Height measuring device, height measuring method, height measuring program, and recording medium

By prioritizing the measurement of overlapping points and parallel processing of non-overlapping ranges, the apparatus efficiently measures all points despite overlapping ranges, minimizing waiting times and enhancing measurement efficiency.

JP2025109533APending Publication Date: 2025-07-25YAMAHA MOTOR CO LTD
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Patent Information

Application Number
JP2024003477
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-12
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

In apparatuses with two height measurement units, overlapping measurement point ranges lead to significant time deviations and prolonged measurement times due to interference and waiting periods.

Method used

A control unit sets a measurement procedure where the first height measurement unit starts measuring the overlapping range first, followed by the second unit, with specific point orderings to minimize waiting times and overlap interference.

Benefits of technology

This approach allows efficient measurement of all points by ensuring early completion of measurements closest to the overlap and parallel processing of non-overlapping ranges, reducing overall measurement time.

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Abstract

To make it possible to efficiently measure heights of all measuring points of a workpiece when existence ranges of the measuring points for which each of two height measuring units is in charge of measuring hights protrude and overlap each other in a Y direction.SOLUTION: A height sensor 8a (first height measuring unit) is set to start to measure a height of a measuring point P in an overlapping range Ro first, and a height sensor 8b (second height measuring unit) is set to start after (step S103). Further, a measurement procedure is set to measure a height of a measuring point Pa (the measuring point Pa at a position Y2) on the most Yb side among the measuring points Pa for which the height sensor 8a is in charge of first (step S103).SELECTED DRAWING: Figure 4
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Description

Technical Field

[0001] This invention relates to a technique for measuring the height of measurement points provided on a workpiece.

Background Art

[0002] Patent Document 1 discloses a component mounter that detects the heights of a plurality of measurement points provided on a substrate using height sensors. This component mounter has two height sensors that move in the X and Y directions respectively, and each height sensor can measure the height of a measurement point.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In an apparatus equipped with two height measurement units (height sensors), in order to prevent interference between them, it is necessary to perform measurement of measurement points while separating them in the Y direction. Therefore, if the existence range in the Y direction of the measurement points for which one height measurement unit is responsible for measurement and the existence range in the Y direction of the measurement points for which the other height measurement unit is responsible for measurement mutually protrude and overlap in the Y direction, a situation may occur where while one height measurement unit is measuring the height of the measurement points in the overlapping range, the other height measurement unit waits to measure the height of the measurement points in the overlapping range. Therefore, the times when each of the two height measurement units finishes measuring the height of the measurement points may deviate significantly, and it may take a long time to measure the heights of all the measurement points on the workpiece.

[0005] This invention has been made in view of the above problems, and an object thereof is to enable efficient measurement of the heights of all the measurement points on a workpiece when the existence ranges of the measurement points for which each of the two height measurement units is responsible for height measurement mutually protrude and overlap in the Y direction.

Means for Solving the Problem

[0006] The height measuring device according to the present invention is movable in the X direction and the Y direction orthogonal to the X direction, and measures the height of the measurement points while facing the measurement points of a workpiece provided with a plurality of measurement points. The first height measuring unit, the second height measuring unit that is movable in the X direction and the Y direction and measures the height of the measurement points while facing the measurement points of the workpiece, and the first height measuring unit on the first side in the Y direction from the second height measuring unit. A first driving unit that moves the unit in the X direction and the Y direction, and a second driving unit that moves the second height measuring unit in the X direction and the Y direction on the second side opposite to the first side in the Y direction from the first height measuring unit, Among the plurality of measurement points, a measurement point responsible for measuring the height by the first height measuring unit and a measurement point responsible for measuring the height by the second height measuring unit are set, and the height measurement of the measurement points responsible for the first height measuring unit and the second height measuring unit are set. And a control unit that sets a measurement procedure indicating the procedure for measuring the height of the measurement points, and in the Y direction, the end on the second side of the first movement range where the first height measuring unit moves to measure the measurement points is the second height measuring unit. When it is located on the second side from the end on the first side of the second movement range where the unit moves to measure the measurement point, the control unit measures the height of the measurement point within the overlapping range between the end on the second side of the first movement range and the end on the first side of the second movement range in the Y direction. The first height measuring unit starts first and then the second height measuring unit starts, and the measurement procedure is set so that the height of the measurement point on the second side most among the measurement points responsible for the first height measuring unit is measured first.

[0007] The height measurement method according to the present invention includes a step of setting, from among a plurality of measurement points, a measurement point for which the first height measurement unit, which is movable in the X direction and the Y direction orthogonal to the X direction and measures the height of the measurement point while facing the measurement point of a workpiece provided with a plurality of measurement points, is responsible for measuring the height; a step of setting, from among the plurality of measurement points, a measurement point for which the second height measurement unit, which is movable in the X direction and the Y direction and measures the height of the measurement point while facing the measurement point of the workpiece, is responsible for measuring the height; a step of setting a measurement procedure showing the procedure for measuring the height of the measurement point for which the first height measurement unit is responsible and the procedure for measuring the height of the measurement point for which the second height measurement unit is responsible; a step of moving the first height measurement unit on the first side in the Y direction from the second height measurement unit and causing the first height measurement unit to measure the height of the measurement point for which it is responsible according to the measurement procedure; and a step of moving the second height measurement unit on the second side opposite to the first side in the Y direction from the first height measurement unit and causing the second height measurement unit to measure the height of the measurement point for which it is responsible according to the measurement procedure. In the Y direction, when the end on the second side of the first movement range in which the first height measurement unit moves to measure the measurement point is located on the second side from the end on the first side of the second movement range in which the second height measurement unit moves to measure the measurement point, the first height measurement unit starts measuring the height of the measurement points within the overlapping range between the end on the second side of the first movement range and the end on the first side of the second movement range in the Y direction first, and then the second height measurement unit starts measuring later. The measurement procedure is set so that the height of the measurement point on the second side among the measurement points for which the first height measurement unit is responsible is measured first.

[0008] The height measurement program according to the present invention causes a computer to execute the above height measurement method.

[0009] The recording medium according to the present invention records the above height measurement program in a computer-readable manner.

[0010] In the present invention (height measuring device, height measuring method, height measuring program, and recording medium) configured as described above, in the Y direction, when the end on the second side of the first moving range in which the first height measuring unit moves to measure the measurement point is located on the second side of the end on the first side of the second moving range in which the second height measuring unit moves to measure the measurement point (that is, when there is an overlapping range), the following measurement procedure is set for the measurement points within the overlapping range between the end on the second side of the first moving range and the end on the first side of the second moving range in the Y direction. That is, it is set that the first height measuring unit starts measuring the height of the measurement points within the overlapping range first and then the second height measuring unit starts later. And the measurement procedure is set so that the height of the measurement point on the second side among the measurement points handled by the first height measuring unit is measured first. Therefore, among the overlapping range, the height measurement by the first height measuring unit of the measurement point closest to the second height measuring unit is completed early, and the height measurement by the second height measuring unit of the measurement points in the vicinity of the measurement point becomes possible. As a result, it is possible to shorten the period during which the second height measuring unit waits for measuring the height of the measurement point. In this way, when the existence ranges of the measurement points for which each of the two height measuring units is responsible for height measurement protrude and overlap each other in the Y direction, it becomes possible to efficiently measure the height of all the measurement points of the workpiece.

