Multilayer electronic component and method of manufacturing the same

Abstract

To provide a multilayer electronic component having excellent reliability.SOLUTION: One embodiment of the present invention provides a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces, and opposing each other in a second direction, and fifth and sixth surfaces connected to the first surface to the fourth surface and opposing each other in a third direction; and an external electrode including a connection portion disposed on the third or fourth surface and a band portion extending from the connection portion to portions of the first and second surfaces. The external electrode includes: a sputtered layer disposed in the connection portion and contacting the internal electrode and including Cu; an oxide layer disposed on the sputtered layer and including a Cu oxide; and a conductive polymer layer disposed in the band portion and including a polymer material.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component and a method for manufacturing the same.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, and mobile phones, and serves to charge or discharge electricity. The MLCC can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount.

[0003] The external electrodes of the MLCC generally consist of a Cu sintered electrode and a plating layer formed on the sintered electrode. On the other hand, when the MLCC is mounted on a printed circuit board, the MLCC may be subjected to impact, and cracks generated by such impact may reduce the reliability of the MLCC.

[0004] In order to solve such problems, in the case of automotive / industrial MLCCs, external electrodes with a conductive resin layer containing metal particles and a resin such as epoxy resin formed on the Cu sintered electrode may be used.

[0005] However, in the case of small IT MLCCs, if the above-mentioned conductive resin layer is applied, the thickness of the external electrode may increase, which may reduce the capacitance per unit volume of the MLCC. Therefore, research on the structure of the external electrode that can suppress the generation of cracks during mounting while not reducing the capacitance per unit volume of the MLCC is necessary.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the various objects of the present invention is to provide a laminated electronic component with excellent reliability.

[0007] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0008] One embodiment of the present invention includes a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween, a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected from the first surface to the fourth surface and facing each other in a third direction, a main body including the above, a connection portion disposed on the third surface or the fourth surface, and an external electrode including a band portion extending from the connection portion to a part of the first surface and the second surface. The external electrode is disposed on the connection portion and contacts the internal electrode, and provides a laminated electronic component including a sputtering layer containing Cu, an oxide layer disposed on the sputtering layer and containing an oxide of Cu, and a conductive polymer layer disposed on the band portion and containing a polymer substance.

[0009] One embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer, a step of preparing a main body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected from the first surface to the fourth surface and facing each other in a third direction, a first step of forming a Cu film on the third surface and the fourth surface through a sputtering method, and a second step of applying a polymer composition to at least one of the first surface and the second surface, and provides a method for manufacturing a laminated electronic component including an electrode formation step of performing the first step and the second step sequentially or in reverse order, and a heat treatment step of heat-treating the main body after the electrode formation step to oxidize the outer surface of the Cu film.

Effects of the Invention

[0010] As one of the various effects of the present invention, it is possible to provide a laminated electronic component with excellent reliability.

Brief Description of the Drawings

[0011]

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Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0013] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present invention, and the sizes and thicknesses of the illustrated components are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the illustration. Also, components having the same function within the scope of the same idea are described using the same reference numerals. Further, throughout the specification, when a certain part “includes” a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0014] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0015] Multilayer electronic component FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a cut cross-section along the line I-I' of FIG. 1, FIG. 3 is a cross-sectional view schematically showing a cut cross-section along the line II-II' of FIG. 1, FIG. 4 is a cross-sectional view schematically showing a cut cross-section along the line III-III' of FIG. 1, FIG. 5 is a cross-sectional view schematically showing a cut cross-section along the line IV-IV' of FIG. 2, and FIG. 6 is a cross-sectional view schematically showing a cut cross-section along the line V-V' of FIG. 2.

[0016] Hereinafter, with reference to FIGS. 1 to 6, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Further, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto, and it can also be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0017] The size of the multilayer electronic component 100 is not particularly limited. The maximum dimension of the multilayer electronic component 100 in the second direction can be, for example, 0.2 mm to 5.0 mm, the maximum dimension of the multilayer electronic component 100 in the third direction can be, for example, 0.2 mm to 5.0 mm, and the maximum dimension of the multilayer electronic component 100 in the first direction can be, for example, 0.04 mm to 0.3 mm.

[0018] The multilayer electronic component 100 can include a main body 110 and external electrodes 131 and 132. There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. The main body 110 does not have a completely straight hexahedron shape, but can have a substantially hexahedron shape.

[0019] The main body 110 can have a first surface and a second surface 1 and 2 facing each other in the first direction, a third surface and a fourth surface 3 and 4 facing each other in the second direction and connected to the first surface and the second surface 1 and 2, and a fifth surface and a sixth surface 5 and 6 facing each other in the third direction.

[0020] The main body 110 can include a first edge EG1 that connects the third surface 3 to the first, second, fifth, and sixth surfaces 1, 2, 5, 6 and a second edge EG2 that connects the fourth surface 4 to the first, second, fifth, and sixth surfaces 1, 2, 5, 6. The first and second edges EG1, EG2 can have a rounded form by performing a separate polishing process. The first through sixth surfaces 1, 2, 3, 4, 5, 6 can be substantially flat surfaces, and regions that are not flat can be regarded as edges.

[0021] The main body 110 can include a dielectric layer 111 and internal electrodes 121, 122 that are alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

[0022] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3 or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5).

[0023] The average thickness of the dielectric layer 111 is not particularly limited. The average thickness of the dielectric layer 111 can be, for example, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0024] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122 that are alternately arranged with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0025] The first internal electrode 121 can be spaced apart from the fourth surface 4 and exposed on the third surface 3 and connected to the first external electrode 131. The second internal electrode 122 can be spaced apart from the third surface 3 and exposed on the fourth surface 4 and connected to the second external electrode 132.

