Pressurization device

Abstract

To provide a pressurization device which can collectively pressurize only portions required to be pressurized among a plurality of workpieces.SOLUTION: A pressurization device 1, 1Z according to the present invention is a pressurization device pressurizing a plurality of workpieces W. The pressurization device comprises: a mounting plate 14 on which the workpieces can be placed; a plurality of individual pressurizing members 7 which are disposed above the mounting plate and can individually pressurize each of the workpieces from above; a supporting metallic mold 6 which supports the individual pressurizing members; an upper metallic mold 3 which can pressurize the individual pressurizing members downward; and a pressurizing pad Pd, 18 which is disposed between the individual pressurizing members and the upper metallic mold. The individual pressurizing member is relatively movable in the vertical direction with respect to the supporting metallic mold. The pressurizing pad is deformable in accordance with an amount of relative movement of each individual pressurizing member with respect to the supporting metallic mold. When the workpieces are pressurized, the individual pressurizing members protrude from the supporting metallic mold toward the corresponding workpieces.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a pressure device. [Background technology]

[0002] A pressure device that applies pressure to multiple workpieces (objects to be pressed), such as substrates, at once is known (see, for example, Patent Document 1). This pressure device is equipped with a pressure pad that can apply pressure evenly to each workpiece. The pressure pad is made of a special elastic body that has a flexible body that deforms to follow the shape of each workpiece. Therefore, this pressure device can apply pressure evenly and collectively to multiple workpieces that have some height differences due to tolerances, etc. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-296746 Summary of the Invention [Problem to be solved by the invention]

[0004] In the pressure device disclosed in Patent Document 1, a flexible body deforms to conform to the shape of the workpiece. Therefore, the pressure device also applies pressure to areas that do not require pressure (for example, areas other than the chip on the substrate). Some workpieces have areas with low strength (for example, eaves-shaped areas). When such workpieces are pressurized using the pressure device, defects such as cracks or chips can occur in the areas with low strength. In other words, the pressure device has a technical problem in that it applies pressure not only to areas that require pressure but also to areas that do not require pressure.

[0005] An object of the present invention is to provide a pressure applying device capable of simultaneously applying pressure to only the portions of a plurality of workpieces that require pressure. [Means for solving the problem]

[0006] In one embodiment of the present invention, a pressure application device is a pressure application device for applying pressure to a plurality of workpieces, comprising: a loading plate on which the workpieces can be placed; a plurality of individual pressure application members arranged above the loading plate and capable of individually applying pressure to each of the workpieces from above; a support mold supporting the individual pressure application members; an upper mold capable of applying pressure to the individual pressure application members in a downward direction; and a pressure pad arranged between the individual pressure application members and the upper mold, wherein the individual pressure application members are movable vertically relative to the support mold, the pressure pad is deformable according to the amount of relative movement of each of the individual pressure application members with respect to the support mold, and when the workpieces are pressed, the individual pressure application members protrude from the support mold toward the corresponding workpiece. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a pressure device that can simultaneously apply pressure to only the portions of a plurality of workpieces that require pressure. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic cross-sectional view of a pressurizing device for explaining an embodiment of the pressurizing device according to the present invention. [Figure 2] FIG. 2 is a partially enlarged schematic cross-sectional view of the device. [Figure 3] FIG. 2 is a schematic bottom view of an upper mold provided in the device. [Figure 4] FIG. 2 is a schematic bottom view of an upper pressure unit provided in the device. [Figure 5] FIG. 2 is a schematic exploded perspective view of a portion of the upper pressure unit. [Figure 6] FIG. 2 is a schematic cross-sectional view showing one state of the device during operation. [Figure 7] FIG. 4 is a schematic cross-sectional view showing another state of the device during operation. [Figure 8] FIG. 8 is a partially enlarged schematic cross-sectional view of the device in the state shown in FIG. 7. [Figure 9] FIG. 10 is a schematic cross-sectional view showing yet another state of the device during operation. [Figure 10] FIG. 10 is a partially enlarged schematic cross-sectional view of the device in the state shown in FIG. 9. [Figure 11] FIG. 4 is a schematic cross-sectional view of a pressurizing device for explaining a second embodiment of the pressurizing device according to the present invention. [Figure 12] FIG. 10 is a partially enlarged schematic cross-sectional view of the device according to the second embodiment. [Figure 13] FIG. 10 is a schematic exploded perspective view of a part of the configuration of an upper pressurizing unit included in the device according to the second embodiment. [Figure 14] FIG. 10 is a schematic cross-sectional view showing one state of the device of the second embodiment during operation. [Figure 15] FIG. 10 is a schematic cross-sectional view showing another state of the device of the second embodiment during operation. [Figure 16] FIG. 16 is a partially enlarged schematic cross-sectional view of the device in the state shown in FIG. 15. [Figure 17] FIG. 10 is a schematic cross-sectional view showing yet another state of the device of the second embodiment during operation. [Figure 18] FIG. 18 is a partially enlarged schematic cross-sectional view of the device in the state shown in FIG. 17. [Figure 19] FIG. 10 is a schematic side view of an individual pressure member provided in the device according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment of a pressure device (hereinafter referred to as "the device") according to the present invention will be described below. In the following description, reference will be made to the drawings as appropriate. In the drawings, the same members and elements are designated by the same reference numerals, and duplicate explanations will be omitted. Furthermore, the dimensional proportions of the elements may be exaggerated for the sake of convenience, and are not limited to the proportions shown in the drawings.

[0010] In the following description and drawings, unless otherwise specified, when the three mutually orthogonal axes in space are the X-axis, Y-axis, and Z-axis, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the up-down direction. That is, the XY plane is a horizontal plane, and the XZ and YZ planes are vertical planes. The "X-axis direction" is the direction along the X-axis, the "+X direction" is one direction along the X-axis, and the "-X direction" is the other direction along the X-axis. The "Y-axis direction" is the direction along the Y-axis, the "+Y direction" is one direction along the Y-axis, and the "-Y direction" is the other direction along the Y-axis. The "Z-axis direction" is the direction along the Z-axis and is the up-down direction. The "+Z direction" is the upward direction, and the "-Z direction" is the downward direction. The "XY direction" is the direction along the X-axis and Y-axis directions, and the "XY plane" is an imaginary plane parallel to the XY directions. The "XZ direction" is the direction along the X-axis and Z-axis directions, and the "XZ plane" is an imaginary plane parallel to the XZ directions. The "YZ direction" is a direction along the Y-axis direction and the Z-axis direction, and the "YZ plane" is an imaginary plane parallel to the YZ direction.

[0011] In the following description, the lower surface is a surface that faces downward and is parallel to the X and Y directions, and the upper surface is a surface that faces upward and is parallel to the X and Y directions.

[0012] ●Pressure device (1)● ●Configuration of pressure device (1) FIG. 1 is a schematic cross-sectional view of the present device, showing an embodiment of the present device. FIG. 2 is a partially enlarged schematic cross-sectional view of the device 1. As shown in FIG. These figures show the state in which the device 1 placed on the XY plane is cut along the XZ plane (the same applies to Figures 6 to 10 described later). Figure 2 shows part A of the device 1 in Figure 1.

[0013] This apparatus 1 applies pressure to a workpiece W. This apparatus 1 includes a base 2, an upper mold 3, a side unit 4, a support unit 5, a support mold 6, multiple (nine in this embodiment) individual pressure members 7, multiple (nine in this embodiment) individual pressure pads 8, multiple (nine in this embodiment) biasing units 9, multiple (nine in this embodiment) individual protection plates 10, a mold receiving member 11, movement restricting members 12, an elevating device 13, a mounting plate 14, a heat unit 15, a control device 16, and a vacuum pump P. The base 2, the upper mold 3, the side unit 4, the support unit 5, the support mold 6, the individual pressure members 7, the individual pressure pads 8, the biasing units 9, the individual protection plates 10, the mold receiving member 11, and the movement restricting members 12 are arranged above the workpiece W in the vertical direction and constitute an upper pressure unit UP. The mounting plate 14 and the heat unit 15 are arranged below the workpiece W in the vertical direction and constitute a lower pressure unit DP.

[0014] The "workpiece W" is an object to be pressed by the apparatus 1. The workpiece W includes, for example, an electronic component w1, a substrate w2, and a paste-like adhesive w6. In this embodiment, the electronic component w1 is, for example, a power semiconductor element. The electronic component w1 is disposed at the upper end of the workpiece W. The substrate w2 is, for example, a DCB (Direct Copper Bonding) substrate formed by bonding a ceramic plate w3 to two copper plates w4 and w5 using DCB. The ceramic plate w3 is sandwiched between two copper plates w4 and w5, and the outer edge of the ceramic plate w3 protrudes horizontally from the copper plates w4 and w5. The adhesive w6 is a bonding layer that is sintered at high temperature and is disposed between the electronic component w1 and the substrate w2. The electronic component w1 is thermocompression-bonded to the substrate w2 by the apparatus 1. Because the thermocompression bonding method is well known, a detailed description thereof will be omitted.

[0015] The base 2 supports the upper mold 3, the side unit 4, and the support unit 5. The base 2 has a rectangular shape that is parallel to the XY direction and is a rectangular parallelepiped. The base 2 is supported by the lifting device 13 so that it can move up and down by the lifting device 13. The base 2 has a lower surface 2a. The lower surface 2a is a surface parallel to the XY plane.

[0016] The upper die 3 presses the workpiece W from above via the individual pressure members 7. The upper die 3 is made of, for example, a metal having high rigidity (for example, carbon steel). The upper die 3 is attached to the lower surface 2a of the base 2. The upper die 3 includes a base portion 30 and a plurality of (nine in this embodiment) individual upper dies 31.

[0017] FIG. 3 is a schematic bottom view of the upper mold 3. As shown in FIG. In the following description, FIGS. 1 and 2 will be referred to together with FIG. 3 as appropriate.

[0018] The base portion 30 has a rectangular shape extending along the XY direction and a flattened rectangular parallelepiped shape in the vertical direction. The base portion 30 has a lower surface 30a. A portion of the lower surface 30a protrudes downward in a rectangular parallelepiped shape to form an individual upper mold 31. In other words, the base portion 30 is configured integrally with the individual upper mold 31.

