Substrate support, substrate table, and method

Abstract

To provide a substrate support that can be cheaper to maintain and that can reduce the length of downtime required for service when wear occurs.SOLUTION: A substrate support for supporting a substrate in a lithographic apparatus includes: a first support body 21 configured to support a substrate W; a main body 22 separate from the first support body and configured to support the first support body, the main body comprising a thermal conditioner 60 configured to thermally condition the main body, the support body and / or the substrate; and an extractor body 100 surrounding the main body and the support body, where the extractor body comprises a first extraction channel 102 configured to extract fluid from near a peripheral part of the substrate.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] [Cross - reference to related applications] This application claims the priority of European Application No. 20158919.9 filed on February 24, 2020 and European Application No. 20163571.1 filed on March 17, 2020, the entire contents of which are incorporated herein by reference.

[0002] [Technical Field] The present invention relates to a substrate support for supporting a substrate in a lithographic apparatus, a substrate table, a method for supporting a substrate, and a device manufacturing method.

Background Art

[0003] A lithographic apparatus is an apparatus configured to apply a desired pattern onto a substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may project, for example, a pattern of a patterning device (e.g., a mask) (often also referred to as a “design layout” or “design”) onto a layer of radiation - sensitive material (resist) provided on a substrate (e.g., a wafer). Known lithographic apparatuses include so - called steppers, in which each target portion is irradiated by exposing the entire pattern onto the target portion in one go, and so - called scanners, in which the substrate is scanned simultaneously in a direction parallel or non - parallel to this direction while scanning the pattern in a predetermined direction (the “scan” direction) through a radiation beam, whereby each target portion is irradiated.

[0004] As semiconductor manufacturing processes continue to advance, following the trend generally represented by "Moore's Law," the number of functional elements such as transistors per device has steadily increased over the past few decades while the dimensions of circuit elements have been continuously reduced. The semiconductor industry is pursuing technologies that enable the generation of ever-smaller features so as not to lag behind Moore's Law. To project a pattern onto a substrate, a lithographic apparatus may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of the features to be patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm.

[0005] Further improvements in the resolution of smaller features may be achieved by providing an immersion fluid such as water, which has a relatively high refractive index, on the substrate during exposure. The effect of the immersion fluid is to enable imaging of smaller features because the exposure radiation in the fluid has a shorter wavelength than in air. The effect of the immersion fluid is also that it increases the effective numerical aperture (NA) of the system and also increases the depth of focus. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION

[0006] The immersion fluid may be restricted by a fluid handling structure to a local area between the projection system of the lithographic apparatus and the substrate. A fast relative movement between the substrate and the restricted immersion liquid may cause leakage of the immersion fluid from the local area. Such leakage is undesirable and may lead to defects on the substrate. For this reason, the speed at which the substrate is stepped or scanned relative to the projection system is restricted. This restricts the throughput of the lithographic apparatus.

[0007] During the semiconductor manufacturing process, the substrate is supported on a substrate support. Over time, the substrate support wears out and needs to be replaced. The object of the present invention is to provide a substrate support that can be maintained at a lower cost and reduce the length of downtime required for service when it wears out.

Means for Solving the Problem

[0008] According to the present invention, there is provided a substrate support for supporting a substrate in a lithographic apparatus. This substrate support includes a first support configured to support the substrate, a main body separated from the first support and configured to support the first support, and a thermal conditioner configured to thermally condition the main body, the support, and / or the substrate, and a removal body surrounding the main body and the support, the removal body including a first removal channel configured to remove fluid from near the peripheral edge of the substrate.

[0009] According to the present invention, there is also provided a substrate table including a substrate stage and a substrate support.

[0010] According to the present invention, there is also provided a method for supporting a substrate on a substrate support in a lithographic apparatus. This method includes supporting the substrate on a first support of the substrate support, supporting the first support on a main body separated from the first support, thermally conditioning the main body, the support, and / or the substrate with a thermal conditioner of the main body, and removing fluid from near the peripheral edge of the substrate through a first removal channel of a removal body surrounding the main body and the support.

[0011] According to the present invention, there is also provided a method for replacing a first support of a substrate support for supporting a substrate in a lithographic apparatus. The method comprises connecting a carrier plate to the first support such that the carrier plate covers a pinhole that penetrates the first support in the thickness direction of the first support; extending a plurality of pins through each pinhole such that the pins support the carrier plate at their ends and the pins penetrate the body of the substrate support below the first support; and controlling the movement of the pins to lower the first support onto the body or to lift the first support from the body.

[0012] According to the present invention, there is also provided a device manufacturing method using a lithographic apparatus. The method comprises projecting a beam patterned by a patterning device onto a substrate while supporting the substrate with a substrate support; and performing a method for supporting a substrate in a lithographic apparatus or a method for replacing a first support of a substrate support for supporting a substrate in a lithographic apparatus.

[0013] Further embodiments, features and advantages of the present invention, and the structures and operations of various embodiments, features and advantages of the present invention will be described in detail below with reference to the accompanying drawings.

Brief Description of the Drawings

[0014] Hereinafter, embodiments of the invention will be described by way of example only with reference to the following accompanying schematic drawings in which corresponding reference numerals represent corresponding parts. FIG. 1 shows a schematic diagram of a lithographic apparatus. FIGS. 2 and 3 show two different versions of a fluid handling system for use in a lithographic projection apparatus in cross-section. FIG. 4 shows a part of a lithographic apparatus. FIG. 5 shows a substrate support according to an embodiment of the invention. FIG. 6 shows a substrate support according to a comparative example. FIGS. 7 to 11 show different versions of a substrate support according to the invention. Figures 12 and 13 show different versions of the height adjustment mechanism for the embodiment of the invention. Figure 14 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 15 is a schematic cross-sectional view of the assembly shown in Figure 14 lowered onto the main body according to an embodiment of the invention. Figure 16 is a schematic cross-sectional view of a carrier plate separated from the first support shown in Figures 14 and 15. Figure 17 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 18 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 19 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 20 is a schematic cross-sectional view of a mechanism for connecting a carrier plate to a first support according to an embodiment of the invention. Figure 21 is a schematic cross-sectional view during the process of separating the carrier plate shown in Figure 20 from the first support. Figure 22 is a schematic cross-sectional view of a carrier plate separated from the first support shown in Figure 20. Figure 23 is a schematic cross-sectional view of a mechanism for connecting a carrier plate to a first support according to an embodiment of the invention. Figure 24 is a schematic cross-sectional view during the process of separating the carrier plate shown in Figure 23 from the first support. Figure 25 is a schematic cross-sectional view of a carrier plate separated from the first support shown in Figure 23. Figure 26 is a schematic plan view of a first support according to an embodiment of the invention. Figure 27 is a schematic plan view of a first support according to an embodiment of the invention being gripped for handling. Figure 28 is a schematic plan view of a first support according to an embodiment of the invention being gripped for handling.

[0015] The features shown are not necessarily to scale and are not limited to the sizes and / or arrangements shown. The figures are understood to include optional features that are not essential to the invention. Further, not all features of the apparatus are shown in each of the figures, and a figure may show only some of the components relevant to describing a particular feature.

DETAILED DESCRIPTION OF THE INVENTION

[0016] In this document, the terms "radiation" and "beam" are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g., having wavelengths of 365, 248, 193, 157, or 126 nm).

[0017] As used in this text, the terms "reticle", "mask", or "patterning device" may be broadly interpreted to represent a general patterning device that can be used to impart a patterned cross-section to an incident radiation beam that corresponds to a pattern to be created in a target portion of a substrate. The term "light valve" may also be used in this context. Examples of such other patterning devices include programmable mirror arrays and programmable LCD arrays, in addition to classical masks (transmission or reflection, binary, phase-shift, hybrid, etc.).

[0018] Figure 1 schematically shows a lithographic apparatus. The lithographic apparatus includes an illumination system (also referred to as illuminator) IL configured to condition a radiation beam B (e.g., UV radiation or DUV radiation), a mask support (e.g., mask table) MT configured to support a patterning device (e.g., mask) MA and connected to a first positioner PM configured to accurately position the patterning device MA in accordance with certain parameters, a substrate support (e.g., substrate table) WT configured to hold a substrate (e.g., a wafer coated with resist) W and connected to a second positioner PW configured to accurately position the substrate support WT in accordance with certain parameters, and a projection system (e.g., refractive projection lens system) PS configured to project a pattern formed in the radiation beam B by the patterning device MA onto a target portion C (e.g., including one or more dies) of the substrate W.

[0019] During operation, the illumination system IL receives the radiation beam B from a radiation source SO, e.g., via a beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and / or other types of optical components, or any combination thereof, for directing, shaping, and / or controlling the radiation. The illuminator IL may be used to condition the radiation beam B such that it has a desired spatial and angular intensity distribution in the plane and in cross section of the patterning device MA.

[0020] As used herein, the term "projection system" PS should be broadly interpreted to encompass various types of projection systems, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic, and / or electrostatic optical systems, or any combination thereof, that are appropriate for the exposure radiation in use, and / or for other factors such as the use of a liquid immersion fluid or vacuum. The use of the term "projection lens" herein may be interpreted synonymously with the more general term "projection system" PS.

