Packaging system, electronic component packaging method, controller, control method, and program

Abstract

To provide a packaging system, an electronic component packaging method, a controller, a control method, and a program, capable of simplifying a control content.SOLUTION: A packaging system comprises: a pressure block for grasping and heating an electronic element; a mounting head for supporting the pressure block liftably with respect to a substrate stage; a mounting head movement mechanism for lifting / lowering the mounting head; a mechanical stopper provided at the mounting head to stop lowering of the pressure block; a mechanical stopper movement mechanism capable of adjusting a height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; and control means for making the mechanical stopper movement mechanism adjust the height position of the mechanical stopper under a condition that the measured height distance is larger than a previously set reference value.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a mounting system, an electronic component mounting method, a control device, a control method, and a program. [Background technology]

[0002] Patent Document 1 discloses technology relating to a bonding device that has a bonding head that adsorbs and holds electronic components and a lifting means that raises and lowers the bonding head, and that heats and presses the electronic components onto a substrate via conductive bumps.

[0003] This bonding device also has a stopper provided on the bonding head, a stopper receiving portion that engages with the stopper to regulate the lowering height of the bonding head, and a stopper receiving portion lifting means that lifts and lowers the stopper receiving portion independently of the bonding head. In this bonding device, the height position of the stopper receiving portion is adjusted based on a detection signal from a distance detection means that detects the distance between the stopper and the stopper receiving portion so as to maintain a constant distance between the stopper and the stopper receiving portion. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-151179 Summary of the Invention [Problem to be solved by the invention]

[0005] The bonding apparatus described in Patent Document 1 constantly performs complex control to keep the distance between the stopper and the stopper receiver constant. For this reason, it is difficult to simplify the control content of the bonding device described in Patent Document 1.

[0006] An object of the present disclosure is to provide a mounting system, an electronic component mounting method, a control device, a control method, and a program that solve the above-mentioned problems. [Means for solving the problem]

[0007] A mounting system according to one aspect of the present disclosure includes a substrate stage on which a mounting substrate is placed, a pressure block that holds and heats an electronic element with bumps formed on a circuit surface facing the mounting substrate, and a loading head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage. The system includes a mounting head moving mechanism that raises and lowers the mounting head, a mechanical stopper that is provided on the mounting head and stops the descent of the pressure block, a mechanical stopper moving mechanism that can adjust the height position of the mechanical stopper, a distance sensor that measures the height distance from the mounting head to the pressure block, and control means that causes the mechanical stopper moving mechanism to adjust the height position of the mechanical stopper, on the condition that the measured height distance is greater than a preset reference value.

[0008] An electronic component mounting method according to one aspect of the present disclosure includes: a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; The pressure block of the mounting system heats an electronic element while gripping it with bumps formed on its circuit surface facing the mounting board, moves the pressure block toward the mounting board, and adjusts the height position of a mechanical stopper to stop the descent of the pressure block, provided that the height position of the pressure block is greater than a preset reference value.

[0009] A control device according to one aspect of the present disclosure includes: a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats an electronic element with bumps formed on a circuit surface facing the mounting substrate; the mounting system includes a mounting head that supports the pressure block so that it can be raised and lowered relative to the substrate stage, a mounting head moving mechanism that raises and lowers the mounting head, a mechanical stopper that is provided on the mounting head and stops the descent of the pressure block, a mechanical stopper moving mechanism that can adjust the height position of the mechanical stopper, and a distance sensor that measures the height distance from the mounting head to the pressure block; a comparison means that compares the height distance measured by the mounting system with a predetermined reference value; and a control means that, based on the comparison, causes the mechanical stopper moving mechanism to adjust the height position, provided that the measured height distance is greater than the reference value.

[0010] A control method according to one aspect of the present disclosure provides a mounting system including a substrate stage on which a mounting substrate is placed, a pressure block that grips and heats an electronic element with bumps formed on its circuit surface facing the mounting substrate, a mounting head that supports the pressure block so that it can be raised and lowered relative to the substrate stage, a mounting head moving mechanism that raises and lowers the mounting head, a mechanical stopper that is provided on the mounting head and stops the descent of the pressure block, a mechanical stopper moving mechanism that can adjust the height position of the mechanical stopper, and a distance sensor that measures the height distance from the mounting head to the pressure block, the control method compares the height distance measured by a mounting system with a predetermined reference value, and, based on the comparison, causes the mechanical stopper moving mechanism to adjust the height position, provided that the measured height distance is greater than the reference value.

