five dielectric layers, i.e., two upper layers and two lower layers, with respect to one dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet, and then determining five points, i.e., two points on the left side and two points on the right side, at equal intervals with the one reference point as the center with respect to the meeting point of the central line in the length direction of the main body and the central line in the thickness direction, and measuring the average value of the thicknesses at each point.

[0031] Referring to FIG. 6, the internal electrode layers and the floating electrode layers can be alternately arranged in the first direction. Although omitted in FIG. 6, a dielectric layer 111 can be arranged between the internal electrode layer and the floating electrode layer. That is, in one embodiment of the present invention, the internal electrode layer and the floating electrode layer may be alternately arranged in the first direction with the dielectric layer 111 interposed therebetween.

[0032] Referring to FIG. 7(a), the internal electrode layer can include a first electrode pattern 121 in contact with the third surface 3 and a second electrode pattern 122 in contact with the fourth surface 4 and spaced apart from the first electrode pattern 121 in the second direction.

[0033] The first electrode pattern 121 can be connected to a first external electrode 130 described later, and the second electrode pattern 122 can be connected to a second external electrode 140 described later. The first electrode pattern 121 and the second electrode pattern 122 can be spaced apart from each other in the second direction, whereby the first electrode pattern 121 and the second electrode pattern 122 can be electrically separated from each other.

[0034] On the other hand, the first electrode pattern 121 and the second electrode pattern 122 can be arranged to be spaced apart from the fifth surface 5 and the sixth surface 6, whereby the moisture resistance reliability of the multilayer electronic component 100 can be improved.

[0035] The materials for forming the first and second electrode patterns 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the first and second electrode patterns 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0036] The first and second electrode patterns 121 and 122 can be formed by printing a conductive paste on a ceramic green sheet. As the printing method, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0037] The average thickness te of the internal electrode layer is not particularly limited.

[0038] When aiming at miniaturization and high capacitance of the multilayer electronic component 100, the average thickness te of the internal electrode layer may be 0.35 μm or less. When aiming at improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrode layer may be 3 μm or more.

[0039] The average thickness te of the internal electrode layer is extracted from an image obtained by scanning the cross-section in the length and thickness directions (L-T) cut at the central portion in the width direction of the main body 110 with a scanning electron microscope (SEM). Among the internal electrode layers, for a total of 5 internal electrode layers including 2 upper layers and 2 lower layers, with reference to 1 layer of the internal electrode layer at the point where the central line in the length direction and the central line in the thickness direction of the capacitance forming portions RA1 and RA2 meet, after determining 5 points including 2 points on the left side and 2 points on the right side at equal intervals around the reference point, the thickness at each point can be measured and the average value can be measured.

[0040] Referring to FIG. 7(b), the floating electrode layer includes a first main portion 123a that overlaps at least a part of the first electrode pattern 121 in the first direction, a second main portion 123b that overlaps at least a part of the second electrode pattern 122 in the first direction, and a third electrode pattern 123 that connects the first main portion 123a and the second main portion 123b and includes a pair of connecting portions 123d that are spaced apart from each other in the third direction with the space portion 123c interposed therebetween.

[0041] The space portion 123c can serve to cancel out the electrostrictive tensile stress applied to the non-capacitance forming portion RC by increasing the compressive residual stress applied to the non-capacitance forming portion RC after firing.

[0042] At least a part of the space portion 123c can overlap at least a part of the region where the first electrode pattern 121 and the second electrode pattern 122 are separated in the second direction in the first direction, whereby the electrostrictive tensile stress applied to the non-capacitance forming portion RC can be effectively canceled out.

[0043] On the other hand, the space portion 123c does not necessarily completely overlap at least a part of the region where the first electrode pattern 121 and the second electrode pattern 122 are separated in the second direction in the first direction. The position of the space portion 123c can be formed to be displaced from the region where the first electrode pattern 121 and the second electrode pattern 122 are separated in the second direction in view of process errors. That is, the space portion 123c may be arranged to be offset in the second direction or the third direction from the region where the first electrode pattern 121 and the second electrode pattern 122 are separated in the second direction.

