Liquid immersion cooling platform

Abstract

To provide a computing system which is cooled by liquid immersion by using management of pressure and / or vapor, and a cooling method therefor.SOLUTION: A system condenses back a dielectric vapor to a liquid phase (a dielectric cooling fluid 140) by a condenser 130 having a cooling coil 132 and uses the dielectric cooling fluid to cool computer components 170. The system operates at a sub-ambient pressure by using a pressure controlled vessel 110 and a pressure controller 150. By controlling the pressure at which the system operates, a user affects a temperature at which the dielectric fluid evaporates, and thereby achieves improved performance of a given computer component. A self-healing computing system is created using a robotic arm and a slot-based computing component.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a computing system that is liquid immersion cooled, i.e., a computing system that utilizes pressure and / or vapor management for liquid immersion cooling.

Summary of the Invention

[0002] Conventional computing and / or server systems utilize air to cool various components. Conventional liquid or water-cooled computers utilize a flowing liquid to remove heat from computer components but avoid direct contact between the computer components and the liquid itself. The development of non-conductive and / or dielectric fluids has enabled the use of immersion cooling where computer components and other electronic parts can be immersed in a dielectric or non-conductive liquid to directly remove heat from the components to the liquid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for adequate cooling. In the embodiments of the disclosure of the present invention described below, the use of a vapor and pressure management system and a power management system can be utilized individually or in combination to form a significantly improved computer system that utilizes liquid immersion cooling. Embodiments of the invention of the present disclosure relate to a pressure control vessel that can be used to house a computing system that is liquid immersion cooled. In one embodiment, the pressure control vessel contains a sufficient amount of a liquid dielectric fluid to substantially immerse the heat-generating computer components and an air-containing gaseous dielectric fluid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for adequate cooling.

[0003] In the embodiments of the disclosure of the present invention described below, the use of a vapor and pressure management system and a power management system can be utilized individually or in combination to form a significantly improved computer system that utilizes liquid immersion cooling.

[0004] Embodiments of the invention of the present disclosure relate to a pressure control vessel that can be used to house a computing system that is liquid immersion cooled. In one embodiment, the pressure control vessel contains a sufficient amount of a liquid dielectric fluid to substantially immerse the heat-generating computer components and an air-containing gaseous dielectric fluid. including a dielectric fluid. Embodiments include a condensation system for cooling a gaseous dielectric fluid to convert it to a liquid dielectric fluid. The disclosed pressure management system enables the disclosed embodiments to operate under vacuum, such that as the dielectric fluid vaporizes, the temperature at which the computing system operates decreases. The disclosed embodiments enable densification of computer components and / or high performance of a computer by improvement of the described temperature management system. BRIEF DESCRIPTION OF THE DRAWINGS

[0005]

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[0006] In the following description, specific examples are provided to provide a thorough understanding of the embodiments disclosed herein. Specific details such as quantity, size, arrangement, configuration, components, etc. are described, although the disclosure is not limited thereto. It will be apparent to one skilled in the art that the present invention may be practiced without such specific details. Therefore, details regarding such considerations and the like may be provided without departing from the spirit and scope of the present disclosure, unless such details are necessary to obtain a complete understanding of the present disclosure. are omitted because they are not necessary for the purpose and are within the skill of those in the art.

[0007] The devices, components, systems, and subsystems of the following several disclosed embodiments are commercial products. This disclosure does not imply that such components may be developed and / or sold under specific trade names. that the invention may be implemented with a number of similar components, regardless of whether they are manufactured using a specific trade name; The features and / or invention features associated with the elements are not essential to the practice of the disclosed invention. It will be apparent to those skilled in the art that

[0008] Dielectric fluid One aspect of immersion cooling is the use of a thermally conductive but electrically substantially non-conductive or substantially Use of dielectric fluids. Examples of such fluids include Novec 7100 from 3M (trademark The fluids include some of the Novec™ series designed by The disclosure is not limited to a particular dielectric fluid. The immersion fluid typically All of the computers in the disclosed system have a desired boiling point at which they can operate. The data components and other aspects are preferably not fusible and, if not, are dielectric. It is made of a material that does not break down dielectrically in the pressure-controlled vessel when in contact with the fluid. The boiling point of the dielectric fluid at subatmospheric pressure is less than about 100° C., less than about 80° C., less than about 60° C., It may be less than about 50° C. or even lower. In some embodiments, the dielectric flow rate at standard atmospheric pressure is The boiling point of the body may be greater than about 60° C., greater than about 40° C., greater than about 30° C., or greater than about 20° C. Certain embodiments of the fluid generally have a low vapor pressure. is a fluorocarbon and / or a fluorinated ketone. Particular embodiments of the dielectric fluid are , (CF3)2CFCF2OCH3, C4F9OCH3 or CF3CF2CF2CF 2OCH3, or a similar chemical formula. Contains fluoroethers and methoxy-nonafluorobutane.

[0009] Other desirable properties of the immersion cooling fluid include low toxicity, non-flammability and / or low surface tension. In an embodiment, the immersion cooling fluid is a cooling fluid that is suitable for use in computing Computer components and / or connections, wiring, cables, enclosures, etc., associated with computer components Some dielectric fluids have a viscosity in the range of about 1.8 to about 8. It has a dielectric constant of about 100 and a dielectric strength of about 15 megavolts per meter (MV / m). In certain embodiments, it has a dielectric strength of at least about 5 MV / m, at least about 8 MV / m, at least about 10 MV / m, or at least about 12 MV / m. In some embodiments, the dielectric fluid has a dielectric strength of up to about 3 MV / m, up to about 5 MV / m, or up to about 8 MV / m. In the disclosed embodiments, any liquid in contact with the computer component 170 has a dielectric strength high enough so as not to damage the computer component during the intervals and conditions of a particular application.

[0010] Some dielectric fluid has a critical heat flux of at least about 10 W / cm 2 2, at least about 15 W / cm 2 , at least about 18 W / cm 2 2, or at least about 20 W / cm 2 2. Some dielectric fluid has a critical heat flux of up to about 15 W / cm 2 2, up to about 10 W / cm 2 2, up to about 8 W / cm 2 2, or up to about 5 W / cm 2 2.

[0011] FIG. 1 shows a schematic diagram of a cooled computing system 110 according to an exemplary embodiment. Embodiments of the disclosed cooled computing system 110 (or computing system, system, container, or pressure control container, all of which can be used interchangeably) can utilize a liquid dielectric fluid 140 to cool the computer component 170 by immersing the components in a fluid bath. As electricity passes through the component 170, the component 170 generates heat. As the temperature of the component 170 rises, the performance of the component deteriorates, or the component will be damaged up to the failure point. Various computing components will deteriorate, or the component will be damaged up to the failure point.​​​​​​​ It is advantageous to maintain the ring component at a stable relatively low temperature. In certain embodiments, the computer component 170 may be maintained at less than about 80°C, less than about 70°C, less than about 65°C, less than about 60°C or less than about 55°C. In certain embodiments, the computer component 170 may be maintained at greater than about 60°C, greater than about 50°C, greater than about 40°C, greater than about 35°C or greater than about 30°C. As the computer component 170 heats up, heat is transferred to the liquid dielectric fluid 140 surrounding the component 170. When the liquid dielectric fluid reaches its boiling point, it will transition from the liquid phase to the gas phase and rise from the liquid reservoir 142. The component 170 in the reservoir 142 of the dielectric fluid may be maintained generally near the boiling point of the particular dielectric fluid 140 being used.

[0012] When the liquid dielectric fluid is heated to its vaporization point at the pressure employed for a given application and becomes a gas, bubbles of dielectric vapor rise from the liquid reservoir 142 to the top of the system 110. The vapor is then cooled using the condenser 130 to its condensation point. Depending on the configuration of the system 110, heating and cooling of the dielectric fluid from the liquid phase to the vapor phase and back to the liquid phase may create convection as shown in FIG. 2.

[0013] In certain embodiments, the computer component 170 will be fully immersed within the liquid dielectric fluid 140 during operation of the system. In other words, the upper portion of the computer component 170 will be below the water level of the dielectric liquid 140. It should be appreciated that heat from the computer component changes the dielectric fluid from the liquid phase to the gas phase and small bubbles of dielectric fluid will come in contact with the computer component. Such components remain in the liquid phase of the dielectric is considered to be completely immersed in the dielectric fluid. In certain embodiments, computer component 170 can be immersed in the liquid-phase dielectric fluid 140. In one exemplary embodiment, and without limitation, any part of a motherboard, chip, server, card, blade, GPU, or CPU, and / or any peripheral component, if any part of the computer component is in direct contact with the liquid-phase dielectric fluid 140, the computer component is considered to be immersed. In certain embodiments, computer component 170 can be at least partially immersed in the liquid-phase dielectric fluid 140. If computer component 1 70 is not immersed but is sufficiently cooled by dielectric vapor, the computer component is considered to be at least partially immersed.

[0014] In certain existing immersion cooling systems, since the fluid is always boiling, dielectric fluid must always be added to the tank of dielectric fluid. If the addition of dielectric fluid to tank 142 is missed, the height of the dielectric fluid in tank 142 will drop until the components are exposed to the gas atmosphere and are not sufficiently cooled. This can lead to a performance degradation or damage of components 170.

[0015] In certain embodiments, there can be multiple operating modes that can be considered for the state of the dielectric fluid in its liquid state. These modes include: (1) an initial fill, which is the process by which dielectric fluid is transferred from a storage system to a container; (2) continuous leveling, which is the process by which additional fluid is added to the container or excess fluid is removed from the container; (3) drawdown, which is the process by which An operation filter that is continuously circulated in the mu to ensure the removal of any fine particles may include a grid.

[0016] In certain embodiments, the first three liquid management challenges, namely, initial filling, continuous leveling and withdrawal, can be achieved by the same set of piping, pumps, and valves as a whole. A dedicated tank for storing the liquid refrigerant can be used for storing excess fluid that is removed and then re - condensed during the vapor management process into the new fluid. The set of pipes and pumps can be used to transfer the refrigerant (or dielectric fluid) from the storage system to the container during filling and leveling, and transfer it back from the container to the storage system during the withdrawal operation operation.

[0017] In certain embodiments, the fourth of the liquid management challenges, namely, operation filtering can be achieved by a series of skimmers and / or filters. The first stage can be a coarse particle filter located within the bottom of the container. The purpose of this filter is to prevent particles that are too large to be handled later from entering the remainder of the system. The second stage can be a medium particle filter located inline in the piping system between the first and third stages. This second - stage medium particle filter can use a small barrel - type filter that removes particles that are too small to be removed by the first - stage filter but are still too large to be handled by the third - stage filter. The third - stage filter can consist of one or more parallel filters with supports for various filter configurations. In certain embodiments, a particular type of filter performs an analysis of the fluid after it has been exposed and is located within the container environment filter configurations. In certain embodiments, a particular type of filter performs an analysis of the fluid after it has been exposed and is located within the container environment filter configurations. In certain embodiments, a particular type of filter performs an analysis of the fluid after it has been exposed and is located within the container environment filter configurations. In certain embodiments, a particular type of filter performs an analysis of the fluid after it has been exposed and is located within the container environment filter configurations. In certain embodiments, a particular type of filter performs an analysis of the fluid after it has been exposed and is located within the container environment filter configurations. In certain embodiments, a particular type of filter performs an analysis of the fluid after it has been exposed and is located within the container environment filter configurations. In certain embodiments, a particular type of filter performs an analysis of the fluid after it has been exposed and is located within the container environment By operating with a set of hardware components to be placed, it will be specialized. By varying the hardware and / or components, different types of fine particles and chemicals that may need to be filtered to ensure the long-term life and efficiency of the dielectric fluid can be more easily generated.

[0018] Pressure management Generally, the immersion cooling fluid must be maintained free of dust, water, and / or other contaminants. Since the computer component 170 is in direct contact with the immersion cooling fluid 140, even a slight contaminant can cause a short circuit or damage to the computer component. Furthermore, water or water vapor that can contaminate the dielectric fluid can, as it becomes contaminated, reduce the dielectric properties of the fluid, including, but not limited to, the dielectric strength. If the dielectric strength of the dielectric fluid decreases, the computer component can short circuit, or, even if not, can be damaged during operation. One way to reduce contamination is to operate the immersion cooling system in an enclosure

[0019] maintained at slightly above or above atmospheric pressure. As the computer component 170 operates, some of the dielectric fluid 140 vaporizes into a gas due to heat generated from the initial use of the computer component or otherwise. If the immersion cooling system is confined within a substantially sealed housing, this vaporization typically increases the pressure of the atmosphere within the housing. Pressure relief valves, expansion enclosures, and / or other techniques can be used Maintaining can help reduce the ingress of dust, water vapor, or other contaminants into the immersion cooling computing system. It can serve to reduce the ingress.

[0020] The present embodiment utilizes a sealed pressure control vessel 110 (or the computing system to be cooled 110) and encloses the computing components 170, immersion cooling equipment, and related power supplies, networking connections, wiring connections, etc. within the pressure control vessel. In contrast to existing models, the pressure control vessel 110 is maintained at at least a slight vacuum, thereby being able to lower the boiling point of the dielectric fluid 140 to a temperature below its boiling point at standard atmospheric pressure. This is possible.

[0021] By operating the computing and immersion cooling system under vacuum, the components 170 can be maintained at the lowered low-pressure boiling point of the dielectric fluid 140. This has the advantage of enhanced cooling, allowing more electricity to flow through the various components 170 and resulting in greater component performance. By controlling the pressure in the pressure control vessel 110, the boiling point of the dielectric fluid 140 can also be controlled, enabling the same fluid 140 to be used under a wider range of conditions. Many embodiments benefit from lower temperatures, but there is an ideal range for certain computer components 170, and performance deteriorates at temperatures below that range. By controlling the pressure in the pressure control vessel 110, the boiling point of the immersion cooling fluid 140 can also be controlled. In certain embodiments, the disclosed pressure management system dynamically controls the pressure of the dielectric fluid 140 and thereby its boiling point in response to when the computing system is started up, shut down, or other changing conditions. It is used to dynamically control the pressure of the dielectric fluid 140 and thereby its boiling point in response to when the computing system is started up, shut down, or other changing conditions. It may also be possible.

[0022] By operating in a pressure control vessel 110 below atmospheric pressure, in addition to lowering the boiling point of the dielectric fluid 140, the computer component 170 itself may be modified to more efficiently transfer heat from itself and to the dielectric fluid 140. The component 170 exposed to the liquid dielectric fluid 140, for example, by increasing the surface area of the chip, the heat transfer between the component 170 and the tank 142 of the dielectric fluid 140 can be increased. An exemplary device for increasing the surface area may be a copper boiler or a copper disk, which can be adhered to the chip of other computer components 170. In certain embodiments, the adhesive used will be selected based on its heat transfer ability and its solubility in the dielectric cooling fluid. A suitable adhesive exhibits high thermal conductivity and low solubility in the selected dielectric fluid. In addition to lowering the boiling point of the dielectric fluid 140 by operating in a pressure control vessel 110 below atmospheric pressure, the computer component 170 itself may be modified to more efficiently transfer heat from itself and to the dielectric fluid 140. The component 170 exposed to the liquid dielectric fluid 140, for example, by increasing the surface area of the chip, the heat transfer between the component 170 and the tank 142 of the dielectric fluid 140 can be increased. The component 170 exposed to the liquid dielectric fluid 140, for example, by increasing the surface area of the chip, the heat transfer between the component 170 and the tank 142 of the dielectric fluid 140 can be increased. The heat transfer between the component 170 and the tank 142 of the dielectric fluid 140 can be increased. An exemplary device for increasing the surface area may be a copper boiler or a copper disk, which can be adhered to the chip of other computer components 170. In certain embodiments, the adhesive used will be selected based on its heat transfer ability and its solubility in the dielectric cooling fluid. In certain embodiments, the adhesive used will be selected based on its heat transfer ability and its solubility in the dielectric cooling fluid. A suitable adhesive exhibits high thermal conductivity and low solubility in the selected dielectric fluid.

[0023] FIG. 1 shows a schematic diagram of an exemplary embodiment of the disclosed computing system. Embodiments of the disclosed system include a pressure control vessel 110 (or the cooled computing system 110), a pressure controller 150, an immersion cooling system including at least a volume of dielectric fluid 140 and a condenser structure 130, and desired computer components 170. The pressure system can be configured to maintain a desired degree of decompression. The pressure control vessel 110 can be configured to maintain a negative pressure while allowing for a plurality of penetrations into the pressure control vessel 110 for various connections including, but not limited to, power, data, networking, cooling water, and / or communication systems. Certain embodiments are configured to be airtight and / or marine grade connections. Embodiments of the disclosed system include a pressure control vessel 110 (or the cooled computing system 110), a pressure controller 150, an immersion cooling system including at least a volume of dielectric fluid 140 and a condenser structure 130, and desired computer components 170. The pressure system can be configured to maintain a desired degree of decompression. The pressure control vessel 110 can be configured to maintain a negative pressure while allowing for a plurality of penetrations into the pressure control vessel 110 for various connections including, but not limited to, power, data, networking, cooling water, and / or communication systems. Embodiments of the disclosed system include a pressure control vessel 110 (or the cooled computing system 110), a pressure controller 150, an immersion cooling system including at least a volume of dielectric fluid 140 and a condenser structure 130, and desired computer components 170. The pressure system can be configured to maintain a desired degree of decompression. The pressure control vessel 110 can be configured to maintain a negative pressure while allowing for a plurality of penetrations into the pressure control vessel 110 for various connections including, but not limited to, power, data, networking, cooling water, and / or communication systems. The pressure control vessel 110 can be configured to maintain a negative pressure while allowing for a plurality of penetrations into the pressure control vessel 110 for various connections including, but not limited to, power, data, networking, cooling water, and / or communication systems. Certain embodiments are configured to be airtight and / or marine grade connections. Utilize the continuation. Operating the computing system within the pressure control vessel 110 below atmospheric pressure requires a series of changes to the system as a whole. These changes are described below, and some are immediately obvious to those skilled in the art.

[0024] Figure 3 shows the appearance of an exemplary embodiment of the pressure control vessel 110. In certain embodiments, the disclosed pressure control vessel 110 is at least 2 feet tall, at least 3 feet tall, at least 4 feet tall or at least 5 feet tall. In certain embodiments, the pressure control vessel is at most about 3 feet tall, at most about 4 feet tall or at most about 5 feet tall.

[0025] In certain embodiments, the pressure control vessel has an internal volume of at least about 100 cubic feet, at least about 150 cubic feet, at least about 200 cubic feet, at least about 250 cubic feet, at least about 300 cubic feet, at least about 350 cubic feet or at least about 400 cubic feet.

[0026] In certain embodiments, the pressure control vessel is configured to contain about 12 inches of dielectric fluid in the vertical direction and about 36 inches of dielectric fluid vapor in the vertical direction during operation. In certain embodiments, the gas volume-to-liquid volume ratio helps direct the gas dielectric vapor to a condensation structure that generates convection and returns the vapor to the liquid. In certain embodiments, the pressure control vessel is configured to contain a volume of liquid dielectric fluid in a ratio of about 1:6 to the volume of gas dielectric fluid during operation. In other embodiments, the pressure control vessel is configured to contain a volume of liquid dielectric fluid in a ratio of about 1:3, about 1:5, about 1:8, about 1:10 or about 1:15 to the volume of gas dielectric fluid during operation. to the volume of gas dielectric fluid during operation. In certain embodiments, the pressure control vessel is configured to contain a volume of liquid dielectric fluid in a ratio of about 1:6 to the volume of gas dielectric fluid during operation. In certain embodiments, the pressure control vessel is configured to contain a volume of liquid dielectric fluid in a ratio of about 1:6 to the volume of gas dielectric fluid during operation. In other embodiments, the pressure control vessel is configured to contain a volume of liquid dielectric fluid in a ratio of about 1 :3, about 1:5, about 1:8, about 1:10 or about 1:15 to the volume of gas dielectric fluid during operation. is configured to be useless.

[0027] In an exemplary embodiment, the pressure management system may include a pressure controller 150. The pressure controller 150 may be a vacuum source. For example, the pressure controller 150 may be a vacuum pump that can be connected to the pressure control container 110. In certain embodiments, the vacuum pump 150 may be remote, and the vacuum can be conveyed to the pressure control container 110 using piping. In a preferred embodiment, a pressure sensor 180 is included within the pressure control container 110 and is used to adjust and / or maintain a desired negative pressure within the pressure control container 110. In certain embodiments, the pressure sensor 180 and / or a pressure regulator 190 may be connected to a processor that monitors the pressure of the pressure control container 110 using the pressure sensor 180 and adjusts the pressure using

[0028] Certain embodiments include an operator protection mechanism. In an exemplary embodiment, the operator protection mechanism may be a locking mechanism that prevents the stem from operating when either the lid or service panel for the pressure control container is not in place. In an exemplary embodiment, the operator protection mechanism may include a controller that immediately shuts off the power to the system when one of the doors or panels of the pressure control container is breached improperly. In addition to providing a life safety configuration, the operator protection mechanism may provide an enhanced operational security configuration for deployments where sensitive data is contained within the container. By ensuring that the A high level of assurance can be achieved in the rate conversion. Further still, in certain embodiments, the disk protection mechanism may use a runtime storage encryption key to protect the stored data on the pressure control vessel.

[0029] In certain embodiments, in addition to denying unauthorized access to the pressure control vessel, sensors may be placed to confirm that the system is operating as designed. The main sensor package may include a temperature sensor in the vapor space, a temperature sensor in the liquid space, a humidity sensor in the vapor space, and / or a pressure sensor in the vapor space. These sensor readings may be monitored by software and / or a human operator to confirm that the system is operating in a safe and normal manner. In certain embodiments, the sensor data is recorded or analyzed later.

[0030] In certain embodiments, additional sensors may be included within the vessel or the superstructure (defined below). Such sensors may include, for example, a FLIR thermal imaging camera, a VESDA or other form of aspirating smoke detector, and / or a refrigerant leak detector designed to detect a leak of the dielectric fluid to the ambient environment.

[0031] In certain embodiments, the vessel and / or the superstructure may be equipped with indicators regarding the operating status of the system.

