Cartridge module and multi wafer test device utilizing same

Abstract

To provide a cartridge module and a multi wafer test device utilizing the same.SOLUTION: A multi wafer test device is provided, comprising: at least two chambers to which a tester is connected, each of two chambers having a test head that electrically connects a probe card and the tester; a cartridge module comprising a first body provided with the probe card, and a second body provided with a wafer chuck on which a wafer is seated, thereby the first body and the second body being detachably assembled with each other; a wafer loading unit for unclamping the first body and the second body to perform attaching / detaching operation of the first body and the second body and thereby loading the wafer on the second body to assemble the first body and the second body by clamping operation; and a transfer unit configured to transfer and deliver the cartridge module between the wafer loading unit and the chambers.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cartridge module that modularizes a probe card and a wafer and can maintain its position, and to a multi-wafer test apparatus that uses the cartridge module to test a large number of wafers in a single test. [Background technology]

[0002] In general, semiconductor devices are formed on wafers by repeatedly performing a series of processing steps, such as a deposition process for forming a film on the wafer, an etching process for forming a pattern having electrical properties on the deposited wafer, an ion implantation or diffusion process for implanting or diffusing impurities into the pattern, and a cleaning and rinsing process for removing impurities from the patterned wafer.

[0003] The semiconductor devices manufactured through this series of processes are subjected to a wafer testing process to test their electrical characteristics. The testing process is performed using a probe station including a probe card with a number of probes and a tester connected to the probe card to provide electrical signals.

[0004] Generally, a probe station includes an inspection chamber, a chuck positioned within the inspection chamber to support the wafer, a chuck transport device that drives the chuck, a probe card having a number of probes configured to contact semiconductor elements formed on the wafer, and a tester connected to the probe card to perform the tests.

[0005] In such conventional technology, a chuck transport device carries a chuck holding a wafer to an inspection chamber, and uses a vision sensor such as a CCD camera to determine the positions of the contact electrodes on the wafer and the probes on the probe card.Based on the determined position information, the chuck transport device is controlled to bring the contact electrodes on the wafer into contact with the probes, thereby electrically connecting them.

[0006] Generally, such wafer testing is a single probe test that tests only one wafer at a time. The present invention has developed and filed a patent application for a cartridge module that can efficiently test multiple wafers by moving away from the conventional single probe test wafer testing process, and a multi-wafer test apparatus that utilizes the cartridge module. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent Publication No. 10-2010-0130540 (Publication Date: December 13, 2010) Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention aims to provide a cartridge module that modularizes a probe card and a wafer for wafer inspection and is capable of maintaining the self-positions of the probe card and the wafer, and a multi-wafer test device that uses the same. [Means for solving the problem]

[0009] To achieve the above object, a multi-wafer test apparatus according to an embodiment of the present invention includes: a cartridge module including at least two chambers to which a tester is connected and which are provided with a test head that electrically connects a probe card and the tester; a first body portion provided with a probe card; and a second body portion provided with a wafer chuck on which a wafer is seated and which is detachably assembled to the first body portion; a wafer loading unit that unclamps the first body portion and the second body portion to detach the first body portion and the second body portion, loads a wafer into the second body portion, and assembles the first body portion and the second body portion by a clamping operation; and a transfer unit that transfers and conveys the cartridge module between the wafer loading unit and the chambers.

[0010] Preferably, the chamber includes a guide rail on which the cartridge module is positioned, a temperature control device provided at the lower end of the cartridge module seated on the guide rail for controlling the temperature, a lifting unit for raising and lowering the temperature control device, and a drive source supply section for supplying a drive source to the cartridge module seated on the guide rail.

[0011] Preferably, the cartridge module storage unit further includes a cartridge module loading stand capable of storing at least two cartridge modules.