[0044] However, when the degree of misalignment between the region where the first electrode pattern 121 and the second electrode pattern 122 are separated in the second direction and the space portion 123c is excessive, even if the maximum width of the space portion 123c is adjusted, it may be difficult to effectively cancel out the electrostriction tensile stress applied to the capacitance non-formation portion RC. Therefore, when the distance by which the first electrode pattern 121 and the second electrode pattern 122 are separated in the second direction is Le, and the maximum length of the space portion 123c in the second direction is Ls, Ls / Le can satisfy 0.8 or more and 1.2 or less, whereby the electrostriction tensile stress applied to the capacitance non-formation portion RC can be effectively canceled out.

[0045] Also, referring to FIG. 7(b), the pair of connection portions 123 can be divided into a connection portion disposed on one side in the third direction of the space portion 123c and a connection portion disposed on the other side in the third direction of the space portion 123c. At this time, when the maximum width in the third direction of the connection portion disposed on one side in the third direction of the space portion 123c is WC1, and the maximum width in the third direction of the connection portion disposed on the other side in the third direction of the space portion 123c is WC2, WC2 / WC1 can satisfy 0.8 or more and 1.2 or less, whereby the electrostriction tensile stress applied to the capacitance formation portion RC can be effectively canceled out.

[0046] On the other hand, the space portion 123c can contain the same material as the dielectric layer 111 instead of the conductive material of the third electrode pattern 123. That is, a dielectric material having the same composition as the dielectric material contained in the dielectric layer 111 can be disposed in the space portion 123c.

[0047] On the other hand, the connection relationship between the first main portion 123a, the second main portion 123b, and the connection portion 123d with the space portion 123c is not particularly limited. However, referring to FIG. 7(b), the first main portion 123a, the second main portion 123b, and the connection portion 123d may be disposed so as to surround the space portion 123c.

[0048] The third electrode pattern 123 can contain a conductive metal, and can contain the same conductive metal as the conductive metal contained in the first and second electrode patterns 121 and 122.

[0049] In one embodiment, the third electrode pattern 123 can be disposed apart from the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6. Therefore, the third electrode pattern 123 may not be connected to the external electrodes 130 and 140 described later.

[0050] A partial region of the third electrode pattern 123 can overlap a partial region of the first electrode pattern 121 in the first direction, and still another partial region of the third electrode pattern 123 can overlap a partial region of the second electrode pattern 122 in the first direction. Specifically, among the regions of the third electrode pattern 123 excluding the space portion 123c, a capacitance can be formed in the region where the first electrode pattern 121 or the second electrode pattern 122 overlaps in the first direction, and a capacitance may not be formed in the region where the first electrode pattern 121 and the second electrode pattern 122 do not overlap with the third electrode pattern 123 in the first direction.

[0051] Specifically, referring to FIG. 2, the main body 110 according to one embodiment includes a first capacitance forming portion RA1 that is a region where the first electrode pattern 121 and the first main portion 123a overlap in the first direction, a second capacitance forming portion RA2 that is a region where the second electrode pattern 122 and the second main portion 123b overlap in the first direction, and a non-capacitance forming portion RC that is a region where the third electrode pattern 123 overlaps with the region where the first electrode pattern 121 and the second electrode pattern 122 are separated in the second direction in the first direction.

[0052] On the other hand, in one embodiment, the first capacitance forming portion RA1 and the second capacitance forming portion RA2 can be disposed on one surface and the other surface in the second direction of the non-capacitance forming portion RC.

[0053] In the case of a laminated electronic component including a floating electrode layer having a conventional general structure, an electrostriction tensile stress can concentrate in a region where the internal electrode layer and the floating electrode layer do not overlap in the first direction, which may cause an electrostriction crack or a burn in the laminated electronic component.

[0054] On the one hand, when firing a multilayer electronic component, the capacitance forming portions RA1 and RA2 with a high ratio of electrode patterns have a high ratio of metal and a high shrinkage rate due to cooling. In contrast, the capacitance non-forming portion RC has a relatively low ratio of electrode patterns and a lower shrinkage rate compared to the capacitance forming portions RA1 and RA2. Therefore, tensile residual stress is generated in the capacitance forming portions RA1 and RA2, and compressive residual stress is generated in the capacitance non-forming portion RC.

[0055] In one embodiment of the present invention, since the third electrode pattern 123 includes a pair of connecting portions 123d that are spaced apart from each other in the third direction with the first main portion 123a, the second main portion 123b, and the space portion 123c interposed therebetween, the compressive residual stress in the capacitance non-forming portion RC can be significantly improved.

[0056] The compressive residual stress in the capacitance non-forming portion RC generated in this way can offset the electrostrictive tensile stress described above, and thereby play a role in alleviating the generation of electrostrictive cracks and the occurrence of burnt defects in the multilayer electronic component 100.

