Mounting device, mounting method, and mounting control program

Abstract

To provide a mounting apparatus or the like capable of accurately and quickly aligning a mounting body such as a semiconductor chip with respect to a mounted object such as a substrate, and mounting the mounting body at a target position on the mounted object with high accuracy in a short time.SOLUTION: A mounting device comprises: a mounting tool configured to acquire and hold a mounting body; a first imaging unit and a second imaging unit each having a field of view of viewing a stage from a side of a mounting tool, in which an optical system and an imaging element are disposed so as to satisfy a Scheimpflug condition such that a plane corresponding to a stage surface of the stage is a focal plane, and which images a mounted body index and a mounting body index specified in the field of view; a calculation part that calculates a relative position between the mounted body index and the mounting body index from a first image output from the first imaging unit and a second image output from the second imaging unit; and a mounting control part that corrects a position of the mounting body based on a calculation result of the calculation part and places the mounting body on the mounted body.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus, a mounting method, and a mounting control program. [Background technology]

[0002] In a bonding machine, which is an example of a conventional mounting machine, a camera first captures an image of a workpiece, such as a die pad, from directly above to confirm its position. Then, the camera is retracted and the head unit supporting the mounting tool is moved directly above the workpiece to perform the bonding operation. Bonding machines employing this type of configuration not only require a long operation time, but also suffer from the problem of accumulated movement errors relative to the target work position. To address this issue, the use of an imaging unit employing a Scheimpflug optical system that can capture an image of the workpiece from an oblique direction has become an option (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-179560 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional bonding devices using an imaging unit that employs a Scheimpflug optical system, images of the substrate, such as a board, and the mounted object, such as a semiconductor chip, are taken separately. The relative positions of the substrate and the semiconductor chip are then determined based on the images of the substrate and the semiconductor chip captured in the separate images. This resulted in low accuracy in aligning the semiconductor chip with the substrate, and required a long time for this alignment.

[0005] The present invention has been made to solve such problems, and provides a mounting device, a mounting method, and a mounting control program that can accurately and quickly align a mounting body such as a semiconductor chip with a mounting object such as a substrate, and can mount the mounting body at a target position on the mounting object with high precision and in a short time. [Means for solving the problem]

[0006] The mounting device in a first aspect of the present invention comprises a mounting tool that acquires and holds a mounted body, a first imaging unit and a second imaging unit that have a field of view overlooking the stage from the mounting tool side, and in which the respective optical systems and imaging elements are arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage is the focal plane, and that capture images of a mounted body index and a mounted body index identified within the field of view, a calculation unit that calculates the relative position between the mounted body index and the mounted body index from a first image output from the first imaging unit and a second image output from the second imaging unit, and a mounting control unit that corrects the position of the mounted body based on the calculation result of the calculation unit and places the mounted body on the mounted body.

[0007] In addition, a mounting method in a second aspect of the present invention is a mounting method for a mounted body using a mounting device that includes a mounting tool that acquires and holds a mounted body, and a first imaging unit and a second imaging unit that have a field of view that overlooks the stage from the mounting tool side, and whose respective optical systems and imaging elements are arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage becomes the focal plane, and includes an imaging step of imaging a mounted body index and a mounted body index identified within the field of view with the first imaging unit and the second imaging unit, a calculation step of calculating the relative position between the mounted body index and the mounted body index from a first image output from the first imaging unit and a second image output from the second imaging unit, and a mounting control step of correcting the position of the mounted body based on the calculation result of the calculation unit and placing the mounted body on the mounted body.

[0008] In addition, a mounting control program in a third aspect of the present invention is a mounting control program that controls a mounting device that includes a mounting tool that acquires and holds a mounted body, and a first imaging unit and a second imaging unit that have a field of view that overlooks a stage from the mounting tool side, and whose respective optical systems and imaging elements are arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage is the focal plane, and causes a computer to execute an imaging step of imaging a mounted body index and a mounted body index identified within the field of view with the first imaging unit and the second imaging unit, a calculation step of calculating the relative position between the mounted body index and the mounted body index from a first image output from the first imaging unit and a second image output from the second imaging unit, and a mounting control step of correcting the position of the mounted body based on the calculation result of the calculation unit and placing the mounted body on the mounted body. [Effects of the Invention]

[0009] The present invention can provide a mounting device or the like that can accurately and quickly align a mounting body such as a semiconductor chip with a mounting body such as a substrate, and can place and mount the mounting body at a target position on the mounting body with high precision and in a short time. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view schematically illustrating a main part of a mounting device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a system configuration diagram of the mounting device. [Figure 3] FIG. 2 is an explanatory diagram for explaining a Scheimpflug optical system. [Figure 4] FIG. 10 is an explanatory diagram illustrating an example of a holding portion. [Figure 5] FIG. 2 is an explanatory diagram for explaining a first image and a second image. [Figure 6] FIG. 2 is an explanatory diagram for explaining the principle of calculating three-dimensional coordinates. [Figure 7] FIG. 4 is a flowchart illustrating a processing procedure of a calculation processing unit. [Figure 8] 10A and 10B are explanatory diagrams for explaining modified examples of the holding portion. [Figure 9] 10A and 10B are explanatory diagrams for explaining modified examples of the holding portion. [Figure 10] FIG. 10 is an explanatory diagram for explaining a modified example of a mounting body index. [Figure 11] FIG. 10 is an explanatory diagram for explaining a modified example of a mounting body index. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems. In each drawing, when there are multiple structures with the same or similar configurations, some may be given reference numerals and other identical reference numerals may be omitted to avoid complication.

[0012] FIG. 1 is a perspective view schematically illustrating a main part of a mounting apparatus 100 according to this embodiment. The mounting apparatus 100 is a bonding apparatus that places and bonds a semiconductor chip 310 to a bonding area 320 of a substrate 330. The substrate 330 is an example of an object to be mounted that is placed on a stage 220. The bonding area 320 is an area corresponding to the bonding surface of the semiconductor chip 310 and has, for example, electrodes that bond to and conduct electricity with bumps formed on the bonding surface. The semiconductor chip 310 is an example of a mounting body. Note that in FIG. 1, the semiconductor chip 310 is separated from the bonding area 320. The substrate 330 is, for example, a lead frame. The bonding area 320 is, for example, a die pad.

[0013] The mounting apparatus 100 mainly comprises a head unit 110, a mounting tool 120, a first imaging unit 130, and a second imaging unit 140. The head unit 110 supports the mounting tool 120, the first imaging unit 130, and the second imaging unit 140, and is movable in the height direction and the planar direction by a head drive motor 150. As shown in the figure, the height direction is the Z-axis direction, which is perpendicular to the planar direction. As shown in the figure, the planar direction is the horizontal direction defined by the X-axis direction and the Y-axis direction, and is also the direction of movement of a stage 220 placed on a mount 210.

[0014] The mounting tool 120 has a holder 121 at its tip on the stage 220 side. The mounting tool 120 sucks the semiconductor chip 310 via the holder 121, places it on the bonding area 320 of the substrate 330 placed on the stage 220, and bonds it by applying pressure and heat. The mounting tool 120 can be moved in the height direction relative to the head unit 110 by a tool drive motor 160.

