Wiring circuit board

The wiring circuit board addresses stress concentration and cracking issues by employing tapered metal support layers at the ends of the wiring, enhancing rigidity and flexibility, thus preventing structural failures.

JP2025113054APending Publication Date: 2025-08-01NITTO DENKO CORP
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2024007690
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-22
Publication Date
2025-08-01

AI Technical Summary

Technical Problem

Conventional wiring circuit boards experience stress concentration and cracking at the end portions of the wiring due to their asymmetrical thickness and width ratios, leading to potential structural failures.

Method used

The wiring circuit board design incorporates tapered metal support layers at the ends of the wiring portions, increasing rigidity and distributing stress more evenly, thereby reducing the likelihood of cracks.

Benefits of technology

The tapered design enhances the rigidity of the wiring ends, preventing stress concentration and subsequent cracking, while maintaining flexibility by limiting the tapered portion's length to 30% or less of the total wiring length.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025113054000001_ABST
    Figure 2025113054000001_ABST
Patent Text Reader

Abstract

To provide a wiring circuit board that can suppress occurrence of cracks in wiring at an end portion of a wiring portion.SOLUTION: A wiring circuit board 1 includes a plurality of wiring portions 3A, 3B and a first support portion 2A that supports one end portion of each of the wiring portions 3A, 3B. Each of the wiring portions 3A, 3B includes a metal support layer 11, a first insulating layer 12, and wiring 133. The metal support layer 11 of each of the wiring portions 3A, 3B includes a first end portion 111 connected to the first support portion 2A, a main body portion 113, and a first tapered portion 114 that widens from the main body portion 113 toward the first end portion 111.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to a wiring circuit board.

Background Art

[0002] Conventionally, a wiring circuit board including a plurality of wiring portions arranged at intervals and a connecting portion connecting the plurality of wiring portions is known (see, for example, Patent Document 1 below).

[0003] In this wiring circuit board, the thickness of the wiring portion is large (more than twice) compared to the width of the wiring portion. Therefore, the wiring portion can move more easily in the width direction than in the thickness direction.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the wiring circuit board as described in Patent Document 1, when the wiring portion moves, stress may concentrate in the vicinity of the end portion (the portion connected to the connecting portion) of the wiring portion. Therefore, cracks may occur in the wiring in the vicinity of the end portion of the wiring portion.

[0006] The present invention provides a wiring circuit board capable of suppressing the occurrence of cracks in the wiring in the vicinity of the end portion of the wiring portion.

Means for Solving the Problems

[0007] The present invention [1] includes a plurality of wiring portions extending in a first direction and arranged at intervals from each other, and a first support portion that supports one end portion of each of the plurality of wiring portions in the first direction. Each of the plurality of wiring portions has a metal support layer, an insulating layer disposed on the metal support layer, and a wiring disposed on the insulating layer and extending in the first direction. The metal support layer of the wiring portion has a first end portion connected to the first support portion, a main body portion disposed away from the first end portion, and a first tapered portion disposed between the first end portion and the main body portion. The width of the first tapered portion widens from the main body portion toward the first end portion, and includes a wiring circuit board.

[0008] According to such a configuration, the metal support layer of the wiring portion has a first tapered portion that widens toward the first end portion in the vicinity of the first end portion connected to the first support portion.

[0009] Therefore, the rigidity in the vicinity of one end portion of the wiring portion can be increased by the first tapered portion.

[0010] Thereby, when the wiring portion moves, it is possible to suppress the stress in the vicinity of one end portion of the wiring portion from concentrating on the wiring. In other words, the stress of the wiring disposed in the vicinity of one end portion of the wiring portion can be relaxed.

[0011] As a result, it is possible to suppress the occurrence of cracks in the wiring in the vicinity of one end portion of the wiring portion.

[0012] The present invention [2] includes the wiring circuit board according to [1] above, in which, in the first direction, the length of the first tapered portion is 30% or less of the total length of the wiring portion.

[0013] According to such a configuration, it is possible to suppress a decrease in the flexibility of the wiring portion.

[0014] The present invention [3] includes the wiring circuit board according to [1] or [2] above, in which the length of the first end portion in the first direction is 200 μm or less.

[0015] The present invention [4] includes any one of the wiring circuit boards [1] to [3] in which the taper ratio of the first tapered portion is 0.0010 or more.

[0016] According to such a configuration, the rigidity in the vicinity of one end portion of the wiring portion can be increased.

[0017] The present invention [5] includes any one of the wiring circuit boards [1] to [4] in which the edge in the width direction of the first tapered portion includes a curve.

