Apparatus for roll-to-plate imprinting process comprising plate carrier with compensation material

Abstract

To mitigate or reduce a degree of uneven flatness of a substrate and / or a plate carrier and / or an imprint roller.SOLUTION: There is provided an imprinting apparatus for a roll-to-plate process, comprising a flexible master (105), a plate carrier (101) and a substrate (102). The imprinting apparatus is configured in that the flexible master can be pressed onto the substrate during an imprinting process, the plate carrier holds the substrate, and the plate carrier has a compensation material. The compensation material has a size larger than an area of the substrate, and each boundary of the substrate and the compensation material does not contact with each other.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an imprint apparatus for a roll-to-plate process.

Background Art

[0002] An imprint apparatus for a roll-to-plate process is known and has a roller, a flexible master having an imprint pattern, a plate carrier, and a substrate. The substrate is disposed on the plate carrier. The flexible stamp supports the reverse structure (imprint pattern or relief structure) required for the desired product and substrate, and / or the flexible master contains a curable resin (also called lacquer). During the imprint process, the flexible master is pressed onto the substrate while sandwiching the curable resin using a roller. During curing, the resin is solidified, for example, by heat and / or UV, and after removing the flexible master, the solidified resin having the required product structure is transferred so as to remain on the substrate.

[0003] The roll-to-plate imprint process is a discontinuous imprint process. This discontinuous process is different from the continuous roll-to-roll imprint process. In the roll-to-roll process, the reverse pressure during imprinting is applied using a second roller. In the roll-to-plate imprint process, a plate carrier is used and the reverse pressure is applied directly by the plate carrier or indirectly via a lower imprint roller disposed under the plate carrier.

[0004] The plate carrier according to the present invention is a kind of plate having a carrier surface, and the area of the carrier surface is larger than the thickness of the plate perpendicular to the carrier surface. The width and length of the plate carrier are larger than the area of the substrate.

[0005] Known prior art of roll-to-plate imprint devices is described, for example, in International Publication No. 2016 / 128493.

[0006] Japanese Patent Application Laid-Open No. 2016-207950 relates to an imprint device for forming a fine pattern. The object is to improve the transfer quality of the fine pattern. Differences in the thickness of the transfer target must be compensated for during the manufacturing process.

Summary of the Invention

Problems to be Solved by the Invention

[0007] The term "flexible master" is used in the present invention for any device that is flexible and suitable as a carrier for an imprint pattern. Preferably, the flexible master is a flexible stamp or a flexible nickel shim.

[0008] In a roll-to-plate imprint device, in order to obtain a curable imprint product, it is possible to imprint on a large-area surface having a resin on the top. This large-area surface can be conveyed or processed by using a large plate carrier. The use of the plate carrier is to guide and convey the substrate. Having a plate carrier can enable or facilitate the alignment of the flexible master and the substrate. The plate carrier can also apply back pressure to the imprint roller. In another configuration, the back pressure is applied by a lower imprint roller under the substrate and the plate carrier.

[0009] The larger the plate carrier size, the more complicated it is to produce a flat surface of the plate carrier. If the plate carrier is not completely flat, the counterpressure on the substrate (placed on the plate carrier) will locally differ during the imprint process in combination with the linear pressure of the upper roller. This will lead to local thickness variations in the final product. Furthermore, the back surface of the (large) substrate (in contact with the plate carrier) will also cause pressure fluctuations during imprint if it is not uniformly flat due to thickness variations, defects or contamination (e.g., dust particles). In addition, the non-uniformity of the imprint roller causes pressure fluctuations during the imprint process. All of these lead to locally thinner or thicker residual layer thicknesses. Therefore, the non-uniform back surface of the substrate causes visible defects on the front surface of the substrate (which means the lacquer side), affecting the quality of the imprinted final product.

[0010] The roll-to-roll imprint process does not use a plate carrier. Roll-to-roll imprint focuses on the production of textured films and not on the replication of textures on discontinuous substrates or products. The alignment of the flexible master to the product is not a problem in roll-to-roll imprint.

