Immersion cooling device and method of operating the same

Abstract

To provide an immersion cooling device capable of preventing leakage of a coolant from an immersion vessel as much as possible.SOLUTION: An immersion cooling device includes an immersion vessel 3 that cools a board 11 on which a plurality of electronic components are mounted by immersing the board in a coolant. The immersion vessel 3 comprises an inner tank 41 in which the coolant is stored and an outer tank 42 provided so as to surround a bottom surface 41a and a side surface 41b of the inner tank 41, gaps S1, S2 are formed between the inner tank 41 and the outer tank 42. The device further includes a drying pocket 46 which stores the board 11 when the board immersed in the immersion vessel 3 is taken out, and a fan 48 which forms an airflow that guides air having flowed along an outer surface of the inner tank 41 to the board 11 placed in the drying pocket 46.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an immersion cooling apparatus suitable for use in cooling servers in data centers, for example, and an operating method thereof. [Background technology]

[0002] BACKGROUND ART In data centers, an immersion apparatus is known that cools electronic devices such as servers and storage devices by immersing them in a cooling liquid (Patent Document 1).

[0003] Patent Document 1 proposes installing a drain pan below the liquid tank of the immersion cooling device to prevent leakage of the cooling liquid from the liquid tank. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2023-67 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when a drain pan is installed below the liquid tank as in Patent Document 1, there is a problem that the installation space below the liquid tank becomes excessively large. Also, there is a problem that the space below the liquid tank is difficult to work in, making it difficult to recover leaked coolant.

[0006] In the immersion method, in which a substrate for a server or the like is immersed in a cooling liquid, the cooling liquid adheres to the substrate, and there is a problem in that the cooling liquid splashes when the substrate is removed from the liquid tank.

[0007] The present disclosure has been made in consideration of the above circumstances, and aims to provide an immersion cooling device and an operating method thereof that can prevent leakage of cooling liquid from an immersion container that stores the cooling liquid as much as possible.

[0008] Another object of the present disclosure is to provide an immersion cooling apparatus and an operating method thereof that can prevent as much as possible the splashing of cooling liquid when a substrate is removed from an immersion container. [Means for solving the problem]

[0009] An immersion cooling apparatus according to one aspect of the present disclosure includes an immersion container that cools a substrate on which a plurality of electronic components are mounted by immersing it in a cooling liquid, the immersion container including an inner tank in which the cooling liquid is stored, and an outer tank that is arranged to surround the bottom and sides of the inner tank, and a gap is formed between the inner tank and the outer tank.

[0010] A method of operating an immersion cooling apparatus according to one aspect of the present disclosure includes an immersion container that cools a substrate mounted with multiple electronic components by immersing it in a cooling liquid, the immersion container including an inner tank in which the cooling liquid is stored and an outer tank that surrounds the bottom and sides of the inner tank, with a gap formed between the inner tank and the outer tank, the method comprising the steps of: installing a substrate storage unit that stores the substrates immersed in the immersion container when they are removed; and activating a fan that forms a flow so as to guide air that flows along the outer surface of the inner tank to the substrates placed in the substrate storage unit. [Effects of the Invention]

