Pickup system, joint device, and information processing method

Abstract

To provide a pickup system capable of properly handling parts.SOLUTION: A pickup system 100 is a system for picking up a chip 6a in a non-contact manner, and includes: a pickup unit 14 including a pickup nozzle 14a having a suction hole 14c for sucking the chip 6a, and an ultrasonic wave generating part 152a for vibrating the pickup nozzle 14a to generate ultrasonic waves from the pickup nozzle 14a, the pickup unit 14 being configured to output a detection signal according to the vibration of the pickup nozzle 14a; and a control part 101 that specifies an operation state related to pickup of the chip 6a by the pickup unit 14 based on the detection signal.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a system for picking up components, etc.

Background Art

[0002] For the high functionality of semiconductor packages, hybrid bonding without using bumps, bonding materials, etc. is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or the like using hydrogen bonds or the like with the surface of the semiconductor chip being cleaned. Therefore, in hybrid bonding, it is necessary to keep the surface of the semiconductor chip highly clean from the time when the semiconductor chip is picked up from the dicing tape, which is an adhesive sheet, until the semiconductor chip is bonded.

[0003] Conventionally, a chip holding device that non - contactingly holds a semiconductor chip pushed up from under the dicing tape using a chip holder, and a manufacturing device having such a chip holding device have been proposed (see, for example, Patent Document 1). Such a chip holder is also called a nozzle or a pickup nozzle, and the chip holding device and the manufacturing device are also called a pickup system equipped with a pickup unit. Further, since the manufacturing device bonds a semiconductor chip as a component to a substrate, it is also called a bonding device. The chip holding device of Patent Document 1 non - contactingly holds a semiconductor chip pushed up from under the dicing tape using ultrasonic waves and suction force.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the chip holding device (i.e., pickup system) of Patent Document 1 described above, there is a problem that semiconductor chips as components may be inappropriately handled.

[0006] Therefore, the present disclosure provides a pickup system and the like that can appropriately handle components.

Means for Solving the Problem

[0007] A pickup system according to an aspect of the present disclosure is a pickup system for non - contact pickup of components, including a nozzle having a suction hole for sucking the components, a sound wave generating unit that vibrates the nozzle to generate sound waves from the nozzle, a pickup unit that outputs a detection signal corresponding to the vibration of the nozzle, and a control unit that specifies an operating state regarding the pickup of the components by the pickup unit based on the detection signal.

[0008] These general or specific aspects may be implemented by an apparatus or a method, or may be implemented by any combination of a system, an apparatus, and a method.

Effect of the Invention

[0009] The pickup system of the present disclosure can appropriately handle components.

[0010] Furthermore, additional advantages and effects in an aspect of the present disclosure will be clarified from the specification and the drawings. Such advantages and / or effects are provided by some embodiments and the configurations described in the specification and the drawings, but not all configurations are necessarily required.

Brief Description of the Drawings

[0011]

Figure 1

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Figure 4B

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Figure 13

BEST MODE FOR CARRYING OUT THE INVENTION

[0012] The inventor of the present invention has found that the following problems occur with respect to the chip holding device of Patent Document 1 described in the "Background Art" section. The chip holding device of Patent Document 1 picks up a semiconductor chip using a chip holder provided with suction holes. That is, the semiconductor chip is attracted to the chip holder by the suction of air from the suction holes of the chip holder. On the other hand, due to the ultrasonic squeeze effect, a force acts on the semiconductor chip to pull the semiconductor chip away from the chip holder. As a result, the semiconductor chip is held in a non-contact manner by the chip holder. However, in the chip holding device of Patent Document 1, actually, the operating state of the chip holder, such as whether the semiconductor chip is held by the chip holder, not held, or in what state it is held, has not been confirmed. Therefore, in any operating state, the chip holding device may proceed with the processing of the semiconductor chip. As a result, the semiconductor chip may be inappropriately handled.

[0013] In order to solve such problems, a pickup system according to a first aspect of the present disclosure is a pickup system for picking up parts in a non-contact manner, including a nozzle having suction holes for sucking the parts, and a sound wave generation unit that vibrates the nozzle to generate sound waves from the nozzle, a pickup unit that outputs a detection signal corresponding to the vibration of the nozzle, and a control unit that specifies an operating state regarding the pickup of the parts by the pickup unit based on the detection signal. Note that the nozzle is also called a pickup nozzle. Also, the sound wave is a sound wave used in a broad sense and may be an ultrasonic wave. When the sound wave is an ultrasonic wave, the sound wave generation unit is also called an ultrasonic wave generation unit.

[0014] As a result, the operating state regarding the picking up of components by the pickup unit is specified, so that the components can be appropriately handled according to the operating state. For example, a state where the pickup unit picks up a component in a non-contact manner, a state where the pickup unit contacts the component and picks up the component, etc. are specified as the above-described operating states. As a result, it is possible to suppress the component that has come into contact with the pickup unit from being used for mounting on a substrate.

[0015] Further, in the pickup system according to the second aspect, the sound wave generation unit may include a piezoelectric element for vibrating the nozzle, and the pickup unit may output, as the detection signal, a signal indicating a current flowing through the piezoelectric element. Note that the second aspect may be subordinate to the first aspect. Further, for example, a predetermined AC voltage is applied to the piezoelectric element.

[0016] As a result, the piezoelectric element can be used for the vibration of the nozzle and the output of the detection signal corresponding to the vibration, and the configuration of the pickup unit can be simplified.

[0017] Further, in the pickup system according to the third aspect, the pickup unit may further include a detection element that detects the vibration of the nozzle and outputs the detection signal. Note that the third aspect may be subordinate to the first aspect or the second aspect.

[0018] As a result, since a dedicated detection element for outputting a detection signal is included in the pickup unit, a detection signal corresponding to the vibration of the nozzle can be effectively output, and the specific accuracy of the operating state can be improved. Further, by arranging the detection element near the nozzle or the nozzle, a relatively large vibration can be detected, and as a result, the specific accuracy of the operating state can be further improved.

[0019] Also, in the pickup system according to the fourth aspect, the sound wave generation unit has a piezoelectric element for vibrating the nozzle, the detection element is a piezoelectric element, and the dielectric constant of the detection element may be larger than the dielectric constant of the piezoelectric element of the sound wave generation unit. Note that the fourth aspect may be dependent on the third aspect.

[0020] As a result, since the dielectric constant of the detection element is large, a detection signal indicating a voltage value corresponding to the vibration of the nozzle can be effectively output, and the specific accuracy of the operating state can be appropriately increased.

[0021] Also, in the pickup system according to the fifth aspect, the pickup unit may output the detection signal indicating a detection value that becomes larger as the vibration speed of the nozzle increases. Note that the fifth aspect may be dependent on any one of the first to fourth aspects.

[0022] As a result, the operating state regarding the pickup of parts by the pickup unit can be appropriately specified based on the detection signal.

[0023] Also, in the pickup system according to the sixth aspect, the control unit may specify, as the operating state, a state in which the pickup unit is not picking up the part if the detection value is equal to or greater than a first threshold value, and may specify, as the operating state, a state in which the pickup unit is picking up the part if the detection value is less than the first threshold value. Note that the sixth aspect may be dependent on the fifth aspect.

[0024] As a result, it is determined whether the pickup unit is picking up a part, that is, whether the pickup unit is holding a part. Therefore, it is possible to omit a wasteful operation of moving the pickup unit to convey the part even though the pickup unit is not holding the part, and improve the work efficiency.

[0025] In addition, in the pickup system according to the seventh aspect, if the detected value is less than the first threshold value and equal to or greater than the second threshold value, the control unit may specify the state in which the pickup unit is non - contact - picking up the component as the operation state. Note that the seventh aspect may be subordinate to the sixth aspect.

[0026] Thereby, the state in which the pickup unit is non - contact - picking up the component, that is, non - contact holding is specified. Therefore, when non - contact holding is specified, for example, the component can be used for mounting on the substrate without checking the operation state using a camera or the like. On the other hand, when the pickup unit is picking up the component but is in contact with the component, the component cannot be used for mounting on the substrate, so for example, the component can be discarded.

