Brush unit and substrate processing device

Abstract

To provide a brush unit capable of improving cleanliness on a bottom face of a substrate after cleaning.SOLUTION: A brush unit 300 is used for cleaning a bottom face of a substrate and includes a bottom face brush 100 and a brush base 200. The bottom face brush 100 is directed upward when cleaning the bottom face of the substrate and at least partially brought into contact with the bottom face of the substrate. The brush base 200 includes a base top face 210 to which the bottom face brush 100 is connected, a base bottom face 220 which is directed downward when cleaning the bottom face of the substrate, and a base side face 250 connecting an outer edge of the base top face 210 and an outer edge of the base bottom face 220. A through hole extending from a first portion on a top face of the bottom face brush 100 to a second portion on the base bottom face 220 or the base side face 250 is formed in the bottom face brush 100 and the brush base 200. The brush unit 300 further has a configuration which restricts a flow of a gas from the second portion to the first portion in the through hole.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a brush unit used to clean the underside of a substrate and a substrate processing apparatus. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells. Substrate cleaning apparatuses are used to clean substrates.

[0003] In the substrate cleaning apparatus described in Patent Document 1, the outer peripheral edge of a substrate is held by a pair of upper holding devices. A lower surface brush wetted with a cleaning liquid is pressed against the central region of the lower surface of the substrate. In this state, the lower surface brush rotates or moves relative to the central region of the lower surface of the substrate. This cleans the central region of the lower surface of the substrate.

[0004] Furthermore, the central underside region of one substrate before or after cleaning is sucked and held by a lower holding device. The lower holding device rotates the substrate. The region of the underside of the substrate that surrounds the central underside region is called the outer underside region. A cleaning liquid is supplied to the outer underside region of the substrate, and a lower surface brush is pressed against the outer underside region. This cleans the outer underside region of the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2023-19211 Summary of the Invention [Problem to be solved by the invention]

[0006] In a substrate cleaning apparatus (substrate processing apparatus) that cleans the underside of a substrate using a brush as described above, it is required to improve the cleanliness of the underside of the substrate after cleaning.

[0007] An object of the present invention is to provide a brush unit and a substrate processing apparatus that can improve the cleanliness of the underside of a substrate after cleaning. [Means for solving the problem]

[0008] A brush unit according to one aspect of the present invention is a brush unit used for cleaning the underside of a substrate, and comprises a brush, a brush base, and a flow restricting portion, wherein the brush has a brush upper surface that faces upward when cleaning the underside of the substrate and at least a portion of which contacts the underside of the substrate, and the brush base has a base upper surface to which the brush is connected, a base lower surface that faces downward when cleaning the underside of the substrate, and a base side surface that connects the outer edge of the base upper surface to the outer edge of the base underside, and the brush and the brush base have through holes formed in them that extend from a first portion of the brush upper surface to a second portion of the base underside or the base side surface, and the flow restricting portion restricts the flow of gas from the second portion of the through hole to the first portion.

[0009] A brush unit according to another aspect of the present invention is a brush unit used for cleaning the underside of a substrate, and comprises a brush, a brush base, and blade members, wherein the brush has a brush upper surface that faces upward when cleaning the underside of the substrate and at least a portion of which contacts the underside of the substrate, the brush base has a base upper surface to which the brush is connected, a base lower surface that faces downward when cleaning the underside of the substrate, and a base side surface that connects the outer edge of the base upper surface to the outer edge of the base underside, the brush and the brush base have through holes that extend from a first portion of the brush upper surface to a second portion of the base underside or the base side surface, the brush base is fixed on a rotating shaft that extends in the vertical direction, and the rotating shaft rotates when cleaning the underside of the substrate, and the blade members are attached to the brush base and rotate together with the brush base to form a downward airflow in the space below the brush base.

[0010] A substrate processing apparatus according to yet another aspect of the present invention includes a substrate holding unit that holds a substrate, and the above-described brush unit that is provided to clean the underside of the substrate held by the substrate holding unit. [Effects of the Invention]

[0011] According to the present invention, it is possible to improve the cleanliness of the underside of the substrate after cleaning. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is an external perspective view of a brush unit according to a first embodiment. FIG. [Figure 2] FIG. 2 is a perspective view of the appearance of the lower surface brush of FIG. 1. [Figure 3] FIG. 2 is a plan view of the lower brush of FIG. 1. [Figure 4] FIG. 2 is a vertical cross-sectional view of the brush unit taken along line AA in FIG. [Figure 5] 5A and 5B are diagrams for explaining the function of each part of a through hole formed in a brush base. [Figure 6]FIG. 10 is an enlarged cross-sectional view illustrating the configuration of a brush unit according to a second embodiment. [Figure 7] FIG. 10 is an enlarged cross-sectional view illustrating the configuration of a brush unit according to a third embodiment. [Figure 8] FIG. 10 is an enlarged cross-sectional view illustrating the configuration of a brush unit according to a fourth embodiment. [Figure 9] FIG. 10 is an enlarged cross-sectional view illustrating the configuration of a brush unit according to a fifth embodiment. [Figure 10] FIG. 13 is an enlarged cross-sectional view illustrating the configuration of a brush unit according to a sixth embodiment. [Figure 11] FIG. 13 is an enlarged cross-sectional view illustrating the configuration of a brush unit according to a sixth embodiment. [Figure 12] FIG. 13 is an external perspective view for explaining the configuration of a brush unit according to a seventh embodiment. [Figure 13] FIG. 13 is a vertical cross-sectional view of the brush unit taken along line BB in FIG. [Figure 14] FIG. 13 is a schematic plan view of a substrate cleaning apparatus according to an eighth embodiment. [Figure 15] FIG. 15 is a perspective view showing the internal configuration of the substrate cleaning apparatus of FIG. [Figure 16] 15 is a flowchart showing a substrate cleaning process performed by the control unit in FIG. [Figure 17] 10A and 10B are diagrams illustrating an example of a configuration of a brush base according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] A brush unit and a substrate processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

[0014] The brush unit described below is used to clean the underside of a substrate held in a horizontal or nearly horizontal position by a holding device, and is mainly composed of a lower-surface brush and a brush base. The lower-surface brush is attached to and supported by the brush base. The lower-surface brush is pressed against the underside of the substrate from below and cleans the underside of the substrate by sliding against the underside of the substrate.

[0015] 1. First embodiment 1 is an external perspective view of the brush unit according to the first embodiment. As described above, the brush unit 300 has a configuration in which the lower brush 100 is attached to the brush base 200. The lower brush 100 is a sponge brush made of a relatively soft resin material such as PVA (polyvinyl alcohol) or PTFE (polytetrafluoroethylene).

[0016] Fig. 2 is an external perspective view of the lower-surface brush 100 of Fig. 1. Fig. 3 is a plan view of the lower-surface brush 100 of Fig. 1. As shown in Figs. 2 and 3, the lower-surface brush 100 includes a base portion 110 and cleaning portions 120 and 130. The base portion 110 has a disk shape. In a plan view, a geometric center 101 (Fig. 3) of the base portion 110 is defined.

[0017] The cleaning portions 120 and 130 are formed on the upper surface of the base portion 110 so as to protrude upward from the upper surface of the base portion 110. The cleaning portion 120 is disposed so as to extend radially of the base portion 110, passing through the geometric center 101 of the base portion 110. The cleaning portion 130 is disposed so as to follow the outer edge of the base portion 110. In this example, the cleaning portion 130 is in contact with both ends of the cleaning portion 120. Note that the cleaning portion 130 does not necessarily have to be in contact with both ends of the cleaning portion 120. The amount of protrusion of the cleaning portions 120 and 130 from the upper surface of the base portion 110 is, for example, 5 mm to 6 mm. The width of the cleaning portion 120 and the width of the cleaning portion 130 may be the same or different.

[0018] The base portion 110 is formed with a plurality of through holes 111, a plurality of through holes 112, and a plurality of through holes 113. Each of the through holes 111 to 113 extends in the vertical direction. The through holes 111 are used to connect the base portion 110 to the brush base 200 of FIG. 1, and ten through holes 111 are provided in this example. Specifically, eight through holes 111 are arranged at approximately equal angular intervals in the peripheral region of the base portion 110. Two through holes 111 are arranged in the central region of the base portion 110 so as to be spaced apart with the cleaning portion 120 sandwiched therebetween.

[0019] The brush base 200 is fixed onto the rotating shaft 400 (FIG. 4) of the motor. The rotating shaft 400 extends upward from below. As a result, the brush base 200 rotates around the vertical axis when the motor is operating. The through holes 112 are used to connect the brush base 200 to the rotating shaft 400, and four through holes 112 are provided in this example. The four through holes 112 are arranged in the central region of the base 110 at approximately equal angular intervals so as to surround the geometric center 101 of the base 110.

[0020] When the brush unit 300 cleans the underside of the substrate, a cleaning liquid for the substrate is used. Also, a cleaning liquid for the lower-surface brush 100 is used to moisten the lower-surface brush 100 in a standby state and to clean the lower-surface brush 100 in a standby state. In the following description, the cleaning liquid for the substrate and the cleaning liquid for the lower-surface brush 100 will be collectively referred to simply as cleaning liquid.