[0011] A program according to one aspect of the present disclosure includes: a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats an electronic element with bumps formed on a circuit surface facing the mounting substrate; and a loading head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage. The mounting system includes a mounting head moving mechanism that raises and lowers the mounting head, a mechanical stopper that is provided on the mounting head and stops the descent of the pressure block, a mechanical stopper moving mechanism that can adjust the height position of the mechanical stopper, and a distance sensor that measures the height distance from the mounting head to the pressure block.The mounting system compares the height distance measured with a predetermined reference value, and, based on the comparison, causes the mechanical stopper moving mechanism to adjust the height position, provided that the measured height distance is greater than the reference value. [Effects of the Invention]

[0012] According to the above aspect, the control content is simplified. [Brief explanation of the drawings]

[0013] [Figure 1]1 is a schematic configuration diagram of a mounting system according to the present disclosure. [Figure 2] FIG. 10 is a schematic configuration diagram of the mounting system showing a state in which the pressure block is lowered. [Figure 3] FIG. 10 is a schematic configuration diagram of the mounting system showing a state in which the pressure block is separated from the mechanical stopper. [Figure 4] 10 is a schematic configuration diagram of the mounting system showing a state in which the mechanical stopper is raised by the mechanical stopper moving mechanism. FIG. [Figure 5] FIG. 10 is a schematic diagram of the mounting system showing a state in which the pressure block is pressed down by the height of the bumps. [Figure 6] 1 is a schematic configuration diagram of a mounting system according to the present disclosure. [Figure 7] 10 is a schematic configuration diagram of the mounting system showing a state in which the mechanical stopper is raised by the mechanical stopper moving mechanism. FIG. [Figure 8] 1 is a flowchart of an electronic component mounting method according to the present disclosure. [Figure 9] FIG. 2 is a block diagram of a control device according to the present disclosure. [Figure 10] 1 is a flowchart of a control method according to the present disclosure. [Figure 11] FIG. 2 is a diagram illustrating an example of a hardware configuration of a computer for realizing the functions of a control device according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0014] Each embodiment will be described below with reference to the drawings. In all drawings, the same or corresponding components are designated by the same reference numerals, and common descriptions will be omitted. It should be noted that in this disclosure, the drawings may relate to one or more embodiments. Furthermore, among the arrows shown in each block diagram, unidirectional arrows simply indicate the direction of flow of a certain signal (data), and do not exclude bidirectionality.

[0015] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic diagram of a mounting system 1 according to the present disclosure, and its main components are a substrate stage 2, a pressure block 3, a mounting head 4, a mounting head moving mechanism 5, a mechanical stopper 6, a mechanical stopper moving mechanism 7, a distance sensor 8, and a control means 9.

[0016] The substrate stage 2 is a base on which the mounting substrate M is placed, and the mounting substrate M is positioned along the XY plane. The pressure block 3 holds and heats the electronic element E. The mounting system 1 further includes a gripping means 10 , a heating means 11 and a pressure means 12 .

[0017] The gripping means 10 is installed below the pressure block 3 and grips the electronic element E in a state where the bumps B formed on the circuit surface face the mounting board M. The heating means 11 is disposed below the pressure block 3 and adjacent to the holding means 10 . The heating means 11 heats the electronic element E held by the holding means 10 . For example, the pressure applying means 12 may comprise a voice coil motor. The voice coil motor of the pressure means 12 applies pressure to the pressure block 3 in the direction of the arrow Z along the vertical direction. The voice coil motor of the pressure applying means 12 can apply pressure to the pressure applying block 3 in a direction toward the mounting substrate M (in the direction of arrow Z1), and can also apply pressure to the pressure applying block 3 in a direction away from the mounting substrate M (in the direction of arrow Z2) (described later).

[0018] The mounting head 4 supports the pressure block 3 via a linear guide 13 so that the pressure block 3 can be raised and lowered in the direction of the arrow Z toward the substrate stage 2 . The mounting head moving mechanism 5 has a fixed head 20 fixed to the mounting head 4, a screw shaft 21 threadedly engaged with the fixed head 20 and extending in the vertical direction, and a drive motor 22 for rotating the screw shaft 21. In the mounting head moving mechanism 5, the screw shaft 21 is rotated by the drive motor 22, whereby the mounting head 4 can be raised and lowered together with the fixed head 20 in the direction of the arrow Z.

[0019] The mechanical stopper 6 and the mechanical stopper moving mechanism 7 are provided on the upper surface of a horizontal step 4A that protrudes horizontally at the lower inner position of the mounting head 4. The mechanical stopper 6 is provided so as to be able to come into contact with the lower surface of a horizontal step portion 3A that protrudes horizontally from the upper portion of the pressure block 3, and stops the pressure block 3 from descending. The mechanical stopper moving mechanism 7 is installed between the mechanical stopper 6 and the horizontal step portion 4A of the mounting head 4. The mechanical stopper moving mechanism 7 functions as a lifting means capable of adjusting the height position of the mechanical stopper 6.