[0018] The present invention [6] includes any one of the wiring circuit boards [1] to [4] in which the edge in the width direction of the first tapered portion is a straight line.

[0019] The present invention [7] further includes a second support portion that supports the other end portions of the plurality of wiring portions in the first direction, and the metal support layer of the wiring portion is disposed away from the main body portion and connected to the second support portion. It further has a second end portion to be connected and a second tapered portion disposed between the second end portion and the main body portion, and the width of the second tapered portion widens from the main body portion toward the second end portion. It includes any one of the wiring circuit boards [1] to [6].

[0020] According to such a configuration, the metal support layer of the wiring portion has a second tapered portion that widens toward the second end portion in the vicinity of the second end portion connected to the second support portion.

[0021] Therefore, the rigidity in the vicinity of the other end portion of the wiring portion can be increased by the second tapered portion.

[0022] Thereby, when the wiring portion moves, it is possible to suppress the concentration of stress in the vicinity of the other end portion of the wiring portion on the wiring. In other words, the stress of the wiring disposed in the vicinity of the other end portion of the wiring portion can be relaxed.

[0023] As a result, it is possible to suppress the occurrence of cracks in the wiring in the vicinity of the other end portion of the wiring portion.

[0024] The wiring circuit board according to the present invention [8] includes the wiring circuit board according to [7] above, in which, in the first direction, the length of the second tapered portion is 30% or less of the total length of the wiring portion.

[0025] According to such a configuration, it is possible to suppress a decrease in the flexibility of the wiring portion.

[0026] The wiring circuit board according to the present invention [9] includes the wiring circuit board according to [7] or [8] above, in which the length of the second end portion in the first direction is 200 μm or less.

[0027] The wiring circuit board according to the present invention

[10] includes any one of the wiring circuit boards according to [7] to [9] above, in which the taper ratio of the second tapered portion is 0.0010 or more.

[0028] According to such a configuration, it is possible to increase the rigidity in the vicinity of the other end portion of the wiring portion.

[0029] The wiring circuit board according to the present invention

[11] includes any one of the wiring circuit boards according to [7] to

[10] above, in which the edge in the width direction of the second tapered portion includes a curve.

[0030] The wiring circuit board according to the present invention

[12] includes any one of the wiring circuit boards according to [7] to

[10] above, in which the edge in the width direction of the second tapered portion is a straight line.

[0031] The wiring circuit board according to the present invention

[13] includes any one of the wiring circuit boards according to [1] to

[12] above, in which each of the plurality of wiring portions has a plurality of wirings.

[0032] According to such a configuration, it is possible to suppress the occurrence of cracks in all the wirings provided in the wiring portion.

Advantages of the Invention

[0033] According to the wiring circuit board of the present invention, it is possible to suppress the occurrence of cracks in the wiring in the vicinity of the end portion of the wiring portion.

Brief Description of the Drawings

[0034]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

DETAILED DESCRIPTION OF THE INVENTION

[0035] 1. Wiring Circuit Board As shown in Figure 1, the wiring circuit board 1 includes a plurality of support portions 2 (a first support portion 2A and a second support portion 2B) and a plurality of wiring portions 3A, 3B.

[0036] The first support portion 2A and the second support portion 2B are arranged at intervals in the first direction. The first direction is the direction in which the wiring 133A described later extends. The first direction is orthogonal to the thickness direction of the wiring circuit board 1. Each of the first support portion 2A and the second support portion 2B extends in the second direction. The second direction is orthogonal to the thickness direction and intersects the first direction. In the present embodiment, the second direction is orthogonal to both the thickness direction and the first direction. The first support portion 2A supports one end portion of each of the wiring portions 3A and 3B in the first direction. Terminals 131A and 131B of the conductor pattern 13 described later are arranged on the first support portion 2A. The second support portion 2B supports the other end portion of each of the wiring portions 3A and 3B in the first direction. Terminals 132A and 132B of the conductor pattern 13 described later are arranged on the second support portion 2B.

[0037] The wiring portions 3A and 3B are arranged between the first support portion 2A and the second support portion 2B in the first direction. In the present embodiment, each of the wiring portions 3A and 3B extends in the first direction. One end portion of each of the wiring portions 3A and 3B in the first direction is connected to the first support portion 2A. The other end portion of each of the wiring portions 3A and 3B in the first direction is connected to the second support portion 2B. Note that the shape of each of the wiring portions 3A and 3B is not limited. Each of the wiring portions 3A and 3B may be linear or curved. The wiring portions 3A and 3B are arranged side by side in the second direction. In other words, the wiring portions 3A and 3B are arranged side by side in a direction orthogonal to the direction in which the wiring portion 3A extends. The wiring portions 3A and 3B are arranged at intervals in the second direction. In other words, the wiring portions 3A and 3B are arranged at intervals in a direction orthogonal to the direction in which the wiring portion 3A extends. At least a part of the wiring 133A of the conductor pattern 13 described later is arranged on the wiring portion 3A. At least a part of the wiring 133B of the conductor pattern 13 described later is arranged on the wiring portion 3B.

