Aerosol resin composition, cured product, and three-dimensional circuit board

Abstract

To provide an aerosol resin composition capable of forming a resin composition film with suppressed variation in film thickness.SOLUTION: An aerosol resin composition includes a resin composition containing epoxy resin, a curing agent, and organic solvents, and a propellant component containing dimethyl ether. The epoxy resin includes a first epoxy resin with a softening point of 60°C or higher, and the ratio of the content of the first epoxy resin to the total content of epoxy resin is 70 mass% or more. The organic solvent includes a first organic solvent with a boiling point of 200°C or higher and a second organic solvent with a boiling point of 100°C or higher and less than 200°C, and the ratio of the content of the first organic solvent to the total content of the first and second organic solvents is 60 mass% or less. The resin composition contains the organic solvents in an amount of 40 mass% or more and 75 mass% or less.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an aerosol resin composition, a cured product, and a three-dimensional circuit board. [Background technology]

[0002] Three-dimensional circuit boards are three-dimensional wiring boards in which conductive wiring is formed three-dimensionally, rather than flatly, on the inner or outer surfaces of a three-dimensional housing, electronic component, etc., and are superior in terms of space efficiency, improved design, and a reduction in the number of components by integrating components and circuits. A known three-dimensional wiring board is a molded interconnect device (MID), which is a component in which an electrical circuit is formed three-dimensionally directly on the surface of a three-dimensional structure. Even in three-dimensional circuit boards on which electronic components are mounted, areas other than the electrodes on which the electronic components are mounted are coated in advance with a curable resin composition such as solder resist. Spray coating is used to coat three-dimensional circuit boards with the curable resin composition.

[0003] In relation to the above, Patent Document 1 describes an anticorrosion coating for aerosol spray cans, and Patent Document 2 describes a photosensitive resin composition containing an organic solvent having a specific boiling point. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-035947 [Patent Document 2] International Publication No. 2015 / 137281 Summary of the Invention [Problem to be solved by the invention]

[0005] When a three-dimensional circuit board is coated with a curable resin composition by spray coating, it is sometimes difficult to suppress variations in film thickness between flat portions and corners. One aspect of the present invention aims to provide an aerosol resin composition capable of forming a resin composition film in which variations in film thickness between flat portions and corners are suppressed. [Means for solving the problem]

[0006] Specific means for solving the above problems are as follows. [1] A resin composition containing an epoxy resin, a curing agent, and an organic solvent; a propellant component comprising dimethyl ether; the epoxy resin includes a first epoxy resin having a softening point of 60°C or higher, and the ratio of the content of the first epoxy resin to the total content of the epoxy resins is 70% by mass or higher; the organic solvent includes a first organic solvent having a boiling point of 200°C or higher and a second organic solvent having a boiling point of 100°C or higher but lower than 200°C, and the ratio of the content of the first organic solvent to the total content of the first organic solvent and the second organic solvent is 60 mass% or lower; The resin composition is an aerosol resin composition, in which the content of the organic solvent is 40% by mass or more and 75% by mass or less.

[0007] [2] The aerosol resin composition according to [1], wherein the first epoxy resin has an epoxy equivalent of 180 g / eq or more.

[0008] [3] The aerosol resin composition according to [1] or [2], wherein the first organic solvent comprises at least one selected from the group consisting of dialkylene glycol monoalkyl ethers, dialkylene glycol monoalkyl ether acylates, trialkylene glycol monoalkyl ethers, trialkylene glycol monoalkyl ether acylates, alicyclic hydrocarbon solvents, aromatic hydrocarbon solvents, and terpenoid solvents.

[0009] [4] The aerosol resin composition according to any one of [1] to [3], wherein the difference in boiling point between the first organic solvent and the second organic solvent is 30°C or more and 120°C or less.

[0010] [5] The aerosol resin composition according to any one of [1] to [4], wherein the resin composition contains a filler, and the ratio of the content of the filler to the total content of the epoxy resin is 40% by mass or more and 120% by mass or less.

[0011] [6] The aerosol resin composition according to any one of [1] to [5], wherein the propellant component contains 70 mass % or more of dimethyl ether.

[0012] [7] The aerosol resin composition according to any one of [1] to [6], which is contained in an aerosol container.

[0013] [8] An aerosol agent comprising the aerosol resin composition according to any one of [1] to [7] contained in an aerosol container.

[0014] [9] A cured product of the aerosol resin composition according to any one of [1] to [7].

[0015]

[10] A three-dimensional circuit board comprising a cured resin film made of the cured product according to [9].

[0016]

[11] A method for producing a cured resin film on a substrate by spraying the aerosol resin composition according to any one of [1] to [7] above onto the substrate, and heat-treating the resin composition film to form a cured resin film on the substrate, A method for producing a resin-coated substrate, wherein the substrate has a corner where at least two surfaces intersect.

[0017]

[12] The manufacturing method according to

[11] , wherein the substrate has a conductive pattern on the surface on which the cured resin film is formed.

[0018]

[13] A resin-coated substrate manufactured by the manufacturing method described in

[11] or

[12] , wherein the ratio of the average thickness of the cured resin film at the corner to the average thickness of the cured resin film on the two surfaces forming the corner is 0.5 or more and 1.5 or less. [Effects of the Invention]

[0019] According to one aspect of the present invention, it is possible to provide an aerosol resin composition capable of forming a resin composition film with suppressed fluctuation in film thickness. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a cross-sectional image showing an example of the state of a cured resin film formed using the spray agent of Example 1. [Figure 2] 1 is a cross-sectional image showing an example of the state of a cured resin film formed using the spray agent of Comparative Example 1. DETAILED DESCRIPTION OF THE INVENTION

[0021] As used herein, the term "process" refers not only to an independent process, but also to processes that cannot be clearly distinguished from other processes, as long as the intended purpose of the process is achieved. Furthermore, the content of each component in a composition refers to the total amount of the components present in the composition, unless otherwise specified, when multiple substances corresponding to each component are present in the composition. Furthermore, the upper and lower limits of the numerical ranges described herein can be arbitrarily selected and combined from the numerical values exemplified as numerical ranges. Hereinafter, embodiments of the present invention will be described in detail. However, the embodiments described below are illustrative of aerosol resin compositions, resin-coated substrates, and methods for producing the same that embody the technical concepts of the present invention, and the present invention is not limited to the aerosol resin compositions, resin-coated substrates, and methods for producing the same described below.

