Electric connection device

Abstract

To provide an electric connection device that enables easy replacement of a substrate.SOLUTION: An electric connection device 1 includes a probe head 60 that keeps a probe 10, a wiring sheet 30 including a first connection part 31 disposed on a first sheet surface 311 facing the probe head 60 and a second connection part 32 disposed on a second sheet surface 312, and a wiring board 20 disposed facing the second sheet surface 312. A press-fit pin 300 having an elastically deformable head part is embedded in the wiring sheet and the head part is exposed in at least one of the first sheet surface 311 and the second sheet surface 312. The head part of the press-fit pin 300 exposed at the first sheet surface 311 is fitted into a concave part of the probe head 60, so that the probe head 60 is fixed to the wiring sheet 30. The head part of the press-fit pin 300 exposed at the second sheet surface 312 is fitted into a concave part of the wiring board 20, so that the wiring board 20 is fixed to the wiring sheet 30.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrical connecting device used for testing electrical characteristics of an object to be tested. [Background technology]

[0002] To measure the electrical characteristics of an object under test, such as an integrated circuit, an electrical connection device having testing terminals that come into contact with the object under test is used. In measurements using the electrical connection device, the object under test is electrically connected to a testing device such as a tester via the testing terminals. To measure the characteristics of the object under test, the electrical connection device is configured by stacking multiple substrates, such as printed circuit boards and space transformers. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-178901 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventionally, the multiple boards that make up an electrical connection device have been connected by screws. When boards are connected by screws, replacing a board takes time. The object of the present invention is to provide an electrical connection device that makes it easy to replace boards. [Means for solving the problem]

[0005] An electrical connection device according to one aspect of the present invention includes a probe head for holding probes, a wiring sheet including a first connection portion disposed on a first sheet surface facing the probe head and a second connection portion disposed on a second sheet surface, and a wiring board disposed opposite the second sheet surface. Press-fit pins having elastically deformable heads are embedded in the wiring sheet, and the heads are exposed on at least one of the first sheet surface and the second sheet surface. The heads of the press-fit pins exposed on the first sheet surface are fitted into recesses formed in the probe head, thereby fixing the probe head to the wiring sheet. The heads of the press-fit pins exposed on the second sheet surface are fitted into recesses formed in the wiring board, thereby fixing the wiring board to the wiring sheet. [Effects of the Invention]

[0006] According to the present invention, an electrical connecting device that allows easy replacement of a substrate can be provided. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an electrical connecting device according to an embodiment. [Figure 2] FIG. 2 is a schematic plan view showing the configuration of the electrical connecting device according to the embodiment. [Figure 3] FIG. 3 is a schematic diagram showing a state where the electrical connecting device according to the embodiment is joined by a press-fit pin. [Figure 4] FIG. 4 is a schematic diagram showing a joining method using a press-fit pin of the electrical connecting device according to the embodiment. [Figure 5] FIG. 5 is a schematic diagram showing another state of joining by press-fit pins of the electrical connecting device according to the embodiment. [Figure 6] FIG. 6 is a schematic diagram showing another method of joining using press-fit pins in the electrical connecting device according to the embodiment. [Figure 7] FIG. 7 is a schematic diagram showing an example of the shape of the head of a press-fit pin of the electrical connecting device according to the embodiment. [Figure 8]FIG. 8 is a schematic cross-sectional view showing an example of the structure of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 9] FIG. 9 is a schematic diagram showing an example of an internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 10] FIG. 10 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 11] FIG. 11 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 12] FIG. 12 is a schematic diagram showing an example of a loopback circuit using the wiring sheet shown in FIG. [Figure 13] FIG. 13 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 14] FIG. 14 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 15] FIG. 15 is a schematic diagram showing an example of the layout of electronic circuits on the wiring sheet of the electrical connecting device according to the embodiment. [Figure 16] FIG. 16 is a schematic diagram showing another example of the wiring sheet and the circuit board of the electrical connecting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, arrangements, etc. of the components of the embodiments of the present invention are not limited to those described below.

[0009] 1 is used to inspect an inspection target object 2. The electrical connection device 1 includes a probe 10, a probe head 60 that holds the probe 10, a wiring sheet 30 laminated on the probe head 60, and a wiring board 20 laminated on the wiring sheet 30.

[0010] The electrical connection device 1 further includes a printed circuit board 40 laminated on the wiring board 20, and a stiffener 50 laminated on the printed circuit board 40. In the following description, the direction in which the electrical connection device 1 is located as viewed from the object under test 2 is referred to as the upward direction, and the direction in which the object under test 2 is located as viewed from the electrical connection device 1 is referred to as the downward direction. As shown in FIG. 1, the direction from bottom to top is referred to as the Z direction, and the plane perpendicular to the Z direction is referred to as the XY plane. In FIG. 1, the left-right direction of the drawing is the X direction, and the depth direction is the Y direction. Furthermore, for each of the components of the electrical connection device 1, the surface facing upward is also referred to as the upper surface, and the surface facing downward is also referred to as the lower surface.

