Liquid jet head and liquid jet device

Abstract

To provide a liquid jet head which can be disassembled easily to enable reuse of unbroken and non-degraded components which are taken out therefrom, and to provide a liquid jet device.SOLUTION: A liquid jet head includes: a head chip 8 configured to jet a liquid in a first direction and having a flexible substrate 110; and a passage structure 200 disposed in a second direction opposite to the first direction. An upper surface 40a facing in the second direction of the head chip 8 has: a first passage connection part for connecting with a passage 402 in the passage structure 200 in a liquid-tight manner; a first opening 43 into which the flexible substrate is inserted; and a first wall 45 protruding in the second direction. At least a part of the first wall 45 is disposed between the first passage connection part and the first opening 43 when viewed in the first direction.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head that ejects liquid from nozzles and a liquid ejection apparatus equipped with the liquid ejection head, and more particularly to an ink jet recording head and an ink jet recording apparatus that ejects ink as the liquid. [Background technology]

[0002] 2. Description of the Related Art A liquid ejecting apparatus, typified by an ink jet recording apparatus such as an ink jet printer or a plotter, includes a liquid ejecting head capable of ejecting liquid such as ink stored in a cartridge or a tank as droplets.

[0003] A liquid jet head includes a head chip having a nozzle plate in which nozzles for jetting liquid are provided, and a flow path structure in which a plurality of head chips are connected to flow paths (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-39804 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when a part of a liquid jet head breaks down or deteriorates, it is desirable to remanufacture the liquid jet head by disassembling the liquid jet head and reusing the parts that are not broken or deteriorated. However, when disassembling the liquid jet head, there is a problem in that the parts to be reused may be damaged by liquid leaking from the flow path connection part between the head chip and the flow path structure. [Means for solving the problem]

[0006] An aspect of the present invention that solves the above problem is a liquid ejection head comprising a head chip that ejects liquid in a first direction and has a flexible substrate, and a flow path structure that is arranged in a second direction opposite to the first direction, wherein the top surface of the head chip facing the second direction has a first flow path connection portion for liquid-tight connection with a flow path in the flow path structure, a first opening into which the flexible substrate is inserted, and a first wall that protrudes in the second direction, and at least a portion of the first wall is arranged between the first flow path connection portion and the first opening when viewed in the first direction.

[0007] Another aspect of the present invention is a liquid ejection head comprising: a head chip that ejects liquid in a first direction and has a flexible substrate; and a flow path structure that is arranged in a second direction opposite to the first direction, wherein the flow path connection surface of the flow path structure facing the first direction has a second flow path connection portion that is liquid-tightly connected to a flow path in the head chip, a second opening into which the flexible substrate is inserted, and a second wall that protrudes in the first direction, and at least a portion of the second wall is arranged between the second flow path connection portion and the second opening when viewed in the second direction.

[0008] Another aspect of the present invention is a liquid ejection apparatus including the liquid ejection head according to the above aspect, and a liquid storage section that supplies liquid to the liquid ejection head. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a diagram showing a schematic configuration of a liquid ejecting apparatus according to a first embodiment. [Figure 2] 1 is an exploded perspective view of a liquid jet head according to a first embodiment. [Figure 3] 1 is a cross-sectional view of a liquid jet head according to a first embodiment. [Figure 4] 2 is an enlarged cross-sectional view of a main part of the liquid jet head according to the first embodiment. FIG. [Figure 5] FIG. 2 is an exploded perspective view of the head chip according to the first embodiment. [Figure 6]1 is a plan view of a main part of a head chip according to a first embodiment. [Figure 7] 1 is a cross-sectional view of a head chip according to a first embodiment. [Figure 8] FIG. 2 is a plan view of a head chip according to the first embodiment. [Figure 9] 1 is a cross-sectional view of a main part illustrating an exploded state of a liquid jet head according to a first embodiment. [Figure 10] 1 is a cross-sectional view of a main part illustrating an exploded state of a liquid jet head according to a first embodiment. [Figure 11] FIG. 10 is an enlarged cross-sectional view of a main part of a liquid jet head according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The present invention will be described in detail below based on embodiments. However, the following description illustrates one aspect of the present invention and can be modified as desired within the scope of the present invention. In each drawing, the same reference numerals indicate the same components, and their description will be omitted as appropriate. In each drawing, X, Y, and Z represent three spatial axes that are orthogonal to each other. In this specification, the directions along these axes are referred to as the X direction, Y direction, and Z direction. In each drawing, the direction indicated by the arrow is the positive (+) direction, and the direction opposite the arrow is the negative (-) direction. The Z direction indicates the vertical direction, the +Z direction indicates a vertically downward direction, and the -Z direction indicates a vertically upward direction. Furthermore, the directions of the three spatial axes, which are not limited to positive and negative directions, will be described as the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0011] (Embodiment 1) FIG. 1 is a diagram showing a schematic configuration of a liquid ejecting apparatus 1 of the present invention.

[0012] As shown in the figure, the liquid ejection device 1 is an inkjet recording device that ejects and impacts ink, a type of liquid, as droplets onto a medium S such as printing paper, and prints an image or the like by forming an array of dots on the medium S. The medium S can be made of any material, such as recording paper, resin film, or cloth.

[0013] The liquid ejecting device 1 includes a liquid ejecting head 2, a liquid storage section 3, a control unit 4 which is a control section, a transport mechanism 5 which feeds out the medium S, and a moving mechanism 6.

[0014] The liquid jet head 2 jets ink supplied from a liquid storage unit 3 as droplets from a plurality of nozzles onto the medium S. A detailed configuration of the liquid jet head 2 will be described later.

[0015] The liquid storage unit 3 stores the ink to be ejected from the liquid ejection head 2. Examples of the liquid storage unit 3 include a cartridge that is detachable from the liquid ejection device 1, a bag-shaped ink pack made of flexible film, and an ink tank that can be refilled with ink. Although not specifically shown, the liquid storage unit 3 may store multiple types of ink with different colors, ingredients, etc. individually. The liquid storage unit 3 may also be separated into a main tank and a sub-tank. The sub-tank may be connected to the liquid ejection head 2, and the liquid consumed when droplets are ejected from the liquid ejection head 2 may be replenished from the main tank to the sub-tank. The liquid may also be circulated between the liquid storage unit 3 and the liquid ejection head 2.

[0016] The control unit 4 includes, for example, a control device such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and a storage device such as a semiconductor memory. The control unit 4 also includes a power supply device that supplies power from an external power source such as a commercial power source to each element of the liquid ejection device 1. The control unit 4 is electrically connected to the liquid ejection head 2 via external wiring (not shown). The control unit 4 comprehensively controls each element of the liquid ejection device 1 by the control device executing a program stored in the storage device.

[0017] The transport mechanism 5 transports the medium S in the X-axis direction, and includes, for example, a transport roller 5a that is rotated by a transport motor that is driven under the control of the control unit 4.