[0027] In addition, in the pickup system according to the eighth aspect, if the detected value is less than the second threshold value which is less than the first threshold value, the control unit may specify the state in which the component is in contact with the pickup unit as the operation state. Note that the eighth aspect may be subordinate to the sixth aspect or the seventh aspect.

[0028] Thereby, the state in which the pickup unit is in contact with the component and picking up the component, that is, full - contact holding is specified. Therefore, when the pickup unit is picking up the component and is in full contact with the component, the component cannot be used for mounting on the substrate, so for example, the component can be discarded.

[0029] In addition, the pickup system according to the ninth aspect further includes a negative - pressure generating unit that generates a negative pressure in the suction hole, and the control unit may start the generation of the negative pressure in the negative - pressure generating unit based on the detection signal. Note that the ninth aspect may be subordinate to any one of the first aspect to the eighth aspect.

[0030] Accordingly, based on the detection signal, it is possible to confirm that the component is in an appropriate state, and after that confirmation, start the generation of negative pressure. As a result, for example, when the component is in a tilted state, the start of the generation of negative pressure can be suppressed, and it is possible to prevent the component from contacting the nozzle.

[0031] Also, in the pickup system according to the tenth aspect, the control unit may specify whether or not the component has hit the nozzle based on the detection signal as the operation state. Note that the tenth aspect may be subordinate to any one of the first aspect to the ninth aspect.

[0032] Accordingly, when the operation state in which the component has hit the nozzle is specified, since the component cannot be used for mounting on the substrate, for example, the component can be discarded.

[0033] The bonding apparatus according to the first aspect includes a pickup system according to any one of the first aspect to the tenth aspect, and a bonding unit that receives the component from the pickup unit and bonds the received component to another component.

[0034] Accordingly, the same effects as those of the pickup system according to any one of the first aspect to the tenth aspect can be achieved.

[0035] The bonding apparatus according to the second aspect includes a pickup system according to the tenth aspect, and a bonding unit that receives the component from the pickup unit and bonds the received component to another component. When the control unit specifies the state in which the component has hit the nozzle as the operation state, the control unit prohibits the bonding unit from receiving the component from the pickup unit.

[0036] Accordingly, when the operating state in which the component hits the nozzle is specified, the reception of the component by the bonding unit from the pickup unit is prohibited, so that the bonding of the component to another component such as a substrate can be suppressed. As a result, the probability that a product generated by bonding the component to another component, for example, a mounting substrate, becomes a defective product can be reduced.

[0037] Further, the information processing method according to the first aspect is an information processing method for the pickup unit to pick up a component in a non-contact manner. The pickup unit includes a nozzle having a suction hole for sucking the component, and a sound wave generation unit that vibrates the nozzle to generate sound waves from the nozzle. The information processing method acquires a detection signal corresponding to the vibration of the nozzle output from the pickup unit, and specifies an operating state related to the pickup of the component by the pickup unit based on the detection signal.

[0038] Accordingly, the same effect as that of the pickup system according to the first aspect can be achieved.

[0039] Hereinafter, embodiments will be specifically described with reference to the drawings.

[0040] Note that all of the embodiments described below show comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, order of steps, etc. shown in the following embodiments are merely examples and not intended to limit the present disclosure. Among the components in the following embodiments, components not described in the independent claims indicating the most general concept are described as optional components. Each figure is a schematic diagram and not necessarily strictly illustrated. Also, in each figure, the same constituent members are denoted by the same reference numerals. In the following embodiments, expressions such as "substantially the same" are used. For example, "substantially the same" not only means completely the same, but also means substantially the same, including, for example, an error of about several percent. Also, "substantially the same" means the same within the range in which the effects according to the present disclosure can be achieved. The same applies to other expressions using "substantially".

[0041] (Embodiment) FIG. 1 is a perspective view of the component mounting apparatus according to the present embodiment.

[0042] In the present embodiment, the component mounting apparatus 1 picks up components and mounts the picked-up components on a substrate 7. Therefore, the component mounting apparatus 1 in the present embodiment includes a pickup system for picking up components. Note that the mounting of components on the substrate 7 is also referred to as the bonding of components to the substrate 7. Therefore, the component mounting apparatus 1 is also referred to as a bonding apparatus. Further, the substrate 7 in the present embodiment is not limited to a specific type of substrate, and may be a silicon substrate, a component, or a silicon chip, etc. Also, in the present disclosure, the vertical direction is referred to as the Z-axis direction or the up-and-down direction, one direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction, the left-right direction or the horizontal direction, and a direction perpendicular to the Y-axis direction in that perpendicular plane is referred to as the X-axis direction or the depth direction. Also, in the present disclosure, the positive side of the Z-axis direction is upward or above, and the negative side of the Z-axis direction is downward or below. Also, in the present disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. Also, in the present disclosure, the positive side of the X-axis direction is the back side or back, and the negative side of the X-axis direction is the front side or front. Also, an example of a component is a semiconductor chip or a chip, etc. Also, in the present disclosure, "pickup" means an operation of holding a component, or among the operations of holding a component, particularly, an operation of picking up a component from an adhesive sheet such as a dicing tape.

[0043] The component mounting apparatus 1 includes a base 2, a component supply unit 3, a substrate holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. The base 2 is the base of the component mounting apparatus 1 and supports each constituent member included in the component mounting apparatus 1.

[0044] The component supply unit 3 is placed on the base 2 and supplies components to the component holding unit 15. Such a component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a moving plate 32, and a plurality of support members 33. The holding table 3a holds the semiconductor wafer unit 6 in a state where it is aligned in the horizontal direction. The semiconductor wafer unit 6 consists of an adhesive sheet 6b and a plurality of chips 6a. The plurality of chips 6a are individual pieces or semiconductor chips obtained by dicing a semiconductor wafer, and are components that are supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is a sheet having adhesiveness and is also called a dicing tape. A plurality of chips 6a are attached to the upper surface of this adhesive sheet 6b. Each of the plurality of support members 33 is a columnar member placed on the moving plate 32 so as to stand up from the moving plate 32. The plurality of support members 33 support the holding table 3a in a state where the semiconductor wafer unit 6 held by the holding table 3a is separated upward from the moving plate 32. The moving plate 32 is a plate arranged in the XY table mechanism 31. The XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction. Along with the movement of this moving plate 32, the semiconductor wafer unit 6 moves in the X-axis direction and the Y-axis direction. That is, the plurality of chips 6a move along the XY plane.

[0045] The pickup camera 21 is arranged above the component supply unit 3 and images the chip 6a to be picked up among the semiconductor wafer units 6.

[0046] The substrate holding unit 5 holds the substrate 7 in a state where it is aligned in the horizontal direction. Such a substrate holding unit 5 includes a transfer rail 5a. Then, the substrate holding unit 5 positions and holds the substrate 7 conveyed by its transfer rail 5a at the mounting position. The mounting position is the position where the chip 6a is mounted.

[0047] The component holding unit 15 includes an arm 15a, a rotational movement mechanism 15b, and a pickup unit 14. The arm 15a is a columnar member and is attached to the rotational movement mechanism 15b in a state along the X-axis direction. That is, one end (i.e., the base end) in the longitudinal direction of the arm 15a is attached to the rotational movement mechanism 15b. Also, a pickup unit 14 is attached to the other end (i.e., the tip) of the arm 15a.

[0048] The rotational movement mechanism 15b is suspended from the Y-axis frame 11b of the frame 11 and moves the arm 15a in the X-axis direction, Y-axis direction, and Z-axis direction. Further, the rotational movement mechanism 15b rotates the arm 15a about a central axis along the longitudinal direction of the arm 15a. That is, the rotational movement mechanism 15b rotates the arm 15a about the axis of the X-axis. The pickup unit 14 is attached to the tip of the arm 15a as described above. Also, the pickup unit 14 includes, for example, a pickup nozzle 14a made of metal that holds the chip 6a in a non-contact manner by means of vacuum suction and ultrasonic waves. Note that vacuum suction is an operation of sucking air and is also simply called suction. Therefore, the pickup nozzle 14a moves in the X-axis direction, Y-axis direction, and Z-axis direction and rotates about the X-axis by being driven by the rotational movement mechanism 15b. Also, the rotational movement mechanism 15b moves the pickup nozzle 14a based on the imaging result by the pickup camera 21. Thereby, the rotational movement mechanism 15b can lower the pickup nozzle 14a and accurately approach the upper surface of the chip 6a to be picked up. Note that the pickup nozzle 14a in the present embodiment is also simply called a nozzle and has an opening for holding the chip 6a in a non-contact manner by means of vacuum suction and ultrasonic waves.