[0026] The conductive metal included in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably can include Ni, but the present invention is not limited thereto.

[0027] The average thickness of the internal electrodes 121 and 122 is not particularly limited. The average thickness of the internal electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0028] The average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 respectively mean the average dimensions of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, after measuring the thicknesses at a number of points on one dielectric layer 111, for example, 30 points at equal intervals in the second direction, the average thickness of the dielectric layer 111 can be measured by taking the average value. Also, after measuring the thicknesses at a number of points on one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, the average thickness of the internal electrodes 121 and 122 can be measured by taking the average value. The 30 points at equal intervals can be specified in the capacitance forming portion Ac. On the other hand, after performing such average value measurements for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average value, the average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 can be further generalized.

[0029] The main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and in which a capacitance is formed including the first and second internal electrodes 121 and 122 that are alternately arranged with each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 that are disposed on both surfaces facing each other in the first direction of the capacitance forming portion Ac. The cover portions 112 and 113 can have a configuration similar to that of the dielectric layer 111 except that they do not include internal electrodes.

[0030] The average thickness of the cover portions 112 and 113 is not particularly limited. The average thickness of the cover portions 112 and 113 can be, for example, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112 and 113 can be, for example, 5 μm or more. Here, the average thickness of the cover portions 112 and 113 means the respective average thicknesses of the first cover portion 112 and the second cover portion 113.

[0031] The average thickness of the cover portions 112 and 113 can mean the average dimension of the cover portions 112 and 113 in the first direction, and can be a value obtained by averaging the dimensions in the first direction measured at five points equally spaced in the second direction in the cross section in the first and second directions cut at the center of the main body 110 in the third direction.

[0032] The main body 110 can include margin portions 114 and 115 respectively disposed on both surfaces facing each other in the third direction of the capacitance forming portion Ac. That is, the margin portions 114 and 115 can mean the regions between the boundaries of the main body 110 and both ends of the internal electrodes 121 and 122 in the cross section in the first and third directions cut at the center of the main body 110 in the second direction. The margin portions 114 and 115 can have a configuration similar to that of the dielectric layer 111, except that they do not include the internal electrodes 121 and 122.

[0033] The average thickness of the margin portions 114 and 115 is not particularly limited. The average thickness of the margin portions 114 and 115 can be, for example, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness of the margin portions 114 and 115 can be, for example, 2 μm or more. Here, the average thickness of the margin portions 114 and 115 means the average thickness of the first margin portion 114 and the second margin portion 115 respectively.

[0034] The average thickness of the margin portions 114 and 115 can mean the average dimension of the margin portions 114 and 115 in the third direction, and can be a value obtained by averaging the dimensions in the third direction measured at five points equally spaced in the first direction in the cross section in the first and third directions cut at the center of the main body 110 in the second direction.

[0035] The external electrodes 131 and 132 can include connection portions A1 and A2 disposed on the third surface 3 or the fourth surface 4, and band portions B1 and B2 extending from the connection portions A1 and A2 to a part of the first surface and the second surface 1 and 2. Further, the external electrodes 131 and 132 can include corner portions C1 and C2 disposed between the connection portions A1 and A2 and the band portions B1 and B2. The external electrodes 131 and 132 can include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0036] The first external electrode 131 can include a first connection portion A1 disposed on the third surface 3, a first band portion B1 extending from the first connection portion A1 to a part of the first surface and the second surface 1 and 2, and a first corner portion C1 disposed between the first connection portion A1 and the first band portion B1. The second external electrode 132 can include a second connection portion A2 disposed on the fourth surface 4, a second band portion B2 extending from the second connection portion A2 to a part of the first surface and the second surface 1 and 2, and a second corner portion C2 disposed between the second connection portion A2 and the second band portion B2.

[0037] The boundary between the first connection portion A1 and the first corner portion C1 can be defined as the point where the third surface 3 contacts the first edge EG1, and the boundary between the second connection portion A2 and the second corner portion C2 can be defined as the point where the fourth surface 4 contacts the second edge EG2. The boundary between the first band portion B1 and the first corner portion C1 can be defined as the point where the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, 6 contact the first edge EG1, and the boundary between the second band portion B2 and the second corner portion C2 can be defined as the point where the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, 6 contact the second edge EG2.

[0038] The external electrodes 131 and 132 can include sputtering layers 131a and 132a disposed at the connection portions A1 and A2 and in contact with the internal electrodes 121 and 122. That is, the first external electrode 131 includes a first sputtering layer 131a disposed at the first connection portion A1 and in contact with the first internal electrode 121, and the second external electrode 132 can include a second sputtering layer 132a disposed at the second connection portion A2 and in contact with the second internal electrode 122.

[0039] The sputtering layers 131a and 132a can serve to electrically connect the internal electrodes 121 and 122 and the external electrodes 131 and 132. Since the sputtering layers 131a and 132a are basically formed by a sputtering method, they can be uniform even if they are thin. Thereby, by thinning the external electrodes 131 and 132, the capacitance per unit volume of the multilayer electronic component 100 can be improved. Also, since the sputtering layers 131a and 132a can ensure a thickness of a certain level or more even at the corner portions C1 and C2 of the external electrodes 131 and 132, penetration of moisture or plating solution from the outside can be effectively blocked. The thickness of the sputtering layers 131a and 132a is not particularly limited and can have a thickness of several tens of nm to several tens of μm.