[0022] Aerosol resin composition The aerosol resin composition comprises a resin composition and a propellant component. The resin composition includes, for example, an epoxy resin, a curing agent, and an organic solvent. The epoxy resin in the resin composition may include at least a first epoxy resin having a softening point of 60°C or higher. The ratio of the content of the first epoxy resin to the total content of the epoxy resins may be 70% by mass or higher. The organic solvent in the resin composition may include a first organic solvent having a boiling point of 200°C or higher and a second organic solvent having a boiling point of 100°C or higher but lower than 200°C. The ratio of the content of the first organic solvent to the total content of the first organic solvent and the second organic solvent may be 60% by mass or lower. Furthermore, the content of the organic solvent in the resin composition may be 40% by mass or higher but 75% by mass or lower relative to the total amount of the resin composition. The aerosol resin composition may include at least dimethyl ether as a propellant component in addition to a resin composition containing an epoxy resin, etc. The propellant component allows the resin composition to be spray-applied.

[0023] The aerosol resin composition contains a first organic solvent and a second organic solvent having specific boiling points, thereby suppressing variations in the film thickness of the resin composition film formed by spray application. In particular, it can effectively suppress film thickness reduction at corners (corner edges) formed by the intersection of at least two surfaces. This is thought to be because, for example, when the propellant component evaporates during spray application, at least a portion of the second organic solvent also evaporates, increasing the viscosity of the resin composition film formed and suppressing film thickness reduction at the corners. Suppressing film thickness reduction at the corners improves adhesion of the cured resin film formed from the resin composition film to the adherend at the corners. Furthermore, the effects of the cured resin film can be fully achieved.

[0024] The epoxy resin constituting the resin composition includes at least one first epoxy resin having a softening point of 60°C or higher, and may optionally further include at least one second epoxy resin having a softening point below 60°C. The first epoxy resin has a softening point of 60°C or higher, preferably 65°C or higher, and more preferably 70°C or higher. The softening point of the first epoxy resin may be, for example, 180°C or lower. The softening point of the epoxy resin is measured, for example, according to the ring and ball method of JIS K7234:1986. In addition, in the case of an epoxy resin that is available through transfer or the like, the softening point may be the value provided by the supplier. The first epoxy resin may be a known or commonly used compound having one or more epoxy groups, with compounds having two or more epoxy groups being preferred. The epoxy equivalent of the first epoxy resin may be, for example, 180 g / eq or higher, preferably 200 g / eq or higher, and preferably 3000 g / eq or lower. The epoxy equivalent is measured, for example, in accordance with JIS K7236: 2001. The first epoxy resin may include, for example, a solid epoxy resin, or may include a novolac-type epoxy resin.

[0025] Examples of the first epoxy resin include novolac epoxy resin, bisphenol A epoxy resin, biphenyl epoxy resin, alicyclic epoxy resin, naphthalene epoxy resin, dicyclopentadiene epoxy resin, trisphenol epoxy resin, etc. In consideration of the solvent resistance of the cured resin film, the first epoxy resin preferably contains at least one of novolac epoxy resin and bisphenol A epoxy resin, and may contain at least a novolac epoxy resin.

[0026] Examples of novolac epoxy resins include those obtained by reacting a novolac obtained by reacting a phenol such as phenol, cresol, halogenated phenol, alkylphenol, or bisphenol A with formaldehyde in the presence of an acid catalyst, with an epihalohydrin such as epichlorohydrin or methylepichlorohydrin.

[0027] Commercially available novolac epoxy resins may be used, including, for example, YDCN-704 and YDPN-638 manufactured by Nippon Steel Chemical & Material Co., Ltd., DEN431 and DEN439 manufactured by Dow Chemical Japan Ltd., Araldite EPN-1138 and ECN-1299 manufactured by Huntsman Chemical, EPICLON N-730, N-770, N-865, N-665, N-673, N-690 and N-695 manufactured by DIC Corporation, and EOCN-104, EOCN-104S and EOCN-1020 manufactured by Nippon Kayaku Co., Ltd. These may be used alone or in combination of two or more types depending on the required properties.

[0028] Examples of bisphenol A type epoxy resins that are the first epoxy resins include EPICLON1050, 3050, 4050, 7050, and HM-091 manufactured by DIC Corporation, YD-011, 012, 013, 014, 017, 019, 020G, 901, 902, 903N, 904, 907, and 7910 manufactured by Nippon Steel Chemical & Material Co., Ltd., and EP-5100-75X manufactured by ADEKA Corporation. Examples of biphenyl type epoxy resins include YX-4000 manufactured by Mitsubishi Chemical Corporation, and NC-3000H and NC-3000L manufactured by Nippon Kayaku Co., Ltd. Examples of alicyclic epoxy resins include TEPIC (tris(2,3-epoxypropyl)isocyanurate) manufactured by Nissan Chemical Industries, Ltd. Examples of naphthalene-type epoxy resins include EPICLON HP-4700 and EXA4700 manufactured by DIC Corporation, NC-7000L manufactured by Nippon Kayaku Co., Ltd., and ESN-475V manufactured by Nippon Steel Chemical & Material Co., Ltd. Examples of dicyclopentadiene-type epoxy resins include EPICLON HP-7200H manufactured by DIC Corporation. Examples of trisphenol-type epoxy resins include EPPN-502H (trisphenol epoxy resin) manufactured by Nippon Kayaku Co., Ltd.

[0029] When the first epoxy resin contains a novolac epoxy resin and another epoxy resin, the content of the novolac epoxy resin in the first epoxy resin may be, for example, 50% by mass or more and 90% by mass or less, and preferably 60% by mass or more or 80% by mass or less. When the first epoxy resin contains a bisphenol A epoxy resin and another epoxy resin, the content of the bisphenol A epoxy resin in the first epoxy resin may be, for example, 10% by mass or more and 60% by mass or less, and preferably 20% by mass or more or 50% by mass or less.

[0030] The resin composition may further contain a second epoxy resin having a softening point below 60°C. The second epoxy resin has a softening point below 60°C, preferably 40°C or lower, and more preferably above 40°C and below 55°C. The second epoxy resin may also be a liquid epoxy resin. A liquid epoxy resin refers to an epoxy resin that is liquid at 20°C. The liquid state is determined in accordance with the "Method for Confirming Liquid State" in Appendix 2 of the Ministerial Ordinance on the Testing and Properties of Hazardous Materials (Ministry of Home Affairs Ordinance No. 1 of 1989). For example, this is performed using the method described in paragraphs 23 to 25 of JP 2016-079384 A. The second epoxy resin may be a known, commonly used compound having one or more epoxy groups, with compounds having two or more epoxy groups being preferred. The epoxy equivalent of the second epoxy resin may be, for example, 100 g / eq or higher, preferably 130 g / eq or higher, or 500 g / eq or lower.

