Capacitor and manufacturing method thereof

Abstract

To provide a capacitor capable of improving the position accuracy of a first bus bar and a second bus bar.SOLUTION: A capacitor 1 includes: a capacitor element 2 that has a first electrode 21 and a second electrode 22; a support member 4 that includes a supporting surface 41 supporting the capacitor element 2 and a non-supporting surface 42 other than the supporting surface 41; a first bus bar 61 that has a first internal terminal 601 connected to the first electrode 21 and a first external terminal 611 extending outward from the non-support surface 42, and is insert-molded into the support member 4; a second bus bar 62 that has a second internal terminal 602 connected to the second electrode 22 and a second external terminal 612 extending outward from the non-supporting surface 42, and is insert-molded into support member 4; and a film 7 that adheres to the capacitor element 2, the first internal terminal 601, the second internal terminal 602 and the supporting surface 41 to thereby seal the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the supporting surface 41.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates generally to capacitors and methods of manufacturing the same, and more particularly to capacitors including capacitor elements and methods of manufacturing the same. [Background technology]

[0002] Patent Document 1 discloses a capacitor. This capacitor includes a capacitor element, a bus bar, a case, a filling resin, a through hole, a connection terminal portion, and a ring-shaped sealing member.

[0003] Here, the bus bar is connected to the electrode of the capacitor element. The case houses the capacitor element with the bus bar connected to its electrode. The case housing the capacitor element is filled with a filling resin. The through hole is provided on one side of the case. The connection terminal portion is provided on the bus bar, leads out through the through hole to the outside, and is connectable to an external terminal. The ring-shaped sealing member surrounds the periphery of the connection terminal portion so as to be in close contact with the connection terminal portion, and abuts against the wall surface around the through hole on the inside of the case, thereby sealing the through hole through which the connection terminal portion passes from the inside of the case. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2019 / 131192 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the capacitor of Patent Document 1 has a problem in that it is difficult to improve the positional accuracy of the busbars. One of the reasons for this is that the through-holes have hole dimensions that are slightly larger than the horizontal cross-sectional dimensions of the connection terminals.

[0006] Furthermore, the capacitor of Patent Document 1 includes a case and a filling resin, which tends to increase the weight, and there is also the problem that space must be secured for the case and the filling resin.

[0007] An object of the present disclosure is to provide a capacitor that can improve the positional accuracy of first bus bars and second bus bars and can also be made lighter and more space-saving, and a method for manufacturing the same. [Means for solving the problem]

[0008] A capacitor according to one embodiment of the present disclosure comprises: a capacitor element having a first electrode and a second electrode; a support member including a support surface supporting the capacitor element and a non-support surface other than the support surface; a first bus bar insert-molded into the support member, the first bus bar having a first internal terminal connected to the first electrode and a first external terminal extending outward from the non-support surface; a second bus bar insert-molded into the support member, the second bus bar having a second internal terminal connected to the second electrode and a second external terminal extending outward from the non-support surface; and a film that seals the capacitor element, the first internal terminal, the second internal terminal, and the support surface by being in close contact with the capacitor element, the first internal terminal, the second internal terminal, and the support surface.

[0009] A method for manufacturing a capacitor according to one embodiment of the present disclosure includes a preparation step of preparing a support member on which a first bus bar having first internal terminals and first external terminals and a second bus bar having second internal terminals and second external terminals are insert-molded, a capacitor element having first electrodes and second electrodes, and a film; a connection step of placing the capacitor element on a support surface of the support member, connecting the first internal terminal to the first electrode, and connecting the second internal terminal to the second electrode; and a sealing step of heating the film and bringing the heated film into close contact with the capacitor element, the first internal terminals, the second internal terminals, and the support surface, thereby sealing the capacitor element, the first internal terminals, the second internal terminals, and the support surface. [Effects of the Invention]