[0040] On the one hand, since the sputtering layers 131a and 132a are formed by a sputtering method, they can be directly formed on the outer surface of the main body 110 without any separate additional process for the main body 110. For example, when a plating layer is directly formed on the main body 110 through an electrolytic plating method, there may be a problem that the plating layer is not formed on the side surface of the cover portion mainly composed of a ceramic component. On the other hand, in the case of the sputtering method, different from the electrolytic plating method, since no separate metal seed is required, the sputtering layers 131a and 132a can also be uniformly formed on the side surfaces of the cover portions 112 and 113 and on the edges EG1 and EG2 of the main body 110. Thereby, one end of the sputtering layers 131a and 132a can be disposed at the corner portions C1 and C2. Also, the sputtering layers 131a and 132a can be in contact with at least a part of the edges EG1 and EG2 of the main body 110.

[0041] Also, when a plating layer is directly formed on the main body 110 through an electrolytic plating method, there is a possibility that the insulation resistance of the dielectric layer 111 may deteriorate due to the penetration of the acidic solution and the generation of hydrogen during the process of immersing the main body 110 in the acidic solution. On the other hand, in the case of the stacked electronic component 100 according to an embodiment of the present invention, since the sputtering layers 131a and 132a are formed by a sputtering method, the penetration of the acidic solution and the generation of hydrogen can be prevented.

[0042] The sputtering layers 131a and 132a can contain Cu. By the sputtering layers 131a and 132a containing Cu, oxide layers 131b and 132b containing copper oxides can be formed by a heat treatment process described later. Since the sputtering layers 131a and 132a are formed by a sputtering method, among the total content (at%) of the elements constituting the sputtering layers 131a and 132a, the content (at%) of Cu can be 99 at% or more. The sputtering layers 131a and 132a can further contain Ni, but the present invention is not limited thereto. On the other hand, the above Cu content can be calculated from an image scanned using SEM-EDS. Specifically, after polishing the stacked electronic component 100 to the central position in the third direction to expose the cross-sections in the first and second directions, the content (at%) of Cu in the total content of the elements constituting the sputtering layers 131a and 132a can be measured using SEM-EDS.

[0043] On the other hand, since the sputtering layers 131a and 132a are formed by a sputtering method, they can be free of glass components, unlike conventional sintered electrodes. Thereby, the ESR characteristics of the stacked electronic component 100 can be improved compared to the prior art.

[0044] The external electrodes 131 and 132 can include oxide layers 131b and 132b disposed on the sputtering layers 131a and 132a. That is, the first external electrode 131 can include a first oxide layer 131b disposed on the first sputtering layer 131a, and the second external electrode 132 can include a second oxide layer 132b disposed on the second sputtering layer 132a.

[0045] The oxide layers 131b and 132b can contain copper oxides. The types of copper oxides contained in the oxide layers 131b and 132b are not particularly limited, and for example, one or more of Cu2O and CuO can be included. Since the copper oxides have low moisture permeability and hydrogen diffusion coefficient, the oxide layers 131b and 132b can serve to prevent moisture and hydrogen from the outside from penetrating into the interior of the main body 110.

[0046] On the other hand, in the drawings, the oxide layers 131b and 132b are continuously formed on the sputtering layers 131a and 132a and the plating layers 131d and 132d, but the present invention is not limited thereto, and the oxide layers 131b and 132b can be discontinuously formed according to the conditions of the heat treatment step described later. The oxide layers 131b and 132b are disposed at the interfaces between the sputtering layers 131a and 132a and the plating layers 131d and 132d, and can be not disposed at the interfaces between the sputtering layers 131a and 132a and the conductive polymer layers 131c and 132c. Or, the ratio of the total length of the regions where the oxide layers are formed to the total length of the interfaces between the sputtering layers 131a and 132a and the plating layers 131d and 132d can be higher than the ratio of the total length of the regions where the oxide layers are formed to the total length of the interfaces between the sputtering layers 131a and 132a and the conductive polymer layers 131c and 132c.

[0047] The external electrodes 131 and 132 can include the conductive polymer layers 131c and 132c disposed in the band portions B1 and B2. That is, the first external electrode 131 can include the first conductive polymer layer 131c disposed in the first band portion B1, and the second external electrode 132 can include the second conductive polymer layer 132c disposed in the second band portion B2.

[0048] The conductive polymer layers 131c and 132c basically contain a polymer substance, and can play a role in preventing cracks from occurring in the stacked electronic component 100 due to the impact generated when the stacked electronic component 100 is mounted on a printed circuit board. That is, the conductive polymer layers 131c and 132c can reduce the stress applied to the stacked electronic component 100 and improve the impact resistance of the stacked electronic component 100.

[0049] The type of the above polymer substance is not particularly limited. The above polymer substance can be an insulating substance. For example, the above polymer substance can contain an insulating resin. The insulating resin can be, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose. In this case, the conductive polymer layers 131c and 132c can further contain metal particles.

[0050] The metal particles can contain one or more of spherical particles and flake-shaped particles. Here, the spherical particles can also include forms that are not completely spherical. For example, they can include forms with a length ratio of the major axis to the minor axis (major axis / minor axis) of 1.45 or less. The flake-shaped particles mean particles having a flat and elongated form and are not particularly limited. For example, the length ratio of the major axis to the minor axis (major axis / minor axis) can be 1.95 or more. The above metal particles can include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or an alloy containing these.