[0015] The first imaging unit 130 is an imaging unit for capturing images of the semiconductor chip 310 and the substrate 330 located below the mounting tool 120, and includes a first optical system 131 and a first imaging element 132. As will be described in detail later, the first imaging unit 130 is obliquely mounted on the head unit 110 with its optical axis directed downward toward the mounting tool 120. That is, the first imaging unit 130 has a field of view that overlooks the stage from the mounting tool 120 side. The first optical system 131 and the first imaging element 132 are arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage 220 is the focal plane. An example of the plane corresponding to the stage surface of the stage 220 is a plane parallel to the stage surface of the stage 220.

[0016] The second imaging unit 140 is an imaging unit for capturing images of the semiconductor chip 310 and the substrate 330 located below the mounting tool 120, and includes a second optical system 141 and a second imaging element 142. As will be described in detail later, the second imaging unit 140 is obliquely mounted on the head unit 110 on the opposite side of the mounting tool 120 from the first imaging unit 130, with its optical axis pointing downward below the mounting tool 120. In other words, the second imaging unit 140 has a field of view that overlooks the stage from the mounting tool 120 side. The second optical system 141 and the second imaging element 142 are arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage 220 is the focal plane. An example of the plane corresponding to the stage surface of the stage 220 is a plane parallel to the stage surface of the stage 220.

[0017] The semiconductor chip 310 has a mounting body index 311 for identifying the position of the semiconductor chip 310. The substrate 330 also has a mounted body index 331 for identifying the position where the semiconductor chip 310 is to be placed and mounted. The mounting body index 311 and the mounted body index 331 are reference indices that serve as reference marks. The mounting body index 311 may be a dedicated reference mark provided by printing or groove, or may be an observable wiring pattern or edge on the held surface 312, as long as three-dimensional coordinates can be calculated stably. The mounted body index 331 may be a dedicated reference mark provided by printing or engraving, or may be an observable wiring pattern, groove, edge, or other object on the bonding region 320, as long as three-dimensional coordinates can be calculated stably. The mounting body index 311 and the mounted body index 331 have different shapes in order to distinguish them from each other in the first and second images described below. In this embodiment, the three-dimensional coordinates are calculated based on the XYZ coordinate system, which is a spatial coordinate system with the origin at the reference position of the head unit 110. When the mounting body index 311 and the mounted body index 331 are imaged by the first imaging unit 130 and the second imaging unit 140, they are within the fields of view of the first imaging unit 130 and the second imaging unit 140.

[0018] 2 is a system configuration diagram of the mounting apparatus. The control system of the mounting apparatus 100 is mainly composed of an arithmetic processing unit 170, a storage unit 180, an input / output device 190, a first imaging unit 130, a second imaging unit 140, a head drive motor 150, and a tool drive motor 160. The arithmetic processing unit 170 is a processor (CPU: Central Processing Unit) that controls the mounting apparatus 100 and executes programs. The processor may be configured to work in conjunction with an arithmetic processing chip such as an ASIC (Application Specific Integrated Circuit) or a GPU (Graphics Processing Unit). The arithmetic processing unit 170 reads out a position control program stored in the storage unit 180 and executes various processes related to position control.

[0019] The storage unit 180 is a non-volatile storage medium, and is configured, for example, by an HDD (Hard Disk Drive). The storage unit 180 can store various parameter values, functions, lookup tables, and the like used for control and calculation, in addition to programs for controlling and executing processes of the mounting apparatus 100. The storage unit 180 particularly stores a conversion table 181. The conversion table 181, which will be described in detail later, is a lookup table that converts input coordinate values ​​of a mounting body index 311 shown in the first image and a mounting body index 311 shown in the second image into three-dimensional coordinates (X1, Y1, Z1) of the mounting body index 311, and converts input coordinate values ​​of a mounted body index 331 shown in the first image and a mounted body index 331 shown in the second image into three-dimensional coordinates (X2, Y2, Z2) of the mounted body index 331.

[0020] The input / output device 190 includes, for example, a keyboard, a mouse, and a display monitor, and is a device that accepts menu operations by the user and presents information to the user. For example, the arithmetic processing unit 170 may display the first image and the second image side by side on a display monitor, which is one of the input / output devices 190.

[0021] The first imaging unit 130 receives an imaging request signal from the arithmetic processing unit 170, specifically from the image acquisition unit 171 described below, performs imaging, and transmits the first image output by the first imaging element 132 as an image signal to the arithmetic processing unit 170. Similarly, the second imaging unit 140 receives an imaging request signal from the arithmetic processing unit 170, performs imaging, and transmits the second image output by the second imaging element 142 to the image acquisition unit 171 as an image signal.

[0022] The head drive motor 150 receives a drive signal from the arithmetic processing unit 170, specifically from a mounting control unit 173 (described later), to move the head unit 110 in the X, Y, and Z directions. The tool drive motor 160 receives a drive signal from the mounting control unit 173 to move the bonding tool 120 in the Z direction.

[0023] The arithmetic processing unit 170 also serves as a functional calculation unit that executes various calculations in accordance with the processing instructed by the position control program. The arithmetic processing unit 170 can function as an image acquisition unit 171, a calculation unit 172, and an implementation control unit 173. The image acquisition unit 171 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140, and acquires an image signal of the first image and an image signal of the second image.

[0024] The calculation unit 172 calculates the relative position between the mounting unit index 311 and the mounted unit index 331 by referring to the mounting unit index 311 and the mounted unit index 331 that appear in the first image and the second image, respectively. The calculation unit 172 may calculate the relative position, for example, by the following method. That is, the three-dimensional coordinates (X1, Y1, Z1) of the mounting unit index 311 and the three-dimensional coordinates (X2, Y2, Z2) of the mounted unit index 331 are calculated. Specifically, the conversion table 181 is used to obtain the three-dimensional coordinates (X1, Y1, Z1) and (X2, Y2, Z2). Then, the calculation unit 172 calculates the relative position between the mounting unit index 311 and the mounted unit index 331 by using both the three-dimensional coordinates. Specifically, the calculation unit 172 calculates the relative position of the mounted unit index 331 relative to the mounting unit index 311 or the relative position of the mounted unit index 311 relative to the mounted unit index 331.

[0025] Furthermore, as will be described in detail later, the mounting body index 311 is provided so that the calculation unit 172 can identify the orientation of the semiconductor chip 310 in the planar direction. The calculation unit 172 calculates the actual orientation of the semiconductor chip 310 in the planar direction by referring to the mounting body index 311 shown in each of the first image and the second image. Then, the calculation unit 172 calculates the angle difference between the calculated actual orientation and the desired orientation of the semiconductor chip 310.

[0026] The mounting control unit 173 generates a drive signal for driving the head drive motor 150 and a drive signal for driving the tool drive motor 160, and transmits these signals to the respective motors to perform mounting control. For example, the calculation unit 172 calculates the three-dimensional coordinates (X1, Y1, Z1) of the mounting body index 311 and the three-dimensional coordinates (X2, Y2, Z2) of the mounted body index 331, and calculates the relative position between these two coordinates. Based on this relative position, the calculation unit 172 generates a drive signal for moving the semiconductor chip 310 closer to the bonding region 320 so as to bring the three-dimensional coordinates of the mounting body index 311 closer to the three-dimensional coordinates of the mounted body index 331, and transmits this drive signal to the tool drive monitor 160.