[0012] Preferably, the cartridge module includes a weight ring assembled to the second body part on the upper part of the first body part by providing a magnet holder in the second body part corresponding to a guide hole drilled in the first body part and a magnet chuck inserted into the guide hole and capable of being fixed to the magnet holder by magnetic force, and a clamp part provided between the first body part and the weight ring and fixing the distance between the first body part and the weight ring.

[0013] Next, a cartridge module according to an embodiment of the present invention is a cartridge module equipped with a probe card for inspecting a wafer, and capable of modularizing the wafer and the probe card for transport, and includes: a first body portion equipped with the probe card and having a guide hole formed vertically therethrough; a second body portion equipped with a wafer chuck on which a wafer is seated and having a magnetic holder corresponding to the guide hole, which is removably assembled with the first body portion so that the probe card and the wafer are electrically connected; a weight ring equipped with a magnetic chuck inserted into the guide hole and capable of being fixed to the magnetic holder by magnetic force, which is assembled with the second body portion on the top of the first body portion; and a clamp portion which clamps / unclamps the first body portion and the second body portion to fix / detach the first body portion and the second body portion.

[0014] Preferably, the magnetic chuck further includes a friction pad provided between the magnetic holder and a contact surface thereof.

[0015] Preferably, the clamping portion includes a shaft having one end fixed to either the weight ring or the first body portion, and a pneumatic drive portion fixed to the other of the weight ring or the first body portion and fixed to the shaft by a pneumatic signal.

[0016] More preferably, the pneumatic drive unit is of a normally closed type.

[0017] Preferably, the second body portion includes a thermally conductive saddle body that contacts the wafer chuck, and the saddle body includes an inner saddle body that is separated by a heat insulating member and that directly contacts the wafer chuck, and an outer saddle body that forms the periphery of the inner saddle body.

[0018] More preferably, the inner saddle body further includes a plurality of heat-conducting members formed vertically therethrough and having a higher thermal conductivity than the saddle body.

[0019] Preferably, at least two of the magnetic chucks are provided below the weight ring, and more preferably, at least two of the clamp portions are provided between the first body portion and the weight ring.

[0020] More preferably, at least one clamping portion is provided between adjacent ones of the magnetic chucks.

[0021] Preferably, the device further includes a guide member interposed between the first body portion and the weight ring to guide an assembly position of the first body portion and the weight ring. [Effects of the Invention]

[0022] The multi-wafer test apparatus of the present invention includes a cartridge module including at least two chambers, a first body portion equipped with a probe card, and a second body portion equipped with a wafer chuck on which a wafer is seated and detachably assembled to the first body portion; a wafer loading unit that unclamps the first body portion and the second body portion to detach the first body portion and the second body portion, loads a wafer into the second body portion, and assembles the first body portion and the second body portion by a clamping operation; and a transfer unit that transfers and conveys the cartridge module between the wafer loading unit and the chambers. This advantageously enables multiple wafers to be tested in a single test, thereby maximizing test efficiency.

