Electronic device, housing unit, and substrate

Abstract

To provide an electronic device, a housing unit, and a substrate that can cool a heat-generating element more efficiently.SOLUTION: An electronic device includes a housing, a fan provided at one end of the housing for blowing cooling air from one side to the other side of the housing, a first substrate provided within the housing at a distance from the fan on the other side of the housing and extending along a plane intersecting a first direction connecting the one side and the other side of the housing, a second substrate provided within the housing on the other side of the housing relative to the first substrate and extending along a plane including the first direction and a second direction intersecting the first direction, and a heat generating element mounted on the second substrate. The first substrate has an opening penetrating the first substrate in the first direction, and the opening dimension in the third direction on the other side of the second direction is smaller than the opening dimension in the third direction on the one side of the second direction in a third direction intersecting the first and second directions.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an electronic device, a housing unit, and a substrate. [Background technology]

[0002] For example, Patent Document 1 describes a configuration that includes a connection circuit board that is arranged to divide one side space and the other side space inside the housing and has a cooling air dissolving rear portion, and a fan that corresponds to the cooling air opening. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-11304 Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration described in Patent Document 1, when the heat-generating element is cooled by cooling air from a fan, the heat-generating element is not necessarily located downstream in the flow direction of the cooling air that has passed through the cooling air opening. For example, if the heat-generating element is positioned offset in a direction that intersects with the flow direction of the cooling air, the cooling air that has passed through the cooling air opening may not sufficiently reach the heat-generating element. Therefore, there is a need for a method of cooling the heat-generating element more efficiently.

[0005] An object of the present disclosure is to provide an electronic device, a housing unit, and a substrate that solve the above-mentioned problems. [Means for solving the problem]

[0006] An electronic device according to one embodiment of the present disclosure comprises a housing, a fan provided at one end of the housing and blowing cooling air from one side of the housing to the other side, a first substrate provided within the housing at a distance from the fan on the other side of the housing and extending along a plane intersecting a first direction connecting one side of the housing to the other side, a second substrate provided within the housing on the other side of the housing relative to the first substrate and extending along a plane including the first direction and a second direction intersecting the first direction, and a heat-generating element mounted on the second substrate, wherein the first substrate has an opening penetrating the first substrate in the first direction, and the opening has an opening dimension in the third direction intersecting the first direction and the second direction on the other side of the second direction that is smaller than the opening dimension in the third direction on the one side of the second direction.

[0007] A housing unit according to one embodiment of the present disclosure comprises a housing; a fan provided at one end of the housing and blowing cooling air from one side of the housing to the other side; a first board provided within the housing at a distance from the fan on the other side of the housing and extending along a plane intersecting a first direction connecting one side of the housing to the other side; and a board accommodating section provided within the housing on the other side of the housing relative to the first board and capable of accommodating a second board extending along a plane including the first direction and a second direction intersecting the first direction, wherein the first board has an opening penetrating the first board in the first direction, and the opening has an opening dimension in the third direction intersecting the first direction and the second direction on the other side of the second direction that is smaller than the opening dimension in the third direction on the one side of the second direction.

[0008] A substrate according to one embodiment of the present disclosure is a substrate that is arranged inside a housing having a fan at one end thereof, spaced apart from the fan on the other side of the housing, and the substrate has an opening that penetrates the substrate in a first direction connecting one side of the substrate to the other side, and the opening dimension in the third direction on one side of a second direction that intersects the first direction is smaller than the opening dimension in the third direction on the other side of the second direction that intersects the first direction. [Effects of the Invention]

[0009] According to the above aspect, the heat generating element can be cooled more efficiently. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view showing a schematic configuration of an electronic device according to the present disclosure. [Figure 2] 10 is a cross-sectional view of the electronic device according to the present disclosure as viewed from a third direction. FIG. [Figure 3] 4 is a cross-sectional view of the electronic device according to the present disclosure as viewed from a second direction. FIG. [Figure 4] 1 is a perspective view showing a first substrate of an electronic device according to the present disclosure. [Figure 5] 3A and 3B are diagrams showing openings formed in a first substrate of the electronic device according to the present disclosure. [Figure 6] 10A and 10B are diagrams illustrating the flow of cooling air in an electronic device according to the present disclosure. [Figure 7] FIG. 10 is a diagram showing a first substrate in a modified example of the electronic device according to the present disclosure. [Figure 8] FIG. 10 is a diagram showing a first substrate in another modified example of the electronic device according to the present disclosure. [Figure 9] FIG. 10 is a cross-sectional view showing yet another modified example of the electronic device according to the present disclosure. [Figure 10] FIG. 1 is a perspective view showing a schematic configuration of a housing unit according to the present disclosure. [Figure 11] FIG. 1 is a perspective view showing a configuration of a substrate according to the present disclosure. [Figure 12] FIG. 1 is a diagram illustrating a study model of an electronic device according to the present disclosure. [Figure 13] 10A and 10B are diagrams illustrating simulation results in a study example of an electronic device according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Each embodiment will be described below with reference to the drawings. In all drawings, the same or corresponding components are designated by the same reference numerals, and common descriptions will be omitted.

