Cleaning liquid supply system

Abstract

To provide a cleaning liquid supply system which can clean the interior of a processing chamber while inhibiting adhesion of a polishing liquid and a cleaning liquid to an operator.SOLUTION: A cleaning liquid supply system includes a processing device 10 and a processing supply unit. The processing device 10 includes at least: a chuck table 20 which rotatably holds a workpiece; a polishing unit 30 which processes the workpiece held by the chuck table 20; a processing chamber 90 which encloses at least the chuck table and a polishing wheel 32 of the polishing unit; and a jet nozzle 96 which jets a cleaning liquid 108 for cleaning the interior of the processing chamber 90 into the processing chamber 90. The processing liquid supply unit is disposed near the processing device 10 and supplies a processing liquid to the polishing unit 30. The processing liquid supply unit has a cleaning liquid supply part including a cleaning liquid storage tank for storing the cleaning liquid 108. The cleaning liquid supply system supplies the cleaning liquid 108 from the cleaning liquid storage tank to the jet nozzle 96 at predetermined timing.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a cleaning liquid supply system. [Background technology]

[0002] In recent years, power devices have attracted attention as semiconductor devices that can control higher voltages and currents than integrated circuits (ICs). They are used in power supplies and inverter control for electric vehicles, hybrid vehicles, air conditioners, and other applications.

[0003] Power devices are formed by epitaxially growing a SiC single crystal film (also called an epitaxial film) on the surface of a single crystal substrate (hereinafter simply referred to as a SiC substrate) made of SiC, which has better electrical properties than a silicon wafer.

[0004] A known technique is to grind the surface of a SiC substrate before forming a power device on it, and then polish it by chemical mechanical polishing (CMP) to flatten it (see, for example, Patent Document 1).An epitaxial layer is then formed on the surface of the SiC substrate.

[0005] Patent Document 1 discloses a series of polishing methods for improving polishing efficiency and performance, in which polishing is performed using a polishing pad with fixed abrasive grains and an oxidizing polishing liquid that does not contain abrasive grains, followed by cleaning.

[0006] It is disclosed that the oxidizing polishing solution is a polishing solution containing permanganate (for example, NaMnO4) as the main oxidizing agent in pure water. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-092246 Summary of the Invention [Problem to be solved by the invention]

[0008] However, the polishing liquid disclosed in Patent Document 1 and the like splashes during processing and adheres to the inner walls of the processing chamber, contaminating the inner walls. For this reason, conventionally, an operator manually sprays a reducing cleaning liquid from a container into the processing chamber at a predetermined timing to perform cleaning (reduction treatment). As a result, there is a risk that the polishing liquid and reducing cleaning liquid will adhere to the operator.

[0009] An object of the present invention is to provide a cleaning liquid supply system that can clean the inside of a processing chamber while preventing the polishing liquid and cleaning liquid from adhering to an operator. [Means for solving the problem]

[0010] In order to solve the above-mentioned problems and achieve the object, the cleaning liquid supply system of the present invention is a cleaning liquid supply system comprising a processing device having at least a chuck table that rotatably holds a workpiece, a processing unit that processes the workpiece held on the chuck table, a processing chamber that surrounds at least the chuck table and the processing unit, and a spray nozzle that sprays cleaning liquid into the processing chamber to clean the inside of the processing chamber, and a processing liquid supply unit that is arranged near the processing device and supplies processing liquid to the processing unit, wherein the processing liquid supply unit has a cleaning liquid supply section that has a storage tank that stores the cleaning liquid, and supplies the cleaning liquid from the storage tank to the spray nozzle at a predetermined timing.

[0011] The cleaning liquid supply system of the present invention is a cleaning liquid supply system comprising a processing device having at least a chuck table that rotatably holds a workpiece and a processing unit that processes the workpiece held on the chuck table, and a processing liquid supply unit that is arranged near the processing device and supplies processing liquid to the processing unit, wherein the processing liquid supply unit has a cleaning liquid supply section that has a storage tank for storing cleaning liquid, and supplies the cleaning liquid from the storage tank to the chuck table at a predetermined timing.

[0012] The cleaning liquid supply system of the present invention is a cleaning liquid supply system comprising a processing device having at least a chuck table that rotatably holds a workpiece, a processing unit that processes the workpiece held on the chuck table, and a cleaning mechanism having a cleaning nozzle that cleans the workpiece, and a processing liquid supply unit that is arranged near the processing device and supplies processing liquid to the processing unit, wherein the processing liquid supply unit has a cleaning liquid supply section that has a storage tank that stores cleaning liquid, and supplies the cleaning liquid from the storage tank to the cleaning nozzle of the cleaning mechanism at a predetermined timing.

[0013] The cleaning liquid supply system of the present invention is a cleaning liquid supply system comprising a processing device having at least a chuck table that rotatably holds a workpiece, a processing unit that processes the workpiece held on the chuck table, and a cleaning member that cleans the surface of the workpiece opposite to the surface to be polished, and a processing liquid supply unit that is arranged near the processing device and supplies processing liquid to the processing unit, wherein the processing liquid supply unit has a cleaning liquid supply section that has a storage tank for storing cleaning liquid, and supplies the cleaning liquid from the storage tank to the cleaning member at a predetermined timing.

[0014] The cleaning liquid supply system of the present invention is a cleaning liquid supply system comprising a processing device having at least a chuck table that rotatably holds a workpiece, a processing unit that is fixed to the tip of a spindle and has a processing tool that processes the workpiece held on the chuck table, and a correction member that corrects the state of the processing tool, and a processing liquid supply unit that is arranged near the processing device and supplies processing liquid to the processing unit, wherein the processing liquid supply unit has a cleaning liquid supply section that has a storage tank that stores cleaning liquid, and supplies the cleaning liquid from the storage tank to the correction member at a predetermined timing.

[0015] In the cleaning liquid supply system, the cleaning liquid supply unit may further include a dilution tank for diluting the cleaning liquid to a predetermined concentration.