[0038] The distance D between the wiring portion 3A and the wiring portion 3B is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0039] As shown in FIG. 2, the wiring circuit board 1 includes a metal support layer 11, a first insulating layer 12 as an example of an insulating layer, a conductor pattern 13, and a second insulating layer 14.

[0040] (1) Metal support layer The metal support layer 11 is disposed on the support portions 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A, 3B. That is, each of the wiring portions 3A, 3B has the metal support layer 11. The metal support layer 11 supports the first insulating layer 12, the conductor pattern 13, and the second insulating layer 14. The metal support layer 11 is made of metal. Examples of the material of the metal support layer 11 include copper, nickel, cobalt, iron, and alloys thereof. Examples of the alloy include copper alloy. Preferably, the material of the metal support layer 11 is copper alloy.

[0041] (2) First insulating layer The first insulating layer 12 is disposed on the support portions 2 (the first support portion 2A, the second support portion 2B) and the wiring portions 3A, 3B. That is, each of the wiring portions 3A, 3B has the first insulating layer 12. The first insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction of the metal support layer 11. The first insulating layer 12 is disposed on the metal support layer 11. Specifically, the first insulating layer 12 is disposed on one surface of the metal support layer 11 in the thickness direction. The first insulating layer 12 is disposed between the metal support layer 11 and the conductor pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the conductor pattern 13. The first insulating layer 12 is made of resin. Examples of the resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0042] (3) Conductor pattern The conductor pattern 13 is disposed on one side of the first insulating layer 12 in the thickness direction. The conductor pattern 13 is disposed on one surface of the first insulating layer 12 in the thickness direction. That is, the wirings 133A and 133B are disposed on the first insulating layer 12. The conductor pattern 13 is disposed on the opposite side of the metal support layer 11 with respect to the first insulating layer 12 in the thickness direction. The shape of the conductor pattern 13 is not limited.

[0043] As shown in FIG. 1, the conductor pattern 13 includes a plurality of terminals 131A and 131B, a plurality of terminals 132A and 132B, and a plurality of wirings 133A and 133B.

[0044] The terminals 131A and 131B are disposed on the first support portion 2A. Each of the terminals 131A and 131B has a square land shape. The terminals 131A and 131B are arranged in the second direction. The terminals 131A and 131B are spaced apart from each other in the second direction.

[0045] The terminals 132A and 132B are disposed on the second support portion 2B. Each of the terminals 132A and 132B has a square land shape. The terminals 132A and 132B are arranged in the second direction. The terminals 132A and 132B are spaced apart from each other in the second direction.

[0046] The wiring 133A electrically connects the terminal 131A and the terminal 132A. One end portion of the wiring 133A is connected to the terminal 131A. The other end portion of the wiring 133A is connected to the terminal 132A. At least a part of the wiring 133A is disposed in the wiring portion 3A. That is, the wiring portion 3A has the wiring 133A. The wiring 133A extends in the first direction.

[0047] The wiring 133B electrically connects the terminal 131B and the terminal 132B. One end of the wiring 133B is connected to the terminal 131B. The other end of the wiring 133B is connected to the terminal 132B. At least a part of the wiring 133B is arranged in the wiring part 3B. That is, the wiring part 3B has the wiring 133B. The wiring 133B extends in the first direction. The wirings 133A and 133B are arranged side by side in the second direction. The wirings 133A and 133B are arranged at intervals from each other in the second direction.

[0048] (4) Second insulating layer As shown in FIG. 2, the second insulating layer 14 covers all the wirings 133A and 133B. The second insulating layer 14 is arranged above the first insulating layer 12 in the thickness direction. Note that the second insulating layer 14 does not cover the terminals 131A, 131B, 132A, and 132B. The second insulating layer 14 is made of resin. Examples of the resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0049] 2. Details of the metal support layer of the wiring part Next, with reference to FIGS. 3 to 5, the details of the metal support layer 11 of the wiring part 3A will be described. Note that the wiring part 3B has the same structure as the wiring part 3A. The description of the metal support layer 11 of the wiring part 3B is omitted.

