Members for manufacturing vapor chamber, vapor chamber, and vapor chamber manufacturing method

Abstract

To provide members for manufacturing a vapor chamber, which are superior in flexibility and have a specially excellent heat transfer ability, and to provide a vapor chamber superior in flexibility and having a specifically excellent heat transfer ability, and a manufacturing method thereof.SOLUTION: Members for manufacturing a vapor chamber of the present invention are members used in manufacturing a vapor chamber and are characterized to include a fiber base material made of fibers and resin materials in a non-hardened state impregnated with the fiber base material. A thickness of the fiber base material is preferably 10 μm or more and 1,000 μm or less.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a member for manufacturing a vapor chamber, a vapor chamber, and a method for manufacturing a vapor chamber.

Background Art

[0002] For example, heat-generating members such as a central processing unit (CPU), a light-emitting diode (LED), and a power semiconductor used in mobile terminals such as mobile phones and tablet terminals are cooled by heat pipes (see, for example, Patent Document 1).

[0003] In recent years, in order to make mobile terminals such as mobile phones thinner, development of a vapor chamber that can be made thinner than a heat pipe has been promoted.

[0004] An operating fluid is enclosed in the vapor chamber, and the operating fluid cools the heat-generating member by absorbing the heat of the heat-generating member and transferring the heat.

[0005] More specifically, the operating fluid in the vapor chamber receives heat from the heat-generating member in a portion (evaporation portion) close to the heat-generating member and evaporates into vapor, and then the vapor moves to a position away from the evaporation portion, is cooled, and condenses into a liquid state.

[0006] A liquid flow path portion as a capillary structure (wick) is provided in the vapor chamber, and the liquefied operating fluid passes through this liquid flow path portion and is transported toward the evaporation portion, and again receives heat at the evaporation portion and evaporates.

[0007] In this way, the operating fluid refluxes in the vapor chamber while repeating phase changes, that is, evaporation and condensation, to transfer the heat of the device and improve the heat dissipation efficiency.

[0008] However, in conventional vapor chambers, there is a lack of flexibility, and depending on the shape of the heating member and the like, it may not be possible to achieve sufficiently excellent adhesion to the heating member. Further, in vapor chambers, further improvement in heat transport capacity is required.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0010] An object of the present invention is to provide a member for manufacturing a vapor chamber that is excellent in flexibility and can be suitably used for manufacturing a vapor chamber having particularly excellent heat transport capacity, and also to provide a vapor chamber that is excellent in flexibility and has particularly excellent heat transport capacity and a method for manufacturing the same.

Means for Solving the Problems

[0011] Such an object is achieved by the present invention as described in the following (1) to (12). (1) A member for manufacturing a vapor chamber used in the manufacture of a vapor chamber, characterized by comprising fibers and an uncured resin material.

[0012] (2) A member for manufacturing a vapor chamber used in the manufacture of a vapor chamber, characterized by comprising a fiber base material composed of fibers and an uncured resin material impregnated in the fiber base material.

[0013] (3) The member for manufacturing a vapor chamber according to the above (2), wherein the thickness of the fiber base material is 10 μm or more and 1000 μm or less.

[0014] (4) The member for manufacturing a vapor chamber according to the above (2) or (3), wherein the thickness of the member for manufacturing a vapor chamber is 10 μm or more and 2000 μm or less.

[0015] (5) The member for manufacturing a vapor chamber according to any one of the above (1) to (4), wherein the fiber is made of an aromatic resin containing a heterocyclic ring in the molecule.

[0016] (6) The member for manufacturing a vapor chamber according to any one of the above (1) to (5), when the content rate of the fiber in the member for manufacturing a vapor chamber is Xf [% by mass] and the content rate of the resin material is Xr [% by mass], satisfying the relationship of 0.01 ≦ Xf / Xr ≦ 8.0.

[0017] (7) The member for manufacturing a vapor chamber according to any one of the above (1) to (6), wherein the resin material contains an alkali-soluble resin and a photopolymerizable resin.

[0018] (8) The member for manufacturing a vapor chamber according to the above (7), wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group.

[0019] (9) The member for manufacturing a vapor chamber according to the above (7) or (8), wherein the resin material further contains a thermosetting resin different from the alkali-soluble resin.

[0020] (10) A vapor chamber having a container having a cavity inside, a wick structure disposed in the cavity, and a working fluid disposed in the cavity. The wick structure is composed of a material containing a cured resin and fibers, and the fibers are arranged in a part of the flow path portion of the working fluid where the cured resin is not arranged. A vapor chamber characterized by this.

[0021] (11) The vapor chamber according to (10) above, wherein the wick structure is formed using the member for manufacturing a vapor chamber according to any one of (1) to (9) above.

[0022] (12) A step of preparing a member for manufacturing a vapor chamber for preparing a member for manufacturing a vapor chamber according to any one of (1) to (9) above, A first bonding step of bonding the member for manufacturing a vapor chamber to a first sheet material on a first surface which is one surface thereof, An exposure step of irradiating light in a predetermined pattern to the member for manufacturing a vapor chamber bonded to the first sheet material, A developing step of removing the uncured resin material at a site where the light was not irradiated in the exposure step, A second bonding step of bonding the member for manufacturing a vapor chamber that has undergone the developing step to a second sheet material on a second surface which is the surface opposite to the first surface, A method for manufacturing a vapor chamber, comprising: injecting a working fluid into a space between the first sheet material and the second sheet material, and a working fluid supply and sealing step of sealing the space.

Effect of the Invention

[0023] According to the present invention, there is provided a member for manufacturing a vapor chamber that is excellent in flexibility and can be suitably used for manufacturing a vapor chamber having particularly excellent heat transport ability. In addition, a vapor chamber and a method for manufacturing the same that are excellent in flexibility and have particularly excellent heat transport ability can be provided.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0025] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. [1] Member for Manufacturing Vapor Chamber First, a member for manufacturing a vapor chamber of the present invention will be described. FIG. 1 is a perspective view schematically showing an example of a member for manufacturing a vapor chamber according to the present invention. FIG. 2 is a longitudinal sectional view schematically showing an example of a member for manufacturing a vapor chamber according to the present invention. FIGS. 3 and 4 are longitudinal sectional views schematically showing other examples of the member for manufacturing a vapor chamber according to the present invention, respectively.

[0026] The member 10' for manufacturing a vapor chamber is used for manufacturing a vapor chamber 100 described later. More specifically, the member 10' for manufacturing a vapor chamber is a member for manufacturing a wick structure for use as a formed body provided in the vapor chamber 100, which is a member for manufacturing a formed body used for manufacturing the wick structure 10 as the formed body included in the vapor chamber 100.

[0027] And the member 10' for manufacturing a vapor chamber includes fibers 131 and an uncured resin material 14'.

[0028] Thereby, it is possible to provide a member 10' for manufacturing a vapor chamber that is excellent in flexibility and can be suitably used for manufacturing a vapor chamber 100 having particularly excellent heat transport ability. In addition, since the flexibility of the vapor chamber 100 can be made excellent, regardless of the member, arrangement, etc. to which the vapor chamber 100 is applied, the close contact state between the vapor chamber 100 and the member can be made good, and the excellent heat transport ability can be more reliably exhibited.

[0029] It is considered that such excellent effects are obtained for the following reasons. That is, since the member 10' for manufacturing the vapor chamber includes the fiber 131 and the uncured resin material 14', the wick structure 10 formed using the member 10' for manufacturing the vapor chamber can be configured with a material including the fiber 131 and the cured resin 14, and the entire vapor chamber 100 can exhibit excellent flexibility. Further, since the member 10' for manufacturing the vapor chamber includes the uncured resin material 14', for example, in the method described later, by irradiating light (exposure light) in a predetermined pattern, the flow path portion 15 of the working fluid 30 in the vapor chamber 100, particularly, the flow path portion of the gaseous working fluid 30 (the portion of the flow path portion 15 where the fiber 131 does not exist, or the portion where the density of the fiber 131 is low), and the flow path portion of the liquid working fluid 30 (the portion of the flow path portion 15 where the fiber 131 exists, or the portion where the density of the fiber 131 is high) can be preferably formed. More specifically, the structure for moving the gaseous working fluid 30 and the structure for moving the liquid working fluid 30 by capillary action can be formed in a suitable arrangement. Thereby, the cycle of evaporation and condensation of the working fluid 30 can be accelerated, and the heat transport capacity of the entire vapor chamber 100 can be made particularly excellent. However, in the flow path portion of the gaseous working fluid 30 (the portion of the flow path portion 15 where the fiber 131 does not exist, or the portion where the density of the fiber 131 is low), a part of the liquid working fluid 30 may flow, and in the flow path portion of the liquid working fluid 30 (the portion of the flow path portion 15 where the fiber 131 exists, or the portion where the density of the fiber 131 is high), a part of the gaseous working fluid 30 may flow.

[0030] In addition, the shape and the like of the flow path portion 15 and the flow path wall 16 provided in the vapor chamber 100 (wick structure 10) manufactured using the vapor chamber manufacturing member 10' can be suitably adjusted according to the use of the vapor chamber 100, the application site, and the like. In other words, it has excellent on-demand characteristics. Further, the vapor chamber 100 (wick structure 10) can be suitably manufactured by general processes such as light irradiation and heat treatment, and the vapor chamber 100 having the above excellent characteristics can be manufactured without performing complicated metal processing or the like. Further, the flow path portion for the gaseous working fluid 30 and the flow path portion for the liquid working fluid 30 can be formed in a common process, and alignment and the like of these portions are not required, so that high productivity and high yield in the manufacture of the vapor chamber 100 can be realized.

[0031] The uncured resin material 14' is a curable resin material, and it may be any material as long as the curing reaction is not completed, and it may be a resin material in which a part of the curing reaction has proceeded, for example, a B-stage resin material.

[0032] In particular, in the illustrated configuration, the vapor chamber manufacturing member 10' includes a fiber base material 13 composed of fibers 131 and an uncured resin material 14' impregnating the fiber base material 13.

