Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of suitably cooling a rotatable mounting table.SOLUTION: A substrate processing apparatus comprises: a processing container; a mounting table which is provided in the processing container and has a first contact surface on a side opposite to a mounting surface on which a substrate is mounted; a refrigeration device which has a second contact surface for cooling the mounting table; a rotation device which rotates the mounting table; a lifting device which raises and lowers the refrigeration device to bring the first contact surface into contact with, or separate it from the second contact surface; a heat transfer gas supply space which includes the first contact surface of the mounting table and the second contact surface of the refrigeration device, and is isolated from an internal space of the processing container; and a gas introduction port which supplies heat transfer gas into the heat transfer gas supply space.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus.

Background Art

[0002] Patent Document 1 discloses a holding device that rotatably holds an object to be processed while cooling it in a vacuum chamber, comprising a stage on which the object to be processed is placed, a rotation driving means for rotatably supporting the stage, and a cooling means for cooling the stage. With the stage surface side where the object to be processed is placed facing upward, the rotation driving means includes a cylindrical rotating shaft body that penetrates through the wall surface of the vacuum chamber via a first vacuum seal, a connecting member that connects the upper end of the rotating shaft body and the lower surface of the stage so that a space is defined below the stage, and a driving motor for rotationally driving the rotating shaft body. The cooling means includes a cooling panel that is disposed opposite to the lower surface of the stage with a gap in the space below the stage, a heat transfer shaft body that is inserted into the rotating shaft body and abuts against the lower surface of the cooling panel, and a refrigerator for cooling the heat transfer shaft body. A holding device characterized by the above is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] One aspect of the present disclosure provides a substrate processing apparatus that preferably cools a rotatable mounting table.

Means for Solving the Problems

[0005] To solve the above problems, according to one aspect, there is provided a substrate processing apparatus including a processing container, a mounting table provided in the processing container and having a first contact surface on the side opposite to the mounting surface for mounting a substrate, a refrigeration device having a second contact surface for cooling the mounting table, a rotation device for rotating the mounting table, a lifting device for lifting the refrigeration device to bring the first contact surface and the second contact surface into contact or separation, a heat transfer gas supply space including the first contact surface of the mounting table and the second contact surface of the refrigeration device and blocked from the internal space of the processing container, and a gas introduction port for supplying heat transfer gas to the heat transfer gas supply space.

Effect of the Invention

[0006] According to one aspect of the present disclosure, it is possible to provide a substrate processing apparatus that suitably cools a rotatable mounting table.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are given to the same components, and redundant descriptions may be omitted.

[0009] <Substrate Processing Apparatus 1> An example of the substrate processing apparatus 1 according to an embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view showing an example configuration when the mounting table 20 of the substrate processing apparatus 1 according to an embodiment rotates. FIG. 2 is a cross-sectional view showing an example configuration when the mounting table 20 of the substrate processing apparatus 1 according to an embodiment is in contact cooling.

[0010] Note that the substrate processing apparatus 1 may be, for example, a substrate processing apparatus (such as a CVD (Chemical Vapor Deposition) apparatus, an ALD (Atomic Layer Deposition) apparatus, etc.) that supplies a processing gas into the processing chamber 10 to perform a desired process (such as a film formation process, etc.) on the substrate W. Further, the substrate processing apparatus 1 may be, for example, a substrate processing apparatus (such as a PVD (Physical Vapor Deposition) apparatus, etc.) that supplies a processing gas into the processing chamber 10 and sputters a target provided in the processing chamber 10 to perform a desired process (such as a film formation process, etc.) on the substrate W.

[0011] The substrate processing apparatus 1 includes a processing chamber 10, a mounting table 20 for mounting the substrate W inside the processing chamber 10, a refrigeration device 30, a rotation device 40 for rotating the mounting table 20, and a lifting device 50 for lifting and lowering the refrigeration device 30. Further, the substrate processing apparatus 1 includes a slip ring 60 for supplying power to the electrode 21 of the rotating mounting table 20. Further, the substrate processing apparatus 1 includes a cooling mechanism 70 for cooling the power supply rod 63. Further, the substrate processing apparatus 1 includes a control device 90 for controlling various devices such as the refrigeration device 30, the rotation device 40, and the lifting device 50.

[0012] The processing chamber 10 forms an internal space 10S. The processing chamber 10 is configured such that its internal space 10S is evacuated to an ultra-high vacuum by operating an exhaust device (not shown) such as a vacuum pump. Further, the processing chamber 10 is configured to supply a desired gas used for substrate processing through a gas supply pipe (not shown) communicating with a processing gas supply device (not shown).

