Apparatus for transferring substrate, system for processing substrate and method for processing substrate

Abstract

To provide an apparatus that transfers a substrate inside a substrate transfer chamber by a substrate transfer module using magnetic levitation.SOLUTION: A placement module 400 includes two placement tables 401 and 402 where wafers W can be placed vertically in two stages. The placement table 401 on a lower stage side includes a base 411, and a holder 403 to hold the center of the bottom surface of the wafer is provided above the base. The placement table 402 on an upper stage side includes a cylindrical portion 412 surrounding the placement table on the lower stage side, and a holder 404 to hold the center of the bottom surface of the wafer is provided above the cylindrical portion. Windows 405 are formed at two positions facing each other on the side surface of the cylindrical portion to deliver the wafer to the placement table on the lower stage side. Each holder delivers the wafer to and from a wafer holder of each first transfer module. Module-side coils 35 are provided at the base and the lower end of the cylindrical portion, respectively. Each of the placement tables is independently rotated about a vertical axis by using the repulsive force between the module-side coils and floor-side coils provided in a floor portion of a vacuum transfer chamber.SELECTED DRAWING: Figure 18

Description

Technical Field

[0001] The present disclosure relates to an apparatus for transporting a substrate, a system for processing a substrate, and a method for processing a substrate.

Background Art

[0002] For example, in an apparatus for performing processing on a semiconductor wafer (hereinafter also referred to as a "wafer") as a substrate, the wafer is transported between a carrier that houses the wafer and a wafer processing chamber where the processing is executed. Various configurations of wafer transfer mechanisms are used for wafer transfer.

[0003] For example, Patent Document 1 describes a substrate carrier that transfers a semiconductor substrate between processing chambers in a state of floating from a plate using magnetic levitation.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure provides a technique for transporting a substrate in a substrate transfer chamber by a substrate transfer module using magnetic levitation.

Means for Solving the Problems

[0006] An apparatus for transporting a substrate according to the present disclosure is an apparatus for transporting a substrate to a substrate processing chamber where the substrate is processed, and a substrate transfer chamber having a floor portion provided with a first magnet and a side wall portion to which the substrate processing chamber is connected and in which an opening is formed for loading and unloading the substrate between the substrate processing chamber; A substrate transfer module including a substrate holding part for holding the substrate and a second magnet that exerts a repulsive force on the first magnet, and configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force. When the substrate transfer mechanism for loading and unloading the substrate between the substrate transfer chamber and the substrate processing chamber through the opening is fixedly provided in the substrate transfer chamber, the substrate transfer module is configured to transfer the substrate to and from the substrate transfer mechanism. A substrate transfer module provided in the substrate transfer chamber, and including a substrate transfer part where the substrate transferred between the substrate transfer module and the substrate transfer mechanism is temporarily placed. The substrate transfer mechanism is a substrate transfer arm configured to be stretchable and rotatable about a vertical axis. On two side wall parts of the substrate transfer chamber provided with the substrate transfer arm there are respectively provided openings facing each other with the substrate transfer arm therebetween, and a plurality of the substrate transfer parts are arranged along the alignment of these openings and the substrate transfer arm.

Advantages of the Invention

[0007] According to the present disclosure, in the substrate transfer chamber, the substrate can be transferred by the substrate transfer module using magnetic levitation.

Brief Description of the Drawings

[0008]

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Embodiments for Carrying Out the Invention

[0009] Hereinafter, the overall configuration of a wafer processing system 100, which is an apparatus for processing a substrate according to an embodiment of the present disclosure, will be described with reference to FIG. 1. FIG. 1 shows a multi-chamber type wafer processing system 100 including a plurality of wafer processing chambers 110 that are substrate processing chambers for processing a wafer W. As shown in FIG. 1, the wafer processing system 100 includes a load port 141, an atmospheric conveyance chamber 140, a load lock chamber 130, a vacuum conveyance chamber 120, and a plurality of wafer processing chambers 110. In the following description, the side where the load port 141 is provided is defined as the front side.

[0010] In the wafer processing system 100, the load port 141, the atmospheric transfer chamber 140, the load lock chamber 130, and the vacuum transfer chamber 120 are arranged in this order horizontally from the front side. Also, a plurality of wafer processing chambers 110 are provided side by side to the left and right of the vacuum transfer chamber 120 as viewed from the front side.

[0011] The load port 141 is configured as a mounting table on which a carrier C for accommodating the wafer W to be processed is placed, and four are arranged side by side in the left-right direction as viewed from the front side. As the carrier C, for example, a FOUP (Front Opening Unified Pod) or the like can be used. The atmospheric transfer chamber 140 has an atmospheric pressure (normal pressure) atmosphere, and for example, a downflow of clean air is formed. Also, inside the atmospheric transfer chamber 140, a wafer transfer mechanism 142 for transferring the wafer W is provided. The wafer transfer mechanism 142 in the atmospheric transfer chamber 140 transfers the wafer W between the carrier C and the load lock chamber 130. Also, an alignment chamber 150 for aligning the wafer W is provided on, for example, the left side surface of the atmospheric transfer chamber 140.

[0012] Three load lock chambers 130 are arranged side by side to the left and right between the vacuum transfer chamber 120 and the atmospheric transfer chamber 140. The load lock chamber 130 has lift pins 131 that push up and hold the loaded wafer W from below. Three lift pins 131 are provided at equal intervals in the circumferential direction and are configured to be able to move up and down. The load lock chamber 130 is configured to be able to switch between an atmospheric pressure atmosphere and a vacuum atmosphere. The load lock chamber 130 and the atmospheric transfer chamber 140 are connected via a gate valve 133. Also, the load lock chamber 130 and the vacuum transfer chamber 120 are connected via a gate valve 132. The boundary portion between the vacuum transfer chamber 120 and the load lock chamber 130 is connected so that there is no step on the floor surface. Therefore, it is configured not to hinder the movement between the load lock chamber 130 and the vacuum transfer chamber 120 of the first transfer module 20 described later. The vacuum transfer chamber 120 is depressurized to a vacuum atmosphere by a vacuum exhaust mechanism (not shown). The vacuum transfer chamber 120 corresponds to the substrate transfer chamber of the present embodiment.

[0013] As shown in FIG. 1, the vacuum transfer chamber 120 in which the wafer W is transferred under a vacuum atmosphere is configured by a rectangular housing that is long in the front-rear direction and rectangular in plan view. In the wafer processing system 100 of this example, a total of six wafer processing chambers 110, three on each of the left and right side wall portions of the vacuum transfer chamber 120, are provided via gate valves 111. Through an opening (not shown) opened and closed by the gate valve 111, the wafer W is carried into and out of the vacuum transfer chamber 120 and the wafer processing chamber 110.

[0014] Each wafer processing chamber 110 is connected to the vacuum transfer chamber 120 through the above-described opening provided with the gate valve 111. Each wafer processing chamber 110 is decompressed to a vacuum atmosphere by a vacuum exhaust mechanism (not shown), and a predetermined process is performed on the wafer W placed on the mounting table 112 provided inside. Examples of the process performed on the wafer W include an etching process, a film forming process, a cleaning process, and an ashing process. The mounting table 112 is provided with a heater (not shown) for heating the wafer W to a predetermined temperature, for example. When the process performed on the wafer W uses a process gas, the wafer processing chamber 110 is provided with a process gas supply unit (not shown) configured by a shower head or the like. The wafer processing chamber 110 corresponds to the substrate processing chamber of the present embodiment.