[0057] Therefore, according to one embodiment of the present invention, in a structure in which the internal electrode layer and the floating electrode layer are alternately arranged in the first direction with the dielectric layer interposed therebetween, the internal electrode layer includes a first electrode pattern 121 in contact with the third surface 3 and a second electrode pattern 122 in contact with the fourth surface 4 and spaced apart from the first electrode pattern 121 in the second direction. The floating electrode layer includes a first main portion 123a that overlaps at least a part of the first electrode pattern 121 in the first direction, a second main portion 123b that overlaps at least a part of the second electrode pattern 122 in the first direction, and a third electrode pattern 123 that includes a pair of connecting portions 123d that connect the first main portion 123a and the second main portion 123b and are spaced apart from each other in the third direction with the space portion 123c interposed therebetween. By including the third electrode pattern 123, the electrostrictive tensile stress in the capacitance non-forming portion RC can be offset by the compressive residual stress. Thereby, the generation of electrostrictive cracks and the occurrence of burnt defects in the multilayer electronic component 100 can be alleviated.

[0058] On the other hand, in order to more effectively alleviate the generation of electrostriction cracks and the occurrence of burnt defects in the laminated electronic component 100, it is necessary to appropriately adjust the region where the space portion 123c is formed.

[0059] In the case of a laminated electronic component including a floating electrode layer having a conventional general structure, when performing a breakdown voltage (BDV) measurement test and confirming the positions where defects occur in the cross-sections in the second direction and the third direction, cracks may concentrate in the dielectric layer on the floating electrode layer included in the non-capacitance formed portion.

[0060] Specifically, in the cross-sections in the second direction and the third direction, cracks may concentrate in the dielectric layer corresponding to the position of 0.08 to 0.92 in the width direction based on the maximum width of the floating electrode layer.

[0061] Therefore, in one embodiment of the present invention, when the maximum width of the third electrode pattern 123 in the third direction is W1 and the maximum width of the space portion 123c in the third direction is W2, by making W2 / W1 satisfy 0.08 or more and 0.92 or less, a space portion 123c where W2 / W1 satisfies 0.08 or more and 0.92 or less is formed in the region of the floating electrode layer where stress concentrates, and the problem of the occurrence of electrostriction cracks or the problem of the occurrence of burnt defects in the laminated electronic component 100 can be effectively alleviated.

[0062] On the other hand, the method for measuring the maximum width W1 of the third electrode pattern 123 in the third direction and the maximum width W2 of the space portion 123c in the third direction is not particularly limited. For example, in the cross-sections in the first direction and the third direction polished to the center portion in the second direction of the laminated electronic component 100 as shown in FIG. 5, based on the third electrode pattern 123 closest to the center in the first direction and adjacent thereto, two or more third electrode patterns 123 located above in the first direction and two or more third electrode patterns 123 located below in the first direction, after measuring the maximum width of the third electrode pattern 123 in the third direction and the maximum width of the space portion 123c in the third direction, the average values can be taken respectively for generalization.

[0063] As another example of measuring the maximum width W1 in the third direction of the third electrode pattern 123 and the maximum width W2 in the third direction of the space portion 123c, in the cross section in the second and third directions obtained by polishing the multilayer electronic component 100 in the first direction so that the third electrode pattern 123 is exposed, there is a method of measuring the maximum width W1 in the third direction of the third electrode pattern 123 and the maximum width W2 in the third direction of the space portion 123c. Such measurements can be repeated for five or more third electrode patterns 123 arranged in other layers, and generalized by taking the average value for each.

[0064] As an example of a method of measuring the maximum widths WC1 and WC2 in the third direction of the connection portion 123d, in the cross section in the second and third directions obtained by polishing the multilayer electronic component 100 in the first direction so that the third electrode pattern 123 is exposed, there is a method of measuring the maximum width WC1 in the third direction of the connection portion arranged on one side in the third direction of the space portion 123c and the maximum width WC2 in the third direction of the connection portion arranged on the other side in the third direction of the space portion 123c. Such measurements can be repeated for five or more third electrode patterns 123 arranged in other layers, and generalized by taking the average value for each.

[0065] Referring to FIGS. 2 to 5, the main body 110 can include a first capacitance forming portion RA1, a second capacitance forming portion RA2, and cover portions 112 and 113 disposed above and below in the first direction of the capacitance non-forming portion RC.

