Swarf recovery device and component fitting system, and swarf recovery method

Abstract

To appropriately transfer swarf received in a recovery passage using air.SOLUTION: A swarf recovery device for recovering swarf of a tape member discharged from a shooter 14 of a component fitting device comprises: a recovery passage 21 for receiving the swarf discharged from the shooter 14 from a swarf receiving opening 21a; a first air discharging unit Q1 for discharging first air F1 into the recovery passage 21 to transfer the swarf; and a second air discharging unit Q2 for discharging second air F2 into the recovery passage 21 to transfer the swarf. In a plan view, a first discharging direction of the first air F1 and a second discharging direction of the second air F2 cross each other.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a chip collection device, a component mounting system, and a chip collection method that collect chips of a tape member discharged from a tape feeder. [Background technology]

[0002] In a component mounting device, a tape feeder transports a tape material (carrier tape) on which a large number of components are lined up and stores them, and the supplied components are mounted on a circuit board. After the components are supplied, the tape material is discharged from the tape feeder, cut to a predetermined length by a cutter, and collected as tape material scraps. Patent Document 1 discloses a production line equipped with a scrap collection device that cuts tape material discharged from multiple tape feeders arranged on a feeder cart with a cutter and collects the tape material in a storage unit located at the end of the production line. The scrap collection device in Patent Document 1 uses air to pressure-feed the scraps that fall under their own weight from a chute on the feeder cart through a scrap inlet opening located in a collection path after cutting to the storage unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 131165 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the prior art including Patent Document 1, the direction of the air discharged to transport chips in the recovery path is the same as the direction of chip transport in the recovery path, which causes the following problems: If the discharge section that discharges air is located in the center of the upstream end in the transport direction, chips accumulated at both ends of the recovery path cannot be transported, and if the discharge sections are located in three or more locations including the center and both ends, the flow rate of the discharged air becomes large, leaving room for further improvement in order to transport chips efficiently with air.

[0005] Therefore, an object of the present disclosure is to provide a chip collection device, a component mounting system, and a chip collection method that can appropriately transport chips received in a collection path using air. [Means for solving the problem]

[0006] The chip collection device disclosed herein is a chip collection device that collects chips of a tape member discharged from a chute of a component mounting device having a tape feeder that supplies components using a tape member, and is equipped with a collection path that receives the chips discharged from the chute through an opening, a first air discharge section that discharges first air into the collection path to transport the chips, and a second air discharge section that discharges second air into the collection path to transport the chips, and in a plan view, a first discharge direction of the first air and a second discharge direction of the second air intersect with each other.

[0007] The component mounting system of the present disclosure is a component mounting system comprising: a component mounting device having a tape feeder that supplies components using a tape member; and a chip collection device that collects chips of the tape member discharged from a chute of the component mounting device, wherein the chip collection device comprises a collection path that receives the chips discharged from the chute through an opening, a first air discharge section that discharges first air into the collection path to transport the chips, and a second air discharge section that discharges second air into the collection path to transport the chips, and wherein a first discharge direction of the first air and a second discharge direction of the second air intersect with each other in a plan view.

[0008] The chip collection method disclosed herein is a chip collection method for collecting chips of a tape member discharged from a chute of a component mounting device having a tape feeder that supplies components using a tape member, and includes a discharge step of discharging the chips from the chute to an opening of a recovery path, and a transport step of transporting the chips in the recovery path by a first air discharge unit discharging first air into the recovery path and a second air discharge unit discharging second air into the recovery path, wherein a first discharge direction of the first air and a second discharge direction of the second air intersect with each other in a planar view. [Effects of the Invention]