[0010] According to the present disclosure, it is possible to improve the positional accuracy of the first bus bar and the second bus bar, and also to achieve weight reduction and space saving. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view illustrating a capacitor according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a plan view showing the capacitor (excluding the film). [Figure 3] FIG. 3 is a bottom view showing the capacitor. [Figure 4] 4A to 4C are schematic cross-sectional views showing the film. [Figure 5] FIG. 5 is a perspective view showing one step of the method for manufacturing the capacitor. [Figure 6] FIG. 6 is a perspective view showing one step of the method for manufacturing the capacitor. [Figure 7] FIG. 7 is a perspective view showing one step of the method for manufacturing the capacitor. DETAILED DESCRIPTION OF THE INVENTION

[0012] 1. Overview In the capacitor of Patent Document 1, the through-hole has a hole dimension slightly larger than the horizontal cross-sectional dimension of the connection terminal. Although the through-hole is sealed from the inside of the case with a ring-shaped sealing member, it is difficult to improve the positional accuracy of the bus bar. Furthermore, the capacitor of Patent Document 1 has a case and a filling resin, which increases the weight and space required.

[0013] Therefore, in light of the above problems, the present inventors have conducted extensive research and have developed the following capacitor 1.

[0014] In this embodiment, the first bus bar 61 and the second bus bar 62 are insert-molded into the support member 4, as will be described in detail later.

[0015] Therefore, the positional accuracy of the first bus bar 61 and the second bus bar 62 can be improved.

[0016] Furthermore, in the capacitor 1 according to this embodiment, the capacitor element 2 is sealed using a film 7, rather than using a case and a filling resin as described in Patent Document 1, thereby achieving weight reduction and space saving.

[0017] 2.Details (1) Capacitor The capacitor 1 according to this embodiment will be described below with reference to Figures 1 to 7. Note that each figure is a schematic diagram, and the ratios of the sizes and thicknesses of the components in each figure do not necessarily reflect the actual dimensional ratios.

[0018] The arrows indicating directions in each figure (arrows indicating the up-down direction, left-right direction, and front-to-back direction) are not intended to define the directions when the capacitor 1 is in use, but are merely shown to make the explanation easier to understand and have no substance. In the following explanation, the direction in which the support member 4 supports the capacitor element 2 is referred to as the "up-down direction," the direction in which the first electrode 21 and the second electrode 22 of the capacitor element 2 are aligned is referred to as the "left-to-right direction," and the direction perpendicular to the up-down direction and left-to-right direction is referred to as the "front-to-back direction." A view along the up-down direction is referred to as a "planar view," a view along the left-to-right direction is referred to as a "side view," and a view along the front-to-back direction is referred to as a "front view."

[0019] As shown in Fig. 1, capacitor 1 is a so-called caseless capacitor. That is, capacitor 1 does not include a case or a filled resin as described in Patent Document 1. Specifically, capacitor 1 according to this embodiment includes a capacitor element 2, a support member 4, a first bus bar 61, a second bus bar 62, and a film 7. Each of the components will be described below in order.

[0020] <Capacitor element> The capacitor element 2 is a main component of the capacitor 1. There are no particular limitations on the capacitor element 2, but examples thereof include a wound capacitor element and a multilayer capacitor element.

[0021] Specifically, the capacitor element 2 has an element body 20, a first electrode 21, and a second electrode 22.

[0022] In this embodiment, the element body 20 has a rectangular shape in plan view and front view, and a rounded rectangle in side view, but is not particularly limited to the shape of the element body 20. For example, the shape of the element body 20 may be a cylindrical shape, an elliptical cylindrical shape, a rectangular parallelepiped shape, or the like.

[0023] The element body 20 has a left side surface, a right side surface, and an outer peripheral surface. The outer peripheral surface is a surface that connects the outer peripheral edge of the left side surface with the outer peripheral edge of the right side surface.