[0011] In addition, the measurement points responsible for the first height measurement unit include measurement points within the overlapping range and measurement points within the non-overlapping preceding range outside the overlapping range. The first height measurement unit starts measuring the height of the measurement points within the non-overlapping preceding range after finishing measuring the height of the measurement points within the overlapping range. The measurement points responsible for the second height measurement unit include measurement points within the overlapping range and measurement points within the non-overlapping succeeding range outside the overlapping range. The height measurement device may be configured such that the second height measurement unit starts measuring the height of the measurement points within the overlapping range after finishing measuring the height of the measurement points within the non-overlapping succeeding range. In such a configuration, the second height measurement unit can execute the measurement of the height of the measurement points within the non-overlapping succeeding range in parallel with the measurement of the height of the measurement points within the overlapping range by the first height measurement unit. Also, the second height measurement unit can execute the measurement of the height of the measurement points within the overlapping range in parallel with the measurement of the height of the measurement points within the non-overlapping preceding range by the first height measurement unit. As a result, it is possible to more efficiently measure the height of all the measurement points of the workpiece.

[0012] Further, the control unit may configure the height measurement device such that the measurement of the measurement points located within the overlapping range among the measurement points responsible for the first height measurement unit is executed in order from the measurement points on the second side in the Y direction, and the measurement of the measurement points located within the overlapping range among the measurement points responsible for the second height measurement unit is executed in order from the measurement points on the second side. In such a configuration, the first height measurement unit measures the height of the measurement points within the overlapping range in order from the side closer to the second height measurement unit (the second side). Therefore, the second height measurement unit can start measuring the height of the measurement points earlier and execute the measurement of the height of the measurement points by following the first height measurement unit that advances the measurement of the height of the measurement points from the second side toward the opposite side (the first side). As a result, it is possible to more efficiently measure the height of all the measurement points of the workpiece.

[0013] Further, the control unit may configure the height measurement device such that the measurement procedure is set so that the number of measurement points for which the first height measurement unit is responsible for height measurement increases as it goes toward the first side, and the measurement procedure is set so that the number of measurement points for which the second height measurement unit is responsible for height measurement decreases as it goes toward the first side. With such a configuration, it is possible to suppress the occurrence of standby of the second height measurement unit and to more efficiently measure the heights of all the measurement points of the workpiece.

[0014] Further, the control unit may configure the height measurement device such that the number of measurement points for which the first height measurement unit is responsible for measurement and the number of measurement points for which the second height measurement unit is responsible for measurement are set according to the time from when the first height measurement unit starts measuring a measurement point to when the second height measurement unit starts measuring a measurement point. With such a configuration, it is possible to suppress the deviation in the time when each of the first height measurement unit and the second height measurement unit finishes measuring the height of the measurement point, and to efficiently measure the heights of all the measurement points of the workpiece.

Advantages of the Invention

[0015] As described above, according to the present invention, when the ranges of existence of the measurement points for which each of the two height measurement units is responsible for height measurement protrude and overlap with each other in the Y direction, it becomes possible to efficiently measure the heights of all the measurement points of the workpiece.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

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Figure 4

Figure 5A

Figure 5B

Figure 6A

Figure 6B

Figure 7A

Figure 7B

Figure 8

Figure 9

Figure 10

Figure 11A

Figure 11B

Best Mode for Carrying Out the Invention

[0017] FIG. 1 is a partial plan view schematically showing an example of a component mounter for implementing a height measurement method according to the present invention, and FIG. 2 is a block diagram showing an example of an electrical configuration of the component mounter of FIG. 1. In FIG. 1 and the following figures, the X direction which is the horizontal direction, the Y direction which is the horizontal direction orthogonal to the X direction, and the Z direction which is the vertical direction are appropriately shown, and the Ya side and the Yb side in the Y direction are appropriately shown. Here, the Ya side and the Yb side face opposite to each other. The component mounter 1 in FIG. 1 produces a component-mounted substrate by mounting a component E on a substrate B.

[0018] As shown in FIG. 2, the component mounter 1 includes a control unit 9 that comprehensively controls the component mounter 1. The control unit 9 includes an arithmetic processing unit 91, a storage unit 92, a drive control unit 93, an imaging control unit 94, and a sensor control unit 95. The arithmetic processing unit 91 is a processor such as a CPU (Central Processing Unit) that performs the arithmetic function in the component mounter 1, and the storage unit 92 is a storage device such as an SSD (Solid State Drive) or an HDD (Hard Disk Drive). In this storage unit 92, a height measurement program 921 for measuring the height of the measurement points provided on the substrate B and measurement point information 922 indicating the positions of the plurality of measurement points provided on the substrate B are stored. This measurement point information 922 is stored in the storage unit 92 in advance, for example, by a user operation or the like. The drive control unit 93 controls the drive system provided in the component mounter 1 in response to a command from the arithmetic processing unit 91, the imaging control unit 94 controls the imaging system provided in the component mounter 1 in response to a command from the arithmetic processing unit 91, and the sensor control unit 95 acquires the output of the sensor provided in the component mounter 1 in response to a command from the arithmetic processing unit 91 and transmits it to the arithmetic processing unit 91.

[0019] The component mounter 1 includes a base 11 having a substantially rectangular shape in plan view and a substrate conveyance unit 2 attached to the base 11. The substrate conveyance unit 2 has a pair of conveyors 21 arranged parallel to the X direction, and conveys the substrate B in the X direction (substrate conveyance direction) by the pair of conveyors 21. Specifically, the substrate conveyance unit 2 conveys the substrate B from the upstream side in the X direction to a predetermined working position (the position of the substrate B in FIG. 1) in response to a loading command from the drive control unit 93. Further, the substrate conveyance unit 2 conveys the substrate B with the component E mounted at the working position from the working position to the downstream side in the X direction in response to an unloading command from the drive control unit 93.

[0020] The component mounter 1 is equipped with two mounting heads 3a and 3b. The mounting head 3a is provided on the Ya side of the mounting head 3b, and the mounting head 3b is provided on the Yb side of the mounting head 3a. Each of the mounting heads 3a and 3b is an in-line type mounting head having a plurality of shafts 31 arranged in a row in the X direction. Each shaft 31 extends in the Z direction, and a suction nozzle is detachably attached to the lower end of each shaft 31. Further, the component mounter 1 is equipped with Z motors 47 attached to each of the mounting heads 3a and 3b. The Z motor 47 is provided for each of the plurality of shafts 31 of the mounting heads 3a and 3b, and drives the corresponding shaft 31 in the Z direction. That is, the mounting heads 3a and 3b can individually raise and lower each of the shafts 31 by the Z motor 47. These mounting heads 3a and 3b mount the component E on the substrate B by placing the component E adsorbed by the suction nozzle on the substrate B. Note that the specific type of the mounting heads 3a and 3b is not limited to the in-line type, and a rotary type in which a plurality of shafts 31 are arranged in a circular shape may be used.

[0021] Further, the component mounter 1 includes an XY drive mechanism 4 that individually drives each of the two mounting heads 3a and 3b in the X and Y directions. This XY drive mechanism 4 has X beams 41a and 41b that extend parallel to the X direction and support the mounting heads 3a and 3b so as to be movable in the X direction. Each of the X beams 41a and 41b is attached with a ball screw 42 extending parallel to the X direction and an X motor 43 that rotationally drives the ball screw 42. The X motor 43 is a servo motor in this example. The mounting heads 3a and 3b are respectively attached to the nuts of the ball screws 42 of the X beams 41a and 41b. Further, the XY drive mechanism 4 has a pair of Y beams 44 and 44 that extend parallel to the Y direction. One end of each of the X beams 41a and 41b is supported by one of the Y beams 44 so as to be movable in the Y direction, and the other end of each of the X beams 41a and 41b is supported by the other Y beam 44 so as to be movable in the Y direction. A Y motor 45 that drives the X beams 41a and 41b in the Y direction is attached to each of the Y beams 44. Each of the Y motors 45 is a linear motor in this example and has movers 451 and 451 attached to both ends of the X beams 41a and 41b and stators 452 and 452 extending parallel to the Y direction. Then, the X beams 41a and 41b are driven in the Y direction together with the movers 451 by the magnetic force acting between the movers 451 and the stators 452. According to such an XY drive mechanism 4, the mounting heads 3a and 3b can be moved in the X and Y directions by the X motor 43 and the Y motor 45. That is, the XY drive mechanism 4 moves the mounting head 3a in the X and Y directions on the Ya side of the mounting head 3b and moves the mounting head 3b in the X and Y directions on the Yb side of the mounting head 3a.

