Temperature control device

Abstract

To provide a temperature control device capable of improving flatness and parallelism of a mounting surface.SOLUTION: A temperature control device includes: a mounting part having a mounting surface on which a temperature control target is mounted; a bottom part facing the mounting part in a first direction; a heat source disposed between the mounting part and the bottom part and capable of heating and cooling the temperature control target; a support part provided on an outer peripheral part of the bottom part and configured to support the mounting part; and a positioning member disposed between the mounting part and the bottom part and configured to position a center of the mounting part and a center of the bottom part. The positioning member includes: a first positioning part provided in the mounting part; a second positioning part provided in the bottom part; and a fitting part. The fitting part includes: a fitting groove provided in the first positioning part and formed to be recessed in a first direction; and a fitting protrusion part provided in the second positioning part, protruding toward the fitting groove in the first direction, and fitted into the fitting groove. The fitting protrusion part includes a tapered part whose width in a second direction decreases from a maximum width part toward the bottom surface side of the fitting groove in the first direction.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a temperature control device. [Background technology]

[0002] Semiconductor manufacturing equipment and inspection equipment use temperature control devices that adjust the temperature of wafers. For example, Patent Document 1 discloses an example of a temperature control device. This temperature control device includes a top plate that supports a wafer, a base plate connected to the top plate so as to form an internal space between the top plate and the base plate, and a thermoelectric module disposed in the internal space. The thermoelectric module adjusts the temperature of a wafer placed on the mounting surface of the top plate. The top plate has a protrusion that protrudes from the back surface to the base plate. The lower end surface of this protrusion on the top plate contacts the upper end surface of a protrusion provided on the base plate via a heat insulating material. The top plate is supported by these protrusions and fixed to the base plate. In order to maintain good wafer quality, the mounting surface on which the wafer is placed is required to have high precision flatness and parallelism. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-77810 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in such a temperature control device, when adjusting the wafer temperature at high or low temperatures, the parts that position and secure the top plate and base plate may be thermally deformed. In this case, the parts may become jammed due to thermal deformation, causing the top plate to lift at an angle. This causes a problem of deterioration in the flatness and parallelism of the mounting surface.

[0005] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a temperature control device that can improve the flatness and parallelism of the mounting surface. [Means for solving the problem]

[0006] In order to solve the above problems, a temperature control device according to the present invention includes a mounting section having a mounting surface on which an object to be temperature-controlled is placed, a bottom section facing the mounting section in a first direction, a heat source arranged between the mounting section and the bottom section in the first direction and capable of heating and cooling the object to be temperature-controlled via the mounting section, a support section provided on the outer periphery of the bottom section, extending toward the mounting section in the first direction, and supporting the mounting section, and a positioning member arranged between the mounting section and the bottom section in the first direction and positioning the center of the mounting section and the center of the bottom section, the positioning member comprising a first positioning section provided at the center of the mounting section, and a second positioning section provided at the center of the bottom section and supporting the first positioning section. The mating portion comprises a second positioning portion facing the positioning portion in the first direction, and a mating portion mating the first positioning portion with the second positioning portion, the mating portion being provided on one of the first positioning portion and the second positioning portion and comprising a mating groove recessed in the first direction, and a mating protrusion portion being provided on the other of the first positioning portion and the second positioning portion and protruding toward the mating groove in the first direction and fitted into the mating groove, the mating protrusion portion having a maximum width portion whose width in the second direction is greatest in a second direction perpendicular to the first direction, and comprising a tapered portion whose width in the second direction decreases from the maximum width portion toward the bottom surface of the mating groove in the first direction. [Effects of the Invention]

