Plasma processing apparatus, substrate processing system, and fixture

The plasma processing apparatus and substrate processing system utilize a fixture with a male and female member configuration to simplify detachment and attachment, addressing the challenge of complex member detachment and attachment in existing systems, thereby reducing maintenance time and costs.

JP2025110412APending Publication Date: 2025-07-28TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2025076761
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-09
Filing Date
2025-05-02
Publication Date
2025-07-28

AI Technical Summary

Technical Problem

Existing plasma processing apparatuses and substrate processing systems face challenges in efficiently detaching and attaching constituent members, which complicates maintenance and replacement processes.

Method used

A plasma processing apparatus and substrate processing system are designed with a fixture that includes a male and female member configuration, where the female member has a housing with a tapered inner wall guiding a spherical member to facilitate axial movement, allowing for easy detachment and attachment without fasteners.

Benefits of technology

This design simplifies the detachment and attachment process, reducing maintenance time and costs by eliminating the need for fasteners, thereby enhancing operational efficiency.

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Abstract

To provide a technology for facilitating attachment and detachment between components of a plasma processing apparatus and a substrate processing system.SOLUTION: A plasma processing apparatus comprising a chamber is provided. The apparatus includes: a first member; a second member; and a fixture that is configured to attachably / detachably fix the first member and the second member along an axial direction and comprises a male type member to be fixed to the first member and a female type member to be fixed to the second member and configured to receive the male type member. The male type member comprises a shaft member that extends in the axial direction and has a diameter enlarged at its tip. The female type member includes a housing member to be fixed to the second member, a holding member to be arranged in the housing member, and a spherical member to be held by the holding member. The spherical member is configured to be guided by a taper part of an inner wall of the housing member and move inward in a radial direction when the holding member moves in a first direction which is the axial direction and a direction toward an opening.SELECTED DRAWING: Figure 3
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Description

Technical Field

[0001] Exemplary embodiments of the present disclosure relate to a plasma processing apparatus, a substrate processing system, and a fixture.

Background Art

[0002] Patent Document 1 discloses fastening an electrostatic chuck and an electrostatic chuck mounting plate with a plurality of first fasteners, and fastening a mounting table for mounting a substrate to a support member with a plurality of second fasteners.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique for facilitating detachment between constituent members of a plasma processing apparatus or a substrate processing system.

Means for Solving the Problems

[0005] In one exemplary embodiment of the present disclosure, there is provided a plasma processing apparatus including a chamber, a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction. The fixture includes a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The male member includes a shaft member extending in the axial direction and having a diameter-expanded tip. The female member includes a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member. The housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member. An inner wall of the housing member defining the housing space includes a tapered portion that contracts in diameter in the radial direction. The holding member is configured to be movable along the axial direction within the housing space while holding the spherical member. The spherical member is configured to move radially inward under the guidance of the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction and is directed toward the opening.

Advantages of the Invention

[0006] According to one exemplary embodiment of the present disclosure, it is possible to provide a technique for facilitating detachment and attachment between components of a plasma processing apparatus or a substrate processing system.

Brief Description of the Drawings

[0007]

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DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, each embodiment of the present disclosure will be described.

[0009] In one exemplary embodiment, there is provided a plasma processing apparatus including a chamber, a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction. The fixture includes a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The male member includes a shaft member extending in the axial direction and having a diameter-expanded tip. The female member includes a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member. The housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member. The inner wall of the housing member defining the housing space includes a tapered portion that contracts in diameter in the radial direction. The holding member is configured to be movable along the axial direction within the housing space while holding the spherical member. The spherical member is configured to be guided by the tapered portion of the inner wall and move radially inward when the holding member moves in a first direction that is the axial direction and is directed toward the opening.

[0010] In one exemplary embodiment, the holding member is moved in a first direction by an elastic member disposed within the accommodation space.

[0011] In one exemplary embodiment, the holding member is moved in a first direction by a first fluid flowing into the accommodation space.

[0012] In one exemplary embodiment, the holding member is moved in a second direction opposite to the first direction by a second fluid flowing into the accommodation space.

[0013] In one exemplary embodiment, the accommodation space includes a first space into which the first fluid flows and a second space into which the second fluid flows, and the space between the first space and the second space is sealed by a sealing member.

[0014] In one exemplary embodiment, the second space is provided on the opening side of the first space, and the space between the second space and the opening is sealed by a sealing member.

[0015] In one exemplary embodiment, the holding member is configured to receive a force in a first direction or a second direction opposite to the first direction via a cylinder or a motor.

[0016] In one exemplary embodiment, the holding member further includes a locking structure that restricts movement toward the inner side in the radial direction of the spherical member.

[0017] In one exemplary embodiment, at least one of the first member and the second member is a member disposed within the chamber.

[0018] In one exemplary embodiment, at least one of the first member and the second member is a member that constitutes the chamber or a member disposed outside the chamber.

[0019] In one exemplary embodiment, when the first member and the second member are fixed by a fixture, a sealing member that seals the space between the outside of the chamber and the opening is further provided.

[0020] In one exemplary embodiment, at least one of the first member and the second member constitutes an electrode of a plasma processing apparatus, and the fixture is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other in a state where the first member and the second member are fixed by the fixture.

[0021] In one exemplary embodiment, a plasma processing apparatus including a chamber, a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, wherein the female member includes a first moving body configured to be movable along the axial direction between a clamping position and an unclamping position, and a second moving body held by the first moving body and configured to move to a position that restricts axial movement of the male member at the clamping position and moves to a position that does not prevent axial movement of the male member at the unclamping position.

[0022] In one exemplary embodiment, at least one of the first member and the second member constitutes an electrode of a plasma processing apparatus, and the fixture is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other at the clamping position.

[0023] In one exemplary embodiment, a substrate processing system includes one or more chambers, a first member, a second member, and a fixture configured to removably fix the first and second members along an axial direction. The fixture includes a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The male member includes a shaft member that extends axially and has an enlarged diameter at a tip. The female member includes a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member. The housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member. The inner wall of the housing member that defines the housing space includes a tapered portion that tapers in a radial direction. The holding member is configured to be movable axially within the housing space while holding the spherical member. The spherical member is configured to be guided by the tapered portion of the inner wall to move radially inward when the holding member moves in a first direction that is the axial direction and is toward the opening. A substrate processing system is provided.

[0024] In one exemplary embodiment, the substrate processing system includes a transfer chamber having a wall surface provided with an opening communicating with a chamber, and an opening / closing device configured to be movable inside the transfer chamber and having a closing portion for closing the opening. The wall surface of the transfer chamber constitutes one of the first and second members, and the closing portion of the opening / closing device constitutes the other of the first and second members.

