Temperature measurement plate, holding device manufacturing method, and temperature measurement device

Abstract

To provide a temperature measurement plate, a holding device manufacturing method, and a temperature measurement device that can improve the measurement accuracy of the temperature distribution on the holding surface of a holding device.SOLUTION: In an embodiment according to the present disclosure, an electrostatic chuck 1 includes a holding surface 11 that holds a semiconductor wafer W and a chuck electrode 50 that generates electrostatic attraction force to hold the semiconductor wafer W on the holding surface 11. In order to measure the temperature distribution of the holding surface 11, an inspection heat-generating ceramic 120 is placed on the holding surface 11 and includes a chuck receiving electrode 121 capable of generating an electrostatic attraction force together with the chuck electrode 50 and a heater 122.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a temperature measurement plate and a temperature measurement device for measuring the temperature distribution on a holding surface of a holding device that holds an object, and a method for manufacturing the holding device. [Background technology]

[0002] Patent Document 1 discloses a temperature measurement device that places a temperature measurement plate on the holding surface (mounting surface) of a holding device (electrostatic chuck device) without using the object (semiconductor wafer) itself, and measures the temperature distribution on the holding surface of the holding device based on the temperature measurement results of the temperature measurement plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5915026 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in Patent Document 1, the temperature measurement plate is simply placed on the holding surface of the holding device, so there is a risk that the temperature measurement plate is not securely held on the holding surface. As a result, heat is not reliably transferred between the holding device and the temperature measurement plate, and the temperature distribution of the temperature measurement plate and the holding surface may not correspond. As a result, the temperature distribution of the holding surface of the holding device cannot be accurately measured based on the temperature measurement results of the temperature measurement plate, and there is a risk that the measurement accuracy of the temperature distribution on the holding surface may be reduced.

[0005] Therefore, the present disclosure has been made to solve the above-mentioned problems, and aims to provide a temperature measurement plate, a method for manufacturing a holding device, and a temperature measurement device that can improve the measurement accuracy of the temperature distribution on the holding surface of a holding device. [Means for solving the problem]

[0006] In semiconductor manufacturing processes, it is necessary to control the temperature distribution on the surface of an object held on the holding surface of a holding device. Here, the temperature distribution on the surface of the object is influenced by heat transfer within the holding device and heat input from the plasma in the vacuum chamber of the semiconductor manufacturing equipment where the object is placed. Therefore, in the manufacturing and inspection of holding devices, there is a need for a means to measure the temperature distribution on the surface of the object under conditions that simulate those when the holding device is in use (i.e., when the object is actually held on the holding surface of the semiconductor manufacturing equipment and processed, and heat transfer within the holding device and heat input from the plasma occur).

[0007] Therefore, it is conceivable to measure the temperature distribution on the holding surface of the holding device under conditions simulating those during use of the holding device, and estimate the temperature distribution on the surface of the object based on the measurement results. However, in this case, if the holding device is not provided with a heating element (e.g., a heater), the holding device cannot be heated, and the heat transfer within the holding device during use (i.e., heating of the holding device and heat dissipation due to cooling of the holding device by, for example, a refrigerant) cannot be reproduced, which poses a problem that the temperature distribution on the holding surface cannot be accurately measured.

[0008] Therefore, one form of the present disclosure made to solve the above problem is characterized in that, in order to measure the temperature distribution of a holding surface in a holding device that includes a holding surface for holding an object and an electrostatic electrode that generates electrostatic attraction to hold the object on the holding surface, a temperature measurement plate placed on the holding surface has an electrostatic receiving electrode that can generate electrostatic attraction together with the electrostatic electrode, and a heating element.

[0009] According to this aspect, even if the holding device does not have a heating element, the holding device can be heated by placing the temperature-measuring plate on the holding surface of the holding device and causing the heating element of the temperature-measuring plate to generate heat. This makes it possible to reproduce the heat transfer within the holding device when the holding device is in use. This improves the measurement accuracy of the temperature distribution on the holding surface.

[0010] Furthermore, the temperature measurement plate can be reliably held on the holding surface of the holding device by electrostatic attraction using the electrostatic electrode and the electrostatic receiving electrode. This ensures reliable heat transfer between the temperature measurement plate and the holding device, allowing the temperature distribution of the temperature measurement plate to correspond to the temperature distribution on the holding surface of the holding device. Therefore, the temperature distribution on the holding surface can be accurately measured based on the temperature measurement results of the temperature measurement plate, improving the measurement accuracy of the temperature distribution on the holding surface.

