Method and apparatus for cutting adhesive tape

Abstract

To provide a method and an apparatus for cutting an adhesive tape, which can easily cut the adhesive tape while suppressing adhesion of impurities to the adhesive tape.SOLUTION: A method for cutting an adhesive tape having an adhesive layer includes a step for stretching at least a portion of the adhesive layer, and a step for cutting the stretched portion of the adhesive layer that is the portion stretched in the stretching step.SELECTED DRAWING: Figure 2F

Description

[Technical Field]

[0001] The present invention relates to a method and an apparatus for cutting an adhesive tape. [Background technology]

[0002] Conventionally, various methods have been proposed for cutting an adhesive tape having an adhesive layer (see, for example, Patent Document 1). For example, in the method of Patent Document 1, the adhesive tape is cut by bringing a cutting means such as a cutter into contact with the adhesive tape. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-231791 Summary of the Invention [Problem to be solved by the invention]

[0004] In particular, in adhesive tapes having strong adhesive strength, the adhesive layer may stick to cutting means such as a cutter or scissors, making it difficult to cut the adhesive tape into the intended shape.

[0005] One possible method to suppress the above-mentioned adhesion is to apply silicone liquid, oil, or the like to the cutting means. However, this method leaves the silicone liquid, oil, or the like remaining on the adhesive tape as impurities. Therefore, this method is difficult to adopt for adhesive tapes used to bond components that require cleanliness (e.g., components used in semiconductor devices).

[0006] The present invention has been made in consideration of the above circumstances, and aims to provide a method and an apparatus for cutting adhesive tape that can easily cut the adhesive tape while suppressing the adhesion of impurities to the adhesive tape. [Means for solving the problem]

[0007] In order to solve the above problem, a method for cutting an adhesive tape according to aspect 1 of the present invention is a cutting method for cutting an adhesive tape having an adhesive layer, and includes a stretching step of stretching at least a portion of the adhesive layer, and a cutting step of cutting the stretched portion of the adhesive layer that is the portion stretched in the stretching step.

[0008] A second aspect of the present invention is the method for cutting an adhesive tape according to the first aspect, wherein in the cutting step, the stretched portion is cut by a cutting unit that cuts the stretched portion without contact.

[0009] A third aspect of the present invention is the method for cutting an adhesive tape according to the first aspect, wherein in the cutting step, the stretched portion is cut by bringing a heated cutting part into contact with the stretched portion.

[0010] Furthermore, in a fourth aspect of the present invention, in the method for cutting an adhesive tape according to any one of the first to third aspects, the adhesive tape further has a peeling portion that contacts the adhesive layer to facilitate peeling, and further has a preliminary cutting step of cutting the peeling portion before the stretching step.

[0011] In order to solve the above problem, the adhesive tape cutting device according to aspect 5 of the present invention is a cutting device for cutting an adhesive tape having an adhesive layer, and comprises a stretching unit that stretches at least a portion of the adhesive layer, and a cutting unit that cuts the stretched portion, which is the portion of the adhesive layer stretched by the stretching unit.

[0012] A sixth aspect of the present invention is the adhesive tape cutting device of the fifth aspect, wherein the cutting section cuts the stretched portion without contacting it.

[0013] A seventh aspect of the present invention is directed to the adhesive tape cutting device of the fifth aspect, wherein the cutting unit cuts the stretched portion by contacting the stretched portion in a heated state.

[0014] Furthermore, aspect 8 of the present invention relates to an adhesive tape cutting device according to any one of aspects 5 to 7, wherein the adhesive tape further has a peeling portion that contacts the adhesive layer to facilitate peeling, and further includes a preliminary cutting portion that cuts the peeling portion before the stretching portion stretches at least a portion of the adhesive layer. [Effects of the Invention]

[0015] According to the above aspects of the present invention, it is possible to provide an adhesive tape cutting method and an adhesive tape cutting device that can easily cut the adhesive tape while suppressing adhesion of impurities to the adhesive tape. [Brief explanation of the drawings]

[0016] [Figure 1] 3 is a flowchart showing a method for cutting an adhesive tape according to an embodiment of the present invention. [Figure 2A] 1A to 1C are diagrams illustrating a method for cutting an adhesive tape according to an embodiment of the present invention. [Figure 2B] FIG. 2B is a diagram showing a state subsequent to FIG. 2A. [Figure 2C] FIG. 2C is a diagram showing a state following FIG. 2B. [Figure 2D] FIG. 2D is a diagram showing a state following FIG. 2C. [Figure 2E] FIG. 2B is a diagram showing a state subsequent to FIG. 2D. [Figure 2F] FIG. 2B shows a state subsequent to FIG. 2E. [Figure 2G] FIG. 2C shows a state following FIG. 2F. [Figure 3] 1 is a diagram showing an adhesive tape cutting device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An adhesive tape cutting method and an adhesive tape cutting device according to an embodiment of the present invention will now be described with reference to the accompanying drawings.