[0009] According to the present disclosure, chips received in the recovery path can be appropriately transported by air. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing a configuration of a component mounting system including a chip collection device and a plurality of component mounting devices according to an embodiment of the present disclosure. [Figure 2] FIG. 1 is a side view showing a configuration of a main part of a component mounting device installed above a chip collection device according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is a perspective view showing a configuration of a chip collection device according to an embodiment of the present disclosure; [Figure 4] 1A is a plan view illustrating a conveying unit and a position changing unit provided in a chip collecting device according to an embodiment of the present disclosure; FIG. 1C is a front view illustrating the conveying unit and the position changing unit provided in the chip collecting device according to an embodiment of the present disclosure; [Figure 5] 1A and 1B are a plan view and a cross-sectional view illustrating a position changing unit provided in a chip collecting device according to an embodiment of the present disclosure; [Figure 6] 1A is a plan view illustrating a conveying section provided in a chip collecting device according to an embodiment of the present disclosure; FIG. 1B is a side cross-sectional view illustrating the conveying section; [Figure 7] FIG. 1 is a timing diagram illustrating a chip transport method using a chip collection device according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, with reference to the drawings as appropriate, detailed descriptions will be given of embodiments that specifically disclose the configuration and operation of a chip collection device, a component mounting system, and a chip collection method according to the present disclosure. However, unnecessary detailed descriptions may be omitted. For example, detailed descriptions of well-known matters or redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

[0012] The configurations, shapes, etc. described below are examples for explanation purposes and can be modified as appropriate depending on the specifications of the component mounting system, component mounting device, and chip collection device. In the following, corresponding elements in all drawings are given the same reference numerals, and duplicated explanations will be omitted. In FIG. 1 and in some of the following descriptions, two axes perpendicular to each other in a horizontal plane are shown: the X-axis in the board transport direction (the left-right direction as seen from the operator OP in FIG. 1 ), and the Y-axis perpendicular to the board transport direction (the front-back direction as seen from the operator OP in FIG. 1 ). In addition, in FIG. 1 and in some of the following descriptions, the Z-axis (the up-down direction) is shown as the height direction perpendicular to the horizontal plane.

[0013] First, the configuration of the component mounting system 1 will be described with reference to FIG. 1. FIG. 1 is a perspective view showing the configuration of a component mounting system including a chip collection device and multiple component mounting devices according to an embodiment of the present disclosure. The component mounting system 1 includes multiple component mounting devices M1 to M3 and a chip collection device 20. The component mounting system 1 has the function of transferring boards KB between adjacent component mounting devices M1 to M3 and mounting components onto the boards KB to produce mounted boards. The component mounting system 1 also has the function of collecting chips from empty tape members after components have been supplied. The component mounting devices M1 to M3 are installed above the collection path 21 (see FIG. 2) and conveyance path 22 of the chip collection device 20.

[0014] Each of the component mounting devices M1-M3 has a feeder carriage 3 equipped with a plurality of tape feeders 2 that supply components using tape members, and functions to mount the components on the board KB. A chip collection device 20 functions to collect chips of the tape members discharged from the chutes of the component mounting devices M1-M3. The number of component mounting devices M1-M3 provided in the component mounting system 1 is not limited to three, and may be one, two, or four or more. Furthermore, the component mounting system 1 may be configured to include a printing device (not shown) that prints cream solder on the board upstream of the component mounting devices M1-M3, and a reflow device (not shown) that melts the cream solder for soldering downstream.

[0015] Next, the configuration of component mounting devices M1 to M3 will be described with reference to Fig. 2. Fig. 2 is a side view showing the configuration of the main parts of a component mounting device installed above a chip collection device according to an embodiment of the present disclosure. The three component mounting devices M1 to M3 have the same configuration, and the component mounting device M1 will be described here as an example. The component mounting device M1 includes a component mounting main body 4 and two feeder carts 3. The feeder carts 3 are detachably connected to component supply units 5 on the front and rear sides of the component mounting main body 4, respectively.

[0016] A plurality of tape feeders 2 are mounted on the upper surface of the feeder cart 3, aligned along the X-axis. A reel 7 around which a tape material T is wound and which stores components 6 to be supplied to the component mounting main body 4 is rotatably held by the feeder cart 3. The tape feeder 2 transports the tape material T stored on the reel 7 in the tape feed direction to supply the components 6 to the component mounting main body 4.