[0033] As a result, the above-described effects are more significantly exhibited. For example, since the fiber 131 is not only included in an independent state, but the fiber base material 13 in which a plurality of fibers 131 are intertwined is included, for example, the gaps between the fibers 131 in the member 10' for manufacturing a vapor chamber can be easily adjusted to a state where capillary action is likely to occur for the liquid working fluid 30, and the arrangement position of the fibers 131 in the member 10' for manufacturing a vapor chamber can be easily adjusted. Therefore, in the wick structure 10 formed using the member 10' for manufacturing a vapor chamber, the flow path portion of the gaseous working fluid 30 and the flow path portion of the liquid working fluid 30 can be formed more preferably, and the above-described effects can be more surely exhibited. Further, the manufacturing of the member 10' for manufacturing a vapor chamber becomes easy, and the arrangement state and distribution of the fibers 131 in the member 10' for manufacturing a vapor chamber can be easily adjusted. For example, uneven distribution of the fibers 131 (for example, insufficient presence of the fibers 131 in a portion that should be the flow path portion 15, etc.) in each part of the member 10' for manufacturing a vapor chamber can be preferably prevented.

[0034] In the illustrated configuration, the fiber base material 13 is in a sheet shape, but the shape of the fiber base material 13 is not particularly limited.

[0035] Further, in the illustrated configuration, the member 10' for manufacturing a vapor chamber is in a sheet shape, particularly, has a shape corresponding to the sheet-like fiber base material 13, but the shape of the member 10' for manufacturing a vapor chamber is not particularly limited.

[0036] [1-1] Fiber The member 10' for manufacturing a vapor chamber includes the fiber 131.

[0037] The fiber 131 may be made of any material. Examples of the constituent material of the fiber 131 include cotton, hemp, wool, polyester resin, polyamide resin, acrylic resin, aromatic resin containing a heterocyclic ring in the molecule, glass, carbon, iron, silver, copper, etc. One or more selected from these can be used in combination.

[0038] In particular, when the fiber 131 is made of an aromatic resin containing a heterocyclic ring in the molecule, the long-term durability of the vapor chamber 100 is improved.

[0039] Examples of the aromatic resin containing a heterocyclic ring in the molecule include polyimide, polyamideimide, polyesterimide, polybenzoxazole, etc. Among them, polyphenylene benzobisoxazole is preferable. Examples of commercially available products of fibers made of polyparaphenylene benzobisoxazole include Zylon manufactured by Toyobo Co., Ltd.

[0040] The thickness of the fiber 131 is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 4 μm or more and 30 μm or less, and even more preferably 5 μm or more and 15 μm or less.

[0041] Thereby, while preventing the member 10' for manufacturing the vapor chamber from being thickened more than necessary, it is possible to secure a more suitable state for the gaps between the fibers 131, and the transport ability of the liquid working fluid 30 due to capillary action in the vapor chamber 100 can be made more excellent. As a result, the heat transport ability of the vapor chamber 100 can be made more excellent.

[0042] In the member 10' for manufacturing the vapor chamber and the vapor chamber 100, the fiber 131 may be included, for example, in a state where a plurality of fibers 131 are bundled together, that is, as a fiber bundle. Examples of the fiber bundle include forms such as multifilament twisted yarn, single twist yarn, lang lay yarn, and braided cord.

[0043] This can prevent the member 10' for manufacturing the vapor chamber from being thickened more than necessary, while ensuring a more suitable state for the gaps between the fibers 131, and can make the transport ability of the liquid working fluid 30 due to capillary action in the vapor chamber 100 even better. As a result, the heat transport ability of the vapor chamber 100 can be made even better.

[0044] In the illustrated configuration, the fibers 131 constitute a sheet-like fiber base material (fiber sheet) 13.

[0045] This can exert the effects resulting from including the fiber base material 13 as described above. Further, since the fiber base material 13 is in a sheet shape, it is possible to suitably prevent the member 10' for manufacturing the vapor chamber from being thickened more than necessary, and it is possible to more suitably prevent unintentional deformation of the fiber base material 13 during the manufacture of the vapor chamber 100 (wick structure 10) and unintentional movement of the fibers 131 in the member 10' for manufacturing the vapor chamber (wick structure 10).

[0046] The fiber base material 13 may be, for example, a nonwoven fabric or a woven fabric. When the fiber base material 13 is a woven fabric, examples of the woven fabric include plain weave, twill weave, damask weave, jacquard weave, mock leno weave, twill weave, double weave, and the like.

[0047] The thickness of the fiber base material 13 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and even more preferably 30 μm or more and 200 μm or less.

[0048] This can prevent the member 10' for manufacturing the vapor chamber from being thickened more than necessary, while ensuring a more suitable state for the gaps between the fibers 131, and can make the transport ability of the liquid working fluid 30 due to capillary action in the vapor chamber 100 even better. As a result, the heat transport ability of the vapor chamber 100 can be made even better.

[0049] The fiber base material 13 may have portions with different fiber densities. For example, the fiber base material 13 may have portions with different fiber densities in its thickness direction.

[0050] The member 10' for manufacturing a vapor chamber may include a plurality of fiber base materials 13. In this case, these fiber base materials 13 may be under the same conditions or different conditions. When the member 10' for manufacturing a vapor chamber includes a plurality of fiber base materials 13, for example, a plurality of fiber base materials 13 may be laminated in the thickness direction of the member 10' for manufacturing a vapor chamber.

[0051] Even if the member 10' for manufacturing a vapor chamber includes the fiber base material 13, it may further include fibers 131 independent of the fiber base material 13.

[0052] The content rate of the fibers 131 in the member 10' for manufacturing a vapor chamber is preferably 1 mass% or more and 80 mass% or less, more preferably 3 mass% or more and 75 mass% or less, and still more preferably 5 mass% or more and 70 mass% or less.

[0053] In particular, when the fibers 131 are made of an inorganic material, the content rate of the fibers 131 in the member 10' for manufacturing a vapor chamber is preferably 40 mass% or more and 80 mass% or less, more preferably 45 mass% or more and 75 mass% or less, and still more preferably 50 mass% or more and 70 mass% or less.

[0054] Also, when the fibers 131 are made of an organic material, the content rate of the fibers 131 in the member 10' for manufacturing a vapor chamber is preferably 1 mass% or more and 40 mass% or less, more preferably 3 mass% or more and 35 mass% or less, and still more preferably 5 mass% or more and 30 mass% or less.

[0055] By satisfying the conditions of the content ratio as described above, in the vapor chamber 100 (wick structure 10) manufactured using the member 10' for manufacturing a vapor chamber, the ratio between the flow path portion of the gaseous working fluid 30 and the flow path portion of the liquid working fluid 30 can be made more suitable.

[0056] [1-2] Resin material The member 10' for manufacturing a vapor chamber contains an uncured resin material 14'.

[0057] The resin material 14' only needs to contain a curable resin in an uncured state, and it may be a resin in which a partial curing reaction has progressed (for example, a B-stage resin), or it may contain a thermoplastic resin in addition to the curable resin in an uncured state.

[0058] Among them, the resin material 14' preferably contains an alkali-soluble resin and a photopolymerizable resin.

[0059] Thereby, in the method as described later, a predetermined pattern can be preferably formed by an exposure process and a development process, and in the development process, instead of an organic solvent widely used as a developer, an alkaline aqueous solution with a lower environmental load can be preferably used.

[0060] Hereinafter, the alkali-soluble resin will be described. Examples of the alkali-soluble resin include novolak resins such as cresol type, phenol type, bisphenol A type, bisphenol F type, catechol type, resorcinol type, and pyrogallol type; phenol aralkyl resins; hydroxy styrene resins; acrylic resins such as methacrylic acid resins and methacrylic acid ester resins; cyclic olefin resins containing a hydroxyl group, a carboxyl group, etc.; polyamide resins (specifically, resins having at least one of a polybenzoxazole structure and a polyimide structure and having a hydroxyl group, a carboxyl group, an ether group, or an ester group in the main chain or side chain, resins having a polybenzoxazole precursor structure, resins having a polyimide precursor structure, resins having a polyamide acid ester structure, etc.).

[0061] As the alkali-soluble resin, for example, a resin having an alkali-soluble group and a double bond can be preferably used.

[0062] Examples of the resin having an alkali-soluble group and a double bond include curable resins that can be cured by both light and heat.

[0063] Examples of the alkali-soluble group include a hydroxyl group, a carboxyl group, etc. This alkali-soluble group can also contribute to the thermosetting reaction.

[0064] Examples of such resins include thermosetting resins having a photoreactive group such as an acryloyl group, a methacryloyl group, and a vinyl group, and photocurable resins having a thermoreactive group such as a phenolic hydroxyl group, an alcoholic hydroxyl group, a carboxyl group, and an acid anhydride group. The photocurable resin may further have a thermoreactive group such as an epoxy group, an amino group, and a cyanate group. Specifically, (meth)acrylic-modified phenol resins, (meth)acryloyl group-containing acrylic acid polymers, carboxyl group-containing (epoxy)acrylates, etc. can be mentioned. Among these, as the alkali-soluble resin, those containing a (meth)acrylic group and a phenolic hydroxyl group are preferable, and (meth)acrylic-modified phenol resins are more preferable.

[0065] By using a resin containing an alkali-soluble group, when removing the unreacted resin at the double bond portion during the development process, an aqueous alkali solution with a lower environmental load can be applied instead of the organic solvent commonly used as the developer. Also, since the double bond portion contributes to the curing reaction, the heat resistance of the resin cured product 14 described later can be maintained.

[0066] Here, when using a thermosetting resin having a photoreactive group, the modification rate (substitution rate) of the photoreactive group is not particularly limited, but it is preferably 20 mol% or more and 80 mol% or less of the total reactive groups of the resin having the alkali-soluble group and the double bond, and more preferably 30 mol% or more and 70 mol% or less.