[0032] The cooled computing system 110 is also sometimes referred to as the pressure controlled system 110, although those skilled in the art will recognize that not all of the cooled computing system 110's ​​​​​However, it should be recognized that a number of advantages can be achieved without using a "pressure control system". be

[0033] Vapor management system Immersion cooling systems can be operated in different ways. Some can operate by continuously directly cooling the immersion fluid. Others can operate by reaching the maximum liquid phase temperature of the liquid and then boiling it to the vapor phase. An immersion cooling system that operates by vaporizing the liquid is called a two-phase immersion cooling system. The two-phase immersion cooling system often vaporizes and / or boils a dielectric fluid and regularly adds additional fluid to replace the fluid lost to the atmosphere. from and operating and / or vaporizing a dielectric fluid and regularly adding additional fluid to replace the fluid lost to the atmosphere. replacing

[0034] The disclosed embodiments utilize an immersion cooling system contained within a pressure control vessel 110. This has the effect of not losing the dielectric fluid 140 even after it has been converted to a gaseous form. In a sealed or substantially sealed pressure control vessel 110, the gaseous dielectric fluid is condensed and returned to the tank 142 of the liquid dielectric fluid 140, which is actively used to cool the computing components 170. The condensation step can be carried out in any suitable manner, for example, by circulating treated water through a heat conduction pipe. The condensation structure 130 may include similar devices that increase the surface area of the heat dissipation fins and / or the condenser, thereby enabling greater and / or faster condensation of the gaseous dielectric fluid, which returns to the liquid form. In some embodiments, the treated water is at ambient temperature and is not actively cooled. In other embodiments, the treated water can be cooled using other known methods in the art for cooling, such as evaporative cooling, dry cooling towers, and / or cooling the treated water. after being converted to a gaseous form In a sealed or substantially sealed pressure control vessel 110, the gaseous dielectric fluid is condensed and returned to the tank 142 of the liquid dielectric fluid 140, which is actively used to cool the computing components 170. condensed and returned to the tank 142 of the liquid dielectric fluid 140, which is actively used to cool the computing components 170. The condensation step can be carried out in any suitable manner, for example, by circulating treated water through a heat conduction pipe. circulating treated water through a heat conduction pipe The condensation structure 130 may include similar devices that increase the surface area of the heat dissipation fins and / or the condenser, thereby enabling greater and / or faster condensation of the gaseous dielectric fluid, which returns to the liquid form. enabling greater and / or faster condensation of the gaseous dielectric fluid, which returns to the liquid form. In some embodiments, the treated water is at ambient temperature and is not actively cooled. In other embodiments, the treated water can be cooled using other known methods in the art for cooling, such as evaporative cooling, dry cooling towers, and / or cooling the treated water. using other known methods in the art for cooling, such as evaporative cooling, dry cooling towers, and / or cooling the treated water.

[0035] In one embodiment, there may be two interfaces between the pressure control vessel and the external system. The first interface may be a treated water supply interface. This may be a pipe that conveys treated water from a facility that supplies cooled treated water to a distribution manifold on the pressure control vessel. The second interface may be a treated water return interface. This may be a pipe that returns treated water to a facility that supplies cooled water. The treated water may be returned to the facility after flowing through the pressure control vessel and associated cooling components. The cooling components may include, for example, a condenser, a condensation coil and / or a radiator within the vessel, and a coil that blocks heat from the exhaust of any powered component, such as a motor, a pump and / or a utility cabinet. In one embodiment, there may be two interfaces between the upper structure and the external system. The interfaces may be the same as or substantially the same as the two interfaces between the pressure control vessel and the external system.

[0036] In one embodiment, the position of the condensation structure 130 within the pressure control vessel 110 may be configured to optimize the flow of the vapor-phase dielectric fluid to increase the rate and / or efficiency of condensation. In one embodiment, the geometry of the pressure control vessel 110 itself may be controlled to increase the rate and / or efficiency of condensation.

[0037] In an exemplary embodiment, the position of the condensation structure 130 is such that the (e.g., robotically) placement of the computer component 170 within the vessel (or the removal of the computer component 170 from the vessel) can facilitate and optimize removal. For example, the condensation structure 130 can be arranged on the side (or side wall) of the container so that it is not located between the lid of the container and the computer component 170. In this way, when the lid is opened, the robot can directly remove the computer 170 without interfering with the condensation structure 130. This arrangement of the condensation structure simplifies the arrangement and removal of the computer component 170, thereby providing a great benefit to the autonomous operation of the container. In an exemplary embodiment, the condensation structure 130 can be located on a shelf within the container.

[0038] As shown in FIGS. 1-3, in one exemplary embodiment, the pressure control container is approximately 10 feet long, 4 feet wide, and 4 feet high. The tank 142 can be formed within the pressure control container 110 using approximately 130 gallons of Novec (trademark) dielectric fluid 140. This leaves a layer of liquid dielectric fluid at a depth of approximately 12 inches in the immersion cooling tank at the bottom of the pressure control container, while most of the volume of the pressure control container is gas. The ceiling of the pressure control container is lower than the central part of the vertically elongated structure. The ceiling and / or lid 120 are angled upward and become higher as they approach the side wall of the pressure control container 110. The condensation structure 130 is vertically elongated on two sides of the pressure control container 110. The condensation structure 130 in this exemplary embodiment is approximately 12 inches wide and 24 inches high and extends substantially the entire length of the pressure control container 110. The condensation structure 130 includes a heat sink such as a material having fins with a large surface area cooled using process water. Some embodiments may additionally or alternatively include a heat exchanger.

[0039] As shown in FIG. 2, the structural arrangement within the pressure control container 110 is such that the dielectric fluid vapor​​​​​​​​​​ As it rises from the liquid tank 142, it directs the convection of the dielectric fluid vapor. The structural arrangement is directs the convection towards the ceiling of the pressure control vessel, where the condensation structure 13 with a large surface area 0 is directed to flow and re-condenses into the form of a liquid. Then, the dielectric fluid 140 is reflows into the liquid tank 142. In this manner, the total amount of the dielectric fluid 140 can be retained within this sealed housing. By using the convection that circulates the dielectric fluid vapor, the disclosed embodiments can operate without a mechanical pump for circulating the dielectric liquid, thereby making it possible to reduce the total energy consumption of the disclosed system. By using convection to circulate the dielectric fluid vapor, the disclosed embodiments can operate without a mechanical pump for circulating the dielectric liquid, thereby making it possible to reduce the total energy consumption of the disclosed system. without a mechanical pump for circulating the dielectric liquid, thereby making it possible to reduce the total energy consumption of the disclosed system. Thereby, it is possible to reduce the total energy consumption of the disclosed system.

[0040] Certain embodiments may utilize additional tanks and / or storage containers for the dielectric fluid that can be used during startup and / or shutdown of the system in case the pressure control vessel has to be opened and / or to allow for redundant and robust control of the height of the liquid dielectric fluid. Certain embodiments may utilize additional tanks and / or storage containers for the dielectric fluid that can be used during startup and / or shutdown of the system in case the pressure control vessel has to be opened and / or to allow for redundant and robust control of the height of the liquid dielectric fluid. Certain embodiments may utilize additional tanks and / or storage containers for the dielectric fluid that can be used during startup and / or shutdown of the system in case the pressure control vessel has to be opened and / or to allow for redundant and robust control of the height of the liquid dielectric fluid. may also be used.

[0041] FIG. 11 shows an exemplary cooling and vapor management system 600 for the pressure control vessel 110. In this exemplary embodiment, the cooling and vapor management system 600 may include a storage section 611 of cooled process water that passes through the cooling coil 132 to effect condensation of the dielectric fluid 140. After passing through the cooling coil 132, the process water may proceed to the process water return storage section 612. The cooling and vapor management system 600 may also include a tank 614 for vapor storage and a tank 615 for dielectric fluid storage. Tanks 614 and 615 can supply the dielectric fluid or vapor as needed, for example, during startup and / or shutdown of the system. For example In this exemplary embodiment, the cooling and vapor management system 600 may include a storage section 611 of cooled process water that passes through the cooling coil 132 to effect condensation of the dielectric fluid 140. After passing through the cooling coil 132, the process water may proceed to the process water return storage section 612. The cooling and vapor management system 600 may also include a tank 614 for vapor storage and a tank 615 for dielectric fluid storage. Tanks 614 and 615 can supply the dielectric fluid or vapor as needed, for example, during startup and / or shutdown of the system. For example In this exemplary embodiment, the cooling and vapor management system 600 may include a storage section 611 of cooled process water that passes through the cooling coil 132 to effect condensation of the dielectric fluid 140. After passing through the cooling coil 132, the process water may proceed to the process water return storage section 612. The cooling and vapor management system 600 may also include a tank 614 for vapor storage and a tank 615 for dielectric fluid storage. Tanks 614 and 615 can supply the dielectric fluid or vapor as needed, for example, during startup and / or shutdown of the system. For example and vapor management system 600 may also include a tank 614 for vapor storage and a tank 615 for dielectric fluid storage. Tanks 614 and 615 can supply the dielectric fluid or vapor as needed, for example, during startup and / or shutdown of the system. For example and vapor management system 600 may also include a tank 614 for vapor storage and a tank 615 for dielectric fluid storage. Tanks 614 and 615 can supply the dielectric fluid or vapor as needed, for example, during startup and / or shutdown of the system. For example during startup and / or shutdown of the system. For example In one embodiment shown, tanks 614 and 615 are coupled via a condensation structure 616 and may be. If there is an excess supply of vapor to tank 614, the condensation structure 616 may remove the vapor and add it to the fluid storage tank 615 as a dielectric fluid.

[0042] In some embodiments, during operation, the pressure control vessel is maintained at about 3 psi lower than atmospheric pressure , which lowers the boiling point of the dielectric fluid and thereby acts to lower the operating temperature of the computer chip and other components. In some embodiments, the pressure control vessel 110 is maintained at least about 2 psi lower than atmospheric pressure, at least about 4 psi lower, at least about 6 psi lower, at least about 8 psi lower, or at least about 10 psi lower than atmospheric pressure.

[0043] In some embodiments, it is necessary to select components that have some tolerance to pressure fluctuations. By adjusting the operating pressure of the system, components that can withstand a wide range of pressures are preferably used to enable the manipulation of the boiling point of the refrigerant and thus the manipulation of the overall operating temperature of the system as such. Considering the nature of the operation of the two-phase system, the standard operating conditions for some embodiments will be a variation between ±4 PSIg. Under certain conditions such as during rapid startup or shutdown of the system, an additional difference of 3 PSIg can be introduced. In some embodiments, system-level adjustments can be made to better control those variables and keep them within more controlled and defined ranges.

[0044] In certain embodiments, the computer component 170 is at least about 3% lower than atmospheric pressure ​​​​​​​​​​Operating at a low pressure, at least about 5% lower than atmospheric pressure, at least about 10% lower, at least about 15% lower, at least about 20% lower, at least about 25% lower, or at least about 30% lower than atmospheric pressure. In some embodiments, the pressure control vessel is maintained during operation at less than about 750 torr, less than about 710 torr, less than about 650 torr, less than about 600 torr, less than about 550 torr, less than about 500 torr, less than about 450 torr, less than about 400 torr, or less. In some embodiments, the pressure control vessel is maintained during operation at greater than about 650 torr, greater than about 600 torr, greater than about 550 torr, greater than about 500 torr, greater than about 450 torr, greater than about 400 torr, or greater than about 300 torr.

[0045] Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. In some embodiments, the pressure control vessel is maintained during operation at less than about 750 torr, less than about 710 torr, less than about 650 torr, less than about 600 torr, less than about 550 torr, less than about 500 torr, less than about 450 torr, less than about 400 torr, or less. In some embodiments, the pressure control vessel is maintained during operation at greater than about 650 torr, greater than about 600 torr, greater than about 550 torr, greater than about 500 torr, greater than about 450 torr, greater than about 400 torr, or greater than about 300 torr. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. In some embodiments, the pressure control vessel is maintained during operation at less than about 750 torr, less than about 710 torr, less than about 650 torr, less than about 600 torr, less than about 550 torr, less than about 500 torr, less than about 450 torr, less than about 400 torr, or less. In some embodiments, the pressure control vessel is maintained during operation at greater than about 650 torr, greater than about 600 torr, greater than about 550 torr, greater than about 500 torr, greater than about 450 torr, greater than about 400 torr, or greater than about 300 torr.

[0046] Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure. Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gas atmosphere within the pressure control vessel. This process removes a portion of the gas atmosphere from the pressure control vessel and removes undesirable portions of the atmosphere such as air and water vapor. These and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses to a liquid. Due to the specialized properties and boiling points of the dielectric fluid, many naturally occurring contaminants can be removed using this method. Removing fluids that are not immediately condensable serves to maintain the purity of the dielectric fluid. A fluid is considered not immediately condensable if its condensation point is more than about 20 °C lower than the condensation point of the dielectric fluid at standard atmospheric pressure, or if its condensation point is less than 10 °C at standard atmospheric pressure.

[0047] During maintenance, startup and / or shutdown operations, when the pressure control vessel is opened and / or exposed to atmospheric conditions, in order to reduce the amount of dielectric fluid lost, a layer of nitrogen gas or any inert gas may be introduced into the pressure control vessel. As shown in FIG. 11, the cooling and vapor management system 600 may include an inert gas tank 613, which can supply inert gas to reduce the loss of dielectric fluid.

[0048] Certain disclosed embodiments may include a substantially self - contained server and / or computing system. In certain embodiments, specialized seals and / or connections may be utilized to reduce the total number of penetrations into the pressure control vessel 110. Certain embodiments minimize penetrations into the pressure control vessel to reduce the potential for leakage while the system is under vacuum by grouping power, water, vacuum and networking connections into a bundle of lines.

[0049] FIG. 4 illustrates an exemplary embodiment of a superstructure including a plurality of pressure control vessels. In this exemplary embodiment, two pressure control vessels 110 are pre - piped, pre - wired and housed within a modular superstructure 210. This enables the embodiment to be pre - fabricated, substantially complete and delivered as a self - contained system. The modular system may be configured to connect to other modular embodiments of the disclosed computing system. In certain embodiments, the modular superstructure 210 may require only a single power connection and be pre - wired with appropriate electronics to supply the required voltage to computer components and / or other electronic parts.

[0050] FIG. 5 illustrates an exemplary data center embodiment showing a plurality of pressure control vessels connected to a central power supply. FIG. 6 illustrates an exemplary data center embodiment showing a plurality of pressure control vessels connected in series with each other. In these exemplary embodiments, the pressure control vessel 110 may or may not be disposed within the upper structure.

[0051] FIGS. 7A - D illustrate an exemplary embodiment of a cryogenic computing system having an internal robot arm, an airlock, and an external robot arm. In this exemplary embodiment, the internal robot arm 230 included within the pressure control vessel 110 may be used to remove the component 170 and convey the removed component to the airlock 220. The component 170 may be removed using the airlock 220 without substantially inhibiting or disturbing the pressure, atmosphere, dielectric fluid, and / or other conditions within the pressure control vessel 110. When the component 170 is removed from the pressure control vessel 110, a replacement component may be introduced into the pressure control vessel 110 using the airlock 220. And the replacement component may be installed by the internal robot arm 230. This process may be significantly facilitated by using components that can be installed in a "slot - in" manner such as blade servers and chassis.

[0052] Disturbances to the conditions within the pressure control vessel may be detected by sensors disposed within the pressure control vessel, such as pressure sensors. The disturbance may be indicated by at least a 10% deviation outside the standard range of operating conditions for those conditions. A large disturbance to the conditions within the pressure control vessel may be indicated by at least a 30% deviation outside the standard range of operating conditions for those conditions. obtained.

[0053] In certain embodiments, a self - contained diagnostic program for analyzing the performance of components within the pressure control vessel 110 may be executed. If a component 170 is not operating as desired, the robot arm 230 may be used to automatically remove and / or replace the component. In this manner, a self - healing, self - contained server and / or computing system may be formed. In certain embodiments, such a self - healing system may be pre - fabricated and pre - wired to form a modular unit that supplies highly efficient computing power and can be shipped or delivered to a remote location using conventional methods, which requires only limited setup and / or maintenance. In certain embodiments, a first vapor management challenge of cooling vapor and condensing it from a gaseous state back to a liquid state is fully achieved within the closed system of the container through the use of a condensation coil. The process water is piped through the condensation coil within the container. The shape and geometry of the container itself facilitate the flow of vapor from the tank region to the coil region, and gravity acts to draw the re - condensed liquid back to the tank region. In certain embodiments, a second vapor management challenge of monitoring and maintaining the internal pressure of the container is achieved through the use of an integrated pressure sensor within the container and the use of a purge system. In certain embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank. In some embodiments, a first vapor management challenge of cooling vapor and condensing it from a gaseous state back to a liquid state is fully achieved within the closed system of the container through the use of a condensation coil. The process water is piped through the condensation coil within the container. The shape and geometry of the container itself facilitate the flow of vapor from the tank region to the coil region, and gravity acts to draw the re - condensed liquid back to the tank region. In some embodiments, a second vapor management challenge of monitoring and maintaining the internal pressure of the container is achieved through the use of an integrated pressure sensor within the container and the use of a purge system. In some embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank. In certain embodiments, a first vapor management challenge of cooling vapor and condensing it from a gaseous state back to a liquid state is fully achieved within the closed system of the container through the use of a condensation coil. The process water is piped through the condensation coil within the container. The shape and geometry of the container itself facilitate the flow of vapor from the tank region to the coil region, and gravity acts to draw the re - condensed liquid back to the tank region.

[0054] In some embodiments, a first vapor management challenge of cooling vapor and condensing it from a gaseous state back to a liquid state is fully achieved within the closed system of the container through the use of a condensation coil. The process water is piped through the condensation coil within the container. The shape and geometry of the container itself facilitate the flow of vapor from the tank region to the coil region, and gravity acts to draw the re - condensed liquid back to the tank region. In some embodiments, a second vapor management challenge of monitoring and maintaining the internal pressure of the container is achieved through the use of an integrated pressure sensor within the container and the use of a purge system. In some embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank. In certain embodiments, a first vapor management challenge of cooling vapor and condensing it from a gaseous state back to a liquid state is fully achieved within the closed system of the container through the use of a condensation coil. The process water is piped through the condensation coil within the container. The shape and geometry of the container itself facilitate the flow of vapor from the tank region to the coil region, and gravity acts to draw the re - condensed liquid back to the tank region. In certain embodiments, a second vapor management challenge of monitoring and maintaining the internal pressure of the container is achieved through the use of an integrated pressure sensor within the container and the use of a purge system. In certain embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank. In certain embodiments, a first vapor management challenge of cooling vapor and condensing it from a gaseous state back to a liquid state is fully achieved within the closed system of the container through the use of a condensation coil. The process water is piped through the condensation coil within the container. The shape and geometry of the container itself facilitate the flow of vapor from the tank region to the coil region, and gravity acts to draw the re - condensed liquid back to the tank region.

[0055] In some embodiments, a second vapor management challenge of monitoring and maintaining the internal pressure of the container is achieved through the use of an integrated pressure sensor within the container and the use of a purge system. In some embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank. In some embodiments, a second vapor management challenge of monitoring and maintaining the internal pressure of the container is achieved through the use of an integrated pressure sensor within the container and the use of a purge system. In some embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank. In some embodiments, a second vapor management challenge of monitoring and maintaining the internal pressure of the container is achieved through the use of an integrated pressure sensor within the container and the use of a purge system. In some embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank. In some embodiments, the purge system is used to remove excess vapor from the container and condense it back to a liquid for storage in a liquid storage tank.

[0056] In one embodiment, the non-condensable components of the vapor present during system startup are controlled and removed This third vapor management challenge of controlling is achieved through the same mechanism as the second challenge. The purge system can be used to remove any non-condensable gas from the system while under pressure during its initial startup

[0057] In one embodiment, a fourth vapor management challenge of controlling a layer of inert gas can be achieved using a dedicated nitrogen layer supply system. This layer maintains the refrigerant below the top of the container and minimizes the loss of refrigerant during the period when the container is opened and its internal components are being repaired making it possible. A dedicated piping from a set of nitrogen storage tanks through a set of dedicated layer pipes within the container allows the addition of an inert layer when the operator wishes to open the system. This gas may be removed during the removal process of non-condensable substances that can occur during system startup, along with any other non-condensable substances The overall vapor management process is managed and monitored through control system software based on user commands and system status monitoring

[0058] Ballast block In certain embodiments of the disclosed systems, such as those shown in FIG. 1, the pressure control vessel 110 can include a deep tank portion 142 for containing a majority of the electro-dielectric fluid 140 and a wide shelf region 112 adjacent to the tank The substrate, card, chip, blade, and / or any other computer component 170 is substantially contained within the deep tank portion 142 of the pressure control vessel 110. The wide shelf region 1 12 also contains the liquid dielectric fluid 140 and / or dielectric that re-condenses from the vapor phase to the liquid phase ​​​​Fluid 140 can be collected. In certain embodiments, the depth of the dielectric liquid in the pressure control vessel 110 can be increased using ballast blocks 160. The ballast blocks 160 are used to occupy the unwanted volume on the shelf, thereby displacing the dielectric liquid 140 that would otherwise be present on the shelf 112 and raising the water level of the liquid without the need for additional dielectric liquid 140. In some embodiments, the ballast blocks 160 include riser legs 161 that allow fluid to flow under the ballast blocks 160 such that condensed liquid can continue to flow into the deep sump of the pressure control vessel without being impeded by the ballast blocks 160.

[0059] The ballast blocks 160 can be made of any material that does not interfere with the operation of the disclosed immersion cooling system. The ballast blocks can be made of materials including, but not limited to, metal, rubber, silicone and / or polymers. Suitable materials are not substantially soluble in the dielectric fluid. The blocks must be denser than the dielectric fluid, but need not be solid. In a preferred embodiment, the blocks have handles or cutouts that allow the blocks to be more easily handled and manipulated. Some embodiments of the ballast blocks 160 utilize interlocking tops and bottoms such that the blocks can be stacked on top of each other in a fixed manner. The interlocking tops and bottoms reduce the risk of the blocks damaging nearby components if the blocks slide or become displaced from their desired positions. In some embodiments, the bottommost block is fixedly stacked on top of the bottommost block to occupy a large volume without impeding fluid flow, thereby providing a large amount of additional ballast. ​ It is possible for the level of the dielectric liquid to rise without the need for additional dielectric liquid to be added. The interlocking upper part includes recesses that align with legs and / or risers on the bottom so as to enable this. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more.

[0060] In one embodiment, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more. In some embodiments, the ballast block 160 is configured to span the entire length of the pressure control vessel 110 and / or the shelf 112. In other embodiments, the ballast block 160 can be substantially any size that allows for handling of the block. In such embodiments, multiple modular ballast blocks can be configured to displace as much or as little volume as desired. In one embodiment, one ballast block has outer dimensions of approximately 2 feet in length, approximately 3 feet in length, approximately 4 feet in length or more, approximately 6 inches in width, approximately 8 inches in width, approximately 12 inches in width or more, and approximately 1 inch in height, approximately 3 inches in height, approximately 6 inches in height, approximately 8 inches in height or more.