[0017] 2, when the feeder cart 3 is mounted on the component supply unit 5, the multiple tape feeders 2 are connected to a mounting control device 8 provided in the component mounting main body 4 via the feeder cart 3. The mounting control device 8 sends a command to the tape feeders 2 to supply components 6, and upon receiving the command, the tape feeders 2 feed the tape material T to supply the components 6 to the component removal position.

[0018] The placement control device 8 calculates the length of the empty tape material T discharged from the tape feeder 2 based on the length of the tape material T discharged from the tape feeder 2 in response to one supply command and the number of components 6 supplied by the tape feeder 2. The placement control device 8 also receives the detection result of the sensor 2a that detects the end of the tape material T built into the tape feeder 2, and executes a predetermined process described below.

[0019] 2, two board transport mechanisms 10 are arranged side by side, front and rear, on the upper surface of the base 9 of the component mounting main body 4, between the front and rear component supply units 5. Each board transport mechanism 10 transports, positions, and holds a board KB along the X axis. Above the board transport mechanisms 10, two mounting heads 12 are installed, which are moved horizontally (in the X-axis and Y-axis directions) by a head movement mechanism 11.

[0020] The placement control device 8 controls the head movement mechanism 11 and the placement head 12 to perform a component placement operation in which the placement head 12 picks up the components 6 supplied to the component pick-up position by the tape feeder 2 and transfers and mounts them at the placement point on the board KB held by the board transport mechanism 10. A freely openable main body cover 13 is installed above the feeder cart 3 to prevent workers from touching the moving mechanisms such as the placement head 12 during the component placement operation.

[0021] 2, a chute 14 is provided on the side of the feeder cart 3 that is connected to the base 9, for guiding downward the empty tape material T discharged from the tape feeder 2. A cutter 15 is provided on the chute 14 for cutting the empty tape material T.

[0022] The cutter 15 is controlled by the mounting control device 8, and cuts all empty tape members T at once when the empty tape members T discharged from any of the multiple tape feeders 2 reach a predetermined length (for example, 10 cm). The cut tape members T are discharged from below the chute 14 as scraps Ts (see FIG. 4) of the tape member T. The predetermined length to which the tape member T is cut by the cutter 15 is set to a length that makes it easy for the scrap collection device 20 to collect the scraps Ts.

[0023] Next, the configuration of the chip collection device 20 will be described with reference to FIGS. 2 to 4. FIG. 3 is a perspective view showing the configuration of a chip collection device according to an embodiment of the present disclosure. In FIG. 3, the chip collection device 20 includes six collection paths 21, two conveying paths 22, a positive pressure supply unit 23, and a storage unit 24. The conveying paths 22 are tubular members extending in the arrangement direction (X-axis direction) of the component mounting devices M1 to M3, and are installed on the floor FL. Two conveying paths 22 are installed side by side, one in front of the other. The conveying path 22 installed on the front side corresponds to the three feeder carts 3 located on the front side. The conveying path 22 installed on the rear side corresponds to the three feeder carts 3 located on the rear side.

[0024] The front and rear conveying paths 22 each extend linearly in the area below the multiple component mounting devices M1 to M3 lined up in series in the X-axis direction, and each conveying path 22 has an opening at one end located upstream of the flow of boards KB, and at the other end of the flow of boards KB. Hereinafter, the opening at one end of each conveying path 22 will be referred to as the "air inlet 22A," and the opening at the other end of each conveying path 22 will be referred to as the "air outlet 22B."

[0025] 2 to 4, three recovery paths 21 corresponding to the three feeder carriages 3 connected to the front side are connected to the front side of the transport path 22 installed on the front side. Also, three recovery paths 21 corresponding to the three feeder carriages 3 connected to the rear side are connected to the rear side of the transport path 22 installed on the rear side. In the recovery paths 21, a transport opening 22K is opened at the tip end opposite to the one end connected to the transport path 22.