[0021] If excess cleaning liquid remains on the lower surface brush 100, the underside of the substrate cannot be properly cleaned. Therefore, the through holes 113, together with through holes 203 (FIG. 4) of the brush base 200 described below, are used to drain excess cleaning liquid from the lower surface brush 100. In this example, ten through holes 113 are provided. The ten through holes 113 are regularly arranged in the peripheral region of the base portion 110 so as to follow the cleaning portion 130.

[0022] The brush base 200 is a single member having a flat, cylindrical shape, and has the same external shape as the base portion 110 of the lower-surface brush 100 in a plan view. The brush base 200 is formed from a relatively hard resin material such as PVC (polyvinyl chloride) or PP (polypropylene), and has a relatively large thickness compared to the lower-surface brush 100. The outer diameter of the brush base 200 in a plan view is, for example, 100 mm to 120 mm. The thickness of the brush base 200 is, for example, 20 mm to 50 mm.

[0023] Figure 4 is a vertical cross-sectional view of the brush unit 300 taken along line AA in Figure 1. In Figure 4, some of the components in Figure 1 (multiple screw members 310, 320, described below) are omitted from the illustration in order to make it easier to understand the cross-sectional structures of the lower brush 100 and the brush base 200.

[0024] As shown in Figure 4, the brush base 200 has a base upper surface 210, a base lower surface 220, and a base side surface 250. The base upper surface 210 is a circular, flat surface to which the lower surface brush 100 is connected. The base lower surface 220 is a circular surface corresponding to the base upper surface 210. The base side surface 250 is the outer peripheral surface of the brush base 200 that connects the outer edge of the base upper surface 210 and the outer edge of the base lower surface 220.

[0025] A recess 230 is formed in the central region of base undersurface 220. In addition, an inclined portion 240 that slopes diagonally downward outward is formed in the peripheral region of base undersurface 220. Furthermore, brush base 200 has a plurality of screw holes 201, a plurality of through holes 202, and a plurality of through holes 203.

[0026] The multiple screw holes 201 are formed to correspond to the multiple through holes 111 of the lower-surface brush 100, respectively. Each screw hole 201 opens in the base upper surface 210 and extends a fixed distance from the base upper surface 210 toward the base lower surface 220. The multiple through holes 202 are formed to correspond to the multiple through holes 112 of the lower-surface brush 100, respectively. Each through hole 202 extends linearly from the base upper surface 210 to the base lower surface 220. The multiple through holes 203 will be described later.

[0027] When fabricating the brush unit 300, the lower-surface brush 100 is placed on the base upper surface 210 so that each through-hole 111 of the lower-surface brush 100 overlaps the corresponding screw hole 201 of the brush base 200 in a plan view. In this state, a plurality of screw members 310 (FIG. 1) are inserted into each of the through-holes 111 of the lower-surface brush 100 from above the lower-surface brush 100. The lower end (threaded portion) of each screw member 310 is attached to the screw hole 201 of the brush base 200. This connects the lower-surface brush 100 and brush base 200, completing the brush unit 300.

[0028] In the brush unit 300, each through hole 112 of the lower brush 100 overlaps with a corresponding through hole 202 of the brush base 200 in a plan view. That is, the internal spaces of the multiple through holes 113 of the lower brush 100 are in communication with the internal spaces of the multiple through holes 203 of the brush base 200, respectively.

[0029] As described above, the brush unit 300 according to this embodiment is fixed onto the rotating shaft 400 of a motor. Specifically, the rotating shaft 400 is formed with a plurality of screw holes 401 corresponding to the plurality of through holes 202 of the brush unit 300. When attaching the brush unit 300 to the rotating shaft 400, the brush unit 300 and the rotating shaft 400 are positioned so that the plurality of through holes 202 of the brush unit 300 overlap the plurality of screw holes 401 of the rotating shaft 400 in a plan view. In this state, the upper end of the rotating shaft 400 is fitted into the recess 230 of the brush base 200. Furthermore, a plurality of screw members 320 ( FIG. 1 ) are inserted from above the brush unit 300 into the plurality of through holes 112 of the lower-surface brush 100 and the plurality of through holes 202 of the brush base 200. Furthermore, the lower end (threaded portion) of each screw member 320 is attached to the screw hole 401 of the rotating shaft 400.

[0030] The multiple through holes 203 in the brush base 200 correspond to the multiple through holes 113 in the lower surface brush 100. In this example, each through hole 203 extends from the base upper surface 210 to the base side surface 250 while bending multiple times. The shape of the through holes 203 will be described in more detail.

[0031] 4, an enlarged cross-sectional view of one through-hole 203 and its surrounding area is shown in a bubble indicated by a dashed line. As shown in the enlarged cross-sectional view, through-hole 203 extends downward from a part of base upper surface 210 to a position near base lower surface 220. Furthermore, through-hole 203 extends obliquely upward for a certain distance from a position near base lower surface 220 toward base side surface 250, bends, extends obliquely downward toward base side surface 250, and opens at base side surface 250.

[0032] This through-hole 203 has multiple portions with different functions: introduction portion 203a, storage portion 203b, and discharge portion 203c. Introduction portion 203a extends downward a certain distance from base upper surface 210, and storage portion 203b is located below introduction portion 203a. Discharge portion 203c is a curved portion located between storage portion 203b and base side surface 250, and at least a portion of it is located above storage portion 203b.

[0033] 5 is a diagram for explaining the function of each part of the through-holes 203 formed in the brush base 200. In the brush unit 300, the multiple through-holes 113 of the lower-surface brush 100 and the multiple through-holes 203 of the brush base 200 are formed as flow paths for discharging excess cleaning liquid on the lower-surface brush 100, as described above.

[0034] As shown in the upper part of Fig. 5, assume that the lower brush 100 in a standby state is cleaned. When the lower brush 100 is cleaned, for example, a large amount of cleaning liquid is supplied onto the lower brush 100, as indicated by the white arrow in Fig. 5. In Fig. 5, the cleaning liquid is indicated by hatching.

[0035] A portion of the cleaning liquid supplied onto the lower-surface brush 100 flows into the introduction portion 203a of the brush base 200 through the through-holes 113 of the lower-surface brush 100. In this case, the introduction portion 203a guides the flowing cleaning liquid to the storage portion 203b below. When the cleaning liquid on the lower-surface brush 100 continuously flows into the introduction portion 203a, the cleaning liquid in the storage portion 203b is discharged downward and to the side of the brush unit 300 through the discharge portion 203c. In this way, in the brush unit 300 described above, the cleaning liquid does not stagnate on the upper surface of the lower-surface brush 100.

[0036] Next, as shown in the lower part of Figure 5, consider the case where the underside of the substrate is cleaned using the brush unit 300. When cleaning the underside of the substrate, the cleaning portions 120, 130 of the lower-surface brush 100 are pressed against the underside of the substrate and slide against the underside of the substrate. At this time, the lower-surface brush 100 is maintained in a wet state. However, cleaning liquid is not supplied directly to the upper surface of the lower-surface brush 100 while cleaning the underside of the substrate. Therefore, cleaning liquid does not flow into the multiple through-holes 113 of the lower-surface brush 100 when cleaning the underside of the substrate.

[0037] As described above, at least a portion of the discharge portion 203c is located above the storage portion 203b in the through-hole 203 of the brush base 200. As a result, if cleaning liquid flows into the through-hole 113 of the lower brush 100 at or before the start of cleaning, at least a portion of the cleaning liquid is maintained in a state of being stored in the storage portion 203b.

[0038] Here, when cleaning the substrate, the internal pressure of the through hole 203 of the brush base 200 and the through hole 113 of the lower-surface brush 100 may decrease due to relative movement between the underside of the substrate and the lower-surface brush 100. When the internal pressure of the through hole 203 of the brush base 200 decreases, the atmosphere on the side of the brush unit 300 may be drawn into the through hole 203.

[0039] However, when cleaning liquid is stored in the storage portion 203b of the through-hole 203, the cleaning liquid functions as a sealing member (water seal) that blocks the flow of gas through the through-hole 203. Therefore, the atmosphere on the side of the brush unit 300 is prevented from flowing above the lower surface brush 100 through the through-hole 203.

[0040] This prevents contaminants floating in the space to the sides of brush unit 300 from adhering to the underside of the substrate through through-holes 203 of brush base 200 and through-holes 113 of underside brush 100 when the underside of the substrate is being cleaned. As a result, brush unit 300 described above can improve the cleanliness of the underside of the substrate after cleaning.

[0041] 2. Second embodiment The brush unit according to the second embodiment differs from brush unit 300 according to the first embodiment in that the shape of the plurality of through holes 203 in brush base 200 of the brush unit according to the present embodiment differs from the shape of the plurality of through holes 203 in brush unit 300 according to the first embodiment.

[0042] Fig. 6 is an enlarged cross-sectional view for explaining the configuration of the brush unit according to the second embodiment. The enlarged cross-sectional view of Fig. 6 corresponds to the enlarged cross-sectional view in the balloon of Fig. 4, and shows the structure of one through-hole 203 of brush base 200 and its surrounding area.

[0043] 6, the through-hole 203 in this example extends downward from a part of the base upper surface 210 to a position near the base lower surface 220. The through-hole 203 also bends at a position near the base lower surface 220, extends toward the base side surface 250, and opens at the base side surface 250.