[0031] Examples of the second epoxy resin include monoepoxy compounds such as butyl glycidyl ether, phenyl glycidyl ether, and glycidyl (meth)acrylate, bisphenol A type epoxy resins, bisphenol S type epoxy resins, bisphenol F type epoxy resins, alicyclic epoxy resins, trimethylolpropane polyglycidyl ether, phenyl-1, bisphenol AF type resins, naphthalene type epoxy resins, phenol novolac type epoxy resins, aromatic amino epoxy resins, tert-butyl-catechol type epoxy resins, and glycidylamine type epoxy resins. Examples of epoxy resins include aromatic aminoepoxy resins such as aminophenol-type epoxy resins, heterocyclic epoxy resins, alicyclic epoxy resins such as tris(2,3-epoxypropyl)isocyanurate and triglycidyl tris(2-hydroxyethyl)isocyanurate, and compounds having two or more epoxy groups per molecule, such as 3-diglycidyl ether, biphenyl-4,4'-diglycidyl ether, 1,6-hexanediol diglycidyl ether, diglycidyl ether of ethylene glycol or propylene glycol, and sorbitol polyglycidyl ether. These can be used alone or in combination of two or more types depending on the required properties.

[0032] The second epoxy resin may be a commercially available product, such as bisphenol A epoxy resins such as EPICLON 850, 860, 900-IM, EXA-4816, and EXA-4822 manufactured by DIC Corporation, Epotohto YD-134 manufactured by Nippon Steel Chemical & Material Co., Ltd., jER834 and 872 manufactured by Mitsubishi Chemical Corporation, and ELA-134 manufactured by Sumitomo Chemical Co., Ltd.; naphthalene epoxy resins such as EPICLON HP-4032 manufactured by DIC Corporation; phenol novolac epoxy resins such as EPICLON N-740 manufactured by DIC Corporation; and aromatic amino epoxy resins such as jER604 manufactured by Mitsubishi Chemical Corporation. These may be used alone or in combination of two or more types depending on the required properties.

[0033] The resin composition may contain an epoxidized polybutadiene resin as the second epoxy resin. The epoxidized polybutadiene resin may be any resin having both a polybutadiene skeleton and an epoxy group. When the resin composition contains an epoxidized polybutadiene resin, the adhesion to the substrate can be further improved.

[0034] Epoxidized polybutadiene resins can be obtained by epoxidizing polybutadiene with hydrogen peroxide or peracids. The polybutadiene used as a raw material may be linear or branched. The number-average molecular weight (Mn) of polybutadiene is not particularly limited, but may be, for example, in the range of 2,000 to 7,000. Polybutadiene resins (epoxidized polybutadiene resins) epoxidized using such polybutadiene as a raw material have a number-average molecular weight in the range of 2,000 to 7,000. In this specification, the number-average molecular weight refers to a value measured by gel permeation chromatography (GPC) (polystyrene standard).

[0035] Commercially available epoxidized polybutadiene resins may be used, including, for example, Epolead PB3600, PB4700, Epofriend CT310, and AT501 manufactured by Daicel Corporation, JP-100 and JP-200 manufactured by Nippon Soda Co., Ltd., and Ricon 657 manufactured by Cray Valley Corp. These may be used alone or in combination of two or more types depending on the required properties.

[0036] The content of the first epoxy resin in the resin composition may be, for example, 5% by mass or more and 40% by mass or less, preferably 10% by mass or more or 15% by mass or more, and preferably 35% by mass or less or 30% by mass or less, relative to the total amount of the resin composition. When the resin composition contains a second epoxy resin, the content of the second epoxy resin in the resin composition may be, for example, 1% by mass or more and 10% by mass or less, preferably 2% by mass or more, and preferably 5% by mass or less or 3% by mass or less, relative to the total amount of the resin composition.

[0037] The epoxy resin in the resin composition may have a ratio of the content of the first epoxy resin to the total content of the epoxy resin of, for example, 70% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more, and may have a ratio of, for example, 100% by mass or less, to the total content of the epoxy resin.

[0038] The organic solvent constituting the resin composition may include at least one first organic solvent having a specific boiling point and at least one second organic solvent having a boiling point lower than that of the first organic solvent. The boiling point of the first organic solvent may be, for example, 200°C or higher, preferably 205°C or higher, and more preferably 210°C or higher. The boiling point of the first organic solvent may be, for example, 280°C or lower, preferably 260°C or lower. In one embodiment, the boiling point of the first organic solvent may be, for example, 190°C or higher.

[0039] Specific examples of the first organic solvent include glycol ether-based solvents such as dialkylene glycol monoalkyl ether, dialkylene glycol monoalkyl ether acylate, trialkylene glycol monoalkyl ether, and trialkylene glycol monoalkyl ether acylate; alicyclic hydrocarbon-based solvents such as isophorone; aromatic hydrocarbon-based solvents such as Ibsol 150 (manufactured by Idemitsu Kosan Co., Ltd.); and terpenoid-based solvents such as terpineol. The first organic solvent may contain at least one selected from the group consisting of these. The first organic solvents can be used alone or in combination of two or more.

[0040] The number of carbon atoms in the alkylene glycol moiety in the glycol ether solvent may be, for example, 2 to 4, and preferably 2 or 3. The number of carbon atoms in the alkyl ether moiety may be, for example, 1 to 6, and preferably 1 to 4. The number of carbon atoms in the hydrocarbon group of the acylate moiety may be, for example, 1 to 3, and preferably 1 to 2.

[0041] Specific examples of glycol ether solvents include ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-propyl ether, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, dipropylene glycol monomethyl ether acetate, and triethylene glycol monoethyl ether.

[0042] The boiling point of the second organic solvent may be, for example, 100° C. or higher and lower than 200° C., and preferably 100° C. or higher and 170° C. or lower. The boiling point of the second organic solvent may be preferably 110° C. or higher, more preferably 120° C. or higher, and preferably 160° C. or lower, and more preferably 150° C. or lower. The difference in boiling point between the first organic solvent and the second organic solvent may be, for example, 30° C. or higher and 120° C. or lower, preferably 40° C. or higher, more preferably 50° C. or higher, and preferably 110° C. or lower, more preferably 100° C. or lower.