[0018] The movement mechanism 6 is a mechanism for reciprocating the liquid jet head 2 in the Y-axis direction, and includes a holder 6a that holds the liquid jet head 2, and a conveyor belt 6b that is an endless belt that is stretched along the Y-axis direction. The control unit 4 controls the driving of a conveyor motor (not shown) to rotate the conveyor belt 6b, and moves the liquid jet head 2 reciprocally in the Y-axis direction together with the holder 6a fixed to the conveyor belt 6b.

[0019] The liquid jet head 2 performs a jetting operation of jetting ink supplied from the liquid storage section 3 as droplets in the +Z direction from each of the multiple nozzles 21 (see FIG. 3) under the control of the control unit 4. This jetting operation by the liquid jet head 2 is performed in parallel with the transport of the medium S by the transport mechanism 5 and the reciprocating movement of the liquid jet head 2 by the movement mechanism 6, thereby applying ink to the medium S, or so-called printing.

[0020] That is, in this embodiment, the +Z direction is an example of a "first direction," and the -Z direction is an example of a "second direction."

[0021] Fig. 2 is an exploded perspective view of the liquid jet head 2. Fig. 3 is a cross-sectional view of the liquid jet head 2. Fig. 4 is an enlarged view of the main part of Fig. 3. Note that the directions of the liquid jet head 2 will be described based on the directions when it is mounted on the liquid jet device 1, i.e., the X-axis direction, Y-axis direction, and Z-axis direction.

[0022] As shown in the figure, the liquid jet head 2 includes a plurality of head chips 8, a flow path structure 200 having a flow path 400, a relay substrate 220, and a cover 230.

[0023] The flow path structure 200 has a flow path 400 that supplies ink supplied from the liquid storage section 3 to the head chip 8. Note that the flow path structure 200 may be provided with a recovery flow path, separate from the flow path 400, that returns ink that has not been ejected from the nozzles 21 of the head chip 8 to the liquid storage section 3, thereby circulating ink between the liquid jet head 2 and the liquid storage section 3.

[0024] The flow path structure 200 comprises a first flow path member 201 having a first flow path 401, a second flow path member 202 having a second flow path 402, and a sealing member 203 that connects the first flow path 401 and the second flow path 402 in a liquid-tight state.

[0025] The first flow path member 201, the seal member 203, and the second flow path member 202 are stacked in this order in the +Z direction.

[0026] In this embodiment, the first flow path member 201 is configured by stacking three members 201a, 201b, and 201c in the Z-axis direction. The first flow path member 201 has a flow path connection portion 204 that is connected to a liquid storage portion 3 in which ink, which is a liquid, is stored. In this embodiment, the flow path connection portion 204 is provided on the -Z direction surface of the first flow path member 201 and protrudes in a cylindrical shape in the -Z direction. The flow path connection portion 204 is connected to the liquid storage portion 3 via a tube or the like (not shown). A first flow path 401 to which ink is supplied from the liquid storage portion 3 is provided inside such a flow path connection portion 204.

[0027] First flow path 401 is composed of a flow path extending in the Z-axis direction, a flow path extending along the interface between laminated members, etc. In addition, a liquid reservoir 401a having an inner diameter wider than other regions is provided midway along first flow path 401, and a filter 401b is provided within liquid reservoir 401a to capture foreign matter such as dust and air bubbles contained in the ink.

[0028] In this embodiment, one first flow path member 201 includes four flow path connecting portions 204 and four independent first flow paths 401. Note that the first flow path 401 may branch into two or more paths downstream of the filter 401b, for example.

[0029] The second flow path member 202 has second flow paths 402 that communicate with each of the first flow paths 401. That is, the second flow path member 202 has four second flow paths 402. The first flow paths 401 and the second flow paths 402 are liquid-tightly connected via a seal member 203. The seal member 203 is made of a material that is liquid-resistant to liquids such as ink used in the liquid jet head 2 and that is elastically deformable, such as rubber or elastomer. Such a seal member 203 is provided with a connecting flow path 403 that penetrates in the Z-axis direction, and the first flow paths 401 and the second flow paths 402 communicate with each other via the connecting flow path 403. That is, the flow path 400 of the flow path structure 200 includes the first flow path 401, the second flow path 402, and the connecting flow path 403.

[0030] The second flow path member 202 also has a storage portion 210 having a recessed shape that opens to a surface facing the +Z direction. The head chip 8 is stored in this storage portion 210. That is, the flow path structure 200 is disposed in the -Z direction of the head chip 8. In this embodiment, the liquid jet head 2 includes a plurality of head chips 8, for example, two head chips 8. The two head chips 8 are held in a single common storage portion 210. The number of head chips 8 held by the liquid jet head 2 is not particularly limited to this, and may be one, or two or more. The storage portion 210 may be provided independently for each head chip 8, or may be provided for each head chip group consisting of two or more head chips 8.

[0031] In this embodiment, the two head chips 8 are arranged side by side in the Y-axis direction so as to be at the same position in the X-axis direction. In this embodiment, the surface of the head chip 8 facing the -Z direction and the bottom surface of the accommodation section 210, i.e., the surface facing the +Z direction, are bonded with an adhesive (not shown). The head chip 8 and the flow path structure 200 may be fixed by screw fastening or the like. When the head chip 8 and the flow path structure 200 are fixed by screw fastening or the like, a seal member made of rubber, elastomer, or the like may be interposed between them to connect the inlet 44 and the second flow path 402 in a liquid-tight manner.

[0032] In this embodiment, the bottom surface of the accommodation section 210 that is bonded to the head chip 8 is referred to as the flow path connecting surface 211. Here, the "flow path connecting surface" of the flow path structure 200 refers to the surface at the height that has the largest surface area among the surfaces facing the +Z plane of the flow path structure 200 that have different heights in the Z axis direction. For example, the surface facing the +Z direction of the flow path structure 200 may have steps formed by recesses, protrusions, etc., but the "flow path connecting surface" refers to the surface facing the +Z direction at the part with the largest surface area among the surfaces that have different heights in the Z axis direction, including these recesses and protrusions.

[0033] The arrangement of the plurality of head chips 8 is not particularly limited to this.

[0034] Second flow paths 402 open to flow path connecting surface 211 of second flow path member 202. Inlet 44 of head chip 8 held in accommodating section 210 and second flow path 402 communicate with each other. That is, two second flow paths 402 are provided for one head chip 8, and the openings of these two second flow paths 402 in flow path connecting surface 211 are arranged side by side in the Y-axis direction.

[0035] The second flow path member 202 also has a first wiring insertion hole 205 penetrating through it in the Z-axis direction. One end of the first wiring insertion hole 205 is open to a surface of the second flow path member 202 facing the -Z direction, and the other end is open to a flow path connecting surface 211. A wiring member 110 of a head chip 8, which will be described in detail later, is inserted through the first wiring insertion hole 205. In this embodiment, one first wiring insertion hole 205 is provided for one head chip 8, and the opening of this one first wiring insertion hole 205 in the flow path connecting surface 211 is positioned between the openings of two second flow paths 402 aligned in the Y-axis direction.

