Tape attaching method and workpiece cutting method

Abstract

To less likely to peel off a tape attached to a non-flat surface of a frame from the frame.SOLUTION: A tape attaching method for attaching a tape having a base material layer and an adhesive layer provided on one surface side of the base material layer so as to cover an opening to a non-flat one surface of a frame in which an opening is formed at the center, comprises: a disposing step of disposing at least one of the frame and the tape so that the one surface of the frame and the adhesive layer of the tape face each other; and after the disposing step, an attaching step of attaching the tape to one surface of the frame by applying an external force so that the frame and the tape are pressed against each other in a state where the base material layer included in an annular part of the tape in contact with the one surface of the frame is heated to a temperature at which a storage elastic modulus (G') of a resin included in the base material layer is 1.0 E+6 Pa or more and 1.0 E+8 Pa or less.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a method of attaching a tape having a base material layer on a non-flat surface of a frame having an opening formed at the center and an adhesive layer provided on one surface side of the base material layer so as to cover the opening, and a method of cutting a workpiece to be processed.

Background Art

[0002] Chips of devices such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. Such chips are manufactured, for example, by dividing a workpiece such as a wafer on which a plurality of devices are formed along the boundaries of the plurality of devices.

[0003] The division of the workpiece is performed, for example, in a cutting device including a chuck table for holding the workpiece and a spindle having an annular cutting blade attached to the tip for cutting the workpiece held on the chuck table. Specifically, in this cutting device, the workpiece is divided by cutting a cutting blade that rotates together with the spindle along the boundaries of a plurality of devices into the workpiece held by the chuck table.

[0004] However, when the workpiece is held alone by the chuck table, there is a risk that the surface of the workpiece that contacts the chuck table is damaged and / or contaminated. Also, in this case, a large number of chips manufactured by dividing the workpiece may become discrete, making it difficult to handle each chip.

[0005] Taking these points into consideration, the workpiece is generally divided in a state of being integrated with a frame having an opening formed through a circular tape (see, for example, Patent Document 1). In other words, prior to the division of the workpiece, it is generally located in the opening formed in the frame and one of its surfaces is attached to the tape.

[0006] In this case, when dividing the workpiece, the chuck table can hold the workpiece via the tape. Thereby, damage and / or contamination of one surface of the workpiece can be prevented. Also, in this case, the state in which a large number of chips produced by dividing the workpiece are integrated with the frame via the tape is maintained. Thereby, the chips are prevented from being discrete, and their handling becomes easy.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] The tape used to integrate the workpiece and the frame has a base material layer and an adhesive layer provided on one surface side of the base material layer. And this integration is performed, for example, by applying an external force so that the frame, the workpiece, and the tape are pressed against each other in a state where one surface of the frame and one surface of the workpiece positioned in the opening of the frame face the adhesive layer of the tape.

[0009] Generally, the adhesive layer of the tape is softer than its base material layer. Therefore, when processing the workpiece by cutting into the workpiece with a rotating cutting blade attached to this tape, depending on the force acting on the adhesive layer of the tape, the workpiece vibrates together with the adhesive layer, and processing defects such as chipping are likely to occur.

[0010] The occurrence of such processing defects can be suppressed by thinning the adhesive layer contained in the tape. However, in this case, there is a risk that the bonding force between the tape and the frame becomes weak, and the tape is likely to peel off from the frame.

[0011] Specifically, this frame is often manufactured in such a way that minute unevenness is formed on one of its surfaces. Therefore, one surface of the frame is often non - flat. And when the adhesive layer contained in the tape is thin, this adhesive layer does not enter the concave portions formed on one surface of the frame, and the contact area between the tape and the frame becomes narrow. As a result, the bonding force between the tape and the frame becomes weak, and the tape is likely to peel off from the frame.

[0012] In view of these points, an object of the present invention is to make it difficult for the tape adhered to the non - flat surface of the frame to peel off from the frame.

Means for Solving the Problems

[0013] According to one aspect of the present invention, there is provided a method of attaching a tape having a base material layer and an adhesive layer provided on one surface side of the base material layer so as to cover an opening formed in the center, to a non - flat surface of a frame having an opening formed in the center, the method comprising: an arranging step of arranging at least one of the frame or the tape so that the one surface of the frame and the adhesive layer of the tape face each other; and after the arranging step, applying an external force so that the frame and the tape are pressed against each other in a state where the base material layer contained in an annular portion of the tape that contacts the one surface of the frame is heated to a temperature at which the storage elastic modulus (G') of the resin contained in the base material layer is 1.0E + 6 Pa or more and 1.0E + 8 Pa or less, thereby attaching the tape to the one surface of the frame.