[0022] Furthermore, the component mounter 1 includes a component supply unit 5a arranged on the Ya side in the Y direction of the board transport unit 2, and a component supply unit 5b arranged on the Yb side in the Y direction of the board transport unit 2. A plurality of tape feeders 51 aligned in the X direction are detachably attached to each of the component supply units 5a and 5b. Each tape feeder 51 intermittently feeds out in the Y direction a tape that stores small pieces of components E (chip components) such as integrated circuits, transistors, and capacitors at predetermined intervals, thereby supplying the components E on the tape to a component supply position.

[0023] In this way, the component E supplied by the tape feeder 51 of the component supply unit 5a is mounted on the board B at the work position by the mounting head 3a, and the component E supplied by the tape feeder 51 of the component supply unit 5b is mounted on the board B at the work position by the mounting head 3b. The details of component mounting by the mounting head 3a are as follows. The drive control unit 93 drives the mounting head 3a by the XY drive mechanism 4, so that the suction nozzle attached to the lower end of the shaft 31 of the mounting head 3a faces the component E supplied by the tape feeder 51 of the component supply unit 5a from above. Then, the drive control unit 93 lowers the shaft 31 by the Z motor 47 to bring the suction nozzle into contact with the upper surface of the component E, and the mounting head 3a applies negative pressure to the suction nozzle to suction the component E. The drive control unit 93 also raises the shaft 31, to which the suction nozzle that suctions the component E is attached, by the Z motor 47, to take out the component E from the tape feeder 51. Next, the drive control unit 93 drives the mounting head 3a using the XY drive mechanism 4, so that the shaft 31 of the mounting head 3a faces the component E picked up by the suction nozzle from above toward the board B. Then, the drive control unit 93 lowers the shaft 31 using the Z motor 47, so that the component E picked up by the suction nozzle comes into contact with the surface of the board B, and the mounting head 3a applies atmospheric pressure or positive pressure to the suction nozzle to detach the component E from the suction nozzle to the board B. In this way, the component E is mounted on the board B. The same is true for component mounting by the mounting head 3b.

[0024] The component mounter 1 is equipped with two component recognition cameras 6a and 6b provided corresponding to the two mounting heads 3a and 3b. Each of the component recognition cameras 6a and 6b is provided for recognizing the component E adsorbed to the corresponding mounting heads 3a and 3b (component recognition). This component recognition is executed after the adsorption of the component E and before the mounting of the component E on the substrate B. That is, when the mounting head 3a adsorbs the component E from the component supply unit 5a, the XY drive mechanism 4 moves the mounting head 3a toward the component recognition camera 6a in accordance with a command from the drive control unit 93, and makes the component E adsorbed to the mounting head 3a face the component recognition camera 6a from above. Subsequently, the component recognition camera 6a captures an image of the component E in accordance with a command from the imaging control unit 94 to acquire image data, and transmits the image data to the imaging control unit 94. The imaging control unit 94 recognizes the position of the component E based on the image data. Based on the position thus recognized, the position of the component E when the mounting head 3a mounts it on the substrate B is adjusted. The recognition of the component E adsorbed to the mounting head 3b by the component recognition camera 6b is executed in the same manner.

[0025] In addition, the component mounter 1 is equipped with nozzle changers 7a and 7b for exchanging the suction nozzles mounted on the shafts 31 of the mounting heads 3a and 3b. The nozzle changer 7a is arranged on the Ya side of the substrate conveyance unit 2, and exchanges the suction nozzle of the mounting head 3a that has been moved by the XY drive mechanism 4 to a position facing the nozzle changer 7a from above. Similarly, the nozzle changer 7b is arranged on the Yb side of the substrate conveyance unit 2, and exchanges the suction nozzle of the mounting head 3b that has been moved by the XY drive mechanism 4 to a position facing the nozzle changer 7b from above.

[0026] Furthermore, the component mounter 1 includes two height sensors 8a and 8b provided corresponding to the two mounting heads 3a and 3b. Each of the height sensors 8a and 8b is a laser distance sensor and measures the distance to a measurement point provided on the substrate B. As the laser distance sensor, a triangulation distance type sensor or a time-of-flight type sensor can be used. However, the sensors that can be used as the height sensors 8a and 8b are not limited to laser distance sensors, and ultrasonic distance sensors may also be used. The height sensors 8a and 8b are respectively fixed to the corresponding mounting heads 3a and 3b and move along with the mounting heads 3a and 3b. Therefore, the drive control unit 93 can move the height sensor 8a in the X and Y directions on the Ya side of the height sensor 8b by driving the mounting head 3a by the XY drive mechanism 4, and can move the height sensor 8b in the X and Y directions on the Yb side of the height sensor 8a by driving the mounting head 3b by the XY drive mechanism 4. When measuring the height of the measurement point, the drive control unit 93 drives the height sensor 8a in the X and Y directions to oppose the height sensor 8a to the measurement point from above. Then, the height sensor 8a measures the height of the opposing measurement point and acquires height data indicating the height of the measurement point. This height data is transmitted from the height sensor 8a to the sensor control unit 95. The acquisition of height data by the height sensor 8b is executed in the same manner. Also, the drive control unit 93 executes the following control to prevent interference between the height sensor 8a and the height sensor 8b.

[0027] FIG. 3 is a diagram schematically showing the control by the drive control unit for preventing interference of the height sensor. In FIG. 3, an example is shown in which the height of the measurement point Pa is measured by the height sensor 8a and the height of the measurement point Pb is measured by the height sensor 8b. In FIG. 3, different symbols Pa and Pb are assigned to the measurement point Pa measured by the height sensor 8a and the measurement point Pb measured by the height sensor 8b, but when these are not distinguished hereinafter, they are appropriately referred to as the measurement point P.

[0028] The positions in the Y direction (i.e., Y coordinates) of measurement point Pa and measurement point Pb are the same. The drive control unit 93 controls the XY drive mechanism 4 so that the height sensor 8b is positioned on the Yb side of the virtual straight line La parallel to the X direction and separated from the height sensor 8a by a distance d toward the Yb side, and prohibits the height sensor 8b from entering the Ya side of the virtual straight line La. Similarly, the drive control unit 93 controls the XY drive mechanism 4 so that the height sensor 8a is positioned on the Ya side of the virtual straight line Lb parallel to the X direction and separated from the height sensor 8b by a distance d toward the Ya side, and prohibits the height sensor 8a from entering the Yb side of the virtual straight line Lb. Therefore, while the height sensor 8a is facing measurement point Pa from above for measuring the height of measurement point Pa, the height sensor 8b cannot measure measurement point Pb. In other words, while the height sensor 8b is facing measurement point Pb from above for measuring the height of measurement point Pb, the height sensor 8a cannot measure measurement point Pa.

[0029] That is, these measurement points Pa and Pb are measurement points (alternative measurement points) that cannot be measured in parallel. Thus, when measurement point Pb exists in a range where the height sensor 8b cannot enter while the height sensor 8a is measuring the height of measurement point Pa, in other words, when measurement point Pa exists in a range where the height sensor 8a cannot enter while the height sensor 8b is measuring the height of measurement point Pb, the measurement of the heights of these alternative measurement points Pa and Pb is performed sequentially. Specifically, a preceding height sensor that starts measuring the heights of alternative measurement points Pa and Pb first and a subsequent height sensor that starts later are set from among the height sensor 8a and the height sensor 8b. For example, when the height sensor 8a is the preceding height sensor and the height sensor 8b is the subsequent height sensor, the height sensor 8a measures the height of measurement point Pa while facing measurement point Pa. Subsequently, after the height sensor 8a moves to the Ya side to a position that does not interfere with the height sensor 8b facing measurement point Pb, the height sensor 8b measures the height of measurement point Pb while facing measurement point Pb. The same applies when the height sensor 8b is the preceding height sensor and the height sensor 8a is the subsequent height sensor. Subsequently, a specific example of measuring the height of a measurement point by the height sensors 8a and 8b will be described.