[0012] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIGS. 1 to 3, the electronic device 1 includes a housing unit 2 and an electronic component P housed in the housing unit 2. The housing unit 2 includes a housing unit 2a, a housing unit 2b, and an electronic component Pc.

[0013] The housing unit 2 includes a housing 3, a fan 4, and a first board 5. The housing 3 is in the shape of a hollow box, and accommodates the fan 4, the first board 5, and the electronic components P therein. The housing 3 of the present disclosure has, for example, a rectangular parallelepiped shape. The housing 3 is not limited to a rectangular parallelepiped shape, and may be of any other suitable shape. In the following description, the direction connecting one end 3a and the other end 3b of the housing 3 is referred to as the first direction D1, the direction perpendicular to the first direction is referred to as the second direction D2, and the direction perpendicular to the first direction D1 and the second direction D2 is referred to as the third direction D3.

[0014] The housing 3 of the present disclosure includes a bottom plate 31, a pair of side plates 32, a first end plate 33, a second end plate 34, and a top plate 35. The bottom plate 31 is provided on one side of the housing 3 in the third direction D3 and forms the bottom surface of the housing 3. The bottom plate 31 has a rectangular shape when viewed from the third direction D3. When viewed from the third direction D3, the bottom plate 31 of the present disclosure has a rectangular shape with its longer side aligned in the first direction D1 and its shorter side aligned in the second direction D2.

[0015] The pair of side plates 32 are provided on both sides of the bottom plate 31 in the second direction D2. The pair of side plates 32 rise from both end portions of the bottom plate 31 in the second direction D2 toward the other side in the third direction. The first end plate 33 is provided on one side of the bottom plate 31 in the first direction D1. The first end plate 33 rises from one end of the bottom plate 31 in the first direction D1 toward the other side in the third direction. The second end plate 34 is provided on the other side of the bottom plate 31 in the first direction D1. The second end plate 34 rises from the end of the bottom plate 31 on the other side in the first direction D1 toward the other side in the third direction. The top plate 35 is provided spaced apart from the bottom plate 31 on the other side in the third direction. The top plate 35 closes the space surrounded by the bottom plate 31, the pair of side plates 32, the first end plate 33, and the second end plate 34 from the other side in the third direction.

[0016] The fan 4 is provided at an end 3a of the housing 3 on one side in the first direction D1. The fan 4 is provided along the first end plate 33 of the housing 3 . The fan 4 includes a fan body 41 and a drive source (not shown) that drives the fan body 41. The fan body 41 has a plurality of blades 41w. The fan body 41 is rotationally driven by a drive source. The fan body 41 takes in air from outside the housing 3 through an opening 33h formed in the first end plate 33, and sends cooling air from one side to the other side in the first direction D1 within the housing 3.

[0017] The first board 5 is provided in the housing 3 and spaced apart from the fan 4 on the other side in the first direction D1. The first board 5 is provided in the housing 3 at a distance from the fan 4 on the other side of the housing 3 . The first substrate 5 is disposed in the housing 3 at a central portion in the first direction D1. The first substrate 5 is disposed within the housing 3 between the first end plate 33 and the second end plate 34 . The first substrate 5 extends along a plane intersecting the first direction D1. The first substrate 5 has a plate shape extending along a plane perpendicular to the first direction D1. The first substrate 5 has a rectangular shape when viewed in the first direction D1. Both ends of the first substrate 5 in the second direction D2 are in contact with a pair of side plates 32. Both ends of the first substrate 5 in the third direction D3 are in contact with the bottom plate 31 and the top plate 35.

