Mounting device and control method for mounting device

Abstract

To optimize the tact difference between two mounting heads of a dual-lane dual-head type mounting device.SOLUTION: A control device for a mounting device is configured to: extract an allocation pattern for allocating a plurality of electronic components C to be mounted on one substrate as to by which of an upstream-side first mounting head and a downstream-side second mounting head; extract combination patterns of initial heights of the first mounting head and initial heights of the second mounting head when mounting processing on the one substrate starts; calculate absolute values of tact differences each between the first mounting head and the second mounting head in the respective combination patterns; and determine either of the allocation patterns to be the allocation pattern to be executed, as an allocation pattern having the tact difference optimized, based upon the respective calculated absolute values.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a mounting apparatus and a method for controlling the mounting apparatus. [Background technology]

[0002] In the technical field related to mounting devices, there is known a mounting device that uses one or more mounting heads to mount electronic components on boards transported along multiple lanes. For example, Patent Document 1 discloses a mounting device that has a total of four mounting areas on the upstream and downstream sides of two lanes, and is equipped with an upstream mounting head and a downstream mounting head that are movable across the two lanes.

[0003] When such a mounting head is in a higher position than when it is in a lower position, the distance to the board is greater and the vertical movement distance of the nozzle is longer, which increases the time required. Therefore, the mounting head is controlled to move to the lowest position when no components have yet been mounted on the boards on the lane, and to move to a higher position as each component is mounted so as not to interfere with the component. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-251586 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, in a mounting device that mounts components on a single board using two mounting heads, one on the upstream side and one on the downstream side, the number of components to be mounted on the upstream side and the downstream side is allocated so as to minimize the standby time of each mounting head, as in Patent Document 1. However, when passing across another lane and there is a large component in the other lane, the mounting head ends up moving at a higher position than expected in optimization, which delays the work of one mounting head and increases the standby time of the other mounting head, posing a problem of increasing the takt time.

[0006] The technology disclosed in this specification aims to optimize the tact time difference between two mounting heads in a dual-lane, dual-head mounting apparatus. [Means for solving the problem]

[0007] This specification discloses a mounting apparatus, which includes a plurality of substrate transport devices arranged in parallel and transporting substrates in a transport direction, a first mounting head in an upstream region in the transport direction that mounts electronic components on each of the substrates transported by the plurality of substrate transport devices, a second mounting head in a downstream region in the transport direction that mounts further electronic components on the substrates after the electronic components have been mounted by the first mounting head, a head moving device that moves the first mounting head and the second mounting head horizontally across the plurality of substrate transport devices and changes their height positions in stages, and a control device that controls each unit, and the control device controls the mounting head and the second mounting head to mount electronic components on one substrate. An allocation pattern is extracted in which of the first mounting head and the second mounting head will mount the multiple electronic components C to be mounted, and for each of the allocation patterns, a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting the mounting process for one board is extracted, the absolute value of the takt time difference between the first mounting head and the second mounting head in each of the combination patterns is calculated, and based on the calculated absolute values, one of the allocation patterns is considered to be an allocation pattern with an optimized takt time difference, and is determined to be the allocation pattern to be executed.

[0008] This specification discloses a method for controlling a mounting apparatus, the method for controlling a mounting apparatus including: a plurality of substrate transport devices arranged in parallel and transporting substrates in a transport direction; a first mounting head in an upstream region in the transport direction that mounts electronic components on each of the substrates transported by the plurality of substrate transport devices; a second mounting head in a downstream region in the transport direction that mounts further electronic components on the substrates after the electronic components have been mounted by the first mounting head; and a head moving device that moves the first mounting head and the second mounting head in a horizontal direction across the plurality of substrate transport devices and changes their height positions in stages, the method for controlling a mounting apparatus including: a plurality of substrate transport devices arranged in parallel and transporting substrates in a transport direction; a first mounting head that mounts electronic components on each of the substrates transported by the plurality of substrate transport devices in an upstream region in the transport direction that mounts further electronic components on the substrates after the electronic components have been mounted by the first mounting head; and a head moving device that moves the first mounting head and the second mounting head in a horizontal direction across the plurality of substrate transport devices and changes their height positions in stages, extracting an allocation pattern in which either the first mounting head or the second mounting head will perform mounting from among the above; extracting a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting mounting processing for one board for each of the allocation patterns; calculating the absolute value of the takt time difference between the first mounting head and the second mounting head for each of the combination patterns; and determining one of the allocation patterns as the allocation pattern with the optimized takt time difference based on the calculated absolute values. [Effects of the Invention]

[0009] According to the technology disclosed in this specification, it is possible to optimize the tact time difference between the two mounting heads in a dual-lane, dual-head mounting apparatus. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view schematically showing a mounting apparatus according to an embodiment. [Figure 2] FIG. 2 is a side view showing the mounting head according to the embodiment. [Figure 3] FIG. 3 is a flowchart showing the mounting process according to the embodiment. [Figure 4]FIG. 4 is a flowchart showing the head height change process according to the embodiment. [Figure 5] FIG. 5 is a flowchart showing the allocation determination process according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ Cartesian coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis of the predetermined plane, which is perpendicular to the X axis, is defined as the Y-axis direction. The direction parallel to the Z axis, which is perpendicular to the predetermined plane, is defined as the Z-axis direction. The direction of rotation or tilt around the X-axis direction is defined as the θX direction. The direction of rotation or tilt around the Y-axis direction is defined as the θY direction. The direction of rotation or tilt around the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Note that the predetermined plane may be inclined with respect to the horizontal plane. Furthermore, in the embodiments, the predetermined plane including the X axis and the Y axis is referred to as the XY plane as appropriate.

[0012] [Mounting equipment] Fig. 1 is a plan view schematically showing a mounting apparatus 10 according to an embodiment. Fig. 2 is a side view showing a mounting head 40 according to an embodiment. The mounting apparatus 10 is an apparatus for mounting an electronic component C on a substrate P.