[0019] The individual upper dies 31 press the corresponding individual pressing members 7 downward to press the corresponding workpieces W. The individual upper dies 31 are shaped like a rectangular parallelepiped that is aligned with the X and Y directions. The individual upper dies 31 have a lower surface 31a. When viewed from below, the individual upper dies 31 are evenly arranged (3 rows x 3 columns) along the X and Y directions. In the following description, when the individual upper dies 31 are to be particularly distinguished from one another, the numbers "1" to "9" are added to the end of their names.

[0020] The individual upper molds 311, 312, and 313 are arranged in the +Y direction half of the base part 30 so as to extend along the X axis direction in order from the +X direction side. The individual upper molds 314, 315, and 316 are arranged in the center of the base part 30 in the Y axis direction so as to extend along the X axis direction in order from the +X direction side. The individual upper molds 317, 318, and 319 are arranged in the -Y direction half of the base part 30 so as to extend along the X axis direction in order from the +X direction side.

[0021] In the present invention, the upper mold 3 may be formed integrally with the base 2.

[0022] In the present invention, the upper mold 3 does not necessarily have to include the base portion 30. In this case, for example, the individual upper mold 31 may be attached to the lower surface 2a of the base 2, or may be formed integrally with the base 2.

[0023] FIG. 4 is a schematic bottom view of the upper pressure unit UP. In this figure, the base 2 of the upper pressure unit UP is omitted. In the following description, Figures 1 and 2 will be referred to as appropriate together with Figure 4. For the sake of convenience, in this figure, the outer edge of the upper mold 3 is indicated by a two-dot chain line, and the outer edge of a support member 50, which will be described later, is indicated by a thick two-dot chain line.

[0024] When the workpiece W is pressurized, the side unit 4, together with the base 2 and the mounting plate 14, forms a space (hereinafter referred to as the "accommodation chamber R"; see FIG. 6; the same applies below) in which the workpiece W is accommodated. The side unit 4 is disposed below the base 2. The side unit 4 includes a first side member 40, a second side member 41, a first seal member 42, a second seal member 43, a third seal member 44, and a cylinder 45.

[0025] The first side member 40 and the second side member 41 are shaped like a cylinder extending in the XY direction. That is, when viewed from below, a rectangular internal space is formed at the center of the first side member 40 and the second side member 41. The first side member 40 is attached to the lower surface 2a of the base 2. In the horizontal direction, the first side member 40 is disposed so as to surround the upper mold 3, the support unit 5, and the support mold 6. That is, when viewed from below, the upper mold 3, the support unit 5, and the support mold 6 are disposed in the internal space of the first side member 40. The second side member 41 is supported by the base 2 via a cylinder 45. In the horizontal direction, the second side member 41 is disposed so as to surround the first side member 40. That is, when viewed from below, the first side member 40 (the upper mold 3, the support unit 5, and the support mold 6) are disposed in the internal space of the second side member 41. The second side member 41 has a lower surface 41a, an upper surface 41b, and exhaust holes 41c. The exhaust holes 41c are through-holes that open to the inner and outer circumferential surfaces of the second side member 41.

[0026] The first seal member 42, the second seal member 43, and the third seal member 44 are, for example, known O-rings. The first seal member 42 is disposed between the base 2 and the first side member 40. The second seal member 43 is disposed between the first side member 40 and the second side member 41. The third seal member 44 is attached to the lower surface 41a.

[0027] The cylinder 45 raises and lowers the second side member 41. The cylinder 45 is attached to the lower surface 2a of the base 2 and the upper surface 41b of the second side member 41, and supports the second side member 41 so that it can be raised and lowered. The cylinder 45 is, for example, a known air cylinder.

[0028] The support unit 5 supports the support mold 6. The support unit 5 is disposed below the base 2. The support unit 5 includes a support member 50 and a plurality of spring members 51.

[0029] The support member 50 supports the support mold 6. The support member 50 has a rectangular frame shape extending along the XY directions. That is, when viewed from below, a rectangular internal space is formed in the center of the support member 50. The support member 50 is made of, for example, a metal having high rigidity (e.g., stainless steel). The support member 50 has a lower surface 50a and an upper surface 50b. When viewed from below, the support member 50 is disposed to the side of the upper mold 3 so as to surround the upper mold 3.

[0030] The spring member 51 supports the support member 50. The spring member 51 is attached to the lower surface 2a of the base 2 and the upper surface 50b of the support member 50, and supports the support member 50 so that it can move vertically relative to the upper mold 3. The spring member 51 is, for example, a known coil spring.

[0031] FIG. 5 is a schematic exploded perspective view of a portion of the upper pressure unit UP (the upper mold 3, the support mold 6, the individual pressure members 7, the individual pressure pads 8, the biasing units 9, and the individual protection plates 10). In the following description, FIGS. 1 to 4 will be referred to together with FIG. 5 as appropriate.

[0032] The support mold 6 supports the individual pressure members 7 so that they can move relative to the support mold 6 in the up-down direction. The support mold 6 is made of, for example, a metal (e.g., carbon steel) having high rigidity. The support mold 6 has a rectangular shape extending along the XY direction, and is a rectangular parallelepiped. When viewed from below, the shape (size) of the outer edge of the support mold 6 is the same as the shape (size) of the outer edge of the support member 50. The support mold 6 is disposed below the upper mold 3 and the support unit 5. The support mold 6 has a lower surface 6a, an upper surface 6b, and multiple (nine in this embodiment) accommodation holes 6c. The support mold 6 is attached to the lower surface 50a of the support member 50 via a movement restricting member 12.

[0033] The receiving hole 6c is a through-hole that penetrates the support mold 6 in the vertical direction. The receiving hole 6c has a rectangular shape along the XY direction and a two-tiered prism shape. The receiving hole 6c has an inner peripheral surface 6d and an inner flange portion 6e. The lower end of the inner peripheral surface 6d of the receiving hole 6c protrudes horizontally (inward of the receiving hole 6c) along the entire circumference to form the inner flange portion 6e. In other words, a two-tiered prism-shaped space is formed inside the receiving hole 6c. The inner flange portion 6e has a rectangular shape along the XY direction and a frame shape. The inner flange portion 6e has an upper surface 6f. Each receiving hole 6c corresponds to a respective individual upper mold 31. This correspondence will be described later. When viewed from below, the receiving holes 6c are located at the same positions as the corresponding individual upper mold 31. In the following description, when the receiving holes 6c are particularly distinguished from one another, the numbers "1" to "9" will be added to the end of their names.

[0034] As will be described later, when the workpiece W is pressed, the portions of the support mold 6 other than the accommodation holes 6c receive pressure (pressing force) in the horizontal direction from the individual pressure pads 8. Therefore, the length (thickness) of the portions in the horizontal direction is designed to be a length that will not be deformed by the pressure.

[0035] The individual pressure members 7 individually pressurize the corresponding workpieces W from above. The individual pressure members 7 are made of, for example, a highly rigid metal (e.g., carbon steel). As shown in FIG. 2, the individual pressure members 7 have a lower surface 7a, an upper surface 7b, a main body 7c, and an outer flange 7d. The lower surface 7a is the lower surface of the main body 7c, and the upper surface 7b is the upper surface of the main body 7c and the outer flange 7d. Each individual pressure member 7 corresponds to each of the accommodating holes 6c and each of the individual upper dies 31. This correspondence will be described later. The individual pressure members 7 are accommodated in the corresponding accommodating holes 6c. The individual pressure members 7 are movable (slidable) in the vertical direction within the corresponding accommodating holes 6c. In other words, the individual pressure members 7 are movable in the vertical direction relative to the support die 6. In the following description, when the individual pressure members 7 are to be specifically distinguished from one another, the numbers "1" to "9" will be added to the end of their names.

[0036] The main body 7c has a rectangular shape extending along the X and Y directions, and is a rectangular parallelepiped. In the X and Y directions, the length (width) of the main body 7c is smaller than the length (width) of the receiving hole 6c in the inner flange 6e. In the vertical direction, the length (height) of the main body 7c is smaller than the length of the receiving hole 6c (i.e., the length of the support mold 6).

[0037] The upper end of the outer peripheral surface of the main body portion 7c protrudes outward along the entire circumference, forming an outer flange portion 7d. That is, when viewed from the side, the shape of the individual pressure applying member 7 is "T" shaped. The shape of the outer flange portion 7d is rectangular along the XY directions. In the XY directions, the length (width) of the outer flange portion 7d is slightly smaller than the length (width) of the corresponding accommodating hole 6c (to the extent that the individual pressure applying member 7 can slide within the accommodating hole 6c). The outer flange portion 7d has a lower surface 7e. In the vertical direction, the lower surface 7e is disposed so as to face the upper surface 6f of the corresponding inner flange portion 6e.

[0038] When the workpiece W is pressed, the individual pressure pads 8 deform according to the relative movement of the corresponding individual pressure members 7 with respect to the support mold 6. As shown in FIG. 2, the individual pressure pads 8 include a flexible body 8a and two membranes 8b and 8c. Each individual pressure pad 8 corresponds to a corresponding accommodation hole 6c and a corresponding individual pressure member 7. This correspondence will be described later. The individual pressure pads 8 are accommodated in the corresponding accommodation hole 6c and disposed adjacent to the corresponding individual pressure member 7 above the corresponding individual pressure member 7. That is, the individual pressure pads 8 are disposed between the corresponding individual pressure member 7 and the corresponding individual upper mold 31 (upper mold 3). That is, the individual pressure pads 8 function as pressure pads in the present invention. In other words, the present device 1 includes a pressure pad Pd that includes a plurality of individual pressure pads 8 and is disposed between the upper mold 3 and the individual pressure members 7. In the following description, when the individual pressure pads 8 are to be specifically distinguished from one another, the numbers "1" to "9" will be added to the end of their names.

[0039] When the workpiece W is pressed, the flexible body 8a uniformly transmits the pressure from the corresponding individual upper mold 31 to the corresponding individual pressing member 7. The flexible body 8a is made of, for example, a known elastic material having high fluidity and low resilience (for example, a high-damping thermally conductive gel sheet "αGEL (registered trademark)" manufactured by Geltec Co., Ltd.). When pressed against an uneven object, the flexible body 8a has flexibility that allows it to deform to follow the uneven shape of the object. The flexible body 8a is, for example, filled between two films 8b and 8c arranged above and below the flexible body 8a.