[0011] The probe 10 functions as an inspection terminal that electrically connects the inspection object 2 to the inspection device. The probe 10 has a tip portion 11, which is one end of the probe 10, arranged so as to be able to come into contact with the inspection object 2, and a base portion 12, which is the other end of the probe 10 connected to the tip portion 11. For example, the probe 10 is held in a state in which it passes through a through-hole formed in the probe head 60. The tip portion 11 and the base portion 12 are exposed from the probe head 60.

[0012] The wiring sheet 30 includes a first connection portion 31 disposed on a first sheet surface 311 facing the probe head 60, and a second connection portion 32 disposed on a second sheet surface 312 facing the opposite direction from the first sheet surface 311. The first sheet surface 311 is the lower surface of the wiring sheet 30, and the second sheet surface 312 is the upper surface of the wiring sheet 30. That is, the first sheet surface 311 and the second sheet surface 312 are main surfaces of the wiring sheet 30 facing in opposite directions. Although not shown in FIG. 1 , the wiring sheet 30 has an internal circuit electrically connected to at least one of the first connection portion 31 and the second connection portion 32. The first connection portion 31 connects to the base end 12 of the probe 10 exposed from the probe head 60. The wiring sheet 30 is flexible and elastically deforms in the film thickness direction. The configuration of the wiring sheet 30 will be described in detail later.

[0013] The wiring board 20 is disposed opposite the probe head 60 with the wiring sheet 30 sandwiched therebetween. A first electrode 21 electrically connected to the second connection portion 32 of the wiring sheet 30 is disposed on the lower surface of the wiring board 20 facing the second sheet surface 312 of the wiring sheet 30. A second electrode 22 is disposed on the upper surface of the wiring board 20 facing the printed circuit board 40. The first electrode 21 and the second electrode 22 are electrically connected via internal wiring 200. A multilayer wiring board such as MLO (Multi-Layer Organic) or MLC (Multi-Layer Ceramic) may be used for the wiring board 20.

[0014] The printed circuit board 40 is disposed opposite the upper surface of the wiring board 20. The printed circuit board 40 includes a first end 41 disposed on the lower surface facing the wiring board 20, a second end 42 disposed on the upper surface, and a wiring pattern 400 that electrically connects the first end 41 and the second end 42. The second end 42 is electrically connected to, for example, an inspection device (not shown). As a result, an electrical signal is transmitted between the inspection object 2 and the inspection device via the electrical connection device 1.

[0015] The object under test 2 is mounted on a stage 3. The electrical connecting device 1 and the stage 3 are relatively movable in the vertical direction. When inspecting the object under test 2, the distance between the electrical connecting device 1 and the stage 3 is narrowed so that the tip 11 of the probe 10 comes into contact with a signal terminal (not shown) of the object under test 2. FIG. 1 shows a state in which the probe 10 and the object under test 2 are spaced apart.

[0016] The wiring board 20 may be, for example, a space transformer that converts the spacing between the base ends 12 of the probes 10 as viewed from the normal direction of the top surface of the wiring board 20 into the spacing between the first ends 41 of the printed circuit board 40. When the wiring board 20 is a space transformer, the second ends 42 of the printed circuit board 40, which are arranged at a wider interval than the spacing between the signal terminals arranged on the test object 2, can be electrically connected to the signal terminals. This facilitates the electrical connection between the wiring pattern 400 of the printed circuit board 40 and the test device.

[0017] 1, a stiffener 50 may be laminated on the printed circuit board 40. The stiffener 50 has a higher rigidity than the printed circuit board 40, and prevents the printed circuit board 40 from bending, thereby ensuring the mechanical strength of the electrical connection device 1. Furthermore, the stiffener 50 may be used as a support for fixing each of the components of the electrical connection device 1.

[0018] 2 is a plan view (hereinafter also referred to as "plan view") of the laminated structure of wiring board 20, wiring sheet 30, printed circuit board 40, and stiffener 50, as seen from the Z direction. Stiffener 50 is disposed on the top surface of printed circuit board 40, which is circular in plan view.

[0019] 2, the stiffener 50 has a shape in which an outer circular ring and an inner rectangular ring are connected by spokes. The wiring board 20 and the wiring sheet 30 are disposed near the center of the underside of the printed circuit board 40. The wiring board 20 and the printed circuit board 40, and the printed circuit board 40 and the stiffener 50 are fixed together with screws, for example.

[0020] 1, press-fit pins 300 are used to join the probe head 60 to the wiring sheet 30, and to join the wiring sheet 30 to the wiring board 20. The press-fit pins 300 have heads that are elastically deformable in a direction perpendicular to their axial direction.