[0014] Preferably, the thickness of the adhesive layer of the tape is less than the maximum height (Ry) on one surface of the frame. Further, in the arranging step, the workpiece is arranged so as to be positioned in the opening of the frame, and in the sticking step, the temperature of the base material layer included in the annular portion of the tape is made higher than the temperature of the base material layer included in the portion positioned more inward than the annular portion, and an external force is applied so that the workpiece and the tape are pressed against each other, whereby the tape is preferably stuck to one surface of the workpiece. Alternatively, the method for sticking the tape of the present invention preferably further includes a second sticking step of sticking the tape to one surface of the workpiece by applying an external force so that the workpiece positioned to face the adhesive layer included in the portion positioned more inward than the annular portion of the tape and the tape are pressed against each other after the sticking step.

[0015] According to another aspect of the present invention, there is provided a method for cutting a workpiece, the method including: an arranging step of arranging at least one of the frame and the tape so that the non-flat one surface of the frame having an opening formed at the center thereof faces the adhesive layer of the tape having a base material layer and an adhesive layer provided on one surface side of the base material layer; a first sticking step of, after the arranging step, applying an external force so that the frame and the tape are pressed against each other in a state where the base material layer included in the annular portion of the tape that contacts the one surface of the frame is heated to a temperature at which the storage elastic modulus (G') of the resin included in the base material layer is 1.0E+6 Pa or more and 1.0E+8 Pa or less, thereby sticking the tape to the one surface of the frame; a second sticking step of, after the first sticking step, applying an external force so that the workpiece positioned to face the adhesive layer included in the portion positioned more inward than the annular portion of the tape and the tape are pressed against each other, thereby sticking the tape to the one surface of the workpiece; and a cutting step of cutting the workpiece held via the tape using an annular cutting blade that rotates the workpiece.

[0016] According to still another aspect of the present invention, there is provided a method for cutting a workpiece, the method including: an arranging step of arranging at least one of the frame, the workpiece, or the tape such that a non-planar surface of the frame having an opening formed at the center thereof and a surface of the workpiece positioned in the opening of the frame face a pressure-sensitive adhesive layer of a tape having a base material layer and a pressure-sensitive adhesive layer provided on one surface side of the base material layer; a sticking step of sticking the tape to each of the non-planar surface of the frame and the surface of the workpiece by applying an external force after the arranging step so that the frame, the workpiece, and the tape are pressed against each other while the base material layer included in an annular portion of the tape that contacts the non-planar surface of the frame is heated to a temperature at which a storage elastic modulus (G') of a resin included in the base material layer is 1.0E+6 Pa or more and 1.0E+8 Pa or less; and a cutting step of cutting the workpiece held via the tape using an annular cutting blade that rotates the workpiece, after the sticking step.

Advantages of the Invention

[0017] In the present invention, the tape is stuck to one surface of the frame by applying an external force so that the frame and the tape are pressed against each other while the base material layer included in the annular portion of the tape that contacts the non-planar surface of the frame is heated to a temperature at which a storage elastic modulus (G') of a resin included in the base material layer is 1.0E+6 Pa or more and 1.0E+8 Pa or less.

[0018] In this case, the base material layer included in the annular portion of the tape is softened and easily deformed to conform to the shape of one surface of the frame. Therefore, in this case, the pressure-sensitive adhesive layer of the tape enters into a recess formed in one surface of the frame, and the contact area between the tape and the frame becomes wider. As a result, the bonding force between the tape and the frame becomes stronger, and the tape is less likely to peel off from the frame.

Brief Description of the Drawings

[0019]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

MODE FOR CARRYING OUT THE INVENTION

[0020] Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing an example of a tape. The tape 1 shown in FIG. 1 has a film-like base material layer 1a and an adhesive layer 1b provided on one surface side of the base material layer 1a. Further, the tape 1 has a rectangular shape in which the length is significantly larger than the width, and is wound in a roll shape such that the adhesive layer 1b is positioned inside.

[0021] The base material layer 1a contains, for example, a resin such as polyolefin (PO), polyethylene terephthalate (PET), polyvinyl chloride (PVC), or polystyrene (PS). Further, a surface treatment is performed on the other surface side of the base material layer 1a so as not to adhere the adhesive layer 1b.