[0051] Also, the above polymer substance can be a conductive substance. For example, the above polymer substance can contain one or more of polypyrrole, polyaniline, polythiophene, and PEDOT:PSS. In this case, the conductive polymer layers 131c and 132c can be composed of one or more of the conductive polymers of polypyrrole, polyaniline, polythiophene, and PEDOT:PSS and can not contain metal particles.

[0052] The forms of the conductive polymer layers 131c and 132c are not particularly limited. In one embodiment, the conductive polymer layers 131c and 132c can include a first layer 131c1 and 132c1 disposed on the first surface 1, and a second layer 131c2 and 132c2 spaced apart from the first layer 131c1 and 132c1 and disposed on the second surface 2.

[0053] The conductive polymer layers 131c and 132c are disposed, for example, on the first surface and the second surface 1 and 2, but can be not disposed on the fifth surface and the sixth surface 5 and 6. However, the present invention is not limited thereto, and the conductive polymer layers 131c and 132c can also be disposed on a part of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, and 6.

[0054] On the other hand, since the conductive polymer layers 131c and 132c have higher resistance than the sputtering layers 131a and 132a, if the conductive polymer layers 131c and 132c are in direct contact with the internal electrodes 121 and 122, the ESR characteristics of the laminated electronic component 100 may deteriorate. In one embodiment, the conductive polymer layers 131c and 132c can be not disposed on the connection portions A1 and A2. That is, the first conductive polymer layer 131c can be not disposed on the first connection portion A1, and the second conductive polymer layer 132c can be not disposed on the second connection portion A2.

[0055] Also, the structures of the sputtering layers 131a and 132a and the conductive polymer layers 131c and 132c in the corner portions C1 and C2 can be changed according to the order of the first and second steps described later. For example, as shown in FIG. 2, the conductive polymer layers 131c and 132c in the corner portions C1 and C2 can cover one end of the sputtering layers 131a and 132a. That is, the first conductive polymer layer 131c in the first corner portion C1 can cover one end of the first sputtering layer 131a, and the second conductive polymer layer 132c in the second corner portion C2 can cover one end of the second sputtering layer 132a.

[0056] The thicknesses of the conductive polymer layers 131c and 132c are not particularly limited, but can be 0.5 μm or more and 3.0 μm or less. If the thicknesses of the conductive polymer layers 131c and 132c are less than 0.5 μm, the effect of improving the impact resistance of the present invention may be slight. Further, if the thicknesses of the conductive polymer layers 131c and 132c exceed 3.0 μm, the capacitance per unit volume of the laminated electronic component may decrease. Here, the thicknesses of the conductive polymer layers 131c and 132c can mean the dimensions in the first direction measured at the central portion in the second direction of the conductive polymer layers 131c and 132c in the cross-sections in the first and second directions cut at the center in the third direction of the main body 110.

[0057] The external electrodes 131 and 132 can include plating layers 131d and 132d disposed on the oxide layers 131b and 132b and the conductive polymer layers 131c and 132c. The plating layers 131d and 132d can improve the mounting characteristics.

[0058] The plating layers 131d and 132d can include, for example, Ni, Sn, Pd, and / or an alloy containing the same, and can also be formed of a plurality of layers. The plating layers 131d and 132d can be, for example, Ni plating layers or Sn plating layers, or can be in a form in which a Ni plating layer and an Sn plating layer are sequentially formed. Further, the plating layers 131d and 132d can also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0059] In one embodiment, the external electrodes 131 and 132 can include Ni plating layers 131d1 and 132d1 disposed on the oxide layers 131b and 132b at the connection portions A1 and A2 and Sn plating layers 131d2 and 132d2 disposed on the Ni plating layers 131d1 and 132d1 at the band portions B1 and B2.

[0060] The thicknesses of the plating layers 131d and 132d are not particularly limited. For example, the thickness of the Ni plating layers 131d1 and 132d1 can be 2 μm or more and 4 μm or less, and the thickness of the Sn plating layers 131d2 and 132d2 can be 2 μm or more and 4 μm or less. In one embodiment, the thickness of the conductive polymer layers 131c and 132c measured at the band portions B1 and B2 can be smaller than the thickness of the Ni plating layers 131d1 and 132d1 measured at the band portions B1 and B2.

[0061] In the drawings, the laminated electronic component 100 is illustrated as having a structure with two external electrodes 131 and 132, but it is not limited thereto. The number, shape, etc. of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0062] On the other hand, the internal electrodes 121 and 122 can include main portions 121a and 122a and lead portions 121b and 122b that extend from the main portions 121a and 122a to the third surface 3 or the fourth surface 4 and contact the external electrodes 131 and 132. That is, the first internal electrode 121 includes a first main portion 121a and a first lead portion 121b that extends from the first main portion 121a to the third surface 3 and contacts the first external electrode 131, and the second internal electrode 122 can include a second main portion 122a and a second lead portion 122b that extends from the second main portion 122a to the fourth surface 4 and contacts the second external electrode 132.

[0063] In one embodiment, the dimension of the lead portions 121b and 122b in the third direction can be larger than the dimension of the main portions 121a and 122a in the third direction. More specifically, the lead portions 121b and 122b can be exposed on the fifth surface and the sixth surface 5 and 6 of the main body 110. That is, the first lead portion 121b can contact the first external electrode 131 on the third surface, the fifth surface, and the sixth surface 3, 5, and 6, and the second lead portion 122b can contact the second external electrode 132 on the fourth surface, the fifth surface, and the sixth surface 4, 5, and 6. The lead portions 121b and 122b exposed on the fifth surface and the sixth surface 5 and 6 can serve as a metal seed for forming the plating layers 131d and 132d on the fifth surface and the sixth surface 5 and 6.