[0027] The mounting control unit 173 generates a drive signal for rotating the semiconductor chip 310 by the angle difference calculated by the calculation unit 172 so that the three-dimensional coordinates of the mounting body index 311 do not move from (X1, Y1, Z1). Then, the mounting control unit 173 transmits the drive signal to the tool drive monitor 160.

[0028] Fig. 3 is an explanatory diagram for explaining the Scheimpflug optical system. The Scheimpflug optical system explained in Fig. 3 is adopted in the first imaging unit 130 and the second imaging unit 140, but here, the Scheimpflug optical system of the first imaging unit 130 will be explained as a representative.

[0029] 3, plane S1 is the planned focal plane of the bonding region 320, which is arranged parallel to the stage surface of the stage 220. Virtual plane S2 is a plane that includes the principal plane of the first optical system 131, which is composed of an object-side lens group 131a and an image-side lens group 131b. Plane S3 is a plane that includes the light-receiving surface of the first image sensor 132. In this embodiment, the Scheimpflug optical system includes the first optical system 131 and the first image sensor 132, which are arranged so as to satisfy the Scheimpflug condition. An arrangement that satisfies the Scheimpflug condition is an arrangement in which plane S1, virtual plane S2, and virtual plane S3 intersect each other on a common straight line P.

[0030] In order to clearly explain the Scheimpflug condition, FIG. 3 shows the object-side lens group 131a and the bonding region 320 close to each other, but in reality, they are spaced apart as shown in FIG. 1. The mounting tool 120 can move in the Z-axis direction in the space above the bonding region 320 without interfering with the first imaging unit 130. In this embodiment, as will be described later, the first imaging unit 130 captures images of the mount assembly index 311 and the mountable assembly index 331 through the holding portion 121. Here, in FIG. 3, the holding portion 121 and the semiconductor chip 310 are omitted from the illustration in order to clearly explain the Scheimpflug condition. In reality, when the first imaging unit 130 captures images of the mount assembly index 311 and the mountable assembly index 331, the semiconductor chip 310 held by the holding portion 121 is close to the bonding region 320.

[0031] The aperture 133 is disposed between the object-side lens group 131a and the image-side lens group 131b, and limits the light beam passing through. The diameter of the aperture 133 determines the depth of field D P Therefore, for example, when the holder 121 for holding the semiconductor chip 310 is adjusted to have a depth of field D P The mounting body index 311 is at the depth of field D P When the first imaging unit 130 enters the interior, it can capture images of both the mounting body index 311 and the mounted body index 331 in a focused state.

[0032] The second imaging unit 140 has a configuration similar to that of the first imaging unit 130, and is disposed on the head part 110 symmetrically with respect to the YZ plane including the central axis of the mounting tool 120. Therefore, like the first imaging unit 130, the second imaging unit 140 can also capture images of both the mounting body index 311 and the mounted body index 331 in a focused state.

[0033] In this embodiment, double-sided telecentricity is achieved by the object-side lens group 131a and the image-side lens group 131b. This allows the object to be imaged on the image sensor at a constant magnification, which is convenient for calculating three-dimensional coordinates. In particular, in a Scheimpflug optical system, it is desirable to have object-side telecentricity, where the object on the side of line P and the object on the side farther from line P have the same magnification on the imaging plane.

[0034] Fig. 4 is a perspective view schematically showing the main parts of the holding part 121 according to this embodiment. The holding part 121 has a holding surface 122, a mounting body optical path region 123a, a mounted body optical path region 123b, and a suction tube 124. In Fig. 4, the semiconductor chip 310 is separated from the bonding region 320. The shaded areas indicate that the parts are made of a material that is not optically transparent.

[0035] The holding surface 122 is located at the tip of the holding part 121 on the stage 220 side. The holding surface 122 is a flat surface that holds the semiconductor chip 310. The shape of the holding surface 122 is not limited to a circular shape, and may be a polygonal shape such as a square or a triangle, or a shape in which part or all of the outer edge is curved.

[0036] The mounting body light path region 123a is a region in the holding portion 121 that passes the subject light beam L1 from the mounting body index 311 and reaches the first imaging element 132 and the second imaging element 142, respectively. The mounted body light path region 123b is a region in the holding portion 121 that passes the subject light beam L2 from the mounted body index 331 and reaches the first imaging element 132 and the second imaging element 142.

[0037] At least the mounting body optical path region 123 a and the mounted body optical path region 123 b of the holding unit 121 are made of a light-transmitting material. The light-transmitting material is not particularly limited, but examples thereof include glass such as quartz glass and resin such as acrylic resin.

[0038] The type of light-transmitting member is determined according to the first imaging element 132 and the second imaging element 142 employed in the first imaging unit 130 and the second imaging unit 140, respectively. When the light that can be detected by the first imaging element 132 and the second imaging element 142 is visible light, a member that transmits visible light is selected as the light-transmitting member. The light that can be detected by the first imaging element 132 and the second imaging element 142 is not limited to visible light, and may be, for example, ultraviolet light or infrared light.

[0039] Furthermore, the optically transparent member need only transmit light to an extent that the first imaging unit 130 and the second imaging unit described later can detect the subject light beams L1 and L2 from the mounted body index 311 and the mounted body index 331, and although there are no particular limitations, for example, the member may transmit 30% or more of light.

[0040] The suction pipe 124 is provided near the center of the holding portion 121 so as to penetrate the holding portion 121 in the height direction. The suction pipe 124 sucks the semiconductor chip 310 so that the holding surface 122 can hold the semiconductor chip 310.

[0041] The number of suction tubes 124 is not limited to one, and multiple suction tubes 124 may be provided. However, it is desirable that the suction tubes 124 be provided at positions that do not overlap with the mounting body optical path region 123a and the mounted body optical path region 123b. From this perspective, it is desirable that neither the mounting body optical path region 123a nor the mounted body optical path region 123b overlap with the suction tube 124, and that the regions of the holding section 121 other than these regions are made of a material that does not have optical transparency.

[0042] When the mounting control unit 173 moves the mounting tool 120 to cause the holder 121 to hold the semiconductor chip 310, the position of the semiconductor chip 310 in the holder 121 may be slightly deviated from the target position. In this case, too, it is necessary to enable the first imaging unit 130 and the second imaging unit 140 to observe the mounting body index 311 and the mounted body index 331 through the mounting body optical path region 123a and the mounted body optical path region 123b. Therefore, it is preferable that the mounting body optical path region 123a and the mounted body optical path region 123b are provided to have a certain degree of size, taking the above-mentioned deviation into consideration.

[0043] The semiconductor chip 310 is adsorbed and held on the holding surface 122 by the held surface 312. The mounting body index 311 is provided on the held surface 312. The holding surface 122 covers the entire held surface 312 and brings the held surface 312 into close contact with the held surface 312 so that the held surface 312 is parallel to the stage surface.

[0044] In this embodiment, the mounting assembly index 311 is provided so that the calculation unit 172 can identify the orientation of the semiconductor chip 310 in the horizontal direction. Specifically, the mounting assembly index 311 is a pattern provided by printing on the held surface 312, and the pattern has one-fold rotational symmetry. An example of a pattern with one-fold rotational symmetry is a cross-shaped mark in which two line segments extending along the x-axis and y-axis intersect with each other, and the lengths from the intersection of the two line segments to the four ends of the two line segments are all different. Alternatively, if two or more mounting assembly indexes 311 are provided, the calculation unit 172 can identify the orientation of the semiconductor chip 310 in the horizontal direction.