[0022] The adhesive layer 1b contains, for example, an ultraviolet curable silicone rubber, an acrylic material, or an epoxy material. Further, the adhesive layer 1b is provided thinly so as not to cause processing defects such as chipping when processing the workpiece with the tape 1 adhered to the workpiece described later. Specifically, the adhesive layer 1b has a thickness of 10 μm or less, preferably 8 μm or less, more preferably 6 μm or less, and most preferably 4 μm or less.

[0023] A part (adhesive part) 1c of the tape 1 is cut out from the remaining part after being adhered to the frame. FIG. 2(A) is a perspective view schematically showing an example of a frame to which the adhesive part 1c of the tape 1 is adhered, and FIG. 2(B) is a partially enlarged cross-sectional view schematically showing one surface of the frame shown in FIG. 2(A).

[0024] The frame 3 shown in FIGS. 2(A) and 2(B) has a surface 3a to which the tape 1 (specifically, the adhesive part 1c thereof) is adhered, and this surface 3a is uneven because it contains minute irregularities formed during its manufacture. The maximum height (Ry) on this surface 3a is, for example, 5 μm or more and 20 μm or less.

[0025] Further, the frame 3 is made of a metal material such as aluminum or stainless steel, and a circular opening 3b is formed in the center thereof. And, a tape 1 is adhered to one surface 3a of the frame 3 so as to cover the opening 3b. FIG. 3 is a flowchart schematically showing an example of a method of adhering the tape 1 to the frame 3 in this manner.

[0026] Briefly, in this method, the tape 1 is adhered to the frame 3 by applying an external force so that the tape 1 and the frame 3 are pressed against each other while heating the tape 1. FIG. 4 is a partial cross-sectional side view schematically showing an example of an adhering device capable of adhering the tape 1 to the frame 3 in this manner.

[0027] The adhering device 2 shown in FIG. 4 has an annular table 4 for supporting the frame 3. A circular opening 4a is formed in the center of the annular table 4. Further, on the upper surface of the annular table 4, there is a step formed by an annular upper stage located inside, an annular lower stage located outside, and an intermediate portion between the outer edge of the upper stage and the inner edge of the lower stage. And, an annular heater 4b is built in near the lower stage of the step existing on the upper surface of the annular table 4.

[0028] Furthermore, a disk-shaped chuck table 6 for holding a workpiece to be described later is provided in the opening 4a. The chuck table 6 has, for example, a disk-shaped frame made of ceramics or the like, and a disk-shaped porous plate fixed in a recess formed on the upper surface side of the frame.

[0029] In addition, a flow path that opens at the bottom surface of the recess is formed in the frame of the chuck table 6, and this flow path is connected to a suction source (not shown) and a fluid supply source (not shown) via a valve (not shown) or the like. Note that this suction source includes, for example, an ejector or the like. The fluid supply source includes, for example, a tank for storing high-pressure gas, a filter for removing foreign matters mixed in the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

[0030] When a suction source communicating with the flow path formed in the frame is operated with the workpiece to be described later placed on the chuck table 6, the flow path becomes negative pressure. As a result, a suction force acts on the workpiece carried onto the chuck table 6 via the porous plate. That is, the workpiece is held by the chuck table 6.

[0031] Also, when a fluid supply source communicating with the flow path formed in the frame is operated with the workpiece held by the chuck table 6, the flow path returns to normal pressure. As a result, the suction force no longer acts on the workpiece carried onto the chuck table 6 via the porous plate. That is, the workpiece is simply placed on the chuck table 6.

[0032] Furthermore, the chuck table 6 is connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, a ball screw and a motor connected to the ball screw. When this vertical movement mechanism is operated, the chuck table 6 moves along the vertical direction, that is, moves up and down.

[0033] Also, the annular table 4 and the chuck table 6 are connected to a horizontal movement mechanism (not shown). This horizontal movement mechanism includes, for example, a ball screw and a motor connected to the ball screw. When this horizontal movement mechanism is operated, the annular table 4 and the chuck table 6 move along the horizontal direction. For example, when this horizontal movement mechanism is operated, the annular table 4 and the chuck table 6 move between the loading / unloading position and the sticking position.

[0034] The loading / unloading position is the position of the annular table 4 (specifically, the lower step on its upper surface) and the chuck table 6 that enables easy loading of the frame 3 onto the annular table 4 (and subsequent unloading therefrom) and loading of the workpiece to be described later onto the chuck table 6 (and subsequent unloading therefrom). The sticking position is the position of the annular table 4 and the chuck table 6 where the tape 1 can be stuck to the frame 3 supported by the annular table 4 and / or the workpiece held by the chuck table 6.