[0013] The mounting apparatus 10 of the embodiment is a dual-lane type mounting apparatus 10 that mounts electronic components C on different substrates P using two lanes. In the mounting apparatus 10 of the embodiment, the transport direction of the substrate P is from the -X side toward the +X side. In the embodiment, approximately half of the area on the -X side of the mounting apparatus 10 is referred to as the upstream area DU, and approximately half of the area on the +X side is referred to as the downstream area DD. In the mounting apparatus 10 of the embodiment, electronic components C can be mounted on the same substrate P in two stages using the upstream area DU and the downstream area DD.

[0014] As shown in FIG. 1, the mounting apparatus 10 includes a base member 12, a VCS unit 14, an exchange nozzle holding mechanism 16, a component storage section 18, a substrate conveying device 20, a component supplying device 30, a mounting head 40, a head moving device 50, and a control device 90.

[0015] The base member 12 supports the VCS unit 14, the replacement nozzle holding mechanism 16, the component storage section 18, the board transport device 20, the component supply device 30, the mounting head 40, and the head moving device 50.

[0016] The substrate transfer device 20 transfers the substrate P from upstream to downstream of the mounting device 10. In the embodiment, the substrate transfer device 20 transfers the substrate P in the direction from the -X side to the +X side in the X-axis direction. The substrate transfer device 20 transfers the substrate P to the mounting area DM. The mounting area DM is defined by the transfer path of the substrate transfer device 20.

[0017] The substrate P before the electronic components C are mounted is carried into the substrate transport device 20 from the end of the base member 12 on the -X side. The substrate transport device 20 transports the carried-in substrate P in the +X direction and stops it in each mounting area DM. The substrate transport device 20 transports the substrate P after the electronic components C have been mounted in the +X direction. The substrate P after the electronic components C have been mounted is carried out from the end of the base member 12 on the +X side.

[0018] In the mounting apparatus 10 of the embodiment, the substrate P is transported along two separate lanes. The substrate transport device 20 includes a first substrate transport device 22 and a second substrate transport device 24, which are provided on each of the two lanes. The substrate P before the electronic components C are mounted is carried into either the first substrate transport device 22 or the second substrate transport device 24 of the substrate transport device 20 from the end of the base member 12 on the -X side.

[0019] In the mounting device 10 of the embodiment, the mounting area DM includes a first upstream area Uf on the upstream area DU side of the transport path by the first substrate transport device 22, a first downstream area Df on the downstream area DD side, a second upstream area Ur on the upstream area DU side of the transport path by the second substrate transport device 24, and a second downstream area Dr on the downstream area DD side.

[0020] The first substrate transport device 22 is provided near the -Y side of the mounting device 10, and transports the substrate P in the direction from the -X side to the +X side in the X-axis direction. The substrate P transported near the -Y side of the mounting device 10 by the first substrate transport device 22 has several electronic components C mounted on it in the first upstream area Uf, and then further electronic components C are mounted on it in the first downstream area Df.

[0021] The second substrate transport device 24 is aligned with the first substrate transport device 22 in a direction (Y-axis direction) perpendicular to the transport direction of the substrate P (X-axis direction), is provided closer to the +Y side of the mounting device 10, and transports the substrate P in a direction from the -X side to the +X side in the X-axis direction. The substrate P transported closer to the +Y side of the mounting device 10 by the second substrate transport device 24 has several electronic components C mounted on it in the second upstream area Ur, and then further electronic components C are mounted on it in the second downstream area Dr.

[0022] The first substrate transport device 22 and the second substrate transport device 24 each have, for example, a pair of guide members 26 that guide the substrate P, and a pair of transport belts 28 that transport the substrate P in the X-axis direction.

[0023] The guide members 26 extend in the X-axis direction. The pair of guide members 26 are spaced apart from each other in the Y-axis direction. One guide member 26 is disposed on the +Y side of the substrate P. The other guide member 26 is disposed on the -Y side of the substrate P.

[0024] The conveyor belts 28 are closed belts in a circular shape. The conveyor belts 28 are a transport mechanism that supports the substrate P and moves the substrate P along the guide members 26. One of the conveyor belts 28 is supported by one of the guide members 26 via a drive pulley and a driven pulley. The other conveyor belt 28 is supported by the other guide member 26 via a drive pulley and a driven pulley.

[0025] Of the pair of transport belts 28, the transport belt 28 arranged on the +Y side supports the +Y side end of the underside of the substrate P. The transport belt 28 arranged on the -Y side supports the -Y side end of the underside of the substrate P. The substrate P is transported in the X axis direction by the drive pulley rotating due to a drive motor (not shown).

[0026] The component supply device 30 holds a large number of electronic components C to be mounted on the board P and supplies them to the mounting head 40, that is, supplies them to a holding position in a state where they can be held (sucked or gripped) by the mounting head 40.

[0027] In the mounting apparatus 10 of the embodiment, the component supply device 30 includes a component supply device 32f arranged on the -Y side of the first board transport device 22 in the upstream area DU, a component supply device 32r arranged on the +Y side of the second board transport device 24 in the upstream area DU, a component supply device 34f arranged on the -Y side of the first board transport device 22 in the downstream area DD, and a component supply device 34r arranged on the +Y side of the second board transport device 24 in the downstream area DD. Note that the component supply device 30 does not necessarily have to include the component supply devices 32f, 34f arranged on the -Y side.

[0028] Each of the component supply devices 32f, 32r, 34f, and 34r includes a plurality of tape feeders 36. The tape feeders 36 transport a carrier tape that holds a plurality of electronic components C. As the carrier tape is transported, at least one electronic component C among the plurality of electronic components C is supplied to a holding position by the mounting head 40.

[0029] The mounting head 40 holds electronic components C supplied from the component supply device 30 with a nozzle 46 and mounts them on the surface of the substrate P placed in the mounting area DM. The mounting head 40 has an upstream head 42 having a movable area in the upstream area DU, and a downstream head 44 having a movable area in the downstream area DD. In other words, the mounting apparatus 10 of this embodiment is a dual-head type mounting apparatus 10. In the following description, when there is no need to particularly distinguish between the upstream head 42 and the downstream head 44, they will simply be referred to as the mounting head 40.

