Electronic component, system, and mobile

Abstract

To provide a technology advantageous for realizing both of downsizing of an electronic component and accurate positioning between an element of a board and an optical member.SOLUTION: An electronic component includes a board having a first surface, a circuit board having a second surface facing the first surface, and an optical member having a third surface facing the first surface. The first surface of the board has a central region on which a plurality of elements are arranged. The second surface of the circuit board is arranged over the first surface so as not to cover the central region. The third surface of the optical member is arranged over the central region so as to has a space between the first surface and the third surface and without intervention of the circuit board.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component, a system, and a mobile object. [Background technology]

[0002] Electronic components including devices with light-receiving elements such as imaging devices, devices with light-emitting elements such as OLEDs, and devices with light-emitting elements such as VCSELs (vertical-cavity surface-emitting lasers) are widely used. These electronic components are commonly configured with optical elements on the front surface of the device. Due to space constraints in the products in which they are installed, further miniaturization of such electronic components is required. Furthermore, when the optical element includes a microlens, it is necessary to precisely align the clearance and position between the microlens and the element in order to focus the light.

[0003] Patent Document 1 describes a configuration in which a wiring board with an opening is mounted on an imaging element, and a sealant (optical member) is mounted on the opening on the wiring board. Patent Document 2 describes a configuration in which a surface-emitting laser substrate is mounted on a mounting substrate, and an optical member is mounted on the surface-emitting laser substrate. Patent Document 3 describes a configuration in which a resin base material in which a conductor (lead frame) and a transparent member (optical member) are embedded and integrally molded is mounted on an optical element. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-299592 [Patent Document 2] Japanese Patent Publication No. 2023-52615 [Patent Document 3] Japanese Patent Application Laid-Open No. 2008-277593 Summary of the Invention [Problem to be solved by the invention]

[0005] In Patent Document 1, since the optical members are mounted on the wiring board, there is room for improvement in reducing the size in the thickness direction. Also, the clearance between the imaging element and the optical members can cause variations in the thickness of the components.

[0006] In Patent Document 2, optical components are mounted directly on the surface-emitting laser substrate, but thickness variations may occur due to soldering. In addition, because the surface-emitting laser substrate is mounted on the mounting substrate, warping of the mounting substrate and the surface-emitting laser substrate during bonding may cause variations in height within the surface.

[0007] In Patent Document 3, integral molding can cause warping of the transparent member (optical member) within the resin substrate, which can lead to variations in height within the surface. In addition, because it does not function as a circuit board with circuits on both sides, it is necessary to prepare a separate circuit board, which leaves room for improvement in terms of miniaturization.

[0008] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide an advantageous technology for achieving both miniaturization of electronic components and high-precision alignment between elements on a substrate and optical members. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided an electronic component including a substrate having a first surface, a circuit board having a second surface opposite the first surface, and an optical element having a third surface opposite the first surface, wherein the first surface of the substrate has a central region in which a plurality of elements are arranged, the second surface of the circuit board is disposed on the first surface so as not to cover the central region, and the third surface of the optical element is disposed on the central region without the circuit board in between so as to have a space between the first surface and the third surface. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide an advantageous technique for achieving both miniaturization of electronic components and highly accurate alignment between elements on a substrate and optical members. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is a diagram showing the configuration of an electronic component according to the first embodiment. [Figure 2] 10A and 10B are diagrams illustrating examples of adhesive placement patterns. [Figure 3] 10A and 10B are diagrams showing examples of resins that fill gaps between optical members and circuit boards. [Figure 4] 10A and 10B are diagrams showing examples of the height relationship between an optical member and a circuit board. [Figure 5] FIG. 10 is a diagram showing the configuration of an electronic component according to a second embodiment. [Figure 6] FIG. 10 is a diagram showing the configuration of an electronic component according to a third embodiment. [Figure 7] FIG. 10 is a diagram showing the configuration of an electronic component according to a third embodiment. [Figure 8] FIG. 10 is a diagram showing the configuration of a system according to a fourth embodiment. [Figure 9] FIG. 13 is a diagram showing the configuration of a system and a moving object according to a fifth embodiment. [Figure 10] FIG. 13 is a diagram showing the configuration of a system according to a sixth embodiment. [Figure 11] FIG. 13 is a diagram showing the configuration of a system according to a seventh embodiment. [Figure 12] FIG. 13 is a diagram showing the configuration of a system according to an eighth embodiment. [Figure 13] FIG. 13 is a diagram showing the configuration of a system according to a ninth embodiment. [Figure 14] FIG. 23 is a diagram showing the configuration of a system according to a tenth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0013] In the following description and drawings, common reference numerals are used to designate components common to multiple drawings. The common components may be described by mutually referring to multiple drawings. Furthermore, the description of the components with the common reference numerals may be omitted.

[0014] First Embodiment 1(a) and 1(b) are diagrams illustrating the configuration of an electronic component 100 according to a first embodiment. FIG. 1(a) is a plan view of the electronic component 100, and FIG. 1(b) is a cross-sectional view taken along line Aa in FIG. 1(a). In this specification and the drawings, directions are indicated in an XYZ coordinate system, with the horizontal plane being the XY plane. Here, it is assumed that the substrate 10 is placed so that its surface (first surface 101) is parallel to the horizontal plane (XY plane). Therefore, in the following, the directions perpendicular to each other in the plane along the surface of the substrate 10 are referred to as the X-axis and Y-axis, and the direction perpendicular to the X-axis and Y-axis is referred to as the Z-axis. In the following, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively.

[0015] The electronic component 100 may include a substrate 10, and a circuit board 20 and an optical member 30 disposed on the substrate 10. The X and Y directions are parallel to a first surface 101 of the substrate 10. The Z direction is perpendicular to the first surface 101. The size in the Z direction may also be expressed as thickness. The size in the Z direction of a typical substrate 10 and electronic component 100 is smaller than the dimensions in the X and Y directions, and they are generally flat.