[0044] As a result, through hole 203 according to the present embodiment does not have a portion corresponding to reservoir portion 203b of through hole 203 according to the first embodiment. Therefore, in brush unit 300 according to the present embodiment, cleaning liquid cannot be stored inside through hole 203 without the cleaning liquid flowing into through hole 203.

[0045] However, as described above, each through hole 203 of the brush base 200 is partially bent and not formed in a straight line. In this case, the gas does not flow smoothly through each through hole 203 compared to when the through hole 203 is formed in a straight line. In other words, in the through hole 203 according to this embodiment, the gas does not flow smoothly as easily as when the through hole 203 is formed in a straight line.

[0046] As a result, even if the internal pressure of through-hole 203 of brush base 200 drops when cleaning the underside of the substrate, the atmosphere on the side of brush unit 300 is less likely to flow into through-hole 203. Therefore, with a simple configuration, the atmosphere on the side of brush unit 300 is reduced from flowing above lower surface brush 100 through through-hole 203. As a result, it is possible to improve the cleanliness of the underside of the substrate after cleaning.

[0047] Through-hole 203 according to this embodiment has two vertically aligned straight line portions 203d and 203e. An angle α between the axes of straight line portions 203d and 203e is preferably equal to or greater than 90° and smaller than 180°, and is preferably equal to or greater than 90° and smaller than 135°.

[0048] Furthermore, in through-hole 203 according to this embodiment, the inner diameter of straight portions 203d, 203e may be constant or may vary among multiple portions. For example, the inner diameter of straight portion 203e may gradually decrease from the lower end of straight portion 203d toward the open portion on the base side surface 250 side. In other words, through-hole 203 may be formed so that the opening cross-sectional area is locally smaller at or near the lower end. In this case, the atmosphere on the side of brush unit 300 is further reduced from flowing upward to lower surface brush 100 through through-hole 203.

[0049] 3. Third Embodiment The brush unit according to the third embodiment differs from brush unit 300 according to the first embodiment in that the shape of the plurality of through holes 203 in brush base 200 of the brush unit according to the present embodiment differs from the shape of the plurality of through holes 203 in brush unit 300 according to the first embodiment.

[0050] Fig. 7 is an enlarged cross-sectional view for explaining the configuration of a brush unit according to the third embodiment. The enlarged cross-sectional view of Fig. 7 corresponds to the enlarged cross-sectional view in the balloon of Fig. 4, and shows the structure of one through-hole 203 of brush base 200 and its surrounding area.

[0051] 7, the through-hole 203 in this example extends downward from a part of the base upper surface 210 to approximately the center in the vertical direction of the brush base 200. The through-hole 203 also bends at a position near the base lower surface 220, extends diagonally downward away from the base side surface 250, and opens at the base lower surface 220.

[0052] In this embodiment, as in the second embodiment, each through hole 203 of the brush base 200 is partially bent and not formed straight. In this case, the gas flow through each through hole 203 is not as smooth as when the through hole 203 is formed straight. In other words, in the through hole 203 according to this embodiment, the gas does not flow as smoothly as when the through hole 203 is formed straight.

[0053] As a result, even if the internal pressure of the through-holes 203 of the brush base 200 drops when cleaning the underside of the substrate, the atmosphere below the brush unit 300 is less likely to flow into the through-holes 203. Therefore, with a simple configuration, the atmosphere below the brush unit 300 is less likely to flow above the lower surface brush 100 through the through-holes 203. As a result, it is possible to improve the cleanliness of the underside of the substrate after cleaning.

[0054] Furthermore, with the above configuration, the lower end of through hole 203 extends toward rotation shaft 400 in Fig. 4 in a plan view. As a result, when brush unit 300 rotates around rotation shaft 400 in Fig. 4, a portion of the cleaning liquid flowing into through hole 203 can be retained in through hole 203 by centrifugal force acting on the cleaning liquid. Therefore, by adjusting the rotation speed of rotation shaft 400, it is possible to reduce or block the flow of gas in through hole 203.

[0055] The inner diameter of at least a portion of through-hole 203 according to this embodiment, including the lower end, may gradually decrease from top to bottom. In this case, the flow of the atmosphere below brush unit 300 through through-hole 203 to above lower brush 100 is further reduced.

[0056] 4. Fourth Embodiment The differences between the brush unit according to the fourth embodiment and brush unit 300 according to the first embodiment will be described below. Fig. 8 is an enlarged cross-sectional view for explaining the configuration of the brush unit according to the fourth embodiment. The enlarged cross-sectional view of Fig. 8 corresponds to the enlarged cross-sectional view in the balloon in Fig. 4, and shows the structure of one through-hole 203 of brush base 200 and its surrounding area.

[0057] 8, the through-hole 203 of this example extends linearly downward from a part of the base upper surface 210 to the base lower surface 220. A filter member 204 is provided near the lower end of the through-hole 203.

[0058] Filter member 204 has a mesh shape and functions as a member that restricts the flow of gas within through hole 203. As a result, gas does not flow as smoothly through through hole 203 according to this embodiment as compared to when filter member 204 is not provided. As a result, even if the internal pressure of through hole 203 of brush base 200 drops when cleaning the underside of the substrate, the atmosphere below brush unit 300 is less likely to flow into through hole 203. Therefore, the atmosphere below brush unit 300 is less likely to flow above lower surface brush 100 through through hole 203.

[0059] Furthermore, with the above configuration, even if the atmosphere below the brush unit 300 flows above the lower surface brush 100 through the through-holes 203, contaminants contained in the atmosphere are captured by the filter member 204. Therefore, the contaminants do not reach the underside of the substrate. As a result, it is possible to improve the cleanliness of the underside of the substrate after cleaning.

[0060] 5. Fifth Embodiment The brush unit according to the fifth embodiment differs from brush unit 300 according to the second embodiment in the following points. The brush unit according to this embodiment has a configuration in which a plurality of opening and closing mechanisms corresponding to the plurality of through holes 203 are attached to brush unit 300 according to the second embodiment.

[0061] Fig. 9 is an enlarged cross-sectional view for explaining the configuration of a brush unit according to the fifth embodiment. The enlarged cross-sectional view of Fig. 5 corresponds to the enlarged cross-sectional view of Fig. 6, and shows the structure of one through-hole 203 of the brush base 200 and its surrounding area.

[0062] 9, opening / closing mechanism 205 of this example includes lid member 205a and hinge 205b. Lid member 205a is larger than the opening of through-hole 203 that is open on base side surface 250, and is formed so as to be able to close said opening. Hinges 205b are provided at a position above the opening of through-hole 203 on base side surface 250, and support lid member 205a on base side surface 250 so as to be able to open and close.

[0063] With this configuration, the weight of the cover member 205a closes the opening of the through-hole 203 when no cleaning liquid is supplied to the brush unit 300. This prevents the atmosphere on the side of the brush unit 300 from flowing into the through-hole 203.

[0064] On the other hand, when cleaning liquid is supplied to the brush unit 300 and flows into each through-hole 203, the cover member 205a opens the opening of the through-hole 203 due to the weight of the cleaning liquid or the pressure from the cleaning liquid, thereby discharging excess cleaning liquid from the lower surface brush 100.

[0065] As described above, according to the brush unit 300 of this embodiment, the opening and closing mechanism 205 prevents the atmosphere on the side of the brush unit 300 from flowing above the lower brush 100 through the through hole 203 with a simple configuration.

[0066] In this embodiment, each through hole 203 of brush base 200 may be formed to extend linearly from base upper surface 210 to base lower surface 220. In this case, it is necessary to provide opening / closing mechanisms 205 corresponding to each through hole 203 on base lower surface 220 so as to open and close the opening of each through hole 203 on base lower surface 220.

[0067] 6. Sixth Embodiment The brush unit according to the sixth embodiment differs from brush unit 300 according to the second embodiment in the following points. The brush unit according to this embodiment has a configuration in which a plurality of opening and closing mechanisms corresponding to the plurality of through holes 203 are attached to brush unit 300 according to the second embodiment.

[0068] Figures 10 and 11 are enlarged cross-sectional views for explaining the configuration of a brush unit according to the sixth embodiment. The enlarged cross-sectional views of Figures 10 and 11 correspond to the enlarged cross-sectional view of Figure 6, and show the structure of one through-hole 203 of brush base 200 and its surrounding area.

[0069] 10, the opening / closing mechanism 206 of this example includes a cover member 206a, a bending member 206b, a weight 206c, and an elastic member 206d. The cover member 206a is larger than the opening of the through-hole 203 opened in the base side surface 250 and is formed so as to be able to close the opening. The bending member 206b is a single member having two rod-shaped portions in a side view, and formed so that the two rod-shaped portions are bent at a certain angle. The apex of the bending member 206b is rotatably attached to the base side surface 250.

[0070] A lid member 206a is attached to one rod-shaped portion of the bending member 206b so as to be able to open and close the opening of the through-hole 203 in the base side surface 250. A weight 206c is attached to the other rod-shaped portion of the bending member 206b. In this configuration, the lid member 206a can open the opening of the through-hole 203 when the weight 206c is located close to the base side surface 250, and can close the opening of the through-hole 203 when the weight 206c is moved away from the base side surface 250.