[0030] As shown in FIG. 2, the mounting head 40 has a housing 40 a, one or more nozzles 46 , and nozzle driving units 48 corresponding to the respective nozzles 46 .

[0031] The housing 40a is connected to a Z-axis movement device 80, which will be described later. In this embodiment, the housing 40a is provided integrally with a Z-axis slide member 84 of the Z-axis movement device 80. The housing 40a supports the nozzle 46 and the nozzle drive unit 48.

[0032] The nozzle 46 releasably holds the electronic component C. The nozzle 46 of the embodiment is a suction nozzle that suction-holds the electronic component C. An opening 46a is provided at the tip of the nozzle 46. The opening 46a of the nozzle 46 is connected to a vacuum system. With the tip of the nozzle 46 and the electronic component C in contact, a suction operation is performed from the opening 46a provided at the tip of the nozzle 46, thereby suction-holding the electronic component C at the tip of the nozzle 46. When the suction operation from the opening 46a is released, the electronic component C is released from the nozzle 46. The nozzle 46 may also be a gripping nozzle that clamps and holds the electronic component C.

[0033] The nozzle 46 has an opening 46a formed therein and a shaft 46b connected to a tip portion that sucks the electronic component C. The shaft 46b is a rod-shaped member that supports the tip portion and is supported by the housing 40a so as to extend in a direction (Z-axis direction) perpendicular to the surface of the substrate P. An air pipe (piping) that connects the opening 46a to the suction mechanism of the nozzle drive unit 48 is arranged inside the shaft 46b.

[0034] The nozzle driving unit 48 moves the nozzle 46 in a direction (Z-axis direction) perpendicular to the surface of the substrate P, and causes the opening 46a of the nozzle 46 to pick up the electronic component C. The nozzle driving unit 48 rotates the nozzle 46 in the θZ direction.

[0035] In the nozzle drive unit 48, an example of a mechanism for moving the nozzle 46 in the Z-axis direction is a mechanism having a linear motor whose drive direction is the Z-axis direction. The nozzle drive unit 48 moves the shaft 46b of the nozzle 46 in the Z-axis direction using the linear motor, thereby moving the opening 46a at the tip of the nozzle 46 in the Z-axis direction. In addition, in the nozzle drive unit 48, an example of a mechanism for rotating the nozzle 46 in the θZ direction is a mechanism including a motor and a transmission element connected to the shaft 46b. The nozzle drive unit 48 transmits the driving force output from the motor to the shaft 46b via the transmission element, and rotates the shaft 46b in the θZ direction, thereby rotating the tip of the nozzle 46 in the θZ direction.

[0036] In the nozzle driving unit 48, the mechanism for sucking the electronic component C at the opening 46a of the nozzle 46, i.e., the suction mechanism, may be, for example, a mechanism having an air pipe connected to the opening 46a of the nozzle 46, a pump connected to the air pipe, and a solenoid valve that switches the air pipe between open and closed. The nozzle driving unit 48 uses the pump to suck air into the air pipe and switches the solenoid valve between open and closed to determine whether or not to suck air through the opening 46a. The nozzle driving unit 48 opens the solenoid valve to suck air through the opening 46a, thereby sucking (holding) the electronic component C at the opening 46a, and closes the solenoid valve to stop sucking air through the opening 46a, thereby releasing the electronic component C that was sucked to the opening 46a. In other words, the opening 46a is not sucking (holding) the electronic component C.

[0037] 1, the mounting head 40 is movable between a supply area SM (holding position) where electronic components C are supplied by the component supply device 30 and a mounting area DM where a substrate P is arranged. The mounting head 40 can be moved in the X-axis direction, Y-axis direction, and Z-axis direction within a movable range by a head moving device 50. The mounting head 40 holds the electronic components C supplied to the component supply device 30 with a nozzle 46, moves them to the respective mounting areas DM, and then mounts them on the substrate P arranged in the mounting area DM.

[0038] The upstream head 42 is movable between a supply area SM (holding position) where electronic components C are supplied in the component supply devices 32f, 32r, and a first upstream area Uf and a second upstream area Ur where the board P is arranged. The downstream head 44 is movable between a supply area SM (holding position) where electronic components C are supplied in the component supply devices 34f, 34r, and a first downstream area Df and a second downstream area Dr where the board P is arranged. Each supply area SM and each mounting area DM are defined at different positions in the XY plane.

[0039] The head moving device 50 is capable of moving the mounting head 40 in each of the X-axis direction, Y-axis direction, and Z-axis direction. The head moving device 50 includes a head moving device 50U provided in the upstream area DU and moving the upstream head 42, and a head moving device 50D provided in the downstream area DD and moving the downstream head 44. In the following description, when there is no need to distinguish between the head moving device 50U and the head moving device 50D, they will simply be referred to as the head moving device 50.

[0040] The head moving device 50U and the head moving device 50D each have an X-axis moving device 60 that moves the mounting head 40 in the X-axis direction, a Y-axis moving device 70 that moves the mounting head 40 in the Y-axis direction, and a Z-axis moving device 80 that moves the mounting head 40 in the Z-axis direction.

[0041] The Z-axis moving device 80 is connected to the mounting head 40. The mounting head 40 moves in the Z-axis direction when the Z-axis moving device 80 is driven. The X-axis moving device 60 is connected to the mounting head 40 via the Z-axis moving device 80. The X-axis moving device 60 is driven to move the Z-axis moving device 80 in the X-axis direction, thereby moving the mounting head 40 in the X-axis direction. The Y-axis moving device 70 is connected to the mounting head 40 via the X-axis moving device 60 and the Z-axis moving device 80. The Y-axis moving device 70 is driven to move the X-axis moving device 60 in the Y-axis direction, thereby moving the mounting head 40 in the Y-axis direction.