[0066] The cover portions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the first capacitance forming portion RA1, the second capacitance forming portion RA2, and the capacitance non-forming portion RC, and basically can play a role of preventing damage to the internal electrodes due to physical or chemical stress.

[0067] The cover parts 112 and 113 do not include internal electrodes and can include a dielectric layer 111 and a dielectric material. That is, the cover parts 112 and 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0068] On the other hand, the thickness of the cover parts 112 and 113 does not need to be particularly limited. For example, the average thickness tc of the cover parts 112 and 113 may be 10 to 300 μm. The average thickness tc of the cover parts 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover parts 112 and 113 measured at five equally spaced points above or below the first capacitance forming part RA1, the second capacitance forming part RA2, and the non-capacitance forming part RC.

[0069] Margin parts 114 and 115 can be arranged on the side surfaces of the first capacitance forming part RA1, the second capacitance forming part RA2, and the non-capacitance forming part RC.

[0070] Referring to FIGS. 3 to 5, the margin parts 114 and 115 can be arranged on both end surfaces in the width direction of the ceramic body 110.

[0071] As shown in FIGS. 3 to 5, the margin parts 114 and 115 can mean the regions between the boundaries of both ends of the first electrode pattern 121, the second electrode pattern 122, and the third electrode pattern 123 and the main body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0072] The margin parts 114 and 115 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0073] The margin parts 114 and 115 may be formed by applying a conductive paste to form the first to third electrode patterns except for the locations where the margin parts are formed on the ceramic green sheet.

[0074] Further, in order to suppress steps, after laminating the dielectric layer 111, the internal electrode layer, and the floating electrode layer, after cutting so that the first to third electrode patterns 121, 122, 123 are exposed on the fifth and sixth surfaces 5, 6 of the main body, a single dielectric layer or two or more dielectric layers may be laminated in the third direction (width direction) to form the margin portions 114, 115.

[0075] On the other hand, the widths of the margin portions 114, 115 do not need to be particularly limited. For example, the widths of the margin portions 114, 115 may be 5 to 300 μm.

[0076] The average width of the margin portions 114, 115 can mean the average size in the third direction of the region where the internal electrode is separated from the fifth surface, and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be a value obtained by averaging the sizes in the third direction of the margin portions 114, 115 measured at five equally spaced points on the side surfaces of the first capacitance forming portion RA1, the second capacitance forming portion RA2, and the non-capacitance forming portion RC.

[0077] The external electrodes 130, 140 can be disposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0078] The external electrodes 130, 140 can be respectively disposed on the third and fourth surfaces 3, 4 of the main body 110 and include the first and second external electrodes 130, 140 respectively connected to the first and second electrode patterns 121, 122. Specifically, the first external electrode 130 can be disposed on the third surface 3 and connected to the first electrode pattern 121, and the second external electrode 140 can be disposed on the fourth surface 4 and connected to the second electrode pattern 122.

[0079] In this embodiment, the structure in which the stacked electronic component 100 has two external electrodes 130, 140 is described, but the number, shape, etc. of the external electrodes 130, 140 can be changed according to the form of the internal electrode layer and other purposes.

[0080] On the one hand, the external electrodes 130 and 140 may be formed of any material as long as it has electrical conductivity, such as metal. A specific material may be determined in consideration of electrical characteristics, structural stability, etc., and it may further have a multilayer structure.

[0081] For example, the external electrodes 130 and 140 may include an electrode layer disposed on the main body 110 and a plating layer formed on the electrode layer.

[0082] More specifically, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and a resin.

[0083] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layer may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode. Also, the electrode layer may be formed of a plating layer, or may be a layer formed using a vapor deposition method such as sputtering or ALD (Atomic layer deposition).

[0084] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0085] The plating layer plays a role in improving mounting characteristics. The type of the plating layer is not particularly limited, and it may be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, or may be formed of a plurality of layers.

[0086] To give a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Further, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers. Also, the plating layer may be in a form in which a Ni plating layer and a Pd plating layer are sequentially formed on the electrode layer.

[0087] The size of the stacked electronic component 100 does not need to be particularly limited. According to the present invention, since it is advantageous for miniaturization and high capacity, it can also be applied to the size of IT products with a small size, and since high reliability can be ensured in various environments, it can also be applied to the size of automotive electrical components that require high reliability.

