Resin supplying device, resin molded product manufacturing device, resin molded product manufacturing method, and resin supplying method

Abstract

To provide a resin supplying device capable of supplying a resin material onto a spraying surface as uniformly as possible in a short supply time.SOLUTION: In a resin supplying device, a resin material 13 in a housing part is extruded from a discharge part 12a, and the resin material 13 lands at an extrusion starting point A1 on a spraying surface 60s. A control unit 70 is configured to control a moving mechanism 20 in a first mode in which the discharge part 12a moves relative to the spraying surface 60s at a first speed V1 after the resin material 13 lands at the extrusion starting point A1, and a second mode in which the discharge part 12a moves relative to the spraying surface 60s at a second speed V2 faster than the first speed V1. The control unit 70 switches from the first mode to the second mode when a straight-line distance between a predetermined reference position A0 and the discharge part 12a exceeds a predetermined value L1, or when a predetermined time has elapsed since a pressing part 32 started moving to extrude the resin material 13 from the discharge part 12a.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present specification relates to a resin supplying device, a resin molded product manufacturing device, a resin molded product manufacturing method, and a resin supplying method. [Background technology]

[0002] As disclosed in Japanese Patent Laid-Open Publication No. 2018-134846 (Patent Document 1), a resin supplying device that supplies a resin material to a supplying target is known. Patent Document 1 states that if air is contained in the resin material supplied to the supplying target, the presence of air can cause voids to occur. Patent Document 1 also states that by increasing the movement speed of the discharge unit (nozzle), the amount of resin material supplied at that position can be reduced compared to other positions, which in turn makes it easier to expel air from the resin material during the compression process. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-134846 Summary of the Invention [Problem to be solved by the invention]

[0004] When resin material is to be widely applied onto the surface of the object to be sprayed, a discharge unit (nozzle) is positioned above the surface and moved relative to the surface. By continuously discharging resin material from the discharge unit while scanning the surface, the resin material can be widely applied onto the surface. Here, we focus on the situation immediately after the resin material is discharged from the discharge unit.

[0005] FIG. 9 is a diagram showing the state immediately after resin material 73 stored in storage section 71 is discharged from discharge section 72a onto spray surface 75 and discharge section 72a begins to move. After resin material 73 is discharged from discharge section 72a, resin material 73 advances downward, drooping from discharge section 72a, and then lands on spray surface 75 of the object to be supplied. Resin material 73 is continuously discharged from discharge section 72a. In this state, discharge section 72a begins to move (arrow AR). Starting from the position on spray surface 75 where resin material 73 lands, resin material 73 begins to trace a predetermined trajectory on spray surface 75.

[0006] Immediately after the resin material 73 lands on the spraying surface 75 of the object to be supplied, the resin material 73 is not sufficiently fixed to the spraying surface 75. If the movement of the discharge part 72a is started in this state, the resin material 73 will be dragged along with the movement of the discharge part 72a, and there is a possibility that the resin material 73 will shift from the position on the spraying surface 75 where it first landed. In this case, it becomes difficult to supply the resin material 73 uniformly onto the spraying surface 75.

[0007] This phenomenon is more likely to occur when a liquid resin material with high viscosity is dispensed from a dispenser with a narrow nozzle diameter. As shown in Figure 10, when a resin material 73 with high viscosity lands on a spray surface 75, the contact angle θ becomes large. When the contact angle θ is large, the contact area AA between the resin material 73 and the spray surface 75 becomes relatively small. The adhesive force between the resin material 73 and the spray surface 75 also weakens, so as the dispenser moves, the resin material 73 is more likely to move away from the position on the spray surface 75 where it first landed.

[0008] One possible solution to prevent the resin material 73 from shifting is to reduce the movement speed of the discharge section 72a, but if the discharge section 72a moves at a slow speed while supplying the resin material 73, it may take time to supply the resin material 73 over a wide area of the spraying surface 75, or there may be insufficient resin material 73 (in the cartridge set in the storage section 71) before the resin material 73 is supplied over the entire specified area, which may result in the resin material 73 not being able to be supplied evenly over the spraying surface 75.