[0015] When looking at the inside of the vacuum transfer chamber 120 shown in Fig. 1 from the front side and dividing it into three regions: the front stage, the middle stage, and the rear stage, the wafer processing chamber 110 is installed so as to face each region with the left and right sides sandwiching it. In the front stage region and the middle stage region, wafer transfer arms 5, which are substrate transfer mechanisms, are respectively provided. As shown in Figs. 1 and 2, the wafer transfer arm 5 is composed of a base 50 fixed to the bottom surface of the vacuum transfer chamber 120, a lower arm portion 51 connected via a rotation axis (not shown) above the base 50, an upper arm portion 52, and a joint arm that connects the wafer holding portions 53 arranged in two stages in this order from the lower side. With this configuration, the wafer transfer arm 5 can operate so as to be extendable and retractable and rotatable around the vertical axis. Hereinafter, the wafer transfer arm 5 provided in the front stage region (front side) and the wafer transfer arm 5 provided in the middle stage region (rear side) are respectively denoted by adding symbols A and B (5A, 5B).

[0016] And between the front stage region and the middle stage region, and between the middle stage region and the rear stage region, placement portions 4, which are substrate delivery portions for temporarily placing the wafer W, are installed side by side in, for example, three positions in the left - right direction. The positions where the placement portions 4 are arranged correspond to the positions for delivering the substrate. The placement portion 4 is provided with three lifting pins 41 for supporting the wafer W so as to form a triangular support surface when viewed in plan. The lifting pins 41 are configured to project from and retract into the bottom surface of the vacuum transfer chamber 120 by a lifting mechanism (not shown), and push up and hold the wafer W from the lower side. In the drawings, the region where the wafer W supported by the lifting pins 41 is projected onto the bottom surface of the vacuum transfer chamber 120 is shown as the placement portion 4 by a dashed line. Also, the placement portions 4 arranged between the wafer transfer arm 5A and the wafer transfer arm 5B and the placement portion 4 provided on the rear side of the wafer transfer arm 5B are respectively denoted by adding symbols A and B (4A, 4B).

[0017] The placing units 4A and 4B are configured such that the lifting pins 41 project from the bottom surface of the vacuum transfer chamber 120 when holding the wafer W, and when not holding the wafer W, the lifting pins 41 descend below the bottom surface of the vacuum transfer chamber 120. Therefore, when not holding the wafer W, the first and second transfer modules 20 and 30, which will be described later, can pass above the placing units 4A and 4B.

[0018] The front-back direction interval between each of the placing units 4A and 4B and the base 50 of each wafer transfer arm 5A and 5B is set to an interval through which the first transfer module 20, which will be described later, can pass even when the lifting pins 41 are in the raised state. Also, the front-back direction interval between the base 50 of the front wafer transfer arm 5A and the load lock chamber 130 is set to an interval through which the first transfer module 20 can pass under the same conditions. Further, the front-back direction interval between the rear placing unit 4B and the rear wall surface of the vacuum transfer chamber 120 is set to an interval in which the second transfer module 30, which will be described later, can assume a posture with the arm portion 32 oriented in the front-back direction.

[0019] With the above configuration, in the vacuum transfer chamber 120, the wafer transfer arms 5 (5A, 5B) are arranged so as to be sandwiched between two openings to which the wafer processing chamber 110 is connected. And, in a layout, a plurality of placing units 4 are arranged along the alignment of these openings and the wafer transfer arms 5.

[0020] In the vacuum transfer chamber 120, in addition to the wafer transfer arms 5A and 5B, the first and second transfer modules 20 and 30, which are substrate transfer modules for transferring the wafer W, are accommodated. In this example, the first transfer module 20 configured in a disc shape and the second transfer module 30 provided with an arm portion 32 having a fork-shaped substrate holding portion are accommodated. The first and second transfer modules 20 are each configured to be movable within the vacuum transfer chamber 120 by magnetic levitation. Hereinafter, the configuration of the equipment related to the transfer and processing of the wafer W using the transfer module 20 will be described in detail.

[0021] As shown in FIGS. 3 and 4, the first transfer module 20 includes a stage 2 which is a substrate holding portion on which the wafer W is placed and held. For example, the stage 2 is formed in a flat disk shape, and its upper surface serves as a placement surface for placing the wafer W to be transferred and processed. As shown in FIG. 3, three slits 21 extending from the periphery of the stage 2 toward the inside of the stage 2 are formed in the first transfer module 20 so as not to interfere with the placement portions 4A and 4B and the lifting pins 41 and 131 in the load lock chamber 130. In the following description, the direction of the first transfer module 20 may be expressed as facing the first transfer module 20 when the opening end side of the slit 21 is directed in a predetermined direction.

[0022] The relationship between the lifting pins 41 and 131 and the slit 21 will be described by taking the placement portion 4 in the vacuum transfer chamber 120 as an example. First, the first transfer module 20 is arranged in front of the placement portion 4 in a posture facing the back side of the vacuum transfer chamber 120 and moved toward the back side. At this time, as described above, a space through which the first transfer module 20 can pass is secured between the placement portion 4 and the base 50 of each wafer transfer arm 5. Therefore, the first transfer module 20 and the lifting pin 41 do not interfere with each other, and the first transfer module 20 can be arranged at a position facing the placement portion 4. Further, the first transfer module 20 is arranged behind the placement portion 4 in a posture facing the front side of the vacuum transfer chamber 120 and moved toward the front side. By this operation, the formation region of the slit 21 is moved along the arrangement position of the lifting pin 41. As a result, the first transfer module 20 and the placement portion 4 can be arranged vertically so that the first transfer module 20 and the lifting pin 41 do not interfere with each other and their centers are aligned.

[0023] As schematically shown in FIG. 4, a plurality of floor-side coils 15 are arranged in the floor portions 10 of the vacuum transfer chamber 120 and the load lock chamber 130, respectively. The floor-side coil 15 generates a magnetic field when power is supplied from a power supply unit (not shown). From this viewpoint, the floor-side coil 15 corresponds to the first magnet of the present embodiment.

[0024] On the other hand, a plurality of module-side coils 35 are also arranged inside the first transfer module 20. A repulsive force acts between the module-side coil 35 and the magnetic field generated by the floor-side coil 15. By this action, the first transfer module 20 can be magnetically levitated with respect to the floor surface portion 10. Further, by adjusting the strength and position of the magnetic field generated by the floor-side coil 15, the first transfer module 20 can be moved in a desired direction on the floor surface portion 10, the levitation amount can be adjusted, and the orientation of the first transfer module 20 can be adjusted.

[0025] The module-side coil 35 provided in the first transfer module 20 corresponds to the second magnet of the present embodiment. Power is supplied to the module-side coil 35 from a battery (not shown) which is a magnet power supply unit provided inside the first transfer module 20, and it functions as an electromagnet. Note that, together with the plurality of module-side coils 35, a permanent magnet may be additionally provided inside the first transfer module 20. Further, the module-side coil 35 may be constituted by a permanent magnet.