[0007] According to the present invention, the flatness and parallelism of the mounting surface can be improved. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view of a temperature control device according to a first embodiment of the present invention. [Figure 2] 1 is a cross-sectional view of a temperature control device according to a first embodiment of the present invention. [Figure 3] FIG. 2 is an enlarged cross-sectional view of a positioning member according to the first embodiment of the present invention. [Figure 4] FIG. 2 is an enlarged perspective view of a positioning member according to the first embodiment of the present invention. [Figure 5] FIG. 10 is an enlarged cross-sectional view of a positioning member according to a modified example of the first embodiment of the present invention. [Figure 6] FIG. 4 is a cross-sectional view of a temperature control device according to a second embodiment of the present invention. [Figure 7] FIG. 6 is an enlarged cross-sectional view of a positioning member according to a second embodiment of the present invention. [Figure 8] FIG. 10 is an enlarged perspective view of a positioning member according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] First Embodiment (Configuration of temperature control device) A temperature control device 1 according to a first embodiment of the present invention will be described below with reference to Fig. 1 to Fig. 4. The temperature control device 1 shown in Fig. 1 controls the temperature of a semiconductor wafer (hereinafter simply referred to as wafer A) while performing film formation, exposure, etching, etc. on wafer A. Wafer A is an example of an object to be temperature controlled.

[0010] 1 and 2, the temperature control device 1 is formed, for example, in a disk shape. The temperature control device 1 includes a top plate 10 (mounting portion), a bottom plate 20 (bottom portion), a Peltier module 2 (heat source), a cooling plate 3, a support portion 30, and a positioning member 40.

[0011] (top plate) The top plate 10 has a mounting surface 11 on which a wafer A is placed. The top plate 10 is a disk-shaped member made of a heat transfer material and has a uniform thickness. Hereinafter, the axis of the top plate 10 will be simply referred to as axis O. This axis O passes through the center C1 of the top plate 10 and extends linearly in the thickness direction of the top plate 10. Furthermore, the radial direction of this axis O will be simply referred to as the "radial direction," and the circumferential direction of this axis O will be simply referred to as the "circumferential direction." The radial direction is perpendicular to the direction of the axis O. The direction of the axis O is an example of a first direction, and the radial direction is an example of a second direction. In the following, an example will be described in which the top plate 10 is disposed along a horizontal plane and the axis O of the top plate 10 extends vertically.

[0012] The above-described top plate 10 expands and contracts under the influence of heat from the Peltier module 2 (described later). For example, the top plate 10 expands in the radial direction at high temperatures, and contracts in the radial direction at low temperatures.

[0013] (bottom plate) The bottom plate 20 is disposed at a position opposite to the top plate 10 in the direction of the axis O. The bottom plate 20 is formed in a circular plate shape with the axis O as its central axis. The bottom plate 20 is formed to have approximately the same diameter as the top plate 10. In addition, a pin 23 that protrudes toward the top plate 10 in the direction of the axis O is provided on an outer periphery 22 of the bottom plate 20.

[0014] The bottom plate 20 has a mounting surface 21 on the opposite side to the top plate 10 in the direction of the axis O. The mounting surface 21 extends parallel to the placement surface 11. The bottom plate 20 is mounted on the main body of a semiconductor manufacturing device or the like using this mounting surface 21.

[0015] The bottom plate 20 expands and contracts under the influence of heat from the Peltier module 2. For example, the bottom plate 20 expands in the direction of the axis O at high temperatures, and contracts in the direction of the axis O at low temperatures.

[0016] (Peltier module) The Peltier module 2 is disposed between the top plate 10 and the bottom plate 20 in the direction of the axis O. The Peltier module 2 is capable of heating and cooling the wafer A via the top plate 10. The Peltier module 2 is disposed in the shape of an annular plate with the axis O as its central axis.

[0017] (Cooling plate) The cooling plate 3 is disposed between the Peltier module 2 and the bottom plate 20 in the direction of the axis O, and exchanges heat with the Peltier module 2, thereby cooling the Peltier module 2. The cooling plate 3 is formed in the shape of an annular plate with the axis O as its central axis. Note that a flow path through which a refrigerant flows may be formed within the cooling plate 3. In this case, heat is exchanged between the refrigerant flowing through this flow path and the Peltier module 2, thereby cooling the Peltier module 2. The cooling plate 3 is placed on pins 23 provided on the bottom plate 20. The cooling plate 3 is supported from below by the pins 23, and a space is formed between the cooling plate 3 and the support portion 30.