[0049] The frame 11 is disposed on the positive side in the X-axis direction on the base 2, and includes two support posts 11a and a long Y-axis frame 11b. The two support posts 11a support the Y-axis frame 11b in a state where the Y-axis frame 11b extends along the Y-axis direction and is separated upward from the upper surface of the base 2. That is, the Y-axis frame 11b is suspended by the two support posts 11a. And, as described above, a rotational movement mechanism 15b is suspended from this Y-axis frame 11b.

[0050] The Y-axis drive mechanism 12 is attached to the surface on the negative side in the X-axis direction of the Y-axis frame 11b, and moves the component mounting unit 13 in the Y-axis direction. The component mounting unit 13 includes a mounting unit 20. The component mounting unit 13 receives the chip 6a held by the pickup nozzle 14a using the mounting unit 20, and mounts the chip 6a on the substrate 7 positioned at the mounting position from the pickup nozzle 14a.

[0051] FIG. 2 is a diagram for explaining the operation of the component mounting apparatus 1 for mounting the chip 6a on the substrate 7.

[0052] The component mounting apparatus 1 picks up the chip 6a disposed at a preset pickup operation position P in the XY plane among the plurality of chips 6a adhered to the adhesive sheet 6b, and mounts the chip 6a on the substrate 7.

[0053] Specifically, the XY table mechanism 31 arranges the chip 6a to be picked up at the pickup operation position P by moving the moving plate 32 in the X-axis direction and the Y-axis direction. The chip 6a to be picked up disposed at such a pickup operation position P is pushed up by the pushing-up portion 34.

[0054] That is, as shown in FIG. 2, the component mounting apparatus 1 in the present embodiment includes a pushing-up portion 34 disposed at the pickup operation position P. Note that the pushing-up portion 34 may be provided in the component supply unit 3. The pushing-up portion 34 pushes up the chip 6a adhered on the adhesive sheet 6b from below to above through the adhesive sheet 6b. Specifically, the pushing-up portion 34 pushes up the chip 6a to be picked up disposed at the pickup operation position P.

[0055] The pickup camera 21 is disposed above the component supply unit 3 and at the pickup operation position P. Such a pickup camera 21 images the pickup operation position P and its periphery among the plurality of chips 6a adhered to the adhesive sheet 6b from above the component supply unit 3. Thereby, the chip 6a to be picked up is imaged, and based on the imaging result, the position of the chip 6a to be picked up is recognized. That is, the position of the chip 6a is recognized.

[0056] The pickup nozzle 14a of the pickup unit 14 descends by the drive of the rotational movement mechanism 15b, approaches the chip 6a whose position is recognized based on the imaging result of the pickup camera 21 from above, and holds the chip 6a. Then, the pickup nozzle 14a rises while holding the chip 6a, and further moves, for example, in the negative Y-axis direction. Here, the pickup nozzle 14a turns the lower surface (i.e., the bottom surface) of the held chip 6a upward by the rotation of the arm 15a by the rotational movement mechanism 15b. Thereby, the chip 6a is held by the pickup nozzle 14a in a state of being turned upside down.

[0057] As shown in FIG. 2, the component mounting portion 13 includes not only the above-described mounting unit 20 but also a moving plate 13a, a lifting mechanism 13b, and a lifting plate 13c. The moving plate 13a is a plate movably attached in the Y-axis direction to the Y-axis drive mechanism 12. That is, the moving plate 13a moves in the Y-axis direction by the drive of the Y-axis drive mechanism 12.

[0058] The lifting mechanism 13b is attached to the front surface of the moving plate 13a and raises and lowers the lifting plate 13c. A mounting unit 20 is attached to the lower portion of the lifting plate 13c. The mounting unit 20 has component mounting nozzles 20a. The component mounting nozzles 20a receive the chip 6a, for example, from a pickup nozzle 14a that holds the chip 6a in an upside-down state. For example, the component mounting nozzles 20a move above the chip 6a by the driving of the Y-axis drive mechanism 12 and the lifting mechanism 13b respectively, and hold the chip 6a by, for example, vacuum suction. Then, with the chip 6a held, the component mounting nozzles 20a move along the Y-axis direction toward the substrate 7 side and mount the chip 6a on the substrate 7.

[0059] The component mounting unit 13 in such an embodiment is an example of a bonding unit that bonds the chip 6a held by the pickup unit 14 of the component holding unit 15 to another component such as the substrate 7. Therefore, the bonding device which is the component mounting apparatus 1 in this embodiment includes a pickup system and a bonding unit that receives the chip 6a from the pickup unit 14 of the pickup system and bonds the received chip 6a to another component. Note that, when receiving the chip 6a, the bonding unit in this embodiment receives the chip 6a from the pickup unit 14 after the rotation movement mechanism 15b rotates the pickup unit 14.

[0060] FIG. 3 is a diagram showing an example of the configuration of the pickup system in this embodiment.

[0061] The pickup system 100 in this embodiment is a system provided in the component mounting apparatus 1 for non-contact pickup of the chip 6a, and includes, for example, the above-described component holding unit 15, a jacking unit 34, and a control unit 101.

[0062] The component holding unit 15 includes a pickup unit 14, a negative pressure generating unit 153, and a rotational movement mechanism 15b. The pickup unit 14 is a mechanism for non-contact pickup of the chip 6a, and includes a pickup nozzle 14a, an ultrasonic generating unit 152a, and an ultrasonic horn 152b.

[0063] The ultrasonic generating unit 152a vibrates the pickup nozzle 14a to generate ultrasonic waves from the pickup nozzle 14a. That is, the ultrasonic generating unit 152a has, for example, a Langevin type ultrasonic vibrator, and vibrates (i.e., ultrasonic vibration) according to the voltage applied to the ultrasonic vibrator. The ultrasonic horn 152b is connected to the ultrasonic generating unit 152a and the pickup nozzle 14a, and amplifies the vibration of the ultrasonic generating unit 152a and transmits it to the pickup nozzle 14a. As a result, ultrasonic waves are generated from around the opening 14b of the pickup nozzle 14a. That is, when the pickup nozzle 14a ultrasonically vibrates in the vertical direction, the vibration is transmitted to the air in contact with the lower surface of the pickup nozzle 14a. For example, the ultrasonic generating unit 152a ultrasonically vibrates the pickup nozzle 14a with an amplitude of up to about 10 to 20 μm. The pickup nozzle 14a non-contact picks up the chip 6a using the ultrasonic waves generated by the vibration.

[0064] In this embodiment, the ultrasonic generating unit 152a generates ultrasonic waves having a frequency of, for example, 20 kHz or more, but may generate sound waves used in a broad sense. In this case, the ultrasonic generating unit 152a and the ultrasonic vibrator may be respectively called a sound wave generating unit and a sound wave vibrator. That is, the sound waves generated by the ultrasonic generating unit 152a may be sound waves used in a narrow sense, that is, elastic waves that propagate in the air at a human audible frequency (for example, 10 kHz or more and less than 20 kHz), or may be ultrasonic waves. In other words, as long as the ultrasonic generating unit 152a in this embodiment can apply a repulsive force to the chip 6a, elastic waves of any frequency may be generated in the air.

[0065] The negative pressure generating unit 153 generates a negative pressure in the suction hole 14c of the pickup nozzle 14a. In the present embodiment, the negative pressure generating unit 153 is configured as, for example, a vacuum pump. Specifically, a suction path 152c, which is a hole for sucking the chip 6a, is provided in the ultrasonic horn 152b, and the pickup nozzle 14a has a suction hole 14c that is connected to the suction path 152c and communicates with the opening 14b. The negative pressure generating unit 153 generates a negative pressure around the opening 14b of the pickup nozzle 14a by creating a negative pressure in the suction path 152c and the suction hole 14c. In other words, the negative pressure generating unit 153 generates a negative pressure around the opening 14b by sucking the air around the opening 14b through the suction path 152c and the suction hole 14c. Further, the negative pressure generating unit 153 has an adjustment valve for adjusting the negative pressure, and generates a negative pressure of a magnitude corresponding to the opening degree of the adjustment valve.