[0061] Superstructure The disclosed computing system consists of various components, all of which can be attached directly or indirectly to a physical superstructure 210 as shown in FIG. 4. The superstructure 210 allows for pre-wiring and pre-piping of any necessary electrical sensors, controls, power, fluid control, pressure control, and / or communication systems. This enables faster and simpler on-site deployment and factory testing before delivery to the customer. The disclosed computing system consists of various components, all of which can be attached directly or indirectly to a physical superstructure 210 as shown in FIG. 4. The superstructure 210 allows for pre-wiring and pre-piping of any necessary electrical sensors, controls, power, fluid control, pressure control, and / or communication systems. This enables faster and simpler on-site deployment and factory testing before delivery to the customer. The superstructure 210 allows for pre-wiring and pre-piping of any necessary electrical sensors, controls, power, fluid control, pressure control, and / or communication systems. This enables faster and simpler on-site deployment and factory testing before delivery to the customer. The superstructure 210 allows for pre-wiring and pre-piping of any necessary electrical sensors, controls, power, fluid control, pressure control, and / or communication systems. This enables faster and simpler on-site deployment and factory testing before delivery to the customer. The superstructure 210 allows for pre-wiring and pre-piping of any necessary electrical sensors, controls, power, fluid control, pressure control, and / or communication systems. This enables faster and simpler on-site deployment and factory testing before delivery to the customer.

[0062] The superstructure 210 is typically made of metal components, skid-mounted, or configured to be handled by a forklift, hoist, or crane. The superstructure 210 is typically made of metal components, skid-mounted, or configured to be handled by a forklift, hoist, or crane. In one embodiment, the upper structure 210 is configured to fit within a standard container to facilitate shipping. The upper structure 210 and associated components are configured to have a combined weight of less than about 58000 lbs and may be divided into smaller sub-components to facilitate shipping without requiring special equipment. In one embodiment, the upper structure 210 and associated components have a weight of less than about 50000 lbs, less than about 40000 lbs, less than about 30000 lbs or less than about 20000 lbs. In one embodiment, the upper structure 2 10 and associated components have a weight of more than about 5000 lbs, more than about 10000 lbs, more than about 20000 lbs or more than about 30000 lbs. Embodiments of the upper structure 210 can be of any size and / or shape. Many embodiments are large enough to include multiple pressure control vessels 110, a server rack 310 and associated liquid immersion cooling equipment, and equipment necessary to manage power transmission and distribution and network connections. The overall design of the upper structure 210 can be adjusted to accommodate the unique aspects of each deployment, including type customizations and the number of electrical and process water interconnections, to meet the needs of existing equipment. A control and management system for all of the components within the disclosed pressure control vessels can be included as part of the disclosed computing system. Preferred embodiments of the disclosed system include all of the mechanical systems necessary to maintain and operate a two-phase liquid immersion cooling environment, including the required pumps, valves, regulators, vapor management systems, pressure management systems, and other associated components.

[0063]

[0064]

[0065] The upper structure 210 may be of an open frame design or may include side panels and access doors. This allows for deployment inside an existing structure or outside at a site location. The upper structure 210 may be modified to include a weather-resistant configuration, enabling deployment in harsh environments. In one embodiment, the upper structure may be a skid / module framework.

[0066] Various systems, configurations, and / or capabilities may be included in the upper structure 210 to support, monitor, and manage some environment associated with or contained within other components of the pressure control vessel and the pressure control vessel. In one embodiment, such systems may include, among many others, fire detection and / or suppression capabilities, dedicated air conditioning and / or environmental management capabilities, security configurations such as access control, and / or monitoring configurations.

[0067] Power system One embodiment of the upper structure 210 is designed to receive various electrical input means and connect them to an existing power distribution system built within the upper structure. One of many exemplary embodiments includes a 415V input to a main breaker, which is then distributed to a series of power shelves that convert the AC 415V input to a DC 12V output. In a preferred embodiment, this conversion is done in substantially one conversion step, thereby reducing the efficiency typically lost with such a conversion. Conventional computer server locations typically convert incoming industrial power from a high AC voltage such as 415V to a reduced AC voltage such as 120V. ​​​​​​​​​​​​​​The conversion results in a loss of energy to heat. In a typical environment, this can be about 6% energy loss. And a voltage of 120V has to be further converted to DC current for use by various computer components. This second conversion results in a second loss of about 6% of energy to heat. By directly converting an industrial voltage of about 415V to about DC12V, the total loss of energy to heat can be reduced.

[0068] Other exemplary embodiments include the connection of an AC480V input to a power rack that converts it to a DC48V output, and the DC48V output is then distributed to a series of relay power sources that convert the DC48V input to various DC outputs including, for example, 12V, 5V, 3.5V, 3.3V, and others.

[0069] In some embodiments, there may be a single set of power sources, or there may be multiple power sources operating at different input and output voltages. The exact configuration is adjusted to suit the needs of the particular equipment being installed and the conditions of the application. The specific design of the power system can be adjusted to suit the needs of the particular environment in which the disclosed computing system is deployed. Customization can include the type, capacity, and interface for both the input and output of power to the system.

[0070] In some embodiments, a rack power distribution system can comprise a modular power system and / or a set of modular power systems. The specific configuration of the single or multiple modular power systems is not particularly limited as long as it can transmit the desired amount and type of power to the rack. ​​​​​​​​​​​​​It is not important. Thus, the modular power system can be configured in parallel, series, or a combination thereof to provide one, two, or even a number of power distribution paths. The specific path to the rack may be direct or indirect and often depends on the components involved, the amount of power, and the type and / or the desired configuration. If desired, the path to the rack may involve power distribution to a chassis located within the rack. The power to be distributed may be transmitted at one or more desired voltages that may vary depending on the configuration and components. In some cases, the desired voltages may include, for example, 12V, 5V, and / or 3.5V. In certain embodiments, when a chassis is employed, it may employ one or more subsystems. Such subsystems may include any desired subsystem that does not interfere with the desired amount and type of power transmitted to the rack. By way of example, a power-on package subsystem may be employed. Such a package may be capable of receiving AC current and converting it to DC current and / or vice versa, depending on what is desired. For example, a particularly useful power-on package subsystem may be designed to receive input power at AC208, 240, 380, 400, 415, 480, and / or 600 volts and convert that power directly to DC power, such as DC48V. One or more modular power systems may be powered directly or indirectly in any suitable manner. For example, a modular power system may be powered directly through the main power distribution system within a chassis. Depending on the type and amount of power and other components, the chassis may use an interface such as a set of spring-loaded pins or other suitable connector interface to interface with the modular power system.

[0071] One or more modular power systems may be powered directly or indirectly in any suitable manner. For example, a modular power system may be powered directly through the main power distribution system within a chassis. Depending on the type and amount of power and other components, the chassis may use an interface such as a set of spring-loaded pins or other suitable connector interface to interface with the modular power system.​ Electrical continuity may be established between the power distribution paths and the chassis itself. interface connector and the desired server or other computer located on the chassis. A power supply may be established between any desired power input interface in the power supply component. In one embodiment, the power-on-package module is integrated into the chassis itself. This may be used within each chassis to directly convert the voltage to the appropriate level. It may be used for various types of power distribution, but may be particularly useful for example for 48V power distribution. FIG. 17 illustrates an example embodiment of a rack power distribution system 950. In this example embodiment, The rack 310 is connected to an AC input 96 at an AC interface 311 of the rack 310. The power distribution system 950 generates a DC output 320 and receives a DC output 3 20 may be distributed among one or more chassis 400.

[0072] In one embodiment, a reliable power supply is ensured to computer components in a rack. To that end, one embodiment may select a particular input voltage. to provide the required output voltage to the blade and / or component level power supplies. Some embodiments use a power supply that provides redundancy. Each blade includes multiple power sources to support

[0073] In some embodiments, one or more switches may require power. Appropriate interfaces connect to the backplane to provide rack-level communication to each blade. The switch may be a standard data center grade switch with Distribute the voltage at the minimum, which serves as the interface between each of the power rail and the blade. It can be achieved by a power rail having a connector and an interface system, and the electricity is transmitted either directly to the source input rail or through a relay connector positioned between the power supply lead and the rack-level voltage distribution system.

[0074] In certain embodiments, there may be one or more power rails that distribute the main voltage along the bottom of the rack. This rail is supplied by one or more main power rectifiers that are often located outside the pressure control vessel and is transmitted to each rack via a cable or busbar system. By using a higher voltage, such as 48 volts, at this level, the required current-carrying capacity of the power distribution system is reduced, and it can efficiently interface between the distribution rail and the load interface.

[0075] In certain embodiments, there are two main power distribution systems located within the upper structure platform. The first main power distribution system is the primary equipment power system (PEPS), and the second main power distribution system is the secondary equipment power system (SEPS). The purpose of the PEPS is to provide electrical services to the components within the container. This system can be a high-voltage and high-current distribution system that receives input via a copper conductor or busbar system and transmits it to the main power supply that supplies operating current to the chassis, computer components, and / or other critical load equipment. The power enters the upper structure at a specified point and is transmitted to the master service disconnect breaker. All power redundancy components used in the electrical services and systems are upstream of this point. This input can be, for example, AC 415 or 480 volts, etc. ​ results in a high voltage. The main equipment load is powered from the breaker panel downstream of the main disconnect breaker or by a power supply or rectifier that is driven.

[0076] The purpose of the SEPS is to provide electrical service to all of the infrastructure support systems and components located within the upper structure. Since the components required as part of the secondary equipment infrastructure may assume a lower input voltage, the SEPS may be powered by a step-down converter connected via a secondary service disconnect upstream of the PEPS main service disconnect breaker. This arrangement enables the upper structure support and infrastructure system, including all components powered from the SEPS, to be turned on and operate even if the main power is not being transmitted to the remainder of the system components. All aspects of the management and control system and the steam control system may be made to operate independently of the operation of the PEPS.

[0077] In certain embodiments, an uninterruptible power supply (UPS) is included as part of or in addition to the power distribution system. By including a UPS, continuous operation of the disclosed computing system is made possible in the event of a temporary interruption to the external power supply. The components of the disclosed power distribution system may include, but are not limited to, commercially available components such as, for example, uninterruptible power supplies,

[0078] DC power systems, AC power systems, and / or power control and monitoring systems. Such components may include, but are not limited to, Vertiv products such as Liebert and / or Chloride UPS products,

[0079] ​​​​​​​​​​​Al conversion online UPS, line interactive UPS, standby UPS, lithium ion battery UPS, and combinations thereof may be included. The UPS products can be single-phase or three-phase obtainable. Other exemplary power distribution system components may include, for example, Emerson Network Po wer products, NetSure DC power systems, Vertiv, Liebert, Chl oride and / or NetSure power distribution units, and related components such as, for example, inverters, rectifiers, transfer switches, and combinations thereof. Commercially available monitoring units, controller units, and / or software related to such components may also be included in the disclosed specific embodiments shown.

[0080] Pressure control vessel and pressure management system Embodiments of the disclosed system are designed to accommodate a two-phase liquid immersion cooling system and include a pressure control container. The pressure control container 110 includes a tank 142 of a dielectric cooling fluid 140, a condenser 130 having a cooling coil 132 that condenses the vapor-phase dielectric fluid into a liquid, and physical mechanisms and / or equipment for holding a computer component 170 and distributing power from the power system to the devices and components within the pressure control container 110.

[0081] During operation, the pressure control container 110 can be maintained at a slight vacuum. It should be understood that various specialized connections and considerations must be made to operate a computing system within the pressure control container 110 maintained at a negative pressure

[0082] In addition to breaking through the panel and cable tray to distribute the fiber to the patch 310, an embodiment of a disclosed system includes a series of optical fiber media transfer protocols (MTP ​ ) enables the connection of the fiber to the pressure control vessel 110 using an interface. This arrangement reduces the total number of penetrations into the pressure control vessel 110 to reduce the potential for leakage in the vessel.

[0083] Certain embodiments of the pressure control vessel 110 include sensors that ensure safe operation. These sensors may include, but are not limited to, temperature sensors, fluid height sensors, pressure sensors 180, gas partial pressure sensors, position sensors, electrical sensors, microphones, and / or cameras to ensure and / or automate the operation of the system.

[0084] In one exemplary embodiment, the temperature sensors may include, but are not limited to, sensors for measuring the temperature of the gas phase within the pressure control vessel 110, sensors for measuring the temperature of the liquid phase within the pressure control vessel, sensors for measuring the temperature of water and / or other process fluids, and / or sensors for measuring the temperature of other components including the computer components 170. thermocouples, thermistors, and / or silicon sensors may be utilized to measure the temperature of the computer components. In certain embodiments, the system may determine the device temperature depending on information provided by the components themselves and information obtained or monitored via the use of generally accepted communication protocols such as APIs provided by the device or other programs such as JSON via HTTP or SNMP.

[0085] Certain embodiments may include various life safety configurations that ensure the safety of the user. These configurations may include, but are not limited to, automatic electromagnetic locking mechanisms, fail-safe systems, A fire and / or smoke detector and / or suppression system, a ventilation system, and / or may include backup lighting. In certain embodiments, these components may be included as part of an integrated platform.

[0086] Certain embodiments include an automatic steam detection system leak detection system that ensures rapid detection of any fluid loss in a pressure control vessel. These systems may include a pressure sensor 180 within the pressure control vessel 110 that monitors pressure to confirm the absence of substantial leaks, and / or a gas sensor located outside the pressure control vessel that detects the presence of any

[0087] dielectric steam that may have leaked from the pressure control vessel. The specific design, arrangement, and / or layout of embodiments of the disclosed system may be adjusted based on the conditions under which it is deployed. In certain embodiments, the choices of size, materials, internal systems, component implementation and configuration, the pressure control vessel 110, the computer

[0088] Rack system Figures 8A - C illustrate an exemplary embodiment of a rack system 310 (or rack 310). The rack 310 may act as an intermediary between an electrical and communication system installed within the pressure control vessel 110 and computing equipment 170 installed within the rack 310. The computer components 170 may be mounted on the rack 310 to control the spacing, In one embodiment, each computer component 170 can be installed on the chassis 400 before being mounted on the pressure control vessel 110. It can be installed on the chassis 400.

[0089] The rack 310 can be any physical structure that can be used to mount the computer component 170, including, but not limited to, a frame, bracket, support, or other structure. The computer component 170 is considered to be mounted on the rack 310 when they are directly or indirectly attached to the rack 310 and held in a substantially fixed position. Certain embodiments may include a dedicated mechanical guide plate as a mounting mechanism, a wiring harness attached to the bulk head fitting, and / or the use of a relay power supply and backplane receiver 331 that distributes power and signals within the rack. When they are attached to the rack 310 and held in a substantially fixed position. Certain embodiments may include a dedicated mechanical guide plate as a mounting mechanism, a wiring harness attached to the bulk head fitting, and / or the use of a relay power supply and backplane receiver 331 that distributes power and signals within the rack. The specific design of the rack system 310 can be adjusted based on the conditions under which the system is deployed. Certain embodiments of the rack 310 may include a dedicated switch.

[0090] In certain embodiments, the uplink interface is connected via a fiber infrastructure and / or the downlink access interface is connected to the computing device 170 within the rack via the backplane receiver 331 interface or any other suitable means of connecting the computing device. In certain embodiments, the uplink interface is connected via a fiber infrastructure and / or the downlink access interface is connected to the computing device 170 within the rack via the backplane receiver 331 interface or any other suitable means of connecting the computing device. In certain embodiments, the uplink interface is connected via a fiber infrastructure and / or the downlink access interface is connected to the computing device 170 within the rack via the backplane receiver 331 interface or any other suitable means of connecting the computing device. In certain embodiments, the uplink interface is connected via a fiber infrastructure and / or the downlink access interface is connected to the computing device 170 within the rack via the backplane receiver 331 interface or any other suitable means of connecting the computing device. In certain embodiments, the uplink interface is connected via a fiber infrastructure and / or the downlink access interface is connected to the computing device 170 within the rack via the backplane receiver 331 interface or any other suitable means of connecting the computing device. In certain embodiments, the uplink interface is connected via a fiber infrastructure and / or the downlink access interface is connected to the computing device 170 within the rack via the backplane receiver 331 interface or any other suitable means of connecting the computing device.

[0091] In certain embodiments, the rack system 310 may include a housing for one or more relay power supplies that can distribute an appropriate voltage from a power interface to other devices installed within the rack 310. The interface that interconnects power from the distribution system to the relay power supply can be of various types. The interface that interconnects power from the distribution system to the relay power supply can be of various types. By disconnecting the interfaces between the rack, power, and communication systems, it is possible for it to be removed and / or replaced with an alternative rack configuration, and may be included in the design of rack 3 10.

[0092] FIG. 8A shows a top view of rack 310. In this exemplary embodiment, rack 310 includes an AC interface 311 and a data interface 312. Rack 310 also includes a pair of power supplies, a power supply 313 and a redundant power supply 314 (or backup power supply). The ra ck 310 may also include a rectifier and a controller. The redundant power supply 314 (as well as / or the rectif ier and controller) enables rack 310 to continue functioning even if it is quickly repaired or even if the main power supply fails. Rack 310 may optionally include a converter 315 . Rack 310 is configured to receive a plurality of chassis 400 and hold the chassis 400 in a substantially fixed position.

[0093] In certain embodiments, the entire rack 310 may be immersed in a dielectric fluid. This may include immersing the rectifier, power connections, and / or data connections in the dielectric liquid during operation. In order to reduce and / or eliminate plastic contamination of the dielectric fluid, in certain embodiments the plastic insulation and / or cable sheathing may be eliminated. In such embodiments the dielectric fluid may act to insulate the cables and / or connections that would otherwise be exposed.

[0094] FIG. 8B shows a perspective view of rack 310 including a plurality of chassis 400. The disclosed configuration of the rack facilitates hot swapping of the chassis 400. In this exemplary embodiment, the rack The rack 310 may include a plurality of AC cables 318 that connect the AC interface 311 to the power supply 313 and / or the redundant power supply 314. The power supply 313 and / or the redundant power supply 314 can generate a DC output 320 that can be transmitted to the backplane receiver 331 via the DC cable 321. The rack 310 may also include a plurality of data cables 319 that connect the data interface 312 to the backplane receiver 331. The backplane receiver 331 can be used to supply data from a data connection portion at the bottom of the chassis 400 to a data connection portion at the top of the rack. ... ... ... ... ... ...

[0095] FIG. 8C shows a side view of the rack 310. In one embodiment, the rack 310 provides mechanical stability and / or housing for the chassis 400 and its components. Further, the rack 310 facilitates the routing of power cables and data cables from the top of the rack 310, where the cables are generally accessible within the enclosure, to the bottom of the rack 310 where the cables connect to the chassis 400. ... ... ... ...

[0096] Chassis and interface system In one exemplary embodiment, the purpose of the disclosed chassis system 400 is to act as a standardized physical relay component between conventional and / or dedicated computing components 170 and the disclosed rack system 310. In one exemplary embodiment, the purpose of the backplane receiver 331 is to provide a plug-in type interface between the chassis 400 and the rack 310 to communicate with the power supply in the power system and the network switch in the communication system having various computing components 170 installed within the chassis 400. ... ... ... ... ... To enable the distribution of power and signals to and from the switch.

[0097] In one embodiment, the pressure control vessel of the present disclosure may include at least one rack 310 that may include one or more servers, such as blade servers. Each server is attachable to a chassis 400 (also referred to as a server case or simply a case). FIGS. 9A - G illustrate exemplary embodiments of a chassis 400 for mounting various components 170. The chassis may facilitate the installation of servers onto the rack of the pressure control vessel or their removal from the system. In one embodiment, other electronic components of the pressure control vessel may be mountable on the chassis. For example, computer components or hardware such as a motherboard, chip, card, part of a GPU or CPU, etc. may be installed on the chassis. As another example, components such as a power supply, power interface, or network communication interface may be mountable on the chassis. In one exemplary embodiment, the chassis can act as a common interface between components (e.g., servers) and the pressure control vessel. The chassis can provide a variety of mounting, power, and connection configurations that can be customized based on the nature or design of the components. In other words, various aspects of the chassis can be modified based on the design specifications of the components. Thus, the chassis can accommodate almost any model or type of hardware. For example, the chassis can facilitate the use of specifically designed hardware or off - the - shelf hardware. Embodiments of the chassis 400 are compatible with existing commercially available components and can accommodate custom - designed components.

[0098]

[0099] ​ It may include components designed to enable the use of and / or the use of a chassis specialized for a particular application. Embodiments may include a standard motherboard and an adapter kit for special components. In certain embodiments, such components include a gigabyte motherboard with an NVIDIA GPU and / or a subminiature motherboard with an Intel CPU.

[0100] Figure 9A shows a chassis 400 for mounting a server on a rack according to an exemplary embodiment. In this exemplary embodiment, the chassis 400 may be a rectangular box including a rear wall 410 and two side walls 420. The rear wall 410 may include a plurality of holes 411 to facilitate the circulation of fluid within the chassis 400. The chassis 400 may include guide rails 421 on each side wall 420.

[0101] Figure 9B shows a plurality of components inside the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the rear wall 410 is removed. Thus, Figure 9B shows a server 430 including a power module 431, a GPU module 432, a CPU module 433, and an interface card 434. In one exemplary embodiment, the components inside the chassis 400 may include components used in a blade server, such as a CPU module 433 and a GPU module 432. Furthermore, the components inside the chassis 400 may include other components not conventionally included in a server, such as a power module 431 or an interface card 434. Since the chassis 400 does not require conventional air cooling equipment, the chassis 400 does not include a fan or a heat sink inside the chassis. In this way, the chassis has a very thin profile with respect to the computing power of the chassis. It has a profile file.

[0102] FIG. 9C shows a schematic diagram of components within the chassis. In this exemplary embodiment, a server motherboard 445, a plurality of power modules 431, and interface cards 434 are mounted on the chassis 400. A storage device and / or other peripheral device components may also be mounted on the chassis 400, together with the backplane interface 330 and / or the power module and the communication system module. In one example, the mounting interface is such that one piece of hardware can be added to or removed from the chassis so as to be fixed to the chassis. On the inner surface of the chassis 400, measures can be taken to enable components (e.g., motherboards, GPUs, CPUs, interface cards, and other related components) to be mounted on the chassis. These measures are the mounting interface. The specific arrangement of the chassis system 400 will depend on the chassis 400 and / or the devices and / or components attached to the rack. An embodiment of a certain chassis 400 may feature a compatible mounting plate that can be used for mounting devices. A set of standard mounting plates may be used for common or frequently used components. The elements of the power and network interface modules within the chassis system 400 in terms of layout and form are based on the requirements and specifications of specific components and / or user-specified devices.

[0103] In one example, the mounting interface is such that one piece of hardware can be added to or removed from the chassis so as to be fixed to the chassis. On the inner surface of the chassis 400, measures can be taken to enable components (e.g., motherboards, GPUs, CPUs, interface cards, and other related components) to be mounted on the chassis. These measures are the mounting interface. The specific arrangement of the chassis system 400 will depend on the chassis 400 and / or the devices and / or components attached to the rack. An embodiment of a certain chassis 400 may feature a compatible mounting plate that can be used for mounting devices. A set of standard mounting plates may be used for common or frequently used components. An embodiment of a certain chassis 400 may feature a compatible mounting plate that can be used for mounting devices. A set of standard mounting plates may be used for common or frequently used components. These may be used for common or frequently used components.