[0071] Elastic member 206d is provided to connect weight 206c and a portion of base side surface 250. Elastic member 206d is made of, for example, a coil spring or rubber, and generates a tensile force between weight 206c and base side surface 250 by its elastic force, as shown by the thick solid arrow in FIG.

[0072] In the opening / closing mechanism 206 having the above configuration, when the brush unit 300 rotates about the rotation shaft 400 in Fig. 4, a centrifugal force acts on the weight 206c, moving it away from the brush base 200, as shown by the thick dotted arrow in Fig. 10. The elastic force of the elastic member 206d is set so that when the rotation speed of the brush unit 300 is equal to or lower than a predetermined threshold speed, the centrifugal force does not cause the weight 206c to move away from the base side surface 250. The elastic force of the elastic member 206d is also set so that when the rotation speed of the brush unit 300 exceeds the threshold speed, the centrifugal force causes the weight 206c to move away from the base side surface 250.

[0073] As a result, when the rotation speed of the brush unit 300 is equal to or lower than the threshold speed, as shown in Fig. 10, the weight 206c does not move away from the base side surface 250, and the lid member 206a opens the opening of the through-hole 203. On the other hand, when the rotation speed of the brush unit 300 exceeds the threshold speed, as shown in Fig. 11, the weight 206c moves away from the base side surface 250, and the lid member 206a closes the opening of the through-hole 203.

[0074] As described above, in brush unit 300 according to this embodiment, the opening of through-hole 203 in base side surface 250 can be opened and closed by cover member 206a in accordance with the rotation speed of rotary shaft 400.

[0075] Therefore, for example, when cleaning the underside of a substrate, the openings of the through-holes 203 can be closed by rotating the brush unit 300 at a speed higher than the threshold speed. This prevents the atmosphere on the sides of the brush unit 300 from flowing into the through-holes 203. On the other hand, when cleaning the lower-surface brush 100, the openings of the through-holes 203 can be opened by rotating the brush unit 300 at a speed equal to or lower than the threshold speed or not rotating at all. This prevents the cleaning liquid from accumulating on the upper surface of the lower-surface brush 100.

[0076] In this embodiment, each through hole 203 of brush base 200 may be formed to extend linearly from base upper surface 210 to base lower surface 220. In this case, it is necessary to provide opening / closing mechanisms 206 corresponding to each through hole 203 on base lower surface 220 so as to open and close the opening of each through hole 203 on base lower surface 220.

[0077] 7. Seventh Embodiment The differences between the brush unit according to the seventh embodiment and the brush unit 300 according to the first embodiment will be described below. Fig. 12 is an external perspective view for explaining the configuration of the brush unit according to the seventh embodiment. The external perspective view of Fig. 12 corresponds to the external perspective view of Fig. 1. Fig. 13 is a vertical cross-sectional view of the brush unit 300 taken along line BB in Fig. 12. The vertical cross-sectional view of Fig. 13 corresponds to the vertical cross-sectional view of Fig. 4. In Fig. 13, as with the example of Fig. 4, some of the components of Fig. 12 (multiple screw members 310, 320) have been omitted from the illustration to make it easier to understand the cross-sectional structures of the lower brush 100 and the brush base 200.

[0078] 12 and 13, in the brush unit 300 according to this embodiment, a plurality of blade members 290 are attached to the base side surface 250 of the brush base 200. In this example, four blade members 290 are attached at equal angular intervals in the circumferential direction of the base side surface 250. Each blade member 290 has a gently curved rectangular plate shape, and one side thereof is joined to the base side surface 250 of the brush base 200. Furthermore, when attached to the brush base 200, the blade member 290 is inclined with respect to the horizontal plane (the plane perpendicular to the central axis of the brush unit 300).

[0079] As shown in FIG. 13, in the brush unit 300 according to this embodiment, each of the multiple through holes 203 formed in the brush base 200 is formed to extend linearly from the base upper surface 210 to the base lower surface 220.

[0080] In the brush unit 300 having the above configuration, when the brush unit 300 rotates on the rotary shaft 400, the rotation of the plurality of blade members 290 creates a downward air current in the space below the brush unit 300 and the space around it.

[0081] This prevents contaminants such as dust from approaching brush unit 300, even if they are generated in the space below brush unit 300. Therefore, when cleaning the underside of the substrate, rotation of brush unit 300 prevents contaminants from adhering to the underside of the substrate through multiple through holes 203. As a result, it is possible to improve the cleanliness of the underside of the substrate after cleaning.

[0082] In the brush unit 300 according to this embodiment, there is no limit to the number of blade members 290 attached to the brush base 200. Two blade members 290 may be provided on the base side surface 250. Alternatively, three blade members 290 may be provided on the base side surface 250, or five or more blade members 290 may be provided on the base side surface 250.

[0083] 8. Eighth Embodiment As the eighth embodiment, a substrate processing apparatus including the brush unit 300 according to any one of the first to seventh embodiments will be described. The substrate processing apparatus described below is a substrate cleaning apparatus that cleans the underside of a substrate using the brush unit 300.

[0084] <1> Substrate cleaning equipment configuration Figure 14 is a schematic plan view of a substrate cleaning apparatus according to an eighth embodiment. Figure 15 is a perspective view showing the internal configuration of substrate cleaning apparatus 1 of Figure 14. In substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X, Y, and Z directions are defined to clarify the positional relationship. In Figures 14 and 15, the X, Y, and Z directions are indicated by arrows. The X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction corresponds to the up-down direction (vertical direction).

[0085] 14 and 15, the substrate cleaning apparatus 1 has a configuration in which upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90 are housed in a unit housing 2. In Fig. 15, the unit housing 2 is indicated by a dotted line.

[0086] The unit housing 2 has a rectangular parallelepiped shape and includes a rectangular bottom surface and four side walls extending upward from the four sides of the bottom surface. Two of the four side walls face each other in the Y direction. The other two of the four side walls face each other in the X direction. A loading / unloading opening 2x for the substrate W is formed in the center of one of the four side walls. An opening / closing device 90 is provided near the loading / unloading opening 2x. The opening / closing device 90 includes a shutter 91 and is configured to be able to open and close the loading / unloading opening 2x by means of the shutter 91.

[0087] A pedestal device 30 is provided on the bottom surface of the unit housing 2. The pedestal device 30 includes a linear guide 31 and a movable pedestal 32. The linear guide 31 includes two rails aligned in the X direction and extends in the Y direction so as to cross the center of the bottom surface in the X direction. The pedestal device 30 is configured so that the movable pedestal 32 can be moved to multiple positions in the Y direction on the two rails of the linear guide 31.

[0088] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 is fixed to the upper surface of the movable base 32 and includes a suction holding unit 21. The suction holding unit 21 is a so-called spin chuck, and has a circular suction surface capable of suction-holding the lower surface of the substrate W. The suction holding unit 21 is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). The lower holding device 20 includes a motor (not shown) that rotates the suction holding unit 21. As a result, under the control of the control unit 9 (described later), the lower holding device 20 suction-holds the lower surface of the substrate W using the suction holding unit 21, and rotates the suction-held substrate W around the axis extending in the vertical direction.

[0089] In the following description, when the substrate W is sucked and held by the sucking holding part 21, the area of the underside of the substrate W that is sucked and held by the sucking surface of the sucking holding part 21 is referred to as the underside central area. Also, the area of the underside of the substrate W that surrounds the underside central area is referred to as the underside outer area.

[0090] A delivery device 40 is provided on the movable base 32 near the lower holding device 20. The delivery device 40 has a plurality of support pins 41 (three in this example) that surround the suction holding part 21 in a plan view and extend in the vertical direction. The plurality of support pins 41 are provided so as to be able to rise and fall between a plurality of predetermined height positions.

[0091] As will be described later, the upper holding devices 10A, 10B are configured to be able to hold the substrate W at a position higher than the lower holding device 20. The delivery device 40 is able to receive the substrate W held by the lower holding device 20 and transfer it to the upper holding devices 10A, 10B by raising and lowering a plurality of support pins 41. The delivery device 40 is also able to receive the substrate W held by the upper holding devices 10A, 10B and transfer it to the lower holding device 20.

[0092] The lower surface cleaning device 50 includes a brush unit 300 according to any one of the first to seventh embodiments, two substrate nozzles 51, two brush nozzles 52a and 52b, a gas ejection unit 53, a lifting and rotation support unit 54, and various driving units (not shown). The lifting and rotation support unit 54 is fixed to the upper surface of the movable base 32 so as to be adjacent to the lower holding device 20 in the Y direction.

[0093] The lifting / rotating support portion 54 includes a lifting device that lifts and lowers the brush unit 300 and a brush driving device that rotates the brush unit 300.

[0094] The brush drive device of the lifting rotation support part 54 is a motor, and is disposed so that its rotation shaft protrudes upward. This rotation shaft corresponds to the rotation shaft 400 in Fig. 4. The brush unit 300 is attached to the rotation shaft of the brush drive device.

[0095] The lifting and rotating support part 54 uses its lifting device to move the brush unit 300 between a first height position, a second height position, and a third height position, which are different from one another. The first height position is the lowest position in the Z-direction range in which the brush unit 300 can be raised and lowered by the lifting device. The second height position is the height position of the brush unit 300 when the lower-surface brush 100 contacts the lower surface of the substrate W held by the upper holding devices 10A and 10B. The third height position is the height position of the brush unit 300 when the lower-surface brush 100 contacts the lower surface of the substrate W held by the lower-side holding device 20.

