Heat dissipation structure

Abstract

To provide a heat dissipation structure that contributes to reducing the cost of realizing a heat dissipation structure for each moving object.SOLUTION: A heat dissipation structure (1) according to an embodiment of the present disclosure includes a heat sink (3) fixed to the outer surface of a housing (2a) of an electronic device (2) and having a plurality of heat dissipation fins (5b) arranged such that grooves (5c) extend in the direction of gravity, and a mounting member (4) replaceably fixed to the end of the heat dissipation fins (5b) opposite the outer surface of the housing (2a) so as to straddle the grooves (5c) and having a screw hole (4c) into which a first screw (6) for mounting the electronic device (2) to a mobile object is screwed. The heat sink (3) is made of an extruded material and has a cut portion where a portion that interferes with the first screw (6) screwed into the screw hole (4c) of the mounting member (4) is cut.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure.

Background Art

[0002] An electronic device is a heat generating body. For example, a heat sink is provided for the electronic device so that the performance of the electronic device does not deteriorate. For example, in the heat dissipation structure of Patent Document 1, a light source is fixed to a vehicle via a heat sink. At this time, in the heat dissipation structure of Patent Document 1, the heat sink is fixed to the vehicle via a rotating shaft inserted into the rotating shaft hole of the heat sink.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the heat dissipation structure of Patent Document 1, for example, when the position of the rotating shaft is different according to the vehicle, the position of the rotating shaft hole of the heat sink is correspondingly different. Therefore, when fixing the electronic device to the vehicle via the heat sink, it is necessary to replace the heat sink according to the vehicle. Therefore, for example, it is necessary to cast a heat sink for each moving body represented by a vehicle, and there is a problem that the cost for realizing a heat dissipation structure for each moving body increases.

[0005] An object of the present disclosure is to solve the above-described problems and provide a heat dissipation structure that contributes to reducing the cost for realizing a heat dissipation structure for each moving body.

Means for Solving the Problems

[0006] A heat dissipation structure according to an aspect of the present disclosure includes a heat sink fixed to an outer surface of a housing of an electronic device, in which a plurality of heat dissipation fins are arranged such that grooves extend in the direction of gravity, and a mounting member that is removably fixed to an end portion of the heat dissipation fin on the side opposite to the outer surface of the housing so as to straddle the groove, and has a screw hole into which a first screw for attaching the electronic device to a moving body is screwed. The heat dissipation structure includes: The heat sink is made of an extruded material and has a cut portion obtained by cutting a portion where the first screw screwed into the screw hole of the mounting member interferes.

Advantages of the Invention

[0007] According to the present disclosure, it is possible to provide a heat dissipation structure that contributes to reducing the cost of realizing the heat dissipation structure for each moving body.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0009] Hereinafter, specific embodiments to which the present disclosure is applied will be described in detail with reference to the drawings. However, the present disclosure is not limited to the following embodiments, and the following description and drawings are appropriately simplified.

[0010] <Embodiment 1> FIG. 1 is a perspective view showing a state in which the heat dissipation structure of this embodiment is attached to an electronic device. In the following description, for clarity, a three-dimensional (XYZ) coordinate system will be used for the description. Here, the + side of the X-axis is the rear side of the electronic device, and the - side of the X-axis is the front side of the electronic device. The + side of the Y-axis is the left side of the electronic device, and the - side of the Y-axis is the right side of the electronic device. The + side of the Z-axis is the upper side of the electronic device, and the - side of the Z-axis is the lower side of the electronic device (i.e., the direction of gravity).

[0011] As shown in FIG. 1, the heat dissipation structure 1 of this embodiment is suitable for dissipating the heat of the electronic device 2 and fixing the electronic device 2 to a vehicle (not shown), which is a representative example of a moving body. Here, the electronic device 2 is, for example, a car navigation device, a display audio, or an audio, and includes a housing 2a in which a control device for realizing a car navigation function or an audio function is stored, and a monitor 2b fixed to the end portion on the - side of the X-axis of the housing 2a.