[0050] As shown in FIG. 3, the thickness T of the metal support layer 11 of the wiring part 3A is larger than the width W.

[0051] Note that the "width" is the maximum length in the width direction that is orthogonal to both the extending direction and the thickness direction of the wiring part 3A. In the present embodiment, the width direction is the same direction as the second direction. The width direction may be a direction different from the second direction.

[0052] The thickness T of the metal support layer 11 is, for example, 10 μm to 300 μm, preferably 50 μm to 250 μm.

[0053] The metal support layer 11 is thicker than the wiring 133A (see FIG. 1). The width W of the metal support layer 11 is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0054] Throughout the entire wiring portion 3A, the ratio (T / W) of the thickness T to the width W of the metal support layer 11 is, for example, 2 or more, preferably 3 or more. Hereinafter, the ratio (T / W) is defined as the aspect ratio of the metal support layer 11.

[0055] When the aspect ratio (T / W) of the metal support layer 11 is equal to or greater than the above lower limit value, the rigidity of the wiring portion 3A in the thickness direction can be ensured.

[0056] The aspect ratio (T / W) of the metal support layer 11 is, for example, 30 or less, preferably 10 or less.

[0057] The aspect ratio (T / W) of the metal support layer 11 may be 2 to 30, or 3 to 10.

[0058] As shown in FIG. 4, the metal support layer 11 of the wiring portion 3A has a first end portion 111, a second end portion 112, a main body portion 113, a first tapered portion 114, and a second tapered portion 115.

[0059] (1) The first end The first end portion 111 is connected to the first support portion 2A. As shown in FIG. 5, the first end portion 111 is disposed between the first support portion 2A and the first tapered portion 114 in the first direction. One edge E of the first end portion 111 in the width direction curves toward one side in the width direction from the first tapered portion 114 toward the first support portion 2A. The other edge (not shown) of the first end portion 111 in the width direction curves toward the other side in the width direction from the first tapered portion 114 toward the first support portion 2A.

[0060] The length L of the first end portion 111 in the first direction is, for example, 200 μm or less, preferably 100 μm or less.

[0061] (2) The second end As shown in FIG. 4, the second end portion 112 is connected to the second support portion 2B. The second end portion 112 is disposed between the second support portion 2B and the second tapered portion 115 in the first direction. One edge (not shown) of the second end portion 112 in the width direction curves toward one side in the width direction from the second tapered portion 115 toward the second support portion 2B. The other edge (not shown) of the second end portion 112 in the width direction curves toward the other side in the width direction from the second tapered portion 115 toward the second support portion 2B.

[0062] The length of the second end portion 112 in the first direction is, for example, 200 μm or less, preferably 100 μm or less.

[0063] (3) Main body portion The main body portion 113 is disposed between the first end portion 111 and the second end portion 112 in the first direction. The main body portion 113 is disposed away from the first end portion 111 and the second end portion 112 in the first direction. The main body portion 113 extends in the first direction. The main body portion 113 has no taper. Specifically, one edge E1 of the main body portion 113 in the width direction extends substantially parallel to the other edge E2 of the main body portion 113 in the width direction.

[0064] (4) First tapered portion The first tapered portion 114 is disposed between the first end portion 111 and the main body portion 113 in the first direction. The width of the first tapered portion 114 widens from the main body portion 113 toward the first end portion 111. Specifically, one end portion of the first tapered portion 114 in the first direction is connected to the first end portion 111 (see FIG. 5). The other end portion of the first tapered portion 114 in the first direction is connected to the main body portion 113. The width W11 of one end portion of the first tapered portion 114 in the first direction is wider than the width W12 of the other end portion of the first tapered portion 114 in the first direction. The width W12 is the same as the width W1 of the main body portion 113. One edge E11 of the first tapered portion 114 in the width direction and the other edge E12 of the first tapered portion 114 in the width direction extend away from each other from the main body portion 113 toward the first end portion 111. Each of the edges E11 and E12 in the width direction of the first tapered portion 114 is a straight line.

[0065] In the first direction, the length L1 of the first tapered portion 114 is, for example, 30% or less, preferably 20% or less of the total length L0 of the wiring portion 3A. When the length L1 of the first tapered portion 114 is equal to or less than the above upper limit value, it is possible to suppress a decrease in the flexibility of the wiring portion 3A. The length L1 of the first tapered portion 114 is, for example, 5% or more, preferably 10% or more of the total length L0 of the wiring portion 3A. When the length L1 of the first tapered portion 114 is equal to or more than the above lower limit value, the rigidity in the vicinity of one end portion of the wiring portion 3A in the first direction can be increased.