[0013] Inside the processing container 10, a mounting table 20 for mounting the substrate W is provided. The mounting table 20 is formed of a material with high thermal conductivity (for example, Cu). The mounting table 20 includes an electrostatic chuck. The electrostatic chuck has an electrode 21 embedded in a dielectric film. A predetermined potential is applied to the electrode 21 via a slip ring 60 and a power supply rod 63, which will be described later. With this configuration, the substrate W can be adsorbed by the electrostatic chuck and fixed to the upper surface of the mounting table 20. Further, a first comb tooth structure 20a is formed on the lower surface (the first contact surface) of the mounting table 20, which is opposite to the mounting surface (the upper surface) for mounting the substrate W. The comb tooth structure 20a has a plurality of annular convex portions protruding downward (in the direction of the refrigeration heat medium 32) from the lower surface (the first contact surface) of the mounting table 20, and recesses are formed between these convex portions. Further, circular and / or annular recesses and convex portions are alternately formed coaxially with the central axis CL of the mounting table 20. In the example shown in FIGS. 1 and 2, an annular first convex portion and an annular second convex portion are provided radially outward from the center of the central axis CL, and a circular first recess formed inside the first convex portion and an annular second recess formed between the first convex portion and the second convex portion are provided.

[0014] Below the mounting table 20, a refrigeration device 30 is provided. The refrigeration device 30 is composed of a refrigerator 31 and a refrigeration heat medium 32 stacked together. Note that the refrigeration heat medium 32 can also be referred to as a cold link. The refrigerator 31 holds the refrigeration heat medium 32 and cools the upper surface of the refrigeration heat medium 32 to an extremely low temperature. From the perspective of cooling capacity, a form using a GM (Gifford-McMahon) cycle is preferably adopted for the refrigerator 31. The refrigeration heat medium 32 is fixed on the refrigerator 31, and its upper part is housed inside the processing container 10. The refrigeration heat medium 32 is formed of a material with high thermal conductivity (for example, Cu), and its outer shape is substantially cylindrical. The refrigeration heat medium 32 is arranged such that its center coincides with the central axis CL of the mounting table 20. Further, a second comb tooth structure 32a is formed on the upper surface (second contact surface) of the refrigeration heat medium 32. The comb tooth structure 32a has a plurality of annular recesses on the upper surface (second contact surface) of the refrigeration heat medium 32, and convex portions are formed between these recesses. Also, in the comb tooth structure 32a, circular and / or annular convex portions and recesses are alternately formed coaxially with the central axis CL of the mounting table 20. In the example shown in FIGS. 1 and 2, an annular third recess and an annular fourth recess are provided radially outward from the center of the central axis CL, and a circular fourth convex portion formed inside the third recess and an annular fourth convex portion formed between the third recess and the fourth recess are provided.

[0015] Further, a concave portion of the comb tooth structure 32a is formed at a position corresponding to the convex portion of the comb tooth structure 20a, and a concave portion of the comb tooth structure 20a is formed at a position corresponding to the convex portion of the comb tooth structure 32a. That is, a third concave portion of the refrigeration heat medium 32 is formed at a position corresponding to the first convex portion of the mounting table 20, a fourth concave portion of the refrigeration heat medium 32 is formed at a position corresponding to the second convex portion of the mounting table 20, a first concave portion of the mounting table 20 is formed at a position corresponding to the third convex portion of the refrigeration heat medium 32, and a second concave portion of the mounting table 20 is formed at a position corresponding to the fourth convex portion of the refrigeration heat medium 32. Thereby, when the upper surface of the refrigeration heat medium 32 is pressed against the lower surface of the mounting table 20, the comb tooth structure 20a and the comb tooth structure 32a are provided so as not to interfere with each other. That is, when the lower surface (first contact surface) of the mounting table 20 and the upper surface (second contact surface) of the refrigeration heat medium 32 are brought into contact with each other, the convex portion of the comb tooth structure 20a is inserted into the concave portion of the comb tooth structure 32a. Further, the comb tooth structures 20a and 32a are formed coaxially with respect to the central axis CL. Thereby, when the mounting table 20 rotates, the comb tooth structure 20a and the comb tooth structure 32a are provided so as not to interfere with each other.

[0016] Further, the height of the convex portion of the comb tooth structure 20a formed on the lower surface (first contact surface) of the mounting table 20 may be lower than the depth of the concave portion of the comb tooth structure 32a formed on the upper surface (second contact surface) of the refrigeration heat medium 32.

[0017] Note that the comb tooth structure 20a has been described as having a plurality of annular convex portions protruding downward (toward the refrigeration heat medium 32) from the lower surface (first contact surface) of the mounting table 20, and the comb tooth structure 32a has a plurality of annular concave portions on the upper surface (second contact surface) of the refrigeration heat medium 32, but the present invention is not limited to this. The comb tooth structure 20a may have a plurality of annular concave portions on the lower surface (first contact surface) of the mounting table 20, and the comb tooth structure 32a may have a configuration having a plurality of annular convex portions protruding upward (toward the mounting table 20) from the upper surface (second contact surface) of the refrigeration heat medium 32.