[0018] (Support part) The support portion 30 is provided on the outer peripheral portion 22 radially outside of the bottom plate 20. The support portion 30 extends from the bottom plate 20 toward the top plate 10 in the direction of the axis O. The end of the support portion 30 on the top plate 10 side in the direction of the axis O contacts the top plate 10, and the support portion 30 supports the top plate 10.

[0019] The support portion 30 of this embodiment includes a sidewall 31 and a block 32. The sidewall 31 is formed in a cylindrical shape extending in the axial direction O along the outer peripheral edge 22a of the bottom plate 20. The sidewall 31 radially covers the Peltier module 2, the cooling plate 3, the pins 23, and a positioning member 40 (described later) from the outside. The sidewall 31 is integrally formed with the bottom plate 20. Alternatively, the sidewall 31 may be formed separately from the bottom plate 20 and fixed to the bottom plate 20 by a fixing member (not shown). The block 32 is provided at the end of the sidewall 31 on the top plate 10 side in the axial direction O. A plurality of blocks 32 are provided at intervals in the circumferential direction. The arrangement, shape, and number of the blocks 32 can be changed as appropriate. For example, only one block 32 may be provided, and may be formed in an annular shape when viewed from the axial direction O. The top plate 10 is placed on this block 32. The block 32 is formed separately from the side wall 31 and is fixed to the side wall 31 by a fixing member (not shown). Note that the block 32 may be formed integrally with the side wall 31.

[0020] (positioning member) As shown in FIGS. 3 and 4 , the positioning member 40 is disposed between the top plate 10 and the bottom plate 20 in the direction of the axis O. The positioning member 40 positions the center C1 of the top plate 10 and the center C2 of the bottom plate 20. The positioning member 40 causes the center C1 of the top plate 10 and the center C2 of the bottom plate 20 to be disposed on the same axis O. In other words, the positioning member 40 centers the top plate 10 and the bottom plate 20. The positioning member 40 includes a first positioning portion 41, a second positioning portion 42, and a fitting portion 50.

[0021] (First positioning part) The first positioning portion 41 is provided at the center C1 of the top plate 10. The first positioning portion 41 protrudes from the surface of the top plate 10 opposite the mounting surface 11 in the direction of the axis O toward the bottom plate 20 in the direction of the axis O. The first positioning portion 41 is formed separately from the top plate 10 and is fixed to the top plate 10 by a fixing member (not shown) such as a bolt. The first positioning portion 41 may also be formed integrally with the top plate 10. The first positioning portion 41 of this embodiment is formed in a cylindrical shape with the axis O as its central axis.

[0022] (Second positioning part) The second positioning portion 42 is provided at the center C2 of the bottom plate 20. The second positioning portion 42 faces the first positioning portion 41 in the direction of the axis O. The second positioning portion 42 protrudes toward the top plate 10 in the direction of the axis O from the surface of the bottom plate 20 opposite the mounting surface 21 in the direction of the axis O. The second positioning portion 42 is formed separately from the bottom plate 20 and is fixed to the bottom plate 20 by a fixing member (not shown) such as a bolt. The second positioning portion 42 may also be formed integrally with the bottom plate 20. The second positioning portion 42 in this embodiment is formed in a cylindrical shape with the axis O as its central axis.

[0023] The end face 42a (upper end face) of the second positioning part 42 in the axis O direction is arranged with a small gap S1 in the axis O direction relative to the end face 41a (lower end face) of the first positioning part 41 in the axis O direction.

[0024] (fitting part) The mating portion 50 mates the first positioning portion 41 and the second positioning portion 42. The mating portion 50 includes a mating groove 51 and a mating protrusion 52.