[0009] The present specification aims to disclose a resin supplying device, a resin molded product manufacturing device, a resin molded product manufacturing method, and a resin supplying method that are capable of supplying resin material as uniformly as possible onto a spraying surface in as short a supply time as possible. [Means for solving the problem]

[0010] The resin supplying device of the present disclosure is a resin supplying device that supplies a resin material onto a spray surface of a supplying object, a container that contains the resin material and has a discharge portion that discharges the resin material; a pressing mechanism having a pressing part inserted into the accommodation part; a movement mechanism that moves the discharge unit relative to the spray surface, thereby causing the discharge unit to scan the spray surface; a control unit that controls the movement mechanism, When the pressing portion moves within the storage portion, the resin material within the storage portion is pushed out from the discharge portion, and the resin material lands at a discharge start point within the spraying surface. The control unit a first mode in which the discharge portion moves relative to the spray surface at a first speed after the resin material lands at the discharge start point; A second mode in which the discharge portion moves relative to the spray surface at a second speed faster than the first speed, The control unit When the linear distance between a predetermined reference position and the discharge portion exceeds a predetermined value, or When a predetermined time has elapsed since the pressing portion started to move in order to extrude the resin material from the discharge portion, The first mode is switched to the second mode.

[0011] The manufacturing apparatus for a resin molded product according to the present disclosure includes the resin supplying apparatus described above. A method for manufacturing a resin molded product according to the present disclosure uses the above-described apparatus for manufacturing a resin molded product, and includes: a step in which the resin supplying device supplies the resin material to a supply target; and a step of resin molding the object to be supplied using the resin material.

[0012] The resin supplying method of the present disclosure is a resin supplying method for supplying a resin material onto a spray surface of a supply target, the resin material extruded from the discharge portion by the pressing portion moving within the storage portion lands at a discharge start point within the spraying surface; A first mode is implemented in which the resin material is supplied to the spraying surface while the discharge portion moves relative to the spraying surface at a first speed after the resin material lands at the discharge start point; A second mode is implemented in which the discharge portion supplies the resin material to the spraying surface while moving relative to the spraying surface at a second speed faster than the first speed, When the linear distance between a predetermined reference position and the discharge portion exceeds a predetermined value, or When a predetermined time has elapsed since the pressing portion started to move in order to extrude the resin material from the discharge portion, The first mode is switched to the second mode. [Effects of the Invention]

[0013] According to the technical concept disclosed in this specification, it is possible to obtain a resin supplying device, a resin molded product manufacturing device, a resin molded product manufacturing method, and a resin supplying method that are capable of supplying resin material as uniformly as possible onto a spraying surface in as short a supplying time as possible. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a diagram showing functional blocks of a manufacturing apparatus 1000 for a resin molded product. [Figure 2] 1 is a cross-sectional view showing a state before clamping of a molding unit 80 provided in an apparatus 1000 for manufacturing a resin molded product. [Figure 3] 1 is a cross-sectional view showing a state after clamping of a molding unit 80 provided in an apparatus 1000 for manufacturing a resin molded product. [Figure 4] 1 is a flowchart showing a method for manufacturing a resin molded product using an apparatus 1000 for manufacturing a resin molded product. [Figure 5] 1 is a cross-sectional view showing a resin supplying device 100 provided in an apparatus 1000 for manufacturing a resin molded product. [Figure 6] 1 is a perspective view showing a state in which a resin material 13 is being supplied onto a spraying surface 60s from a discharge portion 12a of a resin supplying device 100. FIG. [Figure 7] FIG. 10 is a plan view showing the state of resin material 13 formed when discharge part 12a is operated along a spiral trajectory on spray surface 60s. [Figure 8] FIG. 2 is a flowchart showing a resin supplying method using the resin supplying device 100. [Figure 9] FIG. 10 is a diagram showing the state immediately after the resin material 73 contained in the container 71 is discharged from the discharge part 72a onto the spraying surface 75 and the discharge part 72a starts to move. [Figure 10] 10 is a diagram for explaining that when a resin material 73 having a high viscosity lands on a spraying surface 75, the contact angle θ becomes large. DETAILED DESCRIPTION OF THE INVENTION

[0015] The following describes embodiments of the present disclosure. In the embodiments described below, when numbers, quantities, etc. are mentioned, the scope of the present disclosure is not necessarily limited to those numbers, quantities, etc., unless otherwise specified. Each component is not necessarily essential to the present disclosure, unless otherwise specified. The same reference numbers are used for the same and corresponding components, and redundant descriptions may not be repeated.

[0016] [Resin molding manufacturing device 1000] Fig. 1 is a diagram showing functional blocks of a resin molded product manufacturing apparatus 1000. Fig. 2 is a cross-sectional view showing a state before mold clamping of a molding unit 80 provided in the resin molded product manufacturing apparatus 1000. Fig. 3 is a cross-sectional view showing a state after mold clamping of a molding unit 80 provided in the resin molded product manufacturing apparatus 1000.