[0026] A chip receiving opening 21a is formed on the upper surface of the recovery path 21. The chip receiving opening 21a is located directly below the chute 14 of each of the component mounting devices M1 to M3. The recovery path 21 receives chips Ts of the tape material T discharged from the chute 14 through the chip receiving opening 21a (opening). In the recovery path 21, below the chip receiving opening 21a, a position changing unit U is arranged which changes the position of the chips Ts discharged from the chute 14 and received in the recovery path 21.

[0027] Some of the chips Ts have an arc-like shape due to a tendency for the tape member T to warp as it is wound around the reel 7 and passes through the tape feeder 2. Furthermore, when the end of the tape member T is discharged from the tape feeder 2, the chips Ts are not cut by the cutter 15 and become longer than the length (predetermined length) that is easy for the chip collection device 20 to collect. The position changing unit U has a function of changing the position of the chips Ts so that the chips Ts that have an arc-like shape or chips Ts that are longer than the predetermined length can be smoothly received in the collection path 21 without getting caught in the chip receiving opening 21a, etc.

[0028] 2 to 4, a transport unit 25 having a first air outlet Q1 and a second air outlet Q2 that discharge air in a direction toward the transport opening 22K is disposed inside the recovery path 21 and in front of the wall facing the transport opening 22K. The transport unit 25 transports the chips Ts discharged from the chute 14 in the recovery path 21 toward the transport opening 22K by air discharged into the recovery path 21 from the first outlet Q1h of the first air outlet Q1 and the second outlet Q2h of the second air outlet Q2 (transport step). The chips Ts transported in the recovery path 21 are then transported into the transport path 22 through the transport opening 22K.

[0029] 3, the positive pressure supply unit 23 is connected to a positive pressure source 27 via an external pipe 26. The positive pressure supply unit 23 has a built-in control valve 23V. The air inlets 22A of the front and rear conveying paths 22 and the upstream ends of the respective pipes 28 are connected to the control valve 23V via internal pipes (not shown) provided inside the positive pressure supply unit 23. The external pipes 26 are connected to the internal pipes via the control valves 23V.

[0030] The operation of the control valve 23V is controlled by the management device 29. The positive pressure supply unit 23 controls the positive pressure supplied from the positive pressure source 27 through the external piping 26 with the control valve 23V, thereby supplying positive pressure to the air inlets 22A of the front and rear conveying paths 22. When positive pressure is supplied to the air inlets 22A of the conveying path 22, an air flow is formed in the conveying path 22 from the air inlets 22A to the air outlets 22B.

[0031] 3, the positive pressure supply unit 23 also supplies positive pressure to each of the pipes 28 by controlling the positive pressure supplied from the positive pressure source 27 with the control valve 23V. When positive pressure is supplied into the pipes 28, air is blown out from the first air outlet Q1 and the second air outlet Q2 of the conveying unit 25 in the recovery path 21 connected to the pipes 28. By discharging air from the conveying unit 25, the chips Ts in the recovery path 21 are conveyed to the conveying path 22 through the conveying opening 22K (conveying process). Furthermore, by supplying positive pressure to the air inlet 22A of the conveying path 22, the chips Ts in the conveying path 22 are discharged out of the conveying path 22 from the air outlet 22B.

[0032] The storage section 24 has a belt conveyor 30 that receives chips Ts discharged from the air outlet 22B and transports them to a chip passage 31. A box-shaped storage box 32 that opens upward is installed below the chip passage 31. The chips Ts transported to the chip passage 31 by the belt conveyor 30 are collected in the storage box 32. In this way, the chip collection device 20 collects in the storage box 32 the chips Ts of the tape member T discharged from the chutes 14 of the component mounting devices M1 to M3 that have tape feeders 2 that supply components 6 using the tape member T.

[0033] Next, the configuration and function of the position change unit U of the chip collection device 20 will be described with reference to Figures 4 and 5. Figure 4(a) is a plan view of the state in which the chutes 14 of the component mounting devices M1 to M3 are arranged above the chip receiving opening 21a of the collection path 21. Figure 4(b) is a cross section taken along line AA in Figure 4(a). Figure 4(c) is a front view of the collection path 21 as seen from the conveying opening 22K side (downstream in the conveying direction of the chips Ts). Note that the first air discharge unit Q1 and the second air discharge unit Q2 are omitted from Figure 5.