[0036] In this embodiment, the opening edge portion of the second flow path 402 on the flow path connection surface 211 is an example of a "second flow path connection portion," and the opening of the first wiring insertion hole 205 on the flow path connection surface 211 is an example of a "second opening."

[0037] In addition, in the Z-axis direction, a relay substrate 220 to which the wiring members 110 of the plurality of head chips 8 are commonly connected is provided between the sealing member 203 and the first flow path member 201. The relay substrate 220 is made of a hard, rigid substrate with no flexibility, and wiring, electronic components, and the like (not shown) are mounted on the relay substrate 220. In the present embodiment, as an example of the electronic components, a connector 221 to which the wiring members 110 of the head chip 8 are connected and an external wiring connector 222 to which external wiring (not shown) provided outside the liquid jet head 2 is connected are illustrated. Print signals and the like for controlling the head chips 8 are input from the external wiring to the relay substrate 220 via the external wiring connector 222, and are supplied to each head chip 8 via the connector 221 and the wiring member 110 of the relay substrate 220. An external wiring opening 206 for inserting external wiring connected to the external wiring connector 222 is provided on a side wall of the flow path structure 200 facing the external wiring connector 222. The external wiring is connected to an external wiring connector 222 of a relay substrate 220 provided inside the flow path structure 200 through an external wiring opening 206 .

[0038] The relay substrate 220 also has a second wiring insertion hole 223 that penetrates in the Z-axis direction. The second wiring insertion hole 223 is disposed at a position that communicates with the first wiring insertion hole 205, that is, at a position that overlaps with the first wiring insertion hole 205 when viewed in the Z-axis direction. The wiring member 110 of the head chip 8 is led out to the surface of the relay substrate 220 facing the -Z direction through the first wiring insertion hole 205 and the second wiring insertion hole 223.

[0039] Furthermore, relay substrate 220 has protrusion insertion hole 224 penetrating in the Z-axis direction. Cylindrical protrusion 207 having second flow path 402 provided therein is provided on the surface facing the −Z direction of second flow path member 202 so as to protrude in the −Z direction. Protrusion 207 is inserted into relay substrate 220 in the −Z direction via protrusion insertion hole 224, and is connected to connection flow path 403.

[0040] A cover 230 is fixed to a surface of the flow path structure 200 facing the +Z direction. The cover 230 is made of a metal plate such as stainless steel, and is large enough to cover the accommodation portion 210 of the flow path structure 200. The cover 230 is a common member fixed to the surfaces of the two head chips 8 facing the +Z direction. The cover 230 is provided with an exposure opening 231 that exposes the nozzles 21 of the head chip 8 in the +Z direction, independently for each head chip 8. Ink is ejected in the +Z direction from the nozzles 21 exposed from the exposure opening 231.

[0041] FIG. 5 is an exploded perspective view of the head chip 8 according to one embodiment of the present invention. FIG. 6 is a plan view of the head chip 8 as viewed in the -Z direction. FIG. 7 is a cross-sectional view of the head chip 8 and the cover 230 taken along line AA' in FIG. 6. FIG. 8 is a plan view of the head chip 8. FIG. 9 is a cross-sectional view of a main part showing an exploded state of the liquid jet head 2 with the nozzle plate 20 facing in the +Z direction. FIG. 10 is a cross-sectional view of a main part showing an exploded state of the liquid jet head 2 with the nozzle plate 20 facing in the -Z direction. Note that the directions of the head chip 8 will be described based on the directions when the head chip 8 is mounted on the liquid jet head 2, i.e., the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0042] As shown in the figure, the head chip 8 of this embodiment comprises a pressure chamber substrate 10, a communicating plate 15, a nozzle plate 20 having a plurality of nozzles 21 formed therein, a protective substrate 30, a case member 40, a piezoelectric actuator 300, and a wiring member 110.

[0043] The pressure chamber substrate 10 is made of, for example, a silicon substrate. In the pressure chamber substrate 10, a plurality of pressure chambers 12 are arranged side by side along the X-axis direction. The plurality of pressure chambers 12 are arranged side by side along the X-axis direction so as to be at the same position in the Y-axis direction. Two pressure chambers 12 adjacent to each other in the X-axis direction are separated by a partition wall (not shown). In this embodiment, two pressure chamber rows in which the pressure chambers 12 are arranged side by side along the X-axis direction are provided in the Y-axis direction.

[0044] A communication plate 15 and a nozzle plate 20 are stacked in this order on the surface of the pressure chamber substrate 10 facing the +Z direction. A vibration plate 50 and a piezoelectric actuator 300 are stacked in this order on the surface of the pressure chamber substrate 10 facing the -Z direction.

[0045] The communicating plate 15 is made of a plate-like member bonded to the surface of the pressure chamber substrate 10 facing the +Z direction. The communicating plate 15 is provided with nozzle communicating passages 16 that communicate between the pressure chambers 12 and the nozzles 21. The communicating plate 15 is also provided with a first common liquid chamber section 17 and a second common liquid chamber section 18 that constitute a common liquid chamber 100 that communicates with a plurality of pressure chambers 12. The first common liquid chamber section 17 is provided by penetrating the communicating plate 15 in the Z-axis direction. The second common liquid chamber section 18 is provided by opening onto the surface facing the +Z direction without penetrating the communicating plate 15 in the Z-axis direction. Furthermore, the communicating plate 15 is provided with supply communicating passages 19 that communicate with one end of the pressure chambers 12 in the Y-axis direction, independently for each pressure chamber 12. The supply communication passage 19 communicates the second common liquid chamber portion 18 with the pressure chamber 12, and supplies ink in the common liquid chamber 100 to the pressure chamber 12. As such a communication plate 15, a silicon substrate or the like can be used.

[0046] The nozzle plate 20 is bonded to the surface of the communication plate 15 facing the +Z direction. Nozzles 21 are formed in the nozzle plate 20, which communicate with each pressure chamber 12 via nozzle communication passages 16. In this embodiment, the multiple nozzles 21 are arranged in a row along the X-axis direction. Also, in this embodiment, two nozzle rows, in which the nozzles 21 are arranged side by side along the X-axis direction, are provided spaced apart in the Y-axis direction.

[0047] The material of the nozzle plate 20 is not particularly limited, and for example, a silicon substrate or the like can be used.

[0048] The vibration plate 50 has, for example, an elastic film 51 made of silicon oxide provided on the pressure chamber substrate 10 side, and an insulating film 52 made of zirconium oxide provided on the surface of the elastic film 51 facing the -Z direction.