[0021] The lithographic apparatus may be of a type in which at least a portion of a substrate W is covered by an immersion liquid such as water having a relatively high refractive index in order to fill an immersion space 11 between the projection system PS and the substrate W (also referred to as immersion lithography). More information on immersion techniques is given in US6,952,253 which is incorporated herein by reference.

[0022] The lithographic apparatus may be of a type having two or more substrate supports WT (also referred to as a “dual stage”). In such a “multi-stage” apparatus, the substrate supports WT may be used in parallel and / or preparatory steps for a subsequent exposure of a substrate W may be carried out on a substrate W located on one of the substrate supports WT while another substrate W on the other substrate support WT is being used for exposing a pattern on the other substrate W.

[0023] In addition to the substrate support WT, the lithographic apparatus may comprise a measurement stage (not shown). The measurement stage is provided to hold a sensor and / or a cleaning device. The sensor may be provided to measure a characteristic of the projection system PS or of the radiation beam B. The measurement stage may hold a plurality of sensors. The cleaning device may be provided to clean parts of the lithographic apparatus, for example parts of the projection system PS or parts of the system providing the immersion liquid. The measurement stage may move under the projection system PS when the substrate support WT is away from the projection system PS.

[0024] During operation, the radiation beam B is incident on a patterning device such as a mask MA held on a mask support MT, and is patterned by a pattern (design layout) existing on the patterning device MA. The radiation beam B passing through the mask MA passes through a projection system PS that focuses the beam on a target portion C of the substrate W. By means of a second positioner PW and a position measurement system IF, for example, the substrate support WT can be accurately driven to place different target portions C at the focusing and alignment positions in the path of the radiation beam B. Similarly, a first positioner PM and other suitable position sensors (not explicitly shown in FIG. 1) may be used to accurately position the patterning device MA with respect to the path of the radiation beam B. The patterning device MA and the substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. The illustrated substrate alignment marks P1, P2 occupy dedicated target portions, but they may also be arranged in the space between the target portions. Substrate alignment marks P1, P2 arranged between the target portions C are known as scribe line alignment marks.

[0025] To clarify the invention, a Cartesian coordinate system is used. The Cartesian coordinate system has three axes, namely, the x-axis, the y-axis and the z-axis. Each of the three axes is orthogonal to the other two axes. Rotation about the x-axis is denoted as Rx rotation. Rotation about the y-axis is denoted as Ry rotation. Rotation about the z-axis is denoted as Rz rotation. The x-axis and the y-axis define a horizontal plane, and the z-axis defines a vertical direction. The Cartesian coordinate system is not intended to limit the invention and is used only for the purpose of explanation. Instead, other coordinate systems such as a cylindrical coordinate system may be used to clarify the invention. For example, the direction of the Cartesian coordinate system may be different such that the z-axis has a component along the horizontal plane.

[0026] Immersion technology has been introduced into lithography systems in order to enable improved resolution of smaller features. In an immersion lithography apparatus, a liquid layer of an immersion liquid having a relatively high refractive index is interposed in an immersion space 11 between a projection system PS of the apparatus (through which a pattern-formed beam is projected toward a substrate W) and the substrate W. The immersion liquid covers at least a part of the substrate W under the final element of the projection system PS. Thus, at least a part of the substrate W during exposure is immersed in the immersion liquid.

[0027] In commercially available immersion lithography, the immersion liquid is water. The water is typically high-purity distilled water such as ultrapure water (UPW) commonly used in semiconductor manufacturing plants. In an immersion system, the UPW is frequently purified and may have to undergo additional processing steps before being supplied as the immersion liquid to the immersion space 11. Other liquids other than water having a high refractive index, such as hydrocarbons such as fluorocarbons and / or aqueous solutions, can also be used as the immersion liquid. Furthermore, other fluids other than liquids are also expected to be used in immersion lithography.

[0028] Reference is made herein to localized immersion in which the immersion liquid in use is restricted to the immersion space 11 between the final element and the surface facing the final element. The opposing surface is the surface of the substrate W or the surface of a support stage (or substrate support WT) on the same plane as the surface of the substrate W (note that references to the surface of the substrate W in the following text represent, in addition or in place of, the surface of the substrate support WT unless otherwise specified, and vice versa). A fluid handling structure IH existing between the projection system PS and the substrate support WT is used to restrict the immersion liquid to the immersion space 11. The immersion space 11 filled with the immersion liquid is smaller than the outermost surface of the substrate W in plan view, and the immersion space 11 remains substantially stationary with respect to the projection system PS while the substrate W and the substrate support WT move below.

[0029] Other immersion systems such as non-restricted immersion systems (so-called "all-wet" immersion systems) and bath-type immersion systems are also anticipated. In a non-restricted immersion system, the immersion liquid covers more than the surface below the final element. The liquid outside the immersion space 11 exists as a thin liquid film. The liquid may cover the entire surface of the substrate W or the substrate W and the substrate support WT on the same plane as the substrate W. In a bath-type system, the substrate W is completely immersed in the bath of the immersion liquid.

[0030] The fluid handling structure IH is a structure that restricts the immersion liquid to the immersion space 11 by supplying the immersion liquid to the immersion space 11 and removing the immersion liquid from the immersion space 11. It includes features that are part of a fluid supply system. The arrangement disclosed in PCT Patent Application Publication No. WO99 / 49504 is an initial fluid handling structure comprising pipes that supply or recover the immersion liquid in the immersion space 11 and operate in response to the relative movement of the stage under the projection system PS. In a more recent design, the fluid handling structure extends along at least a part of the boundary of the immersion space 11 between the final element of the projection system PS and the substrate support WT or the substrate W, and partially defines the immersion space 11.

[0031] The fluid handling structure IH may have different functional options. Each function may be obtained from corresponding features that enable the fluid handling structure IH to implement that function. The fluid handling structure IH may be represented by many different terms representing functions, such as barrier members, seal members, fluid supply systems, fluid removal systems, liquid restriction structures, etc.

[0032] The fluid handling structure IH as a barrier member is a barrier against the flow of the immersion liquid from the immersion space 11. The structure as a liquid restriction structure restricts the immersion liquid to the immersion space 11. The sealing feature of the fluid handling structure IH as a seal member forms a seal for restricting the immersion liquid to the immersion space 11. The sealing feature may include an additional gas flow from an opening on the surface of a seal member such as a gas knife.

[0033] In one embodiment, the fluid handling structure IH may supply the immersion fluid as a fluid supply system.

[0034] In one embodiment, the fluid handling structure IH may at least partially restrict the immersion fluid as a fluid restriction system.

[0035] In one embodiment, the fluid handling structure IH may provide a barrier to the immersion fluid as a barrier member such as a fluid restriction structure.

[0036] In one embodiment, the fluid handling structure IH may generate or use a gas flow, for example, to assist in controlling the flow and / or position of the immersion fluid.

[0037] The gas flow may form a seal for restricting the immersion fluid, and the fluid handling structure IH may be represented as a seal member. Such a seal member may be a fluid restriction structure.

[0038] In one embodiment, the immersion liquid is used as the immersion fluid. In this case, the fluid handling structure IH may be a liquid handling system. With reference to the above description, references to the features defined for the fluid in these paragraphs are understood to include the features defined for the liquid.

[0039] The lithographic apparatus has a projection system PS. During the exposure of the substrate W, the projection system PS projects a patterned radiation beam onto the substrate W. In order to reach the substrate W, the path of the radiation beam B passes through the immersion liquid restricted by the fluid handling structure IH between the projection system PS and the substrate W. The projection system PS has a lens element that contacts the immersion liquid at the end of the beam path. This lens element that contacts the immersion liquid may be referred to as the "final lens element" or "final element". The final element is at least partially surrounded by the fluid handling structure IH. The fluid handling structure IH may restrict the immersion liquid below and above the lower and opposing surfaces of the final element.

[0040] As shown in FIG. 1, in one embodiment, the lithographic apparatus comprises a controller 500. The controller 500 is configured to control the substrate table WT.

[0041] FIG. 2 schematically shows a localized liquid supply system or fluid handling system. The liquid supply system is provided with a fluid handling structure IH (or liquid confinement structure) extending along at least part of the boundary of the space 11 between the final element of the projection system PS and the support table WT or the substrate W. The fluid handling structure IH is substantially stationary in the XY plane with respect to the projection system PS, although relative movement in the Z direction (the direction of the optical axis) is possible. In an example, a seal, which may be a non-contact seal such as a gas seal (such a system having a gas seal is disclosed in EP 1,420,298) or a liquid seal, is formed between the fluid handling structure IH and the surface of the substrate W.

[0042] The fluid handling structure IH at least partially confines the immersion liquid in the space 11 between the final element of the projection system PS and the substrate W. The space 11 is at least partially formed by the fluid handling structure IH located below and surrounding the final element of the projection system PS. The immersion liquid is supplied into the space 11 under the projection system PS and within the fluid handling structure IH through an opening 13 for liquid. The immersion liquid may be removed through another opening 13 for liquid. The immersion liquid may be supplied into the space 11 through at least two openings 13 for liquid. Which opening 13 for liquid is used to supply the immersion liquid and, optionally, which is used to remove the immersion liquid may depend on the direction of movement of the support table WT.