[0104] The layout and form of the power and network interface modules within the chassis system 400 are based on the requirements and specifications of specific components and / or user-specified devices. It can be adjusted as needed. In one example, the power subsystem of the chassis can be changed to accommodate the needs of specific components. In other examples, the size of the chassis can be designed to accommodate any size of one piece of hardware. In still other examples, the chassis can provide different networking options depending on the network connection card installed in the chassis. For these and other configurations of the chassis, the chassis can accommodate a variety of components. As a result, the assembly and removal of these components of the pressure control vessel can be simplified and thus automated. For example, the chassis may include a blade server, and the robot can easily install or remove the chassis with respect to the rack of the pressure control vessel. In this way, the robot can remove and replace the blade server without human intervention, thereby minimizing human exposure to the dielectric fluid.

[0105] In an exemplary embodiment, the chassis may include a microcontroller communicable with the management system of the pressure control vessel. The microcontroller can receive sensor data from various sensors disposed within or external to the chassis. For example, the chassis may include a sensor for detecting whether the chassis is properly positioned within the rack. The server is appropriately positioned within the rack if the server can make a connection with the rack. The sensor can determine whether the chassis is properly positioned within the rack. In this way, the sensor can send data to the microcontroller, and using that data, the microcontroller can send a signal indicating whether the chassis is properly positioned within the rack. It can be supplied to the management system.

[0106] In one embodiment, the microcontroller can be coupled to a switch that can turn on or off components mounted within the chassis. The microcontroller can receive a power-on or power-off signal from the management system, and in response to receiving that signal, the microcontroller can send a signal to a switch that turns on or off a component, such as a server. In one exemplary embodiment, the microcontroller can receive operational data from the server, and the microcontroller can relay this data to the management system. The operational data is an indicator of the server's critical performance and can indicate its performance. The operational data can include the speed of computational operations, the degradation of computational operations, power consumption, the temperature of the circuit, and the bandwidth of the system. In one exemplary embodiment, the microcontroller can monitor, manage, and control the electrical and communication facilities of a blade server. For example, displays such as current (i.e., amperes) and voltage are monitored to confirm that the system can protect itself, for example, that there are no countermeasures for overcurrent or current shortage.

[0107] In one exemplary embodiment, the chassis may include a structure that enables a robot to grip and remove the chassis. For example, the chassis can be in the shape of a rectangular box having a front wall, a rear wall and side walls. The chassis may also include an upper wall and a bottom wall. The upper wall of the chassis can have a plate that can be coupled to a robotic arm.

[0108] In one exemplary embodiment, the chassis may include a structure that enables a robot to grip and remove the chassis. For example, the chassis can be in the shape of a rectangular box having a front wall, a rear wall and side walls. The chassis may also include an upper wall and a bottom wall. The upper wall of the chassis can have a plate that can be coupled to a robotic arm. ​​​​​​​It may be included. Using this plate, the robotic arm can grip the plate for unloading and other handling operations.

[0109] In an exemplary embodiment, the chassis may include mechanical guide rails and positioning pins to ensure proper alignment and insertion of the chassis in the rack. The mechanical guide rails may be disposed on the side walls of the chassis.

[0110] In an exemplary embodiment, the chassis may include various configurations to facilitate fluid flow. For example, the chassis may be in the shape of a rectangular box having a front wall, a back wall, and side walls. The chassis may also include an upper wall and a bottom wall. In this example, at least one of the walls of the chassis may include fluid flow holes throughout the wall. For example, the back wall may include a plurality of holes that allow fluid to flow into and out of the chassis when the chassis is immersed in a liquid bath.

[0111] In an exemplary embodiment, the chassis may include an opening to ensure that all fluid within the chassis is drained when the chassis is removed from the liquid bath. For example, the rack may be located in a liquid bath that cools computer components held by the rack. To remove the server, a robot can grip the plate of the chassis and lift the chassis out of the rack (thereby removing the chassis from the liquid bath). When the chassis is removed from the liquid bath, a certain amount of fluid may remain within the chassis. The chassis may include a pressure control container on the bottom wall of the chassis to ensure that the fluid can be evacuated even when the container is not perfectly horizontal. ​​​​​​​​​​​​​​It may include a notch or a drain. The notch or the drain is present at the corner of the bottom wall to obtain.

[0112] In an exemplary embodiment, the chassis may include a power interface and / or a communication interface . The interface can be electrically coupled to components mounted within the chassis to a rack and / or a pressure control vessel. The power interface and / or the communication interface can be disposed on a backplane. For example, a server mounted within the chassis can be connected to the interface of the chassis via various wirings and cables . When the chassis is disposed within a rack, the interface can be electrically coupled to the rack (i.e., a backplane receiver) and / or other interfaces connected to the pressure control vessel . Through the electrical coupling between these two interfaces (i.e., the backplane and the backplane receiver), power can be supplied to the server, and the server can be connected to a communication network inside or outside the pressure control vessel . The coupling between these two interfaces can be automatically performed during the mechanical insertion of the chassis into the rack . Similarly, by removing the chassis from the rack, the rack and / or the pressure control vessel can be disconnected from the server . . . . . .

[0113] In an embodiment, by providing standardized interconnectivity via a backplane interface 330 and a communication system interface, the possibility of misconnection of the data interface can be minimized, and the need for connection troubleshooting can be reduced . . to be able to.

[0114] In certain embodiments, the chassis 400 includes a set of standard power and network interfaces. The network interface may be in the form of a Cat6A or Cat7 compatible RJ45 interface for connection to a 1G or 10G Ethernet interface on the motherboard of the device. In such embodiments, the power interface may include a set of standard Molex style connectors for connection to the standard motherboard and / or peripheral components. In one exemplary embodiment, the pressure control vessel may include an internal database that stores information about the components installed within the system. The internal database may be a repository of the components installed in the pressure control vessel. For example, the internal database can store the configuration and model of each server and power supply installed within the system.

[0115] Since the components of the system are replaced or substituted, for example, by a robot, the management system can track changes and updates to the information stored in the internal database. The pressure control vessel can also be connected to an external database via a network.

[0116] In one exemplary embodiment, each chassis may be associated with a unique serial number, for example, displayed as a barcode on the chassis. When a component is placed within the chassis, the specifications of the component (or the configuration and model of the component) can be stored in an external database in association with the unique serial number. Thereafter, when the chassis is installed in the pressure control vessel, the pressure control vessel searches for the unique serial number in the external database. ​​Components can be referenced by. For example, a robotic arm is on a chassis able to scan barcodes, and the management system can search in an external database using the barcodes The management system can update the internal database using the information obtained from the external database. Similarly, when the chassis is removed from the pressure control vessel, the robotic arm can scan the barcode associated with the chassis and the management system can update the internal database to indicate that the components mounted on the chassis are no longer installed in the system In one exemplary embodiment, the chassis may include an RFID tag. The robotic arm of the pressure control vessel may include a scanner capable of emitting radio waves to detect the RFID tag. When the robotic arm is handling the chassis, the robotic arm can scan the RFID tag and provide the unique serial number to the management system to update the internal database

[0117] and provide the unique serial number to the management system to update the internal database In one exemplary embodiment, the chassis may include an identification plate that may include a user-specific asset identification number. This asset identification number can be stored in association with the components installed in the chassis In one embodiment, the identification plate may be a chip configured to store the asset identification number In one exemplary embodiment, the chassis may include a pump for enhancing the flow of fluid within the chassis. To maximize heat exchange between the components within the chassis and the liquid tank, the chassis may include a pump capable of circulating fluid within the chassis and around the components. The pump is part of the chassis

[0118] In one exemplary embodiment, the chassis may include an identification plate that may include a user-specific asset identification number. This asset identification number can be stored in association with the components installed in the chassis In one embodiment, the identification plate may be a chip configured to store the asset identification number In one exemplary embodiment, the chassis may include a pump for enhancing the flow of fluid within the chassis. To maximize heat exchange between the components within the chassis and the liquid tank, the chassis may include a pump capable of circulating fluid within the chassis and around the components. The pump is part of the chassis

[0119] In one exemplary embodiment, the chassis may include a pump for enhancing the flow of fluid within the chassis. To maximize heat exchange between the components within the chassis and the liquid tank, the chassis may include a pump capable of circulating fluid within the chassis and around the components. The pump is part of the chassis In order to maximize heat exchange between the components within the chassis and the liquid tank, the chassis may include a pump capable of circulating fluid within the chassis and around the components. The pump is part of the chassis In order to maximize heat exchange between the components within the chassis and the liquid tank, the chassis may include a pump capable of circulating fluid within the chassis and around the components. The pump is part of the chassis​​​ Fluids can be drawn from various conduits extending to the periphery and pushed out of the chassis, or vice versa. This can be done.

[0120] In one exemplary embodiment, the chassis can include various conduits around the chassis to dry the chassis and the components mounted thereon. When the chassis is withdrawn from the liquid tank, a predetermined amount of liquid may remain in the chassis or within the components therein. The chassis can include various conduits that can induce the flow of gas within the chassis or around the components to facilitate drying of the chassis and the components. In one exemplary embodiment, the pressure control vessel can expose the chassis to a gas flow before delivering the chassis to the user. For example, the chassis may include an input pipe for receiving the gas flow, and the pressure control vessel can supply the gas flow through the input pipe.

[0121] FIG. 9D shows the bottom wall 415 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the bottom wall 415 can include a power interface 416 and a communication interface 417. FIG. 9D also shows the guide rail 421 on the side wall 420 of the chassis 400.

[0122] FIG. 9E shows the top wall 425 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the top wall 425 can include a plate 426 and a pair of handles 427. The robotic arm can remove the chassis 400 using the plate 426.

[0123] FIG. 9F shows the side wall 420 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, ​​​​​​​​​​​In a configuration, side wall 420 may include a guide rail 421. FIG. 9F also shows back wall 410 , handle 427 and power interface 416.

[0124] FIG. 9G shows an exploded view of bottom drain hole 450 of chassis 400 according to an exemplary embodiment . In this exemplary embodiment, bottom drain hole 450 can be disposed at the corners of bottom wall 415, side wall 420 and back surface wall 410.

[0125] FIGS. 10A - F show exemplary embodiments of pressure control vessel 500. In particular, FIG. 10A shows vessel 500, e.g., an exemplary embodiment of a 600KW skid. The exemplary embodiment includes a Joule - type skid. Vessel 500 may include a plurality of forklift tubes 514 to facilitate movement and transfer of vessel 500 to a desired location. Vessel 500 can receive power and communication input 511 and process water from process water pipe 512 with a minimum of penetrations through the vessel itself . These connections may be disposed at the top of the vessel to facilitate sealed packaging of modular vessels in a data center. In some embodiments, the connections may be disposed at the front and / or sides of the vessel to accommodate vertical stacks of a plurality of modular vessels within the data center. In some embodiments, the vessel may include vertical spacers to facilitate vertical stacking of the vessels on top of each other . The vertical space can form additional space for connections, airflow and / or insulation between the vessels. By stacking the vessels vertically , a very high power density can be achieved in square feet. In some embodiments, vessel 500 receives input 511 and distributes power and network connections across vessel 500 . . The vertical space can form additional space for connections, airflow and / or insulation between the vessels. By stacking the vessels vertically , a very high power density can be achieved in square feet. In some embodiments, . By stacking the vessels vertically, a very high power density can be achieved per square foot. In some embodiments, vessel 500 receives input 511 and distributes power and network connections across vessel 500 It may include a power and communication box configured to distribute. The container 500 is the container 500 It may include a sealing lid 515 that can facilitate the addition of components to the container 500 and / or the removal of components from the container 500 5.

[0126] Figure 10B shows other views of the container 500. In certain embodiments, an inventory of replacement components may be stored within the container 500 so that components can be replaced using the robotic system within the container without opening the container The robotic system may be operated using a gantry motor 516. In such embodiments, if a component is damaged or in need of repair, a replacement component is installed in the system and the component to be removed, whether damaged or not, can be stored in a cassette until the cassette is full. At that point, the cassette containing the removed component is removed from the container and a new cassette with new replacement components can be inserted into the container for future use. In certain embodiments, the disclosed container is approximately 15 feet long, 7 feet wide, and 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet The robotic system may be operated using a gantry motor 516. In such embodiments, if a component is damaged or in need of repair, a replacement component is installed in the system and the component to be removed, whether damaged or not, can be stored in a cassette until the cassette is full. At that point, the cassette containing the removed component is removed from the container and a new cassette with new replacement components can be inserted into the container for future use. In certain embodiments, the disclosed container is approximately 15 feet long, 7 feet wide, and 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet The robotic system may be operated using a gantry motor 516. In such embodiments, if a component is damaged or in need of repair, a replacement component is installed in the system and the component to be removed, whether damaged or not, can be stored in a cassette until the cassette is full. At that point, the cassette containing the removed component is removed from the container and a new cassette with new replacement components can be inserted into the container for future use. In certain embodiments, the disclosed container is approximately 15 feet long, 7 feet wide, and 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet The robotic system may be operated using a gantry motor 516. In such embodiments, if a component is damaged or in need of repair, a replacement component is installed in the system and the component to be removed, whether damaged or not, can be stored in a cassette until the cassette is full. At that point, the cassette containing the removed component is removed from the container and a new cassette with new replacement components can be inserted into the container for future use. In certain embodiments, the disclosed container is approximately 15 feet long, 7 feet wide, and 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet The robotic system may be operated using a gantry motor 516. In such embodiments, if a component is damaged or in need of repair, a replacement component is installed in the system and the component to be removed, whether damaged or not, can be stored in a cassette until the cassette is full. At that point, the cassette containing the removed component is removed from the container and a new cassette with new replacement components can be inserted into the container for future use. In certain embodiments, the disclosed container is approximately 15 feet long, 7 feet wide, and 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet The robotic system may be operated using a gantry motor 516. In such embodiments, if a component is damaged or in need of repair, a replacement component is installed in the system and the component to be removed, whether damaged or not, can be stored in a cassette until the cassette is full. At that point, the cassette containing the removed component is removed from the container and a new cassette with new replacement components can be inserted into the container for future use. In certain embodiments, the disclosed container is approximately 15 feet long, 7 feet wide, and 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet The robotic system may be operated using a gantry motor 516. In such embodiments, if a component is damaged or in need of repair, a replacement component is installed in the system and the component to be removed, whether damaged or not, can be stored in a cassette until the cassette is full. At that point, the cassette containing the removed component is removed from the container and a new cassette with new replacement components can be inserted into the container for future use. In certain embodiments, the disclosed container is approximately 15 feet long, 7 feet wide, and 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet 15 feet long, approximately 7 feet wide, and approximately 10 feet high. In certain embodiments, the disclosed system supplies 600KW of computing power to be achieved in approximately 150 square feet for computing.

[0127] In certain embodiments, the container 500 may also include one or more bellows tanks 517. The bellows tank 517 can be used to adjust the pressure within the container. When the disclosed computing and / or cooling system is first activated, the expanded dielectric fluid may be directed to the bellows tank so that it does not escape to the environment and / or to avoid overpressure within the container The bellows tank 517 can be used to adjust the pressure within the container. When the disclosed computing and / or cooling system is first activated, the expanded dielectric fluid may be directed to the bellows tank so that it does not escape to the environment and / or to avoid overpressure within the container The bellows tank 517 can be used to adjust the pressure within the container. When the disclosed computing and / or cooling system is first activated, the expanded dielectric fluid may be directed to the bellows tank so that it does not escape to the environment and / or to avoid overpressure within the container The bellows tank 517 can be used to adjust the pressure within the container. When the disclosed computing and / or cooling system is first activated, the expanded dielectric fluid may be directed to the bellows tank so that it does not escape to the environment and / or to avoid overpressure within the container The bellows tank 517 can be used to adjust the pressure within the container. When the disclosed computing and / or cooling system is first activated, the expanded dielectric fluid may be directed to the bellows tank so that it does not escape to the environment and / or to avoid overpressure within the container It may be large enough to be held within a container.

[0128] FIG. 10C shows a cross-sectional view of the container 500. The lower portion of the container 500 may include a rack 310 and / or a chassis 400 that includes computing components. A condenser coil 132 that cools and condenses any dielectric vapor is on the rack. Power may be distributed into the container using a power bus bar 518. This enables power to be distributed to individual computing components in a hot-swappable manner. The power bus bar 518 enables the container to receive external power using only one or a few penetrations through the container. This design simplifies the installation and operation of the container system. In one embodiment, each power bus bar can supply 600 amperes as power to five racks. In such an embodiment, there may be a set of two bus bars on each side of the container. In one embodiment, the bus bar does not include a plastic insulator. Plastic may be considered a contaminant for some dielectric fluids and is generally avoided in some embodiments. In one embodiment, the container 500 may include a desiccant 519. In one embodiment, the dielectric vapor may be removed from the headspace of the container 500 and condensed in a manner that enables any non-condensable components to be removed from the dielectric fluid. Water does not condense under the same conditions as many dielectric fluids. Thus, this system can be used to remove water contaminants from the dielectric fluid. In one embodiment, the container 500 may include a fluid filter 520, a fluid pipe 521, and a fluid port.

[0129]

[0130] ​​​​​​​​​​​​​​ It may include the pump 522. In certain embodiments, the dielectric fluid may be added to the container in a manner that causes the liquid dielectric fluid to overflow from the rack 310 into the storage region 523. Then, the fluid may be filtered using the fluid filter 520 and pumped distally of the container using the fluid pump 522 and the fluid path 521. Since this system circulates the newly filtered dielectric fluid through the container, the dielectric fluid can be reused to cool the computing components.

[0131] FIG. 10D shows a cross-sectional view of the container 500. In this embodiment, the level of the liquid dielectric fluid can be maintained at a fluid height 524 that is higher than the height of the rack 310 and / or the computing components located therein. As a result, the rack 310 and / or the computing components will be immersed in the dielectric fluid. Saturated dielectric vapor can exist above the fluid height 524, for example, up to an intermediate height 525. In certain embodiments, the saturated dielectric vapor is maintained up to the intermediate height 525, which can be approximately half the height of the condenser coil 132. In certain embodiments, a headspace that may contain low-density dielectric vapor exists above the saturated vapor.

[0132] In the exemplary embodiment of FIG. 10D, the cooling coil 132 is located above the shelf region. In this way, when the robot 526 positions or removes the chassis 400, the cooling coil 132 will not be an obstacle thereto. This arrangement of the cooling coil 132 simplifies the positioning and removal of the chassis 400, thereby providing a significant benefit to the autonomous operation of the container.

[0133] Communication system Embodiments of the disclosed communication system are for standard level 1 to 3 connectivity and management interfaces for devices that are within or associated with the disclosed higher-level structure 210, pressure control vessel 110, and / or / or computing system and are designed to provide such. In certain embodiments, a series of MTP interfaces provide the function of introducing multiple high-density multimode fiber

[0134] connections to the pressure control vessel 110. When included in the pressure control vessel 110, the fiber connections can be split into individual switch-level connections using a set of dedicated breakout cables, breakout interfaces, patch panels, and / or distribution patch panels to the rack 310. In certain embodiments of the disclosed system, each rack 310 may include ports of a dedicated fiber patch panel interface to enable connection to a switch

[0135] system installed therein via a short patch panel. In other embodiments, there may be a dedicated patch panel, or a set of patch panel bits extending from each switch system to the MTP distribution interface. In certain embodiments, the interface between the switch system and the chassis 400 may be via a backplane interface 330 and / or via any other mechanism that may or may not include the use of backplane

[0136] connectors. In certain embodiments, a mid-relay rack-level switch system may be absent. In such embodiments, a set of centralized switches within the pressure control vessel 110 can be used to connect to various computing devices located there. ​

[0137] The standard interface between the switch system and the chassis 400 is realized using a patch panel attached to the rack 31 0, and is wired to the backplane system 330 with patch cables that connect the ports of the patch panel to the appropriate ports of the switch system It can be.

[0138] In one embodiment, a small (6U) rack rail area including a patch panel that interconnects the communication system cabinet to the MTP interface in each pressure control vessel 110, As well as a centralized communication system distribution switch that acts to interconnect the switch systems to each other and / or to the outside world. In such an embodiment, an end user or customer can choose to install their own cabling means within this space and provide an external connection that serves as a connection between the disclosed computing system and the outside world, or to make a fiber connection between the pressure control vessel 110 or the upper structure 210 and an existing network environment. It can be.

[0139] The access, communication and / or networking components utilized within the communication system environment embodiments may be standard equipment or user-specified. The system of rack 310 and backplane interface 330 may include the function of replacing the switch system located within each rack 310 by removing an existing switch, replacing it with some standard switch (such as a 1U switch), and rewiring the desired interface to the backplane network interface panel. 10 and the backplane interface 330 may include the function of replacing the switch system located within each rack 310 by removing an existing switch, replacing it with some standard switch (such as a 1U switch), and rewiring the desired interface to the backplane network interface panel. It may also include.

[0140] ​​​​​​​​​In certain embodiments, products designed to interface directly with the backplane system 330 may be utilized. Such products may interface via a specialized dedicated interconnect interface, via commercially used protocols, or via specifications for the design of a network worklevel interconnect interface, to the patch panel system of the chassis 400 and / or to a direct electrical interface specifically designed to interconnect switch ports. In one embodiment, the connections between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port that may be a standard port available on a commercially available switch. A common interface may be 1GBase-T or 10GBase-T that utilizes a Cat6 or Cat7 twisted pair copper connection between the switch and the host device. Another interface may be a switch-backplane relay device that may consist of either a patch panel with a standard patch cable from the standard switch port to the front side of the patch panel and a hardwired connection from the back side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of a specialized cable from the switch port towards the board and / or a standard RJ45 interface to establish a connection between the standard switch port and the backplane. Still another interface may be an interface system that distributes the signal path along a printed circuit board (PCB) from the standard switch port. to the patch panel system of the chassis 400 and / or to a direct electrical interface specifically designed to interconnect switch ports. In one embodiment, the connections between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port that may be a standard port available on a commercially available switch. A common interface may be 1GBase-T or 10GBase-T that utilizes a Cat6 or Cat7 twisted pair copper connection between the switch and the host device. Another interface may be a switch-backplane relay device that may consist of either a patch panel with a standard patch cable from the standard switch port to the front side of the patch panel and a hardwired connection from the back side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of a specialized cable from the switch port towards the board and / or a standard RJ45 interface to establish a connection between the standard switch port and the backplane. Still another interface may be an interface system that distributes the signal path along a printed circuit board (PCB) from the standard switch port.