[0020] A distance sensor 8 is provided on the upper surface of the horizontal step 4A of the mounting head 4. The distance sensor 8 detects the height distance between the horizontal step portion 3A of the pressure block 3, as shown by the symbol h in Figure 2, thereby measuring the height distance between the pressure block 3 and the mounting head 4 and also measuring the amount of expansion of the pressure block 3 in the height direction due to heating. The control means 9 determines whether or not the height distance between the horizontal step portion 3A of the pressure block 3 detected by the distance sensor 8 is greater than a preset reference value (=H+H1). Thereafter, when the height distance (h) detected by the distance sensor 8 is greater than the reference value (=H+H1), the control means 9 causes the mechanical stopper moving mechanism 7 to adjust the height position of the mechanical stopper 6 (see Figures 3 and 4). The control means 9 also controls the driving of the mounting head moving mechanism 5 based on the height distance (h) detected by the distance sensor 8.

[0021] Here, "H", which is set as the reference value, is a value indicating the distance between the mechanical stopper 6 and the horizontal step portion 3A of the pressure block 3 when the mechanical stopper 6 comes into contact with the horizontal step portion 3A of the pressure block 3 before the pressure block 3 thermally expands (see Figure 2). Furthermore, "H1" set as a reference value is a value indicating the height of the bump B of the electronic element E, and represents the amount of bump crushing (see FIGS. 3 and 4). Then, under the condition that the pressure block 3 thermally expands due to heating and the height distance (h) detected by the distance sensor 8 becomes larger than the reference value (=H+H1), the control means 9 raises the mechanical stopper 6 by the length of expansion of the pressure block 3 (indicated by the symbol α in Figures 4 and 5) (to be described later).

[0022] Next, a method for controlling the amount of crushing of bumps when the bumps melt in the mounting system 1 of the embodiment will be described with reference to FIGS. The following processing is executed by the control means 9.

[0023] First, the height (h) of the pressure block 3 is measured by the distance sensor 8 in advance with the mechanical stopper 6 and the pressure block 3 in contact with each other, and the measured value is set as "H" (see FIG. 2).

[0024] Next, the electronic element E held by the holding means 10 and the mounting substrate M held by the substrate stage 2 are aligned in the in-plane directions (XY directions) on the substrate stage 2 (see FIG. 1). At this time, the alignment of the electronic element E and the mounting substrate M in the in-plane direction may be performed using image data captured by a camera. Thereafter, while a constant load is applied downward (in the direction of arrow Z1) to the pressure block 3 by the pressure means 12, the pressure block 3 is lowered together with the mounting head 4 by the mounting head moving mechanism 5 toward the substrate stage 2. This brings the bumps B of the electronic element E into contact with the electrodes of the mounting substrate M (see FIGS. 1 and 2).

[0025] Here, the voice coil motor of the pressure applying means 12 can apply a load in a direction (indicated by arrow Z2) that cancels out the weight of the pressure applying block 3, heating means 11, and holding means 10, thereby minimizing the load applied to the electronic element E (see Figure 2).

[0026] Furthermore, the mounting head moving mechanism 5 moves the pressure block 3 together with the mounting head 4 toward the substrate stage 2 in the direction of arrow Z1. However, since the bumps B of the electronic element E held by the pressure block 3 are in contact with the electrodes of the mounting substrate M, the electronic element E cannot move any further toward the substrate stage 2 side. At this time, the pressure block 3 moves away from the mechanical stopper 6, and when the detection value (h) of the distance sensor 8 reaches the reference value "H+H1", the movement of the mounting head 4 downward (in the direction of arrow Z1) is stopped (see Figures 3 and 4).

[0027] Here, the distance between the horizontal step portion 3A of the pressure block 3 and the mechanical stopper 6 is set to a preset bump crushing amount "H1." Whether or not the bumps B of the electronic element E come into contact with the electrodes of the mounting substrate M may be detected by a sensor such as a load cell. Then, the mounting head moving mechanism 5 may move the mounting head 4 toward the substrate stage 2 by the height of the bump crushing amount "H1" based on the detection result of a sensor such as a load cell.

[0028] Next, the electronic element E is heated by the heating means 11 . At this time, the pressure block 3, the heating means 11, and their peripheral members thermally expand due to the temperature rise, causing the horizontal step 3A of the pressure block 3 to move in the direction of arrow Z2 away from the horizontal step 4A of the mounting head 4.