[0043] The immersion liquid may be restricted to the space 11 by a non-contact seal such as a gas seal 16 formed by gas that forms between the bottom of the fluid handling structure IH and the surface of the substrate W during use. The gas in the gas seal 16 is pressurized and provided through the inlet 15 into the gap between the fluid handling structure IH and the substrate W. The gas is taken out through the outlet 14. The positive pressure at the gas inlet 15, the vacuum level at the outlet 14, and the geometric arrangement of the gap are adjusted so that a high-speed gas flow inward that restricts the immersion liquid occurs. Such a system is disclosed in US2004 / 0207824, which is hereby incorporated by reference in its entirety. In one example, the fluid handling structure IH does not have a gas seal 16.

[0044] FIG. 3 is a side cross-sectional view showing a further liquid supply system or fluid handling system according to an embodiment. The arrangement illustrated in FIG. 3 and described below may be applied to the lithographic apparatus previously described and illustrated in FIG. 1. The liquid supply system is provided together with a fluid handling structure IH (or liquid confinement structure) that extends along at least a part of the boundary of the space 11 between the final element of the projection system PS and the support table WT or the substrate W.

[0045] The fluid handling structure IH at least partially restricts the immersion liquid in the space 11 between the final element of the projection system PS and the substrate W. The space 11 is at least partially formed by the fluid handling structure IH that is located below and surrounds the final element of the projection system PS. In an example, the fluid handling structure IH includes a body member 53 and a porous member 33. The porous member 33 is plate-shaped and has a plurality of holes (i.e., openings or pores). In one embodiment, the porous member 33 is a mesh plate in which a large number of small holes 84 are formed in a mesh pattern. Such a system is disclosed in US patent application US2010 / 0045949A1, which is hereby incorporated by reference in its entirety.

[0046] The main body member 53 includes a supply port 72 capable of supplying the immersion liquid to the space 11 and a recovery port 73 capable of recovering the immersion liquid from the space 11. The supply port 72 is connected to a liquid supply device 75 via a flow path 74. The liquid supply device 75 can supply the immersion liquid to the supply port 72 through the corresponding flow path 74. The recovery port 73 can recover the immersion liquid from the space 11. The recovery port 73 is connected to a liquid recovery device 80 via a flow path 79. The liquid recovery device 80 recovers the immersion liquid recovered through the recovery port 73 through the flow path 79. The porous member 33 is disposed at the recovery port 73. By performing a liquid supply operation using the supply port 72 and a liquid recovery operation using the porous member 33, a space 11 is formed in which one side is between the projection system PS and the fluid handling structure IH and the other side has the substrate W.

[0047] FIG. 4 illustrates a part of a lithographic apparatus useful for understanding an embodiment of the present invention. The arrangement illustrated in FIG. 4 and described below may be applied to the lithographic apparatus previously described and illustrated in FIG. 1. FIG. 4 is a cross-section of the substrate support 20 and the substrate W. In one embodiment, the substrate support 20 includes one or more adjustment channels 61 of a thermal conditioner 60 described in more detail below. There is a gap 5 between the edge of the substrate W and the edge of the substrate support 20. When the edge of the substrate W is imaged, or at other times such as when the substrate W first moves under the projection system PS (as described above), the immersion space 11 filled with liquid by the fluid handling structure IH (for example) at least partially passes through the gap 5 between the edge of the substrate W and the edge of the substrate support 20. For this reason, the liquid from the immersion space 11 can flow into the gap 5.

[0048] The substrate W is held by a first support 21 (e.g., a pimple or a bar table) having one or more protrusions 41 (i.e., bars). The first support 21 is an example of an object holding part. Another example of the object holding part is a mask holding part. The negative pressure applied between the substrate W and the substrate support 20 can ensure that the substrate W is securely held in place. However, if the immersion liquid gets between the substrate W and the first support 21, it can cause difficulties, especially when removing the substrate W.

[0049] To deal with the immersion liquid flowing into the gap 5, at least one drain 10, 12 for removing the immersion liquid flowing into the gap 5 is provided at the edge of the substrate W. There may be only one drain, or more than two drains, but in one embodiment shown in FIG. 4, two drains 10, 12 are illustrated. In one embodiment, each of the drains 10, 12 is annular and surrounds the entire periphery of the substrate W.

[0050] The main function of the first drain 10 (which is radially outside the edge of the substrate W / the first support 21) is to prevent air bubbles from entering the immersion space 11 where the liquid of the fluid handling structure IH exists. Such bubbles can have an adverse effect on the imaging of the substrate W. The first drain 10 exists to avoid a situation where the gas in the gap 5 escapes into the immersion space 11 in the fluid handling structure IH. The gas that has escaped into the immersion space 11 can result in bubbles floating in the immersion space 11. If such bubbles come on the path of the projection beam, it will lead to imaging errors. The first drain 10 is configured to remove gas from the gap 5 between the edge of the substrate W and the edge of the recess in the substrate support 20 on which the substrate W is disposed. The edge of the recess in the substrate support 20 may optionally be defined by a covering 101 separated from the first support 21 of the substrate support 20. The covering 101 may be ring-shaped in plan view and may surround the outer periphery of the substrate W. The first drain 10 removes most of the gas and a very small amount of the immersion liquid.

[0051] The second drain 12 (which is radially inward of the edge of the substrate W / the first support 21) is provided to prevent liquid from entering from the gap 5 below the substrate W so as not to impede the efficient release of the substrate W from the substrate table WT after imaging. By providing the second drain 12, problems that may occur due to liquid entering below the substrate W are reduced or eliminated.

[0052] As shown in FIG. 4, in one embodiment, the lithographic apparatus comprises a first extraction channel 102 that serves as a two-phase flow channel. The first extraction channel 102 is formed within the block. The first and second drains 10, 12 are provided together with respective openings 107, 117 and respective extraction channels 102, 113. The extraction channels 102, 113 allow fluid to flow between the respective openings 107, 117 through the respective flow paths 103, 114.

[0053] As shown in FIG. 4, the covering 101 has an upper surface. The upper surface extends circumferentially around the substrate W on the first support 21. During use of the lithographic apparatus, the fluid handling structure IH moves relative to the substrate support 20. During this relative movement, the fluid handling structure IH passes through the gap 5 between the covering 101 and the substrate W. In one embodiment, the relative movement is provided by the substrate support 20 moving below the fluid handling structure IH. In an alternative embodiment, the relative movement is provided by the fluid handling structure IH moving above the substrate support 20. In a further alternative embodiment, the relative movement is provided by both the movement of the substrate support 20 below the fluid handling structure IH and the movement of the fluid handling structure IH above the substrate support 20. In the following description, the movement of the fluid handling structure IH is used to mean the relative movement of the fluid handling structure IH with respect to the substrate support 20.

[0054] FIG. 5 is a schematic diagram of a substrate support 20 according to an embodiment of the invention. The substrate support 20 is for supporting a substrate W in a lithographic apparatus (for example, the lithographic apparatus shown in FIG. 1). During the exposure process, the substrate W is supported on the substrate support 20. During a plurality of exposure processes, the substrate W on the substrate support 20 may be exchanged. During this time, the substrate support 20 may not support any substrate W either.

[0055] As shown in FIG. 5, in one embodiment, the substrate support 20 includes a first support 21. The first support 21 is configured to support the substrate W. When the substrate W is supported by the substrate support 20, the substrate W is in direct contact with the first support 21. The first support 21 is a part of the substrate support 20 that physically supports the lower side of the substrate W. As shown in FIG. 5, in one embodiment, the first support 21 includes a plurality of bars 41. The ends of the bars 41 form a surface on which the lower side of the substrate W is supported. The lower side of the substrate W contacts the ends of the bars 41. The bars 41 are on the upper side of the first support 21.

[0056] As shown in FIG. 5, in one embodiment, there is a space 42 between the lower side of the substrate W and the upper base surface (between the plurality of bars 41) of the first support 21. In one embodiment, the substrate support 20 includes a clamp configured to hold the substrate W on the first support 21. For example, as shown in FIG. 5, in one embodiment, the substrate support 20 includes a clamp having a clamp channel 43. The clamp channel 43 is configured to extract gas from the space 42 between the substrate W and the first support 21. The clamp channel 43 allows fluid to flow between it and the space 42. As shown in FIG. 5, in one embodiment, the clamp channel 43 allows fluid to flow between it and the space 42 via one or more clamp channels 44. In one embodiment, the clamp channel 43 has an annular shape surrounding the center of the substrate support 20. The clamp channel 43 extends in the circumferential direction. In one embodiment, a plurality of clamp channels 44 extend in the vertical direction to connect the clamp channel 43 to the space 42.

[0057] As shown in FIG. 5, in one embodiment, the substrate support 20 includes a main body 22. The main body 22 is separated from the first support 21. The first support 21 can be separated from the main body 22 without substantially damaging the main body 22. The first support 21 may be removed from the main body 22 or may be repositioned on the main body 22. The main body 22 is configured to support the first support 21.

[0058] While the substrate support 20 is in use, the substrate support 20 wears out. For example, the ends of the bars 41 wear out over time. Even if the bars 41 wear out, it is not necessary to replace the entire substrate support 20, and the first support 21 can be replaced. For example, the first support 21 may be replaced without replacing the main body 22. In one embodiment, the first support 21 is removed from the main body 22. The replaced first support 21 is placed on the main body 22. Then, using the replaced first support 21, the exposure process is continued. Embodiments of the invention are expected to reduce the cost of maintaining the availability of the substrate support 20.