[0011] In the above aspect, it is preferable to have a temperature measurement mechanism for measuring the temperature of the temperature measurement plate.

[0012] According to this aspect, the temperature of the temperature-measuring plate can be directly measured by the temperature measurement mechanism provided on the temperature-measuring plate, improving the accuracy of measuring the temperature of the temperature-measuring plate, and therefore the temperature distribution on the holding surface of the holding device can be measured more accurately based on the temperature measurement results of the temperature-measuring plate.

[0013] In the above aspect, it is preferable that the electrostatic receiving electrode and the heating element are arranged in this order from the side placed on the holding surface.

[0014] According to this aspect, the electrostatic receiving electrode can be brought closer to the electrostatic electrode of the holding device, so that the temperature measurement plate can be more effectively held securely on the holding surface of the holding device by electrostatic attraction using the electrostatic electrode and the electrostatic receiving electrode.

[0015] In the above aspect, it is preferable that the temperature measurement mechanism is a resistance temperature detector, and that the electrostatic receiving electrode, the resistance temperature detector, and the heating element are arranged in this order from the side placed on the holding surface.

[0016] According to this aspect, the electrostatic receiving electrode can be brought closer to the electrostatic electrode of the holding device, so that the temperature measurement plate can be more effectively held securely on the holding surface of the holding device by electrostatic attraction using the electrostatic electrode and the electrostatic receiving electrode.

[0017] Furthermore, since the resistance temperature detector can be brought closer to the holding surface, the measured value of the resistance temperature detector can be made to correspond more accurately to the temperature of the holding surface, thereby more reliably improving the measurement accuracy of the temperature distribution on the holding surface.

[0018] In the above aspect, it is preferable that the outer diameter of the temperature measurement plate is larger than the outer diameter of the holding surface, and that the terminals of the electrostatic receiving electrode and the terminals of the heating element are positioned radially outward from the holding surface when the temperature measurement plate is placed on the holding surface.

[0019] According to this aspect, the terminals of the electrostatic receiving electrode and the terminals of the heating element are not disposed in the portion corresponding to the holding surface, so that the measurement accuracy of the temperature distribution of the holding surface can be improved more reliably.

[0020] In the above aspect, it is preferable that the outer peripheral portion on the side that is placed on the holding surface is provided with a stepped portion that is recessed on the opposite side to the side that is placed on the holding surface, and that the electrostatic receiving electrode and the heating element are arranged so as to be located within a range corresponding to the holding surface in the radial direction.

[0021] According to this aspect, the temperature measurement plate can be more effectively held on the holding surface, and can be heated by the heating element of the temperature measurement plate.

[0022] Another aspect of the present disclosure made to solve the above-mentioned problems is a method for manufacturing a holding device comprising a holding surface for holding an object and an electrostatic electrode for generating electrostatic attraction to hold the object on the holding surface, the method comprising the steps of: preparing the holding device; placing a temperature measurement plate on the holding surface, the temperature measurement plate comprising an electrostatic receiving electrode capable of generating electrostatic attraction together with the electrostatic electrode and a heating element; cooling the holding device; applying a voltage to the electrostatic electrode to generate electrostatic attraction between the electrostatic electrode and the electrostatic receiving electrode, thereby holding the temperature measurement plate on the holding surface; causing the heating element of the temperature measurement plate to generate heat; and measuring the temperature of the temperature measurement plate using a temperature measurement mechanism and measuring the temperature distribution on the holding surface based on the measurement results.

[0023] According to this aspect, even if the holding device does not have a heating element, by generating heat from the heating element of the temperature measurement plate, it is possible to reproduce the heat transfer in the holding device when the holding device is in use. Furthermore, by using the electrostatic electrode and the electrostatic receiving electrode, the temperature measurement plate can be reliably held in the holding device by electrostatic attraction. Therefore, it is possible to improve the measurement accuracy of the temperature distribution on the holding surface of the holding device.

[0024] Another aspect of the present disclosure made to solve the above problems is a temperature measurement device for measuring the temperature distribution of a holding surface in a holding device having a holding surface for holding an object and an electrostatic electrode that generates electrostatic attraction to hold the object on the holding surface, the temperature measurement device having a temperature measurement plate placed on the holding surface and a temperature measurement mechanism that measures the temperature of the temperature measurement plate, the temperature measurement plate having an electrostatic receiving electrode that can generate electrostatic attraction together with the electrostatic electrode and a heating element, and the temperature distribution of the holding surface is measured based on the measurement results of the temperature measurement mechanism.