[0030] FIG. 4 is a flowchart showing a measurement procedure setting process for setting a measurement procedure of the height of a measurement point, and FIGS. 5A and 5B are diagrams schematically showing a first setting example for setting a measurement procedure of the height of a measurement point.

[0031] As shown in FIG. 5A, on the substrate B, a plurality of measurement points P are two-dimensionally arranged in the X direction and the Y direction. A predetermined number (4) of measurement points P are arranged along the X direction at a position Y1 in the Y direction (i.e., Y coordinate Y1), a predetermined number (4) of measurement points P are arranged along the X direction at a position Y2 on the Ya side of the position Y1, a predetermined number (4) of measurement points P are arranged along the X direction at a position Y3 on the Ya side of the position Y2, and a predetermined number (4) of measurement points P are arranged along the X direction at a position Y4 on the Ya side of the position Y3.

[0032] The measurement procedure setting process in FIG. 4 is defined by a height measurement program 921, and the arithmetic processing unit 91 executes each step of the flowchart in FIG. 4 according to the height measurement program 921. In step S101, the arithmetic processing unit 91 confirms the positions of the respective measurement points P based on measurement point information 922 indicating the positions of the plurality of measurement points P provided on the substrate B.

[0033] In step S102, the arithmetic processing unit 91 sets a measurement point Pa responsible for height measurement by the height sensor 8a and a measurement point Pb responsible for height measurement by the height sensor 8b among the plurality of measurement points P. In the example of FIG. 5A, among the plurality of measurement points P, the measurement points P on the Ya side (the measurement points P located at the position Y3 and the measurement points P located at the position Y4) are set as the measurement point Pa, and the measurement points P on the Yb side (the measurement points P located at the position Y1 and the measurement points P located at the position Y2) are set as the measurement point Pb.

[0034] In step S103, the arithmetic processing unit 91 sets the height measurement procedures for the measurement points Pa and Pb by the height sensors 8a and 8b. This measurement procedure indicates the order in which the height of a plurality of measurement points Pa assigned to the height sensor 8a is measured and the order in which the height of a plurality of measurement points Pb assigned to the height sensor 8b is measured. In FIG. 5B, it is set that the height sensor 8a measures each measurement point Pa in the order indicated by the arrows between the respective measurement points Pa, and it is set that the height sensor 8b measures each measurement point Pb in the order indicated by the arrows between the respective measurement points Pb. In particular, in the example of FIG. 5B, it is set that the height sensor 8a measures in order (in other words, preferentially) from the measurement point Pa on the Yb side, and it is set that the height sensor 8b measures in order (in other words, preferentially) from the measurement point Pb on the Yb side. Therefore, after the height sensor 8a completes the height measurement for each measurement point Pa at the position Y3, the height sensor 8a executes the height measurement for each measurement point Pa at the position Y4 on the Ya side of the position Y3. Also, after the height sensor 8b completes the height measurement for each measurement point Pb at the position Y1, the height sensor 8b executes the height measurement for each measurement point Pb at the position Y2 on the Ya side of the position Y1.

[0035] Note that the height sensor 8a moves within the movement range Ra to measure each measurement point Pa, and the height sensor 8b moves within the movement range Rb to measure each measurement point Pb. In the Y direction, the movement range Ra of the height sensor 8a exists on the Ya side of the movement range Rb of the height sensor 8b, and the end Eab on the Yb side of the movement range Ra of the height sensor 8a is on the Ya side of the end Eba on the Ya side of the movement range Rb of the height sensor 8b. Therefore, interference does not occur between the height sensor 8a moving within the movement range Ra and the height sensor 8b moving within the movement range Rb. That is, there is no alternative measurement point P.

[0036] FIG. 6A and FIG. 6B are diagrams schematically showing a second setting example for setting the measurement procedure of the height of measurement points. As shown in FIG. 6A, on the substrate B, a plurality of measurement points P are two-dimensionally arranged in the X direction and the Y direction. A predetermined number (5) of measurement points P are arranged along the X direction at the position Y1 (i.e., the Y coordinate Y1) in the Y direction, a predetermined number (4) of measurement points P are arranged along the X direction at the position Y2 on the Ya side of the position Y1, and a predetermined number (5) of measurement points P are arranged along the X direction at the position Y3 on the Ya side of the position Y2.

[0037] In step S102, as shown in FIG. 6A, the arithmetic processing unit 91 sets the measurement point Pa to be in charge of the height sensor 8a and the measurement point Pb to be in charge of the height sensor 8b. That is, all (5) of the measurement points P located at the position Y3 and a part (2) of the measurement points P on one side (right side) in the X direction of the measurement points P located at the position Y2 are set as the measurement point Pa, and all (5) of the measurement points P located at the position Y1 and a part (2) of the measurement points P on the other side (left side) in the X direction of the measurement points P located at the position Y2 are set as the measurement point Pb.

[0038] Therefore, both the moving range Ra where the height sensor 8a moves for measuring the height of the measurement point Pa and the moving range Rb where the height sensor 8b moves for measuring the height of the measurement point Pb overlap at the position Y2 in the Y direction. That is, in the Y direction, the moving range Ra of the height sensor 8a exists on the Ya side of the moving range Rb of the height sensor 8b, and the end Eab on the Yb side of the moving range Ra of the height sensor 8a is on the Yb side of the end Eba on the Ya side of the moving range Rb of the height sensor 8b. Therefore, in the overlapping range Ro between the end Eab and the end Eba in the Y direction, the height sensor 8a and the height sensor 8b cannot enter simultaneously, and only one of them can enter the overlapping range Ro.

[0039] In step S103, the arithmetic processing unit 91 sets the height measurement procedures for the measurement points Pa and Pb by the height sensors 8a and 8b. In the example of FIG. 6B, it is set that the height sensor 8a measures in order (in other words, preferentially) from the measurement point Pa on the Yb side, and the height sensor 8b measures in order (in other words, preferentially) from the measurement point Pb on the Yb side. Therefore, after the height sensor 8a completes the height measurement for each measurement point Pa at position Y2, it executes the height measurement for each measurement point Pa at position Y3 on the Ya side of position Y2. Also, after the height sensor 8b completes the height measurement for each measurement point Pb at position Y1, it executes the height measurement for each measurement point Pb at position Y2 on the Ya side of position Y1.

[0040] In this way, among the height sensor 8a and the height sensor 8b, it is set that the height sensor 8a (the preceding height sensor) measures the height of the measurement point Pa within the overlapping range Ro first, and the height sensor 8b (the subsequent height sensor) measures the height of the measurement point Pb within the overlapping range Ro later. Therefore, during the period when the height sensor 8a is measuring the height of the measurement point Pa within the overlapping range Ro, the height sensor 8b is measuring the measurement point Pb at position Y1, so it is located on the Yb side of the overlapping range Ro. And after the height sensor 8a completes the measurement of the height of the measurement point Pa within the overlapping range Ro and starts the measurement of the height of the measurement point Pa at position Y3, the height sensor 8b starts the measurement of the height of the measurement point Pb within the overlapping range Ro. That is, during the period when the height sensor 8b is measuring the height of the measurement point Pa within the overlapping range Ro, the height sensor 8a is measuring the measurement point Pa at position Y3, so it is located on the Ya side of the overlapping range Ro.