[0059] The first support 21 can be replaced more quickly compared to replacing the entire substrate support 20. Embodiments of the invention are expected to reduce the downtime of the lithography apparatus required to maintain the substrate support 20.

[0060] As shown in FIG. 5, in one embodiment, the main body 22 includes a thermal conditioner 60. In one embodiment, the thermal conditioner 60 is configured to thermally condition the main body 22. Additionally or alternatively, the thermal conditioner 60 is configured to thermally condition the first support 21. Additionally or alternatively, the thermal conditioner 60 is configured to thermally condition the substrate W. By thermally conditioning the main body 22, the first support 21, and / or the substrate W, the temperature profile can be controlled. In particular, deformations caused by thermal variations can be reduced. By reducing the deformations, the accuracy of the exposure process can be improved.

[0061] The method by which the thermal conditioner 60 thermally adjusts is not particularly limited. As a mere example, as shown in FIG. 5, in one embodiment, the thermal conditioner 60 includes one or more adjustment channels 61. The adjustment channel 61 may penetrate the main body 22. In one embodiment, the adjustment channel 61 contains a fluid (e.g., gas and / or liquid).

[0062] As shown in FIG. 1, in one embodiment, the lithographic apparatus includes a controller 500. In one embodiment, the controller 500 is configured to control the flow or fluid through one or more adjustment channels 61. In one embodiment, the controller 500 is configured to control the fluid flow through the adjustment channel 61 to control the temperature profile of a target (e.g., the main body 22, the first support 21, and / or the substrate W).

[0063] As shown in FIG. 5, in one embodiment, the thermal conditioner 60 includes one or more sensors 62. In one embodiment, the sensor 62 is attached to or embedded in the main body 22. In one embodiment, the sensor 62 is a temperature sensor. In one embodiment, the sensor 62 may be configured to measure the temperature of the fluid flowing within the adjustment channel 61. In one embodiment, a plurality of sensors 62 are provided at different positions along the adjustment channel 61 to detect the temperature profile across the adjustment channel 61.

[0064] As shown in FIG. 5, in one embodiment, the thermal conditioner 60 includes one or more heaters 63. As shown in FIG. 5, in one embodiment, the heater 63 is attached to the lower side of the main body 22. However, the heater 63 may be disposed on other surfaces of the main body 22 or the first support 21. Additionally or alternatively, sensors may be provided on the surfaces of the main body 22 and / or the first support 21. In one embodiment, the controller 500 is configured to receive signals from the sensor 62 and subsequently configured to control the fluid flow through the heater 63 and / or the adjustment channel 61.

[0065] In the substrate support 20, the function of physically supporting (and clamping) the substrate W is performed by the first support 21. On the other hand, the function of thermally adjusting is performed by the main body 22. The first support 21 is separated from the main body 22. The function of supporting the substrate W and the function of thermal stabilization are separated into different components. If one function is lost (or if the required execution level cannot be satisfied), the corresponding component can be replaced without replacing the other components. Embodiments of the invention are expected to facilitate the maintenance of the substrate support 20 such that the functions performed meet the required levels.

[0066] As shown in FIG. 5, in one embodiment, the substrate support 20 includes a removable body 100. The removable body 100 surrounds the main body 22 and the first support 21. The removable body 100 is on the radially outer side of the main body 22 and the first support 21. As shown in FIG. 5, in one embodiment, the removable body 100 is provided in a component separated from the main body 22. However, it is not essential that the removable body 100 be separated from the main body 22 and the first support 21. As will be described in more detail later, the removable body 100 may be part of the same component as the main body 22. In such an embodiment, the removable body 100 cannot be replaced without the main body 22 (and vice versa). In one embodiment, for example, as shown in FIGS. 7 to 10, the removable body 100 is part of the same component as the main body 22. The removable body 100 may be integrally formed with the main body 22. The removable body 100 and the main body 22 are formed together as one component. The removable body 100 and the main body 22 cannot be separated from each other. In an alternative embodiment, the removable body 100 is integrally formed with the substrate stage 26.

[0067] As shown in FIG. 5, in one embodiment, the extraction body 100 includes a first extraction channel 102. In one embodiment, the extraction body 100 includes the aforementioned first drain 10. The first extraction channel 102 is configured to extract fluid near the peripheral edge of the substrate W. As shown in FIG. 5, in one embodiment, the first extraction channel 102 is configured to extract fluid from the outer side in the radial direction of the peripheral edge of the substrate W. The first extraction channel 102 is configured to remove bubbles that may occur in the immersion liquid used in the lithographic apparatus. The first extraction channel 102 contributes to reducing image defects by reducing bubbles and / or by reducing, for example, the occurrence of watermarks.

[0068] As described above, the extraction body 100 is configured to reduce the problem of defects. The functions performed by the extraction body 100 may be different from the functions performed by the first support 21 and the main body 22. If one function is lost, or if the required execution level cannot be met, instead of replacing other components of the substrate support 20, the corresponding component (for example, the extraction body 100, the first support 21, or the main body 22) can be replaced.

[0069] FIG. 6 schematically shows a substrate support 20 according to a comparative example. In the comparative example shown in FIG. 6, both the function of supporting (and clamping) the substrate W and the function of thermally adjusting the substrate W are performed in the same component. Therefore, when the tip of the bar 41 is worn out, the entire main body 22 including both the thermal conditioner 60 and the bar 41 that supports the substrate W must be replaced. For example, even if the thermal conditioner 60 is still operating normally and does not need to be replaced, the entire main body 22 needs to be replaced.

[0070] As shown in FIG. 5, in one embodiment, a seal member 27 is provided to seal the gap between the substrate support 20 and the substrate stage 26 that supports the substrate support 20. In the comparative example shown in FIG. 6, when the substrate support 20 is replaced, it is also necessary to remove and replace the seal member 27. In contrast, in the embodiment shown in FIG. 5, the extraction body 100 and the seal member 27 remain as they are while the first support 21 and / or the main body 22 are being replaced. Similarly, in an embodiment where the extraction body 100 is part of the same component as the main body 22, the extraction body 100 and the seal member 27 remain as they are while the first support 21 is being replaced. Embodiments of the invention are expected to reduce the time required for maintaining the substrate support 20.

[0071] As shown in FIG. 5, in one embodiment, the substrate support 20 includes a second support 23. The second support 23 is separated from the main body 22. The second support 23 is configured to support the main body 22 on the substrate stage 26. In one embodiment, the main body 22 physically contacts the second support 23. For example, in one embodiment, the lower side of the main body 22 is supported on top of the upper portion of the second support 23. The second support 23 is supported on the substrate stage 26.

[0072] As shown in FIG. 5, in one embodiment, the second support 23 includes a plurality of bars 91. In one embodiment, the bars 91 of the second support 23 are longer than the bars 41 of the first support 21. The bars 91 protrude on the lower side of the second support 23. These bars 91 extend toward the substrate stage 26 and are supported by the substrate stage 26. In one embodiment, the second support 23 is configured to reduce relative movement between the substrate support 20 and the substrate stage 26. The second support 23 is configured to reduce slippage between the substrate support 20 and the substrate stage 26. While using a lithography apparatus, large accelerations occur on the substrate stage 20. If the substrate support 20 slips relative to the substrate stage 26, it may lead to undesirable overlay errors. The bars 91 are configured to grip the substrate stage 26 and reduce slippage of the substrate support 20 relative to the substrate stage 26.

[0073] The second support 23 can be physically separated from the main body 22 without damaging the main body 22 or the second support 23. One or the other of the main body 22 and the second support 23 can be replaced without replacing the other. For example, when the anti-slip function of the second support 23 fails to meet the required performance level, the second support 23 can be replaced without replacing the main body 22. Embodiments of the invention are expected to reduce the cost of maintaining the substrate support 20.

[0074] In another example, for example, when the heat conditioner 60 needs to be replaced, the main body 22 may be replaced. The main body 22 can be replaced without replacing the second support 23 (or without substantially moving it). Embodiments of the invention are expected to reduce the cost of maintaining the substrate support 20.

[0075] However, it is not essential for the substrate support 20 to include such a second support 23. For example, as shown in FIGS. 7 to 12, the function of reducing the slip of the substrate stage 26 of the substrate support 20 may be performed by the main body 22. The curl 91 may be provided at the lower part of the main body 22.

[0076] As shown in FIGS. 5 and 7, for example, in one embodiment, the main body 22 includes a plurality of curls 65 on its upper side. The curls 65 have ends in the plane. The curls 65 are configured to support the first support 21. By providing the curls 65 on the upper side of the main body 22, the structure of the first support 21 can be kept simple. The lower side of the first support 21 may be flat and substantially featureless. The upper side of the first support includes curls 41 for supporting the substrate W. Embodiments of the invention are expected to enable the components for clamping the substrate W to be manufactured at low cost.

