Holding device
The dual-layer bonding system in the electrostatic chuck improves heat transfer and dissipation by using a high thermal conductivity and modulus central bonding layer, addressing inefficiencies in existing chucks and enhancing temperature reduction and bonding stability.
JP2025114013AActive Publication Date: 2025-08-05NITERRA CO LTD
Patent Information
- Application Number
- JP2024007467
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-01-22
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2044-01-22
Smart Images
Figure 2025114013000001_ABST
Abstract
To provide a holding device which can be improved in property of drawing heat away from a to-be-held object.SOLUTION: An electrostatic chuck 1 is provided, comprising a plate-shaped member 10 (10a, 10b), a base member 20, and a joining layer 30 joining the plate-shaped member 10 and the base member 20. The plate-shaped member 10 has a first region R1 at the center in the plane direction and a second region R2 at the periphery in the plane direction. The joining layer 30 has a first joining layer 30a arranged between the base member 20 and the first region R1, and a second joining layer 30b arranged between the base member 20 and the second region R2. The thermal conductivity of the first joining layer 30a is greater than the thermal conductivity of the second joining layer 30b. The Young's modulus of the first joining layer 30a is greater than the Young's modulus of the second joining layer 30b.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
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