[0016] In the cleaning liquid supply system, the cleaning liquid supply unit may further include a storage unit for storing a solid cleaning agent, and the solid cleaning agent may be supplied from the storage unit to the storage tank or dilution tank, and a fluid may be supplied to the storage tank or dilution tank to produce the cleaning liquid. [Effects of the Invention]

[0017] The present invention has an effect of being able to clean the inside of the processing chamber while preventing the polishing liquid and cleaning liquid from adhering to the operator. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a cleaning liquid supply system according to the first embodiment. [Figure 2] FIG. 2 is a diagram schematically illustrating the configuration of the cleaning liquid supply system shown in FIG. [Figure 3] FIG. 3 is a perspective view showing a state in which the spray nozzle of the cleaning liquid supply system shown in FIG. 1 sprays the cleaning liquid. [Figure 4] 4 is a side view, partly in section, showing a state in which the spray nozzle of the cleaning liquid supply system shown in FIG. 1 sprays the cleaning liquid. [Figure 5]FIG. 5 is a cross-sectional view showing the configuration of a main part of a processing device of a cleaning liquid supply system according to a second embodiment. [Figure 6] FIG. 6 is a perspective view showing the configuration of a cleaning mechanism of a processing device of a cleaning liquid supply system according to a third embodiment. [Figure 7] FIG. 7 is a perspective view showing an example of the configuration of a cleaning liquid supply system according to the fourth embodiment. [Figure 8] FIG. 8 is a side view, partly in section, schematically showing a state in which the cleaning liquid supply system shown in FIG. 7 supplies cleaning liquid to the cleaning roller of the processing device. [Figure 9] FIG. 9 is a side view, partly in section, schematically showing another example of the state in which the cleaning liquid supply system shown in FIG. 7 supplies cleaning liquid to the cleaning roller of the processing device. [Figure 10] FIG. 10 is a side view schematically showing a main part of a polishing unit according to the first, second, third and first modified examples of the fourth embodiments. [Figure 11] FIG. 11 is a side view schematically showing a state in which the lower surface of the polishing pad of the polishing unit shown in FIG. 10 is dressed with a dressing member. [Figure 12] FIG. 12 is a side view schematically showing a state in which a cleaning liquid is supplied to the dressing member shown in FIG. [Figure 13] FIG. 13 is a diagram schematically illustrating the configuration of a main part of a cleaning liquid supply system according to the first embodiment, the second embodiment, and the second modification of the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0020] [Embodiment 1] A cleaning liquid supply system according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of the configuration of the cleaning liquid supply system according to the first embodiment. Fig. 2 is a diagram schematically showing the configuration of the cleaning liquid supply system shown in Fig. 1. Fig. 3 is a perspective view showing a state in which a spray nozzle of the cleaning liquid supply system shown in Fig. 1 sprays cleaning liquid. Fig. 4 is a side view, partially in cross section, showing a state in which a spray nozzle of the cleaning liquid supply system shown in Fig. 1 sprays cleaning liquid.

[0021] (Cleaning liquid supply system) As shown in FIGS. 1 and 2, the cleaning liquid supply system 1 according to the first embodiment includes a processing device 10, a processing liquid supply unit 100, and a control unit. In the first embodiment, the processing device 10 is a polishing device that polishes a workpiece 200. The workpiece 200 to be processed by the processing device 10 of the cleaning liquid supply system 1 according to the first embodiment is a single-crystal substrate made of SiC (i.e., a SiC substrate). After polishing the back surface 201, a SiC single-crystal film (also called an epitaxial film) is deposited by epitaxial growth to form a power device. In the first embodiment, no device is formed on a front surface 202 behind (opposite) the back surface 201 (corresponding to the surface to be polished) of the workpiece 200, and the back surface 201 is polished without adhering a surface protective tape for protecting the device to the front surface 202.

[0022] (Processing equipment) 1 and 2 of the cleaning liquid supply system 1 according to the first embodiment is a polishing apparatus that polishes the back surface 201 of a workpiece 200. As shown in FIG. 1, the processing apparatus 10 includes an apparatus base 11, a chuck table 20, a polishing unit 30, a processing feed unit 40, a polishing feed unit 50, and a control unit (not shown).

[0023] The chuck table 20 holds the workpiece 200 by holding a front surface 202 side of the workpiece 200 with a holding surface 21, exposing a back surface 201 of the workpiece 200. The chuck table 20 is disk-shaped, and the holding surface 21 that holds the workpiece 200 is made of porous ceramic or the like.

[0024] The holding surface 21 of the chuck table 20 is connected to a suction source 24 and a fluid supply source 26 via a flow path 23 provided with on-off valves 22 and 25. The chuck table 20 suction-holds a surface 202 of a workpiece 200 placed on the holding surface 21 by the holding surface 21 being sucked by the suction source 24. The chuck table 20 is capable of spraying a fluid supplied from the fluid supply source 26 onto the holding surface 21.

[0025] The chuck table 20 is rotatable about an axis parallel to the Z-axis direction by a rotary drive source (not shown). The Z-axis direction is parallel to the vertical direction and perpendicular to the holding surface 21. The chuck table 20 suction-holds the workpiece 200 on the holding surface 21 and rotates about its axis by the rotary drive source, thereby supporting the workpiece 200 so that it can rotate about its axis.

[0026] The polishing unit 30 is a processing unit that polishes the back surface 201 of the workpiece 200 held on the chuck table 20 with a polishing wheel 32 including a polishing pad 35 attached to the lower end, which is the tip of a spindle 31. The polishing unit 30 is supported by an upright wall 12 that stands from one end of the device base 11 in the X-axis direction parallel to the horizontal direction, via a polishing feed unit 50. The polishing unit 30 includes the spindle 31, a motor 33 that rotates the spindle 31 around its axis, and a polishing wheel 32 (processing tool) fixed to the lower end of the spindle 31.

[0027] The axis of the spindle 31 is disposed along the Z-axis direction. The grinding wheel 32 grinds the back surface 201 of the workpiece 200 held on the chuck table 20. The grinding wheel 32 has a wheel base 34 formed in a disk shape and attached to the lower end of the spindle 31, and a grinding pad 35 attached to the lower surface of the wheel base 34 and having abrasive grains fixed thereto for grinding the back surface 201 of the workpiece 200.

[0028] The processing feed unit 40 is installed on the device base 11, and moves the chuck table 20 relative to the polishing unit 30 in the X-axis direction, which is the processing feed direction parallel to the holding surface 21. By moving the chuck table 20 in the X-axis direction, the processing feed unit 40 moves the chuck table 20 between a carry-in / out position where the workpiece 200 is carried in and out of the chuck table 20 and a processing position located below the polishing unit 30 where the workpiece 200 is polished by the polishing unit 30.

[0029] The polishing feed unit 50 is attached to an upright wall 12 that stands upright from the device base 11, and moves the polishing unit 30 in the Z-axis direction, which is the polishing feed direction perpendicular to the holding surface 21. The polishing feed unit 50 lowers the polishing unit 30 to bring the polishing pad 35 closer to the workpiece 200 held on the chuck table 20 at the processing position, and raises the polishing unit 30 to move the polishing pad 35 away from the workpiece 200 held on the chuck table 20 at the processing position.

[0030] The processing feed unit 40 and the polishing feed unit 50 are equipped with a well-known ball screw rotatable about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the chuck table 20 or the polishing unit 30 movably in the X-axis or Z-axis direction. In the present invention, the motor may be a servo motor or a pulse motor.

[0031] The processing apparatus 10 also includes a cassette elevator 14 on which a cassette 13 is placed on the apparatus base 11 and which raises and lowers the cassette 13 in the Z-axis direction. The cassette 13 is a container that stores a plurality of workpieces 200. The cassette 13 stores the workpieces 200 before and after polishing. In the first embodiment, the cassette 13 stores a plurality of workpieces 200 with the front surface 202 of the workpiece 200 positioned downward and the back surface 201 of the workpiece 200 positioned upward. The cassette elevator 14 is installed at the end of the apparatus base 11 on the carry-in / out position side in the X-axis direction, and the cassette 13 is placed on the cassette elevator 14.