[0018] The first substrate 5 divides the inside of the housing 3 into one side in the first direction D1 and the other side in the first direction D1. As a result, within the housing unit 2, a first substrate accommodating section S1 is formed on one side of the first substrate 5 in the first direction D1, and a second substrate accommodating section (substrate accommodating section) S2 is formed on the other side of the first substrate 5 in the first direction D1.

[0019] The electronic component P is housed in the housing 3 of the housing unit 2. The electronic component P of the present disclosure includes, for example, a second substrate 6 and a third substrate 7. The second substrate 6 is provided inside the housing 3 on the other side of the housing 3 relative to the first substrate 5. The second substrate 6 is accommodated in a second substrate accommodating portion S2 in the housing 3 on the other side of the first substrate 5 in the first direction D1. The second substrate 6 is plate-shaped and extends along a plane including the first direction D1 and the second direction D2. The second substrate 6 is provided parallel to the bottom plate 31 .

[0020] On the second substrate 6, a heat generating element 8 is mounted. The heat generating element 8 is an element whose temperature rises during operation, such as a central processing unit (CPU), a field programmable gate array (FPGA), a graphics processing unit (GPU), a large scale integration (LSI), an inverter, etc. The heat generating element 8 of the present disclosure is mounted on, for example, the surface of the second substrate 6 facing the other side in the third direction D3 (the top panel 35 side). The heating element 8 may include a heat sink 85 that dissipates heat generated by the heating element 8 to the surroundings. For example, one heating element 8 of the present disclosure is provided on the second substrate 6. The heat generating element 8 of the present disclosure is disposed, for example, in the center of the second substrate 6 in the second direction D2. The number and arrangement of the heat generating elements 8 provided on the second substrate 6 can be changed as appropriate. In addition to the heat generating element 8, appropriate electronic components are mounted on the second substrate 6.

[0021] The third substrate 7 is provided inside the housing 3 on one side of the housing 3 relative to the first substrate 5. The third substrate 7 is accommodated in the first substrate accommodating portion S1 in the housing 3 on one side of the first substrate 5 in the first direction D1. The third substrate 7 is plate-shaped and extends along a plane including the first direction D1 and the second direction D2. The third substrate 7 is provided parallel to the bottom plate 31 . Heat generating elements (not shown) and other appropriate electronic components are mounted on the third substrate 7.

[0022] The first substrate 5 is provided with a first connector receiving port 52 and a second connector receiving port 53. The first connector receiving port 52 is provided on the surface of the first substrate 5 facing the other side in the first direction D1. The first connector receiving port 52 is connectable to a connector (not shown) that connects the second substrate 6 and the first substrate 5. The second connector receiving port 53 is provided on the surface of the first substrate 5 facing one side in the first direction D1. The second connector receiving port 53 is connectable to a connector (not shown) that connects the third substrate 7 and the first substrate 5. The first connector receiving port 52 and the second connector receiving port 53 are connected via a wiring portion (not shown) provided on the first substrate 5. The second substrate 6, which is connected to the first connector receiving port 52 via a connector (not shown), and the third substrate 7, which is connected to the second connector receiving port 53 via a connector (not shown), are electrically connected via the wiring portion of the first substrate 5.

[0023] The first substrate 5 has an opening 9 . The opening 9 penetrates the first substrate 5 in the first direction D1. As shown in FIGS. 1 to 5, a plurality of openings 9 according to the present disclosure are provided in the first substrate 5 at intervals in the second direction D2. Two openings 9 according to the present disclosure are provided in the first substrate 5 at an interval in the second direction D2. The opening 9 of the present disclosure includes an opening 9A and an opening 9B. As shown in FIG. 2, the openings 9A and 9B are provided at positions offset in the second direction D2 with respect to the heating element 8 when viewed from the first direction D1. When viewed from the first direction D1, the openings 9A and 9B are provided offset to both sides in the second direction across the heat generating element 8. The openings 9A and 9B of the present disclosure are provided line-symmetrically with respect to the center of the first substrate 5 in the second direction D2.