[0029] The distance that the pressure block 3 moves at this time is measured by the distance sensor 8 . Thereafter, the mechanical stopper moving mechanism 7 raises the mechanical stopper 6 by the distance by which the detected height (h) by the distance sensor 8 exceeds the reference value "H+H1", i.e., the length (α) by which the pressure block 3 expands (see Figures 4 and 5).

[0030] The mechanical stopper moving mechanism 7 repeats this operation during heating, thereby maintaining the distance between the pressure block 3 and the mechanical stopper 6. The mechanical stopper moving mechanism 7 is set to rise only when the gap between the pressure block 3 and the mechanical stopper 6 widens, and not to operate when the gap between the pressure block 3 and the mechanical stopper 6 narrows.

[0031] Thereafter, the pressure block 3 moves in the direction of the arrow Z1 on the substrate stage 2 as the bumps B on the electronic element E liquefy when they reach their melting point and as a load is applied in the direction of the downward arrow Z1 by the voice coil motor of the pressure means 12. At this time, the distance sensor 8 detects the movement distance (negative value) of the position of the pressure block 3. However, at this time, the mechanical stopper 6 is set so that it can only move up and cannot move down, so its position does not move. Therefore, the pressure block 3 comes into contact with the mechanical stopper 6 and descends until the descending distance reaches the preset bump crushing amount "H1" (see FIGS. 4 and 5).

[0032] That is, the pressure block 3 starts from a state in which the bumps B of the electronic element E and the electrodes of the mounting substrate M are in contact with each other, and then crushes the bumps B on the electronic element E by a preset bump crushing amount H1. The melting of the bumps B on the electronic element E can be detected by checking whether the height (h) detected by the distance sensor 8 reaches "H" which is set as a reference value. In addition, the mounting head moving mechanism 5 can flexibly adjust the distance between the electronic element E and the mounting substrate M by appropriately adjusting the pressure block 3 to rise or fall together with the mounting head 4 while the bumps B are melted.

[0033] As described in detail above, in the mounting system 1 according to the present disclosure, even if the pressure block 3 thermally expands during the heating process of the electronic element E, it is possible to keep the amount of bump crushing (H1) constant when the bump melts, thereby stabilizing the mounting quality of the electronic element E.

[0034] Furthermore, in the mounting system 1 according to the present disclosure, the mechanical stopper 6 is controlled to be raised by the distance that exceeds the reference value "H+H1" when the detected height (h) by the distance sensor 8, i.e., the length (α) of the thermal expansion of the pressure block 3. As a result, in the mounting system 1 according to the present disclosure, the height position of the mechanical stopper 6 is adjusted by the mechanical stopper moving mechanism 7 only under specific conditions, which has the advantage of simplifying the control content compared to when the height position of the mechanical stopper is controlled at all times.

[0035] Second Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 6, the mounting system 101 includes a substrate stage 102, a pressure block 103, a mounting head 104, a mounting head moving mechanism 105, a mechanical stopper 106, a mechanical stopper moving mechanism 107, a distance sensor 108, and a control means 109.

[0036] A mounting substrate is placed on the substrate stage 102 . The pressure block 103 holds and heats the electronic element with the bumps formed on the circuit surface facing the mounting board. The mounting head 104 supports the pressure block 103 so that it can be raised and lowered toward the substrate stage 102 .

[0037] The mounting head moving mechanism 105 moves the mounting head 104 up and down. A mechanical stopper 106 is provided on the mounting head 104 to stop the pressure block 103 from descending. The mechanical stopper moving mechanism 107 adjusts the height position of the mechanical stopper 106 . The distance sensor 108 measures the height distance from the mounting head 104 to the pressure block 103 .

[0038] The control means 109 compares the height distance measured by the distance sensor 108 with a preset reference value A, and based on the comparison, causes the mechanical stopper moving mechanism 107 to adjust the height position, provided that the measured height distance (h) is greater than the reference value A.

[0039] As shown in FIG. 7, in the mounting system 101 according to the present disclosure, the mechanical stopper 106 is controlled to be raised by the distance by which the detected height (h) by the distance sensor 108 exceeds the reference value "A", that is, by the length (α1) by which the pressure block 103 thermally expands. As a result, in the mounting system 101 according to the present disclosure, the height position of the mechanical stopper 106 is adjusted by the mechanical stopper moving mechanism 107 only under specific conditions, which has the advantage of simplifying the control content compared to when the height position of the mechanical stopper is controlled at all times.

[0040] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. FIG. 8 is a flowchart showing the steps of the electronic component mounting method according to the present disclosure.