[0025] In one exemplary embodiment, a fixture of a substrate processing system includes a male member having a shaft member and a female member configured to removably fix the shaft member of the male member. The female member includes a first moving body configured to be movable between a clamping position and an unclamping position along an axial direction, a second moving body held by the first moving body, the second moving body being configured to move to a position that restricts axial movement of the shaft member of the male member at the clamping position and to a position that does not prevent axial movement of the male member at the unclamping position, and a third moving body configured to press the shaft member of the male member and move it along the axial direction at the unclamping position. A fixture of a substrate processing system is provided.

[0026] In one exemplary embodiment, a fixture of a substrate processing system includes a female member having an inner wall defining an accommodation space and an engaging portion provided on a part of the inner wall, and a male member having a shaft member configured to be movable along an axial direction inside the accommodation space and a moving body configured to move between a clamping position where it engages with the engaging portion of the female member and an unclamping position where it does not engage with the engaging portion of the female member as the shaft member moves in the axial direction. The shaft member is configured to be able to move axially and press the inner wall of the female member when the engaging portion is in the unclamping position. A fixture of a substrate processing system is provided.

[0027] In one exemplary embodiment, a substrate processing system includes the above-described fixture, a transfer chamber having a wall surface provided with an opening communicating with a chamber, and an opening / closing device configured to be movable inside the transfer chamber and having a closing portion for closing the opening. One of the male member or the female member is provided on the wall surface of the transfer chamber, and the other of the male member or the female member is directed toward the closing portion of the opening / closing device. A substrate processing system is provided.

[0028] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are denoted by the same reference numerals, and redundant descriptions are omitted. Unless otherwise specified, the positional relationships such as up, down, left, and right are described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and the actual ratios are not limited to the ratios shown in the drawings.

[0029] <Configuration Example of Plasma Processing System> FIG. 1 is a diagram for explaining a configuration example of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing apparatus 1 and a control unit 2. The plasma processing system is an example of a substrate processing system, and the plasma processing apparatus 1 is an example of a substrate processing apparatus. The plasma processing apparatus 1 includes a plasma processing chamber 10, a substrate support unit 11, and a plasma generation unit 12. The plasma processing chamber 10 has a plasma processing space. Further, the plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space and at least one gas discharge port for discharging gas from the plasma processing space. The gas supply port is connected to a gas supply unit 20 described later, and the gas discharge port is connected to an exhaust system 40 described later. The substrate support unit 11 is disposed in the plasma processing space and has a substrate support surface for supporting a substrate.

[0030] The plasma generation unit 12 is configured to generate plasma from at least one processing gas supplied into the plasma processing space. The plasma formed in the plasma processing space may be capacitively coupled plasma (CCP), inductively coupled plasma (ICP), electron-cyclotron-resonance plasma (ECR plasma), helicon wave plasma (HWP), surface wave plasma (SWP), or the like. Also, various types of plasma generation units including an AC (alternating current) plasma generation unit and a DC (direct current) plasma generation unit may be used. In one embodiment, the AC signal (AC power) used in the AC plasma generation unit has a frequency within the range of 100 kHz to 10 GHz. Accordingly, the AC signal includes RF (radio frequency) signals and microwave signals. In one embodiment, the RF signal has a frequency within the range of 100 kHz to 150 MHz.

[0031] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to execute various processes described in the present disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 so as to execute the various processes described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is realized by, for example, a computer 2a. The processing unit 2a1 may be configured to perform various control operations by reading a program from the storage unit 2a2 and executing the read program. This program may be stored in the storage unit 2a2 in advance, or may be acquired via a medium when necessary. The acquired program is stored in the storage unit 2a2 and read from the storage unit 2a2 by the processing unit 2a1 and executed. The medium may be various storage media readable by the computer 2a, or may be a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network).

[0032] Hereinafter, a configuration example of a capacitively coupled plasma processing apparatus as an example of the plasma processing apparatus 1 will be described. FIG. 2 is a diagram for explaining a configuration example of a capacitively coupled plasma processing apparatus.

[0033] The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support unit 11 and a gas introduction unit. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas introduction unit includes a shower head 13. The substrate support unit 11 is disposed within the plasma processing chamber 10. The shower head 13 is disposed above the substrate support unit 11. In one embodiment, the shower head 13 constitutes at least a part of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 13, the side wall 10a of the plasma processing chamber 10, and the substrate support unit 11. The plasma processing chamber 10 is grounded. The shower head 13 and the substrate support unit 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0034] The substrate support unit 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region 111a for supporting the substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of the substrate W. The annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111 in a plan view. The substrate W is disposed on the central region 111a of the main body portion 111, and the ring assembly 112 is disposed on the annular region 111b of the main body portion 111 so as to surround the substrate W on the central region 111a of the main body portion 111. Accordingly, the central region 111a is also referred to as a substrate support surface for supporting the substrate W, and the annular region 111b is also referred to as a ring support surface for supporting the ring assembly 112.

[0035] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive member. The conductive member of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic member 1111a and an electrostatic electrode 1111b disposed within the ceramic member 1111a. The ceramic member 1111a has a central region 111a. In one embodiment, the ceramic member 1111a also has an annular region 111b. Note that other members surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member, may have the annular region 111b. In this case, the ring assembly 112 may be disposed on the annular electrostatic chuck or the annular insulating member, or may be disposed on both the electrostatic chuck 1111 and the annular insulating member. Also, at least one RF / DC electrode coupled to the RF power supply 31 and / or the DC power supply 32 described later may be disposed within the ceramic member 1111a. In this case, at least one RF / DC electrode functions as a lower electrode. When the bias RF signal and / or the DC signal described later is supplied to at least one RF / DC electrode, the RF / DC electrode is also referred to as a bias electrode. Note that the conductive member of the base 1110 and at least one RF / DC electrode may function as a plurality of lower electrodes. Also, the electrostatic electrode 1111b may function as a lower electrode. Accordingly, the substrate support portion 11 includes at least one lower electrode.

[0036] The ring assembly 112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge ring is formed of a conductive material or an insulating material, and the cover ring is formed of an insulating material.

[0037] Further, the substrate support portion 11 may include a temperature control module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 1110a, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path 1110a. In one embodiment, the flow path 1110a is formed in the base 1110, and one or more heaters are disposed in the ceramic member 1111a of the electrostatic chuck 1111. Further, the substrate support portion 11 may include a heat transfer gas supply portion configured to supply a heat transfer gas to a gap between the back surface of the substrate W and the central region 111a.

[0038] The shower head 13 is configured to introduce at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas introduction ports 13c. The process gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the plurality of gas introduction ports 13c. Further, the shower head 13 includes at least one upper electrode. Note that the gas introduction portion may include, in addition to the shower head 13, one or more side gas injection portions (SGI) attached to one or more openings formed in the side wall 10a.