[0077] In addition, as shown in FIGS. 5 and 8 to 10, for example, in one embodiment, the first support 21 includes a plurality of seal protrusions 46. The seal protrusions 46 protrude above the first support 21. The seal protrusions 46 are shorter than the beads 41. The seal protrusions 46 do not contact the substrate W. A small gap exists between the upper portion of the seal protrusions 46 and the lower side of the substrate W. In one embodiment, the seal protrusions 46 extend circumferentially around the first support 21, that is, the seal protrusions 46 each form a ring. The seal protrusions 46 are configured to reduce the amount of fluid passing through the seal protrusions 46.

[0078] However, it is not essential that the body 22 be provided with the beads 65. For example, in an alternative embodiment shown in FIG. 8, the first support 21 includes a plurality of beads 47 at its lowermost side. The beads 47 have ends in the plane. The beads 47 are configured to contact the upper side of the body 22. As shown in FIG. 8, instead of the beads 65 provided on the body 22, different sets of the beads 47 may be provided under the first support 21. In use, the beads 41, 47 may wear out before other parts of the substrate support 20. By providing both sets of the beads 41, 47 on the first support 21, the beads can be replaced simply by replacing the first support 21 without replacing the body 22. Embodiments of the invention are expected to reduce the cost for maintaining the substrate support 20.

[0079] As shown in FIG. 5, in one embodiment, the extraction body 100 includes a second extraction channel 113. This is also shown in other figures. The second extraction channel 113 is part of the second drain 12. In one embodiment, the second extraction channel 113 is configured to extract fluid from the radially inner side of the first extraction channel 102. In one embodiment, the second extraction channel 113 is provided to prevent liquid from flowing below the substrate W. However, it is not essential that such a second extraction channel 113 be provided. For example, FIG. 10 shows an embodiment without the second extraction channel 113.

[0080] In one embodiment, to prevent the liquid from reaching the space 42 between the central portion W of the substrate and the first support 21, the second extraction channel 113 is configured to extract fluid from below the peripheral edge of the substrate W. As shown in FIG. 4, in one embodiment, the second extraction channel 113 is connected to the space below the peripheral edge of the substrate W via one or more second flow paths 114. In one embodiment, the second extraction channel 113 extends circumferentially around the substrate support 20. In one embodiment, a plurality of second flow paths 114 are provided. The second flow path 114 extends vertically between the second extraction channel 113 and directly below the peripheral edge of the substrate W.

[0081] As shown in FIG. 5, in one embodiment, the second extraction channel 113 is isolated from the first extraction channel 102 by an open gap. The first extraction channel 102 and the second extraction channel 113 may be provided in separate bodies 24, 25. The separate bodies 24, 25 can be separated from each other without either of the separate bodies 24, 25 being damaged. The function of reducing the problem of defects (performed by the first extraction channel 102) and the function of preventing the liquid from flowing into the space below the substrate W (performed by the second extraction channel 113) may be performed by the separate bodies 24, 25. One of the separate bodies 24, 25 can be replaced without replacing the other. Embodiments of the invention are expected to reduce the cost for maintaining the substrate support 20.

[0082] As shown in FIG. 7 (visually recognizable also in FIGS. 5 and 8, for example), in one embodiment, the substrate support 20 includes an inner seal 112 and an outer seal 111. The inner seal 112 is located radially inside the opening from which the second extraction channel 113 extracts fluid. The outer seal 111 is located radially outside the opening from which the second extraction channel 113 extracts fluid. The inner seal 112 and the outer seal 111 project downward toward the lower side of the substrate W. The inner seal 112 and the outer seal 111 do not project so as to contact the substrate W in use together with the substrate support 20. Instead, there are small gaps between the upper portions of the inner seal 112 and the substrate W and between the upper portions of the outer seal 111 and the substrate W. The inner seal 112 and the outer seal 111 are configured such that liquid may be present between the seals 111, 112 and the substrate W during use. This helps to prevent liquid from reaching below the substrate W at the central portion of the substrate W.

[0083] As shown in FIG. 9, in one embodiment, the function of the inner seal 112 is performed by the seal protrusion 46 on the upper side of the first support 21. This is, for example, an alternative to the arrangement shown in FIG. 7 where the inner seal 112 is provided as a protrusion on the upper side of the main body 22. As shown in FIG. 9, in one embodiment, an upper flow path 49 passing through the first support 21 is provided. The upper flow path 49 is connected to the second flow path 114 such that fluid is extracted into the second extraction channel 113 from below the peripheral portion of the substrate W.

[0084] As shown in FIG. 9, for example, in one embodiment, the main body 22 includes a seal protrusion 66. The seal protrusion 66 is configured to reduce the possibility of moisture reaching the upper surface of the main body 22. This reduces the oxidation of the main body 22.

[0085] As shown in FIG. 10, in one embodiment, the substrate support 20 is not provided with a second extraction channel 113 as shown in FIGS. 5 to 9, for example. As shown in FIG. 10, in one embodiment, an open gap or flow path 115 is formed between the extraction body 100, the main body 22, and the first support 21. In one embodiment, the open gap or flow path 115 allows fluid to flow between the atmospheric pressure or a pressure source. In one embodiment, a plurality of flow paths 115 extend mainly in the vertical direction through the main body 22 (which may be part of the same component as the extraction body 100). In an alternative embodiment, the open gap may extend circumferentially around the main body 22, and the extraction body 100 may be provided as a component different from the main body 22. In one embodiment, a gas flow passes through the open gap or flow path 115. The gas flow passes through the seal protrusion 46 at the upper peripheral edge of the first support 21. By providing the gas flow, the possibility of liquid reaching the lower side of the substrate W beyond the seal protrusion 46 can be reduced. It is not always necessary to provide the second extraction channel 113. Embodiments of the invention are expected to reduce the complexity of the substrate support 20. Embodiments of the invention are expected to facilitate the manufacture of the substrate support 20.

[0086] As described above and illustrated in FIGS. 5, 7 to 10, the substrate support 20 can be modularized in various ways. As shown in FIG. 11, in one embodiment, the extraction body 100 is provided together with both the first extraction channel 102 and the second extraction channel 113. The extraction body 100 is separated from both the first support 21 and the main body 22. The main body 22 is directly supported on the substrate stage 26 (i.e., without passing through the second support 23). As shown in FIG. 11, the inner seal 112 and the outer seal 111 are provided as part of the extraction body 100. This reduces the radial dimension of the first support 21 (since the first support 21 does not require additional seal protrusions 46 to perform the function of the inner seal 112). This reduces the amount of the substrate support 20 to be replaced when it is necessary to replace the worn bar 41.

[0087] As shown in FIG. 11, in one embodiment, the main body 22 extends below the extraction body 100. The lower side of the extraction body 100 is coupled to the main body 22. This facilitates control of the height of the extraction body 100 with respect to the first support 21. By more accurately controlling the height of the extraction body 100, the reliability of the sealing function provided by the inner seal 112 and the outer seal 111 is enhanced.

[0088] As shown in FIG. 11, in one embodiment, one or more holes 119 are provided in the main body 22. The holes 119 are configured to allow fluid to flow between the radial interior of the extraction body 100 and the gap between the main body 22. The holes 119 may be connected to other holes extending through the substrate stage 26. The holes 119 are configured to provide atmospheric pressure or pressurized gas. By providing a gas flow upward through the holes 119, the possibility that liquid reaches below the central portion of the substrate W is reduced. By providing a gas flow through the holes 119, the movement of moisture to the first support 21 is reduced. By reducing the movement of moisture to the first support 21, oxidation of the first support 21 is reduced.

[0089] In one embodiment, the holes 119 are configured to provide pressurized gas. By providing a pressurized gas flow, the lifting of the edge of the substrate W can be controlled. By controlling the lifting of the outer edge of the substrate W, wear of the outermost bead 41 of the first support 21 can be reduced. Embodiments of the invention are expected to reduce wear of the substrate support 20.

[0090] As shown in FIG. 11, in one embodiment, an adhesive layer 104 is provided between the extraction body 100 and the main body 22. The adhesive layer 104 fixes the extraction body 100 to the main body 22. This facilitates control of the gap from the substrate W to the inner seal 112 and the outer seal 111 of the extraction body 100.

[0091] In one embodiment, beads are dispersed in the adhesive layer 104. For example, glass beads may be dispersed in the adhesive. The size of the beads can be selected to provide the required height step between the upper portions of the inner / outer seals 111, 112 and the upper portions of the seal projections 66 on the radially outer portion of the outermost surface of the body 22. In one embodiment, the beads have a diameter of, for example, 45 microns, 50 microns or 55 microns.

[0092] As shown in FIG. 11, in one embodiment, a fluid connection is maintained through the body 22 (to which the extractor 100 is attached) from the first / second extraction channels 102, 113 and then through the substrate stage 26. The fluid connection may be maintained by the dog bone connector 105 and the ring 106. However, the connection between the extractor 100 and the body 22 for the purposes of the first / second extraction channels 102, 113 is not particularly limited.

[0093] It is not essential for the body 22 to extend below the extractor 100. In an alternative embodiment, the lower side of the extractor 100 is attached to the substrate stage 26. In one embodiment, the substrate table WT (comprising the substrate stage 26 and the substrate support 20) comprises a height adjustment mechanism 130. Alternative versions of the height adjustment mechanism 130 are shown, for example, in FIGS. 12 and 13. The height adjustment mechanism 130 is configured to provide fine-adjustable height adjustment to obtain an appropriate seal gap between the extractor 100 and the substrate W. The height adjustment mechanism 130 is configured to control the height of at least a portion of the extractor 100 below the substrate W such that the extractor 100 is configured to prevent liquid from reaching between the central portion of the substrate W and the first support 21.