[0018] 1, the method for cutting an adhesive tape according to this embodiment (hereinafter may be simply referred to as the "cutting method") includes a holding step S11, a preliminary cutting step S12, a stretching step S13, and a cutting step S14. In this embodiment, the holding step S11, preliminary cutting step S12, stretching step S13, and cutting step S14 are performed in this order.

[0019] In the following description, a case will be described in which an operator performs the above-described cutting method by operating an adhesive tape cutting device 10 (hereinafter sometimes simply referred to as "cutting device 10") shown in Figures 2A to 2G. As shown in Figures 2A to 2G, cutting device 10 according to this embodiment includes a pair of bases 11A and 11B (first base 11A and second base 11B), a pair of pressing units 12A and 12B (first pressing unit 12A and second pressing unit 12B), a preliminary cutting unit 14, and a cutting unit 15. However, the configuration of cutting device 10 can be modified as appropriate as long as the cutting method according to this embodiment can be performed.

[0020] (Holding step S11) In the holding step S11, first, an operator places the adhesive tape 20 to be cut on a pair of pedestals 11A and 11B (see FIGS. 2A and 2B). As shown in FIG. 2A, the adhesive tape 20 has a long shape.

[0021] Hereinafter, the longitudinal direction of the adhesive tape 20 will be referred to as the "longitudinal direction X," the lateral direction of the adhesive tape 20 will be referred to as the "lateral direction Y," and the thickness direction of the adhesive tape 20 will be referred to as the "thickness direction Z." One direction in the longitudinal direction X will be referred to as the +X direction or right side. The direction opposite to the +X direction will be referred to as the -X direction or left side. One direction in the lateral direction Y will be referred to as the +Y direction or rear side. The direction opposite to the +Y direction will be referred to as the -Y direction or front side. One direction in the thickness direction Z will be referred to as the +Z direction or upward. The direction opposite to the +Z direction will be referred to as the -Z direction or downward. However, the +Z direction (-Z direction) may or may not coincide with the upward (downward) direction in the direction of gravity.

[0022] 2A, the adhesive tape 20 according to this embodiment has an adhesive layer 21 and a release portion 22. The adhesive layer 21 and the release portion 22 are adjacent to each other in the thickness direction Z. The adhesive tape 20 may be an adhesive tape for adhering components that require cleanliness (for example, components used in semiconductor devices).

[0023] The adhesive layer 21 is a layer made of an adhesive. The adhesive constituting the adhesive layer 21 may be an adhesive that exhibits excellent adhesive strength to fluororesin. The adhesive layer 21 has a first surface 21a and a second surface 21b located on the opposite side to the first surface 21a. In the holding step S11 according to this embodiment, the adhesive tape 20 is placed on the base portions 11A and 11B so that the first surface 21a contacts the base portions 11A and 11B.

[0024] In the adhesive tape 20 according to this embodiment, the adhesive layer 21 does not include a support (substrate) such as a nonwoven fabric. As a result, in the adhesive layer 21 according to this embodiment, both the first surface 21a and the second surface 21b exhibit adhesive force. In other words, the adhesive layer 21 according to this embodiment functions as a so-called double-sided tape.

[0025] The release portion 22 is a layer for protecting the adhesive layer 21. The release portion 22 is, for example, a release paper. The release portion 22 has a contact surface 22a that comes into contact with the second surface 21b of the adhesive layer 21. At least the contact surface 22a of the release portion 22 is subjected to a release treatment to make the adhesive layer 21 less likely to adhere. In other words, the contact surface 22a is a release surface to which the adhesive layer 21 is less likely to adhere. This allows the release portion 22 to come into contact with the adhesive layer 21 and be easily peeled off.