[0018] Further, a heat conduction member 33 is disposed on the upper surface (second contact surface) of the refrigerating heat medium 32. In a state where the thermal contact between the mounting table 20 and the refrigerating device 30 is released (see FIG. 1), the heat conduction member 33 is disposed on the upper surface of the refrigerating heat medium 32 of the refrigerating device 30. Further, in a state where the mounting table 20 and the refrigerating device 30 are thermally connected (see FIG. 2), the heat conduction member 33 is interposed between the lower surface (first contact surface) of the mounting table 20 and the upper surface (second contact surface) of the refrigerating heat medium 32 of the refrigerating device 30.

[0019] The heat conduction member 33 is formed of an elastically deformable soft metal. In other words, the heat conduction member 33 is formed of a soft metal that is more easily elastically deformed than the material of the lower surface of the mounting table 20 and / or the upper surface of the refrigerating heat medium 32. In other words, the heat conduction member 33 is formed of a metal having a lower hardness (e.g., Vickers hardness) than the material of the lower surface of the mounting table 20 and / or the upper surface of the refrigerating heat medium 32. Further, the heat conduction member 33 can be used in the vacuum atmosphere of the internal space 10S, and a material that can be used at an extremely low temperature cooled by the refrigerator 31 is used. Further, a material that does not affect the process of substrate processing is used for the heat conduction member 33. Further, a material having a high thermal conductivity is preferable for the heat conduction member 33. Note that the material of the heat conduction member 33 may be a material having a lower thermal conductivity than the material of the lower surface of the mounting table 20 and / or the upper surface of the refrigerating heat medium 32. Specifically, copper, indium, silver, tin, etc. can be used as the soft metal. Further, the heat conduction member 33 is formed as a sheet-like member (soft metal sheet, e.g., indium sheet, etc.). Thereby, even when the material of the heat conduction member 33 is a material having a lower thermal conductivity than the material of the lower surface of the mounting table 20 and / or the upper surface of the refrigerating heat medium 32, by forming the heat conduction member 33 as a thin sheet-like member, the influence on the overall heat conduction from the refrigerator 31 to the mounting table 20 can be made sufficiently small.

[0020] As shown in FIGS. 1 and 2, the heat conduction member 33 may be arranged so as to surround the comb-tooth structures 20a and 32a. That is, the heat conduction member 33 has an annular shape, and the comb-tooth structures 20a and 32a may be arranged inside the heat conduction member 33 in the radial direction.

[0021] Also, the position where the heat conduction member 33 is provided is not limited to this. The heat conduction member may be provided on the upper surface of the convex portion of the comb tooth structure 32a, or the heat conduction member may be provided on the bottom surface of the concave portion of the comb tooth structure 32a.

[0022] Also, the mounting table 20 is rotatably supported by a rotating device 40. The rotating device 40 includes a rotation driving device 41, a fixed shaft 45, a rotating shaft 44, a housing 46, magnetic fluid seals 47 and 48, and a stand 49.

[0023] The rotation driving device 41 is a direct drive motor having a rotor 42 and a stator 43. The rotor 42 has a substantially cylindrical shape extending coaxially with the rotating shaft 44 and is fixed to the rotating shaft 44. The stator 43 has a substantially cylindrical shape whose inner diameter is larger than the outer diameter of the rotor 42. The rotation driving device 41 may be in a form other than a direct drive motor, such as a form including a servo motor and a transmission belt.

[0024] The rotating shaft 44 has a substantially cylindrical shape extending coaxially with the central axis CL of the mounting table 20. A fixed shaft 45 is provided on the radially inner side of the rotating shaft 44. The fixed shaft 45 has a substantially cylindrical shape extending coaxially with the central axis CL of the mounting table 20. A housing 46 is provided on the radially outer side of the rotating shaft 44. The housing 46 has a substantially cylindrical shape extending coaxially with the central axis CL of the mounting table 20 and is fixed to the processing container 10.

[0025] Also, a magnetic fluid seal 47 is provided between the outer peripheral surface of the fixed shaft 45 and the inner peripheral surface of the rotating shaft 44. The magnetic fluid seal 47 rotatably supports the rotating shaft 44 with respect to the fixed shaft 45, seals the space between the outer peripheral surface of the fixed shaft 45 and the inner peripheral surface of the rotating shaft 44, and separates the second space S2, which will be described later, from the external space of the processing container 10. Further, a magnetic fluid seal 48 is provided between the inner peripheral surface of the housing 46 and the outer peripheral surface of the rotating shaft 44. The magnetic fluid seal 48 rotatably supports the rotating shaft 44 with respect to the housing 46, seals the space between the inner peripheral surface of the housing 46 and the outer peripheral surface of the rotating shaft 44, and separates the internal space 10S of the processing container 10, which can be depressurized, from the external space of the processing container 10. Thereby, the rotating shaft 44 is rotatably supported by the fixed shaft 45 and the housing 46.