[0040] The films 8b and 8c prevent the corresponding individual pressure applying members 7 and individual protective plates 10 from adhering to the flexible body 8a. The films 8b and 8c also function as sealants that prevent the flexible body 8a from entering the gap between the corresponding accommodating hole 6c and the individual pressure applying member 7 (outer flange portion 7d) and the gap between the corresponding accommodating hole 6c and the individual protective plate 10. The films 8b and 8c are shaped like a rectangle extending along the XY direction, and are film-like. In the XY direction, the length (width) of the films 8b and 8c is the same as or slightly larger than the length (width) of the corresponding accommodating hole 6c.

[0041] In the present invention, when the size of the gap between the corresponding accommodating hole 6c and the individual pressure member 7 (outer flange portion 7d) and the gap between the corresponding accommodating hole 6c and the individual protection plate 10 are large enough to prevent the flexible body 8a from penetrating, the length (width) of the films 8b, 8c in the XY directions may be smaller than the length (width) of the accommodating hole 6c. In this case, a sealant (e.g., an O-ring) may be disposed between the accommodating hole 6c and the outer flange portion 7d. Furthermore, when the flexible body 8a is made of a material that does not penetrate into the gap, the individual pressure pad 8 does not need to include the films 8b, 8c.

[0042] The biasing units 9 bias the individual pressure members 7 upward. The biasing units 9 are configured, for example, with one or more (four in this embodiment) biasing members (e.g., coil springs). Each biasing unit 9 corresponds to a corresponding accommodation hole 6c and individual pressure member 7. This correspondence will be described later. The biasing units 9 are accommodated in the corresponding accommodation hole 6c and are disposed between the upper surface 6f of the corresponding inner flange portion 6e and the lower surface 7e of the outer flange portion 7d of the individual pressure member 7. In the following description, when the biasing units 9 are to be particularly distinguished from one another, the numbers "1" to "9" will be added to the end of their names.

[0043] In the present invention, the number of biasing members constituting the biasing unit 9 is not limited to "4". That is, for example, the biasing unit 9 may be composed of one coil spring arranged so that the main body portion 7c serves as a core material. Furthermore, the biasing member is not limited to a coil spring. That is, for example, the biasing member may be a leaf spring.

[0044] The individual protection plates 10 protect the individual pressure pads 8 from the individual upper molds 31. The individual protection plates 10 are made of, for example, a metal (e.g., carbon steel) having high rigidity. The individual protection plates 10 are shaped like a rectangular plate extending along the XY directions. In the XY directions, the length (width) of the individual protection plates 10 is slightly smaller than the length (width) of the corresponding accommodating holes 6c. Each individual protection plate 10 corresponds to each individual upper mold 31, each accommodating hole 6c, and each individual pressure pad 8. This correspondence will be described later. The individual protection plates 10 are disposed below the corresponding individual upper molds 31, are accommodated in the corresponding accommodating holes 6c, and are placed on the corresponding individual pressure pads 8. In the following description, when the individual protection plates 10 are to be particularly distinguished from one another, the numbers "1" to "9" will be added to their end.

[0045] The die receiving member 11 receives downward pressure from the support die 6 when pressure is applied to the workpiece W. Furthermore, the die receiving member 11 determines the vertical position (height) of the support die 6 relative to the mounting plate 14 when pressure is applied to the workpiece W. The die receiving member 11 is made of, for example, a known hard insulating material (for example, an insulating material having a compressive strength of several tens of MPa to 100 MPa or more). The die receiving member 11 has a rectangular frame shape extending along the XY direction. The die receiving member 11 is attached to the outer edge of the lower surface 6a of the support die 6. As a result, the die receiving member 11 faces a mounting surface 14a (described later) of the mounting plate 14. As shown in FIG. 2, the length (thickness) L11 of the die receiving member 11 in the vertical direction is greater than the length (thickness) Lw of the workpiece W. The die receiving member 11 has a lower surface 11a.

[0046] The movement restricting member 12 restricts upward movement of the individual pressure members 7, individual pressure pads 8, and individual protection plates 10 by the biasing unit 9. The movement restricting member 12 is rectangular and plate-shaped along the XY directions. The movement restricting member 12 is disposed above the support mold 6 and attached to the upper surface 6b of the support mold 6. The movement restricting member 12 has a lower surface 12a and a plurality of (nine in this embodiment) insertion holes 12b.

[0047] The insertion holes 12b are through-holes that penetrate the movement restricting member 12 in the vertical direction. The shape of the insertion holes 12b is a rectangle along the XY direction. Each insertion hole 12b corresponds to a corresponding individual upper mold 31, a corresponding storage hole 6c, and a corresponding individual protective plate 10. The correspondence will be described later. When viewed from below, the insertion holes 12b are located at the same positions as the corresponding individual upper mold 31 and storage hole 6c. When viewed from above, the portion of the movement restricting member 12 surrounding the insertion holes 12b covers the outer edge of the corresponding storage hole 6c in a rectangular frame shape. As a result, this portion restricts the upward movement of the corresponding individual pressure member 7, individual pressure pad 8, and individual protective plate 10. In the XY direction, the length (width) of the insertion holes 12b is greater than the length (width) of the corresponding individual upper mold 31 and smaller than the length (width) of the corresponding storage hole 6c and individual protective plate 10. In the following description, when the insertion holes 12b are to be particularly distinguished from one another, the numbers "1" to "9" are added to the end of the numbers.

[0048] In the present invention, the movement restricting member 12 may be made up of a plurality of frame-shaped members (for example, the same number as the number of receiving holes 6c).

[0049] The lifting device 13 lifts and lowers the base 2. The lifting device 13 is, for example, a known hydraulic cylinder.

[0050] The mounting plate 14 is a member on which the workpiece W is placed. The mounting plate 14 is made of, for example, graphite or a metal with high thermal conductivity (for example, a copper alloy). The mounting plate 14 has a rectangular plate shape extending along the XY direction when viewed from below. The mounting plate 14 is placed on the heating unit 15. The mounting plate 14 has a mounting surface 14a, which is its upper surface.

[0051] The heating unit 15 heats the workpiece W. The heating unit 15 is made of, for example, a metal (e.g., carbon steel) having high rigidity. The heating unit 15 has a rectangular shape along the XY axis direction when viewed from above and below, that is, a rectangular parallelepiped shape. The heating unit 15 includes a plurality of heaters and a refrigerant flow path (both not shown) arranged inside the heating unit 15.

[0052] The control device 16 controls the overall operation of the device 1 .

[0053] The vacuum pump P adjusts the atmosphere inside the accommodation chamber R (described later) to a reduced pressure atmosphere (vacuum atmosphere). The vacuum pump P is a known vacuum pump. The vacuum pump P is connected to the exhaust hole 41c via a pipe.

[0054] Here, among the individual upper mold 31, the accommodation hole 6c, the individual pressure member 7, the individual pressure pad 8, the biasing unit 9, the individual protective plate 10, and the insertion hole 12b, components with the same reference numerals for distinction correspond to each other. That is, for example, the individual upper mold 311, the accommodation hole 6c1, the individual pressure member 71, the individual pressure pad 81, the biasing unit 91, the individual protective plate 101, and the insertion hole 12b1 correspond to each other. The individual pressure member 71, the individual pressure pad 81, the biasing unit 91, and the individual protective plate 101 are accommodated in the accommodation hole 6c1. The individual pressure member 71 is movable (slidable) in the vertical direction within the accommodation hole 6c1. The individual pressure pad 81 is disposed above and adjacent to the individual pressure member 71. The biasing unit 91 biases the individual pressure member 71, the individual pressure pad 81, and the individual protective plate 101 upward. The individual protection plate 101 is disposed below the individual upper mold 311 and placed on the individual pressure pad 81. When viewed from above, the portion of the movement restricting member 12 surrounding the insertion hole 12b1 covers the outer edge of the accommodation hole 6c1 in a rectangular frame shape. As a result, this portion restricts the upward movement of the individual pressure member 71, the individual pressure pad 81, and the individual protection plate 101.

[0055] The device 1 configured in this manner is capable of pressurizing different types of workpieces W by replacing the upper mold 3 (individual upper mold 31), support mold 6, individual pressure member 7, individual pressure pad 8, biasing unit 9, individual protective plate 10, and movement restricting member 12.

[0056] ●Operation of pressure device (1) Next, the operation of the present apparatus 1 will be described below. In the following description, the present apparatus 1 simultaneously pressurizes nine workpieces W. In the following description, FIGS. 1, 2, and 5 will be referred to as appropriate.

[0057] As shown in FIG. 1, when the workpiece W is not being pressed, the upper pressurizing unit UP is positioned above the lower pressurizing unit DP and spaced apart from it. In this state, as shown in FIG. 2, the biasing unit 9 biases the corresponding individual pressurizing members 7, individual pressurizing pads 8, and individual protective plates 10 upward in the accommodation holes 6c. As a result, the individual pressurizing members 7 are accommodated in the corresponding accommodation holes 6c and do not protrude downward from the support mold 6. Furthermore, the individual protective plates 10 abut against the movement restricting members 12, so the individual pressurizing members 7, individual pressurizing pads 8, and individual protective plates 10 do not protrude upward from the accommodation holes 6c. The individual upper molds 31 face the corresponding individual protective plates 10 and are positioned above the corresponding accommodation holes 6c and insertion holes 12b. The support molds 6 and individual pressurizing members 7 are positioned above the mounting plate 14.

[0058] First, the workpieces W are placed on the placement surface 14a of the placement plate 14. At this time, each workpiece W is positioned below the corresponding individual pressing member 7.

[0059] In the present invention, the workpiece W may be placed on the placement plate 14 and transported together with the placement plate 14 to above the heating unit 15.

[0060] Next, the lifting device 13 lowers the upper pressurizing unit UP. Specifically, the lifting device 13 lowers the upper pressurizing unit UP until the second side member 41 and the third seal member 44 come into close contact with the mounting plate 14. At this time, a storage chamber R for storing the workpiece W is formed between the upper pressurizing unit UP and the mounting plate 14. The storage chamber R is a space surrounded by the base 2, the side unit 4, and the mounting plate 14.