[0017] As shown in Fig. 1, the resin molded product manufacturing apparatus 1000 includes a substrate module 101, a press module 102, a discharge module 103, and a film module 104. A substrate 90 (Fig. 2) is carried out from the substrate module 101, and a film 60 (Fig. 2) is carried out from the film module 104. The discharge module 103 supplies a thermosetting resin material 13 onto the film 60. The press module 102 resin-forms the substrate 90 using the liquid resin material 13 supplied onto the film 60 (Fig. 3).

[0018] In the resin molded product manufacturing apparatus 1000, the substrate module 101, press module 102, discharge module 103, and film module 104 are illustrated as separate modules. Each module may be detachable from the other modules, and the number of modules may be increased or decreased. For example, two or three discharge modules 103 may be disposed between the press module 102 and the film module 104.

[0019] The resin molded product manufacturing apparatus 1000 further includes conveying mechanisms 91 and 92. The conveying mechanism 91 conveys the substrate 90 carried out from the substrate module 101 to an upper mold 81 (FIG. 2) of a molding die in a molding section 80 (FIG. 2) of the press module 102. The molding die includes an upper mold 81 and a lower mold 87, and uses the resin material 13 supplied to the film 60 (supply object) to perform resin molding on a silicon wafer (substrate 90) on which a chip is mounted. In other words, the molding object is, for example, a so-called thin wafer-level package.

[0020] The conveying mechanism 92 conveys the film 60 onto which the resin material 13 has been discharged by the discharge module 103 to the lower mold 87 (FIG. 2) of the forming mold in the molding section 80 of the press module 102. The conveying mechanism 92 further conveys the film 60 that has been discharged from the film module 104 and does not have the resin material 13 thereon to the discharge module 103.

[0021] [Manufacturing method for resin molded products] Fig. 4 is a diagram showing a flowchart of a method for manufacturing a resin molded product using the resin molded product manufacturing apparatus 1000. Fig. 5 is a cross-sectional view showing a resin supplying apparatus 100 provided in the resin molded product manufacturing apparatus 1000. Here, the method for manufacturing a resin molded product will be described, and the detailed configuration and operation of the resin supplying apparatus 100 will be described later.

[0022] 1 to 5, in the method for manufacturing a resin molded product, first, resin supplying device 100 (FIG. 5) supplies resin material 13 onto film 60 (step S101). For example, conveying mechanism 92 conveys film 60 and frame-shaped tray cover 54 (FIG. 5) placed on film 60 from film module 104 to discharge module 103.

[0023] Next, the resin supply device 100 of the discharge module 103 supplies the resin material 13 onto the film 60 in the tray cover 54. Details of this operation will be described later. Next, the transport mechanism 91 transports the substrate 90 from the substrate module 101 to the press module 102, and places it on the underside of the upper mold 81 of the forming mold of the press module 102 (step S102).

[0024] The transport mechanism 91 places the film 60, on which the resin material 13 has been supplied, on the upper surface of the lower mold 87 (step S103). The transport mechanism 92 transports the film 60, on which the resin material 13 has been supplied, from the discharge module 103 to the press module 102 together with the tray cover 54, and places the film 60 on which the resin material 13 is placed on the upper surface of the lower mold 87 of the forming mold of the press module 102. The transport mechanism 92 transports the tray cover 54 to the film module 104 without placing the tray cover 54 in the press module 102.

[0025] 2, in the forming section 80, a block-shaped fixed platen 88 is supported by tie bars or a hold frame. An upper mold 81 is installed below the fixed platen 88. A movable platen 86 is arranged below the fixed platen 88. A lower mold 87 is installed above the movable platen 86.

[0026] The lower mold 87 includes a bottom member 82, a side member 83, a plurality of elastic members 84, and a base plate 85. A recess that is recessed downward is formed in the lower mold 87. The transport mechanism 92 places the film 60 on the upper surface of the lower mold 87 so that the resin material 13 on the film 60 is located on the bottom surface of the recess. The transport mechanism 91 places the substrate 90 on the lower surface of the upper mold 81, as shown in FIG. 2.

[0027] The upper mold 81 and the lower mold 87 are clamped together by moving the lower mold 87 upward toward the upper mold 81 (step S104). For example, a clamping mechanism (not shown) moves the movable platen 86 upward. As a result, the lower mold 87 moves upward toward the upper mold 81. As the movable platen 86 moves upward, the frame-shaped side member 83 first comes into contact with the substrate 90 with the film 60 interposed therebetween.