[0042] In the embodiment, the Y-axis moving device 70 includes a pair of Y-axis moving devices 70. The Y-axis moving device 70 includes, for example, a Y-axis guide member 72 that is supported by the base member 12 and extends in the Y-axis direction, a Y-axis sliding member 74 that is guided by the Y-axis guide member 72 and slides in the Y-axis direction, and a Y-axis actuator that generates power to move the Y-axis sliding member 74 in the Y-axis direction. The Y-axis sliding member 74 supports the X-axis moving device 60.

[0043] X-axis movement device 60 includes an X-axis guide member 62 that is supported by Y-axis slide member 74 of Y-axis movement device 70 and extends in the X-axis direction, an X-axis slide member 64 that is guided by X-axis guide member 62 and slides in the X-axis direction, and an X-axis actuator that generates power to move X-axis slide member 64 in the X-axis direction. X-axis slide member 64 supports Z-axis movement device 80.

[0044] The Z-axis moving device 80 includes a Z-axis guide member 82 that is supported by the X-axis slide member 64 of the X-axis moving device 60 and extends in the Z-axis direction, a Z-axis slide member 84 that slides in the Z-axis direction while being guided by the Z-axis guide member 82, and a Z-axis actuator that generates power to move the Z-axis slide member 84 in the Z-axis direction. The Z-axis slide member 84 supports the mounting head 40, or is provided integrally with the housing 40a of the mounting head 40 (see FIG. 2).

[0045] The VCS unit 14, the replacement nozzle holding mechanism 16, and the component storage section 18 are disposed in a position that overlaps with the movable area of the mounting head 40 in the XY plane, and that is positioned vertically below the mounting head 40 in the Z-axis direction. In the embodiment, the VCS unit 14, the replacement nozzle holding mechanism 16, and the component storage section 18 are disposed adjacent to each other between the second substrate transport device 24 and the component supply device 30.

[0046] The VCS unit 14, replacement nozzle holding mechanism 16, and component storage unit 18 are respectively arranged in both the upstream area DU and downstream area DD on the +Y side of the second conveyance device. That is, they are arranged to correspond to the upstream head 42, which is the mounting head 40 on the upstream area DU side, and the downstream head 44, which is the mounting head 40 on the downstream area DD side.

[0047] The VCS unit 14 is an image recognition device for detecting the state of the electronic component C, and includes, for example, a camera that captures an image of the vicinity of the nozzle 46 of the mounting head 40, and an illumination unit that captures an image of the capture area. The VCS unit 14 recognizes the shape of the electronic component C picked up by the nozzle 46 of the mounting head 40 and the state of holding the electronic component C by the nozzle 46. More specifically, when the mounting head 40 moves to a position facing the VCS unit 14, the VCS unit 14 captures an image of the nozzle 46 of the mounting head 40 from below in the vertical direction (-Z side), and analyzes the captured image to recognize the shape of the electronic component C picked up by the nozzle 46 and the state of holding the electronic component C by the nozzle 46. The VCS unit 14 outputs the acquired information to the control device 90.

[0048] The replacement nozzle holding mechanism 16 is a mechanism that holds multiple types of nozzles 46. The replacement nozzle holding mechanism 16 holds multiple types of nozzles 46 in a state that allows the mounting head 40 to replace them by detaching them. The replacement nozzle holding mechanism 16 may hold, for example, a suction nozzle that holds an electronic component C by suction, and a gripping nozzle that holds an electronic component C by gripping it. The mounting head 40 can hold the electronic component C under appropriate conditions (suction or gripping) by changing the nozzle 46 to be attached by the replacement nozzle holding mechanism 16 and supplying air pressure to the attached nozzle 46 to drive it.

[0049] The component storage section 18 is a box that stores electronic components C that are held by the mounting head 40 with the nozzle 46 and that will not be mounted on the board P. That is, in the mounting device 10, it serves as a disposal box for discarding electronic components C that will not be mounted on the board P. When there are electronic components C that will not be mounted on the board P among the electronic components C held by the mounting head 40, the mounting device 10 moves the mounting head 40 to a position facing the component storage section 18 and releases the held electronic components C, thereby putting the electronic components C into the component storage section 18.

[0050] The control device 90 controls each part of the mounting device 10. The control device 90 includes a computer system having at least one processor, a main memory, a storage, and an interface. The processor is a central processing unit (CPU). The main memory includes non-volatile memory such as read-only memory (ROM) and volatile memory such as random access memory (RAM). Examples of storage include hard disk drives (HDDs), solid state drives (SSDs), magnetic disks, magneto-optical disks, CD-ROMs, and DVD-ROMs. The interface includes input / output circuits. The processor's functions are stored in the storage as a program. The processor reads the program from the storage, expands it into the main memory, and executes processing according to the program.

[0051] The control device 90 may be provided directly in the mounting apparatus 10, or may be provided separately via a network. In an embodiment, controlling the mounting head 40 includes controlling the head moving device 50. Controlling the nozzle 46 includes controlling the nozzle driving unit 48.

[0052] Furthermore, the mounting device 10 may be appropriately equipped with an operation device (not shown) for operation by an operator, a display device (not shown) for displaying various information, a warning device for issuing a warning by light or sound, and the like.

[0053] [How to optimize takt time difference] In the mounting apparatus 10 of the embodiment, two mounting heads 40, an upstream head 42 and a downstream head 44, can simultaneously perform mounting processing on two substrates P. Furthermore, after the upstream head 42 mounts several electronic components C on one substrate P, the downstream head 44 can mount further electronic components C.

[0054] For example, after the upstream head 42 mounts some electronic components C onto a first substrate P transported to the first upstream area Uf, the first substrate P is transported to the first downstream area Df, where the remaining electronic components C are mounted by the downstream head 44. After mounting electronic components C onto the first substrate P in the first upstream area Uf, the upstream head 42 mounts some electronic components C onto a second substrate P transported to the second upstream area Ur, and then mounts some electronic components C onto a third substrate P transported to the first upstream area Uf.

