Sensor

Abstract

To provide a sensor capable of high-accuracy detection.SOLUTION: The sensor comprises: a substrate including a first substrate area and a second substrate area; a first detection unit; and a second detection unit. The first detection unit includes: a first fixing unit fixed to the first substrate area; a first temperature detection element fixed to the first substrate area; and a first element supported by the first fixing unit. A first gap is provided between the first temperature detection element and the first element. The first element includes a first resistance member and a first conductive member. At least portion of the first temperature detection element overlaps the first element in a first direction from the first substrate area to the first fixing unit. The second detection unit includes: a second fixing unit fixed to the second substrate area; and a second element supported by the second fixing unit. A second gap is provided between the second substrate area and the second element. The second element includes a second resistance member.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION An embodiment of the present invention relates to a sensor. [Background technology]

[0002] For example, there are sensors that use MEMS (Micro Electro Mechanical Systems) elements, etc. Stable detection is desired for sensors. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-41893 Summary of the Invention [Problem to be solved by the invention]

[0004] The embodiments provide a sensor capable of highly accurate detection. [Means for solving the problem]

[0005] According to an embodiment, the sensor includes a base including a first base region and a second base region, a first detection unit, and a second detection unit. The first detection unit includes a first fixing unit fixed to the first base region, a first temperature detection element fixed to the first base region, and a first element supported by the first fixing unit. A first gap is provided between the first temperature detection element and the first element. The first element includes a first resistive member and a first conductive member. At least a portion of the first temperature detection element overlaps the first element in a first direction from the first base region to the first fixing unit. The second detection unit includes a second fixing unit fixed to the second base region and a second element supported by the second fixing unit. A second gap is provided between the second base region and the second element. The second element includes a second resistive member. [Brief explanation of the drawings]

[0006] [Figure 1] 1A and 1B are schematic cross-sectional views illustrating the sensor according to the first embodiment. [Figure 2] FIG. 2 is a schematic plan view illustrating the sensor according to the first embodiment. [Figure 3] 3A and 3B are schematic cross-sectional views illustrating the sensor according to the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In this specification and in each drawing, elements similar to those previously described with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted where appropriate.

[0008] (First embodiment) 1A and 1B are schematic cross-sectional views illustrating the sensor according to the first embodiment. FIG. 2 is a schematic plan view illustrating the sensor according to the first embodiment. Fig. 1(a) is a cross-sectional view taken along line A1-A2 in Fig. 2. Fig. 1(b) is a cross-sectional view taken along line A3-A4 in Fig. 2. As shown in FIGS. 1(a), 1(b) and 2, a sensor 110 according to the embodiment includes a base 40, a first detection unit 10A and a second detection unit 10B.

[0009] The substrate 40 includes a first substrate region 41 and a second substrate region 42. The first detection unit 10A is provided in the first substrate region 41. The second detection unit 10B is provided in the second substrate region 42. The region where the first detection unit 10A is provided corresponds to the first substrate region 41. The region where the second detection unit 10B is provided corresponds to the second substrate region 42. The boundary between these substrate regions may be clear or unclear.

[0010] The first detection unit 10A includes a first fixed portion 11F, a first temperature detection element 51, and a first element 11E. The first fixed portion 11F is fixed to the first base region 41. The first temperature detection element 51 is fixed to the first base region 41. The first element 11E is supported by the first fixed portion 11F. A first gap g1 is provided between the first temperature detection element 51 and the first element 11E. The first element 11E includes a first resistance member 11 and a first conductive member 21. The first element 11E is, for example, a first film portion. The first conductive member 21 is, for example, a heater.

[0011] A first direction D1 from the first base region 41 to the first fixing portion 11F is defined as the Z-axis direction. A direction perpendicular to the Z-axis direction is defined as the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is defined as the Y-axis direction. The direction from the first base region 41 to the second base region 42 intersects with the first direction D1.

[0012] In a first direction D1 from the first base region 41 to the first fixing portion 11F, at least a portion of the first temperature detection element 51 overlaps with the first element 11E.

[0013] The second detection unit 10B includes a second fixed portion 12F and a second element 12E. The second fixed portion 12F is fixed to the second base region 42. The second element 12E is supported by the second fixed portion 12F. A second gap g2 is provided between the second base region 42 and the second element 12E. The second element 12E includes a second resistance member 12. The second element 12E is, for example, a second membrane portion.