[0039] The gas supply unit 20 may include at least one gas source 21 and at least one flow rate controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one process gas from the corresponding gas source 21 to the shower head 13 via the corresponding flow rate controller 22. Each flow rate controller 22 may include, for example, a mass flow controller or a pressure control type flow rate controller. Further, the gas supply unit 20 may include at least one flow rate modulation device that modulates or pulses the flow rate of at least one process gas.

[0040] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. Thereby, plasma is formed from at least one process gas supplied to the plasma processing space 10s. Accordingly, the RF power supply 31 can function as at least a part of the plasma generation unit 12. Also, by supplying a bias RF signal to at least one lower electrode, a bias potential is generated on the substrate W, and the ion component in the formed plasma can be drawn into the substrate W.

[0041] In one embodiment, the RF power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generation unit 31a may be configured to generate a plurality of source RF signals having different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0042] The second RF generation unit 31b is coupled to at least one lower electrode via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency within the range of 100 kHz to 60 MHz. In one embodiment, the second RF generation unit 31b may be configured to generate a plurality of bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0043] Further, the power supply 30 may include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generation unit 32a and a second DC generation unit 32b. In one embodiment, the first DC generation unit 32a is connected to at least one lower electrode and is configured to generate a first DC signal. The generated first DC signal is applied to at least one lower electrode. In one embodiment, the second DC generation unit 32b is connected to at least one upper electrode and is configured to generate a second DC signal. The generated second DC signal is applied to at least one upper electrode.

[0044] In various embodiments, the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses may have a pulse waveform that is rectangular, trapezoidal, triangular, or a combination thereof. In one embodiment, a waveform generation unit for generating a sequence of voltage pulses from a DC signal is connected between the first DC generation unit 32a and at least one lower electrode. Accordingly, the first DC generation unit 32a and the waveform generation unit constitute a voltage pulse generation unit. When the second DC generation unit 32b and the waveform generation unit constitute a voltage pulse generation unit, the voltage pulse generation unit is connected to at least one upper electrode. The voltage pulses may have a positive polarity or a negative polarity. Also, the sequence of voltage pulses may include one or more positive-polarity voltage pulses and one or more negative-polarity voltage pulses within one period. Note that the first and second DC generation units 32a and 32b may be provided in addition to the RF power source 31, or the first DC generation unit 32a may be provided in place of the second RF generation unit 31b.

[0045] The exhaust system 40 can be connected to, for example, a gas outlet 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump may include a turbo molecular pump, a dry pump, or a combination thereof.

[0046] <An example of the fixture F> FIG. 3 is a diagram schematically showing an example of a fixture F according to an embodiment. In one embodiment, the fixture F may be used to fix between the components of the plasma processing apparatus 1 shown in FIGS. 1 and 2. The fixture F is configured to detachably fix two members of the plasma processing apparatus 1 along the axial direction (the Z-axis direction in FIG. 3). The axial direction may vary depending on the arrangement of the components fixed by the fixture F. The axial direction may be a direction perpendicular (the vertical direction in FIG. 2) to the horizontal plane (the main surface of the substrate support portion 11) of the plasma processing apparatus 1, a parallel direction (the left-right direction in FIG. 2), or an oblique direction.

[0047] As shown in FIG. 3, the fixture F includes a male member F1 and a female member F2. The male member F1 is fixed to a first member CP1 (not shown) which is a component of the plasma processing apparatus 1. The female member F2 is fixed to a second member CP2 (not shown) which is a component of the plasma processing apparatus 1.

[0048] In one embodiment, at least one of the first member CP1 and the second member CP2 may be a member (for example, an electrostatic chuck 1111 or a base 1110, etc.) disposed in the plasma processing chamber 10 (hereinafter also referred to as "chamber 10"). For example, the first member CP1 may be the electrostatic chuck 1111 and the second member CP2 may be the base 1110. Also, for example, the first member CP1 may be the base 1110 and the second member CP2 may be the electrostatic chuck 1111. In one embodiment, the first member CP1 and / or the second member CP2 may constitute the lower electrode of the plasma processing apparatus 1. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a member (for example, a shower head 13 or a side wall 10a, etc.) that constitutes the chamber 10. For example, the first member CP1 may be the shower head 13 and the second member CP2 may be the side wall 10a. Also, for example, the first member CP1 may be the side wall 10a and the second member CP2 may be the shower head 13. Also, for example, when the shower head 13 is composed of a plurality of members, the first member CP1 may be one member of the shower head 13 (in one example, the top plate facing the plasma processing space 10s), and the second member CP2 may be another member of the shower head 13 (for example, a support that supports the top plate). In one embodiment, the first member CP1 and / or the second member CP2 may constitute the upper electrode of the plasma processing apparatus 1. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a member (for example, a gas supply unit 20 or an exhaust system 40, etc.) outside the chamber 10.

[0049] In one embodiment, the first member CP1 and the second member CP2 may be composed of one or more components. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a component that is replaced due to wear, modification, or the like.

[0050] As shown in FIG. 3, the male member F1 includes a shaft member F10 extending along the axial direction (z direction). The shaft member F10 has a head portion F102 with a diameter enlarged at one end in the axial direction. The male member F1 may include a support member F12 that supports the other end of the shaft member F10. In one embodiment, the male member F1 may be fixed to the first member CP1 (not shown) by fixing the support member F12 to the first member CP1. In one embodiment, a first seal member SL1 may be provided on the surface of the support member F12.

[0051] In one embodiment, the male member F1 may not include the support member F12. In this case, the male member F1 is fixed to the first member CP1 by fixing the other end of the shaft member F10 to the first member CP1.

[0052] As shown in FIG. 3, the female member F2 includes a housing member F20, a holding member F22 disposed within the housing member F20, and a spherical member F24 held by the holding member F22.

[0053] The housing member F20 includes an outer wall W1 and an inner wall W2. In one embodiment, at least a part of the outer wall W1 of the housing member F20 is fixed to the second member CP2 (not shown).

[0054] Note that in one embodiment, a part of the second member CP2 may constitute a part of the outer wall W1 and the inner wall W2 of the housing member F20. For example, the upper end F200 of the housing member F20 in FIG. 3 may be a part of the second member CP2 or may be integrated with the second member CP2. In this case, a second seal member SL2 for sealing between the upper end F200 of the housing member F20 and the remaining portion thereof may be provided.

[0055] The inner wall W2 of the housing member F20 defines the housing space SP and the opening OP. The housing space SP houses the holding member F22, the spherical member F24, etc. In one embodiment, the housing space SP may be divided into a plurality of spaces sealed from each other. For example, in the example shown in FIG. 3, the housing space SP is divided into a first space SP1, a second space SP2, and a third space SP3 from the distal side to the proximal side of the opening OP. The first space SP1 and the second space SP2 may be configured to receive a first fluid FL1 and a second fluid FL2, which will be described later, respectively. In this case, the first space SP1 communicates with an opening through which the first fluid FL1 flows in and / or out. Also, the second space SP2 communicates with an opening through which the second fluid FL2 flows in and / or out. The third space SP3 is a space in which the spherical member F24 is disposed. In one embodiment, a third sealing member SL3 may be provided between the first space SP1 and the second space SP2. In one embodiment, a fourth sealing member SL4 may be provided between the second space SP2 and the third space SP3.