[0043] Specific examples of the second organic solvent include ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monobutyl ether, 2-methoxyethanol, ethylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and cyclohexanone. The second organic solvent may contain at least one selected from the group consisting of these. The second organic solvents may be used alone or in combination of two or more.

[0044] The total content of organic solvents in the resin composition may be, for example, 40% by mass or more and 75% by mass or less, preferably 50% by mass or more, and more preferably 55% by mass or more, based on the total amount of the resin composition. The total content of organic solvents in the resin composition may be preferably 70% by mass or less, and more preferably 65% by mass or less. When the content is within the above range, good leveling properties are achieved during spray application.

[0045] The ratio of the content of the first organic solvent to the total content of organic solvents in the resin composition may be, for example, 60% by mass or less, preferably 50% by mass or less, and more preferably 40% by mass or less. The ratio of the content of the first organic solvent to the total content of organic solvents in the resin composition may be, for example, 5% by mass or more, and preferably 7% by mass or more.

[0046] The ratio of the content of the second organic solvent to the total content of organic solvents in the resin composition may be, for example, 40% by mass or more and 95% by mass or less, preferably 93% by mass or less, and more preferably 90% by mass or less. The ratio of the content of the second organic solvent to the total content of organic solvents in the resin composition may be, for example, 45% by mass or more, and preferably 50% by mass or more. By being within the above range, variation in film thickness at flat portions and corner portions can be better suppressed.

[0047] The ratio of the content of the second organic solvent to the content of the first organic solvent in the resin composition may be, for example, 0.5 or more and 15 or less, preferably 1 or more, and more preferably 2 or more. The ratio of the content of the second organic solvent to the content of the first organic solvent may be preferably 14.5 or less, and more preferably 14 or less.

[0048] The resin composition may contain at least one curing agent. The inclusion of a curing agent accelerates the thermosetting reaction, and properties such as adhesion, chemical resistance, and heat resistance can be further improved. Examples of the curing agent include imidazole-based curing agents, amine-based curing agents, hydrazine-based curing agents, and phosphorus-based curing agents. The curing agents can be used alone or in combination of two or more.

[0049] As the imidazole curing agent, well-known and conventional ones can be used without any restrictions. For example, 2-(2-hydroxyphenyl)imidazole, 2-(2-hydroxyphenyl)-4(5)-methylimidazole, 4(5)-ethyl-2-(2-hydroxyphenyl)imidazole, 4,5-dimethyl-2-(2-hydroxyphenyl)imidazole, 4-ethyl-(2-hydroxyphenyl)-5-methylimidazole, (2-hydroxyphenyl)-4-isopropyl-5-methylimidazole, 4-butyl-(2-hydroxyphenyl)-5- Methylimidazole, 2-(2-hydroxy-3-methylphenyl)imidazole, 2-(2-hydroxy-3-methylphenyl)-4(5)-methylimidazole, 4(5)-ethyl-2-(2-hydroxy-3-methylphenyl)imidazole, 4,5-dimethyl-2-(2-hydroxy-3-methylphenyl)imidazole, 4-ethyl-(2-hydroxy-3-methylphenyl)-5-methylimidazole, (2-hydroxy-3-methylphenyl)-4- Isopropyl-5-methylimidazole, 4-butyl-(2-hydroxy-3-methylphenyl)-5-methylimidazole, 2-(2-hydroxy-4-methylphenyl)imidazole, 2-(2-hydroxy-4-methylphenyl)-4(5)-methylimidazole, 4(5)-ethyl-2-(2-hydroxy-4-methylphenyl)imidazole, 4,5-dimethyl-2-(2-hydroxy-4-methylphenyl)imidazole, 4-ethyl-(2-hydroxy 4-butyl-(2-hydroxy-4-methylphenyl)-5-methylimidazole, 2-(2-hydroxy-5-methylphenyl)imidazole, 2-(2-hydroxy-5-methylphenyl)-4(5)-methylimidazole, 4(5)-ethyl-2-(2-hydroxy-5-methylphenyl)imidazole, 4,5-Dimethyl-2-(2-hydroxy-5-methylphenyl)imidazole, 4-Ethyl-(2-hydroxy-5-methylphenyl)-5-methylimidazole, (2-hydroxy-5-methylphenyl)-4-isopropyl-5-methylimidazole, 4-Butyl-(2-hydroxy-5-methylphenyl)-5-methylimidazole, 2-(3-t-butyl-2-hydroxyphenyl)imidazole, 2-(3-t-butyl-2-hydroxyphenyl)-4(5)-methylimidazole 2-(3-t-butyl-2-hydroxyphenyl)-4(5)-ethylimidazole, 2-(3-t-butyl-2-hydroxyphenyl)-4,5-dimethylimidazole, 2-(3-t-butyl-2-hydroxyphenyl)-4-ethyl-5-methylimidazole, 2-(3-t-butyl-2-hydroxyphenyl)-4-isopropyl-5-methylimidazole, 4-butyl-2-(3-t-butyl-2-hydroxyphenyl)-5-methylimidazo 2-phenyl-4,5-dihydroxymethylimidazole, 2-(4-fluoro-2-hydroxyphenyl)imidazole, 2-(4-fluoro-2-hydroxyphenyl)-4(5)-methylimidazole, 2-(4-fluoro-2-hydroxyphenyl)-4(5)-ethylimidazole, 2-(4-fluoro-2-hydroxyphenyl)-4,5-dimethylimidazole, 4-ethyl-2-(4-fluoro-2-hydroxyphenyl)-5-methylimidazole 2-(4-fluoro-2-hydroxyphenyl)-4-isopropyl-5-methylimidazole, 4-butyl-2-(4-fluoro-2-hydroxyphenyl)-5-methylimidazole, 2-(4-chloro-2-hydroxyphenyl)imidazole, 2-(4-chloro-2-hydroxyphenyl)-4(5)-methylimidazole, 2-(4-chloro-2-hydroxyphenyl)-4(5)-ethylimidazole, 2-(4-chloro-2-hydroxyphenyl)-4,5-Dimethylimidazole, 2-(4-chloro-2-hydroxyphenyl)-4-ethyl-5-methylimidazole, 2-(4-chloro-2-hydroxyphenyl)-4-isopropyl-5-methylimidazole, 4-butyl-2-(4-chloro-2-hydroxyphenyl)-5-methylimidazole, 2-(4-bromo-2-hydroxyphenyl)imidazole, 2-(4-bromo-2-hydroxyphenyl)-4(5)-methylimidazole, 2 2-(4-bromo-2-hydroxyphenyl)-4(5)-ethylimidazole, 2-(4-bromo-2-hydroxyphenyl)-4,5-dimethylimidazole, 2-(4-bromo-2-hydroxyphenyl)-4-ethyl-5-methylimidazole, 2-(4-bromo-2-hydroxyphenyl)-4-isopropyl-5-methylimidazole, 2-(4-bromo-2-hydroxyphenyl)-4-butyl-5-methylimidazole, etc. These can be used alone or in combination of two or more.