[0035] Above the annular table 4 and the chuck table 6 positioned at the sticking position, a sticking unit 8 is provided. This sticking unit 8 has a feeding roller 8a for feeding out the tape 1 wound in a roll. The feeding roller 8a is positioned in front of the annular table 4 and the chuck table 6 in a plan view.

[0036] Below the feeding roller 8a, a guide roller 8b is provided in front of the annular table 4 and the chuck table 6 positioned at the sticking position in a plan view. The base material layer 1a side of the tape 1 fed out by rotating the feeding roller 8a comes into contact with this guide roller 8b.

[0037] Behind the guide roller 8b, a guide roller 8c is provided behind the annular table 4 and the chuck table 6 positioned at the sticking position in a plan view. The base material layer 1a side of the tape 1 pulled out rearward from the guide roller 8b comes into contact with this guide roller 8c.

[0038] Above the guide roller 8c, a recovery roller 8d for recovering the tape 1 is provided. The recovery roller 8d is located behind the annular table 4 and the chuck table 6 positioned at the sticking position in a plan view. Further, the surface of the recovery roller 8d is treated so as not to stick the adhesive layer 1b of the tape 1. Then, the adhesive layer 1b side of the tape 1 lifted upward from the guide roller 8c comes into contact with the recovery roller 8d.

[0039] Furthermore, the recovery roller 8d is connected to a rotation mechanism (not shown). This rotation mechanism includes, for example, a motor or the like. When this rotation mechanism is operated, the tape 1 is wound around the recovery roller 8d and recovered, and at the same time, the feeding roller 8a is rotated to further feed out the tape 1.

[0040] Also, a pressing roller 8e is provided between the two guide rollers 8b and 8c. The pressing roller 8e is connected to a moving mechanism (not shown). This moving mechanism includes, for example, a ball screw and a motor connected to this ball screw. When this moving mechanism is operated, the pressing roller 8e moves in a cycle among a standby position, a sticking start position, and a sticking end position.

[0041] The standby position is the position of the pressing roller 8e that does not contact the tape 1 (specifically, it is a position behind the guide roller 8b and in front of the guide roller 8c and above both in a plan view). The sticking start position is the position of the pressing roller 8e capable of pressing the tape 1 against the front end of the frame 3 supported by the annular table 4. The sticking end position is the position of the pressing roller 8e capable of pressing the tape 1 against the rear end of the frame 3 supported by the annular table 4.

[0042] Immediately above the annular table 4 and the chuck table 6 positioned at the sticking position, a cutting unit 10 is provided via a tape 1 existing between two guide rollers 8b and 8c. This cutting unit 10 has a rotating shaft 10a whose center is positioned directly above the center of the chuck table 6 positioned at the sticking position. And at the lower end of the rotating shaft 10a, the base end of an arm 10b having a length approximately equal to half of the outer diameter of the annular table 4 is fixed. Also, a cutter 10c is provided below the tip of the arm 10b.

[0043] Furthermore, the rotating shaft 10a is connected to a rotation mechanism (not shown). This rotation mechanism includes, for example, a motor or the like. And when this rotation mechanism is operated, the rotating shaft 10a can be rotated around a straight line passing through its center and along the vertical direction, that is, the cutter 10c can be swung around this straight line.

[0044] Also, the rotating shaft 10a is connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, an air cylinder or the like. And when the air cylinder is operated to lower the cutter 10c, the cutter 10c can be cut into the tape 1 so as to penetrate the tape 1.

[0045] When sticking the tape 1 so as to cover the opening 3b on one surface 3a of the frame 3 in the sticking device 2, first, at least one of the frame 3 or the tape 1 is arranged so that one surface 3a of the frame 3 and the adhesive layer 1b of the tape 1 face each other (arrangement step S1). FIG. 5(A) is a partial cross-sectional side view schematically showing the state of the arrangement step S1.

[0046] In this arrangement step S1, first, the annular table 4 and the chuck table 6 are positioned at the loading / unloading position. Next, the frame 3 is carried into the annular table 4 so that its one surface 3a faces upward. Next, the annular table 4 and the chuck table 6 are positioned at the sticking position (see FIG. 5(A)). Thereby, one surface 3a of the frame 3 and the adhesive layer 1b of the tape 1 face each other and the arrangement step S1 is completed.

[0047] After the configuration step S1, an external force is applied so that the frame 3 and the tape 1 are pressed against each other with the base material layer 1a included in the annular portion of the tape 1 that contacts one surface 3a of the frame 3 in a heated state, thereby attaching the tape 1 to the one surface 3a of the frame 3 (attachment step (first attachment step) S2). FIG. 5(B) is a partial cross-sectional side view schematically showing the state of the attachment step S2, and FIG. 5(C) is a partially enlarged cross-sectional view schematically showing one surface 3a of the frame 3 to which the tape 1 is attached in the attachment step S2.