[0049] The piezoelectric actuator 300 includes a first electrode 60 sequentially stacked in the -Z direction on the diaphragm 50, a piezoelectric layer 70 formed using a piezoelectric material, for example, a composite oxide with a perovskite structure represented by the general formula ABO3, and a second electrode 80. Such a piezoelectric actuator 300 is also referred to as a piezoelectric element, and refers to a portion including the first electrode 60, the piezoelectric layer 70, and the second electrode 80. Furthermore, a portion of the piezoelectric layer 70 where piezoelectric strain occurs when a voltage is applied between the first electrode 60 and the second electrode 80 is referred to as an active portion 310. In contrast, a portion of the piezoelectric layer 70 where no piezoelectric strain occurs is referred to as an inactive portion. In other words, the active portion 310 refers to the portion of the piezoelectric layer 70 sandwiched between the first electrode 60 and the second electrode 80. In this embodiment, an active portion 310 is formed for each pressure chamber 12. In other words, the piezoelectric actuator 300 is formed with multiple active portions 310. The plurality of active portions 310 serve as driving elements that cause pressure changes in the ink within the pressure chambers 12. Generally, one of the electrodes of the active portions 310 is configured as an individual electrode that is independent for each active portion 310, and the other electrode is configured as a common electrode that is common to the plurality of active portions 310. In this embodiment, the first electrode 60 constitutes the individual electrode, and the second electrode 80 constitutes the common electrode.

[0050] Furthermore, lead electrodes 90, which are lead wiring, are drawn out from each electrode of the piezoelectric actuator 300. A wiring member 110 made of a flexible substrate is connected to the end of the lead electrode 90 opposite to the end connected to the piezoelectric actuator 300. The wiring member 110 is mounted with a drive circuit 111 having a plurality of switching elements that select whether or not to supply a drive signal (COM) for driving each active portion 310 to each active portion 310. In other words, the wiring member 110 in this embodiment is a COF (Chip On Film). Note that the wiring member 110 does not necessarily have to be provided with the drive circuit 111. In other words, the wiring member 110 may be an FFC (Flexible Flat Cable), an FPC (Flexible Printed Circuits), or the like.

[0051] As shown in FIG. 7 , a protection substrate 30 having approximately the same size as the pressure chamber substrate 10 is bonded to the surface of the pressure chamber substrate 10 facing the −Z direction. The protection substrate 30 has accommodation sections 31, which are spaces for protecting the piezoelectric actuators 300. The accommodation sections 31 are provided independently for each row of piezoelectric actuators 300 arranged side by side in the X-axis direction, with two accommodation sections 31 formed side by side in the Y-axis direction. The protection substrate 30 also has a through hole 32 penetrating in the Z-axis direction between the two accommodation sections 31 arranged side by side in the Y-axis direction. Ends of lead electrodes 90 drawn from each electrode of the piezoelectric actuators 300 extend so as to be exposed within the through hole 32, and the lead electrodes 90 and wiring members 110 are electrically connected within the through hole 32. Such a protection substrate 30 may be made of, for example, a silicon substrate.

[0052] In addition, a case member 40 that defines a common liquid chamber 100 that communicates with the multiple pressure chambers 12 is fixed on the protective substrate 30. The case member 40 has substantially the same shape as the above-mentioned communicating plate 15 in a plan view, and is bonded to the protective substrate 30 as well as to the above-mentioned communicating plate 15.

[0053] Such a case member 40 has a recess 41 on the protective substrate 30 side that is deep enough to accommodate the pressure chamber substrate 10 and the protective substrate 30. This recess 41 has an opening area that is larger than the surface of the protective substrate 30 that is bonded to the pressure chamber substrate 10. Then, with the pressure chamber substrate 10 and the protective substrate 30 accommodated in the recess 41, the opening surface of the recess 41 on the nozzle plate 20 side is sealed by the communicating plate 15.

[0054] The case member 40 is also provided with a third common liquid chamber 42 that communicates with the first common liquid chamber 17 of the communication plate 15. The first common liquid chamber 17 and second common liquid chamber 18 provided in the communication plate 15 and the third common liquid chamber 42 provided in the case member 40 constitute a common liquid chamber 100 of this embodiment. A total of two common liquid chambers 100 are provided, one for each row of pressure chambers 12. Each common liquid chamber 100 is provided continuously along the X-axis direction in which the pressure chambers 12 are arranged side by side, and the supply communication paths 19 that connect each pressure chamber 12 to the common liquid chamber 100 are arranged side by side in the X-axis direction. The case member 40 is also provided with an inlet 44 that communicates with the common liquid chamber 100 and supplies ink to each common liquid chamber 100. The inlet 44 is provided to open on the surface of the case member 40 facing the -Z direction. A total of two inlet ports 44 are arranged in the case member 40. Each inlet port 44 is arranged at a position communicating with the center of the common liquid chamber 100 in the X-axis direction, which is the longitudinal direction. The two inlet ports 44 are arranged side by side in the Y-axis direction, which is the direction in which the common liquid chambers 100 are arranged side by side. The case member 40 is also provided with a connection port 43 that communicates with the through-hole 32 of the protective substrate 30 and through which the wiring member 110 is inserted. The connection port 43 is opened on the surface of the case member 40 facing the +Z direction. The connection port 43 is also arranged between the two inlet ports 44 in the Y-axis direction. The connection port 43 has an elongated opening shape extending along the X-axis direction as viewed in the +Z direction. The wiring member 110 of the head chip 8 is led out through the connection port 43 to the surface of the liquid jet head 2 facing the -Z direction. The case member 40 is made of a material such as a metal material, a resin material, or the like.

[0055] In this embodiment, as will be described in more detail later, the surface of the case member 40 facing the -Z direction is an example of the "top surface," the opening edge of the inlet 44 on the top surface of the case member 40 is an example of the "first flow path connection portion," and the opening of the connection port 43 on the top surface of the case member 40 is an example of the "first opening."

[0056] Furthermore, a compliance substrate 47 is provided on the surface of the communicating plate 15 on the +Z direction side where the first common liquid chamber portion 17 and the second common liquid chamber portion 18 open. This compliance substrate 47 seals the openings of the first common liquid chamber portion 17 and the second common liquid chamber portion 18 on the ejection surface 20a side. In this embodiment, the compliance substrate 47 includes a sealing film 47a made of a flexible thin film, and a fixed substrate 47b made of a hard material such as metal. The area of the fixed substrate 47b facing the common liquid chamber 100 is an opening 48 that is completely removed in the thickness direction, and therefore one side of the common liquid chamber 100 forms a compliance portion 49 that is a flexible portion sealed only by the flexible sealing film 47a.

[0057] A cover 230 is bonded to the surface of the compliance substrate 47 facing the +Z direction. That is, the cover 230 is bonded to the fixed substrate 47b so as to cover the opening 48. That is, the fixed substrate 47b defines a compliance space inside the opening 48 in which the compliance portion 49 can bend and deform. The space between the cover 230 and the sealing film 47a is open to the atmosphere, allowing the compliance portion 49 of the sealing film 47a to deform in response to the pressure of the ink in the common liquid chamber 100.

[0058] In such a liquid jet head 2, liquid is supplied from the flow path connection portion 204 connected to the liquid storage portion 3, and the interior is filled with the liquid supplied via the flow path 400 from the common liquid chamber 100 to the nozzles 21. Then, a voltage is applied to each active portion 310 corresponding to each pressure chamber 12 in accordance with a recording signal from the drive circuit 111. This causes the diaphragm 50 to flex and deform together with the active portion 310, increasing the pressure of the liquid in each pressure chamber 12 and causing droplets to be ejected from each nozzle 21.