[0050] Among the above, 2-(2-hydroxyphenyl)imidazole, 2-(2-hydroxyphenyl)-4(5)-methylimidazole, 4-ethyl-(2-hydroxyphenyl)-5-methylimidazole, (2-hydroxyphenyl)-4-isopropyl-5-methylimidazole, 4-butyl-(2-hydroxyphenyl)-5-methylimidazole, and 2-phenyl-4,5-dihydroxymethylimidazole are preferred.

[0051] Examples of amine-based curing agents include dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, and 4-methyl-N,N-dimethylbenzylamine. Examples of hydrazine-based curing agents include adipic acid dihydrazide and sebacic acid dihydrazide. Examples of phosphorus-based curing agents include triphenylphosphine. Also usable are s-triazine derivatives such as guanamine, acetoguanamine, benzoguanamine, melamine, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, 2-vinyl-2,4-diamino-s-triazine, 2-vinyl-4,6-diamino-s-triazine-isocyanuric acid adduct, and 2,4-diamino-6-methacryloyloxyethyl-s-triazine-isocyanuric acid adduct.

[0052] Examples of commercially available curing agents include 2E4MZ, 2MZ-A, 2MZ-A PW, 2MZ-OK, 2PHZ, 2PHZ-PW, 2P4BHZ, and 2P4MHZ (all of which are trade names for imidazole-based compounds) manufactured by Shikoku Chemicals Corporation, and U-CAT (registered trademark) 3503N and U-CAT3502T (all of which are trade names for dimethylamine-blocked isocyanate compounds), DBU, DBN, U-CATSA102, and U-CAT5002 (all of which are bicyclic amidine compounds and salts thereof) manufactured by San-Apro Co., Ltd.

[0053] The content of the curing agent in the resin composition may be, for example, 0.1 to 20 parts by mass, preferably 0.5 to 15 parts by mass, relative to 100 parts by mass of the total amount of the epoxy resins.

[0054] In one embodiment, the curing agent may include an amine-based curing agent and an imidazole-based curing agent. Combining two or more curing agents tends to improve adhesion. When an amine-based curing agent and an imidazole-based curing agent are used in combination as the curing agent, the mass ratio of the imidazole-based curing agent to the amine-based curing agent may be, for example, 0.1 or more and 1 or less, preferably 0.2 or more and 0.8 or less.

[0055] The resin composition may further contain at least one phenolic resin. Examples of phenols constituting the phenolic resin include phenol, o-cresol, p-cresol, bisphenol A, bisphenol F, bisphenol S, bisphenol, and naphthalenediol. The phenolic resin may be a phenolic novolac resin, which is a polycondensation product of a phenol and an aldehyde. The hydroxyl group equivalent of the phenolic resin may be, for example, 75 g / eq or more and 250 g / eq or less, and preferably 100 g / eq or more and 230 g / eq or less.

[0056] Specific examples of phenolic resins include PHENOLITE TD-2131, TD-2106, TD-2093Y, TD-2090, VH-4170, KH-6021, KA-1160, KA-1163, KA-1165, LA-7054, LA-7751, and LA-1356 manufactured by DIC Corporation; KAYHARD GPH-65, GPH-103, and KTG-105 manufactured by Nippon Kayaku Co., Ltd.; RESITOP GRA, HB, ELPC75, ELP83H, and TPM manufactured by Gunei Chemical Industry Co., Ltd.; and HF-1M, HF-3M, HF-4M, H-4, DL-92, MEH-7800, MEH-7851, and MEH-7500 manufactured by UBE Corporation.

[0057] When the resin composition contains a phenolic resin, the ratio of the number of moles of phenolic hydroxyl groups contained in the phenolic resin to the number of moles of epoxy groups contained in the epoxy resin may be, for example, from 0.3 to 1.8, and preferably from 0.5 to 1.5. When the ratio of the number of moles of epoxy groups to the number of moles of phenolic hydroxyl groups is within the above range, heat resistance tends to be improved.

[0058] The resin composition may contain a filler. The inclusion of a filler can improve the mechanical strength of the cured product obtained by curing the resin composition. The filler can be appropriately selected from known inorganic fillers and organic fillers. Examples of inorganic fillers include barium sulfate, silica, Neuburg silica particles, and talc. In addition to the filler, a metal oxide or a metal hydroxide such as aluminum hydroxide may be used in combination. The inclusion of a metal oxide or metal hydroxide tends to improve flame retardancy. The filler can be used alone or in combination of two or more.

[0059] The filler may be one whose surface has been surface-treated. Surface treatment tends to improve dispersibility in the resin composition and further suppress aggregation. The surface treatment method is not particularly limited, and any known or commonly used method may be used. For example, it is preferable to treat the surface of the filler with a surface treatment agent having a curable reactive group, such as a coupling agent having a curable reactive group as an organic group.

[0060] As the coupling agent, silane-based, titanate-based, aluminate-based, zircoaluminate-based, and other coupling agents can be used. Among these, silane-based coupling agents are preferred. Examples of such silane-based coupling agents include vinyltrimethoxysilane, vinyltriethoxysilane, N-(2-aminomethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane. These can be used alone or in combination of two or more.

[0061] The content of the filler in the resin composition, calculated as solid content relative to the total content of the epoxy resin, may be, for example, in the range of 20% by mass to 200% by mass, and preferably, from the viewpoint of suppressing dripping of the resin composition when producing a three-dimensional circuit board, in the range of 30% by mass to 150% by mass, and more preferably, in the range of 40% by mass to 120% by mass. Here, "in terms of solid content" means based on the nonvolatile components obtained by excluding volatile components from the filler material used.