[0141] In one embodiment, the connections between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port that may be a standard port available on a commercially available switch. A common interface may be 1GBase-T or 10GBase-T that utilizes a Cat6 or Cat7 twisted pair copper connection between the switch and the host device. Another interface may be a switch-backplane relay device that may consist of either a patch panel with a standard patch cable from the standard switch port to the front side of the patch panel and a hardwired connection from the back side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of a specialized cable from the switch port towards the board and / or a standard RJ45 interface to establish a connection between the standard switch port and the backplane. Still another interface may be an interface system that distributes the signal path along a printed circuit board (PCB) from the standard switch port. In one embodiment, the connections between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port that may be a standard port available on a commercially available switch. A common interface may be 1GBase-T or 10GBase-T that utilizes a Cat6 or Cat7 twisted pair copper connection between the switch and the host device. Another interface may be a switch-backplane relay device that may consist of either a patch panel with a standard patch cable from the standard switch port to the front side of the patch panel and a hardwired connection from the back side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of a specialized cable from the switch port towards the board and / or a standard RJ45 interface to establish a connection between the standard switch port and the backplane. Still another interface may be an interface system that distributes the signal path along a printed circuit board (PCB) from the standard switch port. to the patch panel system of the chassis 400 and / or to a direct electrical interface specifically designed to interconnect switch ports. In one embodiment, the connections between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port that may be a standard port available on a commercially available switch. A common interface may be 1GBase-T or 10GBase-T that utilizes a Cat6 or Cat7 twisted pair copper connection between the switch and the host device. Another interface may be a switch-backplane relay device that may consist of either a patch panel with a standard patch cable from the standard switch port to the front side of the patch panel and a hardwired connection from the back side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of a specialized cable from the switch port towards the board and / or a standard RJ45 interface to establish a connection between the standard switch port and the backplane. Still another interface may be an interface system that distributes the signal path along a printed circuit board (PCB) from the standard switch port. to the patch panel system of the chassis 400 and / or to a direct electrical interface specifically designed to interconnect switch ports. In one embodiment, the connections between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port that may be a standard port available on a commercially available switch. A common interface may be 1GBase-T or 10GBase-T that utilizes a Cat6 or Cat7 twisted pair copper connection between the switch and the host device. Another interface may be a switch-backplane relay device that may consist of either a patch panel with a standard patch cable from the standard switch port to the front side of the patch panel and a hardwired connection from the back side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of a specialized cable from the switch port towards the board and / or a standard RJ45 interface to establish a connection between the standard switch port and the backplane. Still another interface may be an interface system that distributes the signal path along a printed circuit board (PCB) from the standard switch port. to the patch panel system of the chassis 400 and / or to a direct electrical interface specifically designed to interconnect switch ports. In one embodiment, the connections between each blade or chassis and the switch may include multiple interfaces. One interface may be a standard switch port that may be a standard port available on a commercially available switch. A common interface may be 1GBase-T or 10GBase-T that utilizes a Cat6 or Cat7 twisted pair copper connection between the switch and the host device. Another interface may be a switch-backplane relay device that may consist of either a patch panel with a standard patch cable from the standard switch port to the front side of the patch panel and a hardwired connection from the back side of the patch panel to the signal interface of the signal backplane. It can become a lane. One or more of the signal paths may be terminated at a connector in a PCB to which the signal backplane interface is connected. Furthermore, other interfaces may be chassis signal backplane interfaces. This may be a connector located on the chassis itself that mates with a connector in the interface system signal backplane. It serves as an interface between the interface system signal backplane and the chassis itself. Furthermore, other interfaces may be chassis network interfaces. This may be a standard patch interface that enables connection of a patch cable from the chassis network interface to an RJ45 interface in a server attached to the chassis.

[0142] Robot system In an embodiment of the disclosed system, a promising way to address the need for hot-swapability of components within the pressure control vessel 110 is shown. The need for a function to remotely remove and replace a failed component 170 can be addressed by a robot.

[0143] Certain embodiments of the disclosed system combinations may include an internal robot arm 230 and / or an external robot arm 240. Some embodiments, such as cryptocurrency applications and / or embodiments for certain high-performance computing environments, may require hot-swapability of components. In other hyperscale GPU and CPU environments, this may be a basic requirement. Embodiments of the disclosed robot system enable replacement of the chassis and / or other computer components without interrupting any other components. ​ In one embodiment, a failed card and / or component can be automatically and / or programmatically replaced and / or stored. This enables fully remote and autonomous operation of the disclosed system embodiments for short and medium periods of time. In one embodiment, a failed card and / or component can be automatically and / or programmatically replaced and / or stored. This enables fully remote and autonomous operation of the disclosed system embodiments for short and medium periods of time. In one embodiment, a failed card and / or component can be automatically and / or programmatically replaced and / or stored. This enables fully remote and autonomous operation of the disclosed system embodiments for short and medium periods of time.

[0144] The mechanism of the internal robot arm 230 is located within the environment of the pressure control vessel 110. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot. As shown in FIGS. 7A-D, in an exemplary embodiment, when a card or component is not operating properly, a removal sequence can be initiated. When the removal sequence is initiated, the internal arm 230 removes the appropriate computer component 170 and / or associated chassis 400 from the rack 310 and moves it to the airlock 220 located within the pressure control vessel 110, signaling the completion of the removal sequence. When this sequence is complete, the inner airlock door 222 closes, the pressure in the airlock is equalized with the pressure of the outside atmosphere, and the outer airlock door 224 opens. When the outer door 224 is opened, the external robot arm 240 removes the chassis 400 from the airlock 220 and places it in an empty storage slot.

[0145] In one embodiment, before the airlock 220 is opened to the external environment, the airlock 220 is purged with nitrogen, other inert gases, and / or non-condensable gases. In one embodiment, this has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is aligned internally, externally, or both with a one-way valve. In embodiments having one-way valves both internally and externally of the airlock, purging the airlock prevents cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment. In one embodiment, before the airlock 220 is opened to the external environment, the airlock 220 is purged with nitrogen, other inert gases, and / or non-condensable gases. In one embodiment, this has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is aligned internally, externally, or both with a one-way valve. In embodiments having one-way valves both internally and externally of the airlock, purging the airlock prevents cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment. In one embodiment, before the airlock 220 is opened to the external environment, the airlock 220 is purged with nitrogen, other inert gases, and / or non-condensable gases. In one embodiment, this has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is aligned internally, externally, or both with a one-way valve. In embodiments having one-way valves both internally and externally of the airlock, purging the airlock prevents cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment. In one embodiment, before the airlock 220 is opened to the external environment, the airlock 220 is purged with nitrogen, other inert gases, and / or non-condensable gases. In one embodiment, this has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is aligned internally, externally, or both with a one-way valve. In embodiments having one-way valves both internally and externally of the airlock, purging the airlock prevents cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment. In one embodiment, before the airlock 220 is opened to the external environment, the airlock 220 is purged with nitrogen, other inert gases, and / or non-condensable gases. In one embodiment, this has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is aligned internally, externally, or both with a one-way valve. In embodiments having one-way valves both internally and externally of the airlock, purging the airlock prevents cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment. In one embodiment, before the airlock 220 is opened to the external environment, the airlock 220 is purged with nitrogen, other inert gases, and / or non-condensable gases. In one embodiment, this has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is aligned internally, externally, or both with a one-way valve. In embodiments having one-way valves both internally and externally of the airlock, purging the airlock prevents cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment. This also prevents loss of dielectric vapor.

[0146] When a card or component exchange sequence is initiated, the external robotic arm 240 4. Remove the replacement component and / or chassis 400 from the storage slot and place the component in the airlock. 220. Once complete, the outer airlock door 224 closes and the airlock is depressurized. The internal pressure of the pressure controlled vessel 110 is equalized and the inner door 222 is opened. Once the airlock 220 is open, the internal robotic arm 230 removes the chassis 400 from the airlock 220. 3 and insert it into the appropriate rack 310.

[0147] When coupled with a remotely accessible management system, the internal and external robotic arms 23 0 and 240 allow remote operation and management of data center environments. This reduces human Reduces the need for operators to be on standby, reducing costs and / or downtime In one embodiment, the external robotic arm 240 is mounted on a movable base, Thereby, one external robotic arm system can be connected to the disclosed computing system. It is possible to act in multiple embodiments.

[0148] When integrated with custom-developed workflow management systems and virtualization technologies, the disclosed robots The system must be fully autonomous and self-regulating, providing the highest level of system reliability. This enables the development of data center solutions that are easy to use.

[0149] In some embodiments, the unique human and / or machine readable serial number and / or product ID number may be An asset tag having a tag code is included with each computer component and / or chassis. In these embodiments, the asset tag may be a unique serial number. The tag may include a printed barcode or a QR code, and may be used by embodiments of the disclosed robotic system. The tag code may be used for detailed inventory control and automation systems. It may also be used in conjunction with a management software system that provides detailed component information. The adhesive and any associated adhesives or other components are preferably made of a material that is compatible with the dielectric fluid. The tag preferably comprises a slot that is readable when the chassis is inserted into the rack. In one embodiment, a secondary or additional tag is located on the chassis at the pot. may be located in other areas of the chassis to aid in component and / or inventory control identification. good.

[0150] An embodiment of the disclosed robotic system is capable of temporarily removing and This allows for a process called "reseat" in which the battery is replaced during troubleshooting. , is useful when it is determined that a hard power cycle of the component is desired. This is accomplished by cutting all power, waiting a moment, and then reconnecting it.

[0151] In some embodiments, individual cards and / or chassis are inserted into a pressure controlled enclosure through an airlock. In one embodiment, the robotic system may include a rack. Remove the chassis from the slot, move it to the airlock, and the airlock is opened. This signal indicates the completion of this task, allowing the card and / or chassis to be removed. Some embodiments may route replacement components through the same airlock used for removal. and / or enables the chassis to be placed in a specific rack slot. In certain embodiments the robotic system removes the chassis from the airlock, places it in the appropriate rack slot, and signals completion of this task.

[0152] Robot for internal system Embodiments of the disclosed system may include an "inside-the-robot" robotic system. In such embodiments, the pressure control vessel may be extended to house robotic arms operating within the vessel. The vessel may be arranged to accommodate the movement or transfer of computer components and / or the chassis on a rack containing operating computer components. It should be understood that the pressure control vessel may also be referred to as a tank, pod, and / or vacuum chamber. Alternatively, it should be understood that certain components of the pressure control vessel may be referred to as a tank or pod. It should be understood that the pressure control vessel may also be referred to as a tank, pod, and / or vacuum chamber. Alternatively, it should be understood that certain components of the pressure control vessel may be referred to as a tank or pod. It should be understood that the pressure control vessel may also be referred to as a tank, pod, and / or vacuum chamber. Alternatively, it should be understood that certain components of the pressure control vessel may be referred to as a tank or pod. Figure 10E illustrates an embodiment of a disclosed system having a gantry robot 526 configured to remove, replace, and / or install computing components, such as the chassis 400 of rack 310. In certain embodiments, the gantry robot 526 may be configured to remove, replace, and / or install the DC rectifier and / or other components of the power distribution system. It should be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. Figure 10E illustrates an embodiment of a disclosed system having a gantry robot 526 configured to remove, replace, and / or install computing components, such as the chassis 400 of rack 310. In certain embodiments, the gantry robot 526 may be configured to remove, replace, and / or install the DC rectifier and / or other components of the power distribution system. It should be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions.

[0153] Figure 10E illustrates an embodiment of a disclosed system having a gantry robot 526 configured to remove, replace, and / or install computing components, such as the chassis 400 of rack 310. In certain embodiments, the gantry robot 526 may be configured to remove, replace, and / or install the DC rectifier and / or other components of the power distribution system. It should be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. Figure 10E illustrates an embodiment of a disclosed system having a gantry robot 526 configured to remove, replace, and / or install computing components, such as the chassis 400 of rack 310. In certain embodiments, the gantry robot 526 may be configured to remove, replace, and / or install the DC rectifier and / or other components of the power distribution system. It should be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. In certain embodiments, the gantry robot 526 may be configured to remove, replace, and / or install the DC rectifier and / or other components of the power distribution system. It should be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. In certain embodiments, the gantry robot 526 may be configured to remove, replace, and / or install the DC rectifier and / or other components of the power distribution system. It should be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. Some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. Some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. It should be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be hot-swappable and may include a handle or other configuration that facilitates handling by the gantry robot 526. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. In certain embodiments, the gantry robot 526 may be configured to travel in both the x and y directions. configured to be able to descend in the z direction to remove and / or install replacement components . In certain embodiments, the gantry robot 526 includes a gripping tool that holds the chassis 400 and / or the power supply, and for example, the gripping tool can grip the plate 426.

[0154] FIG. 10E shows a top cross-sectional view of an exemplary embodiment of the disclosed tank. In certain embodiments, an array of racks 310 may be mounted to the chassis 400 and / or the computing substrate. . In certain embodiments, each chassis 400 utilizes approximately 6 KW of power, and each rack 310 may include 10 chassis. Thus, in an embodiment including such 10 racks 310, the container can utilize approximately 600 KW of power for computing. . In certain embodiments, additional racks 310 and / or magazines 527 of the chassis 400, along with the DC power rectifier, may be stored in the container 500 and may provide space for components used as replacement components and / or for storing components removed from the container 500.

[0155] Robot for external system FIGS. 12A - E show other embodiments of the container. In particular, FIG. 12A illustrates an embodiment of a container 700 in which a gantry robot 526 is present external to a tank 710 that houses the chassis 400 and / or computing components. In this embodiment, the tank 710 is smaller, but the external gantry robot 526 needs to be opened more frequently to access the chassis 400 and / or the power supply inside the tank 710. Also, the switch is housed within a modular enclosure such as a storage unit 716 external to the tank 710. It may be incorporated and / or housed. In some embodiments, the tank 710 has a plurality of doors 711 and may thereby limit the exposure of the interior of the tank 710 when one door 711 is opened for the purpose of removing, installing, and / or replacing components or the chassis 400. In such embodiments, the replacement components may be stored outside the tank 710 to avoid unnecessarily opening the tank .

[0156] Furthermore, the container 700 may include one or more transformers 712, a power distribution panel 713, a process water pipe 5 12, and an electrical chase 714. The container 700 may also include a programmable logic controller (PLC) cabinet 715 for monitoring and controlling the status of various devices within the container 700. The transformers 712, the power distribution panel 713, the process water pipe 512, the electrical chase 714, and the PLC cabinet 715 may be located outside the tank 710 . as well.

[0157] FIG. 12B shows a cross-sectional view of the container 700 in which the tank 710 is accessible by an external gantry robot 526. In this exemplary embodiment, the condenser coil 132, the rack 310, and the bellows 717 are located in the tank 710. FIG. 12C shows a side view of the container 700 having the tank 710 with an external gantry robot and a plurality of doors 711. In this exemplary embodiment, the tank 710 includes a fluid pump for removing fluid from the storage area and delivering the fluid through a fluid pipe 521 to a fluid filter 520. The container 700 also includes a magazine 718 for storing replacement equipment. In this exemplary embodiment, the magazine 718 is located outside the tank 710. In some embodiments, the liquid dielectric fluid in the tank 710 ​​​​​​​​​​ Spacers and / or ballast blocks 160 may be used to reduce the overall volume as well.

[0158] FIG. 12D shows a rack 310 according to an exemplary embodiment. In one embodiment, the redundant power supply 314 may be located on the opposite side of the rack 310 rather than adjacent to the primary power supply 313. Furthermore, the power and / or data cables 318 and 319 may be routed in an alternative configuration to accommodate the specific requirements of a particular deployment. In this exemplary embodiment, the backplane receiver 331 is located at the bottom of the rack 310.

[0159] FIG. 12E shows an exemplary hinged door 711 that may be used in an alternative embodiment of the disclosed tank 710. In one embodiment, a sliding door may be used instead of a hinged door to reduce or avoid induced currents in the dielectric vapor. Slowly sliding the door open results in less variation in the dielectric vapor compared to swinging the hinged door open and generating a mixing current.

[0160] Management system The management system is a web-based interface between the user of the disclosed computing system and the computing system itself. Embodiments of the management system provide operational displays of the computing system and enable monitoring and management of various components including the pressure control vessel 110, the robotic system, the communication system, the power system, and / or other systems and components. In one exemplary embodiment, the management system may be implemented in the PLC cabinet 715 of FIG. 12A. In other exemplary embodiments it may be implemented in the PLC cabinet 715 of FIG. 12A. In other exemplary embodiments ​​​​​​​​​​, The management system can be implemented in the power and communication box 513 of FIG. 10A. In each embodiment, the power management system can be implemented as a control device or other suitable device, such as a software program on a computer.

[0161] In certain embodiments, a set of data points accessible via a simple network management protocol may be made available to the user of the management system to enable monitoring of key operating parameters via a third- party monitoring system. All operation logs may be retained, and charts may be provided for user updating of operating condition data.

[0162] Periodic maintenance of system components may be scheduled and maintained via the management system. The user may be given periodic reminders of the scheduled maintenance, and the user may be able to recognize it as being executed within the interface. All of this data may be retained as part of the operation log information for consideration of historical operations.

[0163] In one embodiment, the operating functions may be exposed via an API interface to enable remote monitoring and management by a computing system and associated components. A full set of operation monitoring and warning functions may be included to enable notification to an operator in the event of any problems.

[0164] A centralized server version or a hosted cloud-based version of the management system may be used to serve customers using multiple pressure control vessel computing systems. can be used. This provides the operator with a user-accessible interface by a single program for the management of a group of pressure control vessel computing systems.

[0165] In certain embodiments, a software-based interface module enables interaction with utility platforms such as Microsoft System Center and VMWare VCenter and third-party management utilities. The user, and the API interface provided by the management system, enable full interaction with the disclosed robotic system and enable full remote and programmatic autonomous operation and management of the disclosed computing platform.

[0166] In certain embodiments, the control system enables adjustment and control of operations including temperature, pressure, flow rate, and / or power management. In certain embodiments, the user authentication system enables multiple unique users to be authenticated to the system. Certain embodiments include a role-based and / or element-based permission system. In such embodiments, the administrator can configure multiple roles to which users are assigned and / or apply specific permissions to individual users outside of their role assignments.

[0167] Certain embodiments include video management to provide the user with the ability to record and acquire video input from cameras that may be located within the vessel and / or superstructure. In certain embodiments, the camera can acquire visible data that can be analyzed by a processor. In such embodiments, the processor can, depending on the acquired visible data, control the vessel, robot, and / or superstructure. ​​​​​​​​To control the operation of the system, computer vision technology may be utilized.

[0168] In certain embodiments, the control system and software may be configured to generate reports regarding the operation and state of the overall system, individual subsystems, and / or components of the disclosed computing platform.

[0169] Exemplary merged system embodiments It should be understood that the disclosed systems may be utilized individually or in combination. There are numerous embodiments of a converged computing system that can be adapted to various use cases.

[0170] One exemplary embodiment is the Crypto series. This is a high-density example of the disclosed technology that utilizes dedicated computing hardware, a guide plate and wiring harness designed for that hardware, a rack 310, a variant embodiment of the architecture of a communication system 360, and a 1MW pressure control vessel 110 and power distribution system. Typical users of this embodiment are those who wish to perform cryptocurrency mining or other high-power density processing using customized computing components, or manufacturers of computing components who wish to develop an all-inclusive two-phase liquid immersion cooling system that includes their own hardware.

[0171] Another exemplary embodiment is the GPU series. This is an example of high-density GPU supercomputing of the disclosed technology. This example uses Gigabyte motherboards with NVidia NVLink technology that facilitates ultra-fast GPUs for GPU communication. Custom chassis 400 designed to include a board and an NVidia GPU. Utilize the technologies of rack 310 and backplane interface 330. The typical user of this technology can utilize the GPU-based computing and memory capabilities for general-purpose parallel processing applications including graphical rendering, particle simulations, and general research activities.

[0172] Still other exemplary embodiments are the CPU series. This is an example of high-density CPU computing of the disclosed technology. This example utilizes a high-end Supermicro-based motherboard, an Intel Xeon CPU, a high-speed network interface, high-speed memory, and a semiconductor memory device for local storage. The typical users of this technology are data centers, enterprises, and cloud / VPS hosting providers and service providers that utilize high-performance computing for their own

[0173] internal applications or for what they provide to third-party customers and other organizations. Still other exemplary embodiments include the Edge series. This is an example of scaling down the disclosed computing system specifically designed for remote / field deployment or within or associated with conventional business and data center environments. The embodiments Becoming an operator of existing facilities who wishes to further enhance their computing capabilities This system can simplify the connection to a utility service system that includes various expansion functions in an external structure, including electrical, water, and network connections.

[0174] Self - contained embodiments Certain embodiments of the disclosure do not require an external water supply source. Such embodiments may include a closed-loop chiller for cooling water or other fluids that can be circulated through a condenser as described above Using a closed-loop chiller instead of an external cooling water supply source enables a substantially self-contained embodiment.

[0175] Figure 13 shows an exemplary self-contained container 750. The exemplary embodiment of Figure 13 utilizes a skid-mounted closed-loop chiller 719 for cooling water or other liquids used in a condenser within a pod or immersion tank 710. By utilizing a closed-loop chiller, the need for an external cooling water supply source is eliminated, resulting in a self-contained data center solution that requires only an external power source and a network connection to be fully operational. Container 7 50 may also include bellows 717, door 711, gantry robot 526, power distribution panel 713, PLC cabinet 715, and magazine 718.

[0176] In certain embodiments, the closed-loop chiller 719 can be a skid-mounted closed-loop chiller enclosed within an outer housing of a modular pressure control container In such embodiments heat is transferred from computer components to a dielectric liquid within tank 710. This process converts the dielectric liquid to a dielectric vapor as described herein. The dielectric vapor is then transferred to the tank​​ rises within 710 and is cooled by a condenser, thereby converting the dielectric vapor into a dielectric liquid and returning it. The heat transferred from the dielectric vapor to the condenser is transferred from the condenser to the refrigerant or the condensing fluid within the condenser and then transferred to the closed-loop chiller 719. In certain embodiments the chiller 719 removes heat from the refrigerant or the condensing fluid using vapor compression, a compressor, an evaporator, a heat exchanger, or other means of cooling the refrigerant or the condensing fluid in a closed loop. The heat from the refrigerant or the condensing fluid is ultimately dissipated via air cooling. In certain embodiments, this results in a self- contained modular air-cooled two-phase liquid immersion computing system. The field of immersion cooling has generally taught the opposite with respect to air cooling, particularly for self-contained devices, so the air cooling of any self-contained embodiment is surprising.

[0177] Certain embodiments of the disclosure may be provided in the form of space-saving installation footprints. The exemplary embodiment includes a single rack containing 10 blades or servers immersed in a dielectric liquid as described above. In certain embodiments, each server can draw approximately 6 kW of power. Thus, approximately 60 kW of computer power is provided in a small installation footprint.

[0178] The exemplary embodiment shown in FIG. 13 is contained within an installation footprint that is approximately 4 feet 2 inches deep, approximately 8 feet 8.5 inches wide, and approximately 8 feet 8 inches tall. This exemplary embodiment includes approximately 60 kW of computer power as well as other operating components and systems and is contained within an area of approximately 36.3 square feet. The operating components of the enclosure include, but are not limited to, a tank or pod containing a dielectric fluid, a condenser, a power supply, and data connections for the computer components. should be understood to be able to include. The container may also include sensors, control devices, power cabinets, bellows 717, vacuum systems, fluid filters, purge systems and / or other components. Some self - contained embodiments may include an outer housing. In some embodiments, the outer housing encloses the container, provides structural support, is skid - mountable, ventilated, weather - and / or water - resistant, and / or may be decorative. In some embodiments, the outer housing of a self - contained container may include a radiator coil, a fan grate, heat transfer components and / or air - cooling components that facilitate the use of a closed - loop chiller.