[0025] (fitting groove) The fitting groove 51 is provided in the first positioning portion 41. The fitting groove 51 is recessed toward the top plate 10 in the direction of the axis O. The fitting groove 51 opens toward the second positioning portion 42 in the direction of the axis O. The fitting groove 51 has a bottom surface 51a and a side surface 51b. The bottom surface 51a is formed in a circular shape. The side surface 51b extends from the outer peripheral edge of the bottom surface 51a toward the second positioning portion 42 in the direction of the axis O. In this embodiment, the side surface 51b extends parallel to the axis O. An opening edge 51c of the fitting groove 51 and the end surface 41a of the first positioning portion 41 are connected by an inclined surface 53. This inclined surface 53 is formed around the entire circumference of the opening edge 51c of the fitting groove 51. The inclined surface 53 is positioned radially outward as it approaches the second positioning portion 42 in the direction of the axis O. The inclined surface 53 does not necessarily have to be formed.

[0026] (Mating protrusion) The mating protrusion 52 is provided on the second positioning portion 42. The mating protrusion 52 protrudes toward the mating groove 51 in the direction of the axis O. The mating protrusion 52 is fitted into the mating groove 51. The mating protrusion 52 is formed integrally with the second positioning portion 42. Note that the mating protrusion 52 may be formed separately from the second positioning portion 42 and fixed to the second positioning portion 42 by a fixing member (not shown). The mating protrusion 52 has a base portion 54 and a tapered portion 55.

[0027] (base) The base 54 is formed in a cylindrical shape extending in the axial direction O from an end surface 42a (upper end surface) of the second positioning portion 42 in the axial direction O. The base 54 has the axial direction O as its central axis. A reinforcing portion 57 is provided at the end of the base 54 on the second positioning portion 42 side in the axial direction O. The reinforcing portion 57 is provided around the entire circumference of the base 54. The reinforcing portion 57 expands radially outward as it approaches the second positioning portion 42 side in the axial direction O. The reinforcing portion 57 is located closer to the second positioning portion 42 in the axial direction O than the end surface 41a of the first positioning portion 41. The reinforcing portion 57 is formed integrally with the base 54 and the second positioning portion 42. The reinforcing portion 57 does not necessarily have to be provided on the base 54.

[0028] (Tapered part) The tapered portion 55 is formed at the end of the cylindrical portion on the top plate 10 side in the axial direction O. The tapered portion 55 has a maximum width portion 56 having the largest radial width W. The tapered portion 55 is formed such that the radial width W decreases from the maximum width portion 56 toward the bottom surface 51a of the fitting groove 51 in the axial direction O. The maximum width portion 56 is positioned so as to radially overlap the end of the side surface 51b of the fitting groove 51 on the fitting protrusion 52 side in the axial direction O. The maximum width portion 56 is positioned at the same position in the axial direction O as the opening edge 51c of the fitting groove 51, or is positioned closer to the bottom surface 51a of the fitting groove 51 than the opening edge 51c of the fitting groove 51 in the axial direction O. It is preferable that the distance between the maximum width portion 56 and the opening edge 51c in the axial direction O be as short as possible. It is particularly preferable that the maximum width portion 56 be disposed at the same position in the direction of the axis O as the opening edge 51c of the fitting groove 51.

[0029] In this embodiment, the tapered portion 55 extends along the axis O and is tapered such that its diameter decreases toward the bottom surface 51a of the fitting groove 51 in the direction of the axis O. The tapered portion 55 has a tip surface 55a and a tapered surface 55b. The tip surface 55a is the outer surface of the tapered portion 55 that faces the bottom surface 51a of the fitting groove 51 in the direction of the axis O. The tip surface 55a is a flat surface extending in the radial direction. The tip surface 55a is formed in a circular shape with the axis O as its central axis. The tapered surface 55b is a surface that connects the outer periphery of the maximum width portion 56 and the outer periphery of the tip surface 55a. The tapered surface 55b faces radially outward and is curved so as to approach the radially inward direction toward the bottom surface 51a of the fitting groove 51 in the direction of the axis O.