[0016] The type of substrate 10 is not particularly limited, but is typically a semiconductor substrate. In one example, the substrate 10 may be a semiconductor substrate for an optical device such as an imaging device, a display device, or a light-emitting device. The substrate 10 of this embodiment may include a central region 120 and a peripheral region 130 located around the central region. A plurality of elements 110 are formed in an array on a first surface 101 of the central region 120. When the substrate 10 is a semiconductor substrate for an imaging device, the elements 110 are light-receiving elements. In this case, the elements 110 may be, for example, a single photon avalanche diode (SPAD) sensor, a complementary metal oxide semiconductor (CMOS) sensor, or the like. When the substrate 10 is a light-emitting device, the elements 110 are light-emitting elements. In this case, the elements 110 may be, for example, a vertical cavity surface-emitting laser (VCSEL). Peripheral circuits (not shown), such as a drive circuit, a control circuit, a signal processing circuit, and an output processing circuit, and electrodes (first electrodes 15), such as input terminals and output terminals, are provided in the peripheral region 130. When the substrate 10 is a substrate in which two or more substrates are stacked, a configuration in which a substrate on which a peripheral circuit is provided is stacked below the central region 120 may also be used.

[0017] The circuit board 20 is a board on which electrical circuits that achieve various functions are mounted. Specific functions of the circuit board 20 may include supplying control signals and power to elements provided on the board 10, processing signals output from the board 10, storing signals, and transmitting signals to an external computer or network. The circuit board 20 has electrodes 210 (second electrodes) on at least one of a second surface 201 facing the first surface 101 of the board 10 and a surface 202 opposite the second surface 201. A plurality of electrodes 210 may be arranged. From the viewpoint described below, it is preferable that a plurality of electrodes 210 (second electrodes) are arranged on the second surface 201 of the circuit board 20, and a plurality of electrodes 210 (third electrodes) that are electrically connected to the second electrodes are arranged on the opposite surface 202. In this case, the electrodes 210 on the second surface 201 and the electrodes 210 on the opposite surface 202 may be connected to each other by wiring 220 (conductors) within the circuit board 20. For example, an electrode (not shown) provided in the peripheral region 130 of the first surface 101 of the substrate 10 and an electrode 210 provided on the second surface 201 of the circuit board 20 are arranged to face each other, and are electrically connected to each other via a conductive member 40. This allows input and output to and from the substrate 10 to be performed from both the first surface 201 and the opposite surface 202 of the circuit board 20, and the circuit board can be made smaller by routing the wiring 220. For example, Au bumps can be used as the conductive member 40. Furthermore, the circuit board 20 is arranged so as not to cover at least the upper part of the central region 120 of the substrate 10 so as not to interfere with light reception, display, or emission by the plurality of elements 110 formed in an array in the central region 120 of the first surface 101 of the substrate 10.

[0018] 1(b), the conductive member 40 can serve as both an electrical connection and a mechanical connection between the substrate 10 and the circuit board 20. Note that mechanical strength may be supplemented by providing an underfill agent (not shown) around the conductive member 40.

[0019] The optical member 30 may be made of a transparent material such as glass, quartz glass, or crystal. Depending on the specifications of the electronic component 100, the optical member 30 may be coated with an anti-reflection coating. Alternatively, depending on the specifications of the electronic component 100, the optical member 30 may be made of a material that easily transmits infrared light, or may be coated with an infrared-blocking film. The optical member 30 is mounted on the substrate 10. The optical member 30 has a third surface 301 facing the first surface 101 of the substrate 10. The third surface 301 of the optical member 30 is disposed in the central region of the optical member 30 such that a space is formed between the first surface 101 of the substrate 10 and the third surface 301 of the optical member 30, without the circuit board 20 interposed therebetween. In one example, the optical member 30 is mounted via an adhesive 50 such that a space is formed between the first surface 101 of the substrate 10 and the third surface 301 of the optical member 30. In this case, the optical member 30 is mounted so as to cover at least the entire upper area of the plurality of elements 110, but not the upper area of the circuit board 20. As shown in FIG. 1 , the adhesive 50 may be disposed so as to bond the first surface 101 of the substrate 10 and the third surface 301 of the optical member 30, or may be disposed between the circuit board 20 and the optical member 30. To provide a space between the first surface 101 and the third surface 301, it is easier to dispose the adhesive 50 between the first surface 101 and the third surface 301. Additionally, disposing the adhesive 50 between the first surface 101 and the third surface 301 is preferable to accurately form the spatial distance between the first surface 101 and the third surface 301. One reason why it is preferable to make the spatial distance between the first surface 101 and the third surface 301 the same distance is that it can improve the accuracy and efficiency of light reception, display, or light emission of the elements 110. If the distances are different, there is a possibility that the amount of light received or emitted will vary among the elements 110. To ensure that the space between the first surface 101 and the third surface 301 is uniform, it is more preferable that the adhesive 50 contains spacers of uniform size. The distance between the first surface 101 and the third surface 301 is, for example, 10 μm or more and 200 μm or less, but an appropriate value can be selected depending on the size of the element, etc. The thickness of the optical member is, for example, about 0.2 mm to 1.0 mm. If it is too thin, it may affect strength or deformation. If it is too thick, it may hinder miniaturization.It is preferable to select an appropriate thickness in consideration of the thickness of the circuit board 20, the distance between the first surface 101 and the third surface 301, and the like.