[0026] For example, each module-side coil 35 is controlled to increase or decrease the power supplied to the module-side coil 35 and to supply or stop the power by a power supply control unit (not shown) provided inside the first transfer module 20. At this time, the power supply control unit may be configured to acquire a control signal related to power supply control by wireless communication with a control unit 9 described later.

[0027] Also, as described above, the first transfer module 20 is formed to have a size that allows it to pass between the bases 50 of the wafer transfer arms 5A and 5B and the placement unit 4 (FIGS. 1 and 2). Further, as shown in FIG. 2, the second transfer module 30 is formed to have a height dimension that allows it to pass below the pivoting lower arm portions 51 of the wafer transfer arms 5A and 5B while holding the wafer W.

[0028] Next, the configuration of the second transfer module 30 disposed at the subsequent stage of the vacuum transfer chamber 120 will be described. As shown in FIGS. 5 and 6, the second transfer module 30 has substantially the same width dimension as the first transfer module 20 and includes a main body 31 having a rectangular planar shape. A horizontal arm portion 32 is provided on the main body 31 so as to extend horizontally and hold the wafer W horizontally. At the tip of the arm portion 32, a fork is provided that can be arranged so as to surround from the left and right a region where three lifting pins 41 and 131 are provided. The fork corresponds to a substrate holding portion in the second transfer module 30. The length of the arm portion 32 is set such that the wafer W can be transferred to the mounting table 112 by opening the gate valve 111 and inserting the arm portion 32 into the wafer processing chamber 110 while keeping the main body 31 in the vacuum transfer chamber 120.

[0029] Also, inside the main body 31 of the second transfer module 30, a module-side coil 35 similar to that of the first transfer module 20 is provided. With this configuration, similar to the first transfer module 20, the second transfer module 30 can be moved in a desired direction on the floor surface portion 10, the floating amount can be adjusted, and the orientation of the second transfer module 30 can be adjusted. The vacuum transfer chamber 120 including the first and second transfer modules 20 and 30 and the wafer transfer arm 5 described above, to which the wafer processing chamber 110 is connected, corresponds to an apparatus for transferring a substrate according to the present disclosure.

[0030] Returning to FIG. 1, the wafer processing system 100 having the above-described configuration includes a control unit 9 that controls each floor-side coil 15, the wafer processing chamber 110, and the like. The control unit 9 is configured by a computer including a CPU and a storage unit, and controls each part of the wafer processing system 100. In the storage unit, a program in which a group of steps (instructions) for controlling the operations of the first and second transfer modules 20 and 30 and the wafer processing chamber 110 is recorded. This program is stored in a storage medium such as a hard disk, a compact disk, a magneto-optical disk, or a memory card, and is installed in the computer from there.

[0031] Next, an example of the operation of the wafer processing system 100 will be described. First, when a carrier C containing a wafer W to be processed is placed on the load port 141, the wafer W is taken out from the carrier C by the wafer transfer mechanism 142 in the atmospheric transfer chamber 140. Next, the wafer W is transferred to the alignment chamber 150, and the alignment of the wafer W is performed. Further, when the wafer W is taken out from the alignment chamber 150 by the wafer transfer mechanism 142, the gate valve 133 is opened.

[0032] Subsequently, the wafer transfer mechanism 142 enters the load lock chamber 130, and the lifting pin 131 pushes up and receives the wafer W. Here, for example, the first wafer W is carried into the leftmost load lock chamber 130 when looking from the front side to the back side. After that, when the wafer transfer mechanism 142 retreats from the load lock chamber 130, the gate valve 133 is closed. Further, the inside of the load lock chamber 130 is switched from the atmospheric pressure atmosphere to the vacuum atmosphere. Subsequently, the wafer W is similarly transferred to each load lock chamber 130. In this example, for example, the second wafer W is transferred to the rightmost load lock chamber 130.

[0033] When the inside of the load lock chamber 130 becomes a vacuum atmosphere, the gate valve 132 is opened. At this time, in the vacuum transfer chamber 120, the first transfer module 20A is waiting in a posture facing the load lock chamber 130 in the vicinity of the connection position of the load lock chamber 130. Then, using the magnetic field generated by the floor surface side coil 15 provided on the floor surface portion 10, the first transfer module 20A is lifted by magnetic levitation using the repulsive force.

[0034] Next, the transfer of the wafer W from the load lock chamber 130 to each wafer processing chamber 110 will be described. First, an example of sequentially transferring the wafer W to the front-stage wafer processing chamber 110 and the middle-stage wafer processing chamber 110 will be described with reference to FIGS. 7 to 10. Here, an example of sequentially transferring the wafer W to each wafer processing chamber 110 provided on the right side of the vacuum transfer chamber 120 as viewed from the front side will be described. In FIGS. 7 to 10, the first transfer module 20 that first transfers the wafer W is also marked with the symbol A (20A), and subsequently, the first transfer module 20 that transfers the wafer W is marked with the symbol B.

[0035] First, as shown in FIG. 7, the first transfer module 20A is made to enter the load lock chamber 130 and is positioned below the wafer W supported by the lifting pin 131. Further, the lifting pin 131 is lowered, and the wafer W is transferred to the first transfer module 20, whereby the wafer W is placed on the stage 2.

[0036] Next, the first transfer module 20A holding the wafer W is made to exit the load lock chamber 130 and is advanced straight ahead to in front of the front placement portion A4. Subsequently, the first transfer module 20A moves rightward between the front placement portion 4A and the base 50 of the front wafer transfer arm 5A. At this time, the first transfer module 20A moves in parallel to the right without changing its direction. After moving to in front of the rightmost placement portion 4A, the moving direction is changed to the rear side to reach above the placement portion 4 (FIG. 8).

[0037] Furthermore, at the placement portion 4A, the lifting pin 41 rises and pushes up and receives the wafer W held by the first transfer module 20A. At this time, a subsequent wafer W has been carried into the leftmost load lock chamber 130, and similarly, the atmosphere of the load lock chamber 130 is being switched to a vacuum atmosphere. Then, the first transfer module 20B enters the load lock chamber 130 and receives the wafer W.

[0038] Subsequently, as shown in FIG. 9, the first transfer module 20A that has transferred the wafer W moves to the back side of the placement unit 4A and moves from the back side of the front placement unit 4A from the right side to the left side. Further, the first transfer module 20A moves straight ahead toward the front side and waits on the back side of the left load lock chamber 130. Note that the first transfer module 20A moves to the placement unit 4A in a state where the lifting pin 41 is not raised while maintaining the posture facing the load lock chamber 130. For this reason, the first transfer module 20A can move along the trajectory shown in FIG. 9 without interfering with the lifting pin 41. This also applies to the operation of the other first transfer module 20B.

[0039] Furthermore, the front wafer transfer arm 5A receives the wafer W delivered to the right placement unit 4A and transfers the wafer W to, for example, the right wafer processing chamber 110 in the previous stage. At this time, the first transfer module 20B holding the subsequent wafer W exits from the load lock chamber 130 and moves straight ahead to the front of the placement unit 4A. Further, the moving direction is changed, and it moves to the left between the placement unit 4A and the front wafer transfer arm 5A. Then, after moving to the front of the central placement unit 4A, the moving direction is changed to the back side, and it reaches above the placement unit 4A (FIG. 9). Then, the lifting pin 41 of the placement unit 4A is raised, and the wafer W is transferred to the lifting pin 41.