[0041] In the embodiments described above, in the Y direction, when the end Eab on the Yb side (second side) of the movement range Ra (first movement range) in which the height sensor 8a (first height measurement unit) moves to measure the measurement point Pa is located on the Yb side of the end Eba on the Ya side (first side) of the movement range Rb (second movement range) in which the height sensor 8b (second height measurement unit) moves to measure the measurement point Pb (that is, when the overlapping range Ro shown in the second example exists), the following measurement procedure is set for the measurement point P within the overlapping range Ro between the end Eab on the Yb side of the movement range Ra and the end Eba on the Ya side of the movement range Rb in the Y direction. That is, it is set that the height sensor 8a (first height measurement unit) starts measuring the height of the measurement point P within the overlapping range Ro first, and then the height sensor 8b (second height measurement unit) starts later (step S103). And the measurement procedure is set so that the height of the measurement point Pa on the Yb side (measurement point Pa at position Y2) among the measurement points Pa for which the height sensor 8a is responsible is measured first (step S103). Therefore, within the overlapping range Ro, the height measurement by the height sensor 8a of the measurement point Pa closest to the height sensor 8b is completed early, and the height measurement by the height sensor 8b of the measurement point Pb (measurement point Pb at position Y2) near the measurement point Pa becomes possible. As a result, it is possible to shorten the period during which the height sensor 8b waits to measure the height of the measurement point Pb. In this way, when the existence ranges of the measurement points Pa and Pb for which the two height sensors 8a and 8b are each responsible for height measurement protrude and overlap each other in the Y direction, it becomes possible to efficiently measure the height of all the measurement points P on the substrate B (workpiece).

[0042] Also, in the example of FIG. 6B, the measurement points Pa responsible for the height sensor 8a (first height measurement unit) include the measurement points Pa within the overlapping range Ro and the measurement points Pa at the position Y3 (non-overlapping leading range) outside the overlapping range Ro. In contrast, the height sensor 8a starts measuring the height of the measurement points Pa at the position Y3 after finishing measuring the height of the measurement points Pa within the overlapping range Ro. Also, the measurement points Pb responsible for the height sensor 8b (second height measurement unit) include the measurement points Pb within the overlapping range Ro and the measurement points Pb at the position Y1 (non-overlapping trailing range) outside the overlapping range Ro. In contrast, the height sensor 8b starts measuring the height of the measurement points Pb within the overlapping range Ro after finishing measuring the height of the measurement points Pb at the position Y1. With such a configuration, the height measurement of the measurement points Pb at the position Y1 by the height sensor 8b can be executed in parallel with the height measurement of the measurement points Pa within the overlapping range Ro by the height sensor 8a. Also, the height measurement of the measurement points Pb within the overlapping range Ro by the height sensor 8b can be executed in parallel with the height measurement of the measurement points Pa at the position Y3 by the height sensor 8a. As a result, it is possible to more efficiently measure the height of all the measurement points P on the substrate B.

[0043] Further, the control unit 9 sets the measurement procedure so that the number of measurement points Pa for which the height sensor 8a is responsible for height measurement increases as it goes toward the Ya side, and sets the measurement procedure so that the number of measurement points Pb for which the height sensor 8b is responsible for height measurement decreases as it goes toward the Ya side. With such a configuration, it is possible to suppress the occurrence of standby of the height sensor 8b (second height measurement unit) and more efficiently measure the height of all the measurement points P on the substrate B.

[0044] Figures 7A and 7B are diagrams schematically showing a third setting example for setting the measurement procedure of the height of the measurement points. As shown in FIG. 7A, the arrangement of the measurement points P on the substrate B is the same as in the example of FIG. 6A. However, there are limitations to the ranges that the height sensors 8a and 8b can measure. That is, as shown in FIG. 1, the height sensor 8a is provided offset to one side (right side) in the X direction with respect to the mounting head 3a, and the height sensor 8b is provided offset to the other side (left side) in the Z direction with respect to the mounting head 3b. On the other hand, if the movable ranges of the mounting head 3a and the mounting head 3b are narrow, it may not be possible to move the height sensor 8a to the position Xl at the other end (left end) in the X direction, and there may be a case where it is not possible to move the height sensor 8b to the position Xr at one end (right end) in the X direction.

[0045] Therefore, in step S102, as shown in FIG. 7A, the arithmetic processing unit 91 sets the measurement points Pa to be handled by the height sensor 8a and the measurement points Pb to be handled by the height sensor 8b. That is, among the measurement points P located at position Y3, a part (4) of the measurement points P located on one side of the position Xl at the other end in the X direction are set as the measurement points Pa, among the measurement points P located at position Y2, a part (2) of the measurement points P on one side in the X direction are set as the measurement points Pa, and among the measurement points P located at position Y1, a part (1) of the measurement points P located at the position Xr at one end in the X direction are set as the measurement points Pa. Also, among the measurement points P located at position Y1, a part (4) of the measurement points P located on the other side of the position Xr at one end in the X direction are set as the measurement points Pb, among the measurement points P located at position Y2, a part (2) of the measurement points P on the other side in the X direction are set as the measurement points Pb, and among the measurement points P located at position Y3, a part (1) of the measurement points P located at the position Xl at the other end in the X direction are set as the measurement points Pb.

[0046] Therefore, both the movement range Ra in which the height sensor 8a moves for measuring the height of the measurement point Pa and the movement range Rb in which the height sensor 8b moves for measuring the height of the measurement point Pb overlap the positions Y1, Y2, and Y3 in the Y direction. That is, in the Y direction, the movement range Ra of the height sensor 8a exists on the Ya side of the movement range Rb of the height sensor 8b, and the end Eab on the Yb side of the movement range Ra of the height sensor 8a is on the Yb side of the end Eba on the Ya side of the movement range Rb of the height sensor 8b. Also, in the Y direction, the end Eaa on the Ya side of the movement range Ra of the height sensor 8a coincides with the end Eba on the Ya side of the movement range Rb of the height sensor 8b, and the end Eab on the Yb side of the movement range Ra of the height sensor 8a coincides with the end Ebb on the Yb side of the movement range Rb of the height sensor 8b. Thus, all the measurement points Pa and all the measurement points Pb are included in the overlapping range Ro between the end Eab and the end Eba in the Y direction, and in this overlapping range Ro, interference between the height sensor 8a and the height sensor 8b may occur.

[0047] Therefore, in step S103, the arithmetic processing unit 91 sets the measurement procedure for the heights of the measurement points Pa and Pb by the height sensors 8a and 8b. That is, the arithmetic processing unit 91 sets that among the height sensor 8a and the height sensor 8b, the height sensor 8a (the preceding height sensor) starts the measurement of the height of the measurement point Pa within the overlapping range Ro first, and the height sensor 8b (the following height sensor) starts the measurement of the height of the measurement point Pb within the overlapping range Ro later. Also, as shown in the example of FIG. 7B, the arithmetic processing unit 91 sets that the height sensor 8a measures in order (in other words, preferentially) from the measurement point Pa on the Yb side, and the height sensor 8b measures in order (in other words, preferentially) from the measurement point Pb on the Yb side. Therefore, after the height sensor 8a completes the height measurement for the measurement point Pa at the position Y1, it executes the height measurement for each measurement point Pa at the position Y2 on the Ya side of the position Y1, and after completing the height measurement for each measurement point Pa at the position Y2, it executes the height measurement for each measurement point Pa at the position Y3 on the Ya side of the position Y2. Also, after the height sensor 8b completes the height measurement for the measurement point Pb at the position Y1, it executes the height measurement for each measurement point Pb at the position Y2 on the Ya side of the position Y1, and after completing the height measurement for each measurement point Pb at the position Y2, it executes the height measurement for each measurement point Pb at the position Y3 on the Yb side of the position Y2.