[0028] Thereafter, the upward movement of the movable platen 86 continues. With the upward movement of the side members 83 stopped, the bottom member 82 moves upward, and the multiple elastic members 84 contract. When the position of the upper surface of the side members 83 reaches a predetermined position, the upward movement of the movable platen 86 stops, and the mold clamping in step S104 ends.

[0029] After the movement of the lower mold 87 is stopped to close the mold, the temperature of the molding mold is increased (step S105). The resin material 13 is thermosetting. Therefore, when the temperature of the resin material 13 increases, the resin material 13 hardens to become hardened resin 18 (FIG. 3) (step S106). After waiting until the resin material 13 hardens, the base plate 85 is moved downward, thereby moving the lower mold 87 downward. This opens the mold, and a resin molded product is produced in which the underside of the substrate 90 is sealed with resin (step S107).

[0030] In the above, for example, as shown in Figures 2 and 3, a case has been described in which the discharge module 103 of the resin molded product manufacturing apparatus 1000 shown in Figure 1, which has a press module 102 that places a substrate 90 on an upper mold 81 to manufacture a resin molded product, is equipped with the resin supply device 100 of the above embodiment. However, for example, the discharge module 103 of the resin molded product manufacturing apparatus 1000 shown in Figure 1, which has a press module 102 that places a substrate 90 on a lower mold 87 to manufacture a resin molded product, may also be equipped with the resin supply device 100 of the above embodiment.

[0031] [Resin supply device 100] 5, the resin supplying device 100 supplies a liquid resin material 13 onto a spray surface 60s of a supplying object such as a film 60. Specifically, the resin supplying device 100 includes, for example, a cartridge 10, a moving mechanism 20, a pressing mechanism 30, an opening / closing mechanism 40, a detecting unit 50, a mounting table 52, and a control unit 70.

[0032] (Cartridge 10) The cartridge 10 has a lid 11, a storage section 12, and a resin material 13. The storage section 12 stores the resin material 13, and the lid 11 is placed on the surface of the resin material 13. The lid 11 seals the resin material 13 so that the resin material 13 does not leak out of the storage section 12. The storage section 12 of the cartridge 10 is placed inside a cylindrical section 23 of a moving mechanism 20, which will be described later. A discharge section 12a is provided at the end of the storage section 12. The cartridge 10 discharges the resin material 13 through the discharge section 12a.

[0033] (Detection unit 50) A mounting table 52 is disposed below the discharge unit 12a, and a film 60 transported from a film module 104 is placed on the mounting table 52. A frame-shaped tray cover 54 is disposed on the film 60. The upper surface of the film 60 is a spraying surface 60s onto which the resin material 13 is supplied, and the resin material 13 is supplied to the inside of the tray cover 54 on the spraying surface 60s. A detection unit 50 is connected to the mounting table 52, and detects the weight of the resin material 13 extruded from the discharge unit 12a and supplied onto the film 60.

[0034] (Moving mechanism 20) The moving mechanism 20 has a peripheral wall 21, locking members 22, and a cylindrical portion 23, and holds the cartridge 10. A plurality of locking members 22 are provided on the inner periphery of the peripheral wall 21, and the cylindrical portion 23 is locked to the plurality of locking members 22. The cartridge 10 is detachably installed inside the cylindrical portion 23.

[0035] The moving mechanism 20 is supported by a drive system (not shown) so that the position of the discharge unit 12a can be changed, and can move the discharge unit 12a, for example, in the left-right and up-down directions within the plane of Fig. 5, and in a direction perpendicular to the plane of Fig. 5. By moving the discharge unit 12a relative to the spraying surface 60s of the film 60, the discharge unit 12a can scan over the spraying surface 60s.

[0036] (Pressing mechanism 30) The pressing mechanism 30 has a servo motor 31 and a pressing unit 32. The pressing unit 32 is inserted into the inside of the storage unit 12 of the cartridge 10 and is arranged so as to contact the lid body 11. As the pressing unit 32 moves, the pressing unit 32 presses the resin material 13 via the lid body 11, and the resin material 13 is extruded from the discharge unit 12a of the cartridge 10.