[0026] Also, a refrigeration heat medium 32 is inserted radially inside the fixed shaft 45.

[0027] The stand 49 has a support member 49a and a locking member 49b.

[0028] The support member 49a is, for example, a cylindrical member. The upper part of the support member 49a is fixed to the mounting table 20. The lower part of the support member 49a is connected to the rotating shaft 44 via a bellows 82. Further, between the rotating shaft 44 and the support member 49a, there is a rotational force transmission mechanism (not shown) that transmits the rotation of the rotating shaft 44 to the support member 49a while allowing the support member 49a to slide in the vertical direction with respect to the rotating shaft 44. The rotational force transmission mechanism may have, for example, a hole provided in the support member 49a and a shaft portion standing upright from the rotating shaft 44, and the shaft portion may be inserted into the hole. Note that a plurality (for example, three) of sets of the hole and the shaft portion are provided in the circumferential direction of the support member 49a and the rotating shaft 44.

[0029] By moving the support member 49a so as to insert the shaft portion into the hole portion, the support member 49a slides downward with respect to the rotating shaft 44. Also, by moving the support member 49a so as to remove the shaft portion from the hole portion, the support member 49a slides upward with respect to the rotating shaft 44. Further, the rotation of the rotating shaft 44 is transmitted to the support member 49a via the shaft portion inserted into the hole portion. Note that a plurality (for example, three) sets of the hole portion and the shaft portion are provided in the circumferential direction of the support member 49a and the rotating shaft 44 as the rotational force transmission mechanism. Note that the rotational force transmission mechanism may be provided inside the bellows 82 or may be provided outside the bellows 82.

[0030] The locking member 49b is fixed to the housing 46.

[0031] Here, as shown in FIG. 2, when the refrigeration heat medium 32 is raised and pressed against the mounting table 20, the support member 49a is locked by the locking member 49b. Also, when the refrigeration heat medium 32 is pressed against the mounting table 20, a load is received by the housing 46 fixed to the processing container 10 via the support member 49a and the locking member 49b. Thereby, it is possible to prevent the rotating shaft 44 from tilting and coming into contact with the fixed shaft 45 or the housing 46, and to prevent the sealing performance of the magnetic fluid seals 47 and 48 from deteriorating.

[0032] On the other hand, as shown in FIG. 1, when the refrigeration heat medium 32 is lowered and separated from the mounting table 20, both the support member 49a and the locking member 49b are separated. With the above configuration, when the rotor 42 of the rotation drive device 41 rotates, the rotating shaft 44, the bellows 82, the support member 49a, and the mounting table 20 rotate relative to the refrigeration heat medium 32.

[0033] Further, the refrigeration device 30 is supported by an elevating device 50 so as to be movable up and down. The elevating device 50 includes an air cylinder 51, a link mechanism 52, a refrigeration device support portion 53, a linear guide 54, a fixing portion 55, and a bellows 56.

[0034] The air cylinder 51 is a mechanical device in which a rod moves linearly by air pressure. The link mechanism 52 converts the linear motion of the rod of the air cylinder 51 into the up-and-down motion of the refrigeration device support portion 53. The link mechanism 52 has a lever structure with one end connected to the air cylinder 51 and the other end connected to the refrigeration device support portion 53. Thereby, a large pressing force can be generated with a small thrust of the air cylinder 51. The refrigeration device support portion 53 supports the refrigeration device 30 (refrigerator 31, refrigeration heat medium 32). Further, the moving direction of the refrigeration device support portion 53 is guided in the up-and-down direction by a linear guide 54.

[0035] The fixing portion 55 is fixed to the lower surface of the fixing shaft 45. A substantially cylindrical bellows 56 that surrounds the refrigerator 31 is provided between the lower surface of the fixing portion 55 and the upper surface of the refrigeration device support portion 53. The bellows 56 is a metal bellows structure that can expand and contract in the vertical direction. Thereby, the fixing portion 55, the bellows 56, and the refrigeration device support portion 53 seal between the inner peripheral surface of the fixing shaft 45 and the outer peripheral surface of the refrigeration heat medium 32.

[0036] A slip ring 60 is provided below the rotating shaft 44 and the housing 46. The slip ring 60 has a rotating body 61 including a metal ring and a fixed body 62 including a brush. The rotating body 61 has a substantially cylindrical shape extending coaxially with the rotating shaft 44 and is fixed to the lower surface of the rotating shaft 44. The fixed body 62 has a substantially cylindrical shape whose inner diameter is slightly larger than the outer diameter of the rotating body 61 and is fixed to the lower surface of the housing 46. The slip ring 60 is electrically connected to a power source (not shown) and supplies the power supplied from the power source to the power supply rod 63. With this configuration, a potential can be applied from the power source to the electrode 21 without causing twisting or the like in the power supply rod 63. The structure of the slip ring 60 is not particularly limited and may be, for example, a brush structure, a non-contact power supply structure, a structure having no mercury or a conductive liquid, or the like. The details of the slip ring 60 will be described later with reference to FIG. 3.