[0032] The processing apparatus 10 also includes an alignment unit 15, a transport unit 60 that transports the workpiece 200, and a cleaning mechanism 70 that cleans the workpiece 200 after polishing.

[0033] The alignment unit 15 is a table on which the workpiece 200 before polishing, which has been taken out of the cassette 13, is temporarily placed and on which the center of the workpiece 200 is aligned.

[0034] The transport unit 60 includes a carry-in / out unit 61, a first transport unit 62, and a second transport unit 63. The carry-in / out unit 61 is, for example, a robot pick equipped with a U-shaped hand, and transports the workpiece 200 by suction and holding it with the U-shaped hand. Specifically, the carry-in / out unit 61 carries the workpiece 200 before polishing from the cassette 13 to the alignment unit 15, and carries the workpiece 200 after polishing from the cleaning mechanism 70 into the cassette 13.

[0035] The first transport unit 62 carries the workpiece 200 before polishing, which has been aligned by the alignment unit 15, out of the cassette 13 and onto the chuck table 20 positioned at the carry-in / out position. The second transport unit 63 carries the polished workpiece 200 held on the chuck table 20 positioned at the carry-in / out position out of the chuck table 20 and carries it into the cleaning mechanism 70.

[0036] The cleaning mechanism 70 includes a spinner table 71, a cleaning nozzle 72, a gas injection nozzle 73, an upper cover 74, and a lifting cover 75. The spinner table 71 holds the workpiece 200 by suction after polishing and supports the workpiece 200 so that it can rotate freely around an axis parallel to the Z-axis direction.

[0037] The cleaning nozzle 72 receives fluid from a fluid supply source 77 through a flow path 76 and sprays the fluid from the fluid supply source 77 onto the back surface 201 of the workpiece 200 held by suction on the spinner table 71, thereby cleaning the workpiece 200. The gas spray nozzle 73 receives gas from a gas supply source 79 through a flow path 78 and sprays the gas from the gas supply source 79 onto the back surface 201 of the workpiece 200 held by suction on the spinner table 71, thereby drying the workpiece 200.

[0038] Upper cover 74 stands upright from apparatus base 11 and covers the top of spinner table 71. Lift-up cover 75 is mounted on apparatus base 11 so as to be movable up and down in the Z-axis direction, and rises to cover workpiece 200 held by suction on spinner table 71 together with upper cover 74, and lowers to expose spinner table 71. Upper cover 74 and lift-up cover 75 form processing chamber 80 that surrounds spinner table 71 and workpiece 200 held by suction on spinner table 71.

[0039] 1, the processing apparatus 10 also includes a processing chamber 90. The processing chamber 90 surrounds and houses at least the chuck table 20 at the processing position and the polishing wheel 32 of the lowered polishing unit 30. In the first embodiment, the processing chamber 90 is configured with a plurality of partition walls 91 that surround the chuck table 20 at the processing position and the polishing pad 35 of the lowered polishing unit 30, and a flat ceiling wall 92 that is connected to the upper ends of the plurality of partition walls 91. The processing chamber 90 does not house the chuck table 20 at the load / unload position. In other words, the chuck table 20 at the load / unload position is located outside the processing chamber 90.

[0040] Furthermore, one of the partition walls 91 constituting the processing chamber 90 is formed with an entrance / exit 93 that allows the chuck table 20 to enter and exit the processing chamber 90. The chuck table 20 passes through the entrance / exit 93 and is moved by the processing feed unit 40 along the X-axis direction between a carry-in / out position and a processing position.

[0041] A wheel entrance / exit 94 is formed in a ceiling wall 92 constituting the processing chamber 90, allowing the grinding wheel 32 of the polishing unit 30 to enter and exit the processing chamber 90. The polishing pad 35 of the polishing unit 30 passes through the wheel entrance / exit 94 and is moved in and out of the processing chamber 90 along the Z-axis direction by the polishing feed unit 50. A hose 95 is connected to a suction source (not shown) that exhausts the atmosphere inside the processing chamber 90 to the outside, and is connected to one of the partition walls 91 constituting the processing apparatus 10.

[0042] 3 and 4, the processing apparatus 10 is also provided with a spray nozzle 96. The spray nozzle 96 sprays a cleaning liquid 108 into the processing chamber 90 to clean the interior of the processing chamber 90. In the first embodiment, the spray nozzle 96 is attached to the lower surface of the ceiling wall 92 that constitutes the processing chamber 90, and is disposed inside the processing chamber 90. In the first embodiment, the spray nozzle 96 sprays the cleaning liquid 108 toward the grinding wheel 32 of the polishing unit 30 in the processing chamber 90.

[0043] In the first embodiment, the cleaning liquid 108 sprayed by the spray nozzle 96 reduces the machining liquid 107 supplied to the workpiece 200 by the polishing unit 30 during polishing. In the first embodiment, the cleaning liquid 108 is hydroxylamine sulfate or vitamin C (ascorbic acid). When the cleaning liquid 108 is a mixture of citric acid and hydrogen peroxide, hydrogen peroxide (pH value of 5 to 6) can act as a reducing agent, an oxidizing agent, or an alkaline agent depending on the pH value. By adding citric acid to hydrogen peroxide, the pH value can be adjusted to 1 to 3, which is on the acid side, and the hydrogen peroxide acts as a reducing agent.

[0044] (Machining fluid supply unit) The machining liquid supply unit 100 is disposed near the processing apparatus 10 and supplies a machining liquid 107 to the polishing unit 30. As shown in Fig. 2, the machining liquid supply unit 100 includes a fluid supply source 101, a machining liquid supply section 110, and a cleaning liquid supply section 120. The fluid supply source 101 supplies pure water 106 to the machining liquid supply section 110 and the cleaning liquid supply section 120 through pipes 104 and 105, which are provided with on-off valves 102 and 103.

[0045] The machining fluid supply unit 110 has a machining fluid dilution tank 111 and a machining fluid storage tank 112. The machining fluid dilution tank 111 is supplied with an undiluted machining fluid that does not contain abrasive grains and pure water 106 from a fluid supply source 101, and mixes them to generate a machining fluid 107 (corresponding to a polishing fluid) of a predetermined concentration, and is a container for storing the generated machining fluid 107. In the first embodiment, the machining fluid 107 is an aqueous solution of sodium permanganate or potassium permanganate as an oxidizing agent. In this way, the machining fluid dilution tank 111 dilutes the machining fluid 107 to the predetermined concentration.