[0055] Furthermore, after mounting the electronic components C on the first substrate P in the first downstream area Df, the downstream head 44 mounts the remaining electronic components C on the second substrate P transported to the second downstream area Dr, and then mounts the remaining electronic components C on the third substrate P transported to the first downstream area Df. In this way, the upstream head 42 and the downstream head 44 alternately process the substrate P transported by the first substrate transport device 22 and the substrate P transported by the second substrate transport device 24.

[0056] The downstream head 44 will wait if the processing by the upstream head 42 is slow and the next substrate P to be processed is not transported to the downstream DD. Also, the upstream head 42 will wait if the processing by the downstream head 44 is slow and transport of the substrate P is congested, preventing the processed substrate P from being transported to the downstream DD. In mounting processing, it is preferable that such waiting time be minimized, that is, it is preferable that the tact time difference between the two mounting heads 40 be small.

[0057] Here, the height position of the mounting head 40 of the embodiment can be changed by a Z-axis moving device 80. Furthermore, when mounting the electronic component C held by the nozzle 46 onto the substrate P, the nozzle 46 is moved back and forth in the Z-axis direction by a nozzle driving unit 48. Specifically, the nozzle 46 descends in the Z-axis direction, and with the electronic component C placed on the substrate P, the suction operation through the opening 46a is stopped, and then the nozzle 46 ascends in the Z-axis direction, thereby completing the mounting.

[0058] At this time, the reciprocating movement of the nozzle 46 in the Z-axis direction becomes shorter the distance traveled and the time required becomes shorter as the mounting head 40 is positioned lower. For this reason, it is preferable to shorten the takt time required for production by mounting the electronic components C in order of decreasing height dimension of the electronic components C, setting the initial height position of the mounting head 40 to the lowest, and gradually raising the height position of the mounting head 40 so as not to interfere with electronic components C that have already been mounted.

[0059] Incidentally, when the same mounting head 40 mounts the substrates P transported to the multiple lanes as in the embodiment, it may be necessary for the mounting head 40 to cross the first substrate transport device 22 and the second substrate transport device 24 while moving. In this case, a large electronic component C may be mounted on the substrate P transported to the side of the substrate transport device 20 that is not undergoing mounting processing, and interference may occur during crossing if the mounting head 40 is at the planned height.

[0060] In such a case, the mounting head 40 is raised to avoid interference between the electronic component C held by the nozzle 46 and the electronic component C mounted on the board P. As a result, the reciprocating movement distance of the nozzle 46 in the Z-axis direction must be increased by the amount corresponding to the increased height position of the mounting head 40, and the overall time required for the mounting process becomes longer than expected. This causes a delay in the process of one mounting head 40, which causes or extends a waiting time for the other mounting head 40, which changes the takt time difference and may delay the entire production schedule.

[0061] For example, if two mounting heads 40 each maintain the lowest height position within the producible range that does not cause interference with the substrate P being mounted, and the processing times for each are the same, the planned takt time difference will be zero, and the takt time will be minimized. However, in this case, there is a high possibility that the height position of the mounting head 40 will be unplannedly raised when the other substrate transport device 20 crosses, increasing the possibility of delays to the entire production schedule. On the other hand, if the two mounting heads 40 maintain the highest height position, no interference will occur in either case, and there is no need to unplannedly change the height position to a higher position, reducing the possibility of delays to the entire production schedule, but increasing the planned takt time itself.

[0062] Therefore, in the mounting apparatus 10 of the embodiment, the takt time difference is optimized so as to prevent significant delays in the schedule even when the height position of the mounting head 40 is changed, without significantly lengthening the takt time. Therefore, when multiple electronic components C are mounted in a predetermined order on one board P to be mounted, the allocation of electronic components C is optimized, i.e., up to which electronic components C the upstream head 42 mounts in the upstream area UD, and from which electronic components C the downstream head 44 mounts in the downstream area DD.

[0063] Specifically, an allocation pattern for electronic components C is extracted, which indicates up to which electronic component C the upstream head 42 will mount in the upstream area UD, and from which electronic component C the downstream head 44 will mount in the downstream area DD, and one of the allocation patterns is selected and implemented. The allocation pattern indicates the type of combination of up to which electronic component C the upstream head 42 will mount, and from which electronic component C the downstream head 44 will mount.

[0064] Assuming that the number of electronic components C to be mounted on one board P is α, a maximum of α-1 allocation patterns can be extracted. For example, the allocation patterns to be extracted may be limited based on predetermined conditions. The predetermined conditions include, for example, that the difference between the number of electronic components C mounted by the upstream head 42 and the downstream head 44 is equal to or less than a predetermined number, or that the number of electronic components C mounted by the upstream head 42 and the downstream head 44 is equal to or greater than a predetermined number.

[0065] In a predetermined allocation pattern, a combination pattern of the initial height of the upstream head 42 and the initial height of the downstream head 44 when starting mounting processing on one board P is extracted. Next, the tact time difference and its absolute value between processing by the upstream head 42 and processing by the downstream head 44 in each combination pattern are calculated. Table 1 shows an example of the combination patterns of initial heights, and the respective tact time differences and absolute values of the tact time differences.

[0066] [Table 1]

[0067] The initial height is selected from settable values for the height positions of the upstream head 42 and the downstream head 44, and in this embodiment, is any of 1 mm, 3 mm, 6 mm, 10 mm, 15 mm, and 25 mm on the +Z side from the reference height. The initial height of the upstream head 42 is selected from a range from a height at which the nozzle 46 does not interfere with the substrate P, etc., when it is holding the first electronic component C to be mounted, to a maximum height (25 mm in this embodiment). The initial height of the downstream head 44 is selected from a range from a height at which the nozzle 46 does not interfere with the substrate P, etc., when it is holding the first electronic component C to be mounted on the downstream area DD side, to a maximum height (25 mm in this embodiment). In addition, the initial height of the downstream head 44 is at least equal to or greater than the initial height of the upstream head 42 and is equal to or greater than the height at which the upstream head 42 mounts the last electronic component C.