[0024] The element body 20 includes a dielectric film, a first internal electrode, and a second internal electrode. Inside the element body 20, the first internal electrode and the second internal electrode face each other via the dielectric film. The first internal electrode and the second internal electrode are vapor-deposited on the dielectric film. Thus, the capacitor 1 is a film capacitor. Note that the first internal electrode and the second internal electrode are not shown in the figure.

[0025] The material of the dielectric film is not particularly limited, but examples thereof include polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polycarbonate (PC), polystyrene (PS), etc. The outer peripheral surface of the element body 20 may be formed of a dielectric film, but may also be formed of an electrically insulating member other than a dielectric film.

[0026] A portion of the first internal electrode is exposed on the left side surface of the element body 20, but not on the right side surface. A portion of the second internal electrode is exposed on the right side surface of the element body 20, but not on the left side surface. The material of the first internal electrode and the second internal electrode is not particularly limited, but examples thereof include aluminum (Al), gold (Au), magnesium (Mg), zinc (Zn), tin (Sn), nickel (Ni), chromium (Cr), iron (Fe), copper (Cu), titanium (Ti), and alloys thereof.

[0027] The first electrode 21 is formed by spraying metal onto the left side surface of the element body 20. As a result, the first electrode 21 is electrically connected to the first internal electrode.

[0028] The second electrode 22 is formed by spraying metal onto the right side surface of the element body 20. As a result, the second electrode 22 is electrically connected to the second internal electrode.

[0029] The metal to be sprayed onto each of the first electrode 21 and the second electrode 22 is not particularly limited, but examples thereof include zinc (Zn), tin (Sn), and alloys thereof.

[0030] <Supporting member> The support member 4 is a member that supports the capacitor element 2. The support member 4 is generally plate-shaped and has a thickness in the vertical direction. As shown in FIG. 2, in plan view, the outer periphery of the support member 4 is located outside the outer periphery of the capacitor element 2. In other words, the support member 4 is slightly larger than the capacitor element 2 in plan view.

[0031] As shown in FIGS. 3 and 5, the support member 4 includes a support surface 41, a non-support surface 42, and at least one fastening portion 300 (two in this embodiment).

[0032] The support surface 41 is a surface that supports the capacitor element 2. In this embodiment, the support surface 41 is the upper surface of the support member 4.

[0033] The non-supporting surface 42 is a surface other than the supporting surface 41. Specifically, the non-supporting surface 42 includes the lower surface and the outer surface of the supporting member 4.

[0034] The fastening portion 300 is a portion that is fastened to an external device (not shown). In this embodiment, the fastening portion 300 is present on the non-support surface 42 (outer surface). The fastening portion 300 has a collar 301. The collar 301 is a cylindrical member that penetrates in the vertical direction. A nut, a positioning pin, or the like may be used instead of the collar 301. The external device is not particularly limited, but an example thereof is an inverter case made of die-cast aluminum.

[0035] The support member 4 has electrical insulation properties. The material of the support member 4 is not particularly limited, but examples thereof include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), and epoxy resin (EP).

[0036] <First bus bar> 5, the first bus bar 61 is insert-molded into the support member 4. That is, the first bus bar 61 is integrated with the support member 4.

[0037] The first bus bar 61 is a conductive member. The material of the first bus bar 61 is not particularly limited, but examples thereof include copper (Cu), aluminum (Al), and alloys thereof.

[0038] 3 and 5, the first bus bar 61 has a first inner terminal 601, a first outer terminal 611, and a first intermediate portion 621. The first inner terminal 601, the first outer terminal 611, and the first intermediate portion 621 are integrated together.

[0039] The first internal terminal 601 is connected to the first electrode 21 by, for example, soldering (see FIG. 2). As shown in FIG. 5, the first internal terminal 601 extends outward from the support surface 41 of the support member 4. Specifically, the first internal terminal 601 extends upward from the support surface 41.

[0040] The first external terminal 611 extends outward from the non-support surface 42 of the support member 4 (see FIGS. 1 and 3). Specifically, the first external terminal 611 extends downward from the non-support surface 42 (lower surface).