[0012] The heat dissipation structure 1 is fixed to the end portion on the - side of the Y-axis of the electronic device 2, for example, as shown in FIG. 1. However, the heat dissipation structure 1 may be fixed to the end portion on the + side of the Y-axis of the electronic device 2, or may be fixed to the end portions on the + side and the - side of the Y-axis of the electronic device 2.

[0013] At this time, the heat dissipation structure 1 fixed to the end portion on the + side of the Y-axis of the electronic device 2 and the heat dissipation structure 1 fixed to the end portion on the - side of the Y-axis of the electronic device 2 may have a line-symmetric configuration with an axis passing through the center in the Y-axis direction of the electronic device 2 when viewed from the Z-axis direction and extending in the X-axis direction as the axis of symmetry.

[0014] As shown in FIG. 1, the heat dissipation structure 1 includes a heat sink 3 and a mounting member 4. Here, FIG. 2 is a perspective view showing a common heat sink in the heat dissipation structure of the present embodiment. FIG. 3 is a perspective view showing a heat sink formed by cutting the common heat sink in the heat dissipation structure of the present embodiment according to the vehicle.

[0015] In the heat dissipation structure 1 of the present embodiment, for example, a common heat sink 5 as shown in FIG. 2 can be used after being cut for each vehicle. Here, the common heat sink before cutting is labeled with the reference numeral 5, and the heat sink after cutting is labeled with the reference numeral 3 for distinction.

[0016] The common heat sink 5 is, for example, an extruded material made of a material having excellent thermal conductivity such as aluminum. The common heat sink 5 includes, for example, a base 5a and heat dissipation fins 5b as shown in FIG. 2.

[0017] The base 5a has, for example, a substantially rectangular shape when viewed from the Y-axis direction and is a plate body substantially parallel to the XZ plane as shown in FIG. 2. The base 5a preferably has, for example, a shape substantially equal to the Y-axis side surface of the housing 2a of the electronic device 2 when viewed from the Y-axis direction.

[0018] The heat dissipation fins 5b protrude from the base 5a toward the Y-axis side in order to form a plurality of grooves 5c extending in the Z-axis direction at substantially equal intervals in the X-axis direction, and are arranged at substantially equal intervals in the X-axis direction as shown in FIG. 2.

[0019] The heat dissipation fins 5b have, for example, a substantially rectangular shape when viewed from the X-axis direction and are plate bodies substantially parallel to the YZ plane as shown in FIG. 2. The heat dissipation fins 5b extend in the Z-axis direction and are preferably arranged over substantially the entire Z-axis direction of the base 5a, for example.

[0020] Here, the thickness of the heat dissipation fins 5b arranged on both sides in the X-axis direction is preferably thicker than the thickness of the other heat dissipation fins 5b in the X-axis direction as shown in FIG. 2. And screw holes 5d are preferably formed at intervals in the Z-axis direction in the heat dissipation fins 5b on the X-axis + side.

[0021] For such a common heat sink 5, for example, in order to fix the electronic device 2 to the vehicle via a bracket prepared for each vehicle, a first screw 6 passed through a through hole of the bracket is disposed at an interfering portion in the common heat sink 5 and cuts a heat radiation fin 5b to be machined as a machined portion, thereby forming a heat sink 3 as shown in FIG. 3.

[0022] That is, in the heat sink 3, a relief portion 3a including a machined portion is formed so that the first screw 6 does not interfere. And a cutting mark is formed in the portion where the heat radiation fin 5b in the base 5a of the heat sink 3 is cut.

[0023] At this time, the heat radiation fin 5b to be cut is appropriately changed for each vehicle. Therefore, the heat sink 3 is prepared for each vehicle, for example. However, as described above, by cutting the heat radiation fin 5b of the common heat sink 5, the heat sink 3 can be easily formed for each vehicle.

[0024] The heat sink 3 can be fixed to the electronic device 2, for example, by bringing the base 5a into substantial contact with the Y-axis-side surface of the housing 2a of the electronic device 2 from the Y-axis - side and screwing a screw (not shown) passed through a through hole formed in the base 5a of the heat sink 3 from the Y-axis - side into a screw hole formed in the Y-axis - side surface of the housing 2a of the electronic device 2.