[0062] The resin composition may contain an appropriate colorant depending on the intended use. Examples of the colorant include color pigments and dyes having appropriate color tones. Examples of the colorant include red, blue, green, yellow, white, black, purple, orange, and brown colorants. Examples of red colorants include monoazo, disazo, azo-lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone. Examples of blue colorants include phthalocyanine and anthraquinone, and pigment compounds classified as pigments can be used. In addition to these, metal-substituted or unsubstituted phthalocyanine compounds can also be used. Examples of green colorants include phthalocyanine, anthraquinone, and perylene. In addition to these, metal-substituted or unsubstituted phthalocyanine compounds can also be used. Examples of yellow colorants include monoazo-based, disazo-based, condensed azo-based, benzimidazolone-based, isoindolinone-based, anthraquinone-based, etc. Examples of black colorants include carbon black-based, graphite-based, iron oxide-based, titanium black, iron oxide, anthraquinone-based, cobalt oxide-based, copper oxide-based, manganese oxide-based, antimony oxide-based, nickel oxide-based, perylene-based, aniline-based, molybdenum sulfide, bismuth sulfide, etc. These colorants can be used alone or in combination in any ratio.

[0063] The content of the colorant in the resin composition may be, for example, in the range of 0.3 mass % or more and 10 mass % or less, preferably 0.4 mass % or more and 7 mass % or less, and more preferably 0.4 mass % or more and 5 mass % or less, in terms of solid content relative to the total content of the epoxy resin.

[0064] The resin composition may further contain other additives known and commonly used in the field of electronic materials, such as a thermal polymerization inhibitor, an ultraviolet absorber, a silane coupling agent, a plasticizer, a flame retardant, an antistatic agent, an antioxidant, an antibacterial and antifungal agent, an antifoaming agent, a leveling agent, a thickener, an adhesion imparting agent, a thixotropy imparting agent, a sensitizer, a curing accelerator, a release agent, a surface treatment agent, a dispersant, a wetting and dispersing agent, a dispersing aid, a surface modifier, a stabilizer, and a phosphor.

[0065] The aerosol resin composition contains a propellant component in addition to the resin composition, thereby forming an aerosol agent that can be sprayed from the nozzle of an aerosol container by aerosolizing the resin composition. The propellant component contains at least dimethyl ether and may further contain other propellant components. When the propellant component contains dimethyl ether, compatibility with the resin composition and atomization properties are excellent. Examples of other propellant components other than dimethyl ether include LP gas, various fluorocarbon derivatives, carbon dioxide gas, nitrogen gas, etc. The propellant is not particularly limited as long as it is one that is commonly used as a propellant for aerosol agents.

[0066] The content of the propellant component in the aerosol resin composition may be, for example, 80% by mass or more and 120% by mass or less, preferably 85% by mass or more and 115% by mass or less, and more preferably 90% by mass or more and 110% by mass or less, based on the resin composition. The content of dimethyl ether in the propellant component may be, for example, 70% by mass or more, preferably 80% by mass or more, and more preferably 95% by mass or more.

[0067] The aerosol resin composition may be a one-component type or a two-component type, and is preferably a one-component type. The one-component type provides excellent handling properties when sprayed.

[0068] The aerosol resin composition can be prepared by a known production method. Specifically, for example, the aerosol resin composition can be prepared by mixing components other than the propellant component to prepare a resin composition, and then placing the resin composition and the propellant component in an aerosol container. A known and commonly used aerosol container can be used as the aerosol container. The aerosol resin composition stored in the aerosol container can be used as an aerosol agent for spray application of the resin composition.

[0069] Cured product and three-dimensional circuit board The cured product may be a cured resin film formed by spraying the aerosol resin composition onto a substrate and then heat-treating the resulting resin composition film. That is, the cured product may be a thermoset product of the resin composition contained in the aerosol resin composition. The cured product may also be a solder resist layer formed on a printed wiring board as a substrate. The aerosol resin composition can be used to form solder resist layers on conventionally known flat printed wiring boards, but it can also be used suitably on three-dimensional structures, such as flat plates, and on surfaces with three-dimensional structures. Three-dimensional structures include polyhedrons and spheres. Examples of such substrates include flexible printed wiring boards and three-dimensional circuit boards, and the aerosol resin composition is particularly suitable for use on three-dimensional circuit boards. A three-dimensional circuit board is a resin molded product on which three-dimensional electrical circuit wiring is formed, providing both mechanical and electrical functions. For three-dimensional circuit boards, reference can be made to the descriptions in, for example, JP-A Nos. 63-234603, 2008-53465, 2001-15874, JP-A No. 2004-534408, and JP-A No. 11-6073, etc. As the molding material for the three-dimensional circuit board, a known material is used, such as a mixture of an organic material using a resin and an inorganic material.

[0070] The shape of the resin molded product constituting the three-dimensional circuit board is not particularly limited and may be appropriately selected depending on the purpose, etc. For example, the resin molded product may have a shape having a corner (corner edge) where at least two surfaces intersect. Generally, when a resin composition is spray-applied to a resin molded product having a corner to form a resin composition film, the film thickness at the corner tends to be thinner than that at flat surfaces. However, by spray-applying the aerosol resin composition of the present embodiment to a substrate that is a resin molded product having a corner to form a resin composition film and then thermally curing the formed resin composition film to form a cured resin film, a cured resin film with reduced film thickness variation at the corner can be formed. Suppressing film thickness variation (thickness reduction) of the cured resin film at the corner improves the adhesion of the cured resin film at the corner, thereby achieving excellent properties for the three-dimensional circuit board. The corner of the resin molded product may be linear, formed by two surfaces intersecting in a straight line, or curved, formed by two surfaces intersecting via a curved surface.

[0071] The three-dimensional circuit board is preferably made of a resin molded product, with a circuit formed on the resin molded product. It is desirable to use a thermoplastic resin for the resin molded product, which is lightweight and easy to mold. In particular, when electronic components are mounted on the three-dimensional circuit board by soldering, suitable thermoplastic resins for the resin molded product include, for example, fluororesins, known as engineering plastics, which have excellent heat resistance, polycarbonate, polyacetal, polyamide, polyphenylene ether, amorphous polyarylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, polyimide, polyetherimide, and liquid crystal polymers. Furthermore, when an aerosol resin composition is applied to a three-dimensional circuit board, polyphenylene sulfide, polyetheretherketone, polycarbonate, polyamide, polyacetal, and the like can be preferably used among the above, from the viewpoint of being able to withstand the heat generated when curing the epoxy resin.

[0072] In the case of a three-dimensional circuit board, a circuit can be formed on the surface of the three-dimensional board by any known method, and the method can be selected appropriately depending on the purpose. In particular, in the case of a three-dimensional circuit board, a non-conductive metal complex can be dispersed in a molding resin, which is the material of the three-dimensional board, and after molding the three-dimensional board using this molding resin, a laser beam can be irradiated in accordance with the circuit pattern to generate metal nuclei, and then plating can be performed to form a circuit.