[0021] FIG. 3 shows an example of a state of joining using a press-fit pin 300. The press-fit pin 300 shown in FIG. 3 has a main body 310 that penetrates the wiring sheet 30 from a first sheet surface 311 to a second sheet surface 312. A first head 321 connected to one end of the main body 310 is exposed on the first sheet surface 311. A second head 322 connected to the other end of the main body 310 is exposed on the second sheet surface 312. Hereinafter, when there is no need to specify the first head 321 and the second head 322, they will be referred to as head 320. The head 320 may be ring-shaped when viewed from a direction parallel to the XY plane, for example.

[0022] The first heads 321 of the press-fit pins 300 exposed on the first sheet surface 311 are fitted into recesses (hereinafter referred to as "first recesses 620") formed in the probe head 60, and the probe head 60 is fixed to the wiring sheet 30. The second heads 322 of the press-fit pins 300 exposed on the second sheet surface 312 are fitted into recesses (hereinafter referred to as "second recesses 220") formed in the wiring board 20, and the wiring board 20 is fixed to the wiring sheet 30.

[0023] FIG. 4 shows a state in which the probe head 60, the wiring sheet 30, and the wiring board 20 are separated. For example, as shown in FIG. 4, the main body 310 of the press-fit pin 300 is fitted into a through-hole formed in the wiring sheet 30. At this time, the first head 321 is exposed on the first seat surface 311, and the second head 322 is exposed on the second seat surface 312. Next, the first seat surface 311 of the wiring sheet 30 and the probe head 60 are brought close to each other, and the first head 321 of the press-fit pin 300 is fitted into the first recess 620 of the probe head 60. Then, the second seat surface 312 of the wiring sheet 30 and the wiring board 20 are brought close to each other, and the second head 322 of the press-fit pin 300 is fitted into the second recess 220 of the wiring board 20.

[0024] The probe head 60, the wiring sheet 30, and the wiring board 20 may be bonded in any order. For example, the probe head 60 and the wiring sheet 30 may be bonded together, and then the wiring sheet 30 and the wiring board 20 may be bonded together. Alternatively, the wiring sheet 30 and the wiring board 20 may be bonded together, and then the probe head 60 and the wiring sheet 30 may be bonded together.

[0025] The first head 321 fitted into the first recess 620 of the probe head 60 is compressed and deformed, and the elastic force of the first head 321 returning to its original shape bonds the probe head 60 to the wiring sheet 30. Similarly, the second head 322 fitted into the second recess 220 of the wiring board 20 is compressed and deformed, and the elastic force of the second head 322 returning to its original shape bonds the wiring board 20 to the wiring sheet 30.

[0026] Fig. 4 shows the state of the press-fit pin 300 before assembling the electrical connecting device 1. Compared to Fig. 3, the press-fit pin 300 shown in Fig. 4 bulges in a direction perpendicular to the axial direction.

[0027] 3 and 4 show an example of a press-fit pin 300 in which a main body 310 is embedded in a wiring sheet 30 and a head 320 is exposed on both the first sheet surface 311 and the second sheet surface 312. Alternatively, the head 320 connected to one main body 310 may be exposed on only one of the first sheet surface 311 and the second sheet surface 312. In other words, there may be only one head 320 connected to the main body 310.

[0028] 5, the wiring sheet 30 and the probe head 60 are joined by a first press-fit pin 300A having one head 320 connected to the main body 310. The head 320 of the first press-fit pin 300A is exposed on the first sheet surface 311. The wiring sheet 30 and the wiring board 20 may be joined by a second press-fit pin 300B having one head 320 connected to the main body 310. The head 320 of the second press-fit pin 300B is exposed on the second sheet surface 312.

[0029] 5, the positions of the first press-fit pins 300A and the second press-fit pins 300B do not have to overlap in a plan view seen from the normal direction of the main surface of the wiring sheet 30. In other words, the positions of the press-fit pins 300 joining the wiring sheet 30 to the probe head 60 and the positions of the press-fit pins 300 joining the wiring sheet 30 to the wiring board 20 do not have to overlap in a plan view.

[0030] 6 shows the probe head 60, wiring sheet 30, and wiring board 20 shown in FIG. 5 in a separated state. As shown in FIG. 6, the body 310 of the first press-fit pin 300A is fitted into a through-hole formed in the wiring sheet 30. At this time, the head 320 of the first press-fit pin 300A is exposed on the first seat surface 311. The body 310 of the second press-fit pin 300B is fitted into a through-hole formed in the wiring sheet 30. At this time, the head 320 of the second press-fit pin 300B is exposed on the second seat surface 312. Next, the first seat surface 311 of the wiring sheet 30 and the probe head 60 are brought close to each other, and the head 320 of the first press-fit pin 300A is fitted into the first recess 620 of the probe head 60. Then, the second sheet surface 312 of the wiring sheet 30 and the wiring board 20 are brought close to each other, and the head 320 of the second press-fit pin 300B is fitted into the second recess 220 of the wiring board 20. As a result, the elastic force of the head 320 fixes the probe head 60 and the wiring sheet 30, and the wiring board 20 and the wiring sheet 30 are fixed together.