[0023] In addition, the cartridge module of the present invention is provided with a probe card for testing a wafer, and the wafer and the probe card are modularized for transport. The cartridge module includes a first body portion having a guide hole formed vertically therethrough, the probe card being provided with the first body portion, a second body portion having a wafer chuck for seating the wafer and a magnetic holder corresponding to the guide hole, and being detachably assembled with the first body portion so as to electrically connect the probe card and the wafer, a weight ring having a magnetic chuck inserted into the guide hole and capable of being fixed to the magnetic holder by magnetic force, and assembled to the second body portion on the top of the first body portion, and a clamp member for clamping / unclamping the first body portion and the second body portion to fix / detach the first body portion and the second body portion. By modularizing the wafer and the probe card and configuring them as a single unit, it is possible to precisely maintain the self-positions of the probe card and the wafer during transportation of the cartridge module. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a plan view of a multi-wafer test apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view of a cartridge module according to an embodiment of the present invention. [Figure 3] 1 is a perspective view showing a state in which a cartridge module is attached or detached according to an embodiment of the present invention; [Figure 4] FIG. 2 is an exploded perspective view of a cartridge module according to an embodiment of the present invention. [Figure 5] FIG. 2 is a plan view of a cartridge module according to an embodiment of the present invention. [Figure 6] 1(a) and 1(b) are a front view and a side view, respectively, of a cartridge module according to an embodiment of the present invention. [Figure 7] FIG. 3 is a cross-sectional view taken along the line AA in FIG. 2. [Figure 8]FIG. 6 is a cross-sectional view taken along line BB in FIG. 5. [Figure 9] 10(a) and 10(b) are a cross-sectional view showing another embodiment of a cartridge module according to an embodiment of the present invention, and a cross-sectional view taken along line CC. [Figure 10] FIG. 10 is a cross-sectional view showing another modified example of the second body portion in the cartridge module according to the embodiment of the present invention. [Figure 11] FIG. 2 is a front view of the configuration of a multi-chamber in the multi-wafer test apparatus according to the embodiment of the present invention. [Figure 12] FIG. 2 is an enlarged front view of a part of the multi-chamber in the multi-wafer test apparatus according to the embodiment of the present invention. [Figure 13] 1 is a configuration diagram showing a cartridge module loading stage in a multi-wafer test apparatus according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0025] The specific structure or functional description presented in the embodiments of the present invention is merely an example for the purpose of describing the embodiments according to the inventive concept, and the embodiments according to the inventive concept can be embodied in various forms. Furthermore, it should not be construed as being limited to the embodiments described herein, but should be understood to encompass all modifications, equivalents, and alternatives within the spirit and technical scope of the present invention.

[0026] The present invention will now be described in detail with reference to the accompanying drawings.

[0027] FIG. 1 is a planar layout diagram of a multi-wafer test apparatus according to an embodiment of the present invention, FIG. 2 is a perspective diagram of a cartridge module 200 according to an embodiment of the present invention, and FIG. 3 is a perspective diagram showing the attached and detached state of the cartridge module 200 according to an embodiment of the present invention.

[0028] 1 to 3, a multi-wafer testing apparatus according to an embodiment of the present invention includes a tester 110, a chamber 120, a wafer loading unit 130, an aligner 140, a transfer unit 150, and a cartridge module 200.

[0029] The cartridge module 200 includes a first body part 210 having a probe card 211 and a second body part 220 having a wafer chuck 221 and detachably assembled to the first body part 210. A clamping member is provided between the first body part 210 and the second body part 220, and the first body part 210 and the second body part 220 are clamped or unclamped by the clamping / unclamping of the clamping member, thereby being fixed to or detached from each other. In this embodiment, the clamping member may be provided by a clamping mechanism that performs clamping operation using a magnetic force and a pneumatic signal. In this cartridge module 200, the first body part 210 and the second body part 220 are mechanically detachably assembled, and the clamping member can precisely maintain the self-position between the probe card 211 and the wafer 10, allowing multiple wafers to be tested at one time. Specific embodiments of this cartridge module will be described again with reference to the related drawings.

[0030] The chamber 120 may be a multi-chamber consisting of at least two chambers, providing a test space for the wafer 10 and providing auxiliary equipment for generating conditions such as test temperature. Each chamber 120 is provided with a test head 121 electrically connected to the tester 110, and the test head 121 is coupled to a probe card 211 of the cartridge module 200 to test the wafer 10 loaded in the cartridge module 200. The tester 110 generates a test signal, which is transmitted to the wafer 10 via the test head 121 and the probe card 211.

[0031] The wafer loading section 130 is loaded with the wafer 10 to be inspected, and the wafer 10 is loaded into the cartridge module 200; more specifically, the wafer 10 to be inspected is loaded into the second body section 220 separated from the cartridge module 200.