[0024] As shown in Figure 5, one opening 9A has a first opening dimension h1 in the third direction D3 at one end in the second direction D2, and a second opening dimension h2 in the third direction D3 at the other end in the second direction D2 that is smaller than the first opening dimension h1 in the third direction D3 at one end in the second direction D2. The opening 9A of the present disclosure is formed in an L-shape when viewed from the first direction D1. The opening 9A of the present disclosure comprises a rectangular first opening 91 formed on one side in the second direction D2, and a rectangular second opening 92 formed in communication with the first opening 91 on the other side in the second direction D2. The first opening 91 and the second opening 92 are integrally formed, and are not actually separated from each other. In the present disclosure, for the sake of explanation, the boundary between the first opening 91 and the second opening 92 is shown by a dotted line in FIG. 5.

[0025] The first opening 91 of the opening 9A has a first opening dimension h1 in the third direction D3 and is rectangular in shape with the longer side in the third direction D3. The second opening 92 of the opening 9A is square and has a second opening dimension h2 that is smaller than the first opening dimension h1 of the first opening 91 in the third direction D3. The second opening 92 communicates with one end of the first opening 91 in the third direction D3. The second opening 92 communicates with the end of the first opening 91 that is closer to the second substrate 6 on one side in the third direction D3.

[0026] In the opening 9A, the second opening dimension h2 of the second opening 92 of the present disclosure is, for example, ½ of the first opening dimension h1 of the first opening 91. The ratio of the second opening dimension h2 of the second opening 92 to the first opening dimension h1 of the first opening 91 is not limited to 1 / 2 and can be changed as appropriate.

[0027] The first opening 91 of the opening 9A has an opening dimension w1 in the second direction D2. The second opening 92 has an opening dimension w2 (w2=w1) that is the same as the opening dimension w1 of the first opening 91 in the second direction D2. The opening dimension w1 of the first opening 91 and the opening dimension w2 of the second opening 92 may be different.

[0028] In this way, the opening 9A having a smaller second opening dimension h2 on the other side of the second direction D2 is positioned offset to the other side of the second direction D2 relative to the heating element 8 when viewed from the first direction D1.

[0029] The other opening 9B is formed symmetrically with respect to the opening 9A across the center of the first substrate 5 in the second direction D2. In other words, "one side in the second direction D2" and "the other side in the second direction D2" in the above description of the opening 9A are opposite in the second direction in the following description of the opening 9B. In the present disclosure, the one side in the second direction D2 is the side closer to the heating element 8 in the second direction D2 when viewed from the first direction D1, and the other side in the second direction D2 is the side farther away from the heating element 8 in the second direction D2. The opening 9B has a first opening dimension h1 in the third direction D3 at one end in the second direction D2, and a second opening dimension h2 in the third direction D3 at the other end in the second direction D2 that is smaller than the first opening dimension h1 in the third direction D3 at one end in the second direction D2. The opening 9B of the present disclosure is formed in an L-shape when viewed from the first direction D1. The opening 9B of the present disclosure comprises a rectangular first opening 91 formed on one side in the second direction D2, and a rectangular second opening 92 formed in communication with the first opening 91 on the other side in the second direction D2.

[0030] The first opening 91 of the opening 9B has a first opening dimension h1 in the third direction D3 and is rectangular in shape with the longer side in the third direction D3. The second opening 92 of the opening 9A is square and has a second opening dimension h2 that is smaller than the first opening dimension h1 of the first opening 91 in the third direction D3. The second opening 92 communicates with one end of the first opening 91 in the third direction D3. The second opening 92 communicates with the end of the first opening 91 that is closer to the second substrate 6 on one side in the third direction D3.

[0031] In the opening 9B, the second opening dimension h2 of the second opening 92 of the present disclosure is, for example, ½ of the first opening dimension h1 of the first opening 91. The ratio of the second opening dimension h2 of the second opening 92 to the first opening dimension h1 of the first opening 91 is not limited to 1 / 2 and can be changed as appropriate.

[0032] The first opening 91 of the opening 9B has an opening dimension w1 in the second direction D2. The second opening 92 has an opening dimension w2 (w2=w1) that is the same as the opening dimension w1 of the first opening 91 in the second direction D2. The opening dimension w1 of the first opening 91 and the opening dimension w2 of the second opening 92 may be different.

[0033] In this way, the opening 9B having a smaller second opening dimension h2 on the other side of the second direction D2 is positioned offset to the other side of the second direction D2 relative to the heating element 8 when viewed from the first direction D1.