[0179] In some embodiments, a self - contained computing system supplies computing power of at least about 1.5 kW per square foot, at least about 1.6 kW per square foot, at least about 1.65 kW per square foot, at least about 1.8 kW per square foot, at least about 2.0 kW per square foot, or at least about 3.0 kW per square foot. In some embodiments, a self - contained computing system supplies computing power of at most about 1.5 kW per square foot, at most about 1.6 kW per square foot, at most about 1.65 kW per square foot, at most about 1.8 kW per square foot, at most about 2.0 kW per square foot, or at most about 3.0 kW per square foot. It should be understood that more or less computing power can be supplied within a given installation area by adjusting the height of the self - contained system. 1.8 kW per square foot, at most about 2.0 kW per square foot, or at most about 3.0 kW per square foot. It should be understood that more or less computing power can be supplied within a given installation area by adjusting the height of the self - contained system. It should be understood that more or less computing power can be supplied within a given installation area by adjusting the height of the self - contained system. It should be understood that more or less computing power can be supplied within a given installation area by adjusting the height of the self - contained system.

[0180] The dimensions, components, arrangements, and configurations of the exemplary embodiments of the disclosure can be modified, added to, and / or removed to generate various potential embodiments in various morphological elements. It should be understood that. should be.

[0181] In one embodiment, a self - contained computing system can include, for example, a robotic system such as a gantry robot 526 configured to remove, replace, and / or install blades, power supplies, or other components, such as a chassis 400. The self - contained system can include either an "inner - side robot" or an "outer - side robot" of the system. In embodiments with a smaller installation footprint, a smaller magazine 7 18 for replacement components can be used. In one embodiment, the magazine 718 for replacement components may be attached outside the tank 710 shown in FIG. 13. In one embodiment, the tank 710, rack, computer components, power supply, replacement magazine 718, and gantry robot 526 are arranged such that the gantry robot 526 can remove, replace, and / or install components while traveling substantially in only one direction. When various components are arranged substantially linearly, the gantry robot 526 can travel along a single axis to remove, replace, and / or install the desired components without traveling in a second direction. The gantry robot 526 may be capable of moving components up and down in addition to traveling in a single linear direction. It should be understood that. By utilizing small elements such as those shown in the embodiment of FIG. 13, a self - contained 2PL IC system can be easily transported. By including a closed - loop chiller 719 in. it should be understood that the gantry robot 526 may be capable of raising and lowering components in addition to traveling in a single linear direction. should be understood.

[0182] By utilizing small elements such as those shown in the embodiment of FIG. 13, a self - contained 2PL IC system can be easily transported. By including a closed - loop chiller 719 Therefore, the two-phase liquid immersion cooling system may not have access to a practical source of the coolant water. It can be used under remote conditions. Furthermore, it does not require external cooling water. In one embodiment, a self - contained computing system is formed that requires only two external connections, one power supply, and one data connection.

[0183] In one embodiment, the computing system may be contained within an outer housing as shown in FIG. 14. In one embodiment, the components identified and / or disclosed herein schematically in FIG. 13 may be contained within the outer housing. In one embodiment, the volume of the outer housing may be adapted based on the expected cooling requirements, the configuration of the closed - loop chiller, and / or the environment in which the self - contained computing system is expected to be deployed.

[0184] The disclosed self - contained, self - healing, and small form factor embodiments can be used as stand - alone solutions that provide substantial computing power almost anywhere or in any environment. In one application, multiple small computing systems can be located in proximity to each other and / or linked together to form a cluster. In one embodiment, the outer housing is arranged to allow maintenance and / or service work to be performed while accessing only one or two sides of the outer housing. This arrangement allows individual self - contained computing systems to be placed at reduced or minimum distances between each self - contained system.

[0185] In one exemplary embodiment, a cluster of four exemplary self - contained computing systems The units can be strategically arranged to enable approximately 240 kW of self - contained computers in an installation area of approximately 140 square feet. In certain embodiments, these units may be in power and / or data communication with each other, thereby enabling the operation of a multi - unit cluster that has only a single external power connection and a single data connection. In certain embodiments, a data center can be established using multiple small computing systems or multiple clusters of such computing systems. Some embodiments of the disclosed computing systems can be utilized in modern data centers and / or climate - controlled environments, although some embodiments of the disclosed self - contained computing systems can be deployed in remote locations and / or harsh environmental conditions.

[0186] In certain embodiments, the outer housing can be weather - resistant, waterproof, and / or otherwise configured to withstand long - term exposure to harsh environments. Some embodiments of the disclosure enable the rapid deployment of large amounts of computing resources to remote or difficult locations. Some self - contained embodiments can be arranged to be operable in substantially any location with access to power and data connections. In certain embodiments, an uninterruptible power supply and / or a generator may be operably connected to the computing system to provide more reliable or constant access to power. Some self - contained embodiments of the disclosure are designed to be transportable. Some transportable embodiments can be designed with a low - profile. Certain embodiments have a height of approximately 5 feet 5 inches, a depth of approximately... In certain embodiments, an uninterruptible power supply and / or a generator may be operably connected to the computing system to provide more reliable or constant access to power.

[0187] Some self - contained embodiments of the disclosure are designed to be transportable. Some transportable embodiments can be designed with a low - profile. It can be 5 feet 6 inches and 9 feet wide. This results in approximately 60 kW of computer power within an installation area of 42 square feet. Such units may be stacked vertically to supply 120 kW of computer power within the same 42 square foot installation area. In embodiments of the disclosed computing systems, the units may be stacked and multiple units may be arranged adjacent to each other. This reduces the need for aisle space between individual computing systems, thereby enabling a generally high power density within the data center. In some embodiments, the units may be stacked vertically to supply 120 kW of computer power within the same 42 square foot installation area.

[0188] Embodiments of the disclosed computing systems may be stacked, and multiple stacks may be arranged adjacent to each other. This reduces the need for aisle space between individual computing systems, thereby enabling a generally high power density within the data center. In some embodiments, the units may be stacked vertically to supply 120 kW of computer power within the same 42 square foot installation area. This reduces the need for aisle space between individual computing systems, thereby enabling a generally high power density within the data center.

[0189] Some embodiments may be designed to be fully operational and maintainable with access to only one side of a self - contained computing system. Such embodiments are advantageous because they facilitate arranging self - contained systems very close to each other. Furthermore, in some self - contained embodiments, the entire immersion tank may be accessed and removed and / or replaced while accessing only one side of the device. In certain embodiments, the tanks may be individually modular and / or skid - mounted. In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other. In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other. In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other.

[0190] In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other. In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other. In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other. In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other. In some embodiments, the self - contained computing systems may be arranged vertically to utilize a smaller installation area. Embodiments of the vertical design of the disclosed systems can supply approximately 60 kW of computing power within an installation area of about 22.9 square feet. Similar to other disclosed embodiments, some vertically - oriented self - contained computing systems may be arranged close to each other. As described above, some vertically oriented self - contained computing systems can be operated and maintained with access to only one side of the device. In one embodiment, the entire tank can be removed from the outer housing and replaced. This arrangement allows for the rapid replacement of multiple blade servers and / or other computing components.

[0191] Mobile embodiments A self - contained computing system that does not require an external source of cooling water enables novel computing applications. In one embodiment, a generator is used to supply power to the system, eliminating the need to connect the system to an external and / or fixed power source. In one embodiment, the system may rely on wireless data communication. In certain self - contained embodiments that do not rely on a fixed power source or wired data communication, a fully mobile computing system can be realized. The disclosed embodiments include in - vehicle self - contained computing systems that can be used to supply a large amount of computing power in almost any environment. In one embodiment, a truck - mounted wireless computing system is driven within the wireless communication range of an existing or temporary network and can supply a large amount of computing power with substantially no setup or installation time.

[0192] In one embodiment, a computing system is utilized on a boat, ship, oil extraction device, floating platform, or other container or structure located in proximity to a body of water.

[0193] Natural water embodiments In such an embodiment, the dielectric vapor may be arranged to be The condenser used to convert back to a dielectric fluid may be cooled using water from a body of water. In one exemplary embodiment, the modular computing system includes a water inlet, a water outlet, and a pump or impeller. The pump and / or impeller may move water from the body of water to the condenser. Some embodiments may include condensers, piping, and other components. Designed to protect computing system components from sources of contamination in bodies of water In some embodiments, the condenser and other components may include filters and / or processing components. The material is arranged to withstand prolonged contact with brackish or salt water, for example sea water.

[0194] Horizontal magazine swap In one embodiment, the magazine of replacement components is connected to a computing system external to the tank. For example, chassis, servers, blades, and Replacement components, such as fuel and / or power components, are removed from the magazine and refitted in the tank. The magazine can be used to replace components. The magazine can be used to replace components from the magazine. configured to extend from an outer housing of a computing system to enable The device may be on a platform that supports the

[0195] In one non-limiting example, if a blade server in a tank is not functioning properly, a robot The team removes the inoperative component from the tank and places the inoperative component in the magazine compartment. The robot arm can then be used to move the machine from the magazine to a storage slot. Remove the functioning blade server and install it where the non-working server was previously located. configured such that inoperative servers can be replaced with new operable servers.

[0196] Over time, the magazine accumulates inoperative components that can be replaced with new operable components to enable the robot system to continue operation for an extended period. In one embodiment the magazine is located on a platform that can project outside the outer housing, thereby enabling an operator to access the magazine. In one embodiment the platform is configured to rotate the magazine from a substantially vertical position to a substantially horizontal position to enable components to slide into or out of the magazine. In one embodiment, an adjustable-height cart can be used to move, load, and / or receive components such that a human operator does not need to lift or support the weight of the components while removing or replacing the components from the magazine. It should be appreciated that a magazine configured to rotate to a substantially horizontal position can also facilitate loading of functional components into the magazine and removal of non-functional components from the magazine. configured to rotate the magazine from a substantially vertical position to a substantially horizontal position to enable components to slide into or out of the magazine.

[0197] In one embodiment, an adjustable-height cart can be used to move, load, and / or receive components such that a human operator does not need to lift or support the weight of the components while removing or replacing the components from the magazine. configured to rotate the magazine from a substantially vertical position to a substantially horizontal position to enable components to slide into or out of the magazine. It should be appreciated that a magazine configured to rotate to a substantially horizontal position can also facilitate loading of functional components into the magazine and removal of non-functional components from the magazine. configured to rotate to a substantially horizontal position can also facilitate loading of functional components into the magazine and removal of non-functional components from the magazine.

[0198] Figs. 15A - D show an exemplary magazine 810 located on a platform 820 that can project outside the container. In Fig. 15A, the magazine 810 can be connected to a platform that includes a rotating member 821, a support member 822, and a rail 823. In one embodiment the support member 822 includes rails 824 that enable the support member 822 to move while supporting the weight of the magazine 810 and any servers or other components stored within the magazine. the support member 822 includes rails 824 that enable the support member 822 to move while supporting the weight of the magazine 810 and any servers or other components stored within the magazine. the support member 822 includes rails 824 that enable the support member 822 to move while supporting the weight of the magazine 810 and any servers or other components stored within the magazine. any servers or other components stored within the magazine. ​​It can be connected to 3. In the exemplary embodiment of FIG. 15A, the platform 820 is in the extended position therein.

[0199] As shown in FIG. 15B, during normal operation, the support member 822 can be retracted with respect to the outer housing of the computing system . The magazine 810 can be stored on the rail 823 during normal operation. In some embodiments, the weight of the magazine 810 is supported by the support member 822 and the rail 823 regardless of the position of the support member 822 on the rail 823 .

[0200] In some embodiments, computer components such as servers utilized in the disclosed embodiments may be denser and / or heavier than conventional computer components . In some embodiments, due to the increased cooling capacity of the disclosed embodiments, the weight of the blade server can be at least about 50 lbs, at least about 60 lbs, at least about 70 lbs , at least about 80 lbs, at least about 90 lbs or at least about 1 00 lbs. In some embodiments, the weight of the blade server can be up to about 50 lbs, up to about 60 lbs, up to about 70 lbs, up to about 80 lbs , up to about 90 lbs or up to about 100 lbs. As shown in FIG. 15B, the magazine 810 can hold a plurality of chassis 400 or blade servers, and the weight of an individual blade server can be about 73 lbs. When three such servers are loaded into the magazine, the total weight of the magazine 810 and the servers can be about 395 lbs .

[0201] In some embodiments, the server used is a blade server mounted on a chassis The server and / or chassis may include a backplane system that facilitates the installation and removal of servers in a computing system. In certain embodiments, the server may be an immersion server that does not include a fan or other air-cooling device. In certain embodiments, an individual server board may be configured to include 16 GPUs and draw approximately 6 KW of power. In certain embodiments, the server is a 1.5U server. A disclosed server may be a 1-ott immersion unit (OIU) server. Such a server is 1.5U in height and is configured for liquid immersion cooling. In certain embodiments, a single tank within the computing system may be configured to operate 10 1OIU servers and provide approximately 60 KW of power when all 10 servers are operating at substantially full power. In certain embodiments, the computing system may include one or two such tanks. In certain embodiments, the computing system may include multiple tanks, such as, for example, 10 such tanks.

[0202] In certain embodiments, as shown in FIG. 15A, when the magazine is removed from the computing system, the support member moves along the rail from the storage position and is cantilevered outside the outer housing of the computing system.

[0203] As also shown in FIGS. 15C-D, the magazine may slide along the rail when withdrawn or not, and be cantilevered outside the computing system. In certain embodiments, as shown in FIGS. 15C-D, a magazine removal tool is provided for the entire magazine and the maga ​It may be used to remove components contained within the magazine. In such embodiments, the magazine removal tool can be used to lift the magazine from the support member in order to convey the magazine and slide it along the rails.

[0204] In certain embodiments, when the magazine is moved outside of the computing system, the platform can rotate the magazine to a substantially horizontal position. Then, the servers contained within the magazine can slide out of the magazine.

[0205] Figures 15A - D illustrate an example series of steps for removing a server from a magazine, according to an exemplary embodiment. In the exemplary embodiment, the magazine can be attached to a linear guide rail system behind the access door. As illustrated in Figures 15C - D, the magazine can be pulled out and cantilevered outside of the computing system. The magazine can be pulled out manually or moved outside of the computing system using a powered or automated system. As shown in Figure 15D, the magazine can be rotated approximately 90 degrees so that the servers and / or other components contained within the magazine face a substantially horizontal position. Once in the substantially horizontal position, the servers and / or other components can slide out of the magazine and onto a cart or other tool configured to receive the servers and / or other components. As shown in Figure 15C, a shear - lift cart can be adjusted to an appropriate height to receive the servers or other components. A height - adjustable cart with a rotating surface can allow the servers to slide out of the magazine without requiring a human operator to support the weight of the servers and onto the cart or other tool configured to receive the servers and / or other components. As shown in Figure 15C, a shear - lift cart can be adjusted to an appropriate height to receive the servers or other components. A height - adjustable cart with a rotating surface can allow the servers to slide out of the magazine without requiring a human operator to support the weight of the servers and onto the cart or other tool configured to receive the servers and / or other components. It may be used to enable transfer from the gin to the cart. As shown in FIG. 15D When the server is slid onto a cart having a ground surface or a rotating surface, as shown, the server or other components will be transported to another location for replacement or repair. It should be understood that new components can be loaded into the magazine using substantially the same steps in reverse order .

[0206] In an alternative embodiment, the magazine can be supported on an arm that can rotate and expand without rails . In such an embodiment, the magazine can be stored in a substantially vertical position within the outer housing of the computing system during normal operation . When it is determined that a component within the magazine should be replaced, the magazine can be extended outside the outer housing using the expandable arm . When the magazine is extended beyond the outer housing, the magazine can be rotated from a substantially vertical position to a substantially horizontal position such that the components stored within the magazine can be removed horizontally from the magazine .

[0207] Bellows In some embodiments, bellows and / or a vapor collection system can be utilized. Before a disclosed embodiment is first activated, dielectric fluid, computer components such as servers, and other system components can be brought to thermal equilibrium . When the computing system is activated, computer components such as servers begin to generate heat that can be dissipated into the dielectric fluid . This process causes a portion of the dielectric fluid to transition from a liquid state to a vapor state . As the temperature of the fluid rises, more portions of the dielectric fluid can transition to the vapor state . In a closed system In the μ, the increase in the volume of the dielectric vapor will result in an increase in the pressure within the system. A In certain embodiments, a tank containing a dielectric fluid may be in fluid and / or vapor communication with a recovery system.

[0208] FIG. 16 shows a vapor recovery system 900 according to an exemplary embodiment. The recovery system 900 is connected to a tank 710 containing dielectric vapor. The dielectric vapor will flow from the tank 710 through piping to one or more bellows 905. In certain embodiments, the vapor recovery system 900 includes a bellows 905 configured to receive the dielectric vapor, which will reduce or eliminate any increased pressure in the tank 710. When the system is cooled or a portion of the dielectric vapor condenses to a dielectric liquid, the bellows can be folded or contracted to substantially maintain the pressure equilibrium within the tank 710. When the system is cooled or a portion of the dielectric vapor condenses to a dielectric liquid, the bellows can be folded or contracted to substantially maintain the pressure equilibrium within the tank 710. When the system is cooled or a portion of the dielectric vapor condenses to a dielectric liquid, the bellows can be folded or contracted to substantially maintain the pressure equilibrium within the tank 710.

[0209] In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced. In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced. In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced. In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced. In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced. In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced. In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced. In certain embodiments, the vapor recovery system 900 includes a valve 912 configured to introduce air into the vapor recovery system. In such embodiments, the dielectric vapor can be mixed with air. By mixing the dielectric vapor with air, the temperature of the dielectric vapor can be reduced.

[0210] After operating over a sufficient period of time, an embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. Thereby, the bellows 905 can expand and / or contract in response to the heat dissipated in the dielectric fluid. In some embodiments, the bellows 905 may comprise one or more pouches. Each pouch may comprise a metal foil and polymer laminate structure. The bellows pouches may be connected in series or parallel to and with each other in the vapor recovery system piping. In some embodiments, the total volume of the expanded bellows pouches can be at least about 15% of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be at least about 20%, at least about 23% or at least about 25% or more of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be up to about 40%, up to about 30% or up to about 25% or less of the liquid fluid volume of the tank. In some embodiments, when the computing system substantially reaches thermal stability, the vapor recovery system 900 is closed to the cooling atmosphere, and a valve that allows air to be exhausted from the system may be closed. In some embodiments, the carbon bed can be configured to be open only to the tank and bellows using a valve. In some embodiments, a desorption heater configured to pass heat through the carbon medium raises the temperature of the carbon medium. After operating over a sufficient period of time, an embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. Thereby, the bellows 905 can expand and / or contract in response to the heat dissipated in the dielectric fluid. In some embodiments, the bellows 905 may comprise one or more pouches. Each pouch may comprise a metal foil and polymer laminate structure. The bellows pouches may be connected in series or parallel to and with each other in the vapor recovery system piping. In some embodiments, the total volume of the expanded bellows pouches can be at least about 15% of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be at least about 20%, at least about 23% or at least about 25% or more of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be up to about 40%, up to about 30% or up to about 25% or less of the liquid fluid volume of the tank.

[0211] In some embodiments, when the computing system substantially reaches thermal stability, the vapor recovery system 900 is closed to the cooling atmosphere, and a valve that allows air to be exhausted from the system may be closed. In some embodiments, the carbon bed can be configured to be open only to the tank and bellows using a valve. In some embodiments, a desorption heater configured to pass heat through the carbon medium raises the temperature of the carbon medium. After operating over a sufficient period of time, an embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. Thereby, the bellows 905 can expand and / or contract in response to the heat dissipated in the dielectric fluid. In some embodiments, the bellows 905 may comprise one or more pouches. Each pouch may comprise a metal foil and polymer laminate structure. The bellows pouches may be connected in series or parallel to and with each other in the vapor recovery system piping. In some embodiments, the total volume of the expanded bellows pouches can be at least about 15% of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be at least about 20%, at least about 23% or at least about 25% or more of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be up to about 40%, up to about 30% or up to about 25% or less of the liquid fluid volume of the tank. In some embodiments, when the computing system substantially reaches thermal stability, the vapor recovery system 900 is closed to the cooling atmosphere, and a valve that allows air to be exhausted from the system may be closed. In some embodiments, the carbon bed can be configured to be open only to the tank and bellows using a valve. In some embodiments, a desorption heater configured to pass heat through the carbon medium raises the temperature of the carbon medium. After operating over a sufficient period of time, an embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. Thereby, the bellows 905 can expand and / or contract in response to the heat dissipated in the dielectric fluid. In some embodiments, the bellows 905 may comprise one or more pouches. Each pouch may comprise a metal foil and polymer laminate structure. The bellows pouches may be connected in series or parallel to and with each other in the vapor recovery system piping. In some embodiments, the total volume of the expanded bellows pouches can be at least about 15% of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be at least about 20%, at least about 23% or at least about 25% or more of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be up to about 40%, up to about 30% or up to about 25% or less of the liquid fluid volume of the tank. In some embodiments, when the computing system substantially reaches thermal stability, the vapor recovery system 900 is closed to the cooling atmosphere, and a valve that allows air to be exhausted from the system may be closed. In some embodiments, the carbon bed can be configured to be open only to the tank and bellows using a valve. In some embodiments, a desorption heater configured to pass heat through the carbon medium raises the temperature of the carbon medium. After operating over a sufficient period of time, an embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. Thereby, the bellows 905 can expand and / or contract in response to the heat dissipated in the dielectric fluid.