[0037] Also, a cooling mechanism 70 for supplying cooling water to the power supply rod 63 is provided below the slip ring 60. The details of the cooling mechanism 70 will be described later with reference to FIG. 4.

[0038] The control device 90 is, for example, a computer, and includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or the auxiliary storage device, and controls the operation of the substrate processing apparatus 1. The control device 90 may be provided inside the substrate processing apparatus 1 or outside it. When the control device 90 is provided outside the substrate processing apparatus 1, the control device 90 can control the substrate processing apparatus 1 by means of communication means such as wired or wireless.

[0039] When performing a desired process on the substrate W, as shown in FIG. 1, the control device 90 controls the elevating device 50 (air cylinder 51) to separate the mounting table 20 from the refrigerating and heating medium 32, and controls the rotating device 40 (rotary driving device 41) to rotate the mounting table 20 on which the substrate W is mounted. Thereby, the in-plane uniformity of the substrate processing (for example, film forming process, etc.) of the substrate W can be improved.

[0040] Also, when cooling the mounting table 20 and the substrate W mounted on the mounting table 20, as shown in FIG. 2, the control device 90 stops the rotating device 40 (rotary driving device 41) to stop the rotation of the mounting table 20, and controls the elevating device 50 (air cylinder 51) to bring the mounting table 20 into contact with the refrigerating and heating medium 32. Thereby, the substrate W mounted on the mounting table 20 can be cooled.

[0041] Between the refrigeration heat medium 32 and the fixed shaft 45, a substantially cylindrical bellows 81 (first bellows) is provided. The bellows 81 is a metal bellows structure that can expand and contract in the vertical direction (axial direction of the central axis CL). One end of the bellows 81 is airtightly fixed to the refrigeration heat medium 32 by welding, and the other end of the bellows 81 is airtightly fixed to the fixed shaft 45 by welding. Also, between the mounting table 20 (support member 49a fixed to the mounting table 20) and the rotating shaft 44, a substantially cylindrical bellows 82 (second bellows) is provided. The bellows 82 is a metal bellows structure that can expand and contract in the vertical direction (axial direction of the central axis CL). One end of the bellows 82 is airtightly fixed to the mounting table 20 (support member 49a fixed to the mounting table 20) by welding, and the other end of the bellows 81 is airtightly fixed to the rotating shaft 44 by welding.

[0042] Here, the back surface side of the mounting table 20 has a space blocked from the internal space 10S. Specifically, a first space S1 is formed between the lower surface of the mounting table 20 and the upper surface of the refrigeration heat medium 32. Also, a second space S2 sealed by the bellows 81, 82 and the magnetic fluid seal 47 is formed. That is, the mounting table 20, the refrigeration heat medium 32, the bellows 81 provided between the refrigeration heat medium 32 and the fixed shaft 45, the bellows 82 provided between the mounting table 20 and the rotating shaft 44, and the magnetic fluid seal 47 provided between the outer peripheral surface of the fixed shaft 45 and the inner peripheral surface of the rotating shaft 44 form a heat transfer gas supply space (first space S1, second space S2) blocked from the internal space 10S. Thus, the heat transfer gas supply space (first space S1, second space S2) includes the lower surface (first contact surface) of the mounting table 20 and the upper surface (second contact surface) of the refrigeration heat medium 32 and is a space blocked from the internal space 10S.

[0043] As shown in FIG. 1, when the mounting table 20 is rotated, the first space S1 and the second space S2 communicate with each other. Further, as shown in FIG. 2, when the refrigeration heat medium 32 is pressed against the mounting table 20, the heat conduction member 33 provided at the contact portion between the refrigeration heat medium 32 and the mounting table 20 blocks the first space S1 and the second space S2. Note that when the refrigeration heat medium 32 is pressed against the mounting table 20, the first space S1 and the second space S2 may communicate with each other.

[0044] Further, a third space S3 sealed by bellows 81 and 56 is formed. That is, the refrigeration heat medium 32, the cylindrical fixed shaft 45 and the fixing portion 55, the bellows 81 provided between the refrigeration heat medium 32 and the fixed shaft 45, and the bellows 56 provided between the fixing portion 55 and the refrigeration device support portion 53 form a third space S3 blocked from the internal space 10S.