[0020] 1(a) and 1(b) show an example in which adhesive 50 is disposed in at least four locations scattered across peripheral region 130 of substrate 10 (e.g., at the four corners of third surface 301 of optical member 30). FIGS. 2(a) to 2(c) are plan views of electronic component 100 similar to FIG. 1(a), illustrating other examples of the arrangement pattern of adhesive 50. When peripheral region 130 corresponding to the periphery of optical member 30 is viewed as a quadrilateral, one long side of the four sides is defined as a first side, and the long side opposite the first side is defined as a second side. Furthermore, one short side of the four sides is defined as a third side, and the short side opposite the third side is defined as a fourth side. FIG. 2(a) shows an example in which adhesive 50 is disposed in a first region having a longitudinal length in the direction along the first side (Y direction) and a second region having a longitudinal length in the direction along the second side (Y direction). FIG. 2(b) shows an example in which adhesive 50 is disposed in a third region having a longitudinal length in the direction along the third side (X direction) and a fourth region having a longitudinal length in the direction along the third side (X direction). FIG. 2(c) shows an example in which adhesive 50 is disposed in a first region, a second region, a third region, and a fourth region. That is, in FIG. 2(c), adhesive 50 is disposed in regions along each of the four sides of a quadrilateral peripheral region 130. By surrounding the multiple elements 110 as shown in FIG. 2(c), adhesive 50 containing spacers with highly uniform sizes can maintain a uniform spatial interval between the first surface 101 and the third surface 301 and protect the multiple elements 110 from the external environment.

[0021] The gap between the optical member 30 and the circuit board 20 may be empty, or the gap may be filled with resin. Filling the gap with resin can improve the adhesive strength of the optical member 30 and the circuit board 20 to the substrate 10. FIGS. 3(a) and 3(b) are cross-sectional views of the electronic component 100 similar to FIG. 1(b), showing examples of forming a different resin 60. FIG. 3(a) shows an example in which, when bonding the optical member 30 and the substrate 10, an adhesive 50 serving as the resin 60 is injected into the gap so that it overflows onto the underside of the optical member 30 and the circuit board 20, thereby filling the gap with the circuit board 20. FIG. 3(b) shows an example in which, after bonding the optical member 30 and the substrate 10 with the adhesive 50, an additional resin 60 made of the same material as the adhesive 50 or a different material is injected to fill the gap with the circuit board 20.

[0022] 4(a) to 4(c) are cross-sectional views of the electronic component 100 similar to FIG. 1(b), illustrating examples of the height relationship between the optical member 30 and the circuit board 20. FIG. 4(a) illustrates an example in which the optical member 30 is positioned higher than the circuit board 20. FIG. 4(b) illustrates an example in which the optical member 30 and the circuit board 20 are at the same height. FIG. 4(c) illustrates an example in which the optical member 30 is positioned lower than the circuit board 20. To reduce the size of the electronic component 100, it is preferable that the optical member 30 and the circuit board 20 are at the same height as shown in FIG. 4(b), or that the optical member 30 is lower than the circuit board 20 as shown in FIG. 4(c). In other words, it is preferable that the height of the optical member 30 is equal to or lower than the height of the circuit board 20. Having the optical member 30 lower than the circuit board 20 is advantageous in that it prevents contact between the optical member 30 and another component when the electronic component 100 is attached to the other component via the surface 202 opposite the second surface of the circuit board 20.

[0023] The configurations according to the various examples described above are advantageous in that they enable the electronic component 100 to be made smaller than a configuration in which the substrate 10 is mounted on the circuit substrate 20 and the optical element 30 is mounted on the substrate 10, or a configuration in which the circuit substrate 20 is mounted on the substrate 10 and the optical element 30 is mounted on the circuit substrate 20. Furthermore, when the substrate 10 is mounted on the circuit substrate 20, warping of the substrate 10 occurs due to thermal curing when the substrate 10 is bonded, which can cause variations in the spatial distance between the substrate 10 and the optical element 30 mounted on the substrate 10. In contrast, according to the configuration of this embodiment, warping of the substrate 10 is reduced, and therefore variations in the spatial distance between the substrate 10 and the optical element 30 can be suppressed.

[0024] As described above, according to this embodiment, it is possible to provide an electronic component that achieves both miniaturization and highly accurate alignment between the elements on the substrate and the optical member.

[0025] Second Embodiment The second embodiment differs from the first embodiment described above mainly in the configuration of the optical member 30. Matters not mentioned in this second embodiment may follow those of the first embodiment as long as they are not inconsistent. Figures 5(a) and (b) are diagrams showing the configuration of an electronic component 100 according to the second embodiment. Figure 5(a) is a plan view of the electronic component 100, and Figure 5(b) is a cross-sectional view taken along line Aa shown in Figure 5(a).

[0026] 5(b), a plurality of microlenses 70 are formed on the third surface 301 of the optical member 30. Each of the plurality of microlenses 70 is formed to match the size of each of the plurality of elements 110 formed on the substrate 10. The plurality of microlenses 70 are formed at the same pitch and arrangement as the plurality of elements 110, and the number of the plurality of microlenses 70 is at least the same as the number of the plurality of elements 110. Thus, each of the plurality of microlenses 70 is disposed at a position corresponding to each of the plurality of elements 110.

[0027] Each of the multiple microlenses 70 can be formed by, for example, processing quartz glass. When mounting the optical member 30 on the substrate 10, the multiple elements 110 are mounted so that the XY positions of each of the multiple elements 110 and each of the multiple microlenses 70 coincide. The alignment of the multiple elements 110 and the multiple microlenses 70 is performed, for example, by providing alignment marks on the substrate 10 and the optical member 30 and recognizing both alignment marks with an alignment scope (camera) (not shown). The distance between the optical member 30 and the substrate 10 is the same as in the first embodiment, but the microlenses 70 can further improve the light focusing performance, making it possible to suppress variations in the distance between the optical member 30 and the substrate 10.

[0028] According to the configuration of the second embodiment, it is possible to provide an electronic component 100 that achieves both miniaturization and highly accurate alignment between the elements on the substrate and the optical member (microlens).