[0037] (Opening and closing mechanism 40) The opening / closing mechanism 40 has a drive unit 41 and a pair of chucks 42 and 43. The chucks 42 and 43 are arranged to open and close the discharge unit 12a. The chucks 42 and 43 are configured to be able to form an open state and a closed state, and are driven by the drive unit 41 to switch between these states.

[0038] Discharge unit 12a has a structure such as a tube made of a soft material through which resin material 13 can pass, and chucks 42, 43 press against the tube to switch from a state in which resin material 13 can pass through the tube (open state) to a state in which resin material 13 cannot pass through (closed state). Opening / closing mechanism 40 allows resin material 13 extruded from discharge unit 12a to reach film 60 when chucks 42, 43 are in the open state, and blocks resin material 13 extruded from discharge unit 12a from reaching film 60 when chucks 42, 43 are in the closed state.

[0039] The control unit 70 is connected to the moving mechanism 20, the pressing mechanism 30 (servo motor 31), the opening / closing mechanism 40 (drive unit 41), the detection unit 50, etc., and can control the operating state of these devices by sending instruction signals to them, and can also perform sensing, servo control, etc. by receiving signals from these devices.

[0040] 6 is a perspective view showing how the resin material 13 is being supplied from the discharge unit 12a of the resin supplying device 100 onto the spraying surface 60s. The moving mechanism 20, for example, causes the discharge unit 12a to scan along a spiral trajectory on the spraying surface 60s. FIG. 6 shows how the discharge unit 12a scans from the center of the spiral toward the outside.

[0041] 7 is a plan view showing the state of the resin material 13 formed when the discharge part 12a is operated along a spiral trajectory TR on the spraying surface 60s. The trajectory TR is formed to extend spirally around a center point A0 at a predetermined spiral pitch. As will be described in detail later, in the inner region of the spiral trajectory TR (the range from the discharge start point A1 to the mode switching point A2), the trajectory TR extends spirally with a spiral pitch P1, and in the outer region of the spiral trajectory TR (the range from the mode switching point A2 to the supply end point A3), the trajectory TR extends spirally with a spiral pitch P2.

[0042] As described above, the resin material 13 in the storage unit 12 is pushed out from the discharge unit 12a by the pressing unit 32 (FIG. 5) moving within the storage unit 12. The resin material 13 lands at the discharge start point A1 (FIG. 7) within the spraying surface 60s. In other words, the control unit 70 controls the moving mechanism 20, the pressing mechanism 30, etc. so that the resin material 13 discharged from the discharge unit 12a lands at the discharge start point A1.

[0043] Here, the control unit 70 is configured to control the moving mechanism 20 in a first mode in which the discharge portion 12a moves relative to the spraying surface 60s at a first speed V1 after the resin material 13 lands at the discharge starting point A1, and a second mode in which the discharge portion 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1.

[0044] 7, a spiral trajectory TR is formed by the resin material 13. The spiral trajectory TR starts from the discharge start point A1, and extends in a spiral shape to the mode switching point A2, and then to the supply end point A3. In other words, the control unit 70 controls the moving mechanism 20, the pressing mechanism 30, and the like so that the resin material 13 from the discharge unit 12a traces a spiral shape as shown in FIG. 7 from the discharge start point A1 to the mode switching point A2, and then traces a spiral shape as shown in FIG. 7 from the mode switching point A2 to the supply end point A3.

[0045] After the resin material 13 lands at the discharge start point A1, the control unit 70 drives the movement mechanism 20 in the first mode until the resin material 13 discharged from the discharge unit 12a moves from the discharge start point A1 to the mode switching point A2. In the first mode, the discharge unit 12a moves relative to the spraying surface 60s at a first speed V1. The first speed V1 is a value calculated, for example, as the speed in the tangential direction of the spiral trajectory TR.

[0046] The control unit 70 further drives the moving mechanism 20 in the second mode from the mode switching point A2 until the resin material 13 discharged from the discharge unit 12a reaches the supply end point A3. In the second mode, the discharge unit 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1. The second speed V2 is also a value calculated, for example, as the speed in the tangential direction of the spiral trajectory TR.

[0047] Here, the control unit 70 switches from the first mode to the second mode when the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined value L1 (FIG. 7). The mode switching point A2 is set at such a location. However, without being limited to this configuration, the control unit 70 may switch from the first mode to the second mode when a predetermined time has elapsed since the pressing unit 32 started to move to extrude the resin material 13 from the discharge unit 12a.

[0048] (Example) Examples of various parameters applicable to the above-described embodiment are as follows: The diameter of the silicon wafer package to be molded is 290 mm, and the thickness is 0.05 mm.