[0045] Thus, the bellows 81 seals between the first space S1 and the second space S2 and the third space S3. Further, the bellows 82 seals between the first space S1 and the second space S2 and the internal space 10S. Further, the bellows 56 seals between the third space S3 and the internal space 10S. Further, the magnetic fluid seal 47 seals between the first space S1 and the second space S2 and the external space of the processing container 10. Further, the magnetic fluid seal 48 seals between the internal space 10S and the external space of the processing container 10.

[0046] The refrigeration device 30 also has a gas introduction port 83 for introducing a heat transfer gas into the first space S1 and the second space S2. A heat transfer gas supply source (not shown) is connected to the gas introduction port 83. Thereby, the heat transfer gas supply source fills the first space S1 and the second space S2 with the heat transfer gas via the gas introduction port 83. As the heat transfer gas, for example, He gas or the like can be used. Note that a switching valve may be provided in the path between the gas introduction port 83 and the heat transfer gas supply source, and the configuration may be such that the gas introduction port 83 and an exhaust device (not shown) are connected by switching. Thereby, by switching the switching valve, the gas is exhausted from the first space S1 and the second space S2 via the gas introduction port 83, and the pressure is reduced to a vacuum atmosphere. Further, another switching valve may be provided in the path between the gas introduction port 83 and the heat transfer gas supply source, and the configuration may be such that the gas introduction port 83 and the external space of the processing container 10 are connected by switching. Thereby, by switching the other switching valve, the first space S1 and the second space S2 are opened to the atmosphere via the gas introduction port 83.

[0047] The refrigeration device support portion 53 is also provided with an exhaust port 84. An exhaust device (not shown) is connected to the exhaust port 84. Thereby, the gas is exhausted from the third space S3, and the pressure is reduced to a vacuum atmosphere. That is, vacuum insulation is provided between the refrigeration device 30 (the refrigerator 31 and the refrigeration heat medium 32), the fixed shaft 45, and the fixing portion 55. Further, a switching valve may be provided in the path between the exhaust port 84 and the exhaust device, and the configuration may be such that the exhaust port 84 and the external space of the processing container 10 are connected by switching. Thereby, by switching the switching valve, the third space S3 is opened to the atmosphere via the exhaust port 84.

[0048] With such a configuration, as shown in FIG. 2, when the rotation of the mounting table 20 is stopped and the refrigerating heat medium 32 is brought into contact with the mounting table 20, the mounting table 20 is mainly cooled by conduction heat transfer. Further, by interposing the heat conduction member 33, the conduction heat transfer between the mounting table 20 and the refrigerating heat medium 32 can be improved. Further, heat transfer occurs between the mounting table 20 and the refrigerating heat medium 32 through the heat transfer gas filled in the first space S1 formed by the upper and lower comb tooth structures 20a, 32a. Here, by providing the comb tooth structures 20a, 32a, the surface area facing the first space S1 can be increased, and the heat transfer performance between the mounting table 20 and the refrigerating heat medium 32 through the heat transfer gas can be improved.

[0049] Further, as shown in FIG. 1, when the refrigerating heat medium 32 and the mounting table 20 are separated and the mounting table 20 is rotated, heat transfer (gas heat transfer) occurs from the mounting table 20 to the refrigerating heat medium 32 through the heat transfer gas filled in the heat transfer gas supply spaces (the first space S1 and the second space S2). Thereby, it is possible to suppress the temperature rise of the mounting table 20 during the substrate processing in which the mounting table 20 is rotated. Further, when the refrigerating heat medium 32 is brought into contact with the mounting table 20 to cool the mounting table 20 after the substrate processing, the cooling time due to the contact can be shortened. Thereby, the throughput of the substrate processing in the substrate processing apparatus 1 is improved.

[0050] Further, bellows 81, 82 which are metal bellows structures that can expand and contract in the vertical direction are used to form the heat transfer gas supply spaces (the first space S1 and the second space S2). Thereby, even if the bellows 81, 82 are cooled through the mounting table 20 and the refrigerating heat medium 32 cooled by the refrigerator 31, it is possible to prevent a decrease in the sealing performance due to cooling shrinkage as compared with a seal member made of resin or the like. Further, by using the bellows 81, 82 which are metal bellows structures, the replacement frequency can be reduced and the stop period of the substrate processing apparatus 1 can be suppressed as compared with a seal member made of resin or the like.

[0051] Next, the slip ring 60 will be described with reference to FIG. 3. FIG. 3 is an example of a cross-sectional view of the slip ring 60.