[0026] 2A, the pair of base portions 11A, 11B are spaced apart in the longitudinal direction X. Each of the base portions 11A, 11B has an arrangement surface 11a that contacts (is arranged on) the first surface 21a of the adhesive layer 21. The arrangement surface 11a faces upward.

[0027] 2B, the adhesive tape 20 is placed on the base portions 11A and 11B so that the first surface 21a contacts both the placement surface 11a of the first base portion 11A and the placement surface 11a of the second base portion 11B. At this time, the intended cutting location C of the adhesive tape 20 is positioned between the base portions 11A and 11B in the longitudinal direction X.

[0028] The placement surfaces 11a of the base portions 11A and 11B are preferably subjected to a release treatment to make the adhesive layer 21 less likely to stick to them. For example, the placement surfaces 11a may be used as release surfaces by disposing release-treated release portions 11b (release paper) on the upper ends of the base portions 11A and 11B. By using the placement surfaces 11a as release surfaces, it is possible to prevent the adhesive layer 21 from sticking to the base portions 11A and 11B. This allows the adhesive tape 20 to be easily removed from the cutting device 10, for example, after the cutting step S14.

[0029] After placing the adhesive tape 20 on the base portions 11A and 11B, the worker presses the adhesive tape 20 toward the base portions 11A and 11B with the pair of pressing portions 12A and 12B, as shown in FIG. 2C. At this time, the base portions 11A and 11B and the pressing portions 12A and 12B sandwich the adhesive tape 20 from above and below. As a result, the first base portion 11A and the second base portion 11B function as the first holding portion 13A that holds the adhesive tape 20 on the right side of the intended cutting location C. The second base portion 11B and the second pressing portion 12B function as the second holding portion 13B that holds the adhesive tape 20 on the left side of the intended cutting location C.

[0030] As described above, in the holding step S11, the adhesive tape 20 is held by the holding units 13A and 13B. More specifically, the holding units 13A and 13B hold both sides of the planned cutting location C of the adhesive tape 20. Note that the configuration of the holding units 13A and 13B is not particularly limited as long as they are capable of holding the adhesive tape 20, and can be changed as appropriate.

[0031] (Preliminary cutting process S12) In the preliminary cutting step S12, as shown in FIGS. 2D and 2E , the worker cuts the peeling portion 22 using the preliminary cutting unit 14. More specifically, the worker cuts the peeling portion 22 at a planned cutting location C using the preliminary cutting unit 14. At this time, the adhesive layer 21 is not cut by the preliminary cutting unit 14. That is, in the preliminary cutting step S12, only the peeling portion 22 of the adhesive tape 20 is cut by the preliminary cutting unit 14.

[0032] The preliminary cutting unit 14 is, for example, a cutter blade. In the example of Fig. 2D, the preliminary cutting unit 14 is inserted from the gap between the pressing units 12A and 12B in the longitudinal direction X and is in contact with the peeling unit 22. However, the configuration of the preliminary cutting unit 14 is not particularly limited as long as it can cut the peeling unit 22, and can be changed as appropriate.

[0033] Note that if the subsequent stretching step S13 can be performed, the preliminary cutting step S12 does not have to be performed. In this case, the cutting device 10 does not have to be equipped with the preliminary cutting unit 14. However, performing the preliminary cutting step S12 makes it easier to generate the stretched portion 21s in the stretching step S13. Furthermore, by cutting the peeled portion 22 at the planned cutting location C, the location where the stretched portion 21s will be generated can be guided to the planned cutting location C.

[0034] (Stretching process S13) In the stretching step S13, as shown in Fig. 2E, the worker moves each of the pair of holding parts 13A, 13B outward in the longitudinal direction X. That is, each of the pair of holding parts 13A, 13B moves in the longitudinal direction X so as to move away from the planned cutting portion C.

[0035] At this time, the pair of holding portions 13A, 13B function as stretching portions that stretch the portion of the adhesive layer 21 located between the holding portions 13A, 13B (the planned cutting portion C) in the longitudinal direction X. Due to the action of the holding portions 13A, 13B as stretching portions, a stretched portion 21s is generated in the portion of the adhesive layer 21 located between the holding portions 13A, 13B (the planned cutting portion C).

[0036] The stretched portion 21s is a portion of the adhesive layer 21 that is stretched in the longitudinal direction X. Tensile stress in the longitudinal direction X is concentrated in the stretched portion 21s. Therefore, the stretched portion 21s (the planned cutting portion C) is easier to cut than the other portions of the adhesive layer 21 other than the stretched portion 21s.