[0011] This makes it possible to prevent leakage of the cooling liquid from the immersion vessel as much as possible. Furthermore, scattering of the cooling liquid can be prevented as much as possible when the substrate is removed from the immersion vessel. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic diagram showing a general configuration of an immersion cooling device. [Figure 2] 2 is a perspective view of a container-type data center equipped with the immersion cooling system of FIG. 1 according to one embodiment of the present disclosure. [Figure 3] FIG. 3 is a side view showing the immersion vessel of FIG. 2. [Figure 4]FIG. 3 is a front view showing the immersion container of FIG. 2. [Figure 5] 3 is a plan view of the immersion vessel of FIG. 2, illustrating the air flow when drying a substrate in the drying pocket. FIG. [Figure 6A] FIG. 10 is a side view showing the state in which the substrate is removed from the immersion vessel and transported to the drying pocket. [Figure 6B] FIG. 10 is a side view showing the state in which the substrate is transported above the drying pocket. [Figure 6C] FIG. 10 is a side view showing the state after the substrate has been transported to the drying pocket. [Figure 7] FIG. 3 is a plan view showing the immersion vessel of FIG. 2, illustrating the air flow when the inner tank is cooled. [Figure 8] FIG. 10 is a side view of an immersion container showing a modified example. [Figure 9] FIG. 9 is a front view of the immersion vessel of FIG. 8. [Figure 10] 9 is a plan view of the immersion vessel of FIG. 8, illustrating the air flow when drying a substrate in the drying pocket. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. 1 shows a schematic configuration of an immersion cooling apparatus 1 used in a container-type data center. The immersion cooling apparatus 1 includes an immersion vessel 3 that stores a cooling liquid, and a pump unit 5.

[0014] The immersion vessel 3 is a bottomed vessel that stores cooling liquid Lq inside. An electrically insulating liquid, such as silicone oil, is used as the cooling liquid Lq. The cooling liquid Lq is filled to a height sufficient to completely immerse the substrate 11 placed inside the immersion vessel 3.

[0015] A plurality of substrates 11 are placed inside the immersion vessel 3. Each substrate 11 is, for example, a substrate that constitutes a server, and is arranged at predetermined intervals with its longitudinal direction oriented vertically. A plurality of electronic components that constitute the server are mounted on the substrate 11, such as a CPU, a power supply unit, memory, storage such as a hard disk or SSD (Solid State Drive), and a communication unit. These electronic components generate heat during operation of the server and are cooled by the coolant Lq.

[0016] A pump unit 5 is connected to the immersion container 3 via a liquid supply pipe 13 and a liquid return pipe 15 . A downstream end 13a of the liquid supply pipe 13 is connected to the immersion vessel 3. An upstream end 13b of the liquid supply pipe 13 is connected to a heat exchanger 17 installed inside the pump unit 5. An upstream end 15a of the liquid return pipe 15 is connected to the immersion vessel 3. A downstream end 15b of the liquid return pipe 15 is connected to a liquid pump 19 installed inside the pump unit 5.

[0017] The pump unit 5 includes the heat exchanger 17 and the liquid pump 19 described above. Heat exchanger 17 exchanges heat between cooling water (coolant, etc.) and cooling liquid supplied from liquid pump 19 via cooling liquid discharge pipe 21. The cooling liquid is cooled by exchanging heat with the cooling water in heat exchanger 17. The cooling water introduced into heat exchanger 17 is, for example, cooling water cooled by outside air using a radiator (heat sink) or the like (not shown). The liquid pump 19 may be driven by, for example, an electric motor, and the discharge amount may be varied by a control unit (not shown).

[0018] 2 shows a container-type data center (immersion cooling apparatus) 30 that houses the above-mentioned immersion vessel 3 and pump unit 5. The container-type data center 30 has a standard container shape that is portable.

[0019] The container-type data center 30 includes a container body 32 having an external shape that is a rectangular parallelepiped. The width (longitudinal) direction of the container body 32 is, for example, 12 ft (3.66 m) or less. The depth direction of the container body 32 is smaller than the dimension in the width direction. Each side of the rectangular parallelepiped container body 32 is formed by frame members 34, for example, metal square pillars, and the ends of each frame member 34 are fixed.

[0020] A floor portion 36 is provided at the bottom of the container body 32. On the left side of Figure 2, the immersion vessel 3 is placed on the floor portion 36. The figure shows a state in which the substrate 11 is being removed upward from the immersion vessel 3.

[0021] A partition wall 37 is provided in the container body 32 to separate the interior into a front side and a rear side. An auxiliary machinery room is provided on the rear side of the partition wall 37, and a pump unit 5 (see FIG. 1) is provided in this auxiliary machinery room.