[0029] <Third embodiment> The third embodiment differs from the first and second embodiments mainly in the configuration of the circuit board 20. Matters not mentioned in this third embodiment may follow those of the first and second embodiments as long as they are not inconsistent. FIGS. 6(a)-(c) and 7(a)-(c) are diagrams showing the configuration of an electronic component 100 according to a third embodiment. FIGS. 6(a) and 7(a) are plan views of the electronic component 100. FIGS. 6(b) and 7(b) are cross-sectional views taken along line Aa in FIGS. 6(a) and 7(a), respectively. FIGS. 6(c) and 7(c) are cross-sectional views taken along line Bb in FIGS. 6(a) and 7(a), respectively.

[0030] The circuit board 20 has a shape in which at least the upper part of the central region 120 of the substrate 10 is open. In the plan view of FIG. 6(a), the circuit board 20 is disposed so as to surround the central region 120 of the substrate 10 that is visible through the opening. Because the circuit board 20 is a single substrate, the circuit board 20 only needs to be mounted on the substrate 10 once. Furthermore, the area of the circuit board 20 above the substrate 10 is larger than that of the circuit board 20 in the first embodiment, and the area in which the wiring 220 can be arranged is increased, thereby enabling the external size of the circuit board 20 to be reduced. Note that in this example, as can be seen from FIGS. 6(a) to 6(c), the electrical connection between the substrate 10 and the circuit board 20 via the wiring 220 is made at multiple positions along the two long sides of the opening.

[0031] The examples of FIGS. 7(a) to 7(c) are the same as the examples of FIGS. 6(a) to 6(c) in that the circuit board 20 has an opening at the top of the central region 120 of the substrate 10. However, the examples of FIGS. 7(a) to 7(c) differ from the examples of FIGS. 6(a) to 6(c) in that the electrical connection between the substrate 10 and the circuit board 20 via the wiring 220 is made at multiple positions along the four sides of the opening. Because the electrical connection between the substrate 10 and the circuit board 20 is made at multiple positions along the four sides, electrodes are arranged along the four sides of the first surface 101 of the substrate 10. This makes it possible to reduce the size of the substrate 10 and the circuit board 20 compared to when electrodes are arranged only along two sides. Furthermore, in the configurations shown in FIGS. 7(a) to 7(c), the connection areas between the substrate 10 and the circuit board 20 are on the four sides, which improves mechanical strength.

[0032] According to this embodiment, it is possible to provide an electronic component 100 that achieves both miniaturization and highly accurate alignment between the elements on the substrate and the optical member (microlens). The specific configuration of the electronic component 100 is not limited to the above-described embodiment, and various modifications are possible. For example, the wiring 220 not only penetrates the second surface 201 and the opposite surface 202 of the substrate 20 in the Z direction, but also can be routed in the X and Y directions if the substrate 20 is made up of multiple wiring layers, allowing for a wiring pattern with multiple paths. It is also possible to combine all or part of the different embodiments described above.

[0033] Application examples of the electronic component 100 described above will be described below as fourth to tenth embodiments.

[0034] <Fourth embodiment> The system according to the fourth embodiment will be described with reference to Fig. 8. Fig. 8 is a block diagram showing a schematic configuration of the system according to the fourth embodiment.

[0035] The electronic component 100 described above can be applied to various systems. Examples of applicable systems include digital still cameras, digital camcorders, surveillance cameras, copiers, facsimiles, mobile phones, vehicle-mounted cameras, and observation satellites. Camera modules equipped with an optical system such as a lens and an imaging device are also included in the system. Figure 8 illustrates a block diagram of a digital still camera as an example of such systems.

[0036] 8 includes an image capturing device 1004, which is an example of an electronic component. The system 1000 also includes a lens 1002 that forms an optical image of a subject on the image capturing device 1004, an aperture 1003 that adjusts the amount of light passing through the lens 1002, and a barrier 1001 that protects the lens 1002. The lens 1002 and the aperture 1003 form an optical system (optical device) that focuses light on the image capturing device 1004. The image capturing device 1004 includes the electronic component 100 (image capturing device) described above, in which the element 110 is a light receiving element, and converts the optical image formed by the lens 1002 into an electrical signal.

[0037] The system 1000 also includes a signal processing unit 1007, which is an image generation unit that generates an image by processing an output signal output by the image capture device 1004. The signal processing unit 1007 functions as a processing device that performs various corrections and compressions as necessary and outputs image data. The signal processing unit 1007 may be formed on the same semiconductor substrate on which the image capture device 1004 is provided, or may be formed on a semiconductor substrate separate from the image capture device 1004. Alternatively, the image capture device 1004 and the signal processing unit 1007 may be formed on the same semiconductor substrate.

[0038] The system 1000 further includes a memory unit 1010 for temporarily storing image data, and an external interface unit (external I / F unit) 1013 for communicating with an external computer or the like. The system 1000 also includes a recording medium 1012 such as a semiconductor memory for recording or reading out imaging data, and a recording medium control interface unit (recording medium control I / F unit) 1011 for recording or reading out data from the recording medium 1012. The recording medium control I / F unit 1011 and the recording medium 1012 may form part of a storage device. The recording medium 1012 may be built into the system 1000 or may be removable.

[0039] Furthermore, the system 1000 has an overall control and calculation unit 1009 that performs various calculations and controls the entire digital still camera, and a timing generation unit 1008 that outputs various timing signals to the image capture device 1004 and the signal processing unit 1007. The overall control and calculation unit 1009 and the timing generation unit 1008 can form part of a control device for controlling the operation of the system 1000. Here, timing signals and the like may be input from outside, and the system 1000 only needs to have at least the image capture device 1004 and the signal processing unit 1007 that processes the output signal output from the image capture device 1004.