[0014] 2, the sensor 110 may include a control unit 70. The control unit 70 is electrically connected to the first resistive member 11, the first conductive member 21, the second resistive member 12, and the first temperature detecting element 51. The control unit 70 may be configured to perform the following first operation. In the first operation, the control unit 70 detects a detection value corresponding to the difference between the first electrical resistance of the first resistive member 11 and the second electrical resistance of the second resistive member 12 after power is supplied to the first conductive member 21.

[0015] For example, pulsed power is supplied to first conductive member 21. The power supplied to first conductive member 21 increases the temperature of first element 11E. Thereafter, the temperature of first element 11E changes (decreases) toward its original temperature. At this time, the heat propagation characteristics change depending on the detection target (e.g., gas) present around first element 11E. The temperature of first element 11E takes a value depending on the detection target. Therefore, the first electrical resistance of first resistance member 11 depends on the state of the detection target (type, concentration, flow rate, etc.). On the other hand, no power is supplied to second element 12E, and the temperature of second element 12E is substantially constant. The detection target can be detected by detecting a value depending on the difference between the first electrical resistance of first element 11E and the second electrical resistance of second element 12E.

[0016] In the embodiment, a first temperature detection element 51 is provided. The first temperature detection element 51 detects the temperature around the first element 11E (for example, the temperature of the first base region 41). The first temperature detected by the first temperature detection element 51 is used to correct the above-mentioned "detection value corresponding to the difference," thereby enabling detection of the detection target with higher accuracy.

[0017] In this way, in the first operation, the control unit 70 outputs a first correction value obtained by correcting the detection value using the first value corresponding to the first temperature detected by the first temperature detection element 51. For example, the control unit 70 is configured to correct the detection value using the first value corresponding to the first temperature detected by the first temperature detection element 51 in the first operation, and detect the detection target substance around the first element 11E.

[0018] In this embodiment, at least a portion of the first temperature detection element 51 overlaps with the first element 11E in the first direction D1, which allows temperature correction to be performed with higher accuracy.

[0019] For example, a first reference example may be considered in which the first temperature detection element 51 is provided at a position different from the first element 11E. In the first reference example, the first temperature detection element 51 is provided at a position different from the first base region 41. The temperature detected by the first temperature detection element 51 does not necessarily reflect the temperature of the first element 11E. For example, a temperature change detected by the first temperature detection element 51 provided at a position distant from the first element 11E may lag behind the temperature change of the first element 11E. For this reason, highly accurate correction is difficult in the first reference example.

[0020] In the embodiment, at least a portion of the first temperature detection element 51 overlaps with the first element 11E in the first direction D1. Heat from the first element 11E is efficiently transferred to the first temperature detection element 51 through the first gap g1. For example, it is possible to suppress a time delay in a temperature change.

[0021] For example, heat from first element 11E is conducted to base 40 via first fixed portion 11F. The change in temperature due to heat conduction via first fixed portion 11F is efficiently detected by first temperature detection element 51. Higher accuracy of detection is possible.

[0022] In this example, the first detection unit 10A further includes a first connection portion 11C. The first connection portion 11C is provided between the first fixed portion 11F and the first element 11E. The first connection portion 11C is supported by the first fixed portion 11F. The first connection portion 11C supports the first element 11E. A portion of the first gap g1 is provided between the first base region 41 and the first connection portion 11C.

[0023] For example, a portion of the first temperature detection element 51 may overlap at least a portion of the first connection portion 11C in the first direction D1. The first temperature detection element 51 can more efficiently detect temperature changes caused by the first connection portion 11C.

[0024] A second direction D2 from the first fixing portion 11F to the first element 11E intersects with the first direction D1. The second direction D2 may be, for example, the X-axis direction. The width of the first connection portion 11C in an intersecting direction intersecting with the direction in which the first connection portion 11C extends (the second direction D2) is smaller than the width of the first element 11E in the intersecting direction. This, for example, suppresses heat from the first element 11E from being dissipated to the base 40 via the first connection portion 11C. Higher accuracy of detection is possible. The intersecting direction may be along a third direction D3 intersecting with a plane including the first direction D1 and the second direction D2. The third direction D3 is, for example, the Y-axis direction.