[0022] A walkway 38 is provided in the center of the floor 36, and workers P can walk on the walkway 38. As shown in the figure, the container-type data center 30 is high enough to allow workers P to enter inside. A distribution board 40 for supplying power to each device is provided on the right side of the container body 32.

[0023] FIG. 3 shows the immersion vessel 3 as viewed from the side. The immersion vessel 3 has a double structure comprising an inner tank 41 and an outer tank 42. The inner tank 41 is a substantially rectangular parallelepiped having a bottom surface (outer surface) 41a and a side surface (outer surface) 41b. The top of the inner tank 41 is open. Coolant Lq is stored inside the inner tank 41. The substrate 11 is cooled inside the inner tank 41 by the coolant Lq. The bottom surface 41a and side surface 42b of the inner tank 41 are made of a material with a relatively high thermal conductivity, such as copper. Note that the material used for the inner tank 41 can be metal other than copper, such as stainless steel, and is a material with a higher thermal conductivity than the material used for the outer tank 42.

[0024] The outer tank 42 is provided so as to surround the bottom surface 41a and side surfaces 41b of the inner tank 41, and is a substantially rectangular parallelepiped with a bottom surface 42a and side surfaces 42b. The outer tank 42 is made of a material having a lower thermal conductivity than the inner tank 41, such as stainless steel (in this case, copper is preferably used for the inner tank 41), or an insulating material made of resin or ceramics. The top of the outer tank 42 is open. An openable drain hole (not shown) is formed in the bottom surface 42a of the outer tank 42, so that the coolant Lq accumulated in the outer tank 42 can be collected.

[0025] A gap S1 is provided between the opposing bottom surface 41a of the inner tank 41 and the bottom surface 42a of the outer tank 42. The coolant Lq is not stored in the gap S1 except in the event of leakage.

[0026] A plurality of vibration-isolating rubbers (vibration-isolating members) 44 are arranged in the gap S1. The vibration-isolating rubbers 44 are provided at predetermined intervals from one another over the entire bottom surfaces 41a, 42a. The weight of the inner tank 41 is supported by the vibration-isolating rubbers 44. Air is allowed to flow through the gap S1.

[0027] A gap S2 is provided between the opposing side surface 41b of the inner tank 41 and the side surface 42b of the outer tank 42. Except in the event of leakage, the liquid coolant Lq is not stored in the gap S2, and air can pass through.

[0028] A drying pocket (substrate storage section) 46 for temporarily storing the substrates 11 is provided on one side surface 42b1 (the right side surface in FIG. 3) of the outer bath 42. The drying pocket 46 is provided in contact with the one side surface 42b1 of the outer bath 42.

[0029] In the drying pocket 46, the substrate 11 can be temporarily stored and dried when it is removed from the immersion container 3 after being immersed in the cooling liquid Lq. The drying pocket 46 is used when the substrate 11 is removed from the immersion container 3, such as during maintenance, and can be removed at other times. In other words, the drying pocket 46 is installable and detachable.

[0030] The drying pocket 46 is a box-like structure with an open top, and has an opening (not shown) formed in a wall portion facing one side surface 42b1 of the four side surfaces 42b of the outer tub 42. As shown in FIG. 4, this opening communicates with a hand hole (opening) 50 formed in one side surface 42b1 of the outer tub 42. The hand hole 50 can also be used for work inside the outer tub 42, such as maintenance of the vibration-damping rubber 44. Note that, as shown in FIG. 2, the hand hole 50 is closed with a lid 51 when the drying pocket 46 is not used.

[0031] A plurality of fans 48 are provided inside the drying pocket 46. As shown in Fig. 4, three fans 48 are provided on each side of the drying pocket 46 at predetermined intervals in the vertical direction. However, the number of fans 48 is not limited to this and is set appropriately so as to create an appropriate air flow. The operation of each fan 48, such as starting and stopping, is controlled by a control unit (not shown).