[0068] In the example shown in Table 1, the allocation pattern indicates that the electronic component C that the upstream head 42 mounts first will not interfere with the board P even if the upstream head 42 is 1 mm high while held by the nozzle 46. Also, the allocation pattern indicates that the electronic component C that the downstream head 44 mounts first will not interfere with the board P after the upstream head 42 has mounted a predetermined number of electronic components C while held by the nozzle 46, when the downstream head 44 is 10 mm high. Therefore, the initial height of the upstream head 42 is selected from 1 mm, 3 mm, 6 mm, 10 mm, 15 mm, and 25 mm, and the initial height of the downstream head 44 is selected from 10 mm, 15 mm, and 25 mm.

[0069] The time required for processing by each of the upstream head 42 and the downstream head 44 is calculated assuming that the height position is not raised unplanned and that the height position is raised based on the height of the electronic components C being mounted on the substrate P to be processed. Based on the time required for processing by each of the upstream head 42 and the downstream head 44, the takt time difference and its absolute value are calculated.

[0070] As shown in Table 1, the absolute values of the tact time differences of all combination patterns are calculated for that allocation pattern. Furthermore, the average value of the absolute values of the tact time differences of all combination patterns for that allocation pattern is calculated. Similarly, the average value of the absolute values of the tact time differences is calculated for all allocation patterns. Of all the extracted allocation patterns, the allocation pattern with the smallest average value of the absolute values of the tact time differences can be considered as the allocation pattern with the optimized tact time difference.

[0071] Each combination pattern may be multiplied by a weighting coefficient. Table 2 shows an example of combination patterns of initial heights, their respective tact time differences, absolute values of the tact time differences, and weighting coefficients.

[0072] [Table 2]

[0073] The weighting coefficient is set in the range of 0 to 1. For example, the weighting coefficient may be set larger as the takt time difference becomes smaller, and smaller as the takt time difference becomes larger. In this case, emphasis is placed on shortening the takt time. Also, the weighting coefficient may be set smaller as the takt time difference becomes smaller, and larger as the takt time difference becomes larger. In this case, emphasis is placed on ensuring that the production schedule does not fall behind schedule.

[0074] [Implementation method] Fig. 3 is a flowchart showing a mounting process according to an embodiment. The process of the flowchart shown in Fig. 3 is executed by the control device 90 of the mounting device 10 in accordance with a program stored in advance. Note that in the mounting process, the pickup position of the electronic component C in the component supply device 30, the mounting coordinates of the electronic component C on the board P, etc. are assumed to be stored in advance in the mounting device 10 by teaching performed before the mounting process shown in Fig. 3.

[0075] 3 shows a series of processes executed by the corresponding mounting head 40 (upstream head 42 or downstream head 44) for one substrate P transported to one of the mounting areas DM. In the following explanation, the mounting process in the first upstream area Uf will be explained as an example.

[0076] The substrate P is transported to the mounting device 10. The first substrate transport device 22 of the substrate transport device 20 transports the substrate P to the first upstream area Uf of the mounting area DM. An alignment process is performed on the substrate P. The control device 90 controls the head moving device 50U to move the upstream head 42 of the mounting heads 40 to the supply area SM (step SA1).

[0077] The supply area SM to which the upstream head 42 moves is either one of the component supply devices 32f or 32r on the upstream area UD side. The upstream head 42 moves to either of the supply areas SM to which the next electronic component C to be mounted will be supplied based on a production program preset before the mounting process shown in Fig. 3. The control device 90 moves the upstream head 42 to a position in the supply area SM where the electronic component C and the nozzle 46 face each other.

[0078] The control device 90 controls the nozzle driving unit 48 of the upstream head 42 to hold the electronic component C at the nozzle 46 (step SA2).

[0079] The control device 90 controls the head moving device 50U to move the upstream head 42 to a position facing the VCS unit 14 on the upstream area UD side (step SA3). Here, if the supply area SM to which the electronic components C were supplied in step SA1 is the component supply device 32f located on the -Y side of the first board transport device 22, the upstream head 42 moves across above the first board transport device 22 and the second board transport device 24 to a position facing the VCS unit 14. At this time, the height position of the upstream head 42 is controlled so as not to interfere with the board P held in the first upstream area Uf or the electronic components C already mounted on the board P held in the second upstream area Ur.

[0080] The control device 90 controls the VCS unit 14 to detect the state of the electronic component C held by the nozzle 46 of the upstream head 42 (step SA4). If it is determined based on the detection result that the electronic component C will not be mounted on the board P, the control device 90 controls the head moving device 50U to move the upstream head 42 to a position facing the component storage section 18, and controls the nozzle driving section 48 to release the hold of the electronic component C and discard the electronic component C into the component storage section 18.

[0081] The control device 90 controls the head moving device 50U to move the upstream head 42 to a position where the nozzle 46 faces a predetermined mounting position on the substrate P in the first upstream area Uf of the mounting area DM (step SA5). Here, the VCS unit 14 is disposed on the +Y side of the second substrate transport device 24. Therefore, the upstream head 42 moves across above the second substrate transport device 24 to above the substrate P held in the first upstream area Uf of the first substrate transport device 22. At this time, the height position of the upstream head 42 is controlled so as not to interfere with the substrate P held in the first upstream area Uf or electronic components C already mounted on the substrate P held in the second upstream area Ur.

[0082] The control device 90 controls the nozzle driving unit 48 of the upstream head 42 to mount the electronic component C sucked and held by the nozzle 46 (step SA6).

[0083] 3 based on a preset production program until a predetermined number and type of electronic components C are mounted in their respective predetermined mounting positions on the board P in the first upstream area Uf. Once the upstream head 42 has completed mounting of the electronic components C, the first board transport device 22 transports the board P to the first downstream area Df within the mounting area DM. The upstream head 42 commences mounting processing on the board P transported to the second upstream area Ur.

[0084] The mounting process in first downstream area Df is performed in the same manner as in the series of processes described above, except that upstream head 42 is replaced by downstream head 44, upstream area UD is replaced by downstream area DD, and component supply devices 32f, 32r are replaced by component supply devices 34f, 34r. When mounting of electronic components C by downstream head 44 is completed, first substrate transport device 22 carries out substrate P from mounting device 10 to the +X side.