[0041] 3, the first intermediate portion 621 extends in the front-rear direction and is embedded inside the support member 4. The first intermediate portion 621 connects the first internal terminal 601 and the first external terminal 611. That is, the first internal terminal 601 extends upward from the left end of the first intermediate portion 621. Meanwhile, the first external terminal 611 extends downward from the front end of the first intermediate portion 621. Therefore, the first internal terminal 601 and the first external terminal 611 are located at different positions in a plan view.

[0042] <Second bus bar> 5, second bus bar 62 is also insert-molded into support member 4, similar to first bus bar 61. That is, second bus bar 62 is also integrated with support member 4.

[0043] The second bus bar 62 is also a conductive member. The material of the second bus bar 62 is the same as the material of the first bus bar 61.

[0044] 3 and 5, the second bus bar 62 has a second inner terminal 602, a second outer terminal 612, and a second intermediate portion 622. The second inner terminal 602, the second outer terminal 612, and the second intermediate portion 622 are integrated together.

[0045] The second internal terminal 602 is connected to the second electrode 22 by, for example, soldering (see FIGS. 2 and 6). As shown in FIG. 5, the second internal terminal 602 extends outward from the support surface 41 of the support member 4. Specifically, the second internal terminal 602 extends upward from the support surface 41. The second internal terminal 602 faces the first internal terminal 601 in the left-right direction. The distance between the first internal terminal 601 and the second internal terminal 602 is approximately equal to the length (left-right direction) of the capacitor element 2.

[0046] The second external terminal 612 extends outward from the non-support surface 42 of the support member 4 (see FIGS. 1 and 3). Specifically, the second external terminal 612 extends downward from the non-support surface 42 (lower surface). The first external terminal 611 and the second external terminal 612 are aligned in the left-right direction.

[0047] As shown in FIG. 3 , like the first intermediate portion 621, the second intermediate portion 622 also extends in the front-rear direction and is embedded inside the support member 4. In this way, the second intermediate portion 622 is parallel to the first intermediate portion 621. The second intermediate portion 622 connects the second internal terminal 602 and the second external terminal 612. That is, the second internal terminal 602 extends upward from the right end of the second intermediate portion 622. Meanwhile, the second external terminal 612 extends downward from the front end of the second intermediate portion 622. Therefore, the second internal terminal 602 and the second external terminal 612 are located at different positions in a plan view.

[0048] <Film> The film 7 seals the capacitor element 2, the first internal terminal 601, and the second internal terminal 602. That is, the film 7 covers the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the support surface 41 so as to prevent the capacitor element 2, the first internal terminal 601, and the second internal terminal 602 from coming into direct contact with the outside air. The film 7 may be transparent, translucent, or opaque.

[0049] The film 7 is in close contact with the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the support surface 41. In this manner, the film 7 conforms to the surface shapes of the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the support surface 41.

[0050] Here, the lower surface of the capacitor element 2 is in substantial contact with the support surface 41 of the support member 4, and therefore the portion of the capacitor element 2 to which the film 7 is in close contact is mainly the portion excluding the lower surface of the capacitor element 2. Furthermore, the portion of the support surface 41 to which the film 7 is in close contact is the portion of the support surface 41 that is not overlapped by the capacitor element 2 in plan view, in other words, the portion between the outer periphery of the support member 4 (excluding the fastening portion 300) and the outer periphery of the capacitor element 2 in plan view.

[0051] As described above, the film 7 is in close contact with the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the support surface 41, thereby sealing the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the support surface 41.

[0052] There are no particular limitations on the film 7, as long as it can seal at least the capacitor element 2, the first inner terminal 601, and the second inner terminal 602. A preferred film 7 will be described below with reference to Figures 4A to 4C.