[0032] 5 is formed by activating each fan 48. That is, air taken in from above the immersion vessel 3 is drawn by the fan 48 and flows through the gap S2 between the side surface 41b of the inner bath 41 and the side surface 42b of the outer bath 42 from one end (left end) to the other end (right end) in the figure (see arrow A1 in FIG. 5). The air that has flowed through the gap S2 then turns around at the other end (right end) of the inner bath 41 as indicated by arrow A2, and then flows into the drying pocket 46 through the hand hole 50 as indicated by arrow A3. The air introduced into the drying pocket 46 comes into contact with the surface of the substrate 11 and flows thereafter, and is then discharged to the outside by the fan 48.

[0033] In the gap S1 (see Figures 3 and 4) between the bottom surface 41a of the inner tank 41 and the bottom surface 42a of the outer tank 42, like the air flowing through the gap S2 described above, the air flows from one end (left end) of the inner tank 41 to the other end (right end), then passes through the hand hole 50 and is guided into the drying pocket 46 before being discharged to the outside.

[0034] 6A to 6C show the process of guiding the substrate 11 immersed in the immersion vessel 3 into the drying pocket 46. In FIG.

[0035] As shown in Fig. 6A, the substrate 11 is transported by an overhead crane 55 that travels on traveling rails 53 provided on the upper part of the container body 32. Specifically, as in the case of substrate 11(1) shown on the left in Fig. 6A, the lower end of a wire 56 that is reeled out from the overhead crane 55 is attached to the upper end of the substrate 11(1). Then, after the wire 56 is reeled up to pull the substrate 11 upward, as in the case of substrate 11(2) on the right, the overhead crane 55 is made to travel along the traveling rails 53 to transport the substrate 11(2) toward above the drying pocket 46.

[0036] Then, as shown in Fig. 6B, wire 56 is paid out to lower substrate 11 and place it in drying pocket 46. Thereafter, as shown in Fig. 6C, wire 56 is removed from substrate 11. The above-described series of operations may be performed by a control unit.

[0037] The control unit is composed of, for example, a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and computer-readable storage media. A series of processes for realizing various functions is stored in, for example, a storage medium in the form of a program. The CPU reads this program into RAM and executes information processing and arithmetic operations to realize various functions. The program may be pre-installed in a ROM or other storage medium, provided in a state stored in a computer-readable storage medium, or distributed via wired or wireless communication means. Examples of computer-readable storage media include magnetic disks, magneto-optical disks, CD-ROMs, DVD-ROMs, and semiconductor memories.

[0038] The above-described embodiment has the following advantages. The immersion vessel 3 has a double structure with an inner tank 41 and an outer tank 42, and gaps S1 and S2 are formed between the inner tank 41 and the outer tank 42. Therefore, even if the cooling liquid Lq leaks from the inner tank 41, the cooling liquid Lq can be received by the outer tank 42 without being scattered outside the immersion vessel 3. Furthermore, since the coolant Lq can be collected in the outer tank 42, there is no need to provide a drain pan below the immersion vessel 3 to receive the coolant Lq. Furthermore, since the coolant Lq that leaks from the inner tank 41 can be received by the outer tank 42, the leaked coolant Lq can be easily recovered.

[0039] The substrate 11 immersed in the immersion container 3 is temporarily stored in the drying pocket 46 when it is removed from the immersion container 3. This makes it possible to prevent as much as possible the cooling liquid Lq adhering to the substrate 11 from scattering. Furthermore, by storing the substrate 11 in the drying pocket 46, the substrate 11 to which the cooling liquid Lq has adhered can be dried.

[0040] A fan 48 is provided in the drying pocket 46, so that air flows along the outer surface of the inner tank 41 and is guided toward the substrates 11 placed in the drying pocket 46. As the air flows along the outer surface of the inner tank 41, it receives heat from the inner tank 41 and is heated, so that the substrates 11 placed in the drying pocket 46 can be dried effectively.