[0032] The aligner 140 is where the cartridge module 200 is located. First, the first body part 210 and the second body part 220 of the cartridge module 200 are unclamped to detach the first body part 210 and the second body part 220 from each other, and then the second body part 220 is transferred to the wafer loading part 130. After being transferred to the wafer loading part 130, the wafer 10 to be inspected is loaded onto the wafer chuck 221 of the second body part 220. The second body part 220 with the wafer 10 loaded is then transferred to the aligner 140. The second body part 220 transferred to the aligner 140 is assembled to the first body part 210 with the wafer 10 seated thereon. The first body part 210 and the second body part 220 are assembled by a clamping operation of a clamping member, and the assembled cartridge module 200 is transferred to the chamber 120 by the transfer part 150 for testing. On the other hand, although not shown, the system may further include a loader on which inspected wafers are loaded.

[0033] Meanwhile, in this embodiment, the wafer loading process of the cartridge module 200 has been described as being divided into the wafer loading unit 130 and the aligner 140, but the two processes may be one continuous process rather than separate, divided processes. To achieve this, auxiliary equipment such as a well-known robot arm, aligner, vision inspection device, or conveying device may be included to attach, detach, or assemble the first body part 210 and the second body part 220 of the cartridge module 200.

[0034] Preferably, the cartridge module 200 is provided with a utility supply unit 215 for supplying a driving source (electrical power / air) for clamping / unclamping, and the cartridge module 200 seated in the wafer loading unit 130 and the aligner 140 can perform clamping / unclamping operations by receiving a driving source from the outside through the utility supply unit.

[0035] Preferably, the system further includes a cartridge module loading platform 160 capable of accommodating multiple cartridge modules 200, such cartridge module loading platform 160 either storing a probe card 211 or cartridge module 200 that needs to be replaced, or storing an extra cartridge module such as a new (repaired) probe card or cartridge module for replacement.

[0036] Each of the above-mentioned configurations will be specifically described below with reference to the related drawings.

[0037] Figure 4 is an exploded oblique view of the cartridge module 200 according to an embodiment of the present invention, Figure 5 is a plan view of the cartridge module 200 according to an embodiment of the present invention, Figures 6(a) and 6(b) are a front view and a side view, respectively, of the cartridge module 200 according to an embodiment of the present invention, and Figure 7 is a cross-sectional view taken along line AA in Figure 2.

[0038] 4 to 7, a cartridge module 200 according to an embodiment of the present invention includes a first body portion 210, a second body portion 220, a weight ring 230, and a clamp portion 240. As shown in FIG.

[0039] The first body portion 210 has a probe card 211 provided in the center and guide holes 212 formed perpendicularly penetrating the periphery of the probe card 211. In this embodiment, the first body portion 210 is a substantially rectangular member having four sides, and the guide holes 212 are shown to be disposed at each of the four corners of the first body portion 210, but the shape of the first body portion 210 and the number and positions of the guide holes 212 can be modified in various ways. Preferably, the first body portion 210 has at least two guide holes 212.

[0040] The first body part 210 may be provided with a plurality of freely rotatable rollers 213 at both ends for transportation. The rollers 213 may be implemented by cam followers having a low friction coefficient and excellent rotation performance, but are not limited thereto.

[0041] The first body portion 210 further includes a utility supply portion 215 for receiving a power source from an external source for clamping / unclamping operations of the cartridge module 200. In this embodiment, the utility supply portion 215 includes a brush 215a to which power is supplied and an auto coupler 215a to which compressed air (clean dry air, CDA) is supplied.

[0042] The second body part 220 has a wafer chuck 221 in the center on which the wafer 10 is seated, and a magnet holder 222 corresponding to the guide hole 212 of the first body part 210. The magnet holder 222 can be made of a known material (e.g., a ferromagnetic material) that can be attracted to the magnet chuck 231 of the weight ring 230 by magnetic force. In this embodiment, four magnet holders 222 are provided at positions corresponding to the guide holes 212. The wafer chuck 221 can be provided with an air fitting 221a for vacuum-sucking and fixing the seated wafer 10.