[0048] At this time, as described above, the height sensor 8a starts measuring the measurement point P within the overlapping range Ro earlier than the height sensor 8b. Therefore, during the period when the height sensor 8a is measuring the measurement point Pa at the position Y1 on the Yb side of the overlapping range Ro, the height sensor 8b cannot enter the overlapping range Ro and waits on the Yb side of the overlapping range Ro. Then, after the height sensor 8a completes the measurement of the height of the measurement point Pa at the position Y1 and starts measuring the height of the measurement point Pa at the position Y2, the height sensor 8b starts measuring the height of the measurement point Pb at the position Y1. Also, during the period when the height sensor 8a is measuring the measurement point Pa at the position Y2, the height sensor 8b does not enter the position Y2 and measures the height of the measurement point Pb at the position Y1. Then, after the height sensor 8a completes the measurement of the height of each measurement point Pa at the position Y2 and starts measuring the height of the measurement point Pa at the position Y3, the height sensor 8b starts measuring the height of the measurement point Pb at the position Y2. Also, during the period when the height sensor 8a is measuring the measurement point Pa at the position Y3, the height sensor 8b does not enter the position Y3 and measures the height of the measurement point Pb at the position Y1 or the position Y2. Then, after the height sensor 8a completes the measurement of the height of each measurement point Pa at the position Y3 and retreats to the Ya side from the position Y3, the height sensor 8b starts measuring the height of the measurement point Pb at the position Y3.

[0049] In the third setting example described above, in the Y direction, when the end Eab on the Yb side (second side) of the movement range Ra (first movement range) in which the height sensor 8a (first height measurement unit) moves to measure the measurement point Pa is located on the Yb side of the end Eba on the Ya side (first side) of the movement range Rb (second movement range) in which the height sensor 8b (second height measurement unit) moves to measure the measurement point Pb (that is, when there is an overlapping range Ro shown in the third example), the following measurement procedure is set for the measurement point P within the overlapping range Ro between the end Eab on the Yb side of the movement range Ra and the end Eba on the Ya side of the movement range Rb in the Y direction. That is, it is set that the height sensor 8a (first height measurement unit) starts measuring the height of the measurement point P within the overlapping range Ro first, and then the height sensor 8b (second height measurement unit) starts later (step S103). And the measurement procedure is set so that the height of the measurement point Pa on the Yb side (measurement point Pa at position Y2) among the measurement points Pa for which the height sensor 8a is responsible is measured first (step S103). Therefore, within the overlapping range Ro, the height measurement by the height sensor 8a of the measurement point Pa closest to the height sensor 8b is completed early, and the height measurement by the height sensor 8b of the measurement point Pb (measurement point Pb at position Y1) near the measurement point Pa becomes possible. As a result, it is possible to shorten the period during which the height sensor 8b waits to measure the height of the measurement point Pb. In this way, when the existence ranges of the measurement points Pa and Pb for which the two height sensors 8a and 8b are each responsible for height measurement protrude and overlap with each other in the Y direction, it becomes possible to efficiently measure the height of all the measurement points P on the substrate B (workpiece).

[0050] Further, the control unit 9 sets the measurement procedure so that the height sensors 8a (first height measurement units) measure the measurement points Pa located within the overlapping range Ro among the measurement points Pa for which the height sensors 8a are responsible, in order from the measurement points Pa on the Yb side (second side) where the height sensor 8b is located with respect to the height sensor 8a. Also, the control unit 9 sets the measurement procedure so that the height sensors 8b (second height measurement units) measure the measurement points Pb located within the overlapping range Ro among the measurement points Pb for which the height sensors 8b are responsible, in order from the measurement points Pb on the Yb side. With such a configuration, the height sensors 8a measure the heights of the measurement points within the overlapping range Ro in order from the Yb side closer to the height sensor 8b. Therefore, the height sensor 8b can start measuring the height of the measurement point Pb earlier and can execute the measurement of the height of the measurement point Pb while chasing the height sensor 8a that advances the measurement of the height of the measurement point Pa from the Yb side toward the Ya side (first side). As a result, it is possible to more efficiently measure the heights of all the measurement points P on the substrate B.

[0051] Also, the control unit 9 sets the measurement procedure so that the number of measurement points Pa for which the height sensor 8a is responsible for height measurement increases as it goes toward the Ya side, and sets the measurement procedure so that the number of measurement points Pb for which the height sensor 8b is responsible for height measurement decreases as it goes toward the Ya side. With such a configuration, it is possible to suppress the occurrence of standby of the height sensor 8b (second height measurement unit) and more efficiently measure the heights of all the measurement points P on the substrate B.

[0052] FIG. 8 is a flowchart showing substrate production executed by the component mounter, and FIG. 9 is a timing chart showing the operations executed according to the flowchart of FIG. 8. The flowchart of FIG. 8 is defined by the height measurement program 921 and is executed based on the control of the arithmetic processing unit 91 according to the height measurement program 921.

[0053] In step S201 of FIG. 8, the conveyor 21 conveys the substrate B to the working position. As a result, as shown in FIG. 9, the substrate B is conveyed to the working position at times t1 to t2. In step S202, a measurement procedure setting process for setting the measurement procedure for measuring the measurement points P of the substrate B conveyed to the working position is executed (FIG. 4).

[0054] In step S203, the arithmetic processing unit 91 determines whether each of the height sensor 8a and the height sensor 8b can start measuring the measurement points Pa and Pb. For example, in cases such as the first setting example in FIGS. 5A and 5B and the second setting example in FIGS. 6A and 6B, both the height sensors 8a and 8b can start measuring the heights of the measurement points Pa and Pb simultaneously. Therefore, it is determined that the measurements can be started for both the height sensors 8a and 8b (step S203, "YES"). Accordingly, the height sensor 8a starts measuring the height of the measurement point Pa, and the height sensor 8b starts measuring the height of the measurement point Pb (step S204).

[0055] When the measurements of the heights of the measurement points Pa and Pb are completed, the mounting heads 3a and 3b adsorb the component E from the component supply units 5a and 5b (step S205), recognize the component E by the component recognition cameras 6a and 6b (step S206), and mount the component E on the substrate B (step S207) in the above-described manner. Steps S205 to S207 are repeated until the mounting of all the components E on the substrate B is completed (until "YES" in step S208). When the mounting of all the components E on the substrate B is completed (step S208, "YES"), the arithmetic processing unit 91 determines whether the substrate B can be unloaded from the working position (step S209). Then, when it is determined that the substrate B can be unloaded (step S210), the conveyor 21 unloads the substrate B.

[0056] On the other hand, in the case of the third setting example such as FIGS. 7A and 7B, during the period from when the height sensor 8a finishes measuring the height of the measurement point Pa at position Y1 until it moves to position Y2, the height sensor 8b cannot start measuring the measurement point Pb and waits. Therefore, in step S203, it is determined that the height sensor 8a can start measurement, while it is determined that the height sensor 8b cannot start measurement. For this reason, the height sensor 8a starts measuring the height of the measurement point Pa at time t3, while the height sensor 8b does not start measuring the height of the measurement point Pb during the period from time t3 to t4. Then, when the height sensor 8a finishes measuring the height of the measurement point Pa at position Y1 and moves to position Y2, it is determined that the height sensor 8b can start measuring the measurement point Pb (''YES'' in step S203), and the height sensor 8b starts measuring the height of the measurement point Pb at time t4. Then, the measurement of the height of the measurement point Pa by the height sensor 8a is completed at time t5, and the measurement of the height of the measurement point Pb by the height sensor 8b is completed at time t6, which is later than time t5.