[0041] [Step S1] The electronic element E is heated while being held by the pressure block of the mounting system with the bumps formed on the circuit surface facing the mounting board. The mounting system includes a substrate stage, a pressure block, a mounting head, a mounting head moving mechanism, a mechanical stopper, a mechanical stopper moving mechanism, and a distance sensor. A mounting substrate is placed on the substrate stage. The pressure block holds and heats the electronic element with the bumps formed on the circuit surface facing the mounting board. The mounting head supports the pressure block so that it can be raised and lowered relative to the substrate stage. The mounting head moving mechanism moves the mounting head up and down. A mechanical stopper is provided on the mounting head to stop the pressure block from descending. The mechanical stopper moving mechanism is capable of adjusting the mechanical stopper and the height position of the mechanical stopper. The distance sensor measures the height distance from the mounting head to the pressure block.

[0042] [Step S2] The pressure block is moved toward the mounting substrate.

[0043] [Step S3] On the condition that the height detected by the distance sensor is greater than a preset reference value, the height position of a mechanical stopper for stopping the descent of the pressure block is adjusted.

[0044] In the electronic component mounting method according to the present disclosure, it is possible to perform control to raise the mechanical stopper by the distance by which the height detected by the distance sensor exceeds the reference value, i.e., the distance by which the pressure block thermally expands. As a result, in the electronic component mounting method according to the present disclosure, the height position of the mechanical stopper is adjusted by the mechanical stopper moving mechanism only under specific conditions, which has the advantage of simplifying the control content compared to when the height position of the mechanical stopper is controlled at all times.

[0045] <Fourth embodiment> Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings.

[0046] As shown in FIG. 9, the control device 109' includes a comparison means 109A and a control means 109B.

[0047] The comparison means 109A compares the height distance (h) measured by the distance sensor of the mounting system with a preset reference value. The mounting system includes a substrate stage, a pressure block, a mounting head, a mounting head moving mechanism, a mechanical stopper, a mechanical stopper moving mechanism, and a distance sensor. A mounting substrate is placed on the substrate stage. The pressure block holds and heats the electronic element with the bumps formed on the circuit surface facing the mounting board. The mounting head supports the pressure block so that it can be raised and lowered relative to the substrate stage. The mounting head moving mechanism moves the mounting head up and down. A mechanical stopper is provided on the mounting head to stop the pressure block from descending. The mechanical stopper moving mechanism is capable of adjusting the mechanical stopper and the height position of the mechanical stopper. The distance sensor measures the height distance from the mounting head to the pressure block.

[0048] Based on the comparison by the comparison means 109A, the control means 109B causes the mechanical stopper moving mechanism to adjust the height position on the condition that the measured height distance (h) is greater than the reference value.

[0049] The control device 109' according to the present disclosure can perform control to raise the mechanical stopper by the distance by which the height (h) detected by the distance sensor exceeds the reference value, that is, the distance by which the pressure block thermally expands. As a result, the control device 109' according to the present disclosure adjusts the height position of the mechanical stopper using the mechanical stopper moving mechanism only under specific conditions, making the control content simpler compared to when the height position of the mechanical stopper is controlled at all times.

[0050] Fifth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. The control method shown in FIG. 10 consists of the following steps.

[0051] [Step S11] The height distance measured by the mounting system is compared with a preset reference value. The mounting system includes a substrate stage, a pressure block, a mounting head, a mounting head moving mechanism, a mechanical stopper, a mechanical stopper moving mechanism, and a distance sensor. A mounting substrate is placed on the substrate stage. The pressure block holds and heats the electronic element with the bumps formed on the circuit surface facing the mounting board. The mounting head supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage. The mounting head moving mechanism moves the mounting head up and down. A mechanical stopper is provided on the mounting head to stop the pressure block from descending. The mechanical stopper moving mechanism is capable of adjusting the mechanical stopper and the height position of the mechanical stopper. The distance sensor measures the height distance from the mounting head to the pressure block.

[0052] [Step S12] Based on the comparison in step S11, the mechanical stopper moving mechanism is caused to adjust the height position on the condition that the measured height distance is greater than the reference value.

[0053] The control method according to the present disclosure can control the mechanical stopper to be raised by the distance beyond which the height detected by the distance sensor reaches the reference value, i.e., the distance by which the pressure block has thermally expanded. As a result, in the control method disclosed herein, the height position of the mechanical stopper is adjusted by the mechanical stopper moving mechanism only under specific conditions, making the control content simpler compared to when the height position of the mechanical stopper is controlled at all times.

[0054] <Hardware configuration of each device> An example of a hardware configuration for realizing all or part of the control device 109' (or control means 9) in the above-described embodiment will be described with reference to FIG. As shown in FIG. 11, the control device 109′ (or control means 9) includes a computer 90 having the following hardware components: a processor 91, a memory 92, a storage / playback device 93, a communication I / F (communication interface) 94, and an IO I / F (input output interface) 95.