[0094] As shown in FIG. 12, in one embodiment, the height adjustment mechanism 130 comprises an insert member 131. The insert member 131 is a block of material. The insert member 131 is provided between the lower side of the extractor 100 and the substrate stage 26. The insert member 131 is separated from the body 22. The insert member 131 is a component that attaches the extractor 100 to the substrate stage 26.

[0095] As shown in FIG. 12, in one embodiment, the height adjustment mechanism 130 includes a fastener 132. For example, in one embodiment, the fastener 132 is a bolt. As shown in FIG. 12, in one embodiment, the fastener 132 does not reach the substrate stage 26. The fastener 132 connects the take-out body 100 to the insert member 131.

[0096] As shown in FIG. 12, in one embodiment, the take-out body 100 includes a protrusion 134 configured to engage with the insert member 131. As shown in FIG. 12, in one embodiment, the insert member 131 is adhered onto the substrate stage 26.

[0097] As shown in FIG. 12, in one embodiment, when the fastener 132 couples the take-out body 100 to the insert member 131, the insert member 131 is configured with the notch 133 such that the insert member 131 is compressed. The compression of the insert member 131 can be controlled to control the height of the upper portion of the take-out body 100 below the substrate W. In particular, the force provided by the fastener 132 can be controlled to control the compression of the insert member 131.

[0098] FIG. 12 shows the lines of force 135 of the stress passing through the solid portions of the fastener 132 and the insert member 131 (i.e., between the notches 133). As shown in FIG. 12, the notch 133 may be provided such that the line of force 135 penetrates a relatively narrow portion of the insert member 131. If the narrow portion of the insert member 131 is relatively flexible, it becomes easier to control the compression of the insert member 131. This is useful for controlling the height of the take-out body 100 below the substrate W. In particular, the narrow portion of the insert member 131 between the notches 133 may function as a leaf spring (or other flexible portion).

[0099] The height adjustment mechanism 130 shown in FIG. 12 is merely an example. As another example, an alternative height adjustment mechanism 130 is shown in FIG. 13. As shown in FIG. 13, in one embodiment, the extraction body 100 includes a leaf spring 141. The leaf spring 141 includes a lower portion 142 fixed to the rest of the extraction body 100. The leaf spring 141 further includes an upper portion 143 that extends between the extraction body 100 and the first support 21. In one embodiment, a plurality of such leaf springs 141 are provided circumferentially around the substrate support 20. In an alternative embodiment, a single leaf spring 141 extends circumferentially around the substrate support 20.

[0100] As shown in FIG. 13, in one embodiment, the height adjustment mechanism 130 is configured to control the height of the upper portion 143 below the substrate W such that the upper portion 143 is configured to prevent liquid from reaching between the central portion of the substrate W and the first support 21. In one embodiment, a set screw 144 is provided to enable fine adjustment of the leaf spring 141. The set screw 144 can protrude a controlled distance below the extraction body 100. When the set screw 144 protrudes further from the lower portion of the extraction body 100, the set screw 144 bends the leaf spring 141 and lowers the height of the upper portion 143 of the leaf spring 141. As shown in FIG. 13, in one embodiment, the first extraction channel 102 may be connected to the second extraction channel 113 via the connection channel 140.

[0101] The manner in which the thermal conditioner 60 is provided on the main body 22 is not particularly limited. In one embodiment, the thermal conditioner 60 is attached under the surface of the main body 22. For example, one or more Peltier elements and / or heaters may be provided on the lower surface of the main body 22 and / or the extraction body 100. Additionally or alternatively, the channel 61, one or more Peltier elements and / or heaters 63 may be provided on the outer periphery of the lower part of the main body 22. In an alternative embodiment, the thermal conditioner 60 is attached to the upper side of the main body 22. The external channel 61 and / or one or more Peltier elements and / or heaters 63 may be attached (e.g., adhered onto the main body 22). In one embodiment, the channel 61, the heater 63 and / or the sensor 62 are provided on the substrate stage 26. At least part of the thermal adjustment function is executed by the substrate stage 26. This helps to simplify the design of the main body 22. In one embodiment, a bar 91 is provided as part of the substrate stage 26. The main body 22 may not be provided with the bar 91. The lower side of the main body 22 may be substantially flat. In one embodiment, at least one sensor 62 is provided on each bar 91 of the substrate stage 26. The sensor 62 is configured to measure the temperature of the main body 22. The sensor 62 is located in the vicinity of the main body 22. In one embodiment, at least one heater 63 is provided on the surface of the substrate stage 26 facing the main body 22. In one embodiment, the heater 63 is paired with each sensor 62. The heater 63 is located in the vicinity of each sensor 62. In one embodiment, the heater 63 is controlled based on the output from the paired sensor 62.

[0102] As shown in FIG. 5, in one embodiment, the clamp channel 43 allows fluid to flow between the space 42 through another space 45 between the main body 22 and the first support 21.

[0103] As shown in FIG. 5, in one embodiment, the substrate support 20 is locked to the substrate stage 26 by at least one fastening bolt 29. In one embodiment, the fastening bolt 29 is configured to function as a safety lock to prevent the substrate support 20 from falling off the substrate stage 26. However, the bar 91 performs a function of preventing the substrate support 20 from slipping relative to the substrate stage 26.

[0104] As shown in FIG. 5, in one embodiment, one or more pins 28 may be used to lower the substrate W onto the first support 21. The pins 28 support the substrate W by passing through each pin hole 121 in the substrate support 20 to control the height of the substrate W on the first support 21 during the loading and unloading sequences.

[0105] As shown in FIG. 7, in one embodiment, the body 22 is formed of two parts attached to each other by a bonding line 64. For example, an adhesive material may be used.

[0106] As described above, the first support 21 can be replaced without replacing other parts of the substrate holder 20. As shown, the first support 21 has a shape generally similar to that of the substrate W. In one embodiment, the lithographic apparatus comprises at least one handling tool configured to drive the substrate W, for example, to drive the substrate W between different parts of the lithographic apparatus and / or to drive the substrate W to be loaded or unloaded between the lithographic apparatus. In one embodiment, the same handling tool can be used to control the movement of the first support 21.

[0107] FIG. 14 is a schematic cross-sectional view of a carrier plate 120 coupled to a first support 21 according to an embodiment of the invention. The carrier plate 120 is configured to be coupled to the first support 21. The carrier plate 120 is configured to be releasable (removable) from the first support 21. As shown in FIG. 14, in one embodiment, when the carrier plate 120 is coupled to the first support 21, the carrier plate 120 is configured to cover the pinhole 121 in the first support 21.

[0108] As described above, in one embodiment, a plurality of pins 28 support the substrate W and can be controlled to lower the substrate W onto the substrate support 20. FIG. 15 shows an assembly of the carrier plate 120 and the first support 21 supported by the pins 28. By providing a carrier plate 120 that covers the pinhole 121, the first support 21 is effectively coupled to the carrier plate 120, so that the pins 28 can effectively support the first support 21 via the carrier plate 120. Embodiments of the invention are expected to facilitate the replacement of the first support 21. Embodiments of the invention are expected to reduce the downtime of the lithographic apparatus. It is not essential that a carrier plate 120 be provided. In alternative embodiments (described in more detail later), an alternative to the pins 28 is provided to control the movement of the first support 21.

[0109] Since the first support 21 and the carrier plate 120 are coupled to each other, the pins 28 can be controlled to lower the first support 21 onto the remainder of the substrate support 20. Once the first support 21 is placed on the remainder of the substrate support 20, the carrier plate 120 can be removed. FIG. 16 schematically shows the carrier plate 120 being removed and detached from the first support 21. In one embodiment, a positive pressure is applied through the opening 44 to release the carrier plate 120 from the first support 21. The carrier plate 120 can be lifted from the first support 21 by the pins 28. In one embodiment, the carrier plate 120 can be driven using the same handling tool used to handle the substrate W.

[0110] As shown in FIGS. 14 to 16, in one embodiment, the carrier plate 120 includes a plurality of connection protrusions 122. The connection protrusions 122 are configured to protrude from the base plate 125 of the carrier plate 120 toward the first support 21. The carrier plate 120 includes the base plate 125 and the connection protrusions 122. The base plate 125 is flat. In one embodiment, the base plate 125 and the connection protrusions 122 are formed of the same material. To form the carrier plate 120, the base plate 125 is integrally formed with the connection protrusions 122. As shown in FIG. 14, in one embodiment, the connection protrusions 122 limit the distance by which the base plate 125 approaches the first support 21. As shown in FIG. 14, in one embodiment, the connection protrusions 122 have contact surfaces 123. The contact surfaces 123 are configured to contact the first support 21 directly or via an adhesive material.

[0111] By providing the connection protrusions 122, the ends of the burrs 41 do not contact the carrier plate 120. The carrier plate 120 is supported by the first support 21 among the plurality of burrs 41 on the upper side of the first support 21 with the ends of the burrs 41 on the upper side of the first support 21 being isolated from the carrier plate 120. Embodiments of the invention are expected to further prevent wear of the burrs 41.