[0066] The pickup nozzle 14a is a nozzle having a suction hole 14c for sucking the chip 6a. Further, the pickup nozzle 14a holds the chip 6a in a non-contact manner around the opening 14b based on the repulsive force that separates the chip 6a from the pickup nozzle 14a obtained by the ultrasonic waves of the ultrasonic generating unit 152a and the suction force that attracts the chip 6a to the pickup nozzle 14a obtained by the negative pressure of the negative pressure generating unit 153. Note that the above-mentioned repulsive force is a force obtained by the formation of a squeeze film by ultrasonic waves. Further, such a repulsive force may be a force obtained not only by ultrasonic waves but also by sound waves used in a broad sense.

[0067] The rotational movement mechanism 15b includes, for example, a motor and moves the pickup nozzle 14a in the X-axis direction, Y-axis direction, and Z-axis direction. Further, the rotational movement mechanism 15b rotates the pickup nozzle 14a of the pickup unit 14 attached to the tip of the arm 15a by rotating the arm 15a. The time required for the pickup nozzle 14a to rotate by 180 degrees, that is, the time required for the inversion of the pickup nozzle 14a, is, for example, less than 0.5 seconds.

[0068] The pushing-up portion 34 includes a plurality of pushing-up pins 34a, and raises and lowers the plurality of pushing-up pins 34a. When the plurality of pushing-up pins 34a rise to push up the adhesive sheet 6b, the chip 6a adhered to the adhesive sheet 6b is pushed up.

[0069] The control unit 101 controls the pushing-up portion 34 and the component holding portion 15. That is, the control unit 101 controls the pushing-up portion 34, the ultrasonic generating portion 152a, the negative pressure generating portion 153, and the rotation and movement mechanism 15b. For example, the control unit 101 adjusts the repulsive force applied to the chip 6a by controlling the voltage applied to the ultrasonic vibrator of the ultrasonic generating portion 152a. Further, the control unit 101 adjusts the suction force applied to the chip 6a by controlling the adjustment valve of the negative pressure generating portion 153. Thereby, the repulsive force and the suction force applied to the chip 6a can be effectively adjusted.

[0070] In this embodiment, the component holding portion 15 includes the ultrasonic generating portion 152a and the negative pressure generating portion 153, but the ultrasonic generating portion 152a and the negative pressure generating portion 153 may not be included in the component holding portion 15. Also, in this embodiment, the ultrasonic horn 152b and the pickup nozzle 14a are separate bodies, but they may be integrally formed. In other words, the pickup unit 14 may not include the ultrasonic horn 152b.

[0071] FIGS. 4A and 4B are diagrams showing an example of the operation in which the pickup system 100 in this embodiment picks up the chip 6a using the pickup nozzle 14a and delivers it to the component mounting nozzle 20a.

[0072] For example, by moving the XY table mechanism 31 to move the moving plate 32, the adhesive sheet 6b held by the holding table 3a moves in the X-axis direction and the Y-axis direction. Due to the movement of this adhesive sheet 6b, as shown in Fig. 4A(a), the chip 6a to be picked up is arranged at the pick-up working position P. That is, the chip 6a to be picked up is arranged on the plurality of pushing-up pins 34a of the pushing-up portion 34.

[0073] Next, as shown in Fig. 4A(b), the pushing-up portion 34 raises the plurality of pushing-up pins 34a to push up the chip 6a through the adhesive sheet 6b. Then, as shown in Fig. 4A(c), the pick-up nozzle 14a descends, and the ultrasonic generating portion 152a generates ultrasonic waves. Specifically, the ultrasonic generating portion 152a vibrates the pick-up nozzle 14a via the ultrasonic horn 152b in response to the control by the control portion 101, and generates ultrasonic waves from around the opening 14b of the pick-up nozzle 14a. The ultrasonic waves generated by the ultrasonic generating portion 152a are generated, for example, when the pick-up nozzle 14a vibrates at a vibration speed of 10 mm / s or more and 5000 mm / s or less. Next, as shown in Fig. 4A(d), the negative pressure generating portion 153 performs air suction in response to the control by the control portion 101. As a result, a negative pressure is generated around the opening 14b of the pick-up nozzle 14a. As a result, the control portion 101 uses the suction force due to the negative pressure around the opening 14b and the repulsive force due to the ultrasonic waves around the opening 14b to hold the chip 6a on the pick-up nozzle 14a in a non-contact manner. That is, the pick-up nozzle 14a holds the chip 6a in a non-contact manner using the suction force that tries to attract the chip 6a to the opening 14b side of the pick-up nozzle 14a and the repulsive force that tries to move the chip 6a away from the opening 14b.

[0074] In other words, the pickup unit 14, specifically the pickup nozzle 14a, picks up the chip 6a in a non-contact manner. Alternatively, the pickup unit 14, specifically the pickup nozzle 14a, assumes an operating state of non-contact holding. In such non-contact holding, a gap of, for example, about 20 to 60 μm is formed between the pickup nozzle 14a and the chip 6a.

[0075] Thereafter, as shown in Fig. 4B(a), the control unit 101 raises the pickup nozzle 14a by controlling the rotational movement mechanism 15b. That is, the chip 6a is peeled off from the adhesive sheet 6b and raised. Further, as shown in Fig. 4B(b), the control unit 101 rotates the pickup nozzle 14a by controlling the rotational movement mechanism 15b. That is, as shown in Fig. 4B(b) and (c), the rotational movement mechanism 15b rotates the arm 15a to rotate the pickup nozzle 14a by 180 degrees so that the opening 14b of the pickup nozzle 14a faces upward from below. That is, in response to the rotation of the arm 15a, the pickup unit 14 attached to the tip of the arm 15a is inverted. As a result, the pickup nozzle 14a included in the pickup unit 14 is inverted. Thereby, the chip 6a non-contact held by the pickup nozzle 14a is also inverted, and the lower surface, which is the surface adhered to the adhesive sheet 6b of the chip 6a, faces upward. Note that the rotational movement mechanism 15b may move the pickup nozzle 14a in the X-axis direction and the Y-axis direction to the chip transfer position before inverting the pickup nozzle 14a. The chip transfer position is the position where the chip 6a is transferred to the component mounting nozzle 20a.

[0076] Then, as shown in Fig. 4B(c), the component mounting nozzle 20a sucks the inverted chip 6a from above. As a result, the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0077] FIG. 5 is a diagram showing an example of the appearance of the pickup unit 14. Note that (a) of FIG. 5 is a perspective view of the pickup unit 14, and (b) of FIG. 5 is a diagram showing the appearance of the pickup unit 14 as viewed from the negative side in the Z-axis direction.

[0078] As shown in FIG. 5(a), the pickup unit 14 includes an ultrasonic generating unit 152a, an ultrasonic horn 152b, and a pickup nozzle 14a that are connected in order from the positive side in the Z-axis direction. The pickup nozzle 14a has a first portion 14aa, a second portion 14ab, and a third portion 14ac that are arranged in order from the positive side in the Z-axis direction. The third portion 14ac has a shape corresponding to the shape of the chip 6a. Thereby, since there is the third portion 14ac having a shape corresponding to the shape of the chip 6a, the chip 6a can be appropriately held in a non-contact manner without being restricted by the shape and size of the second portion 14ab. Specifically, the third portion 14ac is connected to the lower surface of the second portion 14ab and has a rectangular parallelepiped shape. This rectangular parallelepiped shape is a shape corresponding to the shape of the chip 6a. That is, the lower surface of the third portion 14ac has substantially the same shape and size as the upper surface of the chip 6a. More specifically, the third portion 14ac, that is, the lower surface of the third portion 14ac, has a rectangular shape having a side in the longitudinal direction and a side in the short-side direction. Thereby, the rectangular chip 6a can be appropriately held in a non-contact manner.