[0059] An upper surface of such head chip 8 facing the -Z direction, in this embodiment, an upper surface 40a of case member 40 facing the -Z direction, has a first wall 45 protruding in the -Z direction.

[0060] Here, the "top surface" of head chip 8 refers to the surface at the height with the largest surface area among multiple surfaces of different heights in the Z-axis direction on the surface facing the -Z direction of the component located furthest in the -Z direction of head chip 8. For example, the surface facing the -Z direction of case component 40, which is the component located furthest in the -Z direction of head chip 8, may have steps formed by recesses, protrusions, etc., but the "top surface" refers to the surface facing the -Z direction of the portion with the largest surface area among the surfaces of different heights in the Z-axis direction, including these recesses and protrusions. In this embodiment, the surface facing the -Z direction of case component 40 is formed as a flat surface without steps, and this surface is top surface 40a.

[0061] As described above, two inlets 44 and one connection port 43 are formed on the upper surface 40a of the case member 40. The connection port 43 is disposed between the two inlets 44 aligned in the Y-axis direction as viewed in the Z-axis direction. At least a portion of the first wall 45 is disposed between the connection port 43 and each inlet 44 as viewed in the +Z direction. In this embodiment, the first wall 45 is a surrounding wall that is provided continuously around the periphery of the opening of the connection port 43 as viewed in the +Z direction and surrounds the connection port 43. Note that the first wall 45 only needs to be provided at least between the opening of the connection port 43 and the opening of each inlet 44 as viewed in the +Z direction. In other words, the first wall 45 only needs to be provided between the opening of the connection port 43 and the opening of each inlet 44 with a width equal to or greater than the width of the opening of each inlet 44 as viewed in the +Z direction.

[0062] The first end 45a, which is the end of the first wall 45 in the -Z direction, is preferably located further in the -Z direction than the inlet 44. In this embodiment, the inlet 44 opens to the upper surface 40a, and therefore the first end 45a in the -Z direction of the first wall 45 is located further in the -Z direction than the inlet 44.

[0063] By providing the first wall 45 in this way, as shown in FIG. 9, when the liquid injection head 2 is disassembled into the flow path structure 200 and the head chip 8 with the injection surface 20a of the nozzle plate 20 facing vertically downward, i.e., in the +Z direction, even if the liquid 500 leaking from the second flow path 402 or the inlet 44 adheres to the upper surface 40a, it is possible to suppress the liquid 500 adhering to the upper surface 40a from overcoming the first wall 45 and entering the inside of the head chip 8 through the connection port 43. Therefore, it is possible to suppress the occurrence of electrical problems such as the liquid 500 that has entered the connection port 43 adhering to the connection portion between the wiring member 110 and the lead electrode 90 and causing a short circuit between the wirings.

[0064] As shown in FIG. 8, in the +Z direction view, regarding the arrangement direction of a part of the first wall 45 sandwiched between the opening of the inlet 44 and the opening of the connection port 43, and the opening of the connection port 43, it is preferable that the distance L1 between a part of the first wall 45 and the opening of the connection port 43 is shorter than the distance L2 between a part of the first wall 45 and the opening of the inlet 44. That is, it is preferable that the distance L1 and the distance L2 satisfy the relationship L1 < L2. In particular, it is preferable that the distance L1 is 0 (zero). In this embodiment, since the side surface of the first wall 45 is formed flush with the inner surface of the connection port 43, the distance L1 is 0 (zero).

[0065] In this way, by making the distance L1 between a part of the first wall 45 and the connection port 43 shorter than the distance L2 between a part of the first wall 45 and the inlet 44, as shown in FIG. 9, when the flow path structure 200 and the head chip 8 are disassembled, the liquid 500 leaking from the inlet 44 or the second flow path 402 is made to adhere between the first wall 45 and the inlet 44 on the upper surface 40a of the case member 40, and the first wall 45 can suppress the intrusion of the liquid 500 adhering to the upper surface 40a into the connection port 43. In particular, by making the distance L1 0 (zero), it is possible to eliminate the region of the upper surface 40a where the liquid 500 adheres between the first wall 45 and the connection port 43, and the first wall 45 can suppress the intrusion of the liquid 500 into the connection port 43.

[0066] 4, the flow path connecting surface 211 of the second flow path member 202 has a second wall 212 that protrudes in the +Z direction. The second wall 212 protruding in the +Z direction beyond the flow path connecting surface 211 means that a second end 212a, which is the end of the second wall 212 in the +Z direction, is located further in the +Z direction than the flow path connecting surface 211.

[0067] Furthermore, the second wall 212 is disposed at least between the opening of the second flow path 402 in the flow path connecting surface 211 and the opening of the first wiring insertion hole 205, as viewed in the -Z direction. In this embodiment, the second wall 212 is a surrounding wall provided continuously around the periphery of the opening of the first wiring insertion hole 205, as viewed in the -Z direction, so as to surround the first wiring insertion hole 205. Note that it is sufficient that the second wall 212 is provided at least between the opening of the second flow path 402 and the opening of the first wiring insertion hole 205, as viewed in the -Z direction. In other words, it is sufficient that the second wall 212 is provided between the opening of the second flow path 402 and the opening of the first wiring insertion hole 205, with a width equal to or greater than the width of the opening of the second flow path 402, as viewed in the -Z direction.

[0068] Furthermore, it is preferable that the second end 212a in the +Z direction of the second wall 212 is located further in the +Z direction than the opening of the second flow path 402 in the flow path connecting surface 211. In this embodiment, the second flow path 402 opens to the flow path connecting surface 211, and therefore the second end 212a in the -Z direction of the second wall 212 is located further in the +Z direction than the opening of the second flow path 402 in the flow path connecting surface 211.

[0069] 10 , when the liquid jet head 2 is disassembled into the flow path structure 200 and the head chip 8 with the ejection surface 20a of the nozzle plate 20 facing vertically upward, i.e., facing the −Z direction, even if the liquid 500 leaking from the second flow path 402 or the inlet 44 adheres to the flow path connecting surface 211, it is possible to prevent the liquid 500 adhering to the flow path connecting surface 211 from climbing over the second wall 212 and entering the inside of the flow path structure 200 through the first wiring insertion hole 205. Therefore, it is possible to prevent the liquid 500 that has entered through the first wiring insertion hole 205 from adhering to the connection portion between the wiring member 110 and the relay substrate 220, or to wiring or electronic components (not shown) of the relay substrate 220, and thereby preventing electrical malfunctions such as short-circuiting between wiring. Therefore, the liquid jet head 2 can be easily disassembled while preventing the liquid leaking when the flow path is disconnected from entering the head chip 8 and the flow path structure 200, and therefore, for example, a defective head chip 8 can be easily replaced. Therefore, by replacing only the defective parts of the liquid jet head 2, that is, either one or both of the head chips 8 or the flow path structure 200, it is possible to extend the life of the liquid jet head 2 and to reuse parts that are not defective.