[0045] With the mounting control unit 173 bringing the semiconductor chip 310 close to the bonding region 320, the image acquisition unit 171 causes the first imaging unit 130 and the second imaging unit 140 to capture images of the mounting body index 311 and the mounted body index 331. Specifically, the mounting control unit 173 brings the semiconductor chip 310 close to the bonding region 320 so that both the semiconductor chip 310 and the bonding region 320 are within the overlapping range of the depth of field of the first imaging unit 130 and the second imaging unit 140.

[0046] In the mounting apparatus 100 of this embodiment, when adjusting the position of the semiconductor chip 310, the mounting control unit 173 brings the semiconductor chip 310 close to the bonding region 320. Then, the first imaging unit 130 and the second imaging unit 140 can each capture a single image of both the semiconductor chip 310 and the bonding region 320. As a result, the number of times each of the first imaging unit 130 and the second imaging unit 140 takes an image is minimized, and the position of the semiconductor chip 310 is adjusted in a short time. Furthermore, the mounting control unit 173 brings the semiconductor chip 310 close to the bonding region 320, and then adjusts the position of the semiconductor chip 310. Therefore, after this position adjustment, errors associated with the movement of the mounting tool 120 to place the semiconductor chip 310 at the target position are reduced, and the semiconductor chip 310 is placed in the bonding region 320 with high accuracy.

[0047] When the semiconductor chip 310 is placed on the bonding area 320, in order to reduce the error in the position where the semiconductor chip 310 is placed, the semiconductor chip 310 needs to be stably held by the holding part 121 so as to be horizontal with respect to the bonding area 320. From this viewpoint, when the semiconductor chip 310 is held by the holding part 121, it is preferable that the holding surface 122 be in close contact with the held surface 312 so as to cover the entire held surface 312.

[0048] However, when the mounting control unit brings the holding surface into close contact with the held surface of the semiconductor chip so that the holding surface covers the held surface, the mounting body index on the held surface is covered by the holding surface, making it impossible for the imaging unit to observe the mounting body index, which in turn makes it impossible for the calculation unit to calculate the three-dimensional coordinates of the semiconductor chip, and therefore makes it impossible for the mounting control unit to place the semiconductor chip at the target position on the bonding area.

[0049] Therefore, when the mounting control unit brings the holding surface into close contact with a partial area of ​​the semiconductor chip's surface, the imaging unit can observe the mounting body index on the surface, and the calculation unit can calculate the three-dimensional coordinates of the semiconductor chip. However, when the mounting control unit brings the holding surface into close contact with a partial area of ​​the semiconductor chip's surface, the semiconductor chip bends or tilts relative to the bonding area and is not held stably. As a result, when the mounting control unit places the semiconductor chip on the bonding area, there is a large error in the position of the semiconductor chip on the bonding area.

[0050] On the other hand, in the mounting device 100 of this embodiment, even if the mounting control unit 173 brings the holding surface 122 into close contact with the held surface 312 so that the holding surface 122 covers the entire held surface 312, the first imaging unit 130 and the second imaging unit 140 can capture images of the mounting body index 311 on the held surface 312. That is, the mounting device 100 of this embodiment can place the semiconductor chip 310 on the bonding area 320 in a state in which the semiconductor chip 310 is stably held by the holding unit 121 so that it is horizontal with respect to the bonding area 320. Therefore, in the mounting device 100 of this embodiment, the mounting control unit 173 can place the semiconductor chip 310 on the bonding area 320 with high precision.

[0051] FIG. 5 is an explanatory diagram for explaining the first image and the second image. The first image output from the first imaging unit 130 and the second image output from the second imaging unit 140 are focused on the mounting body index 311 and the mounted body index 331. On the other hand, since the first imaging unit 130 and the second imaging unit 140 are obliquely installed on the head part 110 with their optical axes pointing downwards of the mounting tool 120, the first image and the second image are distorted into a trapezoidal shape. Furthermore, the distortion of the first image and the distortion of the second image are symmetrical. Therefore, the coordinate value (x 1A , y 1A ) and the coordinate value (x 2A , y 2A ) is different from the coordinate value (x 1B , y 1B ) and the coordinate value (x 2B , y 2B ) is different from

[0052] 6 is an explanatory diagram for explaining the calculation principle of three-dimensional coordinates, and in particular, a diagram for explaining the procedure for generating the conversion table 181. First, the calculation principle of the three-dimensional coordinates (X2, Y2, Z2) of the mount object index 331 will be explained.

[0053] The conversion table 181 is generated as follows: First, a chart 400 having the same thickness as the substrate 330 is placed on the stage 220 directly below the mounting tool 120. Next, the mounting control unit 173 brings the head unit 110 close to the chart 400, and calculates the height Z of the head unit 110 from the stage 220 as follows: Z=h nThe distance between the head unit 110 and the chart 400 in this case is such that the chart 400 falls within the overlapping range of the depth of field of the first imaging unit 130 and the second imaging unit 140. Next, the mounting control unit 173 brings the holding unit 121 closer to the chart 400. The distance between the holding unit 121 and the chart 400 in this case is such that the holding surface 122 and the chart 400 fall within the overlapping range of the depth of field of the first imaging unit 130 and the second imaging unit 140. Next, in this state, the image acquisition unit 171 causes the first imaging unit 130 and the second imaging unit 140 to capture images of the chart 400 and causes the first imaging unit 130 and the second imaging unit 140 to output a first chart image and a second chart image, respectively. The conversion table 181 is generated using the first chart image and the second chart image.

[0054] A plurality of dots 410 are printed in a matrix at set intervals on the surface of the chart 400. The height Z of the head unit 110 is set as Z=h1, h2, h3, . . . h n and images of the chart 400 are captured at each height to obtain a pair of a first chart image and a second chart image.

[0055] Since the first imaging unit 130 and the second imaging unit 140 use a Scheimpflug optical system, the resulting chart image 400' is completely in focus, but each image is distorted into a trapezoid with opposite orientations. In the image coordinate system, the horizontal axis is the x-axis and the vertical axis is the y-axis, and the coordinates of the corresponding dot images 410' in the first chart image and the second chart image are expressed as follows: (x 1k ,y 1k ), (x 2k ,y 2k ) is calculated as follows:

[0056] The holding portion 121 appears in the first chart image and the second chart image. The first imaging unit 130 and the second imaging unit 140 detect the subject light beam of the dot 410A that passes through the holding portion 121 and the subject light beam of the dot 410B that passes only through the atmosphere without passing through the holding portion 121. In this embodiment, the first imaging unit 130 and the second imaging unit 140 detect the subject light beam L1 from the mounting object index 311 and the subject light beam L2 from the mounted object index 331 that pass through the holding portion 121. Therefore, a conversion table 181 is generated for the dot 410A.