[0079] Such a pickup unit 14 outputs a detection signal corresponding to the vibration of the pickup nozzle 14a. And the control unit 101 in the present embodiment specifies the operation state regarding the pickup of the chip 6a by the pickup unit 14 based on the detection signal.

[0080] FIG. 6 is a diagram for explaining the electrical configuration of the pickup unit 14.

[0081] The ultrasonic generating unit 152a included in the pickup unit 14 has a piezoelectric element 51 for vibrating the pickup nozzle 14a. Specifically, the piezoelectric element 51 is included in the ultrasonic vibrator described above. An AC voltage is applied to this piezoelectric element 51 by an AC power supply 201. As a result, the piezoelectric element 51 vibrates periodically. Consequently, the pickup nozzle 14a vibrates.

[0082] Also, the pickup unit 14 in the present embodiment includes a detection element 52 that detects the vibration of the pickup nozzle 14a and outputs the above-described detection signal. Specifically, this detection element 52 is a piezoelectric element and outputs a detection signal indicating a detection value corresponding to the vibration speed of the pickup nozzle 14a. More specifically, the detection element 52 outputs a detection signal indicating a larger detection value as the vibration speed of the pickup nozzle 14a is faster. For example, the detection signal is a sine wave signal corresponding to the frequency of the AC power supply 201, and the detection value indicated by the detection signal is a voltage value. The faster the vibration speed, the larger the amplitude of the detection signal, that is, the detection value at the peak of each mountain included in the wave of the detection signal. The vibration speed and the amplitude of the detection signal may be proportional.

[0083] The monitoring circuit 53 monitors the detection signal output from the detection element 52 and outputs the detection signal to the control unit 101. Note that the monitoring circuit 53 may be provided in the ultrasonic generating unit 152a, the pickup unit 14, the control unit 101, or the pickup system 100. Also, the monitoring circuit 53 may perform digital signal processing on the detection signal to convert the detection signal into a signal format that can be processed by the control unit 101 and output the converted detection signal to the control unit 101. For example, the monitoring circuit 53 may output, as the converted detection signal to the control unit 101, a signal indicating only the detection value at the peak of each mountain included in the wave of the detection signal output from the detection element 52.

[0084] The control unit 101 in the present embodiment specifies the above-described operating state based on such a detection signal.

[0085] FIG. 7 is a diagram showing an example of the operating state specified by the control unit 101.

[0086] The control unit 101 specifies, for example, the operating states shown in FIGS. 7(a) to 7(d). That is, the control unit 101 specifies non-contact holding shown in FIG. 7(a) as the operating state. In this non-contact holding, the pickup nozzle 14a picks up the chip 6a without contact. At this time, the chip 6a is peeled off from the adhesive sheet 6b. Further, the control unit 101 specifies partial-contact non-holding shown in FIG. 7(b) as the operating state. In this partial-contact non-holding, the pickup nozzle 14a is in contact with the edge of the chip 6a, but the chip 6a cannot be peeled off from the adhesive sheet 6b and picked up. Further, the control unit 101 specifies full-contact holding shown in FIG. 7(c) as the operating state. In this full-contact holding, the pickup nozzle 14a peels off the chip 6a from the adhesive sheet 6b and picks it up while being in full contact with the upper surface of the chip 6a. Further, the control unit 101 specifies non-contact non-holding shown in FIG. 7(d) as the operating state. In this non-contact non-holding, the pickup nozzle 14a is not in contact with the chip 6a and does not pick up the chip 6a. That is, the chip 6a is not peeled off from the adhesive sheet 6b.

[0087] Note that the full-contact holding in the present embodiment may mean a state in which the pickup nozzle 14a is in contact with all of the upper surface of the chip 6a, or may mean a state in which the pickup nozzle 14a is in contact with a wider area on the upper surface of the chip 6a than in the partial-contact non-holding. That is, in the present embodiment, the state in which the pickup nozzle 14a is in full contact with the upper surface of the chip 6a may be a state in which the pickup nozzle 14a is in contact with, for example, more than half of the upper surface.

[0088] FIG. 8 is a diagram showing an example of changes in the detection value indicated by the detection signal. Specifically, the detection value is the voltage value of each peak of the mountain included in the voltage waveform like a sine wave output from the detection element 52, and FIG. 8 shows the time change of the voltage value by a graph. The vertical axis of the graph indicates the voltage value, and the horizontal axis indicates the time.

[0089] When the pickup unit 14 is in the non-contact holding operation state, for example, at time t0, as shown in FIG. 7(a), the pickup nozzle 14a is above the chip 6a, and ultrasonic waves are generated from the pickup nozzle 14a. At this time, as shown in FIG. 8, the voltage value is slightly larger than the value V3. Then, suction is started at time t1. At this time, the chip 6a is peeled off from the adhesive sheet 6b and picked up non-contact by the pickup nozzle 14a. That is, the pickup unit 14 is in the non-contact holding operation state. As a result, the vibration of the pickup nozzle 14a is suppressed, and the voltage value becomes slightly smaller than the value V3 after time t2, as shown in FIG. 8.

[0090] When the pickup unit 14 is in the partial contact non-holding operation state, for example, at time t0, as shown in FIG. 7(b), the pickup nozzle 14a is above the chip 6a, and ultrasonic waves are generated from the pickup nozzle 14a. At this time, for example, the pickup nozzle 14a is at a higher position from the chip 6a than in the case of non-contact holding. Therefore, as shown in FIG. 8, the voltage value becomes a value close to the value V4 larger than the value V3. Then, suction is started at time t1. At this time, the chip 6a is not peeled off from the adhesive sheet 6b, and the edge of the chip 6a contacts the pickup nozzle 14a. That is, the pickup unit 14 is in the partial contact non-holding operation state. As a result, as shown in FIG. 8, the voltage value becomes larger than the value V4 at time t2.

[0091] When the pickup unit 14 is in the fully - contact holding operation state, for example, at time t0, the pickup nozzle 14a is above the chip 6a as shown in Fig. 7(c), and ultrasonic waves are generated from the pickup nozzle 14a. At this time, for example, the height of the pickup nozzle 14a from the chip 6a is the same as that in the non - contact holding state. Therefore, the voltage value is slightly larger than the value V3 as shown in Fig. 8. Then, suction is started at time t1. At this time, the suction force is stronger than that in the non - contact holding state. Therefore, the chip 6a is peeled off from the adhesive sheet 6b, and the upper surface of the chip 6a comes into contact with the pickup nozzle 14a. That is, the pickup unit 14 is in the fully - contact holding operation state. As a result, the vibration of the pickup nozzle 14a is greatly suppressed, and the voltage value becomes smaller than the value V2 after time t2 as shown in Fig. 8.

[0092] When the pickup unit 14 is in the non - contact non - holding operation state, for example, at time t0, the pickup nozzle 14a is above the chip 6a as shown in Fig. 7(d), and ultrasonic waves are generated from the pickup nozzle 14a. At this time, for example, the pickup nozzle 14a is at a position higher than the chip 6a compared to the partial - contact non - holding state. Therefore, the voltage value is slightly larger than the value V6 as shown in Fig. 8. Then, suction is started at time t1. However, since the pickup nozzle 14a is too far away from the chip 6a, the chip 6a is not peeled off from the adhesive sheet 6b and does not come into contact with the pickup nozzle 14a. That is, the pickup unit 14 is in the non - contact non - holding operation state. As a result, the vibration of the pickup nozzle 14a does not change, and the voltage value maintains a value slightly larger than the value V6 after time t2 as shown in Fig. 8.

[0093] Therefore, the control unit 101 in the present embodiment identifies the operation state of the pickup unit 14 by comparing the detected value after suction is started with one or more threshold values. The one or more threshold values include, for example, a first threshold value which is the value V3, a second threshold value which is the value V2, and a third threshold value which is the value V5.

[0094] That is, when the detected value is equal to or greater than the first threshold value, the control unit 101 specifies the state where the pickup unit 14 is not picking up the chip 6a as the operating state. The operating states are partial contact non-holding and non-contact non-holding. When the detected value is less than the first threshold value, the control unit 101 specifies the state where the pickup unit 14 is picking up the chip 6a as the operating state. The operating states are non-contact holding and full contact holding.