[0085] In this way, the upstream head 42 and the downstream head 44 alternately process the substrate P transported by the first substrate transport device 22 and the substrate P transported by the second substrate transport device 24. Furthermore, after the upstream head 42 mounts several electronic components C on one substrate P, the downstream head 44 mounts further electronic components C thereon.

[0086] [Head height change processing] Fig. 4 is a flowchart showing a head height change process according to the embodiment. The head height change process shown in Fig. 4 is executed by the control device 90 of the mounting device 10 in accordance with a pre-stored program. The head height change process shown in Fig. 4 is executed in parallel with the process of the flowchart shown in Fig. 3.

[0087] 4 is a process for changing the height position of the mounting head 40 based on a preset production program. In the following explanation, as an example, a process for changing the height position of the downstream head 44 during mounting processing in the first downstream area Df will be explained.

[0088] The control device 90 periodically acquires height information of the electronic components C mounted on the board P in the second downstream area Dr (step SB1).

[0089] The control device 90 determines whether or not the electronic components C mounted on the substrate P in the second downstream area Dr will interfere with the downstream head 44 (step SB2). Here, the electronic components C for which the determination of whether or not there will be interference may be limited to electronic components C on the movement path of the downstream head 44, or may be the electronic component C with the largest height dimension among the electronic components C already mounted on the substrate P in the second downstream area Dr.

[0090] If the control device 90 determines that the downstream head 44 will interfere (step SB2; Yes), it changes the height of the downstream head 44 (step SB3). The height position of the mounting head 40 can be changed in stages, for example, to a position elevated 1 mm, 3 mm, 6 mm, 10 mm, 15 mm, or 25 mm from the reference height to the +Z side. In step SB3 of this embodiment, the current height position is changed to a position one step higher. The control device 90 repeatedly executes steps SB2 and SB3 until it determines in step SB2 that the downstream head 44 will not interfere (step SB2; No).

[0091] If the control device 90 determines that the downstream head 44 will not interfere, it ends the series of processes shown in Fig. 4 and returns to step SB1. Note that in the head height change process shown in Fig. 4, the amount of interference in the height direction may be obtained in step SB2, and the position may be changed to two or more levels higher accordingly in step SB3.

[0092] When changing the height position of the downstream head 44 during mounting processing in the second downstream area Dr, the above-described series of processes is performed in the same manner, except that the second downstream area Dr is replaced with the first downstream area Df. When changing the height position of the upstream head 42, the same processes are performed, except that the upstream head 42 is replaced with the downstream head 44, the first downstream area Df is replaced with the first upstream area Uf, and the second downstream area Dr is replaced with the second upstream area Ur.

[0093] [Allocation decision process] Fig. 5 is a flowchart showing an allocation determination process according to an embodiment. The process of the flowchart shown in Fig. 5 is executed by the control device 90 of the mounting device 10 according to a program stored in advance. The allocation determination process shown in Fig. 5 is executed when creating a production program before starting the mounting process shown in Fig. 3.

[0094] The allocation determination process shown in Fig. 5 is a process for determining, when mounting a plurality of electronic components C in a predetermined order on a single substrate P that is the target of mounting processing, up to which electronic component C the upstream head 42 will mount in the upstream area UD, and from which electronic component C the downstream head 44 will mount in the downstream area DD. The process shown in Fig. 5 is started, for example, automatically or in response to a predetermined operation by an operator, after information such as the type and dimensions of the electronic components C to be mounted on the substrate P, as well as the coordinate positions and order of mounting, has been set.

[0095] The control device 90 extracts an allocation pattern for the electronic component C (step SC1).

[0096] The control device 90 sets the execution count i to i=1 and starts the loop process (step SC2). In the loop process, while i≦n holds, the processes from step SC3 to step SC7 are repeated n times, where n is the number of allocation patterns extracted in step SC1.

[0097] The control device 90 extracts a combination pattern of the initial height of the upstream head 42 and the initial height of the downstream head 44 in the i-th allocation pattern (step SC3).

[0098] The control device 90 sets the number of executions j to j=1 and starts the loop process (step SC4). In the loop process, while j≦m is satisfied, the process of step SC5 is repeated m times, where m is the number of combination patterns of initial heights extracted in step SC3.

[0099] The control device 90 calculates the time required for the upstream head 42 to mount all of the allocated electronic components C on one board P for the jth combination pattern in the nth allocation pattern. Note that the upstream head 42 is assumed to rise in height so that the electronic components C it holds do not interfere with the board P, and is assumed not to descend until all of the allocated electronic components C have been mounted on one board P.

[0100] Similarly, for the jth combination pattern in the nth allocation pattern, the control device 90 calculates the time required for the downstream head 44 to mount all of the allocated electronic components C on one board P after the upstream head 42 has mounted a predetermined number of electronic components C. Note that the downstream head 44 is assumed to rise in height so that the electronic components C it holds do not interfere with the board P, and is not assumed to descend until all of the allocated electronic components C have been mounted on one board P.

[0101] The control device 90 calculates the tact time difference between the upstream head 42 and the downstream head 44 from the calculated required time for the j-th combination pattern in the n-th allocation pattern (step SC5).

[0102] The control device 90 resets the execution number j in the loop processing to j=j+1 and returns to step SC5. After executing the processing of step SC5 m times and calculating the tact time difference between the upstream head 42 and the downstream head 44 for the m combination patterns extracted in step SC3, the control device 90 ends the loop processing (step SC6).

[0103] The control device 90 calculates and stores the tact time difference for each of the m combination patterns in the loop process from step SC4 to step SC6. The control device 90 calculates the average value of the absolute values of the tact time differences for the m combination patterns for the i-th allocation pattern (step SC8).

[0104] The control device 90 resets the execution number i in the loop processing as i=i+1 and returns to step SC3. After executing the processing from step SC3 to step SC7 n times and calculating the average value of the absolute values of the tact differences for the n allocation patterns extracted in step SC1, the loop processing ends (step SC8).