[0046] Machining liquid storage tank 112 is connected to machining liquid dilution tank 111 through piping 114 equipped with on-off valve 113, and machining liquid 107 is supplied from machining liquid dilution tank 111. Machining liquid storage tank 112 is a container that stores machining liquid 107 supplied from machining liquid dilution tank 111. Machining liquid storage tank 112 is also connected to polishing unit 30 of processing apparatus 10 through piping 116 equipped with on-off valve 115, and supplies machining liquid 107 to polishing unit 30.

[0047] The cleaning liquid supply unit 120 has a cleaning liquid dilution tank 121 (corresponding to a dilution tank) and a cleaning liquid storage tank 122 (corresponding to a storage tank). The cleaning liquid dilution tank 121 is a container that receives the undiluted cleaning liquid and the pure water 106 from the fluid supply source 101, mixes them, generates a cleaning liquid 108 of a predetermined concentration, and stores the generated cleaning liquid 108. In this way, the cleaning liquid dilution tank 121 dilutes the cleaning liquid 108 to the cleaning liquid 108 of the predetermined concentration.

[0048] The cleaning liquid storage tank 122 is connected to the cleaning liquid dilution tank 121 through a pipe 124 provided with an on-off valve 123, and the cleaning liquid 108 is supplied from the cleaning liquid dilution tank 121. The cleaning liquid storage tank 122 is a container for storing the cleaning liquid 108 supplied from the cleaning liquid dilution tank 121. The cleaning liquid storage tank 122 is also connected to the spray nozzle 96 of the processing device 10 through a pipe 126 provided with an on-off valve 125, and supplies the cleaning liquid 108 to the spray nozzle 96.

[0049] The control unit controls each of the above-mentioned components constituting the cleaning liquid supply system 1. That is, the control unit causes the processing device 10 to execute processing operations on the workpiece 200. The control unit is a computer that has an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device, and is capable of executing computer programs.

[0050] The arithmetic processing unit of the control unit executes a computer program stored in the ROM on the RAM to generate control signals for controlling the cleaning liquid supply system 1. The arithmetic processing unit of the control unit outputs the generated control signals to each component of the cleaning liquid supply system 1 via the input / output interface device. The control unit is also connected to a display means (not shown) configured by a liquid crystal display device or the like for displaying the status and images of the processing operation, and to an input means used by an operator to register processing conditions. The input means is configured by at least one of a touch panel provided on the display means and a keyboard or the like.

[0051] (Machining operation) Next, a description will be given of the processing operation of the cleaning liquid supply system 1 according to the embodiment 1. In the cleaning liquid supply system 1 having the above-described configuration, an operator or the like places a cassette 13 containing a workpiece 200 before polishing on the cassette elevator 14 of the processing device 10, and the control unit receives the processing conditions input by the operator or the like. The cleaning liquid supply system 1 starts the processing operation when the control unit receives a command to start the processing operation input by the operator.

[0052] When the machining operation is started, the control unit of the cleaning liquid supply system 1 drives the motor 84 to start rotating the spindle 83 and the grinding wheel 32 about their axes. Also, when the machining operation is started, the control unit of the cleaning liquid supply system 1 starts generating the machining liquid 107 in the machining liquid dilution tank 111 of the machining liquid supply unit 110, and starts generating the cleaning liquid 108 in the cleaning liquid dilution tank 121. In the cleaning liquid supply system 1, the control unit stores the machining liquid 107 in the machining liquid storage tank 112, and stores the cleaning liquid 108 in the cleaning liquid storage tank 122.

[0053] In the processing operation, the control unit of the cleaning liquid supply system 1 controls the carry-in / out unit 61 to take out one workpiece 200 from the cassette 13 and carry it out to the alignment unit 15. In the processing operation, the control unit of the processing apparatus 10 controls the alignment unit 15 to align the center of the workpiece 200, and controls the first transport unit 62 to carry the workpiece 200 aligned by the alignment unit 15 onto the chuck table 20 located at the carry-in / out position.

[0054] In the machining operation, the control unit of the machining device 10 opens the on-off valve 22 and operates the suction source 24 to suction-hold the front surface 202 of the workpiece 200 on the holding surface 21 of the chuck table 20, thereby exposing the back surface 201 of the workpiece 200 upward. In the machining operation, the control unit of the machining device 10 controls the machining feed unit 40 to move the chuck table 20, which suction-holds the workpiece 200, to the machining position.

[0055] In the processing operation, the control unit of the processing apparatus 10 rotates the chuck table 20 around its axis at the processing position. In the processing operation, the control unit opens the on-off valve 115 to supply the processing liquid 107 from the processing liquid reservoir 112 to the polishing wheel 32 of the polishing unit 30 through the piping 116, and controls the polishing feed unit 50 to lower the polishing wheel 32 rotating around its axis. In the processing operation, the processing apparatus 10 brings the polishing pad 35 of the polishing wheel 32 rotating around its axis into contact with the back surface 201 of the workpiece 200 held on the chuck table 20 rotating around its axis while supplying the processing liquid 107, thereby polishing the back surface 201 of the workpiece 200 with the polishing pad 35. In this way, in the first embodiment, the processing apparatus 10 of the cleaning liquid supply system 1 performs CMP (chemical mechanical polishing) on ​​the back surface 201 of the workpiece 200 to planarize it.

[0056] In the processing operation, when the processing device 10 has polished the rear surface 201 of the workpiece 200 with the polishing pad 35 for a predetermined time determined by the processing conditions, the control unit controls the polishing feed unit 50 to raise the polishing pad 35. In the processing operation, the control unit of the processing device 10 stops the rotation of the chuck table 20 about its axis.

[0057] In the processing operation, the control unit of the processing apparatus 10 controls the processing feed unit 40 to transport the chuck table 20, which holds by suction the polished workpiece 200, to the carry-in / out position, and stops the suction holding of the chuck table 20 at the carry-in / out position. In the processing operation, the control unit of the processing apparatus 10 controls the second transport unit 63 to transport the workpiece 200 to the cleaning mechanism 70, and after the cleaning mechanism 70 cleans the workpiece 200, controls the carry-in / out unit 61 to store the workpiece 200 in the cassette 13. Note that the processing apparatus 10 completes the processing operation after polishing the workpieces 200 in the cassette 13 in order.

[0058] In the first embodiment, the control unit of the cleaning liquid supply system 1 opens the on-off valve 125 for a predetermined time during a processing operation, thereby supplying the cleaning liquid 108 from the cleaning liquid reservoir tank 122 through the pipe 126 to the spray nozzle 96, and spraying the cleaning liquid 108 from the spray nozzle 96, as shown in FIGS. 3 and 4. The predetermined timing is, for example, a timing included in the processing conditions, and is a timing at predetermined intervals. The predetermined timing is a timing at which the processing liquid 107 can be removed from the inner surface of the processing chamber 90 by spraying the cleaning liquid 108 from the spray nozzle 96.

[0059] As described above, the cleaning liquid supply system 1 according to the first embodiment sprays the cleaning liquid 108 from the spray nozzle 96 into the processing chamber 90 at a predetermined timing, thereby achieving the effect of cleaning the inside of the processing chamber 90 while preventing the polishing liquid 107 and the cleaning liquid 108 from adhering to the operator.