[0031] When the press-fit pin 300 has two heads 320, one head 320 is fitted into either the first recess 620 or the second recess 220, and then the other head 320 is fitted into the other recess. As a result, the head 320 that is fitted into the recess later may be slightly thinner than before. If the head 320 in this narrowed state is fitted into the recess, the joining force will be reduced. Because the press-fit pin 300 has only one head 320, the head 320 in a wide, expanded state can be fitted into both the second recess 220 and the first recess 620.

[0032] Furthermore, by using the press-fit pin 300 with one head 320, the degree of freedom in determining the position of the first recess 620 of the probe head 60 and the position of the second recess 220 of the wiring board 20 increases. For example, the second recess 220 can be formed so as to avoid the positions where the first electrode 21 and the second electrode 22 of the wiring board 20 are arranged and the position where the internal wiring 200 is arranged.

[0033] The placement locations of the press-fit pins 300 can be set arbitrarily as long as it does not affect the function of the electrical connecting device 1. For example, the press-fit pins 300 may be placed at the four corners of the wiring sheet 30, which is rectangular in plan view. Furthermore, the press-fit pins 300 may be placed at any position in addition to the four corners of the wiring sheet 30.

[0034] The press-fit pins 300 may be made of any material, but may be made of a metal material, for example. By using a metal press-fit pin 300, it is possible to bond the wiring sheet 30 to the probe head 60 and the wiring board 20 with a strong holding force. However, an insulating material may also be used for the press-fit pins 300. For example, when it is desired to ensure electrical insulation between the wiring sheet 30 and the probe head 60, or between the wiring sheet 30 and the wiring board 20, an insulating material may be used for the press-fit pins 300.

[0035] The head 320 of the press-fit pin may have any shape in plan view. For example, when viewed in the axial direction of the press-fit pin 300, the head 320 may be circular or star-shaped as shown in FIG.

[0036] When multiple press-fit pins 300 are arranged on the wiring sheet 30, the maximum value of the diameter perpendicular to the axial direction of the head portion 320 (hereinafter also referred to as the "maximum diameter") may be the same for all of the head portions 320. For example, the maximum diameters of all of the head portions 320 exposed on the first sheet surface 311 may be the same. Also, the maximum diameters of all of the head portions 320 exposed on the second sheet surface 312 may be the same. The maximum diameters of the head portions 320 exposed on the first sheet surface 311 of the wiring sheet 30 and the head portions 320 exposed on the second sheet surface 312 may be the same.

[0037] On the other hand, the heads 320 exposed on the first sheet surface 311 and the heads 320 exposed on the second sheet surface 312 may have different maximum diameters. For example, the maximum diameter of the heads 320 exposed on the first sheet surface 311 may be larger than the maximum diameter of the heads 320 exposed on the second sheet surface 312. This makes it possible to ensure that, when the first recess 620 and the second recess 220 have the same inner diameter, the bonding force between the first recess 620 and the heads 320 is larger than the bonding force between the second recess 220 and the heads 320. As a result, when the wiring sheet 30 is removed from the wiring board 20, the heads 320 of all the press-fit pins 300 remain fitted in the probe head 60. In other words, there are no press-fit pins 300 with their heads 320 fitted in the wiring board 20.

[0038] Alternatively, the maximum diameter of the head portion 320 exposed on the second sheet surface 312 may be larger than the maximum diameter of the head portion 320 exposed on the first sheet surface 311. As a result, when the inner diameters of the first recess 620 and the second recess 220 are the same, the bonding force generated between the second recess 220 and the head portion 320 is larger than the bonding force generated between the first recess 620 and the head portion 320. As a result, when the probe head 60 is removed from the wiring sheet 30, the head portions 320 of all the press-fit pins 300 can be fitted into the wiring board 20. In other words, there are no press-fit pins 300 whose head portions 320 are fitted into the probe head 60.

[0039] As described above, the maximum diameter of the head 320 exposed on the first sheet surface 311 is different from the maximum diameter of the head 320 exposed on the second sheet surface 312, so that the head 320 of the press-fit pin 300 can be fitted into only one of the probe head 60 or the wiring board 20. This causes the wiring sheet 30 to be pulled in two directions by the press-fit pin 300 whose head 320 is fitted into the probe head 60 and the press-fit pin 300 whose head 320 is fitted into the wiring board 20, and prevents the film on the surface of the wiring sheet 30 from peeling off.