[0073] The non-conductive metal complex used to form the three-dimensional circuit board is not particularly limited, but a non-conductive metal complex capable of depositing a metal upon irradiation with light is preferably used. Examples of central metals in such non-conductive metal complexes include copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), iron (Fe), cobalt (Co), chromium (Cr), rhodium (Rh), and ruthenium (Ru). Examples of ligands for the non-conductive metal complexes include organic carbonyl compounds such as β-diketones (e.g., acetylacetone, benzoylacetone, and dibenzoylmethane) and β-ketocarboxylic acid esters (e.g., ethyl acetoacetate); organic nitrogen compounds such as organic nitrogen compounds having an -N=N- bond, organic nitrogen compounds having a -C=N- and an OH bond, and organic nitrogen compounds having an -N< and an -OH bond; organic sulfur compounds such as organic sulfur compounds having a >C=S bond and organic sulfur compounds having a -C-SH bond.

[0074] The light irradiation used to precipitate a metal from the non-conductive metal complex is preferably laser light. There are no particular limitations on the laser light, as long as it can precipitate a metal by irradiating the non-conductive metal complex. The wavelength of the laser light can be, for example, 248 nm, 308 nm, 355 nm, 532 nm, 1064 nm, or 10600 nm.

[0075] Resin-coated substrate and method for producing same The resin-coated substrate comprises a substrate and a cured resin film disposed on the substrate. The substrate may have a three-dimensional structure with a corner where at least two surfaces intersect. The substrate may also be a three-dimensional circuit board having a conductive pattern on the surface on which the cured resin film is disposed. The cured resin film is formed by spraying the aerosol resin composition described above onto the substrate, and then heat-treating the resulting resin composition film. In the resin-coated substrate, the average thickness of the cured resin film on the two surfaces forming the corner may be, for example, 10 μm to 50 μm, preferably 20 μm to 40 μm. The cured resin film may have a substantially uniform thickness. The ratio of the average thickness of the cured resin film at the corner to the average thickness on the two surfaces forming the corner may be, for example, 0.5 to 1.5, preferably 0.8 to 1.2. The average thickness of the cured resin film on the two surfaces forming the corner is calculated by measuring the cross-section of the resin-coated substrate at any two points on each surface and arithmetically averaging the measurements at four points. The average thickness of the cured resin film at the corner is calculated as the arithmetic average of the thicknesses measured in the cross section of the resin-coated substrate at three locations along the ridge line of the corner, in the directions that form equal angles with the two surfaces that form the corner. The difference between the average thickness of the cured resin film on the two surfaces that form the corner and the average thickness of the cured resin film at the corner may be, for example, 0 μm or more and 10 μm or less, and preferably 0 μm or more and 5 μm or less. The thickness of the cured resin film at the corner is the thickness in the cross section in the directions that form equal angles with the two surfaces that form the corner.

[0076] The method for producing a resin-coated substrate includes spraying the aerosol resin composition onto a substrate to form a resin composition film, and heat-treating the formed resin composition film to form a cured resin film on the substrate. The substrate may have a three-dimensional structure having a corner (corner edge) where at least two surfaces intersect, and may be a resin molded product having a corner. The substrate may also be a three-dimensional circuit board having a conductive pattern on the surface on which the cured resin film is formed. The temperature of the heat treatment to form the cured resin film may be, for example, 100°C or higher and 180°C or lower, preferably 120°C or higher and 160°C or lower. The heat treatment time may be, for example, 15 minutes or higher and 90 minutes or lower, preferably 20 minutes or higher and 60 minutes or lower. [Example]

[0077] The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

[0078] Examples 1 to 18 and Comparative Examples 2 to 5 The various components shown in Tables 1 to 4 were blended in the ratios (parts by mass) shown, premixed in a mixer, and then kneaded in a three-roll mill to prepare resin compositions. The prepared resin compositions were sealed in spray cans together with the amounts of dimethyl ether shown in Table 1 to prepare aerosols. In the tables, "-" indicates that no additives were added.

[0079] Comparative Example 1 The various components shown in Table 4 were blended in the ratios (parts by mass) shown, premixed in a mixer, and then kneaded in a three-roll mill to prepare a resin composition. The prepared resin composition was used as an air spray agent using a hand gun.

[0080] [Table 1]

[0081] [Table 2]

[0082] [Table 3]

[0083] [Table 4]

[0084] Details of each component in the table are as follows: Epoxy resin Daiichi Epoxy Resin N-695: DIC Corporation, cresol novolac type / solid, epoxy equivalent weight 209g / eq to 219g / eq, softening point 90℃ to 100℃ EPICLON 1050: DIC Corporation, bisphenol A type / solid, epoxy equivalent weight 450g / eq to 500g / eq, softening point 64℃ to 74℃ NC-3000H: Nippon Kayaku Co., Ltd., biphenyl type / solid, epoxy equivalent 288g / eq, softening point 70℃ HP7200H: DIC Corporation, dicyclopentadiene type / solid, epoxy equivalent weight 272g / eq to 284g / eq, softening point 78℃ to 88℃ NC-7000H: Nippon Kayaku Co., Ltd., naphthalene type / solid, epoxy equivalent 230g / eq, softening point 94℃ Secondary Epoxy Resin EPICLON 850: DIC Corporation, bisphenol A type / liquid, epoxy equivalent weight 183g / eq to 193g / eq, liquid viscosity 11000mPa·s to 15000mPa·s PB-3600: Daicel Corporation, Epoxidized polybutadiene / liquid, epoxy equivalent weight 190g / eq to 195g / eq, liquid viscosity 29000mPa·s (@45℃)

[0085] hardener DICY: Dicyandiamide 2MZA-PW: Imidazole-based, manufactured by Shikoku Chemicals Corporation 2PHZ-PW: Imidazole-based, manufactured by Shikoku Chemicals Corporation

[0086] Phenolic resin HF-1M: UBE Corporation, phenolic resin

[0087] Filler Barium sulfate 110: Sakai Chemical Industry Co., Ltd., barium sulfate SG-2000: Talc, manufactured by Nippon Talc Co., Ltd.