[0060] [Embodiment 2] A cleaning liquid supply system according to embodiment 2 will be described with reference to the drawings. Fig. 5 is a cross-sectional view showing the configuration of the main parts of a processing device of the cleaning liquid supply system according to embodiment 2. In Fig. 5, the same parts as those in embodiment 1 are assigned the same reference numerals and will be described in detail.

[0061] 5 , the cleaning liquid supply system 1 has the same configuration as that of the first embodiment, except that a pipe 126 of the machining liquid supply unit 100 is connected between the on-off valves 22, 25 of the flow path 23 and the holding surface 21, and the cleaning liquid 108 is supplied to the holding surface 21 through the pipe 126. In the second embodiment, the cleaning liquid supply system 1 positions the chuck table 20 in the processing chamber 90 at a predetermined timing when the chuck table 20 is not holding the workpiece 200 on the holding surface 21, and the control unit opens the on-off valve 125 for a predetermined time to supply the cleaning liquid 108 from the cleaning liquid reservoir tank 122 through the pipe 126 to the flow path 23, and sprays the cleaning liquid 108 from the holding surface 21 of the chuck table 20 into the processing chamber 90.

[0062] The time when the chuck table 20 is not holding the workpiece 200 on the holding surface 21 is, for example, the time between when the workpiece 200 after polishing is transported to the cleaning mechanism 70 and when the workpiece 200 before polishing is transported in.

[0063] The cleaning liquid supply system 1 according to the second embodiment sprays the cleaning liquid 108 from the holding surface 21 into the processing chamber 90 at a predetermined timing, thereby achieving the effect of cleaning the inside of the processing chamber 90 while preventing the processing liquid 107, which is an abrasive liquid, and the cleaning liquid 108 from adhering to the operator.

[0064] Furthermore, the cleaning liquid supply system 1 according to the second embodiment can also remove the processing liquid, which is the polishing liquid, remaining on the chuck table 20.

[0065] [Embodiment 3] A cleaning liquid supply system according to embodiment 3 will be described with reference to the drawings. Fig. 6 is a perspective view showing the configuration of a cleaning mechanism of a processing device of the cleaning liquid supply system according to embodiment 3. In Fig. 6, the same parts as those in embodiment 1 are assigned the same reference numerals and will be described in detail.

[0066] 6 , cleaning liquid supply system 1 has the same configuration as that of embodiment 1, except that piping 126 of machining liquid supply unit 100 is connected to flow path 76 and cleaning liquid 108 is supplied to cleaning nozzle 72 through piping 126. In embodiment 3, cleaning liquid supply system 1 has a control unit that lifts lift cover 75 at a predetermined timing when spinner table 71 is not holding workpiece 200, opens on-off valve 125 for a predetermined time, and supplies cleaning liquid 108 from cleaning liquid reservoir tank 122 through piping 126 to flow path 76 of cleaning mechanism 70, i.e., cleaning nozzle 72, and sprays cleaning liquid 108 from cleaning nozzle 72 toward spinner table 71.

[0067] The cleaning liquid supply system 1 according to the third embodiment sprays the cleaning liquid 108 from the cleaning nozzle 72 at a predetermined timing, thereby achieving the effect of cleaning the inside of the processing chamber 80 of the cleaning mechanism 70 while preventing the polishing liquid 107 and the cleaning liquid 108 from adhering to the operator.

[0068] In addition to the above, when the workpiece 200 is held on the spinner table 71, cleaning liquid 108 can be sprayed onto the workpiece 200 to remove the polishing liquid 107 remaining on the back surface 201 of the workpiece 200.

[0069] In the present invention, the cleaning liquid supply system 1 according to the third embodiment may spray the cleaning liquid 108 from the spray nozzle 96 at a predetermined timing, similar to the first embodiment. In the present invention, the cleaning liquid 108 may be sprayed from the holding surface 21 of the chuck table 20 in the processing chamber 90 at a predetermined timing when the chuck table 20 is not holding the workpiece 200 on the holding surface 21, similar to the second embodiment.

[0070] [Embodiment 4] A cleaning liquid supply system according to a fourth embodiment will be described with reference to the drawings. Fig. 7 is a perspective view showing an example of the configuration of a cleaning liquid supply system according to the fourth embodiment. Fig. 8 is a side view, partially in cross section, showing a state in which cleaning liquid is supplied to a cleaning roller of a processing device in the cleaning liquid supply system shown in Fig. 7. Fig. 9 is a side view, partially in cross section, showing another example of a state in which cleaning liquid is supplied to a cleaning roller of a processing device in the cleaning liquid supply system shown in Fig. 7. In Figs. 7, 8, and 9, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted.

[0071] 7, the cleaning liquid supply system 1 according to the fourth embodiment is the same as that of the first embodiment, except that the processing device 10 does not include a processing feed unit 40 but includes a plurality of chuck tables 20 (four in FIG. 7), the plurality of chuck tables 20 are installed on a turntable 16, and includes a rough grinding unit 140, a finish grinding unit 150, a grinding feed unit 160, and a second cleaning mechanism 170. In the fourth embodiment, the processing device 10 is a device that performs rough grinding, finish grinding, and polishing on the back surface 201 of the workpiece 200 in that order, thereby thinning the workpiece 200 to a predetermined thickness.

[0072] The chuck table 20 of the processing apparatus 10 according to the fourth embodiment is disposed on the turntable 16. In the first embodiment, for example, four chuck tables 20 are disposed on the turntable 16 at equal intervals at a phase angle of 90 degrees. That is, the turntable 16 has a plurality of chuck tables 20 disposed at equal angles (90 degrees in the first embodiment) in the circumferential direction. The turntable 16 is a disk-shaped table disposed on the upper surface of the apparatus base 11, and is rotatable about an axis parallel to the Z-axis direction in a horizontal plane, and is rotationally driven at a predetermined timing.

[0073] In the fourth embodiment, the chuck table 20 is moved sequentially by the rotation of the turntable 16 to a carry-in / out position 301, a rough grinding position 302, a finish grinding position 303, a polishing position 304, and the carry-in / out position 301. That is, the turntable 16 rotates around its axis to position each chuck table 20 at the predetermined grinding positions 302, 303 and polishing position 304.

[0074] The loading / unloading position 301 is an area where the workpiece 200 is loaded onto or unloaded from the chuck table 20. The rough grinding position 302 is an area where the rough grinding unit 140 rough-grinds the workpiece 200 held on the chuck table 20. The finish grinding position 303 is an area where the finish grinding unit 150 finish-grinds the workpiece 200 held on the chuck table 20. The polishing position 304 is an area where the polishing unit 30 polishes the workpiece 200 held on the chuck table 20.