[0040] Furthermore, when the maximum diameters of the heads 320 exposed on the first sheet surface 311 and the heads 320 exposed on the second sheet surface 312 are the same, the inner diameter of the first recess 620 formed in the probe head 60 and the inner diameter of the second recess 220 formed in the wiring board 20 may be different. For example, the inner diameter of the first recess 620 may be smaller than the inner diameter of the second recess 220. This makes the bonding force generated between the first recess 620 and the heads 320 greater than the bonding force generated between the second recess 220 and the heads 320. As a result, when the wiring sheet 30 is removed from the wiring board 20, the heads 320 of all the press-fit pins 300 can be fitted into the probe head 60.

[0041] Alternatively, the inner diameter of the second recess 220 may be smaller than the inner diameter of the first recess 620. This makes the joining force generated between the second recess 220 and the head 320 greater than the joining force generated between the first recess 620 and the head 320. As a result, when the probe head 60 is removed from the wiring sheet 30, the heads 320 of all the press-fit pins 300 can be fitted into the wiring board 20.

[0042] As described above, the inner diameter of the first recess 620 and the inner diameter of the second recess 220 are different, so that the head 320 of the press-fit pin 300 can be fitted into only one of the probe head 60 or the wiring board 20. This prevents the wiring sheet 30 from being pulled in two directions by the press-fit pin 300 whose head 320 is fitted into the probe head 60 and the press-fit pin 300 whose head 320 is fitted into the wiring board 20, and prevents the film on the surface of the wiring sheet 30 from peeling off.

[0043] The wiring sheet 30 may have a structure in which a conductive film and an insulating film are laminated. For example, an internal circuit may be formed by a conductive pattern formed on the conductive film. FIG. 8 shows an example of the structure of the wiring sheet 30. The wiring sheet 30 shown in FIG. 8 has a structure in which a laminate of a conductive film 302 and an insulating film 303 is sandwiched between a pair of cover films 301 made of an insulating material. The number of laminates of conductive films 302 and insulating films 303 can be set as desired. The conductive film 302 may be made of a metal material such as copper foil. The insulating film 303 may be made of an insulating material such as a polyimide sheet. The cover film 301 may be made of an insulating material such as a solder resist. An adhesive may be used to bond the conductive film 302, the insulating film 303, and the cover film 301 to each other. The wiring sheet 30 may have a structure in which an insulating film (also referred to as a "base film") is further sandwiched between the laminates including the conductive film 302 and the insulating film 303.

[0044] The wiring sheet 30 may be selected from a plurality of wiring sheet candidates. Each of the wiring sheet candidates has a first connection portion 31 arranged on a first sheet surface 311, a second connection portion 32 arranged on a second sheet surface 312, and an internal circuit. Each of the wiring sheet candidates may include an internal circuit having a different configuration from the other wiring sheet candidates. One wiring sheet 30 selected from the plurality of wiring sheet candidates may be configured to be detachable between the probe head 60 and the wiring board 20.

[0045] An example of the configuration of the wiring sheet candidates included in the wiring sheet group will be described below. In the following, when each of the wiring sheet candidates is not limited, it will be referred to as the wiring sheet 30.

[0046] An internal circuit of any of the wiring sheets 30 included in the wiring sheet group may include a circuit (hereinafter also referred to as an "interposer circuit") that electrically connects first connection portion 31 and second connection portion 32. For example, when an interposer circuit is formed on wiring sheet 30 having the structure shown in Fig. 8, wiring is formed that penetrates cover film 301, conductive film 302, and insulating film 303 from first sheet surface 311 to second sheet surface 312 of wiring sheet 30.

[0047] When the internal circuit of wiring sheet 30 includes an interposer circuit, the internal circuit of wiring sheet 30 may include a circuit that short-circuits first connection portion 31 and second connection portion 32, as shown in Fig. 9. In the internal circuit of wiring sheet 30 shown in Fig. 9, first connection portion 31 and second connection portion 32 are electrically short-circuited by short-circuiting wiring 331.

[0048] By attaching the wiring sheet 30 shown in FIG. 9 to the electrical connecting device 1, the probes 10 and the wiring pattern 400 of the printed circuit board 40 are short-circuited via the internal circuit of the wiring sheet 30. As a result, the DUT 2 and the testing device are electrically connected. This allows an electrical signal to be transmitted between the testing device, such as an IC tester, and the DUT 2, thereby measuring the characteristics of the DUT 2. For example, the internal circuit of the wiring sheet 30 connects the first connecting portions 31 and the second connecting portions 32 one-to-one. Alternatively, the internal circuit may connect one first connecting portion 31 to multiple second connecting portions 32, or multiple first connecting portions 31 to one second connecting portion 32.

[0049] When the internal circuit of wiring sheet 30 includes an interposer circuit, the internal circuit may include a matching circuit 332 having a first terminal connected to first connection portion 31 and a second terminal connected to second connection portion 32, as shown in Fig. 10. Matching circuit 332 may be a circuit that matches impedance between first connection portion 31 and second connection portion 32. For example, matching circuit 332 may include a π-type filter.