[0034] In FIG. 4, a partition plate 21c hanging down from the ceiling 21b to the bottom surface 21d of the recovery path 21 is disposed on the conveying section 25 side of the chip receiving opening 21a. At the corners where the opposing inner walls 21e and 21f of the recovery path 21 intersect with the partition plate 21c, a plate-shaped first inclined portion P1 and a plate-shaped second inclined portion P2 are installed in an inclined position. The first air discharge portion Q1 and the second air discharge portion Q2 of the conveying section 25 are disposed upstream of the partition plate 21c, the first inclined portion P1, and the second inclined portion P2 in the chip conveying direction (opposite the conveying opening 22K) and spaced apart in a direction perpendicular to the conveying direction in the horizontal plane (the X-axis direction). The first discharge port Q1h and the second discharge port Q2h open into the recovery path 21 from either the partition plate 21c, the first inclined portion P1, or the second inclined portion P2.

[0035] In this way, the first air discharge portion Q1 and the second air discharge portion Q2 are provided spaced apart from each other at the end of the recovery path 21 on the upstream side in the transport direction of the chips Ts (Y-axis direction). Air is discharged from the first discharge port Q1h of the first air discharge portion Q1 and the second discharge port Q2h of the second air discharge portion Q2 in the transport direction of the chips Ts in the recovery path 21. Furthermore, the first inclined portion P1 and the second inclined portion P2 are provided spaced apart from each other at the end of the recovery path 21 on the upstream side in the transport direction of the chips Ts (Y-axis direction). Hereinafter, when there is no need to distinguish between the first inclined portion P1 and the second inclined portion P2, they will simply be referred to as "inclined portion P."

[0036] 5(b) is a cross section BB perpendicular to the bottom side Pa where the first inclined portion P1 shown in FIG. 5(a) contacts the bottom surface 21d of the recovery path 21. The upward surface (inclined surface Ps) of the inclined portion P faces downstream (toward the conveying opening 22K) in the conveying direction (Y-axis direction) of the chips Ts in the recovery path 21. In this way, the inclined surface Ps is provided at a position where it comes into contact with the chips Ts that have passed through the chip receiving opening 21a (opening).

[0037] 5(a), the first inclined portion P1 and the second inclined portion P2 are respectively arranged in a direction in which the base sides Pa of the inclined surfaces Ps are inclined by angles θy1 and θy2 with respect to the chip transport direction (Y-axis direction) of the chips Ts in a plan view. The distance between the base sides Pa of the inclined surfaces Ps of the first inclined portion P1 and the second inclined portion P2 widens toward the downstream side in the chip transport direction of the chips Ts. In other words, in a plan view, the base sides Pa of the inclined surfaces Ps (the first inclined portion P1 and the second inclined portion P2) are inclined from the chip transport direction of the chips Ts and are arranged along the direction in which the distance between the first inclined portion P1 and the second inclined portion P2 widens toward the downstream side.

[0038] 5(b), the first inclined portion P1 and the second inclined portion P2 are installed at an angle θz from the bottom surface 21d of the recovery path 21. That is, the inclined surface Ps of the inclined portion P extends obliquely upward from the base side Pa of the inclined surface Ps and in a direction approaching the upstream side in the conveying direction (Y-axis direction) of the chips Ts. The angle θz formed between the bottom surface 21d of the recovery path 21 and the inclined surface Ps is set to be equal to or greater than 45 degrees and less than 90 degrees.

[0039] 4(b), chips Ts of the tape material T that are discharged from the chute 14 and fall into the recovery path 21 from the chip receiving opening 21a (discharge process) are changed in position as they fall along the inclined surface Ps of the inclined portion P (position changing process). As a result, even chips Ts that are warped or longer than a predetermined length are received in the recovery path 21 without getting caught in the chip receiving opening 21a. In this way, the inclined portion P (first inclined portion P1 and second inclined portion P2) having the inclined surface Ps constitutes a position changing portion U that changes the position of the chips Ts received in the recovery path 21.