[0043] The weight ring 230 has a square ring shape and is provided with magnetic chucks 231 at the bottom, and the same number of magnetic chucks 231 are provided corresponding to the number of magnetic holders 222 of the second body part 220. The magnetic chucks 231 may be implemented by permanent magnets or electromagnets, and are preferably implemented by permanent magnets.

[0044] Preferably, the magnetic chuck 231 further includes a friction pad 233 capable of providing a frictional force between the contact surface with the magnetic holder 222. As illustrated in Fig. 7, the magnetic chuck 231 and the magnetic holder 222 are fixed by magnetic force and are strongly fixed in the vertical direction (z-axis direction), but may be relatively weakly fixed in the horizontal direction (xy plane). The friction pad 233 is compressed between the magnetic chuck 231 and the magnetic holder 222 to provide a frictional force in the horizontal direction, thereby enabling the cartridge module 200 to precisely maintain its position even against a horizontal external force during movement. The friction pad 233 may be made of a material with a high friction coefficient, for example, but not limited to, a silicon pad.

[0045] Preferably, a plurality of guide pins 232 may be provided on the bottom of the weight ring 230, and holes 214 may be provided on the top surface of the first body part 210 corresponding to each guide pin 232, and during the process of assembling the weight ring 230 and the first body part 210, the guide pins 232 may be inserted into the holes 214, thereby aligning the assembly positions of the weight ring 230 and the first body part 210. Meanwhile, although the present embodiment illustrates the guide pins 232 as being provided on the weight ring 230, the first body part 210 may be provided with a plurality of guide pins 232, and the weight ring 230 may be provided with a plurality of holes corresponding to each guide pin 232, thereby providing a guide member for guiding the assembly positions of the first body part 210 and the weight ring 230.

[0046] The clamp portion 240 is provided between the first body portion 210 and the weight ring 230, and serves to fix the distance between the first body portion 210 and the weight ring 230. Preferably, a plurality of clamp portions 240 are provided between the first body portion 210 and the weight ring 230.

[0047] The clamping part 240 includes a shaft 241, the upper end of which is fixed to the lower part of the weight ring 230, and an air pressure driving part 242, which is fixed to the first body part 210 and fixes the shaft 241 in response to an external air pressure signal. Reference numeral 243 denotes an air fitting for supplying air pressure to the clamping part 240.

[0048] FIG. 8 is a cross-sectional view taken along line BB in FIG. 5, showing the cross-sectional configuration of the clamp portion 240. To facilitate understanding, only the first body portion 210, the weight ring 230, and the clamp portion 240 are shown, and the sizes and proportions of the components are exaggerated.

[0049] Referring to FIG. 8, the clamp unit 240 includes a shaft 241 whose upper end is fixed to the weight ring 230 by a first bolt 244, and a pneumatic driver 242 whose lower end is fixed to the first body unit 210 by a second bolt 245, and which can fix the shaft 241. Depending on the pneumatic signal applied to the pneumatic driver 242, the shaft 241 moves up and down within the pneumatic driver 242, or its position (height) is fixed.

[0050] Preferably, the pneumatic driver 242 is a clamping mechanism driven by an NC (Normal Close) type pneumatic signal, and while air pressure is applied to the pneumatic driver 242, the shaft 241 can be moved up and down by the pneumatic driver 242. On the other hand, when air pressure is not applied to the pneumatic driver 242, the shaft 241 is clamped and fixed by the pneumatic driver 242, and the distance between the first body portion 210 and the weight ring 230 is fixed.

[0051] Such a clamping portion 240 can be provided by, but is not limited to, a clamping mechanism of the RBPS series manufactured by Zimmer and sold as a "clamping and braking element."