[0040] Subsequently, as shown in FIG. 10, the first transfer module 20B that has transferred the wafer W moves to the back side of the placement unit 4 and then changes the moving direction to the right side. Then, it moves straight ahead toward the front side and waits on the back side of the rightmost load lock chamber 130. On the other hand, the back wafer transfer arm 5B receives the wafer W delivered to the central placement unit 4A and transfers the wafer W to, for example, the right wafer processing chamber 110 in the middle stage.

[0041] Next, the operation of transporting the wafer W from the load lock chamber 130 to the subsequent wafer processing chamber 110 will be described with reference to FIGS. 11 to 13. In this example, the case of transporting to the wafer processing chamber 110 installed on the right side at the subsequent stage of the vacuum transfer chamber 120 will be described. First, for example, in the left load lock chamber 130, the wafer W is transferred to the first transfer module 20. Next, as shown in FIG. 11, the first transfer module 20 that has received the wafer W moves straight ahead toward the back side and moves to the front side of the back placement portion 4B.

[0042] Furthermore, the first transfer module 20 changes the moving direction and moves to the right between the back placement portion 4B and the back wafer transfer arm 5B. Then, after moving to the front of the right placement portion 4B, the moving direction is changed to the back side to reach above the right placement portion 4B. And for example, it rotates around the vertical axis on the spot and changes the orientation so as to face the placement portion 4B. Here, since the first transfer module 20 is in a posture facing the front side when exiting the load lock chamber 130, it may be rotated 180° around the vertical axis above the placement portion 4. At this time, the second transfer module 30 is waiting in a posture with the arm portion 32 facing the front side on the back side of the right placement portion 4B.

[0043] Subsequently, as shown in FIG. 12, when the lifting pin 41 of the placement portion 4 is raised to push up and receive the wafer W, the first transfer module 20 moves to the front side. Further, after rotating 180° around the vertical axis, the first transfer module 20 moves leftward between the back placement portion 4B and the back wafer transfer arm 5B. Then, it moves straight ahead to the front side and returns to wait on the back side of the leftmost load lock chamber 130. On the other hand, the second transfer module 30 is advanced to the front side to position the arm portion 32 at the placement portion 4B, and the lifting pin 41 of the placement portion 4B is lowered to transfer the wafer W to the arm portion 32.

[0044] As further shown in FIG. 13, the second transfer module 30 holding the wafer W performs a turning operation of moving backward while changing its orientation as viewed from the placement section 4B, and directs the tip of the arm section 32 toward the right wafer processing chamber 110. Next, the gate valve 111 of the wafer processing chamber 110 is opened, the second transfer module 30 is advanced straight, the arm section 32 is made to enter the wafer processing chamber 110, and the wafer W is transferred. When transferring the wafer W, the main body section 31 of the second transfer module 30 is positioned within the vacuum transfer chamber 120, and only the arm section 32 has entered the wafer processing chamber 110 (FIG. 13).

[0045] By the above-described respective operations, when the loading of the wafer W into each wafer processing chamber 110 is completed, the arm section 32 is retracted into the vacuum transfer chamber 120, and the gate valve 111 is closed. Subsequently, in sequence, the wafer W is heated by the mounting table 112 and the temperature is raised to a preset temperature, and a processing gas is supplied from the processing gas supply section into the wafer processing chamber 110. Thus, a desired process is executed on the wafer W.

[0046] When the processing of the wafer W is executed for a preset period in this way, the heating of the wafer W is stopped and the supply of the processing gas is stopped. Further, if necessary, a cooling gas may be supplied into the wafer processing chamber 110 to cool the wafer W. Thereafter, the wafer W is transferred in a procedure reverse to that at the time of loading, and the wafer W is returned from the wafer processing chamber 110 to the load lock chamber 130. Furthermore, after switching the atmosphere of the load lock chamber 130 to an atmospheric pressure atmosphere, the wafer W in the load lock chamber 130 is taken out by the wafer transfer mechanism 142 on the atmospheric transfer chamber 140 side and returned to a predetermined carrier C.

[0047] In the above-described embodiment, when transferring the wafer W to the wafer processing chamber 110, it is transferred by the first transfer module 20 from the load lock chamber 130 to the placement section 4 provided within the vacuum transfer chamber 120. On the other hand, in the case where the first transfer module 20 is not provided in the vacuum transfer chamber 120, it is necessary to use the wafer transfer arms 5A and 5B also for the transfer of the wafer W in the front-rear direction between the load lock chamber 130 and the front-stage placement unit 4A, and between the front-stage placement unit 4A and the rear-stage placement unit 4B. For this reason, in addition to the operation of transferring the wafer W to the wafer processing chamber 110, the operation of transferring the wafer W in the front-rear direction is added to each of the wafer transfer arms 5A and 5B. As a result, the load of the operation of transferring the wafer W by the wafer transfer arms 5A and 5B increases. An increase in the load of a specific device may also become a constraint in increasing the number of wafers W that can be processed per unit time in the wafer processing system 100. On the other hand, adding and providing a dedicated wafer transfer arm for transferring the wafer W in the front-rear direction is not practical due to insufficient placement space, interference with the other wafer transfer arms 5A and 5B, and restrictions on the positions where the wafer can be transferred by the additional wafer transfer arm.

[0048] On the contrary, by installing the first transfer module 20 that can move relatively freely within the vacuum transfer chamber 120, the transfer of the wafer W from the load lock chamber 130 to each placement unit 4 can be shared by the first transfer module 20. Therefore, the wafer transfer arm 5 only needs to share the transfer of the wafer W between the placement unit 4 and the wafer processing chamber 110. Therefore, an increase in the load of the wafer transfer arm 5 can be suppressed. Also, as described above, a plurality of placement units 4 are arranged along the alignment of the wafer processing chamber 110 and the wafer transfer arm 5. With this configuration, while securing the movement space of the first transfer module 20, the transfer operation of the wafer W by the wafer transfer arm 5 and the first transfer module 20 can be efficiently performed.

[0049] Here, the floor-side coil 15 may also be installed on the floor surface portion of the wafer processing chamber 110 so that the first transfer module 20 can enter directly into the wafer processing chamber 110 to transfer the wafer W. Further, for example, depending on the temperature of the wafer W before and after the processing in the wafer processing chamber 110, the first and second transfer modules 20 and 30 having different usable temperatures may be used respectively.

[0050] Also, when transporting the wafer W by the first transfer module 20, alignment of the notch and the orientation flat (OF) of the wafer W may be performed. When processing the wafer W in the wafer processing chamber 110, it may be necessary to perform the processing with the notch or OF facing in a predetermined direction based on the result of alignment performed in the alignment chamber 150 in advance. On the other hand, as shown in FIG. 1, when the wafer processing chambers 110 are arranged on the left and right sides with the wafer transfer arm 5 in between, if the wafer W placed on the placement unit 4 always faces the same direction, the directions of the notch and OF may differ by 180° between the left and right wafer processing chambers 110. In such a case, the first transfer module 20 can also be used for alignment of the notch and OF. In FIGS. 14 to 15 described below, for the sake of illustration, the description of the wafer transfer arm 5 is omitted.