[0067] This can make the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 as described later, that is, the reproducibility of the pattern in the exposure process, more excellent. As a result, it can be suitably applied to the manufacture of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

[0068] On the other hand, when using a photocurable resin having a heat-reactive group, the modification rate (substitution rate) of the heat-reactive group is not particularly limited, but it is preferably 20 mol% or more and 80 mol% or less of the total reactive groups of the resin having the alkali-soluble group and the double bond, and more preferably 30 mol% or more and 70 mol% or less.

[0069] This can make the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 as described later, that is, the reproducibility of the pattern in the exposure process, more excellent. As a result, it can be suitably applied to the manufacture of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

[0070] The weight average molecular weight of the resin having the alkali-soluble group and the double bond is not particularly limited, but is preferably 300,000 or less, and more preferably 5,000 or more and 150,000 or less.

[0071] Thereby, while making the shape stability of the resin material 14' in the member 10' for manufacturing the vapor chamber sufficiently excellent, the removal of the resin material 14' in the development process can be performed more suitably.

[0072] The weight average molecular weight can be evaluated using, for example, G.P.C., and the weight average molecular weight can be calculated by a calibration curve prepared in advance using a styrene standard substance. In particular, tetrahydrofuran (THF) can be used as the measurement solvent, and the measurement can be performed under the temperature condition of 40°C. In the examples described later, the value obtained by the measurement under this condition is shown as the weight average molecular weight.

[0073] The content of the alkali-soluble resin in the resin material 14' is not particularly limited, but is preferably 10% by mass or more and 80% by mass or less, and more preferably 15% by mass or more and 70% by mass or less.

[0074] Thereby, while making the shape stability of the resin material 14' in the member 10' for manufacturing the vapor chamber sufficiently excellent, the resolution in the exposure process and the developability in the development process can be made more excellent. Further, by the heat treatment in the manufacturing process of the vapor chamber 100, the bonding strength and adhesion between the wick structure 10 and the container 20 (the first sheet material 21 and the second sheet material 22) can be made more excellent.

[0075] Next, the photopolymerizable resin will be described. By including a photopolymerizable resin in the resin material 14' together with the alkali-soluble resin described above, the patterning property can be improved.

[0076] Examples of the photocurable resin include unsaturated polyesters, acrylic compounds such as acrylic monomers or oligomers having at least one acryloyl group or methacryloyl group in one molecule, vinyl compounds such as styrene, etc., and one or more selected from these can be used in combination.

[0077] Among these, an ultraviolet curable resin mainly composed of an acrylic compound is preferable. The acrylic compound has a high curing rate when irradiated with light (exposure light), and the resin material 14' can be suitably patterned with a relatively small exposure amount.

[0078] Examples of the acrylic compound include monomers such as acrylic acid esters and methacrylic acid esters. More specifically, difunctional acrylates such as ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,6 - hexanediol diacrylate, 1,6 - hexanediol dimethacrylate, glycerin diacrylate, glycerin dimethacrylate, 1,10 - decanediol diacrylate, 1,10 - decanediol dimethacrylate, and polyfunctional acrylates such as trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, etc.

[0079] Among them, (meth)acrylic acid esters are preferable, and acrylic acid esters and methacrylic acid alkyl esters having 1 to 15 carbon atoms in the ester moiety are more preferable. Thereby, the reactivity can be improved, and the sensitivity in the exposure process is improved.

[0080] Also, the photocurable resin is not particularly limited, but is preferably in a liquid state at room temperature (23°C).

[0081] As a result, the curing reactivity due to exposure light (especially ultraviolet rays) can be improved. Also, the mixing operation with other compounding components (for example, alkali-soluble resin) can be facilitated. Examples of the liquid photopolymerizable resin at room temperature include, for example, an ultraviolet curable resin mainly composed of the above-described acrylic compound and the like.

[0082] The weight average molecular weight of the photopolymerizable resin is not particularly limited, but is preferably 5,000 or less, and more preferably 150 or more and 3,000 or less.

[0083] As a result, the reactivity of the resin material 14' can be improved, the sensitivity in the exposure process can be improved, and the resolution of the resin material 14' can be improved.

[0084] The content of the photopolymerizable resin in the resin material 14' is not particularly limited, but is preferably 9% by mass or more and 40% by mass or less, and more preferably 13% by mass or more and 30% by mass or less.

[0085] As a result, the heat resistance and flexibility of the resin cured product 14 described later can be made compatible at a higher level. Also, the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 as described later, that is, the reproducibility of the pattern in the exposure process can be made more excellent. As a result, it can be suitably applied to the manufacture of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

[0086] When the content of the alkali-soluble resin in the resin material 14' is XA [% by mass] and the content of the photopolymerizable resin in the resin material 14' is XP [% by mass], it preferably satisfies the relationship of 0.15 ≦ XP / XA ≦ 0.90, more preferably satisfies the relationship of 0.19 ≦ XP / XA ≦ 0.87, and even more preferably satisfies the relationship of 0.22 ≦ XP / XA ≦ 0.33.

[0087] As a result, the shape stability of the resin material 14' in the member 10' for manufacturing the vapor chamber can be made to have an even better balance among the resolution in the exposure process, the developability in the development process, the bonding strength between the wick structure 10 and the container 20 (the first sheet material 21 and the second sheet material 22), the adhesion, the heat resistance, the flexibility, etc. of the cured resin 14.

[0088] When the resin material 14' contains an alkali-soluble resin and a photopolymerizable resin, it is preferable that the resin material 14' further contains a thermosetting resin different from the alkali-soluble resin.

[0089] As a result, the heat resistance of the vapor chamber 100 (wick structure 10) can be made even better. Also, suitable adhesiveness can be exhibited in the manufacturing process of the vapor chamber 100 described later, and the bonding strength and the adhesion between the wick structure 10 and the container 20 (the first sheet material 21 and the second sheet material 22) can be made even better.

[0090] Examples of the thermosetting resin include novolak-type phenol resins such as phenol novolak resin, cresol novolak resin, and bisphenol A novolak resin; phenol resins such as resol phenol resin; bisphenol-type epoxy resins such as bisphenol A epoxy resin and bisphenol F epoxy resin; novolak-type epoxy resins such as novolak epoxy resin and cresol novolak epoxy resin; biphenyl-type epoxy resin, stilbene-type epoxy resin, triphenolmethane-type epoxy resin, alkyl-modified triphenolmethane-type epoxy resin, triazine nucleus-containing epoxy resin, dicyclopentadiene-modified phenol-type epoxy resin, etc.; resins having a triazine ring such as urea (carbamide) resin and melamine resin; unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, resin having a benzoxazine ring, cyanate ester resin, etc. One or more selected from these can be used in combination. Among them, an epoxy resin is particularly preferable as the thermosetting resin. Thereby, the heat resistance of the resin cured product 14 described later and the adhesiveness of the resin cured product 14 to the fiber 131, the first sheet material 21, and the second sheet material 22 can be made more excellent.

[0091] In particular, as the epoxy resin, it is preferable to use a silicone-modified epoxy resin, and it is more preferable to use a combination of a solid epoxy resin at room temperature (particularly, a bisphenol-type epoxy resin) and a liquid epoxy resin at room temperature (particularly, a liquid silicone-modified epoxy resin at room temperature).

[0092] Thereby, the heat resistance and flexibility of the resin cured product 14 described later can be made compatible at a higher level. Also, the resolution of the resin material 14' in the manufacturing method of the vapor chamber 100 as described later, that is, the reproducibility of the pattern in the exposure process can be made more excellent. As a result, it can be more suitably applied to the manufacture of the vapor chamber 100 provided with the wick structure 10 having a fine pattern.

[0093] The content rate of the thermosetting resin in the resin material 14' is not particularly limited, but is preferably 10 mass% or more and 60 mass% or less, and more preferably 15 mass% or more and 55 mass% or less.

[0094] Thereby, it is possible to achieve both high heat resistance and toughness of the resin cured product 14 described later at a higher level.

[0095] When the content rate of the alkali-soluble resin in the resin material 14' is XA [mass%] and the content rate of the thermosetting resin in the resin material 14' is XT [mass%], it preferably satisfies the relationship of 0.20 ≦ XT / XA ≦ 1.5, more preferably satisfies the relationship of 0.30 ≦ XT / XA ≦ 1.2, and even more preferably satisfies the relationship of 0.55 ≦ XT / XA ≦ 0.80.

[0096] Thereby, it is possible to further improve the balance of the shape stability of the resin material 14' in the vapor chamber manufacturing member 10', the resolution in the exposure process, the developability in the development process, the heat resistance and toughness of the resin cured product 14, the bonding strength and adhesion between the wick structure 10 and the container 20 (the first sheet material 21 and the second sheet material 22), etc.

[0097] The content rate of the resin material 14' in the vapor chamber manufacturing member 10' is preferably 10 mass% or more and 95 mass% or less, more preferably 15 mass% or more and 90 mass% or less, and even more preferably 20 mass% or more and 85 mass% or less.

[0098] In particular, when the fiber 131 is made of an inorganic material, the content rate of the resin material 14' in the vapor chamber manufacturing member 10' is preferably 10 mass% or more and 50 mass% or less, more preferably 15 mass% or more and 45 mass% or less, and even more preferably 20 mass% or more and 40 mass% or less.

[0099] Also, when the fiber 131 is made of an organic material, the content of the resin material 14' in the member 10' for manufacturing a vapor chamber is preferably 50% by mass or more and 95% by mass or less, more preferably 55% by mass or more and 90% by mass or less, and still more preferably 60% by mass or more and 85% by mass or less.

[0100] By satisfying the above content conditions, in the vapor chamber 100 (wick structure 10) manufactured using the member 10' for manufacturing a vapor chamber, the ratio between the flow path portion of the gaseous working fluid 30 and the flow path portion of the liquid working fluid 30 can be made more suitable.