[0055] The processor 91 is, for example, a CPU (Central Processing Unit). The memory 92 is a storage medium such as a RAM (Random Access Memory) or a ROM (Read Only Memory). The storage / playback device 93 is a device for storing programs, data, etc. on external media such as CD-ROM (Compact Disc Read Only Memory), DVD (Digital Versatile Disc), flash memory, etc., and for playing back programs, data, etc. from external media. The communication I / F 94 is an interface for communicating between the computer 90 and other devices via a communication line such as the Internet or a dedicated communication line. The IO I / F 95 is an interface for inputting a source program and inputting and outputting information between the computer 90 and other devices.

[0056] <Computer Program> A program for realizing all or part of the functions of the control device 109' (or control means 9) in the above-described embodiment may be stored in a computer-readable storage medium, and all or part of the processing may be performed by reading and executing the program stored in this storage medium into a computer system. The term "computer system" as used herein includes hardware such as an OS (Operating System) and peripheral devices.

[0057] Furthermore, if a WWW (World Wide Web) system is used, the "computer system" also includes the homepage providing environment (or display environment).

[0058] In addition, "computer-readable storage medium" refers to portable media such as flexible disks, optical magnetic disks, ROMs, CD-ROMs, and storage devices such as hard disks built into computer systems.

[0059] In addition, "computer-readable storage medium" includes a medium that dynamically stores a program for a short period of time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line.

[0060] Furthermore, the term "computer-readable storage medium" also includes a medium that stores a program for a certain period of time, such as volatile memory within a computer system that serves as a server or client when transmitting a program via a network such as the Internet or a communication line such as a telephone line.

[0061] For example, the program may be designed to realize some of the functions described above, or may be designed to realize the functions described above in combination with a program already stored in the computer system.

[0062] (Variation) In the above embodiment, the height distance between the pressure blocks is directly measured by the distance sensor. However, the distance sensor is not limited to a sensor that directly measures distance, and may be a sensor that measures the distance by analyzing image data captured by a camera. Furthermore, the image data acquired at this time may also be used to detect contact between the mechanical stopper and the pressure block.

[0063] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0064] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0065] (Appendix 1) a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; a control means for controlling the mechanical stopper moving mechanism to adjust the height position of the mechanical stopper on condition that the measured height distance is greater than a preset reference value; Equipped with Implementation system.

[0066] (Appendix 2) a gripping means for gripping the electronic element; a heating means for heating the electronic element; a pressure applying unit that applies pressure to the pressure block in a direction toward the mounting substrate and in a direction away from the mounting substrate, 10. The mounting system of claim 1.

[0067] (Appendix 3) The pressure applying means includes a voice coil motor. 1. The mounting system of claim 2.

[0068] (Appendix 4) the mechanical stopper and the mechanical stopper moving mechanism are disposed between a horizontal step portion protruding in a horizontal direction of the pressure block and a horizontal step portion protruding in a horizontal direction of the mounting head; 4. A mounting system according to any one of appendices 1 to 3.

[0069] (Appendix 5) the mechanical stopper is provided on the mechanical stopper moving mechanism installed on a horizontal step portion of the mounting head; 10. The mounting system of claim 4.

[0070] (Appendix 6) the distance sensor is disposed between the horizontal step portion of the pressure block and the horizontal step portion of the mounting head, and measures the height distance between the pressure block and the mounting head by detecting the distance from the lower surface of the horizontal step portion of the pressure block. 6. The mounting system of claim 4 or 5.

[0071] (Appendix 7) the distance sensor measures the height distance from the mounting head to the pressure block based on image data captured by a camera; 7. A mounting system according to any one of appendices 1 to 6.

[0072] (Appendix 8) a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; the pressure block of the mounting system heats the electronic element while holding it in a state where the bumps formed on the circuit surface face the mounting substrate, moving the pressure block toward the mounting substrate; adjusting a height position of a mechanical stopper for stopping the descent of the pressure block on the condition that the height position of the pressure block is greater than a preset reference value; Electronic component mounting method.

[0073] (Appendix 9) The mounting system comprises: a gripping means for gripping the electronic element; a heating means for heating the electronic element; a pressure applying unit that applies pressure to the pressure block in a direction toward the mounting substrate and in a direction away from the mounting substrate, 9. The electronic component mounting method according to claim 8.

[0074] (Appendix 10) The pressure applying means includes a voice coil motor. 10. The electronic component mounting method according to claim 9.