[0052] In the cartridge module 200 configured as described above, the wafer 10 is seated on the wafer chuck 221, and the first body part 210 and the weight ring 230 are stacked on top of the second body part 220 to assemble the cartridge module 200. The first body part 210, the second body part 220, and the weight ring 230 are fixed to each other by the magnetic force of the magnetic chuck 231 and the magnetic holder 222. Meanwhile, during the assembly process of the first body part 210, the second body part 220, and the weight ring 230, air pressure is applied to the clamp part 240, so that the shaft 241 can be moved up and down by the air pressure driver 242. Thereafter, when the air pressure supplied to the clamp part 240 is finally cut off, the distance between the first body part 210 and the weight ring 230 is fixed by the clamp part 240, and thus the self-positions of the wafer 10 and the probe card 211 can be fixed.

[0053] In this way, the probe card 211 and the wafer 10 can be transported while their positions are precisely maintained by the cartridge 200, and are then transferred to the chamber 120 for testing.

[0054] 5, arrows are used to illustrate the distances H1 to H4 at each position between the first body portion 210 and the weight ring 230 fixed by the four clamp portions 240. To facilitate understanding, the distances H1 to H4 at each position are exaggerated, and it has been confirmed that the present invention makes it possible to maintain self-position within a precise range of less than 10 μm not only in a horizontal state but also when there is an inclination by employing the magnetic chuck 231 and the clamp portion 240 using a pneumatic signal.

[0055] Meanwhile, in the embodiment of the present invention, the magnet holder 222 is described as having four magnet chucks 231 and four clamping units 240, but the arrangement and number of the magnet chucks 231 and clamping units 240 may vary depending on the size of the wafer.

[0056] Figures 9(a) and 9(b) are a cross-sectional view showing another embodiment of the cartridge module of the present invention and a cross-sectional view taken along line CC. We will omit redundant explanations of the same configuration as the previous embodiment and will focus on the differences.

[0057] 9, in this embodiment, the second body part 320 includes a wafer chuck 321 on which the wafer 10 is seated, and saddle bodies 322 and 323 that contact the wafer chuck 321 and transfer heat generated from the temperature control device 400. Preferably, the saddle bodies 322 and 323 include an inner saddle body 322 and an outer saddle body 323 that are separated by a heat insulating member 324. The saddle bodies 322 and 323 are made of a thermal conductor such as aluminum (Al) that transfers heat generated from the temperature control device 400 to the wafer chuck 321. In particular, by separating the area that directly contacts the wafer chuck 321 with the heat insulating member 324, heat transfer occurs via the inner saddle body 322, allowing for more rapid temperature control of the wafer.

[0058] Preferably, the inner saddle body 322 further includes a plurality of thermally conductive members 322a that penetrate vertically, and the thermally conductive members 322a can be made of a material with a higher thermal conductivity than the inner saddle body 322. For example, such thermally conductive members can be silver (Ag), copper (Cu), or an alloy.

[0059] As described above, in this embodiment, the second body portion 320 includes an inner saddle body 322 that directly contacts the wafer chuck 321 and divides the saddle bodies 322, 323 with a heat insulating member 324. The inner saddle body 322 includes a plurality of heat conducting members 322a formed therethrough, which allows for more rapid transfer of conductive heat for temperature control of the wafer 10 compared to saddle bodies 322, 323 made of a single material. In addition, this configuration allows for rapid heat dissipation through the outer saddle body 323, preventing thermal energy from concentrating on the wafer 10 and maintaining a uniform temperature distribution of the wafer 10.

[0060] FIG. 10 is a cross-sectional view showing another modified example of the second body portion in the cartridge module according to the embodiment of the present invention.

[0061] The second body portion 420 of this embodiment includes a wafer chuck (thin chuck) 421 on which the wafer 10 is seated, and saddle bodies 422 and 423 that contact the wafer chuck 421 and transfer heat generated from the temperature control device 400 .

[0062] In particular, the saddle bodies 422, 423 include an inner saddle body 422 and an outer saddle body 423 separated by a heat insulating member 424, and the inner saddle body 422, which is in direct contact with the wafer chuck 421, includes a plurality of heat conductive members 422a that penetrate vertically. Such heat conductive members 422a are made of a material with a higher thermal conductivity than the inner saddle body 422, which enables rapid temperature control of the wafer 10 and maintains a uniform temperature distribution, as described above.