[0053] The film 7 shown in FIG. 4A has a two-layer structure. That is, the film 7 includes an adhesive layer 70 and an insulating layer 71. The adhesive layer 70 is a layer containing an adhesive, preferably a hot-melt adhesive. A hot-melt adhesive is an adhesive that is heated to melt and bond. The adhesive layer 70 is bonded to the capacitor element 2, the first inner terminal 601, the second inner terminal 602, and the support surface 41. On the other hand, the insulating layer 71 is a layer having electrical insulation properties. The insulating layer 71 overlaps the adhesive layer 70. The insulating layer 71 is not particularly limited, but examples thereof include polypropylene (PP), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyphenylene ether (PPE), and polyvinylidene fluoride (PVDF).

[0054] The film 7 shown in FIG. 4B has a three-layer structure. That is, the film 7 includes an adhesive layer 70, an insulating layer 71, and a gas barrier layer 72. The gas barrier layer 72 is a layer that is difficult for gases such as oxygen and water vapor to permeate. The gas barrier layer 72 overlaps the insulating layer 71. The insulating layer 71 is interposed between the gas barrier layer 72 and the adhesive layer 70. The gas barrier layer 72 is not particularly limited, but may include at least one of silicon oxide and aluminum oxide, for example. The gas barrier layer 72 can be formed by, for example, a vapor deposition method, a sputtering method, a plasma CVD method, or the like.

[0055] The film 7 shown in FIG. 4C also has a three-layer structure. That is, the film 7 includes an adhesive layer 70, an insulating layer 71, and a metal layer 73. The metal layer 73 overlaps the insulating layer 71. The insulating layer 71 is interposed between the metal layer 73 and the adhesive layer 70. The metal layer 73 is not particularly limited, but may include aluminum, for example. The metal layer 73 may be a metal foil or may be formed by a vapor deposition method or the like.

[0056] <Action and effect> In the capacitor 1 according to this embodiment, the first bus bar 61 and the second bus bar 62 are insert-molded into the support member 4.

[0057] This improves the positional accuracy of the first bus bar 61 and the second bus bar 62. In particular, in this embodiment, as shown in FIG. 3 , the first intermediate portion 621 is embedded inside the support member 4 while extending in one direction (the front-to-rear direction), so the contact area between the first bus bar 61 and the support member 4 can be increased compared to when the first intermediate portion 621 is not present. Therefore, the position of the first bus bar 61 is hardly shifted on the support member 4. The same applies to the second bus bar 62.

[0058] Furthermore, the capacitor 1 according to this embodiment is a so-called caseless capacitor, which means that the capacitor element 2 is sealed using a film 7, without using a case or a filling resin as described in Patent Document 1, thereby achieving weight reduction and space saving.

[0059] Furthermore, in the capacitor 1 according to this embodiment, the support member 4 includes the fastening portion 300. Therefore, the capacitor 1 can be attached to an external device by the fastening portion 300.

[0060] Furthermore, in capacitor 1 according to this embodiment, film 7 includes adhesive layer 70, which makes it easier to bond capacitor element 2 and film 7 together.

[0061] (2) Capacitor manufacturing method Next, a method for manufacturing the capacitor 1 according to this embodiment will be described with reference to Figures 5 to 7. The method for manufacturing the capacitor 1 includes a preparation step, a connection step, and a sealing step.

[0062] <Preparation process> 5, in the preparation step, a support member 4, a capacitor element 2, and a film 7 are prepared. As described above, the first bus bar 61 and the second bus bar 62 are insert-molded into the support member 4 in advance. In other words, the support member 4, the first bus bar 61, and the second bus bar 62 are integrated. The film 7 is slightly larger than the support member 4 in a plan view.

[0063] <Connection process> 6, in the connection step, the capacitor element 2 is placed on the support surface 41 of the support member 4, and the first internal terminal 601 is connected to the first electrode 21, and the second internal terminal 602 is connected to the second electrode 22. The first internal terminal 601 can be connected to the first electrode 21 by, for example, soldering. Similarly, the second internal terminal 602 can be connected to the second electrode 22 by, for example, soldering.