[0101] When the content of the fiber 131 in the member 10' for manufacturing a vapor chamber is Xf [% by mass] and the content of the resin material 14' is Xr [% by mass], it is preferably satisfied that 0.01 ≦ Xf / Xr ≦ 8.0, more preferably satisfied that 0.1 ≦ Xf / Xr ≦ 5.0, and still more preferably satisfied that 0.3 ≦ Xf / Xr ≦ 3.0.

[0102] In particular, when the fiber 131 is made of an inorganic material, it is preferably satisfied that 0.8 ≦ Xf / Xr ≦ 8.0, more preferably satisfied that 1.0 ≦ Xf / Xr ≦ 7.0, and still more preferably satisfied that 2.0 ≦ Xf / Xr ≦ 6.0.

[0103] Also, when the fiber 131 is made of an organic material, it is preferably satisfied that 0.01 ≦ Xf / Xr ≦ 0.8, more preferably satisfied that 0.05 ≦ Xf / Xr ≦ 0.6, and still more preferably satisfied that 0.10 ≦ Xf / Xr ≦ 0.4.

[0104] By satisfying the above content relationship, in the vapor chamber 100 (wick structure 10) manufactured using the member 10' for manufacturing a vapor chamber, the ratio between the flow path portion of the gaseous working fluid 30 and the flow path portion of the liquid working fluid 30 can be made more suitable.

[0105] [1-3] Filler The member 10' for manufacturing the vapor chamber may further contain a filler in addition to the fiber 131 and the resin material 14'.

[0106] This can make the shape retention of the resin cured product 14 described later more excellent and improve the durability of the vapor chamber 100.

[0107] The shape of the filler can be any shape, and examples include spherical, spindle-shaped, needle-shaped, rod-shaped, fibrous, flaky, etc.

[0108] Examples of the filler include organic fillers such as fine particles of phenolic resin, acrylic resin, polyamide, polysulfone, polystyrene, fluororesin, etc., silicates such as talc, fired clay, unfired clay, mica, glass, etc., oxides such as titanium oxide, alumina, fused silica (fused spherical silica, fused crushed silica), crystalline silica, etc., carbonates such as calcium carbonate, magnesium carbonate, hydrotalcite, etc., hydroxides such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, etc., sulfates or sulfites such as barium sulfate, calcium sulfate, calcium sulfite, etc., borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, sodium borate, etc., nitrides such as aluminum nitride, boron nitride, silicon nitride, etc., carbon-based materials such as graphite, diamond, etc., and metal materials such as copper, aluminum, etc. One or more selected from these can be used in combination.

[0109] When the filler is spherical, its average particle size is preferably 0.05 μm or more and 0.35 μm or less, more preferably 0.10 μm or more and 0.30 μm or less, and even more preferably 0.10 μm or more and 0.25 μm or less.

[0110] As a result, it is possible to more effectively suppress the generation of residues after the development process in the method for manufacturing the vapor chamber 100 as described below, and it is possible to make the shape retention of the resin cured product 14 described below more excellent.

[0111] In this specification, the average particle size refers to the number-based average particle size unless otherwise specified. For example, it can be obtained by measurement using a laser diffraction particle size distribution measuring device (SALD-7000) in a state where a filler is dispersed in water. Also, at the time of measurement, for example, the above dispersion liquid may be subjected to ultrasonic treatment before measurement. In the examples described below, after adding and stirring a filler in water, ultrasonic treatment was carried out for 1 minute, and then measurement was carried out using a laser diffraction particle size distribution measuring device (SALD-7000) to obtain the average particle size.

[0112] The content of the filler in the vapor chamber manufacturing member 10' is preferably 1% by mass or more and 50% by mass or less, more preferably 3% by mass or more and 45% by mass or less, and even more preferably 5% by mass or more and 40% by mass or less.

[0113] As a result, it is possible to more effectively suppress the generation of residues after the development process in the method for manufacturing the vapor chamber 100 as described below, and it is possible to make the shape retention of the resin cured product 14 described below even more excellent.

[0114] [1-4] Hardening agent The vapor chamber manufacturing member 10' may further contain a hardening agent in addition to the fiber 131 and the resin material 14'.

[0115] The hardening agent (photosensitive agent) is not particularly limited as long as it can harden the resin material 14'. For example, benzophenone, acetophenone, benzoin, benzoin isobutyl ether, methyl benzoate benzoate, benzoic acid benzoin, methyl benzoin ether, benzyl phenyl sulfide, benzyl, dibenzyl, diacetyl, etc. can be mentioned, and one or more selected from these can be used in combination.

[0116] The content of the hardening agent (photosensitive agent) in the member 10' for manufacturing the vapor chamber is not particularly limited, but is preferably 0.1% by mass or more and 50% by mass or less, more preferably 0.5% by mass or more and 40% by mass or less, and even more preferably 1.0% by mass or more and 30% by mass or less.

[0117] Thereby, while making the storage stability of the member 10' for manufacturing the vapor chamber sufficiently excellent, at the time of manufacturing the vapor chamber 100 described later, the photopolymerization reaction can be started and advanced more suitably.

[0118] [1-5] Other components The member 10' for manufacturing the vapor chamber may contain components other than the above-described components (hereinafter, also referred to as "other components"). Examples of such components include ultraviolet absorbers, leveling agents, coupling agents, flame retardants, antioxidants, etc., and one or more selected from these can be used in combination.

[0119] However, the content of other components in the member 10' for manufacturing the vapor chamber is preferably 7.0% by mass or less, more preferably 5.0% by mass or less, and even more preferably 3.0% by mass or less.

[0120] [1-6] Overall configuration of the member for manufacturing the vapor chamber The shape of the member 10' for manufacturing the vapor chamber is not particularly limited, but in the illustrated configuration, it is sheet-shaped.

[0121] As a result, the sheet-shaped vapor chamber 100 (wick structure 10) can be preferably manufactured. Further, it is possible to more preferably prevent an unintended deformation of the vapor chamber manufacturing member 10' during the manufacture of the vapor chamber 100 and an unintended movement of the fibers 131 in the vapor chamber manufacturing member 10' (wick structure 10).

[0122] When the vapor chamber manufacturing member 10' is in a sheet shape, the sheet-shaped fiber base material 13 (fibers 131) may exist over substantially the entire thickness direction of the vapor chamber manufacturing member 10' as shown in FIG. 2, or may be unevenly distributed near the center in the thickness direction of the vapor chamber manufacturing member 10' as shown in FIG. 3, or may be unevenly distributed on one surface side of the vapor chamber manufacturing member 10' as shown in FIG. 4. Further, the sheet-shaped fiber base material 13 (fibers 131) may be unevenly distributed on both surface sides of the vapor chamber manufacturing member 10', and the content rate of the fibers 131 near the center in the thickness direction of the vapor chamber manufacturing member 10' may be lower than those of these portions.

[0123] The thickness of the vapor chamber manufacturing member 10' is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and even more preferably 30 μm or more and 500 μm or less.

[0124] As a result, while preventing the vapor chamber 100 manufactured using the vapor chamber manufacturing member 10' from being thickened more than necessary, it is possible to more preferably form a flow path portion for the gaseous working fluid 30 and a flow path portion for the liquid working fluid 30.

[0125] [2] Vapor Chamber Next, the vapor chamber of the present invention will be described. FIG. 5 is a longitudinal sectional view schematically showing an example of the vapor chamber of the present invention. FIGS. 6 to 8 are longitudinal sectional views schematically showing other examples of the vapor chamber of the present invention, respectively. FIG. 9 is a plan view schematically showing the wick structure included in the vapor chamber of the present invention. In FIG. 9, illustration of the fiber 131 is omitted. In the following description, the vapor chamber 100 will be mainly described for the case where it comes into contact with a member (heating member) to which the vapor chamber 100 is applied on the lower surface (the surface of the first sheet material 21) in FIGS. 5 to 8. However, it may be used in such a manner that it comes into contact with a member (heating member) to which the vapor chamber 100 is applied on the upper surface in FIGS. 5 to 8. Further, in FIGS. 5 to 8, the state where the first sheet material 21 faces downward is shown, but the orientation of the vapor chamber 100 during use of the vapor chamber 100 is not particularly limited. For example, it may be used in a state where the first sheet material 21 faces upward.

[0126] The vapor chamber 100 has a container 20 having a cavity portion inside, a wick structure 10 disposed in the cavity portion, and a working fluid 30 disposed in the cavity portion.

[0127] The wick structure 10 is made of a material containing a cured resin 14 and fibers 131, and the fibers 131 are arranged in a part of the flow path portion 15 of the working fluid 30 where the cured resin 14 is not arranged.

[0128] Thereby, it is possible to provide a vapor chamber having excellent flexibility and particularly excellent heat transport ability. In addition, since the flexibility of the vapor chamber 100 can be made excellent, regardless of the member, arrangement, etc. to which the vapor chamber 100 is applied, the close contact state between the vapor chamber 100 and the member can be made good, and the excellent heat transport ability can be more surely exhibited.

[0129] [2-1] Container The container 20 houses the wick structure 10 and the working fluid 30, and mainly functions to contact, in the evaporation section, a member to be cooled such as a heating member, and transfer heat to the working fluid 30 housed inside the container 20, and in the condensation section, to dissipate the heat received from the working fluid 30 that undergoes a phase transition from the gaseous state to the liquid state.

[0130] The container 20 is formed using a first sheet material 21 and a second sheet material 22.

[0131] Both the first sheet material 21 and the second sheet material 22 are made of a material with high thermal conductivity. Examples of such materials include metal materials such as copper, aluminum, magnesium, zinc, and alloys containing at least one of these.

[0132] The first sheet material 21 and the second sheet material 22 may be made of the same material or different materials.

[0133] The thicknesses of the first sheet material 21 and the second sheet material 22 are not particularly limited, but are preferably 12 μm or more and 70 μm or less, and more preferably 18 μm or more and 35 μm or less.

[0134] The first sheet material 21 and the second sheet material 22 are sealed at their outer peripheral portions by a sealing portion 23. As a result, the cavity portion housing the wick structure 10 and the working fluid 30 is sealed, maintaining a liquid-tight state and an air-tight state.