[0112] FIG. 17 is a schematic diagram of the carrier plate 120 according to an embodiment of the invention. As shown in FIG. 17, in one embodiment, the surface of the carrier plate 120 facing the first support 21 is sufficiently flat, and when the carrier plate 120 is coupled to the first support 21, the carrier plate 120 is supported by the ends of the burrs 41 on the upper side of the first support 21. As shown in FIG. 17, in one embodiment, the connection protrusions 122 do not limit the distance by which the carrier plate 120 approaches the first support 21. Instead, the ends of the burrs 41 support the carrier plate 120. The ends of the burrs 41 contact the base plate surface 124 directly or via an adhesive material.

[0113] As shown in FIGS. 14 and 15, in one embodiment, only a part of the carrier plate 120 contacts the first support 21. This limits the adhesive force and facilitates the separation of the carrier plate 120 and the first support 21.

[0114] As shown in FIGS. 17 and 19, for example, it is not essential for the carrier plate 120 to contact the surface of the first support 21 between the plurality of beads 41. In one embodiment, the surface between the plurality of beads 41 is rough so that the adhesive force is limited. By not requiring contact with the rough surface between the plurality of beads 41, the rough surface does not adversely affect the carrier plate 120 coupled to the first support 21.

[0115] In the arrangement shown in FIG. 17, the ends of the beads 41 contact the carrier plate 120. One reason for replacing the first support 21 is that the beads can wear out. When replacement of the first support 21 is necessary, the ends of the beads 41 may be particularly smooth. The ends of the beads 41 enable suitable adhesion to the carrier plate 120, particularly for removing the first support 21.

[0116] The manner in which the carrier plate 120 is coupled to the first support 21 is not particularly limited. FIG. 18 schematically shows the use of an adhesive material 126 for coupling the carrier plate 120 to the first support 21. As shown in FIG. 18, in one embodiment, an adhesive material 126 is provided between the contact surface 123 of the first support 21 and the connection protrusion 122. Additionally or alternatively, the adhesive material 126 may be provided between the ends of the plurality of beads 41 and the base plate surface 124.

[0117] Next, the bonding material 126 is for temporarily bonding the carrier plate 120 to the first support 21 when the carrier plate 120 is coupled to the first support 21. The bonding material 126 is not particularly limited. In one embodiment, the bonding material (coupling material) 126 comprises an adhesive material. In an alternative embodiment, instead of the bonding material 126, a layer of liquid (e.g., water) is provided. Capillary pressure can be used to maintain the bonded state of the carrier plate 120 and the first support 21.

[0118] In the arrangement shown in FIG. 17, the bonding material may be applied to the recess of the base plate surface 124. By restricting the bonding material to the recess, the possibility that the bonding material contacts other components is reduced.

[0119] As shown in FIG. 19, in addition or alternatively, the carrier plate 120 is clamped to the first support 21 by pressure. In one embodiment, the carrier plate 120 comprises at least one internal channel 127. The internal channel 127 is for fluidly connecting a first opening 128 to at least one second opening 129. The first opening 128 and the second opening 129 are on the surface of the carrier plate 120. As shown in FIG. 19, in one embodiment, when the carrier plate 120 is coupled to the first support 21, the first opening 128 is in a position covering one of the pinholes 121.

[0120] The second opening 129 is in a position where the carrier plate 120 faces the upper side of the first support 21. In one embodiment, the first opening 128 can be connected to a negative pressure in order to generate a gas flow that travels from the second opening 129 through the internal channel 127 towards the first opening 128 and flows out through the first opening 128. This can reduce the pressure in the region between the carrier plate 120 and the first support 21 when the carrier plate 120 is coupled to the first support 21. As a result of the ambient pressure being higher than the pressure between the carrier plate 120 and the first support 21, the carrier plate 120 and the first support 21 can be held together.

[0121] As shown in FIG. 19, in one embodiment, there is a first opening 128 at a position corresponding to the pin 28 that supports the carrier plate 120. In one embodiment, the pin 28 includes a channel for extracting fluid from the internal channel 127 through the first opening 128. The number of the second openings 129 is not particularly limited. The number of the internal channels 127 is not particularly limited. In one embodiment, the first opening 128 is provided for each pinhole 121.

[0122] In one embodiment, the carrier plate 120 includes a conductive material and an insulating layer configured to electrically insulate the conductive material from the first support 21 when the carrier plate 120 is connected to the first support 21. The conductive material may have a potential difference with respect to the first support 21. The electrostatic attraction between the carrier plate 120 and the first support 21 may be useful in coupling the carrier plate 120 to the first support 21. In one embodiment, the insulating layer is provided as a thin layer surrounding the carrier plate 120.

[0123] FIGS. 20 to 22 show different stages of the carrier plate 120 released from the first support 21 according to an embodiment of the invention. As shown in FIG. 20, in one embodiment, the carrier plate 120 includes at least one connection mechanism 151. The connection mechanism 151 is configured to mechanically lock the carrier plate 120 to the first support 21. In one embodiment, the connection mechanism 151 locks the carrier plate 120 to the first support 21 at each pinhole 121 of the first support 21.

[0124] As shown in FIG. 20, in one embodiment, the connection mechanism 151 includes a chamber 153. The chamber 153 is configured to receive each pin 28. The chamber 153 receives the contact end of the pin 28 when the pin 28 supports the carrier plate 120. In one embodiment, the connection mechanism 151 is configured to release the lock when the pressure inside the chamber 153 is sufficiently lower than the atmospheric pressure outside the chamber 153 so that the carrier plate 120 can be released from the first support 21. The carrier plate 120 can be released from the first support 21 when the lock is released.

[0125] As shown in FIG. 20, in one embodiment, the connection mechanism 151 includes at least one locking element 152. The locking element 152 is configured to pass through the pinhole 121 and engage with the surface of the first support 21 on the side opposite to the base plate 125 of the carrier plate 120. The number of locking elements 152 is not particularly limited. In one embodiment, two, three, four or more than four locking elements 152 are provided. The locking elements 152 may be uniformly distributed circumferentially around the pinhole 121. In one embodiment, the locking elements 152 are substantially continuous circumferentially along the inner circumferential surface of the pinhole 121. The locking element 152 is fixedly connected to the base plate 125 of the carrier plate 120 at one end thereof. In one embodiment, the locking element 152 is integrally formed with the base plate 125 of the carrier plate 120.

[0126] In one embodiment, the chamber 153 is connected to a negative pressure in order to reduce the pressure inside the chamber 153. When the carrier plate 120 is released from the first support 21, the chamber 153 is connected to the negative pressure. As described above, in one embodiment, the pin 28 includes a channel for extracting fluid from above the contact end of the pin 28. In one embodiment, the channel in the pin 28 is configured to extract fluid from the chamber 153 in order to reduce the pressure inside the chamber 153. As shown in FIG. 20, in one embodiment, a plurality of pores 154 are provided for fluidly connecting the channel of the pin 28 to the chamber 153. The number and shape of the pores 154 are not particularly limited. In one embodiment, a mesh including the pores 154 is provided. In one embodiment, the mesh is integrally formed with the base plate 125 of the carrier plate 120. In one embodiment, when the pin 28 supports the carrier plate 120, the contact end of the pin 28 is not completely orthogonal to the length direction of the pin 28 so that the channel in the pin 28 is fluidly connected to the chamber 153.

[0127] FIG. 21 shows the processing steps for reducing the pressure inside the chamber 153. As a result of the pressure inside the chamber 153 dropping, the lock element 152 bends inward toward the pin 28. For this reason, the engagement between the surface of the first support 21 on the side opposite to the base plate 125 of the carrier plate 120 and the lock element 152 is released. When the engagement between the lock element 152 and the first support 21 is released, the carrier plate 120 is no longer locked to the first support 21. As shown in FIG. 22, the carrier plate 120 can be released from the first support 21.

[0128] Figures 23 to 25 schematically show an alternative connection mechanism 151 according to an embodiment of the invention. As shown in Figure 23, in one embodiment, the chamber 153 is defined by the housing 157. In one embodiment, a part of the housing 157 protrudes from the surface of the carrier plate 120 on the side opposite to the first support 21. In one embodiment, the housing 157 is formed as a component separate from the base plate 125 and is later connected to the base plate 125. Embodiments of the invention are expected to facilitate the manufacture of the carrier plate 120. The design of the base plate 125 becomes simpler.

[0129] In one embodiment, the material used for the housing 157 is different from the materials used for the base plate 125 of the carrier plate 120. As shown in Figure 23, in one embodiment, the lock element 152 is integrally formed with the housing 157 that defines the chamber 153.

[0130] As shown in Figure 23, in one embodiment, the carrier plate 120 includes an unlock channel portion 155. The unlock channel portion 155 defines an unlock channel through which fluid can flow to unlock the carrier plate 120 from the first support 21. As shown in Figure 23, in one embodiment, the carrier plate 120 includes an elastic member 156 configured to connect the housing 157 to the unlock channel portion 155. In one embodiment, the unlock channel portion 155 is part of the base plate 125 of the carrier plate 120.