[0061] FIG. 6 is a schematic cross-sectional view showing one state of the device 1 during operation. The figure shows a state in which the storage chamber R is formed.

[0062] Next, the vacuum pump P makes the atmosphere in the accommodation chamber R into a reduced pressure atmosphere.

[0063] Next, the lifting device 13 lowers the upper pressure unit UP until the mold receiving member 11 abuts against the mounting plate 14. At this time, the second side member 41 moves upward relative to the first side member 40 in response to the lowering of the base 2.

[0064] FIG. 7 is a schematic cross-sectional view showing another state of the device 1 during operation. FIG. 8 is a partially enlarged schematic cross-sectional view of the device 1 in the state shown in FIG. These figures show a state in which the mold receiving member 11 is in contact with the mounting plate 14. FIG. 8 shows part B of the present device 1 in FIG.

[0065] When the mold receiving member 11 abuts against the mounting plate 14, the mold receiving member 11 is pressed downward by the spring member 51 via the support member 50 and the support mold 6. That is, the mold receiving member 11 is sandwiched between the support mold 6 (lower surface 6a) and the mounting plate 14 (mounting surface 14a). At this time, the mold receiving member 11 receives the pressure applied downward from the support mold 6 (mainly the pressure caused by the weight of the support member 50 and the support mold 6, and the pressing force from the spring member 51). In addition, due to this pressure, a frictional force is generated between the mold receiving member 11 and the mounting plate 14 that prevents the support mold 6 from moving horizontally relative to the mounting plate 14. As a result, the support mold 6 does not slide horizontally relative to the mounting plate 14. Furthermore, the position of the lower surface 6a relative to the mounting surface 14a in the vertical direction is maintained at a position corresponding to the length L11 of the mold receiving member 11. That is, the position of the supporting mold 6 relative to the mounting plate 14 (workpiece W) is fixed (determined) by the mold receiving member 11 abutting against the mounting plate 14. In this state, the supporting mold 6 (lower surface 6a) and the individual pressure members 7 (lower surfaces 7a) do not come into contact with the workpiece W. Therefore, problems such as movement of the workpiece W or unintended pressure on the workpiece W due to these members coming into contact with the workpiece W do not occur. In this way, the mold receiving member 11 is pressed against the mounting plate 14, and the mold receiving member 11 determines the position of the supporting mold 6 relative to the mounting plate 14 (workpiece W).

[0066] Next, the heat unit 15 heats the workpiece W to a predetermined temperature (for example, 300° C.).

[0067] In the present invention, the timing at which the heat unit 15 starts heating the workpiece W may be before the upper pressure unit UP descends.

[0068] Next, the lifting device 13 lowers the upper pressure unit UP until each individual pressure member 7 abuts against the corresponding workpiece W. At this time, the individual upper mold 31 is inserted into the corresponding insertion hole 12b and abuts against the corresponding individual protective plate 10. Furthermore, the spring member 51 contracts as the base 2 descends, causing the support member 50 and the support mold 6 to move upward relative to the upper mold 3. Next, the individual upper mold 31 presses the corresponding individual protective plate 10 downward. At this time, the individual upper mold 31, the individual pressure member 7, the individual pressure pad 8, and the individual protective plate 10 move downward (slide) within the accommodating hole 6c against the biasing force of the biasing unit 9. That is, the individual upper mold 31, the individual pressure member 7, the individual pressure pad 8, and the individual protective plate 10 move downward relative to the support mold 6. As a result, the individual pressure member 7 protrudes from the accommodating hole 6c toward the corresponding workpiece W and abuts against the upper end (electronic component w1) of the corresponding workpiece W. The individual pressure members 7 contact only the portions of the workpiece W that require pressure (electronic components w1). Here, the length Lw of each workpiece W and the position of the lower surface 7a of each individual pressure member 7 in the vertical direction may vary slightly depending on the tolerances of the workpiece W and each member. Therefore, the amount of relative movement of each individual pressure member 7 with respect to the support mold 6 may vary slightly (there is a difference in the amount of relative movement).

[0069] Next, the lifting device 13 lowers the upper pressurizing unit UP until each individual pressurizing member 7 applies a specified pressure (for example, several tens of MPa, hereinafter referred to as "specified pressure") to the corresponding workpiece W (the workpiece W is pressurized).

[0070] FIG. 9 is a schematic cross-sectional view showing yet another state of the device 1 during operation. FIG. 10 is a partially enlarged schematic cross-sectional view of the device 1 in the state shown in FIG. 9 shows a state in which the workpiece W is being pressed. FIG. 10 shows part C of the apparatus 1 in FIG.

[0071] In this state, the individual pressure pad 8 (flexible body 8a) is deformed according to the relative movement of the corresponding individual pressure member 7. As a result, the specified pressure from the corresponding individual upper mold 31 is evenly transmitted to the corresponding individual pressure member 7. In other words, the individual upper mold 31 presses the corresponding individual pressure member 7 downward. As described above, the flexible body 8a is sandwiched between two films 8b, 8c. Therefore, the flexible body 8a does not penetrate into the gap between the accommodating hole 6c and the individual pressure member 7 (outer flange portion 7d) or the gap between the accommodating hole 6c and the individual protective plate 10. Furthermore, because the flexible body 8a absorbs differences in the relative movement of the corresponding individual pressure member 7, the specified pressure from the individual upper mold 31 is evenly transmitted to all workpieces W. As described above, the flexible body 8a is made of a gel sheet and can absorb differences on the order of several hundred microns. At this time, as the individual pressure pads 8 deform, the specified pressure from the individual upper mold 31 is also transmitted in the horizontal direction (i.e., to the inner peripheral surface 6d of the receiving hole 6c) via the individual pressure pads 8. Therefore, as described above, the support mold 6 is designed not to deform due to the specified pressure transmitted to the inner peripheral surface 6d.

[0072] As described above, the individual pressure members 7 contact only the electronic components w1 of the corresponding workpieces W and apply downward pressure only to the electronic components w1. Therefore, the outer edge of the ceramic plate w3 protruding from the copper plates w4 and w5 is not pressed, and defects such as cracks or chips do not occur in the outer edge. In this way, the present device 1 uses the individual pressure members 7 that move relative to the support mold 6 to simultaneously apply pressure to only the portions of each of the multiple workpieces W that require pressure (electronic components w1).

[0073] When the workpiece W is being pressed, each coil spring constituting the biasing unit 9 is not fully compressed. Therefore, the specified pressure transmitted to the individual pressure members 7 is transmitted to the workpiece W, not to the inner flange portion 6e (supporting die 6). Furthermore, as described above, when the workpiece W is being pressed, the support member 50 and the supporting die 6 move upward relative to the upper die 3. Therefore, the specified pressure from the upper die 3 is transmitted primarily to the individual pressure members 7, not to the supporting die 6. Therefore, in the present device 1, the pressure required from the lifting device 13 to pressurize the workpiece W is reduced (for example, by about one-quarter) compared to a conventional pressurizing device (hereinafter referred to as the "conventional device") that pressurizes multiple workpieces with a pressure pad arranged to cover the entire surface of the upper die. As a result, the lifting device 13 is more compact than the conventional device. Furthermore, the pressure resistance required of the supporting die 6 is smaller than when the upper surface 6b of the supporting die 6 is pressed. Therefore, the vertical length of the supporting die 6 can be reduced, and the weight of the supporting die 6 can be reduced.

[0074] Next, the lifting device 13 maintains the state in which the specified pressure is applied to the workpiece W for a predetermined time. Here, the support mold 6 is not in contact with the mounting plate 14, and the mold receiving member 11 is made of a heat-insulating material. Therefore, the heat from the heat unit 15 is indirectly transmitted to the individual pressure members 7 via the workpiece W, but is not directly transmitted from the mounting plate 14 to the support mold 6.

[0075] Next, the lifting device 13 raises the upper pressure unit UP. At this time, the individual upper mold 31 rises within the corresponding storage hole 6c and moves upward from the corresponding insertion hole 12b. As a result, the individual pressure member 7, individual pressure pad 8, and individual protective plate 10 rise within the storage hole 6c due to the biasing force of the biasing unit 9, and the individual pressure member 7 is accommodated in the storage hole 6c. Therefore, the individual pressure member 7 does not protrude downward from the support mold 6. In addition, the flexible body 8a of the individual pressure pad 8 returns to its pre-pressure state, and the individual protective plate 10 abuts against the movement restricting member 12. As described above, the individual protective plate 10 is disposed between the film 8b and the individual upper mold 31. Therefore, when the individual upper mold 31 moves upward from the storage hole 6c, the film 8b (individual pressure pad 8) does not adhere to the individual upper mold 31 and is not lifted out of the storage hole 6c together with the individual upper mold 31.

[0076] When the lifting device 13 raises the upper pressurizing unit UP, the control device 16 purges the storage chamber R with gas (e.g., nitrogen gas) to make the atmosphere in the storage chamber R an atmospheric pressure atmosphere. Also, the heating unit 15 stops heating the workpiece W.

[0077] Summary (1) According to the embodiment described above, the apparatus 1 includes an upper mold 3, a support mold 6, a plurality of individual pressure members 7, a pressure pad Pd having a plurality of individual pressure pads 8, and a mounting plate 14. The support mold 6 supports each individual pressure member 7. The individual pressure members 7 are disposed above the mounting plate 14 and can individually pressurize the corresponding workpieces W from above. The pressure pads Pd (individual pressure pads 8) are disposed between the upper mold 3 and the corresponding individual pressure members 7. The individual pressure members 7 are movable vertically relative to the support mold 6. The pressure pads Pd are deformable according to the amount of relative movement of the corresponding individual pressure members 7 with respect to the support mold 6. When the workpieces W are pressed, the individual pressure members 7 protrude downward from the support mold 6 toward the corresponding workpieces W. With this configuration, when the workpieces W are pressed, only the individual pressure members 7 are in contact with the workpieces W, and pressure from the upper mold 3 is applied only to the upper end (electronic component w1) of the workpieces W via the individual pressure members 7. Therefore, the outer edge of the ceramic plate w3 protruding from the copper plates w4 and w5 is not pressed, and defects such as cracks or chips do not occur at the outer edge. In this way, the device 1 uses the individual pressing members 7 that move relatively to the support mold 6 to simultaneously pressurize only the portions of each of the multiple workpieces W that require pressure (electronic components w1).