[0066] The length L1 of the first tapered portion 114 may be 5% - 30%, or 10% - 20% of the total length L0 of the wiring portion 3A.

[0067] The taper ratio (=(W11 - W12) / L1) of the first tapered portion 114 is, for example, 0.0010 or more, preferably 0.0050 or more. When the taper ratio of the first tapered portion 114 is equal to or more than the above lower limit value, the rigidity in the vicinity of one end portion of the wiring portion 3A in the first direction can be increased. The taper ratio of the first tapered portion 114 is, for example, 0.0300 or less, preferably 0.0200 or less. When the taper ratio of the first tapered portion 114 is equal to or less than the above upper limit value, it is possible to suppress a decrease in the flexibility of the wiring portion 3A.

[0068] The taper ratio of the first tapered portion 114 may be 0.0010 - 0.0300, or 0.0050 - 0.0200.

[0069] The ratio (W11 / W0) of the width W11 of one end portion of the first tapered portion 114 in the first direction to the width W0 of the wiring 133A (see FIG. 1) is, for example, 20 or less, preferably 15 or less. The ratio (W11 / W0) is, for example, 0.1 or more.

[0070] (5) Second tapered portion The second tapered portion 115 is disposed between the second end portion 112 and the main body portion 113 in the first direction. The width of the second tapered portion 115 widens from the main body portion 113 toward the second end portion 112. Specifically, one end portion of the second tapered portion 115 in the first direction is connected to the main body portion 113. The other end portion of the second tapered portion 115 in the first direction is connected to the second end portion 112. The width W21 of the other end portion of the second tapered portion 115 in the first direction is wider than the width W22 of one end portion of the second tapered portion 115 in the first direction. The width W22 is the same as the width W1 of the main body portion 113. One edge E21 of the second tapered portion 115 in the width direction and the other edge E22 of the second tapered portion 115 in the width direction extend away from each other from the main body portion 113 toward the second end portion 112. Each of the edges E21 and E22 in the width direction of the second tapered portion 115 is a straight line.

[0071] In the first direction, the length L2 of the second tapered portion 115 is, for example, 30% or less, preferably 20% or less, of the total length L0 of the wiring portion 3A. When the length L2 of the second tapered portion 115 is equal to or less than the above upper limit value, it is possible to suppress a decrease in the flexibility of the wiring portion 3A. The length L2 of the second tapered portion 115 is, for example, 5% or more, preferably 10% or more, of the total length L0 of the wiring portion 3A. When the length L2 of the second tapered portion 115 is equal to or more than the above lower limit value, it is possible to increase the rigidity in the vicinity of the other end portion of the wiring portion 3A in the first direction.

[0072] The length L2 of the second tapered portion 115 may be 5% - 30%, or 10% - 20%, of the total length L0 of the wiring portion 3A.

[0073] The taper ratio (=(W21 - W22) / L2) of the second tapered portion 115 is, for example, 0.0010 or more, preferably 0.0050 or more. When the taper ratio of the second tapered portion 115 is equal to or more than the above lower limit value, it is possible to increase the rigidity in the vicinity of the other end portion of the wiring portion 3A in the first direction. The taper ratio of the second tapered portion 115 is, for example, 0.0300 or less, preferably 0.0200 or less. When the taper ratio of the second tapered portion 115 is equal to or less than the above upper limit value, it is possible to suppress a decrease in the flexibility of the wiring portion 3A.

[0074] The taper ratio of the second taper portion 115 may be 0.0010 to 0.0300, or 0.0050 to 0.0200.

[0075] With respect to the width W0 of the wiring 133A (see FIG. 1), the ratio (W21 / W0) of the width W21 of the other end portion of the second taper portion 115 in the first direction is, for example, 20 or less, preferably 15 or less. The ratio (W21 / W0) is, for example, 0.1 or more.

[0076] 2. Operational Effects (1) According to the wiring circuit board 1, as shown in FIG. 4, the metal support layer 11 of the wiring portion 3A has a first taper portion 114 that widens toward the first end portion 111 in the vicinity of the first end portion 111 connected to the first support portion 2A, and a second taper portion 115 that widens toward the second end portion 112 in the vicinity of the second end portion 112 connected to the second support portion 2B.

[0077] Therefore, the first taper portion 114 can increase the rigidity in the vicinity of one end portion of the wiring portion 3A, and the second taper portion 115 can increase the rigidity in the vicinity of the other end portion of the wiring portion 3A.