[0064] However, the present invention is not limited thereto, and the internal electrodes 121 and 122 can also be arranged at a distance from the fifth and sixth surfaces 5 and 6 of the main body 110. FIG. 7 is a modified example of FIG. 3, FIG. 8 is a modified example of FIG. 5, and FIG. 9 is a modified example of FIG. 6. Referring to FIGS. 7 to 9, the first internal electrode 121 contacts the first external electrode 131 on the third surface 3, but can be arranged at a distance from the fifth and sixth surfaces 5 and 6, and the second internal electrode 122 contacts the second external electrode 132 on the fourth surface 4, but can be arranged at a distance from the fifth and sixth surfaces 5 and 6. In this case, unevenness can be formed on a part or all of the fifth and sixth surfaces 5 and 6, but it is not limited thereto.

[0065] FIGS. 10 to 13 are cross-sectional views schematically showing a multilayer electronic component according to another embodiment of the present invention, and are drawings corresponding to FIG. 2. Hereinafter, a multilayer electronic component according to another embodiment of the present invention will be described with reference to FIGS. 10 to 13. For the components having the same / similar configurations as those of the multilayer electronic component 100 described with reference to FIGS. 1 to 6, the same / similar reference numerals are used, and redundant descriptions are omitted.

[0066] Referring to FIG. 10, a multilayer electronic component 200 according to an embodiment of the present invention can include a main body 110 and external electrodes 231 and 232.

[0067] The external electrodes 231 and 232 are arranged at connection portions A1 and A2, contact the internal electrodes 121 and 122, and can include sputtering layers 231a and 232a containing Cu, which are arranged on the sputtering layers 231a and 232a, oxide layers 231b and 232b containing an oxide of Cu, which are arranged at band portions B1 and B2, conductive polymer layers 231c and 232c containing a polymer substance, and plating layers 231d and 232d, which are arranged on the oxide layers 231b and 232b and the conductive polymer layers 231c and 232c.

[0068] The conductive polymer layers 231c and 232c can include, for example, a first layer 231c1 and 232c1 disposed on the first surface, and a second layer 231c2 and 232c2 that are spaced apart from the first layer 231c1 and 232c1 and disposed on the second surface.

[0069] The plating layers 231d and 232d can include Ni plating layers 231d1 and 232d1 disposed on the oxide layers 231b and 232b at the connection portions A1 and A2, and Sn plating layers 231d2 and 232d2 disposed on the Ni plating layers 231d1 and 232d1 at the band portions B1 and B2.

[0070] In the case of the laminated electronic component 200 according to an embodiment of the present invention, one end of the conductive polymer layers 231c and 232c can be disposed at the connection portions A1 and A2. That is, one end of the first conductive polymer layer 231c can be disposed at the first connection portion A1, and one end of the second conductive polymer layer 232c can be disposed at the second connection portion A2. In this case, it is possible to more effectively prevent cracks from occurring in the laminated electronic component 200 due to the impact generated when the laminated electronic component 200 is mounted on a printed circuit board.

[0071] However, in order to prevent the occurrence of a secondary effect in which other electrical characteristics of the laminated electronic component 200 deteriorate, the conductive polymer layers 231c and 232c can be disposed so as not to overlap the internal electrodes 121 and 122 in the second direction. On the other hand, the oxide layers 231b and 232b are disposed at the connection portions A1 and A2, but can be not disposed at the band portions B1 and B2 and the corner portions C1 and C2, but the present invention is not limited thereto.

[0072] Referring to FIG. 11, the laminated electronic component 300 according to an embodiment of the present invention can include a main body 110 and external electrodes 331 and 332.

[0073] The external electrodes 331 and 332 are disposed at the connection portions A1 and A2, contact the internal electrodes 121 and 122, include sputtering layers 331a and 332a containing Cu, are disposed on the sputtering layers 331a and 332a, include oxide layers 331b and 332b containing an oxide of Cu, are disposed at the band portions B1 and B2, include conductive polymer layers 331c and 332c containing a polymer substance, and may include plating layers 331d and 332d disposed on the oxide layers 331b and 332b and the conductive polymer layers 331c and 332c.

[0074] The conductive polymer layers 331c and 332c may include, for example, a first layer 331c1 and 332c1 disposed on a first surface and a second layer 331c2 and 332c2 disposed on a second surface separated from the first layer 331c1 and 332c1.

[0075] The plating layers 331d and 332d may include Ni plating layers 331d1 and 332d1 disposed on the oxide layers 331b and 332b at the connection portions A1 and A2 and Sn plating layers 331d2 and 332d2 disposed on the Ni plating layers 331d1 and 332d1 at the band portions B1 and B2.

[0076] In the case of the stacked electronic component 300 according to an embodiment of the present invention, one end of the sputtering layers 331a and 332a can be disposed at the band portions B1 and B2. For example, one end of the first sputtering layer 331a can be disposed at the first band portion B1, and one end of the second sputtering layer 332a can be disposed at the second band portion B2. For example, the first sputtering layer 331a is disposed on a third surface and can extend on a part of the first surface and the second surface, and the second sputtering layer 332a is disposed on a fourth surface and can extend on a part of the first surface and the second surface.