[0063] FIG. 11 is a front view of the multi-chambers in a multi-wafer test apparatus according to an embodiment of the present invention, and FIG. 12 is a front view of the multi-chambers in a multi-wafer test apparatus according to an embodiment of the present invention, showing an enlarged view of the multi-chambers.

[0064] Referring to FIG. 11, the chamber 120 of this embodiment is provided as a multi-chamber consisting of at least two chambers, and the cartridge module 200 can be seated in the chamber 120 by the transfer unit 150 and automatically connected to the tester 110, and the utility supply unit 215 of the cartridge module 200 can be connected to the drive source supply unit in the chamber 120 to supply power and air.

[0065] 12 shows a state in which the cartridge module 200 is seated in the chamber 120. Referring to FIG. 12, rollers 213 of the cartridge module 200 are positioned along guide rails 122, and a temperature control device consisting of a heating block 123 and a cooling block 124 is provided at the lower end of the second body portion 220. The heating block 123 and the cooling block 124 heat or cool the wafer 10 to a target temperature. Reference numeral 124a denotes a cooling manifold to which a refrigerant for cooling is supplied, and reference numeral 126 denotes an air manifold (CDA manifold) for supplying compressed air to the cartridge module 200. A lifting unit 216 for height adjustment may be provided at the lower end of the cooling block 124. The cartridge module 200 is seated in the chamber, and the heating / cooling blocks 123, 124 contact the second body part 220 by the lifting unit 216, and the temperature of the wafer to be inspected is controlled by conduction.

[0066] FIG. 13 is a configuration diagram showing a cartridge module loading stage 160 in a multi-wafer test apparatus according to an embodiment of the present invention.

[0067] Referring to FIG. 13, the cartridge module loading platform 160 can accommodate at least two cartridge modules 200 and can be positioned adjacent to the chamber.

[0068] The cartridge module loading platform 160 is for storing a probe card 211 or cartridge module 200 that needs to be replaced, and for replacing it with a new (repaired) probe card or cartridge module.

[0069] For example, a probe card or cartridge module 200A that has failed is transferred to the cartridge module loading platform 160 by the transfer unit 150 and waits to be transported outside for repair, and a probe card or cartridge module 200B that has been repaired from outside is stored on the cartridge module loading platform 160 by the transfer cart 170.

[0070] Such a cartridge module loading platform 160 can store normal probe cards and cartridge modules that can be used when replacement is required, and reference numeral '200C' indicates a normal cartridge module, and reference numeral '200D' indicates an assembly of the first body part 210 and the second body part 220 equipped with a probe card, excluding the second body part 220 equipped with a wafer chuck in the normal cartridge module.

[0071] The present invention described above is not limited to the above-described embodiments and accompanying drawings, and it will be obvious to those skilled in the art to which the present invention pertains that various substitutions, modifications and changes can be made without departing from the technical spirit of the present invention. [Explanation of symbols]

[0072] 110 Tester 120 Chamber 130 Wafer Loading Section 140 aligners 150 Transfer section 160 Cartridge Module Loading Platform 200 Cartridge Module 210 First Body Section 211 Probe Card 212 Guide hole 220, 320, 420 Second body section 221 Wafer Chuck 222 Magnet Holder 230 Weight Ring 240 Clamp section 231 Magnetic chuck 233 Friction Pad

Claims

1. At least two chambers to which a tester is connected and in which a test head for electrically connecting the probe card and the tester is provided; a cartridge module including a first body portion on which a probe card is provided, and a second body portion on which a wafer chuck for seating a wafer is provided and which is detachably assembled to the first body portion; a wafer loading unit that unclamps the first body part and the second body part, detaches the first body part and the second body part, loads a wafer into the second body part, and assembles the first body part and the second body part by a clamping operation; a transfer unit that transfers and conveys the cartridge module between the wafer loading unit and the chamber.