[0049] The nozzle diameter of the discharge unit 12a is 4 mm. The amount of resin material 13 required to form the spiral trajectory TR is 6 g to 10 g. For example, a high-viscosity resin material (one whose linear expansion coefficient is similar to that of a silicon wafer) can be used as the liquid resin material 13. High viscosity refers to a viscosity exceeding 500 Pa·s (Pascal seconds). The weight of the resin material 13 discharged from the discharge unit 12a per unit time (discharge rate) is 0.1 g / second. The discharge rate can be set to a constant value from the start to the end of discharge. The time required to form the spiral trajectory TR (amount of resin / discharge rate) is 100 seconds.

[0050] The time (T0) from when the pressing unit 32 starts moving to extrude the resin material 13 from the discharge unit 12a until the discharge unit 12a starts moving in the first mode (first speed V1) is 10 seconds. The execution time of the first mode, that is, the time from when the discharge unit 12a starts moving in the first mode (first speed V1) until it transitions to the second mode (second speed V2), is 57.5 seconds. The time from when the discharge unit 12a starts moving in the second mode (second speed V2) until the discharge unit 12a reaches the supply end point A3 is 32.5 seconds.

[0051] The distance between the center point A0 of the spiral trajectory TR and the discharge start point A1 is 10 mm. The spiral trajectory TR can be, for example, a trajectory represented by an Archimedes spiral. The distance (predetermined value L1) between the center point A0 and the mode switching point A2 is 30 mm (equivalent to 60 mm in diameter). The distance L2 between the center point A0 and the supply end point A3 is 130 mm (equivalent to 260 mm in diameter).

[0052] Furthermore, the first speed V1 is 4.3 mm / sec, and the second speed V2 is 309.5 mm / sec. The spiral pitch P1 is 10 mm, and the spiral pitch P2 is 5 mm. That is, the spiral pitch P1 when the control unit 70 controls the movement mechanism 20 in the first mode is larger than the spiral pitch P2 when the control unit 70 controls the movement mechanism 20 in the second mode. The larger the spiral pitch, the smaller the amount of resin supplied per unit area. The faster the movement speed of the discharge unit 12a, the smaller the amount of resin supplied per unit area.

[0053] For example, if the amount of resin is small, the length of resin that can be dispensed will be short. Furthermore, if the nozzle diameter of the discharging unit 12a is large, the length of resin that can be dispensed will be short. If the length of resin that can be dispensed is shorter than the spiral length, discharging will end midway through the spiral, making it difficult to supply resin outside the desired range. If the resin distribution becomes uneven between the center and outside of the resin supply area, the margin for package thickness and flatness will decrease, and wire sweep due to resin flow may occur, resulting in product defects such as poor appearance (flow marks) and component segregation. Therefore, various parameters are optimized to ensure that the resin material 13 is uniformly sprayed within the spraying surface 60s. For example, if the discharging unit 12a moves at high speed, it is recommended to narrow the spiral pitch.

[0054] (Resin supply method) 8 is a flowchart of a resin supplying method using the resin supplying device 100. The resin supplying device 100 (FIG. 5) first reads setting values from a reference table or the like that has been prepared in advance (step t101 in FIG. 8).

[0055] For example, the above-mentioned various parameters differ when using a resin material 13 having a first viscosity and when using a second viscosity higher than the first viscosity. Alternatively, the above-mentioned various parameters differ not only depending on the type of resin material 13 but also on the nozzle diameter of the discharge part 12a, the distance between the discharge part 12a and the spraying surface 60s, the area of the spraying surface 60s, etc. These various parameters are optimized based on past resin supply implementation status and the like, and are stored as a lookup table.

[0056] For example, when a resin material 13 having a first viscosity is supplied onto the spraying surface 60s, the time from when the resin material 13 lands on the discharge start point A1 until the first mode is switched to the second mode is defined as the first time interval. When a resin material 13 having a second viscosity higher than the first viscosity is supplied onto the spraying surface 60s, the time from when the resin material 13 lands on the discharge start point A1 until the first mode is switched to the second mode is defined as the second time interval. In this case, various parameters can be set so that the second time interval is shorter than the first time interval. In the above example, the first time interval (the length of time during which the first mode is performed) is 57.5 seconds, and the second time interval (the length of time during which the second mode is performed) is 32.5 seconds.