[0077] The sputtering layers 331a and 332a in the band portions B1 and B2 can be disposed between the main body 110 and the conductive polymer layers 331c and 332c. That is, the first sputtering layer 331a in the first band portion B1 can be disposed between the main body 110 and the first conductive polymer layer 331c, and the second sputtering layer 332a in the second band portion B2 can be disposed between the main body 110 and the second conductive polymer layer 332c. The conductive polymer layers 331c and 332c can cover the ends of the sputtering layers 331a and 332a in the band portions B1 and B2.

[0078] The oxide layers 331b and 332b can be disposed at the connection portions A1 and A2 and the corner portions C1 and C2. The oxide layers 331b and 332b cannot be disposed in the band portions B1 and B2, whereby the ends of the oxide layers 331b and 332b can be disposed at the corner portions C1 and C2, but the present invention is not limited thereto.

[0079] Referring to FIG. 12, a laminated electronic component 400 according to an embodiment of the present invention can include a main body 110 and external electrodes 431 and 432.

[0080] The external electrodes 431 and 432 are disposed at the connection portions A1 and A2 to contact the internal electrodes 121 and 122, and include sputtering layers 431a and 432a containing Cu, oxide layers 431b and 432b containing an oxide of Cu disposed on the sputtering layers 431a and 432a, conductive polymer layers 431c and 432c containing a polymer substance disposed in the band portions B1 and B2, and plating layers 431d and 432d disposed on the oxide layers 431b and 432b and the conductive polymer layers 431c and 432c.

[0081] The conductive polymer layers 431c and 432c can include, for example, a first layer 431c1 and 432c1 disposed on the first surface and a second layer 431c2 and 432c2 disposed on the second surface and spaced apart from the first layer 431c1 and 432c1.

[0082] The plating layers 431d and 432d can include Ni plating layers 431d1 and 432d1 disposed on the oxide layers 431b and 432b at the connection portions A1 and A2, and on the conductive polymer layers 431c and 432c at the band portions B1 and B2, and Sn plating layers 431d2 and 432d2 disposed on the Ni plating layers 431d1 and 432d1.

[0083] In the case of the laminated electronic component 400 according to an embodiment of the present invention, one ends of the sputtering layers 431a and 432a and one ends of the conductive polymer layers 431c and 432c can be respectively disposed at the corner portions C1 and C2. At this time, the sputtering layers 431a and 432a at the corner portions C1 and C2 can cover one ends of the conductive polymer layers 431c and 432c. The conductive polymer layers 431c and 432c can be in contact with at least a part of the edges EG1 and EG2 of the main body 110.

[0084] The oxide layers 431b and 432b can be disposed at the connection portions A1 and A2 and the corner portions C1 and C2. The oxide layers 431b and 432b cannot be disposed at the band portions B1 and B2, whereby the ends of the oxide layers 431b and 432b can be disposed at the corner portions C1 and C2, but the present invention is not limited thereto.

[0085] Referring to FIG. 13, the laminated electronic component 500 according to an embodiment of the present invention can include a main body 110 and external electrodes 531 and 532.

[0086] The external electrodes 531 and 532 are disposed at the connection portions A1 and A2 to contact the internal electrodes 121 and 122, and can include sputtering layers 531a and 532a containing Cu, oxide layers 531b and 532b containing an oxide of Cu disposed on the sputtering layers 531a and 532a, conductive polymer layers 531c and 532c containing a polymer substance disposed at the band portions B1 and B2, and plating layers 531d and 532d disposed on the oxide layers 531b and 532b and the conductive polymer layers 531c and 532c.

[0087] The conductive polymer layers 531c and 532c can include, for example, a first layer 531c1 and 532c1 disposed on the first surface, and a second layer 531c2 and 532c2 that are spaced apart from the first layer 531c1 and 532c1 and disposed on the second surface.

[0088] The plating layers 531d and 532d can include Ni plating layers 531d1 and 532d1 disposed on the oxide layers 531b and 532b at the connection portions A1 and A2, and Sn plating layers 531d2 and 532d2 disposed on the Ni plating layers 531d1 and 532d1 at the band portions B1 and B2.

[0089] In the case of the laminated electronic component 500 according to an embodiment of the present invention, one end of the sputtering layers 531a and 532a can be disposed at the band portions B1 and B2. For example, one end of the first sputtering layer 531a can be disposed at the first band portion B1, and one end of the second sputtering layer 532a can be disposed at the second band portion B2. For example, the first sputtering layer 531a can be disposed on the third surface and extend over a part of the first surface and the second surface, and the second sputtering layer 532a can be disposed on the fourth surface and extend over a part of the first surface and the second surface.

[0090] On the other hand, the conductive polymer layers 531c and 532c at the band portions B1 and B2 can be disposed between the main body 110 and the sputtering layers 531a and 532a. That is, the first conductive polymer layer 531c at the first band portion B1 can be disposed between the main body 110 and the first sputtering layer 531a, and the second conductive polymer layer 532c at the second band portion B2 can be disposed between the main body 110 and the sputtering layer 532a. The sputtering layers 531a and 532a can be disposed so as to cover the conductive polymer layers 531c and 532c disposed at the band portions B1 and B2 and the corner portions C1 and C2.

[0091] The oxide layers 531b and 532b can be disposed at the connection portions A1 and A2, the band portions B1 and B2, and the corner portions C1 and C2. The oxide layers 531b and 532b can be disposed so as to cover the sputtering layers 531a and 532a at the connection portions A1 and A2, the band portions B1 and B2, and the corner portions C1 and C2, but the present invention is not limited thereto.