[0212] In some embodiments, when the computing system substantially reaches thermal stability, the vapor recovery system 900 is closed to the cooling atmosphere, and a valve that allows air to be exhausted from the system may be closed. In some embodiments, the carbon bed can be configured to be open only to the tank and bellows using a valve. In some embodiments, a desorption heater configured to pass heat through the carbon medium raises the temperature of the carbon medium. After operating over a sufficient period of time, an embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. Thereby, the bellows 905 can expand and / or contract in response to the heat dissipated in the dielectric fluid. In some embodiments, the bellows 905 may comprise one or more pouches. Each pouch may comprise a metal foil and polymer laminate structure. The bellows pouches may be connected in series or parallel to and with each other in the vapor recovery system piping. In some embodiments, the total volume of the expanded bellows pouches can be at least about 15% of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be at least about 20%, at least about 23% or at least about 25% or more of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches can be up to about 40%, up to about 30% or up to about 25% or less of the liquid fluid volume of the tank. In some embodiments, when the computing system substantially reaches thermal stability, the vapor recovery system 900 is closed to the cooling atmosphere, and a valve that allows air to be exhausted from the system may be closed. In some embodiments, the carbon bed can be configured to be open only to the tank and bellows using a valve. In some embodiments, a desorption heater configured to pass heat through the carbon medium raises the temperature of the carbon medium. After operating over a sufficient period of time, an embodiment of the computing system reaches a stable thermal state based on the power capacity utilized by the computing components. If more or less computing power is utilized, more or less dielectric fluid may transition to dielectric vapor. Thereby, the bellows 905 can expand and / or contract in response to the heat dissipated in the dielectric fluid. It can be actuated by sea urchins. As the temperature of the carbon medium rises, any dielectric fluid previously collected by the carbon medium will be separated from the carbon and returned to the tank, which can condense and be returned to the dielectric fluid as described above. In certain embodiments, where the computing system is powered below its previous stable state, the portion of the dielectric fluid in the vapor state may decrease, and in certain embodiments, the bellows may contract to regulate the decrease in dielectric vapor. In certain embodiments, a valve that admits air into the bellows may be opened to admit air into the bellows to further reduce the pressure differential. In certain embodiments, nitrogen rather than air may be used to reduce the pressure differential and also avoid the introduction of potential contaminants from the atmosphere.

[0213] In certain embodiments, the bellows and / or the vapor recovery system may be fully or substantially passive. In certain embodiments, the bellows and / or the vapor recovery system may be powered and / or automated based on sensor data from temperature, pressure, and / or power sensors disposed throughout the computing system. In certain embodiments, a computing system having a vapor recovery system will be non-discharging even if the system is not a closed system. In certain embodiments, air or nitrogen may be introduced into the system and discharged from the system without releasing any or almost any of the dielectric fluid into the ambient atmosphere. In certain embodiments, the bellows may contract to regulate the decrease in dielectric vapor. In certain embodiments, a valve that admits air into the bellows may be opened to admit air into the bellows to further reduce the pressure differential. In certain embodiments, nitrogen rather than air may be used to reduce the pressure differential and also avoid the introduction of potential contaminants from the atmosphere. In certain embodiments, a valve that admits air into the bellows may be opened to admit air into the bellows to further reduce the pressure differential. In certain embodiments, nitrogen rather than air may be used to reduce the pressure differential and also avoid the introduction of potential contaminants from the atmosphere. In certain embodiments, nitrogen rather than air may be used to reduce the pressure differential and also avoid the introduction of potential contaminants from the atmosphere. In certain embodiments, nitrogen rather than air may be used to reduce the pressure differential and also avoid the introduction of potential contaminants from the atmosphere.

[0214] In certain embodiments, the bellows and / or the vapor recovery system may be fully or substantially passive. In certain embodiments, the bellows and / or the vapor recovery system may be powered and / or automated based on sensor data from temperature, pressure, and / or power sensors disposed throughout the computing system. In certain embodiments, the bellows and / or the vapor recovery system may be powered and / or automated based on sensor data from temperature, pressure, and / or power sensors disposed throughout the computing system. In certain embodiments, the bellows and / or the vapor recovery system may be powered and / or automated based on sensor data from temperature, pressure, and / or power sensors disposed throughout the computing system.

[0215] In certain embodiments, a computing system having a vapor recovery system will be non-discharging even if the system is not a closed system. In certain embodiments, a computing system having a vapor recovery system will be non-discharging even if the system is not a closed system. In certain embodiments, air or nitrogen may be introduced into the system and discharged from the system without releasing any or almost any of the dielectric fluid into the ambient atmosphere. In certain embodiments, air or nitrogen may be introduced into the system and discharged from the system without releasing any or almost any of the dielectric fluid into the ambient atmosphere.

[0216] Exemplary embodiments The disclosed embodiments relate to computer components and / or the density of computing power Enables an increase. The computer component 1 70 that is cooled by two-phase liquid immersion within the pressure control vessel 110. In certain embodiments, the components can be spaced apart from each other by less than about 1 inch, less than about 0.7 inch, or less than about 0.5 inch. In certain embodiments, the individual components are spaced apart by more than about 0.3 inch, more than about 0.5 inch, more than about 0.7 inch, more than about 1 inch, or more than about 1.5

[0217] Certain disclosed embodiments enable improved power usage efficiency (P UE) compared to conventional data centers. By using the disclosed embodiments, it is possible to reduce the amount of energy used to cool the computer component 170 , thereby reducing the total energy usage of the data center and causing the PUE to approach 1.0. Certain embodiments relate to a data center that includes computer components cooled by two-phase liquid immersion within a pressure control vessel 110 , and the data center has a PUE of less than about 1.15, less than about 1.10, less than about 1.08, or less than about 1.05 . Certain embodiments relate to a data center that includes computer components cooled by two-phase liquid immersion within a pressure control vessel 110 , and the data center has a PUE of more than about 1.05, more than about 1.06 , more than about 1.08, or more than about 1.10.

[0218] In certain embodiments, a heat-transferable condensable dielectric fluid is provided for use in a two-phase liquid immersion cooling system. The computer components operate at less than atmospheric pressure, which lowers the temperature at which the dielectric fluid vaporizes, thereby maintaining the liquid phase of the dielectric fluid at a lower temperature compared to standard atmospheric pressure. The computer components generate heat as they operate. The generated heat... ... causes the dielectric fluid to vaporize, and the vaporized dielectric fluid rises to the upper portion of the pressure control vessel 110 where it condenses on the condenser 140, releasing heat to the heat sink 150. The condensed dielectric fluid then returns to the lower portion of the pressure control vessel 110 Heat is transferred to a dielectric liquid in contact with computer components and vaporizes the dielectric liquid into a gas. The gaseous dielectric fluid can be condensed using a condenser. Ambient temperature or cooled process water is passed through the condenser. When the gaseous dielectric fluid is cooled by the condenser, it condenses back into the liquid phase, drops down, and returns to the tank of the liquid dielectric fluid.

[0219] Certain disclosed embodiments relate to high-density data centers. Conventional data centers include computing power of about 1 megawatt (MW) distributed over about 10,000 square feet. High-end data centers can include computing power of 1 MW distributed over about 6,000 square feet. Disclosed embodiments relate to a data center having computer components 170 cooled by two-phase liquid immersion within a pressure control vessel 110, where the data center utilizes about 1 MW of computing power distributed over about 3,000 square feet, about 1,500 square feet, about 1,000 square feet, about 800 square feet, or about 600 square feet. In certain embodiments, a plurality of pressure control vessels containing the disclosed computing system can be arranged in a row and powered by a central power supply. In certain embodiments, multiple embodiments of the disclosed computing system may be connected in series with each other.

[0220] Disclosed embodiments include computer components 170 that are liquid-immersed within a pressure control vessel 110, thereby shielding the components from air pollution by being enclosed by the pressure control vessel and immersed in a dielectric liquid 140. Certain disclosed embodiments relate to data centers that operate with minimal air filtration and / or cleaning requirements. In certain embodiments, the data center 、operates without a HEPA filter or its equivalent, without an MERV11 filter or its equivalent, or without an MERV8 filter or its equivalent.

[0221] The disclosed embodiments include computer component 170 that is liquid immersion cooled within pressure control vessel 110, such that the component is not cooled by gaseous air. The disclosed embodiments include a data center that operates without a cooling fan and / or other similar devices for circulating air.

[0222] The disclosed embodiments relate to environmentally conscious data centers. In certain embodiments, the data center includes computer component 170 that is liquid immersion cooled within pressure control vessel 110 and consumes little or no water for cooling processing. Certain embodiments utilize a closed circuit dry cooling tower to cool condenser structure 130 to condense dielectric fluid vapor to dielectric fluid liquid and to reduce the temperature of the water circulated through disclosed condenser structure 130. Such embodiments operate as a closed loop without substantial water make-up or discharge, and the dry cooling tower does not rely on a water stream for evaporative cooling or cooling operation. Certain data center embodiments utilize and / or discharge less than about 10,000 gallons of water per day, less than about 1,000 gallons of water per day, less than about 100 gallons of water per day, less than about 10 gallons of water per day, or 0 gallons of water per day. Certain data center embodiments utilize and / or discharge more than about 100 gallons of water per day, more than about 1,000 gallons of water per day, or more than about 10,000 gallons of water per day.

[0223] The disclosed embodiments relate to a pressure control vessel operably connected to a pressure controller and / or a vacuum source, having an interior and an exterior, and configured to contain an atmosphere within the interior. A pressure control vessel having an interior configured to be operably connected to a pressure controller that reduces the internal pressure below atmospheric pressure, and configured to contain a predetermined volume of thermally conductive condensable dielectric fluid in both liquid and gas phases. And a rack for mounting computer components, the rack being arranged such that when the computer components are mounted on the rack, they are at least partially immersed in a predetermined volume of thermally conductive dielectric fluid. And a condensation structure, wherein the predetermined volume of thermally conductive dielectric fluid, the rack, the computer components, and the condensation structure are contained within the pressure control vessel. Certain embodiments relate to a computing system comprising a pressure control vessel having an interior, a pressure controller operably connected to reduce the internal pressure below atmospheric pressure, and a predetermined volume of thermally conductive condensable dielectric fluid in both liquid and gas phases. One or more computer components arranged to be at least partially immersed in the liquid phase of a predetermined volume of thermally conductive condensable dielectric fluid, and a condenser for condensing the vapor phase dielectric fluid into the liquid phase dielectric fluid. In certain embodiments, the pressure control vessel is mounted within an upper structure, the blade server is configured to be swappable without interruption of the computing system, the pressure control vessel is operably connected to a power source, a water supply source, and a networking connection, and the pressure control vessel comprises a lid configured to seal an upper opening and close the opening. The lid is configured to direct the rising vapor from the middle portion of the pressure control vessel to the side portion of the pressure control vessel, and the pressure control vessel is about 1

[0224] ​​​​​​​​​​00 cubic feet and approximately 300 cubic feet internal volume and / or pressure controlled vessel The dielectric fluid comprises a ratio of between about 1:3 and about 1:8 of liquid dielectric fluid to gas dielectric fluid. The embodiment includes a ballast block, a blade server and a blade server chassis, a robot, The airlock is a large disturbance to the atmosphere in the pressure control vessel. A robot configured to allow access to an interior of a pressure controlled vessel without Arm and airlock, and / or purge system with a volume of thermally conductive dielectric The system further comprises a purge system configured to remove contaminants from the fluid. In this embodiment, the purge system removes a portion of the atmosphere from the pressure control vessel and removes any remaining atmosphere from the vessel. The dielectric fluid is configured to condense any remaining vapor and discard any remaining vapor. In an embodiment, the purge system condenses at least a portion of the gaseous dielectric fluid to remove gaseous contaminants. The device is configured to dispose of the object.

[0225] One embodiment relates to a method of cooling a computer component, the method comprising: providing a housing for storing a thermally conductive condensable dielectric fluid and a heat generating The housing includes computer components and is configured to withstand at least a slight vacuum. and a step of operating the computer components, The step of operating the computer components generates heat, and the computer components are in contact with the dielectric fluid. generating a vacuum within the housing; and wherein the pressure is at least about 1 atmosphere. maintaining a vacuum in the housing while the computer components are operating; a step where the pressure inside the housing is less than about 1 atmosphere, and using heat generated by computer components to vaporize the dielectric fluid from a liquid state to a gaseous state, a step of condensing the dielectric fluid from a gaseous state to a liquid state using a condenser, and a step of removing a fluid that is not immediately condensable from the dielectric fluid. In certain embodiments, during and / or during operation of the system, a portion of the computer components is replaced. In certain embodiments the step of removing non-condensable fluid comprises blocking a portion of the gaseous atmosphere from within the housing, condensing any dielectric fluid from the gaseous atmosphere, returning the condensed dielectric fluid to the housing, and discarding any remaining portion of the gaseous atmosphere, and / or the housing is configured to generate convection.

[0226] Certain embodiments relate to a method of cooling computer components that comprises operating the computer components in contact with a thermally conductive dielectric fluid at less than atmospheric pressure. Certain embodiments further comprise vaporizing the dielectric fluid and condensing the dielectric fluid at less than atmospheric pressure. Certain embodiments relate to a method of cooling computer components, the method comprising supplying a condensable thermally conductive dielectric fluid in liquid and gaseous phases, and operating computer components in at least partial contact with the liquid phase of the condensable thermally conductive dielectric fluid at a pressure less than atmospheric pressure in the presence of the condensable thermally conductive dielectric fluid. Certain embodiments

[0227] relate to a method of cooling computer components, the method comprising at least one of the heat generated by operating the computer components In the presence of a condensable thermally conductive dielectric fluid in liquid and gaseous phases, and operating computer components in at least partial contact with the liquid phase of the condensable thermally conductive dielectric fluid at a pressure less than atmospheric pressure. Certain embodiments comprise using heat generated by operating the computer components to vaporize at least a portion of the condensable thermally conductive dielectric fluid. portion of the condensable thermally conductive dielectric fluid. vaporizing a dielectric fluid from a liquid phase to a gas phase using a section; and at least condensing at least a portion of the dielectric fluid from the gas phase to the liquid phase; removing at least a portion of a fluid that is not immediately condensable from the dielectric fluid; and / or replacing at least one or more computer components while the computer components are operating further comprises.

[0228] One embodiment relates to a method of cooling computer components, the method comprising operating the computer components at less than atmospheric pressure by at least 1 psi, the computer components being at least partially in contact with a thermally conductive dielectric fluid, the boiling point of the dielectric fluid being less than about 80°C. One embodiment further comprises condensing the dielectric fluid under conditions such that the computer components do not exceed about 80°C.

[0229] It should be understood that various disclosed embodiments may include some or all of the components even if not described herein. Specific components and their characteristics may be adjusted based on the characteristics of each particular embodiment. Variations may include the use of higher or lower density power, cooling and network connection systems, pressure management systems, vapor management systems, and the selection of specialized equipment and components. From the above description, those skilled in the art can readily identify the essential features of this disclosure and make various changes and

[0230] modifications to adapt the disclosure to various uses and conditions without departing from the spirit and scope of the disclosure. The above-described embodiments are merely illustrative and should not be construed as limiting the scope of the disclosure.

[0231] ​​​​​ Heating and cooling of the tank in response to impact events In one exemplary embodiment, the immersion cooling system or vessel may include a tank, a computing device, a vise, a robot, an absorption unit, bellows, and a management system. The tank may be a pressure control tank maintained at (or within) atmospheric pressure. The tank may include a bath region and a reservoir region, and the computing device may be immersed in the dielectric fluid within the bath region of the tank. The computing device may be connected to the network while being immersed in the dielectric fluid and may perform various processing tasks. The tank may include a lid providing access to the bath region, the computing device, and the reservoir region. The tank may be fluidly coupled to the bellows and the absorption unit, and a plurality of valves may selectively connect or disconnect the tank from the bellows and the absorption unit so as to allow the dielectric vapor to be transferred to and / or from the bellows and the absorption unit. The robot may be a gantry robot capable of lifting the computing device out of the tank of the vessel when the lid of the tank is open. The robot may place the lifted computing device into a magazine provided for storage of the computing device. The robot may also lift the computing device out of the magazine and place it in place of the computing device lifted from the tank. In one exemplary embodiment, the tank may include heating elements, for example, a plurality of heating rods at least partially immersed in the dielectric fluid. The tank may include a plurality of sensors, for example

[0232] , operation data related to a temperature sensor, a pressure sensor, or a computing device (e.g., current, voltage, workload, etc.) may be included. The temperature sensor may be located within or above the tank. The container management system may use the data received from the sensor to operate the heating element to adjust or control the temperature or temperature variation of the dielectric fluid within the tank (and / or the pressure or pressure variation of the dielectric vapor). FIG. 18 shows an example of a heating element 1000 for an immersion cooling system according to an exemplary embodiment. The heating element 1 000 may include a plurality of heating rods 1010. Each heating rod may include a plurality of wires 1011 that can be connected to the power supply of the tank . The controller of the tank may adjust the heating element 1000 to heat the tank area during various operations of the tank, for example. In this exemplary embodiment, the heating element 1000 is mounted within the tank of the tank and can be fully immersed in the dielectric fluid .

[0233] In one exemplary embodiment, the heating element is separated from the computing device and the heating element does not process data. The heating element is specialized only in generating heat and may not be specialized in other functions . The heating element can be easily controlled, especially during operations of the tank (e.g., startup operations), changes to components or other times when control is required. The heat generated by the heating element may be adjustable depending on evaluating data indicating the size of the bellows and other aspects of the system, such as pressure or temperature .

[0234] In particular, rapid changes in the power consumption or workload of the computing device (e.g., caused by the activities or lack thereof of the end user ) within the container can be... The device can cause a rapid change in the amount of heat generated. This, in turn, can cause a rapid temperature change in the tank or vessel, which can cause a sudden change in the pressure of the tank (since in a closed adiabatic system, pressure and temperature are directly related, i.e., PV=nRT). These pressure fluctuations can damage the container and introduce contaminated gas (e.g., air) or particles (e.g., dust) into the tank. These pressure fluctuations can also cause leakage of the dielectric fluid from the tank. To counter the effects of these pressure fluctuations, bellows or absorption units can be used to remove excess vapor from the tank or introduce vapor into the tank when the pressure drops. On the other hand, by using a heating element, the capacity of the bellows and absorption units can be reduced, thereby enabling the design of a more space-efficient container. If no heating element is used, the bellows will rupture if there is an excessive increase in pressure. The heating element enables modulation with changes in the temperature within the tank or vessel, thereby facilitating control transitions between various operating load states that the computing device may experience during its operation. For example, if there is a rapid decrease in the operating workload of the computing device, the heat generation by the computing device can drop rapidly. This can cause a sudden decrease in the internal pressure of the tank. The heating element can add heat to the tank to enable, for example, a controlled decrease in the temperature of the dielectric fluid during shutdown.

[0235] In other words, the heating element can compensate for sudden changes in the workload of the computing device, i.e., That is, in the event of an impact event, the pressure and temperature of the tank can be equalized. Therefore, the container requires a much smaller bellows and absorption unit to maintain the atmospheric pressure of the tank.

[0236] In an exemplary embodiment, the container management system can determine how much heat to add to the tank in response to an impact event, such as an increase or decrease in the internal pressure or temperature of the tank. In an exemplary embodiment, the rate of decrease (or increase) in temperature or pressure can determine how much heat to add to the tank. For example, if the dielectric fluid temperature level in the tank decreases by more than a predetermined number of degrees over a predetermined number of minutes, the management system can activate a heating element (e.g., to maintain the temperature and pressure of the system) to add a predetermined amount of heat to the tank. This added heat can stop the temperature drop or reduce the rate at which the temperature is dropping. The management system can stop the heating element from adding heat to the system when the tank is in a steady state, e.g., when the rate of decrease in pressure or temperature falls below a threshold. In other exemplary embodiments, the actual temperature of the dielectric fluid in the tank when an increase or decrease in the computing device's workload is initiated can determine how much heat to add to the tank. In an exemplary embodiment, the management system can activate the heating element when an impact event is detected, e.g., before, during, or after a startup operation, boost operation, slowdown operation, or shutdown operation. The management system can determine the operating mode of the container (e.g., startup or shutdown) from sensor data (e.g., from temperature or pressure sensors in the tank) or

[0237] ​​ It can be detected by receiving data (e.g., current, voltage, temperature, workload, data transfer, etc.) from a computing device. The heating element can mitigate or adjust the changes in temperature or pressure within the tank to minimize the pressure deviation from atmospheric pressure. Otherwise, without the operation of the heating element according to the technology disclosed herein, the container would either need to absorb or store the excessive gas generated as a result of the rapid heating of the computing device, or the container would need to release or supply gas to invalidate the pressure drop resulting

[0238] from the rapid decrease in heat generation of the computing device. During startup operation, the temperature of the tank, e.g., the temperature of the dielectric fluid within the tank, is below the threshold when the computing device starts operating. The startup operation can occur, for example, when the tank is cold shortly after the container is turned on. Since the computing device can rapidly increase its temperature, when the dielectric fluid is cold, the computing device can generate a large amount of vapor. Therefore, before, during, or after the startup operation, the management system can activate the heating element to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing the vapor generation by the computing device. For example, the heating element can slowly increase the temperature of the dielectric fluid to the threshold

[0239] During a boost operation, the temperature of the tank, e.g., the temperature of the dielectric fluid in the tank, can increase faster than a threshold rate (e.g., when the temperature of the tank falls below a threshold). The boost operation can occur, for example, when a computing device is in operation and, for example, the workload of the computing device significantly increases due to an increase in consumer demand. A sudden increase in the workload of the computing device increases the amount of heat generated by the computing device, and thereby can increase the amount of vapor generated by the computing device. Thus, before, during, or after the boost operation, a management system can activate a heating element to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing vapor generation by the computing device. Otherwise, the container would need to accommodate an excessive amount of vapor to maintain the tank at atmospheric pressure, which may require a large capacity for storage or absorption in the bellows and absorption unit. During a slowdown operation, the temperature of the tank, e.g., the temperature of the dielectric fluid in the tank, can decrease faster than a threshold rate (e.g., when the temperature of the tank exceeds a threshold). The slowdown operation can occur, for example, when a computing device is in operation and, for example, the workload of the computing device significantly decreases due to a decrease in consumer demand. A sudden decrease in the workload of the computing device decreases the amount of heat generated by the computing device, and thereby can suddenly decrease the pressure in the tank. Thus, before, during, or after the slowdown operation, a management system can activate a heating element to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing vapor generation by the computing device. Otherwise, the container would need to accommodate an excessive amount of vapor to maintain the tank at atmospheric pressure, which may require a large capacity for storage or absorption in the bellows and absorption unit. a management system can activate a heating element to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing vapor generation by the computing device. Otherwise, the container would need to accommodate an excessive amount of vapor to maintain the tank at atmospheric pressure, which may require a large capacity for storage or absorption in the bellows and absorption unit. capacity for storage or absorption in the bellows and absorption unit. capacity for storage or absorption in the bellows and absorption unit.