[0056] The opening OP communicates with the third space SP3. The opening OP has a diameter larger than that of the head F102 of the shaft member F10. Thereby, the shaft member F10 can be inserted into and removed from the housing space SP through the opening OP. Further, a tapered portion TP is provided on the inner wall W2 that defines the third space SP3. As shown in FIG. 3, the tapered portion TP has a reduced diameter along a first direction (the direction indicated by Z1 in FIG. 3) that is an axial direction and is a direction toward the opening OP. The tapered portion TP functions as a guide member that guides the spherical member F24 along the radial direction (the Y-axis direction in FIG. 3), as will be described later.

[0057] The holding member F22 is configured to be movable along the axial direction within the housing space SP while holding the spherical member F24. Specifically, the holding member F22 is movable in both a first direction toward the opening OP within the housing space SP and a second direction (the direction indicated by Z2 in FIG. 3) that is opposite to the first direction. That is, the holding member F22 can reciprocate along the axial direction within the housing space SP. The holding member F22 is an example of a first moving body.

[0058] In one embodiment, the second fluid FL2 may flow into the second space SP2. The movement of the holding member F22 in the second direction may be caused by the second fluid FL2 flowing into the second space SP2 pressing against the first surface F220 (the surface facing the first direction) of the holding member F22.

[0059] In one embodiment, an elastic member F26 (e.g., a compression spring) may be disposed in the first space SP1. The movement of the holding member F22 in the first direction may be caused by the elastic member F26 pressing against the second surface F222 (the surface facing the second direction) of the holding member F22. In one embodiment, the first fluid FL1 may flow into the first space SP1. And the movement of the holding member F22 in the first direction may be caused by the first fluid FL1 flowing into the first space SP1 pressing against the second surface F222 of the holding member F22. In one embodiment, the movement of the holding member F22 in the first direction may be caused by the elastic member F26 and the second fluid FL2 pressing against the second surface F222 of the holding member F22.

[0060] In one embodiment, the holding member F22 may be provided with a locking structure that restricts movement of the spherical member F24 inward in the radial direction (Y-axis in FIG. 3). The locking structure may be, for example, a protrusion F224 as shown in FIG. 3.

[0061] The spherical member F24 is held by the holding member F22. When the spherical member F24 is moved in the axial direction (Z-axis direction in FIG. 3) by the movement of the holding member F22, it is simultaneously guided by the tapered portion TP of the inner wall W2 and also moves along the radial direction (Y-axis direction in FIG. 3). The spherical member F24 is an example of a second moving body. In one embodiment, two or more spherical members F24 may be provided.

[0062] As described above, the first member CP1 and the second member CP2 may form part of the electrode (upper electrode or lower electrode) of the plasma processing apparatus 1. Including such a case, in one embodiment, the male member F1 and the female member F2 of the fixture F may be configured to be electrically connectable to each other. For example, the support member F12, the shaft member F10 of the male member F1, the spherical member F24, the holding member F22, the elastic member F26 of the female member F2, and the upper end F200 of the housing member F20 may be formed of a conductive member. As shown in FIG. 5(c) described later, when the male member F1 is fixed to the female member F2 so as not to be movable in the axial direction, the shaft member F10 and the spherical member F24 come into contact with each other. Then, a current conduction path is formed by the support member F12, the shaft member F10 of the male member F1, the spherical member F24, the holding member F22, the elastic member F26 of the female member F2, and the upper end F200 of the housing member F20. Thereby, the male member F1 and the female member F2 are electrically connected. That is, the fixture F can function as a conduction path between the first member CP1 and the second member CP2 in a state where the first member CP1 and the second member CP2 are fixed. For example, in a state where the first member CP1 and the second member CP2 are fixed, the current supplied to the first member CP1 can be supplied to the second member CP2 via the fixture F. Also, for example, in a state where the first member CP1 and the second member CP2 are fixed, the current supplied to the second member CP2 can be supplied to the first member CP1 via the fixture F.

[0063] FIGS. 4A and 4B are diagrams for explaining an example of the moving position of the spherical member. FIG. 4A is an example of a state where the holding member F22 has moved maximally in the second direction (the direction away from the opening OP) of the opening OP (hereinafter this position is also referred to as the "unclamped position"). FIG. 4B is an example of a state where the holding member F22 has moved maximally in the first direction (the direction approaching the opening OP) (hereinafter this position is also referred to as the "clamped position").

[0064] As shown in FIG. 4A, in the unclamped position, the spherical member F24 abuts against the upper (distal with respect to the opening OP) portion of the tapered portion TP. At this time, the radial distance between the spherical members F24 is D1. D1 is larger than the maximum width of the head F102 of the shaft member F10. As shown in FIG. 4B, in the clamped position, the spherical member F24 abuts against the lower (proximal with respect to the opening OP) portion of the tapered portion TP. At this time, the radial distance between the spherical members F24 is D2. D2 is smaller than the maximum width of the head F102 of the shaft member F10.

[0065] <Example of use of the fixture F> FIG. 5 is a diagram showing an example of a method of using the fixture F. FIG. 5 is an example of a method of fixing the male member F1 of the fixture F (and the first member CP1 fixed to the male member F1) to the female member F2 (and the second member CP2 fixed to the female member F2).

[0066] First, the male member F1 of the fixture F is moved in the second direction (the direction indicated by Z2 in FIG. 5) toward the female member F2. Note that the female member F2 may be moved in the first direction toward the male member F1. Then, the shaft member F10 of the male member F1 is inserted through the opening OP of the housing member F20 toward the third space SP3 (see FIG. 5(a)). At this time, the holding member F22 of the female member F2 is in the unclamped position.

[0067] When the support member F12 of the male member F1 abuts against the outer wall W1 of the housing member F20 of the female member F2, the shaft member F10 of the male member F1 is disposed within the third space SP3 of the housing member F20 (see FIG. 5(b)). Next, the second fluid FL2 flows out from the second space SP2. Then, the holding member F22 of the female member F2 is moved in the first direction (the direction indicated by Z1 in FIG. 5) by the elastic member F26. At this time, the first fluid FL1 may flow into the first space SP1 in order to facilitate the movement in the first direction.