[0078] Thereby, when the wiring portion 3A moves, it is possible to suppress the concentration of stress in the vicinity of the end portion of the wiring portion 3A on the wiring 133A (see FIG. 1). In other words, the stress of the wiring 133A disposed in the vicinity of the end portion of the wiring portion 3A can be relaxed.

[0079] As a result, it is possible to suppress the occurrence of cracks in the wiring 133A in the vicinity of the end portion of the wiring portion 3A.

[0080] (2) According to the wiring circuit board 1, as shown in FIG. 4, in the first direction, each of the length L1 of the first taper portion 114 and the length L2 of the second taper portion 115 is 30% or less of the total length L0 of the wiring portion 3A.

[0081] Therefore, it is possible to suppress a decrease in the flexibility of the wiring portion 3A.

[0082] (3) According to the wiring circuit board 1, as shown in FIG. 4, the taper ratio of the first taper portion 114 is 0.0010 or more.

[0083] Therefore, the rigidity in the vicinity of one end portion of the wiring portion 3A can be increased.

[0084] Also, the taper ratio of the second taper portion 115 is 0.0010 or more.

[0085] Therefore, the rigidity in the vicinity of the other end portion of the wiring portion 3A can be increased.

[0086] 3. Modification Next, a modification will be described. In the modification, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0087] (1) As shown in FIG. 6, the first end portion 111 may extend straight in the first direction. The length L of the first end portion 111 may exceed 100 μm.

[0088] (2) As shown in FIGS. 7A and 7B, the edges E11 and E12 in the width direction of the first taper portion 114 may include curves.

[0089] For example, as shown in FIG. 7A, the edges E11 and E12 may curve outward in the width direction in an exponential function shape as they approach the first end portion 111.

[0090] Also, as shown in FIG. 7B, the edges E11 and E12 may bulge outward in the width direction in a parabolic shape as they approach the first end portion 111.

[0091] The same applies to the second taper portion 115 (see FIG. 4). That is, the edges E21 and E22 in the width direction of the second taper portion 115 may also include curves.

[0092] (3) As shown in FIG. 8, each of the wiring portions 3A and 3B may have a plurality of wirings 203A and 203B. Specifically, the wiring circuit board 1 has a conductor pattern 20 instead of the conductor pattern 13. The conductor pattern 20 has a plurality of terminals 201A, 201B, 201C, 201D, a plurality of terminals 202A, 202B, 202C, 202D, and a plurality of wirings 203A, 203B, 203C, 203D.

[0093] The terminals 201A, 201B, 201C, and 201D are arranged on the first support portion 2A. The terminals 201A, 201B, 201C, and 201D are arranged in the second direction. The terminals 201A, 201B, 201C, and 201D are arranged at intervals from each other in the second direction.

[0094] The terminals 202A, 202B, 202C, and 202D are arranged on the second support portion 2B. The terminals 202A, 202B, 202C, and 202D are arranged in the second direction. The terminals 202A, 202B, 202C, and 202D are arranged at intervals from each other in the second direction.

[0095] The wiring 203A electrically connects the terminal 201A and the terminal 202A. The wiring 203B electrically connects the terminal 201B and the terminal 202B. The wirings 203A and 203B are arranged in the second direction. The wirings 203A and 203B are arranged at intervals from each other in the second direction. The wiring 203A and the wiring 20,3B are arranged in the wiring portion 3A.

[0096] The wiring 203C electrically connects the terminal 201C and the terminal 202C. The wiring 203D electrically connects the terminal 201D and the terminal 202D. The wirings 203C and 203D are arranged in the second direction. The wirings 203C and 203D are arranged at intervals from each other in the second direction. The wiring 203C and the wiring 203D are arranged in the wiring portion 3B.

[0097] According to this modification example, it is possible to suppress the occurrence of cracks in all of the wirings 203A, 203B, 203C, and 203D provided in the wiring portion 3A or the wiring portion 3B.

[0098] (4) The wiring portion 3A may have a plurality of conductor layers (for example, a first conductor layer 30A and a second conductor layer 30B).

[0099] For example, as shown in FIG. 9, the conductor pattern 30 may have a first conductor layer 30A and a second conductor layer 30B. In other words, each of the terminals 301A, 302A, and the wiring 303A has the first conductor layer 30A and the second conductor layer 30B. The first conductor layer 30A is disposed on the first insulating layer 12. The second conductor layer 30B is disposed on the first conductor layer 30A.