[0135] The sealing portion 23 may be made of, for example, the same material as the first sheet material 21 or the second sheet material 22, or a material different from the first sheet material 21 and the second sheet material 22.

[0136] The sealing portion 23 can be formed, for example, by plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, or adhesion.

[0137] [2-2] Wick structure The wick structure 10 is a member in which the flow of the working fluid 30 accompanying heat transfer, particularly the flow of the working fluid 30 vaporized by heat reception in the evaporation section of the container 20 and the flow of the working fluid 30 condensed by heat reception in the condensation section of the container 20 occur.

[0138] The wick structure 10 is composed of a material containing a resin cured product 14 and fibers 131, and the fibers 131 are arranged in a part of the flow path portion 15 of the working fluid 30 where the resin cured product 14 is not arranged. In particular, the flow path portion 15 has a flow path portion of the gaseous working fluid 30 (a portion of the flow path portion 15 where the fibers 131 do not exist or the density of the fibers 131 is low) and a flow path portion of the liquid working fluid 30 (a portion of the flow path portion 15 where the fibers 131 exist or the density of the fibers 131 is high).

[0139] Such a wick structure 10 may be formed by any method, but it is preferably formed using the member 10' for manufacturing the vapor chamber of the present invention described above.

[0140] Thereby, for example, by the method described later, the vapor chamber 100 can be manufactured with high productivity and high yield, and the reliability of the vapor chamber 100 can be made more excellent.

[0141] When the wick structure 10 is formed using the member 10' for manufacturing the vapor chamber of the present invention described above, the wick structure 10 may be manufactured using one member 10' for manufacturing the vapor chamber, or may be manufactured using a plurality of members 10' for manufacturing the vapor chamber. When using a plurality of members 10' for manufacturing the vapor chamber, these members 10' for manufacturing the vapor chamber may be arranged and used in the plane direction of the wick structure 10, or may be arranged (laminated) and used in the thickness direction of the wick structure 10.

[0142] In the following description, when the wick structure 10 is manufactured using the member 10' for manufacturing a vapor chamber described above, in particular, when it is manufactured using the member 10' for manufacturing a vapor chamber including the fiber base material 13, it will be mainly described.

[0143] The wick structure 10 is in contact with the inner surface of the container 20 on both of its surfaces. More specifically, the wick structure 10 is in contact with the first sheet material 21 on the first surface 11 which is one surface, and is in contact with the second sheet material 22 on the second surface 12 which is the other surface.

[0144] The fibers 131 and the fiber base material 13 constituting the wick structure 10 preferably satisfy the same conditions as those described in the item of the member 10' for manufacturing a vapor chamber.

[0145] The sheet-like fiber base material 13 (fibers 131) may exist over substantially the entire thickness direction of the wick structure 10 as shown in FIG. 5, or may be unevenly distributed near the center in the thickness direction of the wick structure 10 as shown in FIG. 6, or may be unevenly distributed on the second surface 12 side of the wick structure 10 as shown in FIG. 7, or may be unevenly distributed on the first surface 11 side of the wick structure 10 as shown in FIG. 8. Further, the sheet-like fiber base material 13 (fibers 131) may be unevenly distributed on both surfaces (the first surface 11 side and the second surface 12 side) of the wick structure 10, and the content of the fibers 131 near the center in the thickness direction of the wick structure 10 may be lower than those in these portions.

[0146] The cured resin 14 is preferably obtained by curing the resin material 14' described above. The wick structure 10 extends in its longitudinal direction, is composed of a material including the cured resin 14, and has a plurality of portions that function as the flow path wall 16 for the working fluid 30.

[0147] The interval S between adjacent flow path walls 16 (that is, the width of the flow path portion 15) is not particularly limited, but is preferably 100 μm or more and 1000 μm or less, more preferably 200 μm or more and 800 μm or less, and even more preferably 300 μm or more and 700 μm or less.

[0148] Thereby, while suppressing the enlargement of the wick structure 10 and the vapor chamber 100, the movement of the working fluid 30 (the gaseous working fluid 30 and the liquid working fluid 30) can be made smoother. Further, when reducing the pressure of the portion of the flow path portion 15 where the fiber 131 does not exist in order to lower the boiling point of the working fluid 30, since the flow path wall 16 exists between the first sheet material 21 and the second sheet material 22, deformation of the first sheet material 21 and the second sheet material 22 can be prevented. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent.

[0149] The ratio (L / S) of the width L [μm] of the flow path wall 16 to the width S [μm] of the flow path portion 15 is not particularly limited, but is preferably 0.05 or more and 0.50 or less, more preferably 0.08 or more and 0.40 or less, and even more preferably 0.10 or more and 0.35 or less.

[0150] Thereby, while suppressing the enlargement of the wick structure 10 and the vapor chamber 100, the heat transport capacity of the vapor chamber 100, the durability of the vapor chamber 100, etc. can be made more excellent. On the other hand, when the value of L / S is less than the lower limit value, deformation of the first sheet material 21 or the second sheet material 22 is likely to occur when the flow path portion 15 is depressurized. Further, when the value of L / S exceeds the upper limit value, the heat transport efficiency decreases.

[0151] In the illustrated configuration, the flow path portion 15 and the flow path wall 16 have a constant width, but these may have portions with different widths.

[0152] In the illustrated configuration, the flow path portion 15 and the flow path wall 16 are provided linearly in one direction, but they may have curved or bent portions.

[0153] [2-3] Working fluid In the cavity of the container 20, the working fluid 30 is disposed together with the wick structure 10.

[0154] The working fluid 30 mainly has a function of performing heat transport in the cavity inside the container 20.

[0155] Examples of the working fluid 30 include water, hydrochlorofluorocarbons such as HCFC-22, hydrofluorocarbons such as HFCR134a, HFCR407C, HFCR410A, and HFC32, hydrofluoroolefins such as HFO1234yf, hydrofluoroethers, alcohols such as ethanol and methanol, acetone, carbon dioxide gas, ammonia, propane, and the like.

[0156] [2-4] Overall configuration of the vapor chamber The thickness of the vapor chamber 100 is preferably 150 μm or more and 3000 μm or less, more preferably 200 μm or more and 2000 μm or less, and even more preferably 250 μm or more and 1000 μm or less.

[0157] Thereby, while preventing the vapor chamber 100 from becoming thick, the movement of the working fluid 30 (gaseous working fluid 30 and liquid working fluid 30) can be made smoother. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent. Also, the durability of the vapor chamber 100 can be made more excellent.

[0158] [2-5] Usage form of the vapor chamber Next, an example of the usage form of the vapor chamber of the present invention will be described.

[0159] The vapor chamber of the present invention may be used, for example, for the purpose of transferring the heat of a heating member to a predetermined location, or for the purpose of equalizing the heat of a locally high-temperature portion of the heating member.

[0160] Hereinafter, the case where the vapor chamber of the present invention is used for the purpose of transferring the heat of a predetermined member (heating member) will be mainly described.

[0161] When used for the purpose of cooling a heating member (for example, a CPU or the like), the vapor chamber is used in a state where a part of its surface (evaporation portion) is in contact with the heating member itself or a member (for example, a heat conduction sheet or the like) made of a high heat conduction material in contact therewith (hereinafter, these are collectively referred to as "heating member etc.").

[0162] At this time, the vapor chamber may be in a state of being in contact with a heat dissipation member (for example, a heat sink or the like) or a member (for example, a heat conduction sheet or the like) made of a high heat conduction material in contact therewith (hereinafter, these are collectively referred to as "heat dissipation member etc.") at a portion different from the evaporation portion, that is, at a portion that dissipates the heat received from the heating member.

[0163] As described above, the vapor chamber of the present invention is excellent in flexibility.

[0164] Therefore, when there is a step between the part where the heat generating member is installed and the part where the heat radiating member should be installed, or when using a conventional heat pipe or vapor chamber that is inferior in flexibility, it is necessary to install a spacer (for example, a metal spacer, etc.) to eliminate or mitigate the step, which has caused problems such as an increase in cost due to an increase in parts and an increase in the weight of the entire device. In contrast, the vapor chamber of the present invention is excellent in flexibility (flexibility), and for example, bending processing and the like can be suitably performed. Therefore, even when the above-mentioned spacer is omitted, a good adhesion state with other members (such as the heat generating member and the heat radiating member) in the condensation part and the evaporation part can be ensured. Therefore, while suitably solving the above-mentioned problems, good heat dissipation performance can be exhibited.

[0165] Further, when the vapor chamber of the present invention is used, by curving and bending the vapor chamber, interference with other members can be suitably avoided, so that the degree of freedom in the layout of each component of the device provided with the heat generating member increases.

[0166] Also, in the present invention, by using the method described above, the shape of the flow path portion and the flow path wall provided in the vapor chamber (wick structure) can be suitably adjusted. Therefore, according to the present invention, for example, not only a simple shape such as a rectangle, but also a vapor chamber having a complex shape such as a shape having a notch portion and having a flow path portion and a flow path wall corresponding to the shape can be suitably manufactured. Therefore, for example, while making the contact area with the heat generating member and the heat radiating member large, interference with other members can be suitably eliminated. Thereby, better heat dissipation performance can be exhibited.

[0167] Further, for example, in a housing (e.g., a joint portion of a multi-joint robot) that houses a motor as a heat generating member, in order to release the heat generated from the motor to the outside through the housing, an aluminum molded body and a heat conduction sheet were sometimes used in combination inside the housing. However, in this case, there was a problem that the housing became large. On the other hand, when using the vapor chamber of the present invention, since it is not necessary to use an aluminum molded body, it is advantageous from the viewpoints of downsizing the housing and reducing the number of parts.

[0168] [3] Manufacturing method of vapor chamber Next, the manufacturing method of the vapor chamber of the present invention will be described. FIGS. 10 and 11 are longitudinal sectional views schematically showing an example of the manufacturing method of the vapor chamber of the present invention.