[0075] The rough grinding unit 140 is disposed above the chuck table 20 positioned at the rough grinding position 302, and is a processing unit equipped with a rough grinding wheel 141 having a ring-shaped arrangement of rough grinding grinding stones for rough grinding the exposed back surface 201 of the workpiece 200 held on the holding surface 21 of the chuck table 20 at the rough grinding position 302. The finish grinding unit 150 is disposed above the chuck table 20 positioned at the finish grinding position 303, and is a processing unit equipped with a finish grinding wheel 151 having a ring-shaped arrangement of grinding stones for finish grinding the back surface 201 of the workpiece 200 held on the holding surface 21 of the chuck table 20 at the finish grinding position 303.

[0076] The grinding units 140, 150 are supported by an upright wall 12 erected from one end of the device base 11 in the X-axis direction parallel to the horizontal direction via a grinding feed unit 160. The grinding units 140, 150 include spindles 142, 152 arranged to extend along the Z-axis direction, spindle motors 143, 153 that rotate the spindles 142, 152 about their axes, spindle housings 144, 154 that support the spindles 142, 152 rotatably about their axes, and grinding wheels 141, 151.

[0077] The spindles 142, 152 are formed in a cylindrical shape with their axes aligned along the Z-axis direction, which is the vertical direction. The spindles 142, 152 have grinding wheels 141, 151 attached to their lower ends.

[0078] The spindle motors 143 and 153 are attached to the upper ends (corresponding to the other ends) of the spindles 142 and 152.

[0079] The spindle housings 144, 154 are cylindrical and house the spindles 142, 152 therein so as to be rotatable about their axes, with the upper and lower ends of the spindles 142, 152 exposed.

[0080] The grinding wheels 141, 151 are fixed to the lower ends of the spindles 142, 152. The grinding wheels 141, 151 are provided with a wheel base formed in an annular shape and fixed to the lower ends of the spindles 142, 152, and a plurality of grinding stones arranged in an annular shape on the underside of the wheel base. The grinding stones are arranged at equal intervals in the circumferential direction of the wheel base, and a plurality of grinding stones are fixed to the underside of the wheel base.

[0081] The grinding wheel is configured as a so-called segment grinding wheel, which is formed into a single mass by mixing abrasive grains such as diamond or CBN (Cubic Boron Nitride) with a bonding material (also called a bond material) made of metal, ceramic, resin, etc. The grinding wheel grinds the back surface 201 of the workpiece 200.

[0082] The grinding units 140, 150 perform rough grinding or finish grinding of the back surface 201 of the workpiece 200 by rotating the spindles 142, 152 and grinding wheels 141, 151 around their axes using the spindle motors 143, 153 and supplying grinding water to the back surface 201 of the workpiece 200 held on the chuck table 20 at the grinding positions 302, 303 while the grinding feed unit 160 moves the grinding wheel closer to the chuck table 20 at a predetermined feed speed.

[0083] The grinding feed unit 160 moves the grinding units 140, 150 in the Z-axis direction, thereby moving the grinding units 140, 150 relatively closer to and farther away from the chuck table 20. In the first embodiment, the grinding feed unit 160 is provided on an upright wall 12 that stands from one end of the apparatus base 11 in the X-axis direction, which is parallel to the horizontal direction. The grinding feed unit 160 includes a well-known ball screw that is rotatable about its axis, a well-known motor that rotates the ball screw about its axis, and well-known guide rails that support the spindle housings 144, 154 of the grinding units 140, 150 movably in the Z-axis direction.

[0084] In embodiment 1, the rough grinding unit 140 and the finish grinding unit 150 are arranged such that the axes which are the centers of rotation of the grinding wheels 141, 151 and the axis which is the center of rotation of the chuck table 20 are parallel and spaced apart horizontally, and the grinding wheel passes over the center of the back surface 201 of the workpiece 200 held on the chuck table 20.

[0085] In addition, in embodiment 4, the ceiling wall 92 constituting the processing chamber 90 of the processing device 10 has a wheel entrance / exit 94 that allows the grinding wheel 32 of the polishing unit 30 to enter and exit the processing chamber 90, as well as wheel entrance / exit 94-1, 94-2 that allow the grinding wheels 141, 151 of the grinding units 140, 150 to enter and exit the processing chamber 90.

[0086] In the fourth embodiment, the processing apparatus 10 is installed via a polishing feed unit 50 on an upright wall erected from the center of the apparatus base 11 in the X-axis direction. In the fourth embodiment, the processing apparatus 10 has a first transport unit 62 that transports the unpolished workpiece 200, which has been unloaded from the cassette 13 and aligned by the alignment unit 15, onto the chuck table 20 positioned at the load / unload position, and also transports the polished workpiece 200 held on the chuck table 20 positioned at the load / unload position from the chuck table 20 and transports it into the second cleaning mechanism 170. The second transport unit 63 transports the polished workpiece 200 from the second cleaning mechanism 170 and transports it into the cleaning mechanism 70.

[0087] The second cleaning mechanism 170 cleans a surface 202 behind the back surface 201 of the workpiece 200 (hereinafter referred to as the surface 202 of the workpiece 200). The surface 202 corresponds to the first surface, and the back surface 201 corresponds to the second surface. In the present invention, the back surface 201 may be the first surface, or the surface 202 may be the second surface. As shown in FIGS. 8 and 9, the second cleaning mechanism 170 includes a processing chamber 171 (shown in FIG. 7) installed on the apparatus base 11, a plurality of support rollers 172 installed in the processing chamber 171 and supporting the outer edge of the workpiece 200, a cleaning roller 173 (corresponding to a cleaning member) installed in the processing chamber 171 and cleaning the surface 202 of the workpiece 200 whose outer edge is supported by the support rollers 172, and a cleaning nozzle 174 that supplies cleaning liquid 108 to the cleaning roller 173.

[0088] The cleaning roller 173 is made of sponge and is cylindrical with its axis parallel to the horizontal direction, and is rotated about its axis by a driving source such as a motor (not shown). The cleaning nozzle 174 supplies the cleaning liquid 108 supplied from the cleaning liquid supply section 120 of the machining liquid supply unit 100 to the outer circumferential surface of the cleaning roller 173.

[0089] The second cleaning mechanism 170 supports the outer edge of the workpiece 200 with a plurality of support rollers 172 and rotates the support rollers 172 to rotate the workpiece 200 about its axis. As shown in Fig. 8 , while rotating the workpiece 200 about its axis, the second cleaning mechanism 170 supplies cleaning liquid 108 from a cleaning nozzle 174 to a cleaning roller 173 rotating about its axis while bringing the outer circumferential surface of the cleaning roller 173 into contact with a surface 202 of the workpiece 200, thereby cleaning the surface 202 of the workpiece 200.