[0068] When the holding member F22 of the female member moves to the clamping position, the radial distance between the spherical members F24 decreases, and the head F102 of the shaft member F10 is sandwiched between the spherical members F24 (see Fig. 5(c)). The movement of the spherical members F24 outward in the radial direction is restricted by the tapered portion TP of the inner wall W2. Therefore, the axial movement of the shaft member F10 is restricted. As a result, the male member F1 is fixed axially immovable relative to the female member F2. Consequently, the first member CP1 is fixed relative to the second member CP2. When removing the male member F1 of the fixture F from the female member F2 (removing the first member CP1 from the second member CP2), the reverse procedure to the above may be executed.

[0069] By using the fixture F, the detachment and attachment between the members of the plasma processing apparatus 1 can be performed by mechanically operating the fixture F without using a fastener (screw). Thereby, the detachment and attachment of the constituent members in the plasma processing apparatus 1 can be easily performed. By using the fixture F, the man-hour and working time in maintenance such as the assembly of the plasma processing apparatus, the replacement of consumables, and the modification can be reduced compared to the case of using a fastener.

[0070] <Another example of the drive mechanism of the holding member> Figs. 6A and 6B are diagrams showing another example of the drive mechanism of the holding member. In one embodiment, the upper end of the holding member F22 of the female member F2 may be connected to the cylinder member F24 as shown in Fig. 6A. The cylinder member F24 may be configured to reciprocate along the axial direction and thereby apply forces in the first direction and the second direction to the holding member F22. In one embodiment, the upper end of the holding member F22 of the female member F2 may be connected to the rack of the rack and pinion system F29 as shown in Fig. 6B. The rack and pinion system F29 transmits the rotational motion of the motor to the rack via the pinion gear. The rack may be configured to reciprocate along the axial direction according to the rotational direction of the motor and thereby apply forces in the first direction and the second direction to the holding member F22. <Another example of the fixture F>

[0071] FIG. 7 is a diagram for explaining another example of the fixture F. In the example shown in FIG. 7, the other end of the shaft member F10 of the male member F1 is fixed so as to be embedded in the first member CP1. Also, the female member F2 is fixed so that its entirety is embedded in the second member CP2. In one embodiment, a first seal member SL1 may be disposed on the opposing surfaces of the first member CP1 and the second member CP2. The first seal member SL1 seals between the external space SPout (for example, the space outside the chamber 10) and the opening OP of the housing member F20.

[0072] In one embodiment, each component of the fixture F may be composed of a plurality of parts. For example, as shown in FIG. 7, the housing member F20 of the female member F2 may be composed of a plurality of parts (F20A to F20C).

[0073] FIG. 8 is a diagram for explaining another example of the fixture F and its operation. In the example shown in FIG. 8, the female member F2 includes a pressing member F25 that presses the shaft member F10 of the male member F1. The pressing member F25 is disposed in the accommodation space SP of the housing member F20 and is configured to be movable in the axial direction. The pressing member F25 includes a head portion F250 and a shaft portion F252 that extends axially from the center of the head portion F250. The accommodation space SP includes a fourth space SP4 and a first space SP1 partitioned by the head portion F250. The tip of the shaft portion F252 is provided so as to penetrate the central portion of the holding member F22. The pressing member F25 is an example of a third moving body.

[0074] When the holding member F22 moves from the clamp position (see FIG. 8(a)) to the unclamp position (see FIG. 8(b)), the engagement between the spherical member F24 and the head portion F102 of the shaft member F10 is released. In this state, a fourth fluid FL4 flows into the fourth space SP4. Then, the pressing member F25 is moved in the first direction (the direction indicated by Z1 in FIG. 8(b)). At this time, the first fluid FL1 may be caused to flow out from the first space SP1, or the first space SP1 may be sealed so that the first fluid FL1 does not flow out.

[0075] As the pressing member F25 moves in the first direction, the shaft portion F252 abuts against the head portion F102 of the shaft member F10, and the shaft member F10 is pushed out along the first direction (see Fig. 8(c)). As a result, the female die member F2 (and the second member CP2) and the male die member F1 (and the first member CP1) are separated from each other (hereinafter this position is referred to as the "pushing-out position").

[0076] By the way, when the male die member F1 and the female die member F2 are fixed to each other, for example, at their boundary surface TH1, in a state where the holding member F22 is in the unclamped position (Fig. 8(b)). In such a case, the two cannot be separated unless the fixation is released. Also, it is difficult to detect non-contact whether such fixation actually occurs or not.

[0077] In this regard, in the configuration shown in Fig. 8, at the unclamped position (Fig. 8(b)), a pressing member F25 for pressing the shaft member F10 of the male die member F1 is provided. Therefore, even if fixation has occurred, the male die member F1 and the female die member F2 can be separated (Fig. 8(c)).

[0078] In one embodiment, during the transition from the unclamped position (Fig. 8(b)) to the pushing-out position (Fig. 8(c)), the first space SP1 may be sealed to detect the pressure in the first space SP1. Thereby, it can be detected whether the pressing member F25 has actually reached the pushing-out position. For example, when the pressure in the first space SP1 has risen to a given pressure after a certain period of time, it is determined that the pressing member F25 has moved to the pushing-out position. Also, when the pressure in the first space SP1 has not reached the given pressure even after a certain period of time, it is determined that the pressing member F25 cannot move to the pushing-out position (the male die member F1 and the female die member F2 are firmly fixed). Thereby, it can be detected whether the male die member F1 and the female die member F2 can actually be separated.

[0079] FIG. 9 is a diagram for explaining another example of the fixture F and its operation. In the example shown in FIG. 9, the fixture F includes a female member F3 and a male member F4. The female member F3 includes an inner wall W3 that defines an accommodation space SP5. A part of the inner wall W3 includes a tapered engagement portion EG that expands in diameter in the radial direction.

[0080] The male member F4 includes a support base F40, a shaft member F42, a spherical member F44, a holding member F46, and a housing member F48.

[0081] The support base F40 is provided in the accommodation space of the housing member F48 and defines a sixth space SP6 and a seventh space SP7. The support base F40 moves in a first direction (z1 direction) along the axial direction and a second direction (z2 direction) opposite to the first direction in accordance with the inflow or outflow of fluid into or from the sixth space SP6 and the seventh space SP7, respectively. The shaft member F42 is fixed on the support base F40 and moves inside the accommodation space SP5 in the first direction and the second direction as the support base F40 moves. The shaft member F42 includes a neck portion F420 that contracts in diameter along the axial direction.

[0082] The spherical member F44 moves between a clamp position and an unclamp position when the female member F3 and the male member F4 are in contact with each other.

[0083] Specifically, when fluid flows into the sixth space SP6 and the support base F40 and the shaft member F42 move in the first direction (z1 direction), the spherical member F44 moves radially outward (at this time, the axial movement of the spherical member F44 is restricted by the holding member F46). As a result, the spherical member F44 engages with the engagement portion EG of the female member F3 (see FIG. 9(a)). This position is the clamp position, and the female member F3 and the male member F4 are fixed so as not to be movable relative to each other in the axial direction.