[0051] Therefore, for example, regarding an example of notch alignment, assume that the wafer W whose notch has been aligned by alignment is arranged as shown in FIG. 14. Here, if the wafer W is placed on the placement unit 4 without changing the direction of the notch and is carried into the right-hand wafer processing chamber 110 by the wafer transfer arm 5, assume that the wafer W is in a state of being rotated 180° around the vertical axis with respect to the preset direction.

[0052] In this case, for example, when the first transfer module 20 holding the wafer W enters the vacuum transfer chamber 120 from the load lock chamber 130, the first transfer module 20 is rotated 180° around the vertical axis as shown in FIG. 15. Then, as shown in FIG. 16, by delivering the wafer W to the placement unit 4, the direction of the wafer W delivered to the placement unit 4 can be rotated 180°. Further, the first transfer module 20 retreats from the position of the placement unit 4, is rotated 180° around the vertical axis, and returns to wait on the back side of the leftmost load lock chamber 130 (FIG. 16). By using the first transfer module 20 that utilizes magnetic levitation in this way, it is not necessary to separately provide a device for aligning the notch in the wafer processing system 100.

[0053] Next, FIGS. 17 and 18 show an example of a placement module 400 that constitutes a substrate transfer unit disposed on the placement unit 4. This placement module 400 is configured to be rotatable around the vertical axis using magnetic levitation. This placement module 400 includes two placement tables 401 and 402 so that the wafers W can be placed in two upper and lower stages. For example, the lower placement table 401 includes a base portion 411, and a holding portion 403 for holding the center of the lower surface of the wafer W is provided above the base portion 411. The holding portion 403 is configured to be able to transfer the wafer W with the wafer holding portion 53 of each first transfer module 20.

[0054] Also, the upper placement table 402 includes a cylindrical portion 412 that surrounds the lower placement table 401, and a holding portion 404 for holding the center of the lower surface of the wafer W is provided above the cylindrical portion 412. Two window portions 405 for delivering the wafer W to the lower placement table 401 are formed at positions on the side surface of the cylindrical portion 412 that face each other. The holding portion 404 is also configured to be able to transfer the wafer W with the wafer holding portion 53 of each first transfer module 20.

[0055] Also, at the lower end of the base portion 411 of the mounting table 401 and the cylindrical portion 412 of the mounting table 402, a module-side coil 35, which is a magnet on the substrate transfer portion side, is provided respectively. By utilizing the repulsive force between this module-side coil 35 and the floor-side coil 15 provided on the floor surface portion 10 of the vacuum transfer chamber 12, each of the mounting tables 401 and 402 is configured to be rotatable independently around the vertical axis. According to the mounting module 400 of this example, the orientation of the wafer W can be changed when it is held by the first transfer module 20 and when it is held by the wafer transfer arm 5. In this example, instead of the operation of aligning the notch and OF of the wafer W by the first transfer module 20 described with reference to FIGS. 14 to 16, by providing a dedicated mounting module 400, the transfer and rotation operations of the wafer W can be shared.

[0056] Next, FIG. 19 shows an example of aligning the wafer W using a transfer module that utilizes magnetic levitation. The transfer module 60 illustrated in FIG. 19 includes a main body portion 61 provided with a module-side coil 35 and a support column portion 62 that extends upward from the upper surface of the main body portion 61 and has a diameter smaller than that of the wafer W. On the upper surface of the support column portion 62, a substrate holding surface that forms a substrate holding portion is formed, and the wafer W is supported from the lower surface side by the substrate holding surface. In the alignment using the above-described transfer module 60, for example, a wafer sensor 6 for alignment, which is a detection unit that irradiates light downward and has a light receiving unit that receives the light on the lower side, is used. The wafer sensor 6 detects the position of the periphery of the wafer W located outside the support column portion 62. The wafer sensor 6 is provided, for example, in the load lock chamber 130.

[0057] Then, for example, with the transfer module 60 waiting in the load lock chamber 130, the wafer W is transferred to the transfer module 60 from the atmospheric transfer chamber 140 side, and the gate valve 133 on the atmospheric transfer chamber 140 side is closed. Further, the transfer module 60 is moved so that the periphery of the wafer W is positioned on the optical path of the wafer sensor 6.

[0058] While switching the inside of the load lock chamber 130 to a vacuum atmosphere, the transfer module 60 is rotated on the spot around the vertical axis. As a result, the wafer W rotates around the central axis passing through its center, and alignment is performed while detecting the position of the periphery of the rotating wafer W. By configuring in this way, the installation of the alignment chamber 150 shown in FIG. 1 can be omitted, and the wafer processing system 100 can be miniaturized. Furthermore, since alignment can be performed while switching the load lock chamber 130 to a vacuum, for example, compared with the example of transferring to the alignment chamber 150 and performing alignment, the number of wafers W processed per unit time can be improved. Note that the sensor unit 6 may be provided in the moving area of the transfer module 60 such as the atmospheric transfer chamber 140 or the vacuum transfer chamber 120, and alignment may be performed at each installation location.

[0059] The above-described transfer module 60 also corresponds to the substrate transfer module of this example, and instead of or together with the above-described first and second transfer modules 20 and 30, the transfer of the wafer W in the vacuum transfer chamber 120 may be executed. In this case, the lifting pin 41 of the mounting portion 4 is disposed at a position where it can support the lower surface of the wafer W around the support column portion 62.

[0060] In addition, an accelerometer or a thermometer may be provided in each of the above-described transfer modules 20, 30, and 60 to detect vibrations during the transfer of the wafer W or to detect a temperature rise of the wafer W. Then, for example, the measured values of acceleration and temperature are transmitted to the control unit 9, and for example, the failure of the transfer modules 20, 30, and 60 may be self-diagnosed when the measured value of acceleration exceeds the threshold value or when the measured value of temperature exceeds the threshold value. Also, an abnormality in the processing process of the wafer W may be detected when the measured value of the temperature of the wafer W exceeds the threshold value.

[0061] In addition, a camera for monitoring, for example, the inside of the vacuum transfer chamber 120 may be provided in the disk-shaped first transfer module 20. For example, by imaging the inside of the vacuum transfer chamber 120, it is possible to check for abnormalities inside the vacuum transfer chamber 120. Further, the first transfer module 20 may be allowed to enter the wafer processing chamber 110 to image the inside of the chamber and check for abnormalities. For example, by imaging the wafer W placed on the mounting table 112 and the mounting table 112 and checking the positions of the wafer W and the mounting table 112, the teaching and transfer accuracy of the wafer W may be confirmed. In addition to the camera, a laser displacement meter or an encoder may be installed to further improve the accuracy of position confirmation. Alternatively, an imaging module that can move inside the vacuum transfer chamber 120 by magnetic levitation may be provided separately from the above-described transfer modules 20, 30, and 60, and a camera may be installed in the imaging module.

[0062] Next, FIGS. 20 and 21 show an example in which a magnet is provided on the ceiling (top surface portion) side of a substrate transfer chamber (for example, the above-described vacuum transfer chamber 120) in which the wafer W is transferred, and a module that moves along the ceiling by magnetic attraction is provided. As an example of such a module, the gas discharge module 7 will be described. As shown in FIG. 20, the gas discharge module 7 includes a housing 70. Inside the housing 70, a gas storage portion 71 in which nitrogen (N2) gas, which is a clean gas, is stored, for example, is provided.