[0040] Next, the transfer unit 25 will be described in detail with reference to FIG. 6. FIG. 6(b) is a cross section taken along the line CC of FIG. 6(a). In FIG. 6(a), the transfer unit 25 includes a first air discharge unit Q1, a second air discharge unit Q2, a first air valve S1, and a second air valve S2. Positive pressure (air) supplied from a positive pressure source 27 through a conduit 28 is supplied to the first air discharge unit Q1 and the second air discharge unit Q2 via the first air valve S1 and the second air valve S2. The first air valve S1 and the second air valve S2 are controlled by a mounting control device 8. The mounting control device 8 opens and closes the first air valve S1 and the second air valve S2 at predetermined timings, thereby discharging air from the first air discharge unit Q1 and the second air discharge unit Q2.

[0041] 6(a) and 6(b), the first air discharge unit Q1 is installed so that the first discharge direction of the first air F1 discharged from the first discharge port Q1h is inclined at an angle Θy1 with respect to the transport direction of the chips Ts (Y-axis direction) along the horizontal direction (XY plane). Also, the second air discharge unit Q2 is installed so that the second discharge direction of the second air F2 discharged from the second discharge port Q2h is inclined at an angle Θy2 with respect to the transport direction of the chips Ts along the horizontal direction.

[0042] As a result, in a plan view, the first discharge direction of the first air F1 and the second discharge direction of the second air F2 intersect with each other and are aligned horizontally. The intersecting first air F1 and second air F2 become air that flows along the transport direction (Y-axis direction) of the chips Ts. Furthermore, the angle Θy (Θy1 + Θy2) formed by the first discharge direction and the second discharge direction is greater than 0 degrees and less than or equal to 120 degrees. As a result, the chips Ts discharged from the chute 14 do not accumulate in the corners D of the recovery path 21, and the chips Ts can be efficiently transported toward the transport opening 22K.

[0043] 6(c), the first discharge port Q1h and the second discharge port Q2h are approximately the same size. Furthermore, the second discharge port Q2h is higher than the first discharge port Q1h, and they are arranged so that a portion of the region R overlaps. By making the heights of the first discharge port Q1h and the second discharge port Q2h different, it is possible to prevent the first air F1 and the second air F2 from completely canceling each other out in the direction perpendicular to the conveying direction of the chips Ts (X-axis direction) at the portion where the first air F1 and the second air F2 intersect in a plan view, and it is possible to efficiently convey the chips Ts accumulated in the corner D of the recovery path 21.

[0044] In this way, the height of the first outlet Q1h from which the first air F1 is discharged in the first air discharge part Q1 is different from the height of the second outlet Q2h from which the second air F2 is discharged in the second air discharge part Q2, and the first outlet Q1h and the second outlet Q2h are arranged so that partial areas R overlap in the height direction, so that part of the first air F1 intersects part of the second air F2 in the height direction.

[0045] Next, referring to FIG. 7, a method for transporting chips Ts in which the mounting control device 8 controls the first air valve S1 and the second air valve S2 to transport the chips Ts within the collection path 21 will be described. FIG. 7 is a timing diagram illustrating a method for transporting chips by a chip collection device according to an embodiment of the present disclosure. At time T0, the cutter 15 is stopped, and the first air valve S1 and the second air valve S2 are closed. That is, at time T0, air is not being discharged from either the first air discharge portion Q1 or the second air discharge portion Q2.

[0046] The mounting control device 8 monitors the length of the empty tape material T discharged from each of the multiple tape feeders 2 mounted on the feeder cart 3. When the length of the empty tape material T discharged from any of the multiple tape feeders 2 mounted on the feeder cart 3 reaches a predetermined length since the previous time it was cut by the cutter 15, the mounting control device 8 controls the cutter 15 to cut all of the empty tape materials T discharged from the multiple tape feeders 2 at once.