[0040] The imaging device 1004 outputs an imaging signal to a signal processing unit 1007. The signal processing unit 1007 performs predetermined signal processing on the imaging signal output from the imaging device 1004 and outputs image data. The signal processing unit 1007 generates an image using the imaging signal. Although not shown in FIG. 8 , a display device such as a display for displaying the generated image may be provided in the system 1000. As described above, according to this embodiment, it is possible to realize a system 1000 to which the electronic component 100 (imaging device) of any of the above embodiments is applied.

[0041] Fifth Embodiment A system 1300 and a mobile object 1301 according to the fifth embodiment will be described with reference to Figures 9(a) and 9(b). Figures 9(a) and 9(b) are diagrams showing the configurations of the system 1300 and the mobile object 1301 according to the fifth embodiment.

[0042] FIG. 9A illustrates an example of a system related to an in-vehicle camera. The system 1300 includes an image capture device 1310. The image capture device 1310 is the electronic component 100 (image capture device) described above, in which the element 110 is a light-receiving element. The system 1300 also includes an image processing unit 1312 that performs image processing on multiple pieces of image data acquired by the image capture device 1310. The system 1300 also includes a distance acquisition unit 1316 that calculates the distance to an object, and a collision determination unit 1318 that determines whether or not a collision is likely based on the calculated distance. The distance acquisition unit 1316 may acquire distance information to the object using a Time of Flight (ToF) method, or may acquire distance information using parallax information, etc. In other words, the distance information is information related to parallax, defocus amount, distance to the object, etc. The collision determination unit 1318 may determine the possibility of a collision using any of these pieces of distance information. The distance acquisition unit 1316 may be implemented by dedicated hardware or a software module. The distance acquisition unit 1316 may also be realized by a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc. The distance acquisition unit 1316 may also be realized by a combination of these.

[0043] The system 1300 is connected to a vehicle information acquisition device 1320 and can acquire vehicle information such as vehicle speed, yaw rate, and steering angle. The system 1300 is also connected to an ECU 1330, which is a control device that outputs a control signal to generate a braking force for the vehicle based on the determination result of the collision determination unit 1318. The system 1300 is also connected to an alarm device 1340 that issues an alarm to the driver based on the determination result of the collision determination unit 1318. For example, if the determination result of the collision determination unit 1318 indicates a high collision possibility, the ECU 1330 controls the drive device (mechanical device) 1360 by applying the brakes, releasing the accelerator, suppressing engine output, or other vehicle control to avoid the collision and mitigate damage. The alarm device 1340 warns the user by sounding an alarm, displaying alarm information on a screen of a car navigation system, or vibrating a seat belt or steering wheel.

[0044] In this embodiment, the system 1300 captures an image of the periphery of a vehicle (moving object 1301), for example, the front or rear. FIG. 9(b) shows a system for capturing an image of the area in front of the vehicle (image capturing range 1350). A vehicle information acquisition device 1320 sends instructions to the system 1300 or the image capturing device 1310. This configuration can further improve the accuracy of distance measurement.

[0045] While the above describes an example of control to prevent collisions with other vehicles, system 1300 can also be applied to autonomous driving control to follow other vehicles and autonomous driving control to prevent vehicles from drifting out of their lanes. Furthermore, system 1300 can be applied not only to vehicles such as automobiles, but also to moving bodies (mobile devices) such as ships, aircraft, and industrial robots. The moving body includes one or both of a driving force generating unit that generates a driving force primarily used to move the moving body and a rotating body primarily used to move the moving body. The driving force generating unit can be an engine, a motor, or the like. The rotating body can be a tire, a wheel, a ship's screw, an aircraft's propeller, or the like. In addition to moving bodies, system 1300 can be applied to a wide range of devices that use object recognition, such as intelligent transport systems (ITS).

[0046] Sixth Embodiment The system of the sixth embodiment will be described with reference to Fig. 10. Fig. 10 is a block diagram showing an example of the configuration of a range image sensor 1401 that is the system of this embodiment.

[0047] 10, the range image sensor 1401 is configured to include an optical system 1402, a photoelectric conversion device 1403, an image processing circuit 1404, a monitor 1405, and a memory 1406. The range image sensor 1401 can obtain a range image according to the distance to the subject by receiving light (modulated light or pulsed light) that is projected from a light source device 1411 toward the subject and reflected from the surface of the subject.

[0048] The optical system 1402 is configured to have one or more lenses, and guides image light (incident light) from an object to the photoelectric conversion device 1403 , forming an image on the light receiving surface (sensor section) of the photoelectric conversion device 1403 .

[0049] The photoelectric conversion device 1403 is the aforementioned electronic component 100 in which the element 110 is a light receiving element, and a distance signal indicating the distance determined from the light receiving signal output from the photoelectric conversion device 1403 is supplied to the image processing circuit 1404.

[0050] The image processing circuit 1404 performs image processing to construct a distance image based on the distance signal supplied from the photoelectric conversion device 1403. The distance image (image data) obtained by this image processing is then supplied to a monitor 1405 for display, or supplied to a memory 1406 for storage (recording).

[0051] In the range image sensor 1401 configured in this way, by applying the electronic component 100 described above, it is possible to obtain, for example, a more accurate range image as the pixel characteristics improve.

[0052] Seventh Embodiment The system of the seventh embodiment will be described with reference to Fig. 11. Fig. 11 is a diagram showing an example of a schematic configuration of an endoscopic surgery system 1250, which is the system of this embodiment.

[0053] 11 shows a state in which an operator (doctor) 1231 is performing surgery on a patient 1232 on a patient bed 1233 using an endoscopic surgery system 1250. As shown in the figure, the endoscopic surgery system 1250 includes an endoscope 1200, a surgical tool 1210, and a cart 1234 on which various devices for endoscopic surgery are mounted.