[0100] (5) As shown in FIG. 10, the wiring portion 3A may have an intermediate insulating layer 41 between the first conductor layer 30A and the second conductor layer 30B. The intermediate insulating layer 41 is disposed on the first insulating layer 12. The intermediate insulating layer 41 covers the first conductor layer 30A. The second insulating layer 14 is disposed on the intermediate insulating layer 41. The second insulating layer 14 covers the second conductor layer 30B. The second conductor layer 30B is, for example, a signal wiring, and the first conductor layer 30A is, for example, a shield conductor layer.

[0101] Also in this modification, as in the above-described embodiment, the metal support layer 11 of the wiring portion 3A has a first end portion 111, a second end portion 112, a main body portion 113, a first tapered portion 114, and a second tapered portion 115.

[0102] (6) As shown in FIG. 11, the wiring 133A may have a first portion 1331, a second portion 1332, a third portion 1333, a fourth portion 1334, and a fifth portion 1335.

[0103] The first portion 1331, the second portion 1332, and the third portion 1333 are disposed in the wiring portion 3A. The first portion 1331, the second portion 1332, and the third portion 1333 are disposed between the first support portion 2A and the second support portion 2B in the first direction.

[0104] The first part 1331 is disposed in the first direction at one end of the wiring portion 3A and in its vicinity. The first part 1331 overlaps with the first tapered portion 114 of the metal support layer 11. The first part 1331 is disposed between the first support portion 2A and the third part 1333 in the first direction. The first part 1331 is connected to the first support portion 2A. Specifically, one end of the first part 1331 in the first direction is connected to the fourth part 1334 of the wiring 133A. The first part 1331 is thinner than the third part 1333.

[0105] The second part 1332 is disposed in the first direction at the other end of the wiring portion 3A and in its vicinity. The second part 1332 overlaps with the second tapered portion 115 of the metal support layer 11. The second part 1332 is disposed between the second support portion 2B and the third part 1333 in the first direction. The second part 1332 is connected to the second support portion 2B. Specifically, one end of the second part 1332 in the first direction is connected to the fifth part 1335 of the wiring 133A. The second part 1332 is thinner than the third part 1333. The width of the second part 1332 may be the same as the width of the first part 1331.

[0106] The third part 1333 is disposed between the first part 1331 and the second part 1332 in the first direction. The third part 1333 overlaps with the main body portion 113 of the metal support layer 11. One end of the third part 1333 in the first direction is connected to the first part 1331. The other end of the third part 1333 in the first direction is connected to the second part 1332.

[0107] The fourth part 1334 is disposed on the first support portion 2A. One end of the fourth part 1334 in the first direction is connected to the terminal 131A. The other end of the fourth part 1334 in the first direction is connected to the first part 1331. The width of the fourth part 1334 may be the same as the width of the third part 1333.

[0108] The fifth part 1335 is arranged on the second support part 2B. One end of the fifth part 1335 in the first direction is connected to the second part 1332. The other end of the fifth part 1335 in the first direction is connected to the terminal 132A. The width of the fifth part 1335 may be the same as the width of the third part 1333.

[0109] In this modification, in the vicinity of one end of the wiring part 3A, the metal support layer 11 has the first tapered part 114, and the wiring 133A has the first part 1331.

[0110] Also, in the vicinity of the other end of the wiring part 3A, the metal support layer 11 has the second tapered part 115, and the wiring 133A has the second part 1332.

[0111] The first part 1331 and the second part 1332 are thinner than the third part 1333.

[0112] Therefore, when the wiring part 3A moves, it is possible to further suppress the concentration of stress in the vicinity of the end of the wiring part 3A on the first part 1331 and the second part 1332.

[0113] As a result, it is possible to further suppress the occurrence of cracks in the wiring 133A in the vicinity of the end of the wiring part 3A.

[0114] (7) The wiring circuit board 1 may have three or more support parts 2. For example, as shown in FIG. 12, in addition to the first support part 2A, the second support part 2B, and the plurality of wiring parts 3A, 3B described above, the wiring circuit board 1 may have a third support part 2C and a plurality of wiring parts 50A, 50B.

[0115] In this case, the terminals 132A, 132B are not arranged on the second support part 2B but on the third support part 2C. Each of the wirings 133A, 133B extends from the first support part 2A, passes through the second support part 2B, and reaches the third support part 2C. Intermediate portions of each of the wirings 133A, 133B are arranged on the second support part 2B.

[0116] The third support portion 2C is arranged on the opposite side of the first support portion 2A with respect to the second support portion 2B in the first direction. In other words, the second support portion 2B is arranged between the first support portion 2A and the third support portion 2C in the first direction. The third support portion 2C extends in the second direction. The third support portion 2C supports the respective other ends of the wiring portions 50A and 50B in the first direction. Note that one end of each of the wiring portions 50A and 50B in the first direction is supported by the second support portion 2B.