[0078] Furthermore, according to the embodiment described above, the present apparatus 1 includes a support member 50 that supports the support mold 6. The support member 50 is disposed to the side of the upper mold 3 when viewed from below, and is movable in the vertical direction relative to the upper mold 3. With this configuration, when the workpiece W is pressed, the pressure from the upper mold 3 is concentrated on the individual pressing members 7 and is not transmitted to the support mold 6. Therefore, the lifting device 13 of the present apparatus 1 is made smaller than conventional devices. Furthermore, the pressure resistance required of the support mold 6 is smaller than when the upper surface 6b of the support mold 6 is pressed. Therefore, the length of the support mold 6 in the vertical direction can be reduced, and the weight of the support mold 6 can be reduced.

[0079] Furthermore, according to the embodiment described above, the upper mold 3 includes a plurality of individual upper molds 31 corresponding to the individual pressure members 7. The pressure pad Pd includes a plurality of individual pressure pads 8 corresponding to the individual pressure members 7. The support mold 6 includes a plurality of accommodating holes 6c that penetrate the support mold 6 in the vertical direction and accommodate the corresponding individual pressure members 7 and individual pressure pads 8. The individual upper molds 31 are movable in the vertical direction relative to the support mold 6 within the corresponding accommodating holes 6c. The individual pressure pads 8 are deformable in accordance with the amount of relative movement of the corresponding individual pressure members 7 with respect to the support mold 6. According to this configuration, the specified pressure from the corresponding individual upper molds 31 is transmitted evenly to the corresponding individual pressure members 7. Furthermore, the flexible bodies 8a absorb differences in the amount of relative movement of the individual pressure members 7, and the specified pressure from the individual upper molds 31 is transmitted evenly to all of the workpieces W.

[0080] Furthermore, according to the embodiment described above, the apparatus 1 includes a plurality of biasing units 9 each composed of a plurality of biasing members. Each biasing unit 9 is disposed between the inner flange portion 6e of the support mold 6 and the outer flange portion 7d of the corresponding individual pressure member 7, and biases the corresponding individual pressure member 7 upward. When the workpiece W is not being pressed, each individual upper mold 31 is positioned above the corresponding accommodation hole 6c, and each individual pressure member 7 is biased upward by the biasing force of the biasing unit 9 and does not protrude downward from the support mold 6. With this configuration, when the upper pressure unit UP descends, before the support mold 6 is positioned or before the specified pressure from the individual upper mold 31 is applied to the individual pressure member 7, the individual pressure member 7 (lower surface 7a) does not protrude from the support mold 6 and does not contact the workpiece W. Therefore, problems such as movement of the workpiece W due to contact of the lower surface 7a with the workpiece W do not occur. As a result, the apparatus 1 can stably pressurize multiple workpieces W simultaneously.

[0081] Furthermore, according to the embodiment described above, the apparatus 1 includes a mold receiving member 11. The mold receiving member 11 is attached to the lower surface 6a of the support mold 6 and is disposed between the lower surface 6a and the mounting surface 14a in the vertical direction so as to face the mounting surface 14a. The length L11 of the mold receiving member 11 in the vertical direction is greater than the length Lw1 of each workpiece W. With this configuration, when the workpiece W is pressed, the support mold 6 (lower surface 6a) does not come into contact with the workpiece W. Therefore, problems such as movement of the workpiece W due to contact of the lower surface 6a with the workpiece W or unintended pressing of the workpiece W do not occur. Furthermore, the position of the support mold 6 relative to the mounting plate 14 in the vertical direction is maintained at a position corresponding to the length of the mold receiving member 11. Furthermore, when the mold receiving member 11 abuts against the mounting surface 14a, the position of the support mold 6 relative to the mounting plate 14 (workpiece W) is fixed (determined).

[0082] In the present invention, the material of the flexible body 8a is not limited to a gel sheet. That is, for example, when the difference in height between the workpieces W is minute, on the order of several tens of μm, the material of the flexible body 8a may be a material (such as silicone rubber) that has lower conformability to the shape than the gel sheet.

[0083] In the present invention, the device 1 does not necessarily have to include the individual protection plates 10.

[0084] Furthermore, in the present invention, the mold receiving member 11 may be attached to a mounting plate 14 .

[0085] Furthermore, in the present invention, the device 1 does not necessarily have to include the movement restricting member 12. In this case, for example, the length of the accommodating hole 6c in the vertical direction or the biasing force of the biasing unit 9 is adjusted so that the entire individual protection plate 10 does not protrude upward from the accommodating hole 6c.

[0086] Furthermore, in the present invention, the mold receiving member 11 may be formed integrally with the support mold 6 and / or the mounting plate 14.

[0087] Furthermore, in the present invention, when the workpiece W is not being pressed, the individual pressure members 7 may protrude downward from the support mold 6. In this case, it is preferable that the amount of protrusion is limited to an extent that the individual pressure members 7 do not come into contact with the workpiece W when the mold receiving member 11 abuts against the mounting plate 14.

[0088] ●Pressure device (2)● Next, another embodiment of the present device (hereinafter referred to as the "second embodiment") will be described below, focusing on the differences from the previously described embodiment (hereinafter referred to as the "first embodiment"). In the second embodiment, the configuration of the upper pressure unit differs from that of the first embodiment. In the following description of the second embodiment, for convenience of explanation, the same components as those in the first embodiment and components having common functions are assigned the same reference numerals as those in the first embodiment, and detailed explanations will be omitted.

[0089] ●Configuration of pressure device (2) FIG. 11 is a schematic cross-sectional view of the device, showing a second embodiment of the device. FIG. 12 is a partially enlarged schematic cross-sectional view of the device 1Z. These figures show the state in which the device 1Z placed on the XY plane is cut along the XZ plane (the same applies to Figures 14 to 18 described later). Figure 12 shows part D of the device 1Z in Figure 11.

[0090] This device 1Z pressurizes the workpiece W. This device 1Z includes a base 2, an upper mold 3Z, a side unit 4, a support unit 5, a support mold 6Z, multiple (nine in this embodiment) individual pressure members 7, multiple (nine in this embodiment) biasing units 9, a mold receiving member 11Z, an elevating device 13, a mounting plate 14, a heat unit 15, a control device 16, a frame member 17, a pressure pad 18, and a vacuum pump P. The base 2, the upper mold 3Z, the side unit 4, the support unit 5, the support mold 6Z, the individual pressure members 7, the biasing units 9, the frame member 17, and the pressure pad 18 are arranged above the workpiece W in the vertical direction and constitute an upper pressure unit UPZ. The mold receiving member 11Z, the mounting plate 14, and the heat unit 15 are arranged below the workpiece W in the vertical direction and constitute a lower pressure unit DPZ.

[0091] The upper die 3Z presses the workpiece W from above via the individual pressure members 7. The upper die 3Z is made of, for example, a metal having high rigidity (for example, carbon steel). The upper die 3Z has a rectangular shape along the XY axis direction and a flattened rectangular parallelepiped shape in the vertical direction. The upper die 3Z has a lower surface 3a. The upper die 3Z is attached to the lower surface 2a of the base 2.

[0092] The support unit 5 supports the frame member 17. The support unit 5 is disposed below the base 2. When viewed from below, the support member 50 is disposed on the side of the upper mold 3Z so as to surround the upper mold 3Z.

[0093] 13 is a schematic exploded perspective view of a portion of the upper pressure unit UPZ (upper mold 3Z, support mold 6Z, individual pressure members 7, frame member 17, and pressure pad 18). In the following description, FIGS. 11 and 12 will be referred to along with FIG. 13 as appropriate.

[0094] The support mold 6Z supports the individual pressure members 7 so that they can move relative to the support mold 6Z in the vertical direction. The support mold 6Z is made of, for example, a metal (e.g., carbon steel) having high rigidity. The support mold 6Z has a rectangular shape extending along the XY direction and is a rectangular parallelepiped. When viewed from below, the shape (size) of the outer edge of the support mold 6Z is the same as the shape (size) of the outer edge of the support member 50 and the shape (size) of the outer edge of the frame member 17. The support mold 6Z is disposed below the upper mold 3Z, the support unit 5, the frame member 17, and the pressure pad 18. The support mold 6Z is supported by the frame member 17. The support mold 6Z has a lower surface 6a, an upper surface 6b, multiple (nine in this embodiment) accommodating holes 6c, and recesses 6g. The accommodating holes 6c accommodate the corresponding individual pressure members 7 and biasing units 9.

[0095] The upper surface 6b of the support mold 6Z, excluding the outer edge, is recessed downward in a rectangular plate shape to form a recess 6g. In the XY directions, the length (width) of the recess 6g is the same as or slightly smaller than the length (width) of the upper mold 3Z. The support mold 6Z is attached to a lower surface 17a (described later) of the frame member 17.

[0096] As will be described later, when the workpiece W is pressed, the supporting mold 6Z receives a specified downward pressure from the pressure pad 18. Therefore, the length (thickness) of the supporting mold 6Z in the vertical direction is designed to be a length that will not be deformed by the specified pressure.

[0097] The die receiving member 11Z receives downward pressure (predetermined pressure) from the support die 6Z when the workpiece W is pressed. The die receiving member 11Z also determines the vertical position (height) of the support die 6Z relative to the mounting plate 14 when the workpiece W is pressed. The die receiving member 11Z is made of, for example, a known hard insulating material (e.g., an insulating material having a compressive strength of several tens of MPa to 100 MPa or more). The die receiving member 11Z has a rectangular, lattice-like shape extending along the XY direction. The die receiving member 11Z is attached to the mounting surface 14a of the mounting plate 14 at a position facing the lower surface 6a of the support die 6Z (a position not facing the receiving hole 6c). As shown in FIG. 12, the length L11Z of the die receiving member 11Z in the vertical direction is greater than the length Lw of the workpiece W. The die receiving member 11Z has a lower surface 11a and an upper surface 11b.