[0057] Thus, when the measurement of the heights of the measurement points Pa and Pb is completed, the mounting head 3a performs suction of the component E from the component supply unit 5a (step S205), recognition of the component E by the component recognition camera 6a (step S206), and mounting of the component E on the substrate B (step S207) at times t7 to t8. Also, the mounting head 3b performs suction of the component E from the component supply unit 5b (step S205), recognition of the component E by the component recognition camera 6b (step S206), and mounting of the component E on the substrate B (step S207) at times t7 to t9. Then, when the mounting of all the components E is completed at time t9 (''YES'' in step S208) and the substrate B can be unloaded (''YES'' in step S209), the conveyor 21 unloads the substrate B at times t10 to t11 (step S210).

[0058] Note that, even when a measurement procedure is set as in the first setting example of FIGS. 5A and 5B, the second setting example of FIGS. 6A and 6B, etc., there may be cases where the measurement of the height of the measurement point Pa by the height sensor 8a and the measurement of the height of the measurement point Pb by the height sensor 8b cannot be started simultaneously. For example, if there is a difference in the time required for changing the suction nozzles by the nozzle changers 7a and 7b to the mounting heads 3a and 3b, which is executed before the start of the height measurement, the measurements by the height sensors 8a and 8b cannot be started simultaneously. In one case, a "YES" determination is made in step S203 for one of them, and a "NO" determination is made in step S203 for the other. Also, if for reasons other than the replacement of the suction nozzles, these measurements cannot be started simultaneously, the same determination is made in step S203.

[0059] FIG. 10 is a plan view schematically showing a case where the measurement of the height cannot be started simultaneously in a dual-lane component mounter. In the component mounter 1 of FIG. 10, two substrate transfer units 2a and 2b are provided in parallel. And, among the substrate transfer unit 2a and the substrate transfer unit 2b, the mounting of the component E is performed first on the substrate Bb carried in by the substrate transfer unit 2b. Also, the mounting of the component E on the substrate Bb is performed by both the mounting head 3a and the mounting head 3b. And, among the mounting head 3a and the mounting head 3b, the mounting head 3a finishes the mounting on the substrate Bb first. After the mounting head 3a finishes the mounting, the mounting head 3b mounts the component E on the unmounted portion F shown by the dashed line in FIG. 10. Therefore, for the measurement point P of the substrate Ba carried in by the substrate transfer unit 2a, the height sensor 8a can start the height measurement earlier than the height sensor 8b. In other words, for the measurement point P of the substrate Ba, the height sensors 8a and 8b cannot start the height measurement simultaneously.

[0060] FIGS. 11A and 11B are diagrams schematically showing a fourth setting example for setting the measurement procedure of the height of the measurement point. As shown in FIG. 11A, the arrangement of the measurement points P on the substrate B is the same as in the example of FIG. 7A. Also, the same applies to the point that there are limitations on the ranges that the height sensor 8a and the height sensor 8b can measure.

[0061] In the fourth setting example, according to the difference between the timing at which the height sensor 8a can start measuring the measurement point P and the timing at which the height sensor 8b can start measuring the measurement point P, the number of measurement points P for which the height sensor 8a is responsible for measurement and the number of measurement points P for which the height sensor 8b is responsible for measurement are set (step S102). For example, when the height sensor 8a can start measurement earlier than the height sensor 8b, the height sensor 8a is set as the preceding height sensor and the height sensor 8b is set as the subsequent height sensor. And, the greater the difference between the timing at which the height sensor 8a starts measurement and the timing at which the height sensor 8b starts measurement, the greater the number of measurement points Pa for which the height sensor 8a is responsible for measurement is increased, and the number of measurement points Pb for which the height sensor 8b is responsible for measurement is decreased. As a result, in the example of FIG. 11B, the number of measurement points Pa for which the height sensor 8a is responsible is 9, which is more than the 5 measurement points Pb for which the height sensor 8b is responsible.

[0062] Specifically, a part (4) of the measurement points P located on one side of the position Xl at the other end in the X direction among the measurement points P located at the position Y3, a part (4) of the measurement points P located on one side of the position Xl at the other end in the X direction among the measurement points P located at the position Y2, and a part (1) of the measurement points P located at the position Xr at one end in the X direction among the measurement points P located at the position Y1 are set as the measurement points Pa. Also, a part (4) of the measurement points P located on the other side of the position Xr at one end in the X direction among the measurement points P located at the position Y1 and a part (1) of the measurement points P located at the position Xl at the other end in the X direction among the measurement points P located at the position Y3 are set as the measurement points Pb. Also in this example, all the measurement points Pa and all the measurement points Pb are included in the overlapping range Ro between the end Eab and the end Eba in the Y direction, and in this overlapping range Ro, interference between the height sensor 8a and the height sensor 8b can occur.

[0063] Therefore, in step S103, the arithmetic processing unit 91 sets the measurement procedure for the heights of the measurement points Pa and Pb by the height sensors 8a and 8b. That is, the arithmetic processing unit 91 sets that among the height sensors 8a and 8b, the height sensor 8a (preceding height sensor) measures the height of the measurement point Pa within the overlapping range Ro first, and the height sensor 8b (subsequent height sensor) measures the height of the measurement point Pb within the overlapping range Ro later. Also, as shown in the example of FIG. 11B, the arithmetic processing unit 91 sets that the height sensor 8a measures in order (in other words, preferentially) from the measurement point Pa on the Yb side, and the height sensor 8b measures in order (in other words, preferentially) from the measurement point Pb on the Yb side. Therefore, after the height sensor 8a completes the height measurement for the measurement point Pa at position Y1, it executes the height measurement for each measurement point Pa at position Y2 on the Ya side of position Y1. After completing the height measurement for each measurement point Pa at position Y2, it executes the height measurement for each measurement point Pa at position Y3 on the Ya side of position Y2. Also, after the height sensor 8b completes the height measurement for each measurement point Pb at position Y1, it executes the height measurement for the measurement point Pb at position Y3 on the Ya side of position Y1.

[0064] At this time, as described above, the height sensor 8a starts measuring the measurement point P within the overlapping range Ro earlier than the height sensor 8b. Therefore, during the period when the height sensor 8a measures the measurement point Pa at the position Y1 at the Yb-side end of the overlapping range Ro, the height sensor 8b cannot enter the overlapping range Ro and waits on the Yb side of the overlapping range Ro. Then, after the height sensor 8a completes the height measurement for the measurement point Pa at position Y1 and starts the height measurement for the measurement point Pa at position Y2, the height sensor 8b starts measuring the height of the measurement point Pb at position Y1. Also, during the period when the height sensor 8a measures the measurement point Pa at position Y2, the height sensor 8b does not enter position Y2 and measures the height of the measurement point Pb at position Y1. Also, during the period when the height sensor 8a measures the measurement point Pa at position Y3, the height sensor 8b does not enter position Y3, and after the height sensor 8a completes the height measurement for each measurement point Pa at position Y3 and retreats to the Ya side of position Y3, the height sensor 8b starts measuring the height of the measurement point Pb at position Y3.

[0065] In the fourth embodiment described above, by executing the control common to the third setting example, similar effects can be obtained, and the following effects can be further obtained. That is, the control unit 9 sets the number of measurement points Pb for which the height sensor 8a (first height measurement unit) is responsible for measurement and the number of measurement points Pb for which the height sensor 8b (second height measurement unit) is responsible for measurement according to the time from when the height sensor 8a (first height measurement unit) starts measuring the measurement point Pa to when the height sensor 8b (second height measurement unit) starts measuring the measurement point Pb. With such a configuration, it is possible to suppress the deviation in the time when each of the height sensor 8a and the height sensor 8b finishes measuring the heights of the measurement points Pa and Pb, and efficiently measure the heights of all the measurement points P on the substrate B.