[0025] The first detection unit 10A may further include a first other fixing portion 11G fixed to the first base region 41. A portion of the first element 11E is further supported by the first other fixing portion 11G. In this example, the first detection unit 10A further includes a first other connection portion 11D. The first other connection portion 11D is provided between the first other fixing portion 11G and the first element 11E. The first other connection portion 11D is supported by the first other fixing portion 11G. The first other connection portion 11D supports the first element 11E. A portion of the first gap g1 is provided between the first base region 41 and the first other connection portion 11D. The first element 11E is provided between the first connection portion 11C and the first other connection portion 11D.

[0026] In this example, the second detection unit 10B further includes a second connection portion 12C. The second connection portion 12C is provided between the second fixed portion 12F and the second element 12E. The second connection portion 12C is supported by the second fixed portion 12F. The second connection portion 12C supports the second element 12E. A portion of the second gap g2 is provided between the second base region 42 and the second connection portion 12C.

[0027] The width of second connection portion 12C in a cross direction that crosses the direction in which second connection portion 12C extends is smaller than the width of second element 12E in the cross direction.

[0028] The second detection unit 10B may further include a second other fixing portion 12G fixed to the second base region 42. A portion of the second element 12E is further supported by the second other fixing portion 12G. In this example, the second detection unit 10B further includes a second other connection portion 12D. The second other connection portion 12D is provided between the second other fixing portion 12G and the second element 12E. The second other connection portion 12D is supported by the second other fixing portion 12G. The second other connection portion 12D supports the second element 12E. A portion of the second gap g2 is provided between the second base region 42 and the second other connection portion 12D. The second element 12E is provided between the second connection portion 12C and the second other connection portion 12D.

[0029] The second element 12E may further include a second conductive member 22. The configuration of the second conductive member 22 may be substantially the same as the configuration of the first conductive member 21. By providing the second conductive member 22, for example, the thermal characteristics (such as heat capacity) of the second element 12E can be made substantially the same as the thermal characteristics of the first element 11E. Correction using the second element 12E can be performed with higher accuracy.

[0030] Power may not be supplied to the second conductive member 22. The control unit 70 may not be connected to the second conductive member 22. The second conductive member 22 may not be used for operation.

[0031] In this example, the second detector 10B further includes a second temperature detection element 52 fixed to the second base region 42. A second gap g2 is provided between the second temperature detection element 52 and the second element 12E. At least a portion of the second temperature detection element 52 overlaps with the second element 12E in the first direction D1.

[0032] 2, the control unit 70 may be electrically connected to the first resistive element 11, the first conductive element 21, the second resistive element 12, the first temperature detecting element 51, and the second temperature detecting element 52. The control unit 70 may be configured to perform the following second operation. In the second operation, the control unit 70 detects a detection value corresponding to the difference between a first electrical resistance of the first resistive element 11 and a second electrical resistance of the second resistive element 12 after power is supplied to the first conductive element 21. In the second operation, the control unit 70 outputs a first correction value obtained by correcting the detection value using at least one of a first value corresponding to the first temperature detected by the first temperature detecting element 51 and a second value corresponding to the second temperature detected by the second temperature detecting element 52.

[0033] For example, in the second operation, the control unit 70 corrects the detection value using at least one of a first value corresponding to the first temperature detected by the first temperature detection element 51 and a second value corresponding to the second temperature detected by the second temperature detection element 52, and detects the target substance around the first element.

[0034] In the embodiment, a portion of the second temperature detection element 52 may overlap at least a portion of the second fixed portion 12F in the first direction D1.

[0035] As already described, the second detection unit 10B may further include a second connection portion 12C. A portion of the second temperature detection element 52 may overlap at least a portion of the second connection portion 12C in the first direction D1. The second detection unit 10B may further include a second other connection portion 12D. A portion of the second temperature detection element 52 may overlap at least a portion of the second other connection portion 12D in the first direction D1.

[0036] 1(a), the first element 11E may include a first insulating member 11i. The first insulating member 11i is provided around the first resistive member 11 and the first conductive member 21. As shown in FIG. 1(b), the second element 12E may include a second insulating member 12i. The second insulating member 12i is provided around the second resistive member 12 and the second conductive member 22.