[0011] Therefore, an object of the present invention is to compensate for or at least minimize the drawbacks of the prior art roll-to-plate imprint apparatus.

Means for Solving the Problems

[0012] This object is achieved by an imprint apparatus for a roll-to-plate process, wherein the plate carrier has a compensation material, the substrate is arranged on the compensation material, the area of the compensation material is larger than the area of the substrate, and the boundaries of the substrate and the boundaries of the compensation material do not touch. By using the compensation material, the drawbacks of non-uniform flatness of the substrate and / or the plate carrier and / or the imprint roller can be reduced or mitigated by the compensation material.

[0013] The substrate is positioned on the compensation material at a predetermined distance from the boundary region of the compensation material. Preferably, the distance of the boundary of the substrate to the boundary of the compensation material is at least 3 mm, preferably at least 0.5 cm, more preferably at least 3 cm, most preferably at least 5 cm, and extremely preferably at least 10 cm.

[0014] The boundary region of the compensation material means the side surfaces and edges of the compensation material. When a circular compensation material is used, the circular material has only one side surface, and the substrate is positioned at a predetermined distance from this one side surface.

[0015] According to a first concept of the present invention, the dimensions of the compensation material are larger than the dimensions of the base material, and the base material is arranged on the compensation material such that the base material has a predetermined distance with respect to the side surface of the compensation material. That is, the boundary of the base material and the boundary of the compensation material do not (contact each other). The base material is preferably arranged in the central region of the compensation material, and none of the side surfaces of the base material coincide with the side surface of the compensation material, or the base material protrudes beyond the compensation material. In addition to the base material, side carrier supports can be arranged on the same compensation material, or side carrier supports can be formed from the compensation material. For a base material that is not particularly square, the pressure on the base material will change. Because the underlying layer (for example, the plate carrier) is not equally divided between the base material and the side carrier supports. For example, at the starting end of a circular wafer as the base material, there is almost no compensation material, and the roller cannot bend. At the center of a circular wafer as the base material, the roller can bend. At this point, the pressure on the base material is higher. When there is no compensation material under the base material and the side supports, the pressure is equal at the center and the sides of the circular base material. Therefore, it is particularly advantageous if the compensation material has dimensions larger than the base material and the base material is arranged at a predetermined distance up to the boundary region of the compensation material.

[0016] The object is achieved by an imprint device for a roll-to-plate process having a flexible master, a plate carrier, and a base material, wherein the flexible master is pressable onto the base material during the imprint process, the plate carrier holds the base material, and the plate carrier has a compensation material in the form of an additional layer having a fluid.

[0017] The term "compensation material" means all materials having reversible pressure compensation characteristics. In one form of the present invention, the compensation material is a fluid. The fluid preferably exists in the form of an additional layer that conformally contacts the plate carrier directly. The term "direct contact" means that the additional layer mechanically contacts the plate carrier. For example, the additional layer is disposed between the substrate and the plate carrier. In one preferred embodiment, the fluid is a gas or a liquid. As the gas, argon, nitrogen or air is preferred. Water, oil, acrylate fluid or curable acrylate fluid is a preferred liquid medium. In another preferred embodiment, the fluid is a viscoelastic fluid. The additional layer in the form of a fluid means that the fluid forms a layer formed from the fluid itself, or the fluid is filled in a package and the substrate is located on this package, or the substrate is located on or in the fluid itself. Further, the additional layer may be a kind of cushion filled with the fluid inside. The additional layer in the form of a fluid does not mean a kind of recessed portion used to hold the substrate in place of the plate carrier during the imprint process. A kind of fluid bed is formed by the fluid. This fluid bed can compensate for various different pressure fluctuations during the imprint process.