[0030] The mating protrusion 52 is fitted into the mating groove 51 by clearance fit. That is, the mating protrusion 52 is fitted into the mating groove 51 with a small gap S2. Hereinafter, the gap S2 in the axial direction is referred to as gap S2a, and the gap S2 in the radial direction is referred to as gap S2b. In this embodiment, the gap S2a in the axial direction between the bottom surface 51a of the mating groove 51 and the tip surface 55a of the mating protrusion 52 is constant at any radial position. Furthermore, the radial gap S2b between the side surface 51b of the mating groove 51 and the tapered surface 55b of the mating protrusion 52 gradually increases from the maximum width portion 56 toward the bottom surface 51a of the mating groove 51 in the axial direction. The radial gap S2b between the side surface 51b of the mating groove 51 and the tapered surface 55b of the mating protrusion 52 is smallest at the maximum width portion 56. The radial gap S2b between the side surface 51b of the mating groove 51 and the tapered surface 55b of the mating protrusion 52 at the maximum width portion 56 is smaller than the gap S1 in the direction of the axis O between the first positioning portion 41 and the second positioning portion 42. Note that the tapered surface 55b of the mating protrusion 52 may be in contact (line contact) with the side surface 51b of the mating groove 51 at the maximum width portion 56.

[0031] <Effects> The temperature control device 1 of the above-described embodiment can achieve the following effects. In this embodiment, the temperature control device 1 includes a top plate 10 having a mounting surface 11 on which a wafer A is placed, a bottom plate 20 facing the top plate 10 in the axial direction O, a Peltier module 2 arranged between the top plate 10 and the bottom plate 20 in the axial direction O and capable of heating and cooling the wafer A via the top plate 10, a support part 30 provided on the outer periphery 22 of the bottom plate 20, extending toward the top plate 10 in the axial direction O, and supporting the top plate 10, and a positioning member 40 arranged between the top plate 10 and the bottom plate 20 in the axial direction O, and positioning the center C1 of the top plate 10 and the center C2 of the bottom plate 20. The positioning member 40 includes a first positioning portion 41 provided at the center C1 of the top plate 10, a second positioning portion 42 provided at the center C2 of the bottom plate 20 and facing the first positioning portion 41 in the axial direction O, and a mating portion 50 that matings the first positioning portion 41 and the second positioning portion 42. The mating portion 50 includes a mating groove 51 provided in the first positioning portion 41 and recessed in the axial direction O, and a mating protrusion 52 provided in the second positioning portion 42 and protruding toward the mating groove 51 in the axial direction O to be fitted into the mating groove 51. The mating protrusion 52 has a maximum width portion 56 whose width W in the radial direction perpendicular to the axial direction O is the largest, and a tapered portion 55 whose radial width W decreases from the maximum width portion 56 toward the bottom surface 51a of the mating groove 51 in the axial direction O.

[0032] In conventional temperature control devices, the first positioning member may be attached to the top plate in a state where it is tilted radially relative to the second positioning member during assembly. Operating the temperature control device in this state causes thermal deformation of the positioning member, causing the first positioning member to expand and contract in the axial direction. This can cause the mating groove and mating protrusion to engage with each other, lifting the top plate and tilting it relative to a virtual plane (horizontal plane) perpendicular to the axial direction. This can also cause deformation of the top plate's mounting surface.