[0240] During a slowdown operation, the temperature of the tank, e.g., the temperature of the dielectric fluid in the tank, can decrease faster than a threshold rate (e.g., when the temperature of the tank exceeds a threshold). The slowdown operation can occur, for example, when a computing device is in operation and, for example, the workload of the computing device significantly decreases due to a decrease in consumer demand. A sudden decrease in the workload of the computing device decreases the amount of heat generated by the computing device, and thereby can suddenly decrease the pressure in the tank. Thus, before, during, or after the slowdown operation, a management system can activate a heating element to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing vapor generation by the computing device. Otherwise, the container would need to accommodate an excessive amount of vapor to maintain the tank at atmospheric pressure, which may require a large capacity for storage or absorption in the bellows and absorption unit. During a slowdown operation, the temperature of the tank, e.g., the temperature of the dielectric fluid in the tank, can decrease faster than a threshold rate (e.g., when the temperature of the tank exceeds a threshold). The slowdown operation can occur, for example, when a computing device is in operation and, for example, the workload of the computing device significantly decreases due to a decrease in consumer demand. A sudden decrease in the workload of the computing device decreases the amount of heat generated by the computing device, and thereby can suddenly decrease the pressure in the tank. Thus, before, during, or after the slowdown operation, a management system can activate a heating element to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing vapor generation by the computing device. Otherwise, the container would need to accommodate an excessive amount of vapor to maintain the tank at atmospheric pressure, which may require a large Activating the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop in the tank. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. During shutdown operation (or a controlled shutdown process), the container is instructed to turn off while the temperature of the tank, e.g., the temperature of the dielectric fluid in the tank, exceeds a threshold. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. In one exemplary embodiment, in response to an impact event on the container, the management system (or other system) can add or remove steam or fluid from the tank to maintain the pressure in the tank at a pressure close to atmospheric pressure. For example, as the temperature of the tank increases, steam or fluid can be removed from the tank, and as the temperature of the tank decreases,

[0241] During shutdown operation (or a controlled shutdown process), the container is instructed to turn off while the temperature of the tank, e.g., the temperature of the dielectric fluid in the tank, exceeds a threshold. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. During shutdown operation (or a controlled shutdown process), the container is instructed to turn off while the temperature of the tank, e.g., the temperature of the dielectric fluid in the tank, exceeds a threshold. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit. Since the computing device suddenly stops generating heat, the pressure in the tank drops rapidly. Therefore, before, during, or after the shutdown operation, the management system can activate the heating element to heat the dielectric fluid, thereby reducing the temperature of the dielectric fluid in a controlled manner and minimizing the pressure drop. For example, the heating element can slowly heat the dielectric fluid so that the temperature of the dielectric fluid drops slowly when the computing device is turned off. Otherwise, the container would need to generate a large amount of steam to maintain the tank at atmospheric pressure, which could require a large storage or desorption capacity in the bellows and absorption unit.

[0242] In one exemplary embodiment, in response to an impact event on the container, the management system (or other system) can add or remove steam or fluid from the tank to maintain the pressure in the tank at a pressure close to atmospheric pressure. For example, as the temperature of the tank increases, steam or fluid can be removed from the tank, and as the temperature of the tank decreases, In one exemplary embodiment, in response to an impact event on the container, the management system (or other system) can add or remove steam or fluid from the tank to maintain the pressure in the tank at a pressure close to atmospheric pressure. For example, as the temperature of the tank increases, steam or fluid can be removed from the tank, and as the temperature of the tank decreases, In one exemplary embodiment, in response to an impact event on the container, the management system (or other system) can add or remove steam or fluid from the tank to maintain the pressure in the tank at a pressure close to atmospheric pressure. For example, as the temperature of the tank increases, steam or fluid can be removed from the tank, and as the temperature of the tank decreases, In one exemplary embodiment, in response to an impact event on the container, the management system (or other system) can add or remove steam or fluid from the tank to maintain the pressure in the tank at a pressure close to atmospheric pressure. For example, as the temperature of the tank increases, steam or fluid can be removed from the tank, and as the temperature of the tank decreases, As it progresses, steam or fluid can be added to the tank.

[0243] The container can use various mechanisms to add steam or fluid to the tank or remove steam or fluid from the tank. In one exemplary embodiment, the container can use bellows as a mechanism to add steam to the tank or remove steam from the tank. In another exemplary embodiment, the container can use an absorption / desorption unit (hereinafter referred to as an "absorption unit") to add steam to the tank or remove steam from the tank. In still another exemplary embodiment, the container can use a pressurized container to add steam to the tank or remove steam from the tank. In still another exemplary embodiment, the container can use a combination of the mechanisms listed above to add steam or fluid to the tank or remove steam or fluid from the tank. In still another exemplary embodiment, the container can use a heating element and a combination of one or more of the mechanisms listed above to maintain the pressure of the tank. For example, during startup operation, the management system can use a combination of a heating element and bellows to maintain the pressure of the tank. In one example, before the computing device is turned on, the management system can operate the heating element to heat the dielectric fluid. At some point (e.g., before heating, after heating, or during heating), the management system can open a valve connecting the bellows to the tank, thereby facilitating the transfer of dielectric steam to the bellows. This transfer of dielectric steam to the bellows prevents an uncontrolled increase in the pressure of the tank, thereby allowing the temperature of the dielectric fluid to be increased while the pressure of the tank is maintained (e.g., within an acceptable range).

[0244] ​​​​​​​​​​​

[0245] Similarly, during the setup operation, the management system can maintain the pressure of the tank using a combination of the heating element and the absorption unit. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the absorption unit to the tank, thereby facilitating the transfer of the dielectric vapor to the absorption unit, which can absorb or hold the dielectric vapor in an absorption unit, such as a carbon bed. Similarly, during the setup operation, the management system can maintain the pressure of the tank using a combination of the heating element and the pressurized container. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the pump and the pressurized container to the tank, thereby facilitating the transfer of the dielectric vapor to the pressurized container using the pump. The pressurized container can store the dielectric vapor. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the absorption unit to the tank, thereby facilitating the transfer of the dielectric vapor to the absorption unit, which can absorb or hold the dielectric vapor in an absorption unit, such as a carbon bed. Similarly, during the setup operation, the management system can maintain the pressure of the tank using a combination of the heating element and the pressurized container. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the absorption unit to the tank, thereby facilitating the transfer of the dielectric vapor to the absorption unit, which can absorb or hold the dielectric vapor in an absorption unit, such as a carbon bed. Similarly, during the setup operation, the management system can maintain the pressure of the tank using a combination of the heating element and the pressurized container. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the absorption unit to the tank, thereby facilitating the transfer of the dielectric vapor to the absorption unit, which can absorb or hold the dielectric vapor in an absorption unit, such as a carbon bed. Similarly, during the setup operation, the management system can maintain the pressure of the tank using a combination of the heating element and the pressurized container. At a certain point (e.g., before heating, after heating, or during heating), the management system can maintain the pressure of the tank using a combination of the heating element and the pressurized container. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the pump and the pressurized container to the tank, thereby facilitating the transfer of the dielectric vapor to the pressurized container using the pump. The pressurized container can store the dielectric vapor. the management system opens the valve connecting the pump and the pressurized container to the tank, thereby facilitating the transfer of the dielectric vapor to the pressurized container using the pump. The pressurized container can store the dielectric vapor. thereby facilitating the transfer of the dielectric vapor to the pressurized container using the pump. The pressurized container can store the dielectric vapor. The pressurized container can store the dielectric vapor.

[0246] As another example, during the shutdown operation, the management system can maintain the pressure of the tank using a combination of the heating element and the bellows. In one example, after the computing device is turned off, the management system can operate the heating element to heat the dielectric fluid. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the bellows to the tank, thereby facilitating the transfer of the dielectric vapor to the tank. This transfer of the dielectric vapor to the tank prevents an uncontrolled decrease in the pressure of the tank, thereby allowing the temperature of the dielectric fluid to be reduced while the pressure of the tank is maintained (e.g., within an acceptable range). In one example, after the computing device is turned off, the management system can operate the heating element to heat the dielectric fluid. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the bellows to the tank, thereby facilitating the transfer of the dielectric vapor to the tank. This transfer of the dielectric vapor to the tank prevents an uncontrolled decrease in the pressure of the tank, In one example, after the computing device is turned off, the management system can operate the heating element to heat the dielectric fluid. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the bellows to the tank, thereby facilitating the transfer of the dielectric vapor to the tank. This transfer of the dielectric vapor to the tank prevents an uncontrolled decrease in the pressure of the tank, thereby allowing the temperature of the dielectric fluid to be reduced while the pressure of the tank is maintained (e.g., within an acceptable range). thereby allowing the temperature of the dielectric fluid to be reduced while the pressure of the tank is maintained (e.g., within an acceptable range). thereby allowing the temperature of the dielectric fluid to be reduced while the pressure of the tank is maintained (e.g., within an acceptable range). In one example, after the computing device is turned off, the management system can operate the heating element to heat the dielectric fluid. At a certain point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the bellows to the tank, thereby facilitating the transfer of the dielectric vapor to the tank. This transfer of the dielectric vapor to the tank prevents an uncontrolled decrease in the pressure of the tank,

[0247] Similarly, during the shutdown operation, the management system can maintain the pressure of the tank using a combination of a heating element and an absorption unit. At some point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the absorption unit to the tank, thereby facilitating the transfer of the dielectric vapor to the tank. In the case of a carbon bed as the absorption unit, the management system can activate the carbon bed and release the captured or absorbed dielectric molecules. The management system can activate the carbon bed, for example, by sending a signal to a switch to turn on the heating element in the carbon bed. In one example, as the pressure in the tank decreases, the carbon bed is heated to release the dielectric vapor and minimize the pressure drop.

[0248] Similarly, during the shutdown operation, the management system can maintain the pressure of the tank using a combination of a heating element and a pressurized container. At some point (e.g., before heating, after heating, or during heating), the management system opens the valve connecting the pressurized container to the tank, thereby facilitating the transfer of the dielectric vapor to the tank.

[0249] In one exemplary embodiment, there may be a trade - off between the use of bellows and the use of an absorption unit. Bellows are passive elements, while absorption units are active elements. A bellows - type system can be more power - efficient than an absorption - unit - type system because the bellows do not require active heating. On the other hand, bellows take up more space than absorption units, and an absorption - unit - type system provides more advanced control and functionality. Regarding this, the equipment As control constraints, efficiency, control, and space may be available.

[0250] In one exemplary embodiment, the container may undergo an uncontrolled shutdown. For example the container may undergo an uncontrolled shutdown due to a power loss. In this exemplary embodiment, an emergency shutdown process may be implemented to address the possibility of pressure fluctuations in the tank. For example, the container may have a backup or uninterruptible power supply ("UPS") that can supply power to the container and its management system (or other systems). When the management system receives a signal from a sensor indicating that the pressure in the tank has dropped below an acceptable threshold as a result of a power loss and cooling of the system, the management system can instruct the bypass valve to open. The bypass valve can connect the tank to the external environment. The bypass valve can introduce air into the tank, thereby normalizing the pressure in the tank (so that the tank or bellows does not collapse). Thereafter, during the startup operation, the container can purge the air introduced into the tank.

[0251] In one exemplary embodiment, the management system (or other system) can use a table, matrix, or map ( "map") to determine how to respond to impact events. In one exemplary embodiment, the map can display a change in temperature as an input and display an output regarding how much heat to add to the tank in response to the change in temperature. In one exemplary embodiment, the map can display data regarding steam temperature, tank pressure, height of fluid in the tank or storage area, fluid pressure of a pump or filter, differential pressure, humidity level, and condition of alumina. may include an input such as a tag. In response to these inputs, the map can provide outputs such as the operating parameters of a capacitor, a heating element, a pump, a bellows valve, a carbon intake valve, a carbon exhaust valve, and a computing device. The map can define various states regarding the operation of the container. The management system can receive various data from sensors provided throughout the container. The management system can use the map to convert the data into operating parameters for devices on the container, such as bellows, absorption units, valves, heating elements, pumps, capacitors, and computing devices. In one exemplary embodiment, the container can operate at a temperature near the boiling point of the dielectric fluid and a pressure near atmospheric pressure. However, those skilled in the art will recognize that the container can operate at other temperature and pressure ranges based on the optimal operating temperature for operating the computing device. In one exemplary embodiment, the optimal operating temperature of the system is approximately 137 ± 8 degrees Fahrenheit. In one exemplary embodiment,

[0252] the optimal operating pressure of the system is approximately atmospheric pressure (e.g., 101325 Pa) ± 5000 Pa. In this exemplary embodiment, during an impact event, the management system attempts to maintain the temperature and pressure of the container within this range. In some exemplary embodiments of this disclosure, the management system is designated as a system programmed to perform various tasks in an impact event. However, those skilled in the art will recognize that other systems disclosed in this disclosure can be programmed to perform these tasks.

[0253]

[0254] In an exemplary embodiment, the container can operate under three modes of operation. In the first mode of operation, the tank can operate at atmospheric pressure. In the second mode of operation, the tank can operate within a pressure range that significantly deviates from atmospheric pressure. In the third mode of operation, the container may operate at atmospheric pressure or within a pressure range that significantly deviates from atmospheric pressure. The operation of the third mode may be a hybrid of the first and second modes. In an exemplary embodiment, the management system can determine the operating mode of the container. For example, the management system can operate the container based on rules defined for the management system, e.g., pressurize the container at 5:00 am every morning, return it to atmospheric pressure at night, and pressurize the container at the peak of the workload as determined by the sensor data. As another example, the management system can predict the operating mode for the container using machine learning algorithms. For example, the machine learning algorithms can use exogenous data such as weather conditions, calendar data, usage data, etc., in addition to the sensor data, to predict which operating mode is more efficient under the circumstances. The user of the system can

[0255] provide labeled data to the management system, which can create a model for extrapolating the data to predict the operating mode. In an exemplary embodiment, the management system can perform certain routines before the lid of the tank can be opened. For example, if the container is provided with an instruction to open the lid of the tank, the condensation system The vapor within the tank can be minimized such that it is lost to the environment.

[0256] In one exemplary embodiment, the immersion cooling system can be a modular system. For example, each group of components of the system can be mounted on an individual skid, such as a condensation skid, a heating skid, a bellows skid, an absorption unit skid, etc. These skids can be made movable and deployed for various applications.

[0257] Circulation and filtration of dielectric fluid In one exemplary embodiment, the container can include a pump that circulates a dielectric fluid through the tank. For example, the tank can include a storage region and a sump region. The sump region can hold a computing device immersed in the dielectric fluid. The storage region can be adjacent to the sump region or to the tank region, or in fluid communication with the tank region. For example, the storage region can receive an overflow of the dielectric fluid from the tank region, and for example, the dielectric fluid can flow over the wall of the tank region adjacent to the storage region. The pump can draw the dielectric fluid out of the storage

[0258] region and pass the fluid through a filter. After the filter, the dielectric fluid will return to the tank region. The container can include various pipes that connect the storage region, the pump, the filter, and the tank region. The pump draws the dielectric fluid out of the storage region and passes it, It is possible. The dielectric fluid is more in the tank than the capacity of the tank region holding the fluid, so when the pump operates, (especially when the pump is in operation), the tank region is always filled. However, depending on the temperature of the tank, the height of the dielectric fluid in the storage region may change. This is because the dielectric fluid evaporates from the tank region, and the dielectric fluid from the storage region can be exchanged with the evaporated fluid in the tank. In one exemplary embodiment, the tank can be in the shape of a rectangular box. The dielectric fluid can flow into the storage region adjacent to the short side over one of the upper parts of the short side. Since cavitation can be caused by interruption or turbulence in the fluid, the pump can draw out the dielectric fluid and return it or reintroduce it to a location in the tank that can cause minimal interruption or turbulence to the fluid in the tank. In particular, the longer the distance between the overflow region and the reintroduction point, the less turbulence associated with the reintroduction of the fluid into the tank. For example, when the dielectric fluid overflows from the upper part of the first side of the tank, the pump can return the dielectric fluid to the bottom of the side opposite the first side. The pump can return the dielectric fluid to the corner of the bottom side, which minimizes the interruption or turbulence of the fluid in the tank. In one exemplary embodiment, the container can include two pumps. Each pump can independently draw out the fluid from the storage region and send it to the tank region. Providing two separate and independent pumps in the container can increase the service life of the container. In addition, if one of the pumps fails for some reason, the container can continue to operate without interruption until the failed pump is replaced.

[0259]

[0260]

[0261] ​​​​​​​​​​​​​​​ In an exemplary embodiment, the container may include a filter. The filter may include one or more cores. Each core may be capable of filtering a dielectric fluid for different types of contaminants, particles, substances, diluents, or solutes. In an exemplary embodiment, the core can be selected based on the properties of the dielectric fluid and the contaminants likely to be introduced into the dielectric fluid. For example, the contaminants may include solder and resin used during the manufacturing process of electronic substrates used in computing devices. The dielectric fluid can act as a cleaning agent for resins, solder, dust, dirt, or other things in the system. The solder and resin (or other substances) may be washed away from these electronic substrates after they are immersed in the dielectric fluid. The filter can remove solder and resin (or other substances) from the dielectric fluid. If these substances are not removed from the dielectric fluid, when the dielectric fluid vaporizes, these substances may deposit as a layer on the heat-generating components of a computing device, such as a processor. As a result, the layer thermally separates or insulates the heat-generating components from the dielectric fluid, thereby reducing the efficiency of heat transfer from these components to the dielectric fluid. Consequently, the components may heat up at a higher frequency and may be damaged.

[0262] In an exemplary embodiment, the filter may include two cores. One core may include activated carbon (charcoal), and the other core may include activated aluminum. For example, the ratio of activated carbon to activated aluminum may be 3 to 1. As another example, the filter may include four cores. Three cores may include activated carbon, and one core may include activated aluminum.

[0263] In an exemplary embodiment, the filter includes a strip that tests the acidity of the dielectric fluid obtained. This strip can be a pH indicator, litmus paper, or other indicator. In one example the dielectric fluid can become acidic after interaction with a given component of the tank. The strip contacts the dielectric fluid and can cause a color change if the dielectric fluid becomes acidic. The filter may include a color detection sensor that detects the color change in the strip and can send a signal to a management system (or other system) when the color change in the strip is detected. In an exemplary embodiment, the strip can be placed in a container or chamber that includes a glass shield. Thus, the color change of the strip can be visible outside the container . A camera can be placed within the vicinity of the container. The camera can take a picture of the strip (behind the glass shield) and send the picture to the management system. When the management system (or the user of the system) detects the color change of the strip (using the data provided by the camera or color sensor ), the management system can trigger remedial measures , such as notifying a maintenance system or shutting down the system .

[0264] In an exemplary embodiment, the camera can be a pan-tilt-zoom camera. The lid of the filter can be mounted on top of the reservoir area. The lid of the filter can be installed next to another lid that provides access to the tank area . The lid of the filter may include the filter and the camera can be installed on top of the lid of the filter. In one embodiment, the camera is on top of the lid of the filter ​​​​​​It can be installed directly below. Therefore, when the camera rotates, the camera can capture images of areas including stripes, storage areas (the area under the camera) and the trough area.

[0265] Figures 19A - B show a filter including three cores according to an exemplary embodiment. As shown in Figure 19A , the filter may include a mountable lid 1050 on the tank, for example, next to other lids that provide access to a computing device installed inside the tank. Each core of the filter can be connected to the lid 1050. The lid 1050 may include three caps 1 060, and each cap provides access to one of the cores. Figure 19B shows a structure 1070 mounted on the lid 1050. The structure 1070 can support various filter cores and other components, such as filter core 1071, camera 1072, and electro mechanical valve 1073. On the opposite side of the structure 1070, two other filter cores may be present (not shown in Figure 19B). In this exemplary filter, there is a camera and two color sensors attached to the lid. The camera

[0266] and color sensors can acquire data regarding the acidity of the dielectric fluid (based on the color of the stripes) and convey the data to the management system. In one exemplary embodiment, the filter can be mounted on a chassis that can be removed by a robot. The chassis may include a connection interface for detachably connecting the chassis (and the filter provided thereon) to various pipes provided inside the tank. Therefore, when the management

[0267] system determines that the filter needs to be replaced, the robot can remove the chassis from the tank or the tank. including the filter provided thereon. or the tank. It can be lifted and the filter can be placed in the magazine.

[0268] In one exemplary embodiment, the management system can notify the user when the filter needs to be repaired or replaced. For example, the management system can include a timer or counter that is activated when the filter is installed in the container. If the management system determines that the filter has been operating for longer than a threshold time, the management system can send a notification to the user (or other entity). As another example, the management system can activate the timer or counter only when the container is operating, the pump is in an operating state, or (as determined by a fluid sensor at the filter) induced electrical fluid passes through the filter. If the management system determines that the filter has been operating for longer than a threshold time, the management system can send a notification to the user. As yet another example, the management system can determine the pressure difference across the filter, and the management system can notify the user to repair or replace the filter when the pressure difference exceeds a threshold pressure. In particular, the filter can include an input pipe and an output pipe, and there can be pressure sensors on the input pipe and the output pipe. Each pressure sensor can send a pressure reading to the management system. If the pressure difference between the readings of the pressure sensors exceeds a threshold pressure, the management sensor can determine that the filter is clogged. Accordingly, the management system can notify the user to repair or replace the filter. As yet another example, the filter can include a sensor that indicates the flow rate through the filter. The management system can... ... ... ... ... ... ... ... ... ... ... ... The flow rate can be used to determine whether filter repair is necessary. As ano...

Claims

1. A system comprising: a tank configured to hold a liquid-phase and a gas-phase fluid; a structure within the tank configured to hold one or more computer components that are at least partially immersed in the liquid-phase fluid during operation of the system; a heating element configured to heat the liquid-phase fluid; and a controller configured to adjust the heating element.

2. The system of claim 1, wherein the heating element is configured to be fully immersed in the liquid phase during operation of the system.

3. The system of claim 1, wherein the controller is configured to adjust the heating element using a matrix.

4. The system of claim 1, further comprising a temperature sensor or a pressure sensor operably coupled to the controller.

5. The system of claim 1, wherein the controller is configured to: receive data regarding the operating load, temperature, or both of the processor; and adjust the heating element based on the operating load, temperature, or both of the processor.

6. The system of claim 1, wherein the controller is configured to cause the heating element to heat the liquid-phase fluid during or prior to a startup operation.

7. The system of claim 1, wherein the controller is configured to cause the heating element to heat the liquid-phase fluid when the temperature of the liquid-phase fluid is below a threshold temperature.

8. The system of claim 1, wherein the controller is configured to cause the heating element to heat the liquid-phase fluid during or prior to a boost operation.

9. The system of claim 8, wherein the boost operation is identified by the controller in response to an indication that an increase in the operating load of the processor has occurred.

10. The system of claim 1, further comprising a pressure management system, wherein the controller is configured to operate the pressure management.

11. The system of claim 1, wherein the controller is configured to operate the heating element to maintain the temperature of the liquid-phase fluid within a threshold range below the boiling point of the fluid.

12. A method for cooling computer components, comprising: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Receiving first sensor data from a sensor located in the tank, wherein the tank comprises: (a) a fluid in a liquid phase and a gas phase; (b) one or more computer components at least partially immersed in the fluid of the liquid phase; (c) a heating element at least partially immersed in the fluid of the liquid phase; (d) a sensor; and is configured to hold them, the step; Operating the heating element based on the sensor data; Stopping the heating element based on the sensor data; A method comprising:

13. Detecting an operating mode of the one or more computer components, wherein the operating mode is a startup mode, a boost mode, a slowdown mode, or a shutdown mode, the method according to claim 12, further comprising the step of:

14. The startup mode is the case where the one or more computer components are inactive over a period before operating the one or more computer components, the method according to claim 13.

15. The boost mode is the case where an increase in the operating load of the one or more computer components is expected, the method according to claim 13. ​ ​ ​

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