[0098] The frame member 17 holds the pressure pad 18. The frame member 17 is made of, for example, a highly rigid metal (e.g., stainless steel). The frame member 17 has a rectangular frame shape extending along the X and Y directions, and is the same shape as the support member 50 when viewed from below. That is, when viewed from below, a rectangular internal space is formed in the center of the frame member 17. The frame member 17 has a lower surface 17a and an upper surface 17b. The frame member 17 is disposed below the support member 50 and attached to the lower surface 50a of the support member 50. When viewed from below, the frame member 17 is disposed to the side of the upper mold 3Z so as to surround the upper mold 3Z. The frame member 17 is movable vertically relative to the upper mold 3Z, integrally with the support member 50. When viewed from above, the frame member 17 is located below the lower surface 3a of the upper mold 3Z.

[0099] When pressure is applied to the workpiece W, the pressure pad 18 deforms in accordance with the amount of relative movement of the individual pressure members 7 with respect to the support mold 6Z. The pressure pad 18 is disposed above the support mold 6Z so as to cover the entire surface of the recess 6g of the support mold 6Z when viewed from above, and is disposed so as to cover the entire surface of the upper mold 3Z when viewed from below. In other words, the pressure pad 18 is disposed between the upper mold 3Z and the individual pressure members 7. The pressure pad 18 includes a flexible body 18a, two films 18b and 18c, and a heat insulator 18d.

[0100] When the workpiece W is pressed, the flexible body 18a uniformly transmits the pressure from the upper die 3Z to the individual pressing members 7. The flexible body 18a is made of, for example, the same material as the flexible body 8a of the first embodiment. The flexible body 8a is filled, for example, between two membranes 18b and 18c arranged above and below the flexible body 8a. The outer edges of the membranes 18b and 18c are held by the frame member 17 around the entire periphery, so that the flexible body 18a is surrounded by the frame member 17 in the horizontal direction (filling the internal space of the frame member 17).

[0101] When the workpiece W is pressed, the heat insulator 18d evenly transfers pressure from the upper die 3Z to the individual pressure members 7 and suppresses transfer of heat from the heat unit 15 to the flexible body 18a. The heat insulator 18d is made of, for example, a known fiber material having high flexibility and low thermal conductivity. Like the flexible body 18a, the heat insulator 18d has flexibility that allows it to flexibly deform in accordance with the amount of relative movement of the individual pressure members 7 with respect to the support die 6Z. The heat insulator 18d is disposed below the flexible body 18a and adjacent to the film 18c, and is housed in the recess 6g of the support die 6Z.

[0102] The device 1Z thus configured can pressurize different types of workpieces W by replacing the support mold 6Z, the individual pressing members 7, and the biasing unit 9.

[0103] ●Operation of pressure device (2) Next, the operation of the present device 1Z will be described below. In the following description, the present device 1Z simultaneously pressurizes nine workpieces W. In the following description, FIGS. 11 and 12 will be referred to as appropriate.

[0104] As shown in FIG. 11, when the workpiece W is not being pressurized, the upper pressurizing unit UPZ is disposed above the lower pressurizing unit DPZ and spaced apart from the lower pressurizing unit DPZ. In this state, the biasing unit 9 biases the corresponding individual pressurizing member 7 upward in the accommodation hole 6c. As a result, the individual pressurizing member 7 is accommodated in the corresponding accommodation hole 6c and does not protrude downward from the support mold 6Z. Furthermore, the individual pressurizing member 7 abuts against the heat insulator 18d, and the individual pressurizing member 7 does not protrude upward from the accommodation hole 6c. The heat insulator 18d is sandwiched between the support mold 6Z and the flexible body 18a, and the upper mold 3Z is disposed above the pressure pad 18 and spaced apart from the pressure pad 18.

[0105] Of the operations of the present device 1Z, the operations from placing the workpiece W on the placement plate 14 to decompressing the accommodation chamber R are common to the operations of the present device 1 of the first embodiment.

[0106] FIG. 14 is a schematic cross-sectional view showing one state of the device 1Z during operation. The figure shows a state in which the storage chamber R is formed.

[0107] Next, the lifting device 13 lowers the upper pressure unit UPZ until the support mold 6Z abuts against the mold receiving member 11Z. At this time, the second side member 41 moves upward relative to the first side member 40 in response to the lowering of the base 2.

[0108] FIG. 15 is a schematic cross-sectional view showing another state of the device 1Z during operation. FIG. 16 is a partially enlarged schematic cross-sectional view of the device 1Z in the state shown in FIG. These figures show a state in which the support mold 6Z is in contact with the mold receiving member 11Z. Fig. 16 shows part E of the present device 1Z in Fig. 15.

[0109] When the support mold 6Z abuts against the mold receiving member 11Z, the mold receiving member 11Z is pressed downward by the spring member 51 via the support member 50, the frame member 17, and the support mold 6Z. That is, the mold receiving member 11Z is sandwiched between the support mold 6Z and the mounting plate 14. At this time, the mold receiving member 11Z receives the pressure applied downward from the support mold 6Z (mainly the pressure caused by the weights of the support member 50, the support mold 6Z, the frame member 17, and the pressure pad 18, and the pressing force from the spring member 51). In this state, similar to the apparatus 1 of the first embodiment, the position of the support mold 6 with respect to the mounting plate 14 (workpiece W) is fixed (determined). Furthermore, the support mold 6Z (lower surface 6a) and the individual pressure members 7 (lower surfaces 7a) do not contact the workpiece W. Therefore, problems such as movement of the workpiece W or unintended pressure on the workpiece W due to contact with these members do not occur. In this way, the supporting mold 6Z is pressed against the mold receiving member 11Z, whereby the mold receiving member 11Z determines the position of the supporting mold 6Z relative to the mounting plate 14 (workpiece W).

[0110] Next, the heat unit 15 heats the workpiece W to a predetermined temperature (for example, 300° C.).

[0111] In the present invention, the timing at which the heat unit 15 starts heating the workpiece W may be before the upper pressure unit UPZ descends.

[0112] Next, the lifting device 13 lowers the upper pressure unit UPZ until each individual pressure member 7 abuts against the corresponding workpiece W. At this time, the upper mold 3Z enters the internal space of the frame member 17 while pressing the pressure pad 18 downward. Furthermore, the support member 50 and the frame member 17 move upward relative to the upper mold 3Z as the upper mold 3Z descends. As a result, the flexible body 18a deforms and enters the recess 6g of the support mold 6Z, pressing the heat insulator 18d downward. The heat insulator 18d deforms to conform to the shape of the support mold 6Z and enters the accommodating hole 6c, pressing the individual pressure member 7 downward. At this time, the individual pressure member 7 descends (slides) within the accommodating hole 6c against the biasing force of the biasing unit 9. That is, the individual pressure member 7 moves downward relative to the support mold 6Z. As a result, the individual pressure applying members 7 protrude downward from the support mold 6Z from the accommodation holes 6c toward the corresponding workpieces W and come into contact with the upper ends (electronic components w1) of the corresponding workpieces W. The individual pressure applying members 7 come into contact only with the portions of the workpieces W that require pressure (electronic components w1).

[0113] Next, the lifting device 13 lowers the upper pressurizing unit UPZ until each individual pressurizing member 7 applies a predetermined pressure to the corresponding workpiece W (the workpiece W is pressurized).

[0114] FIG. 17 is a schematic cross-sectional view showing yet another state of the device 1Z during operation. FIG. 18 is a partially enlarged schematic cross-sectional view of the device 1Z in the state shown in FIG. These figures show a state in which pressure is being applied to the workpiece W. FIG. 18 shows part F of the present device 1Z in FIG.

[0115] In this state, the pressure pad 18 (flexible body 18a and heat insulator 18d) is deformed to follow the shape of the support mold 6Z according to the amount of penetration of the heat insulator 18d into the accommodation hole 6c (i.e., the amount of relative movement of the individual pressure members 7). As a result, the specified pressure from the upper mold 3Z is transmitted evenly to the individual pressure members 7. In other words, the upper mold 3Z presses the individual pressure members 7 downward. Furthermore, because the flexible body 18a absorbs the difference in the amount of relative movement of the individual pressure members 7, the specified pressure from the upper mold 3Z is transmitted evenly to all of the workpieces W.

[0116] As described above, the pressure pad 18 is disposed above the support mold 6Z, and the heat insulator 18d is housed in the recess 6g. Therefore, the support mold 6Z is pressurized at a specified pressure from the upper mold 3Z via the flexible body 18a and the heat insulator 18d. In the second embodiment, the mold receiving member 11Z is disposed in a lattice pattern between the lower surface 6a of the support mold 6Z and the mounting surface 14a of the mounting plate 14, and supports the support mold 6Z, which is pressurized at a specified pressure. Therefore, the support mold 6Z does not deform even when the specified pressure is applied. In addition, the output (pressure) required of the lifting device 13 is greater than the output required of the lifting device 13 of the first embodiment. Therefore, the lifting device 13 of the second embodiment is greater than the lifting device 13 of the first embodiment.

[0117] The individual pressure members 7 are in contact with only the electronic components w1 of the corresponding workpieces W and apply downward pressure only to the electronic components w1. Therefore, the present device 1Z can simultaneously apply pressure to only the portions (electronic components w1) of each of the multiple workpieces W that require pressure, using the individual pressure members 7 that move relatively to the support mold 6Z.

[0118] Next, the lifting device 13 maintains the state in which the specified pressure is applied to the workpiece W for a predetermined time. Here, the support mold 6Z is not in contact with the mounting plate 14, and the mold receiving member 11Z is made of a heat-insulating material. Therefore, heat from the heat unit 15 is indirectly transferred to the individual pressure members 7 via the workpiece W, but is not directly transferred from the mounting plate 14 to the support mold 6Z. In addition, a heat insulator 18d with high heat insulation properties is disposed between the support mold 6Z and the flexible body 18a. Therefore, even if heat from the heat unit 15 is transferred to the support mold 6Z, the transfer of the heat to the flexible body 18a is suppressed.