[0025] The mounting member 4 is a sheet metal member for fixing the electronic device 2 to the vehicle via the heat sink 3, and is fixedly attached to the heat sink 3 in a replaceable manner. The mounting member 4 is, for example, a plate body bent in a substantially L shape as viewed from the Z-axis direction as shown in FIG. 1, and is made of a steel material or the like having a lower thermal conductivity and higher rigidity than the heat sink 3.

[0026] The mounting member 4 includes, for example, a first flat plate portion 4a and a second flat plate portion 4b as shown in FIG. 1. The first flat plate portion 4a has, for example, a substantially rectangular shape when viewed from the Y-axis direction and is a flat plate substantially parallel to the XZ plane. The first flat plate portion 4a preferably has a shape substantially equal to that of the base 5a of the heat sink 3 when viewed from the Y-axis direction.

[0027] A through hole (not shown) through which a second screw 7 for fixing the mounting member 4 to the heat sink 3 is passed is formed in the first flat plate portion 4a. And a screw hole 4c into which a first screw 6 used when fixing the electronic device 2 to the vehicle is screwed is formed at a predetermined position of the first flat plate portion 4a as shown in FIG. 1. Here, the first flat plate portion 4a preferably has a first heat dissipation hole 4d for dissipating the heat transmitted to the heat sink 3.

[0028] The second flat plate portion 4b has, for example, a substantially rectangular shape when viewed from the X-axis direction and is a flat plate substantially parallel to the YZ plane as shown in FIG. 1. The second flat plate portion 4b protrudes from the end portion on the X-axis side of the first flat plate portion 4a toward the Y-axis side.

[0029] At this time, the height of the second flat plate portion 4b in the Z-axis direction is preferably higher than the height of the first flat plate portion 4a in the Z-axis direction. A through hole (not shown) through which a third screw 8 for fixing the mounting member 4 to the surface on the +X-axis side of the monitor 2b in the electronic device 2 is passed is formed in the second flat plate portion 4b.

[0030] In the mounting member 4, as shown in FIG. 1, with the first flat plate portion 4a straddling the groove 5c of the heat sink 3 and the first flat plate portion 4a being substantially in contact with the end portion on the Y-axis side of the heat dissipation fin 5b of the heat sink 3 from the Y-axis side, the second screw 7 passed through the through hole of the first flat plate portion 4a is screwed into the screw hole 5d of the heat sink 3.

[0031] Then, as shown in FIG. 1, with the second flat plate portion 4b in a state of being substantially in contact with the +X side surface of the monitor 2b in the electronic device 2 from the +X side, the third screw 8 passed through the through hole of the second flat plate portion 4b is screwed into a screw hole (not shown) formed in the +X side surface of the monitor 2b in the electronic device 2. Thereby, the attachment member 4 is fixed to the electronic device 2 and the heat sink 3.

[0032] At this time, the screw hole 4c of the first flat plate portion 4a in the attachment member 4 is appropriately changed according to the arrangement of the first screw 6 passed through the through hole of the bracket prepared for each vehicle, for example. Therefore, although the attachment member 4 is prepared for each vehicle, the attachment member 4 can be easily formed for each vehicle only by changing the arrangement of the screw holes 4c for each vehicle.

[0033] Next, the process of fixing the electronic device 2 to the vehicle using the heat dissipation structure 1 of the present embodiment will be described. According to the vehicle to which the electronic device 2 is to be fixed, the heat sink 3 and the attachment member 4 are selected and the selected heat sink 3 and attachment member 4 are fixed.

[0034] Then, for example, the first screw 6 is passed through the through hole of the bracket prepared according to the vehicle and screwed into the screw hole 4c of the attachment member 4 to fix the bracket to the attachment member 4. After that, by fixing the bracket to the vehicle, the electronic device 2 can be fixed to the vehicle using the heat dissipation structure 1.