[0034] As shown in FIG. 6, in such an electronic device 1, when the fan 4 is driven, the fan 4 takes in air from the outside of the housing 3 and sends cooling air Cw from one side of the housing 3 to the other side. The cooling air Cw from the fan 4 cools the third substrate 7 accommodated in the first substrate accommodating portion S1. The cooling air Cw that has passed through the third substrate 7 passes through the openings 9 (9A, 9B) of the first substrate 5 and flows into the second substrate accommodating portion S2. When the cooling air Cw passes through the openings 9A and 9B, in each of the openings 9A and 9B, the second opening 92 on the side away from the heating element 8 in the second direction D2 has a smaller opening dimension in the third direction D3 than the first opening 91 on the side closer to the heating element 8 in the second direction D2. In other words, the cross-sectional area of ​​the flow path for the cooling air Cw is narrower in the second opening 92 than in the first opening 91. As a result, the cooling air Cw2 passing through the second opening 92 has a higher flow velocity than the cooling air Cw1 passing through the first opening 91. Then, when viewed from the third direction D3, the cooling air Cw (Cw1, Cw2) that has passed through the openings 9A and 9B flows in the second direction while being deflected in a direction approaching the heat generating element 8. This allows the heat generating element 8 to be cooled efficiently.

[0035] Furthermore, as shown in Figure 5, the openings 9A and 9B described above can also be understood as having an opening dimension w1 in the second direction D2 at the other end in the third direction D3 that is smaller than the opening dimension w3 in the second direction D2 at the one end in the third direction D3. As a result, the cooling air that has passed through the openings 9A and 9B flows faster on one side of the third direction D3 where the opening dimension w3 is large than on the other side of the third direction D3 where the opening dimension w1 is small. As a result, the air flows while being deflected in a direction approaching the second substrate 6 on one side from the other side of the third direction D3. This means that the heat generating elements 8 mounted on the second substrate 6 can be cooled more efficiently.

[0036] In the electronic device 1 of this embodiment, the opening 9 formed in the first substrate 5 has a first opening dimension h1 in the third direction D3 on one side of the second direction D2, and a second opening dimension h2 in the third direction D3 on the other side of the second direction D2 that is smaller than the first opening dimension h1 in the third direction D3 on the other side of the second direction D2. Therefore, when the cooling air from the fan 4 passes through the opening 9, the flow velocity of the cooling air in the area on the other side of the opening 9 in the second direction D2 is higher than the flow velocity in the area on one side of the opening 9 in the second direction D2. Therefore, after passing through the opening 9, the cooling air is deflected toward one side of the second direction D2. Therefore, even if the opening 9 is positioned offset toward the other side of the second direction D2 with respect to the heat-generating element 8, the cooling air can be directed toward the heat-generating element 8. This allows the heat-generating element 8 to be cooled more efficiently.

[0037] (Modification of the first embodiment) In the above first embodiment, the second openings 92, 92 are connected to the ends of the first openings 91, 91 on one side in the third direction D3, so that the openings 9A, 9B are formed in an L-shape when viewed from the first direction D1. In contrast, the second openings 92, 92 may be connected to the other end of the first openings 91, 91 in the third direction D3, so that the openings 9A, 9B have an inverted L-shape when viewed from the first direction D1.

[0038] Also, as shown in Figure 7, the openings 9C and 9D formed in the first substrate 5 may be such that a first opening 91 has a first opening dimension h1 in the third direction D3, and a second opening 92 has a second opening dimension h2 in the third direction D3 that is smaller than the first opening dimension h1, and is arranged to communicate with the middle part of the first opening 91 in the third direction D3.

[0039] Furthermore, the opening 9 may be trapezoidal or triangular, for example, as long as the second opening dimension h2 in the third direction D3 on the other side of the second direction D2 is smaller than the first opening dimension h1 in the third direction D3 on one side of the second direction D2.

[0040] Furthermore, the opening 9 may be formed directly in the first substrate 5 as in the above embodiment, but may also be formed, as in the first substrate 5C shown in Fig. 8, by providing a substrate main body 51 having a rectangular through-hole 96 and an opening unit 97 having a rectangular outer shape that is attached to the through-hole 96. In this case, the opening unit 97 has an outer peripheral frame 97f that has a shape that allows it to be attached to the through-hole 96, and an opening 9 of a predetermined shape that is formed inside the outer peripheral frame 97f. In this configuration, by attaching the opening unit 97 to the through-hole 96 of the substrate body 51, the first substrate 5C having the opening 9 can be easily assembled.