[0025] According to this aspect, even if the holding device does not have a heating element, by generating heat from the heating element of the temperature measurement plate, it is possible to reproduce the heat transfer in the holding device when the holding device is in use. Furthermore, by using the electrostatic electrode and the electrostatic receiving electrode, the temperature measurement plate can be reliably held in the holding device by electrostatic attraction. Therefore, it is possible to improve the measurement accuracy of the temperature distribution on the holding surface of the holding device. [Effects of the Invention]

[0026] According to the temperature measurement plate, the method for manufacturing a holding device, and the temperature measurement device of the present disclosure, it is possible to improve the accuracy of measuring the temperature distribution on the holding surface of the holding device. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a schematic perspective view of an electrostatic chuck. [Figure 2] FIG. 2 is a schematic diagram of the electrostatic chuck taken along an XZ cross section. [Figure 3] FIG. 1 is a schematic plan view of an electrostatic chuck. [Figure 4] 1 is a schematic configuration diagram of a temperature measuring device according to an embodiment of the present invention. [Figure 5] 1 is a schematic cross-sectional view of an inspection heat-generating ceramic having a sense resistor placed on a holding surface of an electrostatic chuck in the present embodiment. FIG. [Figure 6] 1 is a schematic cross-sectional view of an embodiment of the present invention in which a heat-generating ceramic for inspection having a thermistor is placed on a holding surface of an electrostatic chuck. [Figure 7] 10A and 10B are diagrams illustrating a method for measuring the temperature distribution on the holding surface of the electrostatic chuck in the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0028] The temperature measuring plate, the manufacturing method of the holding device, and the temperature measuring device according to the present disclosure will be described below. In the present embodiment, the holding device will be described by taking as an example an electrostatic chuck used in semiconductor manufacturing equipment such as a film forming apparatus (such as a CVD film forming apparatus or a sputtering film forming apparatus) or an etching apparatus (such as a plasma etching apparatus).

[0029] <Explanation of electrostatic chuck> First, the electrostatic chuck 1 will be described.

[0030] The electrostatic chuck 1 is a device that attracts and holds a semiconductor wafer W by electrostatic attraction, and is used, for example, to fix the semiconductor wafer W in a vacuum chamber of a semiconductor manufacturing device. The semiconductor wafer W is an example of the "target object" in this disclosure.

[0031] In the following description, for convenience of explanation, the X, Y, and Z axes are defined as shown in Fig. 1. Here, the Z axis is an axis in the axial direction of the electrostatic chuck 1 (the vertical direction in Fig. 1), and the X and Y axes are axes in the radial direction of the electrostatic chuck 1.

[0032] As shown in FIGS. 1 and 2, the electrostatic chuck 1 includes a plate-shaped member 10, a base member 20, and a bonding layer 30 that bonds the plate-shaped member 10 and the base member 20 together.

[0033] 1, the plate-like member 10 is a disk-like member made of ceramics. Specifically, the plate-like member 10 has a stepped disk shape in which two disks of different diameters are stacked on top of each other with a common central axis (more specifically, a disk-like upper section 10a having a smaller diameter is stacked on top of a disk-like lower section 10b having a larger diameter).

[0034] As shown in Figures 1 and 2, the plate-shaped member 10 has a holding surface 11 (upper surface) that holds the semiconductor wafer W, and a lower surface 12 that is provided on the opposite side of the holding surface 11 in the thickness direction of the plate-shaped member 10 (i.e., the Z-axis direction).

[0035] The holding surface 11 of the plate-like member 10 has an uneven shape. Specifically, as shown in Figures 2 and 3, the holding surface 11 has an annular convex portion 13 formed near its outer edge, and a plurality of independent columnar convex portions 14 formed inside the annular convex portion 13. In this way, the holding surface 11 has an annular convex portion 13 formed so as to surround all of the plurality of convex portions 14. The annular convex portion 13 is also called a seal band.

[0036] As shown in Fig. 3, each of the protrusions 14 has a substantially circular shape when viewed in the Z-axis direction (plan view) and is arranged at substantially equal intervals. Note that, as shown in Figs. 2 and 3, the portion of the holding surface 11 of the plate-like member 10 inside the annular protrusion 13 where no protrusions 14 are formed is a recess 15.