[0096] The lifting and rotating support part 54 rotates the brush unit 300 by its brush driving device. By rotating the brush unit 300 while it is at the second height position or the third height position, the portion of the underside of the substrate W that is in contact with the brush unit 300 is cleaned. In this embodiment, the area of the entire upper surface of the brush unit 300 when viewed in the Z direction (when viewed from above) is larger than the area of the entire suction surface of the suction holding part 21.

[0097] Each of the two substrate nozzles 51 is attached to the upper surface of the lifting and rotating support part 54 so that it is located near the brush unit 300 and has its liquid discharge port facing upward. A cleaning liquid supply system (not shown) is connected to the substrate nozzles 51. When the underside of the substrate W is cleaned by the brush unit 300, the substrate nozzles 51 discharge the cleaning liquid supplied from the cleaning liquid supply system onto the underside of the substrate W.

[0098] The two brush nozzles 52a, 52b are used to clean the brush unit 300 and to wet the lower surface brush 100 with cleaning liquid. One of the brush nozzles, 52a, is provided on the upper surface of the lifting and rotating support part 54 so that its tip (liquid discharge port) faces the space above the brush unit 300. The other brush nozzle 52b is provided on the upper surface of the lifting and rotating support part 54 so that its tip (liquid discharge port) faces the side (outer peripheral surface) of the brush unit 300. A cleaning liquid supply system (not shown) is connected to the brush nozzles 52a, 52b.

[0099] The brush nozzle 52a discharges the cleaning liquid supplied from the cleaning liquid supply system when the brush unit 300 is on standby at the first height position. In this case, the cleaning liquid discharged from the brush nozzle 52a is guided from a position to the side of the lower-surface brush 100 to the center of the upper surface of the lower-surface brush 100 in a parabolic curve.

[0100] Furthermore, the brush nozzle 52b discharges the cleaning liquid supplied from the cleaning liquid supply system when the brush unit 300 is on standby at the first height position. In this case, the cleaning liquid discharged from the brush nozzle 52b is guided from a position on the side of the lower-surface brush 100 to the side (outer peripheral surface) of the lower-surface brush 100.

[0101] The brush unit 300 is rotated at a predetermined rotational speed by the lifting and rotating support part 54 even during standby. As a result, when cleaning liquid is supplied to the brush unit 300 from the brush nozzles 52a, 52b, the cleaning liquid flows over the entire surface of the lower-surface brush 100. Therefore, contaminants adhering to the lower-surface brush 100 are smoothly removed at the first height position. Furthermore, the cleaning liquid seeping into the lower-surface brush 100 prevents the lower-surface brush 100 from drying out. Furthermore, some of the excess cleaning liquid supplied onto the lower-surface brush 100 is discharged to the side or below the brush unit 300 through the multiple through-holes 113 in the lower-surface brush 100 and the multiple through-holes 203 in the brush base 200.

[0102] In this embodiment, pure water is used as the cleaning liquid supplied to the substrate nozzle 51 and the brush nozzles 52a, 52b. In this manner, when the same cleaning liquid is used to clean the lower surface of the substrate W and the lower surface brush 100, a single cleaning liquid supply system may be commonly connected to the substrate nozzle 51 and the brush nozzles 52a, 52b.

[0103] The gas ejection unit 53 is a slit-shaped gas injection nozzle having a gas ejection port extending in one direction. The gas ejection unit 53 is attached to the lifting and rotation support unit 54 so that it is located between the brush unit 300 and the suction and holding unit 21 in a plan view and has its gas ejection port facing upward. A jet gas supply system (not shown) is connected to the gas ejection unit 53. In this embodiment, nitrogen gas is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 ejects gas supplied from the jet gas supply system onto the underside of the substrate W when the substrate W is cleaned with the lower surface brush 100 and when the underside of the substrate W is dried, as described below. This forms a band-shaped gas curtain extending in the X direction between the brush unit 300 and the suction and holding unit 21.

[0104] The cup device 60 is provided in approximately the center of the unit housing 2 and includes a cup 61. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is capable of being raised and lowered. In FIG. 15, the cup 61 is indicated by a dotted line. The cup 61 moves between a predetermined lower cup position and an upper cup position depending on which portion of the underside of the substrate W is to be cleaned by the brush unit 300. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W that is sucked and held by the lower holding device 20. The upper cup position is a height position where the upper end of the cup 61 is above the suction holding unit 21 of the lower holding device 20.

[0105] The upper holding devices 10A and 10B are provided at positions above the lower holding device 20 and the cup 61. The upper holding devices 10A and 10B face each other across the base device 30 in a plan view. The upper holding device 10A includes a lower chuck 11A and an upper chuck 12A. The upper holding device 10B includes a lower chuck 11B and an upper chuck 12B.

[0106] The lower chucks 11A and 11B are arranged symmetrically with respect to a vertical plane that passes through the center of the suction holding unit 21 and extends in the Y direction in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces that can support an outer region of the lower surface of the substrate W from below the substrate W. Similar to the lower chucks 11A and 11B, the upper chucks 12A and 12B are arranged symmetrically with respect to a vertical plane that passes through the center of the suction holding unit 21 and extends in the Y direction in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces that are configured to abut two portions of the outer peripheral edge of the substrate W and hold the outer peripheral edge of the substrate W.

[0107] In the upper holding devices 10A and 10B, the distance between the lower chuck 11A and the upper chuck 12A and the distance between the lower chuck 11B and the upper chuck 12B are adjusted. This allows the upper holding devices 10A and 10B to hold the substrate W at a position above the lower holding device 20 by sandwiching the substrate W between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B. In the upper holding devices 10A and 10B, the held substrate W can be released by moving the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B away from each other.

[0108] As shown in FIG. 14, an upper surface cleaning device 70 is provided on one side of the cup 61 in the X direction. As shown in FIG. 15, the upper surface cleaning device 70 includes a rotary support shaft 71, an arm 72, and a spray nozzle 73. The rotary support shaft 71 is provided to extend in the vertical direction and is movable up and down and rotatable. The arm 72 is provided to extend horizontally from the upper end of the rotary support shaft 71 at a position higher than the upper holding devices 10A and 10B. A spray nozzle 73 is attached to the tip of the arm 72. A fluid supply system (not shown) is connected to the spray nozzle 73. A cleaning liquid and a gas are supplied to the spray nozzle 73 from the fluid supply system (not shown). The cleaning liquid and the gas are mixed in the spray nozzle 73, generating a mixed fluid. The generated mixed fluid is sprayed downward from the spray nozzle 73.

[0109] In the upper surface cleaning device 70, for example, while the substrate W is held and rotated by the lower holding device 20, the height position of the rotation support shaft 71 is adjusted and the rotation support shaft 71 rotates so that the spray nozzle 73 moves in the space above the substrate W. In this state, the mixed fluid is sprayed from the spray nozzle 73 onto the substrate W. As a result, the entire upper surface of the substrate W is cleaned.

[0110] As shown in Fig. 14, an edge cleaning device 80 is provided on the other side of cup 61 in the X direction. As shown in Fig. 15, edge cleaning device 80 includes a rotary support shaft 81, an arm 82, and a bevel brush 83. Rotary support shaft 81 is provided so as to extend in the vertical direction and to be movable up and down and rotatable. Arm 82 is provided so as to extend horizontally from the upper end of rotary support shaft 81 at a position above upper holding devices 10A, 10B. Bevel brush 83 is provided at the tip of arm 82 so as to protrude downward and to be rotatable around an axis extending in the vertical direction.

[0111] In the edge cleaning device 80, for example, while the substrate W is held and rotated by the lower holding device 20, the height position of the rotary support shaft 81 is adjusted and the rotary support shaft 81 rotates so that the bevel brush 83 comes into contact with the outer peripheral edge of the substrate W. Furthermore, the bevel brush 83 provided at the tip of the arm 82 rotates around an axis extending in the vertical direction. As a result, the entire outer peripheral edge of the substrate W is cleaned.

[0112] As shown in FIG. 14, the substrate cleaning apparatus 1 further includes a control unit 9. The control unit 9 includes, for example, a CPU (Central Processing Unit) and a memory or a microcomputer. A substrate cleaning program is stored in the memory. The CPU of the control unit 9 controls the operation of each of the above-mentioned components (10A, 10B, 20, 30, 40, 50, 60, 70, 80, 90) by executing the substrate cleaning program stored in the memory. The CPU of the control unit 9 also controls a fluid supply system connected to the various nozzles (51, 52a, 52b, 53, 70).

[0113] <2> Basic flow of substrate cleaning process 14 in the substrate cleaning apparatus 1. FIG. 16 is a flowchart showing the substrate cleaning process performed by the control unit 9 in FIG.

[0114] The substrate cleaning and drying process according to this embodiment is performed by the CPU of the control unit 9 executing a substrate cleaning program stored in the storage device. In the initial state, in the pedestal device 30, the movable pedestal 32 is positioned so that the suction holding unit 21 of the lower holding device 20 is located at the center of the cup 61 in a plan view. Also, in the initial state, the brush unit 300 is at a first height position.