[0057] After the necessary setting values are read, the pressing unit 32 starts to move (step t102 in FIG. 8). As the movement amount of the pressing unit 32 increases, the resin material 13 is extruded from the discharge unit 12a. When the resin material 13 has not yet reached the spray surface 60s of the film 60, the value detected by the detection unit 50 (FIG. 5) does not change.

[0058] The fact that the resin material 13 has landed on the spray surface 60s (discharge start point A1) of the film 60 may be obtained, for example, from the detection result (increase in detected weight) of the detection unit 50 (step t103 in FIG. 8). Alternatively, the resin material 13 may be considered to have landed on the spray surface 60s of the film 60 when a predetermined time has elapsed since the pressing unit 32 started to move to extrude the resin material 13 from the discharge unit 12a. Alternatively, the resin material 13 may be detected to have landed on the spray surface 60s of the film 60 by optical means or the like.

[0059] Thereafter, the discharge unit 12a is driven to operate in the first mode, and the discharge unit 12a starts moving at the first speed V1 (step t104 in FIG. 8). Starting from the discharge start point A1, the resin material 13 starts to draw a spiral trajectory TR.

[0060] When the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined radius (predetermined value L1 shown in FIG. 7), the first mode is switched to the second mode (step t105 in FIG. 8). This switching can be performed based on a value output from, for example, an encoder. As a result, the discharge unit 12a is driven to operate in the second mode, and the discharge unit 12a starts moving at a second velocity V2 (step t106 in FIG. 8).

[0061] When the discharge part 12a reaches the outermost periphery of the spiral trajectory TR (the final supply point A3) (YES in step t107 in FIG. 8), the movement of the pressing part 32 is stopped (step t108). Even after the movement of the pressing part 32 has stopped, the resin material 13 continues to drip from the discharge part 12a, so a predetermined draining operation is performed (step t109). In the draining operation, for example, the discharge part 12a is displaced up or down to stop further dripping. If necessary, the weight is detected by the detection part 50 or the like, and a correction operation for the weight deficiency is performed (step t110). This completes the resin supply. If necessary, the next resin supply is performed on another film 60.

[0062] (Action and effect) As explained at the beginning, immediately after the resin material 13 lands on the spraying surface 60s of the object to be supplied, the resin material 13 is not sufficiently fixed to the spraying surface 60s. If the movement of the discharge unit 12a begins in this state, the resin material 13 will be dragged along with the movement of the discharge unit 12a, and the resin material 13 may shift from the position on the spraying surface 60s where the resin material 13 first landed (the discharge start point A1). In this case, it becomes difficult to supply the resin material 13 uniformly onto the spraying surface 60s.

[0063] One possible solution to prevent the resin material 13 from shifting is to reduce the movement speed of the discharge section 12a, but if the discharge section 12a continues to supply the resin material 13 while moving at a slow speed, it may take time to supply the resin material 13 over a wide area of the spraying surface 60s, or there may be insufficient resin material 13 (in the cartridge set in the storage section 12) before the resin material 13 is supplied to the entire specified area, which may result in the resin material 13 not being able to be supplied evenly onto the spraying surface 60s.

[0064] In contrast, in this embodiment, after the resin material 13 lands at the discharge start point A1, the control unit 70 drives the moving mechanism 20 in the first mode until the resin material 13 discharged from the discharge unit 12a moves from the discharge start point A1 to the mode switching point A2. In the first mode, the discharge unit 12a moves relative to the spraying surface 60s at a first speed V1.

[0065] Then, the control unit 70 switches from the first mode to the second mode when the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined value L1 (FIG. 7). The control unit 70 drives the movement mechanism 20 in the second mode until the resin material 13 discharged from the discharge unit 12a reaches the supply end point A3 from the mode switching point A2. In the second mode, the discharge unit 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1.

[0066] That is, by moving the discharge unit 12a at a low speed immediately after discharge, the resin material 13 is allowed to settle sufficiently on the spraying surface 60s, and after settling, the discharge unit 12a is moved at a high speed. This makes it possible to supply the resin material 13 as uniformly as possible onto the spraying surface 60s in as short a supply time as possible. In addition to the two modes, the first and second modes, the control unit 70 may be configured to control the movement mechanism 20 in a third mode in which the discharge unit 12a moves relative to the spraying surface 60s at a third speed different from the second speed V2. Resin supply can also be performed in three or more modes.