[0169] The manufacturing method of the vapor chamber 100 of the present embodiment includes a vapor chamber manufacturing member preparation step (1a) of preparing a vapor chamber manufacturing member 10' for manufacturing the vapor chamber of the present invention, and a first bonding step (1b) of bonding the vapor chamber manufacturing member 10' to a first sheet material 21 on a first surface 11 which is one surface thereof, and an exposure step (1c) of irradiating light (exposure light) E in a predetermined pattern to the vapor chamber manufacturing member 10' bonded to the first sheet material 21, and a development step (1d) of removing the uncured resin material 14' at a portion where the light E was not irradiated in the exposure step, and a second bonding step (1e) of bonding the vapor chamber manufacturing member 10' that has undergone the development step to a second sheet material 22 on a second surface 12 which is the surface opposite to the first surface 11, and an operating fluid supply and sealing step (1f) of injecting an operating fluid 30 into the space between the first sheet material 21 and the second sheet material 22 and sealing the space.

[0170] Accordingly, it is possible to provide a method for manufacturing a vapor chamber that is excellent in flexibility and can suitably manufacture a vapor chamber having particularly excellent heat transport ability. Further, since the flexibility of the manufactured vapor chamber 100 can be made excellent, regardless of the members and arrangements to which the vapor chamber 100 is applied, the adhesion state between the vapor chamber 100 and the members can be made good, and the excellent heat transport ability can be more surely exhibited.

[0171] [3-1] Member Preparation Step for Vapor Chamber Manufacturing In the member preparation step for vapor chamber manufacturing, the member 10' for vapor chamber manufacturing of the present invention described above is prepared (1a).

[0172] The member 10' for vapor chamber manufacturing can be obtained, for example, by impregnating a fiber base material 13 with a composition containing an uncured resin material 14'.

[0173] The composition may contain, for example, in addition to the resin material 14', the other components described above. Further, the composition may contain a solvent. When the composition contains a solvent, the member 10' for vapor chamber manufacturing can be obtained by volatilizing the solvent after impregnating the fiber base material 13 with the composition.

[0174] The composition may be applied, for example, from the surface side corresponding to the first surface 11 of the fiber base material 13, from the surface side corresponding to the second surface 12 of the fiber base material 13, or from both sides of the surface corresponding to the first surface 11 and the surface corresponding to the second surface 12 of the fiber base material 13.

[0175] Examples of the method for applying the composition to the fiber base material 13 include a coating method, a spraying method, and an immersion method.

[0176] [3-2] First Bonding Step In the first bonding step, a member 10' for manufacturing a vapor chamber is bonded to a first sheet material 21 on a first surface 11, which is one of its surfaces (1b).

[0177] The uncured resin material 14' constituting the member 10' for manufacturing a vapor chamber can be suitably bonded by bringing it into contact with the first sheet material 21 and further applying pressure. In addition to pressure, it can be more suitably bonded by heating.

[0178] [3-3] Exposure Step In the exposure step, light E is irradiated onto the member 10' for manufacturing a vapor chamber bonded to the first sheet material 21 in a predetermined pattern (1c).

[0179] As a result, the portion of the resin material 14' irradiated with the light E is selectively cured to become a cured resin 14. That is, a cured portion corresponding to the portion to be the flow path wall 16 formed of the cured resin 14 can be formed in a pattern corresponding to the irradiation pattern of the light E.

[0180] Note that the curing reaction in this step may proceed to such an extent that the uncured resin material 14' can be removed while the cured resin 14 remains in the subsequent development step, and it does not have to proceed completely.

[0181] The type of the light E irradiated in this step is determined according to the type of the resin material 14', but ultraviolet light is preferably used.

[0182] Thereby, the resin material 14' can be suitably cured by an exposure process for a relatively short time, and the productivity of the vapor chamber 100 can be made more excellent.

[0183] The exposure step may be performed, for example, by scanning light such as laser light in a predetermined pattern, but it can be suitably performed by using a photomask.

[0184] [3-4] Development Step In the developing process, the uncured resin material 14' in the portion not irradiated with the light E in the exposure process is removed (1d).

[0185] Thereby, the resin material 14' can be removed while leaving the cured resin 14 and the fiber 131. As a result, a portion that should become the flow path wall 16 of a predetermined pattern, that is, a pattern corresponding to the irradiation pattern of the light E, can appear.

[0186] The developing process can be preferably performed by using a developer that selectively dissolves the resin material 14' and does not dissolve the cured resin 14.

[0187] The composition of the developer varies depending on the resin material 14', the cured resin 14, etc. For example, when the resin material 14' contains an alkali-soluble resin as described above, an alkaline aqueous solution such as sodium hydroxide or tetramethylammonium hydroxide can be preferably used.

[0188] [3-5]Second bonding process In the second bonding process, the member 10' for manufacturing the vapor chamber that has undergone the developing process is bonded to the second sheet material 22 on the second surface 12, which is the surface opposite to the first surface 11 (1e).

[0189] The joining of the second sheet material 22 and the member 10' for manufacturing the vapor chamber may be performed, for example, by applying an adhesive to the second sheet material 22 or the member 10' for manufacturing the vapor chamber. However, when using a resin material 14' that satisfies the above-described conditions (in particular, including a thermosetting resin different from the alkali-soluble resin together with the alkali-soluble resin and the photopolymerizable resin), after bringing the member 10' for manufacturing the vapor chamber into contact with the second sheet material 22 and then heating, the thermosetting resin exhibits adhesiveness during the process of thermosetting, and the joining strength between the second sheet material 22 and the member 10' (wick structure 10) for manufacturing the vapor chamber can be made particularly excellent. Similarly, the joining strength between the first sheet material 21 and the member 10' (wick structure 10) for manufacturing the vapor chamber can also be made particularly excellent.

[0190] In this case, the heating temperature in this step is preferably 80°C or higher and 250°C or lower, more preferably 90°C or higher and 220°C or lower, and even more preferably 100°C or higher and 200°C or lower.

[0191] Thereby, while more effectively preventing unintentional deterioration of the constituent materials of the vapor chamber 100, the above-described effects are more significantly exhibited. Also, the productivity of the vapor chamber 100 can be made more excellent.

[0192] In this step, heating under different conditions may be combined. Specifically, for example, a heat treatment (thermal pressure bonding) under a pressurized state and a heat treatment (post-cure) in a state where the pressurized state is released thereafter may be combined.

[0193] The heating time in this step is preferably 0.1 minute or longer and 600 minutes or shorter. Thereby, while more effectively preventing unintentional deterioration of the constituent materials of the vapor chamber 100, the above-described effects are more significantly exhibited. Also, the productivity of the vapor chamber 100 can be made more excellent.

[0194] As described above, when performing a combination of heat treatment (thermal compression bonding) in a pressurized state and heat treatment (post-curing) in a state where the pressurized state is then released, the treatment time of the heat treatment (thermal compression bonding) in the pressurized state is preferably 0.1 minute or more and 10 minutes or less, and the treatment time of the heat treatment (post-curing) in the state where the pressurized state is released is preferably 20 minutes or more and 480 minutes or less.

[0195] [3-6] Working fluid supply and sealing step In the working fluid supply and sealing step, the working fluid 30 is injected into the space between the first sheet material 21 and the second sheet material 22, and the space is sealed (1f).

[0196] The injection of the working fluid 30 can be suitably performed, for example, in a state where the space between the first sheet material 21 and the second sheet material 22 is decompressed by evacuation.

[0197] By decompressing the space between the first sheet material 21 and the second sheet material 22, the boiling point of the working fluid 30 can be lowered, and the cycle of evaporation and condensation of the working fluid 30 can be performed more efficiently. Therefore, the heat transfer effect and the heat equalization effect can be further enhanced.

[0198] After the injection of the working fluid 30, the injection portion of the working fluid 30 is sealed, and the space in which the wick structure 10 and the working fluid 30 are accommodated is sealed in a liquid-tight and air-tight manner.

[0199] The sealing of the space in which the wick structure 10 and the working fluid 30 are accommodated is performed by forming a sealing portion 23.

[0200] Examples of the method for forming the sealing portion 23 include plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, adhesion, and the like.

[0201] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited to those described above, and modifications, improvements, etc. within the scope that can achieve the object of the present invention are included in the present invention.

[0202] For example, in the method for manufacturing the vapor chamber of the present invention, in addition to the steps described above, it may further have other steps.

[0203] Further, the vapor chamber of the present invention is not limited to being manufactured by the method described above, and it may be manufactured by any method.

[0204] In the above-described embodiments, the member for manufacturing the vapor chamber of the present invention and the wick structure constituting the vapor chamber of the present invention have been mainly described in the case where they contain fibers in the form of a sheet-like fiber base material (fiber sheet). However, the member for manufacturing the vapor chamber of the present invention and the wick structure constituting the vapor chamber of the present invention may contain fibers in any form, and may contain them in a form other than the sheet-like fiber base material.

[0205] In the above-described embodiments, the case where the vapor chamber is used for the purpose of moving the heat of the heating member to a predetermined location has been mainly described. However, the vapor chamber may be used, for example, for the purpose of equalizing the heat of a locally high-temperature portion of the heating member.

Example

[0206] Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited thereto.

[0207] [4] Member for manufacturing vapor chamber, manufacturing of vapor chamber (Example 1) 1. Synthesis of alkali-soluble resin (resin having an alkali-soluble group and a double bond (curable resin curable by both light and heat: methacryl-modified bisphenol A novolak resin: MPN))

[0208] 60% solids methyl ethyl ketone (MEK) solution of bisphenol A novolak resin (Phenolite LF-4871, manufactured by Dainippon Ink and Chemicals, Inc.): 500 g was placed into a 2 L flask, and 1.5 g of tributylamine as a catalyst and 0.15 g of hydroquinone as a polymerization inhibitor were added thereto, and the mixture was heated to 100 °C.