[0070] Furthermore, in this embodiment, by providing a first wall 45 on the head chip 8 and a second wall 212 on the flow path structure 200, regardless of the posture in which the liquid ejection head 2 is disassembled, it is possible to prevent liquid leaking from the flow paths that are disconnected when the liquid ejection head 2 is disassembled from entering the head chip 8 and the flow path structure 200, thereby preventing electrical malfunctions caused by the intruding liquid.

[0071] Note that, when viewed in the -Z direction, with respect to the arrangement direction of a part of the second wall 212 sandwiched between the opening of the second flow path 402 and the opening of the first wiring insertion hole 205, and the opening of the second flow path 402, the distance L3 between a part of the second wall 212 and the opening of the first wiring insertion hole 205 is preferably shorter than the distance L4 between a part of the second wall 212 and the opening of the second flow path 402. That is, it is preferable that the distance L3 and the distance L4 satisfy the relationship L3 < L4 (see FIG. 4). In particular, the distance L3 is preferably 0 (zero). In the present embodiment, since the side surface of the second wall 212 is formed flush with the inner surface of the first wiring insertion hole 205, the distance L3 is 0 (zero).

[0072] Thus, by making the distance L3 between a part of the second wall 212 and the opening of the first wiring insertion hole 205 shorter than the distance L4 between a part of the second wall 212 and the opening of the second flow path 402, as shown in FIG. 10, when the flow path structure 200 and the head chip 8 are disassembled, the liquid 500 leaking from the inlet 44 or the second flow path 402 is attached between the second wall 212 and the second flow path 402 on the flow path connection surface 211 of the flow path structure 200, and the intrusion of the liquid 500 attached to the flow path connection surface 211 into the first wiring insertion hole 205 can be suppressed by the second wall 212. In particular, by making the distance L3 0 (zero), the region of the flow path connection surface 211 where the liquid 500 adheres between the second wall 212 and the first wiring insertion hole 205 can be eliminated, and the intrusion of the liquid 500 into the first wiring insertion hole 205 can be suppressed by the second wall 212.

[0073] Note that the second wall 212 is arranged inside the first wall 45, that is, at a position closer to the wiring member 110 than the first wall 45, when viewed in the Z-axis direction. For this reason, a first recess 213 into which the first wall 45 is inserted is formed in the flow path connection surface 211. The depth of the first recess 213 in the -Z direction from the flow path connection surface 211 is deeper than the height in the +Z direction from the upper surface 40a of the first wall 45. For this reason, when the first wall 45 is inserted into the first recess 213, it is possible to suppress the first end portion 45a of the first wall 45 from contacting the surface facing the +Z direction of the first recess 213.

[0074] Furthermore, the second end 212a of the second wall 212 in the +Z direction is located further in the +Z direction than the first end 45a of the first wall 45 in the -Z direction. That is, the first wall 45 and the second wall 212 are arranged so as to overlap when viewed in a direction perpendicular to the +Z direction, for example, the Y-axis direction. In this way, by having the second end 212a of the second wall 212 located further in the +Z direction than the first end 45a of the first wall 45, even if liquid splashes in the -Z direction immediately after the connection between the second flow path 402 and the inlet 44 is released, the second wall 212 can prevent the splashed liquid from entering the connection port 43. Incidentally, as long as the second end 212a of the second wall 212 is positioned in the +Z direction relative to the first end 45a of the first wall 45, even if the first end 45a of the first wall 45 is not positioned in the -Z direction relative to the opening of the inlet 44 on the upper surface 40a, the second wall 212 can prevent liquid splashed in the -Z direction from entering the connection port 43. Of course, the same applies to the position shown in FIG.

[0075] Furthermore, in the +Z direction, the distance La between the first end 45a of the first wall 45 and the second end 212a of the second wall 212 is preferably longer than at least one of the distance Lb between the upper surface 40a and the leading edge of the inlet 44 in the -Z direction, i.e., the opening of the inlet 44 on the upper surface 40a, and the distance Lc between the flow path connecting surface 211 and the leading edge of the flow path connecting surface 211 in the +Z direction, i.e., the opening of the second flow path 402 on the flow path connecting surface 211. More preferably, the distance La is longer than both the distance Lb and the distance Lb. In this embodiment, the distance Lb and the distance Lc are both 0 (zero), and the distance La is longer than both the distance Lb and the distance Lc. In this way, by making the distance La longer than at least one of the distance Lb and the distance Lb, the first wall 45 and the second wall 212 serve as guides for each other when the head chip 8 is moved relative to the flow path structure 200 in the +Z direction to disconnect the flow paths from each other. Therefore, while the flow path structure 200 and the head chip 8 are being disassembled, the connection port 43 and the first wiring insertion hole 205 can be prevented from being positioned directly below the inlet port 44 and the second flow path 402, thereby preventing liquid leaking from the inlet port 44 and the second flow path 402 from directly entering the connection port 43 and the first wiring insertion hole 205 without falling onto the upper surface 40a and the flow path connection surface 211.

[0076] In this embodiment, either one of the two head chips 8 is an example of the "other head chip," the inlet 44 of the other head chip is an example of the "other flow path connection portion," the first wiring insertion hole 205 of the other head chip is an example of the "other opening," and the first wall is an example of the "other wall."

[0077] (Embodiment 2) 11 is a cross-sectional view of a main part of a liquid jet head 2 according to a second embodiment of the present invention. Note that the same components as those in the above-described embodiment are given the same reference numerals, and redundant explanations will be omitted. In this embodiment, the +Z direction is an example of the "first direction," and the -Z direction is an example of the "second direction."

[0078] In the first embodiment described above, the second wall 212 is provided inside the first wall 45, but in this embodiment, the second wall 212 is provided outside the first wall 45.

[0079] 11, head chip 8 has a first wall 45 that protrudes in the -Z direction from upper surface 40a, and a second recess 40b that has a recessed shape that opens to upper surface 40a. Second recess 40b is disposed on the outer side of first wall 45. In this embodiment, the inner surface of second recess 40b and the side surface of first wall 45 are provided so as to be flush with each other.

[0080] The flow path structure 200 also has a second wall 212 that protrudes in the +Z direction from the flow path connecting surface 211. The second wall 212 is disposed outside the first wall 45 when viewed in the Z-axis direction, and a second end 212a of the second wall 212 is inserted into the second recess 40b. As a result, in the +Z direction, the distance La between the first end 45a of the first wall 45 and the second end 212a of the second wall 212 can be longer than both the distance Lb between the upper surface 40a and the end of the inlet 44 in the -Z direction, i.e., the opening of the inlet 44 on the upper surface 40a, and the distance Lc between the flow path connecting surface 211 and the end of the flow path connecting surface 211 in the +Z direction, i.e., the opening of the second flow path 402 on the flow path connecting surface 211.

[0081] Even with this configuration, as in the above-described embodiment 1, when the flow path structure 200 and the head chip 8 are disassembled, even if liquid leaking to the outside from the second flow path 402 and the inlet 44 adheres to the upper surface 40a and the flow path connection surface 211, the liquid adhering thereto is prevented from climbing over the first wall 45 and the second wall 212 and entering the connection port 43 and the first wiring insertion hole 205, thereby preventing electrical malfunctions caused by liquid entering the inside of the head chip 8 and the flow path structure 200.