[0063] A plurality of gas discharge holes 72 are formed on the lower surface side of the housing 70, and the N2 gas stored in the gas storage portion 71 is configured to be discharged from the gas discharge holes 72 through the pipe 73. Note that V73 provided in the pipe 73 in FIG. 20 is a valve.

[0064] Then, a module-side coil 35 is provided on the top plate of the housing 70, and a top surface-side coil 16 is installed on the top surface portion 11 of the vacuum transfer chamber 120. The top surface-side coil 16 corresponds to the third magnet, and the module-side coil 35 corresponds to the fourth magnet. Then, due to the attractive force by magnetic force between the module-side coil 35 and the top surface-side coil 16, the gas discharge module 7 is magnetically attracted at a position below the top surface portion 11 in the vacuum transfer chamber 120.

[0065] With the gas discharge module 7 configured as described above, as shown in FIG. 21, for example, N2 gas is discharged while moving inside the vacuum transfer chamber 120. As a result, a downward flow of clean gas is formed toward the wafer W in the vacuum transfer chamber 120. Due to this downward flow, adhesion of particles 93 floating in the vacuum transfer chamber 120 and corrosive gas 94 generated during the processing in the wafer processing chamber 110 to the wafer W is suppressed, and it can be exhausted from the exhaust port 90 together with the flow of N2 gas. Furthermore, when the transfer modules 20 and 30 are transferring the wafer W, the gas discharge module 7 may be moved following the transfer modules 20 and 30 so as to continuously discharge N2 gas to the wafer W held by the transfer modules 20 and 30. By configuring in this way, the wafer W being transferred can be covered with N2 gas, and oxidation of the wafer W due to the gas floating in the transfer path can be prevented.

[0066] In addition, as a module provided on the top surface side and moving, it may be a temperature control module that houses a heater or the like. For example, by moving the temperature control module arranged above the wafer W together with the wafer W being transferred by the first transfer module 20 moving along the floor surface, the temperature of the wafer W can be adjusted during the transfer of the wafer W. Also, a shelf-like wafer placement portion may be provided on a module moving along the ceiling, and the wafer W may be transferred using the module.

[0067] Moreover, a connecting mechanism for connecting the respective transfer modules 20, 30, and 60 to each other may be provided. For example, FIG. 22 shows an example in which a protrusion 22 is provided on the side surface of the first transfer module 20. A recess 23 into which the protrusion 22 can be inserted is provided on the side surface opposite to the protrusion 22. Then, as shown in FIG. 23, the protrusion 22 of the first transfer module 20 is configured to be inserted into the recess of another first transfer module 20 so as to be connectable. The protrusion 22 and the recess 23 constitute the connecting mechanism.

[0068] By configuring in this way, for example, when the first transfer module 20 breaks down and becomes immovable, it is connected so that another first transfer module 20 sandwiches the failed first transfer module . The first transfer module 20 marked with diagonal lines in FIG. 23 indicates the failed first transfer module 20. By configuring in this way, the failed first transfer module 20 can be transferred by another first transfer module 20.

[0069] Furthermore, a dedicated load lock chamber 200 capable of switching the internal atmosphere between an air atmosphere and a vacuum atmosphere may be provided to carry out the failed first transfer module 20. FIG. 24 shows an example in which the load lock chamber 200 is provided on the back side wall surface of the vacuum transfer chamber 120. Reference numeral 201 in FIG. 24 is a gate valve, and reference numeral 202 is the outlet of the first transfer module 20. By providing the load lock chamber 200 for recovering the failed transfer modules 20, 30, and 60 in this way, it is not necessary to stop and open the wafer processing system 100, and the downtime of the system 100 can be reduced. Also, the wafer W in which an abnormality has occurred may be recovered from the load lock chamber 200.

[0070] Furthermore, the aforementioned load lock chamber 200 may be used as a storage chamber for storing unused transfer modules 20, 30, and 60. And it may be configured such that the number of transfer modules 20, 30, and 60 used in the vacuum transfer chamber 120 can be adjusted according to the throughput of the processes performed in the wafer processing system 100. Furthermore, the number of transfer modules 20, 30, and 60 arranged in the vacuum transfer chamber 120 via the load lock chamber 200 may be increased or decreased.

[0071] Furthermore, the transfer modules 20, 30, and 60 may be used to transfer components installed in the vacuum transfer chamber 120 or in the wafer processing chamber 110. FIG. 25 shows an example in which the focus ring 113 is being transferred by the first transfer module 20. And for example, the wafer transfer arm 5 may be configured to receive the focus ring 113 from these first transfer modules 20 and carry it into the wafer processing chamber 110 and install it on the mounting table 112. By configuring it in this way, it is possible to replace and install internal components and members without opening the wafer processing chamber 110.

[0072] Note that the first transfer module 20 may be configured to have a rectangular planar shape. On the other hand, by making the transfer module 20 have a circular planar shape, the area required for the rotation of the transfer module 20 can be reduced, and the area of the vacuum transfer chamber 120 can be narrowed.

[0073] Also, the transfer of the wafer W between the first transfer module 20 and the wafer transfer arm 5 may be performed directly between the first transfer module 20 and the wafer transfer arm 5 without passing through the placement unit 4. In this case, for example, an elevating pin that protrudes from and retracts into the surface of the stage 2 of the first transfer module 20 is provided. And the wafer W placed on the first transfer module 20 may be raised and lowered using the elevating pin to perform the transfer with the wafer transfer arm 5.

[0074] In addition, the number and layout of the wafer processing chambers 110 in the vacuum transfer chamber 120 are not limited to the example shown in FIG. 1. The number of the wafer processing chambers 110 may be increased or decreased as necessary. For example, even when only one wafer processing chamber 110 is provided in the vacuum transfer chamber 120, it is included in the technical scope of the present disclosure.

[0075] Also, the arrangement of the vacuum transfer chamber 120 is not limited to the case where the long side of the rectangular vacuum transfer chamber 120 is arranged in the front-rear direction as shown in FIG. 1. For example, when viewed from the load port 141 side, the vacuum transfer chamber 120 may be arranged with the long side in the left-right direction. Furthermore, regarding the planar shape of the vacuum transfer chamber 120, various shapes may be adopted according to the shape of the area where the wafer processing system 100 is arranged. For example, it may be a square, a polygon with five or more sides, a circle, or an ellipse.

[0076] In addition, the substrate transfer chamber in which the wafer W is transferred to the wafer processing chamber 110 using the transfer modules 20, 30, and 60 is not limited to being configured by the vacuum transfer chamber 120 with an internal vacuum atmosphere. The transfer modules 20, 30, and 60 of the present disclosure can also be applied to a wafer processing system in which the wafer processing chamber 110 is provided on the side of a substrate transfer chamber with an internal atmospheric pressure atmosphere. In this case, it is not an essential requirement to provide the load lock chamber 130 for the wafer processing system, and the wafer W taken out from the carrier C to the atmospheric transfer chamber 140 may be directly transferred into the substrate transfer chamber.