[0057] For each dot 410 on the chart 400, the coordinates (X k ,Y k ) is known, and the height coordinate h k =Z K is adjusted during imaging, so the three-dimensional coordinates (X k ,Y k ,Z K ) is determined at the time of shooting. And the height coordinate h k The coordinates (x 1k ,y 1k ), (x 2k ,y 2k ) is calculated, it is possible to obtain the correspondence of coordinates between each dot 410 and its image, the dot image 410'. That is, for each height at which imaging is performed, three-dimensional coordinates (X k ,Y k ,Z K ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k ) can be acquired. Then, the calculation unit 172 can calculate the three-dimensional coordinates of the image capture object relative to the reference coordinate system of the head unit 110. Such correspondence relationships are described in the conversion table 181.

[0058] The conversion table 181 thus written and generated is a three-dimensional coordinate (X k ,Y k ,ZK ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k ) and can be used as a lookup table. In other words, by referring to the conversion table 181, the coordinate values ​​(x 1B ,y 1B ) and the coordinate value (x 2B ,y 2B ) can be converted into the three-dimensional coordinates (X2, Y2, Z2) of the object index 331. 1B ,y 1B ) and (x 2B ,y 2B ) does not exist in the conversion table 181, a complementation process can be performed using the surrounding coordinates that exist in the conversion table 181.

[0059] Furthermore, the coordinate value (x 1B ,y 1B ) and the coordinate value (x 2B ,y 2B ) may be converted into the three-dimensional coordinates (X2, Y2, Z2) of the mounting body index 331. For example, the three-dimensional coordinates (X k ,Y k ,Z K ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k ) and calculate the polynomial approximation function from the correspondence between (x 1B ,y 1B ) and (x 2B ,y 2B ) to (X2, Y2, Z2). In this way, when a lookup table or polynomial approximation function generated based on actual measurement data is used, error factors resulting from components such as lens aberration and imaging unit installation error are absorbed in the actual measurement data, so calculation of three-dimensional coordinates with higher accuracy can be expected.

[0060] Alternatively, a conversion formula may be calculated arithmetically using Scheimpflug geometric conditions, the baseline length defined between two image sensors, and other factors, without relying on actual measurement data. For example, a transformation matrix for converting a trapezoidal image into a rectangular image is determined in advance, using physical quantities such as the tilt angle of the optical system and image sensor as parameters, and keystone correction is performed on the first and second images using this transformation matrix. The two keystone-corrected images are then treated as stereo images, and the three-dimensional coordinates of the object to be observed are calculated from the amount of positional deviation between the images. This method is advantageous in that it eliminates the need to obtain actual measurement data in advance using charts, etc.

[0061] So far, the principle of calculating the three-dimensional coordinates (X2, Y2, Z2) of the mounted object index 331 has been explained. Next, the principle of calculating the three-dimensional coordinates (X1, Y1, Z1) of the mounted object index 311 will be explained. The calculation unit 172 refers to the conversion table 181 and calculates the coordinate values ​​(x 1A ,y 1A ) and the coordinate value (x 2A ,y 2A ) is converted into the three-dimensional coordinates (X1, Y1, Z1) of the mounting structure index 311.

[0062] As described above, the conversion table 181 contains three-dimensional coordinates (X k ,Y k ,Z K ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k Here, when the calculation unit 172 calculates the three-dimensional coordinates of the mounting body index 311, the height Z of the head unit 110 is expressed as Z=h a When the calculation unit 172 calculates the three-dimensional coordinates of the object index 331 by referring to the above correspondence relationship, the height Z of the head unit 110 is calculated as Z=h b Here, when the first image and the second image are acquired, the mounting object index 311 is closer to the head part 110 in the height direction than the mounted object index 331, so that ha h b is smaller than.

[0063] Note that the conversion table 182 that the calculation unit 172 refers to in order to calculate the three-dimensional coordinates of the mounting body index 311 may be generated separately from the conversion table 181. The conversion table 182 is generated in the same manner as the conversion table 181, except that the holding surface 122 is brought into close contact with the chart 400. In generating the conversion table 182, the distance between the holding unit 121 and the chart 400 is the same as the distance between the holding unit 121 and the semiconductor chip 310 when the image acquisition unit 171 actually causes the first imaging unit 130 and the second imaging unit 140 to capture images of the mounting body index 311. Therefore, by the calculation unit 172 calculating the three-dimensional coordinates of the mounting body index 311 by referring to the conversion table 182, the calculation unit 172 can calculate the three-dimensional coordinates of the mounting body index 311 with higher accuracy.

[0064] Furthermore, when generating the conversion table 181, the distance between the storage unit 121 and the chart 400 may be changed, and multiple conversion tables 181 may be prepared according to the distance between the storage unit 121 and the chart 400.

[0065] Next, a series of mounting processes performed by the mounting apparatus 100 will be described. Fig. 7 is a flow chart illustrating the processing procedure of the arithmetic processing unit. Here, the process from when the mounting tool 120 has sucked the semiconductor chip 310 to when the mounting tool 120 has bonded the semiconductor chip 310 to the bonding area 320 and then retreated will be described.

[0066] In step s101, the mounting control unit 173 transmits drive signals to the head drive motor 150 and the tool drive motor 160 to move the head unit 110 and the mounting tool 120 to a reference position. Here, the reference position is a position where at least a part of the semiconductor chip 310 and the bonding region 320 are present within the overlapping range of the depth of field of the first imaging unit 130 and the second imaging unit 140.

[0067] When the head unit 110 and the mounting tool 120 reach the reference position, in step s102, the image acquisition unit 171 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140, and acquires the first image data and the second image data, respectively. The image acquisition unit 171 passes the acquired first image data and second image data to the calculation unit 172. In the first image data and the second image data, at least the object index 331 is in focus.

[0068] In step s103, the calculation unit 172 determines whether or not the coordinate values ​​of the mounting body index 311 and the mounted body index 331 can be extracted from the first image data and the second image data received from the image acquisition unit 171.

[0069] The calculation unit 172 may be unable to extract at least one of the coordinate values ​​of the mounting body index 311 and the mounted body index 331 in the following cases: The held surface 312 on which the mounting body index 311 is provided is outside the overlapping range of the depth of field of the first imaging unit 130 and the second imaging unit 140, and the mounting body index 311 is not in focus.

[0070] If the calculation unit 172 cannot extract at least one of the coordinate values ​​of the mounting body index 311 and the mounted body index 331 from the first image data and second image data received from the image acquisition unit 171, the mounting control unit 173 moves at least one of the head unit 110 and the mounting tool 120 to change the focus state on the mounting body index 311. Thereafter, the mounting control unit 173 and the image acquisition unit 171 execute step s101 and step s102 again, respectively. Note that in the second execution of step s102, the image acquisition unit 171 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140 to acquire other first image data and other second image data. The image acquisition unit 171 passes the acquired other first image data and other second image data to the calculation unit 172. In the other first image data and other second image data, at least the mounting body index 311 is in focus.

[0071] As a method for changing the focus state for at least one of the mounting body index 311 and the mounted body index 331, a method of adjusting the focus state by moving the focus lenses of the first optical system 131 and the second optical system 141 may be used.