[0084] Also, when fluid flows into the seventh space SP7 and the support base F40 and the shaft member F42 move in the second direction (z2 direction), the spherical member F44 moves radially inward along the neck portion F420 of the shaft member F42 (at this time, the axial movement of the spherical member F44 is restricted by the holding member F46). As a result, the engagement between the spherical member F44 and the engagement portion EG of the female die member F3 is released (see FIG. 9(b)). This position is the unclamp position, and the female die member F3 and the male die member F4 become movable relative to each other in the axial direction.

[0085] In this state, fluid may further flow into the seventh space SP7. Then, the support base F40 and the shaft member F42 move further in the second direction. At this time, fluid may be allowed to flow out from the sixth space SP6, or the sixth space SP6 may be sealed so that fluid does not flow out. As the support base F40 and the shaft member F42 move in the second direction, the shaft member F42 pushes out the inner wall W3 of the female die member F3 along the second direction (see FIG. 9(c)). As a result, the female die member F3 and the male die member F4 are separated from each other (hereinafter, this position is referred to as the "separation position").

[0086] By the way, even when the spherical member F44 is in the unclamp position (FIG. 9(b)), the female die member F3 and the male die member F4 may be fixed to each other, for example, at their interface TH2. In such a case, the two cannot be separated unless the fixation is released. Also, it is difficult to detect non-contact whether such fixation actually occurs.

[0087] In this regard, in the configuration shown in FIG. 9, by moving the support base F40 and the shaft member F42 in the second direction from the unclamped position (FIG. 9(b)), the inner wall W3 of the female mold member F3 can be pressed in the second direction (FIG. 9(c)). Thereby, even when the female mold member F3 and the male mold member F4 are fixed to each other, they can be separated. In addition, in the transition from the unclamped position (FIG. 9(b)) to the separated position (FIG. 9(c)), the sixth space SP6 may be sealed and the pressure in the sixth space SP6 may be detected. And when the pressure in the sixth space SP6 rises to a given pressure after a certain period of time, it is determined that the support base F40 and the shaft member F42 have moved to the separated position. Also, when the pressure in the sixth space SP6 does not reach the given pressure even after a certain period of time, it is determined that the support base F40 and the shaft member F42 have not been able to move to the separated position (the female mold member F3 and the male mold member F4 are firmly fixed). Thereby, it is possible to detect whether the female mold member F3 and the male mold member F4 can actually be separated.

[0088] <Application Example to Substrate Processing System> In one embodiment, the above-described fixture F may be used to fix between components of a substrate processing system (hereinafter also referred to as "substrate processing system PS") including one or more chambers.

[0089] FIG. 10 is a diagram for explaining a configuration example of the substrate processing system PS. The substrate processing system PS includes substrate processing chambers PM1 to PM6 (hereinafter also collectively referred to as "substrate processing modules PM"), a transfer module TM, load lock modules LLM1 and LLM2 (hereinafter also collectively referred to as "load lock modules LLM"), a loader module LM, and load ports LP1 to LP3 (hereinafter also collectively referred to as "load ports LP"). The control unit CT controls each component of the substrate processing system PS to execute a given process on the substrate W.

[0090] The substrate processing module PM has a chamber, and inside it, various processes such as etching, trimming, film deposition, annealing, doping, lithography, cleaning, ashing, etc. are executed on the substrate W. At least one of the substrate processing chambers PM1 to PM6 may be the chamber 10 of the plasma processing apparatus 1 shown in FIG. 1 or FIG. 2. Also, at least one of the substrate processing chambers PM1 to PM6 may be part of a plasma processing apparatus using any plasma source such as inductively coupled plasma or microwave plasma. At least one of the substrate processing chambers PM1 to PM6 may be a measurement module, and for example, the film thickness of the film formed on the substrate W, the dimensions of the pattern formed on the substrate W, etc. may be measured using optical means.

[0091] The transfer module TM has a transfer device for transferring the substrate W, and transfers the substrate W between the substrate processing modules PM or between the substrate processing module PM and the load lock module LLM. The substrate processing module PM and the load lock module LLM are arranged adjacent to the transfer module TM. The transfer module TM, the substrate processing module PM, and the load lock module LLM are spatially isolated or connected by an openable and closable gate valve.

[0092] In one embodiment, the transfer device included in the transfer module TM transfers the substrate W from the transfer module TM to the plasma processing space 10s of the plasma processing apparatus 1, which is an example of the substrate processing module PM. The transfer device places the substrate W in the central region 111a of the substrate support portion 11. The plasma processing apparatus 1 may have a lifter, and the transfer device may place the substrate W on the lifter. The lifter is configured to be able to move up and down inside a plurality of through holes provided in the substrate support portion 11. When the lifter moves up, the tip of the lifter protrudes from the central region 111a of the substrate support portion 11, and the substrate W is held at this position. When the lifter moves down, the tip of the lifter is accommodated in the substrate support portion 11, and the substrate W is placed in the central region 111a of the substrate support portion 11. As an example, the transfer device may be a handler for transferring substrates such as silicon wafers.

[0093] The load lock modules LLM1 and LLM2 are provided between the transfer module TM and the loader module LM. The load lock module LLM can switch its internal pressure between atmospheric pressure and vacuum. "Atmospheric pressure" may be the pressure outside each module included in the substrate processing system PS. Furthermore, "vacuum" may be a pressure lower than atmospheric pressure, for example, a medium vacuum of 0.1 Pa to 100 Pa. The load lock module LLM transfers the substrate W from the loader module LM, which is at atmospheric pressure, to the transfer module TM, which is at vacuum, and also transfers the substrate W from the transfer module TM, which is at vacuum, to the loader module LM, which is at atmospheric pressure.

[0094] The loader module LM has a transport device for transporting the substrate W, and transports the substrate W between the load lock module LLM and the load board LP. Inside the load port LP, for example, a FOUP (Front Opening Unified Pod) capable of storing 25 substrates W or an empty FOUP can be placed. The loader module LM takes out the substrate W from the FOUP in the load port LP and transports it to the load lock module LLM. The loader module LM also takes out the substrate W from the load lock module LLM and transports it to the FOUP in the load board LP.

[0095] The controller CT controls each component of the substrate processing system PS to perform a given process on the substrate W. The controller CT stores a recipe in which a process procedure, process conditions, transport conditions, etc. are set, and controls each component of the substrate processing system PS to perform a given process on the substrate W in accordance with the recipe. The controller CT may have some or all of the functions of the controller 2 shown in FIG.

[0096] FIG. 11 is a diagram for explaining an application example of the fixture F in the substrate processing system PS described above. As shown in FIG. 11, an opening TM100 is provided in a part of a wall surface TM10 that constitutes a vacuum chamber of the transfer module TM. In one example, the opening TM100 communicates with the substrate processing module PM. In one example, the opening TM100 communicates with the load lock module LLM.