[0115] First, the control unit 9 controls the opening / closing device 90 to open the loading / unloading opening 2x, and receives the substrate W loaded from outside the substrate cleaning apparatus 1 into the unit housing 2 (step S1).

[0116] Next, the control unit 9 controls the delivery device 40 to receive the substrate W using the support pins 41 and deliver the received substrate W to the upper holding device 10A, 10B (step S2). At this time, the control unit 9 controls the upper holding device 10A, 10B to hold the outer peripheral edge of the substrate W at a position above the lower holding device 20 (step S3). Note that if the substrate W delivered from outside the substrate cleaning apparatus 1 can be placed on the lower chucks 11A, 11B, the processing of step S2 may be omitted. The loading / unloading opening 2x opened in step S1 is closed by the shutter 91 after the substrate W is received by the delivery device 40.

[0117] Thereafter, the control unit 9 controls the pedestal device 30, the lower surface cleaning device 50, and a cleaning liquid supply system (not shown) to clean the central region of the lower surface of the substrate W (step S4). Specifically, the control unit 9 controls the pedestal device 30 and the lower surface cleaning device 50 to raise the brush unit 300 from the first height position to a second height position and bring the lower surface brush 100 into contact with the central region of the lower surface of the substrate W. The control unit 9 also rotates the brush unit 300 at a predetermined first brush rotation speed. Furthermore, the control unit 9 causes the two substrate nozzles 51 of the lower surface cleaning device 50 to eject cleaning liquid onto the underside of the substrate W.

[0118] During cleaning in step S4, the central region of the lower surface of the substrate W is cleaned by the lower surface brush 100 soaked in cleaning liquid. As a result, the cleaning liquid adheres to the central region of the lower surface of the substrate W. Therefore, the control unit 9 further controls the pedestal device 30 and the lower surface cleaning device 50 to dry the central region of the lower surface of the substrate W (step S5). Specifically, in a state in which gas is being sprayed from the gas blowing unit 53 toward the underside of the substrate W (a state in which a gas curtain is generated), the control unit 9 controls the pedestal device 30 to move the gas blowing unit 53 relative to the underside of the substrate W so that it passes through the central region of the lower surface in a planar view. As a result, the cleaning liquid adhering to the substrate W in the central region of the lower surface is pushed out by the gas curtain to a position away from the central region of the lower surface of the substrate W, and the central region of the lower surface is dried. After completion of step S5, the brush unit 300 is returned from the second height position to the first height position.

[0119] Next, the control unit 9 controls the delivery device 40 to receive the substrate W held by the upper holding devices 10A and 10B with the support pins 41 and deliver the received substrate W to the lower holding device 20 (step S6).

[0120] Next, the control unit 9 controls the lower holding device 20 to suck and hold the central region of the lower surface of the substrate W by the suction holding part 21 (step S7). During the processing of steps S6 and S7, the pedestal device 30 is positioned so that the center of the substrate W is located at the center of the suction holding part 21 in a plan view. As a result, the substrate W is sucked and held by the suction holding part 21 with the center of the substrate W located on the rotation center (rotation axis) of the suction holding part 21.

[0121] Furthermore, the control unit 9 controls the lower holding device 20, the pedestal device 30, the lower surface cleaning device 50, the upper surface cleaning device 70, and the edge cleaning device 80 to clean the entire upper surface, the outer peripheral edge, and the outer region of the lower surface of the substrate W (step S8). Specifically, the control unit 9 controls the lower holding device 20 to rotate the substrate W at a predetermined rotation speed (for example, about 500 rpm). The control unit 9 also controls the upper surface cleaning device 70 to move the spray nozzle 73 to a position above the substrate W while spraying the mixed fluid. The control unit 9 also controls the edge cleaning device 80 to bring the bevel brush 83 into contact with the outer peripheral edge of the substrate W.

[0122] Furthermore, the control unit 9 controls the base device 30 and the lower surface cleaning device 50 to raise the brush unit 300 from the first height position to a third height position and bring the lower surface brush 100 into contact with the outer region of the lower surface of the substrate W. The control unit 9 also rotates the brush unit 300 at a predetermined second brush rotation speed. Furthermore, the control unit 9 causes the two substrate nozzles 51 of the lower surface cleaning device 50 to eject cleaning liquid onto the underside of the substrate W.

[0123] After step S8 is completed, the spray nozzle 73 and the bevel brush 83 are returned to their initial positions, and the brush unit 300 is returned from the third height position to the first height position.

[0124] Next, the control unit 9 controls the lower holding device 20 to rotate the substrate W at high speed and dry the entire substrate W (step S9). Finally, the control unit 9 controls the opening / closing device 90 to open the loading / unloading opening 2x. This allows the substrate W to be transported outside the substrate cleaning apparatus 1 (step S10), and the substrate cleaning process is completed. The loading / unloading opening 2x opened in step S10 is closed by the shutter 91 after the substrate W is unloaded.

[0125] During steps S8 and S9 of the above series of processes, the control unit 9 controls the cup device 60 to hold the cup 61 at the upper cup position. As a result, droplets scattered from the substrate W when cleaning the entire upper surface, outer peripheral edge, and outer region of the lower surface of the substrate W, and when spin-drying the substrate W, are received by the cup 61 and discharged outside the substrate cleaning apparatus 1. During steps S1 to S7, S10 of the above series of processes excluding steps S8 and S9, the control unit 9 controls the cup device 60 to hold the cup 61 at the lower cup position.

[0126] During the above series of processes, when the brush unit 300 is at the first height position, the control unit 9 controls the lower surface cleaning device 50 to rotate the brush unit 300 at a relatively low third brush rotation speed. The control unit 9 also causes the brush nozzles 52a and 52b to eject cleaning liquid. As a result, when the brush unit 300 is on standby and not cleaning the substrate W, the lower surface brush 100 is cleaned, and the upper surface of the lower surface brush 100 is kept clean. The lower surface brush 100 is also kept wet.

[0127] <3> Effects of the substrate cleaning device 1 The substrate cleaning apparatus 1 according to this embodiment includes the brush unit 300 according to any one of the first to seventh embodiments. Therefore, when the underside of the substrate W is not being cleaned, by supplying cleaning liquid to the upper surface of the lower surface brush 100, the lower surface brush 100 can be easily cleaned without excess cleaning liquid remaining. Furthermore, contaminants such as dust are prevented from adhering to the underside of the substrate W through the multiple through holes 113, 203 formed in the brush unit 300. As a result, it is possible to improve the cleanliness of the underside of the substrate W after cleaning.

[0128] <4> Brush Unit 300 rotation speed In the substrate cleaning apparatus 1 described above, the first brush rotation speed when cleaning the central region of the underside of the substrate W is preferably 60 rpm or more and 150 rpm or less. The second brush rotation speed when cleaning the outer region of the underside of the substrate W is preferably 60 rpm or more and 150 rpm or less. Furthermore, the third brush rotation speed when the brush unit 300 is at the first height position is lower than the first brush rotation speed and the second brush rotation speed, and is preferably 60 rpm or more and 100 rpm or less.

[0129] Now, let us consider a case where the brush unit 300 according to the sixth embodiment is used in the substrate cleaning apparatus 1. In this case, it is preferable that the first brush rotation speed is set higher than the threshold speed described in the sixth embodiment. As a result, when the central region of the underside of the substrate W is cleaned, the cover member 206a is in a closed state, and the opening of the through-hole 203 is blocked. Therefore, contaminants are prevented from adhering to the central region of the underside of the substrate W through the inside of the brush unit 300.

[0130] Furthermore, the second brush rotation speed is also preferably set higher than the threshold speed described in the sixth embodiment. As a result, when cleaning the outer region of the underside of the substrate W, the cover member 206a is in the closed state, and the opening of the through-hole 203 is blocked. This prevents contaminants from adhering to the outer region of the underside of the substrate W through the inside of the brush unit 300.

[0131] On the other hand, it is preferable that the third brush rotation speed is set lower than the threshold speed described in the sixth embodiment. As a result, when the lower-surface brush 100 is cleaned, the cover member 206a is in the open state, and the opening of the through-hole 203 is released. This prevents excess cleaning liquid from accumulating on the upper surface of the lower-surface brush 100, allowing the lower-surface brush 100 to be cleaned smoothly.

[0132] 9. Other Embodiments

[0133] (a) In the brush units 300 according to the first to seventh embodiments, only a portion (cleaning portions 120, 130) of the upper surface of the lower surface brush 100 is used to clean the lower surface of the substrate W, but the present invention is not limited to this. The brush unit 300 may be configured so that the entire or most portion of the upper surface of the lower surface brush 100 comes into contact with the lower surface of the substrate W. In this case, the multiple through holes 113 for discharging the cleaning liquid may be formed so as to open on the surface of the lower surface brush 100 that comes into contact with the lower surface of the substrate W (contact surface).

[0134] (b) The brush units 300 according to the first to sixth embodiments may be fitted with a plurality of blade members 290 according to the seventh embodiment. In this case, contaminants are prevented from floating in the space below the brush unit 300 and the space around it. This further improves the cleanliness of the underside of the substrate after cleaning.

[0135] (c) In the brush units 300 according to the first to seventh embodiments, the through-holes 203 form one flow path from the base upper surface 210 to the base side surface 250 or the base lower surface 220, but the present invention is not limited to this.