[0054] The endoscope 1200 includes a lens barrel 1201, a region of which a predetermined length from the tip is inserted into a body cavity of a patient 1232, and a camera head 1202 connected to the base end of the lens barrel 1201. In the illustrated example, the endoscope 1200 is configured as a so-called rigid lens barrel having a rigid lens barrel 1201, but the endoscope 1200 may also be configured as a so-called flexible lens barrel having a flexible lens barrel.

[0055] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 1201. A light source device 1203 is connected to the endoscope 1200, and light generated by the light source device 1203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 1201, and is irradiated via the objective lens towards an observation target inside a body cavity of a patient 1232. The endoscope 1200 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0056] An optical system and a photoelectric conversion device are provided inside the camera head 1202, and light reflected from an observation object (observation light) is focused onto the photoelectric conversion device by the optical system. The observation light is photoelectrically converted by the photoelectric conversion device to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observation image. The photoelectric conversion device can be the aforementioned electronic component 100 (image capture device) in which the element 110 is a light receiving element. The image signal is sent to a camera control unit (CCU) 1235 as RAW data.

[0057] The CCU 1235 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 1200 and the display device 1236. Furthermore, the CCU 1235 receives an image signal from the camera head 1202 and performs various image processing on the image signal, such as development processing (demosaic processing), to display an image based on the image signal.

[0058] Under the control of the CCU 1235 , the display device 1236 displays an image based on the image signal that has been subjected to image processing by the CCU 1235 . The light source device 1203 is configured from a light source such as an LED (Light Emitting Diode), and supplies the endoscope 1200 with irradiation light when photographing an operation site or the like. The input device 1237 is an input interface for the endoscopic surgery system 1250. A user can input various information and instructions to the endoscopic surgery system 1250 via the input device 1237. The treatment tool control device 1238 controls the driving of the energy treatment tool 1212 for cauterizing tissue, incising, sealing blood vessels, or the like.

[0059] The light source device 1203, which supplies illumination light to the endoscope 1200 when photographing the surgical site, can be configured from a white light source composed of, for example, an LED, a laser light source, or a combination of these. The light source device 1203 can use the electronic component 100 described above, in which the element 110 is a light-emitting element. When the white light source is configured from a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, allowing the light source device 1203 to adjust the white balance of the captured image. In this case, it is also possible to time-share images corresponding to each RGB by irradiating the object of observation with laser light from each RGB laser light source and controlling the drive of the image sensor of the camera head 1202 in synchronization with the irradiation timing. This method makes it possible to obtain a color image without providing a color filter to the image sensor.

[0060] Furthermore, the light source device 1203 may be controlled to change the intensity of light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 1202 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and combining the images, it is possible to generate an image with a high dynamic range that is free of so-called blocked-up shadows and blown-out highlights.

[0061] The light source device 1203 may also be configured to supply light in a predetermined wavelength band corresponding to special light observation. Special light observation utilizes, for example, the wavelength dependency of light absorption in body tissue. Specifically, specific tissue, such as blood vessels on the surface of the mucous membrane, can be photographed with high contrast by irradiating light with a narrower band than the light (i.e., white light) used in normal observation. Alternatively, special light observation may involve fluorescence observation, in which an image is obtained using fluorescence generated by irradiating excitation light. Fluorescence observation can involve irradiating excitation light onto body tissue and observing the fluorescence from the body tissue, or locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 1203 may be configured to supply narrow band light and / or excitation light corresponding to such special light observation.

[0062] Eighth Embodiment A system according to the eighth embodiment will be described with reference to FIGS. 12(a) and 12(b). FIG. 12(a) illustrates glasses 1600 (smart glasses) that are the system according to this embodiment. The glasses 1600 include a photoelectric conversion device 1602. The photoelectric conversion device 1602 may use the aforementioned electronic component 100 (imaging device) in which the element 110 is a light-receiving element. A display device including a light-emitting device such as an OLED or LED may be provided on the rear surface of the lens 1601. When the light-emitting device uses an LED, the light-emitting device may use the aforementioned electronic component 100 in which the element 110 is a light-emitting element. The photoelectric conversion device 1602 may be one or more. A combination of multiple types of photoelectric conversion devices may also be used. The arrangement of the photoelectric conversion device 1602 is not limited to that shown in FIG. 12(a).

[0063] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the photoelectric conversion device 1602 and the display device. The control device 1603 also controls the operations of the photoelectric conversion device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light onto the photoelectric conversion device 1602.

[0064] FIG. 12(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 include a control device 1612, which includes a photoelectric conversion device corresponding to the photoelectric conversion device 1602 and a display device. A lens 1611 includes an optical system for projecting light emitted from the photoelectric conversion device and the display device, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the photoelectric conversion device and the display device, and controls the operation of the photoelectric conversion device and the display device. The control device may include a gaze detection unit for detecting the gaze of the wearer. Infrared light may be used for gaze detection. The infrared light emitter emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit with a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. A reduction unit for reducing light from the infrared light emitter to the display unit in a planar view reduces degradation of image quality.

[0065] The gaze of the user relative to the displayed image is detected from an image of the eyeball captured using infrared light. Any known method can be used for gaze detection using an image of the eyeball. As an example, a gaze detection method based on a Purkinje image formed by reflection of irradiated light on the cornea can be used.

[0066] More specifically, gaze detection processing is performed based on the pupil-corneal reflex method, which calculates a gaze vector representing the direction (rotation angle) of the eyeball based on the pupil image and Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0067] The display device of this embodiment may have a photoelectric conversion device having a light receiving element, and may control the image displayed on the display device based on information on the user's line of sight from the photoelectric conversion device.