[0050] The internal circuit of wiring sheet 30 may include a circuit that electrically connects one of first connection portions 31 to another of first connection portions 31. In other words, the internal circuit of wiring sheet 30 may include a circuit (hereinafter also referred to as a "loopback circuit") that electrically connects the output terminal and input terminal of device under test 2. The loopback circuit electrically connects two signal terminals of device under test 2.

[0051] For example, as shown in Fig. 11 , the internal circuit of the wiring sheet 30 may include a circuit that short-circuits one of the first connection portions 31 and another one of the first connection portions 31. In the internal circuit of the wiring sheet 30 shown in Fig. 11 , one first connection portion 31 and another one of the first connection portions 31 are electrically short-circuited by a loopback wiring 333. By attaching the wiring sheet 30 shown in Fig. 11 to the electrical connection device 1, one of the probes 10 and another one of the probes 10 are short-circuited via the internal circuit of the wiring sheet 30. As a result, one signal terminal of the test object 2 and another one of the signal terminals are electrically connected.

[0052] FIG. 12 shows a configuration in which a first signal terminal 2A of the DUT 2, which one of the probes 10 contacts, and a second signal terminal 2B of the DUT 2, which another of the probes 10 contacts, are electrically connected via a loopback wiring 333 on the wiring sheet 30. For example, if the DUT 2 is a receiving circuit, the first signal terminal 2A is the output terminal of the DUT 2, and the second signal terminal 2B is the input terminal of the DUT 2, a transmission test can be performed by returning the output from the DUT 2 to the input. In other words, it is possible to test whether the output and input sections of the DUT 2 are functioning normally, even without the presence of a device to transmit to. For example, as a test similar to a jitter tolerance test performed on a receiving circuit, an output signal output from the first signal terminal 2A (output terminal) can be input as an input signal to the second signal terminal 2B (input terminal) to check whether a specified error rate is maintained.

[0053] When the internal circuit of wiring sheet 30 includes a loopback circuit, the internal circuit may include a circuit including capacitor 34 connected in series between one of first connection portions 31 and another of first connection portions 31, as shown in Fig. 13. One terminal of capacitor 34 is connected to one of first connection portions 31, and the other terminal of capacitor 34 is connected to the other of first connection portions 31. Capacitor 34 may be a capacitor formed using a semiconductor manufacturing process (hereinafter also referred to as a "process capacitor"), or the like.

[0054] Furthermore, the internal circuit of the wiring sheet 30 may include a relay circuit that switches one of the first connection portions 31 to be electrically connected to either one of the second connection portions 32 or another of the first connection portions 31. For example, the internal circuit shown in Fig. 14 includes a relay circuit 334 that constitutes either an interposer circuit that connects the first connection portions 31 and the second connection portions 32, or a loopback circuit that connects the first connection portions 31 to each other.

[0055] 14 constitutes an interposer circuit, the first contact terminal 334a and the second contact terminal 334b ​​are connected, and the third contact terminal 334c and the fourth contact terminal 334d are connected. This electrically connects the first connecting portion 31 and the second connecting portion 32. When the relay circuit 334 constitutes a loopback circuit, the first contact terminal 334a and the common contact terminal 334e of the relay circuit 334 are connected, and the third contact terminal 334c and the common contact terminal 334e are connected. This electrically connects one of the first connecting portions 31 and another of the first connecting portions 31.

[0056] Although examples of the internal circuit of wiring sheet 30 have been described with reference to Figures 9 to 14, the configuration of the internal circuit is not limited to the above. For example, the internal circuit may include an inductor instead of capacitor 34 shown in Figure 13, or the internal circuit may include both a capacitor and an inductor. In other words, the internal circuit of wiring sheet 30 may include a passive circuit including any element. Furthermore, the internal circuit may include a switching circuit using a diode or the like instead of relay circuit 334 shown in Figure 14.

[0057] The elements included in the internal circuit of wiring sheet 30 may be formed using, for example, a MEMS (Micro Electro Mechanical Systems) process. By using the MEMS process, miniaturized elements can be formed integrally with wiring sheet 30.

[0058] As described above, with the electrical connection device 1, various circuit configurations such as those shown in FIGS. 9 to 14 can be realized in the electrical connection device 1 simply by replacing the wiring sheet 30. Therefore, multiple types of measurements can be performed on the inspection target 2 using the electrical connection device 1. For example, a DC test can be performed on the inspection target 2 by mounting the wiring sheet 30 including an internal circuit that shorts the first connection portion 31 and the second connection portion 32 on the electrical connection device 1. Furthermore, a high-frequency test can be performed on the inspection target 2 by mounting the wiring sheet 30 including an internal circuit that includes a matching circuit or a loopback circuit on the electrical connection device 1.

[0059] 14, the electrical connection device 1 can shorten the wiring length of the interposer circuit and the loopback circuit compared to when a relay element is arranged on the printed circuit board 40 by arranging the relay circuit 334 on the wiring sheet 30. As a result, the electrical connection device 1 can shorten the propagation path of the electrical signal, thereby suppressing loss and noise of the electrical signal.