[0041] 9, a single housing 3 may include a plurality of sets of a fan 4, a first board 5, a second board 6, and a third board 7 arranged side by side.

[0042] Second Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 10, the housing unit 2 of the present disclosure includes a housing 3, a fan 4, a first board 5, and a board accommodating portion S2. The fan 4 is provided at one end of the housing 3 and sends cooling air from one side of the housing 3 to the other side. The first board 5 is provided in the housing 3 at a distance from the fan 4 on the other side of the housing 3. The first substrate 5 extends along a plane that intersects with a first direction D1 that connects one side of the housing 3 to the other side. The substrate accommodating section S2 is provided inside the housing 3 on the other side of the housing 3 with respect to the first substrate 5. The substrate accommodating portion S2 is capable of accommodating a second substrate 6 that extends along a plane including a first direction D1 and a second direction D2 that intersects with the first direction D1. The first substrate 5 has an opening 9 that penetrates the first substrate 5 in the first direction D1. The opening 9 has a first opening dimension h1 in a third direction D3 intersecting the first direction D1 and the second direction D2 on one side of the second direction D2, and a second opening dimension h2 in the third direction D3 on the other side of the second direction D2 that is smaller than the first opening dimension h1 in a third direction D3 intersecting the first direction D1 and the second direction D2 on one side of the second direction D2.

[0043] In the housing unit 2 of this embodiment, the opening 9 formed in the first substrate 5 has a first opening dimension h1 in the third direction D3 on one side of the second direction D2, and a second opening dimension h2 in the third direction D3 on the other side of the second direction D2 that is smaller than the first opening dimension h1 in the third direction D3 on the other side of the second direction D2. Therefore, when the cooling air from the fan 4 passes through the opening 9, the flow velocity of the cooling air in the area on the one side of the opening 9 in the second direction D2 is higher than the flow velocity of the cooling air in the area on the other side of the opening 9 in the second direction D2. Therefore, after passing through the opening 9, the cooling air flows while being deflected toward one side of the second direction D2. Therefore, even if the opening 9 is positioned offset toward the other side of the second direction D2 with respect to the heat-generating element 8, the cooling air can be directed toward the heat-generating element 8. This allows the heat generating elements to be cooled more efficiently.

[0044] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 11, the substrate 5 of the present disclosure is provided inside the housing 3, which has the fan 4 provided at one end thereof, and is spaced apart from the fan 4 on the other side of the housing 3. The substrate 5 has an opening 9 that penetrates the substrate 5 in a first direction D1 that connects one side of the substrate 5 to the other side. The opening 9 has a first opening dimension h1 in a third direction D3 that intersects the first direction D1 and the second direction D2 on one side of the second direction D2, which intersects the first direction D1, and a second opening dimension h2 in the third direction D3 on the other side of the second direction D2, which is smaller than the first opening dimension h1 in a third direction D3 that intersects the first direction D1 and the second direction D2.

[0045] In the substrate 5 of this embodiment, the opening 9 has a first opening dimension h1 in the third direction D3 on one side of the second direction D2, and a second opening dimension h2 in the third direction D3 on the other side of the second direction D2 that is smaller than the first opening dimension h1 in the third direction D3 on the other side of the second direction D2. Therefore, when the cooling air from the fan 4 passes through the opening 9, the flow velocity of the cooling air in the region on the one side of the opening 9 in the second direction D2 is higher than the flow velocity in the region on the other side of the opening 9 in the second direction D2. Therefore, after passing through the opening 9, the cooling air is deflected toward one side of the second direction D2. Therefore, even if the opening 9 is positioned toward the other side of the second direction D2 with respect to the heat generating element 8 provided downstream of the opening 9, the cooling air can be directed toward the heat generating element 8. This allows the heat generating elements to be cooled more efficiently.

[0046] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0047] (Example of consideration) Next, the configuration shown in the above embodiment was examined by simulation, and the results are shown below. 12, two openings 9 were formed at an interval in the second direction D2 on a first substrate 5 disposed on one side of the fan 4 in the first direction D1. The first opening 91 of each opening 9 had a first opening dimension h1 (see FIG. 5) of 20 mm and an opening dimension w1 (see FIG. 5) of 10 mm in the third direction D3. The second opening 92 had a second opening dimension h2 (see FIG. 5) of 10 mm and an opening dimension w2 (see FIG. 5) of 10 mm in the third direction D3. For comparison, two square openings were formed on the first substrate, spaced apart in the second direction D2, with the opening dimensions in the second direction being 20 mm and the opening dimensions in the third direction being 20 mm when viewed from the first direction D1.