[0131] As shown in FIG. 24, in one embodiment, the channel in the pin 28 is connected to the unlock channel in the unlock channel portion 155. This enables the pressure in the chamber 153 to be reduced. When the pressure in the chamber 153 is reduced, the housing 157 is pulled downward relative to the base plate 125 of the carrier plate 120. As shown in FIG. 24, in one embodiment, the housing 157 includes a portion inclined with respect to the surface of the base plate 125 such that the downward movement of the housing 157 relative to the base plate 125 bends the lock element 152. When the lock element 152 bends, the engagement between the lock element 152 and the first support 21 is released. When the engagement between the lock element 152 and the first support 21 is released, the carrier plate 120 is unlocked from the first support 21. When the pressure in the chamber 153 is reduced, the elastic member 156 can be compressed. Otherwise, as shown in FIG. 23, the elastic member 156 maintains the high position of the housing 157 relative to the base plate 125 of the carrier plate 120. As shown in FIG. 25, when the carrier plate 120 is unlocked, the carrier plate 120 can be released from the first support 21.

[0132] It is not essential that the carrier plate 120 be provided. FIG. 26 is a schematic plan view of the first support 21 according to an embodiment of the invention. As shown in FIG. 26, in one embodiment, the carrier plate 120 is not provided. As a result, the pins 28 can freely extend through each pinhole 121. In one embodiment, the pins 28 are not used to lower the first support 21 onto the body 22 of the substrate support 20. In one embodiment, an additional set of pins 160 is provided at a position different from the pins 28 used to lower the substrate W. The upper contour of the pins 160 is shown in FIG. 26. In one embodiment, a further set of pinholes for passing the pins 160 is provided in a portion of the substrate support 20 lower than the first support 21. For example, such a further set of pinholes is provided in the body 22. The pins 160 pass through the further set of pinholes in the body 22 and support the lower surface of the first support 21. On the other hand, the pins 28 for supporting the substrate W pass through the pinholes 121 that penetrate both the body 22 and the first support 21.

[0133] In an alternative embodiment, the pins 28 used to lower the substrate W support the first support 21 when the first support 21 is in a rotational position different from the target position on the body 22. The first support 21 is supported by the pins 28 and can be lowered onto the body 22 in its rotational direction. Since the pinholes 121 passing through the first support 21 are not aligned with the pins 28, the carrier plate 120 is not essential. This is because the first support 21 is rotated with respect to its final target position. When the first support 21 is supported by the body 22, the first support 21 is rotated so as to reach the target rotational position on the body 22. When the first support 21 comes to the target position on the body 22, the pinholes 121 are aligned between the first support 21 and the body 22 so that the pins 28 can penetrate the pinholes 121 to support the substrate W above the first support 21. In one embodiment, a rotating tool for rotating the first support 21 on the body 22 is provided. By rotating the first support 21 supported by the body 22, there is no need to provide the carrier plate 120 and no need to provide another set of pins 160.

[0134] FIG. 27 is a schematic plan view of the first support 21 according to an embodiment of the invention. As shown in FIG. 27, the first support 21 is being gripped for handling. As shown in FIG. 27, in one embodiment, a plurality of edge grippers 161 are provided for gripping the first support 21. The edge grippers 161 are configured to grip the outer edge of the first support 21. In one embodiment, the edge grippers 161 are configured as a handling tool separate from the handling tool for handling the first support 21. By providing a separate handling tool, there is no need to use the pin 28 for lowering the first support 21 and there is no need to provide the carrier plate 120.

[0135] FIG. 28 is a schematic plan view of the first support 21 according to an embodiment of the invention. As shown in FIG. 28, the first support 21 is being gripped for handling. As shown in FIG. 28, in one embodiment, an upper gripper 162 is provided for gripping the upper portion of the first support 21. By providing the upper gripper 162, there is no need to provide a different set of the carrier plate 120 or the pins 160 for handling the support 21. In one embodiment, the upper gripper 162 is configured as a handling tool separate from the handling tool for handling the first support 21. The separate handling tool is separated from the pin 28 used for lowering the substrate W onto the first support 21.

[0136] The features shown in the different embodiments illustrated in the figures can be combined with each other as long as it is not apparent that they are incompatible. As a mere example, the feature of providing the bead 47 on the lower side of the first support 21 (shown in FIG. 8) may be applied to the arrangements shown in FIGS. 5, 9, 10 or 11. In particular, the arrangement shown in FIG. 9 can be modified by replacing the bead 65 on the upper side of the main body 22 with the bead 47 provided on the lower side of the first support 21. Other combinations of the features shown in the figures are likewise possible.

Claims

1. A first support configured to support a substrate via a plurality of first bars; A main body separated from the first support and configured to support the first support, the main body having a plurality of second bars provided at its lower part and supported by a substrate stage, and the main body including a thermal conditioner configured to thermally condition the main body, the first support, and / or the substrate; An extraction body surrounding the main body and the first support, the extraction body including a first extraction channel configured to extract fluid near the peripheral edge of the substrate; Comprising; The second bar is longer than the first bar; A substrate support for supporting a substrate in a lithographic apparatus.

2. The substrate support according to claim 1, wherein the plurality of second bars are configured to reduce relative movement between the substrate support and the substrate stage.

3. The main body includes, on its upper side, a plurality of third bars having ends in a plane configured to support the first support, Or, The first support includes, on its lower side, a plurality of fourth bars having ends in a plane configured to contact the upper side of the main body, The substrate support according to claim 1 or 2.

4. The extraction body is a second extraction channel configured to extract fluid from inside the radial direction of the first extraction channel, the second extraction channel being configured to extract fluid from below the peripheral edge of the substrate, preventing liquid from reaching the space between the central part of the substrate and the first support, and including a second extraction channel isolated from the first extraction channel by an open gap, the substrate support according to any one of claims 1 to 3.

5. The substrate support according to any one of claims 1 to 4, wherein an open gap or flow path is formed between the extraction body, the main body, and the first support, or the extraction body is integrally formed with the main body.

6. The substrate support according to claim 5, wherein the open gap or flow path allows fluid to flow between the atmospheric pressure or a pressure source, and / or the main body extends below the extraction body, the lower side of the extraction body is coupled to the main body, and an adhesive layer is provided between the extraction body and the main body.

7. The substrate support according to any one of claims 1 to 6, wherein the thermal conditioner is mounted under the surface of the main body, and / or pinholes are configured to allow each pin for lowering the substrate onto the first support to penetrate through the first support in the thickness direction of the first support.

8. The substrate support according to claim 7, comprising a carrier plate configured to be connectable and releasable to and from the first support and configured to cover pinholes when coupled to the first support.

9. The first support includes, on its upper side, the plurality of first bars having ends within a plane configured to support a substrate. The carrier plate includes connection protrusions configured such that the carrier plate is supported by the first support between the first bars on the upper side of the first support while the ends of the first bars on the upper side of the first support are isolated from the carrier plate. Or, The first support includes, on its upper side, the plurality of first bars having ends within a plane configured to support a substrate. The carrier plate has a surface facing the first support that is sufficiently flat, and when the carrier plate is coupled to the first support, the ends of the first bars on the upper side of the first support support the carrier plate. The substrate support according to claim 8.

10. When the carrier plate is coupled to the first support, it includes an adhesive material for temporarily adhering the carrier plate to the first support, and / or at least one internal channel for connecting the first opening to at least one second opening in a flowable manner, where there is a first opening at a position where the carrier plate covers one of the pinholes when the carrier plate is coupled to the first support, and a second opening at a position where the carrier plate faces the upper side of the first support, and / or the carrier plate includes a conductive material and an insulating layer configured to electrically insulate the conductive material from the first support when the carrier plate is coupled to the first support, and / or the carrier plate includes at least one connection mechanism configured to mechanically lock the carrier plate to each pinhole of the first support. The substrate support according to claim 8 or 9.

11. The connection mechanism includes a chamber configured to receive each pin, and the connection mechanism is configured to release the lock when the pressure in the chamber is sufficiently lower than the atmospheric pressure outside the chamber and the carrier plate can be released from the first support. The substrate support according to claim 10.

12. A substrate stage, and The substrate support according to any one of claims 1 to 4, wherein the take-out body is provided on the substrate stage, or the substrate support according to claim 5 or 6, wherein the lower side of the take-out body is attached to the substrate stage, and a substrate table comprising the same.

13. A height adjustment mechanism configured to control at least a part of the height of the take-out body below the substrate so that the take-out body is configured to prevent liquid from reaching between the central portion of the substrate and the first support. The substrate table according to claim 12.

14. The height adjustment mechanism includes an insert member between the lower side of the take-out body and the substrate stage, and a fastener configured to couple the take-out body to the insert member. The insert member is configured with a notch such that the insert member is compressed when the fastener couples the take-out body to the insert member to control the height of the take-out body below the substrate. Or The take-out body includes a leaf spring having a lower part fixed to the rest of the take-out body and an upper part extending between the take-out body and the first support. The height adjustment mechanism is configured to control the height of the upper part below the substrate such that the upper part is configured to prevent liquid from reaching between the central portion of the substrate and the first support. The substrate table according to claim 13.

15. A lithographic apparatus comprising the substrate support according to any one of claims 1 to 11, or the substrate table according to claim 12, 13 or 14.

Images