[0072] If the calculation unit 172 can extract the coordinate values ​​of the mounting body index 311 and the mounted body index 331 from the first image data and second image data received from the image acquisition unit 171, and other first image data and other second image data as necessary, the calculation unit 172 performs the following operation in step s104. That is, the calculation unit 172 extracts the coordinate values ​​(x 1A ,y 1A ) and the coordinate value (x 2A ,y 2A ), and the coordinate value (x 1B ,y 1B ) and the coordinate value (x 2B ,y 2B ) to extract.

[0073] In step s105, the calculation unit 172 refers to the conversion table 181 to obtain (x 1A ,y 1A ) and (x 2A ,y 2A ) pair of the three-dimensional coordinates (X1, Y1, Z1) of the mounting body index 311, and (x 1B ,y 1B ) and (x 2B ,y 2B ) and obtain the three-dimensional coordinates (X2, Y2, Z2) of the mounted object index 331 corresponding to the pair of the mounted object index 331. Then, obtain the relative position between the mounted object index 331 and the mounted object index 311.

[0074] Based on the obtained relative position, the mounting control unit 173 sends a drive signal to the head drive motor 150 in step s106 so that the relative position on the horizontal plane becomes (0,0). As a result, the mounting body index 311 is moved to the target position (X2, Y2) on the horizontal plane. That is, the position of the semiconductor chip 310 is corrected so that the coordinates of the mounted body index 331 and the mounting body index 311 on the horizontal plane become the same. Furthermore, in step s106, the calculation unit 172 calculates the actual orientation of the semiconductor chip 310 in the planar direction by referring to the mounting body index 311 shown in the first image and the second image. Then, the calculation unit 172 calculates the angular difference between the calculated actual orientation and the desired orientation of the semiconductor chip 310. The mounting control unit 173 generates a drive signal for rotating the semiconductor chip 310 by the angle difference calculated by the calculation unit 172 so that the three-dimensional coordinates of the mounting body index 311 do not move from (X1, Y1, Z1), and transmits the drive signal to the tool drive motor 160. As a result, the semiconductor chip 310 faces in the desired direction.

[0075] When placing the semiconductor chip 310 on the bonding area 320, the mounting control unit 173 may set the center coordinates of the bonding area 320 as a target position and align the center coordinates of the semiconductor chip 310 with this target position. In this case, the positional relationship between the center coordinates of the semiconductor chip 310 and the mounting body index 311, and the positional relationship between the center coordinates of the bonding area 320 and the mounted body index 331 are known. Then, based on both positional relationships and the three-dimensional coordinates of the mounting body index 311 and the mounted body index 331, the semiconductor chip 310 is placed at the target position on the bonding area 320.

[0076] After step s106, the calculation processing unit 170 may detect a deviation of the mounting body index 311 from the target position and determine whether or not this deviation is within the target error range. If the result of the determination is that the deviation is outside the target error range, the calculation processing unit 170 may perform steps s102 to s106 again.

[0077] In step s107, the mounting control unit 173 moves the mounting tool 120 closer to the bonding area 320 until the semiconductor chip 310 held by suction on the mounting tool 120 is placed on the bonding area 320.

[0078] After step s107, the mounting control unit 173 places the semiconductor chip 310 in the bonding area 320 and executes a mounting process to bond the die chip 310 to the bonding area 320. When the mounting process is completed, in step s109, the mounting control unit 173 raises the mounting tool 120 and moves it away from the bonded die chip 310, thereby completing the series of processes.

[0079] In the above, an example has been described in which at least the mount object index 331 is in focus in the first frame of first image data and second image data. On the other hand, at least the mount object index 311 may be in focus in the first frame of first image data and second image data. In this case, at least the mount object index 331 is in focus in the other first image data and other second image data. Otherwise, the arithmetic processing unit 170 performs processing in the same manner as in the example in which at least the mount object index 331 is in focus in the first frame of first image data and second image data.

[0080] In the above description, the holder 121 made of a light-transmitting material is used, but the configuration for observing the mounting body index 311 of the adsorbed semiconductor chip 310 is not limited to this. Fig. 8 is an explanatory diagram for explaining a modified example of the holder as a first modified example. Fig. 8 is a diagram corresponding to Fig. 4, but elements that are the same as elements already described are assigned the same numbers and their description will be omitted unless otherwise specified.

[0081] The holding unit 121 has an end 126, support posts 125 that support the end 126, and a suction tube 124. The space in the holding unit 121 other than the space where the end 126, the suction tube 124, and the support posts 125 exist is an open space. The mounting body light path region 123a and the mounted body light path region 123b exist in the open space. The four support posts 125 are connected to the end 126 near the four corners of the end 126, and connect the end 126 to a base portion 127 on the head unit 110 side of the mounting tool 120. Note that the support posts 125 are not limited to being located near the four corners of the end 126, and multiple support posts 125 may be located near the outer edge of the end 126.

[0082] The end 126 is provided at the tip of the holding portion 121 on the stage 220 side. The end 126 is formed of a material that is not optically transparent. The end 126 has a holding surface 122 on the side facing the stage 220. The end 126 has an open space 126a in the mounting body optical path region 123a and the mounted body optical path region 123b. That is, the mounting body optical path region 123a and the mounted body optical path region 123b are formed as open spaces throughout. As a result, the mounting body optical path region 123a and the mounted body optical path region 123b have the same refractive index as the air throughout.

[0083] As described above, in the first modified example, the mounting body optical path region 123a and the mounted body optical path region 123b have the same refractive index as the air throughout, and therefore the conversion table 181 is generated using the air as a medium. Specifically, the conversion table 181 is generated as follows: First, a chart 400 having the same thickness as the substrate 330 is placed on the stage 220 directly below the mounting tool 120. Next, the mounting control unit 173 brings the head unit 110 close to the chart 400, and adjusts the height Z of the head unit 110 from the stage 220 to Z=h nIn this case, the distance between the head unit 110 and the chart 400 is adjusted so that the chart 400 falls within the overlapping range of the depth of field of the first imaging unit 130 and the second imaging unit 140. The mounting control unit 173 also retracts the holding unit 121 away from the chart 400. In this state, the image acquisition unit 171 causes the first imaging unit 130 and the second imaging unit 140 to capture images of the chart 400 and output a first chart image and a second chart image, respectively. The conversion table 181 is generated using the first chart image and the second chart image obtained as described above. In the first modified example, the mounting control unit 173 retracts the holding unit 121 away from the chart 400, so that the holding unit 121 does not appear in the first chart image and the second chart image.

[0084] Fig. 9 is an explanatory diagram for explaining a modified example of the holding part as a second modified example. Fig. 9 is a diagram corresponding to Fig. 4, but elements that are the same as elements already explained are assigned the same numbers and explanations thereof will be omitted unless otherwise specified.

[0085] The object index 331 is provided near the outer edge of the bonding area 320. Therefore, the subject light beam L2 from the object index 331 does not pass through the holder 121. That is, the object light path area 123b does not exist.

[0086] As described above, the holder 121 appears in the first chart image and the second chart image. The first imaging unit 130 and the second imaging unit 140 detect a subject light beam from the dot 410A that passes through the holder 121 and a subject light beam from the dot 410B that passes only through the atmosphere without passing through the holder 121. In the second modified example, the first imaging unit 130 and the second imaging unit 140 detect a subject light beam L1 from the mount object index 311 that passes through the holder 121 and a subject light beam L2 from the mounted object index 331 that passes only through the atmosphere without passing through the holder 121. Therefore, a conversion table 181A for the dot 410A and a conversion table 181B for the dot 410B are generated. When the calculation unit 172 calculates the three-dimensional coordinates of the mount object index 311, the calculation unit 172 refers to the conversion table 181A. Furthermore, when the calculation unit 172 calculates the three-dimensional coordinates of the mount object index 331, the calculation unit 172 refers to the conversion table 181B.