[0067] Although the embodiments of the present disclosure have been described above, the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, and it is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0068] 10 cartridge, 11 lid body, 12, 71 storage section, 12a, 72a discharge section, 13, 73 resin material, 18 cured resin, 20 moving mechanism, 21 peripheral wall, 22 locking member, 23 cylindrical section, 30 pressing mechanism, 31 servo motor, 32 pressing section, 40 opening and closing mechanism, 41 driving section, 42, 43 chuck, 50 detection section, 52 placing table, 54 tray cover, 60 film, 60s, 75 spraying surface, 70 control section, 80 molding section, 81 upper mold, 82 bottom member, 83 side member, 84 elastic member, 85 base plate, 86 movable platen, 87 lower mold, 88 fixed platen, 90 substrate, 91, 92 conveying mechanism, 100 resin supply device, 101 substrate module, 102 Press module, 103 discharge module, 104 film module, 1000 resin molded product manufacturing equipment, A0 center point, A1 discharge start point, A2 mode switching point, A3 supply end point, AA contact area, AR arrow, L1 predetermined value, L2 distance, P1, P2 spiral pitch, TR trajectory, V1 first speed, V2 second speed.

Claims

1. A resin supplying device that supplies a resin material onto a spray surface of a supply object, a container that contains the resin material and has a discharge portion that discharges the resin material; a pressing mechanism having a pressing part inserted into the accommodation part; a movement mechanism that moves the discharge unit relative to the spray surface, thereby causing the discharge unit to scan the spray surface; a control unit that controls the movement mechanism, When the pressing portion moves within the storage portion, the resin material within the storage portion is pushed out from the discharge portion, and the resin material lands at a discharge start point within the spraying surface. The control unit a first mode in which the discharge portion moves relative to the spray surface at a first speed after the resin material lands at the discharge start point; A second mode in which the discharge portion moves relative to the spray surface at a second speed faster than the first speed, The control unit When the linear distance between a predetermined reference position and the discharge portion exceeds a predetermined value, or When a predetermined time has elapsed since the pressing portion started to move in order to extrude the resin material from the discharge portion, Switching from the first mode to the second mode; Resin supply device.

2. When the resin material having a first viscosity is supplied onto the spraying surface, a time from when the resin material lands at the discharge start point to when the first mode is switched to the second mode is defined as a first time interval; When the resin material having a second viscosity higher than the first viscosity is supplied onto the spraying surface, if the time from when the resin material lands on the discharge start point to when the first mode is switched to the second mode is defined as a second time interval, The second time interval is shorter than the first time interval. The resin supplying device according to claim 1 .

3. The moving mechanism causes the discharge unit to scan along a spiral trajectory on the spray surface. The resin supplying device according to claim 1 or 2.

4. the control unit switches from the first mode to the second mode when a linear distance between the predetermined reference position and the discharge unit exceeds a predetermined value; The predetermined reference position is the center point of the spiral trajectory. The resin supplying device according to claim 3 .

5. a helical pitch when the control unit controls the movement mechanism in the first mode is larger than a helical pitch when the control unit controls the movement mechanism in the second mode; The resin supplying device according to claim 3 or 4.

6. The control unit is configured to control the movement mechanism in a third mode in which the discharge unit moves relative to the spray surface at a third speed different from the second speed. The resin supplying device according to claim 5 .

7. A resin supplying device according to any one of claims 1 to 6, Manufacturing equipment for resin molded products.

8. a molding die for molding resin onto a silicon wafer having a chip mounted thereon using the resin material supplied to the supply object; The apparatus for manufacturing a resin molded product according to claim 7.

9. A method for manufacturing a resin molded product using the apparatus for manufacturing a resin molded product according to claim 7 or 8, a step of supplying the resin material to a supply target by the resin supply device; and performing resin molding on the object to be supplied using the resin material. A method for manufacturing resin molded products.

10. A resin supplying method for supplying a resin material onto a spray surface of a supply object, comprising: the resin material extruded from the discharge portion by the pressing portion moving within the storage portion lands at a discharge start point within the spraying surface; a first mode is implemented in which, after the resin material lands at the discharge start point, the discharge portion moves relative to the spraying surface at a first speed to supply the resin material to the spraying surface; A second mode is implemented in which the discharge portion supplies the resin material to the spraying surface while moving relative to the spraying surface at a second speed faster than the first speed, When the linear distance between a predetermined reference position and the discharge portion exceeds a predetermined value, or When a predetermined time has elapsed since the pressing portion started to move in order to extrude the resin material from the discharge portion, Switching from the first mode to the second mode; Resin supply method.

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