[0097] Inside the transfer module TM, an opening / closing device M1 for opening and closing the opening TM100 is provided. The opening / closing device M1 includes a closing part M10 and a base M12. The opening / closing device M1 moves on the floor surface TM12 of the transfer module TM. When the opening / closing device M1 moves to the front of the opening TM100 and presses the closing part M10 against the opening TM100, the opening TM100 is sealed. When the opening / closing device M1 moves to another position, the sealing of the opening TM100 by the closing part M10 is released.

[0098] In one embodiment, a plurality of coils may be arranged on the floor surface TM12 of the transfer module TM, and a permanent magnet may be provided on the base M12 of the opening / closing device M1. In this case, when an electric current is supplied to each coil on the floor surface TM12, a magnetic field is generated on the floor surface TM12, and the opening / closing device M1 is magnetically levitated and moves on the floor surface TM12. By controlling the current value of each coil, the position, orientation, and levitation amount of the opening / closing device M1 are controlled.

[0099] In one embodiment, the fixture F may be used to fix the wall surface TM10 of the transfer module TM and the opening / closing device M1. For example, the female member F2 (F3) of the fixture F may be provided in a region TM102 surrounding the opening TM100 of the wall surface TM10, and the male member F1 (F4) may be provided at a corresponding position of the closing part M10. Also, for example, the male member F1 (F4) of the fixture F may be provided in the region TM102, and the female member F2 (F3) may be provided at a corresponding position of the closing part M10. Note that one or more fixtures F may be provided.

[0100] By using the fixture F, the closing portion M10 of the opening / closing device M1 and the wall surface TM10 can be fixed more firmly. As a result, even when the pressure difference between the communication destination of the opening TM100 and the transfer module TM is large, leakage of fluid through the opening TM100 is suppressed. Also, by using the fixture F, the closing portion M10 and the wall surface TM10 are mechanically fixed. Thereby, for example, when the opening / closing device M1 is magnetically driven, the power required to fix the position of the opening / closing device M1 can be reduced.

[0101] Embodiments of the present disclosure further include the following aspects.

[0102] (Appendix 1) A plasma processing apparatus including a chamber, a first member, a second member, a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member includes a shaft member extending in the axial direction and having a diameter-expanded tip, the female member, includes a housing member fixed to the second member, a holding member disposed in the housing member, and a spherical member held by the holding member, the housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member, and an inner wall of the housing member defining the housing space includes a tapered portion that contracts in a radial direction, the holding member is configured to be movable along the axial direction within the housing space while holding the spherical member, the spherical member is configured to be guided by the tapered portion of the inner wall and move inward in the radial direction when the holding member moves in a first direction that is the axial direction and toward the opening, A plasma processing apparatus.

[0103] (Appendix 2) The holding member is the plasma processing apparatus according to Appendix 1, which is moved in the first direction by an elastic member disposed in the accommodation space.

[0104] (Appendix 3) The holding member is the plasma processing apparatus according to Appendix 1 or Appendix 2, which is moved in the first direction by a first fluid flowing into the accommodation space.

[0105] (Appendix 4) The holding member is the plasma processing apparatus according to any one of Appendices 1 to 3, which is moved in a second direction opposite to the first direction by a second fluid flowing into the accommodation space.

[0106] (Appendix 5) The accommodation space includes a first space into which a first fluid flows and a second space into which a second fluid flows, and a seal member seals between the first space and the second space. The plasma processing apparatus according to any one of Appendices 1 to 4.

[0107] (Appendix 6) The second space is provided closer to the opening side than the first space, and a seal member seals between the second space and the opening. The plasma processing apparatus according to Appendix 5.

[0108] (Appendix 7) The holding member is configured to receive a force in the first direction or a force in a second direction opposite to the first direction via a cylinder or a motor. The plasma processing apparatus according to any one of Appendices 1 to 6.

[0109] (Appendix 8) The holding member further includes a locking structure that restricts movement of the spherical member toward the inside in the radial direction. The plasma processing apparatus according to any one of Appendices 1 to 7.

[0110] (Appendix 9) The plasma processing apparatus according to any one of Appendices 1 to 8, wherein at least one of the first member and the second member is a member disposed in the chamber.

[0111] (Appendix 10) The plasma processing apparatus according to any one of Appendices 1 to 9, wherein at least one of the first member and the second member is a member constituting the chamber or a member disposed outside the chamber.

[0112] (Appendix 11) The plasma processing apparatus according to any one of Appendices 1 to 10, further comprising a seal member that seals between the space outside the chamber and the opening in a state where the first member and the second member are fixed by the fixture.

[0113] (Appendix 12) The plasma processing apparatus according to any one of Appendices 1 to 11, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixture is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other in a state where the first member and the second member are fixed by the fixture.

[0114] (Appendix 13) A plasma processing apparatus including a chamber, a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The female member includes a first moving body configured to be movable along the axial direction between a clamping position and an unclamping position, and a second moving body held by the first moving body. The second moving body moves to a position that restricts the axial movement of the male member at the clamping position and moves to a position that does not prevent the axial movement of the male member at the unclamping position. A plasma processing apparatus comprising the same.

[0115] (Appendix 14) The plasma processing apparatus according to Appendix 13, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixture is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other at the clamping position.

[0116] (Appendix 15) A substrate processing system including one or more chambers, a first member, a second member, a fixture configured to detachably fix the first member and the second member along the axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The male member includes a shaft member extending in the axial direction and having a diameter-expanded tip. The female member, includes a housing member fixed to the second member, a holding member disposed in the housing member, and a spherical member held by the holding member. The housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member. The inner wall of the housing member defining the housing space includes a tapered portion that contracts in diameter in the radial direction. The holding member is configured to be movable along the axial direction within the housing space while holding the spherical member. When the holding member moves in a first direction which is the axial direction and is the direction toward the opening, the spherical member is configured to be guided by the tapered portion of the inner wall and move inward in the radial direction. Substrate processing system.

[0117] (Appendix 16) The substrate processing system includes a transfer chamber having a wall surface provided with an opening communicating with a chamber, an opening / closing device configured to be movable inside the transfer chamber and including a closing portion for closing the opening. The substrate processing system according to Appendix 15, wherein the wall surface of the transfer chamber constitutes one of the first member and the second member, and the closing portion of the opening / closing device constitutes the other of the first member and the second member.

[0118] (Appendix 17) A fixture for a substrate processing system, comprising a male member including a shaft member, a female member configured to detachably fix the shaft member of the male member. The female member includes a first moving body configured to be movable between a clamping position and an unclamping position along an axial direction, a second moving body held by the first moving body, the second moving body moving to a position that restricts axial movement of the shaft member of the male member at the clamping position and moving to a position that does not prevent axial movement of the shaft member of the male member at the unclamping position, and a third moving body configured to press the shaft member of the male member and move it along the axial direction at the unclamping position. Fixture for a substrate processing system.