[0048] In the simulation, cooling air was blown from fan 4 at a speed of 0.4 m / s (50% duty condition using an 80 mm square fan, average wind speed immediately after the fan), and the average wind speed was calculated in each of areas A1 to A7 where the distance from first substrate 5 in the first direction D1 was 40, 60, 80, 100, 120, 140, and 160 mm. The results are shown in Figure 13. 13, it was confirmed that the first substrate 5 of the example having the opening 9 of the example had a higher flow velocity than the first substrate of the comparative example having a square opening in regions A2 to A7 that were 60 mm or more away from the first substrate 5 in the first direction D1. In particular, it was confirmed that the flow velocity of the cooling air was increased by 170% or more in regions A4 to A7 that were 100 mm or more away from the first substrate 5 in the first direction D1.

[0049] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0050] (Appendix 1) The housing and a fan provided at one end of the housing and configured to blow cooling air from one side of the housing to the other side; a first substrate provided in the housing at a distance from the fan on the other side of the housing and extending along a plane intersecting a first direction connecting the one side and the other side of the housing; a second substrate provided in the housing on the other side of the housing with respect to the first substrate and extending along a plane including the first direction and a second direction intersecting the first direction; a heat generating element mounted on the second substrate, the first substrate has an opening penetrating the first substrate in the first direction; The opening has an opening dimension in a third direction intersecting the first direction and the second direction, on one side in the second direction, which is smaller than an opening dimension in the third direction intersecting the first direction and the second direction, on the other side in the second direction. electronic equipment.

[0051] (Appendix 2) The opening is a rectangular first opening formed on one side in the second direction and having a first opening dimension in the third direction; a rectangular second opening formed in communication with the other side of the first opening in the second direction and having a second opening dimension in the third direction that is smaller than the first opening dimension, 1. The electronic device described in Appendix 1.

[0052] (Appendix 3) The second opening communicates with one end of the first opening in the third direction. 1. An electronic device as described in Appendix 2.

[0053] (Appendix 4) The second opening communicates with a middle portion of the first opening in the third direction. 1. An electronic device as described in Appendix 2.

[0054] (Appendix 5) The second opening size is half the first opening size. 5. An electronic device according to any one of appendices 2 to 4.

[0055] (Appendix 6) When viewed from the first direction, the opening is provided at a position offset to the other side in the second direction with respect to the heating element. 6. An electronic device according to any one of appendices 1 to 5.

[0056] (Appendix 7) The openings are provided on both sides of the heating element in the second direction when viewed from the first direction. 7. An electronic device according to any one of appendices 1 to 6.

[0057] (Appendix 8) a third substrate provided in the housing on one side of the housing with respect to the first substrate and extending along a plane including the first direction. 8. An electronic device according to any one of claims 1 to 7.

[0058] (Appendix 9) The first substrate is a first connector receiving port to which a connector that connects the second substrate and the first substrate can be connected; a second connector receiving port to which a connector that connects the third substrate and the first substrate can be connected; 9. An electronic device according to any one of appendices 1 to 8.

[0059] (Appendix 10) an opening dimension in the second direction on one side of the opening in the third direction is smaller than an opening dimension in the second direction on the other side of the opening in the third direction; 10. An electronic device according to any one of claims 1 to 9.

[0060] (Appendix 11) The first substrate is a substrate body having a rectangular through-hole; an opening unit attached to the through hole and having the opening; 11. An electronic device according to any one of claims 1 to 10.

[0061] (Appendix 12) The housing and a fan provided at one end of the housing and configured to blow cooling air from one side of the housing to the other side; a first substrate provided in the housing at a distance from the fan on the other side of the housing and extending along a plane intersecting a first direction connecting the one side and the other side of the housing; a substrate accommodating section provided on the other side of the housing with respect to the first substrate, in the housing, and capable of accommodating a second substrate extending along a plane including the first direction and a second direction intersecting the first direction; Equipped with the first substrate has an opening penetrating the first substrate in the first direction; The opening has an opening dimension in a third direction intersecting the first direction and the second direction, on one side in the second direction, which is smaller than an opening dimension in the third direction intersecting the first direction and the second direction, on the other side in the second direction. Housing unit.