[0060] 10, the electrical connecting device 1 can shorten the wiring connected to the matching circuit 332 by arranging the matching circuit 332 on the wiring sheet 30. For example, since the matching circuit 332 can be arranged in close proximity to the wiring for which impedance matching is desired, impedance matching can be performed effectively.

[0061] By detachably disposing wiring sheet 30, which includes an internal circuit capable of configuring any of the above-described circuits, between wiring board 20 and printed circuit board 40, it is possible to configure any measurement system for electrical connecting device 1. As a result, electrical connecting device 1 can measure the characteristics of object under test 2 with high accuracy.

[0062] Furthermore, according to the electrical connecting device 1, by disposing the wiring sheet 30, which is flexible in the thickness direction, between the probe head 60 and the wiring board 20, the wiring sheet 30 can absorb warping and unevenness on the surfaces of the probe head 60 and the wiring board 20. This makes it possible to suppress rattles and poor contacts of the electrical connecting device 1 caused by gaps that occur between the probe head 60 and the wiring board 20.

[0063] Furthermore, the electrical connection device 1 allows electronic components electrically connected to the internal circuit to be arranged on the surface of the wiring sheet 30. For example, as shown in FIG. 15 , electronic components 100 connected to the internal circuit of the wiring sheet 30 may be arranged on each of the first sheet surface 311 and the second sheet surface 312. The electronic components 100 may be, for example, capacitors, inductors, or resistors. While FIG. 15 shows an example in which electronic components 100 are arranged on each of the first sheet surface 311 and the second sheet surface 312, the electronic components 100 may also be arranged on either the first sheet surface 311 or the second sheet surface 312. By arranging the electronic components 100 on the surface of the wiring sheet 30, it is possible to reduce or divide the electronic components arranged on, for example, the wiring board 20 or the printed circuit board 40. Furthermore, by arranging the electronic components on the surface of the wiring sheet 30, it is possible to shorten the wiring length between the test object 2 and the electronic components. Therefore, for example, by arranging electronic components such as capacitors that reduce power supply noise on the wiring sheet 30, measurements of the test object 2 can be performed stably.

[0064] Note that when electronic components 100 are placed on the surface of wiring sheet 30, there is a possibility that the end of wiring sheet 30 that protrudes outside probe head 60 in plan view may droop downward. For this reason, as shown in FIG. 16 , the outer edge of wiring board 20 may be positioned outward from the outer edge of wiring sheet 30 in plan view. Then, by placing press-fit pins 300 that join wiring sheet 30 and wiring board 20 outside electronic components 100 placed on wiring sheet 30, it is possible to prevent the end of wiring sheet 30 from drooping. Note that while FIG. 16 shows an example in which press-fit pins 300 with one head 320 are used to join probe head 60 and wiring sheet 30, press-fit pins 300 with two heads 320 may also be used to join probe head 60 and wiring sheet 30.

[0065] As described above, the electrical connecting device 1 uses press-fit pins 300 to join the probe head 60 to the wiring sheet 30 and to join the wiring board 20 to the wiring sheet 30. Therefore, with the electrical connecting device 1, it is easier to attach and detach the probe head 60 to and from the wiring sheet 30 than when the probe head 60, wiring sheet 30, and wiring board 20 are joined by screws. This makes it easier to replace the wiring sheet 30.

[0066] Furthermore, by using the press-fit pins 300 instead of screws, there is no need to process the screw holes, making it easier to manufacture the electrical connecting device. Since the inner diameters of the first recess 620 and the second recess 220 are made smaller than the inner diameter of the screw holes, damage to the probe head 60 and the wiring board 20 during processing can be reduced.

[0067] Furthermore, by using the press-fit pin 300, it is possible to use the second recess 220, which has an inner diameter smaller than that of the screw hole. This improves the degree of freedom in arranging the electrodes and wiring of the wiring board 20. Furthermore, since the difference in the size of the inner diameter between the screw hole and the recess makes it easier for the wiring board 20 to trap heat inside, it is possible to increase the heat capacity.

[0068] (Other embodiments) Although the present invention has been described above by way of the preferred embodiment, the descriptions and drawings that form part of this disclosure should not be understood as limiting the present invention. From this disclosure, various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art.

[0069] For example, wiring sheet 30 may include an internal circuit that combines multiple types of circuit configurations. For example, wiring sheet 30 may include an internal circuit that combines short-circuit wiring 331 and matching circuit 332. Or, wiring sheet 30 may include an internal circuit that combines an interposer circuit and a loopback circuit. For example, the internal circuit may include short-circuit wiring 331, matching circuit 332, and loopback wiring 333, or may further include relay circuit 334. Or, the loopback circuit may include matching circuit 332. In this way, any circuit can be configured as the internal circuit of wiring sheet 30.