[0047] 7, in this example, the length of the empty tape material T discharged from one of the multiple tape feeders 2 attached to the feeder cart 3 at time T1 has reached a predetermined length. Therefore, the attachment control device 8 operates the cutter 15 between time T1 and time T2. As a result, the empty tape material T discharged from the multiple tape feeders 2 attached to the feeder cart 3 is cut, and chips Ts of the predetermined length or shorter than the predetermined length are discharged from the chute 14 through the chip receiving opening 21a (the opening of the recovery path 21) into the recovery path 21 (discharge process).

[0048] The placement control device 8 stops the operation of the cutter 15 at time T2 and waits for a predetermined waiting time Td. After the cut chips Ts fall into the collection path 21, the placement control device 8 opens the first air valve S1 to discharge first air F1 from the first air discharge unit Q1 between times T3 and T4. Next, the placement control device 8 opens the second air valve S2 to discharge second air F2 from the second air discharge unit Q2 between times T4 and T6. Furthermore, the placement control device 8 opens the first air valve S1 to discharge first air F1 from the first air discharge unit Q1 between times T5 and T6.

[0049] 7, as a result, from time T3 to time T4, only the first air F1 is discharged. Furthermore, from time T4 to time T5, only the second air F2 is discharged. In this way, from time T3 to time T5, the timing at which the first air discharge unit Q1 discharges the first air F1 differs from the timing at which the second air discharge unit Q2 discharges the second air F2. This allows the first air F1 and the second air F2 to reach the corner D of the recovery path 21 without canceling each other out, and chips Ts accumulated in the corner D can be efficiently transported.

[0050] Furthermore, between time T5 and time T6, both the first air F1 and the second air F2 are discharged, causing the intersecting first air F1 and second air F2 to flow in the transport direction (Y-axis direction) of the chips Ts, enabling the chips Ts remaining near the center of the recovery path 21 to be transported efficiently.

[0051] In this way, the first air discharge part Q1 discharges the first air F1 into the recovery path 21, and the second air discharge part Q2 discharges the second air F2 into the recovery path 21, thereby transporting the chips Ts in the recovery path 21 (transportation process). Note that if there is a bias in the amount of chips Ts discharged from the multiple tape feeders 2 attached to the feeder cart 3, causing a bias in the chips Ts discharged into the recovery path 21, the flow rate of the first air F1 and the flow rate of the second air F2 may be made different so that more air is sprayed at a position where more chips Ts accumulate.

[0052] As described above, the chip collection method for collecting chips Ts of tape material T discharged from the chute 14 of component mounting devices M1-M3 having tape feeders 2 that supply components 6 using tape material T includes the steps of: discharging the chips Ts from the chute 14 to the chip receiving opening 21a (opening) of the recovery path 21 (discharge step); changing the position of the chips Ts received in the recovery path 21 along the inclined surface Ps of the inclined portion P (position changing step); discharging first air F1 from the first air discharge portion Q1; and discharging second air F2 from the second air discharge portion Q2 to transport the chips Ts whose position has been changed within the recovery path 21 (transport step). Furthermore, the first discharge direction of the first air F1 and the second discharge direction of the second air F2 intersect with each other in a plan view. This allows chips Ts of the tape material T that are warped or the like to be properly collected.

[0053] As described above, the component mounting system 1 of this embodiment includes component mounting devices M1-M3 each having a tape feeder 2 that supplies components 6 using a tape member T, and a chip collection device 20 that collects chips Ts from the tape member T discharged from the chute 14 of the component mounting devices M1-M3. The chip collection device 20 includes a recovery path 21 that receives the chips Ts discharged from the chute 14 through an opening (chip receiving opening 21a), a first air discharge unit Q1 that discharges first air F1 into the recovery path 21 to transport the chips Ts, and a second air discharge unit Q2 that discharges second air F2 into the recovery path 21 to transport the chips Ts. In a plan view, the first discharge direction of the first air F1 and the second discharge direction of the second air F2 intersect with each other. This allows the chips Ts from the tape member T to be properly collected.