[0119] Next, the lifting device 13 raises the upper pressure applying unit UPZ. At this time, the upper mold 3Z moves away from the pressure pad 18 and upwardly of the pressure pad 18. As a result, the individual pressure applying members 7 rise within the accommodation holes 6c while pushing up the insulators 18d due to the biasing force of the biasing unit 9, and are accommodated in the accommodation holes 6c. In addition, the flexible bodies 18a return to their pre-pressure state. As described above, the insulators 18d are accommodated in the recesses 6g. Therefore, the individual pressure applying members 7 are pressed against the insulators 18d and do not protrude upward from the accommodation holes 6c.

[0120] Summary (2) According to the embodiment described above, the apparatus 1Z includes an upper mold 3Z, a support mold 6Z, a plurality of individual pressure members 7, a mounting plate 14, and pressure pads 18. The support mold 6Z supports each individual pressure member 7. The individual pressure members 7 are disposed above the mounting plate 14 and can individually pressurize the corresponding workpieces W from above. The pressure pads 18 are disposed between the upper mold 3Z and the corresponding individual pressure members 7. The individual pressure members 7 are movable vertically relative to the support mold 6Z. The pressure pads 18 are deformable according to the amount of relative movement of the corresponding individual pressure members 7 relative to the support mold 6Z. When the workpieces W are pressed, the individual pressure members 7 protrude downward from the support mold 6Z toward the corresponding workpieces W. With this configuration, when the workpieces W are pressed, only the individual pressure members 7 are in contact with the workpieces W, and pressure from the upper mold 3Z is applied only to the upper end (electronic component w1) of the workpieces W via the individual pressure members 7. Therefore, the outer edge of the ceramic plate w3 protruding from the copper plates w4 and w5 is not pressed, and defects such as cracks or chips do not occur in the outer edge. In this way, the present device 1Z can simultaneously pressurize only the portions (electronic components w1) of each of the multiple workpieces W that require pressure, using the individual pressing members 7 that move relatively to the support mold 6Z.

[0121] Furthermore, according to the embodiment described above, the apparatus 1Z includes a frame member 17 that holds the pressure pad 18. The pressure pad 18 is disposed below the upper mold 3Z so as to cover the entire surface of the upper mold 3Z when viewed from below. The frame member 17 is disposed so as to cover the entire periphery of the pressure pad 18 in the horizontal direction. The support mold 6Z is disposed below the frame member 17 and the pressure pad 18 and is supported by the frame member 17. The frame member 17 is vertically movable relative to the upper mold 3Z. With this configuration, the entire lower surface 3a of the upper mold 3Z presses the pressure pad 18 downward against the pressure pad 18. The pressure pad 18 deforms in accordance with the relative movement of the individual pressure members 7 disposed below the pressure pad 18. Therefore, the specified pressure from the upper mold 3Z is transmitted evenly to the individual pressure members 7. Furthermore, the flexible body 18a and the heat insulator 18d absorb differences in the relative movement of the individual pressure members 7, so that the pressure from the upper mold 3Z is transmitted evenly to all of the workpieces W.

[0122] Furthermore, according to the embodiment described above, the support mold 6Z has a plurality of accommodating holes 6c that penetrate the support mold 6Z in the vertical direction. The accommodating holes 6c accommodate corresponding individual pressure members 7. With this configuration, the pressure pads 18 deform to follow the shape of the accommodating holes 6c. Therefore, the specified pressure from the upper mold 3Z is transmitted evenly and reliably to the individual pressure members 7.

[0123] Furthermore, according to the embodiment described above, the present device 1Z includes a plurality of biasing units 9 each composed of a plurality of biasing members. Each biasing unit 9 is disposed between the inner flange portion 6e of the support mold 6Z and the outer flange portion 7d of the corresponding individual pressure member 7, and biases the corresponding individual pressure member 7 upward. When the workpiece W is not being pressed, each individual pressure member 7 is biased upward by the biasing force of the biasing unit 9 and does not protrude downward from the support mold 6Z. With this configuration, as with the present device 1 of the first embodiment, problems such as movement of the workpiece W due to contact of the individual pressure member 7 with the workpiece W do not occur. As a result, the present device 1Z can stably pressurize a plurality of workpieces W simultaneously.

[0124] Furthermore, according to the embodiment described above, the present apparatus 1Z includes a mold receiving member 11Z. The mold receiving member 11Z is attached to the mounting surface 14a of the mounting plate 14 and is disposed between the lower surface 6a and the mounting surface 14a in the vertical direction so as to face the lower surface 6a. In the vertical direction, the length L11Z of the mold receiving member 11Z is greater than the length Lw of each workpiece W. With this configuration, similar to the present apparatus 1 of the first embodiment, problems such as movement of the workpiece W due to contact of the lower surface 6a with the workpiece W or unintended pressure on the workpiece W do not occur. Furthermore, in the vertical direction, the position of the support mold 6Z relative to the mounting plate 14 is maintained at a position corresponding to the length L11Z of the mold receiving member 11Z. Furthermore, the position of the support mold 6Z relative to the mounting plate 14 (workpiece W) is fixed (determined) by the mold receiving member 11Z abutting against the mounting surface 14a. Furthermore, the support mold 6Z does not deform even when a specified pressure is applied.

[0125] In the second embodiment, the pressure pad 18 does not necessarily have to include the heat insulator 18d, and in this case, the support mold 6Z does not necessarily have to include the recess 6g.

[0126] In the second embodiment, the heat insulator 18d may be held by the frame member 17. In this case, the support mold 6Z does not need to have the recess 6g.

[0127] Furthermore, in the second embodiment, the configuration of the mold receiving member 11Z is not limited to the configuration described in the second embodiment as long as the supporting mold 6Z is not deformed. That is, for example, the mold receiving member 11Z may be composed of a plurality of separable members. Also, for example, the mold receiving member 11Z may be composed of a plurality of members aligned along the X direction or the Y direction. Furthermore, the mold receiving member 11Z may be attached to the lower surface 6a of the supporting mold 6Z.

[0128] Furthermore, in the present invention, the mold receiving member 11Z may be formed integrally with the supporting mold 6Z and / or the mounting plate .

[0129] ●Variations● Next, modified examples of the device 1, 1Z will be described below, focusing on the differences from the first and second embodiments. In the following description of the modified examples, for convenience of explanation, the same components as those in the first and second embodiments and components having common functions are assigned the same reference numerals as those in the first and second embodiments, and their description will be omitted unless otherwise specified. In the following modified examples, the configuration of the individual pressure members differs from that of the first and second embodiments. In the following description, Figures 1, 2, and 11 will be referenced as appropriate.

[0130] FIG. 19 is a schematic cross-sectional view of an individual pressure member provided in the device according to the modified example.

[0131] The individual pressure applying member 7X includes a lower layer 7Xa, a middle layer 7Xb, an upper layer 7Xc, a plurality of (e.g., four) bolts 7Xd and 7Xe (two of which are not shown; the same applies below), and an elastic body 7Xf. The lower layer 7Xa and the upper layer 7Xc are made of, for example, a metal having high rigidity (e.g., carbon steel). The middle layer 7Xb is made of, for example, a known hard insulating material (e.g., an insulating material having a compressive strength of several tens of MPa to 100 MPa or more). That is, the thermal conductivity of the material constituting the middle layer 7Xb is lower than the thermal conductivity of the material constituting the lower layer 7Xa and the upper layer 7Xc, respectively. The middle layer 7Xb is placed on the lower layer 7Xa, and the upper layer 7Xc is placed on the middle layer 7Xb. The lower layer 7Xa is fastened to the upper layer 7Xc by the bolts 7Xd and 7Xe. As a result, the middle layer portion 7Xb is sandwiched between the lower layer portion 7Xa and the upper layer portion 7Xc. In the XY direction, the upper layer portion 7Xc protrudes outward over the entire circumference from the lower layer portion 7Xa and the middle layer portion 7Xb, functioning as the outer flange portion 7d. The elastic body 7Xf is made of, for example, the same material as the heat insulator 18d of the second embodiment. The elastic body 7Xf is fixed to the lower surface 7Xg of the lower layer portion 7Xa, for example, with an adhesive.

[0132] In this configuration, when the workpiece W is pressed, the elastic body 7Xf deforms to conform to the shape of the workpiece W (electronic component w1), uniformly pressing the electronic component w1. As a result, the shape of the bonding agent w6 at the boundary between the electronic component w1 and the copper plate w4 is finished into a good fillet shape. Also, in this configuration, heat from the heat unit 15 that is transferred to the individual pressing member 7X via the workpiece W is blocked by the intermediate layer X7b. As a result, transfer of the heat to the flexible bodies 8a and 18a is suppressed.

[0133] In a modified example, the individual pressure members 7X may not include the elastic bodies 7Xf.

[0134] ●Other embodiments● In the present invention, the shape of the upper mold 3, 3Z does not have to be rectangular along the XY direction. That is, for example, the shape of the upper mold 3, 3Z may be cylindrical. In this case, the shape of the support mold 6, 6Z is cylindrical. The shape of the support member 50 and the frame member 17 is annular. The shape of the pressure pad 18 is circular when viewed from below, and is plate-like.

[0135] In the present invention, the side unit 4 does not necessarily have to include the first side member 40. In this case, the second seal member 43 may be disposed between the first side member 40 and the support member 50.

[0136] Furthermore, in the present invention, the number of individual pressure members 7 may be any number and is not limited to 9. In this case, the numbers and arrangements of the individual upper molds 31, accommodating holes 6c, individual pressure pads 8, biasing units 9, and individual protection plates 10 are appropriately set according to the number and arrangement of the individual pressure members 7.

[0137] Furthermore, in the present invention, the shape of the individual pressure applying members 7 is not limited to a rectangular shape along the XY direction when viewed from below. That is, for example, the shape of the individual pressure applying members 7 may be a circle when viewed from below.

[0138] Furthermore, in the present invention, the configuration of the individual pressure applying member 7 is not limited to the configuration of each embodiment. That is, for example, like the individual pressure applying member 7X, the individual pressure applying member 7 may be configured by a plurality of separable members.

[0139] Furthermore, in the present invention, the shapes of the inner flange portion 6e and the outer flange portion 7d are not limited to rectangular frames as long as they are arranged to face each other in the vertical direction. That is, for example, the inner flange portion 6e and the outer flange portion 7d may be arranged only in the X direction or only in the Y direction.