[0092] FIGS. 14 and 15 are diagrams schematically showing a method for manufacturing a stacked electronic component according to an embodiment of the present invention. Hereinafter, a method for manufacturing the above-described stacked electronic component will be described with reference to FIGS. 1 to 6, FIGS. 14 and 15. In the following description, the method for manufacturing the stacked electronic component 100 shown in FIGS. 1 to 6 will be used as a reference, but the following description can be similarly applied to the methods for manufacturing the stacked electronic components 200, 300, 400, and 500 shown in FIGS. 10 to 13. Therefore, in the following, a separate mention will be made only when an explanation of the methods for manufacturing the stacked electronic components 200, 300, 400, and 500 shown in FIGS. 10 to 13 is required.

[0093] First, ceramic powder is prepared. The ceramic powder is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y)O3 (where 0 < x ≤ 0.5, 0 < y ≤ 0.5) can be used. The BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the method for synthesizing the ceramic powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and the ceramic slurry is applied and dried on a carrier film to provide a ceramic green sheet.

[0094] Next, an internal electrode pattern is formed by printing a conductive paste for internal electrodes containing a metal powder, a binder, an organic solvent, etc. with a predetermined thickness on the ceramic green sheet using a screen printing method or a gravure printing method.

[0095] After that, the ceramic green sheet with the internal electrode pattern printed thereon is peeled off from the carrier film, and then the ceramic green sheets with the internal electrode pattern printed thereon are laminated and pressed by a predetermined number of layers to form a ceramic laminate. On the upper and lower parts of the ceramic laminate, ceramic green sheets without an internal electrode pattern can be laminated by a predetermined number of layers to form the cover parts 112 and 113 after firing. After that, the ceramic laminate is cut to have a predetermined chip size, and the cut chips are fired at a temperature of 1000°C or higher and 1400°C or lower. Thereby, a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 and including the first surface to the sixth surface 1, 2, 3, 4, 5, 6 can be formed. After that, a barrel polishing process can be further performed to round the edges EG1 and EG2 of the main body 110.

[0096] Next, an electrode formation step of forming external electrodes 131 and 132 on the main body 110 can be performed. Referring to FIGS. 14 and 15, the electrode formation step can include a first step of forming Cu films 31a and 32a on the third surface and the fourth surface 3 and 4 by a sputtering method, and a second step of applying polymer compositions 31b and 32b to at least one of the first surface and the second surface 1 and 2.

[0097] Specifically, referring to FIG. 14, in the first step, after aligning a plurality of main bodies 110 on the substrate 10, Cu particles 30 are released in an atomic or ionic state at the target 20 and deposited on the third surface 3 of the main body 110, so that the Cu film 31a can be formed. Although not shown, after this, the main body 110 is turned over and the Cu particles 30 are similarly deposited on the fourth surface 4 to form the Cu film 32a in FIG. 15.

[0098] Next, referring to FIG. 15, in the second step, after aligning the main bodies 110 on which the Cu films 31a and 32a are formed on a substrate (not shown), the polymer compositions 31b and 32b can be applied and dried on at least one of the first surface and the second surface 1 and 2. More preferably, as shown in FIG. 15, after applying the polymer compositions 31b and 32b to a part of the first surface 1, the main body 110 is turned over and the polymer compositions 31b and 32b are similarly applied and dried on the second surface 2. The application of the polymer compositions 31b and 32b can be performed by, for example, an inkjet method or the like, but the present invention is not limited thereto.

[0099] On the other hand, the polymer compositions 31b and 32b can contain a polymer substance. The polymer substance can be, for example, an insulating substance. The polymer substance can be one or more of an epoxy resin, an acrylic resin, and ethyl cellulose. In this case, the polymer compositions 31b and 32b can further contain metal powder. Alternatively, the polymer substance can also be a conductive substance containing one or more of polypyrrole, polyaniline, polythiophene, and PEDOT:PSS.

[0100] The electrode formation steps shown in FIGS. 14 and 15 sequentially perform the first step and the second step. However, the present invention is not limited thereto, and the steps can also be performed in the reverse order. That is, the electrode formation steps can perform the above first and second steps sequentially or in the reverse order. When the above first and second steps are performed sequentially, the external electrodes 131 and 132 of the multilayer electronic component 100 shown in FIG. 2 can be formed. When the above first and second steps are performed in the reverse order, the external electrodes 431 and 432 of the multilayer electronic component 400 shown in FIG. 12 can be formed.

[0101] Further, by adjusting the coating amounts of the polymer compositions 31b and 32b in the second step so that the polymer compositions 31b and 32b flow down onto the Cu films 31a and 32a, the external electrodes 231 and 232 of the multilayer electronic component 200 shown in FIG. 10 can be formed.

[0102] Further, by turning over the main body 110 aligned on the base material in the first step and depositing Cu particles on the first surface and the second surfaces 1 and 2, the external electrodes 331 and 332 of the multilayer electronic component 300 shown in FIG. 11 or the external electrodes 531 and 532 of the multilayer electronic component 500 shown in FIG. 13 can be formed.

[0103] Next, a heat treatment step can be performed in which the main body 110 that has undergone the above electrode formation step is heat treated to oxidize the outer surfaces of the Cu films 31a and 32a. By oxidizing the outer surfaces of the Cu films 31a and 32a by the above heat treatment, sputtering layers 131a and 132a and oxide layers 131b and 132b can be formed, and at the same time, the polymer compositions 31b and 32b can be cured to form conductive polymer layers 131c and 132c.