[0095] In addition, when the detected value is less than the first threshold value and equal to or greater than the second threshold value, the control unit 101 specifies the state where the pickup unit 14 is picking up the chip 6a in a non-contact manner as the operating state. The operating state is non-contact holding. When the detected value is less than the second threshold value which is less than the first threshold value, the control unit 101 specifies the state where the chip 6a is in contact with the pickup unit 14 as the operating state. The operating state is full contact holding. That is, based on the detection signal, specifically based on the comparison result between the detection signal and the second threshold value, the control unit 101 specifies whether the chip 6a has hit the pickup nozzle 14a as the operating state. When the detected value is equal to or greater than the third threshold value (for example, value V5), the control unit 101 specifies non-contact non-holding as the operating state.

[0096] The detected value compared with the first threshold value, the second threshold value, and the third threshold value may be the detected value after time t2 or time t3. For example, time t2 may be the time 0.05 seconds after time t1 when suction is started, and time t3 may be the time 0.1 seconds after time t1. Also, the voltage value of the value V3 used as the first threshold value may be 0.15V, the voltage value of the value V2 used as the second threshold value may be 0.1V, and the voltage value of the value V5 used as the third threshold value may be 0.25V.

[0097] FIG. 9 is a flowchart showing an example of the processing operation of the pickup system 100 in the present embodiment.

[0098] First, the control unit 101 sets the distance between the pickup nozzle 14a and the chip 6a to a predetermined distance by causing the pickup nozzle 14a to descend and the chip 6a to be pushed up by the pushing-up portion 34 (step S11).

[0099] Next, the control unit 101 starts generating ultrasonic waves by the ultrasonic wave generation unit 152a (step S12). Note that the generation of ultrasonic waves may start from step S11. After that, the control unit 101 starts sucking the chip 6a by generating a negative pressure in the negative pressure generation unit 153 (step S13).

[0100] Next, after a predetermined period has elapsed since the suction started, the control unit 101 acquires a detection signal output from the detection element 52 via the monitoring circuit 53, and determines whether the detection value indicated by the detection signal is less than a first threshold value (step S14). Here, when the control unit 101 determines that the detection value is not less than the first threshold value (No in step S14), it specifies partial contact non-holding as the operating state of the pickup unit 14 (step S16).

[0101] In the flowchart of FIG. 9, the control unit 101 performs processing on the premise that a non-contact non-holding operating state does not occur. However, when a non-contact non-holding operating state occurs, the detection value may be compared with a third threshold value. That is, when the control unit 101 determines that the detection value is not less than the first threshold value (No in step S14), it further determines whether the detection value is not less than the third threshold value. Then, if the detection value is not less than the third threshold value, the control unit 101 specifies non-contact non-holding as the operating state of the pickup unit 14. On the other hand, if the detection value is less than the third threshold value, the control unit 101 specifies partial contact non-holding as the operating state of the pickup unit 14.

[0102] On the other hand, when the control unit 101 determines that the detected value is less than the first threshold value (Yes in step S14), it further determines whether the detected value is greater than or equal to the second threshold value (step S15). Here, when the control unit 101 determines that the detected value is greater than or equal to the second threshold value (Yes in step S15), it specifies non-contact holding as the operating state of the pickup unit 14 (step S17). On the other hand, when the control unit 101 determines that the detected value is not greater than or equal to the second threshold value (No in step S15), it specifies full-contact holding as the operating state of the pickup unit 14 (step S18).

[0103] Then, when the control unit 101 specifies non-contact holding as the operating state of the pickup unit 14, it raises the pickup nozzle 14a and starts transporting the chip 6a held by the pickup nozzle 14a (step S19). That is, as shown in (a) to (c) of FIG. 4B, the control unit 101 moves and rotates the pickup nozzle 14a to execute the transfer of the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a. As a result, the component mounting nozzle 20a receives the chip 6a from the pickup nozzle 14a and mounts the received chip 6a on the substrate 7.

[0104] On the one hand, when the control unit 101 identifies full contact holding or partial contact non-holding as the operating state of the pickup unit 14, it discards the chip 6a (step S20). For example, when the operating state is full contact holding, the control unit 101 moves the pickup nozzle 14a to a predetermined location and stops suction, thereby dropping the chip 6a held by the pickup nozzle 14a at that location. Also, for example, when the operating state is partial contact non-holding, the control unit 101 increases the suction force by strengthening the negative pressure of the negative pressure generating unit 153. As a result, the pickup nozzle 14a comes into complete contact with the chip 6a and picks it up. That is, the operating state of the pickup unit 14 becomes full contact holding. As a result, the control unit 101, in the same manner as described above, moves the pickup nozzle 14a to the above-mentioned predetermined location and stops suction, thereby dropping the chip 6a held by the pickup nozzle 14a at that location. By discarding the chip 6a in this way, the receipt of the chip 6a by the component mounting nozzle 20a from the pickup nozzle 14a is prohibited. That is, when the control unit 101 identifies the state where the chip 6a hits the pickup nozzle 14a as the operating state, it prohibits the receipt of the chip 6a by the bonding unit from the pickup unit 14.

[0105] In addition, when the control unit 101 repeatedly executes the process of step S20, it may output an alert prompting inspection of the pickup system 100. The alert may be performed by voice, sound, image, emission of a light source, etc. Also, the number of repetitions of the process in step S20 may be 5 times, or may be a number other than 5 times.

[0106] Also, in the example shown in FIG. 9, after suction is started in step S13, the processes of steps S14 to S16 and S20 are performed at a timing when the pickup nozzle 14a has not been lifted in step S19. However, the processes of steps S14 to S16 and S20 may be performed at other timings different from the above-mentioned timing. For example, the other timing is the timing from when the lifting of the pickup nozzle 14a is started in step S19 until the chip 6a held by the pickup nozzle 14a is transferred to the component mounting nozzle 20a. More specifically, the other timing is the timing during which the pickup nozzle 14a transitions from the state shown in (a) to the state shown in (c) of FIG. 4B. As a result, as shown in FIG. 4B(b), when the pickup nozzle 14a is rotating, if the chip 6a held non-contact with the pickup nozzle 14a comes into contact with the pickup nozzle 14a, the operating state of full-contact holding is specified. Then, by the process of step S20, the chip 6a is discarded. Therefore, the processes of steps S14 to S16 and S20 may be performed at any timing as long as it is between when suction is started in step S13 and when the chip 6a held by the pickup nozzle 14a is transferred to the component mounting nozzle 20a.

[0107] Thus, in the present embodiment, the operating state regarding the pickup of the chip 6a by the pickup unit 14 is specified based on the detection signal. As a result, the chip 6a can be appropriately handled according to the operating state. For example, the state where the pickup unit 14 picks up the chip 6a non-contact, the state where the pickup unit 14 contacts the chip 6a and picks up the chip 6a, etc. are specified as the above-mentioned operating states. As a result, it is possible to suppress the chip 6a that has come into contact with the pickup unit 14 from being used for mounting on the substrate 7.

[0108] In addition, in the present embodiment, since the dedicated detection element 52 for outputting a detection signal is included in the pickup unit 14, a detection signal corresponding to the vibration of the pickup nozzle 14a can be effectively output, and the specific accuracy of the operating state can be improved. Further, by disposing the detection element 52 near the pickup nozzle 14a or at the pickup nozzle 14a, relatively large vibrations can be detected, and as a result, the specific accuracy of the operating state can be further improved.

[0109] In addition, in the present embodiment, since a detection signal indicating a larger detection value is output as the vibration speed of the pickup nozzle 14a is higher, the operating state regarding the pickup of the chip 6a by the pickup unit 14 can be appropriately specified based on the detection signal. Further, the vibration speed of the pickup nozzle 14a can be appropriately estimated from the detection signal.

[0110] In addition, in the present embodiment, whether the pickup unit 14 is picking up the chip 6a, that is, whether the pickup unit 14 is holding the chip 6a, is specified as an operating state. Therefore, even when the pickup unit 14 is not holding the chip 6a, a wasteful operation of moving the pickup unit 14 to transport the chip 6a can be omitted, and the working efficiency can be improved.