[0037] The semiconductor wafer W is supported by the annular convex portion 13 and the plurality of convex portions 14 on the holding surface 11 of the plate-like member 10 and is held by the electrostatic chuck 1. When the semiconductor wafer W is held by the electrostatic chuck 1, a space S exists between the surface (lower surface) of the semiconductor wafer W and the holding surface 11 of the plate-like member 10 (more specifically, the recessed portion 15 of the holding surface 11) (see FIG. 2). An inert gas (e.g., helium gas) is supplied to this space S from gas holes 16 opening in the holding surface 11 via a gas flow path 40 formed in the electrostatic chuck 1.

[0038] 2, a chuck electrode 50 is disposed inside the plate-like member 10. The chuck electrode 50 has, for example, a substantially circular shape when viewed in the Z-axis direction, and is made of a conductive material (for example, tungsten or molybdenum). In this manner, the electrostatic chuck 1 is configured to hold the semiconductor wafer W on the holding surface 11 by supplying power to the chuck electrode 50 to generate an electrostatic attractive force. The chuck electrode 50 is an example of the "electrostatic electrode" of the present disclosure.

[0039] 1 and 2, the base member 20 is disposed on the side of the plate-like member 10 opposite the holding surface 11. The base member 20 is formed, for example, in a cylindrical shape. The base member 20 is formed, for example, from a metal (for example, aluminum or an aluminum alloy), but may be formed from a material other than metal.

[0040] The base member 20 is thermally connected to the lower surface 12 of the plate-like member 10 via a bonding layer 30 .

[0041] Furthermore, a coolant flow path 21 for flowing a coolant (e.g., a fluorine-based inert liquid, water, etc.) is formed in the base member 20. By flowing a coolant through this coolant flow path 21, the base member 20 is cooled, and the plate-like member 10 is cooled via the bonding layer 30. This allows the semiconductor wafer W held on the holding surface 11 to be cooled, and the electrostatic chuck 1 allows temperature control of the semiconductor wafer W.

[0042] 1 and 2, the bonding layer 30 is disposed between the lower surface 12 of the plate-shaped member 10 and the base member 20, and bonds the plate-shaped member 10 and the base member 20 in a heat-transferable manner. The bonding layer 30 is made of a resin adhesive such as a silicone resin, an acrylic resin, or an epoxy resin.

[0043] It is assumed here that the electrostatic chuck 1 does not have a heater as a heating element for adjusting the temperature of the holding surface 11.

[0044] <Explanation of the temperature measuring device and the heat generating ceramic for inspection according to this embodiment> In a semiconductor manufacturing process, it is necessary to control the temperature distribution on the surface of a semiconductor wafer W held on the holding surface 11 of an electrostatic chuck 1. The temperature distribution of the semiconductor wafer W is affected by heat transfer within the electrostatic chuck 1 and heat input from plasma in a vacuum chamber of a semiconductor manufacturing apparatus in which the semiconductor wafer W is placed. Therefore, in manufacturing and inspecting the electrostatic chuck 1, there is a need for a means for measuring the temperature distribution on the surface of the semiconductor wafer W under conditions simulating those when the electrostatic chuck 1 is in use (i.e., when a semiconductor wafer W is actually held on the holding surface 11 in a semiconductor manufacturing apparatus and processed, and heat transfer within the electrostatic chuck 1 and heat input from the plasma occur).

[0045] Therefore, it is conceivable to measure the temperature distribution of the holding surface 11 of the electrostatic chuck 1 under conditions simulating those during use of the electrostatic chuck 1, and then estimate the temperature distribution on the surface of the semiconductor wafer W based on the measurement results. However, in this case, if the electrostatic chuck 1 is not provided with a heating element (e.g., a heater), the electrostatic chuck 1 cannot be heated, and the heat transfer within the electrostatic chuck 1 during use of the electrostatic chuck 1 (i.e., heating of the electrostatic chuck 1 and heat dissipation due to cooling of the electrostatic chuck 1 by the coolant flowing through the coolant flow passage 21) cannot be reproduced, resulting in a problem that the temperature distribution of the holding surface 11 cannot be accurately measured.