[0037] 1(a), a first resistance wiring 11aL connected to a portion 11a of the first resistance component 11 may pass through a first fixed portion 11F. A first other resistance wiring 11bL connected to the other portion 11b of the first resistance component 11 may pass through a first other fixed portion 11G. A first conductive wiring 21aL connected to a portion 21a of the first conductive component 21 may pass through the first fixed portion 11F. A first other conductive wiring 21bL connected to the other portion 21b of the first conductive component 21 may pass through the first other fixed portion 11G.

[0038] 1(b), a second resistance wiring 12aL connected to a portion 12a of the second resistance member 12 may pass through the second fixed portion 12F. A second other resistance wiring 12bL connected to the other portion 12b of the second resistance member 12 may pass through the second other fixed portion 12G. A second conductive wiring 22aL connected to a portion 22a of the second conductive member 22 may pass through the second fixed portion 12F. A second other conductive wiring 22bL connected to the other portion 22b of the second conductive member 22 may pass through the second other fixed portion 12G.

[0039] 2, the control unit 70 may be electrically connected to the first resistance wiring 11aL and the first other resistance wiring 11bL. The control unit 70 may be electrically connected to the first conductive wiring 21aL and the first other conductive wiring 21bL. The control unit 70 may be electrically connected to the second resistance wiring 12aL and the second other resistance wiring 12bL.

[0040] 2, the control unit 70 may be electrically connected to a part 51a of the first temperature detection element 51 and another part 51b of the first temperature detection element 51. The control unit 70 may be electrically connected to a part 52a of the second temperature detection element 52 and another part 52b of the second temperature detection element 52.

[0041] In this manner, at least one of the first resistance wiring 11aL electrically connected to the first resistance member 11 and the first conductive wiring 21aL electrically connected to the first conductive member 21 may pass through the first fixed portion 11F. In this configuration, heat from the first element 11E is likely to propagate through these wirings. In this case, the first temperature detection element 51 overlaps the first fixed portion 11F, so that the temperature state of the first element 11E can be detected with higher accuracy. This enables more accurate correction.

[0042] 1(a) and 1(b), the base 40 may include a substrate 40s and an insulating layer 40i. The substrate 40s may be, for example, a semiconductor substrate (e.g., a silicon substrate). The insulating layer 40i is provided on the substrate 40s. In one example, the first temperature sensing element 51 and the second temperature sensing element 52 may be provided on the insulating layer 40i. The insulating layer 40i may include, for example, silicon oxide.

[0043] 1(a) and 1(b), the sensor 110 may further include a first insulating film 40j. The first insulating film 40j is provided between the first temperature detection element 51 and the first element 11E. For example, the first insulating film 40j is in contact with the first temperature detection element 51. A first gap g1 is provided between the first insulating film 40j and the first element 11E. The first insulating film 40j protects the first temperature detection element 51. The first insulating film 40j may include, for example, silicon nitride.

[0044] As shown in FIG. 1(a), the first temperature detecting element 51 may include a first conductive layer 51f. For example, the electrical resistance of the first conductive layer 51f varies with temperature. As shown in FIG. 1(b), the second temperature detecting element 52 may include a second conductive layer 52f. For example, the electrical resistance of the second conductive layer 52f varies with temperature.

[0045] At least one of the first conductive layer 51f and the second conductive layer 52f includes, for example, at least one selected from the group consisting of a metal layer and a semiconductor. The metal layer includes, for example, at least one selected from the group consisting of TiN, Al, Cu, and AlCu.

[0046] At least one of the first conductive layer 51f and the second conductive layer 52f may include, for example, polysilicon. At least one of the first conductive layer 51f and the second conductive layer 52f may include, for example, a pn junction. At least one of the first conductive layer 51f and the second conductive layer 52f may include, for example, a thermocouple.

[0047] 3A and 3B are schematic cross-sectional views illustrating the sensor according to the first embodiment. 3(a), in the sensor 111 according to the embodiment, the configuration of the first temperature detection element 51 is different from the configuration of the first temperature detection element 51 in the sensor 110. Except for this, the configuration of the sensor 111 may be the same as the configuration of the sensor 110.