[0041] 5, the drying pocket 46 is provided downstream of the air that flows from one end of the outer surface of the inner tank 41 to the other, so that the air that has received sufficient heat from the inner tank 41 is guided to the drying pocket 46. This allows the substrates 11 placed in the drying pocket 46 to be dried more effectively.

[0042] A hand hole 50 is provided in the outer tub 42 so as to open toward the drying pocket 46 arranged outside the outer tub 42. This allows the air flowing along the outer surface of the inner tub 41 to be guided to the drying pocket 46 through the hand hole 50.

[0043] Since the inner tank 41 is constructed with walls having a higher thermal conductivity than the outer tank 42, the heat of the coolant Lq stored inside the inner tank 41 can be efficiently transferred to the outer tank 42. Furthermore, since the outer tank 42 is constructed with walls having a lower thermal conductivity than the inner tank 41, the heat transferred from the inner tank 41 to the outside can be retained inside the outer tank 42. This allows a large amount of heat to be transferred to the air flowing through the gaps S1 and S2 between the inner tank 41 and the outer tank 42.

[0044] Vibration of the inner tank 41 can be suppressed by providing anti-vibration rubber 44 between the bottom surface 41a of the inner tank 41 and the bottom surface 42a of the outer tank 42. This suppresses the vibration of the inner tank 41 even when vibration is applied to the outer tank 42, thereby preventing the coolant Lq stored in the inner tank 41 from leaking out. Furthermore, even if a small amount of coolant leaks out of the inner tank, the gap S1 formed by the vibration-proof rubber 44 can receive it.

[0045] The fan 48 can be used not only to dry the substrate 11 but also to cool the coolant Lq. Specifically, if the cooling function of the pump unit 5 (see FIG. 1) for the coolant Lq is reduced or lost due to some kind of malfunction, the fan 48 is activated even when the substrate 11 is not placed in the drying pocket 46, as shown in FIG. 7. This creates an air flow in the gaps S1 and S2, allowing the inner tank 41 to be cooled by outside air.

[0046] [Variations] In the above-described embodiment, the drying pocket 46 is provided outside the outer tank 42, but the present disclosure is not limited to this. For example, as shown in FIG. 8, the drying pocket 46 may be provided inside the outer tank 42. Specifically, the drying pocket 46 is provided in the gap S2 between the side surface 41b of the inner tank 41 and the side surface 42b of the outer tank 42. In this case, the air flow when drying the substrates 11 flows through the gap S2 as shown in FIG. 10 and is then introduced into the drying pocket 46 (as in the above-described embodiment), and then the air is discharged from the top of the drying pocket 46 as shown by arrow A4 in FIG. 9.

[0047] According to this modification, by providing the drying pocket 46 between the inner tank 41 and the outer tank 42, the heat recovered from the inner tank 41 can be transferred to the substrates 11 in the drying pocket 46 with little loss.

[0048] The immersion cooling apparatus and the operating method thereof described in each of the above-described embodiments can be understood, for example, as follows.

[0049] An immersion cooling apparatus (30) according to a first aspect of the present disclosure includes an immersion container (3) for immersing a substrate (11) on which a plurality of electronic components are mounted in a cooling liquid to cool the substrate, the immersion container including an inner tank (41) in which the cooling liquid is stored, and an outer tank (42) arranged to surround a bottom surface (41a) and a side surface (41b) of the inner tank, and gaps (S1, S2) are formed between the inner tank and the outer tank.

[0050] Since a gap is formed between the inner tank and the outer tank, even if the coolant leaks from the inner tank, the coolant can be received by the outer tank without splashing outside the immersion container. Furthermore, since the coolant can be collected in the outer tank, there is no need to provide a drain pan below the immersion vessel to receive the coolant. Furthermore, since the outer tank can receive the coolant that leaks from the inner tank, the leaked coolant can be easily recovered.

[0051] The immersion cooling apparatus according to a second aspect of the present disclosure is the same as that of the first aspect described above, but includes a substrate storage section (46) for storing the substrates immersed in the immersion container when they are removed, and a fan (48) for forming a flow that guides air flowing along the outer surface of the inner tank to the substrates placed in the substrate storage section.