[0046] In order to solve this problem, in this embodiment, the temperature distribution on the holding surface 11 of the electrostatic chuck 1 is measured using a temperature measuring device 100 and an inspection heat generating ceramic 120 as described below.

[0047] (Explanation of temperature measuring device) 4, the temperature measuring device 100 of this embodiment includes a sealed container 110, an inspection heat-generating ceramic 120 placed on the holding surface 11 of the electrostatic chuck 1, and an IR camera 130 that measures the temperature of the inspection heat-generating ceramic 120. The IR camera 130 is configured to measure the temperature of the inspection heat-generating ceramic 120 through a window 111 of the sealed container 110.

[0048] The temperature measuring device 100 measures the temperature distribution on the holding surface 11 of the electrostatic chuck 1 based on the measurement results of the temperature of the inspection heat generating ceramic 120 by the IR camera 130 and the sense resistor 123 or thermistor 124 of the inspection heat generating ceramic 120 described later.

[0049] In this manner, in this embodiment, the temperature distribution of the semiconductor wafer W can be estimated under conditions simulating those during use of the electrostatic chuck 1 during the manufacture and inspection of the electrostatic chuck 1, based on the measurement results of the temperature distribution of the holding surface 11 measured using the temperature measuring device 100 and the heat-generating ceramic for inspection 120. The heat-generating ceramic for inspection 120 is an example of the "temperature measurement plate" of the present disclosure.

[0050] (Explanation of the heat-generating ceramic for testing) The heat-generating ceramic for inspection 120 is a plate-like body that is placed on the holding surface 11 in order to measure the temperature distribution of the holding surface 11 of the electrostatic chuck 1. The heat-generating ceramic for inspection 120 is a disk-shaped member made of ceramics. As shown in FIG. 5 , the heat-generating ceramic for inspection 120 has a chuck receiving electrode 121 and a heater 122.

[0051] The chuck receiving electrode 121 is an electrode that can generate an electrostatic attractive force together with the chuck electrode 50 (of the electrostatic chuck 1) that is connected to an HV power supply (i.e., a high-voltage power supply) by being connected to a GND. The heater 122 is a heating element that heats the heat-generating ceramic for inspection 120 to increase its temperature.

[0052] The heat-generating ceramic for inspection 120 is an example of a "temperature measurement plate" in the present disclosure. The chuck receiving electrode 121 is an example of an "electrostatic receiving electrode" in the present disclosure.

[0053] The heat-generating ceramic for inspection 120 also has a sense resistor 123 (i.e., a resistance temperature detector) that measures the temperature of the heat-generating ceramic for inspection 120. A chuck receiving electrode 121, the sense resistor 123, and a heater 122 are arranged in this order from the side placed on the holding surface 11.

[0054] The positional relationship between the sense resistor 123 and the heater 122 may be vertical, i.e., the chuck receiving electrode 121, the heater 122, and the sense resistor 123 may be arranged in this order from the side placed on the holding surface 11. The sense resistor 123 is an example of the "temperature measurement mechanism" of the present disclosure.

[0055] 6, the heat-generating ceramic for inspection 120 may have a thermistor 124 instead of the sense resistor 123. In this case, a chuck receiving electrode 121, a heater 122, and a thermistor 124 are arranged in this order from the side placed on the holding surface 11. The thermistor 124 is an example of the "temperature measurement mechanism" of the present disclosure.

[0056] 5 and 6, the terminal 141 of the chuck receiving electrode 121 and the terminal 142 of the heater 122 are arranged so as to be located radially outward of the holding surface 11 when the inspection heat-generating ceramic 120 is placed on the holding surface 11. Specifically, the terminal 141 of the chuck receiving electrode 121 and the terminal 142 of the heater 122 are arranged at positions corresponding to a stepped portion 125 of the inspection heat-generating ceramic 120. The stepped portion 125 is a recessed portion on the outer periphery of the side of the inspection heat-generating ceramic 120 that is placed on the holding surface 11, facing away from the side that is placed on the holding surface 11.

[0057] In this way, the terminal 141 of the chuck receiving electrode 121 and the terminal 142 of the heater 122 are positioned radially outward of the holding surface 11, which makes it difficult for the terminal 141 of the chuck receiving electrode 121 or the terminal 142 of the heater 122 to enter the measurement area when the temperature of the heat-generating ceramic 120 for inspection is measured using the IR camera 130 of the temperature measuring device 100, as described below.