[0088] organic solvents First Organic Solvent Diethylene glycol monoethyl ether acetate, boiling point 217°C Diethylene glycol monoethyl ether, boiling point 202°C Dipropylene glycol monomethyl ether acetate, boiling point 209°C Secondary organic solvent Propylene glycol monomethyl ether acetate, boiling point 146°C Propylene glycol monomethyl ether, boiling point 120°C

[0089] coloring agent Copper phthalocyanine blue: manufactured by Nikko Vicks Co., Ltd.

[0090] additives BYK-057: Antifoaming agent, manufactured by BYK BYK-361N: Surface conditioner, manufactured by BYK

[0091] evaluation A 3cm x 3cm x 3cm three-dimensional wiring board was prepared as a substrate using polyamide resin (RENY XHP1002 manufactured by Global Polyacetal Corporation). The board had two flat surfaces that intersected with a curved surface at approximately right angles (chamfered with a radius of 0.5mm), and a conductive pattern was formed on the corner.

[0092] 1.Spray application The spray agent obtained above was sprayed onto a substrate with the spray nozzle positioned 20 to 30 cm away from the substrate to form a resin composition film. After leaving the substrate at room temperature (25°C) for 10 minutes, the formed resin composition film was visually observed and evaluated for spray applicability based on the following evaluation criteria.

[0093] Evaluation criteria A: Spray application was possible in a uniformly atomized state, and the leveling of the resin composition film was good. B: Spray application was possible in a uniformly atomized state, but the leveling of the formed resin composition film was insufficient. C: Uniform atomization was not achieved, making spray application difficult.

[0094] 2. Film thickness ratio The spray agent obtained above was spray-coated onto a substrate to form a resin composition film, which was then heat-treated at 150°C for 30 minutes to form a cured resin film, yielding a resin-coated substrate. The film thicknesses of the flat and corner portions of the cured resin film formed on the resulting resin-coated substrate were measured by cross-sectional observation at a magnification of 100x using an optical microscope (Keyence Corporation, Digital Microscope VHX-8000), and the ratio of the average thickness at the corner portion to the average thickness on the two surfaces forming the corner portion was calculated and evaluated according to the following evaluation criteria.

[0095] Evaluation criteria A: 0.8 or more and 1.2 or less B: 0.5 or more but less than 0.8 or 1.2 or more but less than 1.5 C: Less than 0.5 or more than 1.5

[0096] Fig. 1 is a cross-sectional view showing an example of a cured resin film formed using the spray agent of Example 1, and Fig. 2 is a cross-sectional view showing an example of a cured resin film formed using the spray agent of Comparative Example 1. In Fig. 1, a substantially uniform cured resin film is formed on both the flat portion and the corner portion. On the other hand, in Fig. 2, the thickness of the cured resin film on the corner portion is thinner than the thickness of the cured resin film on the flat portion.

[0097] 3. Adhesion The resin-coated substrate was stored in an environment of 85°C and 85% RH for 500 hours, and then a tape peel test was carried out to evaluate the adhesion of the cured resin film according to the following evaluation criteria.

[0098] Tape peel test: Peel the tape 1 mm onto the two surfaces that form the corners, including the corners, with a cutter knife. 2 After forming a grid so that there were 100 squares, an 18 mm wide piece of Cellophane Tape (CT-405AP-18, manufactured by Nichiban Co., Ltd., adhesive strength of 10±1 N per 25 mm width) was applied, and the Cellophane Tape was then firmly rubbed with a fingertip. Within 5 minutes of applying the Cellophane Tape, the edge of the Cellophane Tape was grasped at an angle close to 60° and instantly peeled off. The number of grids remaining on the substrate (number of remaining grids) was counted to evaluate the adhesion between the substrate and the cured coating. The evaluation criteria were as follows:

[0099] Evaluation criteria A: Number of remaining lattices is 90 or more B: Number of remaining lattices is 70 or more but less than 90 C: Less than 70 remaining lattices

Claims

1. a resin composition containing an epoxy resin, a curing agent, and an organic solvent; a propellant component comprising dimethyl ether; the epoxy resin includes a first epoxy resin having a softening point of 60°C or higher, and the ratio of the content of the first epoxy resin to the total content of the epoxy resins is 70 mass% or higher; the organic solvent includes a first organic solvent having a boiling point of 200°C or higher and a second organic solvent having a boiling point of 100°C or higher but lower than 200°C, and a ratio of the content of the first organic solvent to the total content of the first organic solvent and the second organic solvent is 60 mass% or lower; The resin composition is an aerosol resin composition, wherein the content of the organic solvent is 40% by mass or more and 75% by mass or less.

2. 2. The aerosol resin composition according to claim 1, wherein the first epoxy resin has an epoxy equivalent of 180 g / eq or more.

3. 2. The aerosol resin composition according to claim 1, wherein the first organic solvent comprises at least one selected from the group consisting of dialkylene glycol monoalkyl ethers, dialkylene glycol monoalkyl ether acylates, trialkylene glycol monoalkyl ethers, trialkylene glycol monoalkyl ether acylates, alicyclic hydrocarbon solvents, aromatic hydrocarbon solvents, and terpenoid solvents.

4. 2. The aerosol resin composition according to claim 1, wherein the difference in boiling point between the first organic solvent and the second organic solvent is 30°C or more and 120°C or less.

5. 2. The aerosol resin composition according to claim 1, wherein the resin composition contains a filler, and the ratio of the content of the filler to the total content of the epoxy resin is 40% by mass or more and 120% by mass or less.

6. 2. The aerosol resin composition according to claim 1, wherein the propellant component contains 70% by mass or more of dimethyl ether.

7. The aerosol resin composition according to claim 1, which is contained in an aerosol container.

8. An aerosol agent comprising the aerosol resin composition according to any one of claims 1 to 7 contained in an aerosol container.

9. A cured product of the aerosol resin composition according to any one of claims 1 to 7.

10. A three-dimensional circuit board comprising a cured resin film made of the cured product according to claim 9.

11. The method includes spray-coating the aerosol resin composition according to any one of claims 1 to 7 onto a substrate to form a resin composition film, and heat-treating the resin composition film to form a cured resin film on the substrate, A method for producing a resin-coated substrate, wherein the substrate has a corner where at least two surfaces intersect.

12. The manufacturing method according to claim 11 , wherein the substrate has a conductive pattern on a surface on which the cured resin film is to be formed.

13. 12. A resin-coated substrate manufactured by the manufacturing method according to claim 11, wherein the ratio of the average thickness of the cured resin film at the corner to the average thickness of the cured resin film on the two surfaces forming the corner is 0.5 or more and 1.5 or less.

Images