[0209] Thereafter, 180.9 g of glycidyl methacrylate was added dropwise to the above mixture over 30 minutes, and the reaction was carried out by stirring at 100 °C for 5 hours to obtain a methacryl-modified bisphenol A novolak resin having a nonvolatile content of 74%. The modification rate of the thus obtained methacryl-modified bisphenol A novolak resin (alkali-soluble resin) was 50%.

[0210] 2. Preparation of Resin Varnish 31.74 parts by mass of the methacryl-modified bisphenol A novolak resin (MPN) synthesized as described above as an alkali-soluble resin (curable resin curable by both light and heat), 9.83 parts by mass of a liquid acrylic resin monomer at room temperature (NK Ester 3G, manufactured by Shin-Nakamura Chemical Co., Ltd.) as a photopolymerizable resin, 19.84 parts by mass of a bisphenol A novolak type epoxy resin (Epiclon N-865, manufactured by Dainippon Ink and Chemicals, Inc.) as a thermosetting resin, 3.63 parts by mass of a silicone epoxy resin (BY16-115, manufactured by Toray Dow Corning Silicone Co., Ltd.), and 33.71 parts by mass of silica (KE-P30, manufactured by Nippon Shokubai Co., Ltd., average particle diameter: 0.28 μm, maximum particle diameter: 0.9 μm) as a particulate filler were weighed, and further methyl ethyl ketone (MEK) was added to prepare a resin component concentration of 71% by mass. Then, the mixture was stirred until the bisphenol A novolak type epoxy resin (N-865) was dissolved.

[0211] Next, a bead mill (bead diameter 400 μm, treatment speed 6 g / s, 5 passes) was used to disperse the silica.

[0212] Thereafter, 1.25 parts by mass of a curing agent (photosensitizer) (Irgacure 651, manufactured by Ciba Specialty Chemicals) was further added and stirred for 1 hour with a stirring blade (450 rpm) to obtain a resin varnish.

[0213] 3. Manufacture of the Adhesive Film A part of the resin varnish prepared in the above “2. Preparation of the Resin Varnish” was applied to a support base polyester film (T100G, thickness 25 μm, manufactured by Mitsubishi Polyester Film Co., Ltd.) with a comma coater, and dried at 80°C for 10 minutes to form a film, thereby obtaining an adhesive film with a thickness of 65 μm.

[0214] 4. Manufacture of the Member for Manufacturing the Vapor Chamber A part of the resin varnish prepared in the above “2. Preparation of the Resin Varnish” was impregnated into a glass woven fabric (♯1078, thickness 46 μm, manufactured by Unitika Ltd.) and dried in a heating furnace at 100°C for 3 minutes to obtain a prepreg with a thickness of 50 μm.

[0215] Next, two sheets of the prepreg thus obtained were overlapped, and photosensitive adhesive films with a thickness of 65 μm manufactured in the above “3. Manufacture of the Adhesive Film” were overlapped on both sides thereof, and joined using a laminating roll at 80°C to obtain a member for manufacturing a vapor chamber with a thickness of 230 μm (first photosensitive adhesive film layer: 65 μm, prepreg: 100 μm, second photosensitive adhesive film layer: 65 μm) (see FIG. 1). Further, thereafter, this member for manufacturing a vapor chamber was cut into a size of 15 mm × 100 mm in outer dimensions.

[0216] The member for manufacturing a vapor chamber thus obtained is in a sheet form with a thickness of 230 μm, contains an uncured resin material, and as shown in FIG. 3, a fiber base material exists near the center in the thickness direction, and no fibers exist on both sides of the member for manufacturing a vapor chamber.

[0217] 5. Manufacture of the Vapor Chamber First, prepare the member for manufacturing a vapor chamber obtained as described above (outer dimensions: 15 mm × 100 mm) (member preparation step for manufacturing a vapor chamber). On the first surface, which is one of its surfaces, utilize the adhesiveness of the uncured resin material constituting the member for manufacturing a vapor chamber to bond it to a copper sheet material (outer dimensions: 15 mm × 100 mm, thickness: 35 μm) as the first sheet material (first bonding step).

[0218] Next, perform light irradiation (exposure) on the member for manufacturing a vapor chamber bonded to the first sheet material using a photomask provided with openings (light-transmitting portions) in a pattern corresponding to the flow path walls to be formed (exposure step). The exposure was carried out using a mercury lamp with a main wavelength of 365 nm, and the exposure amount was 500 mJ / cm 2 under the condition of

[0219] Next, use a 3 mass% aqueous solution of tetramethylammonium hydroxide (TMAH), which is an alkaline aqueous solution, as a developer, and perform treatment under the conditions of a developer pressure of 0.2 MPa and a development time of 300 seconds to remove the uncured resin material at the sites not irradiated with light in the exposure step (development step).

[0220] Next, bring the member for manufacturing a vapor chamber that has undergone the development step into contact with a copper sheet material (thickness: 35 μm) as the second sheet material on the second surface, which is the surface opposite to the first surface, and press it at a pressure of 0.3 MPa. In this state, perform thermocompression bonding at 185°C for 60 minutes, and then perform a heat treatment (post-cure) at 180°C for 1 hour in an oven to firmly bond the member for manufacturing a vapor chamber and the second sheet material. Thereafter, when the curing reaction is completed, a wick structure formed using the member for manufacturing a vapor chamber is firmly bonded to the first sheet material on the first surface, and a bonded body firmly joined to the second sheet material on the second surface is obtained (second bonding step).

[0221] The peripheral edges of the first sheet material and the second sheet material (excluding the working fluid injection port) were sealed by soldering, and then, 80 mg of pure water as the working fluid was injected into the space between the first sheet material and the second sheet material. Further, the working fluid injection port was sealed with solder (working fluid supply and sealing step). As a result, a vapor chamber as shown in FIG. 6 was obtained.

[0222] The wick structure included in the vapor chamber thus obtained had a thickness of 230 μm, had a structure as shown in FIG. 9, extended in the longitudinal direction, was composed of a material containing a cured resin, and had a plurality of parts that functioned as flow path walls for the working fluid. The interval between adjacent flow path walls (i.e., the width of the flow path part) was 500 μm, and the width of the flow path wall was 100 μm.

[0223] (Example 2) 50 parts by mass of methacryl-modified bisphenol A novolak resin (MPN) synthesized in the same manner as described in Example 1 above, 15.5 parts by mass of a liquid acrylic resin monomer at room temperature as a photopolymerizable resin (Light Ester TMP, manufactured by Kyoeisha Chemical Co., Ltd.), 18 parts by mass of bisphenol A novolak type epoxy resin as a thermosetting resin (1032H60, manufactured by Mitsubishi Chemical Corporation), 5 parts by mass of bisphenol F type epoxy resin (EPICLON 830, manufactured by DIC Corporation), 9 parts by mass of phenol novolak resin (PR-53647, manufactured by Sumitomo Bakelite Co., Ltd.), and 2.5 parts by mass of a curing agent (photosensitizer) (Irgacure 651, manufactured by Ciba Specialty Chemicals Inc.) were weighed, and further methyl ethyl ketone (MEK) was added to prepare a resin varnish so that the resin component concentration became 50% by mass.

[0224] An adhesive film, a member for manufacturing a vapor chamber, and a vapor chamber were manufactured in the same manner as in Example 1 above, except that the resin varnish thus obtained was used.

[0225] (Example 3) A vapor chamber was manufactured in the same manner as in Example 2 above, except that the injection amount of pure water as the working fluid was changed from 80 mg to 160 mg.

[0226] (Example 4) A vapor chamber was manufactured in the same manner as in Example 2, except that the injection amount of pure water as the working fluid was changed from 80 mg to 40 mg.

[0227] (Example 5) First, an adhesive film was manufactured in the same manner as in Example 2, except that the thickness was made 40 μm.

[0228] Then, the number of prepregs used by laminating for manufacturing the vapor chamber member was changed from 2 to 3, and a vapor chamber member and a vapor chamber were manufactured in the same manner as in Example 2, except that the adhesive film (the first photosensitive adhesive film layer and the second photosensitive adhesive film layer) used was the above adhesive film with a thickness of 40 μm.

[0229] (Example 6) First, an adhesive film was manufactured in the same manner as in Example 2, except that the thickness was made 100 μm.

[0230] Also, a part of the resin varnish prepared in Example 2 was impregnated into a glass woven fabric (manufactured by Unitika Ltd., #1037, thickness 27 μm) and dried in a heating furnace at 100 °C for 3 minutes to obtain a prepreg with a thickness of 30 μm.

[0231] Then, the above adhesive film with a thickness of 100 μm was overlaid on both sides of one sheet of this prepreg with a thickness of 30 μm and joined using a laminating roll at 80 °C to obtain a vapor chamber member with a thickness of 230 μm (the first photosensitive adhesive film layer: 100 μm, prepreg: 30 μm, the second photosensitive adhesive film layer: 100 μm). Further, thereafter, this vapor chamber member was cut into a size of outer dimensions 15 mm × 100 mm.

[0232] Thereafter, a vapor chamber was manufactured in the same manner as in Example 1, except that this vapor chamber member was used.

[0233] (Example 7) An adhesive film was produced in the same manner as in Example 2, except that the thickness was made 90 μm.

[0234] Also, a part of the resin varnish prepared in Example 2 was impregnated into a glass woven fabric (manufactured by Unitika Ltd., #1078, thickness 46 μm) and dried in a heating furnace at 100 °C for 3 minutes to obtain a prepreg with a thickness of 50 μm.

[0235] Then, the above adhesive film with a thickness of 90 μm was laminated on both sides of one sheet of the prepreg with a thickness of 50 μm and joined using a laminating roll at 80 °C to obtain a member for manufacturing a vapor chamber with a thickness of 230 μm (first photosensitive adhesive film layer: 90 μm, prepreg: 50 μm, second photosensitive adhesive film layer: 90 μm). Furthermore, thereafter, this member for manufacturing a vapor chamber was cut into a size of 15 mm × 100 mm in outer dimensions.

[0236] Thereafter, a vapor chamber was manufactured in the same manner as in Example 1, except that this member for manufacturing a vapor chamber was used.