[0105] In the loop processing from step SC2 to step SC8, the control device 90 calculates and stores the average value of the absolute values of the tact time differences for each of the n allocation patterns. The control device 90 selects the allocation pattern with the smallest average value of the absolute values of the tact time differences from among the n allocation patterns (step SC9). The control device 90 generates a production program for mounting electronic components C on the board P by the upstream head 42 and downstream head 44 based on the allocation pattern selected in the processing of the flowchart shown in FIG.

[0106] [effect] As described above, according to this embodiment, the tact time difference is calculated for a plurality of combination patterns in which the initial heights of the upstream head 42 and the downstream head 44 are set from the lowest height within the producible range in which no interference occurs with the board P being mounted to a height higher than that. Then, an allocation pattern for electronic components C is determined such that the absolute value of the tact time difference for each combination pattern, or the average value of the absolute value multiplied by a predetermined weighting coefficient, is minimized. In this way, the allocation pattern for electronic components C is determined taking into consideration the possibility that the other board transport device 20 may have large electronic components C and the mounting head 40 may operate at a higher position than expected, making it possible to prevent a significant increase in tact time due to a change in the tact time difference.

[0107] [Other embodiments] Although the embodiments of the present application have been described above, the present invention is not limited to the contents of these embodiments. The above-described embodiments and variations can be combined as appropriate as long as the processing content is not inconsistent. Furthermore, the above-described components include those that can be easily imagined by a person skilled in the art, those that are substantially the same, and those that are within the so-called equivalent range. Furthermore, the above-described components can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the components can be made as long as they do not deviate from the spirit of the above-described embodiments.

[0108] For example, among the processes described in the above embodiments, all or part of the processes described as being performed automatically can be performed manually, or all or part of the processes described as being performed manually can be performed automatically using a known method. Furthermore, the information including the processing procedures, specific names, various data, and parameters shown in the above documents and drawings can be changed as desired unless otherwise specified. For example, the various information shown in each drawing is not limited to the information shown in the drawings.

[0109] Furthermore, the components of each device shown in the figure are conceptual functional units and do not necessarily have to be physically configured as shown. In other words, the specific form of distribution and integration of each device is not limited to that shown in the figure, and all or part of the devices can be functionally or physically distributed and integrated in any unit depending on various loads, usage conditions, etc. Furthermore, the above-mentioned control device 90 may be configured by multiple computers each divided into several functions, or may exist separately via a network, and some of the computer functions may be possessed by a cloud server that executes various functions in the form of cloud computing. Furthermore, a program may be distributed to the control device 90 via a network. [Explanation of symbols]

[0110] 10...mounting device, 12...base member, 14...VCS unit, 16...replacement nozzle holding mechanism, 18...component storage section, 20...substrate transport device, 22...first substrate transport device, 24...second substrate transport device, 26...guide member, 28...transport belt, 30, 32f, 32r, 34f, 34r...component supply device, 36...tape feeder, 40...mounting head, 40a...housing, 42...upstream head, 44...downstream head, 46...nozzle, 46a...opening, 46b...shaft, 48...nozzle Zigzag drive unit, 50, 50D, 50U...head moving device, 60...X-axis moving device, 62...X-axis guide member, 64...X-axis slide member, 70...Y-axis moving device, 72...Y-axis guide member, 74...Y-axis slide member, 80...Z-axis moving device, 82...Z-axis guide member, 84...Z-axis slide member, 90...control device, P...board, C...electronic component, DM...mounting area, Df...first downstream area, Dr...second downstream area, SM...supply area, Uf...first upstream area, Ur...second upstream area.

Claims

1. a plurality of substrate transport devices arranged in parallel to transport the substrate in a transport direction; a first mounting head configured to mount electronic components on each of the substrates transported by the plurality of substrate transport devices in an upstream region in the transport direction; a second mounting head that mounts further electronic components on the board after the electronic components have been mounted by the first mounting head in a downstream region in the transport direction; a head moving device that moves the first mounting head and the second mounting head in a horizontal direction across the plurality of substrate transport devices and changes their height positions in a stepwise manner; a control device for controlling each part; Equipped with The control device extracting an allocation pattern indicating whether the first mounting head or the second mounting head will mount the electronic components C from among the plurality of electronic components C to be mounted on one board; extracting, for each of the allocation patterns, a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting a mounting process for one board; calculating an absolute value of a tact time difference between the first mounting head and the second mounting head in each of the combination patterns; Based on the calculated absolute values, one of the allocation patterns is regarded as an allocation pattern in which the takt time difference is optimized, and the allocation pattern is determined to be the allocation pattern to be executed. Mounting equipment.

2. The control device The allocation pattern with the smallest average value calculated by averaging the absolute values across all combination patterns is considered to be the allocation pattern with the optimized takt time difference. The mounting device according to claim 1 .

3. The control device The calculated absolute value is multiplied by a predetermined weighting coefficient, and the average value is averaged over all combination patterns. The allocation pattern with the smallest average value is considered to be the allocation pattern with the optimized takt time difference. The mounting device according to claim 1 .

4. a plurality of substrate transport devices arranged in parallel to transport the substrate in a transport direction; a first mounting head configured to mount electronic components on each of the substrates transported by the plurality of substrate transport devices in an upstream region in the transport direction; a second mounting head that mounts further electronic components on the board after the electronic components have been mounted by the first mounting head in a downstream region in the transport direction; a head moving device that moves the first mounting head and the second mounting head in a horizontal direction across the plurality of substrate transport devices and changes their height positions in a stepwise manner; A control method for a mounting apparatus comprising: extracting an allocation pattern indicating whether the first mounting head or the second mounting head will mount a plurality of electronic components C to be mounted on one board; extracting, for each of the allocation patterns, a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting mounting processing on one board; calculating an absolute value of a tact time difference between the first mounting head and the second mounting head in each of the combination patterns; Based on the calculated absolute values, one of the allocation patterns is regarded as an allocation pattern in which the tact difference is optimized, and the allocation pattern is determined to be the allocation pattern to be executed; Including, A method for controlling a mounting device.

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