[0018] The fluid preferably exists in the form of an additional layer that conformally contacts the plate carrier indirectly. The fluid may exist in a container to hold the location of the fluid. For example, the fluid exists in a bag and forms a balloon or a water bed having reversible pressure compensation characteristics. The fluid may be a gas or a liquid. Japanese Patent Application Laid-Open No. 2016-207950 discloses the use of suction holes. The position of the substrate is held by suction through the suction holes. According to this patent document, the layer formed from the fluid is not formed by the suction holes.

[0019] A fluid system can be used to form a compensating material in the form of an additional layer having a fluid such as an air bed as the compensating material, whereby the substrate is attached non - contact while having a compensating back - pressure. In another example, the fluid system has been used to form a liquid bed as the compensating material, whereby the substrate is attached non - contact while having a compensating back - pressure. The air bed and / or liquid bed described above may be present within a conformable container while forming a balloon or a liquid bed to hold the position of the fluid.

[0020] In another form of the present invention, the compensating material is a flexible material. The term "flexible" means that the material can be reversibly compressed. This means that the flexible material is more elastic than glass or metal. Preferably, the flexible material has a Young's modulus of from 0.1 gigapascals (GPa) to 10 gigapascals (GPa) measured in accordance with ASTM E111, more preferably from 0.5 gigapascals to 5 gigapascals. By way of example, the flexible material may be rubber, elastomer, fibrous material, EPDM, polychloroprene, polyurethane or another plastic or a mixture of the above - mentioned materials. In this application, a material is called a rigid material if it has a Young's modulus greater than 50 GPa measured in accordance with ASTM E111.

[0021] In an even more preferred embodiment, the compensating material has a Shore A value of less than 80 measured in accordance with ASTM D2240.

[0022] The substrate is disposed on the compensating material. The term "disposed on" means that the substrate is disposed in direct or indirect contact (e.g., with another layer in between) on the compensating material. The conformal direct contact between the substrate and the compensating material allows following any non - uniformity and reducing undesirable effects. In a preferred embodiment, the substrate is embedded in the compensating material.

[0023] In one preferred embodiment, the plate carrier has at least one cavity. The term "cavity" means any particular reduction or elevation of at least one segment of the storage area for the substrate of the plate carrier (see FIGS. 5A, 5B and 5C). This includes, for example, a recess within the plate carrier having one or more side walls and a gap within the plate carrier in the form of a groove or a frame structure. The storage area is a part of the plate carrier and is the area where the substrate is disposed on or within the plate carrier.

[0024] Preferably, the substrate is disposed within the cavity of the plate carrier. The at least one cavity guides the flexible master over the substrate, and the edges of the flexible master move on the plate carrier. With this carrier design, the pressure of the flexible master on the substrate is evenly distributed over the substrate.

[0025] In one preferred embodiment, the cavity has a height substantially equal to the substrate thickness. For the sake of understanding, the substrate has an extending direction, and the thickness of the substrate is perpendicular to this extending direction. That is, the substrate has a surface on which the resin is imprinted, and the thickness of the substrate is perpendicular to the imprinted surface. With this preferred embodiment, it is ensured that the entire surface of the substrate contacts the flexible master, whereby a constant pressure is applied to the substrate.

[0026] In another preferred embodiment, the cavity has a height substantially equal to the sum of the substrate thickness and the flexible master thickness. In this case, the width of the flexible master is smaller than the width of the cavity, and the sides of the flexible master are positioned within the cavity. Also, in this embodiment, it is ensured that the flexible master and the substrate have a close overall contact with the resin sandwiched therebetween. Thereby, a constant pressure is applied over the contact area.

[0027] A curable resin, also called a lacquer, is present on a substrate or on a flexible master, and it will be apparent that the flexible master imprints a structure within this resin. Hereinafter, when it is mentioned that the flexible master contacts the substrate, this means that the pattern of the flexible master is transferred into the resin present on the substrate. For other device means of the imprint process and the imprint apparatus, reference is made to International Publication No. WO 2018 / 011208.

[0028] In one preferred embodiment, the plate carrier is formed of at least two parts, namely at least one first plate carrier part and at least one second plate carrier part.