[0088] FIG. 8 is a cross-sectional view of the stacked electronic component according to the comparative example in the first direction and the second direction, FIG. 9 is a graph showing the distribution of the electrostriction stress measured along the line A-A' of FIG. 8, FIG. 10 is a schematic view showing the cross-section of the stacked electronic component according to the comparative example in the first direction and the second direction, FIG. 11 is a schematic view showing the cross-section of the stacked electronic component according to the example in the first direction and the second direction, FIG. 12 is a graph showing the distribution of the compressive residual stress measured along the line B-B' of FIGS. 10 and 11, (a) of FIG. 13 is a schematic view showing the cross-section of the stacked electronic component according to the comparative example in the first direction and the third direction, (b) of FIG. 14 is a schematic view showing the cross-section of the stacked electronic component according to the comparative example in the first direction and the third direction, FIG. 14 is a graph showing the distribution of the compressive residual stress measured along the line C-C' of (a) and (b) of FIG. 13, FIG. 15 is a schematic view schematically showing a cross-sectional view of the stacked electronic component according to the comparative example in the second direction and the third direction after a failure voltage test, and FIG. 16 is a graph showing the distribution of the electrostriction stress according to the position in the third direction in the stacked electronic component according to the comparative example.

[0089] Hereinafter, with reference to FIGS. 8 to 16, the reason why the laminated electronic component 100 according to the embodiment has an excellent effect of relaxing the electrostriction tensile stress concentrated on the capacitance non-forming portion RC as compared with the laminated electronic component 100' according to the comparative example will be described in detail.

[0090] The laminated electronic component 100' according to the comparative example includes a floating electrode layer 123' that does not include the space portion 123c, which is different from an embodiment of the present invention. In contrast, the laminated electronic component 100 according to the embodiment includes a floating electrode layer 123 in which a space portion 123c is formed as in an embodiment of the present invention.

[0091] Except for the shapes of the floating electrode layers 123 and 123', the remaining configurations of both the laminated electronic component 100' according to the comparative example and the laminated electronic component 100 according to the embodiment are the same.

[0092] On the other hand, the stress values measured in FIGS. 8 to 16 are values measured from the laminated electronic components 100 and 100' of size 3225 (length × width × thickness = 3.2 mm × 2.5 mm × 2.5 mm). However, it should be noted that the present invention does not intend to limit the size of the laminated electronic component 100 to size 3225.

[0093] FIG. 8 is a cross-sectional view of the laminated electronic component according to the comparative example in the first and second directions, and FIG. 9 is a graph showing the distribution of electrostriction stress measured along the line A-A' of FIG. 8.

[0094] The line A-A' in FIG. 8 may be a straight line connecting one end and the other end in the second direction of the dielectric layer located at the center in the first direction of the main body 110 in the cross-section in the first and second directions polished to the center in the third direction of the laminated electronic component 100' according to the comparative example.

[0095] FIG. 9 corresponds to the result of measuring the electrostriction stress along the line A-A' in the multilayer electronic component 100' according to the comparative example. Referring to FIG. 9, it can be confirmed that the electrostriction tensile stress is concentrated in the region of about 1300 μm to 1900 μm, which is the region where the first electrode pattern 121 and the second electrode pattern 122 are separated and the third electrode pattern 123 overlaps in the first direction. That is, in the case of the comparative example having a general floating electrode structure, it can be seen that the electrostriction tensile stress is concentrated in the non-formed capacitance portion, which is the region where the first and second electrode patterns 121 and 122 do not overlap the third electrode pattern 123' in the first direction.

[0096] FIG. 10 schematically shows cross-sections of the multilayer electronic component according to the comparative example in the first and second directions, FIG. 11 schematically shows cross-sections of the multilayer electronic component according to the example in the first and second directions, and FIG. 12 is a graph showing the distribution of the compressive residual stress measured along the line B-B' in FIGS. 10 and 11.

[0097] The line B-B' in FIGS. 10 and 11 can correspond to a straight line connecting one end and the other end in the second direction of the dielectric layer located at the center in the first direction of the main body 110 in the cross-sections in the first and second directions polished to the center in the third direction of the multilayer electronic component 100'.

[0098] Referring to FIG. 12, the distribution of the compressive residual stress according to the position of the line B-B' can be confirmed. Specifically, it can be confirmed that the magnitude of the compressive residual stress in the example shown by the solid line has a relatively larger value than that in the comparative example shown by the dotted line.