[0070] As described above, by mounting a wiring sheet 30 including an internal circuit with a mixture of arbitrary circuit configurations on the electrical connecting device 1, multiple types of measurements can be performed on the object to be inspected 2 using a single wiring sheet 30.

[0071] In the above description, the case has been described in which the inspection terminals that come into contact with the signal terminals of the DUT 2 are probes 10. When the inspection terminals are probes 10, it is possible to measure the electrical characteristics of the DUT 2 in a state where it is not separated from the wafer or in a state where it is formed into a chip. On the other hand, in order to measure the electrical characteristics of the DUT 2 mounted in a package or the like, a wiring sheet 30 may be mounted on an electrical connection device that includes a test socket. For example, instead of probes 10 of the electrical connection device 1 shown in FIG. 1 , a test socket in which inspection terminals that can be connected to external terminals of a package in which the DUT 2 is mounted may be arranged on wiring sheet 30.

[0072] As such, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined only by the invention-specifying matters according to the scope of the claims that are appropriate from the above description. [Explanation of symbols]

[0073] 1 Electrical connection device 2. Inspection object 10 probes 11 Tip 12 Proximal end 20 Wiring board 21 1st electrode 22 2nd electrode 30 Wiring sheet 31 First connection part 32 Second connection part 40 Printed Circuit Board 41 First end 42 Second end 50 Stiffna 60 probe head 100 Electronic Components 200 Internal wiring 220 Second recess 300 Press-fit pins 310 Main body 311 First seat surface 312 Second seat surface 320 Head 321 First Head 322 Second Head 400 Wiring Pattern 620 First recess

Claims

1. An electrical connection device used for inspecting an object to be inspected, an inspection terminal having a tip end portion arranged so as to be able to come into contact with the object under test and a base end portion connected to the tip end portion; a probe head that holds the terminals for inspection; a flexible wiring sheet including a first connection portion disposed on a first sheet surface facing the probe head and a second connection portion disposed on a second sheet surface facing in a direction opposite to the first sheet surface; a wiring board including a first electrode disposed opposite the second sheet surface and electrically connected to the second connection portion; Equipped with a main body of a press-fit pin having a head portion that is elastically deformable in a direction perpendicular to an axial direction is embedded in the wiring sheet, and the head portion is exposed on at least one of the first sheet surface and the second sheet surface; the heads of the press-fit pins exposed on the first sheet surface are fitted into recesses formed in the probe head, and the probe head is fixed to the wiring sheet; the heads of the press-fit pins exposed on the second sheet surface are fitted into recesses formed in the wiring board, and the wiring board is fixed to the wiring sheet. Electrical connection device.

2. The press-fit pin is the main body portion penetrates the wiring sheet from the first sheet surface to the second sheet surface; a first head portion connected to one end of the main body portion is exposed on the first sheet surface; a second head portion connected to the other end of the main body portion and exposed to the second sheet surface; 2. The electrical connecting device according to claim 1.

3. 2. The electrical connecting device according to claim 1, wherein the head portion connected to the body portion of one of the press-fit pins is exposed on only one of the first seat surface and the second seat surface.

4. 4. The electrical connecting device according to claim 1, wherein the press-fit pin is made of a metal material.

5. 4. The electrical connecting device according to claim 1, wherein the head portion of the press-fit pin is star-shaped when viewed in the axial direction of the press-fit pin.

6. 4. The electrical connecting device according to claim 1, wherein an outer edge of the wiring board is positioned outside an outer edge of the wiring sheet in a plan view.

7. 4. The electrical connecting device according to claim 1, wherein a maximum diameter of the head portion exposed on the first sheet surface is different from a maximum diameter of the head portion exposed on the second sheet surface.

8. an inner diameter of the recess formed in the probe head is different from an inner diameter of the recess formed in the wiring substrate; 4. The electrical connecting device according to claim 1.

9. 4. The electrical connecting device according to claim 1, wherein the wiring sheet has a structure in which a laminate of a conductive film and an insulating film is sandwiched between cover films made of an insulating material.

10. the wiring substrate includes a second electrode electrically connected to the first electrode via an internal wiring; 4. The electrical connecting device according to claim 1, further comprising a printed circuit board disposed opposite said wiring board and having a wiring pattern connected to said second electrodes.

11. 11. The electrical connecting device according to claim 10, wherein the wiring board is a space transformer that converts the spacing between the terminals for inspection into the spacing between the wiring patterns of the printed circuit board when viewed in a normal direction of the main surface of the wiring board.

12. 4. The electrical connecting device according to claim 1, wherein the terminals for inspection are probes, the tip ends of which are arranged so as to be able to come into contact with signal terminals of the device under test, and the base ends of which are connected to the first connection portions of the wiring sheet.

13. 4. The electrical connecting device according to claim 1, wherein the terminals for inspection are arranged in a test socket that connects to external terminals of a package in which the device under test is mounted.

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