[0029] Preferably, the first plate carrier part is formed of a first material and the second plate carrier part is formed of a second material, whereby the first material and the second material are different from each other. Preferably, at least one of the two parts of the plate carrier has or forms a compensating material. In one preferred embodiment, the first plate carrier part has a fluid system for forming an air bed or a liquid bed as the compensating material, and the second plate carrier part of the plate carrier is formed of a rigid material. In another embodiment, a flexible material has or forms a cavity. In one preferred embodiment, for example, the plate carrier is formed of a first part of a glass material and a second part of a flexible material, in which case the cavity is part of the second part. By using two parts and both parts being formed of different materials, the stability of the plate carrier will not be reduced even when the flexibility is increased.

[0030] Preferably, the first plate carrier portion and / or the second plate carrier portion is formed from a compensating material. "Formed from" means that the carrier portion is formed substantially 100% from the compensating material. For example, the plate carrier is formed from a non-flexible material (glass) as the first plate carrier portion and from a flexible material as the second plate carrier portion. If a cavity exists, the cavity may be part of the first or second portion or extend across both portions. If the compensating material is a fluid, the plate carrier may be a combination of a first plate carrier portion having a more rigid base plate and a second plate carrier portion having a fluid system for forming an air or liquid compensating material layer.

[0031] In another preferred embodiment, the compensating material is reversibly connectable to the plate carrier, preferably the flexible material is reversibly connectable to the plate carrier. Preferably, the compensating material (preferably the flexible material) is reversibly connectable to the first plate carrier portion and / or the second plate carrier portion. Suitably, the compensating material is a flexible material in the form of a flexible mat. This flexible mat is laid on the plate carrier, for example, within the cavity of the plate carrier. In this example, the flexible mat may extend over or be joined by the cavity.

[0032] Preferably, at least two parts of the plate carrier (a first plate carrier part and a second plate carrier part) are reversibly connectable to each other. "Reversibly connectable" means that the two parts can be separated from each other without either of the two parts being destroyed. The connection between the two parts can be achieved by a vacuum system, an adhesive surface in one or both parts, an adhesive and / or a plug connection (such as a rail system or a positioning pin), and / or a screw system and / or magnetism, or a combination of the above systems. The configuration of the two parts of the plate carrier makes it easy to adapt the plate carrier to various different substrate thicknesses (resin thicknesses) or the thickness of a flexible master. Furthermore, by using a flexible material as one part, this part has higher wear resistance than a part formed from a non-flexible material. Therefore, only a part of the plate carrier (instead of the entire plate carrier) needs to be replaced.

[0033] In one preferred embodiment, the first plate carrier part and / or the second plate carrier part has a frame structure for the substrate. In one preferred embodiment, the cavity is equal in shape to the substrate. "Equal in shape" in this context means that the cavity is not circular, for example, the substrate is square. Preferably, the cavity forms a kind of pocket into which the substrate can be inserted. In this embodiment, the substrate is protected in all side regions of the substrate via the plate carrier during the imprint process. It is also possible to dimension the cavity so that the substrate is located in a form-fitting manner within the plate carrier, thus avoiding slippage during the imprint process. However, it is also conceivable that the cavity is formed as a kind of wide groove extending across the entire plate carrier.

[0034] In one preferred embodiment, the plate carrier includes a first plate carrier part and a second plate carrier part in a thickness ratio of 3:1.

[0035] In one suitable embodiment, the fluid flow system is disposed on or within a plate carrier, which should not be confused with a compensating material in the form of an additional layer having fluid. The fluid flow system may be provided on the first plate carrier portion for holding or attaching the second plate carrier portion and / or on the second plate carrier portion for holding or attaching a substrate. The cavity or flat upper surface of the plate carrier may have vacuum holes, for example, that can generate a lower pressure. The vacuum holds the substrate at a defined position within the cavity, thereby improving the imprint process.