[0037] (Cutting process S14) In the cutting step S14, as shown in FIG. 2F, the worker cuts the stretched portion 21s with the cutting unit 15. As a result, the adhesive tape 20 is cut in the longitudinal direction X at an arbitrary intended cutting location C, as shown in FIG. 2G. After the cutting step S14 is performed, the worker moves the pressing units 12A and 12B upward to release the holding of the adhesive tape 20 by the holding units 13A and 13B, and removes the adhesive tape 20 from the cutting device 10.

[0038] Here, the cutting unit 15 may be configured to cut the stretched portion 21s without contact. For example, the cutting unit 15 may cut the stretched portion 21s by spraying gas G (gaseous particles) toward the stretched portion 21s. Alternatively, the cutting unit 15 may cut the stretched portion 21s by spraying volatile solid particles (e.g., dry ice) toward the stretched portion 21s. As described above, the stretched portion 21s is easy to cut, so the stretched portion 21s can be easily cut even by such a non-contact cutting unit 15.

[0039] Alternatively, the cutting unit 15 may be configured to cut the stretched portion 21s by contacting the stretched portion 21s in a heated state. In this case, an adhesion inhibitor (i.e., an impurity in the adhesive tape 20) such as silicone liquid or oil is not applied to the cutting unit 15. For example, the cutting unit 15 may be a heated cutter blade. Even with this configuration, the stretched portion 21s can be easily cut by the cutting unit 15.

[0040] In the example described above, steps S11 to S14 are performed by an operator, but the operator is not limited to being an operator. For example, as shown in Fig. 3, cutting device 10 may further include control unit 16 for controlling the operations of holding units 13A and 13B, preliminary cutting unit 14, and cutting unit 15. Control unit 16 may then control the operations of holding units 13A and 13B, preliminary cutting unit 14, and cutting unit 15 so that the above-described holding steps S11 to S14 are performed.

[0041] The control unit 16 can be realized by a computer such as a personal computer or a workstation. When the control unit 16 is realized by a computer, the functions of the control unit 16 are realized by a program for realizing the functions being executed by a CPU (Central Processing Unit) provided in the computer. In other words, the functions of the control unit 16 are realized by software and hardware resources working together. The control unit 16 may also be realized using hardware such as an FPGA (Field-Programmable Gate Array), an LSI (Large Scale Integration), or an ASIC (Application Specific Integrated Circuit).

[0042] Next, the operation of the cutting method and cutting device 10 configured as above will be described.

[0043] Conventionally, a method for cutting an adhesive tape by bringing a cutting means such as a cutter into contact with the adhesive tape has been known. However, particularly when the adhesive tape has strong adhesive strength, the adhesive layer may adhere to the cutting means such as a cutter or scissors, making it difficult to cut the adhesive tape into the intended shape. One possible method for suppressing such adhesion is to apply silicone liquid, oil, or the like to the cutting means, but this method leaves the silicone liquid, oil, or the like on the adhesive tape as impurities. Therefore, this method is difficult to adopt for adhesive tapes used to bond components that require cleanliness (e.g., components used in semiconductor devices).

[0044] To address this issue, in the cutting method and cutting device 10 according to this embodiment, at least a portion of the adhesive layer 21 is stretched, thereby turning the intended cutting location C into an easily severable stretched portion 21s. This makes it easy to cut the intended cutting location C (stretched portion 21s) using a non-contact cutting unit 15, a heated cutting unit 15, or the like. If the stretched portion 21s is cut using a non-contact cutting unit 15, no impurities remain in the adhesive tape 20 after the adhesive tape 20 is cut. Furthermore, if a heated cutting unit 15 is used, the stretched portion 21s can be easily cut without applying an adhesion inhibitor (i.e., impurities to the adhesive tape 20) such as silicone liquid or oil to the cutting unit 15.

[0045] As described above, the cutting method according to this embodiment is a cutting method for cutting an adhesive tape 20 having an adhesive layer 21, and includes a stretching step S13 for stretching at least a portion of the adhesive layer 21, and a cutting step S14 for cutting a stretched portion 21s, which is the portion of the adhesive layer 21 stretched in the stretching step S13. The cutting device 10 according to this embodiment is a cutting device for cutting a similar adhesive tape 20, and includes holding units 13A, 13B (stretching units) for stretching at least a portion of the adhesive layer 21, and a cutting unit 15 for cutting the stretched portion 21s.