[0111] Also, in the present embodiment, a state where the pickup unit 14 picks up the chip 6a in a non-contact manner, that is, non-contact holding is specified. Therefore, when non-contact holding is specified, for example, the chip 6a can be used for mounting on the substrate 7 without checking the operating state using a camera or the like. On the other hand, even if the pickup unit 14 picks up the chip 6a, if it is in contact with the chip 6a, the chip 6a cannot be used for mounting on the substrate 7, so for example, the chip 6a can be discarded. Note that it is difficult to specify whether the pickup nozzle 14a that picks up the chip 6a is in contact with the chip 6a during the operation of the pickup system 100 by photographing with a camera. However, in the present embodiment, since it is determined based on the detection signal, the specification can be easily performed.

[0112] Also, in the present embodiment, a state where the pickup unit 14 contacts the chip 6a and picks up the chip 6a, that is, full-contact holding is specified. Therefore, even if the pickup unit 14 picks up the chip 6a but is in full contact with the chip 6a, the chip 6a cannot be used for mounting on the substrate 7, so the chip 6a can be discarded. That is, in the present embodiment, based on the detection signal, whether the chip 6a hits the pickup nozzle 14a is specified as an operating state. Therefore, when the operating state where the chip 6a hits the pickup nozzle 14a is specified, the chip 6a cannot be used for mounting on the substrate 7, so the chip 6a can be discarded. Specifically, when the operating state where the chip 6a hits the pickup nozzle 14a is specified, the reception of the chip 6a by the component mounting unit 13 from the pickup unit 14 is prohibited, so the bonding of the chip 6a to another component such as the substrate 7 can be suppressed. As a result, the probability that a product generated by bonding the chip 6a to another component, for example, a mounting substrate, becomes a defective product can be reduced.

[0113] Here, the dielectric constant of the detection element 52 in the present embodiment may be greater than the dielectric constant of the piezoelectric element 51 of the ultrasonic generation unit 152a. As a result, since the dielectric constant of the detection element 52 is large, a detection signal indicating a voltage value corresponding to the vibration of the pickup nozzle 14a can be effectively output, and the specific accuracy of the operating state can be appropriately increased.

[0114] (Modification 1) In this modification, the start of generation of negative pressure by the negative pressure generation unit 153, that is, the start of suction, is controlled based on the detection signal.

[0115] FIG. 10 is a diagram showing an example of the state of the chip 6a where suction should not be started.

[0116] For example, the pushing-up portion 34 pushes up the chip 6a adhered on the adhesive sheet 6b by raising the pushing-up pin 34a. At this time, as shown in FIG. 10, the chip 6a may tilt. That is, the upper surface of the chip 6a tilts with respect to the XY plane. If suction is started when the chip 6a is tilted in this way, the pickup nozzle 14a of the pickup unit 14 is highly likely not to be able to hold the chip 6a in a non-contact manner. That is, the operating state of the pickup unit 14 is highly likely to be in a state of partial contact and non-holding.

[0117] Therefore, the control unit 101 of the pickup system 100 in this modification starts the generation of negative pressure for the negative pressure generation unit 153 after confirming based on the detection signal that the chip 6a is not tilted.

[0118] FIG. 11 is a diagram showing an example of the operation of the pickup system 100 in this modification.

[0119] In this modification example, the pushing up of the chip 6a is performed in synchronization with the rising of the pickup nozzle 14a. Specifically, as shown in Fig. 11(a), before the pushing up of the chip 6a is started, the pickup nozzle 14a descends according to the control by the control unit 101. As a result, the pickup nozzle 14a is positioned above the chip 6a at a predetermined interval away from the chip 6a. The predetermined interval may be, for example, about 50 μm. Further, the ultrasonic generation unit 152a starts generating ultrasonic waves according to the control by the control unit 101.

[0120] Next, as shown in Fig. 11(b), the pushing-up unit 34 starts the rising of the pushing-up pin 34a according to the control by the control unit 101. Thereby, the chip 6a is pushed up by the pushing-up pin 34a via the adhesive sheet 6b. At this time, the pickup nozzle 14a rises in synchronization with the pushing up of the chip 6a so that the interval between the pickup nozzle 14a and the chip 6a is maintained at the above-mentioned predetermined interval according to the control by the control unit 101.

[0121] Then, as shown in Fig. 11(c), when the chip 6a is pushed up to a predetermined height, the control unit 101 determines whether the chip 6a is tilted or not based on the detection signal output from the detection element 52 of the ultrasonic generation unit 152a via the monitoring circuit 53. And when the control unit 101 determines that the chip 6a is not tilted, it starts generating negative pressure for the negative pressure generation unit 153. That is, the control unit 101 starts sucking the chip 6a.

[0122] For example, when the chip 6a is pushed up to the above-mentioned predetermined height, if the detection value indicated by the detection signal decreases, the control unit 101 determines that the chip 6a is not tilted. That is, the control unit 101 determines that the upper surface of the chip 6a is along the XY plane. On the other hand, if the detection value does not decrease, the control unit 101 determines that the chip 6a is tilted.

[0123] FIG. 12 is a flowchart showing an example of the processing operation of the pickup system 100 in this modification.

[0124] First, the control unit 101 sets the distance between the pickup nozzle 14a and the chip 6a to a predetermined distance by lowering the pickup nozzle 14a (step S1). Then, the control unit 101 starts the generation of ultrasonic waves by the ultrasonic generation unit 152a (step S2).

[0125] Next, the control unit 101 executes the pushing up of the chip 6a and the rising of the pickup nozzle 14a in synchronization (step S3).

[0126] Next, when the process of step S3 ends, the control unit 101 determines whether or not the detected value indicated by the detection signal output from the detection element 52 of the ultrasonic generation unit 152a via the monitoring circuit 53 has decreased (step S4). Here, when the control unit 101 determines that the detected value has decreased (Yes in step S4), it executes the processes of steps S13 to S20 in the same manner as the flowchart shown in FIG. 9. For example, the control unit 101 starts the generation of negative pressure in the negative pressure generation unit 153 to hold the chip 6a in a non-contact manner by the pickup nozzle 14a. On the other hand, when the control unit 101 determines that the detected value has not decreased (No in step S4), it ends the process of picking up the chip 6a.

[0127] As described above, in this modification, the control unit 101 starts the generation of negative pressure in the negative pressure generation unit 153 based on the detection signal. As a result, it can be confirmed that the chip 6a is in an appropriate state based on the detection signal, and the generation of negative pressure can be started after the confirmation. As a result, for example, when the chip 6a is in a tilted state, the generation of negative pressure can be prevented from starting and the chip 6a from coming into contact with the pickup nozzle 14a.

[0128] (Modification 2) In the above-described embodiment, the pickup unit 14 includes the detection element 52. On the other hand, in this modified example, the pickup unit 14 does not include the detection element 52, and a signal indicating the current flowing through the piezoelectric element 51 of the ultrasonic generation unit 152a is output as the detection signal.

[0129] FIG. 13 is a diagram for explaining the electrical configuration of the pickup unit 14 in this modified example.

[0130] The ultrasonic generation unit 152a included in the pickup unit 14 has a piezoelectric element 51 for vibrating the pickup nozzle 14a, similar to the above-described embodiment. A predetermined AC voltage is applied to this piezoelectric element 51 by the AC power supply 201. As a result, the piezoelectric element 51 vibrates periodically. Consequently, the pickup nozzle 14a vibrates. Here, the current flowing through the piezoelectric element 51 varies according to the vibration speed of the pickup nozzle 14a.

[0131] Therefore, in this modified example, the pickup unit 14 outputs a signal indicating the current flowing through the piezoelectric element 51 as a detection signal corresponding to the vibration of the pickup nozzle 14a. The monitoring circuit 54 monitors the current flowing through the piezoelectric element 51 and outputs a detection signal indicating the current to the control unit 101. Note that the monitoring circuit 54 may be provided in the ultrasonic generation unit 152a, the pickup unit 14, the control unit 101, or the pickup system 100. Further, the monitoring circuit 54 may perform digital signal processing on the detection signal to convert the detection signal into a signal format that can be processed by the control unit 101, and output the converted detection signal to the control unit 101.