[0082] (Other embodiments) Although the embodiments of the present invention have been described above, the basic configuration of the present invention is not limited to those described above.

[0083] For example, in each of the above-described embodiments, the first wall 45 is provided on the head chip 8, and the second wall 212 is provided on the flow path structure 200. However, this is not particularly limited, and only one of them may be provided. In other words, if the orientation of the liquid jet head 2 when disassembled is such that the liquid jet direction is vertically downward, i.e., the +Z direction, only the first wall 45 needs to be provided. Also, if the liquid jet direction is vertically upward, i.e., the -Z direction, only the second wall 212 needs to be provided. However, by providing both the first wall 45 and the second wall 212 as described above, the orientation of the liquid jet head 2 when disassembled is not limited, and adhesion of liquid to the electrical connection portion can be suppressed.

[0084] Furthermore, in each of the above-described embodiments, the inlet 44 is configured to open on the upper surface 40a, but this is not particularly limited, and the inlet 44 may open at the tip of a first flow path connecting portion that cylindrically protrudes from the upper surface 40a in the -Z direction. Similarly, the second flow path 402 is not limited to a configuration in which it opens on the flow path connecting surface 211, and the second flow path 402 may open at the tip of a second flow path connecting portion that cylindrically protrudes from the flow path connecting surface 211 in the +Z direction. Either one of the first flow path connecting portion and the second flow path connecting portion that cylindrically protrude may be provided, or both may be provided.

[0085] In addition, in each of the above-described embodiments, the second flow path member 202 constituting the flow path structure 200 is illustrated as having the second flow path 402, but the present invention is not particularly limited thereto. For example, the second flow path member 202 may be a member that holds a plurality of head chips 8 but does not have a flow path formed therein. That is, the first flow path 401 of the first flow path member 201 and the inlet 44 of the head chip 8 may be connected without the second flow path member 202. That is, a portion of the first flow path member 201 may be inserted through the second flow path member 202 to connect to the flow path of the head chip 8, or a portion of the head chip 8 may be inserted through the second flow path member 202 to connect to the flow path of the first flow path member 201. Of course, the flow paths of the first flow path member 201 and the head chip 8 may be connected to each other via a member other than the first flow path member 201 and the second flow path member 202.

[0086] In addition, in the above-described embodiments, the thin-film piezoelectric actuator 300 is used as the driving element for generating a pressure change in the pressure chamber 12. However, the present invention is not limited to this, and the driving element can be, for example, a thick-film piezoelectric actuator formed by attaching a green sheet or the like, or a longitudinal vibration type piezoelectric actuator in which piezoelectric material and electrode forming material are alternately laminated and expanded and contracted in the axial direction. In addition, the driving element can be, for example, an actuator in which a heating element is disposed in the pressure chamber 12 and droplets are ejected from the nozzle 21 by bubbles generated by the heat generated by the heating element, or a so-called electrostatic actuator in which static electricity is generated between a vibration plate and an electrode and the electrostatic force deforms the vibration plate to eject droplets from the nozzle 21.

[0087] Furthermore, the present invention is broadly applicable to liquid ejection devices in general that include a liquid ejection head. Examples of liquid ejection heads include various inkjet recording heads used in image recording devices such as printers, and colorant ejection heads used in manufacturing color filters for liquid crystal displays and the like. Examples of liquid ejection heads include electrode material ejection heads used in forming electrodes for organic EL displays, FEDs (field emission displays), and the like, and bioorganic material ejection heads used in biochip manufacturing, and the present invention can also be applied to liquid ejection devices that include these liquid ejection heads.

[0088] (Addendum) From the above-described exemplary embodiments, the following configurations can be understood, for example.

[0089] A liquid jet head according to a first preferred aspect includes a head chip that ejects liquid in a first direction and has a flexible substrate, and a flow path structure that is arranged in a second direction opposite to the first direction, wherein an upper surface of the head chip facing the second direction has a first flow path connection portion for liquid-tight connection with a flow path in the flow path structure, a first opening into which the flexible substrate is inserted, and a first wall that protrudes in the second direction, and at least a portion of the first wall is arranged between the first flow path connection portion and the first opening as viewed in the first direction. This makes it possible to prevent liquid leaking from the flow path connection portion from entering the first opening when the flow path connection between the head chip and the flow path structure is released. This makes it possible to prevent electrical malfunctions caused by liquid entering through the first opening.

[0090] In Aspect 2, which is a specific example of Aspect 1, the first end of the first wall in the second direction is located further in the second direction than the first flow path connecting portion. With this, since the first end is located further in the second direction than the first flow path connecting portion, it is difficult for liquid leaking from the flow path connecting portion to climb over the first wall, and therefore it is possible to prevent the liquid from entering the first opening.

[0091] In Aspect 3, which is a specific example of Aspect 1, the first wall is a surrounding wall that surrounds the first opening when viewed in the first direction. This allows the first wall, which is a surrounding wall, to prevent liquid from entering the first opening.

[0092] In Aspect 4, which is a specific example of Aspect 1, in the direction of arrangement of the first flow path connecting portion, the at least one portion of the first wall, and the first opening when viewed in the first direction, the distance between the at least one portion of the first wall and the first opening is shorter than the distance between the at least one portion of the first wall and the first flow path connecting portion. This reduces the area on the upper surface between the first wall and the first opening, thereby preventing liquid leaking from the flow path connecting portion from adhering to this area and preventing liquid adhering to this area from entering the first opening.

[0093] In Aspect 5, which is a specific example of Aspect 1, the flow path connection surface of the flow path structure facing the first direction has a second flow path connection portion that is fluid-tightly fluid-connected to the first flow path connection portion, a second opening into which the flexible substrate is inserted, and a second wall that protrudes in the first direction, and at least a portion of the second wall is disposed between the second flow path connection portion and the second opening as viewed in the second direction. This allows the second wall to prevent liquid leaking from the flow path connection portion from entering the second opening, even when the liquid jet head is disassembled with the head chip disposed vertically below the flow path structure. Therefore, regardless of whether the head chip is positioned vertically above or below the flow path structure, liquid can be prevented from entering the first opening and the second opening.

[0094] In Aspect 6, which is a specific example of Aspect 5, the second end of the second wall in the first direction is located further in the first direction than the first end of the first wall in the second direction. This effectively prevents the liquid from entering the first opening even if the liquid splashes in the second direction immediately after the channel connection portion is released.

[0095] In Aspect 7, which is a specific example of Aspect 6, the distance between the first end and the second end in the first direction is longer than at least one of the distance from the upper surface to the tip of the first flow path connecting portion in the second direction and the distance from the flow path connecting surface to the tip of the second flow path connecting portion in the first direction. This allows the first wall and the second wall to act as guides for each other when the flow path structure and the head chip are disassembled, making it easy to move them in a straight line along the first or second direction. This prevents the first opening or the second opening from being positioned directly below the flow path connecting portion during disassembly of the head chip and the flow path structure, thereby preventing liquid leaking from the flow path connecting portion from directly falling onto the first or second opening.