[0136] The through-hole 203 may be formed so that one flow path branches into multiple flow paths inside the brush base 200 from the base upper surface 210 to the base side surface 250 or the base lower surface 220. In this case, the through-hole 203 has one opening on the base upper surface 210 and two or more openings on the base side surface 250 or the base lower surface 220.

[0137] (d) In the brush units 300 according to the first to seventh embodiments, the brush base 200 is made up of a single member, but the present invention is not limited to this. The brush base 200 may be made up of two or more members connected together.

[0138] Furthermore, the brush base 200 formed from two or more members may have the following configuration. Figure 17 is a diagram for explaining one example of the configuration of the brush base 200 according to another embodiment. The brush base 200 of this example is made from two disk-shaped members 200A and 200B having a predetermined thickness, as shown in the upper part of Figure 17.

[0139] The disk-shaped member 200A has a plurality of (four in this example) through-holes 203m penetrating from one surface to the other. The disk-shaped member 200B has a plurality of (four in this example) through-holes 203n penetrating from one surface to the other.

[0140] When fabricating the brush base 200, the disc-shaped member 200A and the disc-shaped member 200B are bonded together, as shown in the middle of Fig. 17. During this bonding, the formation positions of the plurality of through holes 203m in the disc-shaped member 200A are slightly offset from the formation positions of the plurality of through holes 203n in the disc-shaped member 200B, as shown in the plan view in the lower part of Fig. 17. This results in the formation of through holes 203 in which the flow path is locally narrowed by the partially overlapping through holes 203m, 203n. Thereafter, a plurality of screw holes 201 for connecting the lower-surface brush 100 and a plurality of through holes 202 for connecting the rotation shaft 400 are formed in the laminate of the disc-shaped members 200A and 200B. This completes the brush base 200 of this example.

[0141] According to this brush base 200, the gas flow through each through hole 203 is not as smooth as when the through holes 203 are formed with a constant inner diameter. In other words, in the through holes 203 of this example, because a portion of the flow path is locally narrowed, the gas does not flow as smoothly as when the through holes 203 are formed with a constant inner diameter. As a result, even if the internal pressure of the through holes 203 of the brush base 200 decreases when cleaning the underside of the substrate, the atmosphere below the brush unit 300 is less likely to flow into the through holes 203.

[0142] In the brush base 200 of this example, the disk-shaped member 200A and the disk-shaped member 200B may be connected to be relatively rotatable about their central axis CA. In this case, for example, when cleaning the lower surface brush 100, by completely overlapping the multiple through holes 203m of the disk-shaped member 200A with the multiple through holes 203n of the disk-shaped member 200B, it is possible to ensure smooth circulation of the cleaning liquid through the through holes 203. Furthermore, for example, when cleaning the lower surface of the substrate W, by completely misaligning the multiple through holes 203m of the disk-shaped member 200A with the multiple through holes 203n of the disk-shaped member 200B, it is possible to close the through holes 203 and restrict the flow of gas.

[0143] 10. Correspondence between each part of the embodiment and each element of the claims The following describes examples of correspondence between the elements of the claims and the elements of the embodiments. Various other elements having the configurations or functions described in the claims may also be used as the elements of the claims.

[0144] In the above-described embodiment, the brush unit 300 is an example of a brush unit, the lower surface brush 100 is an example of a brush, the brush base 200 is an example of a brush base, and the storage portion 203b and the discharge portion 203c in FIG. 4, the bent portion of the through hole 203 in FIGS. 6 and 7, the filter member 204, and the opening / closing mechanisms 205 and 206 are examples of flow restricting portions.

[0145] Furthermore, the upper surface of the lower brush 100 is an example of a brush upper surface, the base upper surface 210 is an example of a base upper surface, the base lower surface 220 is an example of a base lower surface, the base side surface 250 is an example of a base side surface, the through hole 113 is an example of a through hole, the introduction portion 203a is an example of an introduction portion, the storage portion 203b is an example of a storage portion, and the discharge portion 203c is an example of a discharge portion.

[0146] Furthermore, filter member 204 is an example of a filter member, cover member 205a is an example of a cover member, hinge 205b is an example of an attachment part, rotating shaft 400 is an example of a rotating shaft, the first brush rotation speed and the second brush rotation speed are examples of a first rotation speed, the third brush rotation speed is an example of a second rotation speed, and opening / closing mechanism 206 is an example of a switching part.

[0147] Furthermore, the blade member 290 is an example of a blade member, the upper holding devices 10A, 10B and the lower holding device 20 are examples of substrate holding parts, the substrate cleaning device 1 is an example of a substrate processing device, and the brush nozzles 52a, 52b are an example of a cleaning liquid supply part.

[0148] 11. Summary of the embodiment

[0149] (1) The brush unit according to paragraph 1 is A brush unit used to clean the underside of a substrate, A brush and Brush base and a flow restriction portion; the brush has a brush upper surface that faces upward and at least a portion of which contacts the lower surface of the substrate when cleaning the lower surface of the substrate; The brush base is a base upper surface to which the brush is connected; a base lower surface facing downward when cleaning the lower surface of the substrate; a base side surface connecting an outer edge of the base upper surface and an outer edge of the base lower surface; The brush and the brush base are formed with through holes extending from a first portion of the brush upper surface to a second portion of the base lower surface or the base side surface, The flow restricting portion restricts the flow of gas from the second portion to the first portion of the through hole.

[0150] The brush unit can clean the underside of a substrate by bringing at least a portion of the brush's upper surface into contact with the underside of the substrate. Through-holes are formed in the brush and brush base. Therefore, even if a large amount of cleaning liquid is supplied onto the brush's upper surface during cleaning, for example, some of the liquid is discharged downward or to the side of the brush unit through the through-holes. Therefore, excess liquid does not accumulate on the brush's upper surface.

[0151] When the upper surface of the brush slides over the lower surface of the substrate during cleaning, the pressure inside the through-hole decreases, which may cause the ambient atmosphere around the brush unit to enter the through-hole through the second portion of the brush base. Therefore, the brush unit is provided with a flow restrictor.

[0152] As described above, the flow restricting portion restricts the flow of gas from the second portion to the first portion of the through hole. This reduces the flow of the atmosphere in the space to the side of the brush unit or the space below the brush unit through the through hole to the underside of the substrate. That is, when cleaning the underside of the substrate, the adhesion of contaminants floating in the space to the side of the brush unit or the space below the brush unit to the underside of the substrate through the through hole is reduced. As a result, it is possible to improve the cleanliness of the underside of the substrate after cleaning.

[0153] (2) In the brush unit according to paragraph 1, The through hole is formed so that at least a portion thereof is bent, The flow restriction portion may include a curved portion of the through hole.

[0154] In this case, the gas does not flow smoothly through the through holes compared to when the through holes are formed to extend linearly, and therefore, with a simple configuration, the atmosphere in the space to the side of the brush unit or the atmosphere in the space below the brush unit is reduced from flowing through the through holes to the underside of the substrate.

[0155] (3) In the brush unit according to paragraph 2, The through hole is an introduction portion extending downward from the upper surface of the brush base and guiding liquid flowing into the first portion downward; a storage portion that receives the liquid flowing from the introduction portion and stores a predetermined amount of the liquid; a discharge portion, at least a portion of which is located above the storage portion and which discharges liquid overflowing from the storage portion through the second portion; The flow restricting portion may include the storage portion and the discharge portion of the through hole as the curved portion of the through hole.

[0156] According to the above configuration, a portion of the liquid flowing into the introduction portion through the first portion of the brush upper surface is stored in the storage portion. In this case, the liquid stored in the storage portion without overflowing functions as a seal member that blocks the flow of gas through the through-hole. Therefore, when cleaning the underside of the substrate, the atmosphere in the space to the side of the brush unit or the space below the brush unit is prevented from flowing onto the underside of the substrate through the through-hole.

[0157] (4) In the brush unit according to any one of paragraphs 1 to 3, the flow restricting portion includes a filter member having a mesh shape; The filter member may be provided inside the through hole.

[0158] In this case, with a simple configuration, the atmosphere in the space to the side of the brush unit or the atmosphere in the space below the brush unit is reduced from flowing through the through-hole to the underside of the substrate. Even if the atmosphere in the space to the side of the brush unit or the atmosphere in the space below the brush unit flows into the through-hole, contaminants contained in the atmosphere are captured by the filter member, and therefore do not reach the underside of the substrate.

[0159] (Item 5) In the brush unit according to any one of items 1 to 3, The flow restriction portion is a cover member corresponding to the opening of the through hole in the second portion; It may also include an attachment portion for attaching the cover member to the brush base so as to open at least a portion of the opening when liquid flows from the through hole to the second portion, and to close the opening when liquid does not flow from the through hole to the second portion.

[0160] In this case, the cover member and the mounting portion prevent the atmosphere in the space to the side of the brush unit or the atmosphere in the space below the brush unit from flowing through the through-hole onto the underside of the substrate.