[0117] The wiring portion 50A has the same structure as the wiring portion 3A. Specifically, the metal support layer 11 of the wiring portion 50A has a first end portion 111, a second end portion 112, a main body portion 113, a first tapered portion 114, and a second tapered portion 115, similar to the metal support layer 11 of the wiring portion 3A.

[0118] The first end portion 111 of the wiring portion 50A is arranged at one end of the wiring portion 50A in the first direction. The first end portion 111 of the wiring portion 50A is connected to the second support portion 2B in the first direction. The first end portion 111 of the wiring portion 50A is arranged between the second support portion 2B and the first tapered portion 114 in the first direction.

[0119] The second end portion 112 of the wiring portion 50A is arranged at the other end of the wiring portion 50A in the first direction. The second end portion 112 of the wiring portion 50A is connected to the third support portion 2C in the first direction. The second end portion 112 of the wiring portion 50A is arranged between the third support portion 2C and the second tapered portion 115 in the first direction.

[0120] In this modification, the middle portions of the wirings 133A and 133B can be supported by the second support portion 2B.

[0121] (8) In the above-described embodiment, the wiring circuit board 1 includes the conductor pattern 13 on one side of the metal support substrate 11 in the thickness direction, and does not include the conductor pattern 13 on the other side of the metal support substrate 11. In this regard, the wiring circuit board 1 may also include the conductor pattern 13 on the other side of the metal support substrate 11 in the thickness direction. That is, the wiring circuit board 1 may include a first conductor pattern disposed on one side of the metal support substrate 11 in the thickness direction and a second conductor pattern disposed on the other side of the metal support substrate 11 in the thickness direction.

[0122] (9) Even in Modifications (1) to (8), the same operational effects as those of the above-described embodiment can be obtained.

Explanation of Reference Numerals

[0123] 1 Wiring circuit board 2A First support portion 2B Second support portion 3A Wiring portion 3B Wiring portion 11 Metal support layer 12 First insulating layer (an example of an insulating layer) 133A Wiring 133B Wiring 111 First end portion 112 Second end portion 113 Body portion 114 First tapered portion 115 Second tapered portion

Claims

1. A plurality of wiring portions extending in a first direction and arranged at intervals from each other, A first support portion that supports one end portion of each of the plurality of wiring portions in the first direction, Comprising, Each of the plurality of wiring portions, A metal support layer, An insulating layer disposed on the metal support layer, A wiring disposed on the insulating layer and extending in the first direction, Having, The metal support layer of the wiring portion, A first end portion connected to the first support portion, A main body portion disposed away from the first end portion, A first tapered portion disposed between the first end portion and the main body portion, Having, The width of the first tapered portion widens from the main body portion toward the first end portion. A wiring circuit board.

2. In the first direction, the length of the first tapered portion is 30% or less of the total length of the wiring portion. The wiring circuit board according to claim 1.

3. The length of the first end portion in the first direction is 200 μm or less. The wiring circuit board according to claim 1.

4. The taper ratio of the first tapered portion is 0.0010 or more. The wiring circuit board according to claim 1.

5. The edges in the width direction of the first tapered portion include a curve. The wiring circuit board according to claim 1.

6. The edges in the width direction of the first tapered portion are straight lines. The wiring circuit board according to claim 1.

7. The wiring circuit board, Further includes a second support portion that supports the other end portion of each of the plurality of wiring portions in the first direction, The metal support layer of the wiring portion, A second end portion disposed away from the main body portion and connected to the second support portion, A second tapered portion disposed between the second end portion and the main body portion, Further having, The width of the second tapered portion widens from the main body portion toward the second end portion. The wiring circuit board according to any one of claims 1 to 6.

8. In the first direction, the length of the second tapered portion is 30% or less of the total length of the wiring portion. The wiring circuit board according to claim 7.

9. The length of the second end portion in the first direction is 200 μm or less. The wiring circuit board according to claim 7.

10. The taper ratio of the second tapered portion is 0.0010 or more. The wiring circuit board according to claim 7.

11. The edges in the width direction of the second tapered portion include a curve. The wiring circuit board according to claim 7.

12. The edges in the width direction of the second tapered portion are straight lines. The wiring circuit board according to claim 7.

13. The wiring circuit board according to claim 1, wherein each of the plurality of wiring portions has a plurality of wirings.

Citation Information

Patent Citations

  • Wiring circuit board

    JP2019212656A