[0237] (Example 8) A vapor chamber was manufactured in the same manner as in Example 2, except that a film manufactured to have a thickness of 40 μm was used as the first photosensitive adhesive film layer and a film manufactured to have a thickness of 90 μm was used as the second photosensitive adhesive film layer.

[0238] (Example 9) A vapor chamber was manufactured in the same manner as in Example 2, except that a film manufactured to have a thickness of 40 μm was used as the first photosensitive adhesive film layer, a film manufactured to have a thickness of 40 μm was used as the second photosensitive adhesive film layer, and the injection amount of pure water as the working fluid was changed from 80 mg to 40 mg.

[0239] (Example 10) A vapor chamber was manufactured in the same manner as in Example 9, except that one sheet of the prepreg manufactured in Example 7 was used as the prepreg.

[0240] (Example 11) Using a product manufactured to have a thickness of 88 μm as the first photosensitive adhesive film layer and a product manufactured to have a thickness of 88 μm as the second photosensitive adhesive film layer, and using Furukawa Electric Co., Ltd.'s GTS-MP (12 μm thick) as the first sheet material and the second sheet material, a vapor chamber was manufactured in the same manner as in Example 2 above.

[0241] (Example 12) 60 parts by mass of methacrylic acid-modified bisphenol A novolak resin (MPN) synthesized in the same manner as described in Example 1 above, 10.5 parts by mass of a liquid acrylic resin monomer (manufactured by Kyoeisha Chemical Co., Ltd., Light Ester TMP) at room temperature as a photopolymerizable resin, 18 parts by mass of a bisphenol A novolak type epoxy resin (manufactured by Mitsubishi Chemical Corporation, 1032H60) as a thermosetting resin, 9 parts by mass of a phenol novolak resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-53647), and 2.5 parts by mass of a curing agent (photosensitizer) (manufactured by Ciba Specialty Chemicals Inc., Irgacure 651) were weighed, and further methyl ethyl ketone (MEK) was added to prepare a resin varnish so that the resin component concentration became 50% by mass.

[0242] An adhesive film, members for manufacturing a vapor chamber, and a vapor chamber were manufactured in the same manner as in Example 1 above, except that the resin varnish thus obtained was used.

[0243] (Example 13) As the alkali-soluble resin (a curable resin curable by both light and heat), Cyclomer P (manufactured by Daicel Ornex Co., Ltd.): 69 parts by mass; as the photopolymerizable resin, a liquid acrylic resin monomer at room temperature (manufactured by Shin-Nakamura Chemical Co., Ltd., NK Ester 3G): 16 parts by mass; as the thermosetting resin, bisphenol A novolak type epoxy resin (manufactured by Dainippon Ink and Chemicals, Inc., Epiklon N-865): 5 parts by mass; bisphenol F type epoxy resin (manufactured by DIC Corporation, EPICLON 830): 3 parts by mass; phenol novolak resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-53647): 5 parts by mass; a curing agent (photosensitizer) (manufactured by Ciba Specialty Chemicals Inc., Irgacure 651): 2.0 parts by mass were weighed, and further methyl ethyl ketone (MEK) was added to prepare a resin varnish so that the resin component concentration became 50% by mass.

[0244] Except for using the resin varnish thus obtained, an adhesive film, a member for manufacturing a vapor chamber, and a vapor chamber were manufactured in the same manner as in Example 1 above.

[0245] (Comparative Example 1) Using a product manufactured to have a thickness of 115 μm as the first photosensitive adhesive film layer and a product manufactured to have a thickness of 115 μm as the second photosensitive adhesive film layer, a vapor chamber was manufactured in the same manner as in Example 2 above, except that the first photosensitive adhesive film layer and the second photosensitive adhesive film layer were directly joined without using a prepreg.

[0246] The configurations of the vapor chambers of the above-described examples and comparative examples are summarized in Tables 1 and 2. In the tables, the constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 1 is designated as "C-1", the constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 2 is designated as "C-2", the constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 12 is designated as "C-12", and the constituent material of the adhesive film of the member for manufacturing the vapor chamber in Example 13 is designated as "C-13". Also, in Tables 1 and 2, the value of Xf / Xr when the fiber content in the member for manufacturing the vapor chamber is Xf [mass%] and the resin material content is Xr [mass%] is also shown.

[0247] [Table 1]

[0248] [Table 2]

[0249] [5] Evaluation A ceramic heater (manufactured by Sakaguchi Denki Co., Ltd., product number: Ultra Mic, heater part 12 mm square, 2.5 mm thick) whose output of the heater part is variable and the temperature inside the heater can be measured was prepared.

[0250] The internal temperatures of the heater when the ceramic heater was output at 4 W and 7 W were 225°C and 310°C, respectively.

[0251] Next, the ceramic heater was output at 4 W and 7 W respectively, the ends of the vapor chambers manufactured in the above-described examples and comparative examples were placed on the heater part, and the temperature when the temperature inside the heater became stable was measured. These results are summarized in Tables 3 and 4.

[0252] [Table 3]

[0253]

Table 4

[0254] As is apparent from Table 3 and Table 4, in Comparative Example 1 in which a fiber base material was not used for the member for manufacturing the vapor chamber, the temperature of the ceramic heater decreased by 30 °C at both 4W and 7W outputs. However, in the vapor chambers of the respective Examples, the temperature decrease was much larger than that, indicating good heat transport ability.

[0255] In addition, it was confirmed that all of the vapor chambers according to the respective Examples were excellent in flexibility.

[0256] Also, the thickness of the fiber base material constituting the member for manufacturing the vapor chamber was variously changed within the range of 10 μm or more and 1000 μm or less, the thickness of the member for manufacturing the vapor chamber was variously changed within the range of 10 μm or more and 2000 μm or less, and when the fiber content in the member for manufacturing the vapor chamber was Xf [% by mass] and the resin material content was Xr [% by mass], the value of Xf / Xr was variously changed within the range of 0.01 or more and 8.0 or less. Except for this, vapor chambers were manufactured in the same manner as above and evaluated in the same manner as above. As a result, excellent effects similar to those above were obtained.

[0257] Also, by changing the method of applying the resin varnish to the fiber base material, the member for manufacturing the vapor chamber was manufactured as shown in FIGS. 2 and 4, and vapor chambers were manufactured in the same manner as above except that cross-sectional structures as shown in FIGS. 5, 7, and 8 were obtained using these members for manufacturing the vapor chamber, and evaluated in the same manner as above. As a result, excellent effects similar to those above were obtained.

[0258] Also, vapor chambers were manufactured in the same manner as above except that a woven fabric composed of fibers made of p-phenylene benzobisoxazole, which is an aromatic resin containing a heterocyclic ring in the molecule, was used instead of the glass woven fabric, and evaluated in the same manner as above. As a result, excellent effects similar to those above were obtained.

Explanation of Symbols

[0259] 100: Vapor Chamber 10: Wick Structure 10’: Member for Manufacturing Vapor Chamber 11: First Surface 12: Second Surface 13: Fiber Substrate (Fiber Sheet) 131: Fiber 14’: Resin Material 14: Cured Resin 15: Flow Path Portion 16: Flow Path Wall 20: Container 21: First Sheet Material 22: Second Sheet Material 23: Sealing Portion 30: Working Fluid S: Spacing L: Width E: Light (Exposure Light)

Claims

1. A member for manufacturing a vapor chamber, which is used for manufacturing the vapor chamber, characterized by comprising a fiber and an uncured resin material.

2. A member for manufacturing a vapor chamber, which is used for manufacturing the vapor chamber, characterized by comprising a fiber base material composed of fibers and an uncured resin material impregnated in the fiber base material.

3. The member for manufacturing a vapor chamber according to claim 2, wherein the thickness of the fiber base material is 10 μm or more and 1000 μm or less.

4. The member for manufacturing a vapor chamber according to claim 2 or 3, wherein the thickness of the member for manufacturing a vapor chamber is 10 μm or more and 2000 μm or less.

5. The member for manufacturing a vapor chamber according to any one of claims 1 to 4, wherein the fiber is made of an aromatic resin containing a heterocyclic ring in the molecule.

6. The member for manufacturing a vapor chamber according to any one of claims 1 to 5, when the content rate of the fiber in the member for manufacturing a vapor chamber is Xf [mass%] and the content rate of the resin material is Xr [mass%], satisfying the relationship of 0.01 ≦ Xf / Xr ≦ 8.

0.

7. The member for manufacturing a vapor chamber according to any one of claims 1 to 6, wherein the resin material contains an alkali-soluble resin and a photopolymerizable resin.

8. The member for manufacturing a vapor chamber according to claim 7, wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group.

9. The member for manufacturing a vapor chamber according to claim 7 or 8, wherein the resin material further contains a thermosetting resin different from the alkali-soluble resin.

10. A vapor chamber having a container having a cavity inside, a wick structure disposed in the cavity, and a working fluid disposed in the cavity, wherein the wick structure is composed of a material containing a cured resin and a fiber, and the fiber is disposed in a part of the flow path portion of the working fluid where the cured resin is not disposed.

11. The vapor chamber according to claim 10, wherein the wick structure is formed using the member for manufacturing a vapor chamber according to any one of claims 1 to 9.

12. A step of preparing a member for manufacturing a vapor chamber according to any one of claims 1 to 9, a first bonding step of bonding the member for manufacturing a vapor chamber to a first sheet material on a first surface which is one surface thereof, an exposure step of irradiating light in a predetermined pattern to the member for manufacturing a vapor chamber bonded to the first sheet material, a development step of removing the uncured resin material at a portion where the light was not irradiated in the exposure step, a second bonding step of bonding the member for manufacturing a vapor chamber that has undergone the development step to a second sheet material on a second surface which is a surface opposite to the first surface, and a working fluid supply and sealing step of injecting a working fluid into a space between the first sheet material and the second sheet material and sealing the space, the method for manufacturing a vapor chamber being characterized by including these steps.

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