[0048] In this attachment step S2, first, the frame 3 is heated by the heater 4b built into the annular table 4. Next, the pressing roller 8e is moved so as to return from the standby position through the attachment start position and the attachment end position to the standby position (see FIG. 5(B)). Thereby, the annular portion of the tape 1 (specifically, the portion located slightly inside the outer periphery of the attachment portion 1c thereof) is pressed against the frame 3, that is, an external force that presses against each other is applied to the frame 3 and the tape 1.

[0049] Also, this annular portion is heated by the heater 4b built into the annular table 4 via the frame 3. At this time, the heater 4b is set so that the base material layer 1a is softened and easily deformed. Specifically, the storage elastic modulus (G') of the resin contained in the base material layer 1a is 1.0E+6 Pa or more and 1.0E+8 Pa or less, preferably 1.0E+6 Pa or more and 2.0E+7 Pa or less, more preferably 1.0E+6 Pa or more and 8.0E+6 Pa or less, and most preferably 1.0E+6 Pa or more and 5.0E+6 Pa or less. The annular portion of the tape 1 is heated to a temperature such that

[0050] Therefore, in this sticking step S2, an annular portion of the tape 1 including the softened base material layer 1a is pressed against the frame 3. As a result, in this sticking step S2, it becomes easier for this annular portion to enter the recess formed in one surface 3a of the frame 3. Consequently, the tape 1 is stuck to the one surface 3a of the frame 3 with the contact area between the adhesive layer 1b of the tape 1 and the one surface 3a of the frame 3 being widened (see Fig. 5(C)).

[0051] Then, once the tape 1 is stuck to the one surface 3a of the frame 3, the rotary shaft 10a is lowered until the cutter 10c cuts into and penetrates the tape 1 (specifically, the outer periphery of the stuck portion 1c thereof). Next, the rotary shaft 10a is rotated at least once, that is, the cutter 10c is swung around at least once. Thereby, the stuck portion 1c of the tape 1 is cut out from the rest thereof.

[0052] In the method of sticking the tape shown in Fig. 3, an external force is applied so that the frame 3 and the tape 1 are pressed against each other in a state where the base material layer 1a included in the annular portion of the tape 1 that contacts the non-flat one surface 3a of the frame 3 is heated to a temperature at which the storage elastic modulus (G’) of the resin included in the base material layer 1a is 1.0E+6 Pa or more and 1.0E+8 Pa or less, thereby sticking the tape 1 to the one surface 3a of the frame 3.

[0053] In this case, the base material layer 1a included in the annular portion of the tape 1 is softened and becomes easily deformable so as to follow the shape of the one surface 3a of the frame 3. Therefore, in this case, the adhesive layer 1b of the tape 1 enters the recess formed in the one surface 3a of the frame 3 and the contact area between the tape 1 and the frame 3 is widened. As a result, the bonding force between the tape 1 and the frame 3 is strengthened and the tape 1 becomes difficult to peel off from the frame 3.

[0054] In addition, when the thickness of the adhesive layer 1b of the tape 1 is less than the maximum height (Ry) on the one surface 3a of the frame 3, there is a possibility that the adhesive layer 1b of the tape 1 may contact only near the apex of the convex portion formed on the one surface 3a of the frame 3. And in this case, there is a possibility that the bonding force between the tape 1 and the frame 3 may become extremely weak.

[0055] On the other hand, in the above-described sticking step S2, the adhesive layer 1b of the tape 1 can be made to enter the recess formed in one surface 3a of the frame 3, thereby strengthening the bonding force between the tape 1 and the frame 3. Therefore, the tape sticking method shown in FIG. 3 is particularly useful when the thickness of the adhesive layer 1b of the tape 1 is less than the maximum height (Ry) on one surface 3a of the frame 3.

[0056] Note that the tape sticking method shown in FIG. 3 is one aspect of the present invention, and the present invention is not limited to the tape sticking method shown in FIG. 3. For example, in the tape sticking method of the present invention, the tape 1 may be stuck to one surface of the workpiece simultaneously with the sticking of the tape 1 to one surface 3a of the frame 3.

[0057] FIG. 6 is a perspective view schematically showing an example of a workpiece to which the tape 1 is stuck on one surface thereof. The workpiece 5 shown in FIG. 6 is a disk-shaped wafer made of a single crystal semiconductor such as silicon (Si), silicon carbide (SiC), or gallium nitride (GaN). One surface 5a of this workpiece 5 is planarized by, for example, polishing or the like.