[0052] When the substrates immersed in the immersion vessel are removed from the vessel, they are temporarily stored in the substrate storage unit. This prevents the cooling liquid adhering to the substrates from scattering as much as possible. Storing the substrates in the substrate storage unit also allows the substrates to dry out. A fan is installed to guide the air flowing along the outer surface of the inner tank toward the substrates placed in the substrate storage section. As the air flows along the outer surface of the inner tank, it picks up heat from the inner tank and is heated, allowing the substrates placed in the substrate storage section to be dried effectively.

[0053] According to a third aspect of the present disclosure, in the immersion cooling apparatus of the second aspect, the substrate storage unit is provided downstream of air flowing from one end to the other end of the outer surface of the inner bath.

[0054] Since the substrate storage section is located downstream of the air flowing from one end of the outer surface of the inner tank to the other, the air is guided into the substrate storage section after having absorbed sufficient heat from the inner tank, which allows for more effective drying of the substrates placed in the substrate storage section.

[0055] An immersion cooling apparatus according to a fourth aspect of the present disclosure is the same as that of the second or third aspect, in which the substrate storage unit is arranged outside the outer tank, and the outer tank is provided with an opening (50) that opens toward the substrate storage unit.

[0056] An opening is provided in the outer tank so that it faces the substrate storage unit located outside the outer tank, allowing air flowing along the outer surface of the inner tank to be guided through the opening into the substrate storage unit. The opening may be closed with a lid when the substrate storage section is not in use.

[0057] An immersion cooling apparatus according to a fifth aspect of the present disclosure is the immersion cooling apparatus of the second or third aspect, wherein the substrate storage unit is provided between the inner bath and the outer bath.

[0058] By providing the substrate storage section between the inner tank and the outer tank, heat recovered from the inner tank can be transferred to the substrates placed in the substrate storage section with little loss.

[0059] An immersion cooling apparatus according to a sixth aspect of the present disclosure is the immersion cooling apparatus of any one of the first to fifth aspects, wherein the inner tank is formed of a wall portion having a higher thermal conductivity than a wall portion constituting the outer tank.

[0060] The inner tank has walls with a higher thermal conductivity than the outer tank, so the heat of the coolant stored inside the inner tank can be efficiently transferred to the outer tank. The outer tank has walls with a lower thermal conductivity than the inner tank, so the heat transferred from the inner tank to the outside can be retained inside the outer tank. This allows a large amount of heat to be transferred to the air flowing through the gap between the inner and outer tanks. The inner tank may be made of a metal such as copper or stainless steel. The material used for the outer tank may be, for example, stainless steel (in this case, the inner tank is made of copper, etc.), or a heat insulating material using resin, ceramics, or the like.

[0061] An immersion cooling apparatus according to a seventh aspect of the present disclosure is the immersion cooling apparatus of any one of the first to sixth aspects, wherein a vibration-isolating member (44) is provided between a bottom surface of the inner tank and a bottom surface of the outer tank.

[0062] Vibration of the inner tank can be suppressed by providing a vibration-isolating member (e.g., vibration-isolating rubber) between the bottom surfaces of the inner tank and the outer tank. This suppresses vibration of the inner tank even when vibration is applied to the outer tank, thereby preventing the coolant stored in the inner tank from leaking out. Furthermore, even if a small amount of coolant leaks out of the inner tank, it can be received in the gap formed by the vibration-damping member between the bottom surface of the inner tank and the bottom surface of the outer tank.