[0035] At this time, since the escape portion 3a is formed in the heat sink 3, even if the first screw 6 screwed into the screw hole 4c of the attachment member 4 protrudes from the attachment member 4 to the +Y side, it does not interfere with the heat sink 3.

[0036] Next, the heat dissipation effect of the heat dissipation structure 1 of the present embodiment will be described. FIG. 4 is a diagram for explaining the heat dissipation effect of the present embodiment. In FIG. 4, the flow of air is indicated by broken-line arrows, and the attachment member 4 is shown in a perspective view to clarify the flow of air.

[0037] In the heat dissipation structure 1 of the present embodiment, the opening on the Y-axis side of the groove 5c in the heat sink 3 is covered by the mounting member 4, and the end portions on the +Z-axis side and -Z-axis side of the groove 5c are open. Therefore, as shown in FIG. 4, an upward airflow is generated by the chimney effect, and the heat transferred to the heat sink 3 can be efficiently dissipated.

[0038] Thus, in the heat dissipation structure 1 of the present embodiment, for example, by cutting the heat dissipation fins 5b of the common heat sink 5 according to the arrangement of the first screws 6 passed through the through holes of the brackets prepared for each vehicle, the heat sink 3 for each vehicle can be easily formed. Further, the common heat sink 5 can be inexpensively formed by an extruded material instead of by casting.

[0039] Moreover, in the heat dissipation structure 1 of the present embodiment, for example, by simply changing the arrangement of the screw holes 4c of the first flat plate portion 4a in the mounting member 4 according to the arrangement of the first screws 6 passed through the through holes of the brackets prepared for each vehicle, the mounting member 4 for each vehicle can be easily formed.

[0040] Therefore, in the heat dissipation structure 1 of the present embodiment, it is not necessary to cast a heat sink for each vehicle as in the heat dissipation structure of Patent Document 1, for example, and the cost for realizing the heat dissipation structure 1 for each vehicle can be reduced.

[0041] For example, when screwing the first screw 6 for fixing the electronic device 2 to the vehicle into the aluminum heat sink 3, since the rigidity of the heat sink 3 is low, the screw holes formed in the heat sink 3 are easily damaged, such as being worn down. However, in the heat dissipation structure 1 of the present embodiment, for example, since the mounting member 4 is formed of a steel material or the like having higher rigidity than the heat sink 3, the screw holes 4c of the mounting member 4 are less likely to be damaged.

[0042] Further, since the mounting member 4 is formed of a steel material or the like having a lower thermal conductivity than the heat sink 3, the thermal expansion is small, and the first screw 6 used when fixing the electronic device 2 to the vehicle is less likely to loosen.

[0043] In addition, since the mounting member 4 is detachably fixed to the electronic device 2 and the heat sink 3 by the second screw 7 and the third screw 8, if the mounting member 4 is damaged, the mounting member 4 can be easily replaced.

[0044] Further, the open portion on the Y-axis - side of the groove 5c in the heat sink 3 is covered by the mounting member 4, and the end portions on the Z-axis + side and the Z-axis - side of the groove 5c are open. Therefore, as shown in FIG. 4, the heat transmitted to the heat sink 3 due to the chimney effect can be efficiently dissipated.

[0045] In addition, since the mounting member 4 is a bent plate-shaped sheet metal member, the first heat radiation holes 4d can be easily added.

[0046] <Embodiment 2> FIG. 5 is a view of the heat dissipation structure of the present embodiment attached to the electronic device as viewed from the Z-axis + side. Since the heat dissipation structure 11 of the present embodiment has a configuration substantially equal to that of the heat dissipation structure 1 of Embodiment 1 as shown in FIG. 5, redundant descriptions are omitted. However, a heat insulating material 12 is disposed as a heat insulating layer between the heat radiation fins 5b of the heat sink 3 and the first flat plate portion 4a of the mounting member 4.

[0047] Thereby, it is difficult for heat to be transmitted from the heat sink 3 to the mounting member 4. For example, when the electronic device 2 is removed from the vehicle in order to repair the electronic device 2 in a state where the electronic device 2 has been operated until just before, the electronic device 2 can be easily picked up with the heat dissipation structure 11 fixed to the electronic device 2.