[0058] The chuck receiving electrode 121, the heater 122, the sense resistor 123, or thermistor 124 are arranged so as to be positioned within a range corresponding to the holding surface 11 in the radial direction. That is, the chuck receiving electrode 121, the heater 122, the sense resistor 123, or thermistor 124 are arranged at a position radially inward (in the X and Y directions) of the step portion 125 in the inspection heat-generating ceramic 120. This allows the inspection heat-generating ceramic 120 to be held on the holding surface 11 of the electrostatic chuck 1 by electrostatic attraction using the chuck electrode 50 and the chuck receiving electrode 121 of the electrostatic chuck 1 at the holding surface 11, and also allows the heater 122 of the inspection heat-generating ceramic 120 to heat the holding surface 11.

[0059] (Explanation of how to measure the temperature distribution on the holding surface) Next, a method for measuring the temperature distribution on the holding surface 11 of the electrostatic chuck 1 using the temperature measuring device 100 of this embodiment and the heat generating ceramic for inspection 120 will be described. Note that the measurement of the temperature distribution on the holding surface 11 is a step included in the manufacturing method of the electrostatic chuck 1, and is performed after the electrostatic chuck 1 is prepared (step P0) during the manufacturing of the electrostatic chuck 1, as shown in FIG.

[0060] 7, first, inside the sealed container 110 of the temperature measuring device 100, the heat-generating ceramic for inspection 120 is placed on the holding surface 11 of the electrostatic chuck 1 (see FIG. 4) (step P1). Then, the inside of the sealed container 110 is evacuated.

[0061] Next, the electrostatic chuck 1 is cooled (step P2). Specifically, a coolant is caused to flow through the coolant flow passage 21 to cool the base member 20, thereby cooling the plate-like member 10 via the bonding layer 30.

[0062] Next, the heat-generating ceramic for inspection 120 is held on the holding surface 11 of the electrostatic chuck 1 (step P3). Specifically, a voltage (e.g., a high voltage of 2.5 kV) is applied to the chuck electrode 50 of the electrostatic chuck 1, while the chuck receiving electrode 121 of the heat-generating ceramic for inspection 120 is connected to GND. This generates an electrostatic attractive force between the chuck electrode 50 and the chuck receiving electrode 121, thereby holding the heat-generating ceramic for inspection 120 on the holding surface 11.

[0063] The order in which steps P2 and P3 are performed may be reversed, and step P2 may be performed after step P3.

[0064] Next, the heater 122 of the heat-generating ceramic for inspection 120 is heated (step P4). As a result, heat is transferred from the heater 122 to the plate-like member 10 of the electrostatic chuck 1, thereby heating the electrostatic chuck 1. Meanwhile, by flowing a refrigerant through the refrigerant flow path 21 to cool the electrostatic chuck 1 as described above (step P2), heat can be dissipated. Therefore, the heat transfer within the electrostatic chuck 1 when the electrostatic chuck 1 is in use can be reproduced.

[0065] Next, the temperature distribution of the holding surface 11 of the electrostatic chuck 1 is measured (step P5). Specifically, the temperature of the heat-generating ceramic for inspection 120 is measured using the IR camera 130 and the sense resistor 123 or the thermistor 124, and the temperature distribution of the holding surface 11 is measured based on the measurement result.

[0066] <Effects of this embodiment> According to this embodiment, the heat-generating ceramic for inspection 120 has a chuck receiving electrode 121 and a heater 122. Here, the chuck receiving electrode 121 is an electrode capable of generating an electrostatic attractive force together with the chuck electrode 50 of the electrostatic chuck 1.

[0067] In this way, even if the electrostatic chuck 1 is not provided with a heater, the electrostatic chuck 1 can be heated by causing the heater 122 of the heat-generating ceramic for inspection 120 to generate heat while the heat-generating ceramic for inspection 120 is placed on the holding surface 11 of the electrostatic chuck 1. This makes it possible to reproduce the heat transfer within the electrostatic chuck 1 when the electrostatic chuck 1 is in use. This also makes it possible to improve the measurement accuracy of the temperature distribution on the holding surface 11.