[0104] The above heat treatment can be performed, for example, at a temperature of 160°C to 200°C. If the heat treatment temperature is less than 160°C, there is a possibility that the oxide layers 131b and 132b may not be sufficiently formed. If the heat treatment temperature exceeds 200°C, there may be a problem that the polymer compositions 31b and 32b burn because the curing temperature of the polymer compositions 31b and 32b is exceeded.

[0105] On the one hand, the heat treatment is preferably performed in an atmosphere with an oxygen concentration of 30 ppm or more and 50 ppm or less in order to appropriately form the oxide layers 131b and 132b, but the present invention is not limited thereto.

[0106] Next, the laminated electronic component 100 can be manufactured by forming Ni plating layers 131d1 and 132d1 and Sn plating layers 131d2 and 132d2 by a plating method. The plating method can use an electrolytic plating method and / or an electroless plating method. However, the above-described manufacturing method is an example, and the manufacturing method of the laminated electronic component is not limited to the above-described manufacturing method.

[0107] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and this can also be said to belong to the scope of the present invention.

[0108] Also, the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to the other one embodiment as long as there is no explanation contrary to or conflicting with that matter in the other one embodiment.

[0109] In the present disclosure, the meaning of being connected includes not only the case of direct connection but also the case of indirect connection via an adhesive layer or the like. Further, the meaning of being electrically connected includes both the case of physical connection and the case of non-connection. Furthermore, expressions such as first, second, etc. are used to distinguish one component from another component, and do not limit the order and / or importance of the corresponding components. In some cases, without departing from the scope of the rights, the first component can also be named the second component, and similarly, the second component can be named the first component.

Explanation of Signs

[0110] 100, 200, 300, 400, 500 Multilayer Electronic Component 110 Body 111 Dielectric Layer 112, 113 Cover Part 114, 115 Margin Part 121, 122 Internal Electrode 121a, 122a Main Part 121b, 122b Lead Part 131, 132, 231, 232, 331, 332, 431, 432, 531, 532 External Electrode 131b, 132b, 231b, 232b, 331b, 332b, 431b, 432b, 531b, 532b Oxide Layer 131c, 132c, 231c, 232c, 331c, 332c, 431c, 432c, 531c, 532a Conductive Polymer Layer 131d, 132d, 231d, 232d, 331d, 332d, 431d, 432d, 531d, 532d Plating Layer A1, A2 Connection Part B1, B2 Band Part C1, C2 Corner Part EG1, EG2 Edge

Claims

1. A body including a dielectric layer, and first and second internal electrodes alternately disposed with the dielectric layer therebetween, the body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other in a third direction; An external electrode including a connection portion disposed on the third surface or the fourth surface, and a band portion extending from the connection portion to a part of the first surface and the second surface; The external electrode includes: A sputtering layer including Cu and disposed in the connection portion and in contact with at least one of the first internal electrode and the second internal electrode, an oxide layer including an oxide of Cu and disposed on the sputtering layer, and a conductive polymer layer including a polymer substance and disposed in the band portion, the laminated electronic component.

2. The laminated electronic component according to claim 1, wherein the conductive polymer layer includes a first layer disposed on the first surface and a second layer spaced apart from the first layer and disposed on the second surface.

3. The laminated electronic component according to claim 1, wherein the conductive polymer layer is not disposed in the connection portion.

4. The external electrode includes a corner portion disposed between the connection portion and the band portion, The laminated electronic component according to claim 1, wherein one end of the sputtering layer is disposed in the corner portion.

5. The laminated electronic component according to claim 4, wherein in the corner portion, the conductive polymer layer covers one end of the sputtering layer.

6. The laminated electronic component according to claim 4, wherein in the corner portion, the sputtering layer covers one end of the conductive polymer layer.

7. The laminated electronic component according to claim 1, wherein one end of the conductive polymer layer is disposed in the connection portion.

8. One end of the sputtering layer is disposed in the band portion, The laminated electronic component according to claim 1, wherein in the band portion, the sputtering layer is disposed between the body and the conductive polymer layer.

9. One end of the sputtering layer is disposed in the band portion, The laminated electronic component according to claim 1, wherein in the band portion, the conductive polymer layer is disposed between the body and the sputtering layer.

10. The laminated electronic component according to claim 1, wherein the content (at%) of Cu in the total content (at%) of the elements constituting the sputtering layer is 99 at% or more.

11. The external electrode is The laminated electronic component according to claim 1, further comprising a Ni plating layer disposed on the oxide layer in the connection portion and a Sn plating layer disposed on the Ni plating layer in the band portion and disposed on the conductive polymer layer in the band portion.

12. The polymer substance includes an insulating resin, The laminated electronic component according to claim 1, wherein the conductive polymer layer further includes metal particles.

13. The laminated electronic component according to claim 1, wherein the polymer substance includes one or more of polypyrrole, polyaniline, polythiophene, and PEDOT:PSS.

14. Preparing a main body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer, a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected from the first surface to the fourth surface and facing each other in a third direction; An electrode forming step including a first step of forming a Cu film on the third surface and the fourth surface by a sputtering method and a second step of applying a polymer composition to at least one of the first surface and the second surface, and performing the first step and the second step sequentially or in reverse order; A heat treatment step of heat-treating the main body that has undergone the electrode forming step to oxidize the outer surface of the Cu film. A method for manufacturing a laminated electronic component, including:

15. The method for manufacturing a laminated electronic component according to claim 14, wherein the heat treatment is performed at a temperature of 160°C to 200°C.

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