[0063] A method of operating an immersion cooling apparatus according to a first aspect of the present disclosure includes an immersion container that cools a substrate mounted on the immersion container by immersing it in a cooling liquid, the immersion container including an inner tank in which the cooling liquid is stored, an outer tank that surrounds the bottom and side surfaces of the inner tank, a substrate storage unit that stores the substrate immersed in the immersion container when the substrate is removed, and a fan that forms a flow so as to guide air that flows along the outer surface of the inner tank to the substrate placed in the substrate storage unit, with a gap formed between the inner tank and the outer tank, the method comprising the steps of: installing the substrate storage unit that stores the substrate immersed in the immersion container when the substrate is removed; and starting the fan that forms a flow so as to guide air that flows along the outer surface of the inner tank to the substrate placed in the substrate storage unit.

[0064] A method for operating an immersion cooling apparatus according to a second aspect of the present disclosure includes, in the method for operating an immersion cooling apparatus according to the first aspect, a step of starting the fan when the function of cooling the coolant is reduced or lost. [Explanation of symbols]

[0065] 1 Immersion cooling device 3 Immersion container 5 Pump unit 11 Circuit Board 13 Liquid supply pipe 13a Downstream end 13b Upstream end 15 Liquid return pipe 15a Upstream end 15b Downstream end 17 Heat exchanger 19 Liquid Pump 21 Coolant discharge pipe 30 Container-type data center (immersion cooling system) 32 Container body 34 Frame material 36 Floor 37 Partition Wall 38 Corridor 41 Inner tank 41a Bottom (outside) 42b Side (outer surface) 42 Outer tank 41a Bottom 42b Side 42b1 One aspect 44 Anti-vibration rubber (anti-vibration material) 46 Drying pocket (substrate storage area) 48 fans 50 Hand Hole (Opening) 51 Lid 53 Running rail 55 Overhead crane 56 wires Lq Coolant P worker S1 gap

Claims

1. an immersion container for immersing a substrate on which a plurality of electronic components are mounted in a cooling liquid to cool it; The immersion container includes an inner tank in which the cooling liquid is stored; an outer tank provided to surround the bottom and side surfaces of the inner tank, An immersion cooling apparatus, wherein a gap is formed between the inner tank and the outer tank.

2. a substrate storage unit for storing the substrate when the substrate is removed from the immersion vessel; a fan that forms a flow so as to guide the air flowing along the outer surface of the inner tank to the substrates arranged in the substrate storage unit; The immersion cooling apparatus according to claim 1 ,

3. The immersion cooling apparatus according to claim 2 , wherein the substrate storage unit is provided downstream of air flowing from one end to the other end of the outer surface of the inner tank.

4. the substrate storage unit is disposed outside the outer tank, The immersion cooling apparatus according to claim 2 , wherein the outer tank has an opening that opens toward the substrate storage section.

5. The immersion cooling apparatus according to claim 2 , wherein the substrate storage unit is provided between the inner bath and the outer bath.

6. The immersion cooling apparatus according to claim 2 , wherein the inner tank has a wall portion having a thermal conductivity higher than that of a wall portion constituting the outer tank.

7. The immersion cooling apparatus according to claim 1 , wherein a vibration-isolating member is provided between a bottom surface of the inner tank and a bottom surface of the outer tank.

8. an immersion container for immersing a substrate on which a plurality of electronic components are mounted in a cooling liquid to cool it; The immersion container includes an inner tank in which the cooling liquid is stored; an outer tank provided to surround the bottom and side surfaces of the inner tank; a substrate storage unit for storing the substrate when the substrate is removed from the immersion vessel; a fan that forms a flow so as to guide the air flowing along the outer surface of the inner tank to the substrates arranged in the substrate storage unit; Equipped with A method for operating an immersion cooling apparatus in which a gap is formed between the inner tank and the outer tank, comprising: a step of installing the substrate storage unit for storing the substrate when the substrate is removed from the immersion container; activating the fan that forms a flow so as to guide the air flowing along the outer surface of the inner tank to the substrates placed in the substrate storage section; A method of operating an immersion cooling device having the above structure.

9. The method for operating an immersion cooling apparatus according to claim 8 , further comprising the step of starting the fan when the function of cooling the cooling liquid is reduced or lost.

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