[0068] Furthermore, the chuck electrode 50 and the chuck receiving electrode 121 can be used to reliably hold the inspection heat-generating ceramic 120 on the holding surface 11 of the electrostatic chuck 1 by electrostatic attraction. Therefore, the inspection heat-generating ceramic 120 can be closely attached to the annular convex portion 13 and the plurality of convex portions 14 on the holding surface 11. Furthermore, the space S formed between the inspection heat-generating ceramic 120 and the concave portion 15 of the holding surface 11 can be sealed, and this space S can be filled with an inert gas supplied from the gas holes 16. Therefore, heat can be reliably transferred between the inspection heat-generating ceramic 120 and the electrostatic chuck 1, so that the temperature distribution of the inspection heat-generating ceramic 120 and the temperature distribution of the holding surface 11 of the electrostatic chuck 1 can be made to correspond to each other.

[0069] Then, the inside of the sealed container 110 of the temperature measuring device 100 is evacuated, and while the heater 122 of the heat-generating ceramic for inspection 120 heats the electrostatic chuck 1 and the coolant is passed through the coolant flow path 21 to cool the electrostatic chuck 1, the temperature of the heat-generating ceramic for inspection 120 is measured using the IR camera 130, the sense resistor 123, or thermistor 124, and the temperature distribution of the holding surface 11 of the electrostatic chuck 1 can be measured based on the measurement result. Therefore, the measurement accuracy of the temperature distribution of the holding surface 11 can be improved.

[0070] The heat-generating ceramic for inspection 120 also has a sense resistor 123 or a thermistor 124 for measuring the temperature of the heat-generating ceramic for inspection 120 .

[0071] In this way, the temperature of the heat-generating ceramic for inspection 120 can be directly measured by the sense resistor 123 or thermistor 124 provided in the heat-generating ceramic for inspection 120, thereby improving the accuracy of measuring the temperature of the heat-generating ceramic for inspection 120. Therefore, the temperature distribution on the holding surface 11 of the electrostatic chuck 1 can be measured more accurately based on the measurement result of the temperature of the heat-generating ceramic for inspection 120.

[0072] Furthermore, by disposing a sense resistor 123 or a thermistor 124 in each of the many divided zones of the heat-generating ceramic for testing 120, the temperature distribution of the heat-generating ceramic for testing 120 can be measured in detail.

[0073] In addition, a chuck receiving electrode 121, a sense resistor 123, and a heater 122 are arranged in this order from the side placed on the holding surface 11 of the electrostatic chuck 1.

[0074] This allows the chuck receiving electrode 121 of the heat-generating ceramic for inspection 120 to be brought close to the chuck electrode 50 of the electrostatic chuck 1, so that the heat-generating ceramic for inspection 120 can be securely held on the holding surface 11 of the electrostatic chuck 1 by electrostatic attraction using the chuck electrode 50 and the chuck receiving electrode 121.

[0075] Furthermore, since the sense resistor 123 of the heat-generating ceramic for inspection 120 can be brought closer to the holding surface 11 of the electrostatic chuck 1, the measurement value of the sense resistor 123 can be made to more accurately correspond to the temperature of the holding surface 11. Therefore, the measurement accuracy of the temperature distribution on the holding surface 11 can be improved more reliably.

[0076] Further, the outer diameter D1 of the heat-generating ceramic for inspection 120 is larger than the outer diameter D2 of the holding surface 11. The terminal 141 of the chuck receiving electrode 121 and the terminal 142 of the heater 122 are arranged so as to be located radially outward of the holding surface 11 when the heat-generating ceramic for inspection 120 is placed on the holding surface 11.

[0077] This prevents the terminal 141 of the chuck receiving electrode 121 of the inspection heat-generating ceramic 120 and the terminal 142 of the heater 122 from being positioned in the area corresponding to the holding surface 11 of the electrostatic chuck 1. Therefore, when the temperature of the inspection heat-generating ceramic 120 is measured by the IR camera 130 of the temperature measuring device 100, it is possible to prevent the terminal 141 of the chuck receiving electrode 121 and the terminal 142 of the heater 122 from entering the measurement area. This improves the accuracy of measuring the temperature distribution of the inspection heat-generating ceramic 120 by the IR camera 130, thereby more reliably improving the accuracy of measuring the temperature distribution of the holding surface 11.

[0078] The heat-generating ceramic for inspection 120 has a stepped portion 125, which is recessed on the opposite side to the side where it is placed on the holding surface 11, at the outer periphery of the side where it is placed on the holding surface 11 of the electrostatic chuck 1. The chuck receiving electrode 121 and the heater 122 are arranged so as to be located within a range corresponding to the holding surface 11 in the radial direction.