[0036] In a further preferred embodiment, the plate carrier has an alignment system. The alignment system preferably has lifting fingers and / or pushers that can always place the substrate at the same position within the cavity, for example, by using a robot.

[0037] In a preferred embodiment, a substrate positioning system is disposed on the plate carrier. For example, alignment pins can be added on the surface of the second plate carrier portion or within the cavity. The alignment pins can change the position of the substrate. As a result, the process accuracy can be advantageously increased because the imprint process always starts at the same point of the substrate.

Advantages of the Invention

[0038] All embodiments mentioned with respect to the imprint apparatus are also applicable to the roll-to-plate process.

[0039] The concept of the present invention will be further described below with reference to the drawings.

Brief Description of the Drawings

[0040]

Figure 1

Figure 2A

Figure 2B

Figure 2C

Figure 3A

Figure 3B

Figure 3C

Figure 4

Figure 5A

Figure 5B

Figure 5C

Figure 6

DETAILED DESCRIPTION OF THE INVENTION

[0041] Figure 1 shows one imprint configuration and an imprint process. A flexible master 105 having an imprint pattern 105A with an inverted structure (negative) as required for the product texture is pressed onto a curable resin 103 disposed on a substrate 102 by using an imprint roller 104A. The substrate 102 having a substrate thickness 102B is, for example, but not limited to, a plate formed of hard glass and may have various different shapes. This substrate 102 is disposed on a plate carrier 101 to enable conveyance, alignment, and optionally backpressure. The plate carrier 101 may be formed of, among other things, glass or metal. After curing the resin 103 by using UV light 106A from a UV light source 106, the flexible master 105 is peeled off by a peeling roller 104B, and a cured resin 107 having a required product texture 107A and a residual layer 107B thereunder is transferred onto the substrate 102.

[0042] Figure 2 shows various different examples having interferences during the imprint process that cause non-uniform residual layer thicknesses. In Figure 2A, the residual layer thickness 107B is locally different due to unevenness of the plate carrier 101. The imprint pattern 105A of the flexible master 105 is transferred into the resin 103. Due to the unevenness of the plate carrier 101, the imprint pattern 105A in the cured resin 107 is locally different with different residual layer thicknesses 107B-1 and 107B-2 on the substrate 102.

[0043] In Figure 2B, unevenness is caused by the non-uniform thickness of the substrate 102. As an example, non-uniform tempered glass is used as the substrate 102. The pressure difference due to the unevenness of this substrate causes different residual layer thicknesses 107B-1 and 107B-2.

[0044] In FIG. 2C, non-uniformity is caused by contamination (e.g., small dust). Defects and particles 108 below the substrate 102 locally raise the substrate 102. This non-uniformity-induced pressure difference causes various different residual layer thicknesses 107B-1 and 107B-2.

[0045] FIG. 3 shows the positive effect of a plate carrier 101 having a compensating material, e.g., a flexible material 114. The flexible material 114 absorbs local pressure increases. The increased pressure compresses the flexible material 114 of the plate carrier 101, whereby the residual layer thickness 107B remains constant. FIGS. 3A and 3B show the compression of a plate carrier 101 formed from a flexible material 114 (so-called flexible plate carrier 101) as one embodiment of a compensating material below the substrate 102. FIG. 3A shows the compensation of a non-uniform plate carrier thickness 101. This non-uniform plate carrier thickness 101 can be compensated when formed from a compensating material 114. In the case of FIG. 3B, the non-uniform substrate thickness 102 is compensated in the compensating material 114. FIG. 3C shows the local compression of the flexible plate carrier 101 due to the defect 108. Since the non-uniformity 108 is compensated by the flexible material 114 of the plate carrier portion 100, the flexible master pattern 105A of the flexible master 105 is correctly transferred to the cured resin 107. In all embodiments of FIG. 3, it is shown that the dimensions of the compensating material 114 are larger than the dimensions of the substrate 102 and the substrate 102 is located at a predetermined distance from the edge of the compensating material 114. This means that the substrate 102 is located in the central region of the compensating material 114, not in the boundary region of the compensating material 114, and does not coincide with the lower side of the side surface of the compensating material 114.