[0033] In contrast, in this embodiment, a tapered portion 55 is formed on the mating protrusion 52. Therefore, even if the first positioning portion 41 is tilted relative to the second positioning portion 42, contact between the mating protrusion 52 and the mating groove 51 can be minimized. For example, the contact area between the mating groove 51 and the mating protrusion 52 can be reduced to such an extent that the mating protrusion 52 makes line contact with the mating groove 51 at the maximum width portion 56. This prevents the mating groove 51 and the mating protrusion 52 from interlocking with each other. Therefore, according to this embodiment, the positioning member 40 positions the center C1 of the top plate 10 and the center C2 of the bottom plate 20 on the same axis O, while preventing tilting of the top plate 10 and deformation of the mounting surface 11 due to thermal deformation of the positioning member 40, thereby improving the flatness and parallelism of the mounting surface 11.

[0034] In this embodiment, the tapered portion 55 extends along the axis O and is formed in a tapered shape that decreases in diameter as it approaches the bottom surface 51a of the fitting groove 51 in the axis O direction.

[0035] As a result, the surface (tapered surface 55b) of the tapered portion 55 that may come into contact with the mating groove 51 is formed into a smooth curved surface. Therefore, according to this embodiment, it is possible to prevent the tapered portion 55 and the mating groove 51 from mating with each other.

[0036] In this embodiment, the side surface 51b of the engagement groove 51 extends parallel to the axis O, but this is not limitative. The side surface 51b may be inclined relative to the axis O.

[0037] Furthermore, although the base 54 of the engagement protrusion 52 has been described as being formed in a cylindrical shape extending in the direction of the axis O, the present invention is not limited to this. The base 54 may be formed in a tapered shape in which the radial width W decreases as it moves away from the widest part 56 in the direction of the axis O. The base 54 may also be formed in a polygonal columnar shape.

[0038] In addition, although the tapered portion 55 of the engagement protrusion 52 is formed in a tapered shape that decreases in diameter toward the bottom surface 51a of the engagement groove 51 in the direction of the axis O, the shape is not limited to this. The tapered portion 55 may be formed in a conical shape, or in a truncated pyramidal or pyramidal shape.

[0039] Furthermore, the engagement projection 52 may not have the base 54 and may be composed of only the tapered portion 55 .

[0040] 5, the mating groove 51 may be provided in the second positioning portion 42, and the mating protrusion 52 may be provided in the first positioning portion 41. Even in such a case, the temperature control device 1 can achieve the same effects as those of the above-described embodiment.

[0041] Second Embodiment (Configuration of temperature control device) A temperature control device 101 according to a second embodiment of the present invention will be described below with reference to Fig. 6 to Fig. 8. Among the configurations of the second embodiment, the configurations similar to those of the first embodiment will be given the same names and the same reference numerals, and the description will be omitted as appropriate.

[0042] In this embodiment, as shown in FIGS. 6 to 8 , the fitting groove 151 is formed in a spherical shape. The fitting groove 151 has a bottom surface 151a through which the axis O passes and a side surface 151b extending from the outer periphery of the bottom surface 151a toward the second positioning portion 42 in the direction of the axis O. The bottom surface 151a is a region of the fitting groove 151 near the axis O. The side surface 151b is smoothly connected to the bottom surface 151a without any steps. The boundary between the side surface 151b and the bottom surface 151a can be set as appropriate. For example, the boundary between the side surface 151b and the bottom surface 151a is located midway in the direction of the axis O between an opening edge 151c of the fitting groove 151 and a point on the bottom surface 151a through which the axis O passes.

[0043] The outer surface 152a of the mating protrusion 152 located in the mating groove 151 is formed in a spherical shape. The radius of curvature of the outer surface 152a of the mating protrusion 152 is smaller than the radius of curvature of the mating groove 151.

[0044] In this embodiment, the mating protrusion 152 is spherical. The mating protrusion 152 has a base 154 that forms one half of the sphere and a tapered portion 155 that forms the other half of the sphere. The base 154 is the end of the mating protrusion 152 opposite the mating groove 151 in the axial direction O and is embedded in the second positioning portion 42. The tapered portion 155 is located closer to the mating groove 151 in the axial direction O than the base 154. The tapered portion 155 is connected to the base 154 at a maximum width portion 156. The radial width W of the tapered portion 155 decreases from the maximum width portion 156 toward the bottom surface 151a of the mating groove 151 in the axial direction O. In this embodiment, the tapered portion 155 is integrally formed with the base 154. An outer surface 152a of the tapered portion 155 is smoothly connected to the outer surface of the base portion 154 without any steps.