[0048] As shown in FIG. 3(a), the base 40 (first base region 41) includes a first circuit 45a. The first circuit 45a is provided in the first base region 41. The first circuit 45a includes a first control element 46a. The first control element 46a includes, for example, a transistor. The first conductive layer 51f is electrically connected to the first control element 46a. The first control element 46a may include, for example, a complementary metal oxide semiconductor (CMOS). For example, the first conductive layer 51f may include the same material as the conductive film included in the first circuit 45a.

[0049] As shown in FIG. 3(b), the base 40 includes a second circuit 45b. The second circuit 45b is provided in the second base region 42. The second circuit 45b includes a second control element 46b. The second control element 46b includes, for example, a transistor. The second conductive layer 52f is electrically connected to the second control element 46b. The second control element 46b may include, for example, a CMOS. For example, the second conductive layer 52f may include the same material as the conductive film included in the second circuit 45b.

[0050] The first circuit 45a and the second circuit 45b may include, for example, at least a part of the circuits included in the control unit 70. The first circuit 45a and the second circuit 45b may include, for example, at least one of a gas detection circuit, a temperature detection circuit, a heater voltage generation circuit, and a control circuit.

[0051] In the embodiment, at least one of the first resistance member 11 and the second resistance member 12 may include at least one selected from the group consisting of, for example, TiN, Ti, W, Al, Cu, AlCu, Si, and Pd. At least one of the first conductive member 21 and the second conductive member 22 may include at least one selected from the group consisting of, for example, TiN, Ti, W, Al, Cu, AlCu, Si, and Pd. At least one of the first insulating member 11i and the second insulating member 12i may include, for example, silicon nitride.

[0052] The embodiments may include the following technical solutions. (Technical proposal 1) a substrate including a first substrate region and a second substrate region; A first detection unit; A second detection unit; Equipped with The first detection unit a first fixed portion fixed to the first base region; a first temperature detection element fixed to the first base region; a first element supported by the first fixed portion; Including, a first gap is provided between the first temperature detection element and the first element; the first element includes a first resistive member and a first conductive member; At least a portion of the first temperature detection element overlaps with the first element in a first direction from the first base region to the first fixing portion, The second detection unit a second fixing portion fixed to the second base region; a second element supported by the second fixed portion; Including, a second gap is provided between the second substrate region and the second element; The second element includes a second resistive member.

[0053] (Technical proposal 2) a control unit electrically connected to the first resistance member, the first conductive member, the second resistance member, and the first temperature detection element; the control unit is configured to perform a first operation; The control unit, in the first operation, detects a detection value corresponding to the difference between the first electrical resistance of the first resistive element after supplying power to the first conductive element and the second electrical resistance of the second resistive element, and the control unit outputs a first correction value obtained by correcting the detection value using a first value corresponding to the first temperature detected by the first temperature detection element.

[0054] (Technical proposal 3) a control unit electrically connected to the first resistance member, the first conductive member, the second resistance member, and the first temperature detection element; the control unit is configured to perform a first operation; The control unit, in the first operation, detects a detection value corresponding to the difference between the first electrical resistance of the first resistive element after supplying power to the first conductive element and the second electrical resistance of the second resistive element, and the control unit corrects the detection value using a first value corresponding to the first temperature detected by the first temperature detection element to detect the target substance around the first element, as described in Technical Proposal 1.

[0055] (Technical proposal 4) the second detection unit further includes a second temperature detection element fixed to the second base region, the second gap is provided between the second temperature detection element and the second element; The sensor described in Technical Solution 1, wherein in the first direction, at least a portion of the second temperature detection element overlaps with the second element.

[0056] (Technical proposal 5) a control unit electrically connected to the first resistive member, the first conductive member, the second resistive member, the first temperature detecting element, and the second temperature detecting element; the controller is configured to perform a second operation; The control unit, in the second operation, detects a detection value corresponding to the difference between the first electrical resistance of the first resistive element after supplying power to the first conductive element and the second electrical resistance of the second resistive element, and the control unit outputs a first correction value obtained by correcting the detection value using at least one of a first value corresponding to the first temperature detected by the first temperature detection element and a second value corresponding to the second temperature detected by the second temperature detection element. This is the sensor described in Technical Proposal 4.