[0099] That is, as in one embodiment of the present invention, when the floating electrode layer includes a first main portion 123a that overlaps at least a part of the first electrode pattern 121 in the first direction, a second main portion 123b that overlaps at least a part of the second electrode pattern 122 in the first direction, and a third electrode pattern 123 that connects the first main portion 123a and the second main portion 123b and includes a pair of connecting portions 123d that are spaced apart from each other in the third direction with the space portion 123c interposed therebetween, the magnitude of the compressive residual stress in the capacitance-unformed portion RC can be improved as compared with the conventional case.

[0100] FIG. 13(a) schematically shows cross-sections in the first direction and the third direction of a stacked electronic component according to a comparative example, FIG. 13(b) schematically shows cross-sections in the first direction and the third direction of a stacked electronic component according to a comparative example, and FIG. 14 is a graph showing the distribution of compressive residual stress measured along the C-C' line in FIG. 13(a) and FIG. 13(b).

[0101] The C-C' line in FIGS. 13(a) and 13(b) can correspond to a straight line connecting one end and the other end in the third direction of a dielectric layer located at the center in the first direction of the main body 110 in cross-sections in the first direction and the third direction polished to the center in the second direction of the stacked electronic component 100'.

[0102] Referring to FIG. 14, the distribution of the compressive residual stress according to the position of the C-C' line can be confirmed. Specifically, it can be confirmed that the magnitude of the compressive residual stress in the example represented by the solid line has a relatively large value as compared with the comparative example represented by the broken line.

[0103] That is, as in one embodiment of the present invention, when the floating electrode layer includes a first main portion 123a that overlaps at least a part of the first electrode pattern 121 in the first direction, a second main portion 123b that overlaps at least a part of the second electrode pattern 122 in the first direction, and a third electrode pattern 123 that connects the first main portion 123a and the second main portion 123b and includes a pair of connecting portions 123d that are spaced apart from each other in the third direction with the space portion 123c interposed therebetween, the magnitude of the compressive residual stress in the capacitance-unformed portion RC can be improved as compared with the conventional case.

[0104] FIG. 15 schematically shows a schematic diagram of cross-sections in the second direction and the third direction after a breakdown voltage test was performed on a multilayer electronic component according to a comparative example. FIG. 16 is a graph showing the distribution of electrostrain stress by position in the third direction in the multilayer electronic component according to the comparative example.

[0105] FIG. 15 schematically shows a schematic diagram obtained by performing a breakdown voltage (BDV) measurement test on a multilayer electronic component 100' according to a comparative example, polishing cross-sections in the second direction and the third direction to expose the first electrode pattern 121 and the second electrode pattern 122, and then schematically modeling this. Referring to FIG. 15, the floating electrode layer 123' according to the comparative example is represented by a broken line, and the region where cracks occurred intensively is indicated by a dashed line.

[0106] In the breakdown voltage (BDV) measurement test, samples of the multilayer electronic component 100' according to the comparative example were tested at an applied voltage from 1.5 to 2.5 kV using a withstand voltage insulation tester (Chroma 19052 AC / DC HIPOT Tester), and when the insulation resistance decreased by 100 times or more compared to the initial value, it was determined that a breakdown phenomenon had occurred.

[0107] As a result of a breakdown voltage (BDV) measurement test, it was confirmed that, in the dielectric layer 111 arranged in the area where the first electrode pattern 121 and the second electrode pattern 122 are spaced apart in the second direction, when the maximum size of the width in the third direction of the floating electrode layer 123' is W1' and the maximum size of the width of the area where the crack occurred is W2', the ratio W2' / W1' was 0.08 or more and 0.92 or less.

[0108] Specifically, FIG. 16 shows electrostrictive stress from one end to the other end in the third direction of a region of dielectric layer 111 located at the center in the first direction, which is disposed on floating electrode layer 123′, in a cross section in the first and third directions of a laminated electronic component 100′ according to the comparative example polished to the center in the second direction.

[0109] The horizontal axis represents the ratio (W2' / W1') of the maximum width W2' of the area where a crack has occurred to the maximum width W1' of floating electrode layer 123' in the third direction, with one end in the third direction of the area of ​​dielectric layer 111 located at the center in the first direction, which is located on floating electrode layer 123', as the origin, in the cross section in the first and third directions of laminated electronic component 100' of the comparative example polished to the center in the second direction, and the vertical axis represents the ratio of position-specific electrostrictive stress to the maximum value of the measured electrostrictive stress.