[0045] The center C3 of the spherically formed mating groove 151 and the center C4 of the spherical mating protrusion 152 are both located on the same axis O.

[0046] The tapered portion 155 is fitted to the fitting groove 151 with a small gap S2 therebetween. The gap S2 between the fitting groove 151 and the outer surface 152a of the fitting protrusion 152 is smaller than the gap S1 in the axial direction O between the first positioning portion 41 and the second positioning portion 42. Furthermore, of the gap S2 between the fitting groove 151 and the outer surface 152a of the fitting protrusion 152, the radial gap S2b becomes smaller toward the bottom surface 151a of the fitting groove 151 in the axial direction O. The radial gap S2b between the fitting groove 151 and the outer surface 152a of the fitting protrusion 152 is largest at the maximum width portion 156. Furthermore, of the gap S2 between the mating groove 151 and the outer surface 152a of the mating protrusion 152, the gap S2a in the direction of the axis O becomes smaller as it approaches the bottom surface 151a of the mating groove 151 in the direction of the axis O. The tapered portion 155 is closest to the bottom surface 151a of the mating groove 151 on the axis O in the direction of the axis O. Note that the tapered portion 155 may be in contact (point contact) with the bottom surface 151a of the mating groove 151 on the axis O, for example.

[0047] <Effects> The temperature control device 101 of the above-described embodiment can achieve the following effects. In this embodiment, the mating groove 151 is formed in a spherical shape. An outer surface 152a of the mating protrusion 152 located in the mating groove 151 is formed in a spherical shape.

[0048] As described above, in this embodiment, both the mating groove 151 and the outer surface 152a of the mating protrusion 152 are formed as smoothly curved surfaces. Therefore, even if the mating protrusion 152 and the mating groove 151 come into contact with each other, the contact area between the mating groove 151 and the mating protrusion 152 can be reduced. This prevents the mating groove 151 and the mating protrusion 152 from interlocking with each other. Therefore, in this embodiment as well, the positioning member 40 positions the center C1 of the top plate 10 and the center C2 of the bottom plate 20, while preventing tilting of the top plate 10 and deformation of the mounting surface 11 due to thermal deformation of the positioning member 40, thereby improving the flatness and parallelism of the mounting surface 11.

[0049] In this embodiment, the engagement protrusion 152 is a sphere. An end (base 154) of the engagement protrusion 152 opposite the engagement groove 151 in the first direction is embedded in the second positioning portion .

[0050] This allows the efficiency of manufacturing the mating portion 150 to be improved, since it is only necessary to form the mating protrusion portion 152 into a sphere.

[0051] In this embodiment, the radius of curvature of the outer surface 152 a of the mating protrusion 152 is smaller than the radius of curvature of the mating groove 151 .

[0052] This allows the contact between the mating protrusions 152 and the mating grooves 151 to be limited to point contact, thereby further preventing the mating grooves 151 and the mating protrusions 152 from interlocking with each other, thereby further improving the flatness and parallelism of the mounting surface 11.

[0053] As in the first embodiment, the mating groove 151 may be provided in the second positioning portion 42, and the mating protrusion 152 may be provided in the first positioning portion 41. In this case, the spherical mating protrusion 152 is embedded in the first positioning portion 41. Even in this case, the temperature adjustment device 101 can achieve the same effects as the above-described embodiment.

[0054] The above describes an embodiment of the present invention with reference to the drawings, but the specific configuration is not limited to this embodiment, and design changes and the like are also included within the scope that does not deviate from the gist of the present invention. The temperature control device 1 may be used in, for example, a semiconductor manufacturing device or a semiconductor inspection device.