[0075] (Appendix 11) the mechanical stopper and the mechanical stopper moving mechanism are disposed between a horizontal step portion protruding in a horizontal direction of the pressure block and a horizontal step portion protruding in a horizontal direction of the mounting head; 11. The electronic component mounting method according to any one of Supplementary Notes 8 to 10.

[0076] (Appendix 12) the mechanical stopper is provided on the mechanical stopper moving mechanism installed on a horizontal step portion of the mounting head; 9. The electronic component mounting method according to claim 8.

[0077] (Appendix 13) the distance sensor is disposed between the horizontal step portion of the pressure block and the horizontal step portion of the mounting head, and measures the height distance between the pressure block and the mounting head by detecting the distance from the lower surface of the horizontal step portion of the pressure block. 10. The electronic component mounting method according to claim 8 or 9.

[0078] (Appendix 14) the distance sensor measures the height distance from the mounting head to the pressure block based on image data captured by a camera; 14. The electronic component mounting method according to any one of Supplementary Notes 8 to 13.

[0079] (Appendix 15) a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; a comparison means for comparing the height distance measured by the mounting system with a preset reference value; a control means for controlling the mechanical stopper moving mechanism to adjust the height position on the condition that the measured height distance is greater than the reference value based on the comparison; and Equipped with Control device.

[0080] (Appendix 16) The mounting system comprises: a gripping means for gripping the electronic element; a heating means for heating the electronic element; a pressure applying unit that applies pressure to the pressure block in a direction toward the mounting substrate and in a direction away from the mounting substrate, 16. The control device of claim 15.

[0081] (Appendix 17) The pressure applying means includes a voice coil motor. 17. The control device of claim 16.

[0082] (Appendix 18) the mechanical stopper and the mechanical stopper moving mechanism are disposed between a horizontal step portion protruding in a horizontal direction of the pressure block and a horizontal step portion protruding in a horizontal direction of the mounting head; 18. The control device according to any one of appendices 15 to 17.

[0083] (Appendix 19) the mechanical stopper is provided on the mechanical stopper moving mechanism installed on a horizontal step portion of the mounting head; 16. The control device of claim 15.

[0084] (Appendix 20) the distance sensor is disposed between the horizontal step portion of the pressure block and the horizontal step portion of the mounting head, and measures the height distance between the pressure block and the mounting head by detecting the distance from the lower surface of the horizontal step portion of the pressure block. 17. The control device according to claim 15 or 16.

[0085] (Appendix 21) the distance sensor measures the height distance from the mounting head to the pressure block based on image data captured by a camera; 21. The control device according to any one of appendices 15 to 20.

[0086] (Appendix 22) a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; comparing the height distance measured by the mounting system with a preset reference value; causing the mechanical stopper moving mechanism to adjust the height position on the condition that the measured height distance is greater than the reference value based on the comparison; Control method.

[0087] (Appendix 23) The mounting system includes: a gripping means for gripping the electronic element; a heating means for heating the electronic element; a pressure applying unit that applies pressure to the pressure block in a direction toward the mounting substrate and in a direction away from the mounting substrate, 23. The control method of claim 22.

[0088] (Appendix 24) The pressure applying means includes a voice coil motor. 24. The control method of claim 23.

[0089] (Appendix 25) the mechanical stopper and the mechanical stopper moving mechanism are disposed between a horizontal step portion protruding in a horizontal direction of the pressure block and a horizontal step portion protruding in a horizontal direction of the mounting head; A control method according to any one of Supplementary Notes 22 to 24.

[0090] (Appendix 26) the mechanical stopper is provided on the mechanical stopper moving mechanism installed on a horizontal step portion of the mounting head; 23. The control method of claim 22.

[0091] (Appendix 27) the distance sensor is disposed between the horizontal step portion of the pressure block and the horizontal step portion of the mounting head, and measures the height distance between the pressure block and the mounting head by detecting the distance from the lower surface of the horizontal step portion of the pressure block. 24. The control method according to claim 22 or 23.

[0092] (Appendix 28) the distance sensor measures the height distance from the mounting head to the pressure block based on image data captured by a camera; A control method according to any one of Supplementary Notes 22 to 27.

[0093] (Appendix 29) a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; comparing the height distance measured by the mounting system with a preset reference value; causing the mechanical stopper moving mechanism to adjust the height position on the condition that the measured height distance is greater than the reference value based on the comparison; Make the computer do that, program.

[0094] (Appendix 30) The implementation system is a gripping means for gripping the electronic element; a heating means for heating the electronic element; a pressure applying unit that applies pressure to the pressure block in a direction toward the mounting substrate and in a direction away from the mounting substrate, 29. The program described in Appendix 29.