[0046] When the plate carrier 101 is not required to apply back pressure (i.e., the lower stage or the second roller under the plate carrier 101 is used to apply back pressure), the plate carrier 101 can be formed entirely from a compensating material, preferably a flexible material 114 (flexible plate carrier). In this case, adding a carrier function as a load application / load release or alignment mechanism becomes more complex.

[0047] Figure 4 shows a different design of the plate carrier 101 composed of two parts. As shown, the plate carrier 101 has a first plate carrier part 101A and a second plate carrier part 101B. This second plate carrier part 101B can be fixed on the first plate carrier part 101A. The fixing can be removable or non-separable (without destroying one of the parts). Figure 4 shows a carrier design with vacuum holes 110 for stably holding the substrate 102 during imprinting. Figure 4 shows lifting fingers 111 that can move up and down. In the upper position, the substrate 102 can be placed using, for example, a robot. The substrate 102 is placed on the plate carrier 101 when the lifting fingers 111 are lowered. Figure 4 shows a positioning and alignment system 109. This positioning and alignment system is formed from positioning pins that can move in and out to enable the placement of the substrate 102. The pins are placed outward and are aligned and positioned after being moved inward. This second plate carrier part 101B may be formed from a flexible material 114 (not shown). For example, this second plate carrier 101B may be a flexible mat. In a second example, the second plate carrier part 101B may be a fluid system that forms an air bed or a liquid bed for forming a compensation layer.

[0048] FIG. 5 shows various different configurations of the plate carrier 101 having the cavity 112. This cavity 112 can be used to form a uniform imprint pressure over the substrate 102 disposed within the cavity 112. In this case, the cavity height (see FIG. 1) is an important control parameter. In the case of the flexible master 105 wider than the width of the cavity 112, the height of the cavity 112 should be approximately the same as the height of the substrate 102B (not shown in FIG. 5). In the case of the flexible master 105 smaller than the width of the cavity 112 that is fitted and disposed in the cavity 112, the height of the cavity 112 should be the sum of the substrate height and the thickness of the flexible master 105. The cavity 112 may be square, rectangular, may have a groove shape, or may have exactly the same shape as the substrate 102.

[0049] The plate carriers 101 shown in FIGS. 5A and 5B are configured in a form consisting of two parts having a first plate carrier part 101A and a second plate carrier part 101B. The cavity 112 is disposed in the second part 101B. The material of the first plate carrier part 101A may be the same as or different from that of the second plate carrier part 101B. Both the first plate carrier part 101A and the second plate carrier part 101B may be formed from the same flexible material 114 such as rubber, for example. In most cases, the first plate carrier part 101A is formed from a different material compared to the second plate carrier part 101B. For example, the first plate carrier part 101A can be formed from a rigid material such as glass or metal or a material having a higher rigidity, such as rubber having a Shore hardness exceeding 100, while the second plate carrier part 101B is formed from a more flexible material or a fluid film.

[0050] In FIG. 5A, the cavity 112 for disposing the substrate 102 disposed within the second plate carrier portion 101B is open. The substrate 102 is disposed on the first plate carrier portion 101A. In this case, while the material of the first plate carrier portion 101A is formed from a compensating material, the second plate carrier portion 101B is preferably formed from the same compensating material or a material that is more rigid and less flexible. As an example, both the first plate carrier portion 101A and the second plate carrier portion 101B can be formed from rubber. In another example, the first plate carrier portion 101A has a fluid system for forming a compensating material in the form of an air bed or a water bed, while the second plate carrier portion 101B is a more rigid holder.

[0051] In FIG. 5B, the cavity 112 for disposing the substrate 102 is completely surrounded by the material of the second plate carrier portion 101B. In this case, the material of the second plate carrier portion 101B is preferably flexible by using a flexible material 114.