[0058] Also, a plurality of devices 7 are provided on the other surface 5b side of the workpiece. And each device 7 includes, for example, an element for constituting an IC, a semiconductor memory, or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0059] FIG. 7 is a flowchart schematically showing a tape sticking method for sticking the tape 1 to one surface 3a of the frame 3 and one surface 5a of the workpiece 5 in the sticking device 2. For example, this method is performed by operating each component of the sticking device 2 in the same manner as the tape sticking method shown in FIG. 3, except that the workpiece 5 is held by the chuck table 6.

[0060] Specifically, in this method, first, at least one of the frame 3, the workpiece 5, or the tape 1 is arranged so that one surface 3a of the frame 3 and one surface 5a of the workpiece 5 located in the opening 3b of the frame 3 face the adhesive layer 1b of the tape 1 (arrangement step S3). FIG. 8(A) is a partial cross-sectional side view schematically showing the state of the arrangement step S3.

[0061] In this arrangement step S3, first, the annular table 4 and the chuck table 6 are positioned at the loading and unloading position. Next, the frame 3 is carried into the annular table 4 so that its one surface 3a faces upward, and the workpiece 5 is carried into the chuck table 6 so that its one surface 5a faces upward. Next, the workpiece 5 is held by the chuck table 6.

[0062] Next, the position of the workpiece 5 is adjusted so that the adhesion between the frame 3 and the tape 1 is not inhibited due to the presence of the workpiece 5, and the adhesive layer 1b of the tape can contact one surface 5a of the workpiece 5 in the subsequent adhesion step S4. Specifically, the chuck table 6 is raised and lowered so that one surface 5a of the workpiece 5 is positioned slightly below the lower end of the concave portion formed on one surface 3a of the frame 3.

[0063] Next, the annular table 4 and the chuck table 6 are positioned at the adhesion position (see FIG. 8(A)). Thereby, one surface 3a of the frame 3, one surface 5a of the workpiece 5 located in the opening 3b of the frame 3, and the adhesive layer 1b of the tape 1 face each other, and the arrangement step S3 is completed.

[0064] After the arrangement step S3, an external force is applied so that the frame 3, the workpiece 5, and the tape 1 are pressed against each other with the base material layer 1a included in the annular portion of the tape 1 in contact with one surface 3a of the frame 3 being heated, thereby adhering the tape 1 to each of one surface 3a of the frame 3 and one surface 5a of the workpiece 5 (adhesion step S4). FIG. 8(B) is a partial cross-sectional side view schematically showing the state of the adhesion step S4.

[0065] In this sticking step S4, first, the frame 3 is heated by the heater 4b built in the annular table 4. Next, the pressing roller 8e is moved so as to return from the standby position through the sticking start position and the sticking end position to the standby position (see Fig. 8(B)). As a result, the annular portion of the tape 1 is pressed against the frame 3 and the portion inside the annular portion is pressed against the workpiece 5, that is, an external force that presses against each other is applied to the frame 3, the workpiece 5, and the tape 1.

[0066] Also, this annular portion is heated by the heater 4b in the same manner as in the sticking step S2 described above. Therefore, in the sticking step S4, the temperature of the base material layer 1a included in the annular portion of the tape 1 becomes higher than the temperature of the base material layer 1a included in the portion located inside the annular portion. As a result, the tape 1 is stuck to the one surface 3a of the frame 3 and the one surface 5a of the workpiece 5 in a state where the contact area between the adhesive layer 1b of the tape 1 and the one surface 3a of the frame 3 is widened.

[0067] Then, when the tape 1 is stuck to the one surface 3a of the frame 3 and the one surface 5a of the workpiece 5, the rotary shaft 10a is lowered until the cutter 10c cuts into and penetrates the tape 1 (specifically, the outer periphery of the stuck portion 1c). Next, the rotary shaft 10a is rotated at least once, that is, the cutter 10c is swung around at least once. As a result, the stuck portion 1c of the tape 1 is cut out from the rest of the tape.

[0068] Also, in the method for sticking the tape of the present invention, the tape 1 may be stuck to the one surface 5a of the workpiece 5 after the tape 1 is stuck to the one surface 3a of the frame 3. Each of Figs. 9 and 10 is a flowchart schematically showing an example of the method for sticking the tape for sticking the tape 1 to each of the one surface 3a of the frame 3 and the one surface 5a of the workpiece 5 in this manner.