[0161] (Item 6) In the brush unit according to any one of items 1 to 3, The brush base is fixed on a rotation shaft extending in the vertical direction, The rotation axis is rotating the lower surface of the substrate at a first rotational speed higher than a predetermined threshold speed during cleaning; rotating the lower surface of the substrate at a second rotation speed lower than the threshold speed during a standby period when cleaning is not being performed; The flow restriction portion is a cover member attached to the brush base so as to be able to open and close the opening of the through hole in the second portion; a switching unit that switches the lid member between a closed state and an open state, The switching unit is The cover member may be configured to be in a closed state based on a first centrifugal force acting on the switching portion when the rotating shaft rotates at the first rotational speed, and to be in an open state based on a second centrifugal force acting on the switching portion when the rotating shaft rotates at the second rotational speed.

[0162] In this case, the flow state of gas or liquid through the through-hole can be switched by adjusting the rotation speed of the rotary shaft.

[0163] (7) In the brush unit according to any one of paragraphs 1 to 6, The through-hole may be formed to extend from the first portion of the brush top surface to a second portion of the base side surface.

[0164] In this case, the atmosphere in the space to the side of the brush unit is prevented from flowing through the through-hole onto the underside of the substrate.

[0165] (Item 8) The brush unit according to item 8 is A brush unit used to clean the underside of a substrate, A brush and Brush base and a blade member; The brush is a brush upper surface that faces upward and at least a portion of which contacts the lower surface of the substrate when cleaning the lower surface of the substrate; The brush base is a base upper surface to which the brush is connected; a base lower surface facing downward when cleaning the lower surface of the substrate; a base side surface connecting an outer edge of the base upper surface and an outer edge of the base lower surface; The brush and the brush base are formed with through holes extending from a first portion of the brush upper surface to a second portion of the base lower surface or the base side surface, The brush base is fixed on a rotation shaft extending in the vertical direction, the rotation shaft rotates when cleaning the lower surface of the substrate; The blade members are attached to the brush base and rotate together with the brush base to form a downward air current in the space below the brush base.

[0166] The brush unit can clean the underside of a substrate by bringing at least a portion of the brush's upper surface into contact with the underside of the substrate. Through-holes are formed in the brush and brush base. Therefore, even if a large amount of cleaning liquid is supplied onto the brush's upper surface during cleaning, for example, some of the liquid is discharged to the side or below the brush unit through the through-holes. Therefore, excess liquid does not accumulate on the brush's upper surface.

[0167] When the upper surface of the brush slides over the underside of the substrate during cleaning, the pressure inside the through-hole drops, and the atmosphere around the brush unit may enter the through-hole through the second part of the brush base. Therefore, the brush unit is provided with an airflow generating unit.

[0168] The airflow generating unit rotates with the rotation of the rotary shaft when cleaning the underside of the substrate. In this case, a downward airflow is formed in the space below the brush unit and the space around it. This prevents contaminants such as dust from approaching the brush unit, even if they are generated in the space below the brush unit during cleaning of the underside of the substrate. This prevents contaminants from adhering to the underside of the substrate through the through-holes. As a result, it is possible to improve the cleanliness of the underside of the substrate after cleaning.

[0169] (Item 9) The substrate processing apparatus according to item 9 is a substrate holder for holding a substrate; and a brush unit according to any one of paragraphs 1 to 8, which is provided to clean the underside of the substrate held by the substrate holder.

[0170] The substrate processing apparatus includes the brush unit. Therefore, when the underside of the substrate is not being cleaned, the upper surface of the brush can be easily cleaned without excess liquid remaining by supplying cleaning liquid to the upper surface of the brush. Furthermore, the through-holes formed in the brush unit prevent contaminants such as dust from adhering to the underside of the substrate. As a result, the cleanliness of the underside of the substrate after cleaning can be improved.

[0171] (Item 10) In the substrate processing apparatus according to item 9, The substrate processing apparatus includes: The apparatus may further include a cleaning liquid supply unit that supplies cleaning liquid to the upper surfaces of the brushes of the brush unit during standby when the lower surface of the substrate is not being cleaned.

[0172] In this case, the upper surfaces of the brushes of the brush unit are washed during standby, so that the upper surfaces of the brushes are kept clean. [Explanation of symbols]

[0173] 1...substrate cleaning device, 2...unit housing, 2x...loading / unloading port, 9...control unit, 10A, 10B...upper holding device, 11A, 11B...lower chuck, 12A, 12B...upper chuck, 20...lower holding device, 21...suction holding unit, 30...pedestal device, 31...linear guide, 32...movable base, 40...transfer device, 41...support pin, 50...lower surface cleaning device, 51...substrate nozzle, 52a, 52b...brush nozzle, 53...gas ejection unit, 54...lifting and rotating support unit, 60...cup device, 61...cup, 70...upper surface cleaning device, 71...rotating support shaft, 72, 82...arm, 73...spray nozzle, 80...edge cleaning device, 81...rotating support shaft, 83...bevel brush, 90...opening / closing device, 91...shutter, 100...lower surface brush, 101...geometric center, 110 ...Base portion, 111, 112, 113, 202, 203, 203m, 203n...Through hole, 120...Cleaning portion, 130...Cleaning portion, 200...Brush base, 200A...Disk-shaped member, 200B...Disk-shaped member, 201, 401...Screw hole, 203a...Introducing portion, 203b...Storage portion, 203c...Discharge portion, 203d, 203e...Straight portion, 204...Filter member, 20 5, 206...opening / closing mechanism, 205a, 206a...lid member, 205b...hinge, 206b...flexing member, 206c...weight, 206d...elastic member, 210...base upper surface, 220...base lower surface, 230...recess, 240...inclined portion, 250...base side surface, 290...blade member, 300...brush unit, 310, 320...screw member, 400...rotating shaft, CA...central axis, W...substrate

Claims

1. A brush unit used to clean the underside of a substrate, A brush and Brush base and a flow restriction portion; the brush has a brush upper surface that faces upward and at least a portion of which contacts the lower surface of the substrate when cleaning the lower surface of the substrate; The brush base is a base upper surface to which the brush is connected; a base lower surface facing downward when cleaning the lower surface of the substrate; a base side surface connecting an outer edge of the base upper surface and an outer edge of the base lower surface; The brush and the brush base are formed with through holes extending from a first portion of the brush upper surface to a second portion of the base lower surface or a side surface of the base, The flow restricting portion restricts the flow of gas from the second portion to the first portion of the through hole.

2. The through hole is formed so that at least a portion thereof is bent, The brush unit according to claim 1 , wherein the flow restricting portion includes a curved portion of the through hole.

3. The through hole is an introduction portion extending downward from the upper surface of the brush base to guide liquid flowing into the first portion downward; a storage portion that receives the liquid flowing from the introduction portion and stores a predetermined amount of the liquid; a discharge portion at least a portion of which is located above the storage portion and which discharges liquid overflowing from the storage portion through the second portion; The brush unit according to claim 2 , wherein the flow restricting portion includes the storage portion and the discharge portion of the through hole as the curved portion of the through hole.

4. the flow restricting portion includes a filter member having a mesh shape; The brush unit according to claim 1 , wherein the filter member is provided inside the through hole.

5. The flow restriction portion is a cover member corresponding to the opening of the through hole in the second portion; The brush unit of claim 1 further comprises an attachment portion for attaching the cover member to the brush base so as to open at least a portion of the opening when liquid flows from the through hole to the second portion, and to close the opening when liquid does not flow from the through hole to the second portion.

6. The brush base is fixed on a rotation shaft extending in the vertical direction, The rotation axis is rotating the lower surface of the substrate at a first rotational speed higher than a predetermined threshold speed during cleaning; rotating the lower surface of the substrate at a second rotation speed lower than the threshold speed during a standby period when cleaning of the lower surface of the substrate is not being performed; The flow restriction portion is a cover member attached to the brush base so as to be able to open and close the opening of the through hole in the second portion; a switching unit that switches the lid member between a closed state and an open state, The switching unit is 2. The brush unit of claim 1, wherein the cover member is placed in a closed state based on a first centrifugal force acting on the switching portion when the rotating shaft rotates at the first rotational speed, and the cover member is placed in an open state based on a second centrifugal force acting on the switching portion when the rotating shaft rotates at the second rotational speed.

7. The brush unit according to claim 1 , wherein the through-hole is formed so as to extend from the first portion of the brush top surface to the second portion of the base side surface.

8. A brush unit used to clean the underside of a substrate, A brush and Brush base and a blade member; The brush is a brush upper surface that faces upward and at least a portion of which contacts the lower surface of the substrate when cleaning the lower surface of the substrate; The brush base is a base upper surface to which the brush is connected; a base lower surface facing downward when cleaning the lower surface of the substrate; a base side surface connecting an outer edge of the base upper surface and an outer edge of the base lower surface; The brush and the brush base are formed with through holes extending from a first portion of the brush upper surface to a second portion of the base lower surface or a side surface of the base, The brush base is fixed on a rotation shaft extending in the vertical direction, the rotation shaft rotates when cleaning the lower surface of the substrate; The blade members are attached to the brush base and rotate together with the brush base to form a downward air current in the space below the brush base.

9. a substrate holder for holding a substrate; 9. A substrate processing apparatus comprising: a brush unit according to claim 1, the brush unit being provided to clean the underside of the substrate held by the substrate holder.

10. The substrate processing apparatus according to claim 9 , further comprising a cleaning liquid supply unit that supplies a cleaning liquid to the upper surfaces of the brushes of the brush unit during standby when the lower surface of the substrate is not being cleaned.

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