[0066] As described above, in the present embodiment, the X motor 43 and the mover 451 attached to the X beam 41a correspond to an example of the "first drive unit" of the present invention, the X motor 43 and the mover 451 attached to the X beam 41b correspond to an example of the "second drive unit" of the present invention, the height sensor 8a corresponds to an example of the "first height measurement unit" of the present invention, the height sensor 8b corresponds to an example of the "second height measurement unit" of the present invention, the control unit 9 corresponds to an example of the "control unit" of the present invention, the arithmetic processing unit 91 corresponds to an example of the "computer" of the present invention, the storage unit 92 corresponds to an example of the "recording medium" of the present invention, the height measurement program 921 corresponds to an example of the "height measurement program" of the present invention, the Ya side corresponds to an example of the "first side" of the present invention, the Yb side corresponds to an example of the "second side" of the present invention, the measurement points P, the measurement point Pa, and the measurement point Pb correspond to an example of the "measurement point" of the present invention, the movement range Ra corresponds to an example of the "first movement range" of the present invention, the movement range Rb corresponds to an example of the "second movement range" of the present invention, the overlapping range Ro corresponds to an example of the "overlapping range" of the present invention, and the component mounter 1 corresponds to an example of the "height measurement device" of the present invention.

[0067] Note that the present invention is not limited to the above-described embodiments, and various modifications can be made to the above-described embodiments without departing from the spirit thereof. That is, in the above example, the height sensor 8a is set first and the height sensor 8b is set later, but there can naturally be a case where the height sensor 8b is set first and the height sensor 8a is set later. In the latter case, the height sensor 8b corresponds to an example of the "first height measurement unit" of the present invention, and the height sensor 8a corresponds to an example of the "second height measurement unit" of the present invention.

[0068] Also, the execution timing of the measurement procedure setting process is not limited to the example of the flowchart in FIG. 8. Therefore, before loading the substrate B, the measurement procedure setting process for the substrate B may be executed in advance.

[0069] In addition, the control for adjusting the number of individuals in charge of measurement according to the difference in the timing at which the measurement described in the fourth setting example of FIGS. 11A and 11B can be started can also be applied to the first setting example shown in FIGS. 5A and 5B and the second setting example shown in FIGS. 6A and 6B.

[0070] Also, the specific example of the device that functions as the height measuring device is not limited to the component mounter, and it may be a dispenser that applies an adhesive to the substrate.

[0071] Also, the specific object of the height measurement is not limited to the substrate B.

[0072] Also, although the provision mode of the height measurement program 921 has not been particularly described, for example, the height measurement program 921 may be downloaded from a server to the storage unit 92. In this case, the server corresponds to the "recording medium" of the present invention.

Explanation of Reference Numerals

[0073] 1... Component mounter 4... Driving mechanism 8a... Height sensor 8b... Height sensor 9... Control unit 91... Arithmetic processing unit 92... Storage unit 921… Height measurement program P… Measurement point Pa… Measurement point Pb… Measurement point Ra… Movement range Rb… Movement range Ro… Overlap range

Claims

1. A first height measurement unit that is movable in the X direction and in the Y direction orthogonal to the X direction, and measures the height of the measurement points of a workpiece provided with a plurality of measurement points while facing the measurement points; A second height measurement unit that is movable in the X direction and in the Y direction, and measures the height of the measurement points of the workpiece while facing the measurement points; A first drive unit that moves the first height measurement unit in the X direction and in the Y direction on the first side of the Y direction from the second height measurement unit; A second drive unit that moves the second height measurement unit in the X direction and in the Y direction on the second side opposite to the first side of the Y direction from the first height measurement unit; Among the plurality of measurement points, a control unit that sets the measurement points responsible for height measurement by the first height measurement unit and the measurement points responsible for height measurement by the second height measurement unit, and sets a measurement procedure indicating the procedure for measuring the height of the measurement points responsible for the first height measurement unit and the procedure for measuring the height of the measurement points responsible for the second height measurement unit Comprising: In the Y direction, when the end on the second side of the first movement range in which the first height measurement unit moves to measure the measurement point is located on the second side from the end on the first side of the second movement range in which the second height measurement unit moves to measure the measurement point, The control unit starts the first height measurement unit to measure the height of the measurement points within the overlapping range between the end on the second side of the first movement range and the end on the first side of the second movement range in the Y direction first, and then the second height measurement unit starts later, and sets the measurement procedure so that the height of the measurement point on the most second side among the measurement points responsible for the first height measurement unit is measured first. A height measuring device.

2. The measurement points responsible for the first height measurement unit include the measurement points within the overlapping range and the measurement points within the non-overlapping preceding range outside the overlapping range. After finishing measuring the height of the measurement points within the overlapping range, the first height measurement unit starts measuring the height of the measurement points within the non-overlapping preceding range. The measurement points responsible for the second height measurement unit include the measurement points within the overlapping range and the measurement points within the non-overlapping subsequent range outside the overlapping range. After finishing measuring the height of the measurement points within the non-overlapping subsequent range, the second height measurement unit starts measuring the height of the measurement points within the overlapping range. The height measuring device according to Claim 1.

3. The control unit sets the measurement procedure so as to execute the measurement of the measurement points located within the overlapping range among the measurement points for which the first height measurement unit is responsible, in order from the measurement points on the second side in the Y direction, and sets the measurement procedure so as to execute the measurement of the measurement points located within the overlapping range among the measurement points for which the second height measurement unit is responsible, in order from the measurement points on the second side. The height measurement device according to claim 2.

4. The control unit sets the measurement procedure so that the number of measurement points for which the first height measurement unit is responsible for height measurement increases as it goes toward the first side, and sets the measurement procedure so that the number of measurement points for which the second height measurement unit is responsible for height measurement decreases as it goes toward the first side. The height measurement device according to any one of claims 1 to 3.

5. The control unit sets the number of measurement points for which the first height measurement unit is responsible for measurement and the number of measurement points for which the second height measurement unit is responsible for measurement according to the time from when the first height measurement unit starts measuring the measurement points to when the second height measurement unit starts measuring the measurement points. The height measurement device according to claim 1.

6. A step of setting, from among the plurality of measurement points, the measurement points for which a first height measurement unit that is movable in the X direction and in a Y direction orthogonal to the X direction and that measures the height of the measurement points while facing the measurement points of a workpiece provided with the plurality of measurement points is responsible for height measurement; A step of setting, from among the plurality of measurement points, the measurement points for which a second height measurement unit that is movable in the X direction and in the Y direction and that measures the height of the measurement points while facing the measurement points of the workpiece is responsible for height measurement; A step of setting a measurement procedure indicating the procedure for measuring the height of the measurement points for which the first height measurement unit is responsible and the procedure for measuring the height of the measurement points for which the second height measurement unit is responsible; A step of moving the first height measurement unit on the first side in the Y direction from the second height measurement unit and causing the first height measurement unit to measure the height of the measurement points for which it is responsible according to the measurement procedure; A step of moving the second height measurement unit on the second side, which is the opposite of the first side in the Y direction from the first height measurement unit, and causing the second height measurement unit to measure the height of the measurement points for which it is responsible according to the measurement procedure and comprising In the Y direction, when the end on the second side of the first movement range in which the first height measurement unit moves to measure the measurement point is located on the second side of the end on the first side of the second movement range in which the second height measurement unit moves to measure the measurement point, the first height measurement unit starts measuring the height of the measurement point within the overlapping range between the end on the second side of the first movement range and the end on the first side of the second movement range in the Y direction first, and then the second height measurement unit starts measuring later. Further, the measurement procedure is set such that the height of the measurement point on the second side among the measurement points for which the first height measurement unit is responsible is measured first. A height measurement method.

7. A height measurement program for causing a computer to execute the height measurement method according to claim 6.

8. A recording medium on which the height measurement program according to claim 7 is recorded in a computer-readable manner.

Citation Information

Patent Citations

  • Height measuring device, height measuring method, and substrate working device

    JP6928527B2