[0096] In Aspect 8, which is a specific example of Aspect 1, the other head chip ejects liquid in the first direction and has another flexible substrate, and the other top surface of the other head chip facing the second direction has another flow path connection portion for liquid-tight connection with a flow path in the flow path structure, another opening into which the other flexible substrate is inserted, and another wall protruding in the second direction, at least a portion of the other wall being disposed between the other flow path connection portion and the other opening as viewed in the first direction. This allows the other wall to prevent liquid leaking from the flow path connection portion from entering the first opening, even between the other head chip and the flow path structure.

[0097] A liquid jet head according to a ninth preferred aspect includes a head chip that ejects liquid in a first direction and has a flexible substrate, and a flow path structure that is arranged in a second direction opposite to the first direction, wherein a flow path connection surface of the flow path structure facing the first direction has a second flow path connection portion that is liquid-tightly connected to a flow path in the head chip, a second opening into which the flexible substrate is inserted, and a second wall that protrudes in the first direction, and at least a portion of the second wall is arranged between the second flow path connection portion and the second opening as viewed in the second direction. This makes it possible to prevent liquid leaking from the flow path connection portion from entering the second opening when the flow path connection between the head chip and the flow path structure is released. This makes it possible to prevent electrical malfunctions caused by liquid entering through the second opening.

[0098] In Aspect 10, which is a specific example of Aspect 9, the second end of the second wall in the first direction is located further in the first direction than the second flow path connecting portion. With this, since the second end is located further in the first direction than the second flow path connecting portion, liquid leaking from the flow path connecting portion is less likely to climb over the second wall, and the liquid can be prevented from entering the second opening.

[0099] In Aspect 11, which is a specific example of Aspect 9, the second wall is a surrounding wall that surrounds the second opening when viewed in the second direction. This makes it possible to prevent liquid from entering the second opening by the second wall serving as a surrounding wall.

[0100] A liquid ejection device according to Aspect 12, which is a preferred aspect, includes the liquid ejection head according to any one of Aspects 1 to 11, and a liquid storage unit that supplies liquid to the liquid ejection head. This makes it possible to realize a liquid ejection device that can easily disassemble the liquid ejection head and extend the life of the liquid ejection head. [Explanation of symbols]

[0101] S...medium, 1...liquid ejection device, 2...liquid ejection head, 3...liquid storage section, 4...control unit, 5...transport mechanism, 6...movement mechanism, 8...head chip, 10...pressure chamber substrate, 12...pressure chamber, 15...communication plate, 16...nozzle communication path, 17...first common liquid chamber section, 18...second common liquid chamber section, 19...supply communication path, 20...nozzle plate, 20a...ejection surface, 21...nozzle, 30...protective substrate, 31...accommodation section, 32...through hole, 40...case member, 40a...top surface, 40b...second recess, 41...recess, 42...third common liquid chamber section, 43...connection port, 44...inlet port, 45...first wall, 45a...first end, 47...compliance substrate, 49...compliance section, 50...vibration plate, 60...first electrode, 70...piezoelectric layer, 80...second electrode , 90...lead electrode, 100...common liquid chamber, 110...wiring member, 111...drive circuit, 200...flow path structure, 201...first flow path member, 202...second flow path member, 203...sealing member, 204...flow path connecting portion, 205...first wiring insertion hole, 206...opening for external wiring, 207...protrusion, 210...accommodating portion, 211...flow path connecting surface, 212...second wall, 212a...second end, 213...first recess, 220...relay board, 221...connector, 222...external wiring connector, 223...second wiring insertion hole, 224...protrusion insertion hole, 230...cover, 231...exposure opening, 300...piezoelectric actuator, 310...active portion, 400...flow path, 401...first flow path, 402...second flow path, 403...connecting flow path, 500...liquid.

Claims

1. a head chip that ejects liquid in a first direction and has a flexible substrate; a flow path structure disposed in a second direction opposite to the first direction; Equipped with an upper surface of the head chip facing the second direction has a first flow path connecting portion for liquid-tight connection with a flow path in the flow path structure, a first opening into which the flexible substrate is inserted, and a first wall protruding in the second direction; At least a portion of the first wall is disposed between the first flow path connection portion and the first opening when viewed in the first direction. A liquid jet head characterized by:

2. a first end portion of the first wall in the second direction is located further in the second direction than the first flow path connecting portion; The liquid jet head according to claim 1 .

3. The first wall is a surrounding wall that surrounds the first opening when viewed in the first direction. The liquid jet head according to claim 1 .

4. With respect to an arrangement direction of the first flow path connecting portion, the at least one portion of the first wall, and the first opening when viewed in the first direction, a distance between the at least one portion of the first wall and the first opening is shorter than a distance between the at least one portion of the first wall and the first flow path connecting portion. The liquid jet head according to claim 1 .

5. a flow path connection surface of the flow path structure facing the first direction includes a second flow path connection portion that is fluid-tightly connected to the first flow path connection portion, a second opening into which the flexible substrate is inserted, and a second wall that protrudes in the first direction; At least a portion of the second wall is disposed between the second flow path connection portion and the second opening when viewed in the second direction. The liquid jet head according to claim 1 .

6. a second end of the second wall in the first direction is located further in the first direction than a first end of the first wall in the second direction; The liquid jet head according to claim 5 .

7. In the first direction, a distance between the first end and the second end is longer than at least one of a distance from the upper surface to a tip of the first flow path connecting portion in the second direction and a distance from the flow path connecting surface to a tip of the second flow path connecting portion in the first direction. The liquid jet head according to claim 6 .

8. another head chip that ejects liquid in the first direction and has another flexible substrate; another upper surface of the other head chip facing the second direction has another flow path connecting portion for liquid-tight connection with a flow path in the flow path structure, another opening into which the other flexible substrate is inserted, and another wall protruding in the second direction; At least a portion of the other wall is disposed between the other flow path connection portion and the other opening when viewed in the first direction. The liquid jet head according to claim 1 .

9. a head chip that ejects liquid in a first direction and has a flexible substrate; a flow path structure disposed in a second direction opposite to the first direction; Equipped with a flow path connection surface of the flow path structure facing the first direction includes a second flow path connection portion that is liquid-tightly connected to a flow path in the head chip, a second opening into which the flexible substrate is inserted, and a second wall that protrudes in the first direction; At least a portion of the second wall is disposed between the second flow path connection portion and the second opening when viewed in the second direction. A liquid jet head characterized by:

10. a second end portion of the second wall in the first direction is located further in the first direction than the second flow path connecting portion; The liquid jet head according to claim 9 .

11. The second wall is a surrounding wall that surrounds the second opening when viewed in the second direction. The liquid jet head according to claim 9 .

12. A liquid jet head according to any one of claims 1 to 11; a liquid reservoir that supplies liquid to the liquid jet head; Equipped with A liquid ejection device characterized by:

Images