2. The chamber comprises: a guide rail on which the cartridge module is positioned; a temperature adjusting device provided at a lower end of the cartridge module seated on the guide rail, the temperature adjusting device adjusting a temperature; a lifting unit for lifting and lowering the temperature adjustment device; 2. The multi-wafer test apparatus according to claim 1, further comprising: a drive source supply unit for supplying a drive source to said cartridge module seated on said guide rail.

3. 2. The multi-wafer test apparatus according to claim 1, further comprising a cartridge module loading platform capable of accommodating at least two of said cartridge modules.

4. The cartridge module includes: a magnet holder is provided in the second body portion in correspondence with the guide hole formed in the first body portion; a weight ring having a magnetic chuck inserted into the guide hole and capable of being fixed to the magnet holder by magnetic force, the weight ring being assembled to the second body portion on the upper part of the first body portion; 2. The multi-wafer test apparatus according to claim 1, further comprising: a clamp portion provided between the first body portion and the weight ring, the clamp portion fixing a distance between the first body portion and the weight ring.

5. The multi-wafer test apparatus according to claim 4 , wherein the magnetic chuck further includes a friction pad provided between the magnetic chuck and the magnetic holder.

6. 5. The multi-wafer test device according to claim 4, wherein at least two of the magnetic chucks are provided below the weight ring.

7. 7. The multi-wafer test apparatus according to claim 6, wherein at least two clamping portions are provided between the first body portion and the weight ring.

8. 8. The multi-wafer test device according to claim 7, wherein at least one of the clamping portions is provided between the adjacent magnetic chucks.

9. The clamp portion is a shaft having one end fixed to either the weight ring or the first body portion; 5. The multi-wafer test apparatus according to claim 4, further comprising: a pneumatic drive portion fixed to the other of said weight ring and said first body portion, and fixed to said shaft by a pneumatic signal.

10. 10. The multi-wafer test device according to claim 9, wherein the pneumatic drive unit is of a normally closed type.

11. 5. The multi-wafer test apparatus of claim 4, further comprising a guide member interposed between the first body portion and the weight ring for guiding an assembly position of the first body portion and the weight ring.

12. A cartridge module that is equipped with a probe card for inspecting a wafer and that can modularize the wafer and the probe card and transport the same, a first body portion provided with a probe card and having a guide hole formed vertically therethrough; a second body part detachably assembled with the first body part, the second body part including a wafer chuck on which a wafer is seated and a magnet holder corresponding to the guide hole, so that the probe card and the wafer are electrically connected; a weight ring having a magnetic chuck inserted into the guide hole and capable of being fixed to the magnet holder by magnetic force, the weight ring being assembled to the second body portion on the upper part of the first body portion; a clamping portion that clamps / unclamps the first body portion and the second body portion to fix / detach the first body portion and the second body portion.

13. The cartridge module according to claim 12 , wherein the magnetic chuck further includes a friction pad provided between a contact surface thereof and the magnetic holder.

14. The clamp portion is a shaft having one end fixed to either the weight ring or the first body portion; The cartridge module according to claim 12 , further comprising: a pneumatic drive portion fixed to the other of the weight ring and the first body portion, and fixed to the shaft by a pneumatic signal.

15. 15. The cartridge module according to claim 14, wherein the pneumatic drive unit is of a normally closed type.

16. The second body portion is a thermally conductive saddle body in contact with the wafer chuck; 13. The cartridge module according to claim 12, wherein the saddle body includes an inner saddle body separated by a heat insulating member and in direct contact with the wafer chuck, and an outer saddle body that forms a periphery of the inner saddle body.

17. The cartridge module of claim 16, wherein the inner saddle body further includes a plurality of thermally conductive members formed vertically therethrough and having a thermal conductivity greater than that of the saddle body.

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