[0140] ●Embodiments of the present invention● Next, the embodiments of the present invention that can be understood from the above-described embodiments will be described below, using the terms and symbols used in the embodiments.

[0141] A first embodiment of the present invention is a pressure device (e.g., pressure device 1, 1Z) that pressurizes a plurality of workpieces (e.g., workpieces W), comprising: a mounting plate (e.g., mounting plate 14) on which the workpieces can be placed; a plurality of individual pressure members (e.g., individual pressure members 7, 7X) that are arranged above the mounting plate and can individually pressurize each of the workpieces from above; a support mold (e.g., support mold 6, 6Z) that supports the individual pressure members; an upper mold (e.g., upper mold 3, 3Z) that can pressurize the individual pressure members downward; and a pressure pad (e.g., pressure pad Pd, 18) that is arranged between the individual pressure members and the upper mold, wherein the individual pressure members are movable vertically relative to the support mold, and the pressure pad is deformable according to the amount of relative movement of each of the individual pressure members with respect to the support mold, and when the workpieces are pressed, the individual pressure members protrude from the support mold toward the corresponding workpiece. With this configuration, the device can simultaneously apply pressure to only the portions of each of a plurality of workpieces that require pressure.

[0142] A second embodiment of the present invention is a pressure applying device (e.g., pressure applying device 1) that, in the first embodiment, has a support member (e.g., support member 50) that supports the support mold, and the support member is arranged to the side of the upper mold (e.g., upper mold 3) when viewed from below and is movable relative to the upper mold in the vertical direction. According to this configuration, the length (thickness) of the support mold in the vertical direction can be reduced, and the weight of the support mold can be reduced.

[0143] A third embodiment of the present invention is a pressure device in which, in the second embodiment, the support mold comprises a plurality of through holes (e.g., accommodating holes 6c) penetrating the support mold in the vertical direction, the upper mold comprises a plurality of individual upper molds (e.g., individual upper molds 31) corresponding to the individual pressure members, respectively, the pressure pads (e.g., pressure pads Pd) comprise a plurality of individual pressure pads (e.g., individual pressure pads 8) corresponding to the individual pressure members, the through holes accommodate the corresponding individual pressure members and the corresponding individual pressure pads, the individual upper molds are movable in the vertical direction relative to the support mold within the through holes in which the corresponding individual pressure members are accommodated, and the individual pressure pads are deformable in accordance with the amount of relative movement of the corresponding individual pressure members with respect to the support mold. According to this configuration, the specified pressure from the individual upper mold is transmitted evenly to all the workpieces.

[0144] A fourth embodiment of the present invention is a pressure applying device in the third embodiment, which comprises a plurality of biasing members (e.g., biasing units 9) arranged between the support mold and the corresponding individual pressure applying members and biasing the corresponding individual pressure applying members upward, and when the workpiece is not pressurized, the individual upper mold is positioned above the corresponding through hole, and the individual pressure applying members are biased upward by the corresponding biasing members and do not protrude from the support mold. With this configuration, the device can stably apply pressure to multiple workpieces at once.

[0145] A fifth embodiment of the present invention is a pressure device (e.g., pressure device 1Z) in the first embodiment, which comprises a frame member (e.g., frame member 17) that holds the pressure pad (e.g., pressure pad 18), wherein when viewed from below, the pressure pad covers the entire surface of the upper mold (e.g., upper mold 3Z), and in the horizontal direction, the frame member surrounds the entire periphery of the pressure pad, the support mold is arranged below the pressure pad and the frame member and is supported by the frame member, and the frame member is movable relative to the upper mold in the vertical direction. With this configuration, the pressure from the upper die is transmitted evenly to all of the workpieces.

[0146] A sixth embodiment of the present invention is a pressure applying device in the fifth embodiment, wherein the support mold (e.g., support mold 6Z) has a plurality of through holes that penetrate the support mold in the vertical direction, and the through holes accommodate the corresponding individual pressure applying members. According to this configuration, the specified pressure from the upper mold is transmitted evenly and reliably to the individual pressure members.

[0147] A seventh embodiment of the present invention is a pressure applying device according to the sixth embodiment, which comprises a plurality of biasing members arranged between the support mold and the corresponding individual pressure applying members and biasing the corresponding individual pressure applying members upward, and when the workpiece is not being pressurized, each of the individual pressure applying members is biased upward by the biasing members and does not protrude from the support mold. With this configuration, the device can stably apply pressure to multiple workpieces at once.

[0148] An eighth embodiment of the present invention is a pressure applying device in which, in the second or fifth embodiment, the support mold has a lower surface (e.g., lower surface 6a) facing downward, the loading plate has a loading surface (e.g., loading surface 14a) on which each of the workpieces is placed, and has a mold receiving member (e.g., mold receiving member 11, 11Z) arranged between the lower surface and the loading surface in the vertical direction so as to face the lower surface or the loading surface, and the length of the mold receiving member in the vertical direction is greater than the length of each of the workpieces. With this configuration, problems such as movement of the workpiece due to contact with the lower surface of the workpiece or unintended pressure being applied to the workpiece do not occur.

[0149] A ninth embodiment of the present invention is a pressure device according to the first embodiment, which comprises a heater unit (e.g., heat unit 15) capable of heating the mounting table, and each of the individual pressure members comprises an upper layer portion (e.g., upper layer portion 7Xc), a lower layer portion (e.g., lower layer portion 7Xa) arranged below the upper layer portion, and a middle layer portion (e.g., middle layer portion 7Xb) arranged between the upper layer portion and the lower layer portion, and the thermal conductivity of the material constituting the middle layer portion is lower than the thermal conductivity of the material constituting each of the upper layer portion and the lower layer portion. With this configuration, the transfer of heat from the thermal unit to the flexible body is suppressed.

[0150] A tenth embodiment of the present invention is a pressure application device in which, in the first or ninth embodiment, each of the individual pressure application members is provided with an elastic body (e.g., elastic body 7Xf) that contacts the workpiece and deforms to follow the shape of the workpiece when the workpiece is pressurized. According to this configuration, the adhesive is finished into a good fillet shape at the boundary between the electronic component and the copper plate. [Explanation of symbols]

[0151] 1. Pressure device 3 Upper mold 31 Individual upper mold 50 Support member 6 Support mold 6a Bottom side 6c Receiving hole (through hole) 7 Individual pressure members 8 individual pressure pads 9. Pressurizing unit (pressurizing member) 11 Die receiving member 15 Heat Units Pd pressure pad 1Z Pressure device 3Z upper mold 6Z Support mold 11Z Die receiving material 17 Frame members 18 Pressure Pad 7X Individual pressure members 7Xa lower part 7Xb middle section 7Xc Upper Division 7Xf Elastic body

Claims

1. A pressure device that applies pressure to multiple workpieces, a mounting plate on which the workpiece can be placed; a plurality of individual pressure members arranged above the mounting plate and capable of individually applying pressure to each of the works from above; a support mold for supporting the individual pressing members; an upper mold capable of pressing the individual pressing members downward; a pressure pad disposed between the individual pressure members and the upper mold; and the individual pressing members are movable relative to the support mold in a vertical direction, the pressure pad is deformable in accordance with the amount of relative movement of each of the individual pressure members with respect to the support mold; When the workpiece is pressed, the individual pressing members protrude from the support mold toward the corresponding workpiece. Pressure device.

2. a support member for supporting the support mold; and The support member is The mold is disposed to the side of the upper mold when viewed from below, The upper mold is movable in the vertical direction relative to the upper mold. The pressure device according to claim 1 .

3. The support mold is a plurality of through holes passing through the support mold in the vertical direction; With The upper mold is a plurality of individual upper molds corresponding to the individual pressing members, With The pressure pad is a plurality of individual pressure pads corresponding to the individual pressure members; With The through holes accommodate the corresponding individual pressure members and the corresponding individual pressure pads, the individual upper mold is movable relative to the support mold in a vertical direction within the through hole in which the corresponding individual pressing member is housed, the individual pressure pads are deformable in accordance with the amount of relative movement of the corresponding individual pressure members with respect to the support mold; The pressure device according to claim 2 .

4. a plurality of biasing members disposed between the support mold and the corresponding individual pressure members, and biasing the corresponding individual pressure members upward; and When the workpiece is not pressurized, The individual upper mold is positioned above the corresponding through hole, the individual pressure members are urged upward by the corresponding urging members and do not protrude from the support mold; The pressure device according to claim 3 .

5. a frame member for holding the pressure pad; and When viewed from below, the pressure pad covers the entire surface of the upper mold, the frame member surrounds the entire periphery of the pressure pad in the horizontal direction, the support mold is disposed below the pressure pad and the frame member and is supported by the frame member, The frame member is movable relative to the upper mold in the up and down direction. The pressure device according to claim 1 .

6. The support mold is a plurality of through holes passing through the support mold in the vertical direction; With The through holes accommodate the corresponding individual pressure members. The pressure device according to claim 5.

7. a plurality of biasing members disposed between the support mold and the corresponding individual pressure members, and biasing the corresponding individual pressure members upward; and When the workpiece is not pressurized, each of the individual pressure members is urged upward by the urging member and does not protrude from the support mold. The pressure device according to claim 6.

8. The support mold is the underside facing downwards, With The mounting plate is a mounting surface on which each of the workpieces is placed; With a mold receiving member disposed between the lower surface and the placement surface in the up-down direction so as to face the lower surface or the placement surface; and In the vertical direction, the length of the die receiving member is greater than the length of each of the workpieces. The pressure device according to claim 2 or 5.

9. a heating unit capable of heating the mounting table; and Each of the individual pressure members is With the upper management, a lower layer portion disposed below the upper layer portion; a middle layer portion disposed between the upper layer portion and the lower layer portion; With the thermal conductivity of the material constituting the middle layer portion is lower than the thermal conductivity of the materials constituting each of the upper layer portion and the lower layer portion; The pressure device according to claim 1 .

10. Each of the individual pressure members is an elastic body that comes into contact with the workpiece and deforms to follow the shape of the workpiece when pressure is applied to the workpiece; Equipped with The pressure device according to claim 1 or 9.

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