[0079] This allows the heat generating ceramic for inspection 120 to be held more effectively on the holding surface 11 of the electrostatic chuck 1 and also allows the heat generating ceramic for inspection 120 to be heated by the heater 122 .

[0080] It should be noted that the above-described embodiments are merely examples and do not limit the present disclosure in any way. It goes without saying that various improvements and modifications are possible within the scope of the gist of the present disclosure.

[0081] For example, it is also possible to measure the temperature distribution on the holding surface 11 of the electrostatic chuck 1 based only on the measurement results of the IR camera 130 or only on the measurement results of the sense resistor 123 or the thermistor 124 . [Explanation of symbols]

[0082] 1. Electrostatic chuck 10 Plate-shaped member 11 Holding surface 20 Base member 21 refrigerant flow path 30 Bonding layer 50 Chuck electrode 100 Temperature measuring device 120 Heat-generating ceramic for inspection 121 Chuck receiving electrode 122 Heater 123 Sense resistor 124 Thermistor 125 Step 130 IR camera 141 (Chuck receiving electrode) terminal 142 (Heater) terminal W Semiconductor wafer D1 (Outer diameter of the heating ceramic for testing) D2 (retaining surface) outer diameter P0,P1,P2,P3,P4,P5 process

Claims

1. A holding device includes a holding surface for holding an object and an electrostatic electrode for generating an electrostatic attraction force to hold the object on the holding surface. The temperature measurement plate is placed on the holding surface to measure the temperature distribution of the holding surface, an electrostatic receiving electrode capable of generating an electrostatic attractive force together with the electrostatic electrode; a heating element; A temperature measuring plate characterized by:

2. 2. The temperature measuring plate according to claim 1, a temperature measurement mechanism for measuring the temperature of the temperature measurement plate; A temperature measuring plate characterized by:

3. 3. The temperature measuring plate according to claim 1, the electrostatic receiving electrode and the heating element are arranged in this order from the side placed on the holding surface; A temperature measuring plate characterized by:

4. 3. The temperature measuring plate according to claim 2, the temperature measuring mechanism is a resistance temperature detector, the electrostatic receiving electrode, the resistance temperature detector, and the heating element are arranged in this order from the side placed on the holding surface; A temperature measuring plate characterized by:

5. 3. The temperature measuring plate according to claim 1, the temperature measurement plate has an outer diameter larger than the outer diameter of the holding surface; the terminal of the electrostatic receiving electrode and the terminal of the heating element are arranged so as to be positioned radially outward of the holding surface when the temperature measurement plate is placed on the holding surface; A temperature measuring plate characterized by:

6. 3. The temperature measuring plate according to claim 1, a step portion recessed toward the opposite side to the side placed on the holding surface, on an outer periphery portion of the side placed on the holding surface; the electrostatic receiving electrode and the heating element are arranged so as to be positioned within a range corresponding to the holding surface in the radial direction; A temperature measuring plate characterized by:

7. A method for manufacturing a holding device including a holding surface for holding an object and an electrostatic electrode for generating an electrostatic attractive force to hold the object on the holding surface, providing the holding device; a step of placing a temperature measurement plate on the holding surface, the temperature measurement plate including an electrostatic receiving electrode capable of generating an electrostatic attraction force together with the electrostatic electrode and a heating element; cooling the holding device; a step of applying a voltage to the electrostatic electrode to generate an electrostatic attractive force between the electrostatic electrode and the electrostatic receiving electrode, thereby holding the temperature measurement plate on the holding surface; a step of causing the heating element of the temperature measurement plate to generate heat; measuring the temperature of the temperature measurement plate by a temperature measurement mechanism, and measuring the temperature distribution of the holding surface based on the measurement result; A method for manufacturing a holding device, comprising:

8. A temperature measuring device for measuring a temperature distribution on a holding surface of a holding device including: a holding surface for holding an object; and an electrostatic electrode for generating an electrostatic attractive force to hold the object on the holding surface, a temperature measuring plate placed on the holding surface; a temperature measurement mechanism for measuring the temperature of the temperature measurement plate, The temperature measuring plate is an electrostatic receiving electrode capable of generating an electrostatic attractive force together with the electrostatic electrode; A heating element; Preparation, measuring a temperature distribution on the holding surface based on a measurement result of the temperature measurement mechanism; A temperature measuring device comprising:

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