[0052] In FIG. 5C, the plate carrier 101 has a cavity 112, whereby a flexible material 114 is disposed inside the cavity 112. In this embodiment, the plate carrier 101 is formed from a more rigid material. If the back surface of the substrate 101 is not uniformly flat due to defects or thickness variations, pressure fluctuations occur during imprinting. This causes a locally thin residual layer thickness of the resin. The non-uniform backside pattern will be visible on the front surface of the imprinted product. By using the flexible material 114 disposed inside the cavity 112, this effect can also be avoided or reduced. The flexible material 114 can be a thin sheet of rubber or plastic film. Preferably, the flexible material 114 is not only disposed within the cavity 112 but also on the raised sides around the cavity 112.

[0053] In FIG. 6, the base material 102 is at a predetermined distance from the boundary region of the compensation material above the compensation material. The boundary region originates from the side surface A' of the compensation material. When any side surface A of the base material is not aligned above the side surface A' of the compensation material, the base material 102 is arranged at a predetermined distance from the boundary region. The distance between the side surface A of the base material and the side surface A' of the compensation material may be the same or different for all side surfaces.

Claims

1. An imprint apparatus for a roll-to-plate process, having a flexible master (105), a plate carrier (101) and a substrate (102), wherein the flexible master (105) is pressable onto the substrate (102) during the imprint process, the plate carrier (101) holds the substrate (102), and the plate carrier (101) has a compensating material, in the imprint apparatus, wherein the substrate (102) is disposed on the compensating material, the area of the compensating material is larger than the area of the substrate (102), and the boundary of the substrate (102) and the boundary of the compensating material do not contact each other, characterized in that the imprint apparatus.

2. An imprint apparatus for a roll-to-plate process, having a flexible master (105), a plate carrier (101) and a substrate (102), wherein the flexible master (105) is pressable onto the substrate (102) during the imprint process, the plate carrier (101) holds the substrate (102), and the plate carrier (101) has a compensating material in the form of an additional layer having a fluid, the imprint apparatus.

3. The imprint apparatus according to claim 1, wherein the compensating material is a flexible material (114).

4. The imprint apparatus according to claim 1 or 2, wherein the plate carrier (101) has at least one cavity (112) in which the substrate (102) can be disposed.

5. The imprint apparatus according to at least any one of claims 1 to 4, wherein the substrate (102) can be embedded in the compensating material.

6. The imprint apparatus according to at least any one of claims 1 to 5, wherein the plate carrier (101) has at least one first plate carrier part (101A) and at least one second plate carrier part (101B), and the first plate carrier part (101A) and / or the second plate carrier part (101B) has the compensating material.

7. The first plate carrier portion (101A) is formed of a first material, the second plate carrier portion (101B) is formed of a second material, and the first material and the second material are different from each other. The imprinting apparatus according to claim 6.

8. The imprinting apparatus according to claim 6 or 7, wherein the first plate carrier portion (101A) can be reversibly contacted with the second plate carrier portion (101B) via a connecting means.

9. The imprinting apparatus according to claim 1, wherein the plate carrier (101) is formed of the compensation material.

10. The imprinting apparatus according to claim 6, wherein the first plate carrier portion (101A) or the second plate carrier portion (101B) is formed of the compensation material.

11. The imprinting apparatus according to claim 6, wherein the compensation material can be reversibly connected to the first plate carrier portion (101A) and / or the second plate carrier portion (101B).

12. The imprinting apparatus according to claim 1 or 3, wherein a flexible mat (114) is used as the compensation material.

13. The imprinting apparatus according to claim 3, wherein the compensation material is a flexible material having a Young's modulus of 0.1 gigapascals (GPa) to 10 gigapascals (GPa) measured according to ASTM E111.

14. The imprinting apparatus according to claim 3, wherein the compensation material has a Shore A value of less than 80 measured according to ASTM D2240.

15. The imprinting apparatus according to claim 2, wherein the fluid is argon gas, nitrogen gas, air or a viscoelastic fluid.

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