[0077] Also, for example, the vacuum transfer chamber 120A and another vacuum transfer chamber 120B may be connected by a connection path 8 . For example, as shown in FIG. 26, one end of the connection path 8 is connected to the left side of the vacuum transfer chamber 120A, and the other end of the connection path 8 is connected to the right side of another vacuum transfer chamber 120B. This vacuum transfer chamber 120B is configured in the same manner as the vacuum transfer chamber 120A except that the load lock chamber 130 is not provided on the front side.

[0078] Then, a floor-side coil 15 is also installed on the floor of the communication path 8, and the transfer modules 20, 30, and 60 are configured to be movable. By connecting a plurality of vacuum transfer chambers 120A and 120B in this way, the load lock chamber 130, the atmospheric transfer chamber 140, and the load port 141 can be shared.

[0079] In addition, when, for example, only the wafer transfer arm 5 is adopted as the wafer transfer mechanism that fixes the bottom surface between the vacuum transfer chambers 120A and 120B, a large space for turning is required. In addition, since the transferable distance is limited, a plurality of transfer mechanisms may have to be provided to transfer to a far point.

[0080] On the other hand, when using the first and second transfer modules 20 and 30 that float and move by magnetic force, the range where the floor-side coil 15 can be installed can be adjusted relatively freely. As a result, since the range where one transfer module 20, 30, or 60 can move can be freely set, the degree of freedom in device design is increased.

[0081] Alternatively, without providing a fixed transfer mechanism in the vacuum transfer chamber 120, the wafer W may be transferred by only the transfer modules 20, 30, and 60 that float by magnetic force and move inside the vacuum transfer chamber 120. FIG. 27 shows a wafer processing system 101 that transfers the wafer W using only the aforementioned second transfer module 30 (hereinafter, also simply referred to as "transfer module 30"). In this wafer processing system 101, in a plan view, the length in the short side direction of the rectangular vacuum transfer chamber 160 is such that two transfer modules 30 holding the wafer W can pass by side by side. Further, the length in the short side direction of the vacuum transfer chamber 160 in this example is shorter than the length from the main body portion 31 to the tip of the wafer W when the transfer module 30 holds the wafer W (the total length of the transfer module 30 in the state of holding the wafer W). In this example, the wafer W is transferred using two transfer modules 30 provided in the vacuum transfer chamber 160.

[0082] In front of the vacuum transfer chamber 160, two load lock chambers 130 are arranged side by side on the left and right, and four wafer processing chambers 110 are arranged side by side on the left and right of the vacuum transfer chamber 160. That is, the wafer W is to be carried into the wafer processing chamber 110 in a direction (short side direction) intersecting the long side direction of the vacuum transfer chamber 160. On the other hand, as described above, the length of the vacuum transfer chamber 160 in the short side direction is shorter than the total length of the transfer module 30 holding the wafer W. Therefore, when loading and unloading the wafer W using the transfer module 30, it is necessary to perform a switching operation that combines a linear movement along the long side direction of the vacuum transfer chamber 160 and a curved movement of entering or exiting the vacuum transfer chamber 160 while changing the direction of the transfer module 30.

[0083] Therefore, a space 161 is provided on the back side of the vacuum transfer chamber 160 for performing a switching operation when switching the transfer module 30 when loading the wafer W into the last-stage wafer processing chamber 110. That is, the space 161 protrudes to the back side beyond the last-stage wafer processing chamber 110 (specifically, the position of the gate valve 111 of the last-stage wafer processing chamber 110). In addition, when loading and unloading the wafer W to the front-side wafer processing chambers 110 other than the last stage, the above-described switching operation can be performed using the space inside the vacuum transfer chamber 160 that extends to the front side of the above-described space 161. In this wafer processing system 101, the transfer module 30 moves along the long side direction of the vacuum transfer chamber 160 in a posture with the arm portion 32 facing the load lock chamber 130 side (front side) inside the vacuum transfer chamber 160, and moves along the left and right trajectories when viewed from the front side.

[0084] The wafer transfer operation between the wafer processing chamber 110 in this wafer processing system 101 will be described by taking the leftmost last-stage wafer processing chamber 110 as an example. First, when the transfer module 30 receives the wafer W from the left load lock chamber 130, it moves backward with the arm portion 32 facing the front side as it is, toward the back side (also refer to the arrow indicating the traveling direction shown in the transfer module 30 on the left hand side when viewed from the front side in FIG. 27).

[0085] Then, the transfer module 30 holding the wafer W moves to the position where the gate valve 111 of the last wafer processing chamber 110 is provided. At this time, the main body 31 of the transfer module 30 passes through the arrangement position of the gate valve 111 and reaches the deeper space 161. By this operation, the tip side of the arm portion 32 holding the wafer W is disposed near the gate valve 111. Thus, when the tip side of the arm portion 32 reaches near the gate valve 111, as shown in FIG. 28, in addition to the retraction operation, the tip side of the arm portion 32 is rotated clockwise so as to face the gate valve 111.

[0086] Subsequently, the gate valve 111 is opened, and while rotating to insert the wafer W into the wafer processing chamber 110, the moving direction of the transfer module 30 is switched to forward (FIG. 29). Thereafter, when the transfer module 30 faces the wafer processing chamber 110, the rotation is stopped and the module moves straight until the wafer W reaches above the mounting table 112. By the switching operation of switching between backward and forward while rotating the transfer module 30 described above, the transfer module 30 assumes a posture in which the arm portion 32 faces leftward when viewed from the front side (FIG. 30). Then, the wafer W is delivered to the mounting table 112, and the transfer module 30 is retracted from the wafer processing chamber 110. Further, the gate valve 111 is closed, and the wafer W is processed.

[0087] Then, when the wafer W is taken out of the wafer processing chamber 110 after the processing of the wafer W, the transfer module 30 enters the wafer processing chamber 110 again with the arm portion 32 and receives the processed wafer W. Next, as shown in FIGS. 31 to 33, the wafer W is unloaded by performing a switching operation of switching between backward and forward movements while rotating the transfer module 30 by an operation opposite to that at the time of loading. Thereafter, it moves forward toward the front and transfers the wafer W to the left load lock chamber 130. Although the description has been omitted in the above example, the operation when the transfer module 30 retracts and enters the arm portion 32 in a state where the wafer W is not held from the wafer processing chamber 110 also uses the switching operation described with reference to FIGS. 28 to 33.

[0088] As described above, a space 161 for changing the direction while switching the transfer module 30 is provided on the back side of the vacuum transfer chamber 160. By providing this space 161, the width of the vacuum transfer chamber 160 in the short side direction can be made shorter than the total length of the transfer module 30 holding the wafer W. Therefore, the floor area of the vacuum transfer chamber 160 can be reduced. As described above, for each wafer processing chamber 110 arranged on the front side of the rearmost wafer processing chamber 110, the switching operation can be performed using the space in the vacuum transfer chamber 160 that extends to the front side of the space 161. In addition, since this wafer processing system 101 does not provide the wafer transfer arm 5 and the placement unit 4 in the vacuum transfer chamber 160, the height dimension of the vacuum transfer chamber 160 can be reduced as compared with the case where these devices 5 and 4 are provided.

[0089] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and gist of the appended claims.