[0132] The control unit 101 in this modified example specifies the above-described operating state based on such a detection signal. Therefore, in this modified example, the piezoelectric element 51 can be used for the vibration of the pickup nozzle 14a and the output of the detection signal corresponding to the vibration, and the configuration of the pickup unit 14 can be simplified.

[0133] The pickup system 100 and the bonding apparatus according to one or more aspects have been described based on the embodiments and their modifications. However, the present disclosure is not limited to the embodiments and their modifications. As long as the gist of the present disclosure is not deviated from, various modifications conceived by those skilled in the art may also be included in the present disclosure even if applied to the above embodiments or modifications.

[0134] For example, the vibration mode of the pickup nozzle 14a in the above embodiment may be the longitudinal primary mode or a higher-order mode having a node on the component facing surface. Also, in the case of a higher-order mode, the pickup nozzle 14a may vibrate in a mode in which vibration waves propagate radially from the center of the component facing surface toward the end. Alternatively, when the ratio of the length of the long side to the short side of the rectangular component facing surface is large, the pickup nozzle 14a may vibrate in a higher-order mode in which vibration waves propagate in the longitudinal direction of the component facing surface.

[0135] Also, in the above embodiment, the pickup nozzle 14a holds the chip 6a in a non-contact manner, but the component mounting nozzle 20a may also hold the chip 6a in a non-contact manner, similar to the pickup nozzle 14a.

[0136] For example, in the above embodiment, the control unit 101 identifies the operating state based on a detection signal indicating a voltage value as the detection value, and in Modification 2, the control unit 101 identifies the operating state based on a detection signal indicating a current value as the detection value. However, the detection signal may be any signal as long as it indicates a value corresponding to the vibration speed of the pickup nozzle 14a. For example, the detection signal may be a signal indicating impedance.

[0137] Also, the detection element 52 in the above embodiment may have a dielectric constant larger than that of the piezoelectric element 51 of the ultrasonic generation unit 152a, or may have the same dielectric constant. Also, the detection element 52 may have substantially the same configuration as the piezoelectric element 51.

[0138] Also, in each of the above-described embodiment, Modification 1, and Modification 2, the control unit 101 may estimate the vibration speed of the pickup nozzle 14a based on the detection signal, and control the component holding unit 15 including the pickup unit 14 based on the vibration speed. For example, the control unit 101 may estimate the vibration speed by multiplying a detection value indicated by the detection signal by a coefficient.

[0139] In the above-described embodiment, Modification 1, and Modification 2, the control unit 101 or the like may be configured by dedicated hardware or may be realized by executing a software program suitable for the control unit 101. The control unit 101 may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory. Here, the software that realizes the control unit 101 or the like causes a computer to execute each step of the flowchart shown in, for example, FIG. 9 or FIG. 12. Such a method of processing by the control unit 101 is also called an information processing method.

[0140] Note that the following cases are also included in the present disclosure.

[0141] (1) Specifically, the control unit 101 may be a computer system including a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, and the like. A computer program is stored in the RAM or the hard disk unit. The microprocessor operates according to the computer program, whereby the control unit 101 achieves its function. Here, the computer program is configured by a combination of a plurality of instruction codes indicating instructions to the computer in order to achieve a predetermined function.

[0142] (2) The control unit 101 may be composed of a single system LSI (Large Scale Integration). The system LSI is a super multi-functional LSI manufactured by integrating a plurality of components on a single chip. Specifically, it is a computer system composed of a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. When the microprocessor operates according to the computer program, the system LSI achieves its functions.

[0143] (3) The control unit 101 may be composed of a detachable IC card or a single module. The IC card or module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned super multi-functional LSI. When the microprocessor operates according to the computer program, the IC card or module achieves its functions. This IC card or this module may have tamper resistance.

Industrial Applicability

[0144] The present disclosure can be used, for example, in devices, units, systems, etc. that pick up parts and perform operations using those parts.

Explanation of Reference Numerals

[0145] 1 Component mounting device (bonding device) 2 Base 3 Component supply unit 3a Holding table 5 Substrate holding unit 5a Conveyor rail 6 Semiconductor wafer unit 6a Chip (component) 6b Adhesive sheet 7 Substrate 11 Frame 11a Support post 11b Y-axis frame 12 Y-axis drive mechanism 13 Component mounting section 13a Moving plate 13b Lifting mechanism 13c Lifting plate 14 Pickup unit 14a Pickup nozzle (nozzle) 14aa First part 14ab Second part 14ac Third part 14b Opening 14c Suction hole 15 Component holding section 15a Arm 15b Rotary movement mechanism 20 Mounting unit 20a Component mounting nozzle 21 Pickup camera 31 XY table mechanism 32 Moving plate 33 Support member 34 Pushing-up section 34a Pushing-up pin 51 Piezoelectric element 52 Detection element (piezoelectric element) 53, 54 Monitoring circuit 100 Pickup system 101 Control section 152a Ultrasonic generating section (sound wave generating section) 152b Ultrasonic horn 152c Suction path 153 Negative pressure generating section 201 AC power supply

Claims

1. A pickup system for non - contact pickup of components, comprising: a nozzle having a suction hole for sucking the component, and a sound wave generating unit for vibrating the nozzle to generate sound waves from the nozzle, the pickup unit outputting a detection signal corresponding to the vibration of the nozzle; a control unit for specifying an operating state regarding the pickup of the component by the pickup unit based on the detection signal; The pickup system is provided with.

2. The sound wave generating unit has a piezoelectric element for vibrating the nozzle, The pickup unit outputs, as the detection signal, a signal indicating the current flowing through the piezoelectric element. The pickup system according to claim 1.

3. The pickup unit further includes a detection element for detecting the vibration of the nozzle and outputting the detection signal. The pickup system according to claim 1.

4. The sound wave generating unit has a piezoelectric element for vibrating the nozzle, The detection element is a piezoelectric element, The dielectric constant of the detection element is larger than the dielectric constant of the piezoelectric element of the sound wave generating unit. The pickup system according to claim 3.

5. The pickup unit outputs the detection signal indicating a detection value that becomes larger as the vibration speed of the nozzle is faster. The pickup system according to claim 1.

6. The control unit specifies, as the operating state, a state where the pickup unit is not picking up the component if the detection value is equal to or greater than a first threshold value; specifies, as the operating state, a state where the pickup unit is picking up the component if the detection value is smaller than the first threshold value. The pickup system according to claim 5.

7. The control unit specifies, as the operating state, a state where the pickup unit is picking up the component in a non - contact manner if the detection value is smaller than the first threshold value and equal to or greater than a second threshold value. The pickup system according to claim 6.

8. The control unit specifies, as the operating state, a state where the component is in contact with the pickup unit if the detection value is smaller than the second threshold value which is smaller than the first threshold value. The pickup system according to claim 6.

9. The pickup system further includes a negative pressure generating unit for generating a negative pressure in the suction hole, The control unit Based on the detection signal, start the generation of the negative pressure in the negative pressure generation unit. The pickup system according to claim 1.

10. The control unit Based on the detection signal, identify whether the component has hit the nozzle as the operating state. The pickup system according to claim 1.

11. The pickup system according to any one of claims 1 to 10, A joining unit that receives the component from the pickup unit and joins the received component to another component, A joining device comprising the same.

12. The pickup system according to claim 10, A joining unit that receives the component from the pickup unit and joins the received component to another component, and The control unit When the state where the component has hit the nozzle is identified as the operating state, prohibit the joining unit from receiving the component from the pickup unit. Joining device.

13. An information processing method for a pickup unit to pick up a component in a non-contact manner, The pickup unit includes a nozzle having a suction hole for sucking the component and a sound wave generation unit for vibrating the nozzle to generate sound waves from the nozzle. The information processing method Acquire a detection signal output from the pickup unit and corresponding to the vibration of the nozzle. Based on the detection signal, identify the operating state regarding the pickup of the component by the pickup unit. Information processing method.

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