[0068] Specifically, the display device determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. In the display area of the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0069] The display area may include a first display area and a second display area different from the first display area, and a high-priority area may be determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0070] Note that AI may be used to determine the first field of view area and areas with high priority. The AI may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from an image of the eyeball, using as training data an image of the eyeball and the direction in which the eyeball in the image was actually looking. The AI program may be included in the display device, the photoelectric conversion device, or an external device. If included in an external device, it is transmitted to the display device via communication.

[0071] When display control is performed based on visual recognition detection, the present invention is preferably applied to smart glasses that further include a photoelectric conversion device for capturing images of the outside world. The smart glasses can display captured external information in real time.

[0072] Ninth Embodiment The ninth embodiment will be described with reference to Figures 13(a) and 13(b). The above-described photoelectric conversion device and system may be applied to electronic devices such as so-called smartphones and tablets.

[0073] 13(a) and 13(b) are diagrams showing an example of an electronic device 1500 equipped with a photoelectric conversion device. Fig. 13(a) shows the front side of the electronic device 1500, and Fig. 13(b) shows the back side of the electronic device 1500.

[0074] 13(a), a display 1510 that displays an image is disposed in the center of the surface of electronic device 1500. Front cameras 1521 and 1522, an IR light source 1530 that emits infrared light, and a visible light source 1540 that emits visible light are disposed along the upper edge of the surface of electronic device 1500. The front cameras 1521 and 1522 may use the electronic component 100 described above in which the element 110 is a light-receiving element. The IR light source 1530 and the visible light source 1540 may use the electronic component 100 described above in which the element 110 is a light-emitting element.

[0075] 13(b), rear cameras 1551 and 1552, an IR light source 1560 that emits infrared light, and a visible light source 1570 that emits visible light are arranged along the upper side of the rear surface of electronic device 1500. Rear cameras 1551 and 1552 may use the above-described electronic component 100 in which element 110 is a light-receiving element. IR light source 1560 and visible light source 1570 may use the above-described electronic component 100 in which element 110 is a light-emitting element.

[0076] In the electronic device 1500 configured in this manner, by applying the above-described electronic component 100, it is possible to capture, for example, higher quality images. Note that the photoelectric conversion device can also be applied to other electronic devices such as infrared sensors, distance measuring sensors using active infrared light sources, security cameras, and personal or biometric authentication cameras. This can improve the accuracy and performance of these electronic devices.

[0077] Tenth Embodiment 14 is a block diagram of an X-ray CT device 300 according to the tenth embodiment. The electronic component 100 described above is applicable to the detector of the X-ray CT device 300. The X-ray CT device 300 according to this embodiment includes an X-ray generation unit 310, a wedge 316, a collimator 318, an X-ray detection unit 320, a top plate 330, a rotating frame 340, and a high-voltage generation device 350. The X-ray CT device 300 also includes a data acquisition system (DAS) 351, a signal processing unit 352, a display unit 353, and a control unit 354.

[0078] The X-ray generating unit 310 is composed of, for example, a vacuum tube that generates X-rays. A high voltage and a filament current are supplied to the vacuum tube of the X-ray generating unit 310 from a high voltage generator 350. X-rays are generated by irradiating the anode (target) with thermoelectrons from the cathode (filament).

[0079] The wedge 316 is a filter that adjusts the amount of X-rays irradiated from the X-ray generation unit 310. The wedge 316 attenuates the amount of X-rays so that the X-rays irradiated from the X-ray generation unit 310 to the subject have a predetermined distribution. The collimator 318 is made of a lead plate or the like that narrows the irradiation range of the X-rays that have passed through the wedge 316. The X-rays generated by the X-ray generation unit 310 are shaped into a cone beam via the collimator 318 and are irradiated onto the subject on the tabletop 330.

[0080] The X-ray detection unit 320 is configured using the aforementioned electronic component 100, in which the element 110 is a light receiving element. The X-ray detection unit 320 detects X-rays emitted from the X-ray generation unit 310 and passed through the subject, and outputs a signal corresponding to the X-ray dose to the DAS 351.

[0081] The rotating frame 340 has an annular shape and is configured to be rotatable. An X-ray generation unit 310 (wedge 316, collimator 318) and an X-ray detection unit 320 are arranged facing each other inside the rotating frame 340. The X-ray generation unit 310 and the X-ray detection unit 320 can rotate together with the rotating frame 340.

[0082] The high voltage generator 350 includes a booster circuit and outputs a high voltage to the X-ray generation unit 310. The DAS 351 includes an amplifier circuit and an A / D conversion circuit and outputs a signal from the X-ray detection unit 320 to the signal processing unit 352 as digital data.

[0083] The signal processing unit 352 includes a CPU (Central Processing Unit), ROM (Read Only Memory), and RAM (Random Access Memory), and is capable of performing image processing on digital data. The display unit 353 includes a flat display device and is capable of displaying X-ray images. The control unit 354 includes a CPU, ROM, RAM, and the like, and controls the overall operation of the X-ray CT device 300.