[0119] (Appendix 18) A fixture for a substrate processing system, comprising a female member, including an inner wall defining an accommodation space A female member comprising an engaging portion provided on a part of the inner wall; A male member, A shaft member configured to be movable axially inside the accommodation space; A moving body configured to move between a clamped position where it engages with the engaging portion of the female member and an unclamped position where it does not engage with the engaging portion of the female member as the shaft member moves axially; and The shaft member is configured to be movable axially to press the inner wall of the female member in a state where the engaging portion is in the unclamped position. The male member comprises the above. A fixture for a substrate processing system.

[0120] (Appendix 19) A substrate processing system, The fixture according to Appendix 17 or Appendix 18; A transfer chamber having a wall surface provided with an opening communicating with a chamber; An opening and closing device configured to be movable inside the transfer chamber and having a closing portion for closing the opening; and One of the male member or the female member is provided on the wall surface of the transfer chamber, and the other of the male member or the female member is directed toward the closing portion of the opening and closing device. A substrate processing system.

[0121] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. The above embodiments can be variously modified without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to another embodiment. Also, some components in one embodiment can be replaced with corresponding components in another embodiment.

Explanation of Reference Numerals

[0122] 1... Plasma processing apparatus, 10... Plasma processing chamber, CP1... First member, CP2... Second member, F... Fixture, F1, F4... Male-type members, F10... Shaft member, F2, F3... Female-type members, F20... Housing member, F22... Holding member, F24... Spherical member, OP... Opening, SP... Accommodation space, TP... Taper portion, W2, W3... Inner walls

Claims

1. A plasma processing apparatus including a chamber, a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The male member includes a shaft member extending in the axial direction and having a diameter-expanded tip. The female member includes a housing member fixed to the second member, a holding member disposed in the housing member, and a spherical member held by the holding member. The housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member. An inner wall of the housing member defining the housing space includes a tapered portion that contracts in a radial direction. The holding member is configured to be movable along the axial direction within the housing space while holding the spherical member. The spherical member is configured to be guided by the tapered portion of the inner wall and move inward in the radial direction when the holding member moves in a first direction that is the axial direction and is toward the opening. A plasma processing apparatus.

2. The plasma processing apparatus according to claim 1, wherein the holding member is moved in the first direction by an elastic member disposed in the housing space.

3. The plasma processing apparatus according to claim 2, wherein the holding member is moved in the first direction by a first fluid flowing into the housing space.

4. The plasma processing apparatus according to claim 3, wherein the holding member is moved in a second direction opposite to the first direction by a second fluid flowing into the housing space.

5. The plasma processing apparatus according to claim 4, wherein the housing space includes a first space into which the first fluid flows and a second space into which the second fluid flows, and a seal member seals a space between the first space and the second space.

6. The plasma processing apparatus according to claim 5, wherein the second space is provided closer to the opening than the first space, and a seal member seals a space between the second space and the opening.

7. The plasma processing apparatus according to claim 1, wherein the holding member is configured to receive a force in the first direction or a force in a second direction opposite to the first direction via a cylinder or a motor.

8. The plasma processing apparatus according to any one of claims 1 to 7, wherein the holding member further includes a locking structure that restricts movement of the spherical member inward in the radial direction.

9. The plasma processing apparatus according to any one of claims 1 to 7, wherein at least one of the first member and the second member is a member disposed in the chamber.

10. The plasma processing apparatus according to any one of claims 1 to 7, wherein at least one of the first member and the second member is a member that constitutes the chamber or a member disposed outside the chamber.

11. The plasma processing apparatus according to claim 10, further comprising a seal member that seals between a space outside the chamber and the opening in a state where the first member and the second member are fixed by the fixture.

12. The plasma processing apparatus according to any one of claims 1 to 7, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixture is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other in a state where the first member and the second member are fixed by the fixture.

13. A plasma processing apparatus including a chamber, including a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The plasma processing apparatus, wherein the female member includes a first moving body configured to be movable along the axial direction between a clamping position and an unclamping position, and a second moving body held by the first moving body, the second moving body moving to a position that restricts axial movement of the male member at the clamping position and moving to a position that does not prevent axial movement of the male member at the unclamping position.

14. At least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixture is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other at the clamping position. The plasma processing apparatus according to claim 13.

15. A substrate processing system including one or more chambers, a first member, a second member, a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member. The male member includes a shaft member extending in the axial direction and having a diameter-expanded tip. The female member includes a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member. The housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member. An inner wall of the housing member defining the housing space includes a tapered portion that tapers in a radial direction. The holding member is configured to be movable along the axial direction within the housing space while holding the spherical member. The spherical member is configured to move radially inward guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction and toward the opening. A substrate processing system.

16. The substrate processing system includes a transfer chamber having a wall surface provided with an opening communicating with a chamber, and an opening / closing device configured to be movable inside the transfer chamber and including a closing portion that closes the opening. The wall surface of the transfer chamber constitutes one of the first member and the second member, and the closing portion of the opening / closing device constitutes the other of the first member and the second member. The substrate processing system according to claim 15.

17. A fixture for a substrate processing system, including a male member having a shaft member, and a female member configured to detachably fix the shaft member of the male member. The female member includes a first moving body configured to be movable between a clamping position and an unclamping position along an axial direction. A second moving body held by the first moving body, the second moving body being configured to move to a position that restricts the axial movement of the shaft member of the male member at the clamping position and to move to a position that does not prevent the axial movement of the male member at the unclamping position, A third moving body configured to press the shaft member of the male member and move it along the axial direction at the unclamping position, A fixture for a substrate processing system.

18. A fixture for a substrate processing system, A female member, An inner wall defining a receiving space, A female member including an engaging portion provided on a part of the inner wall, A male member, A shaft member configured to be movable axially inside the receiving space, A moving body configured to move between a clamping position where it engages with the engaging portion of the female member and an unclamping position where it does not engage with the engaging portion of the female member as the shaft member moves axially, The shaft member and the male member are configured such that, in a state where the engaging portion is in the unclamping position, the shaft member can move axially to press the inner wall of the female member. A fixture for a substrate processing system.

19. A substrate processing system, The fixture according to claim 17 or claim 18, A transfer chamber having a wall surface provided with an opening communicating with a chamber, An opening / closing device configured to be movable inside the transfer chamber and including a closing portion that closes the opening, One of the male member or the female member is provided on the wall surface of the transfer chamber, and the other of the male member or the female member is directed toward the closing portion of the opening / closing device. A substrate processing system.

Citation Information

Patent Citations

  • Mounting table and plasma processing apparatus

    JP2019197830A