[0055] In the above embodiment, the temperature control object is the wafer A, but the present invention is not limited to this. That is, the temperature control device 1 may be used to control the temperature of a temperature control object other than the wafer A.

[0056] In the above embodiment, the temperature control devices 1 and 101 are described as being formed in a disk shape, but this is not limiting. For example, the temperature control devices 1 and 101 may be formed in a polygonal disk shape.

[0057] Furthermore, a rotation prevention structure may be provided to prevent the top plate 10 and the bottom plate 20 from rotating relative to each other. For example, as the rotation prevention structure, a key may be provided on one of the top plate 10 and the support part 30, and a key groove that mates with the key may be provided on the other of the top plate 10 and the support part 30. [Explanation of symbols]

[0058] 1...Temperature control device, 2...Peltier module, 3...Cooling plate, 10...Top plate, 11...Placement surface, 20...Bottom plate, 21...Mounting surface, 22...Outer periphery, 22a...Outer periphery, 23...Pin, 30...Support portion, 31...Side wall, 32...Block, 40...Positioning member, 41...First positioning portion, 41a...End face, 42...Second positioning portion, 42a...End face, 50...Mating portion, 51...Mating groove, 51a...Bottom surface, 51b...Side, 51c...Opening edge, 52...Mating protrusion, 53...Slope surface, 54...base, 55...tapered portion, 55a...tip surface, 55b...tapered surface, 56...maximum width portion, 57...reinforcement portion, 101...temperature control device, 150...mating portion, 151...mating groove, 151a...bottom surface, 151b...side surface, 151c...opening edge, 152...mating protrusion portion, 152a...outer surface, 154...base, 155...tapered portion, 156...maximum width portion, A...wafer, C1...center, C2...center, C3...center, C4...center, O...axis, S1...gap, S2...gap, S2a...gap, S2b...gap, W...width

Claims

1. a placement section having a placement surface on which an object to be temperature controlled is placed; a bottom portion facing the placement portion in a first direction; a heat source disposed between the mounting portion and the bottom portion in the first direction and capable of heating and cooling the object to be temperature-controlled via the mounting portion; a support portion provided on an outer periphery of the bottom portion, extending toward the placement portion in the first direction, and supporting the placement portion; a positioning member disposed between the placement portion and the bottom portion in the first direction and configured to position a center of the placement portion and a center of the bottom portion; Equipped with The positioning member is a first positioning portion provided at the center of the placement portion; a second positioning portion provided at the center of the bottom portion and facing the first positioning portion in the first direction; a mating portion that matings the first positioning portion and the second positioning portion; Equipped with The mating portion is a mating groove provided in one of the first positioning portion and the second positioning portion and recessed in the first direction; a mating protrusion provided on the other of the first positioning portion and the second positioning portion, protruding toward the mating groove in the first direction and fitted into the mating groove; Equipped with The engagement protrusion portion is a temperature control device having a maximum width portion having the largest width in a second direction perpendicular to the first direction, and a tapered portion in which the width in the second direction decreases from the maximum width portion toward the bottom surface side of the fitting groove in the first direction.

2. The tapered portion extends along an axis in the first direction and is formed in a tapered shape whose diameter decreases toward a bottom surface side of the fitting groove in the axial direction. The temperature control device according to claim 1 .

3. The fitting groove is formed in a spherical shape, The outer surface of the portion of the engagement protrusion located in the engagement groove is formed into a spherical shape. The temperature control device according to claim 1 .

4. The engagement protrusion is a sphere, an end of the engagement protrusion portion opposite to the engagement groove in the first direction is embedded in the other of the first positioning portion and the second positioning portion; The temperature control device according to claim 3 .

5. The radius of curvature of the outer surface of the engagement protrusion is smaller than the radius of curvature of the engagement groove; The temperature control device according to claim 3 or 4.

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