[0069] In the tape sticking method shown in FIG. 9, first, the above-described arrangement step S1 and sticking step S2 are carried out in the sticking device 2. Then, after the sticking step S2, an external force is applied so that the workpiece 5 positioned to face the adhesive layer 1b included in the portion located inside the annular portion of the tape 1 and the tape 1 are pressed against each other, and the tape 1 is stuck to one surface 5a of the workpiece 5 (second sticking step S5). Note that the second sticking step S5 in the tape sticking method shown in FIG. 9 is carried out manually, for example.

[0070] In the tape sticking method shown in FIG. 10, first, the above-described arrangement step S3 is carried out in the sticking device 2. However, in the arrangement step S3 in this method, the position of the workpiece 5 is adjusted so that the adhesive layer 1b of the tape 1 cannot come into contact with one surface 5a of the workpiece 5 in the subsequent sticking step S2. Specifically, the chuck table 6 is lowered so that one surface 5a of the workpiece 5 is positioned sufficiently below the lower end of the recess formed in one surface 3a of the frame 3.

[0071] After carrying out the arrangement step S3 in this way, the above-described sticking step S2 is carried out in the sticking device 2 without moving the position of the chuck table 6. Then, after carrying out the sticking step S2 in this way, the second sticking step S5 is carried out in the sticking device 2. Specifically, this second sticking step S5 is carried out by raising the chuck table 6 so as to press one surface 5a of the workpiece 5 held by the chuck table 6 against the adhesive layer 1b of the tape 1.

[0072] Furthermore, the present invention may also be a cutting method for a workpiece including the tape sticking method shown in FIG. 7, FIG. 9, or FIG. 10. Specifically, in this cutting method for a workpiece, after carrying out the above-described sticking step S4 or second sticking step S5, a cutting step is carried out using an annular cutting blade that rotates the workpiece 5 held via the tape 1.

[0073] In addition, the method of attaching the tape of the present invention may be implemented using a device other than the attaching device 2. For example, this method may be implemented in an attaching device having a structure similar to that of the attaching device 2, except that a heater built into the pressing roller 8e is provided instead of or in addition to the heater 4b built into the annular table 4.

[0074] In addition, this method may be implemented in an attaching device having a structure similar to that of the attaching device 2, except that a pressing member having a shape similar to that of the frame 3 is provided instead of or in addition to the pressing roller 8e. That is, in this case, in the attaching steps S2 and S4, the tape 1 may be attached to one surface 3a of the frame 3 by pressing the pressing member against the frame 3 via the tape 1.

[0075] Furthermore, in this case, the tape 1 may be attached to one surface 3a of the frame 3 by using a pressing member heated by a heater or a pressing member incorporating a heater. Note that when the attaching steps S2 and S4 are performed in this manner, the heater 4b does not have to be built into the annular table 4.

[0076] In addition, this method may be implemented in an attaching device provided with a heater (for example, a fan heater, etc.) for directly heating the annular portion of the tape 1 that contacts one surface 3a of the frame 3 during or prior to the attaching steps S2 and S4, instead of or in addition to the heater 4b built into the annular table 4.

[0077] In addition, this method may be implemented in an attaching device having a structure similar to that of the attaching device 2, except that a table capable of holding the workpiece 5 by a method other than suction or a table that only supports the workpiece 5 without holding it is provided instead of the chuck table 6 capable of sucking and holding the workpiece 5. Examples of the table capable of holding the workpiece 5 by a method other than suction include a table incorporating an electrostatic chuck or a table including a jig for holding the workpiece 5.

[0078] Further, this method may be implemented in an attaching device including components of the attaching device 2, a transport mechanism capable of loading and unloading the frame 3 to and from the annular table 4 and loading and unloading the workpiece 5 to and from the chuck table 6. Note that the attaching device may not be provided with a horizontal movement mechanism for moving the annular table 4 and the chuck table 6 along the horizontal direction.

[0079] Further, this method may be implemented in an attaching device including a first attaching portion for attaching the tape 1 to the frame 3, a second attaching portion for attaching the tape 1 to the workpiece 5, and a transport mechanism capable of transporting the frame 3 with the tape 1 attached thereto from the first attaching portion to the second attaching portion.

[0080] Note that the first attaching portion has a structure similar to that of the attaching device 2 except that, for example, the chuck table 6 is not provided. That is, the first attaching portion includes, for example, an annular table similar to the annular table 4, an attaching unit similar to the attaching unit 8, and a cutting unit similar to the cutting unit 10.