[0057] (Technical proposal 6) a control unit electrically connected to the first resistive member, the first conductive member, the second resistive member, the first temperature detecting element, and the second temperature detecting element; the controller is configured to perform a second operation; The control unit, in the second operation, detects a detection value corresponding to the difference between the first electrical resistance of the first resistive element after supplying power to the first conductive element and the second electrical resistance of the second resistive element, and the control unit corrects the detection value using at least one of a first value corresponding to the first temperature detected by the first temperature detection element and a second value corresponding to the second temperature detected by the second temperature detection element, to detect the target substance around the first element. This is the sensor described in Technical Proposal 4.

[0058] (Technical proposal 7) The sensor according to any one of Technical Solutions 4 to 6, wherein a portion of the second temperature detection element overlaps with at least a portion of the second fixing portion in the first direction.

[0059] (Technical proposal 8) the second detection unit further includes a second connection unit provided between the second fixed unit and the second element, the second connection portion is supported by the second fixed portion, the second connection portion supports the second element; a portion of the second gap is provided between the second base region and the second connection portion, The sensor according to any one of Technical Solutions 4 to 6, wherein a portion of the second temperature detection element overlaps with at least a portion of the second connection portion in the first direction.

[0060] (Technical proposal 9) The sensor according to any one of Technical Solutions 1 to 8, wherein a portion of the first temperature detection element overlaps with at least a portion of the first fixing portion in the first direction.

[0061] (Technical proposal 10) A sensor described in Technical Proposal 9, wherein at least one of a first resistance wiring electrically connected to the first resistance member and a first conductive wiring electrically connected to the first conductive member passes through the first fixed portion.

[0062] (Technical proposal 11) the first detection unit further includes a first connection unit provided between the first fixed unit and the first element, the first connection portion is supported by the first fixed portion, the first connection portion supports the first element; a portion of the first gap is provided between the first base region and the first connection portion, The sensor according to any one of Technical Solutions 1 to 8, wherein a portion of the first temperature detection element overlaps with at least a portion of the first connection portion in the first direction.

[0063] (Technical proposal 12) The sensor according to any one of Technical Schemes 1 to 11, wherein the second element further includes a second conductive member.

[0064] (Technical proposal 13) the first temperature sensing element includes a first conductive layer; The sensor according to any one of Technical Schemes 1 to 12, wherein the electrical resistance of the first conductive layer changes with temperature.

[0065] (Technical proposal 14) The sensor described in Technical Solution 13, wherein the first conductive layer includes at least one selected from the group consisting of a metal layer and a semiconductor.

[0066] (Technical proposal 15) The sensor described in Technical Solution 13, wherein the first conductive layer includes polysilicon.

[0067] (Technical proposal 16) the substrate includes a first circuit provided in the first substrate region and including a first control element; The sensor described in Technical Solution 13, wherein the first conductive layer is electrically connected to the first control element.

[0068] (Technical proposal 17) The sensor described in Technical Proposal 16, wherein the first control element includes a CMOS (Complementary Metal Oxide Semiconductor).

[0069] (Technical proposal 18) The sensor according to any one of Technical Schemes 1 to 12, wherein the first temperature detection element includes a pn junction.

[0070] (Technical proposal 19) The sensor according to any one of Technical Schemes 1 to 12, wherein the first temperature detection element includes a thermocouple.

[0071] (Technical proposal 20) a first insulating film provided between the first temperature detection element and the first element; the first insulating film is in contact with the first temperature detection element; The sensor according to any one of Technical Schemes 1 to 19, wherein the first gap is provided between the first insulating film and the first element.

[0072] According to the embodiment, a sensor capable of highly accurate detection can be provided.

[0073] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of the elements included in the sensor, such as the base, detection unit, resistance member, conductive member, temperature detection element, and circuit, are within the scope of the present invention as long as a person skilled in the art can implement the present invention in a similar manner and obtain similar effects by appropriately selecting them from known ranges.

[0074] Furthermore, any combination of two or more elements of each specific example within the scope of technical feasibility is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0075] In addition, all sensors that can be implemented by a person skilled in the art by appropriately modifying the design based on the sensor described above as an embodiment of the present invention also fall within the scope of the present invention as long as they include the gist of the present invention.