[0054] Although various embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that those skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components of the various embodiments described above may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0055] The chip collection device, component mounting system, and chip collection method disclosed herein have the effect of being able to properly transport chips received in a collection path by air, and are useful in the field of mounting components onto circuit boards. [Explanation of symbols]

[0056] 1. Component placement system 2 tape feeders 14 Shooter 20 Chip collection device 21 Recovery Route 21a Chip receiving opening (opening) F1 1st Air F2 2nd Air M1~M3 component placement device P slope part P1 1st slope P2 2nd slope Ps slope Pa bottom Q1 First air outlet Q1h 1st discharge port Q2 Second air outlet Q2h 2nd outlet T-tape material Ts chips

Claims

1. 1. A chip collection device for collecting chips of a tape member discharged from a chute of a component mounting device having a tape feeder that supplies components using the tape member, a recovery path that receives the chips discharged from the chute through an opening; a first air discharge unit that discharges first air into the recovery path to transport the chips; a second air discharge portion that discharges second air into the recovery path to transport the chips, a first discharge direction of the first air and a second discharge direction of the second air intersect with each other in a plan view;

2. 2. The chip collection device according to claim 1, wherein a height of a first outlet port from which the first air is discharged in the first air discharge section is different from a height of a second outlet port from which the second air is discharged in the second air discharge section.

3. The chip collection device according to claim 2 , wherein the first air discharge portion and the second air discharge portion are arranged such that a portion of the first discharge port and a portion of the second discharge port overlap each other in a height direction.

4. The chip collection device according to claim 1 , wherein a portion of the first air intersects a portion of the second air in a height direction.

5. The chip collection device according to claim 1 , wherein an angle formed between the first discharge direction and the second discharge direction is greater than 0 degrees and is equal to or smaller than 120 degrees.

6. The chip collection device according to claim 5 , wherein the first discharge direction and the second discharge direction are aligned along a horizontal direction.

7. The chip collection device according to claim 1 , wherein a flow rate of the first air is different from a flow rate of the second air.

8. The chip collection device according to claim 1 , wherein the timing at which the first air discharge portion discharges the first air is different from the timing at which the second air discharge portion discharges the second air.

9. The chip collection device according to claim 1 , wherein the first air discharge portion and the second air discharge portion are provided at an end of the collection path on an upstream side in a chip transport direction, the end being spaced apart from each other.

10. The chip collecting passage further includes an inclined portion having an inclined surface for changing the attitude of the chips received in the collection passage, the inclined surface is provided at a position where the chips that have passed through the opening come into contact with the inclined surface, In a plan view, a bottom side of the inclined surface is along a direction inclined from a chip transport direction, The chip collecting device according to claim 1 , wherein the inclined surface extends obliquely upward from the bottom side and in a direction approaching an upstream side in the chip transport direction.

11. The inclined portion includes a first inclined portion and a second inclined portion, The chip collection device according to claim 10 , wherein the first inclined portion and the second inclined portion are provided at an end of the collection path on an upstream side in a chip transport direction and spaced apart from each other.

12. A component mounting system comprising: a component mounting device having a tape feeder that supplies components using a tape member; and a chip collection device that collects chips of the tape member discharged from a chute of the component mounting device, The chip collection device is a recovery path that receives the chips discharged from the chute through an opening; a first air discharge unit that discharges first air into the recovery path to transport the chips; a second air discharge portion that discharges second air into the recovery path to transport the chips, a first discharge direction of the first air and a second discharge direction of the second air intersect with each other in a plan view.

13. 1. A scrap collection method for collecting scraps of a tape member discharged from a chute of a component mounting device having a tape feeder that supplies components using the tape member, comprising: a discharge step of discharging the chips from the chute to an opening of a recovery path; a conveying step of conveying the chips in the recovery path by a first air discharge unit discharging first air into the recovery path and a second air discharge unit discharging second air into the recovery path, a first discharge direction of the first air and a second discharge direction of the second air intersect with each other in a plan view;

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