[0052] The slip ring 60 has a rotating body 61 fixed to the lower surface of the rotating shaft 44 and rotating together with the rotating shaft 44, and a fixed body 62 fixed to the lower surface of the housing 46. A conductive bearing 65 is provided between the rotating body 61 and the fixed body 62. The conductive bearing 65 has rolling elements, an inner ring, and an outer ring. The rolling elements, the inner ring, and the outer ring are formed of a conductive member such as metal, and the inner ring and the outer ring are electrically connected through the rolling elements. Also, conductive grease may be applied to the rolling elements. The rotating body 61 has an insulating portion 611 made of resin or the like and a conductive portion 612. The conductive portion 612 is electrically connected to the inner ring of the conductive bearing 65. The fixed body 62 has an insulating portion 621 made of resin or the like and a conductive portion 622. The conductive portion 622 is electrically connected to the outer ring of the conductive bearing 65. With such a configuration, the conductive portion 622 of the fixed body 62 and the conductive portion 612 of the rotating body 61 are electrically connected through the conductive bearing 65.

[0053] Here, when the rotating body 61 is fastened to the mounting surface (lower surface) of the rotating shaft 44 with bolts and the fixed body 62 is fastened to the mounting surface (lower surface) of the housing 46 with bolts, there is a possibility that an axial displacement may occur between the rotating body 61 and the fixed body 62 of the slip ring 60 due to the height difference between the mounting surface (lower surface) of the rotating shaft 44 and the mounting surface (lower surface) of the housing 46. Due to this axial displacement between the rotating body 61 and the fixed body 62, a load is generated on the conductive bearing 65, which may lead to a reduction in the life of the conductive bearing 65 or damage. Also, when a load is generated on the conductive bearing 65, there is a possibility of problems such as poor electrical conduction or the influence of scattered wear powder on the surrounding drive parts.

[0054] In the slip ring 60 of the present embodiment, the fixed body 62 is fastened to the mounting surface (lower surface) of the housing 46 with bolts 66. That is, the position relationship of the fixed body 62 with respect to the housing 46 in the rotational direction and the axial direction is fixed. On the other hand, the rotating body 61 is not fixed to the mounting surface (lower surface) of the rotating shaft 44 and has a structure in which it is held in a floating state by the conductive bearing 65.

[0055] A hole is formed in each of the mounting surface (lower surface) of the rotating shaft 44 and the mounting surface (upper surface) of the rotating body 61. One end of the driven pin 67 is inserted into a hole formed in the mounting surface (lower surface) of the rotating shaft 44 and extending in a direction parallel to the central axis CL, and the other end is formed in the mounting surface (upper surface) of the rotating body 61 and inserted into an elongated hole in a direction parallel to the central axis CL. With the mounting surface (lower surface) of the rotating shaft 44 and the mounting surface (upper surface) of the rotating body 61 spaced apart from each other, the rotation of the rotating shaft 44 is transmitted to the rotating body 61 via the driven pin 67. As described above, in the slip ring 60 of this embodiment, the fixed body 62 is fastened to the mounting surface (lower surface) of the housing 46 with the bolts 66. The slip ring 60 has a hole in the rotor 61, a hole in the rotating shaft 44, and a driven pin 67 that fix the rotational position of the rotor 61 relative to the rotating shaft 44, but do not restrict the axial position of the rotor 61 relative to the rotating shaft 44. That is, the driven pin 67 connects the rotating shaft 44 and the rotor 61. The rotor 61 is fixed in its rotational position relative to the rotating shaft 44, but does not restrict its axial position. Preferably, the driven pins 67 are arranged at three equal intervals on the same circumference. This suppresses axial wobble of the slip ring 60.

[0056] Furthermore, the height position (axial position) of the mounting surface (upper surface) of the fixed body 62 is formed at a position higher than the height position (axial position) of the mounting surface (upper surface) of the rotating body 61. This makes it possible to prevent a load from being generated in the conductive bearing 65 even if the mounting surface (lower surface) of the rotating shaft 44 is lower than the mounting surface (lower surface) of the housing 46.

[0057] Next, the structure for cooling the power feed rod 63 and the conductive bearing 65 will be described with reference to Fig. 4. Fig. 4 is an example of a cross-sectional view illustrating the structure for cooling the power feed rod 63 and the conductive bearing 65.

[0058] For example, when applying high-frequency power to the electrode 21 for the purpose of generating plasma in the internal space 10S and drawing ions from the generated plasma to the substrate W placed on the mounting table 20, heat is generated in the energized portion. That is, heat is generated in the power supply rod 63 and the conductive bearing 65.

[0059] The fixed body 62 is provided with a heat medium flow path 624 through which a heat transfer medium (for example, cooling water, cooling gas, etc.) flows. Further, the fixed body 62 is provided with a heat transfer member 623 that is exposed to the heat medium flow path 624 and contacts the outer ring of the conductive bearing 65. The heat transfer member 623 is made of a material with high thermal conductivity such as metal. Thereby, the conductive bearing 65 can be cooled via the heat transfer member 623.

[0060] The power supply rod 63 has a hollow structure. The cooling mechanism 70 has a rotating body 71 fixed to the rotating body 61 of the slip ring 60 and rotating together with the rotating shaft 44, and a fixed body 72 fixed to the housing 46. A bearing 75 and a seal member are provided between the rotating body 71 and the fixed body 72.