[0090] In the cleaning liquid supply system 1 according to the fourth embodiment, when a machining operation is started, the control unit starts the rotation of the spindles 142, 152 of the grinding units 140, 150 and the spindle 31 of the polishing unit 30, and similarly to the first embodiment, causes the machining liquid 107 to be stored in the machining liquid storage tank 112 and the cleaning liquid 108 to be stored in the cleaning liquid storage tank 122. In the machining operation, in the cleaning liquid supply system 1 according to the fourth embodiment, the control unit controls the transport unit 60 to remove the unprocessed workpiece 200 from the cassette 13, align it with the alignment unit 15, and then transport it onto the holding surface 21 of the chuck table 20 located at the carry-in / out position 301, where the workpiece 200 is suction-held by the chuck table 20.

[0091] In the processing operation, the cleaning liquid supply system 1 according to the fourth embodiment causes the control unit to rotate the turntable 16, and moves the chuck table 20, which holds the workpiece 200 at the carry-in / out position 301, to the rough grinding position 302, the finish grinding position 303, the polishing position 304, and the carry-in / out position 301 in that order, thereby sequentially performing rough grinding, finish grinding, and polishing on the workpiece 200. Note that when polishing the workpiece 200, the cleaning liquid supply system 1 according to the fourth embodiment supplies the processing liquid 107 from the processing liquid reservoir tank 112 to the polishing wheel 32 of the polishing unit 30.

[0092] In the processing operation, in the cleaning liquid supply system 1 according to the fourth embodiment, the control unit controls the transport unit 60 to transport the polished workpiece 200 from the chuck table 20 at the carry-in / out position 301 to the second cleaning mechanism 170, and then causes the second cleaning mechanism 170 to clean the front surface 202 of the workpiece 200 while supplying the cleaning liquid 108 from the cleaning nozzle 174. In the processing operation, in the cleaning liquid supply system 1 according to the fourth embodiment, the control unit controls the transport unit 60 to transport the workpiece 200 whose front surface 202 has been cleaned to the cleaning mechanism 70, and then causes the cleaning mechanism 70 to clean the back surface 201 of the workpiece 200 and transport it into the cassette 13.

[0093] Furthermore, in the cleaning liquid supply system 1 according to the fourth embodiment, each time the control unit rotates the turntable 16 by 90 degrees, the cleaning liquid supply system 1 transports the workpiece 200 from the chuck table 20 at the loading / unloading position 301, which holds the workpiece 200 after polishing, to the second cleaning mechanism 170, loads the workpiece 200 before processing onto the chuck table 20 positioned at the loading / unloading position 301, roughly grinds the workpiece 200 before grinding held on the chuck table 20 at the rough grinding position 302, finish grinds the workpiece 200 after rough grinding held on the chuck table 20 at the finish grinding position 303, and polishes the workpiece 200 after finish grinding held on the chuck table 20 at the polishing position 304.

[0094] In this way, in the cleaning liquid supply system 1 according to the fourth embodiment, the control unit removes the workpiece 200 from the chuck table 20 at the carry-in / out position 301 and cleans it every time the control unit rotates the turntable 16 by 90 degrees, and also loads the workpiece 200 onto the chuck table 20 at the carry-in / out position 301, positions the workpiece 200 held on the holding surface 21 of the chuck table 20 at the rough grinding position 302, the finish grinding position 303, and the polishing position 304, in that order, and performs rough grinding, finish grinding, and polishing on the workpiece 200. When the control unit has performed rough grinding, finish grinding, and polishing on all of the workpieces 200 in the cassette 13, the processing operation of the processing apparatus 10 ends.

[0095] In addition, in embodiment 4, as shown in Figure 9, the cleaning liquid supply system 1 opens the on-off valve 125 for a predetermined time at a predetermined timing when the support roller 172 is not supporting the workpiece 200, and supplies the cleaning liquid 108 from the cleaning liquid storage tank 122 through the piping 126 to the cleaning nozzle 174 of the second cleaning mechanism 170, and sprays the cleaning liquid 108 from the cleaning nozzle 174 toward the outer surface of the cleaning roller 173 rotating around its axis.

[0096] The cleaning liquid supply system 1 according to the fourth embodiment sprays the cleaning liquid 108 from the cleaning nozzle 72 at a predetermined timing, thereby achieving the effect of cleaning the inside of the processing chamber 171 of the second cleaning mechanism 170 while preventing the polishing liquid 107 and the cleaning liquid 108 from adhering to the operator.

[0097] Furthermore, the cleaning liquid supply system 1 according to the fourth embodiment can also remove the processing liquid, which is the polishing liquid, remaining on the cleaning roller 173.

[0098] [Variation 1] A cleaning liquid supply system according to the first embodiment, the second embodiment, the third embodiment, and the first modification of the fourth embodiment will be described with reference to the drawings. FIG. 10 is a side view schematically showing the main components of a polishing unit according to the first embodiment, the second embodiment, the third embodiment, and the first modification of the fourth embodiment. FIG. 11 is a side view schematically showing the state in which the underside of the polishing pad of the polishing unit shown in FIG. 10 is dressed with a dressing member. FIG. 12 is a side view schematically showing the state in which a cleaning liquid is supplied to the dressing member shown in FIG. 11. In FIGS. 10, 11, and 12, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted.

[0099] In the cleaning liquid supply system 1 according to the first modification, as shown in Fig. 10, the polishing unit 30 includes a dressing member 36 and a cleaning nozzle 37 shown in Fig. 12 in addition to the configuration of the first embodiment. The dressing member 36 is a correcting member that corrects the condition of the polishing pad 35 of the polishing wheel 32, which is a processing tool, and in the first modification, it comes into contact with the underside of the polishing pad 35 to correct the underside of the polishing pad 35 to make it flat. The cleaning nozzle 37 supplies the cleaning liquid 108 supplied from the cleaning liquid storage tank 122 to the dressing member 36.

[0100] 10, the polishing unit 30 of the cleaning liquid supply system 1 according to the first modification polishes the back surface 201 of the workpiece 200 with the polishing pad 35 while supplying the processing liquid 107 to the polishing wheel 32, as in the first embodiment etc. In addition, as shown in FIG. 11, the cleaning liquid supply system 1 according to the first modification rotates the polishing wheel 32 about its axis and moves the polishing wheel 32 and the dressing member 36 relative to each other in the horizontal direction, bringing the dressing member 36 into contact with the underside of the polishing pad 35, thereby flattening the underside of the polishing pad 35.

[0101] In addition, in variant example 1, as shown in Figure 12, at a predetermined timing when the polishing unit 30 is not performing polishing processing or dressing the polishing pad 35, the cleaning liquid supply system 1 opens the on-off valve 125 for a predetermined period of time to supply the cleaning liquid 108 from the cleaning liquid storage tank 122 through the piping 126 to the cleaning nozzle 37, and sprays the cleaning liquid 108 from the cleaning nozzle 37 toward the dressing member 36.

[0102] The cleaning liquid supply system 1 according to the first modification sprays the cleaning liquid 108 from the cleaning nozzle 37 at a predetermined timing, thereby achieving the effect of cleaning the inside of the processing chamber 90 while preventing the polishing liquid 107 and the cleaning liquid 108 from adhering to the operator.