[0046] With this configuration, the intended cutting portion C can be made into the stretched portion 21s, making it easy to cut. Therefore, the intended cutting portion C can be easily cut even by a non-contact cutting portion 15 or a heated cutting portion 15. In other words, it is possible to achieve easy cutting of the adhesive tape 20 without leaving any impurities.

[0047] In the cutting step, the stretched portion 21s may be cut by a cutting unit 15 that cuts the stretched portion 21s without contacting it. According to this configuration, the adhesive tape 20 can be easily cut without leaving impurities in the adhesive tape 20.

[0048] Furthermore, in the cutting step, the stretched portion 21s may be cut by bringing the heated cutting portion 15 into contact with the stretched portion 21s. With this configuration, the stretched portion 21s can be easily cut without applying an adhesion inhibitor (i.e., impurities in the adhesive tape 20) such as silicone liquid or oil to the cutting portion 15. Therefore, the adhesive tape 20 can be easily cut without leaving impurities in the adhesive tape 20.

[0049] The adhesive tape 20 further includes a peeling portion 22 that contacts the adhesive layer 21 to facilitate peeling, the cutting method according to the present embodiment further includes a preliminary cutting step S12 of cutting the peeling portion 22 before the stretching step S13, and the cutting device 10 according to the present embodiment further includes a preliminary cutting unit 14 that cuts the peeling portion 22 before the holding units 13A and 13B stretch at least a portion of the adhesive layer 21. This configuration makes it easier to generate the stretched portion 21s in the stretching step S13. Furthermore, by cutting the peeling portion 22 at the intended cutting location C, the location where the stretched portion 21s is generated can be guided to the intended cutting location C.

[0050] The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0051] For example, in the above embodiment, the adhesive layer 21 is stretched in the longitudinal direction X, and the adhesive tape 20 is cut in the longitudinal direction X, but the stretching and cutting directions are not limited to the longitudinal direction X and can be changed as appropriate. For example, the adhesive layer 21 may be stretched in the lateral direction Y. In this case, tensile stress in the lateral direction Y is concentrated in the stretched portion 21s, and therefore the adhesive tape 20 can be cut in the lateral direction Y.

[0052] Furthermore, the cutting device 10 does not necessarily have to include the holding units 13A and 13B (stretching units). In this case, for example, an operator may hold the adhesive tape 20 and stretch the adhesive layer 21.

[0053] In addition, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, and the above-described embodiments and variations may be combined as appropriate, without departing from the spirit of the present invention. [Explanation of symbols]

[0054] 10...Cutting device 13A, 13B...Holding section (stretching section) 14...Pre-cutting section 15...Cutting section 20...Adhesive tape 21...Adhesive layer 22...Removal section

Claims

1. A cutting method for cutting an adhesive tape having an adhesive layer, comprising: a stretching step of stretching at least a portion of the adhesive layer; and a cutting step of cutting the stretched portion of the adhesive layer that is the portion stretched in the stretching step. How to cut adhesive tape.

2. In the cutting step, the stretched portion is cut by a cutting unit that cuts the stretched portion in a non-contact manner. The method for cutting an adhesive tape according to claim 1.

3. In the cutting step, the stretched portion is cut by bringing a heated cutting part into contact with the stretched portion. The method for cutting an adhesive tape according to claim 1.

4. The adhesive tape further has a release portion that comes into contact with the adhesive layer to facilitate peeling, The method further includes a preliminary cutting step of cutting the peeled portion before the stretching step. The method for cutting an adhesive tape according to any one of claims 1 to 3.

5. A cutting device for cutting an adhesive tape having an adhesive layer, a stretching unit that stretches at least a portion of the adhesive layer; a cutting unit that cuts the stretched portion, which is a portion of the adhesive layer stretched by the stretching unit, Adhesive tape cutting device.

6. the cutting unit cuts the extended portion without contacting it; The adhesive tape cutting device according to claim 5.

7. the cutting unit cuts the stretched portion by coming into contact with the stretched portion in a heated state; The adhesive tape cutting device according to claim 5.

8. The adhesive tape further has a release portion that comes into contact with the adhesive layer to facilitate peeling, The adhesive tape further includes a pre-cutting section that cuts the peeling section before the stretching section stretches at least a portion of the adhesive layer. The adhesive tape cutting device according to any one of claims 5 to 7.

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