[0061] The heat transfer medium (for example, cooling water, cooling gas, etc.) supplied to the heat medium flow path 701 of the fixed body 72 flows into the heat medium flow path 702 of the rotating body 71 and flows through the heat medium flow path 703 inside the inner tube 73 inserted into the hollow power supply rod 63. Then, by supplying the heat transfer medium to the heat medium flow path 704 between the hollow power supply rod 63 and the outside of the inner tube 73, the power supply rod 63 is cooled. The heat transfer medium that has cooled the power supply rod 63 flows through the heat medium flow path 705 of the rotating body 71 and the heat medium flow path 706 of the fixed body 72.

[0062] In this way, by making the power supply rod 63 have a hollow structure and supplying a heat transfer medium therein, the power supply rod 63 is cooled. Thereby, heat generation of the power supply rod 63 is suppressed from being transferred to the mounting table 20 and the refrigeration device 30.

[0063] Although the substrate processing apparatus 1 has been described above, the present disclosure is not limited to the above-described embodiments and the like, and various modifications and improvements can be made within the scope of the gist of the present disclosure described in the claims.

Explanation of Signs

[0064] W Substrate CL Central Axis 1 Substrate Processing Apparatus 10 Processing Container 10S Internal Space 20 Mounting Table 20a, 32a Comb Structure 21 Electrode 30 Refrigeration Device 31 Refrigerator 32 Refrigerant Heat Medium 40 Rotation Device 41 Rotation Driving Device 42 Rotor 43 Stator 44 Rotation Shaft 45 Fixed Shaft 46 Housing 47, 48 Magnetic Fluid Seal 49 Stand 50 Lifting Device 56 Bellows 60 Slip Ring 61 Rotating Body 62 Fixed Body 63 Power Feeding Rod 70 Cooling Mechanism 81 Bellows (First Bellows) 82 Bellows (Second Bellows) 83 Gas Introduction Port 84 Exhaust Port 90 Control Device

Claims

1. A processing container, a mounting table provided within the processing container and having a first contact surface on the side opposite to the mounting surface for mounting a substrate, a refrigeration device having a second contact surface for cooling the mounting table, a rotating device for rotating the mounting table, a lifting device for lifting the refrigeration device to bring the first contact surface and the second contact surface into contact or separation, a heat transfer gas supply space including the first contact surface of the mounting table and the second contact surface of the refrigeration device and blocked from the internal space of the processing container, and a gas introduction port for supplying heat transfer gas to the heat transfer gas supply space. A substrate processing apparatus.

2. A rotating shaft rotated by the rotating device, a fixed shaft provided inside the radial direction of the rotating shaft, a first bellows provided between the refrigeration device and the fixed shaft, a second bellows provided between the mounting table and the rotating shaft, and a magnetic fluid seal provided between the outer peripheral surface of the fixed shaft and the inner peripheral surface of the rotating shaft. The heat transfer gas supply space is formed by the first contact surface, the second contact surface, the first bellows, the second bellows, and the magnetic fluid seal. The substrate processing apparatus according to Claim 1.

3. The first bellows and the second bellows are expandable and contractible metal bellows structures. The substrate processing apparatus according to Claim 2.

4. The first contact surface and the second contact surface have a comb tooth structure. The substrate processing apparatus according to Claim 1.

5. The first contact surface has a plurality of annular protrusions, the second contact surface has a plurality of annular recesses, and when the first contact surface and the second contact surface are brought into contact, the protrusions of the first contact surface are inserted into the recesses of the second contact surface. The substrate processing apparatus according to Claim 4.

6. Further comprising a heat conduction member interposed between the first contact surface and the second contact surface, wherein the heat conduction member is formed of a soft metal softer than the material of the first contact surface and / or the material of the second contact surface. The substrate processing apparatus according to Claim 1.

7. A rotating shaft rotated by the rotating device, a housing provided outside the radial direction of the rotating shaft, and a slip ring. The slip ring is fastened to the housing by bolts, and is a fixed body having a fixed positional relationship in the rotational direction and the axial direction with respect to the housing. A rotating body connected to the rotating shaft by a driven pin and having a fixed rotational positional relationship with respect to the rotating shaft; A bearing provided between the rotating body and the fixed body; and having, The substrate processing apparatus according to claim 1.

8. Further comprising a power supply rod for supplying power to the electrode of the mounting table, The power supply rod, Has a hollow structure to which a heat transfer medium is supplied, The substrate processing apparatus according to claim 7.

9. Further comprising a power supply rod for supplying power to the electrode of the mounting table, The power supply rod, Has a hollow structure to which a heat transfer medium is supplied, The substrate processing apparatus according to claim 7.

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