[0095] (Appendix 31) The pressure applying means includes a voice coil motor. 30. The program described in Appendix 30.

[0096] (Appendix 32) the mechanical stopper and the mechanical stopper moving mechanism are disposed between a horizontal step portion protruding in a horizontal direction of the pressure block and a horizontal step portion protruding in a horizontal direction of the mounting head; A program according to any one of Appendices 29 to 31.

[0097] (Appendix 33) the mechanical stopper is provided on the mechanical stopper moving mechanism installed on a horizontal step portion of the mounting head; 29. The program described in Appendix 29.

[0098] (Appendix 34) the distance sensor is disposed between the horizontal step portion of the pressure block and the horizontal step portion of the mounting head, and measures the height distance between the pressure block and the mounting head by detecting the distance from the lower surface of the horizontal step portion of the pressure block. 31. The program according to claim 29 or 30.

[0099] (Appendix 35) the distance sensor measures the height distance from the mounting head to the pressure block based on image data captured by a camera; A program according to any one of appendices 29 to 34. [Explanation of symbols]

[0100] 1. Mounting system 2. Substrate stage 3 Pressure Block 3A horizontal step 4 Mounting head 4A horizontal step 5 Mounting head movement mechanism 6 Mechanical Stopper 7 Mechanical stopper movement mechanism 8 Distance Sensor 9. Control Measures 10 Gripping means 11 Heating means 12 Pressurizing means 13 Linear guide 20 Fixed Head 21 Screw shaft 22 Drive motor 90 Computer 91 processors 92 memory 93 Storage / playback device 94 Communication I / F 95 IO I / F 101 Mounting System 102 Substrate stage 103 Pressure Block 104 Mounting Head 105 Mounting head movement mechanism 106 Mechanical Stopper 107 Mechanical stopper movement mechanism 108 Distance Sensor 109 Control Measures 109' Control device 109A Comparison means 109B Control means M Mounting board E Electronic element B Bump

Claims

1. a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; a control means for controlling the mechanical stopper moving mechanism to adjust the height position of the mechanical stopper on condition that the measured height distance is greater than a preset reference value; Equipped with Implementation system.

2. a gripping means for gripping the electronic element; a heating means for heating the electronic element; a pressure applying unit that applies pressure to the pressure block in a direction toward the mounting substrate and in a direction away from the mounting substrate, The mounting system according to claim 1 .

3. The pressure applying means includes a voice coil motor. The mounting system according to claim 2 .

4. the mechanical stopper and the mechanical stopper moving mechanism are disposed between a horizontal step portion protruding in a horizontal direction of the pressure block and a horizontal step portion protruding in a horizontal direction of the mounting head; The mounting system according to claim 1 or 2.

5. the mechanical stopper is provided on the mechanical stopper moving mechanism installed on a horizontal step portion of the mounting head; The mounting system according to claim 4 .

6. the distance sensor is disposed between the horizontal step portion of the pressure block and the horizontal step portion of the mounting head, and measures the height distance between the pressure block and the mounting head by detecting the distance from the lower surface of the horizontal step portion of the pressure block. The mounting system according to claim 4 .

7. a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; the pressure block of the mounting system heats the electronic element while holding it in a state in which the bumps formed on the circuit surface face the mounting substrate; moving the pressure block toward the mounting substrate; adjusting a height position of a mechanical stopper for stopping the descent of the pressure block on the condition that the height position of the pressure block is greater than a preset reference value; Electronic component mounting method.

8. a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; a comparison means for comparing the height distance measured by the mounting system with a preset reference value; a control means for controlling the mechanical stopper moving mechanism to adjust the height position on the condition that the measured height distance is greater than the reference value based on the comparison; and Equipped with Control device.

9. a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; comparing the height distance measured by the mounting system with a preset reference value; and causing the mechanical stopper moving mechanism to adjust the height position on the condition that the measured height distance is greater than the reference value based on the comparison. Control method.

10. a substrate stage on which a mounting substrate is placed; a pressure block that holds and heats the electronic element with the bumps formed on its circuit surface facing the mounting substrate; a mounting head that supports the pressure block so that the pressure block can be raised and lowered relative to the substrate stage; a mounting head moving mechanism that raises and lowers the mounting head; a mechanical stopper provided on the mounting head to stop the descent of the pressure block; a mechanical stopper moving mechanism capable of adjusting the height position of the mechanical stopper; a distance sensor for measuring a height distance from the mounting head to the pressure block; comparing the height distance measured by the mounting system with a preset reference value; and causing the mechanical stopper moving mechanism to adjust the height position on the condition that the measured height distance is greater than the reference value based on the comparison. Make the computer do that, program.

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