[0110] Combining FIG. 15 and FIG. 16, it can be seen that many defects occur in the region where stress of 25% or more of the maximum stress value occurs, and the frequency of defect occurrence decreases outside this region.

[0111] Therefore, in one embodiment of the present invention, in a structure including a third electrode pattern 123 in which a floating electrode layer includes a pair of connection portions 123d spaced apart from each other in a third direction with a first main portion 123a, a second main portion 123b, and a space portion 123c interposed therebetween, when the maximum width of the third electrode pattern 123 in the third direction is W1 and the maximum width of the space portion 123c in the third direction is W2, by making W2 / W1 satisfy 0.08 or more and 0.92 or less, the problem of electrostrictive cracks occurring in the multilayer electronic component 100 or the problem of burnt defects occurring can be effectively alleviated.

[0112] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0113] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment as each other, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of other embodiments. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood and related to the description of the other one embodiment as long as there is no description contrary to or conflicting with that matter in the other one embodiment.

[0114] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes plural expressions unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0115] 100: Multilayer electronic component 110: Body 111: Dielectric layer 112, 113: Cover part 114, 115: Margin part 121, 122, 123: Electrode pattern 123a, 123b: Main part 123c: Space part 123d: Connection part 130, 140: External electrode

Claims

1. A body including a dielectric layer, and an internal electrode layer and a floating electrode layer alternately arranged in a first direction with the dielectric layer therebetween, the body including a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction, and external electrodes respectively disposed on the third surface and the fourth surface. The internal electrode layer includes a first electrode pattern in contact with the third surface, and a second electrode pattern in contact with the fourth surface and spaced apart from the first electrode pattern in the second direction. The floating electrode layer includes a first main portion overlapping at least a part of the first electrode pattern in the first direction, a second main portion overlapping at least a part of the second electrode pattern in the first direction, and a third electrode pattern including a pair of connecting portions connecting the first main portion and the second main portion and spaced apart from each other in the third direction with a space portion therebetween. When the maximum width of the third electrode pattern in the third direction is W1 and the maximum width of the space portion in the third direction is W2, a multilayer electronic component in which W2 / W1 satisfies 0.08 or more and 0.92 or less.

2. The multilayer electronic component according to claim 1, wherein the third electrode pattern is disposed spaced apart from the third surface, the fourth surface, the fifth surface, and the sixth surface.

3. The multilayer electronic component according to claim 1, wherein at least a part of the space portion overlaps at least a part of a region where the first electrode pattern and the second electrode pattern are spaced apart in the second direction in the first direction.

4. The multilayer electronic component according to claim 1, wherein the space portion is disposed so as to be offset in the second direction or the third direction from a region where the first electrode pattern and the second electrode pattern are spaced apart.

5. The multilayer electronic component according to claim 1, wherein the space portion includes a dielectric material having the same composition as the dielectric material included in the dielectric layer.

6. When the distance between the first electrode pattern and the second electrode pattern spaced apart in the second direction is Le and the maximum length of the space portion in the second direction is Ls, the multilayer electronic component according to claim 1, wherein Ls / Le satisfies 0.8 or more and 1.2 or less.

7. The multilayer electronic component according to claim 1, wherein the first electrode pattern and the second electrode pattern are disposed spaced apart from the fifth surface and the sixth surface.

8. The main body includes a first capacitance forming portion which is a region where the first electrode pattern and the first main portion overlap in the first direction, a second capacitance forming portion which is a region where the second electrode pattern and the second main portion overlap in the first direction, and a capacitance non-forming portion which is a region where the first electrode pattern and the second electrode pattern are separated in the second direction and the third electrode pattern overlaps in the first direction. The multilayer electronic component according to claim 1.

9. The first capacitance forming portion and the second capacitance forming portion are disposed on one surface and the other surface in the second direction of the capacitance non-forming portion. The multilayer electronic component according to claim 8.

10. When the maximum width in the third direction of the connecting portion disposed on one side in the third direction of the space portion is WC1, and the maximum width in the third direction of the connecting portion disposed on the other side in the third direction of the space portion is WC2, WC2 / WC1 satisfies 0.8 or more and 1.2 or less. The multilayer electronic component according to claim 1.

11. The average thickness of the dielectric layer is 15 μm or more. The multilayer electronic component according to claim 1.

12. The dielectric layer contains Ba and Ti. The multilayer electronic component according to claim 1.

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