[0064] <Sealing process> In the sealing process, first, the film 7 is heated, which softens the film 7. Next, as shown in Fig. 7 , the heated film 7 is brought into close contact with the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the support surface 41, thereby sealing the capacitor element 2, the first internal terminal 601, the second internal terminal 602, and the support surface 41.

[0065] It is particularly preferable to use vacuum forming in the sealing step. When using vacuum forming, a vacuum is drawn between the capacitor element 2 supported by the support member 4 and the film 7. This makes it easier for the film 7 to adhere closely to the capacitor element 2, the first inner terminal 601, the second inner terminal 602, and the support surface 41. When using vacuum forming, a known vacuum forming machine can be used.

[0066] After the film 7 is sealed, it is cooled, the vacuum is stopped, and the pressure is returned to atmospheric pressure, completing the sealing process. If necessary, unnecessary portions of the film 7 that protrude from the support member 4 in plan view can be cut off to obtain the capacitor 1 shown in FIG.

[0067] <Action and effect> In the method for manufacturing capacitor 1 according to this embodiment, first bus bar 61 and second bus bar 62 are insert-molded into support member 4.

[0068] Therefore, in the manufactured capacitor 1, the positional accuracy of the first bus bar 61 and the second bus bar 62 can be improved.

[0069] Furthermore, in the method for manufacturing capacitor 1 according to this embodiment, capacitor element 2 is sealed using film 7, without using a case and a filling resin as described in Patent Document 1.

[0070] Therefore, it is possible to reduce the weight and space of the manufactured capacitor 1. Unlike Patent Document 1, the manufacturing method of capacitor 1 does not require curing the resin filled in the case, so capacitor 1 can be manufactured easily.

[0071] Furthermore, the method for manufacturing capacitor 1 according to this embodiment uses vacuum forming, which makes it easier to remove air, moisture, and the like from between capacitor element 2 and film 7.

[0072] Furthermore, in the method for manufacturing the capacitor 1 according to this embodiment, the film 7 includes the adhesive layer 70, which prevents the film 7 from peeling off in reaction when the vacuum is stopped and the pressure is returned to atmospheric pressure.

[0073] 3. Variations In this embodiment, the support member 4 includes the fastening portion 300 , but the support member 4 does not necessarily have to include the fastening portion 300 .

[0074] In this embodiment, the film 7 has a multilayer structure, but the film 7 may have a single-layer structure. When the film 7 has a single-layer structure, it is preferable that the film 7 has moisture-proof, airtight, electrically insulating, and thermoplastic properties.

[0075] 4. Aspects As is clear from the above-described embodiments and modifications, the present disclosure includes the following aspects. In the following, reference numerals are given in parentheses only to clarify the correspondence with the embodiments.

[0076] The first aspect is a capacitor (1), comprising: a capacitor element (2) having a first electrode (21) and a second electrode (22); a support member (4) including a support surface (41) that supports the capacitor element (2) and a non-support surface (42) other than the support surface (41); a first internal terminal (601) connected to the first electrode (21) and a first external terminal (611) extending outward from the non-support surface (42); a first bus bar (61) insert-molded into the support member (4); and a first external terminal (611) that connects the second electrode (22) to the support member (4). and a second bus bar (62) insert-molded into the support member (4), the second bus bar (62) having a second internal terminal (602) connected to the capacitor element (2) and a second external terminal (612) extending outward from the non-support surface (42), and a film (7) that seals the capacitor element (2), the first internal terminal (601), the second internal terminal (602), and the support surface (41) by being in close contact with the capacitor element (2), the first internal terminal (601), the second internal terminal (602), and the support surface (41).

[0077] According to this embodiment, the positional accuracy of the first bus bar (61) and the second bus bar (62) can be improved, and weight and space can be reduced.