[0103] Furthermore, the cleaning liquid supply system 1 according to the first modification can also remove the processing liquid, which is the polishing liquid, remaining on the dressing member .

[0104] [Variation 2] A cleaning liquid supply system according to the first embodiment, the second embodiment, and the second modification of the third embodiment will be described with reference to the drawings. Fig. 13 is a diagram schematically illustrating the configuration of the main parts of the cleaning liquid supply system according to the first embodiment, the second embodiment, and the second modification of the third embodiment. In Fig. 13, the same parts as those in the first embodiment are denoted by the same reference numerals and will be described in detail.

[0105] 13, the cleaning liquid supply system 1 according to the second modification is the same as that of the first embodiment except that the cleaning liquid supply unit 120 further includes a storage unit 130 that stores a solid (powdered) cleaning agent that constitutes the cleaning liquid 108, the solid cleaning agent is supplied from the storage unit 130 to a cleaning liquid dilution tank 121, and pure water 106, which is a fluid, is supplied from a fluid supply source 101 to the cleaning liquid dilution tank 121 to produce the cleaning liquid 108 of a predetermined concentration. Note that in the second modification of the present invention, the cleaning agent may be supplied from the storage unit 130 to a cleaning liquid storage tank 122, and pure water may be supplied to the cleaning liquid storage tank 122 to produce the cleaning liquid 108 of a predetermined concentration.

[0106] The cleaning liquid supply system 1 according to the second modification sprays the cleaning liquid 108 at a predetermined timing, thereby achieving the effect of cleaning the inside of the processing chambers 80, 90 while preventing the polishing liquid 107 and the cleaning liquid 108 from adhering to the operator.

[0107] [Variation 3] A cleaning liquid supply system according to Modification 3 of Embodiments 1, 2, 3, and 4 will be described. The cleaning liquid supply system 1 according to Modification 3 supplies, for example, a cleaning liquid 108 of a predetermined concentration, which is adjusted at a location other than the cleaning liquid supply system 1, to a cleaning liquid storage tank 122 of the cleaning liquid supply system 1 through a pipe (not shown). In this case, for example, a liquid level sensor that detects the liquid level of the cleaning liquid 108 is provided in the cleaning liquid storage tank 122, and when the liquid level falls below a predetermined value (lower limit), the cleaning liquid 108 is replenished until the liquid level reaches the predetermined value (upper limit). The upper limit and lower limit are set as appropriate.

[0108] [Variation 4] Furthermore, the undiluted cleaning liquid 108 is once fed to a cleaning liquid dilution tank 121 of the cleaning liquid supply system 1. Thereafter, the cleaning liquid 108 is adjusted to a predetermined concentration by supplying pure water, and then fed to a cleaning liquid storage tank 122.

[0109] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the present invention, the processing apparatus 10 is not limited to a polishing apparatus, but may be any processing apparatus that performs various processes on the workpiece 200. Furthermore, the present invention may be implemented in a state where a surface protection tape is attached to the surface 202 of the workpiece 200. [Explanation of symbols]

[0110] 1. Cleaning liquid supply system 10 Processing equipment 20 Chuck table 30 Polishing unit (processing unit) 31 Spindle 32 Grinding wheels (machining tools) 36 Dressing member (correction member) 70 Cleaning mechanism 72 Cleaning nozzle 90 Processing room 96 Injection Nozzle 100 Machining fluid supply unit 108 Cleaning Solution 120 Cleaning liquid supply unit 121 Cleaning solution dilution tank (dilution tank) 122 Cleaning liquid storage tank (storage tank) 130 Storage unit 173 Cleaning roller (cleaning material) 200 Workpiece 201 Back side (surface to be polished) 202 Surface (opposite side)

Claims

1. a chuck table that rotatably holds the workpiece; a processing unit that processes the workpiece held on the chuck table; a processing chamber surrounding at least the chuck table and the processing unit; a spray nozzle for spraying a cleaning liquid into the inside of the processing chamber to clean the inside of the processing chamber; A processing device comprising at least a processing liquid supply unit disposed near the processing device and supplying a processing liquid to the processing unit; A cleaning liquid supply system comprising: The processing liquid supply unit has a cleaning liquid supply section provided with a storage tank for storing the cleaning liquid, supplying the cleaning liquid from the storage tank to the spray nozzle at a predetermined timing; Cleaning fluid supply system.

2. a chuck table that rotatably holds the workpiece; a processing unit that processes the workpiece held on the chuck table; A processing device comprising at least a processing liquid supply unit disposed near the processing device and supplying a processing liquid to the processing unit; A cleaning liquid supply system comprising: The machining liquid supply unit has a cleaning liquid supply section provided with a storage tank for storing a cleaning liquid, supplying the cleaning liquid from the storage tank to the chuck table at a predetermined timing; Cleaning fluid supply system.

3. a chuck table that rotatably holds the workpiece; a processing unit that processes the workpiece held on the chuck table; a cleaning mechanism having a cleaning nozzle for cleaning the workpiece; A processing device comprising at least a processing liquid supply unit disposed near the processing device and supplying a processing liquid to the processing unit; A cleaning liquid supply system comprising: The machining liquid supply unit has a cleaning liquid supply section provided with a storage tank for storing a cleaning liquid, supplying the cleaning liquid from the storage tank to the cleaning nozzle of the cleaning mechanism at a predetermined timing; Cleaning fluid supply system.

4. a chuck table that rotatably holds the workpiece; a processing unit that processes the workpiece held on the chuck table; a cleaning member for cleaning the surface of the workpiece opposite to the surface to be polished; A processing device comprising at least a processing liquid supply unit disposed near the processing device and supplying a processing liquid to the processing unit; A cleaning liquid supply system comprising: The machining liquid supply unit has a cleaning liquid supply section provided with a storage tank for storing a cleaning liquid, supplying the cleaning liquid from the storage tank to the cleaning member at a predetermined timing; Cleaning fluid supply system.

5. a chuck table that rotatably holds the workpiece; a machining unit including a machining tool fixed to the tip of a spindle and adapted to machine the workpiece held on the chuck table; A correcting member for correcting the state of the processing tool; A processing device comprising at least a processing liquid supply unit disposed near the processing device and supplying a processing liquid to the processing unit; A cleaning liquid supply system comprising: The machining liquid supply unit has a cleaning liquid supply section provided with a storage tank for storing a cleaning liquid, supplying the cleaning liquid from the reservoir to the correction member at a predetermined timing; Cleaning fluid supply system.

6. The cleaning liquid supply unit further includes a dilution tank for diluting the cleaning liquid to a predetermined concentration. The cleaning liquid supply system according to any one of claims 1 to 5.

7. The cleaning liquid supply unit further includes a storage unit for storing a solid cleaning agent, supplying the solid cleaning agent from the storage unit to the storage tank or dilution tank, and supplying a fluid to the storage tank or dilution tank to produce a cleaning liquid; The cleaning liquid supply system according to any one of claims 1 to 5.

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