[0076] In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0077] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0078] 10A, 10B: first and second detection portions, 11, 12: first and second resistance members, 11C, 12C: first and second connection portions, 11D, 12D: first and second other connection portions, 11E, 12E: first and second elements, 11F, 12F: first and second fixed portions, 11G, 12G: first and second other fixed portions, 11a, 11b, 12a, 12b: part, 11aL, 12aL: first and second resistance wirings, 11bL, 12bL: first and second other resistance wirings, 11i, 12i: first and second insulating members, 21, 22: first and second conductive members, 21a, 21b, 22a, 22b: part, 21aL, 22aL: first and second conductive wirings, 21bL, 22bL: first and second other conductive wirings, 40: base, 40i: insulating layer, 40j: first insulating film, 40s: substrate, 41, 42: first and second base regions, 45a, 45b: first and second circuits, 46a, 46b: first and second control elements, 51, 52: first and second temperature detection elements, 51a, 51b, 52a, 52b: part, 51f, 52f: first and second conductive layers, 70: control unit, 110, 111: sensor, D1 to D3: first to third directions, g1, g2: first and second gaps

Claims

1. a substrate including a first substrate region and a second substrate region; A first detection unit; A second detection unit; Equipped with The first detection unit a first fixing portion fixed to the first base region; a first temperature detection element fixed to the first substrate region; a first element supported by the first fixed portion; Including, a first gap is provided between the first temperature detection element and the first element; the first element includes a first resistive member and a first conductive member; At least a portion of the first temperature detection element overlaps with the first element in a first direction from the first base region to the first fixing portion, The second detection unit a second fixing portion fixed to the second base region; a second element supported by the second fixed portion; Including, a second gap is provided between the second substrate region and the second element; The second element includes a second resistive member.

2. a control unit electrically connected to the first resistance member, the first conductive member, the second resistance member, and the first temperature detection element, the controller is configured to perform a first operation; 2. The sensor of claim 1, wherein in the first operation, the control unit detects a detection value corresponding to the difference between a first electrical resistance of the first resistive element after supplying power to the first conductive element and a second electrical resistance of the second resistive element, and the control unit corrects the detection value using a first value corresponding to a first temperature detected by the first temperature detection element to detect the target substance around the first element.

3. the second detection unit further includes a second temperature detection element fixed to the second base region, the second gap is provided between the second temperature detection element and the second element; The sensor of claim 1 , wherein in the first orientation, at least a portion of the second temperature sensing element overlaps with the second element.

4. a control unit electrically connected to the first resistance member, the first conductive member, the second resistance member, the first temperature detection element, and the second temperature detection element; the control unit is configured to perform a second operation; 4. The sensor according to claim 3, wherein in the second operation, the control unit detects a detection value corresponding to the difference between a first electrical resistance of the first resistive element after supplying power to the first conductive element and a second electrical resistance of the second resistive element, and the control unit corrects the detection value using at least one of a first value corresponding to a first temperature detected by the first temperature detection element and a second value corresponding to a second temperature detected by the second temperature detection element, to detect the target substance around the first element.

5. 5. The sensor according to claim 1, wherein a portion of the first temperature detection element overlaps with at least a portion of the first fixing portion in the first direction.

6. 6. The sensor according to claim 5, wherein at least one of a first resistance wiring electrically connected to the first resistance member and a first conductive wiring electrically connected to the first conductive member passes through the first fixing portion.

7. the first detection unit further includes a first connection unit provided between the first fixed unit and the first element, the first connection portion is supported by the first fixed portion, the first connection portion supports the first element; a portion of the first gap is provided between the first base region and the first connection portion, The sensor according to claim 1 , wherein a portion of the first temperature detection element overlaps with at least a portion of the first connection portion in the first direction.

8. the first temperature sensing element includes a first conductive layer; The sensor of claim 1 , wherein the electrical resistance of the first conductive layer varies with temperature.

9. the substrate includes a first circuit provided in the first substrate region and including a first control element; The sensor of claim 8 , wherein the first conductive layer is electrically connected to the first control element.

10. The sensor of claim 9 , wherein the first control element includes a complementary metal oxide semiconductor (CMOS).

Images