[0078] The second aspect is a capacitor (1) based on the first aspect. In the second aspect, the support member (4) further includes a fastening portion (300) that is fastened to an external device.

[0079] According to this embodiment, the capacitor (1) can be attached to an external device by the fastening portion (300).

[0080] A third aspect is a capacitor (1) based on the first or second aspect. In the third aspect, the film (7) includes an adhesive layer (70) adhered to the capacitor element (2), the first internal terminal (601), the second internal terminal (602), and the support surface (41), and an insulating layer (71) overlying the adhesive layer (70).

[0081] According to this embodiment, the capacitor element (2) and the film (7) can be easily brought into close contact with each other.

[0082] The fourth aspect is a method for manufacturing a capacitor (1), comprising a preparation step of preparing a support member (4) on which a first bus bar (61) having a first internal terminal (601) and a first external terminal (611) and a second bus bar (62) having a second internal terminal (602) and a second external terminal (612) are insert-molded, a capacitor element (2) having a first electrode (21) and a second electrode (22), and a film (7); The method includes a connecting step of connecting the internal terminal (601) to the first electrode (21) and connecting the second internal terminal (602) to the second electrode (22), and a sealing step of heating the film (7) and bringing the heated film (7) into close contact with the capacitor element (2), the first internal terminal (601), the second internal terminal (602), and the support surface (41), thereby sealing the capacitor element (2), the first internal terminal (601), the second internal terminal (602), and the support surface (41).

[0083] According to this embodiment, the capacitor (1) can be easily manufactured, in which the first bus bar (61) and the second bus bar (62) are positioned with high accuracy and which can achieve lighter weight and space saving.

[0084] A fifth aspect is a method for manufacturing the capacitor (1) according to the fourth aspect. In the fifth aspect, a vacuum forming method is used in the sealing step.

[0085] According to this embodiment, air, moisture, etc. can be easily removed from between the capacitor element (2) and the film (7). [Explanation of symbols]

[0086] 1 capacitor 2 Capacitor elements 21 1st electrode 22 2nd electrode 300 Fastening part 4 Support member 41 Support surface 42 Non-supporting surface 61 First bus bar 601 1st internal terminal 611 First external terminal 62 Second bus bar 602 2nd internal terminal 612 Second external terminal 7 Film 70 Adhesive layer 71 Insulating layer

Claims

1. a capacitor element having a first electrode and a second electrode; a support member including a support surface that supports the capacitor element and a non-support surface other than the support surface; a first bus bar that is insert-molded into the support member and that includes a first internal terminal connected to the first electrode and a first external terminal extending outward from the non-support surface; a second bus bar that is insert-molded into the support member and that includes a second internal terminal connected to the second electrode and a second external terminal extending outward from the non-support surface; a film that seals the capacitor element, the first internal terminal, the second internal terminal, and the support surface by being in close contact with the capacitor element, the first internal terminal, the second internal terminal, and the support surface, Capacitor.

2. The support member further includes a fastening portion that is fastened to an external device. The capacitor of claim 1 .

3. the film includes an adhesive layer adhered to the capacitor element, the first internal terminal, the second internal terminal, and the support surface, and an insulating layer overlying the adhesive layer. The capacitor of claim 1 .

4. a preparation step of preparing a support member on which a first bus bar having a first internal terminal and a first external terminal and a second bus bar having a second internal terminal and a second external terminal are insert-molded, a capacitor element having a first electrode and a second electrode, and a film; a connecting step of placing the capacitor element on the support surface of the support member, connecting the first internal terminal to the first electrode, and connecting the second internal terminal to the second electrode; a sealing step of heating the film and bringing the heated film into close contact with the capacitor element, the first internal terminals, the second internal terminals, and the support surface, thereby sealing the capacitor element, the first internal terminals, the second internal terminals, and the support surface, How to manufacture a capacitor.

5. In the sealing step, a vacuum forming method is used. The method of claim 4.

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