[0048] In the present embodiment, the heat insulating material 12 is disposed as a heat insulating layer between the heat radiation fins 5b of the heat sink 3 and the first flat plate portion 4a of the mounting member 4. However, a gap may be formed as a heat insulating layer between the heat radiation fins 5b of the heat sink 3 and the first flat plate portion 4a of the mounting member 4.

[0049] <Embodiment 3> FIG. 6 is a perspective view showing a state in which the heat dissipation structure of the present embodiment is attached to an electronic device. Since the heat dissipation structure 21 of the present embodiment has substantially the same configuration as the heat dissipation structure 1 of the first embodiment as shown in FIG. 6, redundant descriptions are omitted, but a second heat dissipation hole 4e is added to a portion on the Z-axis side of the first flat plate portion 4a in the attachment member 4.

[0050] The second heat dissipation hole 4e is, for example, substantially circular as viewed from the Y-axis direction and is arranged at substantially equal intervals in the X-axis direction as shown in FIG. 6. That is, the second heat dissipation hole 4e is arranged so as to overlap a portion on the Z-axis side of the groove 5c of the heat sink 3 as viewed from the Y-axis direction.

[0051] Depending on the vehicle, the end portion on the Z-axis side of the groove 5c of the heat sink 3 may be easily blocked. However, by forming the second heat dissipation hole 4e in the attachment member 4, an air inflow path can be secured and the chimney effect can be exhibited well.

[0052] The present disclosure is not limited to the present embodiment and can be appropriately changed without departing from the gist. For example, the shapes of the heat sink 3 and the attachment member 4 in the above embodiment are examples, and the first heat dissipation hole 4d of the attachment member 4 may be omitted. For example, in the above embodiment, the heat dissipation fins 5b of the common heat sink 5 are cut so that the first screw 6 does not interfere. However, depending on the shape of the common heat sink 5, the portion to be cut is appropriately changed. Also, it is not always necessary to form the heat sink 3 by the common heat sink 5, and the heat sink 3 may be formed by cutting a portion where the first screw 6 in the extruded material interferes. For example, the electronic device 2 in the above embodiment is a car navigation, a display audio, or an audio, etc., but any electronic device mounted on a moving body such as a ship or an aircraft may be used.

Description of Reference Numerals

[0053] 1 Heat dissipation structure 2 Electronic device, 2a Housing, 2b Monitor 3 Heat sink, 3a Relief portion 4 Mounting member, 4a First flat portion, 4b Second flat portion, 4c Screw hole, 4d First heat dissipation hole, 4e Second heat dissipation hole 5 Common heat sink, 5a Base, 5b Heat dissipation fin, 5c Groove, 5d Screw hole 6 First screw 7 Second screw 8 Third screw 11 Heat dissipation structure 12 Heat insulating material 21 Heat dissipation structure

Claims

1. A heat sink fixed to an outer surface of a housing of an electronic device, with a plurality of heat radiating fins arranged such that grooves extend in the direction of gravity; An attachment member that is removably fixed to an end portion of the heat radiating fin on the side opposite to the outer surface of the housing so as to straddle the groove, and has a screw hole into which a first screw for attaching the electronic device to a moving body is screwed; Comprising: The heat sink is made of an extruded material and has a cut portion where a part interfering with the first screw screwed into the screw hole of the attachment member is cut, the heat dissipation structure.

2. The heat sink is formed with a relief portion as the cut portion at a portion where the first screw screwed into the screw hole of the attachment member in a common heat sink commonly used for each moving body interferes, the heat dissipation structure according to claim 1.

3. The heat dissipation structure according to claim 1 or 2, wherein a heat insulating layer is disposed between the attachment member and an end portion of the heat radiating fin on the side opposite to the outer surface of the housing.

4. The attachment member has a low thermal conductivity and high rigidity with respect to the heat sink, the heat dissipation structure according to claim 1 or 2.

5. The attachment member is fixed to the heat sink by a second screw, the heat dissipation structure according to claim 1 or 2.

Images