[0087] Furthermore, in the above explanation, an embodiment was described that assumes that the mounting body index 311 is located on the held surface 312 of the semiconductor chip 310, but the mounting body index 311 may be located in a location other than on the held surface 312.

[0088] 10 and 11 are explanatory diagrams for explaining modified examples of the mounting body index. A case where the mounting body index 311 exists on the holding surface 122 of the mounting tool 120 will be described with reference to Fig. 10 and Fig. 11. Elements that are the same as elements that have already been described will be assigned the same numbers and their description will be omitted unless otherwise specified.

[0089] As shown in FIG. 10 , the mounting apparatus 100 includes a top-view imaging unit 500. The top-view imaging unit 500 is installed with its optical axis facing upward. The first imaging unit 130 and the second imaging unit 140 are installed to overlook the semiconductor chip 310 and the bonding region 320, while the top-view imaging unit 500 is installed to overlook the semiconductor chip 310. That is, the top-view imaging unit 500 is installed on the opposite side of the stage 220 from the first imaging unit 130 and the second imaging unit 140. The top-view imaging unit 500 is located at a different position on the horizontal plane from the stage 220. Before the mounting control unit 173 moves the head unit 110 onto the stage 220, the image acquisition unit 171 causes the top-view imaging unit 500 to capture an image of the holding surface 122 that holds the semiconductor chip 310.

[0090] 11 schematically illustrates the holding surface 122 and the semiconductor chip 310 that appear in the overhead image captured by the image acquisition unit 171 using the overhead imaging unit 500. The overhead image shows the semiconductor chip 310 and a mounting body index 311. The calculation unit 172 calculates the positional relationship between the center of the semiconductor chip 310 and the mounting body index 311 based on the overhead image.

[0091] In step s105, the calculation unit 172 calculates the three-dimensional coordinates of the mounting body index 311 and the mounted body index 331, and then calculates the three-dimensional coordinates of the center of the semiconductor chip 310 based on the above positional relationship. Thereafter, in step s106, the mounting control unit 173 sends a drive signal to the head drive motor 150. As a result, the center of the semiconductor chip 310 is positioned at the target position in the horizontal plane, i.e., the coordinates (X2, Y2) of the mounted body index 331 in the horizontal plane.

[0092] In this embodiment, the first imaging unit 130 and the second imaging unit 140 are telecentric, but there are cases where the first imaging unit 130 and the second imaging unit 140 cannot be telecentric due to environmental constraints, etc.

[0093] In this case, the calculation unit 172 determines the three-dimensional coordinates of the mounting body, taking into account that the optical path length of the subject light beam L1 in the mounting body optical path region 123a changes depending on the arrival position of the subject light beam L1 from the mounting body index 311 at the imaging elements 132 and 142 of the first imaging unit 130 and the second imaging unit 140, respectively.

[0094] While the present embodiment has been described above using the mounting apparatus 100 as an example, the mounting apparatus to which the three-dimensional coordinate calculation method and configuration according to the present embodiment can be applied is not limited to die bonders. For example, it can also be applied to flip-chip bonders and wire bonders. When applied to a wire bonder, the tool unit that performs work on the mounted body placed on the stage is a capillary or the like. Furthermore, it can also be applied to a dicer that dices a wafer into semiconductor chips.

[0095] Furthermore, although the mounting apparatus 100 has been described using an example in which the semiconductor chip 310 is placed and mounted on the bonding region 320, the mounted body is not limited to the semiconductor chip 310. For example, the mounted body may be a semiconductor chip, or a stacked body in which one semiconductor chip is stacked on another semiconductor chip. Furthermore, the mounted body on which the mounted body is placed is not limited to the bonding region 320. For example, on a substrate on which a semiconductor chip has already been placed, the already placed semiconductor chip may be used as the mounted body, and another semiconductor chip may be placed on the semiconductor chip.

[0096] Note that, assuming that the surface of the substrate 330 on which the semiconductor chip 310 is mounted is the front surface, the mountable object index 331 may be set on the front surface of the substrate 330, or on a part of the substrate 330 other than the front surface. For example, the mountable object index 331 may be set on the surface opposite to the front surface of the substrate 330. That is, the mountable object index 331 may be set on the substrate 330. Alternatively, the mountable object index 331 may be set at a location other than the substrate 330. When the mountable object index 331 is set on a part of the substrate 330 other than the front surface of the substrate 330, the substrate 330 is made of, for example, a light-transmitting material. The light-transmitting material is not particularly limited, but examples include glass such as quartz glass and resin such as acrylic resin. The mountable object index 331 may also be an index that can identify the position where the semiconductor chip 310 is to be mounted. Alternatively, the mountable object index 331 may be an index for identifying the position where the semiconductor chip 310 is to be mounted.

[0097] The calculation unit 172 does not have to calculate the relative position between the mount object index 331 and the mounting object index 311 from the first image and the second image. In this case, the calculation unit 172 calculates the three-dimensional coordinates of the mount object and the mounting object from, for example, the mount object index 331 and the mounting object index 311 that appear in the first image and the second image, respectively. Then, the mounting control unit 173 transmits a drive signal to the head drive motor 150, with the three-dimensional coordinates (X2, Y2, Z2) of the mount object index 331 set as the approach target. As a result, the mounting object index 311 is moved to the target position (X2, Y2) in the horizontal plane.

[0098] In the above description, the case where the mounting assembly index 311 is on the held surface 312 of the semiconductor chip 310 and the case where the mounting assembly index 311 is on the holding surface 122 of the mounting tool 120 as an example of a location other than on the held surface 312 have been described. In other words, the mounting assembly index 311 may be an index that can identify the position of the semiconductor chip 310. Alternatively, the mounting assembly index 311 may be an index for identifying the position of the semiconductor chip 310.