[0081] Further, the second attaching portion has a structure similar to that of the attaching device 2 except that, for example, components for supplying and recovering the tape 1 in the attaching unit 8 (specifically, the feeding roller 8a, the guide rollers 8b and 8c, and the recovering roller 8d) and the cutting unit 10 are not provided. That is, the second attaching portion includes, for example, an annular table similar to the annular table 4, a chuck table similar to the chuck table 6, and a pressing roller similar to the pressing roller 8e of the attaching unit 8.

[0082] In addition, the structures, methods, etc. according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

Description of Reference Numerals

[0083] 1: Tape (1a: Base material layer, 1b: Adhesive layer, 1c: Part (attaching portion)) 2: Attaching device 3: Frame (3a: one side, 3b: opening) 4: Annular table (4a: opening, 4b: heater) 5: Workpiece (5a: one side, 5b: other side) 6: Chuck table 8: Adhesive unit (8a: feeding roller, 8b, 8c: guide rollers) (8d: recovery roller, 8e: pressing roller) 10: Cutting unit (10a: rotating shaft, 10b: arm, 10c: cutter)

Claims

1. A method for attaching a tape having a base material layer covering an opening formed in a non-planar surface of a frame and an adhesive layer provided on one surface side of the base material layer so as to cover the opening to the non-planar surface of the frame, comprising: An arranging step of arranging at least one of the frame or the tape so that the one surface of the frame and the adhesive layer of the tape face each other; After the arranging step, an external force is applied so that the frame and the tape are pressed against each other in a state where the base material layer included in an annular portion of the tape that contacts the one surface of the frame is heated to a temperature at which the storage elastic modulus (G') of the resin included in the base material layer is 1.0E+6 Pa or more and 1.0E+8 Pa or less, thereby attaching the tape to the one surface of the frame; A method for attaching a tape, comprising the above steps.

2. The method for attaching a tape according to claim 1, wherein the thickness of the adhesive layer of the tape is less than the maximum height (Ry) on the one surface of the frame.

3. In the arranging step, a workpiece is arranged so as to be positioned in the opening of the frame; In the attaching step, an external force is applied so that the workpiece and the tape are pressed against each other in a state where the temperature of the base material layer included in the annular portion of the tape is higher than the temperature of the base material layer included in a portion located more inward than the annular portion, thereby attaching the tape to one surface of the workpiece. The method for attaching a tape according to claim 1 or 2.

4. The method for attaching a tape according to claim 1 or 2, further comprising a second attaching step of applying an external force so that the workpiece positioned to face the adhesive layer included in a portion located more inward than the annular portion of the tape and the tape are pressed against each other after the attaching step, thereby attaching the tape to one surface of the workpiece.

5. A method for cutting a workpiece, comprising: An arranging step of arranging at least one of the frame or the tape so that the non-planar surface of the frame having an opening formed at the center thereof faces the adhesive layer of the tape having a base material layer and an adhesive layer provided on one surface side of the base material layer; After the placement step, an external force is applied such that the frame and the tape are pressed against each other in a state where the base material layer included in the annular portion of the tape that contacts the one surface of the frame is heated to a temperature at which the storage elastic modulus (G') of the resin included in the base material layer is 1.0E+6 Pa or more and 1.0E+8 Pa or less, thereby performing a first sticking step of sticking the tape to the one surface of the frame. After the first sticking step, an external force is applied such that the workpiece and the tape positioned to face each other with respect to the adhesive layer included in the portion of the tape located inside the annular portion of the tape are pressed against each other, thereby performing a second sticking step of sticking the tape to the one surface of the workpiece. After the second sticking step, a cutting step of cutting the workpiece held via the tape using an annular cutting blade that rotates the workpiece. A method for cutting a workpiece, comprising the above steps.

6. A method for cutting a workpiece, comprising: An arrangement step of arranging at least one of the frame, the workpiece, or the tape such that the non-flat one surface of the frame having an opening formed at the center and the one surface of the workpiece positioned in the opening of the frame face the adhesive layer of the tape having a base material layer and an adhesive layer provided on one surface side of the base material layer; After the arrangement step, in a state where the base material layer included in the annular portion of the tape that contacts the one surface of the frame is heated to a temperature at which the storage elastic modulus (G') of the resin included in the base material layer is 1.0E+6 Pa or more and 1.0E+8 Pa or less, an external force is applied such that the frame, the workpiece, and the tape are pressed against each other, thereby performing a sticking step of sticking the tape to each of the one surface of the frame and the one surface of the workpiece. After the sticking step, a cutting step of cutting the workpiece held via the tape using an annular cutting blade that rotates the workpiece. A method for cutting a workpiece, comprising the above steps.

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