[0084] The disclosure of the present specification includes at least the following configurations. (Item 1) An electronic component including a substrate having a first surface, a circuit board having a second surface opposite to the first surface, and an optical member having a third surface opposite to the first surface, the first surface of the substrate has a central region in which a plurality of elements are disposed; the second surface of the circuit board is disposed on the first surface so as not to cover the central region; the third surface of the optical member is disposed above the central region so as to have a space between the first surface and the third surface, without the circuit board therebetween; An electronic component characterized by: (Item 2) 2. The electronic component according to item 1, wherein the circuit board is open at least above the central region. (Item 3) a first electrode disposed on the first surface of the substrate; a second electrode disposed on the second surface of the circuit board; and 3. The electronic component according to item 1 or 2, wherein the first electrode and the second electrode are electrically connected via a conductive member. (Item 4) a plurality of the second electrodes are arranged on the second surface of the circuit board; 4. The electronic component according to item 3, further comprising a plurality of third electrodes arranged on the surface opposite the second surface of the circuit board and conducting with the plurality of second electrodes. (Item 5) 5. The electronic component according to any one of items 1 to 4, wherein the optical member has a plurality of microlenses. (Item 6) 6. The electronic component according to item 5, wherein the plurality of microlenses are arranged in the same manner as the plurality of elements. (Item 7) 7. The electronic component according to item 6, wherein each of the plurality of microlenses is disposed at a position corresponding to each of the plurality of elements. (Item 8) 8. The electronic component according to any one of items 1 to 7, wherein the first surface of the substrate and the third surface of the optical member are bonded together with an adhesive. (Item 9) 9. The electronic component according to item 8, wherein the adhesive contains spacers of uniform size. (Item 10) 10. The electronic component according to item 8 or 9, wherein the adhesive is provided in at least four locations scattered in a peripheral region located around the central region of the substrate. (Item 11) Item 10. The electronic component according to item 8 or 9, characterized in that the adhesive is disposed in a first region having a longitudinal length in a direction along a first side of a quadrilateral peripheral region located around the central region of the substrate, and a second region having a longitudinal length in a direction along a second side located opposite the first side. (Item 12) 10. The electronic component according to item 8 or 9, characterized in that the adhesive is disposed in areas along each of the four sides of a quadrilateral peripheral region located around the central region of the substrate. (Item 13) 13. The electronic component according to any one of items 1 to 12, wherein the distance between the first surface of the substrate and the third surface of the optical member is 10 μm or more and 200 μm or less. (Item 14) 14. The electronic component according to any one of items 1 to 13, wherein there is a gap between the optical member and the circuit board. (Item 15) Item 15. The electronic component according to item 14, further comprising a resin that fills the gaps. (Item 16) 16. The electronic component according to any one of items 1 to 15, wherein the height of the optical member is equal to or less than the height of the circuit board. (Item 17) 17. The electronic component according to any one of items 1 to 16, wherein each of the plurality of elements is a light-receiving element. (Item 18) 17. The electronic component according to any one of items 1 to 16, wherein each of the plurality of elements is a light-emitting element. (Item 19) Item 17: The electronic component according to item 17; a signal processing unit that processes a signal output by the electronic component; A system comprising: (Item 20) a signal processing unit that processes signals; A display device that uses the electronic component according to item 18 to display information based on the signal processed by the signal processing unit; A system comprising: (Item 21) 18. A moving body comprising the electronic component according to item 17, characterized in that the moving body has a control unit that controls the movement of the moving body using a signal output by the electronic device.

[0085] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0086] 100: electronic component, 10: substrate, 20: circuit board, 30: optical member, 40: conductive member, 50: adhesive, 60: resin, 120: central region, 130: peripheral region

Claims

1. An electronic component including a substrate having a first surface, a circuit board having a second surface opposite to the first surface, and an optical member having a third surface opposite to the first surface, the first surface of the substrate has a central region in which a plurality of elements are disposed; the second surface of the circuit board is disposed on the first surface so as not to cover the central region; the third surface of the optical member is disposed above the central region so as to have a space between the first surface and the third surface, without the circuit board therebetween; An electronic component characterized by:

2. 2. The electronic component according to claim 1, wherein the circuit board is open at least above the central region.

3. a first electrode disposed on the first surface of the substrate; a second electrode disposed on the second surface of the circuit board; and 2. The electronic component according to claim 1, wherein the first electrode and the second electrode are electrically connected via a conductive member.

4. a plurality of second electrodes are arranged on the second surface of the circuit board; 4. The electronic component according to claim 3, further comprising a plurality of third electrodes disposed on the surface opposite to the second surface of the circuit board and electrically connected to the plurality of second electrodes.

5. 2. The electronic component according to claim 1, wherein the optical member has a plurality of microlenses.

6. 6. The electronic component according to claim 5, wherein the plurality of microlenses are arranged in the same manner as the plurality of elements.

7. 7. The electronic component according to claim 6, wherein each of the plurality of microlenses is disposed at a position corresponding to each of the plurality of elements.

8. 2. The electronic component according to claim 1, wherein the first surface of the substrate and the third surface of the optical member are bonded together with an adhesive.

9. 9. The electronic component according to claim 8, wherein the adhesive contains spacers of uniform size.

10. 9. The electronic component according to claim 8, wherein the adhesive is applied in at least four locations scattered in a peripheral region located around the central region of the substrate.

11. 9. The electronic component according to claim 8, wherein the adhesive is disposed in a first region having a longitudinal length along a first side of a quadrilateral peripheral region located around the central region of the substrate, and a second region having a longitudinal length along a second side located opposite the first side.

12. 9. The electronic component according to claim 8, wherein the adhesive is provided in areas along each of the four sides of a quadrilateral peripheral area located around the central area of the substrate.

13. 2. The electronic component according to claim 1, wherein the distance between the first surface of the substrate and the third surface of the optical member is 10 μm or more and 200 μm or less.

14. 2. The electronic component according to claim 1, wherein a gap is provided between the optical member and the circuit board.

15. The electronic component according to claim 14 , further comprising a resin that fills the gap.

16. 2. The electronic component according to claim 1, wherein the height of the optical member is equal to or less than the height of the circuit board.

17. 2. The electronic component according to claim 1, wherein each of the plurality of elements is a light-receiving element.

18. 2. The electronic component according to claim 1, wherein each of the plurality of elements is a light-emitting element.

19. The electronic component according to claim 17; a signal processing unit that processes a signal output by the electronic component; A system comprising:

20. a signal processing unit that processes signals; a display device that uses the electronic component according to claim 18 to display information based on the signal processed by the signal processing unit; A system comprising:

21. 18. A moving body comprising the electronic component according to claim 17, further comprising a control unit that controls movement of the moving body using a signal output by the electronic component.

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