[0099] <Additional Notes> Embodiments of the present disclosure include the following aspects. [1] an implementation tool that retrieves and maintains the implementation; a first imaging unit and a second imaging unit that have a field of view overlooking the stage from the mounting tool side, and in which the respective optical systems and imaging elements are arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage becomes a focal plane, and that capture images of the mounted object index and the mounted object index identified within the field of view; a calculation unit that calculates a relative position between the mounted object index and the mounted object index from a first image output from the first imaging unit and a second image output from the second imaging unit; a mounting control unit that corrects the position of the mounting body based on the calculation result of the calculation unit and places the mounting body on the target body; A mounting device comprising: [2] the mounting tool includes a holding portion having a holding surface that adsorbs and holds a held surface of the mounting body, the holding portion has a mount body optical path region for allowing a subject light beam from the mount body index to reach the imaging elements of the first imaging unit and the second imaging unit, [1] The mounting device according to [1]. [3] the holding section has an optical path region for allowing a subject light beam from the object index to reach the imaging elements of the first imaging unit and the second imaging unit, [2] The mounting device according to [2]. [4] the mounting body optical path region is formed of a material having optical transparency; [2] or [3]. [5] the mounting body optical path area is formed as an open space that allows the subject light beam to pass through; [2] or [3]. [6] the calculation unit determines the three-dimensional coordinates of the mount body, taking into consideration that an optical path length of the subject light beam in the mount body optical path region changes depending on a reaching position of the subject light beam from the mount body index on the imaging elements of the first imaging unit and the second imaging unit. The mounting device according to any one of [2] to [5]. [7] the mounting body index is set at a location other than the mounting body, the calculation unit calculates the three-dimensional coordinates of the mounting body based on a positional relationship between the mounting body index and the mounting body. The mounting device according to any one of [1] to [6]. [8] When the calculation unit is unable to calculate at least one of the three-dimensional coordinates of the mounted body index and the three-dimensional coordinates of the mounted body based on one of the first images and one of the second images, the calculation unit changes the focus state for at least one of the mounted body index and the mounted body index and calculates at least one of the three-dimensional coordinates of the mounted body index and the mounted body index based on another first image output by the first imaging unit and another second image output by the second imaging unit. The mounting device according to any one of [1] to [7]. [9] A mounting method for a mounted body using a mounting device including a mounting tool that acquires and holds a mounted body, and a first imaging unit and a second imaging unit that have a field of view that overlooks a stage from the mounting tool side, and in which the optical system and the imaging element are respectively arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage becomes a focal plane, an imaging step of imaging the mounted object index and the mounted object index identified within the field of view with the first imaging unit and the second imaging unit; a calculation step of calculating a relative position between the mounted object index and the mounted object index from a first image output from the first imaging unit and a second image output from the second imaging unit; a mounting control step of correcting the position of the mounting body based on the calculation result of the calculation unit and placing the mounting body on the target body; An implementation method having the following.

[10] A mounting control program for controlling a mounting device including a mounting tool that acquires and holds a mounted body, and a first imaging unit and a second imaging unit that have a field of view overlooking a stage from the mounting tool side, and in which the optical systems and imaging elements are arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage becomes a focal plane, an imaging step of imaging the mounted object index and the mounted object index identified within the field of view with the first imaging unit and the second imaging unit; a calculation step of calculating a relative position between the mounted object index and the mounted object index from a first image output from the first imaging unit and a second image output from the second imaging unit; a mounting control step of correcting the position of the mounting body based on the calculation result of the calculation unit and placing the mounting body on the target body; An implementation control program that causes a computer to execute the above. [Explanation of symbols]

[0100] 100...mounting device, 110...head portion, 120...mounting tool, 121...holding portion, 122...holding surface, 123a...mounting body optical path area, 123b...mounted body optical path area, 124...suction tube, 125...support, 126...end portion, 126a...opening space, 127...base portion, 130...first imaging unit, 131...first optical system, 131a...object side lens group, 131b...image side lens group, 132...first imaging element, 133...aperture, 140...second imaging unit, 141...second optical system, 142...second imaging element, 150...head drive motor, 160...tool drive motor, 1 70...arithmetic processing unit, 171...image acquisition unit, 172...calculation unit, 173...mounting control unit, 180...storage unit, 181...conversion table, 182...conversion table, 190...input / output device, 210...frame, 220...stage, 310...semiconductor chip, 311...mounted body index, 312...held surface, 320...bonding area, 330...substrate, 331...mounted body index, 400...chart, 400'...chart image, 410...dot, 410'...dot image, 500...supination imaging unit, L1...subject light beam from mounted body index, L2...subject light beam from mounted body index

Claims

1. an implementation tool that retrieves and maintains the implementation; a first imaging unit and a second imaging unit having a field of view overlooking the stage from the mounting tool side, each of which has an optical system and an imaging element arranged to satisfy the Scheimpflug condition so that a plane corresponding to the stage surface of the stage becomes a focal plane, and which capture images of a mounted object index and a mounted object index identified within the field of view; a calculation unit that calculates a relative position between the mounted object index and the mounted object index from a first image output from the first imaging unit and a second image output from the second imaging unit; a mounting control unit that corrects the position of the mounting body based on the calculation result of the calculation unit and places the mounting body on the target body; A mounting device comprising:

2. the mounting tool includes a holding portion having a holding surface that adsorbs and holds a held surface of the mounting body, the holding portion has a mount body optical path region for allowing a subject light beam from the mount body index to reach the imaging elements of the first imaging unit and the second imaging unit, The mounting device according to claim 1 .

3. the holding section has an optical path region for allowing a subject light beam from the object index to reach the imaging elements of the first imaging unit and the second imaging unit, The mounting device according to claim 2 .

4. the mounting body optical path region is formed of a material having optical transparency; The mounting device according to claim 2 .

5. the mounting body optical path area is formed as an open space that allows the subject light beam to pass through; The mounting device according to claim 2 .

6. the calculation unit determines the three-dimensional coordinates of the mount body, taking into consideration that an optical path length of the subject light beam in the mount body optical path region changes depending on a reaching position of the subject light beam from the mount body index on the imaging elements of the first imaging unit and the second imaging unit. The mounting device according to claim 2 .

7. the mounting body index is set at a location other than the mounting body, the calculation unit calculates the three-dimensional coordinates of the mounting body based on a positional relationship between the mounting body index and the mounting body. The mounting device according to claim 1 .

8. When the calculation unit is unable to calculate at least one of the three-dimensional coordinates of the mounted body index and the three-dimensional coordinates of the mounted body based on one of the first images and one of the second images, the calculation unit changes the focus state for at least one of the mounted body index and the mounted body index and calculates at least one of the three-dimensional coordinates of the mounted body index and the mounted body index based on another first image output by the first imaging unit and another second image output by the second imaging unit. The mounting device according to claim 1 .

9. A mounting method for a mounted body using a mounting device including a mounting tool that acquires and holds a mounted body, and a first imaging unit and a second imaging unit that have a field of view that overlooks a stage from the mounting tool side, and in which the optical system and the imaging element are respectively arranged to satisfy the Scheimpflug condition so that a plane corresponding to a stage surface of the stage becomes a focal plane, an imaging step of imaging, with the first imaging unit and the second imaging unit, images of the mounted object index and the mounted object index identified within the field of view; a calculation step of calculating a relative position between the mounted object index and the mounted object index from a first image output from the first imaging unit and a second image output from the second imaging unit; a mounting control step of correcting the position of the mounting body based on the calculation result of the calculation unit and placing the mounting body on the target body; An implementation method having the following.

10. A mounting control program for controlling a mounting device including a mounting tool that acquires and holds a mounted body, and a first imaging unit and a second imaging unit that have a field of view overlooking a stage from the mounting tool side, and in which the optical systems and imaging elements are arranged to satisfy the Scheimpflug condition so that a plane corresponding to a stage surface of the stage becomes a focal plane, an imaging step of imaging, with the first imaging unit and the second imaging unit, images of the mounted object index and the mounted object index identified within the field of view; a calculation step of calculating a relative position between the mounted object index and the mounted object index from a first image output from the first imaging unit and a second image output from the second imaging unit; a mounting control step of correcting the position of the mounting body based on the calculation result of the calculation unit and placing the mounting body on the target body; An implementation control program that causes a computer to execute the above.

Images