[0062] (Appendix 13) A substrate is provided in a housing having a fan at one end thereof, the substrate being spaced apart from the fan on the other side of the housing, the substrate has an opening that penetrates the substrate in a first direction connecting one side and the other side of the substrate; The opening has an opening dimension in a third direction intersecting the first direction, on one side in a second direction intersecting the first direction, which is smaller than an opening dimension in the third direction intersecting the first direction and the second direction, on the other side in the second direction. substrate.

[0063] (Appendix 14) The opening is a rectangular first opening formed on one side in the second direction and having a first opening dimension in the third direction; a rectangular second opening formed in communication with the other side of the first opening in the second direction and having a second opening dimension in the third direction that is smaller than the first opening dimension, 14. The substrate of claim 13.

[0064] (Appendix 15) The second opening communicates with one end of the first opening in the third direction. 15. The substrate of claim 14.

[0065] (Appendix 16) The second opening communicates with a middle portion of the first opening in the third direction. 15. The substrate of claim 14.

[0066] (Appendix 17) The second opening size is half the first opening size. 17. The substrate of any one of appendixes 14 to 16. [Explanation of symbols]

[0067] 1 Electronic equipment 2 chassis units 3. Housing 4 Fans 5, 5C 1st board (board) 5C First board 6 Second board 7 Third board 8 Heating element 9, 9A~9D opening 51 Board body 91 First Opening 92 Second Opening 96 Through Hole 97 Opening unit S2 Second board housing section (board housing section)

Claims

1. The housing and a fan provided at one end of the housing and configured to blow cooling air from one side of the housing to the other side; a first substrate provided in the housing at a distance from the fan on the other side of the housing and extending along a plane intersecting a first direction connecting the one side and the other side of the housing; a second substrate provided in the housing on the other side of the housing with respect to the first substrate and extending along a plane including the first direction and a second direction intersecting the first direction; a heat generating element mounted on the second substrate, the first substrate has an opening penetrating the first substrate in the first direction; The opening has an opening dimension in a third direction intersecting the first direction and the second direction, on one side in the second direction, which is smaller than an opening dimension in the third direction intersecting the first direction and the second direction, on the other side in the second direction. electronic equipment.

2. The opening is a rectangular first opening formed on one side in the second direction and having a first opening dimension in the third direction; a rectangular second opening formed in communication with the other side of the first opening in the second direction and having a second opening dimension in the third direction that is smaller than the first opening dimension; The electronic device according to claim 1 .

3. The second opening communicates with one end of the first opening in the third direction. The electronic device according to claim 2 .

4. The second opening communicates with a middle portion of the first opening in the third direction. The electronic device according to claim 2 .

5. The opening is provided at a position offset to the other side in the second direction with respect to the heating element when viewed from the first direction.

3. The electronic device according to claim 1 or 2.

6. The openings are provided on both sides of the heating element in the second direction when viewed from the first direction.

3. The electronic device according to claim 1 or 2.

7. a third substrate provided in the housing on one side of the housing with respect to the first substrate and extending along a plane including the first direction.

3. The electronic device according to claim 1 or 2.

8. The first substrate is a substrate body having a rectangular through-hole; an opening unit attached to the through hole and having the opening; 3. The electronic device according to claim 1 or 2.

9. The housing and a fan provided at one end of the housing and configured to blow cooling air from one side of the housing to the other side; a first substrate provided in the housing at a distance from the fan on the other side of the housing and extending along a plane intersecting a first direction connecting the one side and the other side of the housing; a substrate accommodating section provided on the other side of the housing with respect to the first substrate, within the housing, and capable of accommodating a second substrate extending along a plane including the first direction and a second direction intersecting the first direction; Equipped with the first substrate has an opening penetrating the first substrate in the first direction; The opening has an opening dimension in a third direction intersecting the first direction and the second direction, on one side in the second direction, which is smaller than an opening dimension in the third direction intersecting the first direction and the second direction, on the other side in the second direction. Housing unit.

10. A substrate is provided in a housing having a fan at one end thereof, the substrate being spaced apart from the fan on the other side of the housing, the substrate has an opening that penetrates the substrate in a first direction connecting one side and the other side of the substrate; The opening has an opening dimension in a third direction intersecting the first direction, on one side in a second direction intersecting the first direction, which is smaller than an opening dimension in the third direction intersecting the first direction and the second direction, on the other side in the second direction. substrate.

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