Description of Reference Numerals

[0090] 2 Stage 5 Wafer Transfer Arm 10 Floor Portion 15 Floor Side Coil 20 First Transfer Module (Transfer Module) 30 Second Transfer Module (Transfer Module) 32 Wafer holding part 35 Module side coil 60 Conveying module 100, 101 Wafer processing system 110 Wafer processing chamber 120, 160 Vacuum conveying chamber W Wafer

Claims

1. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a floor portion on which a first magnet is provided and a sidewall portion to which the substrate processing chamber is connected and having an opening formed therein through which substrates are transferred in and out of the substrate processing chamber; a substrate transfer module including a substrate holder that holds the substrate and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being movable within the substrate transfer chamber by magnetic levitation using the repulsive force; the substrate transfer module is configured to transfer a substrate between the substrate transfer chamber and the substrate processing chamber when a substrate transfer mechanism for loading and unloading a substrate between the substrate transfer chamber and the substrate processing chamber through the opening is fixedly provided in the substrate transfer chamber, and a substrate transfer mechanism provided in the substrate transfer chamber and connecting the substrate transfer module and the substrate transfer mechanism; a substrate transfer section on which a substrate to be transferred is temporarily placed, The substrate transfer unit includes a mounting section on which the substrate is placed, and a magnet on the substrate transfer section side that generates a repulsive force between itself and the first magnet, and is configured to be freely rotatable around a vertical axis within the substrate transfer chamber by magnetic levitation using the repulsive force, in order to change the orientation of the substrate when held by the substrate transfer module and when held by the substrate transfer mechanism.

2. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a floor portion on which a first magnet is provided and a sidewall portion to which the substrate processing chamber is connected and having an opening formed therein through which substrates are transferred in and out of the substrate processing chamber; a substrate transfer module including a substrate holder that holds the substrate and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being movable within the substrate transfer chamber by magnetic levitation using the repulsive force; the substrate transfer module is configured to insert the substrate holder into the substrate processing chamber through the opening to load a substrate; the substrate transfer chamber includes a top surface portion on which a third magnet is provided, a fourth magnet is provided, and an attractive force acts between the fourth magnet and the third magnet; and a processing module is provided, which processes the inside of the substrate transfer chamber or the substrate; The processing module is configured to be movable within the substrate transfer chamber by magnetic attraction using the attractive force.

3. 3. The apparatus according to claim 2, wherein the processing module is a gas discharge module that discharges gas into the substrate transfer chamber through gas supply holes provided on a lower surface of the processing module to form a downward flow of clean gas toward the substrate in the substrate transfer chamber.

4. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a floor portion on which a first magnet is provided and a sidewall portion to which the substrate processing chamber is connected and having an opening formed therein through which substrates are transferred in and out of the substrate processing chamber; a substrate transfer module including a substrate holder that holds the substrate and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being movable within the substrate transfer chamber by magnetic levitation using the repulsive force; the substrate transfer module is configured to insert the substrate holder into the substrate processing chamber through the opening to load a substrate; The substrate transfer module includes a coupling mechanism for coupling with another substrate transfer module.

5. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a floor portion on which a first magnet is provided and a sidewall portion to which the substrate processing chamber is connected and having an opening formed therein through which substrates are transferred in and out of the substrate processing chamber; a substrate transfer module including a substrate holder that holds the substrate and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being movable within the substrate transfer chamber by magnetic levitation using the repulsive force; the substrate transfer module is configured to insert the substrate holder into the substrate processing chamber through the opening to load a substrate; The substrate transport module is configured in a disk shape with the second magnet provided inside, and the upper surface of the disk serves as the substrate holder.

6. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a floor portion on which a first magnet is provided and a sidewall portion to which the substrate processing chamber is connected and having an opening formed therein through which substrates are transferred in and out of the substrate processing chamber; a substrate transfer module including a substrate holder that holds the substrate and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being movable within the substrate transfer chamber by magnetic levitation using the repulsive force; the substrate transfer module is configured to insert the substrate holder into the substrate processing chamber through the opening to load a substrate; the substrate transfer module includes a main body portion having the second magnet provided therein, and an arm portion extending laterally from the main body portion and having a fork at its tip end that forms the substrate holding portion; the substrate transfer module performs loading and unloading of the substrate by inserting the arm into the substrate processing chamber through the opening while the main body is positioned within the substrate transfer chamber; The substrate transport chamber has an elongated rectangular shape when viewed in a plane, and the length of the short side of the rectangle is shorter than the overall length of the substrate transport module when it is holding the substrate, and the substrate transport chamber is provided with a space for changing the direction of the substrate transport module by performing a turning operation when the arm portion is inserted into or withdrawn from the substrate processing chamber through the opening.

7. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a floor portion on which a first magnet is provided and a sidewall portion to which the substrate processing chamber is connected and having an opening formed therein through which substrates are transferred in and out of the substrate processing chamber; a substrate transfer module including a substrate holder that holds the substrate and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being movable within the substrate transfer chamber by magnetic levitation using the repulsive force; the substrate transfer module is configured to insert the substrate holder into the substrate processing chamber through the opening to load a substrate; The substrate transport module is an apparatus comprising: a main body portion having the second magnet provided inside; and a support portion extending upward from the top surface of the main body portion and having a substrate holding surface formed on its top surface that forms the substrate holding portion.

8. The support column has a smaller diameter than the substrate, a sensor unit for optically detecting a peripheral portion of a substrate supported by the support column, the peripheral portion being positioned outward from the support column, in an area in which the substrate transfer module can move due to the first magnet being provided on the floor surface portion; 8. The apparatus according to claim 7, wherein the substrate transfer module is configured to align the substrate by moving the substrate to a position where the sensor unit can detect a peripheral edge of the substrate held on the substrate holding surface, and rotating the main body unit around a central axis passing through a center of the substrate.

9. the substrate transfer chamber is configured to transfer the substrate under a vacuum atmosphere; a load lock chamber, the internal pressure of which can be freely switched between atmospheric pressure and vacuum, in which a substrate is temporarily placed for being transferred in and out of the substrate transfer chamber, is connected to a position on the side wall of the substrate transfer chamber different from a position where an opening for connecting the substrate processing chamber is formed; the load lock chamber includes an area in which the substrate transfer module can move by providing the first magnet on a floor surface thereof, and the sensor unit and the substrate transfer module for alignment are disposed in the area; 9. The apparatus according to claim 8, wherein the alignment is performed on the substrate carried into the load lock chamber during a period in which the pressure in the load lock chamber is switched between atmospheric pressure and vacuum.

10. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a floor portion on which a first magnet is provided and a sidewall portion to which the substrate processing chamber is connected and having an opening formed therein through which substrates are transferred in and out of the substrate processing chamber; a substrate transfer module including a substrate holder that holds the substrate and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being movable within the substrate transfer chamber by magnetic levitation using the repulsive force; the substrate transfer module is configured to insert the substrate holder into the substrate processing chamber through the opening to load a substrate; An apparatus comprising an imaging module equipped with a camera that captures images of a moving area in which the first magnet is provided, the imaging module having a magnet for the imaging module that exerts a repulsive force between itself and the first magnet, and the imaging module configured to be movable by magnetic levitation using the repulsive force.

11. a substrate transport device according to any one of claims 1 to 10; a plurality of substrate processing chambers connected to the substrate transfer chamber via a plurality of openings formed in the sidewalls of the substrate processing chambers;

Images